Factor estimation apparatus, factor estimation method and recording medium

Abstract

A substrate processing device effective for accelerating the adjustment of the removal width of a film formed on a substrate is provided. The substrate processing device comprises a peripheral removal unit for removing a peripheral portion of a film formed on the surface of a substrate, a profile acquisition unit for acquiring a removal width profile indicating the relationship between a position in the periphery direction of the substrate and the width of the portion of the film removed on the substrate, and a factor estimation unit for outputting factor information indicating the factor of the width error based on the removal width profile.

Description

Technology Field

[0001] The present disclosure relates to a substrate processing apparatus, a method for estimating substrate processing, and a memory medium. Background Technology

[0002] Patent document 1 discloses a coating film removal method comprising: a coating film removal process in which a circular substrate is rotated around its orthogonal axis and a solvent is supplied from a solvent nozzle to the periphery of the coating film on the surface of the substrate to remove the coating film in a ring shape with a preset width dimension; a process of conveying the substrate to an inspection module for inspecting the condition of the coating film by capturing the entire surface of the substrate; a process of detecting the removal area of ​​the coating film based on image data acquired by the inspection module; and a process of correcting the subsequent transfer position of the substrate based on the detection result. Prior art literature

[0003] Japanese Patent Publication No. 2014-091105 The problem to be solved

[0004] The present disclosure provides a substrate processing apparatus effective for accelerating the adjustment of the removal width of a film formed on a substrate. means of solving the problem

[0005] A substrate processing apparatus according to one aspect of the present disclosure comprises a peripheral removal unit for removing a peripheral portion of a film formed on the surface of a substrate, a profile acquisition unit for acquiring a removal width profile indicating a relationship between a position in the periphery direction of the substrate and the width of the portion of the film removed on the substrate, and a factor estimation unit for outputting factor information indicating a factor of a width error based on the removal width profile. Effects of the invention

[0006] According to the present disclosure, a substrate processing apparatus effective for accelerating the adjustment of the removal width of a film formed on a substrate can be provided. Brief explanation of the drawing

[0007] Figure 1 is a schematic diagram illustrating the general configuration of a substrate processing system. Figure 2 is a schematic diagram illustrating the general configuration of a coating unit. Figure 3 is a schematic diagram illustrating the general configuration of an inspection unit. Figure 4 is a schematic diagram illustrating the functional configuration of the control unit. Figure 5 is a schematic diagram illustrating the hardware configuration of the control unit. Figure 6 is a flowchart illustrating the order of control of the tabernacle. Figure 7 is a flowchart illustrating the acquisition sequence of the removal profile. Figure 8 is a flowchart illustrating the output order of factor information. Specific details for implementing the invention

[0008] Hereinafter, embodiments will be described in detail with reference to the drawings. In the description, the same reference numerals are assigned to elements of the same type or having the same function, and redundant descriptions are omitted.

[0009] [Substrate Processing System]

[0010] The substrate processing system (1) is a system that performs the formation of a photosensitive film, exposure of the photosensitive film, and development of the photosensitive film on a substrate. Examples of substrates to be processed include semiconductor wafers, glass substrates, mask substrates, or FPDs (Flat Panel Displays). The substrates include semiconductor wafers, etc., on which a film, etc., has been formed in the preceding processing.

[0011] As shown in FIG. 1, the substrate processing system (1) is equipped with a coating and developing device (2) and an exposure device (3). The exposure device (3) performs an exposure treatment of a resist film (photosensitive film) formed on a substrate (W). The substrate (W) is, for example, circular and has a position indicator (for example, a notch) at its periphery that serves as a reference for a position in the circumferential direction. Specifically, the exposure device (3) irradiates an energy line to the part of the resist film to be exposed by a method such as immersion exposure. The coating and developing device (2) performs a treatment to form a resist film on the surface of the substrate (W) before the exposure treatment by the exposure device (3), and performs a development treatment of the resist film after the exposure treatment.

[0012] [Substrate Processing Device]

[0013] Hereinafter, as an example of a substrate processing device, the configuration of a coating and developing device (2) is described. The coating and developing device (2) comprises a carrier block (4), a processing block (5), an interface block (6), and a control unit (100).

[0014] The carrier block (4) introduces a substrate (W) into the coating / developing device (2) and extracts the substrate (W) from the coating / developing device (2). For example, the carrier block (4) can support a plurality of carriers (C) (receiving portions) for the substrate (W) and has a built-in transfer arm (A1). The carrier (C) accommodates, for example, a plurality of circular substrates (W). The transfer arm (A1) extracts the substrate (W) from the carrier (C) and transfers it to the processing block (5), and receives the substrate (W) from the processing block (5) and returns it to the carrier (C).

[0015] The processing block (5) has a plurality of processing modules (11, 12, 13, 14). The processing module (11) has a plurality of coating units (U1), a plurality of heat treatment units (U2), and a transport arm (A3) for transporting a substrate (W) to these units.

[0016] The processing module (11) forms a lower layer film on the surface of the substrate (W) by means of a coating unit (U1) and a heat treatment unit (U2). The coating unit (U1) applies a treatment solution for forming the lower layer film onto the substrate (W). The heat treatment unit (U2) performs various heat treatments accompanying the formation of the lower layer film. The heat treatment unit (U2) incorporates, for example, a heating plate and a cooling plate, and performs heat treatment by heating the substrate (W) with the heating plate and cooling the substrate (W) after heating with the cooling plate.

[0017] The processing module (12) (film formation unit) incorporates a plurality of coating units (U1), a plurality of heat treatment units (U2), a plurality of inspection units (U3), and a transport arm (A3) for transporting the substrate (W) to these units. The processing module (12) forms a resist film on the lower layer film by means of the coating unit (U1) and the heat treatment unit (U2). The coating unit (U1) forms a film on the surface of the substrate (W) by applying a treatment solution for forming the resist film onto the lower layer film. Hereinafter, this film is referred to as the "pre-baking resist film." The heat treatment unit (U2) performs various heat treatments accompanying the formation of the resist film. As a result, the pre-baking resist film becomes a resist film.

[0018] The coating unit (U1) may be configured to remove at least a portion of the resist film. Removing at least a portion of the resist film includes removing a portion of the resist film before baking prior to heat treatment by the heat treatment unit (U2). For example, the coating unit (U1) removes a portion of the resist film before baking by supplying a removal liquid to a portion of the substrate (W) after forming a resist film before baking on the surface of the substrate (W).

