Epoxy resin composition for molding

Abstract

The present invention relates to an epoxy resin composition for molding and a semiconductor device molded using the same.

Description

Technology Field

[0001] The present invention relates to an epoxy resin composition for molding and a semiconductor device molded using the same. Background Technology

[0002] Encapsulating resin compositions are used as materials to improve the characteristics and reliability of semiconductor devices by sealing semiconductor devices such as integrated circuits (ICs), large-capacity integrated circuits (LSIs), transistors, and diodes. Recently, as the high integration of semiconductors accelerates in accordance with the trends of miniaturization, lightweighting, and high performance of electronic devices, research to improve the performance of materials used for sealing semiconductor devices is being conducted in various ways. For example, Japanese Patent Publication No. 2017-197620 relates to an epoxy resin composition for semiconductor sealing comprising an epoxy resin, a phenolic resin curing agent, and a filler, and discloses a technology that improves electrical connection reliability by controlling the content of the filler and the thermal modulus of the cured product of the epoxy resin composition.

[0003] In particular, when applied to multi-layer stacked semiconductor packages, filling fine gaps is considered important, so it is required to ensure excellent spreading in the epoxy resin composition to increase filling capacity. However, in the case of conventional epoxy resin compositions with increased filling capacity, there is a problem in that swelling occurs when the epoxy resin composition leaks out of the mold cavity during compression molding, which is performed under high pressure in a vacuum environment.

[0004] Accordingly, there is a need to develop an epoxy resin composition for molding that has excellent spreading properties to improve filling ability, while simultaneously possessing excellent swelling inhibition characteristics. The problem to be solved

[0005] The present invention provides an epoxy resin composition for molding having excellent spreading and swelling inhibition characteristics, and a semiconductor device molded using the same. means of solving the problem

[0006] The present invention provides an epoxy resin composition for molding having an r value greater than 4 and less than 6 according to Formula 1 below.

[0007] [Equation 1]

[0008]

[0009] In the above formula,

[0010] GT is the gel time of the epoxy resin composition for molding, and

[0011] VT is the time for the molding epoxy resin composition to be melted in a vacuum state after the mold is closed, and

[0012] CT is the sum of the time it takes for the upper press of the compression mold (C-mold) to move to the packing position and the time it takes to apply pressure. Effects of the invention

[0013] The present invention provides an epoxy resin composition for molding that has excellent spreadability, thereby improving filling properties, and at the same time has excellent swelling inhibition properties. The epoxy resin composition according to the present invention is applicable to compression molding methods, and in particular, it is applicable as a granular epoxy resin composition for molding because it has excellent swelling inhibition properties. Brief explanation of the drawing

[0014] Figure 1 is a schematic diagram showing a method for evaluating the spreading of an epoxy resin composition. Figure 2 is a schematic diagram showing a method for evaluating the swelling characteristics of an epoxy resin composition. Specific details for implementing the invention

[0015] The present invention will be described in detail below. However, it is not limited to the following description, and each component may be modified in various ways or selectively combined as needed. Accordingly, it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0016] As used herein, “softening point” is measured by conventional methods known in the art, for example, using a Mettler Toledo Dropping Point system calorimetry DP70. “Viscosity” is measured by conventional methods known in the art, for example, using a Brookfield viscometer at room temperature (25 °C). Particle size (D 50 )" is measured by conventional methods known in the relevant technical field, and can be measured, for example, by a laser particle size analyzer.

[0018] Epoxy Resin Composition

[0019] The molding epoxy resin composition of the present invention has an r value according to Formula 1 below that is greater than 4 and less than 6.

[0020] [Equation 1]

[0021]

[0022] In the above formula,

[0023] GT is the gel time of the epoxy resin composition for molding, and

[0024] VT is the time for the molding epoxy resin composition to be melted in a vacuum state after the mold is closed, and

[0025] CT is the sum of the time it takes for the upper press of the compression mold (C-mold) to move to the packing position and the time it takes to apply pressure.

