Substrate holder having integrated temperature measurement electrical devices

Abstract

A substrate holder comprises a base plate, a bond layer disposed on the base plate, and a ceramic layer disposed on the bond layer. The ceramic layer has a top surface including an area configured to support the substrate. A plurality of temperature measuring electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and routed and positioned to be electrically connected to one or more electrical contacts of the plurality of temperature measuring electrical devices. Electrical wires are positioned to make electrical contact with the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.

Description

Technology Field

[0001] The present invention relates to the manufacture of semiconductor devices. Background Technology

[0002] Many modern semiconductor manufacturing processes are performed within plasma process modules in which a substrate is held on a substrate holder upon exposure to plasma. Temperature control of the substrate during plasma processing operations is a factor that can influence the outcome of the processing operations. To provide control of the substrate temperature during plasma processing operations, it is necessary to accurately and reliably measure the temperature of the substrate holder to infer the temperature of the substrate held on the holder. The present invention arises in this context.

[0003] In one exemplary embodiment, a substrate holder is disclosed. The substrate holder comprises a base plate, a bond layer disposed on the base plate, and a ceramic layer disposed on the bond layer. The ceramic layer has a top surface including a region configured to support the substrate. The substrate holder comprises a plurality of temperature measuring electrical devices attached to the ceramic layer. Each of the plurality of temperature measuring electrical devices is configured to measure a corresponding local temperature of the ceramic layer. Each of the plurality of temperature measuring electrical devices has a plurality of electrical contacts. The substrate holder comprises a plurality of electrically conductive traces embedded within the ceramic layer. Some of the plurality of electrically conductive traces are positioned to be electrically in contact with one or more of the plurality of electrical contacts of the plurality of temperature measuring electrical devices. The substrate holder also comprises a plurality of electrical wires electrically in contact with one or more of the plurality of electrically conductive traces. The plurality of electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.

[0004] In one exemplary embodiment, a system is disclosed. The system includes a substrate holder comprising a base plate and a ceramic layer attached to the top surface of the base plate using a bond layer disposed between the base plate and the ceramic layer. The ceramic layer has a top surface including a region configured to support the substrate. The system also includes a plurality of temperature measuring electrical devices attached to the ceramic layer. Each of the plurality of temperature measuring electrical devices is configured to measure a corresponding local temperature of the ceramic layer. Each of the plurality of temperature measuring electrical devices has a plurality of electrical contacts. The ceramic layer includes a plurality of electrically conductive traces embedded within the ceramic layer. A portion of the plurality of electrically conductive traces is routed between the electrical contacts of the plurality of temperature measuring electrical devices. A portion of the plurality of electrically conductive traces is routed from one or more of the electrical contacts of the plurality of temperature measuring electrical devices to a corresponding one of a plurality of exposed electrical contacts. The system also includes a plurality of electrical wires connected to the corresponding exposed electrical contacts among the plurality of exposed electrical contacts. The system also includes a monitoring and control circuit comprising a plurality of electrical nodes that are electrically in contact with each of the plurality of electrical wires. The monitoring and control circuit is configured to control the operation of multiple temperature measuring electrical devices.

[0005] In one exemplary embodiment, a method for fabricating a substrate holder is disclosed. The method also includes the step of forming a ceramic layer having a top surface including a region configured to support a substrate. The ceramic layer is formed to include a plurality of temperature-measuring electrical devices. The ceramic layer is formed to include embedded electrically conductive traces routed to electrically connect the plurality of temperature-measuring electrical devices to a plurality of exposed electrical contacts on the bottom surface of the ceramic layer. The method also includes the step of connecting a plurality of electrical wires to each of the plurality of exposed electrical contacts. The method also includes the step of fixing the ceramic layer to a base plate using a bond layer so that the plurality of electrical wires are routed through the bond layer and through the base plate. The method also includes the step of connecting the plurality of electrical wires to a control circuit.

[0006] In one exemplary embodiment, a method for measuring the temperature of a substrate holder is disclosed. The method comprises the step of supplying power to a plurality of temperature measuring electrical devices within a ceramic layer through a first number of electrically conductive traces embedded within a ceramic layer of the substrate holder. The method also comprises the step of connecting the plurality of temperature measuring electrical devices within the ceramic layer to a reference ground potential through a second number of electrically conductive traces embedded within the ceramic layer. The method further comprises the step of supplying control signals to the plurality of temperature measuring electrical devices within a ceramic layer through a third number of electrically conductive traces embedded within a ceramic layer of the substrate holder to instruct the plurality of temperature measuring electrical devices to measure corresponding local temperatures of the ceramic layer. The method further comprises the step of receiving temperature measurement data signals from the plurality of temperature measuring electrical devices within the ceramic layer through a fourth number of electrically conductive traces embedded within a ceramic layer of the substrate holder.

[0007] Other aspects and advantages of the present invention will become more apparent from the following detailed description, taken together with the accompanying drawings, which are illustrated by examples of the present invention. Brief explanation of the drawing

[0008] FIG. 1 illustrates an exemplary substrate process module according to various embodiments of the present invention. FIG. 2a illustrates a vertical cross-sectional view of an example of a substrate holder configured as an electrostatic chuck according to various embodiments of the present invention. FIG. 2b shows an enlarged view of half of the vertical cross-section of a substrate holder as shown in FIG. 2a, according to various embodiments of the present invention. FIG. 3a illustrates an exemplary arrangement of a plurality of temperature measuring arrays according to various embodiments of the present invention. FIG. 3b illustrates an exemplary layout of a plurality of electrically conductive traces for a predetermined one of the plurality of temperature measuring arrays shown in FIG. 3a, according to various embodiments of the present invention. FIG. 3c illustrates an electrical schematic diagram of a predetermined one of a plurality of temperature measuring arrays as shown in FIG. 3b, according to various embodiments of the present invention. FIG. 4 illustrates an alternative arrangement of a plurality of temperature measurement arrays according to various embodiments of the present invention. FIG. 5 illustrates another arrangement of a plurality of temperature measuring arrays according to various embodiments of the present invention. FIG. 6 illustrates another arrangement of a plurality of temperature measuring arrays according to various embodiments of the present invention. FIG. 7 illustrates a quadrant arrangement of a plurality of temperature measurement arrays according to various embodiments of the present invention. FIG. 8 illustrates a flowchart of a method for manufacturing a substrate holder according to various embodiments of the present invention. FIG. 9 illustrates a flowchart of a method for measuring the temperature of a substrate holder according to various embodiments of the present invention. Specific details for implementing the invention

[0009] In the following description, a number of specific details are presented to provide a complete understanding of the invention. However, it will be obvious to those skilled in the art that the invention may be practiced without all or some of these specific details. In other examples, known process operations are not described in detail so as not to unnecessarily obscure the invention.

[0010] FIG. 1 illustrates an exemplary substrate process module (100) according to various embodiments of the present invention. The process module (100) includes a substrate holder (102) configured to hold a substrate (101) upon exposure to a plasma processing atmosphere in which plasma (104) is generated. The present disclosure is primarily about devices, systems, and methods in which the temperatures of various parts of the substrate holder (102) can be measured during plasma processing operations within the process module (100). For the sake of providing an exemplary context, the process module (100) is illustrated as an inductively coupled plasma (ICP) process module. However, it should be understood that in other embodiments, the process module (100) may be defined as other types of process modules used in semiconductor manufacturing.

