Electroplating conductive metallurgy equipment

Abstract

The present invention relates to an electroplating conductive metallurgy apparatus comprising a base, an upper lid, and a conductive column, wherein the bottom end of the conductive column penetrates the base, a first guide portion is installed on the base, and a second guide portion is installed on the conductive column, at least one of the first guide portion and the second guide portion extends spirally from bottom to top, and a scraper is installed at the bottom end of the conductive column. The present invention allows for cleaning crystals on a conductive plate using the scraper of the conductive column, ensuring good contact, and improving the stability of current and voltage during the electroplating process.

Description

Technology Field

[0001] The present invention relates to the field of electroplating technology, and more specifically, to an electroplating conductive metallurgy apparatus. Background Technology

[0002] In the formation process of metal bumps, an electroplating process is generally used, and the electroplating process generates bumps within a grid formed by photoresist. During the electroplating process, a substrate is placed in an electroplating solution, and by utilizing the reaction of the electrodes, a metal layer is applied to the surface of the bonding pad to ultimately form the bumps.

[0003] The electroplating process is widely applied in the field of electronic manufacturing technology. Conventional electroplating processes are primarily implemented in electroplating devices, which are equipped with conductive metallurgy devices and conductive plates. Conventional conductive metallurgy devices are typically cylindrical wires that make electrical contact with the conductive plates. The conductive plates are placed in a plating solution. Due to the characteristics of the plating solution itself, crystals easily form on the conductive plates immersed in the solution, which causes poor contact between the conductive plates and the conductive metallurgy devices and can lead to abnormal current and voltage phenomena. The problem to be solved

[0004] The technical problem to be solved by the present invention is to provide an electroplating conductive metallurgy mechanism, thereby improving the problem of poor contact caused by crystals between the conductive plate and the conductive metallurgy mechanism existing in the prior art. means of solving the problem

[0005] To solve the above technical problem, the present invention comprises a base, an upper lid matching the base, a receiving chamber installed between the base and the upper lid, and a lifting conductive column received within the receiving chamber, wherein the bottom end of the conductive column penetrates the base downward and also extends outside the receiving chamber;

[0006] A first guide portion is installed on the base, and a second guide portion that matches the first guide portion is installed on the conductive column, at least one of the first guide portion and the second guide portion extends spirally from bottom to top, and a scraper is installed at the bottom end of the conductive column;

[0007] The present invention provides an electroplating conductive metallurgy mechanism in which, under the action of an external force, the bottom end of the conductive column moves to the receiving chamber, and during the movement, the conductive column rotates under the interaction of a first guide part and a second guide part, and after the action of the external force is withdrawn, the conductive column proceeds with a return movement.

[0008] Furthermore, the above-mentioned receiving chamber includes an upper chamber and a lower chamber formed on the base, and the first guide member is formed on the inner wall surface of the lower chamber and can protrude into the lower chamber.

[0009] Furthermore, the lower chamber penetrates the bottom surface of the base downward, and a lower opening is formed on the said bottom surface; the first guide portion is a rib that extends in a spiral shape, and this can extend from top to bottom to the position of the lower opening.

[0010] Furthermore, the challenge column is equipped with an upper cylinder accommodated within the upper chamber and a lower cylinder accommodated within the lower chamber; the second guide portion is a groove extending in a spiral shape, which is formed on the circumferential surface of the lower cylinder and can extend from top to bottom.

[0011] Furthermore, the above-mentioned conductive column is equipped with an upper cylinder, a lower cylinder, a support sheet connected between the upper cylinder and the lower cylinder, and a spring installed over the upper cylinder, and an annular support is formed at the bottom of the upper chamber, and the support supports the support sheet upward, and the support sheet can support the spring upward.

[0012] Furthermore, the above-mentioned conductive column further includes an extendable guide rod accommodated within an upper cylinder and a lower cylinder, and an elastic means is installed over the extendable guide rod, and the elastic means can be accommodated within the lower cylinder.

