Electronic device

Abstract

The present invention relates to an electronic device, and in particular, by including a printed circuit board having a heating element disposed on one surface and a heat transfer coin installed such that one surface of the other surface of the printed circuit board is in contact with the side opposite to the heating element to dissipate heat generated from the heating element, the invention provides the advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.

Description

Technology Field

[0001] The present invention relates to an electronic device, and more specifically, to an electronic device comprising a heat dissipation unit capable of improving heat dissipation performance to the opposite side of a printed circuit board on which a heat-generating element is mounted, while preventing design constraints on the pattern circuit of the printed circuit board. Background Technology

[0002] FIG. 1 is a cross-sectional view showing various heat dissipation patterns of a printed circuit board according to the prior art.

[0003] Generally, an electronic device includes a printed circuit board (PCB) (1000), and the printed circuit board (1000) is formed by stacking a plurality of raw materials in a multi-layer layer as shown in FIG. 1, and a predetermined pattern circuit (P) is printed on each layer, and a layer bridge (B) for electrically connecting each layer may be provided in the form of a hole.

[0004] Here, at least one heating element (Tr) that emits a predetermined amount of heat while being driven by a supplied power source may be provided on one side of the printed circuit board (1000). If the heat emitted from the heating elements (Tr) is not quickly dissipated to the outside, there is a problem of degrading the inherent performance of the electronic device. In particular, as shown in FIG. 1, if it is necessary to dissipate heat in the opposite direction (e.g., the rear) of the printed circuit board (1000) on which the heating element (Tr) is mounted, the heat can be dissipated to the rear through a metal housing (3000) provided on the rear side via a copper heat transfer coin (2100).

[0005] In this case, as referenced in FIG. 1, the heat transfer coin (2100) is inserted in an embedded form on the rear side of the printed circuit board (1000) so that the front end surface is in surface thermal contact with the heating element (Tr) and the rear end surface is in surface thermal contact with the metal housing (3000), thereby dissipating heat by heat conduction.

[0006] However, in order for the heat transfer coin (2100) to be inserted and installed in a completely embedded form, the thickness of the printed circuit board (1000) must be manufactured to be at least 2.5 mm thick as shown in (a) of FIG. 1, and as shown in (b) of FIG. 1, if the thickness of the printed circuit board (1000) is manufactured to be 1.6 mm thin, there is a problem that the inner surface of the metal housing (3000) must be grooved to make surface thermal contact with the metal housing (3000) because a part of the heat transfer coin (2100) protrudes backward.

[0007] In addition, there is a problem in that the thickness of the printed circuit board (1000) must be 2.5 mm or more, making it difficult to design a heat dissipation method to dissipate heat transferred through the printed circuit board (1000) to the rear side. The problem to be solved

[0008] The problem that the present invention aims to solve is to provide an electronic device capable of removing the thickness limitation of a printed circuit board and improving heat dissipation performance by eliminating the process of inserting a heat transfer coin into a printed circuit board.

[0009] The problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0010] To achieve the above objective, an electronic device according to the present invention comprises a printed circuit board having a heating element disposed on one surface, and a heat transfer coin installed such that one surface of the other surface of the printed circuit board is in contact with the side opposite to the heating element, thereby dissipating heat generated from the heating element.

[0011] Here, a component mounting hole through which a heating element passes may be formed in the printed circuit board, and the heat transfer coin may cover the component mounting hole and the heating surface of the heating element may be in contact with one side.

[0012] In addition, the heat transfer coin may be formed of copper or brass.

[0013] In addition, the electronic device according to the present invention may further include a straight heat pipe, one end of which is disposed in contact with the other surface of the heat transfer coin, and the other end of which is disposed protruding outward in a direction parallel to the other surface of the printed circuit board.

[0014] In addition, the heat transfer coin may have a heating surface receiving groove formed therein, in which a portion of the end including the heating surface of the heating element is received.

[0015] In addition, the heat transfer coin can be surface-bonded to the other side of the printed circuit board by means of a conductive adhesive.

[0016] In addition, the heat transfer coin can be closely coupled to the other side of the printed circuit board by means of an assembly screw penetrating the printed circuit board.

