Substrate processing apparatus

Abstract

(Project) Provides a substrate processing device capable of efficiently processing a substrate. (Solution) A substrate processing device for processing substrates, comprising: a horizontal holding posture for maintaining a group of substrates aligned at equal pitch in the vertical direction for a horizontally positioned substrate; a posture conversion mechanism for converting the posture of a substrate in a vertical position to a vertical holding posture for maintaining a group of substrates aligned at equal pitch in the horizontal direction; a pusher mechanism having a pusher member for maintaining a plurality of substrates aligned at a narrow spacing narrower than equal pitch by combining a second group of substrates in the vertical holding posture maintained by the posture conversion mechanism and a first group of substrates in the vertical holding posture received in advance from the posture conversion mechanism; a pitch conversion unit for receiving a plurality of substrates aligned at a narrow spacing and aligning the plurality of substrates aligned at a narrow spacing to a narrow pitch narrower than equal pitch; a substrate processing unit for processing a plurality of substrates aligned at a narrow pitch in bulk; and a main transport mechanism for transporting a plurality of substrates aligned at a narrow pitch in bulk to the substrate processing unit, wherein the pitch conversion unit is disposed on the main transport mechanism side of the pusher mechanism. there is.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. Examples of substrates include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical discs, substrates for magnetic discs, ceramic substrates, substrates for solar cells, etc. Examples of FPDs include liquid crystal display devices, organic EL (electroluminescence) display devices, etc. Background Technology

[0002] Conventionally, a substrate processing apparatus is known for processing multiple substrates in batches by immersing them in a processing solution. This substrate processing apparatus is equipped with an orientation changing mechanism and a pusher (e.g., Japan: Published Patent Application No. 2010-93230). The orientation changing mechanism changes the orientation of the substrate between a horizontal orientation and a vertical orientation. The pusher can receive multiple substrates in a vertical orientation between the orientation changing mechanism and the up-and-down movement of the lifting and lowering member.

[0003] The pusher holds multiple substrates in the lifting and holding section by combining a group of substrates held by the orientation change mechanism with a group of substrates received in advance from the orientation change mechanism. The combination of substrate groups performed in the lifting and holding section is one of the pitch changes. The multiple substrates held in the lifting and holding section are aligned at a half pitch, for example, which is half the substrate holding pitch within the carrier. By processing the substrates aligned at a half pitch in batches, the amount of processing liquid used can be reduced. The problem to be solved

[0004] In order to further reduce the amount of processing liquid (chemical solution and cleaning solution) used in a substrate processing device, there is a desire to align multiple substrates at a narrow pitch narrower than half pitch and to process multiple substrates aligned at this narrow pitch in batches.

[0005] In such cases, it is necessary to combine a group of substrates held by an attitude change mechanism with a group of substrates received in advance from the attitude change mechanism, hold multiple substrates in the lifting and holding unit, and then perform additional pitch change. Consequently, the time required for pitch change becomes longer. Therefore, there is a problem in that conventional devices cannot efficiently process substrates.

[0006] The present invention has been made in consideration of these circumstances and aims to provide a substrate processing device capable of efficiently processing a substrate. means of solving the problem

[0007] To achieve this objective, the present invention adopts the following configuration.

[0008] That is, the substrate processing device related to the present invention is,

[0009] As a substrate processing device for processing substrates,

[0010] A posture conversion mechanism for converting a horizontal position substrate into a horizontal position maintaining a group of substrates aligned at equal pitches in the vertical direction, and a vertical position substrate into a vertical position maintaining a group of substrates aligned at equal pitches in the horizontal direction.

[0011] A pusher mechanism having a pusher member that maintains a plurality of substrates aligned at a narrow spacing narrower than the equal pitch by combining a second substrate group in the vertical holding position maintained by the posture changing mechanism and a first substrate group in the vertical holding position received in advance from the posture changing mechanism, and

[0012] A pitch conversion unit that receives the plurality of substrates aligned at the above narrow spacing and aligns the plurality of substrates aligned at the above narrow spacing to a narrow pitch narrower than the equal pitch, and

[0013] A substrate processing unit that processes the plurality of substrates aligned with the above narrow pitch in batches, and

[0014] The apparatus is equipped with a main transport mechanism that collectively transports the plurality of substrates aligned with the above narrow pitch to the substrate processing unit, and

[0015] The above pitch conversion unit is positioned on the main conveying mechanism side of the above pusher mechanism.

[0016] According to a substrate processing apparatus related to the present invention, a pusher mechanism combines a second group of substrates in a vertically maintained position maintained by a position changing mechanism with a first group of substrates in a vertically maintained position received in advance from the position changing mechanism to maintain a plurality of substrates aligned at a narrow spacing narrower than equal pitch. The process of creating a plurality of substrates aligned at a narrow spacing from a group of substrates of equal pitch is called the first stage pitch conversion. A pitch conversion unit receives the plurality of substrates aligned at a narrow spacing and aligns the plurality of substrates aligned at a narrow spacing into a narrow pitch narrower than equal pitch. The process of creating a plurality of substrates aligned at a narrow pitch from a plurality of substrates aligned at a narrow spacing is called the second stage pitch conversion. In the present invention, the second stage pitch conversion is not performed in the pusher mechanism, but is performed in a pitch conversion unit disposed on the main conveying mechanism side of the pusher mechanism. That is, the second pitch change is performed at a position that does not reduce throughput. Therefore, the substrate can be processed efficiently.

[0017] In addition, in a substrate processing apparatus related to the present invention,

[0018] The plurality of substrates aligned at the above narrow spacing are a plurality of substrates aligned at an unequal pitch in which a first spacing narrower than the equal pitch and a second spacing narrower than the equal pitch and wider than the first spacing are alternately repeated.

[0019] The above equal pitch is equal to the sum of the first interval and the second interval, and

[0020] Preferably, the plurality of substrates aligned with the above narrow pitch are a plurality of substrates aligned by repeating the above first interval. In this way, the second pitch change is performed slowly by narrowing the second interval of the unequal pitch created by the first pitch change until it becomes the first interval. Therefore, the second pitch change can be performed slowly at a position that does not reduce the throughput of the first pitch change.

[0021] In addition, in a substrate processing apparatus related to the present invention,

[0022] The plurality of substrates aligned at the above narrow spacing are the plurality of substrates aligned at a first narrow pitch narrower than the equal pitch, and

[0023] Preferably, the plurality of substrates aligned with the above narrow pitch are the plurality of substrates aligned with a second narrow pitch that is narrower than the first narrow pitch. In this way, the second pitch change is performed slowly by narrowing the first narrow pitch created by the first pitch change until it becomes the second narrow pitch. However, the second pitch change is performed at a position that does not reduce throughput. Therefore, the substrates can be processed efficiently.

[0024] In addition, in a substrate processing apparatus related to the present invention,

[0025] The above substrate processing device is,

[0026] A traversing mechanism is provided to traverse a traversing holding member that collectively holds the plurality of substrates aligned at the narrow spacing received from the pusher member along a traversing path between a substrate transfer position and a substrate transfer position.

[0027] The above substrate transfer position is a position where the plurality of substrates aligned at the narrow interval are transferred collectively between the pusher member and the lateral maintaining member, and

[0028] The above substrate transfer position is a position between the pitch conversion unit and the main transport mechanism where the plurality of substrates aligned at the narrow pitch are transferred collectively, and

[0029] The pitch conversion unit performs the transfer of the plurality of substrates aligned at the narrow spacing between the lateral maintaining unit and the substrate transfer position by raising and lowering at the substrate transfer position,

[0030] It is preferable that the above pitch conversion unit be positioned at the above substrate transfer location. By doing so, the location of the pitch conversion unit performing the second stage pitch conversion can be separated from the pusher mechanism performing the first stage pitch conversion. That is, the second stage pitch conversion is performed at a location that does not reduce the throughput of the first stage pitch conversion. Therefore, the substrate can be processed efficiently.

[0031] In addition, in a substrate processing apparatus related to the present invention,

[0032] It is preferable that the pitch conversion unit be positioned below the traverse path. This allows the operation in the traverse maintenance unit and the operation in the pitch conversion unit to be performed simultaneously, partially simultaneously, or at close timing.

[0033] In addition, in a substrate processing apparatus related to the present invention,

[0034] The above substrate processing device is,

[0035] A traversing mechanism that traverses a traversing holding member, which collectively holds the plurality of substrates aligned at the narrow spacing received from the pusher member, along a traversing path between a substrate transfer position and a substrate transfer position, and

[0036] An intermediate holding member that collectively holds the plurality of substrates aligned at the above narrow pitch is provided with an intermediate mechanism that raises and lowers the substrate transfer position, and

[0037] The above substrate transfer position is a position where the plurality of substrates aligned at the narrow interval are transferred collectively between the pusher member and the lateral maintaining member, and

[0038] The above substrate transfer position is a position between the intermediate holding part and the main transport mechanism where the plurality of substrates aligned with the narrow pitch are transferred collectively, and

[0039] The pitch conversion unit performs the transfer of the plurality of substrates aligned at the narrow spacing between the lateral maintaining unit and the substrate transfer position by raising and lowering at the substrate transfer position,

[0040] The above-mentioned mediating holding unit performs the transfer of the plurality of substrates aligned at the narrow pitch between itself and the pitch conversion unit by raising and lowering at the substrate transfer position, and

[0041] It is preferable that the above pitch conversion unit be positioned at the above substrate transfer location. By doing so, the location of the pitch conversion unit performing the second stage pitch conversion can be separated from the pusher mechanism performing the first stage pitch conversion. That is, the second stage pitch conversion is performed at a location that does not reduce the throughput of the first stage pitch conversion. Therefore, the substrate can be processed efficiently.

[0042] In addition, in a substrate processing apparatus related to the present invention,

[0043] It is preferable that the pitch conversion unit be positioned below the intermediate holding unit. This allows the operation in the pitch conversion unit and the operation in the intermediate holding unit to be performed simultaneously, partially simultaneously, or at close timing.

[0044] In addition, in a substrate processing apparatus related to the present invention,

[0045] It is preferable that the above pitch conversion unit be positioned below the above traverse path. By doing so, the operation in the traverse maintenance unit, the operation in the pitch conversion unit, and the operation in the intermediate maintenance unit can be performed simultaneously, partially simultaneously, or at close timing.

[0046] In addition, in a substrate processing apparatus related to the present invention,

[0047] The above substrate processing device is,

[0048] A first traversing mechanism that traverses a first traversing holding member, which collectively holds the plurality of substrates aligned at the narrow spacing received from the pusher member, along a first traversing path, and

[0049] A second traversing mechanism is provided to traverse a second traversing holding member, which collectively holds the plurality of substrates aligned at the narrow spacing and handed over to the pusher member, along a second traversing path.

[0050] The above pitch conversion unit is,

[0051] A first pitch conversion unit that receives the plurality of substrates aligned at the aforementioned narrow spacing and aligns the plurality of substrates aligned at the aforementioned narrow spacing to the aforementioned narrow pitch,

[0052] It is preferable to have a second pitch conversion unit that receives the plurality of substrates aligned at the narrow pitch and aligns the plurality of substrates aligned at the narrow pitch to the narrow spacing. The two-stage pitch conversion is performed by dividing it into a pusher mechanism and a pitch conversion unit. In addition, depending on the before and after of processing in the substrate processing unit, pitch conversion is performed by dividing it into a first pitch conversion unit and a second pitch conversion unit. Therefore, throughput is not reduced. Thus, substrates can be processed efficiently.

[0053] In addition, in a substrate processing apparatus related to the present invention,

[0054] The above-mentioned first traverse path is a path between the substrate transfer location and the substrate loading location, and

[0055] The above second traverse path is a path between the substrate removal location and the substrate transfer location, and

[0056] The first transverse path and the second transverse path are formed at positions separated in the transverse direction, and

[0057] The first pitch conversion unit is positioned at the substrate loading location, and

[0058] It is preferable that the second pitch conversion unit be positioned at the substrate ejection location. The first transverse path and the second transverse path are formed at positions separated in the transverse direction. Accordingly, the height of the substrate processing device is suppressed. The first pitch conversion unit and the second pitch conversion unit perform pitch conversion at positions separated in the transverse direction. Therefore, since the first pitch conversion unit and the second pitch conversion unit do not interfere with each other, pitch conversion can be performed simultaneously, partially simultaneously, or at close timing. Accordingly, throughput can be improved. As a result, substrates can be processed efficiently.

[0059] In addition, in a substrate processing apparatus related to the present invention,

[0060] The above-mentioned first pitch conversion unit is,

[0061] It is preferable to receive the plurality of substrates aligned at the narrow spacing from the first lateral maintaining unit and to discharge the plurality of substrates aligned at the narrow pitch to the main conveying mechanism. By doing so, the discharge of substrates between the first lateral maintaining unit, the first pitch changing unit, and the main conveying mechanism can be carried out efficiently.

[0062] In addition, in a substrate processing apparatus related to the present invention,

[0063] The intermediate holding unit, which holds the plurality of substrates aligned at the above narrow pitch collectively, is provided with an intermediate mechanism that raises the substrate loading position, and

[0064] The above substrate transfer position is a position where the plurality of substrates aligned at the narrow spacing are brought in collectively from the pusher member to the first transverse holding member, and

[0065] The above substrate loading position is a position where the plurality of substrates aligned with the narrow pitch are loaded collectively from the above intermediate holding unit to the above main transport mechanism, and

[0066] The first pitch conversion unit, by rising at the substrate loading position, loads the plurality of substrates aligned at the narrow spacing from the first lateral maintaining unit, and

[0067] The above-mentioned intermediate holding unit receives the plurality of substrates aligned at the narrow pitch from the pitch conversion unit by rising at the substrate receiving position, and

[0068] It is preferable that the first pitch conversion unit be positioned at the substrate receiving location. By doing so, pitch conversion by the first pitch conversion unit can be efficiently performed during the substrate receiving process carried out between the first lateral holding unit, the first pitch conversion unit, the intermediate holding unit, and the main conveying mechanism.