[0019] The inspection unit (U3) performs a process to inspect the condition of the surface (Wa) of the substrate (W). For example, the inspection unit (U3) obtains information indicating the condition of the surface (Wa) of the substrate (W). The information indicating the condition of the surface (Wa) includes information on the width of the portion of the substrate (W) where the resist film has been removed (for example, the width in the diameter direction of the substrate (W)).

[0020] The processing module (13) incorporates a plurality of coating units (U1), a plurality of heat treatment units (U2), and a transport arm (A3) for transporting a substrate (W) to these units. The processing module (13) forms an upper layer film on a resist film by means of the coating unit (U1) and the heat treatment unit (U2). The coating unit (U1) of the processing module (13) applies a liquid for forming an upper layer film onto the resist film. The heat treatment unit (U2) of the processing module (13) performs various heat treatments accompanying the formation of the upper layer film.

[0021] The processing module (14) incorporates a plurality of developing units (U4), a plurality of heat treatment units (U5), and a transport arm (A3) for transporting a substrate (W) to these units. The processing module (14) performs a developing treatment of the resist film after exposure by the developing unit (U4) and the heat treatment unit (U5). The developing unit (U4) performs a developing treatment of the resist film by applying a developing solution to the surface of the substrate (W) after exposure and then washing it off with a rinsing solution. The heat treatment unit (U5) performs various heat treatments accompanying the developing treatment. Specific examples of heat treatments include heat treatment before the developing treatment (PEB: Post Exposure Bake) and heat treatment after the developing treatment (PB: Post Bake).

[0022] A shelf unit (U10) is provided on the carrier block (4) side within the processing block (5). The shelf unit (U10) is divided into a plurality of cells arranged in an up-and-down direction. A lifting arm (A7) is provided near the shelf unit (U10). The lifting arm (A7) raises and lowers the substrate (W) between the cells of the shelf unit (U10).

[0023] A shelf unit (U11) is provided on the side of the interface block (6) within the processing block (5). The shelf unit (U11) is divided into a plurality of cells arranged in an up-and-down direction.

[0024] The interface block (6) performs the transfer of a substrate (W) between itself and the exposure device (3). For example, the interface block (6) has a transfer arm (A8) built in and is connected to the exposure device (3). The transfer arm (A8) transfers the substrate (W) placed on the shelf unit (U11) to the exposure device (3), and receives the substrate (W) from the exposure device (3) and returns it to the shelf unit (U11).

[0025] The control unit (100) controls each element included in the coating and developing device (2). Below, a series of control sequences executed by the control unit (100) for one substrate (W) is exemplified. For example, the control unit (100) first controls the transfer arm (A1) to transport the substrate (W) in the carrier (C) to the shelf unit (U10), and then controls the lifting arm (A7) to place the substrate (W) into a cell for the processing module (11).

[0026] Next, the control unit (100) controls the return arm (A3) to return the substrate (W) of the shelf unit (U10) to the coating unit (U1) and the heat treatment unit (U2) within the processing module (11). Additionally, the control unit (100) controls the coating unit (U1) and the heat treatment unit (U2) to form a lower layer film on the surface of the substrate (W). Afterward, the control unit (100) controls the return arm (A3) to return the substrate (W) with the lower layer film formed thereon to the shelf unit (U10), and controls the lifting arm (A7) to place the substrate (W) into a cell for the processing module (12).

[0027] Next, the control unit (100) controls the conveying arm (A3) to convey the substrate (W) of the shelf unit (U10) to the coating unit (U1) and the heat treatment unit (U2) within the processing module (12). Additionally, the control unit (100) controls the coating unit (U1) and the heat treatment unit (U2) to form a resist film on the lower layer of the substrate (W). For example, the control unit (100) controls the coating unit (U1) to form the pre-baking resist film on the lower layer of the substrate (W) and to remove the peripheral portion of the pre-baking resist film, and controls the heat treatment unit (U2) to perform heat treatment on the substrate (W) to turn the pre-baking resist film into a resist film.

[0028] Additionally, the control unit (100) controls the return arm (A3) to return the substrate (W) to the inspection unit (U3) and obtains information indicating the surface condition of the substrate (W) from the inspection unit (U3). Afterward, the control unit (100) controls the return arm (A3) to return the substrate (W) to the shelf unit (U10) and controls the lifting arm (A7) to place the substrate (W) into a cell for the processing module (13).

[0029] Next, the control unit (100) controls the return arm (A3) to return the substrate (W) of the shelf unit (U10) to each unit within the processing module (13), and controls the coating unit (U1) and the heat treatment unit (U2) to form an upper layer film on the resist film of the substrate (W). Afterward, the control unit (100) controls the return arm (A3) to return the substrate (W) to the shelf unit (U11).

[0030] Next, the control unit (100) controls the transfer arm (A8) to send the substrate (W) of the shelf unit (U11) to the exposure device (3). Afterward, the control unit (100) receives the substrate (W) that has undergone exposure treatment from the exposure device (3) and controls the transfer arm (A8) to place it in a cell for the processing module (14) in the shelf unit (U11).

[0031] Next, the control unit (100) controls the return arm (A3) to return the substrate (W) of the shelf unit (U11) to the developing unit (U4) and the heat treatment unit (U5) within the processing module (14), thereby controlling the developing unit (U4) and the heat treatment unit (U5) to perform a developing treatment on the resist film of the substrate (W). Afterward, the control unit (100) controls the return arm (A3) to return the substrate (W) to the shelf unit (U10), and controls the lifting arm (A7) and the transfer arm (A1) to return the substrate (W) into the carrier (C). Thus, a series of control sequences for one substrate (W) is completed.

[0032] [Applied Unit]

[0033] Next, an example of the configuration of the coating unit (U1) in the processing module (12) will be described in detail. As described above, the coating unit (U1) supplies a processing liquid for forming a resist film to the surface (Wa) of the substrate (W) to form the resist film before baking. In addition, the coating unit (U1) (edge ​​removal unit) removes the edge portion of the resist film before baking by supplying a removal liquid to the edge portion of the substrate (W) after forming the resist film before baking on the surface (Wa) of the substrate (W).