[0013] Furthermore, a receiving groove and a through hole are additionally opened inside the lower cylinder, the elastic means is received within the receiving groove, the through hole extends downward and penetrates through the bottom cross-section of the conductive column, the bottom end of the telescopic guide rod is received within the through hole, and the top end of the telescopic guide rod extends upward and can also protrude from the top surface of the upper cylinder.

[0014] Furthermore, the scraper includes three blades, and the three blades are installed in a triangular star shape; the width of the blades can gradually decrease from the inside to the outside along the radial direction.

[0015] Furthermore, a circular base is installed at the bottom of the challenge column, and the scraper is extended in a straight line and can also pass through the center of the circular base.

[0016] The electroplating conductive metallurgy apparatus includes a base and a lifting conductive column installed within the base, and the conductive column and the base are matched with each other through a spiral guide section to allow the conductive column to rotate during the lifting process, and a scraper exposed from below the base may be installed at the bottom end of the conductive column. Effects of the invention

[0017] Compared to the prior art, the present invention has a spiral first guide part and a second guide part that match each other installed on a base and a conductive column, and by operating the forward and reverse rotation of the conductive column each time the electroplating conductive metallurgy mechanism rises and falls, crystals on the conductive plate can be cleaned using a scraper at the bottom of the conductive column, good contact between the conductive column and the conductive plate can be secured, and the stability of current and voltage can be improved. Brief explanation of the drawing

[0018] FIG. 1 is a perspective view showing the electroplating conductive metallurgy apparatus of the first embodiment of the present invention; FIG. 2 is a schematic diagram showing the assembly of the base and the conductive column of the electroplating conductive metallurgy apparatus of the first embodiment of the present invention; FIG. 3 is an exploded view showing the electroplating conductive metallurgy mechanism of the first embodiment of the present invention; FIG. 4 is a schematic diagram showing the internal structure of the base of the electroplating conductive metallurgy apparatus of the first embodiment of the present invention; FIG. 5 is a schematic diagram showing the internal structure of the electroplating conductive metallurgy apparatus of the first embodiment of the present invention; FIG. 6 is a schematic diagram showing the structure of the electroplating conductive metallurgy apparatus of the first embodiment of the present invention when the bottom part faces upward; FIG. 7 is a schematic diagram showing the base and the bottom of the conductive column of the electroplating conductive metallurgy apparatus of the first embodiment of the present invention facing upward; FIG. 8 is a perspective view showing the electroplating conductive metallurgy apparatus of the second embodiment of the present invention; FIG. 9 is a schematic diagram showing a local portion when the bottom part of the electroplating conductive metallurgy apparatus of the second embodiment of the present invention faces upward; FIG. 10 is a perspective view showing a conductive column of the electroplating conductive metallurgy apparatus of the second embodiment of the present invention; FIG. 11 is a schematic diagram showing an extendable guide rod of the electroplating conductive metallurgy apparatus of the second embodiment of the present invention; FIG. 12 is a schematic diagram showing the internal structure of the electroplating conductive metallurgy apparatus of the second embodiment of the present invention. Specific details for implementing the invention

[0019] The embodiments described below with reference to the drawings are exemplary and are intended only to interpret the invention, and should not be interpreted as limiting the invention.

[0020] First embodiment

[0021] FIGS. 1 to 7 are first embodiments of the present invention, and the present embodiment provides an electroplating conductive metallurgy apparatus (100) comprising a base (10), an upper lid (20), and a conductive column (30) accommodated within the base (10), wherein the bottom end of the conductive column (30) protrudes downward from the base (10), the bottom end of the conductive column (30) makes abutment contact with a conductive plate (200), and further, at least one scraper (36) is installed at the bottom end of the conductive column (30). When the conductive column (30) and the conductive plate (200) come into contact, the conductive column (30) moves upward and downward due to the contact pressure and also rotates at the same time, thereby the scraper (36) scrapes the surface of the conductive plate (200) and scrapes off crystals on the surface of the conductive plate (200), thereby ensuring stable and reliable electrical contact between the conductive column (30) and the conductive plate (200).

