Resin composition for insulating film formation, insulating film, image display device, and method for manufacturing the insulating film

Abstract

The present invention relates to a resin composition for forming an insulating film, comprising (A) a binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a light absorber, and (E) a solvent, wherein the (B) photopolymerizable compound comprises a fluorene-based compound and the (D) light absorber comprises an azole-based compound, an insulating film manufactured using the same, an image display device, and a method for manufacturing an insulating film.

Description

Technology Field

[0001] The present invention relates to a resin composition for forming an insulating film, an insulating film manufactured using the same, an image display device, and a method for manufacturing an insulating film. Background Technology

[0003] Photosensitive resins are essential materials for displays such as color filters, liquid crystal display materials, and organic light-emitting diodes, and there may be various types of photosensitive resin compositions depending on the purpose of use, such as red pixels (R), green pixels (G), blue pixels (B), black matrix (BM), and column spacers (CS) used in color filters.

[0004] Furthermore, photosensitive resin compositions can also be used to form insulating films for the purpose of protecting and insulating numerous wirings and circuits included in various recently developed semiconductor devices or displays. Particularly regarding recent display devices, as resolution increases, there is a growing demand for smaller pattern sizes while simultaneously improving reliability. Additionally, as the need to protect display devices from external oxygen and moisture penetration increases, the use of such photosensitive resin compositions is becoming more active.

[0005] Various materials that can be used for such insulating films may be used, such as polyethylene, polyvinyl chloride, natural rubber, polyester, epoxy resin, melamine resin, phenolic resin, and synthetic resins such as polyurethane.

[0006] Meanwhile, as the utility of photosensitive resin compositions increases in various fields, recently they may be designed not only for the purpose of electrical insulation of wiring, but also for the purpose of internal flattening of devices such as displays, or to affect the flow of current.

[0007] Specifically, there is a need to develop a photosensitive resin composition that has excellent chemical resistance and allows for control of the line width and hole size of the insulating film, and in particular, an effect that improves metal corrosion in the part in contact with the insulating film is required.

[0008] In particular, when a metal film such as copper is located beneath an insulating film for the purpose of current conduction to drive a device, corrosion of the copper may be induced by moisture penetration due to the characteristics of the organic film. Therefore, properties are required to prevent or mitigate corrosion of metal films such as copper located adjacent to the insulating film.

[0009] Registered Patent No. 10-0732641 also discloses a resin composition that exhibits excellent light resistance and does not yellow even after long-term use by combining a cyanoacrylate UV absorber and a benzotriazole UV absorber and mixing them with a resin composition. However, there are limitations in terms of chemical resistance, control of line width and hole size of formed films or patterns, and corrosion protection effects on adjacent films. Accordingly, with regard to display devices, the need for resin compositions with more diverse utility has recently emerged due to the miniaturization of patterns and thinning of displays. Prior art literature

[0011] Republic of Korea Registered Patent No. 10-0732641 The problem to be solved

[0012] The purpose of the present invention is to provide a resin composition for forming an insulating film with improved pattern characteristics, hole characteristics, and taper characteristics.

[0013] In addition, the present invention aims to provide a resin composition for forming an insulating film with improved chemical resistance.

[0014] In addition, the present invention aims to provide a resin composition for forming an insulating film with improved corrosion resistance against a lower metal, etc.

[0015] In addition, the present invention aims to provide a resin composition for forming an insulating film with improved processability at low temperatures.

[0016] In addition, the present invention aims to provide an insulating film manufactured using the resin composition for forming an insulating film and an image display device including the same.

[0017] In addition, the present invention aims to provide a method for manufacturing an insulating film using the resin composition for forming the insulating film. means of solving the problem

[0019] The present invention relates to a resin composition for forming an insulating film, comprising (A) a binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a light absorber, and (E) a solvent, wherein the (B) photopolymerizable compound comprises a fluorene-based compound and the (D) light absorber comprises an azole-based compound.

[0020] In the first aspect thereof, the present invention may include (A) a binder resin comprising a tetrahydropyran (THP)-based ring.

[0021] In a second aspect, the present invention may be polymerized by including at least one of an acyclic compound and a cyclic compound capable of forming a tetrahydropyran (THP) ring during polymerization.

[0022] In a third aspect, the present invention may include, the acyclic compound, a compound represented by the following chemical formula 1.

[0023] [Chemical Formula 1]

[0024]

[0025] (In the above Chemical Formula 1, R1 and R2 are each independently an aliphatic hydrocarbon group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 18 carbon atoms, which may or may not contain heteroatoms.)

[0026] In a fourth aspect thereof, the present invention may comprise one or more compounds selected from the group consisting of tetrahydropyran-2-yl(meth)acrylate, (tetrahydropyran-2-yl)methyl(meth)acrylate, 2,6-dimethyl-8-(tetrahydropyran-2-yloxy)-1-octen-3-one, 1-(tetrahydropyran-2-yloxy)-3-buten-2-one, 4-(1,4-dioxa-5-oxo-6-heptenyl)-6-methyl-2-pyrone, and 4-(1,5-dioxa-6-oxo-7-octenyl)-6-methyl-2-pyrone.

[0027] In the fifth aspect of the present invention, the (A) binder resin may comprise an epoxy-based binder resin.

[0028] In the sixth aspect thereof, the present invention may include an epoxy-based binder resin comprising a compound represented by the following chemical formula 2.

[0029] [Chemical Formula 2]

[0030]

[0031] (In the above chemical formula 2, R3 and R4 are each independently hydrogen or CH3, and

[0032] a and b are each independently integers from 3 to 20.

[0033] In the seventh aspect thereof, the present invention may include a fluorene-based compound represented by the following chemical formula 3.

[0034] [Chemical Formula 3]

[0035]

[0036] (In the above chemical formula 3, X1 and X 2 Each independently consists of a hydroxyl group, -(OAO) p Represents an H group (A represents an alkylene group having 2 to 3 carbon atoms, and p represents an integer from 1 to 10), and R 5 to R 8 Each represents a hydrocarbon group having 1 to 20 carbon atoms that can be independently substituted, an alkoxy group having 1 to 20 carbon atoms that can be substituted, or a halogen atom; m1 and m2 are each independently integers from 0 to 3, and n1 to n4 are each independently integers from 0 to 4. However, m1+n1 and m2+n2 are each independently integers from 0 to 5.)

[0037] In the eighth aspect of the present invention, the content of the fluorene-based compound may be 3 to 35 weight percent based on the total weight of the solids in the resin composition for forming an insulating film.

[0038] In the ninth aspect of the present invention, the azole compound may comprise one or more selected from the group consisting of benzotriazole (BTA) and pyrazole.

[0039] In its 10th aspect, the present invention may comprise, based on the total weight of the solids in the resin composition for forming an insulating film, (A) 10 to 50 weight% of a binder resin; (B) 5 to 70 weight% of a photopolymerizable compound; (C) 3 to 20 weight% of a photopolymerization initiator; (D) 1 to 10 weight% of a light absorber; and based on the total weight of the resin composition for forming an insulating film, (E) 60 to 90 weight% of a solvent.

[0040] In the eleventh aspect thereof, the resin composition for forming an insulating film may prevent copper corrosion.

[0041] In the 12th aspect of the present invention, the firing temperature of the resin composition for forming an insulating film may be 80 to 150°C.

[0042] In the 13th aspect of the present invention, the firing temperature may be a post-firing temperature.

[0043] In addition, the present invention relates to an insulating film formed by the resin composition for forming an insulating film.

[0044] In addition, the present invention relates to an image display device comprising the insulating film.

[0045] In addition, the present invention relates to a method for manufacturing an insulating film, comprising the step of forming an insulating film by a low-temperature firing process of 80 to 150°C using the above-mentioned resin composition for forming an insulating film. Effects of the invention

[0047] According to the resin composition for forming an insulating film of the present invention, pattern characteristics, hole characteristics, and taper characteristics can be further improved compared to conventional resin compositions for forming an insulating film.

[0048] In addition, the resin composition for forming an insulating film according to the present invention can further improve chemical resistance compared to conventional resin compositions for forming an insulating film.

[0049] In addition, according to the resin composition for forming an insulating film of the present invention, corrosion resistance to the underlying metal, etc. can be further improved compared to conventional resin compositions for forming an insulating film.

