Printed circuit board, fabrication method of the same and electronic device including the same

Abstract

According to various embodiments disclosed in this document, a printed circuit board and / or an electronic device including the same comprises at least one insulating layer comprising a first rigid region and a flexible region extending from the first rigid region, at least one first circuit pattern disposed on any side of the insulating layer so as to at least partially traverse the first rigid region to the flexible region, and at least one conductive pad formed at least partially on the surface of the first circuit pattern in the first rigid region, wherein the flexible region may be configured to be deformably more flexibly than the first rigid region. Various other embodiments are possible.

Description

Technology Field

[0001] The various embodiments disclosed in this document relate to electronic devices, for example, printed circuit boards and electronic devices including the same. Background Technology

[0002] With the development of electronic, information, and communication technologies, various functions are being integrated into a single electronic device. For example, an electronic device (e.g., a smartphone) includes communication functions as well as functions such as an audio player, an imaging device, or an electronic notebook, and even more diverse functions can be implemented on the smartphone through the additional installation of applications. In addition to executing installed applications or stored functions, the electronic device can receive various information in real time by connecting to a server or other electronic device via wired or wireless means.

[0003] As various functions are implemented in a single electronic device, wiring for connecting electrical / electronic components such as displays, audio components, cameras, and various sensors is increasing. Furthermore, with improvements in video and audio quality, electronic devices can include more electrical / electronic components and more signal wiring connected to them. Recently, with the commercialization of flexible displays, foldable electronic devices combining multiple structures (e.g., housings) that move relative to each other have been commercialized. When the multiple structures are folded for portability and use, they can be unfolded to utilize a wide screen, thereby improving user convenience. On the other hand, although they have more limited functions than smartphones or tablet PCs, wearable electronic devices in the form of wristwatches or glasses can be more convenient to carry and use.

[0004] Printed circuit boards can provide means for placing or electrically connecting different electrical / electronic components within such electronic devices, and can improve design freedom in various signal wiring by using flexible printed circuit boards depending on the wiring environment. For example, integrated circuit chip(s) or various active / passive component(s) can be mainly placed on a rigid circuit board, and components such as displays or cameras can be electrically connected to the circuit board on which the integrated circuit chip(s) are placed through signal wiring such as a flexible printed circuit board.

[0005] The information for which it is described may be provided as background art for the purpose of aiding understanding of the disclosure of this document. No claim or determination is made as to whether any of the foregoing may be applied as prior art in connection with the disclosure of this document. The problem to be solved

[0006] In electronic devices composed of multiple different structures (e.g., housings), flexible printed circuit boards may be used to electrically connect electrical / electronic components placed in each of the different structures. However, the placement of connectors may be required to electrically connect the flexible printed circuit board with a rigid circuit board, and such placement of connectors can hinder the miniaturization of the circuit board or electronic device. As the performance of electrical / electronic components improves, more signal lines may be placed on the flexible printed circuit board; however, as the number of signal lines increases, the flexibility of the flexible printed circuit board may decrease. For example, if the flexibility of the flexible printed circuit board decreases, the folding / unfolding operation may not be smooth in electronic devices where housings are folded facing each other or rotated between positions where they are unfolded side by side, and the durability of the flexible printed circuit board may decrease due to repeated folding / unfolding operations.

[0007] Various embodiments disclosed in this document may provide a printed circuit board that is easy to miniaturize by including a rigid region and a flexible region that can be deformed more flexibly than the rigid region, a method for manufacturing the same, and / or an electronic device including the same.

[0008] Various embodiments disclosed in this document may provide a printed circuit board with improved reliability and durability while providing electrical connections between different structures that are relatively movable relative to each other, a method for manufacturing the same, and / or an electronic device including the same.

[0009] Additional aspects according to various embodiments will be presented through the detailed description below, which may become partially apparent from the description or understood through the embodiments of the presented implementation. means of solving the problem

[0010] According to various embodiments disclosed in this document, a printed circuit board and / or an electronic device including the same comprises at least one insulating layer comprising a first rigid region and a flexible region extending from the first rigid region, at least one first circuit pattern disposed on any side of the insulating layer so as to at least partially cross the first rigid region to the flexible region, and at least one conductive pad formed at least partially on the surface of the first circuit pattern in the first rigid region, wherein the flexible region may be configured to be flexibly deformable than the first rigid region.

[0011] According to various embodiments disclosed in this document, an electronic device comprises a first housing, a second housing coupled to the first housing and rotatably coupled to the first housing, a hinge structure for rotatably coupling the second housing to the first housing, and a printed circuit board, wherein the printed circuit board comprises at least one insulating layer comprising a first rigid region and a flexible region extending from the first rigid region, at least one first circuit pattern disposed at least partially across the first rigid region from the flexible region on any one side of the insulating layer, and at least one conductive pad formed at least partially on the surface of the first circuit pattern in the first rigid region, wherein the flexible region is disposed at least partially across the region where the hinge structure is disposed and may be configured to be flexibly deformable than the first rigid region.

[0012] According to various embodiments disclosed in this document, a method for manufacturing a printed circuit board may include: preparing at least one insulating layer comprising a first rigid region and a flexible region extending from the first rigid region; laminating an electrically conductive film on at least one surface of the insulating layer; attaching a dry film to the surface of the electrically conductive film and removing a portion of the dry film to expose a portion of the electrically conductive film; forming a plating layer on at least a portion of the exposed surface of the electrically conductive film; removing the dry film and forming an etching mask to expose at least a portion of the electrically conductive film or at least a portion of the plating layer; and etching to remove at least a portion of the exposed electrically conductive film or at least a portion of the exposed plating layer. Effects of the invention

[0013] According to various embodiments disclosed in this document, a printed circuit board may include a rigid region and a flexible region to improve design freedom in the placement of signal wiring, and the flexible region may extend from the rigid region without a separate connector, thereby allowing the printed circuit board to be miniaturized and / or making it easier to secure space for signal wiring. According to various embodiments, the signal wiring and / or circuit pattern in the flexible region may include rolled copper foil, thereby allowing for more flexible deformation than the rigid region, while ensuring the durability of the signal wiring and / or circuit pattern even under repeated deformation of the flexible region. In addition, various effects that can be identified directly or indirectly through this document may be provided. Brief explanation of the drawing

[0014] The aspects, configurations, and / or advantages described above regarding the various embodiments disclosed in this document may become more apparent from the following detailed description with reference to the attached drawings. FIG. 1 is a cross-sectional view showing a printed circuit board according to various embodiments disclosed in this document. FIG. 2 is a simplified illustration of a printed circuit board according to various embodiments disclosed in this document. FIG. 3 is a flowchart illustrating a method for manufacturing a printed circuit board according to various embodiments disclosed in this document. FIGS. 4 to 9 are drawings sequentially illustrating the process of manufacturing a printed circuit board according to various embodiments disclosed in this document. FIG. 10 is a drawing showing an enlarged view of the area indicated as 'A' in FIG. 9. FIG. 11 is an exploded perspective view showing an electronic device including a printed circuit board according to various embodiments disclosed in this document. FIG. 12 is an enlarged view of a portion of an electronic device including a printed circuit board according to various embodiments disclosed in this document. Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers. Specific details for implementing the invention

[0015] The following description regarding the attached drawings may be provided to facilitate a comprehensive understanding of various implementations of the disclosure defined by the claims and their corresponding contents. The specific embodiments disclosed in the following description include various specific details to aid understanding, but are to be considered as one of various embodiments. Accordingly, it is evident to those skilled in the art that various changes and modifications to the various implementations described herein may be made without departing from the scope and technical spirit of the disclosure. Furthermore, for the sake of clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0016] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe the various embodiments disclosed in this document. Accordingly, it will be obvious to a person skilled in the art that the following description of various implementations of the disclosure is provided solely for illustrative purposes and not for the purpose of limiting the scope of rights or the disclosure defined as equivalent thereto.

