Display apparatus

KR103021296B1Active Publication Date: 2026-09-16LG DISPLAY CO LTD
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Patent Information

Application Number
KR1020210185235
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-22
Publication Date
2026-09-16
Estimated Expiration
2041-12-22

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Abstract

According to an embodiment of the present specification, the resistance of the cathode electrode can be reduced by utilizing the difference in deposition characteristics between the organic light-emitting layer and the cathode electrode to bring the cathode electrode into contact with the auxiliary electrode through the eaves structure. Accordingly, according to the embodiments of the present specification, by reducing the resistance of the cathode electrode to reduce the occurrence of a low-potential power rise phenomenon, the occurrence of brightness non-uniformity in the display device can be reduced.
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Description

Technology Field

[0001] The present specification provides a display device capable of reducing luminance non-uniformity. Background Technology

[0002] Display devices can be implemented in various forms, such as Liquid Crystal Displays (LCDs), Organic Light Emitting Displays (OLEDs), and Micro Light Emitting Displays.

[0003] Among these, since the organic light-emitting display device includes an organic light-emitting element, which is a self-emissive device, a separate light source is not required, allowing the thickness and weight of the display device to be significantly reduced.

[0004] An organic light-emitting display device may have a structure including an organic light-emitting element that emits light between an anode electrode and a cathode electrode.

[0005] The region where the organic light-emitting diode contacts the anode electrode and the cathode electrode may be a light-emitting part that emits light.

[0006] Organic light-emitting display devices can be classified into bottom-emission OLEDs, where light emitted from the light-emitting part comes out in the direction where the substrate is placed; top-emission OLEDs, where light comes out in the opposite direction to where the substrate is placed; and double-sided or transparent OLEDs, where light comes out in both directions. The problem to be solved

[0007] Meanwhile, in the case of a top-side emitting type or a double-sided emitting type, the transmittance of the cathode electrode, which is the upper electrode placed on the top of the organic light-emitting element, can be increased to emit light emitted from the emitting part in an upward direction.

[0008] For example, the cathode electrode can be used as a transparent electrode or a semi-transparent electrode.

[0009] Even in the case of a transparent light-emitting type that includes a light-emitting part and a transparent part, the cathode electrode can be formed as a transparent-like transparent electrode to implement the transparent part.

[0010] Accordingly, the cathode electrode can be formed from a material with high transmittance, but generally, materials with high transmittance tend to have high electrical resistance.

[0011] In addition, the thickness of the cathode electrode can be made thin to improve transmittance, but as the thickness of the cathode electrode decreases, the electrical resistance of the cathode electrode also increases.

[0012] As the resistance of the cathode electrode increases in this way, the brightness of the display device may become uneven due to the low-potential power rise (VSS Rising) phenomenon.

[0013] Accordingly, the inventors of this specification have invented a display device capable of reducing the occurrence of luminance non-uniformity by reducing the low-voltage power rise (VSS Rising) phenomenon through various experiments.

[0014] The problem to be solved according to the embodiments of the present specification is to provide a display device capable of reducing the occurrence of luminance non-uniformity.

[0015] The problem to be solved according to the embodiments of the present specification is to provide a display device that can reduce deformation, tearing defects, or lifting defects of each layer in the contact area between the cathode electrode and the auxiliary electrode.

[0016] The problem to be solved according to the embodiments of the present specification is to provide a display device having a structure that facilitates processes such as cleaning in the contact area between the cathode electrode and the auxiliary electrode.

[0017] The problem to be solved according to the embodiments of the present specification is to provide a display device capable of reducing the occurrence of electrostatic failure in the contact area between the cathode electrode and the auxiliary electrode.

[0018] The problem to be solved according to the embodiments of the present specification is to provide a display device capable of reducing contact failure between a cathode electrode and an auxiliary electrode without being affected by the mobility and orientation of the substrate during the process.

[0019] The problem to be solved according to the embodiments of the present specification is to provide a display device capable of forming an auxiliary electrode structure that facilitates contact of the cathode electrode in the contact area between the cathode electrode and the auxiliary electrode.

[0020] The problems to be solved according to the embodiments of this specification are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0021] A display device according to an embodiment of the present specification includes a substrate, an auxiliary electrode disposed on the substrate, a passivation layer disposed on the auxiliary electrode and including a first hole in which at least a portion of the auxiliary electrode is exposed, an overcoat layer disposed on the passivation layer and including a second hole in which at least a portion of the auxiliary electrode is exposed, and a bank layer disposed on the overcoat layer and including a third hole in which at least a portion of the auxiliary electrode is exposed.

[0022] In this case, the first hole, the second hole, and the third hole are arranged so that at least a portion of them overlap each other, and the first hole and the second hole are arranged to intersect in the first direction and the second direction, respectively, with respect to the center.

[0023] Additionally, a display device according to an embodiment of the present specification includes a substrate, an auxiliary electrode disposed on the substrate, a passivation layer disposed on the auxiliary electrode, an overcoat layer disposed on the passivation layer, a bank layer disposed on the overcoat layer, an organic light-emitting layer disposed on the bank layer, and a cathode electrode disposed on the organic light-emitting layer.

[0024] In this case, the auxiliary electrode includes an auxiliary electrode contact portion in which at least a portion is exposed through holes penetrating the passivation layer, the overcoat layer, and the bank layer, and the organic light-emitting layer and the cathode electrode are arranged to extend to the auxiliary electrode contact portion, and the overcoat layer surrounding the auxiliary electrode contact portion includes a pair of overcoat eaves structures. Effects of the invention

[0025] According to an embodiment of the present specification, the resistance of the cathode electrode can be reduced by utilizing the difference in deposition characteristics between the organic light-emitting layer and the cathode electrode to bring the cathode electrode into contact with the auxiliary electrode through the eaves structure.

[0026] Accordingly, according to the embodiments of the present specification, by reducing the resistance of the cathode electrode to reduce the occurrence of a low-potential power rise phenomenon, the occurrence of brightness non-uniformity in the display device can be reduced.

[0027] In addition, according to an embodiment of the present specification, when forming an eaves structure for contacting a cathode electrode and an auxiliary electrode, a passivation layer, an overcoat layer, and a bank layer are stacked in sequence, and the overcoat layer may include a pair of overcoat eaves structures, and a bank protrusion may be disposed on the overcoat eaves structure.

[0028] Accordingly, according to the embodiments of the present specification, since the overcoat layer rather than the bank layer is placed on the passivation layer, the occurrence of tearing defects caused by adhesion problems between the bank layer and the passivation layer can be reduced, and since the bank layer is placed on the overcoat layer, the deformation of the overcoat layer due to stress or the lifting phenomenon of the overcoat eaves structure can be reduced.

[0029] In addition, according to an embodiment of the present specification, when forming a ridge structure for contacting a cathode electrode and an auxiliary electrode, the ridge structure is formed as an overcoat layer and a bank layer is formed on the overcoat layer, so that the thickness of the ridge structure can be substantially increased, thereby forming a robust structure that is easy to process such as cleaning.

[0030] In addition, according to an embodiment of the present specification, when forming a ridge structure for contacting a cathode electrode and an auxiliary electrode, the ridge structure is formed as an overcoat layer composed of a non-conductive material and a bank layer is formed on the overcoat layer, thereby reducing the occurrence of electrostatic failures that may occur in the area.

[0031] In addition, according to an embodiment of the present specification, when forming an eaves structure for contacting a cathode electrode and an auxiliary electrode, the hole in the passivation layer includes a pair of undercut portions on both sides with respect to the center in a symmetrical structure, thereby reducing the possibility of defects occurring depending on the direction of movement of the substrate during the process of forming an organic light-emitting layer.

