An interposer structure and an electronic device including the same

Abstract

The present disclosure relates to an interposer structure and an electronic device including the same. An interposer structure according to one embodiment of the present disclosure may include: an insulating layer having at least one through hole; a first solder resist layer having at least one first opening formed in an area corresponding to the at least one through hole located in at least one area of ​​the upper surface of the insulating layer; a second solder resist layer having at least one second opening formed in an area corresponding to the at least one through hole located in at least one area of ​​the lower surface of the insulating layer; at least one conductive via located within the at least one through hole; the at least one conductive via may include a first protruding portion formed by protruding in the direction of the at least one first opening and a second protruding portion formed by protruding in the direction of the at least one second opening; a first presolder disposed at the upper end of the first protruding portion of the at least one conductive via and a second presolder disposed at the lower end of the second protruding portion of the at least one conductive via.

Description

Technology Field

[0001] Various embodiments of the present disclosure relate to an interposer structure and an electronic device including the same. Background Technology

[0002] As the size of electronic devices is gradually becoming smaller while their functions are becoming more diverse, it has become important to secure space where electronic components (e.g., processors, communication circuits, and / or memory) required to perform these various functions can be arranged at high density.

[0003] Recently, there has been an increase in electronic devices that form a stacked structure of multiple printed circuit boards using an interposer to secure space for placing electronic components. For example, the electronic device can secure space for placing electronic components by stacking multiple printed circuit boards and placing an interposer, which includes at least one via for electrically connecting the printed circuit boards, between the stacked printed circuit boards. The problem to be solved

[0004] In order to stack multiple printed circuit boards using an interposer, it is necessary to firmly secure the multiple printed circuit boards to the top and / or bottom of the interposer.

[0005] In order to firmly secure multiple printed circuit boards, electronic devices with a structure in which a land is formed on the top and / or bottom of at least one via penetrating the interposer, and then a pre-solder is placed on the land to secure (or "solder") multiple printed circuit boards to the interposer have gradually increased.

[0006] However, in the case of the above-described structure, it is necessary to space the distance (pitch) between vias apart by more than a specified distance in order to secure space for a land to be formed at the top and / or bottom of at least one via. In order to maintain electrical connection between electronic components, the distance between electronic components must also be spaced apart to correspond to the distance between vias, so it may be difficult to mount electronic components at high density on multiple printed circuit boards in an electronic device to which the above-described structure is applied.

[0007] In addition, conventional interposers were generally manufactured through a process in which the inside of a hole (or "via hole") formed in a printed circuit board (PCB) was primarily plated, the inside of the plated hole was filled with a dielectric material (e.g., PSR ink (photo imageable solder resist mask ink)) to form a via, and the top, bottom, and / or sides of the printed circuit board were secondarily plated to form lands and side plated portions. In other words, since conventional interposers are manufactured by additionally plating the printed circuit board to form lands in addition to the process of plating the printed circuit board to form vias, the manufacturing process becomes longer and manufacturing costs increase, which can result in reduced reliability of the manufactured product or defects occurring during the manufacturing process.

[0008] The present disclosure aims to provide an interposer structure and an electronic device including the same, which enables high-density mounting of electronic components and can also reduce manufacturing costs and manufacturing processes by applying a structure in which lands are not formed on the top and / or bottom of a printed circuit board (PCB) (or a "landless structure").

[0009] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0010] An interposer structure according to one embodiment of the present disclosure may include: an insulating layer having at least one through hole; a first solder resist layer having at least one first opening formed in an area corresponding to the at least one through hole located in at least one area of ​​the upper surface of the insulating layer; a second solder resist layer having at least one second opening formed in an area corresponding to the at least one through hole located in at least one area of ​​the lower surface of the insulating layer; at least one conductive via located within the at least one through hole; the at least one conductive via includes a first protruding portion formed by protruding in the direction of the at least one first opening and a second protruding portion formed by protruding in the direction of the at least one second opening; a first presolder disposed at the upper end of the first protruding portion of the at least one conductive via; and a second presolder disposed at the lower end of the second protruding portion of the at least one conductive via.

[0011] An interposer structure according to another embodiment of the present disclosure comprises: an insulating layer comprising at least one through hole and a slot; a first solder resist layer located in at least one region of the upper surface of the insulating layer and comprising at least one first opening formed in a region corresponding to the at least one through hole and at least one second opening formed in a region corresponding to at least one region of the slot; a second solder resist layer located in at least one region of the lower surface of the insulating layer and comprising at least one third opening formed in a region corresponding to the at least one through hole and at least one fourth opening formed in a region corresponding to at least one region of the slot; a first conductive via located within the at least one through hole and formed to have a first height, wherein the first conductive via comprises a first protruding portion formed protruding in the direction of the at least one first opening and a second protruding portion formed protruding in the direction of the at least one third opening; a second conductive via located within the slot and formed to have a second height lower than the first height; and the first conductive via and the second It may include a first presolder disposed at the top of a conductive via and a second presolder disposed at the bottom of the first conductive via and the second conductive via.

[0012] An electronic device according to one embodiment of the present disclosure comprises: a first printed circuit board; a second printed circuit board spaced apart from the first printed circuit board and facing at least one surface of the first printed circuit board; at least one electronic component disposed on the first printed circuit board or the second printed circuit board; and an interposer disposed between the first printed circuit board and the second printed circuit board and arranged to surround the space between the first printed circuit board and the second printed circuit board, wherein the interposer comprises a first surface facing the first printed circuit board and a second surface facing the second printed circuit board, and an insulating layer comprising at least one through hole formed through the first surface and the second surface. A first solder resist layer disposed in at least one region of the first surface of the insulating layer and comprising a first opening formed in a region corresponding to the at least one through hole. The invention includes a second solder resist layer comprising a second opening formed in an area corresponding to the at least one through hole and disposed in at least one area of ​​the second surface of the insulating layer, and a first conductive via comprising a first protrusion formed protruding from the first surface of the insulating layer to the first solder resist layer and a second protrusion formed protruding from the second surface of the insulating layer to the second solder resist layer, wherein the first printed circuit board can be electrically connected to the second printed circuit board through the first conductive via. Effects of the invention

[0013] An interposer structure according to various embodiments of the present disclosure can reduce the pitch between conductive vias by not forming lands, and as a result, electronic components can be mounted at a high density on a printed circuit board placed on the top and / or bottom of the interposer structure.

[0014] The interposer structure according to various embodiments of the present disclosure can reduce manufacturing costs by omitting the plating process for creating lands.

[0015] The interposer structure according to various embodiments of the present disclosure can simplify the manufacturing process (e.g., omit the side plating process), thereby improving manufacturing efficiency. Brief explanation of the drawing

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment. FIG. 3 is a perspective view showing the rear side of the electronic device of FIG. 2. FIG. 4 is an exploded perspective view of an electronic device according to one embodiment. FIG. 5 is an exploded view and an assembled view of a printed circuit board structure according to one embodiment. FIG. 6 is an enlarged view of an interposer structure and region A of the interposer structure according to one embodiment. FIG. 7 is a cross-sectional view of the interposer structure of FIG. 6 cut in the II' direction. FIG. 8 is a flowchart illustrating the manufacturing operation of an interposer structure according to one embodiment. FIG. 9a is a drawing for explaining the operation of forming at least one through hole in a printed circuit board according to one embodiment. FIG. 9b is a diagram illustrating the operation of filling a conductive material inside at least one through hole and flattening a printed circuit board according to one embodiment. FIG. 9c is a drawing for explaining the operation of etching a printed circuit board according to one embodiment. FIG. 9d is a drawing for explaining the operation of forming a solder resist layer on the top surface and / or bottom surface of a printed circuit board according to one embodiment. FIG. 9e is a diagram illustrating the operation of forming a presolder according to one embodiment. FIG. 10 is an enlarged view of an interposer structure and region B of the interposer structure according to another embodiment. FIG. 11a is a cross-sectional view of the interposer structure of FIG. 10 cut in the II' direction. FIG. 11b is a cross-sectional view of the interposer structure of FIG. 10 cut in the II-II' direction. FIG. 11c is a cross-sectional view of the interposer structure of FIG. 10 cut in the direction III-III'. FIG. 11d is a drawing showing the state in which the solder resist layer and / or pre-solder is removed from the interposer structure of FIG. 10. FIG. 12 is a flowchart illustrating the manufacturing operation of an interposer structure according to another embodiment. FIG. 13a is a drawing for illustrating the operation of forming at least one through hole and / or slot in a printed circuit board according to one embodiment. FIG. 13b is a drawing illustrating the operation of filling a conductive material inside at least one through hole and / or slot and flattening a printed circuit board according to one embodiment. FIG. 13c is a drawing for explaining the operation of etching a printed circuit board according to one embodiment. FIG. 13d is a drawing for explaining the operation of forming a solder resist layer on the top surface and / or bottom surface of a printed circuit board according to one embodiment. FIG. 13e is a drawing for explaining the operation of forming a presolder according to one embodiment. FIG. 14 is an enlarged view of an interposer structure and region C of the interposer structure according to another embodiment. FIG. 15a is a cross-sectional view taken in the II' direction of the interposer structure of FIG. 14, according to one embodiment. FIG. 15b is a cross-sectional view of the interposer structure of FIG. 14 cut in the II' direction according to another embodiment. FIG. 16 is a flowchart illustrating the manufacturing operation of an interposer structure according to another embodiment. FIG. 17a is a drawing for explaining the operation of forming at least one through hole in a printed circuit board according to one embodiment. FIG. 17b is a drawing illustrating the operation of plating the inside of at least one through hole and / or the side of the insulating layer according to one embodiment. FIG. 17c is a drawing for explaining the operation of filling a conductive material inside at least one through hole and flattening a printed circuit board according to one embodiment. FIG. 17d is a drawing for explaining the operation of etching a printed circuit board according to one embodiment. FIG. 17e is a drawing for explaining the operation of forming a solder resist layer on the top surface and / or bottom surface of a printed circuit board according to one embodiment. FIG. 17f is a drawing for explaining the operation of forming a presolder according to one embodiment. Specific details for implementing the invention

[0017] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0018] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0019] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0020] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0021] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0022] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0023] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0024] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0025] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0026] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0027] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0028] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0029] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0031] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0032] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0033] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0035] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0036] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0037] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0038] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0039] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0041] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0042] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0043] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0044] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0045] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0046] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment, and FIG. 3 is a perspective view showing the rear of the electronic device of FIG. 2.

[0049] Referring to FIGS. 2 and 3, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or "front surface") (210A), a second surface (or "rear surface") (210B), and a side (or "side wall") (210C) surrounding the space between the first surface (210A) and the second surface (210B). In another embodiment (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIGS. 2 and 3.

[0050] According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. According to an embodiment, the front plate (202) may include a curved portion that extends seamlessly from the first surface (210A) toward the rear plate (211) at least at one side edge portion.

[0051] According to one embodiment, the second surface (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. According to an embodiment, the back plate (211) may include a curved portion that extends seamlessly from the second surface (210B) toward the front plate (202) at least one end.