[0034] As shown in FIG. 2, the coating unit (U1) has a rotation holding unit (20), a processing liquid supply unit (30), and a removal liquid supply unit (40). The rotation holding unit (20) holds and rotates a substrate (W). For example, the rotation holding unit (20) has a holding unit (21) and a rotation driving unit (22). The holding unit (21) supports a substrate (W) positioned horizontally with its surface (Wa) facing upward and holds the substrate (W) by adsorption (e.g., vacuum adsorption). The rotation driving unit (22) rotates the holding unit (21) around a vertical rotation center (CL) using, for example, an electric motor as a power source. By doing so, the substrate (W) rotates.

[0035] The processing liquid supply unit (30) supplies a processing liquid for forming a resist film on the surface (Wa) of the substrate (W). For example, the processing liquid supply unit (30) has a nozzle (31), a liquid source (32), a liquid delivery unit (33), and a nozzle moving unit (34). The nozzle (31) discharges the processing liquid toward the surface (Wa) of the substrate (W). The liquid source (32) receives the processing liquid and pressurizes the processing liquid to the nozzle (31). The liquid delivery unit (33) guides the processing liquid from the liquid source (32) to the nozzle (31). For example, the liquid delivery unit (33) has a liquid delivery line (L1) and a valve (V1). The liquid delivery line (L1) connects the liquid source (32) and the nozzle (31). The valve (V1) is, for example, an air operation valve and opens and closes the flow path within the liquid delivery line (L1). The nozzle moving part (34) moves the nozzle (31) between the center of rotation (CL) and the area outside the substrate (W) by means of a power source such as an electric motor.

[0036] The removal liquid supply unit (40) supplies a removal liquid to the surface (Wa) of the substrate (W). The removal liquid is a solvent capable of removing (dissolving) the pre-baking resist film formed by the processing liquid supplied from the processing liquid supply unit (30). Specific examples of the removal liquid include organic solvents such as thinner. For example, the removal liquid supply unit (40) has a nozzle (41), a liquid source (42), a liquid delivery unit (43), a flow sensor (45), and a nozzle moving unit (44).

[0037] The nozzle (41) discharges the removal liquid toward the periphery of the substrate (W) that is rotated by the rotation holding member (20). The nozzle (41) discharges the removal liquid toward the surface (Wa) of the substrate (W) that is rotated by the rotation holding member (20). The liquid source (42) receives the removal liquid and pressurizes the removal liquid toward the nozzle (41). The liquid delivery unit (43) guides the removal liquid from the liquid source (42) to the nozzle (41). For example, the liquid delivery unit (43) has a liquid delivery line (L2) and a valve (V2). The liquid delivery line (L2) connects the liquid source (42) and the nozzle (41). The valve (V2) is, for example, an air operation valve and opens and closes the flow path within the liquid delivery line (L2). The flow sensor (45) detects the flow rate (flow rate per unit time) of the removal liquid in the liquid delivery line (L2). The nozzle moving part (44) moves the nozzle (41) between the periphery of the substrate (W) and the area outside the substrate (W) by means of a power source such as an electric motor.

[0038] [Inspection Unit]

[0039] Next, an example of the configuration of the inspection unit (U3) will be described in detail. The inspection unit (U3) acquires image data as surface information indicating the state of the surface (Wa) by capturing the surface (Wa) of the substrate (W). As shown in FIG. 3, the inspection unit (U3) has a holding unit (51), a rotational driving unit (52), a position indicator detection unit (53), and an imaging unit (57).

[0040] The holding member (51) supports a substrate (W) that is horizontally positioned with its surface (Wa) facing upward, and holds the substrate (W) by suction (e.g., vacuum suction). The rotational driving member (52) rotates the holding member (51) around a vertical rotation center by means of a power source, such as an electric motor. As a result, the substrate (W) rotates.

[0041] The position indicator detection unit (53) detects a notch in the substrate (W). For example, the position indicator detection unit (53) has a light-emitting unit (55) and a light-receiving unit (56). The light-emitting unit (55) emits light toward the periphery of the rotating substrate (W). For example, the light-emitting unit (55) is positioned above the periphery of the substrate (W) and emits light toward the downward direction. The light-receiving unit (56) receives the light emitted by the light-emitting unit (55). For example, the light-receiving unit (56) is positioned below the periphery of the substrate (W) so as to face the light-emitting unit (55).

[0042] The imaging unit (57) is a camera that images at least the peripheral portion of the surface (Wa) of the substrate (W). For example, the imaging unit (57) images the peripheral portion of the surface (Wa) of the substrate (W) where a resist film is not formed (where the resist film is removed before baking). For example, the imaging unit (57) is positioned above the peripheral portion of the substrate (W) held in the holding unit (51) and faces downward.

[0043] [Control Unit]

[0044] The above-described coating unit (U1) and inspection unit (U3) are controlled by a control unit (100). The control sequence of the coating unit (U1) and inspection unit (U3) by the control unit (100) includes removing a peripheral portion of a resist film formed on the surface (Wa) of a substrate (W) by the coating unit (U1), obtaining a removal width profile from the inspection unit (U3) that indicates the relationship between a position in the periphery direction of the substrate (W) and the width of the portion of the resist film removed on the substrate (W) (hereinafter referred to as 'removal width'), and outputting factor information indicating the error factor of the removal width based on the removal width profile. The error refers to a deviation from a predetermined target value.

[0045] Errors in the removal width can occur due to various factors, and relying solely on the results of the error evaluation requires time to identify which factor caused the error. In contrast, the removal width profile, which represents the relationship between the position in the periphery direction of the substrate (W) and the removal width, tends to exhibit different characteristics depending on the error factor. Therefore, accurate factor information can be output by relying on the removal width profile.

[0046] Hereinafter, with reference to FIG. 4, the configuration of a control unit (100) for controlling a coating unit (U1) and an inspection unit (U3) is specifically illustrated. As shown in FIG. 4, the control unit (100) has, as functional components (hereinafter referred to as 'functional blocks'), a return control unit (111), a film formation control unit (112), a peripheral removal control unit (113), a program memory unit (114), a profile acquisition unit (115), a feature quantity calculation unit (116), a factor candidate memory unit (123), a device status acquisition unit (117), a record generation unit (118), and a data accumulation unit (119).