[0017] In addition, the electronic device according to the present invention may further include a shield cover that covers one side of the printed circuit board to prevent leakage of a signal generated from the heating element, and the heat transfer coin may be closely coupled to the other side of the printed circuit board by means of an assembly screw penetrating the shield cover and the printed circuit board.

[0018] In addition, the printed circuit board may be formed by laminating multiple layers and may have a thickness of 1.6 mm or less.

[0019] The printed circuit board may include a plurality of sections separated in a direction parallel to one side of the printed circuit board by a plating portion that forms a circuit printed on one side of the printed circuit board. The component mounting holes may be formed one by one in the plurality of sections to form a plurality of component mounting holes. The heating element may be formed as a plurality of heating elements that penetrate each of the plurality of component mounting holes. The heat transfer coin may be formed as a plurality of heat transfer coins in which the heating surface of each of the plurality of heating elements contacts one side.

[0020] An electronic device according to the present invention comprises a metal housing having an internal installation space, a printed circuit board laminated on the inner surface of the metal housing and having a heating element disposed on one surface, and a heat transfer coin installed such that one surface of the printed circuit board is in contact with the opposite side of the heating element to dissipate heat generated from the heating element.

[0021] Here, a seating groove into which the heat transfer coin is fully inserted may be formed on the inner surface of the metal housing.

[0022] In addition, the heat transfer coin can be closely coupled to the other side of the printed circuit board by means of a board assembly screw that penetrates the printed circuit board and is fastened to a board screw fastening hole provided on the inner side of the metal housing.

[0023] Specific details of other embodiments are included in the detailed description and drawings. Effects of the invention

[0024] According to the electronic device of the present invention, various effects such as the following can be achieved.

[0025] First, it has the effect of not requiring additional processes, such as grooving the printed circuit board, for the installation of a heat dissipation unit containing a heat transfer coin on the printed circuit board.

[0026] Second, since there is no need to adopt a printed circuit board with a thickness greater than a certain amount and it is possible to use a thin printed circuit board, it has the effect of improving heat dissipation performance in that heat can be dissipated from both sides of the printed circuit board.

[0027] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims. Brief explanation of the drawing

[0028] FIG. 1 is a cross-sectional view showing various heat dissipation aspects of a printed circuit board according to the prior art, and FIGS. 2a and 2b are perspective views showing an electronic device according to an embodiment of the present invention, and FIGS. 3a and 3b are exploded perspective views of FIGS. 2a and 2b, and FIG. 4 is an exploded perspective view showing the installation of the heat dissipation unit of FIG. 2a and FIG. 2b, and FIG. 5 is a plan view of FIG. 2a and FIG. 2b, and FIG. 6 is a cross-sectional view taken along line AA of FIG. 5, and FIGS. 7a and 7b are cut-away perspective views taken along line AA of FIG. 5, and FIGS. 8a and 8b are perspective views showing an electronic device according to another embodiment of the present invention, and FIGS. 9a and 9b are exploded perspective views of FIGS. 8a and 8b, and FIG. 10 is a plan view of FIG. 8a and FIG. 8b, and FIG. 11 is a cross-sectional view taken along line BB of FIG. 10, and Fig. 12 is an incisional perspective view taken along line BB of Fig. 10. Specific details for implementing the invention

[0029] Hereinafter, an embodiment of the heat dissipation device according to the present invention will be described in detail with reference to the attached drawings.

[0030] It should be noted that when assigning reference numerals to the components of each drawing, the same components are assigned the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the embodiments of the present invention, if it is determined that a detailed description of related known components or functions would hinder understanding of the embodiments of the present invention, such detailed description is omitted.

[0031] In describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are intended merely to distinguish the components from other components, and the essence, order, or sequence of the components is not limited by such terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0032] FIGS. 2a and 2b are perspective views showing a heat dissipation device according to an embodiment of the present invention, FIGS. 3a and 3b are exploded perspective views of FIGS. 2a and 2b, FIG. 4 is an exploded perspective view showing the installation of the heat dissipation unit of FIGS. 2a and 2b, FIG. 5 is a plan view of FIGS. 2a and 2b, FIG. 6 is a cross-sectional view taken along line AA of FIG. 5, and FIGS. 7a and 7b are cutaway perspective views taken along line AA of FIG. 5.