[0052] According to one embodiment, the side (210C) may be formed by a side member (or "bracket") (218) comprising a metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side member (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0053] According to one embodiment, the electronic device (200) may include at least one of a display (201) (e.g., display module (160) of FIG. 1), an audio module (203) (e.g., audio module (170) of FIG. 1), a sensor module (not shown) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213, 214, 215) (e.g., camera module (180) of FIG. 1), a flash (206), a key input device (217) (e.g., input module (150) of FIG. 1), and a connector hole (208) (e.g., connection terminal (178) of FIG. 1). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., key input device (217)) or additionally include other components. For example, the electronic device (200) may include a sensor module not shown. For example, within the area provided by the front plate (202), a sensor such as a proximity sensor or an illuminance sensor may be integrated into the display (201) or positioned adjacent to the display (201). In some embodiments, the electronic device (200) may further include a light-emitting element, and the light-emitting element may be positioned adjacent to the display (201) within the area provided by the front plate (202). The light-emitting element may, for example, provide state information of the electronic device (200) in the form of light. In other embodiments, the light-emitting element may, for example, provide a light source that is coupled with the operation of the camera module (205). The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

[0054] The display (201) may be visible to the outside of the electronic device (200), for example, through a significant portion of the front plate (202). In some embodiments, the edges of the display (201) may be formed to be largely identical to the adjacent outer shape (e.g., curved surface) of the front plate (202). In other embodiments (not shown), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be largely identical in order to expand the area where the display (201) is exposed. In other embodiments (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display (201), and other electronic components aligned with said recess or opening, such as a camera module (205, or camera device), a proximity sensor or an illuminance sensor not shown, may be included.

[0055] According to one embodiment, at least one camera module (205, 212, 213, 214, 215) may be positioned in the lower direction (e.g., -z-axis direction) of the display (201). For example, the first camera module (205) may be positioned in at least a portion of the display (201) corresponding to the camera field of view (FOV). As the first camera device (205) is positioned in at least a portion of the display (201) corresponding to the camera field of view (FOV), the position of the first camera module (205) may not be visually distinguishable (or exposed). According to one embodiment, when the display (201) is viewed from the first surface (210A), the first camera module (205) is positioned in a portion corresponding to the camera field of view (FOV), which is at least a part of the display (201), so that an image of an external subject can be acquired without being visually exposed to the outside. For example, the first camera device (205) may be an under-display camera (UDC).

[0056] In one embodiment, the electronic device (200) may include a display (not shown) that is slidably positioned to provide a screen (e.g., a display area). For example, the display area of ​​the electronic device (200) may be an area that is visually exposed and capable of outputting an image. In one example, the electronic device (200) may adjust the display area according to the movement of a sliding plate (not shown) or the movement of the display. For example, the electronic device (200) may include a rollable electronic device configured to allow selective expansion of the display area by ensuring that at least a part of the electronic device (200) (e.g., a housing (210)) operates at least partially slidably. The above-described display may be referred to, for example, as a slide-out display or an expandable display.

[0057] In another embodiment (not shown), at least one of a camera module (e.g., 212, 213, 214, 215), a fingerprint sensor, and a flash (206) may be included on the back side (e.g., the second side (210B)) of the screen display area of ​​the display (201). In yet another embodiment (not shown), the display (201) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field type stylus pen.

[0058] In one embodiment, the audio module (203) may include a microphone hole and / or a speaker hole. A microphone may be placed inside the microphone hole to acquire external sound, and in some embodiments, a plurality of microphones may be placed to detect the direction of sound. In some embodiments, the speaker hole and the microphone hole may be implemented as a single hole (203), or a speaker may be included without a speaker hole (e.g., a piezo speaker). The speaker hole may include an external speaker hole and a receiver hole for calls.

[0059] In one embodiment, the electronic device (200) may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state by including a sensor module not illustrated. The sensor module may further include, for example, a proximity sensor disposed on a first surface (210A) of the housing (210), a fingerprint sensor integrated into or adjacent to the display (201), and / or a biosensor (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The electronic device (200) may further include at least one of the sensor module not illustrated, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] In one embodiment, the camera modules (205, 212, 213, 214, 215) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), and a second camera module (212, 213, 214, 215) disposed on a second surface (210B). The above-described camera modules (205, 212, 213, 214, 215) may include one or more lenses, an image sensor, and / or an image signal processor. In another embodiment, the flash (206) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0061] In one embodiment, the key input device (217) may be positioned on the side (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In some embodiments, the key input device may include at least a portion of a fingerprint sensor positioned on the second side (210B) of the housing (210).

[0062] In one embodiment, the connector hole (208) may accommodate a connector for transmitting and receiving power and / or data with an external electronic device, and / or a connector for transmitting and receiving audio signals with an external electronic device. For example, the connector hole (208) may include a USB connector or an earphone jack. In one embodiment, the USB connector and the earphone jack may be implemented as a single hole (e.g., 208 in FIG. 2 and FIG. 3), and according to another embodiment (not shown), the electronic device (200) may transmit and receive power and / or data or transmit and receive audio signals with an external electronic device without a separate connector hole.

[0064] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment.

[0065] Referring to FIG. 4, an electronic device (300) according to one embodiment (e.g., electronic device (200) of FIG. 2 and FIG. 3) may include a front plate (not shown) (e.g., front plate (202) of FIG. 2), a display (310) (e.g., display (201) of FIG. 2), a side member (320) (e.g., side member (218) of FIG. 2 and FIG. 3), a printed circuit board structure (330) (e.g., printed circuit board (PCB), flexible PCB (FPCB) or rigid-flexible PCB (RFPCB)), a shielding structure (350), a rear case (360), a battery (370), and / or a rear plate (380). According to another embodiment (not shown), at least one of the above-described components of the electronic device (300) (e.g., shielding structure (350), rear case (360)) may be omitted, or other components may be added.

[0066] According to one embodiment, the side member (320) is located between the display (310) and the rear plate (380) and may include a metal frame structure (321) and / or a support member (322).

[0067] In one example, the metal frame structure (321) of the side member (320) may be formed of a conductive material (e.g., metal) to form a side of the electronic device (300) (e.g., the side (210C) of FIG. 2). For example, the metal frame structure (321) may include at least one conductive portion and / or at least one non-conductive portion insulating the at least one conductive portion. The at least one conductive portion of the metal frame structure (321) may function as an antenna radiator that transmits and / or receives an RF signal of a specified frequency band.

[0068] According to one embodiment, an antenna structure may be formed by a part of the side member (320) or a combination thereof. For example, an antenna (or "antenna structure") (not shown) may be placed in at least a part of the space created by a part of the side member (320) or a combination thereof. In one example, the antenna may include at least one radiating conductor (or "radiator") and may communicate a wireless signal (or "radio frequency signal") by receiving a feed from a communication module (or "wireless communication circuit") (e.g., the wireless communication module (192) of FIG. 1) placed on a printed circuit board structure (330). In this disclosure, communication may mean at least one of transmission of a wireless signal, reception of a wireless signal, and / or transmission and reception of a wireless signal, and may be used with the same meaning below.

[0069] According to one embodiment, the antenna may be an antenna configured to transmit and / or receive wireless signals in a frequency band of tens of GHz or higher. For example, the antenna may be an antenna for millimeter wave (mmWave) communication. According to another embodiment, the antenna may include a plurality of antennas for communicating in a plurality of different frequency bands. For example, the antenna may include a first antenna for communicating in a first frequency band (e.g., about 10 GHz) and a second antenna for communicating in a second frequency band (e.g., about 18 GHz).

[0070] In another example, the support member (322) of the side member (320) may be formed of a metal material and / or a non-metal (e.g., polymer) material to provide a space (or "mounting space") in which electronic components can be placed within the electronic device (300). For example, a display (310) may be placed on one side of the support member (322) (e.g., one side in the +z direction of FIG. 4), and a printed circuit board structure (330) may be placed on the other side of the support member (322) (e.g., one side in the -z direction of FIG. 4). According to an embodiment, the support member (322) may be connected to a metal frame structure (321) or formed integrally with a metal frame structure (321).

[0071] According to one embodiment, the printed circuit board structure (330) may be disposed in at least one area of ​​the support member (322). In the present disclosure, the printed circuit board structure (330) may refer to a structure in which a plurality of printed circuit boards (331, 332) are stacked. For example, the printed circuit board structure (330) may include a first printed circuit board (331), a second printed circuit board (332), and / or an interposer (340). As another example, the printed circuit board structure (330) may be a structure in which the interposer (340) and the second printed circuit board (332) are stacked in order with respect to the first printed circuit board (331).

[0072] In one embodiment, the first printed circuit board (331) may be placed in at least one area of ​​the support member (322). In another embodiment, the second printed circuit board (332) may be spaced apart from the first printed circuit board (331) and positioned in the -z direction relative to the first printed circuit board (331). For example, the second printed circuit board (332) may be positioned to face one side facing the -z direction of the first printed circuit board (331). According to one embodiment, the first printed circuit board (331) and / or the second printed circuit board (332) may be a printed circuit board (PCB) formed of a material having non-bending properties (e.g., FR4), or a flexible printed circuit board (FPCB) having bendable properties (or "flexible properties").

[0073] In one embodiment, the interposer (340) is positioned between the first printed circuit board (331) and the second printed circuit board (332) to support the second printed circuit board (332) located in the -z direction of the first printed circuit board (331). For example, the interposer (340) may be positioned to enclose the space between the first printed circuit board (331) and the second printed circuit board (332). In one example, the interposer (340) may include at least one side wall of the printed circuit board (not shown) and / or at least one conductive via (not shown) penetrating at least one region of the printed circuit board. In another example, the first printed circuit board (331) and the second printed circuit board (342) may be electrically connected through at least one conductive via of the interposer (340).

[0074] According to one embodiment, a plurality of electronic components may be disposed on a first printed circuit board (331) and / or a second printed circuit board (332) constituting a printed circuit board structure (330). For example, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (331) and / or the second printed circuit board (332). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect an electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. In one example, a plurality of electronic components placed on a first printed circuit board (331) and a plurality of electronic components placed on a second printed circuit board (332) may be electrically and / or operatively connected through an interposer (340).

[0075] According to one embodiment, the first printed circuit board (331) and / or the second printed circuit board (332) of the printed circuit board structure (330) may be electrically connected to a third printed circuit board (333) spaced apart from the printed circuit board structure (330). For example, the first printed circuit board (331) and / or the second printed circuit board (332) of the printed circuit board structure (330) may be placed in one area of ​​the support member (322) (e.g., the area in the +y direction of FIG. 4), and the third printed circuit board (333) may be placed in another area of ​​the support member (322) spaced apart from the first printed circuit board (331) and / or the second printed circuit board (332) (e.g., the area in the -y direction of FIG. 4). In one example, the first printed circuit board (331) and / or the second printed circuit board (332) and the third printed circuit board (333) may be electrically connected through an electrical connection member (334). In another example, the electrical connection member (334) may electrically connect the first printed circuit board (331) and / or the second printed circuit board (332) and the third printed circuit board (333) across a battery (370) placed on a support member (322). For example, the electrical connection member (334) may include, but is not limited to, at least one of a flexible printed circuit board (FPCB), a coaxial cable, and a board-to-board connector.

[0076] According to one embodiment, the printed circuit board structure (330) may include a region having a bendable or flexible characteristic (hereinafter "flexible area"). In one example, the flexible area may include a base film (or substrate) and a copper clad layer. For example, the flexible area may be a flexible copper clad layer (FCCL) in which at least one copper clad is laminated on at least a portion of at least one of the upper or lower portions of a polyimide film.

[0077] According to one embodiment, the first printed circuit board (331) and / or the second printed circuit board (332) of the printed circuit board structure (330) may be electrically connected to a fourth printed circuit board (not shown) spaced apart from the printed circuit board structure (330). For example, the fourth printed circuit board (not shown) may be a flexible printed circuit board (or "flexible printed circuit board") type radio frequency cable (FRC). In one embodiment, the fourth printed circuit board may be placed on at least a portion of the support member (322). For example, the fourth printed circuit board may be placed on one area of ​​the support member (322) (e.g., the area in the +x direction of FIG. 4) and / or another area (e.g., the area in the -x direction of FIG. 4).