[0026] When the r value is below the aforementioned range, it is when VT and CT are excessively high compared to the gel time (GT) of the epoxy resin composition for molding; in this case, the time for which pressure is applied to the epoxy resin composition for molding becomes longer than the gel time, which may reduce spreadability. When the r value exceeds the aforementioned range, it is when VT and CT are excessively short compared to the gel time of the epoxy resin composition for molding; in this case, the time for which pressure is applied to the epoxy resin composition for molding becomes excessively short, which may cause swelling. By controlling the r value to the aforementioned range, the present invention provides an epoxy resin composition for molding with excellent spreadability and swelling suppression characteristics, thereby improving moldability and reliability.

[0027] GT refers to the time until the epoxy resin composition for molding begins to gel, i.e., the gel time of the epoxy resin composition for molding, and can be measured using a gel timer. The longer the GT, the longer the time it takes for the molten epoxy resin composition for molding to harden due to the thermal curing reaction, so the epoxy resin composition for molding applied to the moving cavity remains in a molten state for a longer period of time. GT may vary depending on the measurement temperature, and typically, the GT measurement temperature of the epoxy resin composition for molding, i.e., the molding temperature, is 140 to 180 °C. GT may be 25 to 200 seconds, for example, 55 to 72 seconds. If GT is below the aforementioned range, curing may proceed while the upper plate (the upper press of a compression mold (C-mold)) and lower plate (moving cavity) of the mold are engaged and closed. Consequently, after the upper and lower plates of the mold are fully engaged, the molding epoxy resin composition loses its flowability and hardens before spreading into the mold and forming, which may result in reduced spreadability even if the condition of an r value greater than 4 and less than 6 is satisfied. As a result, the molding epoxy resin composition may not be formed into the desired shape, leading to appearance defects. On the other hand, if GT exceeds the aforementioned range, the molding epoxy resin composition, which has not cured and has high viscosity, behaves within the mold for a long period, which may cause leakage or swelling to occur outside the mold. This may lead to contamination of the manufacturing equipment or a decrease in the reliability of the semiconductor package.

[0028] VT is the time during which the mold (the upper press and moving cavity of the compression molding mold (C-mold)) is closed and the molding epoxy resin composition is melted in a vacuum state. If VT is prolonged, the time to reach the pressure application stage is extended, and during this period, the spreadability of the molding epoxy resin composition, which has undergone partial gelation, may be reduced. On the other hand, if VT is shortened, spreadability is improved, but since the molding epoxy resin composition is exposed to a vacuum state for only a short time, air bubbles within the molten molding epoxy resin composition may not be completely removed, which may lead to a swelling phenomenon in which the molding epoxy resin composition swells and leaks out of the mold during the high-temperature heat curing reaction. VT may be 2 to 15 seconds, for example, 2 to 5 seconds. If VT is less than the aforementioned range, swelling may occur, and if it exceeds the aforementioned range, spreadability may be reduced.

[0029] CT is the sum of the time it takes for the upper press of the compression mold (C-mold) to move to the packing position and the time it takes to apply pressure. As the upper press plate of the compression mold closes, the substrate fixed at the top and the molding epoxy resin composition move to the packing position, whereupon the cavity and the molding epoxy resin composition come into contact, and pressure is applied after contact. CT refers to the total time required for the entire process. CT can be controlled by adjusting the movement speed of the mold upper plate and the speed of pressure application. If CT is extended, the time required to reach the pressure application stage increases, and during this period, the spreadability of the molding epoxy resin composition, which has undergone partial gelation, may decrease. Conversely, if CT is shortened, pressure can be applied immediately to the molding epoxy resin composition while it is in a molten state, thereby improving spreadability. CT can be 8 to 30 seconds, for example, 12 to 15 seconds. The shorter the CT, the faster pressure is applied to the molten epoxy resin composition for molding, so the spreadability improves; however, due to the physical speed limit of the mold, it may be difficult for the CT to be less than the aforementioned range, and if the CT exceeds the aforementioned range, the spreadability may decrease.

[0030] The present invention can provide an epoxy resin composition for molding with improved moldability and reliability by controlling process variables GT, VT, and CT during a compression molding process, thereby having excellent spreading and swelling inhibition characteristics.