[0011] In exemplary embodiments, the term substrate (101) as used herein refers to a semiconductor wafer. However, in other embodiments, the term substrate (101) as used herein may refer to substrates formed of sapphire, GaN, GaAs, or SiC, or other substrate materials, and may include glass panels / substrates, metal foils, metal sheets, polymer materials, etc. Additionally, in various embodiments, the substrate (101) as used herein may vary in shape, form, and / or size. For example, in some embodiments, the substrate (101) as used herein may correspond to a 200 mm (millimeters) semiconductor wafer, a 300 mm semiconductor wafer, or a 450 mm semiconductor wafer. Also, in some embodiments, the substrate (101) as used herein may correspond to a non-circular substrate, such as a rectangular substrate for a flat panel display, among other shapes.

[0012] The process module (100) is configured to provide exposure of the substrate (101) to plasma-based processing operations to modify the properties of the substrate (101) in a predetermined and controlled manner. The process module (100) includes a chamber (103) defined by peripheral structures including one or more wall structures (103A), a bottom structure (103B), and a top structure (103C). In some embodiments, the top structure (103C) is formed of a material capable of transmitting RF (radiofrequency) signals, such as quartz or ceramic, among others. The process module (100) includes a coil assembly (105) placed on the top structure (103C).

[0013] An RF power supply (107) is connected to a coil assembly (105) via a connection (109) to supply RF power (RF signals). In various embodiments, the RF power supply (107) includes one or more RF generators and associated impedance matching circuits to provide proper transmission of RF power to the coil assembly (105). The chamber (103) may be formed of an electrically conductive material and may have an electrical connection to a reference ground potential (106).

[0014] In some embodiments, the process module (100) includes a closeable access port (111), such as a gate valve or other component, through which a substrate (101) can be transferred in and out of the chamber (103). The process module (100) also includes a plurality of process gas supply ports (113A, 113B, 113C) through which one or more process gas composition(s) can be supplied to an internal section of the chamber (103) that is positioned over the substrate holder (102). During operation, the process gas supply unit (115) operates to deliver one or more process gas composition(s) to process gas supply ports (113A, 113B, 113C) respectively through one or more connection lines (117A, 117B, 117C), and RF power is delivered from the RF power supply unit (107) to the coil assembly (105) so as to generate an electromagnetic field within the plasma generation zone that lies across the upper structure (103C) and the substrate holder (102) to convert one or more process gas composition(s) into plasma (104) within the plasma generation zone. Thus, reactive components of the plasma (104), such as ions and / or radicals, interact with parts of the exposed surfaces of the substrate (101).

[0015] The process module (100) includes a plurality of side venting structures (119) through which gases and byproduct materials can flow to an exhaust port (121) connected to an exhaust module (123) configured to apply negative pressure inside the chamber (103) to facilitate the exhaust of used process gases and byproduct materials. Additionally, in some embodiments, the substrate holder (102) is configured to receive RF power through a connection (127) from another RF power supply (125) to provide for the generation of a bias voltage on the substrate holder (102) to attract ions from the plasma (104) toward the substrate holder (102) and the substrate (101) held on the substrate holder (102), and / or to contribute to the generation of the plasma (104). In various embodiments, the RF power supply (125) includes one or more RF generators and associated impedance matching circuits to provide appropriate transmission of RF power to the substrate holder (102).

[0016] Although the process module (100) illustrates an example of an ICP process module, in various embodiments, the process module (100) may essentially be any type of process module used in the manufacture of semiconductor devices. For example, in some embodiments, the process module (100) may be a CCP (capacitively coupled plasma) process module, and the CCP process module comprises one or more electrodes disposed within a chamber (103) instead of the coil assembly (105) used in the ICP process module, and RF power is delivered to one or more electrodes. In the CCP process module, one or more electrodes may comprise one or more of a top electrode (e.g., among others, a showerhead electrode or a solid electrode), a bottom electrode (e.g., among others, an electrostatic chuck or a substrate support), and a side electrode (e.g., among others, a peripheral ring-shaped electrode), and the top, bottom, and side electrodes are configured around the plasma generation zone. RF power delivered to one or more electrodes of the CCP process module is transferred from one or more electrodes to a reference ground potential through one or more process gas composition(s) present in the plasma generation zone, and thereby converts one or more process gas composition(s) in the plasma generation zone into plasma (104).

[0017] It should be understood that the examples of ICP and CCP process modules mentioned above are discussed in a simplified manner for the sake of technical ease. In reality, the process module (100) is a complex system that includes many components not described herein, whether ICP, CCP, or some other type. However, it should be understood in this discussion that the process module (100), regardless of type, includes a substrate holder (102) configured to hold the substrate (101) in a fixed manner upon exposure to plasma (104) in order to enable processing of the substrate (101) to obtain a specific result. Examples of plasma processing operations that may be performed by the process module (100) include, among others, etching operations, deposition operations, and ashing operations.

[0018] In various embodiments, the substrate holder (102) may be an electrostatic chuck or another type of substrate support member. FIG. 2a illustrates a vertical cross-sectional view of an example of a substrate holder (102) configured as an electrostatic chuck according to various embodiments of the present invention. The substrate holder (102) comprises a base plate (201), a bond layer (203) disposed on the base plate (201), and a ceramic layer (205) disposed on the bond layer (203). The bond layer (203) secures the ceramic layer (205) to the base plate (201). The bond layer (203) also acts as a thermal break between the ceramic layer (205) and the base plate (201).

[0019] The base plate (201) is structurally fixed to the installation module (206) so that electrical continuity is established between the base plate (201) and the installation module (206) to enable the transmission of RF power from the RF power supply (125) to the base plate (201) through the installation module (206). The installation module (206) is configured as a hollow, electrically conductive structure for housing various support components of the substrate holder (102) apart from the plasma atmosphere present in the chamber (103). In some embodiments, the base plate (201) and the installation module (206) are formed of aluminum. However, in other embodiments, the base plate (201) and the installation module (206) may be formed of other materials or a combination of materials, provided that the base plate (201) and the installation module (206) provide sufficient electrical conductivity, thermal conductivity, and mechanical strength to support the operation of the substrate holder (102).

[0020] The top surface of the ceramic layer (205) includes a region configured to support the substrate (101) during processing. In some embodiments, the top surface of the ceramic layer (205) is formed by co-planar top surfaces of a plurality of elevated structures referred to as mesa structures. For the substrate (101) supported on the top surfaces of the mesa structures, the regions between the sides of the mesa structures provide a flow of a fluid, such as helium gas, to the rear surface of the substrate (101) to provide enhanced temperature control of the substrate (101).