[0047] The return control unit (111) controls the return arm (A3) to return the substrate (W) based on an operation program stored in the program memory unit (114). The operation program of the return arm (A3) includes a time series of commands defined by at least one control parameter. Specific examples of the at least one control parameter include the return target position of the substrate (W) and the speed of movement toward the return target position.

[0048] The film formation control unit (112) controls the coating unit (U1) to form a pre-baking resist film on the surface of the substrate (W) based on an operation program stored in the program memory unit (114). The edge removal control unit (113) controls the coating unit (U1) to remove the edge portion of the pre-baking resist film based on an operation program stored in the program memory unit (114).

[0049] The operation program of the coating unit (U1) includes a time series of commands defined by at least one control parameter. Specific examples of at least one control parameter include the discharge amount of the processing liquid from the nozzle (31) for forming the resist film (discharge amount per unit time), the position of the nozzle (41) when discharging the removal liquid (e.g., the distance from the center of rotation (CL) to the center of the nozzle (41)), and the discharge amount of the removal liquid from the nozzle (41) (discharge amount per unit time). Instead of the discharge amount of the processing liquid from the nozzle (31), the degree of opening of the valve (V1) may be determined, and instead of the discharge amount of the removal liquid from the nozzle (41), the degree of opening of the valve (V2) may be determined.

[0050] The profile acquisition unit (115) acquires the removal width profile from the inspection unit (U3), which represents the relationship between a position in the periphery direction of the substrate (W) and the width of the portion of the substrate (W) where the resist film has been removed (the removal width). The position in the periphery direction of the substrate (W) is a position based on a position indicator detected by the position indicator detection unit (53), and is represented, for example, by an angle around the center circumference of the substrate (W). The width of the portion where the resist film has been removed is, for example, the width in the diameter direction of the substrate (W). The removal width profile may be point data that discretely represents the relationship between the position in the periphery direction of the substrate (W) and the removal width, or it may be function data that continuously represents the relationship between the position in the periphery direction of the substrate (W) and the removal width.

[0051] The feature quantity calculation unit (116) calculates a plurality of feature quantities corresponding to at least one error factor based on the removal width profile. The plurality of feature quantities include an evaluation value of the removal width, an evaluation value of the eccentricity of the periphery of the resist film relative to the periphery of the substrate (W), an evaluation value of the degree of perfection of the periphery of the resist film, and an evaluation value of the roughness of the periphery of the resist film. The evaluation value of the removal width is, for example, a value representing the overall trend of the removal width profile. Specific examples of such evaluation values ​​include an average value, a median value, etc.

[0052] The feature quantity calculation unit (116) calculates an approximate function of the outer shape of the resist film with the center of the substrate (W) as the origin based on the removal width profile, and calculates the evaluation value of the eccentricity, the evaluation value of the circularity, and the evaluation value of the roughness based on the said function.

[0053] Each of the multiple types of features calculated by the feature calculation unit (116) corresponds to at least one error factor in the factor candidate memory unit (123). The multiple types of features may include composite features corresponding to the multiple types of error factors.

[0054] For example, the width evaluation value corresponds to at least the positional misalignment of the nozzle (41) and the change in the discharge amount of the removal liquid from the nozzle (41) in the factor candidate memory unit (123). The change here refers to a long-term change that changes over a long period compared to the processing period for one substrate (W).

[0055] The evaluation value of eccentricity corresponds to the positional misalignment of the substrate (W) in at least the rotational holding part (20) in the factor candidate memory part (123), the evaluation value of circularity corresponds to the distortion of at least the substrate (W) and the distortion of the rotational holding part (20), and the evaluation value of roughness corresponds to the splashing of the removal liquid and the variation in the discharge amount of the removal liquid from the nozzle (41). The variation here refers to the variation within the processing period for one substrate (W). The evaluation values ​​of width, circularity, and roughness corresponding to at least two error factors correspond to the above composite type feature quantity.

[0056] The device status acquisition unit (117) acquires information indicating the operating status of at least the devices involved in forming the resist film, such as the return arm (A3) and the coating unit (U1). For example, the device status acquisition unit (117) acquires the position of the substrate (W) within the coating unit (U1) by the return arm (A3) (position of the substrate (W) in the rotation holding unit (20)), the position of the nozzle (41) when removing the resist film before baking, and the amount of removal liquid discharged from the nozzle (41) when removing the resist film before baking (e.g., the amount detected by the flow sensor (45)).

[0057] The record generation unit (118) generates a record including the result of calculating one feature quantity and the state of the coating unit (U1) corresponding to the feature quantity, and accumulates it in the data accumulation unit (119). Here, "corresponding" means corresponding to the same substrate (W). The state of the coating unit (U1) corresponding to the feature quantity means the state of the coating unit (U1) while performing a process to remove the resist liquid before baking on the substrate (W) that is the target of calculating the feature quantity.

[0058] The state of the coating unit (U1) includes, at least, the position of the substrate (W) in the rotation holding unit (20) (the position of the center of the substrate (W) relative to the rotation center (CL) of the holding unit (21), the position of the nozzle (41) when discharging the removal liquid, the amount of removal liquid discharged from the nozzle (41), and the range of variation of the amount of removal liquid discharged from the nozzle (41). The range of variation here refers to the range of variation within the processing period for one substrate (W). The data accumulation unit (119) accumulates records generated by the record generation unit (118).

[0059] The control unit (100) further comprises an evaluation unit (121), a contribution evaluation unit (122), and a factor estimation unit (124). The evaluation unit (121) evaluates the removal width based on a removal width profile. The evaluation result of the removal width by the evaluation unit (121) may include multiple types of evaluation values. For example, the evaluation result of the removal width by the evaluation unit (121) may include the maximum and minimum values ​​of the removal width in the removal width profile, or may include the maximum, average, and minimum values ​​of the removal width in the removal width profile.

[0060] The contribution evaluation unit (122) evaluates the contribution to the error of multiple types of features based on the calculation results of multiple types of features. The contribution is a value indicating the degree of influence on the error. The contribution is calculated by a known statistical calculation method.

[0061] The factor estimation unit (124) outputs factor information indicating the factors of the error in the removal width based on the removal width profile. The output includes displaying to a display device (196) described later, transmitting factor information to another device, etc. The output also includes outputting factor information to a function block that performs further processing based on the factor information, such as the parameter adjustment unit (125) described later.