[0078] According to one embodiment, the shielding structure (350) (or "shield can") may be formed of a conductive material (e.g., metal) and may be disposed in at least one area of ​​the printed circuit board structure (330) to electromagnetically shield a plurality of electronic components disposed in the printed circuit board structure (330). In one example, the shielding structure (350) may be disposed in at least a portion of the second printed circuit board (332) of the printed circuit board structure (330) and may electromagnetically shield a plurality of electronic components disposed in the second printed circuit board (332).

[0079] According to one embodiment, the rear case (360) is positioned in the -z direction of the printed circuit board structure (330) to protect the first printed circuit board (331) and / or the second printed circuit board (332) and a plurality of electronic components positioned on the first printed circuit board (331) and / or the second printed circuit board (332) from external forces applied to the electronic device (300). In one example, the rear case (360) may be formed of a non-conductive material (e.g., plastic), but is not limited thereto. In an electronic device (300) according to another embodiment (not shown), the rear case (360) may be omitted.

[0080] According to one embodiment, the battery (370) is disposed inside the electronic device (300) and can supply power to at least one component of the electronic device (300). The battery (370) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. In one example, the battery (370) is disposed within a battery groove (not shown) formed in at least one area of ​​the support member (322) and can supply power to the components of the electronic device (300). According to one embodiment, the battery (370) may be disposed integrally inside the electronic device (300), but is not limited thereto, and according to another embodiment, the battery (370) may be disposed detachably from the electronic device (300).

[0081] According to one embodiment, the rear plate (380) can form the rear surface of the electronic device (300) (e.g., the second surface (210B) of FIG. 3). The rear plate (380) can protect the internal components of the electronic device (300) from external impact or the ingress of foreign matter.

[0083] FIG. 5 is an exploded view and an assembled view of a printed circuit board structure according to one embodiment.

[0084] FIG. 5 illustrates the first printed circuit board (331), the second printed circuit board (332), and / or the interposer (340) of the printed circuit board structure (330) of FIG. 4 in a disassembled state and the first printed circuit board (331), the second printed circuit board (332), and / or the interposer (340) in a combined state.

[0085] Referring to FIG. 5, a printed circuit board structure (330) according to one embodiment (e.g., the printed circuit board structure (330) of FIG. 4) may include a first printed circuit board (331) (e.g., the first printed circuit board (331) of FIG. 4), a second printed circuit board (332) (e.g., the second printed circuit board (332) of FIG. 4) and / or an interposer (340) (e.g., the interposer (340) of FIG. 4).

[0086] According to one embodiment, the first printed circuit board (331) may include a first surface (331a) facing the +z direction and / or a second surface (331b) facing the opposite direction to the first surface (331a). In one example, at least one electronic component (not shown) may be disposed on at least one of the first surface (331a) or the second surface (331b) of the first printed circuit board (331). For example, the at least one electronic component may include, but is not limited to, at least one of a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), a communication circuit (e.g., communication module (190) of FIG. 1), or a power management module (e.g., power management module (188) of FIG. 1) required for the operation of the electronic device.

[0087] According to one embodiment, the second printed circuit board (332) may be spaced apart from the first printed circuit board (331). For example, the second printed circuit board (332) may be placed on the first surface (331a) of the first printed circuit board (331) (e.g., the +z direction in FIG. 5). In one example, the second printed circuit board (332) may include a third surface (332a) facing the +z direction and / or a fourth surface (332b) facing the opposite direction (e.g., the -z direction in FIG. 5) to the third surface (332a) and facing at least one area of ​​the first surface (331a) of the first printed circuit board (331). In another example, at least one electronic component (not shown) may be placed on the third surface (332a) and / or the fourth surface (332b) of the second printed circuit board (332). At least one electronic component may include, for example, at least one of a processor, memory, communication circuit, or power management module, but is not limited thereto.

[0088] According to one embodiment, the interposer (340) is positioned between the first printed circuit board (331) and the second printed circuit board (332) so that the second printed circuit board (332) can be laminated onto the first printed circuit board (331) (e.g., in the +z direction of FIG. 5). In one example, the bottom surface (340b) of the interposer (340) may be placed on at least one area of ​​the first surface (331a) of the first printed circuit board (331), and at least one area of ​​the fourth surface (332b) of the second printed circuit board (332) may be placed on the top surface (340a) of the interposer (340). In another example, the first printed circuit board (331) may be fixed to the bottom surface (340b) of the interposer (340), and the second printed circuit board (332) may be fixed to the top surface (340a) of the interposer (340). For example, the first printed circuit board (331) can be fixed to the bottom surface (340b) of the interposer (340) by soldering at least one area of ​​the first surface (331a) of the first printed circuit board (331) to the bottom surface (340b) of the interposer (340). As another example, the second printed circuit board (332) can be fixed to the top surface (340a) of the interposer (340) by soldering at least one area of ​​the fourth surface (332b) of the second printed circuit board (332) to the top surface (340a) of the interposer (340).

[0089] According to one embodiment, the interposer (340) may include an insulating layer (341) and / or at least one conductive via (342). In one example, the insulating layer (341) may include at least one side wall and may be positioned to surround the space between the first printed circuit board (331) and the second printed circuit board (332). For example, the insulating layer (341) may be formed in a band shape forming a closed curve along at least one edge of the first printed circuit board (331) or the second printed circuit board (332) when viewed from the top (e.g., the +z direction in FIG. 5). However, the shape of the insulating layer (341) is not limited to the above-described embodiment. According to another embodiment, the insulating layer (341) may include a partition (341a) that connects one point of at least one sidewall and another point and supports the first printed circuit board (331) and / or the second printed circuit board (332).

[0090] In another example, some of the at least one electronic component disposed on the first printed circuit board (331) and / or the second printed circuit board (332) may be disposed to be wrapped by the insulating layer (341) described above.

[0091] In one example, at least one conductive via (342) may be formed of a conductive material and may be positioned through at least one region of the insulating layer (341). In another example, at least one conductive via (342) may electrically connect a first printed circuit board (331) positioned at the bottom of the interposer (340) (e.g., the -z direction in FIG. 5) and a second printed circuit board (332) positioned at the top of the interposer (340) (e.g., the +z direction in FIG. 5). For example, at least one electronic component positioned on the first side (331a) and / or the second side (331b) of the first printed circuit board (331) may be electrically connected to at least one electronic component positioned on the third side (332a) and / or the fourth side (332b) of the second printed circuit board (332) through at least one conductive via (342).

[0093] FIG. 6 is an enlarged view of an interposer structure and region A of the interposer structure according to one embodiment, and FIG. 7 is a cross-sectional view of the interposer structure of FIG. 6 cut in the direction II'. The interposer structure (400) shown in FIG. 6 may be a structure of an interposer (340) disposed between the first printed circuit board (331) and the second printed circuit board (332) of FIG. 5.

[0094] Referring to FIGS. 6 and 7, an interposer structure (400) (or "printed circuit board structure") according to one embodiment may include an insulating layer (410) (e.g., insulating layer (341) of FIG. 5), at least one solder resist layer (or "solder resist") (420), at least one conductive via (430) (e.g., at least one conductive via (342) of FIG. 5) and / or a presolder (440).

[0095] According to one embodiment, the insulating layer (410) is formed of a material having a non-conductive material and can be formed in a closed-curve shape. For example, the insulating layer (410) can be formed in a band shape that forms a closed curve when viewed from the top (e.g., the +z direction in FIG. 6).

[0096] In one embodiment, the insulating layer (410) may include at least one side wall (411) having a specified thickness and forming a closed curve, and / or at least one through hole (412) (or "via hole") penetrating at least one region of the insulating layer (410). In one example, at least one side wall (411) may form at least one side of the insulating layer (410). In another example, at least one through hole (412) may be formed in at least one region of the interior of the insulating layer (410) spaced apart from the side of the insulating layer (410). For example, at least one through hole (412) may be formed penetrating from one side facing the +z direction of the insulating layer (410) to one side facing the -z direction of the insulating layer (410), but is not limited thereto.

[0097] According to one embodiment, at least one solder resist layer (420) may be disposed in at least one area of ​​the top surface (410a) and / or bottom surface (410b) of the insulating layer (410). For example, the at least one solder resist layer (420) can prevent solder from adhering to one area of ​​the insulating layer (410) where the at least one solder resist layer (420) is disposed during the process of soldering (or "soldering") electronic components (e.g., the first printed circuit board (331) and the second printed circuit board (332) of FIG. 5) to the top and / or bottom of the interposer structure (400).

[0098] According to one embodiment, at least one solder resist layer (420) may include a first solder resist layer (421) and / or a second solder resist layer (422). In one example, the first solder resist layer (421) is disposed in at least one area of ​​the top surface (410a) of the insulating layer (410) to prevent solder from adhering to the top surface (410a) of the insulating layer (410). In another example, the second solder resist layer (422) is disposed in at least one area of ​​the bottom surface (410b) of the insulating layer (410) to prevent solder from adhering to the bottom surface (410b) of the insulating layer (410).

[0099] In one example, the first solder resist layer (421) may include at least one first opening (421a) formed at a position corresponding to at least one through hole (412) of the insulating layer (410). For example, when viewed from the top of the interposer structure (400) (e.g., the +z direction in FIG. 7), at least one area of ​​the at least one first opening (421a) may be positioned to overlap with at least one through hole (412). In another example, the at least one first opening (421a) may be formed with a larger area than the at least one through hole (412), so that the outer surface of the at least one first opening (421a) may surround the outer surface of the at least one through hole (412). The shape of at least one first opening (421a) is not limited to the above-described embodiment, and according to other embodiments (not shown), at least one first opening (421a) may be formed with an area narrower than at least one through hole (412) or with substantially the same area.

[0100] In one example, the second solder resist layer (422) may include at least one second opening (422a) formed at a position corresponding to at least one through hole (412) of the insulating layer (410). For example, when viewed from the bottom of the interposer structure (400) (e.g., the -z direction in FIG. 7), at least one area of ​​the at least one second opening (422a) may be positioned to overlap with at least one through hole (412). In another example, the at least one second opening (422a) may be formed with a larger area than the at least one through hole (412), so that the outer surface of the at least one second opening (422a) may surround the outer surface of the at least one through hole (412). The shape of at least one second opening (422a) is not limited to the embodiment described above, and according to other embodiments (not shown), at least one second opening (422a) may be formed with an area narrower than at least one through hole (412) or with substantially the same area.

[0101] As another example, at least one second opening (422a) may be formed at a position corresponding to at least one first opening (421a) of the first solder resist layer (421). In one example, through at least one first opening (421a) formed in the first solder resist layer (421) and / or at least one second opening (422a) formed in the second solder resist layer (422), a portion of the insulating layer (410) and / or a portion of at least one conductive via (430) may be exposed to the outside of the interposer structure (400).

[0102] According to one embodiment, at least one conductive via (430) may be located inside at least one through hole (412) of the insulating layer (410). At least one conductive via (430) may be formed of a conductive material (e.g., metal) to electrically connect electronic components placed in the interposer structure (400). For example, at least one conductive via (430) may electrically connect an electronic component placed at the top of the interposer structure (400) (e.g., the first printed circuit board (331) of FIG. 5) and an electronic component placed at the bottom of the interposer structure (400) (e.g., the second printed circuit board (332) of FIG. 5). As another example, at least one conductive via (430) may include a cylindrical (or "hole-shaped") conductive via, but is not limited thereto.

[0103] In one example, at least one conductive via (430) may include a first protrusion (431) protruding from the top surface (410a) of the insulating layer (410) in the direction in which at least one first opening (421a) of the first solder resist layer (421) is formed (e.g., the +z direction in FIG. 7) and / or a second protrusion (432) protruding from the bottom surface (410b) of the insulating layer (410) in the direction in which at least one second opening (422a) of the second solder resist layer (422) is formed (e.g., the -z direction in FIG. 7). For example, the first protrusion (431) of at least one conductive via (430) may protrude from the top surface (410a) of the insulating layer (410) to one surface facing the +z direction of the first solder resist layer (421). As another example, a second protrusion (432) of at least one conductive via (430) may protrude from the bottom surface (410b) of the insulating layer (410) to a surface facing the -z direction of the second solder resist layer (422).