[0022] The base (10) is formed as a cylinder and has a top surface (11), a bottom surface (12), and a receiving chamber (13) installed between the top surface (11) and the bottom surface (12). The receiving chamber (13) penetrates the top surface (11) and the bottom surface (12) in the vertical direction. Additionally, the top surface (11) and the bottom surface (12) each form an upper opening (14) and a lower opening (15). Furthermore, the upper opening (14) and the lower opening (15) are preferably circular. Additionally, the size of the upper opening (14) is larger than the size of the lower opening (15). A support member (16) is installed within the receiving chamber (13), and the support member (16) is preferably circular. The support member (16) is configured to support the conductive column (30) upward. As to be explained here, due to the presence of the support member (16), the receiving chamber (13) is divided into two parts, upper and lower, respectively, an upper chamber (131) and a lower chamber (132). As illustrated in FIG. 3, the upper chamber (131) corresponds to the upper opening (14), and the lower chamber (132) corresponds to the lower opening (15). Specifically, the upper chamber (131) penetrates the top surface (11) upward to form the upper opening (14), and the lower chamber (132) penetrates the bottom surface (12) downward to form the lower opening (15). The support member (16) is located at the bottom of the upper chamber (131), and the lower chamber (132) is located inside the support member (16). Preferably, the lower chamber (132) is located in the central area of ​​the support member (16), and a first guide member (17) is formed on the inner wall surface of the lower chamber (132), and the first guide member (17) extends in a curved shape from top to bottom to the position of the lower opening (15), and the first guide member (17) is configured to match with the conductive column (30) to guide the conductive column (30) to move up and down.

[0023] The upper lid (20) of the above electroplating conductive metallurgy apparatus (100) also forms a cylindrical body, and its cover is installed on the base (10) to seal the conductive column (30) inside, and a yield chamber (21) is installed inside the upper lid (20) and configured to provide a yield space for the upward movement of the conductive column (30), so that the conductive column (30) can realize an upward and downward extension movement.

[0024] The above-described conductive column (30) includes an upper cylinder (31), a lower cylinder (32), a support seat (33) between the upper cylinder (31) and the lower cylinder (32), and a spring (34) installed over the upper cylinder (31). Both the upper cylinder (31) and the lower cylinder (32) form a cylindrical body, and the upper cylinder (31) is thicker than the lower cylinder (32), and the upper cylinder (31), the lower cylinder (32), and the support seat (33) form a single integral; wherein the upper cylinder (31), the support seat (33), and the spring (34) are all received within the upper chamber (131) of the receiving chamber (13), and the upper end of the upper cylinder (31) protrudes upward from the upper chamber (131) and also enters into the yield chamber (21) of the upper lid (20). The lower cylinder (32) is received into the lower chamber (132), and the bottom end of the lower cylinder (32) protrudes downward from the lower chamber (132). The lower cylinder (32) is configured to come into contact with the conductive plate (200), and the support sheet (33) is circular and protrudes from the circumferential surface of the upper cylinder (31) and the lower cylinder (32). The support sheet (33) is supported on the support member (16) to provide positional limitation for the vertical movement of the conductive column (30) in the vertical direction. The spring (34) is installed over the upper cylinder (31), and the bottom end of the spring (34) comes into direct contact with the support sheet (33), and the top end of the spring (34) comes into direct contact with the upper lid (20). For further explanation, a circular bottom surface (35) is additionally installed at the bottom end of the lower cylinder (32), and a scraper (36) that contacts the conductive plate (200) is installed on the circular bottom surface (35).Preferably, the scraper comprises three blades (37), and the three blades (37) are installed in a triangular star shape, and the three blades (37) are uniformly distributed along the circumferential direction of the circular base (35), and the three blades (37) are connected integrally, and all of the blades (37) are extended in a straight line and pass through the center of the circular base (35), and the width of the blades (37) has a design that gradually changes, that is, gradually narrows toward the direction away from the center of the circular base (35), that is, the width of the blades (37) gradually decreases from the inside to the outside along the radial direction.