[0062] The factor estimation unit (124) may output factor information based on the calculation results of multiple types of feature quantities. The factor estimation unit (124) may output factor information based on the contribution to the error of multiple types of feature quantities. The factor estimation unit (124) may output factor information based on at least one error factor corresponding to the feature quantity with the highest contribution among multiple types of error factors. For example, the factor estimation unit (124) outputs factor information representing the error factor corresponding to the feature quantity with the highest contribution.

[0063] The factor estimation unit (124) may output factor information indicating the contribution and at least one corresponding error factor for each of the multiple types of feature quantities. According to this factor information, the error factor corresponding to the feature quantity with the highest contribution can be indicated, and in addition, the contribution of that error factor can be indicated to some extent compared to the contribution of other error factors.

[0064] Additionally, the factor estimation unit (124) may output factor information indicating which of the multiple types of features has the highest contribution. If the user already knows which error factor corresponds to each of the multiple types of features, the error factor is indicated by indicating which of the multiple types of features has the highest contribution.

[0065] The factor estimation unit (124) may output factor information indicating the contribution for each of the multiple types of features. According to this factor information, the feature with the highest contribution can be indicated, and in addition, the contribution of that feature can be indicated to some extent compared to the contribution of other features.

[0066] The factor estimation unit (124) may output factor information based on the state of the coating unit (U1) and a plurality of error factors corresponding to the composite feature when the feature with the highest contribution is a composite feature. The state of the coating unit (U1) here is the state of the coating unit (U1) corresponding to the composite feature. Corresponding means corresponding to the same substrate (W). The state of the coating unit (U1) corresponding to the composite feature means the state of the coating unit (U1) while performing a process to remove the resist liquid before baking on the substrate (W) to be calculated for the composite feature.

[0067] For example, when the feature with the highest contribution is a composite feature, the factor estimation unit (124) may evaluate the correlation level between each of the multiple types of error factors and the composite feature based on the records accumulated by the data accumulation unit (119), and output factor information based on the result of the correlation level evaluation.

[0068] The factor estimation unit (124) may evaluate the correlation level between each of the multiple types of error factors and the composite feature quantity based on a predetermined number of series of records, including the latest record, among the records accumulated by the data accumulation unit (119). For example, the factor estimation unit (124) outputs factor information indicating an error factor with a relatively high correlation level for the composite feature quantity.

[0069] For example, when the feature quantity with the highest contribution is the width evaluation value, the factor estimation unit (124) evaluates the correlation level between the position of the nozzle (41) and the width evaluation value (hereinafter referred to as the "first correlation level") and the correlation level between the discharge amount of the removal liquid from the nozzle (41) and the evaluation value (hereinafter referred to as the "second correlation level") based on the aforementioned predetermined number of series of records. For example, the first correlation level represents the correlation level between the positional misalignment of the nozzle (41) and the width evaluation value. For example, the second correlation level represents the correlation level between the change in the discharge amount of the removal liquid from the nozzle (41) and the width evaluation value.

[0070] When the first correlation level is higher than the second correlation level, the factor estimation unit (124) outputs factor information indicating the positional misalignment of the nozzle (41) as the most likely error factor. When the second correlation level is higher than the first correlation level, the factor estimation unit (124) outputs factor information indicating the change in the discharge amount of the removal liquid from the nozzle (41) as the most likely error factor.

[0071] When the feature quantity with the highest contribution is the roughness evaluation value, the factor estimation unit (124) evaluates the correlation level (hereinafter referred to as the "third correlation level") between the variation range of the discharge amount of the removal liquid from the nozzle (41) and the roughness evaluation value based on the aforementioned predetermined number of series of records. If the third correlation level exceeds a predetermined level, the factor estimation unit (124) outputs factor information indicating the variation in the discharge amount of the removal liquid as the most likely error factor. If the third correlation level is less than a predetermined level, the factor estimation unit (124) outputs factor information indicating the splashing of the removal liquid as the most likely error factor.

[0072] The factor estimation unit (124) outputs factor information when the evaluation result of the removal width by the evaluation unit (121) is outside the defined range, and may omit the output of factor information when the evaluation result of the removal width by the evaluation unit (121) is within the defined range. For example, the factor estimation unit (124) outputs factor information when the maximum value of the removal width exceeds the upper limit of the defined range or when the minimum value of the removal width falls below the lower limit of the defined range, and may omit the output of factor information when both the maximum value and the minimum value of the removal width are within the defined range.

[0073] Accordingly, the contribution evaluation unit (122) calculates the contribution when the evaluation result of the removal width by the evaluation unit (121) is outside the defined range, and may omit the calculation of the contribution when the evaluation result of the removal width by the evaluation unit (121) is within the defined range. For example, the contribution evaluation unit (122) calculates the contribution when the maximum value of the removal width exceeds the upper limit of the defined range or when the minimum value of the removal width falls below the lower limit of the defined range, and may omit the calculation of the contribution when both the maximum value and the minimum value of the removal width are within the defined range.

[0074] The control unit (100) may further include a parameter adjustment unit (125). The parameter adjustment unit (125) adjusts at least one control parameter in an operation program stored by the program memory unit (114) based on factor information. For example, the parameter adjustment unit (125) changes at least one control parameter to reduce the error factor indicated by the factor information.

[0075] For example, the parameter control unit (125) changes the position of the nozzle (41) when discharging the removal liquid when the most likely error factor is a misalignment of the nozzle (41). The parameter control unit (125) changes the amount of removal liquid discharged from the nozzle (41) when the most likely error factor is a change in the amount of removal liquid discharged from the nozzle (41). The parameter control unit (125) changes the placement position of the substrate (W) within the coating unit (U1) by the return arm (A3) when the most likely error factor is a misalignment of the substrate (W) in the rotation holding unit (20).