[0104] According to one embodiment, the pre-solder (440) is placed in the upper region (e.g., the region in the +z direction of FIG. 7 and FIG. 8) and / or the lower region (e.g., the region in the -z direction of FIG. 7 and FIG. 8) of the interposer structure (400) and can perform the function of fixing electronic components placed in the upper and / or lower regions of the interposer structure (400) to the interposer structure (400).

[0105] In one embodiment, the pre-solder (440) may include a first pre-solder (441) and / or a second pre-solder (442). In one example, the first pre-solder (441) may be placed on a first protrusion (431) of at least one conductive via (430) that is exposed to the outside of the interposer structure (400) through at least one first opening (421a) of the first solder resist layer (421). For example, the first pre-solder (441) may be placed on one end of the first protrusion (431) (e.g., one end in the +z direction of FIG. 7) to cover a portion of the top surface (410a) of the insulating layer (410) and / or a portion of the first protrusion (431). In another example, the second pre-solder (442) may be placed on a second protrusion (432) of at least one conductive via (430) that is exposed to the outside of the interposer structure (400) through at least one second opening (422a) of the second solder resist layer (422). For example, the second pre-solder (442) may be placed on one end of the second protrusion (432) (e.g., one end in the -z direction of FIG. 7) to cover a portion of the bottom surface (410b) of the insulating layer (410) and / or a portion of the second protrusion (432).

[0106] According to one embodiment, the interposer structure (400) can secure electronic components to the top and / or bottom of the interposer structure (400) through a first pre-solder (441) and / or a second pre-solder (442). For example, the interposer structure (400) can apply heat to the first pre-solder (441) to solder a second printed circuit board (e.g., the second printed circuit board (332) of FIG. 5) to the top of the interposer structure (400) (e.g., the +z direction of FIG. 7). As another example, the interposer structure (400) can apply heat to the second pre-solder (442) to solder a first printed circuit board (e.g., the -z direction of FIG. 7) to the bottom of the interposer structure (400).

[0107] According to one embodiment, the interposer structure (400) can form a space in which a pre-solder (440) can be seated without forming a land through at least one conductive via (430) comprising a first protrusion (431) and / or a second protrusion (432) that protrude in an upward direction and / or a downward direction relative to the insulating layer (410). In one example, as the interposer structure (400) is formed as a landless structure that does not include a land, the distance (pitch) (P1) between the conductive vias (430) may not be separated by more than a specified distance to secure a space for forming a land. For example, the above-described interposer structure (400) having a landless structure may form a closer distance between the conductive vias (430) compared to an interposer structure that includes a land. According to one embodiment, the interposer structure (400) can form a distance (P1) between conductive vias (430) so that electronic components can be placed or mounted at a high density on a plurality of printed circuit boards (e.g., the first printed circuit board (331), the second printed circuit board (332) of FIG. 5) placed on the top and / or bottom of the interposer structure (400).

[0108] According to one embodiment, the interposer structure (400) may further include a side plating portion (450). In one example, the side plating portion (450) may be located in at least one area of ​​the side (410c) of the insulating layer (410) to electromagnetically shield the interposer structure (400). In the present disclosure, the side (410c) of the insulating layer (410) may mean a surface located between the upper surface (410a) and the lower surface (410b) of the insulating layer (410) to cover the space between the upper surface (410a) and the lower surface (410b). For example, the side plating portion (450) may shield noise generated inside the interposer structure (400) (e.g., noise generated from electronic components) from leaking out of the interposer structure (400), or may shield noise entering from outside the interposer structure (400).

[0109] Hereinafter, with reference to FIGS. 8 and FIGS. 9a to 9e, we will examine the manufacturing process of an interposer structure (400) according to one embodiment.

[0111] FIG. 8 is a flowchart illustrating the manufacturing operation of an interposer structure according to one embodiment. FIG. 9a is a diagram illustrating the operation of forming at least one through hole in a printed circuit board according to one embodiment, FIG. 9b is a diagram illustrating the operation of filling a conductive material inside at least one through hole and flattening the printed circuit board according to one embodiment, FIG. 9c is a diagram illustrating the operation of etching the printed circuit board according to one embodiment, FIG. 9d is a diagram illustrating the operation of forming a solder resist layer on the top surface and / or bottom surface of the printed circuit board according to one embodiment, FIG. 9e is a diagram illustrating the operation of forming a presolder according to one embodiment.

[0112] FIGS. 9a to 9e illustrate manufacturing operations for a portion of an interposer structure (or "printed circuit board structure") (e.g., Area A of FIG. 6), and other portions of the interposer structure can also be manufactured through the same operations. Hereinafter, when describing the manufacturing operations of the interposer structure of FIG. 8, the description will be made with reference to the configurations of FIGS. 9a to 9e.

[0113] Referring to FIGS. 8 and FIGS. 9a, the manufacturing operation of an interposer structure according to one embodiment may process a printed circuit board (401) in operation 801 to form at least one through hole (412) (or "via hole") (e.g., at least one through hole (412) of FIG. 7) that penetrates at least one region of the printed circuit board (401). For example, a printed circuit board (401) may include an insulating layer (410) (e.g., the insulating layer (410) of FIG. 7) and / or a copper foil (402) (or "copper clad") disposed on the top surface (410a) (e.g., the top surface (410a) of FIG. 7) and the bottom surface (410b) (e.g., the bottom surface (410b) of FIG. 7) of the insulating layer (410), and at least one through hole (412) may penetrate at least one area of ​​the insulating layer (410) and the copper foil (402). According to one embodiment, at least one through hole (412) may be formed by drilling at least one area of ​​the printed circuit board (401). However, drilling is merely one example of a processing method for forming at least one through hole (412), and according to other embodiments, at least one through hole (412) may be formed through laser processing or punching.

[0114] Referring to FIGS. 8 and 9b, the structural manufacturing operation of an interposer according to one embodiment may fill a conductive material (or "conductive material") inside at least one through hole (412) formed in a printed circuit board (401) in operation 802. In one example, the operation 802 may fill the inside of at least one through hole (412) with a conductive material through hole plugging printing technology, but the method of filling the inside of at least one through hole (412) with a conductive material is not limited to the above-described embodiment. In another example, the conductive material filled inside the at least one through hole (412) may be a material other than copper. The conductive material may include, for example, at least one of silver paste, aluminum, silver-aluminum, carbon paste, or carbon nanotube paste, but is not limited thereto.

[0115] In the structural manufacturing operation of the interposer according to one embodiment, the top surface and / or bottom surface of the printed circuit board (401) may be flattened (or "polished") in the 803 operation. For example, in the process of filling the inside of at least one through hole (412) with a conductive material in the 802 operation, an area protruding in the top and / or bottom direction of the printed circuit board (401) may be formed. In the structural manufacturing operation of the interposer according to one embodiment, at least one conductive via (430) (e.g., the conductive via (430) of FIG. 7) may be formed by flattening the area protruding in the top and / or bottom direction of the printed circuit board (401) through the 803 operation. In one example, in the 803 operation, the top surface and / or bottom surface of the printed circuit board (401) may be flattened through brushing or buffing. In another example, in operation 803, the top surface and / or bottom surface of the printed circuit board (401) can be flattened through a polishing process. For example, the polishing process may include at least one of mechanical polishing or chemical mechanical polishing (CMP).

[0116] Referring to FIG. 8 and FIG. 9c, the structural manufacturing operation of the interposer according to one embodiment may remove the copper foil (402) placed on the top and / or bottom surfaces of the insulating layer (410) by etching the top and / or bottom surfaces of the printed circuit board (401) in operation 804. In one example, since at least one conductive via (430) is formed of a material other than copper, at least one conductive via (430) may not be removed during the process of etching the top and / or bottom surfaces of the printed circuit board (401). In another example, as the copper foil (402) placed on the top surface (410a) and bottom surface (410b) of the insulating layer (410) is removed, a portion of the at least one conductive via (430) protruding from the top surface (410a) and / or bottom surface (410b) of the insulating layer (410) may be formed. For example, by the operation of 804, a first protrusion (431) of at least one conductive via (430) protruding in the +z direction from the top surface (410a) of the insulating layer (410) (e.g., the first protrusion (431) of FIG. 7) and / or a second protrusion (432) of at least one conductive via (430) protruding in the -z direction from the bottom surface (410b) of the insulating layer (410) (e.g., the second protrusion (432) of FIG. 7) may be formed.

[0117] Referring to FIGS. 8 and 9d, in the operation of manufacturing the structure of an interposer according to one embodiment, a solder resist layer (420) (e.g., the solder resist layer (420) of FIG. 7) can be formed in at least one area of ​​the top surface (410a) and / or bottom surface (410b) of the insulating layer (410) in operation 805. In one example, in operation 805, a solder resist layer (420) can be formed by applying solder resist ink to an area excluding the region where at least one conductive via (430) of the top surface (410a) and / or bottom surface (410b) of the insulating layer (410) is disposed, and then curing the applied ink by applying UV (ultraviolet ray) to the applied ink, but is not limited thereto. For example, through the operation of 805, a first solder resist layer (421) (e.g., the first solder resist layer (421) of FIG. 7) may be formed on the upper surface (410a) of the insulating layer (410), and a second solder resist layer (422) (e.g., the second solder resist layer (422) of FIG. 7) may be formed on the lower surface (410b) of the insulating layer (410). As another example, as solder resist ink is applied to an area excluding the area where the conductive via (430) is placed, at least one first opening (421a) (e.g., the at least one first opening (421a) of FIG. 7) may be formed in an area corresponding to at least one conductive via (430) of the first solder resist layer (421). Similarly, at least one second opening (422a) (e.g., at least one second opening (422a) of FIG. 7) may be formed in an area corresponding to at least one conductive via (430) of the second solder resist layer (422).

[0118] Referring to FIGS. 8 and 9e, the structural manufacturing operation of an interposer according to one embodiment may form a presolder (440) (e.g., the presolder (440) of FIG. 7) on a first protrusion (431) and / or a second protrusion (432) of at least one conductive via (430) in operation 806. In one example, through operation 806, a first presolder (441) may be formed in at least one area of ​​the first protrusion (431) of at least one conductive via (430), and a second presolder (442) may be formed in at least one area of ​​the second protrusion (432) of at least one conductive via (430). The first pre-solder (441) and / or the second pre-solder (442) may be formed, for example, by applying or squeezing solder cream (or "solder paste") onto the first protrusion (431) and / or the second protrusion (432) using a metal mask, and then melting the applied solder cream (or "reflow process"), but is not limited thereto.

[0119] The manufacturing operation of an interposer structure according to one embodiment can manufacture an interposer structure (400) that does not include a land for mounting a pre-solder (440) through the above-described operations 801 to 806. Although not shown in the drawings, the manufacturing operation of an interposer structure according to one embodiment may further include the operation of forming a side plating portion (e.g., side plating portion (450) of FIG. 6) for electromagnetically shielding the interposer structure (400) in at least an area of ​​the side of the insulating layer (410) (e.g., side (410c) of FIG. 6). In one example, the operation of forming the side plating portion may include the operation of plating the side of the insulating layer (410) and then attaching a dry film to at least one area of ​​the side of the insulating layer (410) where the side plating portion is to be formed. In another example, after undergoing the process of exposing, developing, and etching at least one area of ​​the side of the insulating layer (410) to which a dry film is attached, the dry film attached to the insulating layer (410) is peeled off, thereby forming a side plating portion on at least one area of ​​the side of the insulating layer (410).