[0069] In addition, in a substrate processing apparatus related to the present invention,

[0070] It is preferable that the first pitch conversion unit be positioned below the intermediate holding unit. This allows the operation in the first pitch conversion unit and the operation in the intermediate holding unit to be performed simultaneously, partially simultaneously, or at close timing.

[0071] In addition, in a substrate processing apparatus related to the present invention,

[0072] It is preferable that the first pitch conversion unit be positioned below the first transverse path. By doing so, the operation in the first transverse maintenance unit, the operation in the first pitch conversion unit, and the operation in the intermediate maintenance unit can be performed simultaneously, partially simultaneously, or at close timing.

[0073] In addition, in a substrate processing apparatus related to the present invention,

[0074] The above second pitch conversion unit is,

[0075] The method involves receiving the plurality of substrates aligned at the narrow pitch from the main conveying mechanism and discharging the plurality of substrates aligned at the narrow spacing to the second transverse maintaining part.

[0076] It is preferable that it be positioned at the above-mentioned substrate removal location. By doing so, pitch conversion by the second pitch conversion unit can be efficiently performed during the substrate removal process.

[0077] In addition, in a substrate processing apparatus related to the present invention,

[0078] It is preferable that the second pitch conversion unit be positioned below the second transverse path. This allows the operation in the second pitch conversion unit and the operation in the second transverse maintenance unit to be performed simultaneously, partially simultaneously, or at close timing.

[0079] In addition, in a substrate processing apparatus related to the present invention,

[0080] It is preferable that the second pitch conversion unit be positioned above the first pitch conversion unit. This allows the operation in the first pitch conversion unit and the operation in the second pitch conversion unit to be performed simultaneously, partially simultaneously, or at close timing.

[0081] In addition, in a substrate processing apparatus related to the present invention,

[0082] It is preferable that the second pitch conversion unit be positioned above the intermediate holding unit. This allows the operation in the first pitch conversion unit, the operation in the intermediate holding unit, and the operation in the second pitch conversion unit to be performed simultaneously, partially simultaneously, or at close timing.

[0083] In addition, in a substrate processing apparatus related to the present invention,

[0084] The first transverse path and the second transverse path intersect at a predetermined angle, and

[0085] The above-mentioned pusher mechanism is positioned at a location that intersects at the above-mentioned predetermined angle, and

[0086] It is preferable that the first pitch conversion unit and the second pitch conversion unit are positioned apart at a predetermined angle. This allows the first pitch conversion unit and the second pitch conversion unit to be separated at a position where interference is difficult.

[0087] In addition, in a substrate processing apparatus related to the present invention,

[0088] The above substrate processing device is,

[0089] A traversing mechanism is provided to traverse a traversing holding member, which collectively holds the plurality of substrates aligned at the narrow spacing received from the pusher member, along a traversing path between a substrate transfer position and a substrate transfer position.

[0090] It is preferable that the above pitch conversion unit be provided in the above traverse mechanism. As a result, the height of the substrate processing device can be suppressed as the pitch conversion unit is integrated with the traverse mechanism.

[0091] In addition, in a substrate processing apparatus related to the present invention,

[0092] The first pitch conversion unit is provided in the first traversing mechanism, and

[0093] It is preferable that the second pitch conversion unit be provided in the second traverse mechanism. As a result, the height of the substrate processing device can be suppressed to the extent that the first pitch conversion unit is integrated with the first traverse mechanism and the second pitch conversion unit is integrated with the second traverse mechanism. Effects of the invention

[0094] According to the substrate processing apparatus related to the present invention, while performing pitch conversion, other processing can be performed before or after processing in the substrate processing unit. Accordingly, the substrate can be processed efficiently. Brief explanation of the drawing

[0095] Although several forms considered suitable at present are illustrated to explain the invention, it should be understood that the invention is not limited to the configurations and measures as illustrated. FIG. 1 is a plan view showing the schematic configuration of a substrate processing apparatus related to Example 1. Figure 2 is a plan view showing the configuration of the material block and its surroundings. Figure 3 is a side view showing a substrate handling mechanism. Figure 4 is a side view showing the attitude transformation section. Fig. 5 is a side view showing a pusher mechanism. FIG. 6 is a side view showing the pusher member in a longitudinal section. FIG. 7 is a side view showing the transmission mechanism and two pitch conversion sections, etc., as seen with arrow AA of FIG. 2. FIG. 8 is a plan view mainly showing the incoming and outgoing mechanisms. Figure 9 is a plan view mainly showing the mediation mechanism. FIG. 10 is a side view showing the schematic configuration of a pitch conversion unit that holds multiple substrates aligned at unequal pitches. FIG. 11 is a side view showing the schematic configuration of a pitch conversion unit that holds a plurality of substrates aligned at a narrow pitch. FIG. 12 is a lower view mainly showing the expansion mechanism of a pitch conversion unit that holds multiple substrates aligned at unequal pitches. FIG. 13 is a lower view mainly showing the expansion mechanism of a pitch conversion section that holds multiple substrates aligned at a narrow pitch. Figure 14 is a flowchart for explaining the operation of the first part of the substrate processing device. FIGS. 15a, FIGS. 15b, and FIGS. 15c are side views illustrating the operation of a substrate processing device. FIGS. 16a, FIGS. 16b, and FIGS. 16c are side views for explaining the operation of a substrate processing device. FIGS. 17a, FIGS. 17b, and FIGS. 17c are side views for explaining the operation of a substrate processing device. FIGS. 18a and FIGS. 18b are side views for explaining the operation of a substrate processing device. FIGS. 19a and FIGS. 19b are side views illustrating the operation of a substrate processing device. FIGS. 20a and FIGS. 20b are side views for explaining the operation of a substrate processing device. FIG. 21 is a flowchart for explaining the operation of the latter part of the substrate processing device. FIGS. 22a and FIGS. 22b are side views for explaining the operation of a substrate processing device. FIGS. 23a and FIGS. 23b are side views for explaining the operation of a substrate processing device. FIGS. 24a and FIGS. 24b are side views for explaining the operation of a substrate processing device. FIGS. 25a, FIGS. 25b, and FIGS. 25c are side views for explaining the operation of a substrate processing device. FIGS. 26a, FIGS. 26b, and FIGS. 26c are side views for explaining the operation of a substrate processing device. FIG. 27 is a plan view showing the configuration of the material block and its surroundings related to Example 2. FIG. 28 is a side view showing the transmission mechanism and two pitch conversion sections, etc., as seen with arrow AA in FIG. 27. FIG. 29 is a plan view showing the configuration of the material block and its surroundings related to Example 3. FIG. 30 is a side view showing the transmission mechanism and two pitch conversion sections, etc., as seen with arrow AA of FIG. 29. FIG. 31 is a plan view showing the configuration of the material block and its surroundings related to Example 4. FIG. 32 is a side view showing the transmission mechanism and two pitch conversion sections, etc., as seen with arrow AA in FIG. 31. FIG. 33 is a plan view showing the configuration of the material block and its surroundings related to Example 5. FIG. 34 is a side view showing an extension mechanism of a pitch conversion part provided in a pair of chuck members of an incoming mechanism and a pair of chuck members of an outgoing mechanism. FIG. 35 is a side view showing an extension mechanism of a pitch conversion part provided in a pair of chuck members of an incoming mechanism and a pair of chuck members of an outgoing mechanism. Specific details for implementing the invention

[0096] [Example 1]

[0097] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the schematic configuration of a substrate processing apparatus (1) related to Example 1. FIG. 2 is a plan view showing the configuration of a material block (5) and its surroundings.

[0098] In this specification, for convenience, the direction in which the material block (5) and the processing block (7) are parallel is referred to as the "front-back direction (X)." The front-back direction (X) is horizontal. Among the front-back direction (X), for example, the direction from the processing block (7) toward the material block (5) is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-back direction (X) is referred to as the "width direction (Y)." One direction of the "width direction (Y)" is appropriately referred to as the "right direction." The direction opposite to the right direction is referred to as the "left direction." The direction perpendicular to the horizontal direction is referred to as the "vertical direction (Z)." The vertical direction (Z) is indicated as "upward" and "downward." In each drawing, the front, back, right, left, up, and down directions are appropriately indicated for reference.

[0099] <1. Configuration of the Substrate Processing Device>

[0100] Refer to FIG. 1. A substrate processing device (1) processes a substrate (W). The substrate processing device (1) is a batch-type substrate processing device that processes a plurality of substrates (W) in batches (e.g., 50, 75, 100). The substrate processing device (1) performs, for example, chemical treatment, cleaning treatment, drying treatment, etc. on the substrate (W). The substrate processing device (1) is equipped with a stocker (2), a stacking shelf (3), a material transfer block (5), a processing block (7), and a batch substrate transport area (8).

[0101] <1-1. Stalker>

[0102] The stocker (2) accommodates at least one carrier (C). The stocker (2) is adjacent to the front of the material block (5). The carrier (C) accommodates multiple sheets (e.g., 25 sheets) of substrates (W) in a horizontal position with a predetermined spacing (e.g., 10 mm). In other words, the carrier (C) accommodates N sheets (e.g., 25 sheets) of substrates (W) aligned at a standard pitch in a horizontal position. Furthermore, "N" in the N sheets of substrates (W) is a natural number greater than or equal to 2. Additionally, the standard pitch is a repeating standard spacing (TN9) (e.g., 10 mm (millimeters)). That is, when the standard spacing (TN9) is 10 mm, the standard pitch is a 10 mm pitch. The N sheets of substrates (W) in the carrier (C) are aligned in the vertical direction (Z) or in the thickness direction of each substrate (W). As a carrier (C), for example, a FOUP (Front Opening Unify Pod) is used, but is not limited to this.

[0103] The stocker (2) is equipped with a plurality (e.g., 2) of load ports (9). The 2 load ports (9) are arranged in the width direction (Y). In this embodiment, the 2 load ports (9) are used to load and unload carriers (C). Additionally, the stocker (2) is equipped with at least one storage shelf (11) and a carrier transport robot (13). A carrier (C) is placed on the storage shelf (11).

[0104] The carrier conveyor robot (13) conveys a carrier (C) between two load ports (9), a storage shelf (11), and a storage shelf (3). The carrier conveyor robot (13) is equipped with a gripping part (15) that grips, for example, a projection formed on the upper surface of the carrier (C). The carrier conveyor robot (13) can move the gripping part (15) in the horizontal direction (forward / backward direction (X) and width direction (Y)) and the vertical direction (Z). The carrier conveyor robot (13) is driven by one or more electric motors.

[0105] The storage shelf (3) is placed in the area of ​​the stocker (2). The storage shelf (3) is adjacent to the front of the material block (5). The carrier (C) is stored on the storage shelf (3).

[0106] <1-2. Lee Jae Block>

[0107] Refer to FIG. 1 and FIG. 2. The material block (5) is equipped with a substrate handling mechanism (robot) (HTR), an attitude changer (19), a pusher mechanism (21), a transfer mechanism (23), and two pitch changers (25, 26).

[0108] A substrate handling mechanism (HTR) is positioned at the rear of a stacking shelf (3). The substrate handling mechanism (HTR) conveys a plurality of substrates (e.g., 25) in a horizontal position between a carrier (C) stacked on the stacking shelf (3) and a position changing unit (19). As shown in FIG. 3, the substrate handling mechanism (HTR) is equipped with a plurality of hands (27), e.g., 25 or 13. Each hand (27) holds one substrate (W). The plurality of 25 hands (27) are arranged in a reference pitch in the vertical direction (Z). Therefore, the 25 substrates (W) held by, for example, 25 hands (27) are aligned in a reference pitch. Additionally, the reference pitch is a repeating reference spacing (TN9) (e.g., 10 mm).

[0109] In addition, in FIG. 3 and the like, the substrate handling mechanism (HTR) is equipped with five hands (27) for the urban conditions. Also, the pair of horizontal holding parts (37) and the pair of vertical holding parts (39) described later are configured to hold five substrates (W). Also, the pusher member (55) described later is configured to support ten substrates (W).

[0110] The substrate handling mechanism (HTR) additionally comprises a hand support (29), a reciprocating part (31), and a lifting rotation part (33). The hand support (29) supports a plurality of hands (27). The reciprocating part (31) advances and retracts the plurality of hands (27) through the hand support (29). The lifting rotation part (33) rotates the reciprocating part (31) around a vertical axis (AX1) to change the direction of the hands (27). The lifting rotation part (33) is fixed to the bottom surface. Additionally, the reciprocating part (31) and the lifting rotation part (33) each have an electric motor. Additionally, the substrate handling mechanism (HTR) may be equipped with a movable hand (not shown) for transporting only one substrate (W) separately from the hands (27).

[0111] The posture conversion unit (19) converts a plurality of substrates (e.g., 25 substrates) (W) between a horizontal posture and a vertical posture. The posture conversion unit (19) is positioned to the left of the substrate handling mechanism (HTR). As shown in FIG. 4, the posture conversion unit (19) is equipped with a support (35), a pair of horizontal holding members (37), a pair of vertical holding members (39), and a rotary driving member (41).

[0112] The support member (35) is rotatably supported around a horizontal axis (AX2) that extends in the front-rear direction (X). A pair of horizontal support members (37) and a pair of vertical support members (39) are formed to extend perpendicularly from the support surface (35A). When a plurality of substrates (W) are in a horizontal position, the pair of horizontal support members (37) supports the plurality of substrates (W). In other words, when a plurality of substrates (W) are in a horizontal position, the plurality of substrates (W) are placed on the pair of horizontal support members (37). Also, when a plurality of substrates (W) are in a vertical position, the pair of vertical support members (39) supports the plurality of substrates (W).