[0025] In order to allow the challenge column (30) to move up and down smoothly, in this embodiment, a second guide part (38) is installed on the circumferential surface of the lower cylinder (32), and the second guide part (38) extends straight up from the circular bottom surface (35) to the top end of the lower cylinder (32). In order to correspond with the first guide part (17), the second guide part (38) also extends in a curved shape from bottom to top to match the first guide part (17), and can be seen by referring to FIGS. 6 and 7.

[0026] In combination with what is illustrated in FIG. 6, in actual operation, when lowering the electroplating conductive metallurgy apparatus, if the bottom end of the conductive column (30) comes into press contact with the conductive plate (200), the conductive column (30) is subjected to an upward pushing action. By the mutually cooperative guidance of the first guide section (17) and the second guide section (38), the bottom end of the conductive column (30) moves smoothly upward and moves to the receiving chamber within the base (10). At this time, the spring (34) is compressed upward, and since both the first guide section (17) and the second guide section (38) are designed to extend along a spiral curve, rotational movement occurs simultaneously with the upward movement of the conductive column (30). In other words, under the action of an external force, the conductive column (30) performs a spiral upward movement under the action of the first guide section (17) and the second guide section (38), thereby causing the scraper (36) at the bottom end of the lower cylinder (32) of the conductive column (30) to rotate synchronously together. The rotating scraper (36) performs effective scraping on the surface of the conductive plate (200) and removes crystals or dirt from the surface of the conductive plate (200). After the action of the external force is withdrawn, the conductive column (30) proceeds with a return movement, and because the spring (34) is present, when the electroplating conductive metallurgy mechanism is raised, the conductive column (30) also returns voluntarily, and during the return process, the bottom end of the conductive column (30) moves downward and rotates at the same time. As can be seen from this, during the upward movement of the conductive column (30), the scraper (36) at the bottom end may rotate in the forward and reverse directions.

[0027] Second embodiment

[0028] FIGS. 8 to 12 represent a second embodiment of the present invention. In this embodiment, the operation method of the electroplating conductive metallurgy apparatus (100') is similar to that of the first embodiment, that is, the conductive column (30') is pressed downward onto the conductive plate (200) to cause rotation at the bottom end of the conductive column (30'), and the surface of the conductive plate (200) is scraped using the scraper (36') at the bottom end to remove crystals or dirt from the surface of the conductive plate (200). It is necessary to explain that, aside from the conductive column (30'), the structure of the base (10') and the upper lid (20') in the second embodiment is identical to that of the first embodiment. Therefore, only the structure of the conductive column (30') in the second embodiment will be described below.

[0029] The above-mentioned conductive column (30') is equipped with an upper cylinder (31'), a lower cylinder (32'), a support sheet (33') connecting the upper cylinder (31') and the lower cylinder (32'), and a spring (34') installed over the upper cylinder (31'). Here, a circular cover plate (310') is installed on the top of the upper cylinder (31'), and the bottom end of the lower cylinder (32') protrudes downward from the base (10'). Additionally, a second guide portion (38') is installed on the circumferential surface of the lower cylinder (32'), and the second guide portion (38') is configured to match the first guide portion (17') within the base (10'). Both the first guide portion (17') and the second guide portion (38') are extended in a curved manner, and thus the mutual matching of the two causes the lower cylinder (32') to perform rotational movement (identical to the first embodiment and therefore not further described). Inside the lower cylinder (32'), a receiving groove (321') and a through hole (322') are further opened, and the through hole (322') and the receiving groove (321') are connected to each other. The above through hole (322') extends downward from the bottom of the receiving groove (321') and penetrates to the circular bottom surface (39') of the lower cylinder (32'). The upper end of the retractable guide rod (35') penetrates the cover plate (310') upward and also protrudes from the surface of the cover plate (310'), and the retractable guide rod (35') is installed with one bar-shaped rod body (351') and one bar-shaped rod tip (352'). The rod body (351') is thicker than the rod tip (352'), and the upper end of the rod body (351') passes through the cover plate (310') upward and is also exposed from the surface of the cover plate (310').The rod body (351') passes through the upper cylinder (31') from top to bottom and also protrudes into the receiving groove (321') of the lower cylinder (32'), and the rod tip (352') extends further down from the bottom end of the rod body (351') and also enters into the through hole (322'), and an elastic means (353') is installed on the surface of the rod tip (352'), and the elastic means (353') is received within the receiving groove (321'), and the elastic means (353') is preferably a spring, the top end of which supports the rod body (351') upward, and the bottom end of which supports the bottom wall of the receiving groove (321') downward.