[0032] In addition, according to an embodiment of the present specification, since the holes of the passivation layer, the holes of the overcoat layer, and the holes of the bank layer are located on the inner side of an auxiliary electrode having a flattened surface, the undercut portion can also be located on the flattened surface of the auxiliary electrode, thereby reducing the curvature of the undercut portion area and allowing the cathode electrode to contact the auxiliary electrode without interruption.

[0033] The effects of this specification are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0034] FIG. 1 is a plan view of a display device according to an embodiment of the present specification. FIG. 2 is an enlarged plan view of a display device including a light-emitting part and a transparent part according to an embodiment of the present specification. FIG. 3a is a cross-sectional view corresponding to a part of a display device according to an embodiment of the present specification, FIG. 3b is an enlarged cross-sectional view of a region corresponding to an auxiliary electrode part, and FIG. 3c is an enlarged plan view of a region corresponding to an auxiliary electrode part. Figure 4 is a diagram comparing the normal and defective contact areas between the auxiliary electrode and the cathode electrode according to the transfer direction of the substrate of the display device. FIG. 5 is an enlarged plan view of a display device including a light-emitting part and a transparent part according to another embodiment of the present specification. FIG. 6a is a cross-sectional view corresponding to a portion of a display device according to another embodiment of the present specification, FIG. 6b is an enlarged cross-sectional view of a portion corresponding to an auxiliary electrode portion, and FIG. 6c is an enlarged plan view of a portion corresponding to an auxiliary electrode portion. Figures 7a and 7b are drawings comparing a normal part and a defective part of the eaves structure of the bank layer, respectively, in which tearing did not occur. Figures 8a and 8b are drawings comparing a normal part and a defective part in which the lifting phenomenon of the eaves structure of the overcoat layer did not occur, respectively. Specific details for implementing the invention

[0035] The advantages and features of this specification and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of this specification is complete and to fully inform those skilled in the art of the scope of the invention, and this specification is defined only by the scope of the claims.

[0036] Shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are exemplary and are not limited to the depicted matters. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing this specification, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of this specification, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in this specification, other parts may be added unless "only" is used. Where a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise.

[0037] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0038] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used.

[0039] In the case of an explanation of a temporal relationship, for example, when a temporal sequence is explained using 'after', 'following', 'next', 'before', etc., it may include cases where the sequence is not continuous unless 'immediately' or 'directly' is used.

[0040] Although terms such as "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of this specification.

[0041] The features of each of the various embodiments of this specification may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0042] Below, various configurations of a display device capable of reducing luminance non-uniformity will be described in detail.

[0043] FIG. 1 is a plan view of a display device according to an embodiment of the present specification.

[0044] In the following, a transparent organic light-emitting diode (OLED) that includes a transparent portion and emits light by an organic light-emitting element is described as an example, but the display device according to the embodiments of this specification is not limited thereto.

[0045] A display device (1) includes a substrate (110), and the substrate (110) may include a display area (DA) and a non-display area (NDA) arranged to surround the display area (DA).

[0046] The display area (DA) may include one or more light-emitting parts (EA) and one or more transparent parts (TA) arranged in a matrix form.

[0047] For example, the light-emitting unit (EA) may include a first subpixel (SP1), a second subpixel (SP2), and a third subpixel (SP3) that each implement red (R), green (G), and blue (B), or may include a first subpixel (SP1), a second subpixel (SP2), a third subpixel (SP3), and a fourth subpixel (SP4) that each implement red (R), green (G), blue (B), and white (W).

[0048] In the non-display area (NDA), one or more data pad sections (DPAD) and gate pad sections (GPAD) may be arranged, to which a data driver or gate driver that applies various signals to the light-emitting part (EA) of the display area (DA) can be connected.

[0049] The following description will be explained with reference to FIGS. 2 and FIGS. 3a to 3c.

[0050] FIG. 2 is an enlarged plan view of a display device including a light-emitting part and a transparent part according to an embodiment of the present specification.

[0051] FIG. 3a is a cross-sectional view corresponding to a part of a display device according to an embodiment of the present specification, FIG. 3b is an enlarged cross-sectional view of a region corresponding to an auxiliary electrode part, and FIG. 3c is an enlarged plan view of a region corresponding to an auxiliary electrode part.

[0052] The substrate (110) is a base substrate of the display device (1), and a glass substrate may be used, but is not limited thereto, and a polyimide substrate having flexible properties may also be used.

[0053] A pad portion (PAD portion), a thin film transistor portion (TFT portion), and an auxiliary electrode portion may be formed on a substrate (110).

[0054] The thin-film transistor section (TFT section) may include a light-emitting section (EA).

[0055] In the thin film transistor section (TFT section), a thin film transistor (TFT) including an active layer (121), a gate electrode (124), a first electrode (126a), and a second electrode (126b) may be disposed on a substrate (110).

[0056] A light-blocking layer (111) that can prevent light from being incident on the active layer (121) of the thin film transistor (TFT) may be disposed between the thin film transistor (TFT) and the substrate (110).

[0057] A buffer layer (113) may be placed between the light-blocking layer (111) and the thin-film transistor (TFT).

[0058] A gate insulating layer (123) capable of insulating the active layer (121) and the gate electrode (124) may be disposed between the active layer (121) and the gate electrode (124).

[0059] A capacitor electrode (122) that forms a capacitor may be disposed so as to overlap with the light-blocking layer (111) on the same layer as the active layer (121).

[0060] An interlayer insulating layer (125) is disposed on the active layer (121) and the gate electrode (124), and the first electrode (126a) and the second electrode (126b) can each be electrically connected to the active layer (121) through contact holes formed in the interlayer insulating layer (125).

[0061] The first electrode (126a) may be a source electrode, and the second electrode (126b) may be a drain electrode.

[0062] The second electrode (126b) may be electrically connected to the light-shielding layer (111) through a contact hole formed in the interlayer insulating layer (125) and the buffer layer (113).

[0063] A light-emitting element including an anode electrode (150), an organic light-emitting layer (170), and a cathode electrode (180) electrically connected to the thin film transistor (TFT) may be disposed on the thin film transistor (TFT).

[0064] A passivation layer (130) made of an inorganic insulating material may be disposed between the thin-film transistor (TFT) and the anode electrode (150).

[0065] Additionally, an overcoat layer (140) made of an organic insulating material may be disposed between the passivation layer (130) and the anode electrode (150).

[0066] The overcoat layer (140) can function as a flattening layer and can allow electrodes and layers placed on top to be evenly formed on the flattened surface.

[0067] The anode electrode (150) can be electrically connected to the second electrode (126b) of the thin-film transistor (TFT) through a contact hole formed in the interlayer insulating layer (125) and the overcoat layer (140).

[0068] Light can be emitted in the region where the anode electrode (150), the organic light-emitting layer (170), and the cathode electrode (180) overlap, and the region where the anode electrode (150), the organic light-emitting layer (170), and the cathode electrode (180) overlap can be defined as a light-emitting portion (EA).

[0069] The organic light-emitting layer (170) may be implemented to emit light of the same color for each pixel, such as white light, for example, or to emit light of different colors for each pixel, such as red, green, or blue light.

[0070] A bank layer (160) is placed at the boundary between each light-emitting part (EA) to reduce the mixing of colors of the light-emitting parts (EA) that display different colors.

[0071] The bank layer (160) may be made of an organic insulating material and may be made of an organic insulating material different from the overcoat layer (140), but is not limited thereto.

[0072] A sealing layer is additionally disposed on the light-emitting element to reduce the penetration of moisture and foreign substances from the outside into the organic light-emitting layer (170).