[0031] The epoxy resin composition of the present invention can be manufactured in liquid, powder, granule, or sheet form, and can be used as a sealant for semiconductor devices or as a molding or fixing material for various electronic components or automotive parts. For example, the molding epoxy resin composition of the present invention can be applied for sealing large-area semiconductor packages that are large in size and thin in thickness, and can be manufactured as a granule-type molding epoxy resin composition applicable to compression type molding processes, C-molding processes, or lamination processes.

[0033] Epoxy resin

[0034] The epoxy resin composition of the present invention comprises an epoxy resin. The epoxy resin is used as the main resin and, by reacting with a curing agent and curing to form a three-dimensional network structure, can impart properties of strong and rigid adhesion to a substrate and heat resistance.

[0035] As the above epoxy resin, an epoxy resin commonly used in the relevant technical field may be used. Non-limiting examples of available epoxy resins include bisphenol A type epoxy resin, alicyclic epoxy resin, cresol novolak type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, naphthalene type epoxy resin, anthracene epoxy resin, tetramethylbiphenyl type epoxy resin, phenol novolak type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol S novolak type epoxy resin, biphenyl novolak type epoxy resin, naphthol novolak type epoxy resin, naphthol phenol coaxial novolak type epoxy resin, naphthol cresol coaxial novolak type epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenol resin type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, dicyclopentadiene type epoxy resin, dicyclopentadiene phenol addition type epoxy resin, biphenyl type epoxy resin, phenol aralkyl type epoxy resin, polyfunctional phenol resin, and naphthol. There are aracle-type epoxy resins, etc., and one or more of these may be included.

[0036] For example, the epoxy resin may include formaldehyde, a polymer with 1,1'-biphenyl and phenol, glycidyl ether, 4,4-bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl)), or a mixture thereof.

[0037] For example, the epoxy resin may include formaldehyde, a polymer of 1,1'-biphenyl and phenol, glycidyl ether, and 4,4-bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl). In this case, viscosity and flowability properties can be further improved while maintaining mechanical strength properties such as flexural strength of the epoxy resin composition.

[0038] The above epoxy resin may be used with an epoxy equivalent (EEW) of 100 to 500 g / eq, for example, 150 to 300 g / eq. If the epoxy equivalent is less than the aforementioned range, the curing density may increase, which may result in poor moisture resistance, and if it exceeds the aforementioned range, the curability may be poor.

[0039] The above epoxy resin may be used having a soft point of 30 to 150°C, for example, 50 to 110°C. If the soft point is below the aforementioned range, caking properties may be inferior, and if it exceeds the aforementioned range, non-uniform dispersion may occur during manufacturing.

[0040] Based on the total weight of the epoxy resin composition, the content of the epoxy resin may be 2 to 20 weight%, for example, 5 to 15 weight%. If the content of the epoxy resin is less than the aforementioned range, adhesion, flowability, and moldability may be reduced, and if it exceeds the aforementioned range, the reliability of the semiconductor may be poor due to increased moisture absorption, and the strength may be reduced due to a relative decrease in the filler content.

[0042] hardener

[0043] The epoxy resin composition of the present invention includes a curing agent. The curing agent reacts with the epoxy resin to facilitate the curing of the composition.

[0044] As the above curing agent, a curing agent known in the art for curing with an epoxy resin may be used, and the curing agent may be a phenolic compound having two or more phenolic hydroxyl groups in one molecule. Non-limiting examples of usable curing agents include phenol novolak resin, cresol novolak resin, phenol aralkyl resin, polyfunctional phenolic compounds, etc., and may include one or more of these.

[0045] For example, the curing agent may include a phenol polymer with 4,4-bis(methoxymethyl)1,1-bisphenyl, a phenol polymer with formaldehyde, or a mixture thereof.

[0046] For example, the curing agent may include a phenol polymer with 4,4-bis(methoxymethyl)1,1-bisphenyl and a phenol polymer with formaldehyde. In this case, viscosity and meltability properties can be further improved while maintaining mechanical strength properties such as flexural strength of the epoxy resin composition.

[0047] As the above-mentioned curing agent, a hydroxyl group equivalent of 90 to 300 g / eq, for example 100 to 200 g / eq, may be used. If the hydroxyl group equivalent is less than the aforementioned range, the moisture resistance reliability may be inferior, and if it exceeds the aforementioned range, the curability may be inferior.