[0017] Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include a plural meaning. Thus, for example, "component surface" may mean one or more of the component surfaces.

[0018] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0019] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0020] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0021] Various embodiments of this document may be implemented as software (e.g., a program) comprising one or more instructions stored in a storage medium (e.g., internal memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0022] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0023] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0025] FIG. 1 is a cross-sectional view showing a printed circuit board (100) according to various embodiments disclosed in this document. FIG. 2 is a simplified illustration of a printed circuit board (100) according to various embodiments disclosed in this document.

[0026] Referring to FIGS. 1 and 2, a printed circuit board (100) may include at least one insulating layer (101, 111) and at least one wiring layer (102), and the insulating layer (101, 111) may include at least one rigid region (RR1, RR2) and a flexible region (FR) extending from the rigid region (RR1, RR2). In one embodiment, the flexible region (FR) may be deformed more flexibly than the rigid region (RR1, RR2). For example, when an external force is applied, the rigid region (RR1, RR2) may be maintained in a substantially flat shape, and the flexible region (FR) may be deformed in various ways, such as a flat shape and a curved shape. In another embodiment, when the printed circuit board (100) includes a plurality of rigid regions (RR1, RR2), the flexible region (FR) may be a flexible structure that mechanically connects the rigid regions (RR1, RR2).

[0027] According to various embodiments, the insulating layer (101, 111) may comprise a synthetic resin film such as polyimide or PET (polyethylene terephthalate) and may provide a surface or area forming a circuit pattern (121) and / or a wiring layer (102). In one embodiment, the printed circuit board (100) may comprise a plurality of insulating layers (101, 111), and a wiring layer (102) (e.g., circuit pattern (121)) formed on different surfaces of the insulating layers (101, 111) or on different insulating layers (101, 111) may be electrically connected through via holes (e.g., via holes (23) in FIG. 9) or via conductors (125) formed to penetrate the insulating layers (101, 111). The via conductor (125) may include a metal material or plating layer disposed in at least part of the via hole (23).

[0028] According to various embodiments, the printed circuit board (100) may include two or more, approximately six, insulating layers (101, 111), and the flexible region (FR) may be deformed into a flat or curved shape by an external force. According to an embodiment, when including five insulating layers (101, 111), the printed circuit board (100) may include four to six wiring layers (102)(s) disposed between two adjacent insulating layers (101, 111) and / or on the surface of the outermost insulating layer. The number of insulating layers (101, 111) and wiring layers (102) included in the printed circuit board (100) is not limited to these examples and may be combined in various ways according to the required specifications. For example, the number of wiring layers (102) may be appropriately selected according to the specifications required in the printed circuit board (100), in the range of 1 to 8, and the number of insulating layers (101) may be determined to correspond to the number of selected wiring layers (102). In some embodiments, when the printed circuit board (100) includes a plurality of insulating layers (101, 111), any one of the plurality of insulating layers (101, 111) (e.g., insulating layer designated as '111') may include a dielectric material such as FR4. For example, the printed circuit board (100) may further include additional insulating layers (111) in the rigid regions (RR1, RR2) that are not present in the flexible regions (FR). In one embodiment, the insulating layer (111) may be formed of a glass epoxy material (e.g., FR4 material and / or CEM-1 material).

[0029] According to various embodiments, the wiring layer (102) may include at least one circuit pattern (121) and at least one conductive pad (123). The circuit pattern (121) may be positioned, for example, across at least a portion of the flexible region (FR) from the rigid region (RR1, RR2) on at least one side of the insulating layer (101). When multiple rigid regions (RR1, RR2) are provided, both ends of the circuit pattern (121) may be positioned across the flexible region (FR) while being placed in at least one of the rigid regions (RR1, RR2). For example, the circuit pattern (121) may electrically connect electrical / electronic components placed in the rigid regions (RR1, RR2) across the flexible region (FR).

[0030] According to various embodiments, circuit patterns (121) may be disposed on both sides of a single insulating layer (101), and according to an embodiment, via conductors (125) formed to penetrate the insulating layers (101, 111) may electrically connect the circuit patterns (121) on both sides of the insulating layer (101). In some embodiments, when a printed circuit board (100) includes a plurality of insulating layers (101), the insulating layers (101) are stacked sequentially, and a plurality of circuit patterns (121) may be formed on at least a portion between two adjacent insulating layers (101) among the insulating layers (101), or on at least a portion of the surface of the insulating layer (101) disposed on the outermost part among the insulating layers (101). In the illustrated embodiment, the outermost circuit pattern (121) is exemplified as being exposed to the external space, but the various embodiments disclosed herein are not limited thereto, and another insulating layer or coating layer not illustrated may be formed to protect the outermost circuit pattern (121).

[0031] According to various embodiments, a printed circuit board (100) may include via holes (e.g., via holes (23) of FIG. 4) or via conductors (125) formed in a plurality of insulating layers (101, 111), and circuit patterns (121) placed on different layers may be electrically connected through via conductors (125). In the following detailed description, if it is necessary to distinguish between circuit patterns (121) or rigid regions (RR1, RR2) placed on different layers, ordinal numbers such as 'first' and 'second' may be used, and it should be noted that this is merely for distinction and such use of ordinal numbers does not limit the various embodiments disclosed in this document.

[0032] According to various embodiments, the circuit pattern (121) may comprise at least a portion of an electrically conductive film, such as rolled copper foil, laminated to the surface of the insulating layer (101). Generally, the circuit pattern of the printed circuit board may be formed based on a plating layer formed by a plating method or an electrolytic copper foil, but in various embodiments, the circuit pattern (121) may comprise at least a portion of rolled copper foil in at least the flexible region (FR). Compared to electrolytic copper foil, an electrically conductive film such as rolled copper foil has a high elongation and can have significant durability against repeated deformation when placed in the flexible region (FR).