[0030] In addition, a scraper (36') is also installed on the circular bottom surface of the lower cylinder (32'), and the scraper (36') is straight, and its shape is different from the triangular star structure of the first embodiment. The straight scraper (36') passes through the centrifugal position of the circular bottom surface (39'), and both ends of the scraper (36') extend around the circumference of the circular bottom surface (39'), so that the straight scraper (36') has a relatively long length, which is advantageous for the scraping effect.

[0031] In actual operation, the upper end of the retractable guide rod (35') (i.e., the upper end of the rod body (351')) is compressed so that the lower end of the retractable guide rod (35') protrudes downward from the through hole (322') and is exposed from the bottom surface of the lower cylinder (32'), thereby coming into contact with the conductive plate (200). When the pressure on the upper end of the retractable guide rod (35') is released, under the action of the elastic means (353'), the lower end of the retractable guide rod (35') is contracted into the through hole (322'), and contact with the conductive plate (200) is severed.

[0032] As can be seen from this, compared to the first embodiment, the second embodiment of the present invention has an extendable guide rod (35') installed inside the conductive column (30'), a receiving groove (321') and a through hole (322') installed inside the lower cylinder (32'), and by using two elastic recovery elements, a spring (34') and an elastic means (353'), it is possible to realize pressure contact and return by providing assistance to the extension and retraction of the conductive column (30'). In addition, the extendable guide rod (35') embedded in the conductive column (30') is extended downward under pressure after the scraper (36') scrapes the crystal, and comes into contact with the conductive plate (200) to realize a better conductivity effect.

[0033] Preferably, the first guide part (17) of the first embodiment, the first guide part (17') of the second embodiment, the second guide part (38) of the first embodiment, and the second guide part (38') of the second embodiment are preferably extended from bottom to top using a spiral curve method, the first guide part (17, 17') is a rib extended by forming a spiral curve, and the second guide part (38, 38') is a groove extended by forming a corresponding spiral curve, and through the combination of the rib and the groove, a match effect similar to a sliding groove and a sliding track is achieved. Naturally, the first guide portion (17, 17') may be designed as a bump installed on the inner surface of a lower cylinder, rather than a bar-shaped rib extended in a spiral curve, and this may likewise be caught in the groove and slide along the curve within the groove (i.e., the second guide portion (38, 38')), and also achieve the purpose of rotating the scraper (36, 36') by operating the lower cylinder to rotate it, in other words, it is sufficient that at least one of the first guide portion (17, 17') and the second guide portion (38, 38') is extended spirally. Also, the positions of the groove and the rib may be interchangeable.

[0034] In short, whether it is the first embodiment or the second embodiment, the present invention is optimized for the structure of an electroplating conductive metallurgy tool (100, 100'), and a first guide part (17, 17') and a second guide part (38, 38') are installed to form a spiral shape that matches each other on the base and the conductive column. By operating the forward and reverse rotation of the conductive column (30, 30') each time the electroplating conductive metallurgy tool (100, 100') is raised and lowered, crystals on the conductive plate (200) are cleaned using a scraper (36, 36') at the bottom of the conductive column (30, 30'), and good contact between the conductive column (30, 30') and the conductive plate (200) is secured, thereby improving the stability of current and voltage.