[0113] A pair of horizontal support members (37) and a pair of vertical support members (39) are all arranged in the front-rear direction (X) (see FIG. 2). Also, when a pair of horizontal support members (37) holds a plurality of substrates (W) in a horizontal position, a pair of vertical support members (39) are arranged on the side of the pusher mechanism (21) rather than the pair of horizontal support members (37). A pair of horizontal support members (37) has a plurality of shelves (37A) (e.g., 25 pairs, 38 pairs, 50 pairs) arranged at a reference pitch in the direction (DR1) in which the pair of horizontal support members (37) extend. A pair of vertical retainers (39) has multiple pairs of retainers (39A) (e.g., 25 pairs, 38 pairs, 50 pairs) arranged at a reference pitch in the direction (DR1) in which the pair of vertical retainers (39) extend.

[0114] Additionally, the posture change unit (19) further comprises an axial movement unit (51) and a receiving movement unit (53). The axial movement unit (51) moves a pair of horizontal holding units (37) by a preset minute distance in the direction (DR1) in which the pair of horizontal holding units (37) extend. The receiving movement unit (53) moves a pair of vertical holding units (39) closer to or further away from the pair of horizontal holding units (37). For example, when a pair of horizontal holding units (37) maintain a plurality of substrates (W) in a horizontal posture, the receiving movement unit (53) can move a pair of vertical holding units (39) in the width direction (Y). The rotary drive unit (41) converts a plurality of substrates (W) held by a pair of horizontal holding units (37) and a pair of vertical holding units (39) between a horizontal position and a vertical position.

[0115] Additionally, the rotary drive unit (41) is equipped with, for example, an electric motor. The axial movement unit (51) and the receiving movement unit (53) are each equipped with an air cylinder or an electric actuator. The electric actuator is equipped with an electric motor.

[0116] The pusher mechanism (21) is positioned to the left of the posture changer (19). As shown in FIG. 5, the pusher mechanism (21) comprises a pusher member (55), a rotating shaft (57), a pusher rotating part (59), a pusher horizontal moving part (61), a lifting platform (63), and a pusher lifting part (65).

[0117] The pusher member (55) holds a plurality of substrates (W) arranged in a narrow spacing that is narrower than the reference pitch, repeating the reference spacing (TN9). For example, the pusher member (55) holds a plurality of substrates (e.g., 50, 75, 100) arranged in a vertical position at an unequal pitch in which a first spacing (TN1) (e.g., 3.333 mm) and a second spacing (TN2) (e.g., 6.666 mm) are alternately repeated, as shown in FIG. 6. The second spacing (TN2) is a wider spacing than the first spacing (TN1) (second spacing (TN2) > first spacing (TN1)). Also, the first spacing (TN1) is also called a narrow spacing, and the second spacing (TN2) is also called a wide spacing.

[0118] The pusher member (55) is provided with a plurality of vertical holding grooves (67) (e.g., 50, 75, 100) to hold a plurality of substrates (W) in a vertical position, as shown in FIG. 6. The plurality of vertical holding grooves (67) are arranged at an unequal pitch, for example, with a first gap (TN1) and a second gap (TN2) alternately repeated. The sum of the first gap (TN1) (e.g., 3.333 mm) and the second gap (TN2) (e.g., 6.666 mm) is a reference gap (TN9) (e.g., 10 mm).

[0119] Refer to FIG. 5. The lower surface of the pusher member (55) is connected to the upper surface of the rotation shaft (57). The pusher rotation part (59) rotates the pusher member (55) and the rotation shaft (57) around a vertical axis (AX3) passing through the rotation shaft (57). As a result, a plurality of substrates (W) supported by the pusher member (55) in a vertical position are rotated around the vertical axis (AX3). The pusher rotation part (59) is equipped with, for example, an electric motor. The pusher rotation part (59) is formed below the pusher member (55). Additionally, the pusher rotation part (59) is mounted on the upper surface of the lifting platform (63) via the pusher horizontal movement part (61).

[0120] The pusher horizontal movement unit (61) is equipped with two guide rails (61A) extending in the width direction (Y), a slider (61B), and an electric motor not shown. The two guide rails (61A) are formed on the upper surface of the lifting platform (63). The slider (61B) moves along the two guide rails (61A) in the width direction (Y). The slider (61B) is driven by an electric motor. The pusher lifting unit (65) raises and lowers the lifting platform (63) in the vertical direction (Z). This causes the pusher member (55) to rise and fall. The pusher lifting unit (65) is equipped with, for example, an electric actuator.

[0121] Refer to FIG. 2. Two pitch conversion units (25, 26) are positioned on the side of the main conveying mechanism (WTR) of the pusher mechanism (21), that is, to the left of the pusher mechanism (21). Additionally, if the two pitch conversion units (25, 26) are positioned in the vertical direction (Z), the substrate processing device (1) becomes unnecessarily high. To this end, the two pitch conversion units (25, 26) are positioned in the front-rear direction (X). That is, the first pitch conversion unit (25) is positioned behind the second pitch conversion unit (26) when viewed from a plane. Therefore, it is possible to suppress the substrate processing device (1) from becoming unnecessarily high. The conveying mechanism (23) conveys a plurality of substrates (W) aligned with unequal pitches between, for example, the pusher member (55) and the two pitch conversion units (25, 26).

[0122] The first pitch conversion unit (25) and the second pitch conversion unit (26) are positioned apart at a predetermined angle (α) centered on the substrate transfer position (Po) of the pusher mechanism (21). That is, the first pitch conversion unit (25) is located at the substrate loading position (Pin) located at a predetermined angle (α) away from the second pitch conversion unit (26). The second pitch conversion unit (26) is located at the substrate outgoing position (Pout) located at a predetermined angle (α) away from the first pitch conversion unit (25). In addition, the first traversing path (Rin) along which the first pitch conversion unit (25), described later, traverses, and the second traversing path (Rout) along which the second pitch conversion unit (26) traverses intersect at a predetermined angle (α). The pusher mechanism (21) is positioned at the location where it intersects at a predetermined angle (α). In this way, the first pitch conversion unit (25) and the second pitch conversion unit (26) are separated at a position where interference is difficult. Also, the substrate transfer position (Po), the substrate entry position (Pin), and the second traverse path (Rout) are positions when viewing the transfer block (5) in a plane as shown in FIG. 2.

[0123] Refer to FIG. 2 and FIG. 7. FIG. 7 is a side view showing a transfer mechanism (23) and two pitch conversion units (25, 26), etc., as seen with arrow AA in FIG. 2. The transfer mechanism (23) is equipped with a receiving mechanism (71), an intermediary mechanism (73), and a receiving mechanism (75). The receiving mechanism (71) conveys a plurality of substrates (W) aligned with an unequal pitch from a pusher member (55) to a first pitch conversion unit (25). The intermediary mechanism (73) conveys a plurality of substrates (W) aligned with a narrow pitch from the first pitch conversion unit (25) to a first transfer position (P1). The output mechanism (75) returns a plurality of substrates (W) aligned at an unequal pitch from the second pitch conversion unit (26) to the pusher member (55). The input mechanism (71), the intermediary mechanism (73), and the output mechanism (75) each have a chuck (77), a chuck (78), and a chuck (79).

[0124] As shown in FIG. 7, the receiving mechanism (71) is positioned at the receiving height position (H1) at the substrate receiving position (Pin). The receiving mechanism (71) is positioned at the substrate receiving position (Pin), for example, to the side of the lifting portion (141) of the second pitch conversion unit (26). The chuck (78) of the intermediate mechanism (73) is formed at the position above the first pitch conversion unit (25) at the substrate receiving position (Pin). Additionally, the chuck (78) of the intermediate mechanism (73) is positioned between the receiving height position (H1) and the first transfer position (P1) at the substrate receiving position (Pin). The first transfer position (P1) is a position higher than the receiving height position (H1) and the outgoing height position (H2) at the substrate receiving position (Pin). The output mechanism (75) is positioned at an output height position (H2) that is higher than the input height position (H1) at the substrate output position (Pout). The input mechanism (71) and the output mechanism (75) are each configured so that the output mechanism (75) and the multiple substrates (W) held by the output mechanism (75) do not interfere with the input mechanism (71) and the multiple substrates (W) held by the input mechanism (71). The substrate input position (Pin) and the substrate output position (Pout) are formed at positions that are sufficiently far apart in the front-back direction (X). Additionally, as shown in FIG. 7, the substrate input position (Pin) may be indicated by a dotted line extending in the vertical direction (Z). Also, the substrate output position (Pout) may be indicated by a dotted line extending in the vertical direction (Z).

[0125] FIG. 8 is a plan view mainly showing an incoming mechanism (71) and an outgoing mechanism (75). The incoming mechanism (71) is positioned at a substrate incoming position (Pin) which is behind the outgoing mechanism (75). The outgoing mechanism (75) is positioned at a substrate outgoing position (Pout) which is in front of the incoming mechanism (71). That is, the incoming mechanism (71) is positioned at a substrate incoming position (Pin) which is close to the processing block (7), and the outgoing mechanism (75) is positioned at a substrate outgoing position (Pout) which is close to the stoker (2). The incoming mechanism (71) is equipped with a chuck (77), an opening / closing part (81), a front-rear moving part (83), and a width-direction moving part (85).

[0126] The chuck (77) holds a plurality of substrates (W) aligned at an unequal pitch in a vertical position. The chuck (77) has a pair of chuck members (77A, 77B) each extending in the width direction (Y). The pair of chuck members (77A, 77B) has a plurality of holding grooves (87, 88) arranged at an unequal pitch (e.g., 50 pairs, 75 pairs, 100 pairs). Additionally, the unequal pitch is arranged such that a first gap (TN1) (e.g., 3.333 mm) and a second gap (TN2) (e.g., 6.666 mm) are alternately arranged. A plurality of holding grooves (87) arranged at an unequal pitch are formed in the first chuck member (77A). In addition, a plurality of retaining grooves (88) arranged at an unequal pitch are formed in the second chuck member (77B).

[0127] The opening / closing part (81) supports two chuck members (77A, 77B) so that they can move in the forward / backward direction (X). Additionally, the opening / closing part (81) opens and closes the two chuck members (77A, 77B) in the forward / backward direction (X). Specifically, the opening / closing part (81) moves the two chuck members (77A, 77B) closer together or further apart. When the opening / closing part (81) closes the chuck (77), the chuck (77) can maintain multiple substrates (W) in a vertical position. In contrast, when the opening / closing part (81) opens the chuck (77), the chuck (77) can pass multiple substrates (W) in a vertical position between the two chuck members (77A, 77B) in the vertical direction (Z). The opening / closing part (81) is equipped with an air cylinder or electric actuator that drives two chuck members (77A, 77B).

[0128] The forward-backward movement unit (83) is positioned on the side of the two pitch conversion units (25, 26) rather than the width-direction movement unit (85). The forward-backward movement unit (83) moves the chuck (77) and the opening / closing unit (81) horizontally in the forward-backward direction (X). The width-direction movement unit (85) moves the chuck (77), the opening / closing unit (81), and the forward-backward movement unit (83) horizontally in the width-direction (Y). That is, the forward-backward movement unit (83) and the width-direction movement unit (85) can move the chuck (77) in the forward-backward direction (X) and the width-direction (Y) (two-dimensional direction). Thus, the receiving mechanism (71) can move the chuck (77) between the substrate transfer position (Po) and the substrate delivery position (substrate receiving position (Pin) and substrate outgoing position (Pout)) described later. By simultaneously performing movement in the forward direction (X) and movement in the width direction (Y), movement in an oblique direction, such as the first traverse path (Rin) and the second traverse path (Rout) described above, is realized. The forward direction movement part (83) is equipped with, for example, an air cylinder or an electric actuator. The width direction movement part (85) is equipped with an electric actuator.

[0129] The release mechanism (75) comprises a chuck (79), an opening / closing part (89), a forward / backward movement part (91), and a width / width movement part (93). The chuck (79) is configured in the same way as the chuck (77). Specifically, the chuck (79) comprises a pair of chuck members (79A, 79B) each extending in the width direction (Y). The pair of chuck members (79A, 79B) comprises a plurality of retaining grooves (95, 96) arranged at an unequal pitch (e.g., 50 pairs, 75 pairs, 100 pairs). The forward / backward movement part (91) is positioned on the side of two pitch conversion parts (25, 26) rather than the width / width movement part (93). Except for that, the opening / closing part (89), the forward / backward movement part (91), and the width / pathway movement part (93) are configured in the same way as the opening / closing part (81), the forward / backward movement part (83), and the width / pathway movement part (85), respectively.

[0130] FIG. 9 is a plan view mainly showing an intermediary mechanism (73). The intermediary mechanism (73) is placed at the same substrate loading position (Pin) as the loading mechanism (71). The intermediary mechanism (73) has a chuck (78), an opening / closing part (101), an arm (103), and a lifting part (105). The chuck (78) has a pair of chuck members (78A, 78B) each extending in the width direction (Y). The pair of chuck members (78A, 78B) have a plurality of retaining grooves (107, 108) arranged at a narrow pitch (e.g., 3.333 mm pitch (1 / 3 pitch)). Specifically, in the first chuck member (78A), a plurality of retaining grooves (107) arranged in a narrow pitch are formed in the width direction (Y). Also, in the second chuck member (78B), a plurality of retaining grooves (108) arranged in a narrow pitch are formed.

[0131] The opening / closing part (101) is formed on the right side (on the pusher mechanism (21) side) of the chuck (78). Except for this, the opening / closing part (101) is configured in the same way as the opening / closing part (81). To explain in more detail, the opening / closing part (101) supports a pair of chuck members (78A, 78B) so that they can move in the front / rear direction (X). In addition, the opening / closing part (101) opens and closes the pair of chuck members (78A, 78B) in the front / rear direction (X). When the opening / closing part (101) closes the chuck (78), the chuck (78) can maintain a plurality of substrates (W) aligned at a narrow pitch in a vertical position. In this regard, when the opening / closing part (101) opens the chuck (78), the chuck (78) can pass multiple substrates (W) in a vertical position between two chuck members (78A, 78B) in the vertical direction (Z).