[0033] In the following description, one side may refer to the upper surface of the drawing, the other side may refer to the lower surface of the drawing, and the other side may refer to the lower side of the drawing.

[0034] An electronic device (1) according to one embodiment of the present invention includes, as referenced in FIGS. 2a to 7b, a printed circuit board (10), at least one heating element (20) mounted on the printed circuit board (10), and a heat dissipation unit (200) configured to dissipate heat generated from the heating element (20) to the outside.

[0035] A printed circuit board (10) may be formed by stacking multiple raw material boards to form a multi-layer layer, although not shown, and a pattern circuit may be printed on each layer, and via holes may be plated to electrically connect the pattern circuits of each layer.

[0036] Here, the printed circuit board (10) may have at least one element mounting hole (15) formed therein so that the heating surface of the above-described at least one heating element (20) penetrates and protrudes toward the other side, as referenced in FIG. 3a and FIG. 3b.

[0037] At least one heating element (20) is inserted into an element mounting hole (15) on one side of a printed circuit board (10), and a mounting piece (not indicated in the drawing) is mounted on one side of the printed circuit board (10), and the heating surface may protrude toward the other side of the printed circuit board (10). That is, the heating surface of the heating element (20) may protrude further outward than at least the other side of the printed circuit board (10).

[0038] Meanwhile, at least one heating element (20) is a type of electric element that generates a predetermined amount of heat while operating when power is supplied, and for example, in an embodiment of the present invention where the electronic device (1) is an antenna device, it may be one of an Rx and Tx element responsible for outputting and transmitting a signal.

[0039] Meanwhile, the heat dissipation unit (200) can be defined as a configuration that performs the function of dissipating the driving heat generated from the heat-generating element (20) or the heat of the printed circuit board (10) to the other side of the printed circuit board (10), as referenced in FIG. 4.

[0040] Here, the heat dissipation unit (200) may include a heat transfer coin (210, 220) made of copper or brass material, as referenced in FIGS. 2a to 7b, and a heat pipe (230) that receives heat from the heat transfer coin (210) and conducts heat to a predetermined location.

[0041] The heating element (20) may include a first heating element (20) with a relatively large amount of heat and a second heating element with a relatively small amount of heat (not shown here, see reference numeral 21 in FIG. 9a). The first heating element (20) may be positioned protrudingly on one side of the printed circuit board (10) and may penetrate the element penetration hole (15). The second heating element may be installed on one side of the printed circuit board (10) and positioned protrudingly on one side of the printed circuit board (10).

[0042] The heat transfer coin (210, 220) may include a first heat transfer coin (210) that receives heat from a first heating element (20) and a second heat transfer coin (220) that receives heat from a second heating element (not shown).

[0043] A heating element (20) may be protruded and disposed on one side of a printed circuit board (10), and a heat transfer coin (210, 220) may be disposed such that one side of the heat transfer coin (210, 220) is in contact with the opposite side of the heating element (20) among the other sides of the printed circuit board (10). Here, the opposite side of the heating element (20) refers to the opposite part corresponding to the side on which the heating element (20) is disposed, and one side of the heat transfer coin (210, 220) may be in contact with the part corresponding to the side on which the heating element (20) is disposed among the other sides of the printed circuit board (10).

[0044] The heat transfer coin (210, 220) may be formed of a metal material with excellent heat dissipation performance. In this embodiment, the heat transfer coin (210, 220) may be arranged so that one side is in contact with the other side of the printed circuit board (10). Here, the first heat transfer coin (210) may have one side placed on the other side of the printed circuit board (10) to cover the component mounting hole (15).

[0045] The heat transfer coin (210, 220) is formed in the shape of a square plate in this embodiment, but it is not necessarily formed in the shape of a square plate, and may be formed in at least one plate shape among a circular plate and a polygonal plate (triangular plate, pentagonal plate, hexagonal plate, etc.).