[0121] FIG. 10 is an enlarged view of an interposer structure according to another embodiment and region B of the interposer structure. FIG. 11a is a cross-sectional view of the interposer structure of FIG. 10 cut in the II' direction, FIG. 11b is a cross-sectional view of the interposer structure of FIG. 10 cut in the II-II' direction, FIG. 11c is a cross-sectional view of the interposer structure of FIG. 10 cut in the III-III' direction, and FIG. 11d is a drawing showing the state in which the solder resist layer and / or pre-solder is removed from the interposer structure of FIG. 10.

[0122] The interposer structure (500) illustrated in FIG. 10 may be a structure of an interposer (340) disposed between the first printed circuit board (331) and the second printed circuit board (332) of FIG. 5.

[0123] Referring to FIG. 10, FIG. 11a, FIG. 11b, FIG. 11c and FIG. 11d, an interposer structure (500) (or "printed circuit board structure") according to one embodiment may include an insulating layer (510) (e.g., insulating layer (341) of FIG. 5), at least one solder resist layer (or "solder resist") (520), at least one first conductive via (531), at least one second conductive via (532) and / or presolder (540).

[0124] According to one embodiment, the insulating layer (510) is formed of a material having a non-conductive material and can be formed in a closed-curve shape. For example, the insulating layer (510) can be formed in a band shape that forms a closed curve when viewed from the top (e.g., the +z direction in FIG. 10).

[0125] In one embodiment, the insulating layer (510) may include at least one side wall (511) forming a closed curve and having a specified thickness, at least one through hole (512) (or "via hole") penetrating at least one area of ​​the insulating layer (510), and / or a slot (513) penetrating at least one area of ​​the insulating layer (510). In one example, at least one side wall (511) may form at least one side of the insulating layer (510). In another example, at least one through hole (512) may be formed in at least one area of ​​the interior region of the insulating layer (510) spaced apart from the side of the insulating layer (510). For example, at least one through hole (512) may be formed penetrating from one side facing the +z direction of the insulating layer (510) to one side facing the -z direction of the insulating layer (510), but is not limited thereto. In another example, the slot (513) may be formed in at least one area of ​​the interior region of the insulating layer (510) spaced apart from the side of the insulating layer (510). For example, the slot (513) may be formed penetrating from one side facing the +z direction of the insulating layer (510) to one side facing the -z direction of the insulating layer (510), substantially identical or similar to at least one through hole (512), but is not limited thereto. In one example, the slot (513) may be spaced apart from at least one through hole (512). In another example, the slot (513) may be formed in the shape of a rectangular bar when viewed from the top of the insulating layer (510) (e.g., the +z direction in FIG. 11d). For example, the slot (513) may be formed in a rectangular shape when viewed from the top of the insulating layer (510). As another example, the slot (513) may be formed to have a larger area than at least one through hole (512), but is not limited thereto.

[0126] According to one embodiment, at least one solder resist layer (520) may be disposed in at least one area of ​​the top surface (510a) and / or bottom surface (510b) of the insulating layer (510). For example, the at least one solder resist layer (520) may prevent solder from adhering to the area of ​​the insulating layer (510) where the at least one solder resist layer (520) is disposed during the process of soldering (or "soldering") electronic components (e.g., the first printed circuit board (331), the second printed circuit board (332) of FIG. 5) to the top and / or bottom of the interposer structure (500).

[0127] According to one embodiment, at least one solder resist layer (520) may include a first solder resist layer (521) and / or a second solder resist layer (522). In one example, the first solder resist layer (521) may be disposed in at least one area of ​​the top surface (510a) of the insulating layer (510) to prevent solder from adhering to the top surface (510a) of the insulating layer (510). In another example, the second solder resist layer (522) may be disposed in at least one area of ​​the bottom surface (510b) of the insulating layer (510) to prevent solder from adhering to the bottom surface (510b) of the insulating layer (510).

[0128] In one example, the first solder resist layer (521) may include at least one first opening (521a) formed at a position corresponding to at least one through hole (512) of the insulating layer (510) and / or at least one second opening (521b) formed at a position corresponding to at least one region of the slot. For example, when viewed from the top of the interposer structure (500) (e.g., the +z direction in FIG. 11a), at least one region of the at least one first opening (521a) may be positioned to overlap with at least one through hole (512). In another example, when viewed from the top of the interposer structure (500), at least one region of the at least one second opening (521b) may be positioned to overlap with one region of the slot (513).

[0129] In one example, the second solder resist layer (522) may include at least one third opening (522a) formed at a position corresponding to at least one through hole (512) of the insulating layer (510) and / or at least one fourth opening (522b) formed at a position corresponding to a region of the slot (513) of the insulating layer (510). For example, when viewed from the bottom of the interposer structure (500) (e.g., the -z direction of FIG. 11a), at least one region of the at least one third opening (522a) may be positioned to overlap with at least one through hole (512). In another example, when viewed from the bottom of the interposer structure (500), at least one region of the at least one fourth opening (522b) may be positioned to overlap with a region of the slot (513). In another example, at least one third opening (522a) may be formed at a position corresponding to at least one first opening (521a) of the first solder resist layer (521), and at least one fourth opening (522b) may be formed at a position corresponding to at least one second opening (522b) of the first solder resist layer (521).

[0130] According to one embodiment, at least one first conductive via (531) may be located inside at least one through hole (512) of the insulating layer (510). For example, at least one first conductive via (531) may be formed in a cylindrical shape (or "hole shape"), but the shape of at least one first conductive via (531) is not limited to the above-described embodiment. In one example, at least one first conductive via (531) may be formed of a conductive material (e.g., metal) to electrically connect electronic components placed at the top (e.g., +z direction in FIG. 10) and / or bottom (e.g., -z direction in FIG. 10) of the interposer structure (500). For example, at least one first conductive via (531) can electrically connect an electronic component (e.g., the first printed circuit board (331) of FIG. 5) placed at the bottom (e.g., the -z direction of FIG. 10) of the interposer structure (500) and an electronic component (e.g., the second printed circuit board (332) of FIG. 5) placed at the top (e.g., the +z direction of FIG. 10) of the interposer structure (500).

[0131] According to one embodiment, at least one second conductive via (532) may be located inside a slot (513) of an insulating layer (510). For example, at least one second conductive via (532) may be formed in a rectangular bar shape having a specified length and / or thickness, but the shape of at least one second conductive via (532) is not limited to the above-described embodiment. In one example, at least one second conductive via (532) may be formed of a conductive material to electrically connect an electronic component placed at the top and / or bottom of an interposer structure (500) substantially identical or similar to at least one first conductive via (531).

[0132] In another example, at least one second conductive via (532) can not only electrically connect electronic components but also function as a ground that electromagnetically shields the interposer structure (500). For example, at least one second conductive via (532) can be formed with a relatively larger area compared to at least one first conductive via (531) to function as a ground and can shield noise that enters into or exits the interposer structure (500). In yet another example, at least one second conductive via (532) is placed in an area adjacent to the side (510c) of the insulating layer (510) to shield noise that enters from the side of the interposer structure (500) or to shield noise that exits in a lateral direction from within the interposer structure (500).

[0133] An interposer structure (500) according to one embodiment can electromagnetically shield noise that flows into the interposer structure (500) from the outside or flows out of the interposer structure (500) without forming a separate plating section (e.g., side plating section (450) of FIG. 6) on the side of the insulating layer (510) through at least one second conductive via (532). That is, the interposer structure (500) according to one embodiment electrically connects electronic components and can omit the plating section manufacturing process through at least one second conductive via (532), thereby simplifying the manufacturing process and reducing manufacturing costs.

[0134] Referring to FIG. 11a, FIG. 11b, FIG. 11c and / or FIG. 11d, according to one embodiment, at least one first conductive via (531) and at least one second conductive via (532) may be formed to have different heights. In one embodiment, at least one first conductive via (531) may be formed to have a first height (h1), and at least one second conductive via (532) may be formed to have a second height (h2) lower than the first height (h1). For example, as at least one second conductive via (532) is formed inside a slot (513) having a larger area than at least one through hole (512), it may be formed at a lower height than at least one first conductive via (531), and this will be described later.

[0135] In one example, at least one first conductive via (531) may include a first protrusion (531a) protruding from the top surface (510a) of the insulating layer (510) in the direction in which at least one first opening (521a) of the first solder resist layer (521) is formed (e.g., the +z direction in FIG. 11c) and / or a second protrusion (531b) protruding from the bottom surface (510b) of the insulating layer (510) in the direction in which at least one third opening (522a) of the second solder resist layer (522) is formed (e.g., the -z direction in FIG. 11c). For example, the first protrusion (531a) may protrude from the top surface (510a) of the insulating layer (510) to one surface facing the +z direction of the first solder resist layer (521). As another example, the second protrusion (531b) may protrude from the bottom surface (510b) of the insulating layer (510) to one surface facing the -z direction of the second solder resist layer (522).

[0136] In another example, at least one second conductive via (532) may be formed at substantially the same height as the insulating layer (510). For example, when the insulating layer (510) is viewed from the side (e.g., the -y direction in FIG. 11c), one end of the at least one second conductive via (532) (e.g., one end in the +z direction in FIG. 10) may be aligned with the top surface (510a) of the insulating layer (510), and the other end (e.g., one end in the -z direction in FIG. 10) may be aligned with the bottom surface (510b) of the insulating layer (510). As another example, a portion of at least one second conductive via (532) may be exposed to the outside of the interposer structure (500) through a second opening (521b) of the first solder resist layer (521) and / or a fourth opening (522b) of the second solder resist layer (522).

[0137] According to one embodiment, the pre-solder (540) is placed in the upper region (e.g., the region in the +z direction of FIG. 10) and / or the lower region (e.g., the region in the -z direction of FIG. 10) of the interposer structure (500) and can perform the function of fixing electronic components placed in the upper and / or lower regions of the interposer structure (500) to the interposer structure (500).

[0138] In one embodiment, the pre-solder (540) may include a first pre-solder (541) and / or a second pre-solder (542). In one example, the first pre-solder (541) may be placed in a first protrusion (531a) of at least one first conductive via (531) exposed to the outside of the interposer structure (500) through at least one first opening (521a) and / or in a portion of at least one second conductive via (532) exposed to the outside of the interposer structure (500) through at least one second opening (521b). For example, the first pre-solder (541) may be placed on one end of the first protrusion (531a) (e.g., one end in the +z direction of FIG. 11c) and / or one end of at least one second conductive via (532) (e.g., one end facing the +z direction of FIG. 11c).

[0139] In another example, the second presolder (542) may be placed on a second protrusion (531b) of at least one first conductive via (531) exposed to the outside of the interposer structure (500) through at least one third opening (522a) and / or on a portion of at least one second conductive via (532) exposed to the outside of the interposer structure (500) through at least one fourth opening (522b). For example, the second presolder (542) may be placed on the other end of the second protrusion (531b) (e.g., one end in the -z direction of FIG. 11c) and / or on the other end of at least one second conductive via (532) (e.g., one end in the -z direction of FIG. 11c).

[0140] According to one embodiment, the interposer structure (500) can secure electronic components to the top and / or bottom of the interposer structure (500) through a first pre-solder (541) and / or a second pre-solder (542). For example, the interposer structure (500) can apply heat to the first pre-solder (541) to solder a second printed circuit board (e.g., the second printed circuit board (332) of FIG. 5) to the top of the interposer structure (500) (e.g., the +z direction of FIG. 10 and FIG. 11c). As another example, the interposer structure (500) can apply heat to the second pre-solder (542) to solder a first printed circuit board (e.g., the -z direction of FIG. 10 and FIG. 11c) to the bottom of the interposer structure (500).