[0050] In addition, according to the resin composition for forming an insulating film of the present invention, processability at low temperatures can be further improved compared to conventional resin compositions for forming an insulating film. Specific details for implementing the invention

[0052] The present invention provides a resin composition for forming an insulating film characterized by comprising a photopolymerizable compound including a fluorene-based compound and a light absorber including an azole-based compound, an insulating film manufactured using the same, an image display device, and a method for manufacturing an insulating film.

[0053] The resin composition for forming an insulating film according to the present invention can improve heat resistance, chemical resistance, and transmittance by including a photopolymerizable compound including a fluorene-based compound, and can prevent corrosion of the underlying metal (e.g., copper (Cu), etc.). In addition, by including a light absorber including an azole-based compound, the degree of photocuring can be controlled, thereby improving fine pattern and hole characteristics.

[0055] More specifically, the present invention provides a resin composition for forming an insulating film, comprising (A) a binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a light absorber, and (E) a solvent, wherein the (B) photopolymerizable compound comprises a fluorene-based compound and the (D) light absorber comprises an azole-based compound, an insulating film manufactured using the same, an image display device, and a method for manufacturing an insulating film.

[0057] The term "solid content" as used in the present invention refers to the remaining components excluding the solvent.

[0059] <Resin composition for forming an insulating film>

[0060] The resin composition for forming an insulating film according to the present invention is not particularly limited as long as it is a resin composition comprising a photopolymerizable compound including a fluorene-based compound and a light absorber including an azole-based compound.

[0062] In order to improve storage stability by minimizing reactions with other functional groups, it is preferable that the resin composition for forming an insulating film of the present invention does not include amine compounds or diamine compounds.

[0063] In addition, the resin composition for forming an insulating film according to the present invention has the function of preventing corrosion of a metal adjacent to the insulating film produced by the resin composition for forming an insulating film, and preferably may be intended to prevent corrosion of adjacent copper (Cu).

[0064] In addition, the resin composition for forming an insulating film according to the present invention may have a firing temperature of 80 to 150°C, and preferably, a subsequent firing temperature of 80 to 150°C.

[0066] (A) Binder resin

[0067] The binder resin included in the resin composition for forming an insulating film of the present invention is not particularly limited as long as it is intended to impart pattern-forming properties by imparting alkali solubility to the insulating film formed using the resin composition for forming an insulating film.

[0069] In one embodiment, the binder resin may include a tetrahydropyran (THP)-based ring. In this case, there is an advantage in that the transparency, heat resistance, and pattern characteristics of the coating film can be improved.

[0070] The above tetrahydropyran (THP) ring may be polymerized by including at least one of an acyclic compound and a cyclic compound capable of forming a tetrahydropyran (THP) ring during polymerization.

[0071] The above-mentioned acyclic compound may have unsaturated bonds forming a tetrahydropyran (THP)-based ring in the main chain. For example, it may include a compound represented by the following chemical formula 1, which is preferable in that it can maximize the ring formation efficiency in the copolymer during polymerization, but is not necessarily limited thereto.

[0072] [Chemical Formula 1]

[0073]

[0074] In the above chemical formula 1, R1 and R2 are each independently an aliphatic hydrocarbon group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 18 carbon atoms, which may or may not contain heteroatoms.

[0075] Specific examples of the above R1 and R2 include methyl groups, ethyl groups, n-propyl groups, isopropyl groups, n-butyl groups, t-butyl groups, t-amyl groups, stearyl groups, lauryl groups, cyclohexyl groups, ethylhexyl groups, methoxyethyl groups, ethoxyethyl groups, benzyl groups, etc., among which methyl groups, ethyl groups, cyclohexyl groups, and benzyl groups are preferred.

[0076] The above heteroatoms may be oxygen (O), sulfur (S), nitrogen (N), etc., but are not necessarily limited to these.

[0077] When polymerization is performed by including the compound of Chemical Formula 1 as a monomer, two types of repeating units forming a tetrahydropyran (THP) ring may be formed within the polymer as follows, and there are no special restrictions on the ratio of each repeating unit, and either of the two repeating units may be the main repeating unit within the binder resin.

[0078]

[0079] The above-mentioned cyclic compound may include a pyran-based ring and / or a tetrahydropyran (THP)-based ring within one molecule and may have polymerizable unsaturated bonds. For example, compounds containing a pyran-based ring may be 4-(1,4-dioxa-5-oxo-6-heptenyl)-6-methyl-2-pyrone and 4-(1,5-dioxa-6-oxo-7-octenyl)-6-methyl-2-pyrone, etc., and compounds containing a tetrahydropyran (THP)-based ring may be tetrahydropyran-2-yl(meth)acrylate, (tetrahydropyran-2-yl)methyl(meth)acrylate, 2,6-dimethyl-8-(tetrahydropyran-2-yloxy)-1-octen-3-one and 1-(tetrahydropyran-2-yloxy)-3-buten-2-one, etc.

[0081] The binder resin may comprise a compound having unsaturated bonds copolymerizable with the acyclic compound and the cyclic compound. The compound having unsaturated bonds copolymerizable is not particularly limited and may include, for example, unsaturated carboxyl group-containing monomers and other unsaturated monomers.

[0082] Examples of the above unsaturated carboxyl group-containing monomers include unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated polycarboxylic acids, and unsaturated polycarboxylic acids, which have one or more carboxyl groups in the molecule.

[0083] Examples of the above unsaturated monocarboxylic acids include acrylic acid, methacrylic acid, crotonic acid, α-chloroacrylic acid, cinnamic acid, etc.

[0084] Examples of the above unsaturated dicarboxylic acids include maleic acid, fumaric acid, itaconic acid, citraconic acid, mesaconic acid, etc.

[0085] The above unsaturated polycarboxylic acid may be an acid anhydride, specifically maleic anhydride, itaconic anhydride, citraconic anhydride, etc. In addition, the above unsaturated polycarboxylic acid may be its mono(2-methacryloyloxyalkyl) ester, for example, succinic acid mono(2-acryloyloxyethyl), succinic acid mono(2-methacryloyloxyethyl), phthalic acid mono(2-acryloyloxyethyl), phthalic acid mono(2-methacryloyloxyethyl), etc. The above unsaturated polycarboxylic acid may be a mono(meth)acrylate of a dicarboxylic polymer at both ends, for example, ω-carboxypolycaprolactone monoacrylate, ω-carboxypolycaprolactone monomethacrylate, etc.

[0086] The above unsaturated carboxyl group-containing monomers can each be used individually or in a mixture of two or more types.

[0087] As other unsaturated monomers mentioned above, for example, aromatic vinyl compounds such as styrene, α-methylstyrene, o-vinyltoluene, m-vinyltoluene, p-vinyltoluene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzylmethyl ether, m-vinylbenzylmethyl ether, p-vinylbenzylmethyl ether, o-vinylbenzylglycidyl ether, m-vinylbenzylglycidyl ether, p-vinylbenzylglycidyl ether, indene;Methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, i-propyl acrylate, i-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, i-butyl acrylate, i-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, t-butyl acrylate, t-butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, 2-hydroxybutyl acrylate, 2-Hydroxybutyl methacrylate, 3-Hydroxybutyl acrylate, 3-Hydroxybutyl methacrylate, 4-Hydroxybutyl acrylate, 4-Hydroxybutyl methacrylate, Allyl acrylate, Allyl methacrylate, Benzyl acrylate, Benzyl methacrylate, Cyclohexyl acrylate, Cyclohexyl methacrylate, Phenyl acrylate, Phenyl methacrylate, 2-Methoxyethyl acrylate, 2-Methoxyethyl methacrylate, 2-Phenoxyethyl acrylate, 2-Phenoxyethyl methacrylate, Methoxydiethylene glycol acrylate, Methoxydiethylene glycol methacrylate, Methoxytriethylene glycol acrylate, Methoxytriethylene glycol methacrylate, Methoxypropylene glycol acrylate, Unsaturated carboxylic acid esters such as methoxypropylene glycol methacrylate, methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, isobornyl acrylate, isobornyl methacrylate, dicyclopentadienyl acrylate, dicyclopentadienyl methacrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-phenoxypropyl methacrylate, glycerol monoacrylate, glycerol monomethacrylate, etc.;Unsaturated aminoalkyl esters of carboxylic acids such as 2-aminoethyl acrylate, 2-aminoethyl methacrylate, 2-dimethylaminoethyl acrylate, 2-dimethylaminoethyl methacrylate, 2-aminopropyl acrylate, 2-aminopropyl methacrylate, 2-dimethylaminopropyl acrylate, 2-dimethylaminopropyl methacrylate, 3-aminopropyl acrylate, 3-aminopropyl methacrylate, 3-dimethylaminopropyl acrylate, 3-dimethylaminopropyl methacrylate; unsaturated carboxylic acid glycidyl esters of glycidyl acrylate, glycidyl methacrylate, etc.; vinyl carboxylic acid esters of vinyl acetate, vinyl propionate, vinyl butyrate, vinyl benzoate, etc.; Unsaturated ethers such as vinylmethyl ether, vinylethyl ether, and allylglycidyl ether; vinyl cyanide compounds such as acrylonitrile, methacrylonitrile, α-chloroacrylonitrile, and vinylidene cyanide; unsaturated amides such as acrylamide, methacrylamide, α-chloroacrylamide, N-2-hydroxyethylacrylamide, and N-2-hydroxyethylmethacrylamide; unsaturated imides such as maleimide, N-benzylmaleimide, N-phenylmaleimide, and N-cyclohexylmaleimide; aliphatic conjugated dienes such as 1,3-butadiene, isoprene, and chloroprene; Examples include macromonomers having a monoacryloyl group or a monomethacryloyl group at the end of the polymer molecular chain of polystyrene, polymethyl acrylate, polymethyl methacrylate, poly-n-butyl acrylate, poly-n-butyl methacrylate, and polysiloxane. Each of these monomers may be used individually or in a mixture of two or more.