[0033] According to various embodiments, the conductive pad (123) may be disposed in a first rigid region (RR1) (or a second rigid region (RR2)) and may be formed at least partially on the surface of the circuit pattern (121). The conductive pad (123) may be formed at a location corresponding to a via hole (23) or a via conductor (125) in the rigid region (RR1, RR2). For example, in electrically connecting circuit patterns (121) disposed on different layers, the conductive pad (123) may provide a stable contact structure or a stable electrical connection structure between the via conductor (125) and the circuit pattern (121)(s). According to one embodiment, the conductive pad (123) and the via conductor (125) may be different parts of a plating layer (e.g., electrolytic copper foil) formed to contact the circuit pattern (121). This will be revisited with reference to FIG. 10.

[0034] In the illustrated embodiments, the conductive pad (123) is exemplified as a structure formed at a location corresponding to a via hole (23) or a via conductor (125), but it should be noted that the various embodiments disclosed herein are not limited thereto. In some embodiments, the wiring layer (102) of the rigid regions (RR1, RR2) may include an additional plating layer formed corresponding to the trajectory of the circuit pattern (121), and the conductive pad (123) may be a part of the plating layer formed in the rigid regions (RR1, RR2) corresponding to a via hole (23) or a via conductor (125). In other embodiments, an additional circuit pattern not illustrated may be provided in addition to the circuit pattern (121) formed from rolled copper foil in the rigid regions (RR1, RR2), and the additional circuit pattern may include at least a part of the electrolytic copper foil (e.g., plating layer).

[0035] According to various embodiments, in forming a plating layer (e.g., via conductors (125) and / or conductive pads (123)), a plating mask (131) (e.g., the plating mask (131) of FIG. 4) may be provided on the surface of a circuit pattern (121) or rolled copper foil (e.g., the rolled copper foil (22) of FIG. 4) in a flexible region (FR). For example, in the flexible region (FR), the circuit pattern (121) or the rolled copper foil (22) may be substantially concealed to block the growth of the plating layer (e.g., conductive pads (123)). This ensures flexibility in the flexible region (FR), and in the rigid region (RR1, RR2), via conductors (125) and / or conductive pads (123) that electrically connect the circuit patterns (121) may be formed. In one embodiment, after forming the plating layer, the plating mask (131) is removed, and the plating mask (131) may not be present on the finished printed circuit board (100).

[0036] According to various embodiments, various electrical / electronic components (e.g., the integrated circuit chip (241a) of FIG. 12) may be placed in rigid regions (RR1, RR2) of the printed circuit board (100) and / or insulating layer (101). Circuit patterns (121)(s) in the flexible region (FR) may electrically connect these electrical / electronic components(s) with other electrical / electronic components (e.g., the camera module (251) or sensor module (253))(s) of FIG. 11 that are not placed on the printed circuit board (100) or other electrical / electronic components(s) placed in the second rigid region (RR2). In some embodiments, among the rigid regions (RR1, RR2) of the printed circuit board (100) and / or insulating layer (101), the first rigid region (RR1) is placed in either of the different structures of the electronic device (e.g., the electronic device (200) of FIG. 11), and the flexible region (FR) may be placed across or connecting the different structures. In some embodiments, among the rigid regions (RR1, RR2) of the printed circuit board (100) and / or insulating layer (101), the second rigid region (RR2) is placed in the other of the different structures of the electronic device, and the flexible region (FR) may provide connecting wiring between the first rigid region (RR1) and the second rigid region (RR2).

[0037] According to various embodiments, the printed circuit board (100) may be provided as a wiring member in, for example, an electronic device of Korean Patent Publication No. 10-2020-0092586 (published August 4, 2020; U.S. Patent Publication No. 2020 / 0245481, published July 30, 2020) filed by the applicant, and as a wiring member of a foldable electronic device and / or a wearable electronic device (e.g., the electronic device (200) of FIG. 11) to be described below. Various embodiments of the present disclosure may include configurations of the aforementioned published patents, but may not include descriptions or configurations that are clearly contrary to the various embodiments of the present disclosure. In one embodiment, the rigid regions (RR1, RR2)(s) of the printed circuit board (100) and / or insulating layer (101) are positioned in either one of the housing structures of the foldable electronic device or in either a wearable member (e.g., the wearable member (203) of FIG. 11) or a lens frame (e.g., the lens frame (202) of FIG. 11), and the flexible region (FR) may be positioned across the folding region or hinge structure of the display. According to one embodiment, as the structures in the electronic device move or rotate relative to each other, the flexible region (FR) may be deformed into a flat shape or a curved shape. The circuit pattern (121) in the printed circuit board (100) may be formed of rolled copper foil and may have better durability than electrolytic copper foil against repeated bending deformation of the flexible region (FR).

[0038] Hereinafter, a method for manufacturing a printed circuit board (100) will be examined with reference to FIG. 3. In examining a method for manufacturing a printed circuit board (100) other than the various embodiments disclosed in this document, the embodiments of FIG. 1 and FIG. 2 may be referenced. FIG. 4 to FIG. 10 may be further referenced regarding the product or manufactured according to each operation(s) of the manufacturing method.

[0039] FIG. 3 is a flowchart illustrating a method (10) for manufacturing a printed circuit board (e.g., the printed circuit board (100) of FIG. 1 or FIG. 2) according to various embodiments disclosed in this document. FIG. 4 through 9 are drawings sequentially illustrating the process of manufacturing a printed circuit board (100) according to various embodiments disclosed in this document. FIG. 10 is a drawing showing an enlarged view of the area indicated by 'A' in FIG. 9.

[0040] Referring to FIG. 3, a method (10) for manufacturing a printed circuit board (100) according to various embodiments disclosed in this document may include a preparation operation (11), a plating mask formation operation (13), a plating operation (15), an etching mask formation operation (17) and / or an etching operation (19), and a cleaning / washing operation may be performed as needed after each operation(s) are executed. Although the illustrated embodiment discloses a configuration in which a circuit pattern (e.g., a circuit pattern (121) of FIG. 1 or 2) or a conductive pad (e.g., a conductive pad (123) of FIG. 1 or 2) is formed on at least one surface of an insulating layer (e.g., an insulating layer (101) of FIG. 1 or 2), the various embodiments disclosed herein are not limited thereto, and the printed circuit board (100) may include one or more and six or fewer wiring layers (102) (e.g., circuit patterns (121)) and a corresponding number of insulating layers (101), and the circuit patterns (121)(s) may be disposed on different surfaces of the insulating layers (101)(s). As previously mentioned, the number of wiring layers (102) and insulating layers (101) is not limited to that illustrated in the present disclosure and may be combined in various ways.