[0021] The ceramic layer (205) comprises one or more clamp electrodes (207) that are electrically connected to a clamp voltage supply (209) via an electrical connection (211). In some embodiments, the one or more clamp electrodes (207) may be a single electrode used to generate an electric field for holding a substrate (101) on the top surface of the ceramic layer (205). In some embodiments, the clamp electrode (207) may comprise two separate clamp electrodes configured for bipolar operation in which a differential voltage is applied between the two separate clamp electrodes to generate an electric field for holding a substrate (101) on the top surface of the ceramic layer (205). In various embodiments, the two separate clamp electrodes may be geometrically interdigitated or interleaved to enable bipolar operation.

[0022] In some embodiments, the ceramic layer (205) includes a resistive heater (213) that is electrically connected to a heater power supply (215) via an electrical connection (217). Additionally, in some embodiments, the ceramic layer (205) includes an RF power transfer electrode (219) and associated RF power transfer connection modules (221) distributed in a substantially uniform manner around the periphery of the ceramic layer (205). Each of the RF power transfer connection modules (221) provides a low-impedance transmission path for RF signals between the base plate (201) and the RF power transfer electrode (219). More specifically, each of the RF power transfer connection modules (221) is configured to form an electrical connection from the base plate (201) to the RF power transfer electrode (219) at its respective location to form an RF power transfer path from the base plate (201) to the RF power transfer electrode (219) at its respective location. In this way, the base plate (201), RF power transfer connection modules (221), and RF power transfer electrode (219) together form a Faraday cage that shields the internal volume of the substrate holder (102) from RF signals that may interfere with the operation of electrical components present within the internal volume of the substrate holder (102) by directing RF power transfer within the circumference closest to the radial periphery of the ceramic layer (205) where the RF power transfer connection modules (221) are located, and around the internal volume of the substrate holder (102) existing between the top surface of the base plate (201) and the RF power transfer electrode (219).

[0023] In some embodiments, the substrate holder (102) includes a peripheral seal (223) disposed between the top surface of the base plate (201) and the bottom surface of the ceramic layer (205) radially outside the bond layer (203). The peripheral seal (223) is configured to prevent the entry of plasma (104) components and / or process byproduct materials into the internal zones where the ceramic layer (205) and the base plate (201) interface the bond layer (203).

[0024] In various embodiments, the substrate holder (102) may be configured to include various cooling mechanisms, heating mechanisms, clamping mechanisms, bias electrodes, substrate lifting pins, and sensors, wherein the sensors may provide measurements of temperature, voltage, and / or current, among other parameters. For example, the base plate (201) may be configured to include a plurality of cooling channels (225) through which a cooling fluid can flow. Additionally, the ceramic layer (205) may include an array of fluid flow channels through which a back gas flows and is dispensed into a zone between the mesa structures beneath the substrate (101). It should be understood that the equipment module (206) can be configured to hold various circuits, piping, control components, and support components for internal components of the substrate holder (102), such as a resistance heater (213), a rear gas delivery system, substrate lifting pins, clamp electrode(s) (207), cooling channels (225), sensors, etc.

[0025] In particular, regarding temperature sensors present within a substrate holder (102), various embodiments of the present invention include a plurality of temperature measuring electrical devices (227) disposed within a ceramic layer (205). Each of the plurality of temperature measuring electrical devices (227) is configured to measure a corresponding local temperature of the ceramic layer (205). Additionally, each of the plurality of temperature measuring electrical devices (227) has a plurality of electrical contacts. In some embodiments, each of the plurality of temperature measuring electrical devices (227) is a separate integrated circuit chip configured to measure temperature. In some embodiments, these integrated circuit chips are configured to store the measured temperature data and to provide the transmission of the temperature measuring data to another circuit.

[0026] FIG. 2b illustrates an enlarged view of half of the vertical cross-section of a substrate holder (102) as shown in FIG. 2a, according to various embodiments of the present invention. In some embodiments, each of a plurality of temperature measuring electrical devices (227) is fixed to the ceramic layer (205) by a thermally conductive fixing material (228) to provide good thermal contact between the temperature measuring electrical device (227) and the ceramic layer (205). In various embodiments, the thermally conductive fixing material (228) is a solder material or an adhesive material.

[0027] Additionally, in some embodiments, the ceramic layer (205) comprises a plurality of recessed regions (233) distributed across the bottom surface of the ceramic layer (205). In some embodiments, each of the plurality of recessed regions (233) is configured as a counter-bore formed within the ceramic layer (205) to accommodate a corresponding one of the plurality of temperature measuring electrical devices (227), so that when each of the plurality of temperature measuring electrical devices (227) is placed within the recessed region (233) of the ceramic layer (205), each of the plurality of temperature measuring electrical devices (227) is positioned between the top surface and the bottom surface of the ceramic layer (205). In some embodiments, the depth of the counter-bore is less than about one-fourth of the total thickness of the ceramic layer (205) when measured vertically between the top surface and the bottom surface of the ceramic layer (205). For example, if the total thickness of the ceramic layer (205) is about 4 mm (millimeters) to 5 mm, then the depth of the counter-bore of the recessed area (233) may be about 1 mm. Also, in some embodiments, the substrate holder (102) may include different recessed areas (233) having different counter-bore depths. In some embodiments, the diameter of each recessed area is less than about 5 mm.

[0028] In some embodiments, a backfill material is disposed within each of the multiple recessed regions (233) to cover the corresponding multiple temperature measuring electrical devices (227) and to fill each of the multiple recessed regions (233) at a level substantially equal to the bottom surface of the ceramic layer (205). In these embodiments, the backfill material will be a dielectric material and will have controlled thermal conductivity. For example, in some embodiments, the backfill material may be, among others, a high thermal conductivity epoxy, a high thermal conductivity silicon, or a high thermal conductivity doped silicon. Alternatively, in some embodiments, the multiple temperature measuring electrical devices (227) may be surface-mounted on the bottom surface of the ceramic layer (205) and on the top surface of the bond layer (203) which is modified / molded to accommodate the volumes occupied by the multiple temperature measuring electrical devices (227) when the ceramic layer (205) is disposed on the bond layer (203).

[0029] As illustrated in FIGS. 2a and 2b, the substrate holder (102) comprises a plurality of electrically conductive traces, e.g., 229A, 229B, 231A, 231B, embedded within the ceramic layer (205). Some of the plurality of electrically conductive traces (229A, 229B, etc.) are positioned to be electrically in contact with one or more of the plurality of electrical contacts of the plurality of temperature measuring electrical devices (227). In some embodiments, the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) are routed through a plurality of levels of the ceramic layer (205) using electrically conductive pads and corresponding via structures (235) formed to extend vertically within the ceramic layer (205). In some embodiments, a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) comprise tungsten as an electrical conductor. In some embodiments, a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) comprise one or more of molybdenum, tantalum, tungsten, palladium, ruthenium, and platinum for electrical conductivity, among others. In some embodiments, a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) are co-fired with the ceramic layer (205) such that the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) have a temperature response substantially identical to the temperature response of the ceramic layer (205). More specifically, the thermal conductivity of the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) is approximately the same as the thermal conductivity of the ceramic layer (205) on which the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) are formed.