[0046] The heat pipe (230) can receive heat directly from either one of the heat transfer coins (210, 220) (210, the first heat transfer coin) by taking into account the heat generation amount of the heat transfer coins (210, 220), and although not shown in the drawing, it is also possible to be configured to receive heat by connecting to all of the heat transfer coins (210, 220). Below, the heat pipe (230) will be described mainly in an embodiment in which it is connected only to the first heat transfer coin (210) among the first heat transfer coin (210) and the second heat transfer coin (220).

[0047] A heating surface of the first heating element (20) may be placed in contact with one side of the first heat transfer coin (210), and one end of the heat pipe (230) may be placed in contact with the other side of the first heat transfer coin (210). The other end of the heat pipe (230) may be placed protruding outward from the printed circuit board (10) in a direction parallel to the other side of the printed circuit board (10) (left-right direction in the drawing of FIG. 2b). The heat pipe (230) may be formed in a straight line.

[0048] A heating surface receiving groove (215) for receiving a heating surface of a heating element (20) may be formed on one side of the first heat transfer coin (210). A portion of the end including the heating surface of the heating element (20) may be received in the heating surface receiving groove (215). More specifically, on the other side of the printed circuit board (10), the heating surface of the heating element (20), which is mounted and arranged to penetrate the element mounting hole (15), protrudes to the other side by a predetermined length, and while one side of the heat transfer coin (210) is in surface contact with the other side of the printed circuit board (10), the protruding heating surface of the heating element (20) is received and seated inside the heating surface receiving groove (215), thereby allowing surface thermal contact.

[0049] Here, the heat transfer coins (210, 220), although not shown in the drawing, can be bonded to the other side of the printed circuit board (10) by a conductive adhesive. The conductive adhesive (not shown) is made of a heat-conducting material, and by bonding the other side of the printed circuit board (10) and the heat transfer coins (210, 220) to each other, the heat conduction performance of heat transferred from the printed circuit board (10) can be improved.

[0050] In particular, since the heat transfer coin (210) is joined so as not to overlap horizontally with the other side of the printed circuit board (10), there is no need to separately groove the printed circuit board (10) for installation of the heat transfer coin (210) on the other side of the printed circuit board (10), thus having the advantage of reducing assembly time and shortening the manufacturing time of the printed circuit board (10).

[0051] Meanwhile, the heating surface of the heating element (20) is received and seated in the heating surface receiving groove (215) of the heat transfer coin (210), so that the driving heat generated from the heating element (20) is directly transferred to the heat transfer coin (210), and the heat transferred to the heat transfer coin (210) can be dissipated by transferring it through the heat pipe (230) described above or directly to a metal housing not shown.

[0052] Referring to FIG. 3a, the printed circuit board (10) may include a plurality of sections (S1, S2, S3, S4) separated in a direction parallel to one side of the printed circuit board (10) (left-right direction in FIG. 3a) by a plating portion that forms a circuit printed on one side of the printed circuit board (10). In this embodiment, the plurality of sections (S1, S2, S3, S4) are separated at equal intervals from each other, but they do not necessarily have to be separated at equal intervals and may be separated at various intervals.

[0053] In this embodiment, the plurality of sections (S1, S2, S3, S4) are formed as four, but the number of the plurality of sections (S1, S2, S3, S4) is not limited to four, and it is possible to form at least two or more plurality of sections. Hereinafter, the description will be limited to the plurality of sections (S1, S2, S3, S4) being formed as four.

[0054] A plurality of sections (S1, S2, S3, S4) may include a first section (S1), a second section (S2), a third section (S3), and a fourth section (S4).

[0055] The first section (S1) may be placed at the far left of the printed circuit board (10). The first section (S1) may be placed to the left of the second section (S2) on the printed circuit board (10).

[0056] The second section (S2) may be positioned to the right of the first section (S1) on the printed circuit board (10). The second section (S2) may be positioned to the left of the third section (S3) on the printed circuit board (10). The second section (S2) may be positioned between the first section (S1) and the third section (S3) on the printed circuit board (10).

[0057] The third section (S3) may be positioned to the right of the second section (S2) on the printed circuit board (10). The third section (S3) may be positioned to the left of the fourth section (S4) on the printed circuit board (10). The third section (S3) may be positioned between the second section (S2) and the fourth section (S4) on the printed circuit board (10).