[0041] According to various embodiments, the preparation operation (11) is an operation of providing an insulating layer (21)(s) and / or a rolled copper foil (22) and laminating the insulating layer (21) and the rolled copper foil (22), wherein the insulating layer (21) and the rolled copper foil (22) may be produced in film form in different processes. In laminating the insulating layer (21) and the rolled copper foil (22), the rolled copper foil (22) may be placed on at least one side of the insulating layer (21) by a roll laminating method or a press method in the preparation operation (11). In some embodiments, before lamination, the insulating layer (21) may include a rigid region (e.g., rigid region (RR1, RR2) of FIG. 1) and a flexible region (e.g., flexible region (FR) of FIG. 1). In another embodiment, after the plating layer described below (e.g., the plating layer (25, 27) of FIG. 5) is formed, or after the insulating layer (111) of FIG. 1 described above is formed, a portion of the insulating layer (21) may be set as a rigid region (RR1, RR2), and at least another portion may be set as a flexible region (FR).

[0042] According to various embodiments, the rolled copper foil (22) on at least one side of the insulating layer (21) may be attached to a portion of the surface of the insulating layer (21) or to the entire surface of the insulating layer (21). According to one embodiment, the preparation operation (11) may further include the operation of forming a via hole (23). The via hole (23) may be formed to penetrate at least a portion of the insulating layer (101) in a rigid region (e.g., rigid region (RR1, RR2) of FIG. 1). In some embodiments, for example, as illustrated in FIG. 4, the via hole (23) penetrates the rolled copper foil (22) on one side of the insulating layer (21), and one end of the via hole (23) may be closed by another rolled copper foil (22) adjacent to the other side of the insulating layer (21).

[0043] According to various embodiments, in the plating mask forming operation (13), a plating mask (31) may be formed on at least a portion of the surface of the rolled copper foil (22). Referring further to FIG. 4, the plating mask (31) may expose at least a portion of the rolled copper foil (22) to the outside around at least the via hole (23) or in an area corresponding to the via hole (23). According to one embodiment, the plating mask (31) may be formed by exposing and developing a portion of a photoresist or dry film containing a photosensitive material while the photoresist or dry film is placed or attached to the surface of the rolled copper foil (22). For example, the plating mask (31) may expose a portion of the rolled copper foil (22) to the outside space by removing a portion of the photoresist or dry film in an area where a plating layer (e.g., plating layer (25, 27) of FIG. 5) is to be formed.

[0044] According to various embodiments, the plating operation (15) is an operation of forming an electrolytic copper foil, e.g., a plating layer (25, 27), on a portion exposed to the outside of the plating mask (31), and the plating layer (25, 27) can be grown using a rolled copper foil (22) exposed to the outside of the plating mask (31) as a seed. For example, the plating layer (25, 27) can be grown in contact with the rolled copper foil (22) on one side (e.g., upper surface) of the insulating layer (21) on the via hole (23), and can be grown from the rolled copper foil (22) on the other side (e.g., lower surface) of the insulating layer (21) inside the via hole (23). In one embodiment, an additional plating layer (25) can be grown or formed from the surface of the rolled copper foil (22) on the lower surface of the insulating layer (21) outside the via hole (23). Referring further to FIG. 5, the plating layer (25, 27) may be provided as a via conductor (27) (e.g., via conductor (125) of FIG. 1 or FIG. 2) within the via hole (23) and as a conductive pad (25) (e.g., conductive pad (123) of FIG. 1 or FIG. 2) outside the via hole (23).

[0045] According to various embodiments, a via conductor (27) (e.g., a via conductor (125) of FIG. 1 or FIG. 2) may be utilized to electrically connect a rolled copper foil (22) or a circuit pattern (e.g., a circuit pattern (121) of FIG. 1 or FIG. 2) formed on different surfaces of an insulating layer (21) or on different insulating layers (21) (e.g., insulating layers (101) of FIG. 1). In some embodiments, a conductive pad (25) (e.g., a conductive pad (123) of FIG. 1 or FIG. 2) may maintain a more stable connection between the via conductor (27) and the circuit pattern (121) (or rolled copper foil (22)). In another embodiment, a plating layer grown on a rolled copper foil (22) exposed to the outside on the other side of the insulating layer (21) (e.g., the bottom side of FIG. 5 or FIG. 6) can form another conductive pad (25) (e.g., the conductive pad (123) of FIG. 1 or FIG. 2).

[0046] According to various embodiments, after the plating layer (25, 27) conforming to the designed specifications is formed, the plating mask (31) can be removed as illustrated in FIG. 6. In the illustrated embodiments, the plating layer (25, 27) is illustrated as being formed substantially within the via hole (23) or as being formed on the surface of the rolled copper foil (22) in an area corresponding to the via hole (23), but it should be noted that the various embodiments disclosed herein are not limited thereto. According to the embodiments, the plating layer (25, 27) may be further formed on at least a portion of the surface of the rolled copper foil (22) in a rigid region (e.g., rigid region (RR1, RR2) of FIG. 1). For example, the wiring layer (102) in the rigid region (RR1, RR2) may further include an additional conductive layer not illustrated along the signal line provided by the circuit pattern (121). As will be described later, after the etching operation (19), the edge or side of the electrolytic copper foil may be formed at least partially inclined with respect to the surface of the insulating layer (21, 101). In one embodiment, before the etching operation (19), or after the plating mask (31) is removed, the edge or side of the plating layer (25) may be formed substantially perpendicular to the surface of the insulating layer (21) or the rolled copper foil (22), as illustrated in FIG. 6.

[0047] According to various embodiments, the etching mask forming operation (17) is an operation of forming an etching mask (e.g., the etching mask (33) of FIG. 7 or FIG. 8) corresponding to a designed signal line / wiring on the surface of a plating layer (25, 27) or rolled copper foil (22), and the etching mask (33) can be formed by placing or attaching a photoresist or dry film, followed by exposure and development. After the etching mask (33) is formed, a portion of the plating layer (25, 27) or rolled copper foil (22) may be exposed to an external space. For example, as illustrated in FIG. 7, a portion of the plating layer (25, 27) or rolled copper foil (22) that is not to be used as a signal line or wiring (e.g., the wiring layer (102) of FIG. 1 or FIG. 2) may be exposed outside the etching mask (33).

[0048] According to various embodiments, the etching operation (19) may be an operation of removing a portion of the plating layer (25, 27) or rolled copper foil (22) exposed outside the etching mask (33) with an etching solution selected in consideration of the composition of the rolled copper foil (22) or electrolytic copper foil (or plating layer (25, 27)). For example, the etching mask (33) may protect from the etching solution a portion of the plating layer (25, 27) or rolled copper foil (22) that corresponds to a designed signal line / wiring. After the etching operation (19), as illustrated in FIG. 8, a portion of the plating layer (25, 27) or rolled copper foil (22) (e.g., a portion exposed outside the etching mask (33)) is removed, and the portion protected by the etching mask (33) remains on the surface of the insulating layer (21) and can be provided as a circuit pattern (e.g., circuit pattern (121) of FIG. 1 or FIG. 2) or a conductive pad (e.g., conductive pad (123) of FIG. 1 or FIG. 2).