[0073] The pad section (PAD section) is explained using the gate pad section (GPAD) as an example.

[0074] In the pad portion (PAD portion), a buffer layer (113) may be disposed on the substrate (110), and a pad electrode (324) may be disposed on the buffer layer (113). The pad electrode (324) may be formed of the same material as the gate electrode (124).

[0075] A pad connecting electrode (326) that is electrically connected through a contact hole of the interlayer insulating layer (125) may be disposed on the pad electrode (324).

[0076] The pad connecting electrode (326) can be formed of the same material as the first electrode (126a) and the second electrode (126b).

[0077] A pad contact electrode (350) that is electrically connected through a contact hole of the passivation layer (130) may be disposed on the pad connection electrode (326).

[0078] The pad contact electrode (350) can be formed of the same material as the anode electrode (150).

[0079] Below, the auxiliary electrode section will be explained.

[0080] In the case of the display device (1) according to the embodiment of the present specification, light emitted from the organic light-emitting layer (170) can be emitted in the direction opposite to the direction in which the substrate (110) is placed, in the direction in which the cathode electrode (180) is placed.

[0081] Therefore, the thickness of the cathode electrode (180) can be reduced to increase transmittance.

[0082] The cathode electrode (180) can be formed as a transparent conductive oxide (TCO), such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or ITZO (Indium Tin Zinc Oxide), to form a transparent electrode or a semi-transparent electrode with high transmittance.

[0083] However, if the thickness of the cathode electrode (180) is reduced, the electrical resistance increases, and if it is made of a material with high transmittance, it may have high electrical resistance.

[0084] As the resistance of the cathode electrode (180) increases in this way, a phenomenon in which the brightness of the display device becomes uneven may occur due to the low potential power rising (VSS Rising) phenomenon.

[0085] Accordingly, the display device (1) according to the embodiment of the present specification can reduce the resistance of the cathode electrode (180) by electrically connecting an auxiliary electrode (226) to the cathode electrode (180).

[0086] The auxiliary electrode portion may include an area where the cathode electrode (180) and the auxiliary electrode (226) are in direct contact.

[0087] A buffer layer (113) and an interlayer insulating layer (125) may be disposed on the substrate (110) of the auxiliary electrode part.

[0088] An auxiliary electrode (226) may be placed on the interlayer insulating layer (125).

[0089] The auxiliary electrode (226) can be placed on the same layer as the first electrode (126a) and the second electrode (126b) of the thin-film transistor (TFT) and can be formed of the same material.

[0090] The auxiliary electrode (226) may be composed of copper (Cu), aluminum (Al), molybdenum (Mo), nickel (Ni), titanium (Ti), chromium (Cr) or an alloy thereof, but is not limited thereto.

[0091] A passivation layer (130) including a first hole (130h) may be disposed on the auxiliary electrode (226).

[0092] An overcoat layer (140) including a second hole (140h) may be disposed on the passivation layer (130).

[0093] The second hole (140h) may be formed to have a larger area than the first hole (130h), and the first hole (130h) may be located inside the second hole (140h).

[0094] Additionally, an anode electrode (150) including an anode eaves structure (151) may be disposed on the passivation layer (130).

[0095] The anode electrode (150) of the auxiliary electrode section may be an electrode extended from the anode electrode (150) of the light-emitting section (EA), but is not limited thereto, and may be a separate electrode spaced apart from the anode electrode (150) of the light-emitting section (EA).

[0096] The anode electrode (150) of the auxiliary electrode section and the anode electrode (150) of the light-emitting section (EA) can be formed from the same material and by the same process and placed on the same layer.

[0097] The anode electrode (150) of the auxiliary electrode section may include an anode eaves structure (151) that protrudes a predetermined distance inward from the first hole (130h) of the passivation layer (130).

[0098] An undercut portion (130u) may be formed in the passivation layer (130) corresponding to the lower part of the anode eaves structure portion (151) of the anode electrode (150).

[0099] Since the undercut portion (130u) is formed on the inner side of the first hole (130h), it can correspond to the area where the passivation layer (130) has been removed.

[0100] Since the anode eaves structure (151) protrudes inwardly toward the passivation layer (130), the undercut portion (130u) may be an area that is not exposed to the outside by the anode eaves structure (151) when viewed from the upper direction.

[0101] The first hole (130h) of the passivation layer (130) may include a first center (130c) and a pair of undercut portions (130u) disposed on both sides of the first center (130c).

[0102] A pair of undercut portions (130u) may be positioned facing each other with respect to the first center (130c) and positioned symmetrically to each other.

[0103] In addition, a pair of undercut portions (130u) can be formed in the same shape as each other so as to have a shape that is symmetrical with respect to the first center (130c).

[0104] A bank layer (160) including a third hole (160h) may be disposed on the anode electrode (150) and the overcoat layer (140).

[0105] The third hole (160h) may be formed to have a larger area than the first hole (130h) and the second hole (140h), and the first hole (130h) and the second hole (140h) may be located inside the third hole (160h).

[0106] The third hole (160h) of the bank layer (160) can be exposed to the outside without covering the anode eaves structure (151) of the auxiliary electrode part.

[0107] In the area where a pair of undercut portions (130u) are not formed, a passivation step portion (130s), an overcoat step portion (140s), and a bank step portion (160s) may be formed to be stacked in sequence.

[0108] For example, an overcoat layer (140) including an overcoat step portion (140s) that exposes the passivation step portion (130s) may be disposed on a passivation layer (130) that includes a passivation step portion (130s), and a bank layer (160) including an overcoat step portion (140s) that exposes the bank step portion (160s) may be disposed on the overcoat layer (140) that includes the overcoat step portion (140s).

[0109] The bank step section (160s), the overcoat step section (140s), and the passivation step section (130s) can be positioned in order close to the auxiliary electrode (226).

[0110] That is, the passivation step portion (130s) can be positioned closest to the auxiliary electrode (226), and the bank step portion (160s) can be positioned furthest from the auxiliary electrode (226).

[0111] In addition, the bank step section (160s), the overcoat step section (140s), and the passivation step section (130s) are all formed to have a regular taper shape so as to have a stepped stacked shape.

[0112] An organic light-emitting layer (170) may be formed on the bank layer (160), and a cathode electrode (180) may be formed on the organic light-emitting layer (170).

[0113] The auxiliary electrode (226) may have an auxiliary electrode contact portion (226c) on the surface exposed by the first hole (130h).

[0114] An organic light-emitting layer (170) and a cathode electrode (180) are formed on the auxiliary electrode contact portion (226c) so that they can come into contact with each other.

[0115] The auxiliary electrode (226) can be electrically connected to the low-potential power wiring (VSSL) passing through the display area (DA).

[0116] For example, the auxiliary electrode (226) may be formed integrally with the low-potential power wiring (VSSL) and may be formed to protrude from the low-potential power wiring (VSSL) in the direction of the transmission portion (TA).

[0117] The low potential power wiring (VSSL) is arranged to overlap with the bank layer (160) so as not to overlap with the light-emitting part (EA) and the transmission part (TA), and can supply low potential power (VSS) by being electrically connected to the light-emitting part (EA).

[0118] In this way, since the low-potential power wiring (VSSL) is arranged to overlap with the bank layer (160) rather than overlapping with the light-emitting part (EA) and the transmission part (TA), the loss of the light-emitting area and transmission area due to the low-potential power wiring (VSSL) can be reduced.

[0119] According to an embodiment of the present specification, in order to electrically connect the auxiliary electrode (226) and the cathode electrode (180) at the auxiliary electrode contact portion (226c), an anode eaves structure portion (151) having different deposition characteristics and eaves structure of the organic light-emitting layer (170) and the cathode electrode (180) may be used.