[0030] It should be understood that a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) are embedded within the ceramic layer (205) so that the ceramic layer (205) includes interconnecting conductors for a plurality of temperature measuring electrical devices (227). In various embodiments, the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) may be formed using different methods, including but not limited to sintering of the ceramic layer (205) after screen printing of conductive inks, physical vapor deposition, electroplating, and lithography mask / etching / filling processes. In some embodiments, each of the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) is about 10 μm thick.

[0031] In some embodiments, a plurality of electrically conductive mounting pads are each fixed within a plurality of recessed regions (233), and each of the plurality of electrically conductive mounting pads is electrically connected to a ground bus formed by one or more of a plurality of electrically conductive traces (229A, 229B, etc.). In these embodiments, each of the plurality of temperature measuring electrical devices (227) has an exposed ground pad soldered to each of the plurality of electrically conductive mounting pads. In these embodiments, most of the heat transfer from the ceramic layer (205) to the plurality of temperature measuring electrical devices (227) occurs through a corresponding number of electrically conductive mounting pads and associated solder connections.

[0032] The substrate holder (102) also includes a plurality of electrical wires (237) that are in electrical contact with one or more of a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.). In some embodiments, the plurality of electrical wires (237) extend from the ceramic layer (205) through the bond layer (203) and through the base plate (201) to the control circuit. In some embodiments, a portion of the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) is routed between the electrical contacts of a plurality of temperature measuring electrical devices (227). And, in some embodiments, a portion of a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) is routed from one or more of the plurality of electrical contacts of a plurality of temperature measuring electrical devices (227) to one of the corresponding exposed electrical contacts (239) using a plurality of electrical wires (237) each connected to the corresponding exposed electrical contacts (239).

[0033] In some embodiments, a control circuit to which a plurality of electrical wires (237) are routed includes a plurality of electrical nodes that are each electrically in contact with the plurality of electrical wires (237). In some embodiments, the control circuit is implemented on a circuit board (241). The control circuit is configured to control the operation of a plurality of temperature measuring electrical devices (227) and to receive temperature measuring data from the plurality of temperature measuring electrical devices (227). It should be understood that data transfer between the control circuit and the plurality of temperature measuring electrical devices (227) is performed using digital signals. In some embodiments, the circuit board (241) is associated solely with the board holder (102). And, in some embodiments, the circuit board (241) is placed under the base plate (201) within the installation module (206). Additionally, in some embodiments, the circuit board (241) includes a data jack for transmitting data from the computer (243) outside the board holder (102) via a connection (245) and from the computer (243). In some embodiments, temperature measurement data provided by the temperature measurement electrical devices (227) may be transmitted to a temperature control system to provide closed-loop feedback temperature control of the board holder (102).

[0034] In some embodiments, a plurality of temperature measuring electric devices (227) are distributed within a plurality of temperature measuring zones, and the plurality of temperature measuring zones are defined concentrically around a centerline (247) of the ceramic layer (205) that extends vertically through the center of the top surface of the ceramic layer (205). For example, the substrate holder (102) of FIG. 2a includes four temperature measuring zones, including an inner zone, a middle-inner zone, a middle-outer zone, and an outer zone. However, it should be understood that in other embodiments, the substrate holder (102) may be configured to essentially include any number of temperature measuring zones. In some embodiments, the temperature measuring zones are defined to correspond spatially to the heater control zones when provided by the resistance heater (213).

[0035] In some embodiments, a plurality of temperature measuring electric devices (227), a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) embedded in a ceramic layer (205), and a plurality of electric wires (237) are separated into a plurality of temperature measuring arrays. In some embodiments, each of the plurality of temperature measuring arrays includes: a) separate temperature measuring electric devices (227) each disposed within different temperature measuring zones among a plurality of temperature measuring zones, b) a dedicated set of a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) embedded in a ceramic layer (205), and c) a dedicated set of a plurality of electric wires (237). In this way, a single dedicated set of a plurality of electric wires (237) is provided to service all distinct temperature measuring electric devices (227) within a single corresponding temperature measuring array.

[0036] FIG. 3a illustrates an exemplary arrangement of a plurality of temperature measuring arrays according to various embodiments of the present invention. The AA view of FIG. 3a was referenced in FIG. 2a. In the example of FIG. 3a, the substrate holder (102) includes four temperature measuring arrays (301A, 301B, 301C, 301D). Each of the temperature measuring arrays (301A, 301B, 301C, 301D) includes four temperature measuring electrical devices (227) distributed between four temperature measuring zones. In some embodiments, each of the temperature measuring electrical devices (227) is disposed within each recessed area (233) formed within the ceramic layer (205). In some embodiments, each of the temperature measuring electrical devices (227) may be attached to the bottom surface of the ceramic layer (205). Each of the temperature measurement arrays (301A, 301B, 301C, 301D) includes each set of exposed electrical contacts (239) and each set of multiple electrical wires (237).

[0037] FIG. 3b illustrates an exemplary layout of a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) for a predetermined temperature measurement array among the plurality of temperature measurement arrays (301A, 301B, 301C, 301D) shown in FIG. 3a, according to various embodiments of the present invention. A plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) for a predetermined temperature measuring array among a plurality of temperature measuring arrays (301A, 301B, 301C, 301D) include a first set of electrically conductive traces (231A) for supplying power to each of the temperature measuring electrical devices (227), e.g., integrated circuit chips, within the predetermined temperature measuring array among the plurality of temperature measuring arrays (301A, 301B, 301C, 301D). Additionally, in this exemplary embodiment, a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) for a predetermined one temperature measuring array among a plurality of temperature measuring arrays (301A, 301B, 301C, 301D) include a second set of electrically conductive traces (229A) to provide a reference ground potential to each of the temperature measuring electrical devices (227), e.g., integrated circuit chips, within the predetermined one temperature measuring array among the plurality of temperature measuring arrays (301A, 301B, 301C, 301D).Additionally, in this exemplary embodiment, a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) for a predetermined temperature measurement array among a plurality of temperature measurement arrays (301A, 301B, 301C, 301D) include a third set of electrically conductive traces (231B) for supplying a clock signal to each of the temperature measurement electrical devices (227), e.g., integrated circuit chips, within the predetermined temperature measurement array among the plurality of temperature measurement arrays (301A, 301B, 301C, 301D). Additionally, in this exemplary embodiment, a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) for a predetermined one temperature measuring array among a plurality of temperature measuring arrays (301A, 301B, 301C, 301D) include a fourth set of electrically conductive traces (229B) for transmitting data to and from each of the temperature measuring electrical devices (227), e.g., integrated circuit chips, within the predetermined one temperature measuring array among the plurality of temperature measuring arrays (301A, 301B, 301C, 301D).

[0038] In the exemplary embodiment mentioned above, a plurality of electrical wires (237) for a predetermined temperature measurement array among a plurality of temperature measurement arrays (301A, 301B, 301C, 301D) include a first wire (237A) for supplying power to a first set of electrically conductive traces (231A), a second wire (237B) for connecting a second set of electrically conductive traces (229A) to a reference ground potential, a third wire (237C) for supplying a clock signal to a third set of electrically conductive traces (231B), and a fourth wire (237D) for transmitting data to and from a fourth set of electrically conductive traces (229B). In this way, the first set of electrically conductive traces (231A) forms a power bus, the second set of electrically conductive traces (229A) forms a ground bus, the third set of electrically conductive traces (231B) forms a clock bus, and the fourth set of electrically conductive traces (229B) forms a data bus.