[0048] As the above curing agent, a softening point of 50 to 120°C, for example 55 to 90°C, may be used. If the softening point is below the aforementioned range, caking properties may be inferior, and if it exceeds the aforementioned range, fluidity may be inferior.

[0049] Based on the total weight of the epoxy resin composition, the content of the curing agent may be 2 to 20 weight%, for example, 2 to 10 weight%. If the content of the curing agent is less than the aforementioned range, curability and moldability may be reduced, and if it exceeds the aforementioned range, the reliability of the semiconductor may be poor and strength may be reduced due to increased moisture absorption.

[0051] filling

[0052] The epoxy resin composition of the present invention includes a filler. The filler serves to improve the mechanical properties (e.g., strength) of the epoxy resin composition and to reduce moisture absorption.

[0053] As the above filler, inorganic fillers commonly used in the field of electronic materials can be used without special restrictions. For example, inorganic fillers such as silica, silica nitride, alumina, aluminum nitride, and boron nitride can be used, and these can be used individually or in combination of two or more types.

[0054] The shape of the above-mentioned filler is not particularly limited, and both angular and spherical forms can be used. Non-limiting examples of fillers that can be used in the present invention include natural silica, synthetic silica, fused silica, etc., and, for example, spherical silica particles can be used.

[0055] The above filler may include two or more types of fillers with different particle sizes to improve mechanical properties. In this case, the moldability and workability of the epoxy resin composition can be further improved. For example, the above filler has an average particle size (D 50A first filler having a particle size of 3.5 to 20 μm, for example, 3.5 to 15 μm, and an average particle size (D 50 It may include a second filler having a thickness of 0.1 to 3 μm, for example, 0.1 to 1 μm.

[0056] Based on the total weight of the epoxy resin composition, the content of the filler may be 50 to 90 weight%, for example, 70 to 90 weight%. If the content of the filler is less than the aforementioned range, the moisture absorption of the cured product increases, which may reduce the reliability of the semiconductor device, and if it exceeds the aforementioned range, the fluidity decreases, which may result in poor moldability.

[0058] Organic siloxane

[0059] The epoxy resin composition of the present invention may include an organosiloxane to improve dispersibility. The organopolysiloxane is a linear organosiloxane with a symmetric structure having epoxy groups at both ends. By using an organopolysiloxane with such a structure, an epoxy resin composition for molding with excellent spreading properties and swelling inhibition characteristics can be provided.

[0060] The above organosiloxane has a symmetric linear molecular structure, thereby possessing high compatibility with epoxy resin compositions, particularly those containing biphenyl-based epoxy resins. Furthermore, by having reactive epoxy groups at both ends, the organosiloxane can effectively disperse the epoxy resin composition by participating in the cross-linking curing reaction between the epoxy resin and the phenol curing agent as a reactive diluent. As a result, by lowering the surface tension of the molten epoxy resin composition, the swelling of internal bubbles within the cured epoxy resin composition can be suppressed, and moldability can be improved by lowering the viscosity of the molten epoxy resin composition. Additionally, the organosiloxane can maintain the adhesion of the epoxy resin composition while simultaneously improving meltability and swelling inhibition characteristics.

[0061] For example, the above organosiloxane can be represented by the following chemical formula 1.

[0062] [Chemical Formula 1]

[0063]

[0064] In the above chemical formula 1,

[0065] EP is an epoxy group, and

[0066] R1 is hydrogen, or a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, and

[0067] R2 is hydrogen, or a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, and

[0068] a is an integer from 1 to 5, and

[0069] n is an integer from 1 to 5.

[0070] For example, in the above formula, EP is an epoxy group, R1 is hydrogen or a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, R2 is hydrogen or a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, a is an integer from 1 to 5, and n is an integer from 1 to 5.

[0071] For example, in the above formula, EP is an epoxy group, R1 is a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, R2 is a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, a is an integer from 1 to 3, and n is an integer from 1 to 3.

[0072] For example, in the above formula, EP is an epoxy group, R1 is a methyl group, R2 is a methyl group, a is 1, and n is 3.