[0132] The opening / closing unit (101) is mounted to the lifting unit (105) so as to be vertically movable through the arm (103). The lifting unit (105) raises and lowers the chuck (78) and the opening / closing unit (101) in the vertical direction (Z). The lifting unit (105) is equipped with, for example, an electric actuator. Thus, the intermediate mechanism (73) can receive a plurality of substrates (W) in a vertical position aligned at a narrow pitch from the first pitch conversion unit (25) and move the plurality of substrates (W) to a first transfer position (P1) (see FIG. 7) in order to transfer the plurality of substrates (W) to the main transfer mechanism (WTR).

[0133] Additionally, the material block (5) has two transport paths for transporting multiple substrates (W) between the pusher member (55) (pusher mechanism (21)) and the main transport mechanism (WTR). That is, the first transport path is a path passing through the receiving mechanism (71), the first pitch conversion unit (25), and the intermediate mechanism (73). Additionally, the second transport path is a path passing through the second pitch conversion unit (26) and the output mechanism (75). For example, when 50 substrates (W) are held in the intermediate mechanism (73), the output mechanism (75) can transport 50 substrates (W) processed in the chemical treatment tank (BT1), etc. to the pusher member (55). Therefore, 50 substrates (W) (processed substrate group) can be transported smoothly.

[0134] <1-2-1. Pitch Conversion Section>

[0135] Refer to FIG. 7 and FIG. 10 to 13. Two pitch conversion units (25, 26) each convert the pitch of a plurality of substrates (W) between an unequal pitch and a narrow pitch. The unequal pitch consists of a first interval (TN1) (e.g., 3.333 mm) and a second interval (TN2) (e.g., 6.666 mm) that is wider than the first interval (TN1) being alternately repeated. Additionally, the narrow pitch consists of the first interval (TN1) being repeated.

[0136] The first pitch conversion unit (25) aligns a plurality of substrates (W) aligned with unequal pitches to a narrow pitch. That is, the first pitch conversion unit (25) converts the pitch of the plurality of substrates (W) before processing in the processing block (7) to a narrow pitch. In contrast, the second pitch conversion unit (26) aligns the plurality of substrates (W) aligned with a narrow pitch to an unequal pitch. That is, the second pitch conversion unit (26) converts the pitch of the plurality of substrates (W) after processing in the processing block (7) to an unequal pitch.

[0137] Each of the two pitch conversion units (25, 26) is equipped with a pitch conversion main body (111). The pitch conversion main body (111) is equipped with a plurality of (e.g., 25, 38, 50) holding members (113) (113A to 113E) and moving members (115).

[0138] A plurality of holding members (113) hold a plurality of substrates (W) aligned at an unequal pitch in a vertical position. Each of the plurality of holding members (113) has two holding grooves (117) that hold two of the plurality of substrates (W) at a first gap (TN1) (e.g., 3.333 mm). The two holding grooves (117) are spaced apart at the first gap (TN1). The two holding grooves (117) of each holding member (113) are arranged in the width direction (Y). For example, if the pitch conversion unit (25) has 25 holding members (113), the 25 holding members (113) can hold 50 substrates (W). In addition, in FIGS. 10 to 13, for the sake of the city, the two pitch conversion sections (25, 26) each have five retaining members (113).

[0139] The moving part (115) moves a plurality of retaining members (113) in the alignment direction (width direction (Y)) of a plurality of substrates (W) so as to change between an unequal pitch state in which a plurality of substrates (W) are aligned at an unequal pitch and a narrow pitch state in which a plurality of substrates (W) are aligned at a narrow pitch. The moving part (115) is equipped with a base member (119), two guide rails (121), an extension mechanism (123), a driving part (125), and a connecting part (127).

[0140] Two guide rails (121) support multiple retaining members (113) so that they can move in the alignment direction (width direction (Y)). Each of the two guide rails (121) extends in the width direction (Y). The two guide rails (121) are mounted on the upper surface of the base member (119). Additionally, the central retaining member (113C) among the multiple retaining members (113) is fixed to the base member (119), for example, by a screw (SW). That is, the central retaining member (113C) does not move in the width direction (Y). Also, the guide rails (121) are not limited to two, but may be one or three or more. That is, the moving part (115) only needs to have one or more guide rails (121).

[0141] The extension mechanism (123) extends a plurality of retaining members (113) in an alignment direction (width direction (Y)). The extension mechanism (123) is connected to each retaining member (113). The extension mechanism (123) is configured, for example, as a link mechanism. Specifically, the extension mechanism (123) is configured, for example, in a form of lazy tongs, a zigzag linear, or a shape similar thereto. The extension mechanism (123) is provided, for example, with a plurality of (five in FIG. 10 et al.) link members (129), a plurality of (five in FIG. 10 et al.) pins (131), and a plurality of (four in FIG. 10 et al.) joints (133). In FIGS. 12 and 13, for example, five pins (131) are formed on the bottom surface of five retaining members (113). Five link members (129) are each rotatably mounted around a vertical axis on the five pins (131). The five pins (131) are each located at the five central portions of the five link members (129). Four joints (133) each connect the ends of two adjacent link members (129).

[0142] For example, the first end of the link member (129B) is connected to the second end of the link member (129A) by a joint (133A). Additionally, the second end of the link member (129B) is connected to the first end of the link member (129C) by a joint (133B).

[0143] The driving unit (125) drives the extension mechanism (123). The driving unit (125) is mounted on the lower surface of the base member (119). The driving unit (125) extends and retracts a rod (125A) that extends in the width direction (Y). The driving unit (125) is equipped with an air cylinder or an electric actuator. The connecting unit (127) connects the end retaining member (113E) among a plurality of retaining members (113) to the tip of the rod (125A) of the driving unit (125). Additionally, the connecting unit (127) passes through the opening (119A) of the base member (119).

[0144] In FIG. 10 and FIG. 12, for example, when the rod (125A) of the driving unit (125) is extended, the step retaining member (113E) is separated from the central retaining member (113C), and the other three retaining members (113A, 113B, 113D) are separated from the central retaining member (113C) by the extension mechanism (123). Thus, the plurality of substrates (W) are aligned at an unequal pitch. Also, in FIG. 11 and FIG. 13, for example, when the rod (125A) of the driving unit (125) is retracted, the supporting member (113E) of the stage is brought closer to the central supporting member (113C), and the other three supporting members (113A, 113B, 113D) are brought closer to the central supporting member (113C) by the extension mechanism (123). Thus, the multiple substrates (W) are aligned at a narrow pitch (first gap (TN1)).

[0145] As shown in FIG. 7, the pitch conversion unit (25, 26) each has a lifting unit (141). The lifting unit (141) raises and lowers the pitch conversion main body (111) (multiple holding members (113) and moving unit (115)). The lifting unit (141) has an air cylinder or an electric actuator.

[0146] The lifting portion (141) of the first pitch conversion unit (25) raises and lowers a plurality of holding members (113) between an upper position higher than the chuck (77) (upper surface) of the receiving mechanism (71) and a lower position lower than the chuck (77). Also, the lifting portion (141) of the second pitch conversion unit (26) raises and lowers a plurality of holding members (113) between an upper position higher than the chuck (79) (upper surface) of the receiving mechanism (75) and a lower position lower than the chuck (79).

[0147] <1-3. Processing Block>

[0148] Refer to FIG. 1. The processing block (7) is equipped with a plurality (e.g., 4) batch processing tanks (BT1 to BT4) and a drying section (143). The 4 batch processing tanks (BT1 to BT4) and the drying section (143) are arranged in the front-rear direction (X) where the substrate processing device (1) extends. Each of the 4 batch processing tanks (BT1 to BT4) immerses and processes a plurality of substrates (W) in batches (e.g., 50, 75, or 100). Each of the 4 batch processing tanks (BT1 to BT4) stores a processing solution (e.g., a chemical solution or pure water) for immersing a plurality of substrates (W). Additionally, the processing block (7) corresponds to the "substrate processing section" of the present invention.

[0149] The four batch treatment tanks (BT1 to BT4) are composed, for example, of two chemical treatment tanks (BT1, BT3) and two cleaning treatment tanks (BT2, BT4). The chemical treatment tank (BT1) and the cleaning treatment tank (BT2) form one group, and the chemical treatment tank (BT3) and the cleaning treatment tank (BT4) form another group. Furthermore, the combination of the chemical treatment tanks and the cleaning treatment tanks is not limited to this example. Also, the number of batch treatment tanks is not limited to four, but one or more are sufficient.

[0150] Two chemical treatment tanks (BT1, BT3) each perform etching treatment with a chemical solution. As the chemical solution, for example, a phosphoric acid solution is used, but is not limited to a phosphoric acid solution. The chemical solution is heated to a preset temperature. A chemical solution discharge pipe (not shown) is formed at the bottom of the inner side of each chemical treatment tank (BT1, BT3). Each chemical treatment tank (BT1, BT3) stores the chemical solution supplied from the chemical solution discharge pipe.

[0151] Each of the two cleaning treatment tanks (BT2, BT4) performs a cleaning treatment to wash away the chemical solution attached to multiple substrates (W) with a cleaning solution (rinse solution). As the cleaning solution, pure water such as deionized water (DIW), for example, is used. Each of the cleaning treatment tanks (BT2, BT4) stores pure water supplied from a pure water discharge pipe not shown.

[0152] The processing block (7) is equipped with a lifter (LF1) as a dedicated conveying mechanism for transferring a substrate (W) that has been treated with a chemical solution in a chemical solution treatment tank (BT1) to a cleaning treatment tank (BT2), and a lifter (LF2) for transferring a substrate (W) that has been treated with a chemical solution in a chemical solution treatment tank (BT3) to a cleaning treatment tank (BT4). Each of the two lifters (LF1, LF2) is equipped with a substrate holding part that maintains a plurality of substrates (W) aligned in a narrow pitch in the width direction (Y) in a vertical position, a lifting part that raises and lowers the substrate holding part, and a horizontal moving part that moves the substrate holding part in the front-back direction (X).

[0153] The drying unit (143) is equipped with a substrate holding mechanism that holds a plurality of substrates (W) (e.g., 50, 75, or 100) aligned in a narrow pitch in the width direction (Y) in a vertical position, and a processing chamber that receives the plurality of substrates (W) held by the substrate holding mechanism. The drying unit (143) dries the substrates by supplying an organic solvent (e.g. isopropyl alcohol) to the substrates (W) in a reduced pressure atmosphere, or by shaking off liquid components from the surface of the substrates (W) by centrifugal force.

[0154] <1-4. Batch Board Transport Area>

[0155] The batch substrate transport area (8) is positioned behind the stoker (2) and is adjacent to the left side of the material block (5) and the processing block (7). The batch substrate transport area (8) extends in the front-rear direction (X). The batch substrate transport area (8) is equipped with a main transport mechanism (WTR) (main transport robot). The main transport mechanism (WTR) transports multiple substrates (W) in a vertical position (e.g., 50, 75, or 100) aligned in a narrow pitch in the width direction (Y) in the front-rear direction (X). Additionally, the main transport mechanism (WTR) transports multiple substrates (W) between a first transfer position (P1), a second transfer position (P2), multiple (e.g., 4) batch processing tanks (BT1 to BT4) and a drying section (143).

[0156] The main conveying mechanism (WTR) comprises a chuck (145), a chuck lifting part (not shown), a chuck horizontal moving part (not shown), and a guide rail (147). The chuck (145) holds a plurality of substrates (W) aligned at a narrow pitch in the width direction (Y) in a vertical position. The chuck (145) comprises a pair of chuck members (145A, 145B) each extending in the width direction (Y). The pair of chuck members (145A, 145B) comprises a plurality of holding grooves (e.g., 50 pairs, 75 pairs, or 100 pairs) arranged at a narrow pitch in the width direction (Y). The pair of chuck members (145A, 145B) are opened and closed by a chuck opening and closing part not shown.

[0157] The chuck (145) can move in the forward and backward direction (X) along the guide rail (147). The chuck (145) is moved in the forward and backward direction (X) by the chuck horizontal moving part. The chuck (145) is raised and lowered in the vertical direction (Z) by the chuck lifting part. The chuck horizontal moving part and the chuck lifting part are equipped with, for example, electric actuators. The chuck opening and closing part is equipped with, for example, an air cylinder or an electric actuator.

[0158] <1-5. Control Unit>

[0159] A substrate processing device (1) is equipped with a control unit (151) (see FIG. 1) and a memory unit (not shown). The control unit (151) controls each component of the substrate processing device (1). The control unit (151) is equipped with one or more processors, such as a central processing unit (CPU). The memory unit is equipped with at least one of, for example, ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The memory unit stores computer programs necessary to control each component of the substrate processing device (1).

[0160] <2. Operation of the Substrate Processing Device>

[0161] Next, the operation of the substrate processing device (1) will be explained with reference to the flowcharts of FIG. 14 and FIG. 21. First, with reference to FIG. 14, the operation of the first half from the transfer to the load port (9) of the carrier (C) to the drying process will be explained. In addition, in this embodiment, the substrate processing device (1) processes 50 substrates (W) extracted from two carriers (C) in batches.

[0162] In addition, in FIG. 15a, etc., the symbol TA represents the surface (device surface or main surface) of the substrate (W) (W1, W2). Also, the back surface of the substrate (W) is the surface opposite to the surface of the substrate (W). The device surface is the surface where the device is formed or the surface during the formation of the device. Also, in FIG. 15a, etc., for the sake of illustration, 25 substrates (W1) are shown as 5 substrates (W1), and 25 substrates (W2) are shown as 5 substrates (W2).

[0163] [Step S01] Vertical orientation transformation of the 1st substrate group

[0164] Refer to FIG. 1. An external transport robot, not shown, transports two carriers (C) in sequence to a load port (9). The carrier transport robot (13) of the stocker (2) transports the first carrier (C) from the load port (9) to a stacking shelf (3). The first carrier (C) contains, for example, 25 substrates (W1) (first substrate group) aligned at a reference pitch (e.g., 10 mm pitch) in which a reference spacing (TN9) is repeated. The substrate handling mechanism (HTR) of the transfer block (5) extracts the 25 substrates (W1) in a horizontal position from the first carrier (C) stacked on the stacking shelf (3) by, for example, 25 hands (27). Then, the substrate handling mechanism (HTR) returns the 25 extracted substrates (W1) to the orientation changer (19). Also, the carrier transport robot (13) moves the empty first carrier (C) from which the 25 substrates (W1) have been extracted from the placement shelf (3) to the storage shelf (11).