[0058] The fourth section (S4) may be placed to the right of the third section (S3) on the printed circuit board (10). The fourth section (S4) may be placed to the far right on the printed circuit board (10).

[0059] The device mounting hole (15) may be formed as a plurality of device mounting holes (15). The plurality of device mounting holes (15) may be formed one by one in a plurality of sections (S1, S2, S3, S4). That is, the plurality of device mounting holes (15) may include a first device mounting hole (15A) formed in the first section (S1), a second device mounting hole (15B) formed in the second section (S2), a third device mounting hole (15C) formed in the third section (S3), and a fourth device mounting hole (15D) formed in the fourth section (S4).

[0060] The first heating element (20) may be formed by a plurality of first heating elements (20). Each of the plurality of first heating elements (20) may penetrate each of the plurality of element mounting holes (15). That is, the plurality of first heating elements (20) may include a first-1 heating element (20A) penetrating the first element mounting hole (15A), a first-2 heating element (20B) penetrating the second element mounting hole (15B), a first-3 heating element (20C) penetrating the third element mounting hole (15C), and a first-4 heating element (20D) penetrating the fourth element mounting hole (15D).

[0061] The first heat transfer coin (210) may be formed from a plurality of first heat transfer coins (210). The heating surface of each of the plurality of first heat transfer coins (210) may be in contact with one side of each of the plurality of first heating elements (20). That is, the plurality of first heat transfer coins (210) may include a first-1 heat transfer coin (210A) in which the heating surface of the first-1 heating element (20A) is in contact, a first-2 heat transfer coin (210B) in which the heating surface of the first-2 heating element (20B) is in contact, a first-3 heat transfer coin (210C) in which the heating surface of the first-3 heating element (20C) is in contact, and a first-4 heat transfer coin (210D) in which the heating surface of the first-4 heating element (20D) is in contact.

[0062] A heating surface receiving groove (215) can be formed on one side of each of a plurality of first heat transfer coins (20). That is, the heating surface receiving groove (215) may include a first heating surface receiving groove (215A) formed on one side of the first-1 heat transfer coin (210A) to receive the heating surface of the first-1 heating element (20A), a second heating surface receiving groove (215B) formed on one side of the first-2 heat transfer coin (210B) to receive the heating surface of the first-2 heating element (20B), a third heating surface receiving groove (215C) formed on one side of the first-3 heat transfer coin (210C) to receive the heating surface of the first-3 heating element (20C), and a fourth heating surface receiving groove (215D) formed on one side of the first-4 heat transfer coin (210D) to receive the heating surface of the first-4 heating element (20D).

[0063] The above second heating element (not shown) may be formed of a plurality of second heating elements. The plurality of second heating elements may be installed one by one on one side of a plurality of sections (S1, S2, S3, S4). That is, the plurality of second heating elements may include a 2-1 heating element installed on one side of the first section (S1), a 2-2 heating element installed on one side of the second section (S2), a 2-3 heating element installed on one side of the third section (S3), and a 2-4 heating element installed on one side of the fourth section (S3).

[0064] The second heat transfer coin (220) may be formed from a plurality of second heat transfer coins (220). That is, the plurality of second heat transfer coins (220) may include a second-1 heat transfer coin (220A) disposed on the opposite side of the second-1 heating element on the other side of the printed circuit board (10), a second-2 heat transfer coin (220B) disposed on the opposite side of the second-2 heating element on the other side of the printed circuit board (10), a second-3 heat transfer coin (220C) disposed on the opposite side of the second-3 heating element on the other side of the printed circuit board (10), and a second-4 heat transfer coin (220D) disposed on the opposite side of the second-4 heating element on the other side of the printed circuit board (10).

[0065] The heat pipe (230) may be provided with a plurality of heat pipes (230) that are arranged in contact with each other side of a plurality of first heat transfer coins (210). That is, the plurality of heat pipes (230) may include a pair of first heat pipes (230A) arranged in contact with the other side of a first heat transfer coin (210A), a pair of second heat pipes (230B) arranged in contact with the other side of a second heat transfer coin (210B), a pair of third heat pipes (230C) arranged in contact with the other side of a third heat transfer coin (210C), and a pair of fourth heat pipes (230D) arranged in contact with the other side of a fourth heat transfer coin (210D).