[0120] The organic light-emitting layer (170) and the cathode electrode (180) can be formed using a deposition process, and the organic light-emitting layer (170) and the cathode electrode (180) can be formed to extend along the bank step portion (160s), the overcoat step portion (140s), and the passivation step portion (130s) and formed on the auxiliary electrode contact portion (226c).

[0121] Since the organic light-emitting layer (170) has strong linearity during deposition, the distance it penetrates to the undercut portion (130u), which is the lower region of the anode eaves structure (151), is short, but since the cathode electrode (180) does not have strong linearity, the distance it penetrates to the undercut portion (130u), which is the lower region of the anode eaves structure (151), can be long.

[0122] Therefore, the cathode electrode (180) can be directly contacted with the auxiliary electrode contact portion (226c) at the undercut portion (130u), so that the cathode electrode (180) can be electrically connected to the auxiliary electrode (226).

[0123] Since the anode eaves structure (151) is spaced apart from the lower auxiliary electrode (226) by a predetermined distance, the organic light-emitting layer (170) and the cathode electrode (180) formed on the anode eaves structure (151) cannot extend to the auxiliary electrode contact part (226c) and the connection may be severed at the anode eaves structure (151).

[0124] According to the embodiment of the present specification as described above, the resistance of the cathode electrode (180) can be reduced by utilizing the difference in deposition characteristics between the organic light-emitting layer (170) and the cathode electrode (180) to bring the cathode electrode (180) into contact with the auxiliary electrode (226) through the eaves structure.

[0125] Accordingly, according to the embodiment of the present specification, the resistance of the cathode electrode (180) is reduced to reduce the occurrence of a low-potential power rise phenomenon, thereby reducing the occurrence of a brightness non-uniformity phenomenon of the display device.

[0126] In addition, according to an embodiment of the present specification, when forming an eaves structure for contacting the cathode electrode (180) and the auxiliary electrode (226), the first hole (130h) of the passivation layer (130) includes a pair of undercut portions (130u) on both sides with respect to the first center (130c) in a symmetrical structure, so that the possibility of defects occurring according to the direction of movement of the substrate can be reduced in the process of forming the organic light-emitting layer (170).

[0127] Referring to FIG. 4, a passivation layer (130) is disposed on an auxiliary electrode (226), and an anode electrode (150) including an anode eaves structure (151) is disposed to protrude on the passivation layer (130) to form an undercut portion (130u) at the bottom. In this structure, the contact failure between the auxiliary electrode (226) and the cathode electrode (180) due to the transfer of the substrate during the deposition process of an organic light-emitting diode is compared and illustrated.

[0128] When forming an organic light-emitting layer (170) on an anode electrode (150) including an anode eaves structure (151), it can be formed by a process of depositing an organic light-emitting element while transporting the substrate in one direction.

[0129] In this case, since the substrate moves in one direction, the deposition direction of the organic light-emitting diode is also influenced by the direction of the substrate's movement and can be deposited in a diagonal direction.

[0130] For example, as shown in the top part of FIG. 4, when the undercut portion (130u) is located on the transport direction side of the substrate, the undercut portion (130u) may not be exposed by the anode eaves structure portion (151) with respect to the deposition direction of the organic light-emitting element.

[0131] Accordingly, in the case of the normal portion, the organic light-emitting element may be prevented from being deposited deep inside the undercut portion (130u) by the anode eaves structure portion (151) located on the undercut portion (130u).

[0132] Accordingly, when a cathode electrode (180) is deposited after the organic light-emitting layer (170), the cathode electrode (180) is deposited deeper into the undercut portion (130u) than the organic light-emitting layer (170) in the normal portion so as to make normal contact with the auxiliary electrode (226).

[0133] In contrast, as shown in the defective part of FIG. 4, when the undercut portion (130u) is located on the side opposite to the transport direction of the substrate, the undercut portion (130u) may be exposed with respect to the deposition direction of the organic light-emitting element.

[0134] Accordingly, in the case of a defective part, the organic light-emitting element may not be obstructed from being deposited deep inside the undercut part (130u) by the anode eaves structure part (151) located on the undercut part (130u).

[0135] In addition, in the case of a defective part, the deposition direction of the organic light-emitting element according to the direction of movement of the substrate becomes a diagonal direction that facilitates deposition deep into the undercut part (130u), so the organic light-emitting layer (170) can be formed deep into the undercut part (130u).

[0136] Therefore, when a cathode electrode (180) is deposited after the organic light-emitting layer (170), the contact area where the cathode electrode (180) and the auxiliary electrode (226) can contact at the undercut portion (130u) is reduced due to the organic light-emitting layer (170), so a contact failure may occur.

[0137] Accordingly, according to the embodiment of the present specification, when forming an eaves structure for contacting the cathode electrode (180) and the auxiliary electrode (226), the first hole (130h) of the passivation layer (130) includes a pair of undercut portions (130u) on both sides with respect to the first center (130c) in a symmetrical structure, so that even if one undercut portion (130u) becomes defective depending on the direction of movement, the other undercut portion (130u) can form a normal contact area.

[0138] Accordingly, a pair of undercut portions (130u) can be arranged along the direction of movement of the substrate in the process of forming the organic light-emitting layer (170).

[0139] Accordingly, in the process of forming the organic light-emitting layer (170), the direction of movement of the substrate is not affected, and the possibility of contact failure between the cathode electrode (180) and the auxiliary electrode (226) at the undercut portion (130u) can be reduced.

[0140] In addition, according to an embodiment of the present specification, since the first hole (130h) of the passivation layer (130), the second hole (140h) of the overcoat layer (140), and the third hole (160h) of the bank layer (160) are located inside the auxiliary electrode (226) having a flattened surface, the undercut portion (130u) can also be located on the flattened surface of the auxiliary electrode (226), thereby reducing the curvature of the undercut portion (130u) area and allowing the cathode electrode (180) to contact the auxiliary electrode (226) without interruption.

[0141] Hereinafter, a display device according to another embodiment of the present specification will be described with reference to FIG. 5 and FIG. 6a to 6c.

[0142] FIG. 5 is an enlarged plan view of a display device including a light-emitting part and a transparent part according to another embodiment of the present specification.

[0143] FIG. 6a is a cross-sectional view corresponding to a portion of a display device according to another embodiment of the present specification, FIG. 6b is an enlarged cross-sectional view of a portion corresponding to an auxiliary electrode portion, and FIG. 6c is an enlarged plan view of a portion corresponding to an auxiliary electrode portion.

[0144] However, any content that overlaps with the description of the display device according to the embodiment of the present specification described above with reference to FIG. 2 and FIG. 3a to 3c will be omitted, and the description will focus on the configurations that differ, and the omitted description may be applied as is to other embodiments of the present specification.

[0145] Therefore, the pad section and thin-film transistor section will not be explained further, and the explanation will focus on the auxiliary electrode section.

[0146] A display device (1) according to an embodiment of the present specification may include a substrate (110) and an auxiliary electrode (226) disposed on the substrate (110).

[0147] A passivation layer (130) including a first hole (130h) in which at least a portion of the auxiliary electrode (226) is exposed may be disposed on the auxiliary electrode (226).

[0148] An overcoat layer (140) including a second hole (140h) in which at least a portion of the auxiliary electrode (226) is exposed may be disposed on the passivation layer (130).

[0149] A bank layer (160) including a third hole (160h) in which at least a portion of the auxiliary electrode (226) is exposed may be disposed on the overcoat layer (140).