[0035] The above describes in detail the structure, features, and effects of the present invention through embodiments illustrated in the drawings. The above is merely a more preferred embodiment of the present invention, and the scope of the present invention is not limited by the drawings. Any changes or modifications made in accordance with the spirit of the present invention are equivalent embodiments of equivalent variations, and all shall fall within the scope of protection of the present invention as long as they do not depart from the spirit contained in the specification and drawings.

Claims

Claim 1 An electroplating conductive metallurgy apparatus comprising a base, an upper lid matching the base, a receiving chamber installed between the base and the upper lid, and a lifting conductive column received within the receiving chamber, wherein the bottom end of the conductive column penetrates the base downward and extends outside the receiving chamber; a first guide portion is installed on the base, and a second guide portion matching the first guide portion is installed on the conductive column, and at least one of the first guide portion and the second guide portion extends spirally from bottom to top, and a scraper is installed on the bottom end of the conductive column; wherein, under the action of an external force, the bottom end of the conductive column moves into the receiving chamber, and during the movement, the conductive column rotates under the interaction of the first guide portion and the second guide portion, and after the action of the external force is withdrawn, the conductive column proceeds to return movement. Claim 2 An electroplating conductive metallurgy apparatus according to claim 1, wherein the receiving chamber comprises an upper chamber and a lower chamber formed on the base, and the first guide member is formed on the inner wall surface of the lower chamber and protrudes into the lower chamber. Claim 3 An electroplating conductive metallurgy apparatus according to paragraph 2, wherein the lower chamber penetrates the bottom surface of the base downward, and a lower opening is formed on the said bottom surface; and the first guide portion is a rib extending in a spiral shape, which extends from top to bottom to the position of the lower opening. Claim 4 In paragraph 3, the electroplating conductive metallurgy apparatus is characterized in that the conductive column is equipped with an upper cylinder accommodated in the upper chamber and a lower cylinder accommodated in the lower chamber; and the second guide portion is a groove extending in a spiral shape, which is formed on the circumferential surface of the lower cylinder and extends from top to bottom. Claim 5 An electroplating conductive metallurgy apparatus according to claim 2, wherein the conductive column is equipped with an upper cylinder, a lower cylinder, a support sheet connected between the upper cylinder and the lower cylinder, and a spring installed over the upper cylinder, and an annular support member is formed at the bottom of the upper chamber, the support member supports the support sheet upward, and the support sheet supports the spring upward. Claim 6 An electroplating conductive metallurgy apparatus according to claim 5, wherein the conductive column further comprises an extendable guide rod accommodated within an upper cylinder and a lower cylinder, wherein an elastic means is installed on the extendable guide rod and the elastic means is accommodated within the lower cylinder. Claim 7 An electroplating conductive metallurgy apparatus according to claim 6, wherein a receiving groove and a through hole are further opened inside the lower cylinder, the elastic means is received within the receiving groove, the through hole extends downward and penetrates the bottom cross-section of the conductive column, the bottom end of the expandable guide rod is received within the through hole, and the top end of the expandable guide rod extends upward and protrudes from the top surface of the upper cylinder. Claim 8 An electroplating conductive metallurgy apparatus according to claim 1, wherein the scraper comprises three blades and the three blades are installed in a triangular star shape; and the width of the blades gradually decreases from the inside to the outside along the radial direction. Claim 9 An electroplating conductive metallurgy apparatus according to claim 1, characterized in that a circular bottom surface is installed at the bottom end of the conductive column, and the scraper extends in a straight line and passes through the center of the circular bottom surface. Claim 10 An electroplating conductive metallurgy apparatus comprising a base and a lifting conductive column installed within the base, wherein the conductive column and the base are matched with each other through a spiral guide section to cause the conductive column to rotate during the lifting process, a scraper exposed from below the base is installed at the bottom end of the conductive column, a spring is installed over the conductive column, a receiving chamber is formed in the base, the spring is received within the receiving chamber, the bottom end of the conductive column moves toward the receiving chamber under the action of an external force, the conductive column rotates during the movement process under the interaction between the guide sections, and returns to a position under the action of the spring after the external force is withdrawn.

Images