[0066] When an electronic device (1) according to one embodiment of the present invention is implemented as an antenna device, it may further include a shield cover (100), as referenced in FIGS. 2a to 3b. The shield cover (100) can prevent the leakage of a signal generated from a signal-related heat-generating element (20) mounted on a printed circuit board (10).

[0067] The shield cover (100) may be provided with a grid-shaped shield cover wall (103) that forms a predetermined space (C) containing at least one heating element (20) on the surface facing the printed circuit board (10). The predetermined space (C) may be covered by the shield cover wall (103) and one surface of the printed circuit board (10). Such a shield cover (100) can perform the function of preventing signal leakage so that there is no interference between the heating element (20) in the predetermined space (C) and external signals.

[0068] Meanwhile, a cover screw through-hole (101) through which an assembly screw (not shown) described later passes is formed in the shield cover (100), and a board screw through-hole (11) is formed in the printed circuit board (10) so that the assembly screw passing through the cover screw through-hole (101) of the shield cover (100) passes through sequentially, and a screw fastening hole (211) in which the assembly screw is fastened can be formed in at least the first heat transfer coin (210) among the heat transfer coins (210, 220). Here, the assembly screw can be finally fastened to the metal housing (5, see FIG. 8a) when a metal housing is provided, such as in the electronic device (1a) according to another embodiment described later.

[0069] Here, the heating surface of the heating element (20) and the mutual bonding surface of the heat transfer coin (210) are closely bonded by the assembly force of the assembly screw, so that the thermal contact resistance from the heating element (20) to the heat transfer coin (210) can be minimized.

[0070] In this way, the electronic device (1) according to one embodiment of the present invention has the advantage of preventing a decrease in overall heat dissipation performance, in that it is not necessary to employ a multi-layer printed circuit board (10) having a thickness of at least a predetermined thickness (e.g., 2.5 mm or more) for the installation of at least a heat transfer coin (210, 220) among the heat dissipation unit (200), and it is possible to employ a printed circuit board (10) having a thin thickness of less than a predetermined thickness (e.g., 1.6 mm or less) which facilitates heat transfer to both sides.

[0071] Furthermore, since there is no need for the heat transfer coins (210, 220) among the heat dissipation units (200) to be installed in an embedded form on the printed circuit board (10), the heat transfer coins (210, 220) can be easily attached using a thermal conductive adhesive without groove processing on the other side of the printed circuit board (10), thus having the advantage of shortening the assembly time of the entire product.

[0072] FIGS. 8a and 8b are perspective views showing an electronic device according to another embodiment of the present invention, FIGS. 9a and 9b are exploded perspective views of FIGS. 8a and 8b, FIG. 10 is a plan view of FIGS. 8a and 8b, FIG. 11 is a cross-sectional view taken along line BB of FIG. 10, and FIG. 12 is a cutaway perspective view taken along line BB of FIG. 10.

[0073] An electronic device (1a) according to another embodiment of the present invention may include a metal housing (5) having an internal installation space (5s) as referenced in FIGS. 8a to 12.

[0074] The metal housing (5) is formed of a metal material with excellent thermal conductivity, and a plurality of heat sink fins (5a) may be integrally formed on the back side. The plurality of heat sink fins (5a) may be formed such that a plurality of fins formed long in the vertical direction are spaced apart in the left and right directions.

[0075] Meanwhile, on the inner surface of the installation space (5s, see FIG. 9a) of the metal housing (5), a seating groove (6, see FIG. 11) into which a heat transfer coin (210, 220) described later is fully inserted may be formed.

[0076] Additionally, an electronic device (1a) according to another embodiment of the present invention may further include a printed circuit board (10) that is laminated on the inner surface of the installation space (5s) of a metal housing (5) and has a component mounting hole (15) formed to penetrate in the front-rear direction.

[0077] Here, the mounting form of the heating element (20, 21) (especially the first heating element (20)) described later in the element mounting hole (15) is the same as that of the electronic device (1) according to the above-described embodiment of the present invention, so a detailed description thereof is omitted. However, among the heating elements (20, 21) described later, the second heating element (21) is an electrical component with a relatively low amount of heat (for example, in the case of a signal-related component of an antenna device, an Rx element (LNA) may correspond thereto), and can be directly mounted on the front surface of the printed circuit board (10) without the provision of the element mounting hole (15).