[0076] FIG. 5 is a block diagram illustrating the hardware configuration of a control unit (100). The control unit (100) is configured by one or more control computers. As shown in FIG. 5, the control unit (100) has a circuit (190). The circuit (190) includes at least one processor (191), a memory (192), a storage (193), an input / output port (194), an input device (195), and a display device (196). The storage (193) has a memory medium readable by a computer, such as a hard disk, for example. Storage (193) stores a program for executing to the control unit (100) the following: removing a peripheral portion of a resist film formed on the surface (Wa) of a substrate (W) by the coating unit (U1); obtaining a removal width profile from the inspection unit (U3) that indicates the relationship between a position in the periphery direction of the substrate (W) and the removal width; and outputting factor information indicating the factor of the error in the removal width based on the removal width profile. For example, storage (193) stores a program for configuring each of the above-described function blocks in the control unit (100).

[0077] The memory (192) temporarily stores a program loaded from a storage medium of the storage (193) and the result of an operation by the processor (191). The processor (191) executes the program in cooperation with the memory (192) to configure each of the above-described function modules. The input / output port (194) performs input and output of electrical signals between the return arm (A3), the coating unit (U1), and the inspection unit (U3) according to a command from the processor (191). The input device (195) and the display device (196) function as user interfaces of the control unit (100). The input device (195) is, for example, a keyboard, and acquires input information by the user. The display device (196) includes, for example, a liquid crystal monitor, and is used to display information to the user. The display device (196) is, for example, used to display the above-described factor information. The input device (195) and the display device (196) may be integrated as a so-called touch panel.

[0078] [Control Sequence]

[0079] Hereinafter, as an example of a method for estimating substrate processing, the control sequence of the coating and developing device (2) by the control unit (100) is exemplified. The overall sequence is as described in the [Substrate Processing Device] section. The control sequence of the coating and developing device (2) by the control unit (100) includes, in addition to the overall sequence described above, a film formation control sequence, a removal profile acquisition sequence, and a factor information output sequence.

[0080] The film formation control sequence is a control sequence in which the control unit (100) performs the formation of a resist film before baking and the removal of the peripheral portion of the resist film before baking in the coating unit (U1). The removal profile acquisition sequence is a sequence in which the control unit (100) acquires a removal profile by measuring at least two removal widths in the periphery direction of the substrate (W) with the inspection unit (U3). The factor information output sequence is a sequence in which the control unit (100) outputs factor information indicating the factor of the error in the removal width based on the removal profile. Below, each of the film formation control sequence, the removal profile acquisition sequence, and the factor information output sequence is illustrated in detail.

[0081] (Order of Tabernacle Control)

[0082] As shown in FIG. 6, the control unit (100) executes steps (S01, S02, S03, S04, S05, S06, S07) in sequence. In step (S01), based on an operation program stored in the program memory unit (114), the return control unit (111) controls the return arm (A3) to place the substrate (W) within the coating unit (U1). At this time, the device state acquisition unit (117) acquires information on the placement position of the substrate (W) by the return arm (A3). In step (S02), the film formation control unit (112) holds the substrate (W) placed within the coating unit (U1) by the return arm (A3) in the holding unit (21). In step (S03), the film formation control unit (112) initiates the rotation of the holding unit (21) and the substrate (W) by the rotation drive unit (22).

[0083] In step (S04), based on the operation program stored in the program memory unit (114), the film formation control unit (112) controls the coating unit (U1) to form a pre-baking resist film on the surface (Wa) of the substrate (W). For example, the film formation control unit (112) controls the nozzle moving unit (34) to position the nozzle (31) on the rotation center (CL) of the substrate (W), and controls the liquid delivery unit (33) to discharge the processing liquid from the nozzle (31) for a set period. By doing so, a liquid film of the processing liquid is formed on the surface (Wa). Afterward, the film formation control unit (112) controls the liquid delivery unit (33) to stop the discharge of the processing liquid from the nozzle (31), and the nozzle (31) is withdrawn from the substrate (W) by the nozzle moving unit (34). After the discharge of the processing liquid is stopped, the film formation control unit (112) controls the rotation drive unit (22) to continue rotating the substrate (W) for a set period. By doing so, the drying of the liquid film proceeds, and a resist film is formed before baking.

[0084] In step (S05), based on the operation program stored in the program memory unit (114), the edge removal control unit (113) controls the coating unit (U1) to remove the edge portion of the resist film before baking. For example, the edge removal control unit (113) controls the nozzle moving unit (44) to position the nozzle (41) on the edge portion of the substrate (W), and controls the liquid delivery unit (43) to continue the discharge of the removal liquid from the nozzle (41) for a set period. By doing so, the edge portion of the resist film before baking is removed.

[0085] When the resist film is removed before baking, the device state acquisition unit (117) acquires information on the placement position of the nozzle (41) by the nozzle moving unit (44) and the amount of removal liquid discharged from the nozzle (41) (e.g., a value detected by a flow sensor (45)). Afterward, the main removal control unit (113) controls the liquid delivery unit (43) to stop the discharge of removal liquid from the nozzle (41) and moves the nozzle (41) away from the substrate (W) by the nozzle moving unit (44).

[0086] In step (S06), the main removal control unit (113) stops the rotation of the holding unit (21) and the substrate (W) by means of the rotation drive unit (22). In step (S07), the main removal control unit (113) releases the substrate (W) from the holding unit (21), and the return control unit (111) controls the return arm (A3) to remove the substrate (W) from the coating unit (U1). The film formation control sequence is completed as described above.

[0087] (Order of acquiring removal profiles)

[0088] As shown in FIG. 7, the control unit (100) first executes steps (S11, S12, S13, S14, S15, S16, S17). In step (S11), based on an operation program stored in the program memory unit (114), the return control unit (111) controls the return arm (A3) to place the substrate (W) into the inspection unit (U3). In step (S12), the profile acquisition unit (115) holds the substrate (W) placed into the inspection unit (U3) by the return arm (A3) in the holding unit (51). In step (S13), the profile acquisition unit (115) initiates the rotation of the holding unit (51) and the substrate (W) by the rotation drive unit (52).

[0089] In step (S14), the profile acquisition unit (115) waits for the detection of a position indicator (e.g., a notch) by the position indicator detection unit (53). In step (S15), the profile acquisition unit (115) waits for the rotation angle after notch detection to reach a predetermined measurement angle. In step (S16), the profile acquisition unit (115) captures the periphery of the substrate (W) with the imaging unit (57), calculates the removal width based on the captured image, and stores it in correspondence with the current measurement angle. In step (S17), the profile acquisition unit (115) checks whether the acquisition of the removal width over the entire periphery of the substrate (W) has been completed. For example, the profile acquisition unit (115) checks whether the acquisition of the removal width has been completed for all predetermined measurement points along the periphery of the substrate (W).