[0073] The above organosiloxane may be used having a molecular weight of 300 to 800 g / mol, for example, 300 to 500 g / mol, and a viscosity (25°C) of 0.005 to 1 Pa·s, for example, 0.05 to 0.1 Pa·s. When using an organosiloxane with a low molecular weight and low viscosity within the aforementioned ranges, it is advantageous for mixing the epoxy resin composition and can exhibit high dispersibility. If the molecular weight or viscosity exceeds the aforementioned ranges, the compatibility between the epoxy resin composition and the organosiloxane decreases, which may reduce the dispersibility effect and cause appearance defects such as flow marks.

[0074] As another example, the organosiloxane may be a disiloxane with a symmetric structure having alicyclic epoxy groups at both ends. By using an organosiloxane with such a structure, it is possible to provide an epoxy resin composition for molding with excellent dispersibility, flowability, and thermal conductivity. The epoxy groups included in the structure of the organosiloxane participate in the curing reaction between the epoxy and phenol, thereby reducing side effects such as reduced strength and the occurrence of flow marks that occur when adding conventional organosiloxane compounds. In particular, by including alicyclic epoxy groups, it is possible to prevent the phenomenon where the glass transition temperature decreases when using a linear organosiloxane. Furthermore, since the symmetric organosiloxane has structural similarity to crystalline epoxy resin, it enables cross-linking with the epoxy resin, which increases dispersibility and allows for the design of a filler composition with a higher content, thereby improving the thermal conductivity of the epoxy resin composition for molding.

[0075] For example, the above organosiloxane can be represented by the following chemical formula 2.

[0076] [Chemical Formula 2]

[0077]

[0078] In the above chemical formula 2,

[0079] R1 is an alicyclic epoxy having 5 to 10 carbon atoms, and

[0080] R2 is hydrogen, a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, and

[0081] R3 is hydrogen, a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, and

[0082] a is an integer from 1 to 10.

[0083] For example, in the above formula, R1 is an alicyclic epoxy having 5 to 10 carbon atoms, R2 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, R3 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, and a is an integer from 1 to 10.

[0084] For example, in the above formula, R1 is an alicyclic epoxy having 5 to 7 carbon atoms, R2 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, R3 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, and a is an integer from 1 to 5.

[0085] For example, in the above formula, R1 is an alicyclic epoxy with 6 carbon atoms, R2 is a methyl group, R3 is a methyl group, and a is 2.

[0086] For example, the above organosiloxane can be represented by the following chemical formula 3.

[0087] [Chemical Formula 3]

[0088]

[0089] The above organosiloxane may be used having a molecular weight of 200 to 800 g / mol, for example, 250 to 450 g / mol, and a viscosity (25°C) of 5 to 1,000 mPa·s, for example, 10 to 200 mPa·s. If the molecular weight is less than the aforementioned range, moldability may be reduced, and if it exceeds the aforementioned range, flowability may be reduced. If the viscosity exceeds the aforementioned range, flowability may be reduced.

[0090] Based on the total weight of the epoxy resin composition, the content of the organosiloxane may be 0.05 to 5 weight%, for example, 0.1 to 3 weight%. If the content of the organosiloxane is below the aforementioned range, the effect of improving meltability and suppressing swelling may be limited, and if it exceeds the aforementioned range, the reliability and strength of the epoxy resin composition may be reduced.

[0092] additives

[0093] The epoxy resin composition of the present invention may additionally include additives commonly used in molding compositions. Non-limiting examples of usable additives include ion catchers, catalysts, coupling agents, colorants, release agents, etc.

[0094] Ion capture agents reduce corrosion by capturing and removing impurity ions, and inorganic ion exchangers such as magnesium aluminum hydroxide carbonate hydrate may be used. Catalysts promote the curing reaction and may include imidazole compounds, naphthalene-based latent catalysts, amine compounds, organometallic compounds, organophosphorus compounds, boron compounds, etc. Coupling agents promote the bonding between inorganic and organic materials and may include amino silanes, epoxy silanes, etc. Colorants are added to impart color to the resin composition, and carbon black, Bengala, etc. may be used as colorants. Release agents are added to ensure release between the cured epoxy resin composition and the mold, and may include paraffin wax, carnauba wax, polyethylene wax, ester wax, etc.