[0049] According to various embodiments, after the etching operation (19), the etching mask (33) may be removed, and when manufacturing a printed circuit board (e.g., the printed circuit board (100) of FIG. 1) comprising a plurality of insulating layers (21) (e.g., the insulating layer (101) of FIG. 1), an additional insulating layer may be laminated to the insulating layer (21, 101) on which the circuit pattern (121) or conductive pad (123) is formed, and the operations of the manufacturing method described above may be repeated sequentially. Referring further to FIG. 9 and FIG. 10, the width (W1) of the via hole (23) or via conductor (27, 125) may be approximately 60 micrometers or more and approximately 100 micrometers or less. In one embodiment, the width from the edge of the via hole (23) or via conductor (27, 125) to the edge of the conductive pad (25, 123) (e.g., second width (W2)) may be approximately 85 micrometers. In some embodiments, the second width (W2) may be greater than 85 micrometers. In other embodiments, the width from the edge of the conductive pad (25, 123) to the edge of the rolled copper foil (22) (e.g., circuit pattern (121)) (e.g., third width (W3)) may be approximately 45 micrometers. In some embodiments, the third width (W3) may be greater than 45 micrometers.

[0050] According to various embodiments, the thickness of the wiring layer (102) in the rigid region (e.g., the rigid region (RR1, RR2) of FIG. 1) may be approximately 1.5 times or more and 4.0 times or less the thickness of the wiring layer (102) in the flexible region (FR). Here, "thickness" may mean the height from the surface of the insulating layer (21, 101) to the surface of the wiring layer (102) (e.g., the circuit pattern (121) and / or the conductive pad (25, 123)). In one embodiment, the wiring layer (102) or the circuit pattern (121) may include a conductive layer that provides a conductive line for signal or power transmission, or a ground. In another embodiment, the rolled copper foil (22) or circuit pattern (121) is formed to extend generally from the rigid region (RR1, RR2) and at least partially cross the flexible region (FR), and a conductive pad (25, 123) may be formed on at least a portion of the surface of the circuit pattern (121) within the rigid region (RR1, RR2). In some embodiments, even in the rigid region (RR1, RR2), the thickness of the wiring layer (102) in the portion where the conductive pad (25, 123) is not formed may be substantially the same as the thickness of the circuit pattern (121) in the flexible region (FR). In one embodiment, the conductive pad (25, 123) may be formed to be at least approximately 0.5 times the thickness of the circuit pattern (121). In another embodiment, the conductive pad (25, 123) may be formed with a thickness of approximately 3.0 times the thickness of the circuit pattern (121), and the thickness of the wiring layer (102) in the portion where the conductive pad (25, 123) and the circuit pattern (121) overlap may substantially reach approximately 4.0 times the thickness of the circuit pattern (121). Thus, the flexible region (FR) in the printed circuit board (100) or insulating layer (21, 101) can be deformed more flexibly than the rigid region (RR1, RR2)(s).

[0051] According to various embodiments, after the etching operation (19) or after the etching mask (33) is removed, the edge or side (121a) of the rolled copper foil (22) (e.g., circuit pattern (121)) may be formed at least partially inclined with respect to the surface of the insulating layer (21, 101). This is a phenomenon that occurs in the chemical reaction of the rolled copper foil (22) with the etching solution and may not substantially affect the performance or electrical characteristics of the printed circuit board (100). According to another embodiment, after the etching operation (19) or after the etching mask (33) is removed, the edge or side (123a) of the electrolytic copper foil (e.g., conductive pad (25, 123)) may be formed at least partially inclined with respect to the surface of the insulating layer (21, 101) or the surface of the circuit pattern (121). This is a phenomenon that occurs in the chemical reaction of the electrolytic copper foil with respect to the etching solution, and may not substantially affect the performance or electrical characteristics of the printed circuit board (100).

[0052] FIG. 11 is an exploded perspective view showing an electronic device (200) including a printed circuit board (e.g., the printed circuit board (100) of FIG. 1) according to various embodiments disclosed in this document. FIG. 12 is an enlarged view showing a portion of an electronic device (200) including a printed circuit board (100) according to various embodiments disclosed in this document. In examining the embodiments of FIG. 11 and / or FIG. 12, the printed circuit board (100) of FIG. 1 may be referenced.

[0053] Referring to FIGS. 11 and 12, the electronic device (200) is a wearable electronic device in the form of glasses, so that the user can visually perceive surrounding objects or environments even while wearing the electronic device (200). The electronic device (200) can acquire or perceive visual images of objects or environments in the direction the user is looking at or the direction the electronic device (200) is facing (e.g., -Y direction) using a camera module (251), and can receive information about objects or environments from an external electronic device or a service provider through a network. In another embodiment, the electronic device (200) can provide the received information (e.g., information about objects or environments) to the user in an auditory or visual form. For example, the electronic device (200) can provide the received information about objects or environments to the user in a visual form through a lens (201) using a display module (not shown). By implementing information about objects or environments in a visual form and combining it with actual images of the user's surrounding environment, the electronic device (200) can implement augmented reality. In the following detailed description, various references may be made regarding "the state or position in which the electronic device or a designated component of the electronic device faces the user's face," and it should be noted that this is based on the premise that the user is wearing the electronic device (200).

[0054] According to various embodiments, the electronic device (200) may include at least one lens (201), a lens frame (202), and / or a wearable member (203), and according to an embodiment, the lens (201) may be provided as a pair so that it is positioned to correspond to the user's left eye and right eye, respectively, when the electronic device (200) is worn on the user's body. In some embodiments, the electronic device (200) may include a single lens (201), in which case the lens (201) may be positioned to correspond to either the user's left eye or right eye. In other embodiments, the electronic device (200) may include a form (e.g., a goggle form) that includes a single lens (201) corresponding to the left eye and the right eye.

[0055] According to various embodiments, the lens (201) can receive external light and focus or guide it toward the user's left or right eye. Although not illustrated, the lens (201) may include an optical waveguide structure and can provide the user with an image output from a display module (e.g., an image visually representing information about surrounding objects or the environment) using the optical waveguide structure.

[0056] According to various embodiments, the lens frame (202) is a structure that fixes at least one of the lenses (201) and can be supported or positioned on the user's face while the user is wearing the electronic device (200). For example, the lens frame (202) can position at least one of the lenses (201) to correspond to the user's eyesight. In one embodiment, the lens frame (202) may include a polymer such as polycarbonate or a metallic material. In one embodiment, when the lens frame (202) includes a metallic material, the electronic device (200) can perform wireless communication using the metallic portion of the lens frame (202).

[0057] According to various embodiments, the lens frame (202) may include a first frame (202a) positioned facing the user's face and a second frame (202b) coupled to the first frame (202a). For example, when the user is wearing the electronic device (200), the first frame (202a) may be positioned facing the user's face, and the second frame (202b) may be positioned facing in the opposite direction to the first frame (202a), for example, the direction the user is looking. In one embodiment, the lenses (201) may be positioned in the lens frame (202) such that at least a portion of their edges is located between the first frame (202a) and the second frame (202b). For example, the first frame (202a) and the second frame (202b) may be coupled to face each other, thereby binding or fixing at least one edge of the lenses (211). In some embodiments, the lens frame (202) may have a shape that exposes a portion of the side of the lens (201) to the external environment, and in illustrated embodiments, it may have a closed curve shape that surrounds the lens (201).