[0090] If it is determined that a portion for which the removal width acquisition is not completed remains at the periphery of the substrate (W) in step (S17), the control unit (100) returns the processing to step (S15). Subsequently, the acquisition of the removal width corresponding to a predetermined measurement angle is repeated until the acquisition of the removal width is completed over the entire periphery.

[0091] In step (S17), when it is determined that the acquisition of the removal width over the entire circumference of the substrate (W) is complete, the control unit (100) executes steps (S18, S19). In step (S18), the profile acquisition unit (115) stops the rotation of the holding unit (51) and the substrate (W) by the rotation drive unit (52). In step (S19), the profile acquisition unit (115) releases the substrate (W) from the holding unit (51), and the return control unit (111) controls the return arm (A3) so that the substrate (W) is removed from the inspection unit (U3). The sequence for acquiring the removal profile is completed.

[0092] (Output order of factor information)

[0093] As shown in FIG. 8, the control unit (100) first executes steps (S21, S22, S23, S24, S25). In step (S21), the feature quantity calculation unit (116) waits for the acquisition of the removal profile by the profile acquisition unit (115) to be completed. In step (S22), the feature quantity calculation unit (116) calculates the plurality of types of feature quantities based on the removal width profile. In step (S23), the record generation unit (118) generates a record including the result of calculating the feature quantity and the state of the coating unit (U1) corresponding to the feature quantity, and accumulates it in the data accumulation unit (119). The record generation unit (118) acquires information indicating the state of the coating unit (U1) corresponding to the feature quantity from the device state acquisition unit (117).

[0094] In step (S24), the evaluation unit (121) evaluates the removal width based on the removal width profile. For example, the evaluation unit (121) evaluates the maximum and minimum values ​​of the removal width in the removal width profile. In step (S25), the contribution evaluation unit (122) checks whether the result of the evaluation of the removal width by the evaluation unit (121) is outside the defined range. For example, the contribution evaluation unit (122) determines that the result of the evaluation of the removal width is outside the defined range if the maximum value of the removal width exceeds the upper limit of the defined range, and also determines that the result of the evaluation of the removal width is outside the defined range if the minimum value of the removal width falls below the lower limit of the defined range.

[0095] In step (S25), if the evaluation result of the removal width is determined to be outside the defined range, the control unit (100) executes steps (S26, S27, S28). In step (S26), the contribution evaluation unit (122) evaluates the contribution to the error of multiple types of features based on the calculation result of multiple types of features. In step (S27), the factor estimation unit (124) derives the error factor corresponding to the feature with the highest contribution based on the factor candidate memory unit (123). In step (S28), the factor estimation unit (124) checks whether the feature with the highest contribution is the composite type feature.

[0096] In step (S28), if it is determined that the feature with the highest contribution is a composite feature, the control unit (100) executes steps (S31, S32, S33). In step (S31), when the feature with the highest contribution is a composite feature, the factor estimation unit (124) evaluates the correlation level between each of the multiple types of error factors and the composite feature based on the records accumulated by the data accumulation unit (119). In step (S32), the factor estimation unit (124) selects the error factor with the highest correlation level with the composite feature among the multiple error factors corresponding to the composite feature. In step (S33), the factor estimation unit (124) outputs factor information representing the error factor selected in step (S32).

[0097] In step (S28), if it is determined that the feature with the highest contribution is not a composite feature, the control unit (100) executes step (S33) without executing steps (S31, S32). In this case, the factor estimation unit (124) outputs factor information representing the error factor derived in step (S27).

[0098] Next, the control unit (100) executes step (S34). In step (S34), the parameter adjustment unit (125) adjusts at least one control parameter in an operation program stored by the program memory unit (114) based on factor information.

[0099] In step (S25), if the evaluation result of the removal width is determined to be within a defined range, the contribution evaluation unit (122) omits the calculation of the contribution, the factor estimation unit (124) omits the output of factor information, and the parameter adjustment unit (125) omits the adjustment of the control parameter. The output sequence of factor information is completed as described above.

[0100] [Effects of the present embodiment]

[0101] As described above, the coating and developing device (2) (substrate processing device) comprises a coating unit (U1) (edge ​​removal unit) for removing the edge portion of a film formed on the surface (Wa) of a substrate (W), a profile acquisition unit (115) for acquiring a removal width profile that indicates the relationship between a position in the periphery direction of the substrate (W) and the width of the portion of the film removed on the substrate (W), and a factor estimation unit (124) for outputting factor information indicating the factor of the width error based on the removal width profile.

[0102] Errors in the removal width can occur due to various factors, and relying solely on the results of the error evaluation requires time to identify which factor caused the error. In contrast, the removal width profile, which represents the relationship between the position in the circumferential direction of the substrate (W) and the removal width, tends to exhibit different characteristics depending on the error factor. Therefore, accurate factor information can be output by relying on the removal width profile. By relying on accurate factor information, it becomes possible to quickly identify and adjust the error factor. Accordingly, the coating and developing device (2) is effective for accelerating the adjustment of the removal width.

[0103] The coating and developing device (2) further comprises an evaluation unit (121) that evaluates the width based on a removal width profile, and the factor estimation unit (124) may output factor information when the evaluation result of the width is outside a predetermined range. In this case, the information processing load in the coating and developing device (2) can be reduced by performing the output processing of factor information only when the evaluation result of the error exceeds a predetermined level.

[0104] The coating and developing device (2) further comprises a feature quantity calculation unit (116) that calculates multiple types of feature quantities corresponding to at least one error factor based on a removal width profile, and the factor estimation unit (124) may output factor information based on the calculation result of multiple types of feature quantities. In this case, factor information can be output more easily.

[0105] Multiple types of feature quantities may include an evaluation value of width, an evaluation value of eccentricity of the film margin relative to the substrate margin, an evaluation value of roundness of the film margin, and an evaluation value of roughness of the film margin. In this case, more useful factor information can be output.