[0150] The lower surface of the overcoat layer (140) can be in direct contact with the passivation layer (130), and the upper surface of the overcoat layer (140) can be in direct contact with the bank layer (160).

[0151] The first hole (130h), the second hole (140h), and the third hole (160h) are arranged so that at least a portion of them overlap each other, and the first hole (130h) and the second hole (140h) may be arranged to intersect in the first direction and the second direction, respectively, with respect to the center.

[0152] In the present specification, the fact that the first hole (130h) and the second hole (140h) intersect each other means that the first hole (130h) and the second hole (140h) are not arranged to be completely contained within one of them, but rather that there are parts that overlap with respect to the center but do not overlap each other in each direction that is staggered.

[0153] For example, the first hole (130h) and the second hole (140h) may intersect perpendicularly to each other, but are not limited thereto and may vary depending on the shape of the hole.

[0154] The first hole (130h) and the second hole (140h) can be located inside the third hole (160h).

[0155] The auxiliary electrode (226) may include an auxiliary electrode contact portion (226c) that is exposed at least partially through a first hole (130h), a second hole (140h), and a third hole (160h), which are holes penetrating the passivation layer (130), the overcoat layer (140), and the bank layer (160).

[0156] The organic light-emitting layer (170) and the cathode electrode (180) are arranged to extend to the auxiliary electrode contact portion (226c), and the overcoat layer (140) surrounding the auxiliary electrode contact portion (226c) may include a pair of overcoat eaves structures (141).

[0157] A pair of undercut sections (130u) from which the passivation layer (130) has been removed may be disposed at the bottom of a pair of overcoat eaves structure sections (141).

[0158] Accordingly, the first hole (130h) of the passivation layer (130) includes a first center (130c) and a pair of undercut portions (130u) disposed on both sides of the first center (130c) in a first direction, and the overcoat layer (140) is disposed to cover the pair of undercut portions (130u) so that the pair of undercut portions (130u) may not be exposed to the outside.

[0159] A pair of undercut portions (130u) may be positioned facing each other with respect to the first center (130c) and positioned symmetrically to each other.

[0160] In addition, a pair of undercut portions (130u) can be formed in the same shape as each other so as to have a shape that is symmetrical with respect to the first center (130c).

[0161] Referring to FIG. 5, the first direction may be a direction in which the light-emitting part (EA) and the transmission part (TA) are arranged alternately.

[0162] For example, based on the first direction, one light-emitting part (EA) may be positioned between different transmission parts (TA), and one transmission part (TA) may be positioned between different light-emitting parts (EA).

[0163] Accordingly, a pair of undercut sections (130u) can be arranged to face each other along the direction in which the light-emitting section (EA) and the transmission section (TA) are alternately arranged.

[0164] The second hole (140h) includes a second center (140c) and a pair of passivation exposure portions (140e) disposed on both sides of the second center (140c) in a second direction, and the passivation exposure portions (140e) can expose the passivation layer (130).

[0165] A pair of passivation exposures (140e) may be positioned facing each other with respect to the second center (140c) and positioned symmetrically to each other.

[0166] Additionally, a pair of passivation exposure portions (140e) can be formed in the same shape as each other so as to have a shape that is symmetrical with respect to the second center (140c).

[0167] Referring to FIG. 5, the second direction may be a direction in which a plurality of light-emitting parts (EA) are arranged in succession or a direction in which a plurality of transmission parts (TA) are arranged in succession.

[0168] For example, based on the second direction, one light-emitting part (EA) may be placed between different light-emitting parts (EA), and one transmission part (TA) may be between different transmission parts (TA).

[0169] Accordingly, a pair of passivation exposure portions (140e) can be arranged to face each other along the direction in which a plurality of light-emitting portions (EA) are arranged in succession or the direction in which a plurality of transmission portions (TA) are arranged in succession.

[0170] A bank layer (160) may be placed on the overcoat layer (140).

[0171] The bank layer (160) may include a bank protrusion (161), and the bank protrusion (161) may be placed on the overcoat eaves structure (141).

[0172] The overcoat eaves structure (141) can be formed to protrude more than the bank protrusion (161).

[0173] An organic light-emitting layer (170) may be disposed on the bank layer (160), and a cathode electrode (180) may be disposed on the organic light-emitting layer (170), and the organic light-emitting layer (170) and the cathode electrode (180) may be disposed on an auxiliary electrode (226) by extending along the passivation exposure portion (140e).

[0174] The organic light-emitting layer (170) and the cathode electrode (180) extend along the passivation exposure portion (140e) to the undercut portion (130u), and the cathode electrode (180) located at the undercut portion (130u) extends longer than the organic light-emitting layer (170) so as to be in direct contact with the auxiliary electrode (226).

[0175] In the area where a pair of undercut portions (130u) are not formed, a passivation step portion (130s), an overcoat step portion (140s), and a bank step portion (160s) may be formed to be stacked in sequence.

[0176] The passivation step portion (130s) may correspond to the passivation exposure portion (140e), and the passivation step portion (130s), overcoat step portion (140s), and bank step portion (160s) may be arranged along the second direction.

[0177] For example, an overcoat layer (140) including an overcoat step portion (140s) that exposes the passivation step portion (130s) may be disposed on a passivation layer (130) that includes a passivation step portion (130s), and a bank layer (160) including an overcoat step portion (140s) that exposes the bank step portion (160s) may be disposed on the overcoat layer (140) that includes the overcoat step portion (140s).

[0178] Accordingly, the overcoat layer (140) surrounding the auxiliary electrode contact portion (226c) includes an overcoat step portion (140s), a bank step portion (160s) exposing the overcoat layer (140) is disposed above the overcoat step portion (140s), and a passivation step portion (130s) exposing the passivation layer (130) can be disposed below the overcoat step portion (140s).

[0179] The bank step section (160s), the overcoat step section (140s), and the passivation step section (130s) can be positioned in order close to the auxiliary electrode (226).

[0180] That is, the passivation step portion (130s) can be positioned closest to the auxiliary electrode (226), and the bank step portion (160s) can be positioned furthest from the auxiliary electrode (226).

[0181] In addition, the bank step section (160s), the overcoat step section (140s), and the passivation step section (130s) are all formed to have a regular taper shape so as to have a stepped stacked shape.

[0182] An organic light-emitting layer (170) and a cathode electrode (180) can be extended along the bank step portion (160s), the overcoat step portion (140s), and the passivation step portion (130s) and placed on an auxiliary electrode contact portion (226c).

[0183] The cathode electrode (180) placed on the auxiliary electrode contact portion (226c) can contact the auxiliary electrode (226) in the area corresponding to the undercut portion (130u).

[0184] The first hole (130h), the second hole (140h), and the third hole (160h) may be located inside the auxiliary electrode (226).

[0185] In this case, the auxiliary electrode (226) corresponding to the first hole (130h), the second hole (140h), and the third hole (160h) may have a flattened surface.

[0186] The substrate (110) includes a display area (DA) and a non-display area (NDA), and the display area (DA) may include a light-emitting part (EA) and a transparent part (TA), and an auxiliary electrode (226) may be arranged to overlap with the transparent part (TA).

[0187] The auxiliary electrode (226) can be formed to protrude in the direction of the transmission portion (TA) from the low-potential power wiring (VSSL) passing through the display area (DA) so as not to overlap with the light-emitting portion (EA).

[0188] According to an embodiment of the present specification, in order to electrically connect the auxiliary electrode (226) and the cathode electrode (180) at the auxiliary electrode contact portion (226c), an overcoat eaves structure portion (141) having different deposition characteristics and eaves structure of the organic light-emitting layer (170) and the cathode electrode (180) may be used.