[0078] An electronic device (1a) according to another embodiment of the present invention may include at least one heating element (20, hereinafter referred to as the 'first heating element (20)') mounted on one side of a printed circuit board (10) such that the heating surface is exposed to the other side of the printed circuit board (10) by penetrating the element mounting hole (15) of the printed circuit board (10), as referenced in FIG. 9a. In addition, an electronic device (1a) according to another embodiment of the present invention may further include a second heating element (21) which is directly mounted on the front surface of the printed circuit board (10) without the element mounting hole (15), unlike the first heating element (20).

[0079] When an electronic device (1a) according to another embodiment of the present invention is implemented as an antenna device, the first heating element (20) may be a Tx element (Tr, Da element) with a relatively high amount of heat among signal-related components, and the second heating element (21) may be an Rx element (LNA element) with a relatively low amount of heat among signal-related components.

[0080] Here, it is preferable that the first heating element (20) is mounted such that its heating surface penetrates the element mounting hole (15) and is exposed to the other side of the printed circuit board (10), and that the heating surface of the first heating element (20) and the other side of the printed circuit board (10) form the same surface.

[0081] Meanwhile, an electronic device (1a) according to another embodiment of the present invention may further include a heat transfer coin (210, 220) that is coupled to the other side of a printed circuit board (10) and is coupled to the exposed heating surface of a first heating element (20) in surface heat contact.

[0082] Here, the heat transfer coin (210, 220) may include a first heat transfer coin (210) provided to correspond to the position of the first heating element (20) to receive heat from the first heating element (20), and a second heat transfer coin (220) provided to correspond to the position of the second heating element (21) to receive heat from the second heating element (21).

[0083] The first heat transfer coin (210) is positioned to make direct surface thermal contact with the heating surface of the first heating element (20), whereas the second heat transfer coin (210) does not make direct surface thermal contact with the second heating element (20), but can be attached to the other surface corresponding to the opposite surface of the printed circuit board (10) on which the second heat transfer coin (210) is mounted, via the aforementioned thermal conductive adhesive. Here, the first heat transfer coin (210) and the second heat transfer coin (220) may also be made of copper or brass, which are metal materials with excellent thermal conductivity, as described in the electronic device (1) according to the above-described embodiment of the present invention.

[0084] Meanwhile, an electronic device (1a) according to another embodiment of the present invention may further include a shield cover (100) coupled to the front end of a metal housing (5) to cover one side of a printed circuit board (10), as referenced in FIGS. 8a to 12.

[0085] As in the embodiment already described above, the shield cover (100) has a shield cover wall (not shown in the drawing) formed on its back surface, and provides a predetermined space (C) in which a first heating element (20) and a second heating element (21) are accommodated between the front surface of the printed circuit board (10), and can perform the function of preventing internal signals from leaking out in the predetermined space (C).

[0086] A metal housing (5) may have one side facing the other side of a printed circuit board (10) open, and the printed circuit board (10) may be inserted into an installation space (5s) of the metal housing (5) through the open side of the metal housing (5), and a shield cover (100) may cover the open side of the metal housing (5) after the printed circuit board (10) is inserted into the installation space (5s) of the metal housing (5).

[0087] Meanwhile, a substrate screw through-hole (11) through which at least one substrate assembly screw (10s) passes is formed in the printed circuit board (10), and a substrate screw fastening hole (5h) through which the substrate assembly screw (10s) passes through the printed circuit board (10) may be formed in the metal housing (5).

[0088] Additionally, at least one cover assembly screw (100s) is formed in the shield cover (100) through which the cover assembly screw (100s) passes, and the shield cover (100) can be installed in the metal housing (5) by the operation of the cover assembly screw (100s) passing through the cover screw through hole (100h) of the shield cover (100) and the printed circuit board (10) and fastening to the cover screw fastening hole (5h') formed in the metal housing (5).