[0089] In one embodiment, the binder resin may include an epoxy-based binder resin. In this case, by lowering the firing temperature of the resin composition for forming an insulating film, preferably the post-firing temperature, to 80 to 150°C, the process can be appropriately performed even on substrates that cannot be processed at high temperatures, and reliability can be improved.

[0090] The above-mentioned epoxy-based binder resin may be selected from various polymers used in the technical field to which the present invention belongs, and may be used as a single type or in combination of two or more types, and the functional groups constituting the binder may be used in combinations suitable for the desired purpose. When two or more types are combined, examples include two or more binder resins composed of different copolymer components, two or more binder resins with different weight-average molecular weights, and two or more binder resins with different degrees of dispersion.

[0091] In one or more embodiments, the epoxy binder resin may comprise one or more selected from the group consisting of bisphenol-type epoxy resin, phenol novolak-type epoxy resin, tert-butyl catechol-type epoxy resin, naphthalene-type epoxy resin, glycidylamine-type epoxy resin, biphenyl-type epoxy resin, phenol aralkyl-type epoxy resin, cresol novolak-type epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, spiro-ring containing epoxy resin, cyclohexanedimethanol-type epoxy resin, and halogenated epoxy resin.

[0092] In one embodiment, the epoxy-based binder resin may comprise a compound represented by the following chemical formula 2, which is preferable in terms of developability and reliability. The compound represented by the following chemical formula 2 may comprise a structure in which a known functional group is added.

[0093] [Chemical Formula 2]

[0094]

[0095] In the above chemical formula 2,

[0096] R3 and R4 are each independently hydrogen or CH3, and preferably hydrogen.

[0097] a and b are each independently integers from 3 to 20, preferably integers from 5 to 15.

[0098] The above epoxy-based binder resin is 3,4-epoxytricyclo[5.2.1.0 2,6 It may be copolymerized with one or more monomers that are decane ring-containing compounds and one or more monomers that are unsaturated carboxylic acids or their acid anhydrides, and may additionally include additional functional groups.

[0099] The above 3,4-epoxytricyclo[5.2.1.0 2,6 ] Decane ring-containing compounds are 3,4-epoxytricyclo[5.2.1.0 2,6 ]Decan-9-ylacrylate, 3,4-epoxytricyclo[5.2.1.0 2,6 ] May be decane-8-ylacrylate, etc., and 3,4-epoxytricyclo[5.2.1.0 2,6 ]Decan-9-ylacrylate and 3,4-epoxytricyclo[5.2.1.0 2,6 It is preferable that it is a mixture of decane-8-yl acrylate, and the above 3,4-epoxytricyclo[5.2.1.0 2,6 ]Decan-9-ylacrylate and 3,4-epoxytricyclo[5.2.1.0 2,6 It is more preferable that decane-8-yl acrylate is mixed in a volume ratio of 50:50.

[0100] The above carboxylic acid or its acid anhydride may be an α,β-unsaturated carboxylic acid such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, etc., and its acid anhydride (maleic anhydride, itaconic anhydride, etc.), and methacrylic acid is preferred.

[0102] Factors that significantly influence the patterning process of the resin composition for forming an insulating film according to the present invention may include the molecular weight and acid value of the binder resin; the molecular weight affects the viscosity of the composition and the surface of the formed pattern, and the acid value may affect the pattern formation during the process.

[0103] The weight-average molecular weight (hereinafter 'molecular weight (Mw)') of the binder resin of the present invention, measured by GPC in polystyrene equivalent, may be 5,000 to 30,000, preferably 7,000 to 28,000, and the molecular weight distribution (Mw / Mn) may be 2.0 to 3.0, preferably 2.1 to 2.5.

[0104] In addition, the acid value of the binder resin of the present invention may be 20 to 100 mgKOH / g, and preferably 30 to 90 mgKOH / g.

[0105] When the molecular weight (Mw) and acid value of the above binder resin satisfy the above range, there are advantages in terms of improved pattern characteristics, hole characteristics, and formability.

[0107] The content of the binder resin may be 10 to 50 weight% with respect to the total weight of the solids in the resin composition for forming an insulating film, and preferably 20 to 45 weight%. When the above range is satisfied, there are advantages in terms of improving the pattern characteristics, hole characteristics, and developability of the composition.

[0109] (B) Photopolymerizable compounds

[0110] The photopolymerizable compound of the present invention is not particularly limited as long as it is a material that polymerizes and hardens upon receiving light irradiation such as ultraviolet rays, but it is preferable to include a fluorene-based compound. In this case, corrosion of the underlying copper (Cu) is prevented, heat resistance and chemical resistance are excellent, and transmittance can be improved.

[0112] In one embodiment, the fluorene-based compound may include a compound represented by the following chemical formula 3.

[0113] [Chemical Formula 3]

[0114]

[0115] In the above chemical formula 3, X 1 and X 2 Each independently consists of a hydroxyl group, -(OAO) p Represents an H group (A represents an alkylene group having 2 to 3 carbon atoms, and p represents an integer from 1 to 10), and R 5 to R 8 Each represents a hydrocarbon group having 1 to 20 carbon atoms that can be independently substituted, an alkoxy group having 1 to 20 carbon atoms that can be substituted, or a halogen atom, and m1 and m2 are each independently integers from 0 to 3, and n1 to n4 are each independently integers from 0 to 4. provided that m1+n1 and m2+n2 are integers from 0 to 5.

[0116] The above X 1 and X 2 The substitution position is not particularly limited and may be Ortho, Meta, or Para with respect to Fluorene, but it is preferred to be Meta or Para.

[0117] The above hydrocarbon group may be a straight-chain or branched-chain alkyl group having 1 to 6 carbon atoms, a straight-chain or branched-chain alkenyl group having 2 to 6 carbon atoms, a cycloalkyl group having 5 to 6 carbon atoms, a cycloalkenyl group having 5 to 6 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryl-straight-chain or branched-chain alkyl group having 1 to 4 carbon atoms, etc.

[0118] The above alkoxy group may be a straight-chain or branched-chain alkoxy group having 1 to 6 carbon atoms.

[0119] The above halogen atoms include fluorine (F), chlorine (Cl), bromine (Br), and iodine (I) atoms.