[0095] The above additives may be added within a content range known in the relevant technical field, and for example, may be included in an amount of 0.01 to 5 weight% each with respect to the total weight of the epoxy resin composition, but are not limited thereto.

[0097] The epoxy resin composition according to the present invention can be manufactured by a melt mixing method using conventional methods known in the art, such as a Banbury mixer, a kneader, a roll, a single-screw or twin-screw extruder, and a conider.

[0098] The epoxy resin composition of the present invention can be manufactured in powder form, granule form, etc. In particular, the epoxy resin composition according to the present invention has excellent swelling inhibition properties, so it can be manufactured in a granule form and applied to a compression molding method.

[0099] For example, in the case of powder or granular epoxy resin compositions, each component as described above can be uniformly mixed, then melt-mixed using a heat kneader at a temperature of 80 to 130°C, cooled to room temperature, then ground into a powder, and then subjected to a sieving process to be manufactured, but is not limited thereto.

[0101] Semiconductor Devices and Automotive Parts

[0102] The present invention provides a semiconductor device molded using the aforementioned epoxy resin composition. The semiconductor device may be a transistor, a diode, a microprocessor, a semiconductor memory, a power semiconductor, etc.

[0103] In addition, the present invention provides a vehicle part molded using the aforementioned epoxy resin composition. For example, the aforementioned epoxy resin composition can be used as a molding material to fix and seal a component within a vehicle part. Specifically, a permanent magnet can be inserted into a void space formed within the rotor core of a vehicle motor, and the epoxy resin composition of the present invention can be filled between the void space and the permanent magnet to fix the permanent magnet within the rotor core.

[0104] A method for molding a semiconductor device or a vehicle part using the epoxy resin composition of the present invention can be appropriately selected and performed according to conventional methods in the relevant technical field, such as transfer molding, compression molding, injection molding, etc.

[0106] The present invention will be explained in more detail below through examples. However, the following examples are intended only to aid in understanding the present invention and do not imply that the scope of the present invention is limited to these examples in any way.

[0108] [Experimental Example 1-15]

[0109] After mixing each component according to the compositions listed in Tables 1 and 2 below, the mixture was melt-mixed using a kneader at a temperature of 100 to 130°C, cooled to room temperature, ground into a powder, and then subjected to a sieving process to prepare the granular epoxy resin composition of each experimental example.

[0110] Using the epoxy resin composition of each experimental example, a compression molding process was performed under the process conditions of Tables 1 and 2 below. In Tables 1 and 2 below, GT is the gel time of the molding epoxy resin composition, VT is the time for melting the molding epoxy resin composition in a vacuum state after the mold is closed, and CT is the sum of the time for the upper press of the compression molding mold (C-mold) to move to the packing position and the pressure application time. am.

[0112]

[0113]

[0114] Epoxy resin 1: Polyfunctional epoxy resin (Formaldehyde, polymer with 1,1'-biphenyl and phenol, glycidyl ether, Cas no. 1201169-35-8)

[0115] Epoxy resin 2: Biphenyl-based epoxy resin (4,4-Bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl))

[0116] Curing agent 1: Polyfunctional phenolic resin (Phenol polymer with 4,4-bis(methoxymethyl)1,1-bisphenyl, Cas no. 0106466-55-1)

[0117] Curing agent 2: Phenol novolak resin (Phenol polymer with formaldehyde, Cas no. 9003-35-4)

[0118] Filler: Silicon dioxide

[0119] Organosiloxane 1: 1,3-Bis(3-(2,3-epoxypropoxy)propyl) 1,1,3,3-tetramethyldisiloxane

[0120] Organosiloxane 2: 3-[2-(3,4-epoxycyclohexyl)ethyl]-heptamethyltrisiloxane

[0121] Catalyst: 5-Methyl-2-phenylimidazole-4-methanol

[0122] Release agent: Ester wax

[0124] [Physical Property Evaluation]

[0125] The physical properties of the epoxy resin compositions prepared in each experimental example were measured as follows, and the results are shown in Tables 3 and 4 below.