[0189] The organic light-emitting layer (170) and the cathode electrode (180) can be formed using a deposition process, and the organic light-emitting layer (170) and the cathode electrode (180) can be formed to extend along the bank step portion (160s), the overcoat step portion (140s), and the passivation step portion (130s) and formed on the auxiliary electrode contact portion (226c).

[0190] In this case, since the organic light-emitting layer (170) has strong linearity during deposition, the distance it penetrates to the undercut portion (130u), which is the lower region of the overcoat eaves structure (141), is short, but since the cathode electrode (180) does not have strong linearity, the distance it penetrates to the undercut portion (130u), which is the lower region of the overcoat eaves structure (141), can be long.

[0191] Therefore, the cathode electrode (180) can be directly contacted with the auxiliary electrode contact portion (226c) at the undercut portion (130u), so that the cathode electrode (180) can be electrically connected to the auxiliary electrode (226).

[0192] Since the overcoat eaves structure (141) is spaced apart from the lower auxiliary electrode (226) by a predetermined distance, the organic light-emitting layer (170) and the cathode electrode (180) formed on the overcoat eaves structure (141) cannot extend to the auxiliary electrode contact part (226c) and the connection may be severed at the overcoat eaves structure (141).

[0193] As described above, according to the embodiment of the present specification, the resistance of the cathode electrode (180) can be reduced by using the difference in deposition characteristics between the organic light-emitting layer (170) and the cathode electrode (180) to bring the cathode electrode (180) into contact with the auxiliary electrode (226) through the overcoat eaves structure (141).

[0194] Accordingly, according to the embodiment of the present specification, the resistance of the cathode electrode (180) is reduced to reduce the occurrence of a low-potential power rise phenomenon, thereby reducing the occurrence of a brightness non-uniformity phenomenon of the display device.

[0195] Additionally, according to an embodiment of the present specification, when forming a ridge structure for contacting a cathode electrode (180) and an auxiliary electrode (226), a passivation layer (130), an overcoat layer (140), and a bank layer (160) are stacked in order, and the overcoat layer (140) may include a pair of overcoat ridge structures (141), and a bank protrusion (161) may be disposed on the overcoat ridge structure (141).

[0196] According to the embodiment of the present specification, since the overcoat layer (140) is placed on the passivation layer (130) rather than the bank layer (160), the occurrence of tearing defects due to adhesion problems between the bank layer (160) and the passivation layer (130) can be reduced.

[0197] In addition, since the bank layer (160) is placed on the overcoat layer (140), the deformation of the overcoat layer (140) due to stress or the lifting phenomenon of the overcoat eaves structure (141) can be reduced.

[0198] FIG. 7a illustrates an example of a top section in which an auxiliary electrode is exposed by the eaves structure of the bank layer.

[0199] For example, this is a drawing of a normal example in which a bank layer is formed to be in direct contact with a passivation layer, and an eaves structure is formed by the bank layer.

[0200] FIG. 7b illustrates an example of a defective section where an auxiliary electrode is exposed by the eaves structure of the bank layer.

[0201] For example, this is a drawing of a defect example in which a bank layer is formed to be in direct contact with the passivation layer, and the eaves structure is formed by the bank layer, and the tearing phenomenon of the eaves structure occurs.

[0202] When a bank layer is formed to be in direct contact with a passivation layer and an eaves structure is formed with a bank layer, a problem of tearing of the eaves structure may occur due to adhesion issues between the passivation layer and the bank layer.

[0203] However, according to the embodiments of the present specification, an overcoat layer with excellent adhesion to the passivation layer is formed on the passivation layer to be in direct contact with the passivation layer, and since the eaves structure is formed with the overcoat layer, the problem of tearing of the eaves structure can be reduced.

[0204] Meanwhile, FIG. 8a illustrates an example of a top section in which an auxiliary electrode is exposed by the eaves structure of the overcoat layer.

[0205] For example, this is a drawing of a normal example in which an overcoat layer is formed to be in direct contact with a passivation layer, an organic light-emitting layer is formed on the overcoat layer, and an eaves structure is formed by the overcoat layer.

[0206] FIG. 7b illustrates an example of a defective part where an auxiliary electrode is exposed by the eaves structure of the overcoat layer.

[0207] For example, this is a drawing of a defect example in which a lifting phenomenon occurs in an eaves structure when the defect part is formed such that an overcoat layer is in direct contact with the passivation layer and an organic light-emitting layer is formed on the overcoat layer, and the eaves structure part is formed by the overcoat layer.

[0208] When the eaves structure is formed solely by the overcoat layer, the overcoat layer may deform due to stress or the eaves structure of the overcoat layer may be lifted.

[0209] However, according to the embodiments of the present specification, since a bank layer is formed in contact with the overcoat layer and a bank protrusion is formed on the overcoat eaves structure, the bank layer can reduce deformation of the overcoat layer due to stress or lifting of the overcoat eaves structure.

[0210] In other words, since the overcoat layer plays a role in improving adhesion between the passivation layers and the bank layer plays a role in suppressing deformation of the overcoat layer, the double-layer structure of the overcoat layer and the bank layer can include all the advantages of the overcoat layer and the bank layer and complement each other's disadvantages, compared to when the overcoat layer or the bank layer is formed alone on the passivation layer.

[0211] In addition, according to an embodiment of the present specification, when forming a ridge structure for contacting a cathode electrode (180) and an auxiliary electrode (226), the ridge structure is formed with an overcoat layer (140), which is an insulating layer, instead of a conductive pixel electrode, and a bank layer (160) is formed on the overcoat layer (140), so that the thickness of the ridge structure can be substantially increased, thereby forming a robust structure that is easy to process, such as cleaning.

[0212] For example, if the eaves structure is formed with an anode electrode, which is a pixel electrode having a relatively thin thickness, the eaves structure may be damaged by processes such as cleaning, but if the thickness of the eaves structure is substantially increased using an overcoat layer (140) and a bank layer (160), a more robust structure can be formed.

[0213] In addition, according to an embodiment of the present specification, when forming a ridge structure for contacting a cathode electrode (180) and an auxiliary electrode (226), the ridge structure is formed with an overcoat layer (140) composed of a non-conductive material instead of a conductive pixel electrode, and a bank layer (160) is formed on the overcoat layer (140), thereby reducing the occurrence of electrostatic defects that may occur in the area.

[0214] In addition, according to an embodiment of the present specification, when forming an eaves structure for contacting the cathode electrode (180) and the auxiliary electrode (226), the first hole (130h) of the passivation layer (130) includes a pair of undercut portions (130u) on both sides with respect to the first center (130c) in a symmetrical structure, so that the possibility of defects occurring according to the direction of movement of the substrate can be reduced in the process of forming the organic light-emitting layer (170).

[0215] When forming an organic light-emitting layer (170) on the eaves structure, the organic light-emitting element can be deposited and formed during the process of transferring the substrate.

[0216] Since the substrate moves in one direction, the deposition direction of the organic light-emitting diode can also be diagonal, as it is influenced by the direction of the substrate's movement.

[0217] In this case, when the undercut portion (130u) is located in the transport direction of the substrate, the undercut portion (130u) may not be exposed by the overcoat eaves structure portion (141) with respect to the deposition direction of the organic light-emitting element.

[0218] Accordingly, the organic light-emitting element may be prevented from being deposited deep inside the undercut portion (130u) by the overcoat eaves structure portion (141) located on the undercut portion (130u).

[0219] Therefore, when a cathode electrode (180) is deposited after the organic light-emitting layer (170), the cathode electrode (180) is deposited deeper into the undercut portion (130u) than the organic light-emitting layer (170) so that it can normally come into contact with the auxiliary electrode (226).