[0089] Here, the heat transfer coin (210, 220) can be closely coupled to the other side of the printed circuit board (10) by means of a board assembly screw (10s) that penetrates the printed circuit board (10) and is fastened to a board screw fastening hole (5h) provided on the inner side of the metal housing (5).

[0090] In this way, the electronic device (1a) according to another embodiment of the present invention also has a difference in that it is further equipped with a metal housing (5) compared to the above-described embodiment, but in order to install the first heat transfer coin (210) and the second heat transfer coin (220) equipped with a heat dissipation unit (200) on the printed circuit board (10), it is not necessary to use a printed circuit board (10) with a thickness of at least a predetermined thickness (2.5 mm), and since no separate groove processing is required, assembly time is shortened and a thin thickness (e.g., 1.6 mm) can be used, thereby providing the advantage of improving heat dissipation performance on both sides of the printed circuit board (10).

[0091] For the above, embodiments of an electronic device according to the present invention have been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the embodiments described above, and it is obvious that various modifications and implementations within an equivalent scope are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the rights of the present invention shall be determined by the claims set forth below. Explanation of the symbols

[0092] 1, 1a : Electronic device 5 : Metal housing 5s: Installation space 5h: PCB screw through-holes 10: Printed circuit board 15: Component mounting holes 20, 21 : Heating element 100 : Shield cover 210, 220: Heat transfer coin 230: Heat pipe

Claims

Claim 1 An electronic device comprising: a printed circuit board having a heating element disposed on one surface; a heat transfer coin installed such that one surface is in contact with the opposite side of the printed circuit board opposite to the heating element, thereby dissipating heat generated from the heating element; and a shield cover covering one surface of the printed circuit board to prevent leakage of a signal generated from the heating element; wherein the heat transfer coin is closely coupled to the other surface of the printed circuit board by means of an assembly screw penetrating the shield cover and the printed circuit board. Claim 2 An electronic device according to claim 1, wherein the printed circuit board has a component mounting hole through which a heating element passes, and the heat transfer coin covers the component mounting hole and the heating surface of the heating element contacts one surface. Claim 3 An electronic device according to claim 1, wherein the heat transfer coin is formed of copper or brass material. Claim 4 An electronic device according to claim 1, further comprising a straight heat pipe having one end disposed in contact with the other side of the heat transfer coin and the other end disposed protruding outward in a direction parallel to the other side of the printed circuit board. Claim 5 An electronic device according to claim 2, wherein the heat transfer coin has a heating surface receiving groove formed therein, in which a portion of the end including the heating surface of the heating element is received. Claim 6 An electronic device according to claim 1, wherein the heat transfer coin is surface-bonded to the other side of the printed circuit board by a conductive adhesive. Claim 7 An electronic device according to claim 1 or claim 6, wherein the heat transfer coin is closely coupled to the other side of the printed circuit board by means of an assembly screw penetrating the printed circuit board. Claim 8 delete Claim 9 An electronic device according to claim 1, wherein the printed circuit board is formed by laminating a multi-layer structure and has a thickness of 1.6 mm or less. Claim 10 An electronic device according to claim 2, wherein the printed circuit board comprises a plurality of sections separated in a direction parallel to one side of the printed circuit board by a plating portion forming a circuit printed on one side of the printed circuit board, the component mounting hole is formed by one being formed in each of the plurality of sections to form a plurality of component mounting holes, the heating element is formed by a plurality of heating elements penetrating each of the plurality of component mounting holes, and the heat transfer coin is formed by a plurality of heat transfer coins in which the heating surface of each of the plurality of heating elements contacts one side. Claim 11 An electronic device comprising: a metal housing having an internal installation space; a printed circuit board laminated on the inner surface of the metal housing and having a heating element disposed on one surface; a heat transfer coin installed such that one surface is in contact with the opposite side of the printed circuit board opposite to the heating element to dissipate heat generated from the heating element; and a shield cover covering one surface of the printed circuit board to prevent leakage of a signal generated from the heating element; wherein the heat transfer coin is closely coupled to the other surface of the printed circuit board by means of an assembly screw penetrating the shield cover and the printed circuit board. Claim 12 An electronic device according to claim 11, wherein a seating groove into which the heat transfer coin is fully inserted is formed on the inner surface of the metal housing. Claim 13 delete

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