[0141] According to one embodiment, the interposer structure (500) can form a space in which a pre-solder (540) can be seated without forming a separate land through at least one first conductive via (531) and / or at least one second conductive via (532) in the form of a bar, which includes a first protrusion (531a) and / or a second protrusion (531b). In one example, as the interposer structure (500) is formed as a landless structure that does not include a land, the distance (pitch) (P2) between at least one first conductive via (531) and at least one second conductive via (532) may not be separated by more than a specified distance in order to secure a space for forming a land. For example, the above-described interposer structure (500) having a landless structure can form a distance (P2) between at least one first conductive via (531) and at least one second conductive via (532) closer than an interposer structure including lands. According to one embodiment, by forming a distance between at least one first conductive via (531) and at least one second conductive via (532) closer, the interposer structure (500) can place or mount electronic components at a high density on a plurality of printed circuit boards (e.g., the first printed circuit board (331), the second printed circuit board (332) of FIG. 5) placed on the top and / or bottom of the interposer structure (500).

[0142] Hereinafter, with reference to FIG. 12 and FIG. 13a to FIG. 13e, we will examine the manufacturing process of an interposer structure (500) according to one embodiment.

[0144] FIG. 12 is a flowchart illustrating the manufacturing operation of an interposer structure according to another embodiment. FIG. 13a is a diagram illustrating the operation of forming at least one through hole and / or slot in a printed circuit board according to one embodiment; FIG. 13b is a diagram illustrating the operation of filling a conductive material inside at least one through hole and / or slot and flattening the printed circuit board according to one embodiment; FIG. 13c is a diagram illustrating the operation of etching the printed circuit board according to one embodiment; FIG. 13d is a diagram illustrating the operation of forming a solder resist layer on the top surface and / or bottom surface of the printed circuit board according to one embodiment; and FIG. 13e is a diagram illustrating the operation of forming a presolder according to one embodiment.

[0145] FIGS. 13a to 13e illustrate manufacturing operations for a portion of an interposer structure (or "printed circuit board structure") (e.g., area B of FIG. 10), and other portions of the interposer structure can also be manufactured through the same operations. Hereinafter, in describing the manufacturing operations of the interposer structure of FIG. 12, the description will be made with reference to the configurations of FIGS. 13a to 13e.

[0146] Referring to FIG. 12 and FIG. 13a, the manufacturing operation of an interposer structure according to one embodiment may process a printed circuit board (501) in operation 1201 to form at least one through hole (512) (or "via hole") (e.g., at least one through hole (512) of FIG. 11c) and / or a slot (513) (e.g., a slot (513) of FIG. 11c) that penetrates at least one area of ​​the printed circuit board (501). For example, a printed circuit board (501) may include an insulating layer (510) (e.g., the insulating layer (510) of FIG. 11a) and / or a copper foil (502) (or "copper clad") disposed on the top surface (510a) (e.g., the top surface (510a) of FIG. 11a) and the bottom surface (510b) (e.g., the bottom surface (510b) of FIG. 11a) of the insulating layer (510), and at least one through hole (512) may penetrate at least one area of ​​the insulating layer (510) and the copper foil (502). According to one embodiment, at least one through hole (512) may be formed by drilling at least one area of ​​the printed circuit board (501). However, drilling is merely one example of a processing method for forming at least one through hole (512), and according to other embodiments, at least one through hole (512) may be formed through laser processing or punching. According to one embodiment, a slot (513) is formed to have a relatively larger area compared to at least one through hole (512) and may be formed in a manner substantially identical or similar to the processing method for forming at least one through hole (512). For example, the slot (513) may be formed through at least one processing method among a plurality of drilling, a plurality of punching, or a plurality of laser processing, but is not limited thereto.

[0147] Referring to FIG. 12 and FIG. 13b, the structural manufacturing operation of an interposer according to one embodiment may fill a conductive material inside at least one through hole (512) and / or slot (513) formed in a printed circuit board (501) in operation 1202. In one example, the operation 1202 may fill the inside of at least one through hole (512) and / or slot (513) with a conductive material (or "conductive material") through hole plugging printing technology, but the method of filling the inside of at least one through hole (512) with a conductive material is not limited to the above-described embodiment. In another example, the conductive material filled inside the at least one through hole (512) and / or slot (513) may be a material other than copper. The conductive material may include, for example, at least one of silver paste, aluminum, silver-aluminum, carbon paste, or carbon nanotube paste, but is not limited thereto.

[0148] In the structural manufacturing operation of the interposer according to one embodiment, the top surface and / or bottom surface of the printed circuit board (501) may be flattened (or "polished") in the 1203 operation. For example, in the process of filling the inside of at least one through hole (512) and / or slot (513) with a conductive material in the 1202 operation, an area protruding in the top and / or bottom direction of the printed circuit board (501) may be formed. In one example, the area protruding in the top and / or bottom direction of the printed circuit board (501) may be removed through a flattening process. In one example, in the 1203 operation, the top surface and / or bottom surface of the printed circuit board (501) may be flattened through brush processing or buffing. In another example, in the 1203 operation, the top surface and / or bottom surface of the printed circuit board (501) may be flattened through a polishing process. For example, the polishing process may include at least one of mechanical polishing or chemical mechanical polishing (CMP).

[0149] According to one embodiment, by flattening an area protruding in the top and / or bottom direction of a printed circuit board (501) through the 1203 operation, at least one first conductive via (531) (e.g., at least one first conductive via (531) of FIG. 11a) and / or at least one second conductive via (532) (e.g., at least one second conductive via (532) of FIG. 11a) may be formed. In the 1202 operation, the at least one second conductive via (532) may be formed by filling a slot (513) having a larger area than the at least one through hole (512) with a conductive material, so that the at least one second conductive via (532) may be formed to have a relatively lower height than the at least one first conductive via (531). For example, at least one first conductive via (531) may be formed to have a first height (h1), and at least one second conductive via (532) may be formed to have a second height (h2) lower than the first height (h1).

[0150] Referring to FIG. 12 and FIG. 13c, the structural manufacturing operation of an interposer according to one embodiment may remove a copper foil (502) disposed on the top and / or bottom surfaces of an insulating layer (510) by etching the top and / or bottom surfaces of a printed circuit board (501) in operation 1204. In one example, since at least one first conductive via (531) and / or at least one second conductive via (532) are formed of a material other than copper, at least one first conductive via (531) and / or at least one second conductive via (532) may not be removed during the process of etching the top and / or bottom surfaces of the printed circuit board (501). In another example, as the copper foil (502) placed on the top surface (510a) and bottom surface (510b) of the insulating layer (510) is removed, a portion of at least one first conductive via (531) protruding from the top surface (510a) and / or bottom surface (510b) of the insulating layer (510) may be formed. For example, by the operation of 1204, a first protrusion (531a) of at least one first conductive via (531) protruding in the +z direction from the top surface (510a) of the insulating layer (510) (e.g., the first protrusion (531a) of FIG. 11c) and / or a second protrusion (531b) of at least one first conductive via (530) protruding in the -z direction from the bottom surface (510b) of the insulating layer (510) (e.g., the second protrusion (531b) of FIG. 11c) may be formed.

[0151] Referring to FIG. 12 and FIG. 13d, in the operation of manufacturing the structure of an interposer according to one embodiment, a solder resist layer (520) (e.g., the solder resist layer (520) of FIG. 11a) may be formed in at least one area of ​​the top surface (510a) and / or bottom surface (510b) of the insulating layer (510) in the operation 1205. In one example, in the operation 1205, a solder resist layer (520) may be formed by applying solder resist ink to an area excluding one area of ​​at least one first conductive via (531) and / or at least one second conductive via (532) of the top surface (510a) and / or bottom surface (510b) of the insulating layer (510), and then curing the applied ink by applying UV (ultraviolet ray) to the applied ink, but is not limited thereto. For example, through the operation of 1205, a first solder resist layer (521) (e.g., the first solder resist layer (521) of FIG. 11a) can be formed on the upper surface (510a) of the insulating layer (510), and a second solder resist layer (522) (e.g., the second solder resist layer (522) of FIG. 11a) can be formed on the lower surface (510b) of the insulating layer (510).

[0152] In one example, as solder resist ink is applied to an area excluding a portion of at least one first conductive via (531) and / or at least one second conductive via (532), at least one first opening (521a) and / or at least one second opening (521b) may be formed in the first solder resist layer (521), and at least one third opening (522a) and / or at least one fourth opening (522b) may be formed in the second solder resist layer (522). For example, at least one first opening (521a) may be formed in an area corresponding to at least one first conductive via (531) of the first solder resist layer (521), and at least one second opening (521b) may be formed in an area corresponding to a portion of at least one second conductive via (532). As another example, at least one third opening (522a) may be formed in an area corresponding to at least one first conductive via (531) of the second solder resist layer (522), and at least one second opening (522b) may be formed in an area corresponding to one of the at least one second conductive via (532).

[0153] Referring to FIG. 12 and FIG. 13e, the structural manufacturing operation of an interposer according to one embodiment may form a presolder (540) (e.g., the presolder (540) of FIG. 11a) on at least one first conductive via (531) and / or at least one second conductive via (532) in operation 1206. In one example, through operation 1206, the first presolder (541) may be formed on at least one region of the first protrusion (531a) of at least one first conductive via (531) and / or one end of at least one second conductive via (532) (e.g., one end in the +z direction of FIG. 13e). In another example, a second pre-solder (542) may be formed in at least one region of the second protrusion (531b) of at least one first conductive via (531) and / or the other end of at least one second conductive via (532) (e.g., the end in the -z direction of FIG. 13e).

[0154] In one example, the first pre-solder (541) may be formed by applying or squeezing solder cream (or "solder paste") to a portion of a first protrusion (531a) and / or at least one second conductive via (532) that is exposed to the outside through at least one first opening (521a) and / or at least one second opening (521b), and then melting the applied solder cream (or "reflow process"), but is not limited thereto. In another example, the second pre-solder (542) may be formed by applying solder cream to a portion of the second protrusion (531b) and / or at least one second conductive via (532) that is exposed to the outside through at least one third opening (522a) and / or at least one fourth opening (522b), and then melting the applied solder cream, but is not limited thereto.

[0155] The manufacturing operation of the interposer structure according to one embodiment can manufacture an interposer structure (500) that does not include a land for mounting the pre-solder (540) through the above-described operations 1201 to 1206.

[0157] FIG. 14 is an enlarged view of an interposer structure and region C of the interposer structure according to another embodiment, FIG. 15a is a cross-sectional view of the interposer structure of FIG. 14 cut in the II' direction according to one embodiment, FIG. 15b is a cross-sectional view of the interposer structure of FIG. 14 cut in the II' direction according to another embodiment. The interposer structure (600) shown in FIG. 14 may be a structure of an interposer (340) disposed between the first printed circuit board (331) and the second printed circuit board (332) of FIG. 5.

[0158] Referring to FIG. 14, FIG. 15a and / or FIG. 15b, an interposer structure (600) (or "printed circuit board structure") according to one embodiment may include an insulating layer (610) (e.g., insulating layer (341) of FIG. 5), at least one solder resist layer (or "solder resist") (620), at least one conductive via (630) (e.g., at least one conductive via (342) of FIG. 5), a presolder (640), and / or a conductive pad (650). An interposer structure (600) according to one embodiment may be a structure in which a conductive pad (650) is added to the interposer structure (400) of FIG. 6 and / or the interposer structure (500) of FIG. 10.