[0120] When hydrocarbon groups and alkoxy groups have substituents, the substituents may be alkoxy groups such as methoxy groups, aryl groups such as phenyl groups, benzyl groups, and tolyl groups, arylene groups such as phenylene groups and naphthylene groups, (meth)acryloyl groups, (meth)acryloyloxy groups, nitro groups, hydroxyl groups, phenoxy groups, etc., and (meth)acryloyl groups, (meth)acryloyloxy groups, and hydroxyl groups are preferred. In addition, there may be multiple substituents. Examples of hydrocarbon groups having substituents include 2-ethoxyethyl groups, 2-butoxyethyl groups, 2-nitropropyl groups, 2-(meth)acryloyloxyethyl groups, and 2-(meth)acryloyloxypropyl groups, and 2-(meth)acryloyloxyethyl groups and 2-(meth)acryloyloxypropyl groups are preferred. In addition, examples of alkoxy groups having substituents include 4-methoxyphenyl group, 2-methoxy-2-nitroethoxy group, 2-(meth)acryloyloxyethoxy group, 3-(meth)acryloyloxy-2-hydroxypropoxy group, etc.

[0121] The above n1 to n4 may each independently be an integer from 0 to 4, preferably an integer from 0 to 2, and more preferably 0 or 1.

[0122] The above n3 and n4 are preferably integers from 0 to 3, and more preferably may be integers from 0 to 2.

[0123] The above m1 and m2 may each independently be integers from 0 to 3, preferably integers from 0 to 2, more preferably 0 or 1.

[0124] The above m1+n1 and m2+n2 may each be independently integers from 0 to 5.

[0125] The compound represented by the above chemical formula 3 is, for example, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, 9,9-bis[4-(3-acryloyloxy-2-hydroxypropoxy)phenyl]fluorene, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(3-hydroxy-2-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-2,6-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-di-t-butylphenyl)fluorene, 9,9-bis(3,4-dihydroxyphenyl) Fluorene, 9,9-bis(2,4-dihydroxyphenyl)fluorene, 9,9-bis(2,5-dihydroxyphenyl)fluorene, 9,9-bis(3,4-dihydroxy-5-methylphenyl)fluorene, 9,9-bis(3,4-dihydroxy-6-methylphenyl)fluorene, 9,9-bis(2,4-dihydroxy-3,6-dimethylphenyl)fluorene, 9,9-bis(3,4,5-trihydroxyphenyl)fluorene, 9,9-bis(2,4,6-trihydroxyphenyl)fluorene, 9,9-bis(2,4,5-trihydroxyphenyl)fluorene, 9,9-bis(2,3,4-trihydroxyphenyl)fluorene, 9,9-bis(2,3,5-trihydroxyphenyl)fluorene, 9,9-bis(2,3,6-trihydroxyphenyl)fluorene, 9,9-bis(4-hydroxyethoxyphenyl)fluorene, 9,9-bis(4-hydroxyethoxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxyisopropoxy3-methylphenyl)fluorene, 9,9-bis(4-hydroxyethoxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxyisopropoxy2,6-dimethylphenyl)fluorene, 9,9-bis(4-hydroxyethoxy-3-cyclohexylphenyl)fluorene, 9,9-bis(4-hydroxyethoxy-3-phenylphenyl)fluorene, There may be 9,9-bis[3,4-di(2-hydroxyethoxy)phenyl]fluorene, 9,9-bis[3,4,5-tri(2-hydroxyethoxy)phenyl]fluorene, etc.

[0126] The content of the above fluorene-based compound may be 3 to 35 weight% based on the total weight of the solids in the photosensitive resin composition for forming an insulating film. If the content of the above fluorene-based compound is less than 3 weight%, the chemical resistance, taper characteristics, and copper (Cu) corrosion resistance may be poor, and if it exceeds 35 weight%, the pattern characteristics and hole characteristics may be poor.

[0128] In one or more embodiments, the photopolymerizable compound may further include a monofunctional monomer, a difunctional monomer, other polyfunctional monomers, etc., in addition to the compound represented by Formula 3 described above.

[0129] The types of the above monofunctional monomers are not particularly limited, and examples include nonylphenylcarbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexylcarbitol acrylate, 2-hydroxyethyl acrylate, N-vinylpyrrolidone, etc.

[0130] The types of the above-mentioned difunctional monomers are not particularly limited, and examples include 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl)ether of bisphenol A, 3-methylpentanediol di(meth)acrylate, etc.

[0131] The types of the above-mentioned polyfunctional monomers are not particularly limited, and examples include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc.

[0133] The content of the above photopolymerizable compound may be 5 to 70 weight% based on the total weight of the solids in the photosensitive resin composition, and preferably 20 to 60 weight%. When the above range is satisfied, there is an advantage in terms of the strength or smoothness of the pixel portion.

[0135] (C) Photopolymerization initiator

[0136] The photopolymerization initiator is not particularly limited as long as it is a component capable of initiating the polymerization of the aforementioned photopolymerizable compound, etc. upon irradiation with active light, and conventional or subsequently developed photopolymerization initiators may be used.

[0137] In one or more embodiments, the photopolymerization initiator of the present invention may comprise one or more selected from the group consisting of acetophenone-based, benzophenone-based, triazine-based, thioxantone-based, oxime-based, benzoin-based, and non-imidazole-based compounds.

[0138] Examples of the above acetophenone-based compounds include, for instance, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, and 2-hydroxy-2-methyl[4-(1-methylvinyl)phenyl]propan-1-one oligomers.

[0139] Examples of the above benzophenone compounds include benzophenone, 2,2'-hydroxy-4,4'-dimethoxybenzophenone, o-methyl benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, etc.

[0140] The above triazine compounds include, for example, 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)ethenyl]-1,3,5-triazine, Examples include 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethenyl]-1,3,5-triazine.

[0141] Examples of the above thioxantone-based compounds include 2-isopropylthioxantone, 4-isopropylthioxantone, 2,4-diethylthioxantone, 2,4-dichlorothioxantone, 1-chloro-4-propoxythioxantone, etc.

[0142] The above oxime-based compounds include, for example, 1-[4-(phenylthio)phenyl]-heptane-1,2-dione 2-(O-benzoyloxime), 1-[4-(phenylthio)phenyl]-octane-1,2-dione 2-(O-benzoyloxime), 1-[4-(benzoyloxime)phenyl]-octane-1,2-dione 2-(O-benzoyloxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-ethanone 1-(O-acetyloxime), 1-[9-ethyl-6-(3-methylbenzoyl)-9H-carbazole-3-yl]-ethanone 1-(O-acetyloxime), 1-(9-ethyl-6-benzoyloxime-9H-carbazole-3-yl)-ethanone 1-(O-acetyloxime), Ethanone-1-[9-ethyl-6-(2-methyl-4-tetrahydrofuranylbenzoyl)-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanone-1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylbenzoyl)-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanone-1-[9-ethyl-6-(2-methyl-5-tetrahydrofuranylbenzoyl)-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanone-1-[9-ethyl-6-(2-methyl-5-tetrahydropyranylbenzoyl)-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanol-1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-dioxoranyl)benzoyl}-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanol-1-[9-ethyl-6-(2-methyl-4-tetrahydrofuranylmethoxybenzoyl)-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanol-1-[9-ethyl-6-(2-methyl-4-tetrahydrofuranylmethoxybenzoyl)-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanol-1-[9-ethyl-6-(2-methyl-5-tetrahydrofuranylmethoxybenzoyl)-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanol-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(O-acetyloxime), Ethanol-1-[9-ethyl-6-(2-methyl-5-tetrahydrofuranylmethoxybenzoyl)-9.H.-carbazole-3-yl]-1-(O-acetyloxime), Ethanol-1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-dioxoranyl)methoxybenzoyl}-9.H.Examples include carbazole-3-yl]-1-(O-acetyloxime).

[0143] Examples of the above benzoin-based compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, etc.

[0144] The above non-imidazole compounds include, for example, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(4-ethoxycarbonylphenyl)-1,2'-biimidazole, 2,2'-bis(2-bromophenyl)-4,4',5,5'-tetrakis(4-ethoxycarbonylphenyl)-1,2'-biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4,6-trichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, Examples include 2,2'-bis(2-bromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4-dibromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-bis(2,4,6-tribromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, etc.

[0146] The content of the above photopolymerization initiator may be 3 to 20 weight% based on the total weight of the solids in the resin composition for forming an insulating film, and preferably 5 to 15 weight%. When the above range is satisfied, there are advantages in terms of controlling pattern formation and improving the degree of curing.

[0148] In addition, the above photopolymerization initiator may further include a photopolymerization initiation aid to improve the sensitivity of the resin composition for forming an insulating film according to the present invention. By including the photopolymerization initiation aid, the resin composition for forming an insulating film according to the present invention can further increase sensitivity and improve productivity.