[0165] Refer to FIG. 15a. The orientation changer (19) receives 25 substrates (W1) aligned to a reference pitch from a substrate handling mechanism (HTR). In the orientation changer (19), the 25 substrates (W1) are held (placed) on 25 pairs of shelves (37A) of a pair of horizontal holding members (37). Refer to FIG. 15b. Then, the receiving moving member (53) (see FIG. 4) of the orientation changer (19) brings the pair of vertical holding members (39) close to the pair of horizontal holding members (37). By doing so, the periphery of the 25 substrates (W1) is received and held in the 25 pairs of holding grooves (39A) of the pair of vertical holding members (39).

[0166] Refer to FIG. 15c. Afterwards, the orientation conversion unit (19) converts 25 substrates (W1) (first substrate group) maintained at a reference pitch from a horizontal orientation to a vertical orientation in bulk. Specifically, the rotational driving unit (41) of the orientation conversion unit (19) converts 25 substrates (W1) maintained by a pair of horizontal holding units (37) and a pair of vertical holding units (39) from a horizontal orientation to a vertical orientation. After that, the axial movement part (51) (see FIG. 4) of the posture change part (19) moves the pair of horizontal members (37) in a direction that the pair of horizontal members (37) approaches the support surface (35A) so that the 25 pairs of shelves (37A) of the pair of horizontal members (37) move away from the 25 substrates (W1) in a vertical posture.

[0167] [Step S02] Receipt of the first substrate group by the pusher member

[0168] Refer to FIG. 16a. Then, the pusher lifting part (65) (see FIG. 5) of the pusher mechanism (21) raises the pusher member (55) to a position higher than the pair of horizontal holding parts (37) and the pair of vertical holding parts (39). By doing so, the pusher member (55) receives 25 substrates (W1) (first substrate group) converted to a vertical position. Also, the pusher member (55) maintains the 25 substrates (W1) aligned at a reference pitch in a vertical position. Additionally, 50 vertical holding grooves (67) are arranged at an unequal pitch.

[0169] [Step S03] Movement of the first substrate group by the first interval

[0170] Refer to FIG. 16b. The pusher mechanism (21) moves the 25 substrates (W1) held by the pusher member (55) by a first gap (TN1) (3.333 mm) in the alignment direction of the 25 substrates (W1). Specifically, the pusher rotating part (59) (see FIG. 5) of the pusher mechanism (21) rotates the pusher member (55) by 180 degrees around the vertical axis (AX3). By doing so, the 25 substrates (W1) held by the pusher member (55) are moved to the left by the first gap (TN1). Additionally, movement by this first interval (TN1) may be carried out by rotating the pusher member (55) by 180 degrees by the pusher rotating part (59) and moving the pusher member (55) in the width direction (Y) by the pusher horizontal moving part (61) (see FIG. 5).

[0171] Additionally, the posture changer (19) rotates a pair of horizontal support members (37), etc., 90 degrees around the horizontal axis (AX2). By doing so, the pair of horizontal support members (37), etc. are raised. The axial movement unit (51) (see FIG. 4) of the posture changer (19) moves the pair of horizontal support members (37) in a direction away from the support surface (35A). Additionally, the receiving movement unit (53) (see FIG. 4) of the posture changer (19) moves a pair of vertical support members (39) away from the pair of horizontal support members (37).

[0172] [Step S04] Vertical orientation transformation of the 2nd substrate group

[0173] The carrier transport robot (13) shown in FIG. 1 transports a second carrier (C) from a load port (9) to a stacking shelf (3). The second carrier (C) is configured to hold, for example, 25 substrates (W2) aligned at a reference pitch (10 mm pitch), just like the first carrier (C). The substrate handling mechanism (HTR) uses 25 hands (27) to extract 25 substrates (W2) in a horizontal position from the second carrier (C) placed on the stacking shelf (3). Then, the substrate handling mechanism (HTR) transports the extracted 25 substrates (W2) to a position changing unit (19). Additionally, the carrier return robot (13) moves the empty second carrier (C), from which 25 substrates (W2) have been extracted, from the storage shelf (3) to the storage shelf (11).

[0174] Refer to FIG. 16c. The orientation changer (19) receives 25 substrates (W2) aligned to a reference pitch from a substrate handling mechanism (HTR). In the orientation changer (19), the 25 substrates (W2) are held on 25 pairs of shelves (37A) of a pair of horizontal holding members (37). Refer to FIG. 17a. Then, the receiving moving member (53) (see FIG. 4) of the orientation changer (19) brings a pair of vertical holding members (39) close to a pair of horizontal holding members (37).

[0175] Refer to FIG. 17b. Then, the orientation conversion unit (19) converts 25 substrates (W2) (second substrate group) maintained at a reference pitch from a horizontal orientation to a vertical orientation in bulk. Then, the axial movement unit (51) (see FIG. 4) of the orientation conversion unit (19) moves the pair of horizontal maintenance units (37) in a direction that brings the pair of horizontal maintenance units (37) closer to the support surface (35A) so that the 25 pairs of shelves (37A) of the pair of horizontal maintenance units (37) move away from the 25 substrates (W1) in the vertical orientation.

[0176] [Step S05] Receipt of the second substrate group by the pusher member

[0177] Refer to FIG. 17c. Then, the pusher lifting portion (65) (see FIG. 5) of the pusher mechanism (21) raises the pusher member (55) to a position higher than the pair of horizontal holding portions (37) and the pair of vertical holding portions (39). By doing so, the pusher member (55) receives 25 substrates (W2) (second substrate group) converted to a vertical position. Additionally, the pusher member (55) holds 50 substrates (W) (W1, W2) aligned at an unequal pitch. The 50 substrates (W) are composed of 25 substrates (W1) and 25 substrates (W2) alternately repeated.

[0178] Additionally, as shown in FIG. 17b and FIG. 17c, the surface (device surface or main surface) of 25 substrates (W1) faces in a predetermined direction (right direction). In contrast, the surface of 25 substrates (W2) faces in the opposite direction (left direction) of the predetermined direction. That is, 50 substrates (W) are arranged in a so-called face-to-face arrangement.

[0179] [Step S06] Return of the processing board group to the pitch conversion unit by the receiving mechanism

[0180] After that, the receiving mechanism (71) conveys 50 substrates (W) (processing substrate group) aligned at an uneven pitch from the pusher member (55) to the first pitch conversion unit (25). This operation will be explained in detail. Refer to FIG. 18a. First, the position conversion unit (19) rotates a pair of horizontal holding members (37), etc., 90 degrees around the horizontal axis (AX2). By doing so, a pair of horizontal holding members (37), etc. are raised.

[0181] Refer to FIG. 18b. Afterwards, the feed mechanism (71) horizontally moves the chuck (77) from an upper position of the first pitch conversion unit (25) to a lower position of the pusher member (55). That is, the feed mechanism (71) traverses the chuck (77) that is not holding the substrate (W) along the first traverse path (Rin) from the substrate feed position (Pin) to the substrate release position (Po). Before traversing, the first pitch conversion unit (25) is located below the first traverse path (Rin). The first pitch conversion unit (25) is located at the substrate feed position (Pin). The first pitch conversion unit (25) is located below the chuck (77). Also, the pusher member (55) is located at the substrate release position (Po). The chuck (77) is in a closed state capable of holding 50 substrates (W). Then, the pusher mechanism (21) lowers the pusher member (55) that holds the 50 substrates (W) in a vertical position. When the pusher member (55) passes between a pair of chuck members (77A, 77B) of the chuck (77), the 50 substrates (W) are transferred from the pusher member (55) to the chuck (77). The chuck (77) holds the 50 substrates (W) aligned at an uneven pitch in a vertical position.

[0182] Refer to FIG. 19a. Afterwards, the feed mechanism (71) moves the chuck (77) from an upper position of the pusher member (55) to an upper position of the first pitch conversion unit (25). That is, the feed mechanism (71) traverses the chuck (77) holding 50 substrates (W) along the first traverse path (Rin) from the substrate transfer position (Po) to the substrate feed position (Pin). After traverse, the first pitch conversion unit (25) is located below the first traverse path (Rin). The first pitch conversion unit (25) is located at the substrate feed position (Pin). The first pitch conversion unit (25) is located below the chuck (77). Additionally, the pusher member (55) is located at the substrate transfer position (Po). The substrate receiving position is the upper position of the first pitch conversion unit (25). Refer to FIG. 19b. Then, the lifting unit (141) (see FIG. 7) of the first pitch conversion unit (25) raises the pitch conversion main body (111) which includes 25 holding members (113). By doing so, the first pitch conversion unit (25) receives 50 substrates (W) from the receiving mechanism (71).

[0183] [Step S07] Pitch conversion of the processing substrate group from unequal pitch to narrow pitch

[0184] Refer to FIG. 20a. Afterwards, the first pitch conversion unit (25) converts the pitch of 50 substrates (W) from an unequal pitch to a narrow pitch (3.333 mm). In other words, the first pitch conversion unit (25) aligns the 50 substrates (W) aligned at an unequal pitch to a narrow pitch. This operation will be explained in detail.

[0185] Each of the 25 retaining members (113) of the first pitch conversion unit (25) has two retaining grooves (117) spaced apart by a first interval (3.333 mm). The first pitch conversion unit (25) uses the two retaining grooves (117) that each of the 25 retaining members (113) has to hold two of the 50 substrates (W1, W2), and uses the 25 retaining members (113) to hold 50 substrates (W) aligned at an unequal pitch.

[0186] Additionally, the moving part (115) (see FIG. 10) of the first pitch conversion part (25) moves 25 retaining members (113) in the alignment direction (Y direction) of the 50 substrates (W) so as to change from an unequal pitch state in which 50 substrates (W) are aligned at an unequal pitch to a narrow pitch state in which 50 substrates (W) are aligned at a narrow pitch. Additionally, the mediating mechanism (73) keeps the chuck (78) in an open state.

[0187] [Step S08] Return of the processing substrate group to the first transfer position by the intermediary mechanism

[0188] Refer to FIG. 20b. Then, the intermediate mechanism (73) lowers the chuck (78) as indicated by the dashed line to receive 50 substrates (W) aligned at a narrow pitch maintained by the first pitch conversion unit (25). Then, the intermediate mechanism (73) closes the chuck (78). This makes it possible to hold 50 substrates (W) with the chuck (78).

[0189] After that, the intermediary mechanism (73) raises the chuck (78) to the first transfer position (P1). By doing so, the intermediary mechanism (73) can receive 50 substrates (W) from the first pitch conversion unit (25) and transfer 50 substrates (W) to the main transfer mechanism (WTR). Additionally, the chuck (78) maintains the 50 substrates (W) aligned at a narrow pitch in a vertical position.

[0190] [Step S09] Substrate processing and drying

[0191] After that, the main conveying mechanism (WTR) uses a chuck (145) to receive 50 substrates (W) from the intermediate mechanism (73) and conveys the 50 substrates (W) to one of the two chemical treatment tanks (BT1, BT3). For example, when the main conveying mechanism (WTR) conveys the 50 substrates (W) to the chemical treatment tank (BT1), the lifter (LF1) receives the 50 substrates (W) aligned in a narrow pitch from the main conveying mechanism (WTR) at an upper position of the chemical treatment tank (BT1). After that, the lifter (LF1) lowers the 50 substrates (W) to immerse the 50 substrates (W) in the chemical solution stored in the chemical treatment tank (BT1). Thus, 50 substrates (W) are treated with a chemical solution in batches.

[0192] Additionally, after the preset chemical treatment time has elapsed, the lifter (LF1) lifts the 50 substrates (W) from the chemical treatment tank (BT1) by raising the 50 substrates (W). After that, the lifter (LF1) moves the 50 substrates (W) horizontally from the upper position of the chemical treatment tank (BT1) to the upper position of the cleaning treatment tank (BT2). After that, the lifter (LF1) lowers the 50 substrates (W) to immerse the 50 substrates (W) in the pure water stored in the cleaning treatment tank (BT2). In this way, the 50 substrates (W) are cleaned in batches. After the preset cleaning treatment time has elapsed, the lifter (LF1) lifts the 50 substrates (W) from the pure water in the cleaning treatment tank (BT2).

[0193] Additionally, when the main conveying mechanism (WTR) conveys 50 substrates (W) to the chemical treatment tank (BT3), the lifter (LF2) receives the 50 substrates (W) from the main conveying mechanism (WTR). Then, the lifter (LF2) conveys the 50 substrates (W) in the order of the chemical treatment tank (BT3) and the cleaning treatment tank (BT4).

[0194] The main conveying mechanism (WTR) uses a chuck (145) to receive 50 substrates (W) from one of the two lifters (LF1, LF2) and conveys the 50 substrates (W) to the drying unit (143). The drying unit (143) dries the 50 substrates (W). Afterward, the main conveying mechanism (WTR) receives the dried 50 substrates (W) from the drying unit (143).

[0195] Next, referring to FIG. 21, the operation of the latter part from the drying process to the return of the carrier (C) from the load port (9) will be explained.

[0196] [Step S11] Return of the processing substrate group to the second transfer position by the main return mechanism

[0197] Refer to FIG. 2 and FIG. 22a. The main conveying mechanism (WTR) conveys 50 substrates (W) in a vertical position, which are processed collectively in a chemical treatment tank (BT1) and aligned with a narrow pitch, to an upper position of the second pitch conversion unit (26). In other words, the main conveying mechanism (WTR) conveys 50 substrates (W) that have undergone drying treatment in the drying unit (143) to an upper position of the second pitch conversion unit (26).