[0039] Additionally, due to the connection requirements of different temperature measuring electrical devices (227), it may be necessary to route a first set of electrically conductive traces (231A), a second set of electrically conductive traces (229A), a third set of electrically conductive traces (231B), and a fourth set of electrically conductive traces (229B) in different levels of the ceramic layer (205) to avoid shorting of the different electrically conductive traces (229A, 229B, 231A, 231B) together. For example, FIG. 3b illustrates that a second set of electrically conductive traces (229A) for a ground bus and a fourth set of electrically conductive traces (229B) for a data bus are formed at the same level of the ceramic layer (205). More specifically, a second set of electrically conductive traces (229A) for the ground bus and a fourth set of electrically conductive traces (229B) for the data bus are formed at the integrated circuit chip interface level of the ceramic layer (205).

[0040] FIG. 3b also illustrates that a first set of electrically conductive traces (231A) for a power bus and a third set of electrically conductive traces (231B) for a clock bus are formed at a higher level of the ceramic layer (205) relative to a lower integrated circuit chip interface level of the ceramic layer (205). The third set of electrically conductive traces (231B) for the clock bus are electrically connected to corresponding conductive traces at a lower integrated circuit chip interface level of the ceramic layer (205) through via connections labeled 1 to 6. And, the first set of electrically conductive traces (231A) for the power bus are electrically connected to corresponding conductive traces at a lower integrated circuit chip interface level of the ceramic layer (205) through via connections labeled 7 to 12.

[0041] Additionally, in some embodiments, for signal noise reduction purposes, a fourth set of electrically conductive traces (229B) for the data bus is terminated by a first resistor (R1) disposed between the end of the power bus and the data bus formed by the first set of electrically conductive traces (231A). Similarly, for signal noise reduction purposes, a third set of electrically conductive traces (231B) for the clock bus is terminated by a second resistor (R2) disposed between the end of the power bus and the clock bus formed by the first set of electrically conductive traces (231A). Also, for signal noise reduction purposes, each of the four temperature measuring electrical devices (227) has a corresponding capacitor (C1, C2, C3, C4) electrically connected between its power input terminal and a reference ground potential. It should be understood that the first resistor (R1), the second resistor (R2), and the capacitors (C1, C2, C3, C4) are each embedded within the ceramic layer (205). Therefore, it may not be necessary to have a signal noise control circuit placed outside the ceramic layer (205) to control signal noise according to different electrically conductive traces (229A, 229B, 231A, 231B, etc.).

[0042] FIG. 3c illustrates an electrical schematic diagram of a predetermined one of a plurality of temperature measurement arrays (301A, 301B, 301C, 301D) as illustrated in FIG. 3b, according to various embodiments of the present invention. In this example, each of the temperature measurement electrical devices (227) is defined as an integrated circuit chip having a data port (SDA), a clock port (SCL), a reset port (OS), a ground port (GND), an exposed pad connection (EPAD), a power port (VDD), and three address ports (A0, A1, A2). The three address ports (A0, A1, A2) of each integrated circuit chip (227) may be connected to the power and ground in different combinations to establish unique addressing of the different integrated circuit chips (227). Additionally, in some embodiments, each of the three address ports (A0, A1, A2) of each integrated circuit chip (227) may be connected to a power, ground, clock port (SCL), or data port (SDA) to increase the number of unique address combinations and thereby provide an increased number of uniquely addressable integrated circuit chips (227) implementations within a predetermined plurality of temperature measurement arrays. In this manner, each integrated circuit chip (227) may have a unique trace design for the unique addressing of the integrated circuit chip (227). For example, using the standard I2C (Inter-Integrated Circuit) serial interface protocol, each temperature measurement electrical device may be individually and uniquely addressed (based on the unique connection of the address ports of the integrated circuit). And, data packets received from the temperature measurement electrical devices may be identified based on the unique addressing of the various temperature measurement electrical devices. In various embodiments, the integrated circuit chips (227) may use digital signals, analog signals, or a combination thereof.In one exemplary embodiment, the integrated circuit chip (227) is implemented as a MAX31725 integrated circuit chip provided by Maxim Integrated Products, Inc., San Jose, California, utilizing an I2C serial interface. However, it should be understood that the MAX31725 integrated circuit chip is one of many different devices that can be used for temperature measuring electrical devices (227). For example, in some embodiments, the integrated circuit chip (227) may be configured to utilize the SPI (Serial Peripheral Interface) protocol or other bus-based transport protocols. Therefore, it should be understood that the present invention is not limited to the use of the MAX31725 integrated circuit chip for temperature measuring electrical devices (227) in all embodiments. It should be understood that four temperature measuring electrical devices (227) in a plurality of temperature measuring arrays of FIG. 3c are provided as an example. The number of temperature measuring electrical devices (227) in a predetermined plurality of temperature measuring arrays may be five or more. Additionally, in some embodiments, each of the temperature measuring electrical devices (227) may include a plurality of address ports, such as four or more or two or fewer address ports (A0, A1, A2), as illustrated in the example of FIG. 3c.

[0043] In various embodiments of the substrate holder (102), the number of temperature measuring electrical devices (227) per temperature measuring array, and both the number and location of the temperature measuring arrays, may vary. For example, in various embodiments, the substrate holder (102) may include 1, 2, 3, 4, 5, 6, 7, 8, etc. of temperature measuring arrays. And, in some embodiments, different temperature measuring arrays within the same substrate holder (102) may include different numbers of temperature measuring electrical devices (227).

[0044] FIG. 4 illustrates an alternative arrangement of a plurality of temperature measuring arrays (301A, 301B, 301C, 301D) according to various embodiments of the present invention. An alternative AA view of FIG. 4 was referenced in FIG. 2a. In the example of FIG. 4, the substrate holder (102) includes three temperature measuring arrays (401A, 401B, 401C). Each of the temperature measuring arrays (401A, 401B, 401C) includes four temperature measuring electrical devices (227) distributed among four temperature measuring zones. In some embodiments, each of the temperature measuring electrical devices (227) is placed within each recessed area (233) formed within the ceramic layer (205). In some embodiments, each of the temperature measuring electrical devices (227) may be attached to the bottom surface of the ceramic layer (205). Each of the temperature measurement arrays (401A, 401B, 401C) includes each set of exposed electrical contacts (239) and each set of a plurality of electrical wires (237).