[0149] The above photopolymerization initiation aid may preferably be one or more compounds selected from the group consisting of, for example, amine compounds, carboxylic acid compounds, and polyfunctional thiol compounds.

[0150] It is preferable to use aromatic amine compounds as the above amine compounds, and specifically, aliphatic amine compounds such as triethanolamine, methyldiethanolamine, and triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N,N-dimethylparatoluidine, 4,4'-bis(dimethylamino)benzophenone (commonly known as Mihiler ketone), 4,4'-bis(diethylamino)benzophenone, etc. may be used.

[0151] The above carboxylic acid compound is preferably an aromatic heteroacetic acid, and specifically, examples include phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, naphthoxyacetic acid, etc.

[0152] The above-mentioned polyfunctional thiol compounds include Tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, Trimethylolpropane tris-3-mercaptopropionate, Pentaerythritol tetrakis-3-mercaptopropionate, Dipentaerythritol hexa-3-mercaptopropionate, etc.

[0153] When the above photopolymerization initiation aid is further included, the content of the photopolymerization initiation aid may be 0.1 to 40 weight%, preferably 1 to 30 weight%, based on the total weight of the solids of the binder resin and the photopolymerizable compound. When the above range is satisfied, the sensitivity of the colored photosensitive resin composition is increased, and the productivity of the color filter formed using the colored photosensitive resin composition can be improved.

[0155] (D) Light absorber

[0156] The resin composition for forming an insulating film according to the present invention may include a light absorber. The light absorber is not particularly limited as long as it includes a light-absorbing functional group and a substituent attached to the basic structure, but it is preferable to include an azole-based compound. In this case, it is preferable in that pattern characteristics, hole characteristics, and taper characteristics can be improved.

[0157] In one embodiment, the azole compound may comprise one or more selected from the group consisting of benzotriazole (BTA) and pyrazole.

[0158] The light absorber containing the above-mentioned benzotriazole (BTA) and / or pyrazole can improve pattern and hole characteristics, reliability, etc. by controlling the degree of curing through light absorption characteristics in the long wavelength region.

[0159] It is possible to analyze whether a resin composition for forming an insulating film contains benzotriazole (BTA) to pyrazole using commonly used analytical methods. Specifically, the content of benzotriazole to pyrazole included in the resin composition for forming an insulating film can be analyzed by using nuclear magnetic resonance spectra, infrared absorption spectra, mass spectrometry spectra, etc.

[0160] The content of the light absorber may be 1% to 10% by weight based on the total weight of the solids in the resin composition for forming an insulating film, and preferably 2% to 6% by weight. When the above range is satisfied, there are advantages in terms of pattern characteristics and hole characteristics.

[0162] (E) Solvent

[0163] The above solvent may be any organic solvent known in this field without particular restriction.

[0164] Specific examples of the above solvents include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, and diethylene glycol dibutyl ether; ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate; alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate, and methoxypentyl acetate; aromatic hydrocarbons such as benzene, toluene, xylene, and mesitylene; methyl ethyl ketone, acetone, methyl amyl ketone, and methyl isobutyl ketone. Examples include ketones such as cyclohexanone, alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, and glycerin, esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate, and cyclic esters such as γ-butyrolactone.

[0165] In terms of coating and drying properties, the above solvent may preferably be an organic solvent having a boiling point of 100°C to 200°C, more preferably alkylene glycol alkyl ether acetates, ketones, esters such as ethyl 3-ethoxypropionate or methyl 3-methoxypropionate may be used, and even more preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate may be used.

[0166] The above solvents can each be used individually or in a mixture of two or more types.

[0168] The content of the above solvent may be 60 to 90 weight% based on the total weight of the resin composition for forming an insulating film, and preferably 70 to 85 weight%. Satisfying the above range is desirable because it provides the effect of improving applicability when applied using an application device such as a roll coater, spin coater, slit-and-spin coater, slit coater (sometimes also called a die coater), or inkjet.

[0170] (F) Additives

[0171] The photosensitive resin composition according to the present invention may further include additives as needed. The types of said additives may be determined according to the user's needs and are not specifically limited in the present invention, but examples include fillers, other polymer compounds, curing agents, surfactants, adhesion promoters, antioxidants, UV absorbers, anti-coagulation agents, dispersants, ink-repellent agents, etc. The additives exemplified above may be used alone or in a mixture of two or more types.

[0172] Specifically, the above-mentioned filler may be glass, silica, alumina, etc., but is not limited thereto.

[0173] Specifically, the above-mentioned other polymer compounds may include curable resins such as epoxy resin and maleimide resin; thermoplastic resins such as polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, and polyurethane, but are not limited thereto.

[0174] The above-mentioned curing agent is used to increase deep curing and mechanical strength, and specifically, epoxy compounds, polyfunctional isocyanate compounds, melamine compounds, oxetane compounds, etc. may be used, but is not limited thereto. Specifically, the above-mentioned epoxy compounds may include bisphenol A-based epoxy resin, hydrogenated bisphenol A-based epoxy resin, bisphenol F-based epoxy resin, hydrogenated bisphenol F-based epoxy resin, novolac-type epoxy resin, other aromatic epoxy resins, alicyclic epoxy resins, glycidyl ester-based resins, glycidylamine-based resins, or brominated derivatives of such epoxy resins, aliphatic, alicyclic, or aromatic epoxy compounds other than epoxy resins and their brominated derivatives, butadiene (co)polymer epoxides, isoprene (co)polymer epoxides, glycidyl (meth)acrylate (co)polymers, triglycidyl isocyanulates, etc., but are not limited thereto. Specifically, the above oxetane compounds may include carbonate bis-oxetane, xylene bis-oxetane, adipate bis-oxetane, terephthalate bis-oxetane, cyclohexane dicarboxylic acid bis-oxetane, etc., but are not limited thereto.

[0175] The above-mentioned curing agent may be used in combination with a curing aid compound capable of causing ring-opening polymerization of the epoxy groups of the epoxy compound and the oxetane backbone of the oxetane compound. Specifically, the above-mentioned curing aid compound may be polycarboxylic acids, polycarboxylic anhydrides, acid generators, etc. The above-mentioned carboxylic anhydrides may be commercially available as epoxy resin curing agents. Examples of the above-mentioned commercially available epoxy resin curing agents include the product name (Adeka Hadona EH-700) (manufactured by Adeka Industries, Ltd.), the product name (Ricasitdo HH) (manufactured by Shin Nippon Iwa Co., Ltd.), and the product name (MH-700) (manufactured by Shin Nippon Iwa Co., Ltd.).

[0176] The curing agents and curing aid compounds exemplified above can each be used individually or in a mixture of two or more types.

[0177] Commercially available surfactants may be used as the above surfactants, and examples include silicone-based surfactants, fluorine-based surfactants, and mixtures thereof. Examples of the above silicone-based surfactants include surfactants having siloxane bonds. Examples of commercially available products include Toray Silicon DC3PA, Toray Silicon SH7PA, Toray Silicon DC11PA, Toray Silicon SH21PA, Toray Silicon SH28PA, Toray Silicon 29SHPA, Toray Silicon SH30PA, polyether-modified silicone oil SH8400 (manufactured by Toray Silicon Inc.), KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Silicon), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF-4446, TSF4452, TSF4460 (manufactured by GE Toshiba Silicon Inc.), etc.

[0178] Examples of the above-mentioned fluorine-based surfactants include surfactants having fluorocarbon chains. Specifically, Prolineate (product name) FC430, Prolineate FC431 (manufactured by Sumitomo 3M Corp.), Megapack (product name) F142D, Megapack F171, Megapack F172, Megapack F173, Megapack F177, Megapack F183, Megapack F251, Megapack F410, Megapack F430, Megapack F444, Megapack F477, Megapack F551, Megapack F553, Megapack F554, Megapack F556, Megapack F557, Megapack F558, Megapack F559, Megapack F562, Megapack F563, Megapack F565, Megapack F570, Megapack R30, Megapack R40, Megapack R41, Megapack R43, Examples include Mega Pack R94 (manufactured by DIC, Japan), F-Top (product name) EF301, F-Top EF303, F-Top EF351, F-Top EF352 (manufactured by Shin-Aki Takasei Co., Ltd.), Surfron (product name) S381, Surfron S382, Surfron SC101, Surfron SC105 (manufactured by Asahi Glass Co., Ltd.), E5844 (manufactured by Daikin Fine Chemical Genkyusho Co., Ltd.), BM-1000, BM-1100 (product name: manufactured by BMChemie Co., Ltd.), etc.