[0198] After that, the main conveying mechanism (WTR) lowers the 50 substrates (W) held by the chuck (145) to the transfer position (P2). Thereby, the main conveying mechanism (WTR) conveys the 50 substrates (W) in a vertical position aligned with a narrow pitch to the second pitch conversion unit (26). Also, the second pitch conversion unit (26) receives the 50 substrates (W) in a vertical position aligned with a narrow pitch from the main conveying mechanism (WTR). Also, when receiving the 50 substrates (W), the second pitch conversion unit (26) moves 25 holding members (113) so that 50 holding grooves (117) are arranged in a narrow pitch.

[0199] [Step S12] Pitch conversion of the processing substrate group from narrow pitch to unequal pitch

[0200] Refer to FIG. 22b. Afterwards, the second pitch conversion unit (26) converts the pitch of 50 substrates (W) from a narrow pitch to an unequal pitch. This operation is described in detail. The second pitch conversion unit (26) holds 2 substrates (W) at a first interval (TN1) using 2 holding grooves (117) that are spaced apart by a first interval (TN1) each of the 25 holding members (113), and holds 50 substrates (W) aligned at a narrow pitch using the 25 holding members (113). The moving unit (115) (see FIG. 10) moves the 25 holding members (113) in the alignment direction (width direction (Y)) of the 50 substrates (W) to change from a narrow pitch state to an unequal pitch state.

[0201] [Step S13] Return of the processing substrate group to the pusher member by the ejection mechanism

[0202] Refer to FIG. 23a. Afterwards, the output mechanism (75) of the transfer mechanism (23) conveys 50 substrates (W) aligned with unequal pitches from the second pitch conversion unit (26) to the pusher member (55) in a vertical position. This operation is described in detail. The chuck (79) of the output mechanism (75) is in a closed state. First, the lifting unit (141) (see FIG. 7) of the second pitch conversion unit (26) lowers the pitch conversion main body (111) containing 25 holding members (113). During this lowering, the output mechanism (75) uses the chuck (79) to receive and hold 50 substrates (W) in a vertical position aligned with unequal pitches.

[0203] Refer to FIG. 23b. Afterwards, the ejection mechanism (75) conveys 50 substrates (W) held by the chuck (79) from an upper position of the second pitch conversion unit (26) to an upper position of the pusher member (55). That is, the ejection mechanism (75) traverses the chuck (79) holding 50 substrates (W) along the second traverse route (Rout) from the substrate ejection position (Pout) to the substrate transfer position (Po). Before the traverse of the chuck (79), the second pitch conversion unit (26) is located below the second traverse route (Rout). The second pitch conversion unit (26) is located at the substrate ejection position (Pout). The second pitch conversion unit (26) is located below the chuck (79). Additionally, the pusher member (55) is positioned at the substrate transfer position (Po). Then, the pusher mechanism (21) raises the pusher member (55) to a position higher than the chuck (79). During this raising, the pusher mechanism (21) uses the pusher member (55) to receive and hold 50 substrates (W) from the chuck (79) of the release mechanism (75). The pusher member (55) holds the 50 substrates (W) aligned at an uneven pitch in a vertical position.

[0204] [Step S14] Receipt of the second substrate group by the attitude conversion unit

[0205] Refer to FIG. 24a. After that, the ejection mechanism (75) moves the chuck (79) to an upper position of the second pitch conversion unit (26). That is, the ejection mechanism (75) traverses the chuck (79) that is not holding the substrate (W) along the second traverse path (Rout) from the substrate ejection position (Pout) to the substrate release position (Po). After the chuck (79) traverses, the second pitch conversion unit (26) is located below the second traverse path (Rout). The second pitch conversion unit (26) is located at the substrate ejection position (Pout). The second pitch conversion unit (26) is located below the chuck (79). Additionally, the pusher member (55) is located at the substrate release position (Po). After that, the rotation drive unit (41) of the posture change unit (19) rotates the pair of horizontal support units (37), etc., around the horizontal axis (AX2) by 90 degrees so that the pair of vertical support units (39) receive 25 substrates (W2) (second substrate group). As a result, the pair of horizontal support units (37) and the pair of vertical support units (39) are in a fallen state. In addition, the axial movement unit (51) brings the pair of horizontal support units (37) close to the support surface (35A), and the receiving movement unit (53) brings the pair of vertical support units (39) close to the pair of horizontal support units (37).

[0206] Refer to Fig. 24b.

[0207] After that, the pusher mechanism (21) lowers the pusher member (55) from an upper position of a pair of vertical holding members (39) to a lower position. During this lowering, the posture changing unit (19) uses a pair of horizontal holding members (37) and a pair of vertical holding members (39) to receive 25 substrates (W2) (second substrate group) out of 50 substrates (W) (processing substrate group) from the pusher member (55). The pair of vertical holding members (39) holds the 25 substrates (W2) aligned at a reference pitch (10 mm pitch). After that, the axial moving unit (51) moves the pair of horizontal holding members (37) away from the support surface (35A). Thus, 25 pairs of shelves (37A) of 1 pair of horizontal holding parts (37) each come into contact with the back surface of 25 substrates (W2).

[0208] Additionally, as shown in FIG. 24a, the moving part (115) of the second pitch conversion part (26) moves 25 (24) retaining members (113) so that 50 retaining grooves (117) are arranged in a narrow pitch. As shown in FIG. 24b, the lifting part (141) of the second pitch conversion part (26) raises the pitch conversion main body part (111) containing 25 retaining members (113) so that 50 retaining grooves (117) are arranged at a position higher than the chuck (79).

[0209] [Step S15] Vertical orientation transformation of the 2nd substrate group

[0210] Refer to Fig. 25a.

[0211] The posture conversion unit (19) rotates a pair of horizontal holding units (37), etc., 90 degrees around the horizontal axis (AX2). By doing so, the posture conversion unit (19) converts 25 substrates (W2) from a vertical posture to a horizontal posture. After that, the receiving moving unit (53) moves a pair of vertical holding units (39) away from a pair of horizontal holding units (37). By doing so, the periphery of 25 substrates (W2) is extracted from the 25 pairs of holding grooves (39A) of the pair of vertical holding units (39).

[0212] The carrier transport robot (13) shown in FIG. 1 transports an empty second carrier (C) from the storage shelf (11) to the loading shelf (3). The substrate handling mechanism (HTR) converts to a horizontal position at the position conversion unit (19) and also extracts 25 substrates (W2) aligned to a reference pitch from the position conversion unit (19) (see FIG. 25b). After that, the substrate handling mechanism (HTR) transports the 25 substrates (W2) into the second carrier (C) loaded on the loading shelf (3). After that, the carrier transport robot (13) transports the second carrier (C), which contains the processed 25 substrates (W2), from the loading shelf (3) to the load port (9).

[0213] [Step S16] Movement of the first substrate group by the first interval

[0214] Refer to FIG. 25b. After the posture conversion unit (19) converts 25 substrates (W2) to a horizontal posture, the pusher mechanism (21) raises the pusher member (55) holding 25 substrates (W1) (first substrate group).

[0215] Additionally, the pusher mechanism (21) moves the 25 substrates (W1) held by the pusher member (55) by a first gap (TN1) (3.333 mm) in the alignment direction of the 25 substrates (W1). Specifically, the pusher rotating part (59) (see FIG. 5) of the pusher mechanism (21) rotates the pusher member (55) 180 degrees around the vertical axis (AX3). As a result, the 25 substrates (W1) held by the pusher member (55) are moved to the right by the first gap (TN1). Additionally, movement by this first interval (TN1) may be carried out by rotating the pusher member (55) by 180 degrees by the pusher rotating part (59) and moving the pusher member (55) in the width direction (Y) by the pusher horizontal moving part (61) (see FIG. 5).

[0216] [Step S17] Receipt of the first substrate group by the attitude conversion unit

[0217] Refer to FIG. 25c. The posture changer (19) places a pair of horizontal support members (37) and a pair of vertical support members (39) in a fallen state. Additionally, the axial movement member (51) brings the pair of horizontal support members (37) close to the support surface (35A), and the receiving movement member (53) brings the pair of vertical support members (39) close to the pair of horizontal support members (37).

[0218] Refer to FIG. 26a. Then, the pusher mechanism (21) lowers the pusher member (55) from an upper position of a pair of vertical holding members (39) to a lower position. During this lowering, the position changing unit (19) uses a pair of horizontal holding members (37) and a pair of vertical holding members (39) to receive the remaining 25 substrates (W1) from the pusher member (55). The pair of vertical holding members (39) holds the 25 substrates (W1) aligned at a reference pitch (e.g., 10 mm pitch). Then, the axial moving unit (51) contacts the 25 pairs of shelves (37A) of the pair of horizontal holding members (37) with the back surfaces of the 25 substrates (W1), respectively.

[0219] [Step S18] Vertical orientation transformation of the 1st substrate group

[0220] Refer to FIG. 26b. The posture conversion unit (19) rotates a pair of horizontal holding units (37), etc., 90 degrees around the horizontal axis (AX2). By doing so, the posture conversion unit (19) converts 25 substrates (W1) from a vertical posture to a horizontal posture. Refer to FIG. 26c. After that, the receiving moving unit (53) moves a pair of vertical holding units (39) away from a pair of horizontal holding units (37).

[0221] The carrier transport robot (13) shown in FIG. 1 transports an empty first carrier (C) from the storage shelf (11) to the placement shelf (3). The substrate handling mechanism (HTR) converts to a horizontal position at the position conversion unit (19) and also extracts 25 substrates (W1) aligned at a reference pitch (10 mm pitch) from the position conversion unit (19) (see FIG. 26c). After that, the substrate handling mechanism (HTR) transports the 25 substrates (W1) into the first carrier (C) placed on the placement shelf (3). After that, the carrier transport robot (13) transports the first carrier (C) containing the processed 25 substrates (W1) from the placement shelf (3) to the load port (9). After that, the external return robot that is not in the city returns two carriers (C) in sequence from the load port (9) to the next destination.

[0222] The chuck (77) described above corresponds to the "first traverse maintaining part" of the present invention. The receiving mechanism (71) described above corresponds to the "first traverse mechanism" of the present invention. The chuck (79) described above corresponds to the "second traverse maintaining part" of the present invention. The releasing mechanism (75) described above corresponds to the "second traverse mechanism" of the present invention. The chuck (78) described above corresponds to the "intermediary maintaining part" of the present invention.

[0223] According to Example 1, the orientation conversion unit (19) converts the orientation of the substrate to a horizontal orientation, which maintains a group of substrates aligned to a reference pitch in the vertical direction, and to a vertical orientation, which maintains a group of substrates aligned to a reference pitch in the horizontal direction. The pusher mechanism (21) has a pusher member (55) that maintains a plurality of substrates aligned to an unequal pitch narrower than the reference pitch by combining a substrate (W2) (second group of substrates) in a vertical orientation maintained by the orientation conversion unit (19) and a substrate (W1) (first group of substrates) in a vertical orientation received in advance from the orientation conversion unit (19). The first pitch conversion unit (25) receives a plurality of substrates aligned to an unequal pitch and aligns the plurality of substrates aligned to an unequal pitch to a narrow pitch narrower than the reference pitch. The processing block (7) processes the plurality of substrates aligned to a narrow pitch in batches. The main conveying mechanism (WTR) conveys multiple substrates aligned at a narrow pitch to the processing block (7) in batches. The first pitch conversion unit (25) and the second pitch conversion unit (26) are positioned on the side of the main conveying mechanism (WTR) of the pusher mechanism (21) (left side in the left-right direction (Y)).

[0224] In this way, the pusher mechanism (21) combines a substrate (W2) (second substrate group) in a vertical holding position maintained by the posture conversion unit (19) and a substrate (W1) (first substrate group) in a vertical holding position received in advance from the posture conversion unit (19) to maintain a plurality of substrates aligned at an unequal pitch narrower than the reference pitch. The process of creating a plurality of substrates aligned at an unequal pitch from a substrate group of reference pitch is called the first pitch conversion. The first pitch conversion unit (25) receives a plurality of substrates aligned at an unequal pitch and aligns the plurality of substrates aligned at an unequal pitch to a narrow pitch narrower than the reference pitch. The process of creating a plurality of substrates aligned at a narrow pitch from a plurality of substrates aligned at an unequal pitch is called the second pitch conversion. In the present invention, the second pitch conversion is not performed in the pusher mechanism (21), but in the first pitch conversion unit (25) positioned on the side of the main conveying mechanism (WTR) of the pusher mechanism (21). That is, the second pitch conversion is performed at a position that does not reduce the throughput of the second pitch conversion. Thus, the substrate (W) can be processed efficiently.

[0225] Additionally, the multiple substrates aligned with unequal pitch are a plurality of substrates (W) aligned with unequal pitch in which a first gap (TN1) narrower than the reference pitch and a second gap (TN2) narrower than the reference pitch and wider than the first gap (TN1) are alternately repeated. The equal pitch is equal to the sum of the first gap (TN1) and the second gap (TN2). The multiple substrates (W) aligned with narrow pitch are a plurality of substrates (W) aligned by repeating the first gap (TN1). In this way, the second pitch change is performed slowly by narrowing the second gap (TN2) of the unequal pitch created by the first pitch change until it becomes the first gap (TN1). Therefore, the second pitch change can be performed slowly at a position that does not reduce the throughput of the first pitch change.

[0226] Additionally, the receiving mechanism (71) moves a chuck (77), which holds a plurality of substrates (W) aligned with unequal pitch received from the pusher member (55), along a first traversing path. The discharging mechanism (75) moves a chuck (79), which holds a plurality of substrates (W) aligned with unequal pitch handed over to the pusher member (55), along a second traversing path. The first pitch conversion unit (25) receives a plurality of substrates (W) aligned with unequal pitch and aligns the plurality of substrates (W) aligned with unequal pitch to a narrow pitch. The second pitch conversion unit (26) receives a plurality of substrates (W) aligned with a narrow pitch and aligns the plurality of substrates (W) aligned with a narrow pitch to an unequal pitch. In this way, the two-stage pitch conversion is performed by dividing it into a pusher mechanism (21), a first pitch conversion unit (25), and a second pitch conversion unit (26). Additionally, depending on the before and after of processing in the processing block (7), the pitch conversion is performed by dividing it into the first pitch conversion unit (25) and the second pitch conversion unit (26). Therefore, the throughput of the second stage pitch conversion is not reduced. Thus, the substrate can be processed efficiently.