[0045] FIG. 5 illustrates another arrangement of a plurality of temperature measuring arrays (501A, 501B, 501C, 501D, 503A, 503B, 503C, 503D) according to various embodiments of the present invention. An alternative AA view of FIG. 5 was referenced in FIG. 2a. In the example of FIG. 5, the substrate holder (102) includes eight temperature measuring arrays (501A, 501B, 501C, 501D, 503A, 503B, 503C, 503D). Each of the temperature measuring arrays (501A, 501B, 501C, 501D) includes four temperature measuring electrical devices (227) distributed between four temperature measuring zones. And, each of the temperature measuring arrays (503A, 503B, 503C, 503D) includes three temperature measuring electrical devices (227) distributed between three of the four temperature measuring zones. In some embodiments, each of the temperature measuring electrical devices (227) is placed within each recessed area (233) formed within the ceramic layer (205). In some embodiments, each of the temperature measuring electrical devices (227) may be attached to the bottom surface of the ceramic layer (205). Each of the temperature measuring arrays (501A, 501B, 501C, 501D, 503A, 503B, 503C, 503D) includes each set of exposed electrical contacts (239) and each set of a plurality of electrical wires (237). It should be understood that the use of multiple independently operable temperature measurement arrays provides redundancy in the event that one or more temperature measurement arrays become inoperable.

[0046] FIG. 6 illustrates another arrangement of a plurality of temperature measuring arrays (601A, 601B, 601C, 601D, 601E, 601F, 601G, 601H, 601I, 601J) according to various embodiments of the present invention. An alternative AA view of FIG. 6 was referenced in FIG. 2a. In the example of FIG. 6, the substrate holder (102) includes a rectangular array of temperature measuring electrical devices (227). The temperature measuring electric devices (227) of a rectangular array are shown as multiple temperature measuring arrays (601A, 601B, 601C, 601D, 601E, 601F, 601G, 601H, 601I, 601J) so that the temperature measuring electric devices (227) of a predetermined one of the multiple temperature measuring arrays are interconnected to share a single set of exposed electric contacts (239) and a corresponding set of multiple electric wires (237). In some embodiments, each of the temperature measuring electric devices (227) is placed within a respective recessed area (233) formed within the ceramic layer (205). In some embodiments, each of the temperature measuring electric devices (227) may be attached to the bottom surface of the ceramic layer (205). It should be understood that different temperature measurement arrays among the plurality of temperature measurement arrays (601A, 601B, 601C, 601D, 601E, 601F, 601G, 601H, 601I, 601J) include different numbers of temperature measurement electrical devices (227). It should also be understood that the illustrated locations of the sets of exposed electrical contacts (239) are provided as examples and may be located at different locations in various embodiments.

[0047] FIG. 7 illustrates a quadrant arrangement of a plurality of temperature measuring arrays (701A, 701B, 701C, 701D) according to various embodiments of the present invention. An alternative AA view of FIG. 7 was referenced in FIG. 2a. In the example of FIG. 7, the substrate holder (102) includes a rectangular array of temperature measuring electrical devices (227). The rectangular array of temperature measuring electrical devices (227) is illustrated as a quadrant arrangement of a plurality of temperature measuring arrays (701A, 701B, 701C, 701D) such that the temperature measuring electrical devices (227) of a predetermined quadrant, that is, a predetermined one of the plurality of temperature measuring arrays, are interconnected to share a single set of exposed electrical contacts (239) and a corresponding set of a plurality of electrical wires (237). In some embodiments, each of the temperature measuring electric devices (227) is disposed within each recessed area (233) formed within the ceramic layer (205). In some embodiments, each of the temperature measuring electric devices (227) may be attached to the bottom surface of the ceramic layer (205). It should be understood that in different embodiments, different temperature measuring arrays among the plurality of temperature measuring arrays (701A, 701B, 701C, 701D) may include different numbers of temperature measuring electric devices (227). Also, it should be understood that the illustrated locations of the sets of exposed electric contacts (239) are provided as examples and may be located at different locations in various embodiments.

[0048] As shown in FIGS. 3a, 4, and 5, the small size of the temperature measuring electrical devices (227) and the ability to add electrically conductive traces within the ceramic layer (205) if necessary allow for a redundant distribution of temperature measuring electrical devices (227) within a predetermined temperature measuring zone, thereby allowing for the failure of one or more temperature measuring electrical devices (227) within the predetermined temperature measuring zone. Additionally, the flexibility of the method by which the temperature measuring electrical devices (227) can be spatially distributed in the ceramic layer (205) provides improved accuracy in measuring the azimuth of the temperatures of the ceramic layer (205) around the centerline (247) of the ceramic layer (205). Furthermore, in some embodiments, the number of temperature measuring electrical devices (227) may be greater than the predetermined number of temperature measuring zones, thereby providing a higher density temperature measuring system.

[0049] Based on the foregoing description, in an exemplary embodiment, the system is disclosed to include a substrate holder (102), a plurality of temperature measuring electrical devices (227), a plurality of electrical wires (237), and a control circuit implemented on a circuit board (241). The substrate holder (102) includes a base plate (201) and a ceramic layer (205) attached to the top surface of the base plate (201) using a bond layer (203) disposed between the base plate (201) and the ceramic layer (205). The top surface of the ceramic layer includes an area configured to support the substrate (101). A plurality of temperature measuring electrical devices (227) are attached to the ceramic layer (205). Each of the plurality of temperature measuring electrical devices (227) is configured to measure a corresponding local temperature of the ceramic layer (205). Each of the plurality of temperature measuring electrical devices (227) has a corresponding plurality of electrical contacts.

[0050] The ceramic layer (205) includes a plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) embedded within the ceramic layer (205). A portion of the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) is routed between the electrical contacts of a plurality of temperature measuring electrical devices (227). A portion of the plurality of electrically conductive traces (229A, 229B, 231A, 231B, etc.) is routed from one or more of the electrical contacts of the plurality of temperature measuring electrical devices (227) to corresponding exposed electrical contacts among a plurality of exposed electrical contacts (239). A plurality of electrical wires (237) are connected to corresponding exposed electrical contacts among the plurality of exposed electrical contacts (239). The control circuit includes a plurality of electrical nodes that are electrically in contact with a plurality of electrical wires (237). The control circuit is configured to control the operation of a plurality of temperature measuring electrical devices (227) and to receive temperature measuring data from the plurality of temperature measuring electrical devices (227).

[0051] By having temperature measuring electrical devices (227) and corresponding electrically conductive traces of the temperature measuring electrical devices (227) embedded within the ceramic layer (205), it is possible to pre-calibrate the temperature measuring performance of the substrate holder (102) before the substrate holder (102) is installed in the process module (100), and even before the substrate holder (102) is shipped to the semiconductor manufacturing facility. Pre-calibrating the temperature measuring performance of the substrate holder (102) provides significant cost savings and provides more consistent calibration between different substrate holders (102).

[0052] FIG. 8 illustrates a flowchart of a method for fabricating a substrate holder according to various embodiments of the present invention. The method includes an operation 801 for forming a ceramic layer (205). The ceramic layer (205) is formed to have a top surface including a region configured to support a substrate (101). The ceramic layer (205) is also formed to include a plurality of temperature measuring electrical devices (227). In some embodiments, each of the plurality of temperature measuring electrical devices is a corresponding integrated circuit chip. In some embodiments, forming the ceramic layer (205) in operation 801 includes forming a plurality of recessed regions (233) distributed across the bottom surface of the ceramic layer (205). Each of the plurality of temperature measuring electric devices (227) is configured to accommodate a corresponding temperature measuring electric device among the plurality of temperature measuring electric devices (227) when each of the plurality of temperature measuring electric devices (227) is placed within a recessed area (233) of the ceramic layer (205), such that each of the plurality of temperature measuring electric devices (227) is positioned between the top surface of the ceramic layer (205) and the bottom surface of the ceramic layer (205).