[0106] The coating unit (U1) has a rotation holding part (20) that holds and rotates a substrate (W), and a nozzle (41) that discharges a removal liquid for removing a film toward the periphery of the substrate (W) held and rotated by the rotation holding part (20). The width evaluation value corresponds to at least the positional misalignment of the nozzle (41) and the change in the amount of removal liquid discharged from the nozzle (41), the eccentricity evaluation value corresponds to at least the positional misalignment of the substrate (W) in the rotation holding part (20), the circularity evaluation value corresponds to at least the distortion of the substrate (W) and the distortion of the rotation holding part (20), and the roughness evaluation value corresponds to at least the splashing of the removal liquid and the change in the amount of removal liquid discharged from the nozzle (41). In this case, more useful factor information can be output.

[0107] The coating and developing device (2) further comprises a contribution evaluation unit (122) that evaluates the contribution to the error of multiple types of feature quantities based on the calculation results of multiple types of feature quantities, and the factor estimation unit (124) may output factor information based on the contribution to the error of multiple types of feature quantities. In this case, more accurate factor information can be easily output.

[0108] The factor estimation unit (124) may output factor information based on at least one error factor corresponding to the feature quantity with the highest contribution among a plurality of types of error factors. In this case, more easily understandable factor information can be output.

[0109] Multiple types of feature quantities include composite feature quantities corresponding to multiple types of error factors, and the factor estimation unit (124) may output factor information based on the multiple types of error factors corresponding to said composite feature quantity and the state of the coating unit (U1) when the feature quantity with the highest contribution is the composite feature quantity. In this case, more accurate factor information can be output.

[0110] Although embodiments have been described above, the present disclosure is not necessarily limited to the embodiments described above, and various modifications are possible within the scope of not departing from the gist thereof.

Claims

Claim 1 A factor estimation device comprising: a profile acquisition unit that acquires a removal width profile indicating the relationship between a position in the periphery direction of a substrate in which a film is formed on a surface and a peripheral portion of the film is removed by a peripheral removal unit and the width of the portion in which the film is removed on the substrate; a feature quantity calculation unit that calculates a plurality of types of feature quantities corresponding to at least one error factor of the width based on the removal width profile; a contribution evaluation unit that evaluates the contribution of the plurality of types of feature quantities to the error based on the calculation result of the plurality of types of feature quantities; and a factor estimation unit that outputs factor information indicating the error factor based on the contribution of the plurality of types of feature quantities to the error. Claim 2 In claim 1, the factor estimation unit outputs factor information based on at least one error factor corresponding to the feature quantity with the highest contribution among a plurality of types of error factors. Claim 3 A factor estimation device according to claim 1 or 2, wherein the plurality of types of feature quantities include composite feature quantities corresponding to the plurality of types of error factors, and the factor estimation unit outputs factor information based on the plurality of types of error factors corresponding to the composite feature quantities and the state of the leading edge removal unit when the feature quantity with the highest contribution is the composite feature quantity. Claim 4 In claim 1, the factor estimation unit is a factor estimation device that outputs the contribution to each of the plurality of types of feature quantities as the factor information. Claim 5 A factor estimation device according to claim 1, wherein the output of the factor estimation unit includes displaying the factor information on a display device. Claim 6 A factor estimation device according to claim 5, wherein the plurality of characteristic quantities comprises at least two of the following: an evaluation value of the eccentricity of the periphery of the film relative to the periphery of the substrate, an evaluation value of the circularity of the periphery of the film, and an evaluation value of the roughness of the periphery of the film. Claim 7 In claim 6, the peripheral removal unit comprises a rotation holding unit that holds and rotates the substrate, and a nozzle that discharges a removal liquid for removing the film toward the peripheral portion of the substrate held and rotated by the rotation holding unit, wherein the evaluation value of the eccentricity corresponds to at least the positional misalignment of the substrate in the rotation holding unit, the evaluation value of the circularity corresponds to at least one of the distortion of the substrate and the distortion of the rotation holding unit, and the evaluation value of the roughness corresponds to at least one of the splashing of the removal liquid and the variation in the discharge amount of the removal liquid from the nozzle, a factor estimation device. Claim 8 A factor estimation method comprising: acquiring a removal width profile that indicates the relationship between a position in the periphery direction of a substrate in which a film is formed on a surface and a peripheral portion of the film is removed by a peripheral removal portion, and the width of the portion in which the film is removed on the substrate; calculating a plurality of types of feature quantities corresponding to at least one error factor of the width based on the removal width profile; evaluating the contribution of the plurality of types of feature quantities to the error based on the calculation result of the plurality of types of feature quantities; and outputting factor information indicating the error factor based on the contribution of the plurality of types of feature quantities to the error. Claim 9 A factor estimation method according to claim 8, which outputs factor information based on at least one error factor corresponding to the feature quantity with the highest contribution among a plurality of types of error factors. Claim 10 A factor estimation method according to claim 8, wherein the plurality of types of feature quantities include composite feature quantities corresponding to the plurality of types of error factors, and when the feature quantity with the highest contribution is the composite feature quantity, the factor information is output based on the plurality of types of error factors corresponding to the composite feature quantity and the state of the leading edge removal unit. Claim 11 A factor estimation method according to claim 8, which outputs the contribution to each of the plurality of feature quantities as the factor information. Claim 12 A factor estimation method according to claim 8, wherein the output of the factor information comprises displaying the factor information on a display device. Claim 13 A method for estimating factors according to claim 12, wherein the plurality of characteristic quantities include at least two of the evaluation value of the eccentricity of the periphery of the film relative to the periphery of the substrate, the evaluation value of the circularity of the periphery of the film, and the evaluation value of the roughness of the periphery of the film. Claim 14 A method for estimating factors according to claim 13, wherein the peripheral removal unit comprises a rotational holding unit that holds and rotates the substrate, and a nozzle that discharges a removal liquid for removing the film toward the peripheral portion of the substrate held and rotated by the rotational holding unit, wherein the evaluation value of the eccentricity corresponds to at least the positional misalignment of the substrate in the rotational holding unit, the evaluation value of the circularity corresponds to at least one of the distortion of the substrate and the distortion of the rotational holding unit, and the evaluation value of the roughness corresponds to at least one of the splashing of the removal liquid and the variation in the discharge amount of the removal liquid from the nozzle. Claim 15 A computer-readable storage medium storing a program for executing a factor estimation method described in any one of claims 8 to 14 on a device.

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