[0179] Specifically, the above adhesion promoter may be used alone or a mixture thereof selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanatepropyltrimethoxysilane, and 3-isocyanatepropyltriethoxysilane.

[0180] The above antioxidant may include, for example, one or more selected from the group consisting of phosphorus-based antioxidants, sulfur-based antioxidants, and phenolic-based antioxidants, and in this case, it can suppress color change phenomena that may occur at high temperatures during the process or yellowing that may be caused by a light source after the display is manufactured. The above antioxidant may include one or more selected from the group consisting of phenolic compounds, phosphorus-based compounds, and sulfur-based compounds, and these may be used as a combination of phenolic-phosphorus-based compounds, phenolic-sulfur-based compounds, phosphorus-sulfur-based compounds, or phenolic-phosphorus-sulfur-based compounds.

[0181] Specifically, the above-mentioned ultraviolet absorber may include 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzothiriazole, alkoxybenzophenone, etc., but is not limited thereto.

[0182] The above anti-coagulant may specifically use sodium polyacrylate, but is not limited thereto.

[0183] The above-mentioned dispersant is added to maintain the dispersion stability of the pigment, and any commonly used in the field may be used without restriction.

[0184] The above-mentioned ink-repellent agent has fluorine atoms within its molecule. As a result, the ink-repellent agent possesses the property of migrating to the upper surface (upper surface migration) and ink-repellent properties during the process of forming a cured film using a photosensitive resin composition containing it. The upper layer, including the upper surface of the cured film obtained by using the ink-repellent agent, becomes a layer in which the ink-repellent agent is densely present (hereinafter referred to as the "ink-repellent layer"), thereby imparting ink-repellent properties to the upper surface of the cured film. Furthermore, from the perspective of improving the fixation of the ink-repellent agent to the ink-repellent layer, the ink-repellent agent is preferably a compound having an ethylenically double bond. Since the ink-repellent agent has an ethylenically double bond, radicals act on the ethylenically double bond of the ink-repellent agent that has migrated to the upper surface, thereby enabling crosslinking by (co)polymerization between the ink-repellent agents or between the ink-repellent agent and other components having an ethylenically double bond contained in the photosensitive resin composition for forming a barrier.

[0185] The types of the above-mentioned ink-dispelling agents are not particularly limited, and for example, a partially hydrolyzed condensate of a hydrolyzable silane compound may be used. A partially hydrolyzed condensate of a hydrolyzable silane compound may be used, or two or more types may be used in combination. An ink-dispelling agent composed of a partially hydrolyzed condensate of a hydrolyzable silane compound and having a fluorine atom may be used, and an ink-dispelling agent composed of a compound having a main chain that is a hydrocarbon chain and a side chain that contains a fluorine atom may also be used.

[0186] The above additives may be appropriately added and used by those skilled in the art within a range that does not impede the effects of the present invention. For example, the above additives may be used in an amount of 0.05 to 10 weight%, preferably 0.1 to 10 weight%, and more preferably 0.1 to 5 weight%, based on the total weight of the photosensitive resin composition, but are not limited thereto.

[0188] Insulating film

[0189] The present invention includes an insulating film formed on a substrate by a resin composition for forming an insulating film.

[0190] The above substrate is not particularly limited as long as it serves to provide a structural base for other devices, such as an insulating film formed by a resin composition for forming an insulating film. In one or more embodiments, the substrate may be a polymerizable film such as polyethylene terephthalate, polypropylene, polyethylene, or polyester.

[0191] In one embodiment, the insulating film may include a predetermined pattern, for example, a pattern formed by applying the resin composition for forming the insulating film described above onto a substrate and exposing and developing it into a predetermined pattern.

[0192] Specifically, the method may be manufactured by including the steps of: preparing a solution by mixing a resin composition for forming an insulating film (S1); applying the solution prepared in step (S1) onto a substrate (S2); heating to remove the solvent from the solution applied in step (S2) (S3); forming a pattern by exposure and development (S4); and heating to increase the degree of curing of the formed pattern (S5).

[0193] The step (S2) of applying the above solution onto a substrate may involve applying a resin composition for forming an insulating film onto a substrate and then heating and drying it to remove volatile components such as a solvent, thereby forming a smooth film.

[0194] The coating method may be carried out by, for example, spin coating, flexible coating, roll coating, slit-and-spin coating, or slit coating. After coating, heating is performed after heat drying (pre-baking) or vacuum drying to volatilize volatile components such as solvents.

[0195] The step (S3) of heating to remove the above solvent may typically be performed at 70 to 150 ℃, and preferably at 80 to 130 ℃.

[0196] The step (S4) of forming a pattern by the above exposure and development first involves irradiating ultraviolet rays through a mask to form a desired pattern. At this time, it is preferable to use a device such as a mask aligner or a stepper so that parallel rays are irradiated uniformly across the entire exposure area and accurate positional alignment between the mask and the substrate is achieved. At this time, the mask pattern may be in direct contact with an insulating film, may be in contact through a film through which active rays can pass, or may be formed at a certain distance apart.

[0197] As a light source for the active light, a light source for the active light used in conventional or subsequent exposures may be used, and may include a carbon arc lamp, a mercury vapor arc lamp, an ultra-high pressure mercury lamp, a high pressure mercury lamp, a xenon lamp that effectively emits ultraviolet light, or a photographic flat bulb, a solar lamp that effectively emits visible light.

[0198] Subsequently, by contacting the photocured film with a developer to dissolve the unexposed portion, an insulating film having a required pattern can be formed.

[0199] The step (S5) of heating to increase the degree of hardening of the formed pattern may be performed at 80°C to 150°C.

[0200] The insulating film formed by the resin composition for forming an insulating film of the present invention has an excellent effect in terms of improving reliability and provides an effect of preventing corrosion of the underlying copper substrate.

[0202] Image display device

[0203] The present invention provides a display device comprising the insulating film described above.

[0204] The display device of the present invention may include a conventional or subsequently developed display device, and in one or more embodiments, may include a Liquid Crystal Display (LCD), an Electro Luminescent (EL) display device, a Plasma Display Panel (PDP), a Field Emission Display (FED), an Organic Light Emitting Diode (OLED) display device, etc.

[0205] The above-described display device may include a configuration commonly known in the art, except for including the insulating film described above.

[0207] The present invention will be described in more detail below based on embodiments, but the embodiments of the present invention disclosed below are merely examples, and the scope of the present invention is not limited to these embodiments. The scope of the present invention is defined in the claims, and furthermore, it includes all modifications within the meaning and scope equivalent to the claims. In addition, "%" and "parts" indicating content in the following embodiments and comparative examples are based on mass unless otherwise specified.

[0209] <Preparation Example 1: Preparation of Binder Resin>

[0210] 23.3 g of methyl-2-(bromomethyl)-acrylate (Aldrich), 15.8 g of triethylamine (Aldrich), and 115.0 g of propylene glycol methyl ether (TCI) were added to a four-necked flask equipped with a dropping funnel, thermometer, condenser, and stirrer, and the inside of the four-necked flask was purged with nitrogen. Next, the flask was heated to 90 °C, and a mixed solution of 15.1 g of methyl-2-(hydroxymethyl)-acrylate (Aldrich), 3.2 g of 2,2'-azobis isobutyronitrile (Wako), and 110.0 g of propylene glycol methyl ether (TCI) was added dropwise over 1 hour, followed by a polymerization reaction for 30 minutes to produce a pyran-containing polymer. Next, a mixed solution of 37.5 g of methacrylic acid, 19.0 g of methyl methacrylate, 225.0 g of propylene glycol methyl ether, and 3.2 g of 2,2'-azobis isobutyronitrile (Wako product) was slowly added dropwise over 1 hour, and polymerization was carried out for 8 hours, after which it was cooled to room temperature. After purging the inside of a four-necked flask with nitrogen, 61.5 g of glycidyl methacrylate (Mitsubishi Rayon product), 3.6 g of tetra-n-butylammonium bromide (TCI product), and 0.15 g of methoquinone (Junsei product) were added to the flask, and the mixture was reacted at 80°C for 12 hours to obtain binder resin B1, in which GMA was added to the carboxyl groups of the copolymer. The weight-average molecular weight (Mw) of binder resin B1 measured by GPC was 23,000.