[0227] Additionally, the mediating mechanism (73) raises the chuck (78), which holds multiple substrates (W) aligned with a narrow pitch, at the substrate loading position. The substrate transfer position is a position where multiple substrates (W) aligned with an uneven pitch are loaded together from the pusher member (55) to the chuck (78). The substrate loading position is a position where multiple substrates (W) aligned with a narrow pitch are loaded together from the chuck (78) to the main transport mechanism (WTR). The first pitch conversion unit (25) loads multiple substrates (W) aligned with an uneven pitch from the chuck (77) by rising at the substrate loading position. The chuck (78) loads multiple substrates (W) aligned with a narrow pitch from the first pitch conversion unit (25) by rising at the substrate loading position (Pin). The first pitch conversion unit (25) is positioned at the substrate receiving position (Pin). Thus, during the substrate receiving process carried out between the chuck (77), the first pitch conversion unit (25), the chuck (78), and the main conveying mechanism (WTR), pitch conversion by the first pitch conversion unit (25) can be efficiently performed.

[0228] Additionally, the first pitch conversion unit (25) is positioned below the chuck (78). This allows the operation at the first pitch conversion unit (25) and the operation at the chuck (78) to be performed simultaneously, partially simultaneously, or at close timing.

[0229] Additionally, the first pitch conversion unit (25) is positioned below the first transverse path (Pin). This allows the operation at the chuck (77), the operation at the first pitch conversion unit (25), and the operation at the chuck (78) to be performed simultaneously, partially simultaneously, or at close timing.

[0230] Additionally, the second pitch conversion unit (26) receives a plurality of substrates (W) aligned at a narrow pitch from the main transport mechanism (WTR) and outputs a plurality of substrates (W) aligned at an unequal pitch to the chuck (79). The second pitch conversion unit (26) is positioned at the substrate output location (Pout). Thus, pitch conversion by the second pitch conversion unit (26) can be efficiently performed during the substrate output process.

[0231] Additionally, the second pitch conversion unit (26) is positioned below the second transverse path (Pout). This allows the operation at the second pitch conversion unit (26) and the operation at the chuck (79) to be performed simultaneously, partially simultaneously, or at close timing.

[0232] Also, the second pitch conversion unit (26) is positioned above the first pitch conversion unit (25). This allows the operation in the first pitch conversion unit (25) and the operation in the second pitch conversion unit (26) to be performed simultaneously, partially simultaneously, or at close timing.

[0233] Additionally, the second pitch conversion unit (26) is positioned above the chuck (78). This allows the operation in the first pitch conversion unit (25), the operation in the chuck (79), and the operation in the second pitch conversion unit to be performed simultaneously, partially simultaneously, or at close timing.

[0234] Additionally, the first transverse path (Pin) and the second transverse path (Pout) intersect at a predetermined angle (α), and the pusher mechanism (21) is positioned at the location (Po) where they intersect at a predetermined angle (α), and the first pitch conversion unit (25) and the second pitch conversion unit (26) are positioned apart at a predetermined angle. Thus, the first pitch conversion unit (25) and the second pitch conversion unit (26) can be separated into positions where interference is difficult (substrate loading position (Pin), substrate exporting position (Pout)).

[0235] [Example 2]

[0236] Next, Example 2 of the present invention will be described with reference to the drawings. Also, descriptions that overlap with Example 1 will be omitted.

[0237] FIG. 27 is a plan view showing the configuration of the material block (5) and its surroundings related to Example 2. FIG. 28 is a side view showing the transmission mechanism (23) and two pitch conversion parts (25, 26), etc., when viewed as shown by arrow AA in FIG. 27.

[0238] The substrate processing device (1) related to Example 2 is different from the substrate processing device (1) related to Example 1 in that it does not have an intermediary mechanism (73).

[0239] That is, the main transport mechanism (WTR) receives 50 substrates (W) aligned at a narrow pitch maintained by the first pitch conversion unit (25) without interposing the intermediate mechanism (73). For example, the main transport mechanism (WTR) descends to the height at which the first pitch conversion unit (25) performs pitch conversion (the first transfer position (P1A) in this example). The first pitch conversion unit (25) transfers 50 substrates aligned at a narrow pitch to the main transport mechanism (WTR) from the height at which pitch conversion is performed. Meanwhile, if the first pitch conversion unit (25) can rise to a position higher than the height at which pitch conversion is performed, the first transfer position (P1A) may be higher than the position shown in this example.

[0240] According to Example 2, the first pitch conversion unit (25) receives a plurality of substrates (W) aligned with an unequal pitch from the chuck (77) and outputs a plurality of substrates (W) aligned with a narrow pitch to the main transport mechanism (WTR). In this way, the output of substrates (W) between the chuck (77), the first pitch conversion unit (25), and the main transport mechanism (WTR) can be carried out efficiently.

[0241] [Example 3]

[0242] Next, Example 3 of the present invention will be described with reference to the drawings. Additionally, descriptions that overlap with Examples 1 and 2 will be omitted.

[0243] FIG. 29 is a plan view showing the configuration of the material block (5) and its surroundings related to Example 3. FIG. 30 is a side view showing the transmission mechanism (23A) and one pitch conversion part (25A), etc., when viewed as shown by arrow AA in FIG. 29.

[0244] The substrate processing device (1) related to Example 1 is equipped with a transfer mechanism (23) having two pitch conversion units (25, 26). In this regard, the substrate processing device (1) related to Example 3 is equipped with a transfer mechanism (23A) having one pitch conversion unit (25A).

[0245] That is, the transfer mechanism (23A) is equipped with an incoming / outgoing mechanism (71A) and an intermediary mechanism (73A). The incoming / outgoing mechanism (71A) receives a plurality of substrates (W) aligned with an uneven pitch from the pusher member (55) to the pitch conversion unit (25A), and outputs a plurality of substrates (W) aligned with an uneven pitch from the pitch conversion unit (25A) to the pusher member (55). The intermediary mechanism (73A) receives a plurality of substrates (W) aligned with a narrow pitch from the pitch conversion unit (25A) to the transfer position (P1B), and outputs a plurality of substrates (W) aligned with a narrow pitch from the transfer position (P1B) to the pitch conversion unit (25A).

[0246] The incoming and outgoing mechanism (71A) is placed at the incoming height position (H1) and the incoming height position (H3). The incoming height position (H1) and the incoming height position (H3) are at the same height.

[0247] The incoming and outgoing mechanism (71A) is equipped with a chuck (77), an opening and closing part (81), a forward and backward moving part (83), and a width moving part (85). The chuck (77), the opening and closing part (81), the forward and backward moving part (83), and the width moving part (85) are used for both the incoming and outgoing of multiple substrates (W) aligned at an uneven pitch.

[0248] The intermediary mechanism (73A) is equipped with a chuck (78), an opening / closing part (101), an arm (103), and a lifting part (105). The chuck (78), the opening / closing part (101), the arm (103), and the lifting part (105) are used for both the loading and unloading of multiple substrates (W) aligned at a narrow pitch. Additionally, the intermediary mechanism (73A) may be used only for the loading of substrates (W).

[0249] The pitch conversion unit (25A) is used for both conversion from a plurality of substrates (W) aligned with unequal pitch to a plurality of substrates (W) aligned with narrow pitch, and conversion from a plurality of substrates (W) aligned with narrow pitch to a plurality of substrates (W) aligned with unequal pitch.

[0250] The chuck (77) described above corresponds to the "transverse maintenance part" of the present invention. The incoming / outgoing mechanism (71A) described above corresponds to the "transverse mechanism" of the present invention. The chuck (78) described above corresponds to the "intermediary maintenance part" of the present invention.

[0251] According to the substrate processing apparatus (1) related to Example 3, the input / output mechanism (71A) moves a chuck (77), which holds a plurality of substrates (W) aligned with an uneven pitch received from a pusher member (55), along a traversing path (Rin, Rout) between a substrate transfer position (Po) and a substrate transfer position (Pin, Pout). The intermediary mechanism (73A) raises and lowers a chuck (78), which holds a plurality of substrates (W) aligned with a narrow pitch, at the substrate transfer position (Pin, Pout). The substrate transfer position (Po) is a position between the pusher member (55) and the chuck (77) where a plurality of substrates (W) aligned with an uneven pitch are transferred together. The substrate transfer position (Pin, Pout) is a position between the chuck (78) and the main transport mechanism (WTR) where multiple substrates (W) aligned at a narrow pitch are transferred in bulk. The pitch conversion unit (25A) moves up and down at the substrate transfer position (Pin, Pout) to transfer multiple substrates (W) aligned at an uneven pitch between the chuck (77). The chuck (77) moves up and down at the substrate transfer position (Pin, Pout) to transfer multiple substrates (W) aligned at a narrow pitch between the pitch conversion unit (25A). The pitch conversion unit (25A) is positioned at the substrate transfer position (Pin, Pout). By doing so, the position of the pitch conversion unit (25) that performs the second stage of pitch conversion can be separated from the pusher mechanism (21) that performs the first stage of pitch conversion. That is, the second pitch change is performed at a position that does not reduce the throughput of the first pitch change. Therefore, the substrate (W) can be processed efficiently.

[0252] Additionally, the pitch conversion unit (25A) is positioned below the chuck (78). This allows the operation at the pitch conversion unit (25A) and the operation at the chuck (78) to be performed simultaneously, partially simultaneously, or at close timing.

[0253] Also, the pitch conversion section (25A) is positioned below the transverse path. This allows the operation at the chuck (77), the operation at the pitch conversion section (25A), and the operation at the chuck (78) to be performed simultaneously, partially simultaneously, or at close timing.

[0254] [Example 4]

[0255] Next, Example 4 of the present invention will be described with reference to the drawings. Additionally, descriptions that overlap with Examples 1 to 3 will be omitted.

[0256] FIG. 31 is a plan view showing the configuration of the material block and its surroundings related to Example 4. FIG. 32 is a side view showing the transmission mechanism and two pitch conversion parts, etc., when viewed as indicated by arrow AA in FIG. 31.

[0257] The substrate processing device (1) related to Example 4, like Example 3, has a transfer mechanism (23A) having one pitch conversion unit (25A). The substrate processing device (1) related to Example 4 differs from the substrate processing device (1) related to Example 3 in that it does not have an intermediary mechanism (73A).

[0258] That is, the main transport mechanism (WTR) receives 50 substrates (W) aligned at a narrow pitch maintained by the pitch conversion unit (25A) without interposing the intermediate mechanism (73A). For example, the main transport mechanism (WTR) descends to the height at which the pitch conversion unit (25A) performs pitch conversion (the first transfer position (P1A) in this example). The pitch conversion unit (25A) brings the 50 substrates aligned at a narrow pitch into the main transport mechanism (WTR) from the height at which pitch conversion is performed.

[0259] According to the substrate processing apparatus (1) related to Example 4, the input / output mechanism (71A) moves a chuck (77), which holds a plurality of substrates (W) aligned with an uneven pitch received from a pusher member (55), along a traversing path (Rin, Rout) between a substrate transfer position (Po) and a substrate transfer position (Pin, Pout). The substrate transfer position (Po) is a position between the pusher member (55) and the chuck (77) where a plurality of substrates (W) aligned with an uneven pitch are transferred in a batch. The substrate transfer position (Pin, Pout) is a position between the pitch conversion unit (25A) and the main transport mechanism (WTR) where the plurality of substrates aligned with a narrow pitch are transferred in a batch. The pitch conversion unit (25A) transfers a plurality of substrates (W) aligned with an uneven pitch between the chuck (77) and the substrate transfer position (Pin, Pout) by moving up and down at the substrate transfer position (Pin, Pout). The pitch conversion unit (25A) is positioned at the substrate transfer position (Pin, Pout). By doing so, the position of the pitch conversion unit (25A) performing the second pitch conversion can be separated from the pusher mechanism (21) performing the first pitch conversion. That is, the second pitch conversion is performed at a position that does not reduce the throughput of the first pitch conversion. Therefore, the substrates can be processed efficiently.

[0260] Also, the pitch conversion section (25A) is positioned below the traverse path (Rin, Rout). This allows the operation in the chuck (77) and the operation in the pitch conversion section (25A) to be performed simultaneously, partially simultaneously, or at close timing.

[0261] [Example 5]

[0262] Next, Example 5 of the present invention will be described with reference to the drawings. Additionally, descriptions that overlap with Examples 1 to 4 will be omitted.

[0263] FIG. 33 is a plan view showing the configuration of the material block (5) and its surroundings related to Example 5. FIG. 34 is a side view showing the extension mechanism of the pitch conversion parts (25, 26) provided in the pair of chuck members (77C, 77D) of the receiving mechanism (71) and the pair of chucks (79C, 79D) of the receiving mechanism (75). FIG. 35 is a side view showing the extension mechanism of the pitch conversion parts (25, 26) provided in the pair of chuck members (77C, 77D) of the receiving mechanism (71) and the pair of chucks (79C, 79D) of the receiving mechanism (75).

[0264] In Example 5, the first pitch conversion unit (25) is integrally mounted on a pair of chuck members (77C, 77D) of the receiving mechanism (71). The second pitch conversion unit (26) is mounted on a pair of chucks (79C, 79D) of the receiving mechanism (75). Specifically, the first pitch conversion unit (25) is integrally mounted on the side of a pair of chuck members (77C, 77D) of the receiving mechanism (71). The second pitch conversion unit (26) is mounted on a pair of chucks (79C, 79D) of the receiving mechanism (75).