[0220] However, since the transfer direction of the substrate may change depending on the process, in order to facilitate contact between the cathode electrode (180) and the auxiliary electrode (226) at the undercut portion (130u) regardless of the transfer direction of the substrate, the undercut portion (130u) may be positioned symmetrically so as to face each other with respect to the center and arranged in a symmetrical shape.

[0221] Accordingly, according to the embodiment of the present specification, the influence of the process directionality during the deposition of the organic light-emitting layer (170) can be reduced, so that in the process of forming the organic light-emitting layer (170), the direction of movement of the substrate is not affected, and the possibility of contact failure between the cathode electrode (180) and the auxiliary electrode (226) at the undercut portion (130u) can be reduced.

[0222] For example, when forming an eaves structure for contacting the cathode electrode (180) and the auxiliary electrode (226), the first hole (130h) of the passivation layer (130) includes a pair of undercut portions (130u) on both sides with respect to the first center (130c) in a symmetrical structure, so that even if one undercut portion (130u) becomes defective depending on the direction of movement, the other undercut portion (130u) can form a normal contact area.

[0223] Accordingly, a pair of undercut portions (130u) can be arranged along the direction of movement of the substrate in the process of forming the organic light-emitting layer (170).

[0224] Accordingly, in the process of forming the organic light-emitting layer (170), the direction of movement of the substrate is not affected, and the possibility of contact failure between the cathode electrode (180) and the auxiliary electrode (226) at the undercut portion (130u) can be reduced.

[0225] In addition, according to an embodiment of the present specification, since the first hole (130h) of the passivation layer (130), the second hole (140h) of the overcoat layer (140), and the third hole (160h) of the bank layer (160) are located inside the auxiliary electrode (226) having a flattened surface, the undercut portion (130u) can also be located on the flattened surface of the auxiliary electrode (226), thereby reducing the curvature of the undercut portion (130u) area and allowing the cathode electrode (180) to contact the auxiliary electrode (226) without interruption.

[0226] For example, since the auxiliary electrode (226) is positioned wider than the first hole (130h), the second hole (140h), and the third hole (160h), the curvature of the layers placed on the auxiliary electrode can be reduced and flattened, thereby easily forming a regular taper shape of the passivation layer (130), the overcoat layer (140), and the bank layer (160), so that the cathode electrode (180) and the auxiliary electrode (226) can be in good contact without interruption.

[0227] A display device according to an embodiment of the present specification may be described as follows.

[0228] A display device according to an embodiment of the present specification may include a substrate, an auxiliary electrode disposed on the substrate, a passivation layer disposed on the auxiliary electrode and including a first hole in which at least a portion of the auxiliary electrode is exposed, an overcoat layer disposed on the passivation layer and including a second hole in which at least a portion of the auxiliary electrode is exposed, and a bank layer disposed on the overcoat layer and including a third hole in which at least a portion of the auxiliary electrode is exposed.

[0229] The first hole, the second hole, and the third hole are arranged so that at least a portion of them overlap each other, and the first hole and the second hole may be arranged to intersect in the first direction and the second direction, respectively, with respect to the center.

[0230] The first hole comprises a first center and a pair of undercut portions disposed on both sides of the first center in the first direction, and the overcoat layer is disposed to cover the pair of undercut portions so that the pair of undercut portions may not be exposed to the outside.

[0231] The above pair of undercut portions can be arranged symmetrically with respect to the first center.

[0232] The second hole comprises a second center and a pair of passivation exposure portions disposed on both sides of the second center in the second direction, and the passivation exposure portions can expose the passivation layer.

[0233] The above pair of passivation exposure portions can be arranged symmetrically with respect to the second center.

[0234] A display device according to an embodiment of the present specification further comprises an organic light-emitting layer disposed on the bank layer and a cathode electrode disposed on the organic light-emitting layer, wherein the organic light-emitting layer and the cathode electrode may extend along the passivation exposure portion and be disposed on the auxiliary electrode.

[0235] The organic light-emitting layer and the cathode electrode extend along the passivation exposure portion to the undercut portion, and the cathode electrode located at the undercut portion extends longer than the organic light-emitting layer and can come into direct contact with the auxiliary electrode.

[0236] The first hole, the second hole, and the third hole may be located on the inner side of the auxiliary electrode.

[0237] The auxiliary electrodes corresponding to the first hole, the second hole, and the third hole may have a flattened surface.

[0238] The first hole and the second hole may be located inside the third hole.

[0239] The above substrate includes a display area and a non-display area, the display area includes a light-emitting part and a transparent part, and the auxiliary electrode may be arranged to overlap with the transparent part.

[0240] It further includes a low-potential power wiring passing through the display area so as not to overlap with the light-emitting part, and the auxiliary electrode protrudes from the low-potential power wiring in the direction of the transmission part.

[0241] A display device according to an embodiment of the present specification may include a substrate, an auxiliary electrode disposed on the substrate, a passivation layer disposed on the auxiliary electrode, an overcoat layer disposed on the passivation layer, a bank layer disposed on the overcoat layer, an organic light-emitting layer disposed on the bank layer, and a cathode electrode disposed on the organic light-emitting layer.

[0242] The auxiliary electrode includes an auxiliary electrode contact portion in which at least a portion is exposed through holes penetrating the passivation layer, the overcoat layer, and the bank layer, and the organic light-emitting layer and the cathode electrode are arranged to extend to the auxiliary electrode contact portion, and the overcoat layer surrounding the auxiliary electrode contact portion may include a pair of overcoat eaves structures.

[0243] A pair of undercut sections from which the passivation layer has been removed may be disposed below the above pair of overcoat eaves structures.

[0244] The above pair of undercut sections can be arranged to face each other.

[0245] A bank protrusion of the bank layer is disposed on the overcoat eave structure, and the overcoat eave structure may protrude further than the bank protrusion.

[0246] The overcoat layer surrounding the auxiliary electrode contact portion includes an overcoat step portion, a bank step portion exposing the overcoat layer is disposed above the overcoat step portion, and a passivation step portion exposing the passivation layer is disposed below the overcoat step portion, and the organic light-emitting layer and the cathode electrode may be extended along the bank step portion, the overcoat step portion, and the passivation step portion and disposed on the auxiliary electrode contact portion.

[0247] The bank step portion, the overcoat step portion, and the passivation step portion may all have a regular taper shape.

[0248] The bank step portion, the overcoat step portion, and the passivation step portion may be arranged in order close to the auxiliary electrode.

[0249] The cathode electrode disposed on the auxiliary electrode contact portion can contact the auxiliary electrode in an area corresponding to the undercut portion.

[0250] The lower surface of the overcoat layer may be in direct contact with the passivation layer, and the upper surface of the overcoat layer may be in direct contact with the bank layer.

[0251] The above substrate includes a light-emitting portion and a transmission portion, the first direction is a direction in which the light-emitting portion and the transmission portion are alternately arranged, and the pair of undercut portions may be arranged to face each other along the first direction.

[0252] The above substrate includes a light-emitting portion and a transparent portion, and the second direction is a direction in which a plurality of the light-emitting portions are arranged in succession or a direction in which a plurality of the transparent portions are arranged in succession, and the pair of passivation exposure portions may be arranged to face each other along the second direction.