[0212] <Preparation Example 2: Preparation of Binder Resin>

[0213] 277 g of methoxybutyl acetate was added to a 1-liter volume separable flask equipped with a stirrer, thermometer, reflux condenser, dropping funnel, and nitrogen inlet tube, and after raising the temperature to 80 ℃, a mixed solution containing 301 g of a mixture of 3,4-epoxytricyclo[5.2.1.0,2,6]decane-9-ylacrylate and 3,4-epoxytricyclo[5.2.1.0,2,6]decane-8-ylacrylate [50:50 (molar ratio)], 49 g of methacrylic acid, and 23 g of azobisdimethylvaleronitrile dissolved in 350 g of methoxybutyl acetate was added dropwise over 5 hours, and by aging for 3 hours, binder resin B3 [solid content (NV) 35.0 wt%] was obtained. The acid value (dry) of the obtained binder resin B3 was 69.8 mgKOH / g, the weight-average molecular weight (Mw) was 12,300, and the degree of dispersion (Mw / Mn) was 2.1.

[0215] <Examples and Comparative Examples>

[0216] Referring to Tables 1 and 2 below, resin compositions for forming insulating films according to the examples and comparative examples were each prepared.

[0217] Unit; weight % Examples 1 2 3 4 5 6 7 8 9 10 11 12 13 Binder resin B1 4.51 4.87 4.33 4.51 4.51 5.41 4.51 4.87 4.33 0.00 0.00 0.00 0.00 B2 1.80 0.00 1.44 1.80 1.80 0.00 1.80 0.00 1.44 0.00 0.00 4.51 4.51 B3 0.00 1.44 0.54 0.00 0.00 0.90 0.00 1.44 0.54 9.02 9.02 1.80 1.80 photopolymerizable compounds M1 6.31 6.31 6.31 10.82 4.51 6.31 6.31 6.31 6.31 4.96 4.96 6.31 6.31 M2 5.41 5.41 5.41 0.90 7.21 5.41 5.41 5.41 5.41 4.06 4.06 5.41 5.41 Photopolymerization initiator PI1 1.98 1.98 1.98 1.98 1.98 1.98 1.98 1.98 1.98 1.98 1.98 1.98 1.98 PI2 0.81 0.81 0.81 0.81 0.81 0.81 0.81 0.81 0.81 0.81 0.81 0.81 0.81 PI3 0.14 0.14 0.14 0.14 0.14 0.14 0.14 0.14 0.14 0.14 0.14 0.14 0.14 light absorber PA1 0.90 0.90 0.90 0.90 0.90 0.90 0.00 0.00 0.00 0.90 0.00 0.90 0.00 PA2 0.00 0.00 0.00 0.00 0.00 0.00 0.90 0.90 0.90 0.00 0.90 0.00 0.90 PA3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 PA4 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 additives A1 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.02 A2 0.12 0.12 0.12 0.12 0.12 0.12 0.12 0.12 0.12 0.11 0.11 0.12 0.12 solvent S 78.00 78.00 78.00 78.00 78.00 78.00 78.00 78.00 78.00 78.00 78.00 78.00 78.00 entire Total 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 100.00 - Solids: 22 wt%- B1: THP-based binder resin (Binder resin of Preparation Example 1)- B2: Acrylic-based binder resin (Miramer PS4500, Miwon)- B3: Epoxy-based binder resin (Binder resin of Preparation Example 2)- M1: DPHA (Miwon)- M2: BPEF (Osaka Gas Chemical)- PI1: I-819 (Basf)- PI2: DETX (Chivacure)- PI3: OXE-01 (Basf)- PA1: Benzotriazole (Sigma-aldrich)- PA2: Pyrazole (Sigma-aldrich)- PA3: 2-mercaptobenzoxazole (Sigma-aldrich)- PA4: Pyridine-2-carboxylic acid (Sigma-aldrich)- A1: F554 (DIC)- A2: KBE-9007 (Shin-etsu)- S: Propylene glycol monomethyl ether acetate (PGMEA)

[0219] Unit: Weight % Comparative example 1 2 3 4 5 6 Binder resin B1 5.41 0.00 4.33 0.00 4.51 4.51 B2 0.00 5.41 1.44 6.31 1.80 1.80 B3 0.90 0.90 0.54 0.00 0.00 0.00 photopolymerizable compounds M1 11.72 11.72 11.72 11.72 6.31 6.31 M2 0.00 0.00 0.00 0.00 5.41 5.41 Photopolymerization initiator PI1 1.98 1.98 1.98 1.98 1.98 1.98 PI2 0.81 0.81 0.81 0.81 0.81 0.81 PI3 0.14 0.14 0.14 0.14 0.14 0.14 light absorber PA1 0.90 0.90 0.90 0.90 0.00 0.00 PA2 0.00 0.00 0.00 0.00 0.00 0.00 PA3 0.00 0.00 0.00 0.00 0.90 0.00 PA4 0.00 0.00 0.00 0.00 0.00 0.90 additives A1 0.02 0.02 0.02 0.02 0.02 0.02 A2 0.12 0.12 0.12 0.12 0.12 0.12 solvent S 78.00 78.00 78.00 78.00 78.00 78.00 entire Total 100.00 100.00 100.00 100.00 100.00 100.00 - Solids: 22 wt%- B1: THP-based binder resin (Binder resin of Preparation Example 1)- B2: Acrylic-based binder resin (Miramer PS4500, Miwon)- B3: Epoxy-based binder resin (Binder resin of Preparation Example 2)- M1: DPHA (Miwon)- M2: BPEF (Osaka Gas Chemical)- PI1: I-819 (Basf)- PI2: DETX (Chivacure)- PI3: OXE-01 (Basf)- PA1: Benzotriazole (Sigma-aldrich)- PA2: Pyrazole (Sigma-aldrich)- PA3: 2-mercaptobenzoxazole (Sigma-aldrich)- PA4: Pyridine-2-carboxylic acid (Sigma-aldrich)- A1: F554 (DIC)- A2: KBE-9007 (Shin-etsu)- S: Propylene glycol monomethyl ether acetate (PGMEA)

[0221] <Experimental Example>

[0222] For the resin compositions for forming an insulating film according to the examples and comparative examples, pattern characteristics, hole characteristics, chemical resistance, copper (Cu) corrosion, and taper characteristics were evaluated, and the results are shown in Tables 3 and 4 below.

[0224] (1) PCB fabrication

[0225] A 5cm x 5cm substrate was washed with a neutral detergent and water, and then dried. Depending on the evaluation method, the applicable substrate may be a glass substrate (Corning) or a substrate with a Cu pattern. Each of the insulating film-forming resin compositions prepared in the above examples and comparative examples was spin-coated onto the substrate to achieve a final film thickness of 2.0 μm, and then pre-fired at 80 to 120°C and dried for 1 to 3 minutes to remove the solvent. Subsequently, an exposure dose of 30 to 80 mJ / cm² 2 A pattern was formed by exposure to light, and an unexposed area was removed using an alkaline aqueous solution. Subsequently, a substrate was prepared by post-sintering at 100 to 180°C for 20 to 60 minutes.

[0227] (2) Pattern characteristics and Hole characteristics

[0228] A patterned substrate is fabricated according to the above fabrication standards. The pattern size and hole size are measured using SNU (SIS-2000) equipment. CD-bias is calculated as the difference between the mask pattern size and the actual generated pattern size.

[0229] CD-bias=(Mask Size)-(Actual Pattern Size)

[0231] <Pattern Characteristic Evaluation Criteria>

[0232] O : CD-bias ≤ +4㎛

[0233] X : CD-bias > +4㎛

[0235] <Hole Characteristic Evaluation Criteria>

[0236] O : CD-bias -4 to -7㎛

[0237] X: CD-bias less than -7㎛ or greater than -4㎛

[0239] (3) Chemical resistance

[0240] Using a substrate prepared according to the above criteria, the change in film thickness is checked after sequentially immersing it in an etchant and a stripper. The film thickness is checked after immersing the prepared substrate in the etchant, which is maintained at 45°C, for 2 minutes. Subsequently, the film thickness is checked after immersing it in a stripper maintained at 60°C for 5 minutes. After completing all these steps, the difference between the film thickness before immersion in the etchant and the film thickness after immersion in the stripper is checked.