[0265] The extension structure of the first pitch conversion section (25) and the second pitch conversion section (26) is the same as in Example 1. In Example 1, the pitch conversion section (25, 26) is arranged horizontally, but in Example 5, the pitch conversion section (25, 26) is arranged vertically.

[0266] The retaining groove (113) of the receiving mechanism (71) is mounted on the upper side of each of the pair of chuck members (77C, 77D). The retaining groove (113) of the receiving mechanism (75) is mounted on the upper side of each of the pair of chuck members (79C, 79D). Thus, in the receiving mechanism (71), the substrate (W) is held on the upper side of each of the pair of chuck members (77C, 77D). In the receiving mechanism (75), the substrate (W) is held on the upper side of each of the pair of chuck members (79C, 79D).

[0267] According to Example 5, the first pitch conversion unit (25) is provided in the receiving mechanism (71), and the second pitch conversion unit (26) is provided in the receiving mechanism (75). As a result, the height of the substrate processing device (1) can be suppressed as much as the first pitch conversion unit (25) is integrated with the receiving mechanism (71) and the second pitch conversion unit (26) is integrated with the receiving mechanism (75).

[0268] In addition, it can also be applied to a substrate processing device (1) in which an incoming mechanism (71) and an outgoing mechanism (75) are arranged vertically. This is because the height of the substrate processing device (1) can be suppressed as the first pitch conversion unit (25) is integrated with the incoming mechanism (71) and the second pitch conversion unit (26) is integrated with the outgoing mechanism (75).

[0269] In addition, this example can also be applied to a substrate processing device (1) in which an incoming mechanism (71) and an outgoing mechanism (75) are used as a single mechanism (incoming and outgoing mechanism (71A)).

[0270] The present invention is not limited to the above embodiments and can be modified as follows.

[0271] (1) In the above-described embodiment, when the reference interval (TN9) is, for example, 10 mm, the first interval (TN1) is, for example, 3.333 mm and the second interval (TN2) is, for example, 6.666 mm. In this case, the first interval (TN1) is equivalent to half the interval of the second interval (TN2). In this case, the first interval (TN1) may be smaller than half the interval of the second interval (TN2). For example, when the reference interval (TN9) is, for example, 10 mm, the first interval (TN1) may be 3 mm and the second interval (TN2) may be 7 mm. Also, the first interval (TN1) may be 2.5 mm and the second interval (TN2) may be 7.5 mm. In addition, the second interval (TN2) is preferably 2 to 3 times the first interval (TN1).

[0272] For example, the two retaining grooves (117) of each retaining member (113) may be configured to be spaced apart by a first gap (TN1) (e.g., 3 mm) that is smaller than half the gap of the second gap (TN2) (e.g., 7 mm) and larger than 0 (zero) mm. Additionally, the two retaining grooves (117) of each retaining member (113) may be configured to be spaced apart by a first gap (TN1) (e.g., 3 mm) that is at least 1 / 3 times and less than 1 / 2 times the gap of the second gap (TN2) (e.g., 7 mm). Additionally, the two retaining grooves (117) of each retaining member (113) may be configured to be spaced apart by a first gap (TN1) (e.g., 3.333 mm) that is half the gap of the second gap (TN2) (e.g., 6.666 mm).

[0273] (2) In each of the embodiments and variations described above, when the reference spacing (TN9) is, for example, 10 mm, the first spacing (TN1) is, for example, 3.333 mm and the second spacing (TN2) is, for example, 6.666 mm. In this regard, the first spacing (TN1) may be larger than the spacing of 1 / 3 times the reference spacing (TN9) (for example, 3.333 mm) and smaller than the spacing of 1 / 2 times the reference spacing (TN9) (for example, 5 mm).

[0274] (3) In the embodiment described above, the pitch conversion unit (25, 26) had two retaining grooves (117) formed in one retaining member (113), but it is not necessary for the configuration to have one retaining groove (117) formed in each retaining member (113). In such a configuration, a two-stage pitch conversion different from the embodiment described above can be adopted. That is, the pusher mechanism (21) combines the substrate (W1) of the first substrate group and the substrate (W2) of the second substrate group to create a plurality of substrates (W) aligned to a first narrow pitch narrower than the reference pitch. The first pitch conversion unit (25) converts the plurality of substrates (W) aligned to the first narrow pitch into a plurality of substrates (W) aligned to a second narrow pitch narrower than the first narrow pitch. The first pitch conversion unit (25) can convert the first narrow pitch to the second narrow pitch because one retaining groove (117) is formed for each retaining member (113).

[0275] According to this example, a plurality of substrates (W) aligned with a narrow spacing are a plurality of substrates (W) aligned with a first narrow pitch that is narrower than the reference pitch. A plurality of substrates (W) aligned with a narrow pitch are a plurality of substrates (W) aligned with a second narrow pitch that is narrower than the first narrow pitch. In this way, the second pitch change is performed slowly by narrowing the first narrow pitch created by the first pitch change until it becomes the second narrow pitch. The second pitch change is performed at a position that does not reduce throughput. Therefore, the substrates can be processed efficiently.

[0276] (4) In each embodiment and each variant described above, the receiving mechanism (71) is formed at the rear of the output mechanism (75), but the receiving mechanism (71) may be formed at the front of the output mechanism (75). That is, the arrangement of the receiving mechanism (71) and the output mechanism (75) may be reversed. In this case, the receiving mechanism (71) conveys a plurality of substrates (W) from the pusher member (55) to the second pitch conversion unit (26), and the output mechanism (75) conveys a plurality of substrates (W) from the first pitch conversion unit (25) to the pusher member (55).

[0277] (5) In each embodiment and each variation described above, the mediating mechanism (73) transported a plurality of substrates (W) aligned at a narrow pitch from the first pitch conversion unit (25) to the main transport mechanism (WTR). In this regard, the mediating mechanism (73) may transport a plurality of substrates (W) aligned at a narrow pitch from the main transport mechanism (WTR) to the second pitch conversion unit (26).

[0278] (6) In each of the embodiments and variations described above, the chuck (77) (a pair of chuck members (77A, 77B)) of the receiving mechanism (71) is opened and closed by the opening and closing part (81). In this regard, the chuck (77) does not need to be configured to be opened and closed.

[0279] (7) In each embodiment and each variant described above, the chuck (79) (a pair of chuck members (79A, 79B)) of the release mechanism (75) is opened and closed by the opening and closing part (89). In this regard, the chuck (79) does not need to be configured to be opened and closed.

[0280] The present invention may be implemented in other specific forms without departing from its concept or essence, and therefore, as to indicate the scope of the invention, one should refer to the added claims rather than the above description. Explanation of the symbols

[0281] 1 : Substrate processing device 7 : Processing Block 19: Attitude conversion unit 21: Pusher mechanism 25: First pitch conversion unit 26 : Second pitch converter WTR: Main return mechanism

Claims

Claim 1 A substrate processing device for processing substrates comprises: a horizontal holding posture for maintaining a group of substrates aligned at equal pitch in a vertical direction for a substrate in a horizontal posture; a posture conversion mechanism for converting the posture of a substrate in a vertical posture to a vertical holding posture for maintaining the group of substrates aligned at equal pitch in a horizontal direction; a pusher mechanism having a pusher member for maintaining a plurality of substrates aligned at a narrow spacing narrower than equal pitch by combining a second group of substrates in the vertical holding posture maintained by the posture conversion mechanism and a first group of substrates in the vertical holding posture received in advance from the posture conversion mechanism; a pitch conversion unit for receiving the plurality of substrates aligned at the narrow spacing and aligning the plurality of substrates aligned at the narrow spacing to a narrow pitch narrower than equal pitch; a substrate processing unit for processing the plurality of substrates aligned at the narrow pitch in bulk; and a main transport mechanism for transporting the plurality of substrates aligned at the narrow pitch in bulk to the substrate processing unit, wherein the pitch A conversion unit is disposed on the main conveying mechanism side of the pusher mechanism, and the plurality of substrates aligned at the narrow pitch are a plurality of substrates aligned at an unequal pitch in which a first pitch narrower than the equal pitch and a second pitch narrower than the equal pitch and wider than the first pitch are alternately repeated, the equal pitch is equal to the sum of the first pitch and the second pitch, and the plurality of substrates aligned at the narrow pitch are a plurality of substrates aligned by repeating the first pitch. Claim 2 delete Claim 3 delete Claim 4 In claim 1, the substrate processing device comprises a traversing mechanism that traverses a traversing holding member, which holds a plurality of substrates aligned with the narrow spacing received from the pusher member, along a traversing path between a substrate transfer position and a substrate transfer position; the substrate transfer position is a position where the plurality of substrates aligned with the narrow spacing are transferred collectively between the pusher member and the traversing holding member; the substrate transfer position is a position where the plurality of substrates aligned with the narrow pitch are transferred collectively between the pitch conversion unit and the main transport mechanism; the pitch conversion unit performs the transfer of the plurality of substrates aligned with the narrow spacing between the traversing holding member by raising and lowering at the substrate transfer position; and the pitch conversion unit is a substrate processing device disposed at the substrate transfer position. Claim 5 In claim 4, the pitch conversion unit is a substrate processing device positioned below the transverse path. Claim 6 In claim 1, the substrate processing device comprises a traversing mechanism that moves a traversing holding member, which collectively holds the plurality of substrates aligned with the narrow spacing received from the pusher member, along a traversing path between a substrate transfer position and a substrate delivery position, and a mediating mechanism that raises and lowers an intermediate holding member, which collectively holds the plurality of substrates aligned with the narrow pitch, at the substrate delivery position; the substrate transfer position is a position between the pusher member and the traversing holding member where the plurality of substrates aligned with the narrow spacing are collectively delivered; the substrate delivery position is a position between the mediating holding member and the main conveying mechanism where the plurality of substrates aligned with the narrow pitch are collectively delivered; the pitch conversion unit performs the delivery of the plurality of substrates aligned with the narrow spacing between the traversing holding member by raising and lowering at the substrate delivery position; and the intermediate holding member performs the delivery between the pitch conversion unit, the A substrate processing device that performs the transfer of the plurality of substrates aligned at a narrow pitch, wherein the pitch conversion unit is positioned at the substrate transfer location. Claim 7 In claim 6, the pitch conversion unit is a substrate processing device positioned below the intermediate holding unit. Claim 8 A substrate processing apparatus according to claim 6, wherein the pitch conversion unit is positioned below the transverse path. Claim 9 In claim 1, the substrate processing device comprises a first traversing mechanism that traverses along a first traversing path, a first traversing holding member that collectively holds the plurality of substrates aligned with the narrow spacing received from the pusher member, and a second traversing mechanism that traverses along a second traversing path, a second traversing holding member that collectively holds the plurality of substrates aligned with the narrow spacing handed over to the pusher member, and the pitch conversion unit comprises a first pitch conversion unit that receives the plurality of substrates aligned with the narrow spacing and aligns the plurality of substrates aligned with the narrow spacing to the narrow pitch, and a second pitch conversion unit that receives the plurality of substrates aligned to the narrow pitch and aligns the plurality of substrates aligned to the narrow pitch to the narrow spacing. Claim 10 In claim 9, the first transverse path is a path between a substrate transfer location and a substrate receiving location, the second transverse path is a path between a substrate removal location and a substrate transfer location, the first transverse path and the second transverse path are formed at positions separated in the transverse direction, the first pitch conversion unit is positioned at the substrate receiving location, and the second pitch conversion unit is positioned at the substrate removal location, in a substrate processing device. Claim 11 A substrate processing device according to claim 10, wherein the first pitch conversion unit receives the plurality of substrates aligned at the narrow pitch from the first transverse maintenance unit and discharges the plurality of substrates aligned at the narrow pitch to the main transport mechanism. Claim 12 In claim 10, the intermediate holding member that holds the plurality of substrates aligned with the narrow pitch collectively is provided with an intermediate mechanism that raises the substrate receiving position, the substrate transfer position is a position where the plurality of substrates aligned with the narrow pitch are collectively received from the pusher member to the first transverse holding member, the substrate receiving position is a position where the plurality of substrates aligned with the narrow pitch are collectively received from the intermediate holding member to the main conveying mechanism, the first pitch conversion unit raises the substrate receiving position to receive the plurality of substrates aligned with the narrow pitch from the first transverse holding member, the intermediate holding member raises the substrate receiving position to receive the plurality of substrates aligned with the narrow pitch from the pitch conversion unit, and the first pitch conversion unit is a substrate processing device disposed at the substrate receiving position. Claim 13 In claim 12, the first pitch conversion unit is a substrate processing device positioned below the intermediate holding unit. Claim 14 In claim 13, the first pitch conversion unit is a substrate processing device positioned below the first transverse path. Claim 15 In claim 10, the second pitch conversion unit receives the plurality of substrates aligned at the narrow pitch from the main transport mechanism and outputs the plurality of substrates aligned at the narrow spacing to the second transverse maintenance unit, and the substrate processing device disposed at the substrate output position. Claim 16 In claim 15, the second pitch conversion unit is a substrate processing device positioned below the second transverse path. Claim 17 In claim 9, the second pitch conversion unit is a substrate processing device positioned above the first pitch conversion unit. Claim 18 In claim 12, the second pitch conversion unit is a substrate processing device positioned above the intermediate holding unit. Claim 19 In claim 9, the first transverse path and the second transverse path intersect at a predetermined angle, the pusher mechanism is positioned at the location where they intersect at the predetermined angle, and the first pitch conversion unit and the second pitch conversion unit are positioned apart at the predetermined angle, forming a substrate processing apparatus. Claim 20 In claim 1, the substrate processing device comprises a traversing mechanism that traverses a traversing holding member, which holds a plurality of substrates aligned at the narrow spacing received from the pusher member, along a traversing path between a substrate transfer position and a substrate transfer position, and the pitch changing member is a substrate processing device provided in the traversing mechanism. Claim 21 In claim 9, the first pitch conversion unit is provided in the first traverse mechanism, and the second pitch conversion unit is provided in the second traverse mechanism.

Images