[0253] Although the embodiments of this specification have been described in more detail with reference to the attached drawings, this specification is not necessarily limited to these embodiments and may be modified in various ways within the scope of the technical spirit of this specification. Accordingly, the embodiments disclosed in this specification are intended to explain, not limit, the technical spirit of this specification, and the scope of the technical spirit of this specification is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of protection of this specification shall be interpreted by the claims, and all technical spirits within an equivalent scope shall be interpreted as being included within the scope of rights of this specification. Explanation of the symbols

[0254] 1: Display device 110: Substrate 111: Shading layer 113: Buffer layer 121: Active layer 122: Capacitor electrode 123: Gate insulating layer 124: Gate electrode 125: Interlayer insulating layer 126a, 126b: First electrode, second electrode 130: Passivation layer 130h: 1st hole 130c: 1st center 130u: Undercut section 130s: Passivation step 140: Overcoat layer 140h: 2nd hole 140e: Passivation exposure 140c: Second center 140s: Overcoat step 141: Eaves structure 150: Anode electrode 151: Anode eaves structure 160: Bank level 161: Bank protrusion 60h: 3rd hole 160s: Bank step section 170: Organic light-emitting layer 180: Cathode electrode 226: Auxiliary electrode 226c: Auxiliary electrode contact part 324: Pad electrode 326: Pad connection electrode 350: Pad contact electrode DA: Display area NDA: Non-display area GPAD: Gate pad section DPAD: Data pad section SP1, SP2, SP3, SP4: 1st, 2nd, 3rd, 4th subpixels EA: Light-emitting part TA: Transmitting part VSSL: Low-potential power wiring

Claims

Claim 1 Substrate: an auxiliary electrode disposed on the substrate; a passivation layer disposed on the auxiliary electrode and comprising a first hole in which at least a portion of the auxiliary electrode is exposed; an overcoat layer disposed on the passivation layer and comprising a second hole in which at least a portion of the auxiliary electrode is exposed; a bank layer disposed on the overcoat layer and comprising a third hole in which at least a portion of the auxiliary electrode is exposed; an organic light-emitting layer disposed on the bank layer; and a cathode electrode disposed on the organic light-emitting layer; A display device comprising, wherein the first hole, the second hole, and the third hole are arranged such that at least a portion of them overlap each other, the first center of the first direction of the first hole overlaps with the second center of the second direction of the second hole, and the first direction and the second direction intersect each other, the substrate includes a display area and a non-display area, the display area includes a light-emitting part and a transparent part, the auxiliary electrode is arranged to overlap the transparent part, and the cathode electrode extends to the transparent part and contacts the auxiliary electrode at the transparent part. Claim 2 A display device according to claim 1, wherein the first hole comprises a first center and a pair of undercut portions disposed on both sides of the first center in the first direction, and the overcoat layer is disposed to cover the pair of undercut portions so that the pair of undercut portions are not exposed to the outside. Claim 3 A display device according to paragraph 2, wherein the pair of undercut portions are arranged symmetrically with respect to the first center. Claim 4 A display device according to paragraph 2, wherein the second hole comprises a second center and a pair of passivation exposure portions disposed on both sides of the second center in the second direction, and the passivation exposure portions expose the passivation layer. Claim 5 A display device according to claim 4, wherein the pair of passivation exposure portions are arranged symmetrically with respect to the second center. Claim 6 A display device according to claim 4, further comprising: an organic light-emitting layer disposed on the bank layer; and a cathode electrode disposed on the organic light-emitting layer, wherein the organic light-emitting layer and the cathode electrode extend along the passivation exposure portion and are disposed on the auxiliary electrode. Claim 7 A display device according to claim 6, wherein the organic light-emitting layer and the cathode electrode extend along the passivation exposure portion to the undercut portion, and the cathode electrode located at the undercut portion extends longer than the organic light-emitting layer and comes into direct contact with the auxiliary electrode. Claim 8 A display device according to claim 1, wherein the first hole, the second hole, and the third hole are located inside the area corresponding to the auxiliary electrode. Claim 9 A display device according to claim 1, wherein the auxiliary electrodes corresponding to the first hole, the second hole, and the third hole have a flattened surface. Claim 10 In claim 1, the first hole and the second hole are located inside the area corresponding to the third hole, a display device. Claim 11 A display device according to claim 1, wherein the substrate includes a display area and a non-display area, the display area includes a light-emitting part and a transparent part, and the auxiliary electrode is arranged to overlap with the transparent part. Claim 12 A display device according to claim 11, further comprising a low-potential power line passing through the display area so as not to overlap with the light-emitting part, wherein the auxiliary electrode protrudes from the low-potential power line in the direction of the transmission part. Claim 13 A display device comprising: a substrate; an auxiliary electrode disposed on the substrate; a passivation layer disposed on the auxiliary electrode; an overcoat layer disposed on the passivation layer; a bank layer disposed on the overcoat layer; an organic light-emitting layer disposed on the bank layer; and a cathode electrode disposed on the organic light-emitting layer; wherein the auxiliary electrode includes an auxiliary electrode contact portion in which at least a portion is exposed through holes penetrating the passivation layer, the overcoat layer, and the bank layer, and the organic light-emitting layer and the cathode electrode are disposed to extend to the auxiliary electrode contact portion, and the overcoat layer surrounding the auxiliary electrode contact portion includes a pair of overcoat eaves structures, the substrate includes a display area and a non-display area, the display area includes a light-emitting portion and a transparent portion, the auxiliary electrode is disposed to overlap with the transparent portion, and the cathode electrode extends to the transparent portion and contacts the auxiliary electrode at the transparent portion. Claim 14 A display device according to claim 13, wherein a pair of undercut sections from which the passivation layer has been removed are disposed below the pair of overcoat eaves structural sections. Claim 15 In paragraph 14, a display device wherein the pair of undercut portions are arranged to face each other. Claim 16 A display device according to claim 13, wherein a bank protrusion of the bank layer is disposed on the overcoat eave structure, and the overcoat eave structure protrudes further than the bank protrusion. Claim 17 A display device according to claim 13, wherein the overcoat layer surrounding the auxiliary electrode contact portion includes an overcoat step portion, a bank step portion exposing the overcoat layer is disposed above the overcoat step portion, a passivation step portion exposing the passivation layer is disposed below the overcoat step portion, and the organic light-emitting layer and the cathode electrode are extended along the bank step portion, the overcoat step portion, and the passivation step portion and disposed on the auxiliary electrode contact portion. Claim 18 A display device according to claim 17, wherein the bank step portion, the overcoat step portion, and the passivation step portion all have a regular taper shape. Claim 19 A display device according to claim 17, wherein the bank step portion, the overcoat step portion, and the passivation step portion are arranged in order close to the auxiliary electrode. Claim 20 A display device according to claim 17, wherein a pair of undercut portions from which the passivation layer has been removed are disposed below the pair of overcoat eaves structural portions, and the cathode electrode disposed on the auxiliary electrode contact portion contacts the auxiliary electrode in an area corresponding to the undercut portions. Claim 21 A display device according to claim 13, wherein the lower surface of the overcoat layer is in direct contact with the passivation layer, and the upper surface of the overcoat layer is in direct contact with the bank layer. Claim 22 A display device according to paragraph 2, wherein the substrate includes a light-emitting part and a transparent part, the first direction is a direction in which the light-emitting part and the transparent part are alternately arranged, and the pair of undercut parts are arranged to face each other along the first direction. Claim 23 A display device according to paragraph 2, wherein the second hole comprises a second center and a pair of passivation exposure portions disposed on both sides of the second center in the second direction, the passivation exposure portions expose the passivation layer, the substrate comprises a light-emitting portion and a transparent portion, the second direction is a direction in which a plurality of the light-emitting portions are arranged in succession or a direction in which a plurality of the transparent portions are arranged in succession, and the pair of passivation exposure portions are disposed to face each other along the second direction.

Citation Information

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