[0241] ΔFilm Thickness = Film Thickness Before Chemical Resistance Evaluation - Film Thickness After Stripper Immersion

[0243] Chemical Resistance Evaluation Criteria

[0244] O : Δfilm thickness ≤ 0.2㎛

[0245] X : Δfilm thickness > 0.2㎛

[0247] (4) Cu corrosion

[0248] Using a substrate fabricated according to the above standards, Cu corrosion is verified using a PCT (Pressure Cooker Test) device. The experiment involves maintaining the fabricated substrate within the device at a temperature of 110°C and 100% humidity for 72 hours, after which the presence of corrosion is determined using a microscope. This evaluation utilizes a substrate with a Cu pattern and verifies how many points out of 10 have experienced corrosion.

[0250] Copper (Cu) Corrosion Assessment Criteria

[0251] O: Corrosion within 2 points out of 10 points

[0252] X: Corrosion of 3 points or more

[0254] (5) Taper characteristics

[0255] The taper of the pattern produced according to the above criteria was measured using an SEM (Hitachi, S-4300).

[0257] <Taper Characteristic Evaluation Criteria>

[0258] O : Taper angle 15° or more and less than 80°

[0259] X: Taper angle less than 15° or 80° or more

[0261] division Examples 1 2 3 4 5 6 7 8 9 10 11 12 13 Evaluation criteria Pattern characteristics ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Hole characteristics ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Chemical resistance ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Cu corrosion ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Taper characteristics ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○

[0263] division Comparative example 1 2 3 4 5 6 Evaluation criteria Pattern characteristics ○ ○ ○ ○ X X Hole characteristics ○ ○ ○ ○ X X Chemical resistance X X X X X X Cu corrosion X X X X X X Taper characteristics X X X X X X

[0265] Referring to Tables 3 and 4 above, when an insulating film is manufactured using a resin composition for forming an insulating film according to an embodiment of the present invention, the Critical Dimension bias (CD-bias) of the pattern shows a value of +4㎛ or less, and the CD-bias of the formed hole shows a value of -4 to -7㎛, so it can be seen that the undercut phenomenon that may occur during wet etching is reduced, thereby providing an advantageous effect for forming fine patterns and holes.

[0266] In addition, the change in film thickness after sequential immersion in the etchant and stripper is 0.2㎛ or less, confirming that the loss of the insulating film that may occur during the stripping process can be minimized.

[0267] In addition, it can be confirmed that corrosion occurs on copper patterns within 2 points out of a total of 10 copper patterns on the substrate, indicating that there is an excellent effect on copper protection under high temperature and high humidity conditions that may occur in devices, particularly display devices.

[0268] In addition, the measured taper angle of the formed pattern is between 15° and 80°, indicating that the formed taper characteristics are good.

[0270] On the other hand, when an insulating film is manufactured using a resin composition for forming an insulating film according to Comparative Examples 1 to 4, which does not include a fluorene-based compound as a photopolymerizable compound, it can be confirmed that the difference in film thickness exceeds 0.2 μm, resulting in excessive loss of the insulating film during the stripping process, and that corrosion occurs in at least 3 out of 10 copper pattern points, indicating that it is unsuitable for use in devices, particularly image display devices such as displays.

[0271] In addition, it can be confirmed that the taper characteristics are poor as the taper angle of the formed pattern is less than 15° or greater than 80°.

[0272] In addition, when an insulating film is manufactured using a resin composition for forming an insulating film according to Comparative Examples 5 and 6 that does not contain benzotriazole (BTA) and pyrazole as light absorbers, it can be confirmed that chemical resistance, taper characteristics, and copper (Cu) corrosion resistance are poor, as in Comparative Examples 1 to 4, and that the CD-bias of the formed pattern exceeds 4 μm, and the CD-bias of the formed hole is less than -7 μm or exceeds -4 μm, and that the pattern characteristics and hole characteristics are also poor.

Claims

Claim 1 A resin composition for forming an insulating film comprising (A) a binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a light absorber, and (E) a solvent, wherein the (A) binder resin comprises one or more selected from a binder resin comprising a tetrahydropyran (THP)-based ring and an epoxy-based binder resin represented by the following Chemical Formula 2, the (B) photopolymerizable compound comprises a fluorene-based compound, wherein the fluorene-based compound comprises a compound represented by the following Chemical Formula 3, and the (D) light absorber comprises an azole-based compound. [Chemical Formula 2] (In the above Chemical Formula 2, R3 and R4 are each independently hydrogen or CH3, and a and b are each independently integers from 3 to 20.)[Chemical Formula 3] (In the above chemical formula 3, X 1 and X 2 Each independently consists of a hydroxyl group, -(OAO) p Represents an H group (A represents an alkylene group having 2 to 3 carbon atoms, and p represents an integer from 1 to 10), and R 5 to R 8 Each represents a hydrocarbon group having 1 to 20 carbon atoms that can be independently substituted, an alkoxy group having 1 to 20 carbon atoms that can be substituted, or a halogen atom; m1 and m2 are each independently integers from 1 to 3, and n1 to n4 are each independently integers from 0 to 4. provided that m1+n1 and m2+n2 are each independently integers from 0 to 5.) Claim 2 delete Claim 3 A resin composition for forming an insulating film according to claim 1, wherein the tetrahydropyran (THP)-based ring is polymerized by including at least one of an acyclic compound and a cyclic compound capable of forming a tetrahydropyran (THP)-based ring during polymerization. Claim 4 A resin composition for forming an insulating film according to claim 3, wherein the acyclic compound comprises a compound represented by the following chemical formula 1. [Chemical Formula 1] (In the above Chemical Formula 1, R1 and R2 are each independently an aliphatic hydrocarbon group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 18 carbon atoms, which may or may not contain heteroatoms.) Claim 5 A resin composition for forming an insulating film according to claim 3, wherein the cyclic compound comprises one or more selected from the group consisting of tetrahydropyran-2-yl(meth)acrylate, (tetrahydropyran-2-yl)methyl(meth)acrylate, 2,6-dimethyl-8-(tetrahydropyran-2-yloxy)-1-octen-3-one, 1-(tetrahydropyran-2-yloxy)-3-buten-2-one, 4-(1,4-dioxa-5-oxo-6-heptenyl)-6-methyl-2-pyrone, and 4-(1,5-dioxa-6-oxo-7-octenyl)-6-methyl-2-pyrone. Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 A resin composition for forming an insulating film according to claim 1, wherein the content of the fluorene-based compound is 3 to 35 weight% based on the total weight of the solid content of the resin composition for forming an insulating film. Claim 10 A resin composition for forming an insulating film according to claim 1, wherein the azole-based compound comprises one or more selected from the group consisting of benzotriazole (BTA) and pyrazole. Claim 11 A resin composition for forming an insulating film according to claim 1, comprising, based on the total weight of the solids in the resin composition for forming an insulating film: (A) 10 to 50 weight% of a binder resin; (B) 5 to 70 weight% of a photopolymerizable compound; (C) 3 to 20 weight% of a photopolymerization initiator; (D) 1 to 10 weight% of a light absorber; and based on the total weight of the resin composition for forming an insulating film, (E) 60 to 90 weight% of a solvent. Claim 12 The resin composition for forming an insulating film according to claim 1, wherein the resin composition for forming an insulating film prevents copper corrosion. Claim 13 A resin composition for forming an insulating film according to claim 1, wherein the firing temperature of the resin composition for forming an insulating film is 80 to 150°C. Claim 14 A resin composition for forming an insulating film according to claim 13, wherein the firing temperature is a post-firing temperature. Claim 15 An insulating film formed by a resin composition for forming an insulating film according to any one of claims 1, 3 to 5 and 9 to 14. Claim 16 An image display device comprising the insulating film of claim 15. Claim 17 A method for manufacturing an insulating film, comprising the step of forming an insulating film by a low-temperature firing process of 80 to 150°C using a resin composition for forming an insulating film according to any one of claims 1, 3 to 5 and 9 to 14.

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