[0058] According to various embodiments, the electronic device (200) may include a camera module (251) and / or a sensor module (253) disposed on a lens frame (202). A flexible printed circuit board (205) (e.g., a flexible region (FR) of the printed circuit board (100) of FIG. 1) may extend from a circuit board (241) (e.g., a first rigid region (RR1) of the rigid regions (RR1, RR2) of FIG. 1) received in a wearable member (203), and may electrically connect the camera module (251) and / or sensor module (253) disposed on the lens frame (202) to the circuit board (241). The camera module (251) may acquire an image of surrounding objects or the environment through a first optical hole (221) formed in the second frame (202b). The camera module (251) and / or the first optical hole (221) may be positioned at each end of the lens frame (202) (e.g., the second frame (202b)), for example, at each end of the lens frame (202) (e.g., the second frame (202b)) in the X direction. A processor (not shown) of the electronic device (200) may recognize an object or environment based on an image acquired through the camera module (251). In some embodiments, the electronic device (200) may transmit the image acquired through the camera module (251) to an external electronic device or wireless communication service provider to request information regarding the image.

[0059] According to various embodiments, a flexible region (FR) of a flexible printed circuit board (205), for example, a printed circuit board (100), may extend from either of the rigid regions (RR1, RR2) (e.g., a circuit board (241)) and extend across a hinge structure (229) into the interior of a lens frame (202), and may be positioned within the interior of the lens frame (202) at least a portion of the circumference of the lens (201). In one embodiment, a second rigid region (RR2) of the rigid regions (RR1, RR2) of FIG. 1 may be positioned within the lens frame (202). In some embodiments, the camera module (251) and / or sensor module (253) may be substantially disposed within the lens frame (202) and electrically connected to a second rigid region (RR2) or a flexible region (FR) among the rigid regions (RR1, RR2) within the lens frame (202).

[0060] According to various embodiments, the sensor module (253) may include a proximity sensor and may be electrically connected to the circuit board (241) through a flexible printed circuit board (205) (e.g., a flexible area (FR)). According to an embodiment, the flexible printed circuit board (205) may include a branched structure within the lens frame (202), and a portion of the branched flexible printed circuit board (205) or the flexible area (FR) may be directly connected to the camera module (251) and / or the sensor module (253). The sensor module (253) may detect whether a user's body (e.g., a finger) approaches the lens (201) or remains in close proximity to the lens (201) within a certain distance through a second optical hole (223) formed in the second frame (202b). The sensor module (253) and / or the second optical hole (223) may be positioned between the camera modules (251) in the central part of the lens frame (202), for example, in the X direction. In this embodiment, the electronic device (200) is illustrated as having a configuration including one sensor module (253) (e.g., a proximity sensor) and one second optical hole (223), but various embodiments are not limited thereto, and the number and / or location of the sensor module (253) and the second optical hole (223) may be varied to more accurately detect the approach or proximity of the user's body.

[0061] According to various embodiments, when the approach of a user's body is detected through a sensor module (253) (e.g., a proximity sensor), the electronic device (200) may be configured to perform a specified function. In some embodiments, the sensor module (253) may include an eye-tracking sensor not illustrated. For example, the electronic device (200) may track the user's gaze using the eye-tracking sensor and adjust the position and / or size of an image provided to the user through the lens (201) according to the user's gaze.

[0062] According to various embodiments, the electronic device (200) may include a pair of wearable members (203). Each wearable member (203) extends from the lens frame (202) and, together with the lens frame (202), may be partially supported or positioned on the user's body (e.g., ear). In one embodiment, the wearable member (203) may be rotatably coupled to the lens frame (202) via a hinge structure (229), and when not wearing the electronic device (200), the user may fold the wearable member (203) to overlap the lens frame (202) for convenient carrying or storage. A portion of the hinge structure (229) may be mounted on the lens frame (202), and another portion may be received or mounted inside the wearable member (203). A hinge cover (227) is mounted on the lens frame (202) to conceal a part of the hinge structure (229), and another part of the hinge structure (229) may be received or concealed between the inner case (231) and the outer case (233) to be described later.

[0063] According to various embodiments, a flexible region (FR) (e.g., a flexible printed circuit board (205)) may be bent and deformed depending on the movement of the wearing member (203) being folded over the lens frame (202) or unfolded from the lens frame (202) at a specified angle. According to one embodiment, a circuit pattern (e.g., a circuit pattern (121) of FIG. 1) in the flexible region (FR) may have superior durability to a signal wiring based on electrolytic copper foil even with repeated bending deformation of the flexible region (FR) or the flexible printed circuit board (205).

[0064] According to various embodiments, the electronic device (200) may include various electrical / electronic components located on the wearable member (203), for example, a circuit board (241) (e.g., any one of the rigid regions (RR1, RR2) of FIG. 1), a battery (243), a camera module (251), a display module (not shown) and / or a speaker module (245). Various electrical / electronic components housed in the wearable member (203) may be electrically connected via a circuit board (e.g., circuit board (241), a flexible printed circuit board (e.g., flexible printed circuit board (205) or the printed circuit board (100) of FIG. 1), a conductive cable, or a connector. In one embodiment, the electronic device (200) may further include a second flexible area (e.g., flexible area (FR) of FIG. 1) disposed within the wearable member (203) while extending from the circuit board (241), and the second flexible area may connect a battery (243) or a speaker module (245) to the circuit board (241).

[0065] According to various embodiments, the positions of electrical / electronic components within the wearable member (203) may be varied so that the weight of the electronic device (200) can be evenly distributed while the electronic device (200) is worn. For example, within the wearable member (203), a circuit board (241) may be positioned adjacent to the lens frame (202), and electrical / electronic components heavier than the circuit board (241) (e.g., battery (243)) may be positioned further away from the lens frame (202) than the circuit board (241). For example, this may mitigate the concentration of the weight of the electronic device (200) toward the lens frame (202) or the user's face while worn. A speaker module (245) may be positioned within the wearable member (203) between the circuit board (241) and the battery (245) so that it is located close to the user's ear while the user is wearing the electronic device (200). In one embodiment, at least one integrated circuit chip may be mounted on the circuit board (241), and various circuit devices including a processor may be provided on the integrated circuit chip (241a) (see FIG. 12).

[0066] According to various embodiments, the wearable member (203) may include an inner case (231) and an outer case (233) made of a polymer material or a metal material. The inner case (231) is, for example, a case configured to come into direct contact with the user's body, and the outer case (233) may be positioned facing the external space while being coupled to face the inner case (231). In one embodiment, the materials of the inner case (231) and the outer case (233) may be appropriately selected to block the transfer of heat to the user's body and to induce the heat to be released to the outside when some of the electrical / electronic components housed in the wearable member (203) generate heat.