[0053] The ceramic layer (205) is also formed to include embedded electrically conductive traces (229A, 229B, 231A, 231B, etc.) routed to electrically connect a plurality of temperature measuring electrical devices (227) to a plurality of exposed electrical contacts (239) on the bottom surface of the ceramic layer (205). In some embodiments, the embedded electrically conductive traces (229A, 229B, 231A, 231B, etc.) are routed through a plurality of levels of the ceramic layer (205) using electrically conductive via structures (235) formed to extend vertically within the ceramic layer (205). In some embodiments, forming the ceramic layer (205) in operation 801 includes co-firing the ceramic layer (205) and the embedded electrically conductive traces (229A, 229B, 231A, 231B, etc.) so that the embedded electrically conductive traces (229A, 229B, 231A, 231B, etc.) have a temperature response substantially the same as the temperature response of the ceramic layer (205).

[0054] The method also includes an operation 803 for connecting a plurality of electrical wires (237) to a plurality of exposed electrical contacts (239), respectively. The method also includes an operation 805 for fixing a ceramic layer (205) to a base plate (201) using a bond layer (203) so that a plurality of electrical wires (237) are routed through the bond layer (203) and through the base plate (201). The method also includes an operation 807 for connecting a plurality of electrical wires (237) to a control circuit. In some embodiments, the method includes implementing a control circuit on a circuit board (241) and placing the circuit board (241) under the base plate (201) within an installation module (206).

[0055] FIG. 9 illustrates a flowchart of a method for measuring the temperature of a substrate holder according to various embodiments of the present invention. The method includes an operation 901 for supplying power to a plurality of temperature measuring electrical devices (227) within a ceramic layer (205) through a first number of electrically conductive traces (231A) embedded within the ceramic layer (205) of the substrate holder (102). The method also includes an operation 903 for connecting the plurality of temperature measuring electrical devices (227) within the ceramic layer (205) to a reference ground potential through a second number of electrically conductive traces (229A) embedded within the ceramic layer (205). The method also includes an operation 905 for supplying control signals to a plurality of temperature measuring electrical devices (227) within the ceramic layer (205) through a third number of electrically conductive traces (231B) embedded in the ceramic layer (205) of the substrate holder (102) to instruct the plurality of temperature measuring electrical devices (227) to measure corresponding local temperatures of the ceramic layer (205). The method also includes an operation 907 for receiving temperature measurement data signals from the plurality of temperature measuring electrical devices (227) within the ceramic layer (205) through a fourth number of electrically conductive traces (229B) embedded in the ceramic layer (205) of the substrate holder (102). In some embodiments, each of the plurality of temperature measuring electrical devices (227) is a corresponding integrated circuit chip.

[0056] Based on the foregoing, it should be understood that a plurality of temperature measuring electric devices (227) are permanently mounted within the ceramic layer (205) of the substrate holder (102) so that the temperature measuring electric devices (227) are not damaged during handling. Additionally, since the plurality of temperature measuring electric devices (227) are mounted in very good thermal contact with the ceramic layer (205), for example by soldering, the temperature measuring electric devices (227) will provide accurate temperature measurements regardless of the temperature of the cooler base plate (201). Furthermore, the formation of the temperature measuring electric devices (227) and corresponding electrically conductive traces of the temperature measuring electric devices (227) within the ceramic layer (205) should provide a low-cost means to improve the reliability and accuracy of the temperature measurement of the ceramic layer (205). Additionally, since the temperature measuring electric devices (227) can be calibrated using a ceramic layer outside the process module (100), the accuracy of the substrate (101) temperature measurement and the repeatability of the temperature measurement per substrate should be improved.

[0057] Although the foregoing invention has been described in some detail for the sake of clarity of understanding, it will be apparent that specific changes and modifications may be made within the scope of the appended claims. Accordingly, the embodiments are to be considered as illustrative rather than restrictive, and the invention is not limited to the details given herein, but may be modified within the scope and equivalents of the described embodiments.