[0159] According to one embodiment, the insulating layer (610) may be formed from a material having a non-conductive material and may be formed in a closed-curve shape. For example, the insulating layer (610) may be formed in a band shape that forms a closed curve when viewed from the top (e.g., the +z direction in FIG. 14). In one example, the insulating layer (610) may include at least one side wall (611) that forms a closed curve and has a specified thickness and / or at least one through hole (612) (or "via hole") penetrating at least one area of ​​the insulating layer (610). In one example, at least one side wall (611) may form at least one side of the insulating layer (610). In another example, at least one through hole (612) may be formed in at least one area of ​​the interior of the insulating layer (610) spaced apart from the side of the insulating layer (610). For example, at least one through hole (612) may be formed by penetrating from one side facing the +z direction of the insulating layer (610) to one side facing the -z direction of the insulating layer (610), but is not limited thereto.

[0160] According to another embodiment (not shown), the insulating layer (610) may further include a bar-shaped slot (not shown) (e.g., slot (513) of FIG. 10) having a specified length and / or thickness that penetrates at least one region of the insulating layer (610). The slot described above may be substantially the same or similar as the slot (513) of FIG. 10, and redundant descriptions below will be omitted.

[0161] According to one embodiment, at least one solder resist layer (620) may be disposed in at least one area of ​​the top surface (610a) and / or bottom surface (610b) of the insulating layer (610). For example, the at least one solder resist layer (620) can prevent solder from adhering to the area of ​​the insulating layer (610) where the at least one solder resist layer (620) is disposed during the process of soldering (or "soldering") electronic components (e.g., the first printed circuit board (331) and the second printed circuit board (332) of FIG. 5) to the top and / or bottom of the interposer structure (600).

[0162] According to one embodiment, at least one solder resist layer (620) may include a first solder resist layer (621) and / or a second solder resist layer (622). In one example, the first solder resist layer (621) is disposed in at least one area of ​​the top surface (610a) of the insulating layer (610) to prevent solder from adhering to the top surface (610a) of the insulating layer (610). In another example, the second solder resist layer (622) is disposed in at least one area of ​​the bottom surface (610b) of the insulating layer (610) to prevent solder from adhering to the bottom surface (610b) of the insulating layer (610).

[0163] In one example, the first solder resist layer (621) may include at least one first opening (621a) formed at a position corresponding to at least one through hole (612) of the insulating layer (610). For example, when viewed from the top of the interposer structure (600) (e.g., the +z direction in FIG. 15a and FIG. 15b), at least one area of ​​the at least one first opening (621a) may be positioned to overlap with at least one through hole (612). In another example, the at least one first opening (621a) may be formed with a larger area than the at least one through hole (612), so that the outer surface of the at least one first opening (621a) may surround the outer surface of the at least one through hole (612). The shape of at least one first opening (621a) is not limited to the above-described embodiment, and according to other embodiments (not shown), at least one first opening (621a) may be formed with an area narrower than at least one through hole (612) or with substantially the same area.

[0164] In one example, the second solder resist layer (622) may include at least one second opening (622a) formed at a position corresponding to at least one through hole (612) of the insulating layer (610). For example, when viewed from the bottom of the interposer structure (600) (e.g., the -z direction in FIG. 15a and FIG. 15b), at least one area of ​​the at least one second opening (622a) may be positioned to overlap with at least one through hole (612). In another example, the at least one second opening (622a) may be formed with a larger area than the at least one through hole (612), so that the outer surface of the at least one second opening (622a) may surround the outer surface of the at least one through hole (612). The shape of at least one second opening (622a) is not limited to the embodiment described above, and according to other embodiments (not shown), at least one second opening (622a) may be formed with an area narrower than at least one through hole (612) or with substantially the same area.

[0165] As another example, at least one second opening (622a) may be formed at a position corresponding to at least one first opening (621a) of the first solder resist layer (621). In one example, through at least one first opening (621a) formed in the first solder resist layer (621) and / or at least one second opening (622a) formed in the second solder resist layer (622), a portion of the insulating layer (610) and / or a portion of at least one conductive via (630) may be exposed to the outside of the interposer structure (600).

[0166] According to one embodiment, at least one conductive via (630) may be located inside at least one through hole (612) of the insulating layer (610). At least one conductive via (630) may be formed of a conductive material (e.g., metal) to electrically connect electronic components placed in the interposer structure (600). For example, at least one conductive via (630) may electrically connect an electronic component (e.g., the first printed circuit board (331) of FIG. 5) placed at the bottom (e.g., the -z direction of FIG. 14) of the interposer structure (600) and an electronic component (e.g., the second printed circuit board (332) of FIG. 5) placed at the top (e.g., the +z direction of FIG. 14) of the interposer structure (600). As another example, at least one conductive via (630) may include a cylindrical (or "hole-shaped") conductive via (e.g., at least one first conductive via (531) of FIG. 11d), but is not limited thereto. According to another embodiment (not shown), at least one conductive via (630) may include a rectangular bar-shaped conductive via (e.g., at least one second conductive via (532) of FIG. 11d) located inside a slot and having a specified length and / or thickness.

[0167] In one example, at least one conductive via (630) may include a first protrusion (631) protruding from the top surface (610a) of the insulating layer (610) in the direction in which at least one first opening (621a) of the first solder resist layer (621) is formed (e.g., the +z direction in FIG. 15a and FIG. 15b) and / or a second protrusion (632) protruding from the bottom surface (610b) of the insulating layer (610) in the direction in which at least one second opening (622a) of the second solder resist layer (622) is formed (e.g., the -z direction in FIG. 15a and FIG. 15b). For example, the first protrusion (631) of at least one conductive via (630) may protrude from the top surface (610a) of the insulating layer (610) to one surface facing the +z direction of the first solder resist layer (621). As another example, a second protrusion (632) of at least one conductive via (630) may protrude from the bottom surface (610b) of the insulating layer (610) to a surface facing the -z direction of the second solder resist layer (622).

[0168] According to one embodiment, a conductive pad (650) may be positioned inside at least one through hole (612) of an insulating layer (610) to surround the outer surface of at least one conductive via (630). In one example, the conductive pad (650) may be formed by plating the inner side of at least one through hole (612). In another example, the conductive pad (650) may be positioned between the inner side of at least one through hole (612) and the outer surface of at least one conductive via (630) so that at least one conductive via (630) is firmly fixed to the insulating layer (610).

[0169] According to one embodiment, the pre-solder (640) is placed in the upper region (e.g., the region in the +z direction of FIG. 15a and FIG. 15b) and / or the lower region (e.g., the region in the -z direction of FIG. 15a and FIG. 15b) of the interposer structure (600) and can perform the function of fixing electronic components placed in the upper and / or lower regions of the interposer structure (600) to the interposer structure (600).

[0170] In one embodiment, the presolder (640) may include a first presolder (641) and / or a second presolder (642). In one example, the first presolder (641) may be placed on a first protrusion (631) of at least one conductive via (630) that is exposed to the outside of the interposer structure (600) through at least one first opening (621a) of the first solder resist layer (621). For example, the first presolder (641) may be seated on one end of the first protrusion (631) (e.g., one end in the +z direction of FIG. 15a and FIG. 15b). In another example, the second pre-solder (642) may be placed on a second protrusion (632) of at least one conductive via (630) that is exposed to the outside of the interposer structure (600) through at least one second opening (622a) of the second solder resist layer (622). For example, the second pre-solder (642) may be seated on one end of the second protrusion (632) (e.g., one end in the -z direction in FIG. 15a and FIG. 15b).

[0171] According to one embodiment, the interposer structure (600) can secure electronic components to the top and / or bottom of the interposer structure (600) through a first pre-solder (641) and / or a second pre-solder (642). For example, the interposer structure (600) can apply heat to the first pre-solder (641) to solder a second printed circuit board (e.g., the +z direction in FIG. 15a and FIG. 15b) to the top of the interposer structure (600) (e.g., the +z direction in FIG. 15a and FIG. 15b). As another example, the interposer structure (600) can apply heat to the second pre-solder (642) to solder a first printed circuit board (e.g., the -z direction in FIG. 15a and FIG. 15b) to the bottom of the interposer structure (600).

[0172] According to one embodiment, the interposer structure (600) can form a space in which a pre-solder (640) can be seated without forming a land through at least one conductive via (630) comprising a first protrusion (631) and / or a second protrusion (632) that protrude in an upward direction and / or a downward direction relative to the insulating layer (610). In one example, as the interposer structure (600) is formed as a landless structure that does not include a land, the distance (pitch) (P3) between the conductive vias (630) may not be spaced apart by more than a specified distance to secure a space for forming a land. For example, the above-described interposer structure (600) having a landless structure may form a closer distance between the conductive vias (630) compared to an interposer structure that includes a land. According to one embodiment, the interposer structure (600) can form a distance (P3) between conductive vias (630) close so that electronic components can be placed or mounted at a high density on a plurality of printed circuit boards (e.g., the first printed circuit board (331), the second printed circuit board (332) of FIG. 5) placed on the top and / or bottom of the interposer structure (600).

[0173] Referring to FIG. 15a, according to one embodiment, the interposer structure (600) may further include a side plating portion (660). In one example, the side plating portion (660) may be located in at least one area of ​​the side (610c) of the insulating layer (610) to electromagnetically shield the interposer structure (600). In the present disclosure, the side (610c) of the insulating layer (610) may mean a surface located between the upper surface (610a) and the lower surface (610b) of the insulating layer (610) to cover the space between the upper surface (610a) and the lower surface (610b). For example, the side plating portion (660) may shield noise generated inside the interposer structure (600) (e.g., noise generated from electronic components) from leaking out of the interposer structure (600), or may shield noise entering from outside the interposer structure (600).

[0174] Referring to FIG. 15b, according to another embodiment, the interposer structure (600) may not include a side plating portion for electromagnetically shielding the interposer structure (600). In one example, at least one conductive via (630) may include a bar-shaped conductive via (e.g., at least one second conductive via (532) of FIG. 11d), and the bar-shaped conductive via may be formed to have a specified length and / or thickness and may operate as ground. According to another embodiment, the interposer structure (600) may electromagnetically shield the interposer structure (600) without including a separate side plating portion through the bar-shaped conductive via that operates as ground.

[0175] Hereinafter, with reference to FIGS. 16 and FIGS. 17a to 17f, we will examine the manufacturing process of an interposer structure (600) according to one embodiment.

[0177] FIG. 16 is a flowchart illustrating the manufacturing operation of an interposer structure according to another embodiment.

[0178] FIG. 17a is a drawing illustrating the operation of forming at least one through hole in a printed circuit board according to one embodiment. FIG. 17b is a drawing illustrating the operation of plating the inside of at least one through hole and / or the side of an insulating layer according to one embodiment. FIG. 17c is a drawing illustrating the operation of filling a conductive material inside at least one through hole and flattening the printed circuit board according to one embodiment. FIG. 17d is a drawing illustrating the operation of etching the printed circuit board according to one embodiment. FIG. 17e is a drawing illustrating the operation of forming a solder resist layer on the top surface and / or bottom surface of the printed circuit board according to one embodiment. FIG. 17f is a drawing illustrating the operation of forming a presolder according to one embodiment.

[0179] FIGS. 17a to 17e illustrate manufacturing operations for a portion of an interposer structure (or "printed circuit board structure") (e.g., area C of FIG. 14), and other portions of the interposer structure can also be manufactured through the same operations. Hereinafter, in describing the manufacturing operations of the interposer structure of FIG. 16, the description will be made with reference to the configurations of FIGS. 17a to 17e.