[0067] In one embodiment, the circuit board (241) or speaker module (245) may be accommodated in a space separated from the battery (243) within the wearable member (203). In the illustrated embodiment, the inner case (231) may include a first case (231a) containing the circuit board (241) or speaker module (245) and a second case (231b) accommodating the battery (243), and the outer case (233) may include a third case (233a) coupled to face the first case (231a) and a fourth case (233b) coupled to face the second case (231b). For example, the first case (231a) and the third case (233a) can be combined (hereinafter referred to as the 'first case part (231a, 233a)') to accommodate a circuit board (241) or a speaker module (245), and the second case (231b) and the fourth case (233b) can be combined (hereinafter referred to as the 'second case part (231b, 233b)') to accommodate a battery (243).

[0068] According to various embodiments, the first case portion (231a, 233a) is rotatably coupled to the lens frame (202) through a hinge structure (229), and the second case portion (231b, 233b) may be connected or mounted to the end of the first case portion (231a, 233a) through a connecting member (235). In some embodiments, the portion of the connecting member (235) that contacts the user's body may be made of an elastic material with low thermal conductivity, such as silicone, polyurethane, or rubber, and the portion that does not contact the user's body may be made of a material with high thermal conductivity (e.g., a metal material). For example, when heat is generated in the circuit board (241) or battery (243), the connecting member (235) may block the transfer of heat to the portion that contacts the user's body and disperse or release the heat through the portion that does not contact the user's body. In some embodiments, the portion of the connecting member (235) configured to come into contact with the user's body may be interpreted as part of the inner case (231), and the portion of the connecting member (235) not coming into contact with the user's body may be interpreted as part of the outer case (233).

[0070] As described above, according to various embodiments disclosed herein, a printed circuit board (e.g., the printed circuit board (100) of FIG. 1) and / or an electronic device including the same (e.g., the electronic device (100) of FIG. 11) comprises at least one insulating layer (e.g., the insulating layer (101, 21) of FIG. 1, 2, 9, or 10) comprising a first rigid region (e.g., any one of the rigid regions (RR1, RR2) of FIG. 1) and a flexible region (e.g., the flexible region (FR)) extending from the first rigid region; at least one first circuit pattern (e.g., the circuit pattern (121) of FIG. 1, 2, 10, or the rolled copper foil (22) of FIG. 9) disposed on any one side of the insulating layer so as to at least partially traverse the flexible region from the first rigid region; and the In the first rigid region, at least one conductive pad (e.g., the conductive pad (123, 25) of FIG. 1, FIG. 2, FIG. 9 or FIG. 10) is formed at least partially on the surface of the first circuit pattern, and the flexible region may be configured to be flexibly deformable than the first rigid region.

[0071] According to various embodiments, at least a portion of the first circuit pattern comprises at least a portion of an electrically conductive film laminated to the surface of the insulating layer, and the conductive pad may comprise at least a plating layer formed at least partially on the surface of the first circuit pattern (e.g., plating layer (25, 27) of FIG. 9).

[0072] According to various embodiments, the sum of the thicknesses of the conductive pad and the first circuit pattern from the surface of the insulating layer in the first rigid region may be 1.5 times or more and 4.0 times or less the thickness of the first circuit pattern in the flexible region.

[0073] According to various embodiments, the side of the conductive pad (e.g., the side (123a) of FIG. 10) may be formed to be at least partially inclined with respect to the surface of the insulating layer or the surface of the first circuit pattern.

[0074] According to various embodiments, the insulating layer further comprises a second rigid region (e.g., another of the rigid regions (RR1, RR2) of FIG. 1) connected to the first rigid region through the flexible region, and the flexible region may be configured to be more flexible than the second rigid region.

[0075] According to various embodiments, the first circuit pattern may further include another part disposed in the second rigid region.

[0076] According to various embodiments, the printed circuit board and / or electronic device including the above may further include at least one via conductor (e.g., via conductor (125, 27) of FIG. 1, FIG. 2, FIG. 9 or FIG. 10) formed to penetrate the insulating layer in the first rigid region, and the via conductor may include at least a portion of a plating layer formed integrally with the conductive pad.

[0077] According to various embodiments, the printed circuit board and / or electronic device including the above may further include, on the other side of the insulating layer, a second circuit pattern (e.g., the lower circuit pattern among the circuit patterns (121) of FIG. 2) extending from the first rigid region and positioned to at least partially cross the other side of the flexible region, and at least one via conductor formed to penetrate the insulating layer in the first rigid region, wherein the via conductor may be configured to electrically connect the second circuit pattern to the first circuit pattern.

[0078] According to various embodiments, the printed circuit board and / or electronic device including the above may further include at least one via hole (e.g., via hole (23) of FIG. 9) formed to penetrate the insulating layer, the via conductor may include a plating layer formed in the at least one via hole in a state in contact with the second circuit pattern, and the conductive pad may include a plating layer formed to contact the first circuit pattern while connected to the via conductor.

[0079] According to various embodiments, a plurality of insulating layers are sequentially stacked, and a plurality of first circuit patterns may each be formed between two adjacent insulating layers or on at least a portion of the surface of the insulating layer positioned at the outermost among the insulating layers.

[0080] According to various embodiments, the printed circuit board and / or electronic device including the above may include a via conductor comprising at least one via hole formed to penetrate at least one of the insulating layers and a plating layer formed in the via hole, and the via conductor may be configured to electrically connect two adjacent first circuit patterns located on different layers among the first circuit patterns.

[0081] According to various embodiments, the conductive pad may be formed to contact any one of the first circuit patterns as a plating layer connected to the via conductor.

[0082] According to various embodiments disclosed herein, an electronic device (e.g., the electronic device (200) of FIG. 11) comprises a first housing (e.g., the wearable member (203) of FIG. 11), a second housing (e.g., the lens frame (202) of FIG. 11) coupled to the first housing and rotatably coupled to the first housing, a hinge structure (e.g., the hinge structure (229) of FIG. 11) rotatably coupling the second housing to the first housing, and a printed circuit board (e.g., the printed circuit board (100) of FIG. 1, comprising the circuit board (241) of FIG. 12 and / or a flexible printed circuit board (205) of FIG. 1), wherein the printed circuit board comprises a first rigid region (e.g., any one of the rigid regions (RR1, RR2) of FIG. 1) and a flexible region extending from the first rigid region (e.g., FIG. At least one insulating layer (e.g., insulating layer (21, 101) of FIG. 1, FIG. 2, FIG. 9, or FIG. 10) comprising a flexible region (FR) of 1, at least one first circuit pattern (e.g., circuit pattern (121) of FIG. 1, FIG. 2, FIG. 9, or FIG. 10, or rolled copper foil (22)) disposed at least partially across the flexible region from the first rigid region on one side of the insulating layer, and at least one conductive pad (e.g., conductive pad (123, 25) of FIG. 1, FIG. 2, FIG. 9, or FIG. 10) formed at least partially on the surface of the first circuit pattern in the first rigid region, wherein the flexible region is disposed at least partially across the region where the hinge structure is disposed and may be configured to be flexibly deformable than the first rigid region.