Claims

Claim 1 A substrate holder comprising: a ceramic layer having an upper surface and a lower surface, wherein the upper surface includes a region configured to support a substrate and the lower surface includes a plurality of recessed regions; and a plurality of temperature measuring electrical devices disposed within the plurality of recessed regions of the lower surface of the ceramic layer, wherein each of the plurality of temperature measuring electrical devices is configured to measure a corresponding local temperature of the ceramic layer. Claim 2 A substrate holder according to claim 1, wherein the lower surface of the ceramic layer has a substantially circular outer perimeter. Claim 3 A substrate holder according to claim 1, wherein a set of multiple devices among the multiple temperature measuring electrical devices is positioned along a first line extending across the lower surface of the ceramic layer. Claim 4 A substrate holder according to claim 3, wherein the first line extends through the center point of the lower surface of the ceramic layer, and each of the set of the plurality of temperature measuring electric devices is located in each of the radial zones among the plurality of radial zones on the lower surface of the ceramic layer. Claim 5 In claim 4, the set of the plurality of temperature measuring electrical devices is substantially spaced equally apart from each other across the lower surface of the ceramic layer, in a substrate holder. Claim 6 In claim 4, a substrate holder wherein each radial zone on the lower surface of the ceramic layer comprises a different pair of temperature measuring electric devices of a set of the plurality of temperature measuring electric devices. Claim 7 In claim 6, the different pairs of temperature measuring electrical devices are positioned on opposite sides of the center point of the bottom surface of the ceramic layer, in a substrate holder. Claim 8 In claim 7, the plurality of radial zones on the lower surface of the ceramic layer are four radial zones, a substrate holder. Claim 9 A substrate holder according to claim 1, wherein a first set of the plurality of temperature measuring electrical devices is positioned along a first line extending across the lower surface of the ceramic layer, and a second set of the plurality of temperature measuring electrical devices is positioned along a second line extending across the lower surface of the ceramic layer. Claim 10 A substrate holder according to claim 9, wherein each of the first line and the second line extends through the center point of the bottom surface of the ceramic layer, the second line is perpendicular to the first line, and each of the first set and the second set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each of the radial zones among the plurality of radial zones on the bottom surface of the ceramic layer. Claim 11 A substrate holder according to claim 10, wherein the first set of the plurality of temperature measuring electrical devices is substantially equally spaced from each other across the lower surface of the ceramic layer, and the second set of the plurality of temperature measuring electrical devices is substantially equally spaced from each other across the lower surface of the ceramic layer. Claim 12 A substrate holder according to claim 10, wherein each radial zone on the lower surface of the ceramic layer comprises a different pair of the first set of the temperature measuring electric devices among the plurality of temperature measuring electric devices, and each radial zone on the lower surface of the ceramic layer comprises a different pair of the second set of the temperature measuring electric devices among the plurality of temperature measuring electric devices. Claim 13 A substrate holder according to claim 12, wherein the different pairs of the first set of the plurality of temperature measuring electric devices among the plurality of temperature measuring electric devices are located on the opposing sides of the center point of the bottom surface of the ceramic layer, and the different pairs of the second set of the temperature measuring electric devices among the plurality of temperature measuring electric devices are located on the opposing sides of the center point of the bottom surface of the ceramic layer. Claim 14 In claim 13, the plurality of radial zones on the lower surface of the ceramic layer are four radial zones, a substrate holder. Claim 15 A substrate holder according to claim 1, wherein a first set of the plurality of temperature measuring electric devices is positioned along a first line extending across the bottom surface of the ceramic layer and through the center point of the bottom surface of the ceramic layer, a second set of the plurality of temperature measuring electric devices is positioned along a second line extending across the bottom surface of the ceramic layer and through the center point of the bottom surface of the ceramic layer, the second line is offset by 120° from the first line with respect to the center point of the bottom surface of the ceramic layer, and a third set of the plurality of temperature measuring electric devices is positioned along a third line extending across the bottom surface of the ceramic layer and through the center point of the bottom surface of the ceramic layer, the third line is offset by 120° from the second line with respect to the center point of the bottom surface of the ceramic layer. Claim 16 A substrate holder according to claim 15, wherein each of the first set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each of the plurality of radial zones on the lower surface of the ceramic layer, each of the second set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each of the plurality of radial zones on the lower surface of the ceramic layer, and each of the third set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each of the plurality of radial zones on the lower surface of the ceramic layer. Claim 17 A substrate holder according to claim 16, wherein the first set of the plurality of temperature measuring electrical devices is substantially equally spaced from each other across the lower surface of the ceramic layer, the second set of the plurality of temperature measuring electrical devices is substantially equally spaced from each other across the lower surface of the ceramic layer, and the third set of the plurality of temperature measuring electrical devices is substantially equally spaced from each other across the lower surface of the ceramic layer. Claim 18 In claim 17, the plurality of radial zones on the lower surface of the ceramic layer are four radial zones, a substrate holder. Claim 19 In claim 1, a first set of the plurality of temperature measuring electric devices is positioned along a first line extending radially outward from the center point of the bottom surface of the ceramic layer across the bottom surface of the ceramic layer, a second set of the plurality of temperature measuring electric devices is positioned along a second line extending radially outward from the center point of the bottom surface of the ceramic layer across the bottom surface of the ceramic layer, the second line is offset by 45° from the first line with respect to the center point of the bottom surface of the ceramic layer, a third set of the plurality of temperature measuring electric devices is positioned along a third line extending radially outward from the center point of the bottom surface of the ceramic layer across the bottom surface of the ceramic layer, the third line is offset by 45° from the second line with respect to the center point of the bottom surface of the ceramic layer, and a fourth set of the plurality of temperature measuring electric devices A set is positioned along a fourth line extending radially outwardly across the bottom surface of the ceramic layer from the center point of the bottom surface of the ceramic layer, the fourth line is offset by 45° from the third line with respect to the center point of the bottom surface of the ceramic layer, and a fifth set of a plurality of devices among the plurality of temperature measuring electrical devices is positioned along a fifth line extending radially outwardly across the bottom surface of the ceramic layer from the center point of the bottom surface of the ceramic layer, the fifth line is offset by 45° from the fourth line with respect to the center point of the bottom surface of the ceramic layer, andA sixth set of the plurality of temperature measuring electrical devices is positioned along a sixth line extending radially outwardly across the bottom surface of the ceramic layer from the center point of the bottom surface of the ceramic layer, and the sixth line is offset by 45° from the fifth line with respect to the center point of the bottom surface of the ceramic layer, and a seventh set of the plurality of temperature measuring electrical devices is positioned along a seventh line extending radially outwardly across the bottom surface of the ceramic layer from the center point of the bottom surface of the ceramic layer, and the seventh line is offset by 45° from the sixth line with respect to the center point of the bottom surface of the ceramic layer, and an eighth set of the plurality of temperature measuring electrical devices is positioned along an eighth line extending radially outwardly across the bottom surface of the ceramic layer from the center point of the bottom surface of the ceramic layer, and the eighth line is offset by the seventh Substrate holder offset by 45° from the line. Claim 20 In claim 19, each of the first set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each radial zone among the plurality of radial zones on the lower surface of the ceramic layer, each of the second set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each radial zone among the plurality of radial zones on the lower surface of the ceramic layer, each of the third set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each radial zone among the plurality of radial zones on the lower surface of the ceramic layer, each of the fourth set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each radial zone among the plurality of radial zones on the lower surface of the ceramic layer, each of the fifth set of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each radial zone among the plurality of radial zones on the lower surface of the ceramic layer, and the A substrate holder, wherein each of the 6 sets of temperature measuring electric devices is located in each of the radial zones among the plurality of radial zones on the lower surface of the ceramic layer, each of the 7 sets of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each of the radial zones among the plurality of radial zones on the lower surface of the ceramic layer, and each of the 8 sets of temperature measuring electric devices among the plurality of temperature measuring electric devices is located in each of the radial zones among the plurality of radial zones on the lower surface of the ceramic layer. Claim 21 In claim 20, the first set of the plurality of temperature measuring electric devices is substantially equally spaced from each other across the bottom surface of the ceramic layer, the second set of the plurality of temperature measuring electric devices is substantially equally spaced from each other across the bottom surface of the ceramic layer, the third set of the plurality of temperature measuring electric devices is substantially equally spaced from each other across the bottom surface of the ceramic layer, the fourth set of the plurality of temperature measuring electric devices is substantially equally spaced from each other across the bottom surface of the ceramic layer, the fifth set of the plurality of temperature measuring electric devices is substantially equally spaced from each other across the bottom surface of the ceramic layer, the sixth set of the plurality of temperature measuring electric devices is substantially equally spaced from each other across the bottom surface of the ceramic layer, the seventh set of the plurality of temperature measuring electric devices is substantially equally spaced from each other across the bottom surface of the ceramic layer, and The eighth set of the plurality of temperature measuring electrical devices among the plurality of devices is a substrate holder that is substantially equally spaced from each other across the lower surface of the ceramic layer. Claim 22 In claim 21, the plurality of radial zones on the lower surface of the ceramic layer are four radial zones, a substrate holder. Claim 23 A substrate holder according to claim 1, wherein a first set of the plurality of temperature measuring electric devices is positioned according to a first rectangular array within a first quadrant of the bottom surface of the ceramic layer, a second set of the plurality of temperature measuring electric devices is positioned according to a second rectangular array within a second quadrant of the bottom surface of the ceramic layer, a third set of the plurality of temperature measuring electric devices is positioned according to a third rectangular array within a third quadrant of the bottom surface of the ceramic layer, and a fourth set of the plurality of temperature measuring electric devices is positioned according to a fourth rectangular array within a fourth quadrant of the bottom surface of the ceramic layer. Claim 24 A substrate holder according to claim 23, wherein the first set of the plurality of temperature measuring electric devices is 22 temperature measuring electric devices, the second set of the plurality of temperature measuring electric devices is 22 temperature measuring electric devices, the third set of the plurality of temperature measuring electric devices is 22 temperature measuring electric devices, and the fourth set of the plurality of temperature measuring electric devices is 22 temperature measuring electric devices.

Images