[0127] Spreading

[0128] As shown in FIG. 1, an epoxy resin composition (6.0 g) prepared according to each experimental example was dispensed over a narrow area onto a release film, and then compression molded using a compression molding machine at a temperature of 175 °C, a maximum pressure of 30 ton, a compression time according to Tables 1 and 2, and a cure time of 120 s for each experimental example. After compression molding, the spreading area of ​​the melted epoxy resin composition was measured. The meltability of the epoxy resin composition was evaluated by calculating the spreading area ratio using the following formula.

[0129]

[0131] swelling

[0132] As shown in Fig. 2, the epoxy resin compositions prepared according to each experimental example were compression molded using a compression molding machine at a temperature of 175 ℃, a maximum pressure of 30 ton, and a compression time and cure time of 120 s for each experimental example according to Tables 1 and 2. After compression molding, it was checked whether the molding epoxy resin composition overflowed out of the cavity due to swelling during the compression molding process. The swelling characteristics of the epoxy resin composition were evaluated using the following formula.

[0133]

[0134] M O : Amount of epoxy resin composition for molding (g)

[0135] △M: M O - Amount (g) of molding epoxy resin composition leaked during compression molding

[0137]

[0138]

[0139] As shown in Table 3-4 above, the epoxy resin composition having an r value according to the present invention exhibited excellent spreadability and swelling inhibition characteristics. On the other hand, the epoxy resin composition having an r value outside the scope of the present invention showed inferiority in at least one of the spreadability and swelling inhibition characteristics.

Claims

Claim 1 A molding epoxy resin composition comprising an epoxy resin, a curing agent, a filler, and an organosiloxane, wherein the organosiloxane is a linear organosiloxane with a symmetric structure having epoxy groups at both ends, and the r value according to Formula 1 below is greater than 4 and less than 6, [Formula 1] In the above formula, GT is the gel time of the molding epoxy resin composition measured at 140 to 180 ℃, VT is the time for melting the molding epoxy resin composition in a vacuum state with the mold closed, CT is the sum of the time for the upper press of the compression molding mold (C-mold) to move to the packing position and the time for applying pressure, wherein GT is 25 to 200 seconds, VT is 2 to 15 seconds, and CT is 8 to 30 seconds. Claim 2 delete Claim 3 A molding epoxy resin composition according to claim 1, wherein the epoxy equivalent (EEW) of the epoxy resin is 100 to 500 g / eq, the soft point is 30 to 150 ℃, the hydroxyl equivalent of the curing agent is 90 to 300 g / eq, and the soft point is 50 to 120 ℃. Claim 4 delete Claim 5 In claim 1, the molding epoxy resin composition wherein the organosiloxane is represented by any one of the following Chemical Formulas 1 to 3: [Chemical Formula 1] In the above Chemical Formula 1, EP is an epoxy group, R1 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, R2 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, a is an integer from 1 to 5, n is an integer from 1 to 5, [Chemical Formula 2] In the above Chemical Formula 2, R1 is an alicyclic epoxy having 5 to 10 carbon atoms, R2 is hydrogen, a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, R3 is hydrogen, a substituted or unsubstituted hydrocarbon group having 1 to 5 carbon atoms, and a is an integer from 1 to 10, [Chemical Formula 3] Claim 6 A molding epoxy resin composition according to claim 5, wherein the organosiloxane is represented by the above chemical formula 1, has a molecular weight of 300 to 800 g / mol, and a viscosity (25 ℃) of 0.005 to 1 Pa·s, or wherein the organosiloxane is represented by the above chemical formula 2, has a molecular weight of 200 to 800 g / mol, and a viscosity (25 ℃) of 5 to 1,000 mPa·s. Claim 7 A molding epoxy resin composition according to claim 1, comprising, based on the total weight of the epoxy resin composition, 2 to 20 weight% of the epoxy resin, 2 to 20 weight% of the curing agent, 50 to 90 weight% of the filler, and 0.05 to 5 weight% of the organosiloxane. Claim 8 A semiconductor device molded using an epoxy resin composition for molding according to any one of claims 1, 3 and 5 through 7.

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