[0083] According to various embodiments, the insulating layer further comprises a second rigid region (e.g., another of the rigid regions (RR1, RR2) of FIG. 1) connected to the first rigid region through the flexible region, and the first rigid region may be disposed in the first housing and the second rigid region may be disposed in the second housing.

[0084] According to various embodiments, the sum of the thicknesses of the conductive pad and the first circuit pattern from the surface of the insulating layer in the first rigid region is at least 1.5 times and no more than 4.0 times the thickness of the first circuit pattern in the flexible region, and the side of the conductive pad may be formed to be at least partially inclined with respect to the surface of the insulating layer or the surface of the first circuit pattern.

[0085] According to various embodiments disclosed herein, a method for manufacturing a printed circuit board (e.g., the manufacturing method (10) of FIG. 3) comprises: an operation of preparing at least one insulating layer (e.g., an insulating layer (101, 21) of FIG. 1, FIG. 2, FIG. 9, or FIG. 10) comprising a first rigid region (e.g., any one of the rigid regions (RR1, RR2) of FIG. 1) and a flexible region (e.g., a flexible region (FR)) extending from the first rigid region (e.g., part of the preparation operation (11) of FIG. 3); an operation of laminating an electrically conductive film (e.g., a rolled copper foil (22) of FIG. 4) on at least one surface of the insulating layer (e.g., roll laminating or a press process as the preparation operation (11) of FIG. 3); attaching a dry film to the surface of the electrically conductive film and removing a portion of the dry film to the electrically conductive The method may include an action of exposing a portion of the film (e.g., an action of forming a plating mask (31) of FIG. 4, indicated as ‘13’ in FIG. 3), an action of forming a plating layer (e.g., a plating layer (25, 27) of FIG. 5) on at least a portion of the exposed surface of the electrically conductive film (e.g., a plating action (15) of FIG. 3), an action of removing the dry film and forming an etching mask (e.g., an etching mask (33) of FIG. 7) to expose at least a portion of the electrically conductive film or at least a portion of the plating layer (e.g., an etching mask forming action (17) of FIG. 3), and an action of etching and removing at least a portion of the exposed electrically conductive film or at least a portion of the exposed plating layer (e.g., an etching action (19) of FIG. 3).

[0086] According to various embodiments, by the etching operation, at least one first circuit pattern (e.g., circuit pattern (121) of FIG. 1, FIG. 2, FIG. 10 or rolled copper foil (22) of FIG. 9) is formed on one side of the insulating layer, arranged to at least partially cross the flexible region from the first rigid region, and a conductive pad (e.g., conductive pad (123, 25) of FIG. 1, FIG. 2, FIG. 9 or FIG. 10) located at least partially on the surface of the first circuit pattern can be formed in the first rigid region.

[0087] According to various embodiments, the first circuit pattern may be formed by a part of the electrically conductive film, and the conductive pad may be formed by a part of the plating layer.

[0088] According to various embodiments, the side of the conductive pad (e.g., the side (123a) of FIG. 10) may be formed to be at least partially inclined with respect to the surface of the insulating layer or the surface of the first circuit pattern.

[0089] According to various embodiments, the above manufacturing method further includes the operation of forming at least one via hole (e.g., via hole (23) in FIG. 4) penetrating the insulating layer before the plating operation, and in the plating operation, the plating layer may be formed at least partially within the at least one via hole.

[0091] Although specific embodiments have been described in the detailed description of this document, it will be obvious to those skilled in the art that various modifications are possible without departing from the scope of this disclosure. Explanation of the symbols

[0092] 100: Printed circuit board 101: Insulating layer 23: Via hole 102: Wiring layer 121: Circuit pattern 121a: First side 123: Challenge Pad 123a: Second Side 125: Via conductor 131: Plating mask 133: Etching mask 200: Electronic device

Claims

Claim 1 An electronic device comprises: a housing including a first housing and a second housing rotatably coupled to the first housing; and a hinge structure connecting the first housing and the second housing. and includes a printed circuit board extending from the first housing to the second housing across the hinge structure, wherein the printed circuit board comprises a plurality of insulating layers including a first rigid region, a second rigid region, and a flexible region between the first rigid region and the second rigid region; at least one first circuit pattern disposed in the first rigid region, the second rigid region, and the flexible region on at least one surface of the plurality of insulating layers; and, in each of the first rigid region and the second rigid region, a plurality of conductive pads formed on at least a portion of the surface of the first circuit pattern and via holes penetrating the first rigid region and the second rigid region of the plurality of insulating layers, wherein the thickness of the conductive pads and the first circuit pattern in the first rigid region and the second rigid region is such that the flexible region is deformed more flexibly than the first rigid region and the second rigid region. The sum is at least 1.5 times and no more than 4 times the thickness of the first circuit pattern in the flexible region, and the first circuit pattern in the flexible region is partially rolled copper foil ( a rolled copper foil ) electronic device. Claim 2 An electronic device according to claim 1, wherein at least a portion of the first circuit pattern comprises at least a portion of an electrically conductive film laminated to the surface of each of the plurality of insulating layers, and the conductive pad comprises at least a plating layer formed at least partially on the surface of the first circuit pattern. Claim 3 delete Claim 4 An electronic device according to claim 1, wherein the side of the conductive pad is formed to be at least partially inclined with respect to the surface of the plurality of insulating layers or the surface of the first circuit pattern. Claim 5 delete Claim 6 delete Claim 7 An electronic device according to claim 1, further comprising at least one via conductor formed to penetrate the plurality of insulating layers in the first rigid region, wherein the via conductor comprises at least a portion of a plating layer formed integrally with the conductive pad. Claim 8 An electronic device according to claim 1, further comprising: a second circuit pattern extending from the first rigid region and disposed to partially cross the other side of the flexible region at least on at least one side and the other side of the plurality of insulating layers; and at least one via conductor formed to penetrate the plurality of insulating layers in the first rigid region, wherein the via conductor is configured to electrically connect the second circuit pattern to the first circuit pattern. Claim 9 delete Claim 10 An electronic device according to claim 1, wherein a plurality of first circuit patterns are each formed between two adjacent insulating layers among the plurality of insulating layers or on at least a portion of the surface of the insulating layer disposed at the outermost among the plurality of insulating layers. Claim 11 An electronic device according to claim 10, comprising at least one via hole formed to penetrate at least one of the plurality of insulating layers; and a via conductor comprising a plating layer formed in the via hole, wherein the via conductor is configured to electrically connect two adjacent first circuit patterns located on different layers among the plurality of first circuit patterns. Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 delete Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete

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