[0181] Referring to FIG. 16 and FIG. 17a, the manufacturing operation of an interposer structure according to one embodiment may process a printed circuit board (601) in operation 1601 to form at least one through hole (612) (or "via hole") (e.g., at least one through hole (612) of FIG. 7) that penetrates at least one region of the printed circuit board (601). For example, a printed circuit board (601) may include an insulating layer (610) (e.g., the insulating layer (610) of FIG. 14) and / or a copper foil (602) (or "copper clad") disposed on the top surface (610a) (e.g., the top surface (610a) of FIG. 14) and the bottom surface (610b) (e.g., the bottom surface (610b) of FIG. 14) of the insulating layer (610), and at least one through hole (612) may penetrate at least one area of ​​the insulating layer (610) and the copper foil (602). According to one embodiment, at least one through hole (612) may be formed by drilling at least one area of ​​the printed circuit board (601). However, drilling is merely one example of a processing method for forming at least one through hole (612), and according to other embodiments, at least one through hole (612) may be formed through laser processing or punching. According to other embodiments, the manufacturing operation of the interposer structure may form at least one through hole (612) and / or a slot (e.g., slot (513) in FIG. 11d) in the 1601 operation. In one example, the slot may be formed to have a larger area than the at least one through hole (612). In other examples, the slot may be formed in a manner substantially the same or similar to the processing method for forming at least one through hole (612). For example, the slot may be formed through at least one of a plurality of drilling, a plurality of punching, or a plurality of laser processing methods, but is not limited thereto.

[0182] Referring to FIGS. 16 and FIGS. 17b, the structural manufacturing operation of an interposer according to one embodiment may plate at least one area of ​​a printed circuit board (601) in operation 1602. In one example, in operation 1602, at least one area of ​​the inside of at least one through hole (612) of the printed circuit board (601) and / or the side of the printed circuit board (601) may be plated. Through the above-described operation 1602, a conductive pad (650) located inside the at least one through hole (612) (e.g., the conductive pad (650) of FIGS. 15a and FIGS. 15b) and / or a side plated portion (660) (e.g., the side plated portion (660) of FIG. 15a) may be formed. The process of forming the side plating portion (660) may include, for example, plating the side of the insulating layer (610) and then attaching a dry film to at least one area of ​​the side of the insulating layer (610) where the side plating portion is to be formed. In another example, the side plating portion (660) may be formed on at least one area of ​​the side of the insulating layer (610) by undergoing the processes of exposure, development, and etching of at least one area of ​​the side of the insulating layer (610) to which the dry film is attached, and then peeling off the dry film attached to the insulating layer (610). In another example, the side plating portion (660) may not be formed by plating only the inside of at least one through hole (612) of the printed circuit board (601) in the 1602 operation.

[0183] Referring to FIG. 16 and FIG. 17c, the structural manufacturing operation of an interposer according to one embodiment may fill a conductive material (or "conductive material") inside at least one through hole (612) formed in a printed circuit board (601) in operation 1603. In one example, the operation 1603 may fill the inside of at least one through hole (612) with a conductive material through hole plugging printing technology, but the method of filling the inside of at least one through hole (612) with a conductive material is not limited to the above-described embodiment. In another example, the conductive material filled inside the at least one through hole (612) may be a material other than copper. The conductive material may include, for example, at least one of silver paste, aluminum, silver-aluminum, carbon paste, or carbon nanotube paste, but is not limited thereto. Although not shown in the drawings, in the 1603 operation, the inside of the slot may be filled with a conductive material.

[0184] In one embodiment, the structural manufacturing operation of the interposer may flatten (or "polish") the top surface and / or bottom surface of the printed circuit board (601) in the 1604 operation. For example, in the process of filling the inside of at least one through hole (612) with a conductive material in the 1603 operation, an area protruding in the top and / or bottom direction of the printed circuit board (601) may be formed. In one embodiment, the structural manufacturing operation of the interposer may form at least one conductive via (630) (e.g., the conductive via (630) of FIG. 15a and FIG. 15b) by flattening the area protruding in the top and / or bottom direction of the printed circuit board (601) through the 1604 operation. In one example, in the 1604 operation, the top surface and / or bottom surface of the printed circuit board (601) may be flattened through brushing or buffing. In another example, in operation 1604, the top surface and / or bottom surface of the printed circuit board (601) can be flattened through a polishing process. For example, the polishing process may include at least one of mechanical polishing or chemical mechanical polishing (CMP).

[0185] Referring to FIG. 16 and FIG. 17d, the manufacturing operation of the structure of the interposer according to one embodiment may remove the copper foil (602) placed on the top and / or bottom surfaces of the insulating layer (610) by etching the top and / or bottom surfaces of the printed circuit board (601) in operation 1605. In one example, since at least one conductive via (630) is formed of a material other than copper, at least one conductive via (630) may not be removed during the process of etching the top and / or bottom surfaces of the printed circuit board (601). In another example, as the copper foil (602) placed on the top surface (610a) and bottom surface (610b) of the insulating layer (610) is removed, a portion of the at least one conductive via (630) protruding from the top surface (610a) and / or bottom surface (610b) of the insulating layer (610) may be formed. For example, by the operation of 1605, a first protrusion (631) of at least one conductive via (630) protruding in the +z direction from the top surface (610a) of the insulating layer (610) (e.g., the first protrusion (631) of FIG. 15a, FIG. 15b) and / or a second protrusion (632) of at least one conductive via (630) protruding in the -z direction from the bottom surface (610b) of the insulating layer (610) (e.g., the second protrusion (632) of FIG. 15a, FIG. 15b) may be formed.

[0186] Referring to FIGS. 16 and 17e, in the operation of manufacturing the structure of an interposer according to one embodiment, a solder resist layer (620) (e.g., the solder resist layer (620) of FIGS. 15a and 15b) may be formed in at least one area of ​​the top surface (610a) and / or bottom surface (610b) of the insulating layer (610) in the operation 1606. In one example, in the operation 1606, a solder resist layer (620) may be formed by applying solder resist ink to an area excluding the region where at least one conductive via (630) of the top surface (610a) and / or bottom surface (610b) of the insulating layer (610) is disposed, and then curing the applied ink by applying UV (ultraviolet ray) to the applied ink, but is not limited thereto. For example, through the operation of 1605, a first solder resist layer (621) (e.g., the first solder resist layer (621) of FIG. 15a and FIG. 15b) may be formed on the upper surface (610a) of the insulating layer (610), and a second solder resist layer (622) (e.g., the second solder resist layer (622) of FIG. 15a and FIG. 15b) may be formed on the lower surface (610b) of the insulating layer (610). As another example, as solder resist ink is applied to an area excluding the area where the conductive via (630) is placed, at least one first opening (621a) (e.g., the at least one first opening (621a) of FIG. 15a and FIG. 15b) may be formed in an area corresponding to at least one conductive via (630) of the first solder resist layer (621). Similarly, at least one second opening (622a) (e.g., at least one second opening (622a) of FIG. 15a, FIG. 15b) may be formed in an area corresponding to at least one conductive via (630) of the second solder resist layer (622).

[0187] Referring to FIGS. 16 and FIGS. 17f, the structural manufacturing operation of an interposer according to one embodiment may form a presolder (640) (e.g., the presolder (640) of FIG. 14) on a first protrusion (631) and / or a second protrusion (632) of at least one conductive via (630) in operation 1607. In one example, through operation 1607, a first presolder (641) may be formed in at least one area of ​​the first protrusion (631) of at least one conductive via (630), and a second presolder (642) may be formed in at least one area of ​​the second protrusion (632) of at least one conductive via (630). The first pre-solder (641) and / or the second pre-solder (642) may be formed, for example, by applying or squeezing solder cream (or "solder paste") onto the first protrusion (631) and / or the second protrusion (632) using a metal mask, and then melting the applied solder cream (or "reflow process"), but is not limited thereto. The manufacturing operation of the interposer structure according to one embodiment may produce an interposer structure (600) that does not include a land for seating the pre-solder (640) through the above-described operations 1601 to 1607.

[0189] The interposer structure (400, 500, 600) of the present disclosure may include an insulating layer (341, 410, 510, 610), a first solder resist layer (421, 521, 621), a second solder resist layer (422, 522, 622), at least one conductive via (342, 430, 630), a first presolder (441, 541, 641), and a second presolder (442, 542, 642). The insulating layer (341, 410, 510, 610) may include at least one through hole. The first solder resist layer (421, 521, 621) may include at least one first opening (421a, 521a, 621a) formed in an area corresponding to the at least one through hole, located in at least one area of ​​the upper surface of the insulating layer (341, 410, 510, 610). The second solder resist layer (422, 522, 622) may include at least one second opening (422, 521b, 522b, 622a) formed in an area corresponding to the at least one through hole, located in at least one area of ​​the lower surface of the insulating layer (341, 410, 510, 610). The at least one conductive via (342, 430, 630) may be located within the at least one through hole. The at least one conductive via (342, 430, 630) may include a first protruding portion (431, 531a, 631) formed by protruding in the direction of the at least one first opening (421a, 521a, 621a) and a second protruding portion (432, 531b, 632) formed by protruding in the direction of the at least one second opening (422, 521b, 522b, 622a). The first pre-solder (441, 541, 641) may be disposed on the top of the first protruding portion (431, 531a, 631) of the at least one conductive via (342, 430, 630).The second pre-solder (442, 542, 642) may be placed at the bottom of the second protrusion (432, 531b, 632) of the at least one conductive via (342, 430, 630).

[0190] The first protruding portion (431, 531a, 631) of the interposer structure (400, 500, 600) of the present disclosure may be formed to protrude from the upper surface of the insulating layer (341, 410, 510, 610) to the first solder resist layer (421, 521, 621).

[0191] The second protruding portion (432, 531b, 632) of the interposer structure (400, 500, 600) of the present disclosure may be formed to protrude from the lower surface of the insulating layer (341, 410, 510, 610) to the second solder resist layer (422, 522, 622).

[0192] The interposer structure (400, 500, 600) of the present disclosure may further include a conductive pad (650) positioned inside the at least one through hole and arranged to surround the outer surface of the at least one conductive via (342, 430, 630).

[0193] The interposer structure (400, 500, 600) of the present disclosure may further include a side plating portion (450, 660) located in at least one area of ​​the side of the insulating layer (341, 410, 510, 610) and electromagnetically shielding the interposer structure (400, 500, 600).

[0194] The at least one conductive via (342, 430, 630) of the interposer structure (400, 500, 600) of the present disclosure may be formed in a cylindrical shape.

[0195] The interposer structure (400, 500, 600) of the present disclosure may further include a first printed circuit board (331) disposed on the top of the interposer structure (400, 500, 600) and a second printed circuit board (332) disposed on the bottom of the interposer structure (400, 500, 600). The first printed circuit board (331) may be electrically connected to the second printed circuit board (332) through the at least one conductive via (342, 430, 630).

[0196] The first printed circuit board (331) of the interposer structure (400, 500, 600) of the present disclosure can be fixed to the top of the interposer structure (400, 500, 600) through the first pre-solder (441, 541, 641).

[0197] The second printed circuit board (332) of the interposer structure (400, 500, 600) of the present disclosure can be fixed to the bottom of the interposer structure (400, 500, 600) through the second pre-solder (442, 542, 642).

[0198] The insulating layer (341, 410, 510, 610) of the interposer structure (400, 500, 600) of the present disclosure may be formed in a strip shape along at least one edge of the first printed circuit board (331) or the second printed circuit board (332) when viewed from the top of the interposer structure (400, 500, 600).

[0199] The interposer structure (400, 500, 600) of the present disclosure may include an insulating layer (341, 410, 510, 610), a first solder resist layer (421, 521, 621), a second solder resist layer (422, 522, 622), a first conductive via (530, 531), a second conductive via (532), a first presolder (441, 541, 641), and a second presolder (442, 542, 642). The insulating layer (341, 410, 510, 610) may include at least one through hole and a slot. The first solder resist layer (421, 521, 621) may be located in at least one area of ​​the upper surface of the insulating layer (341, 410, 510, 610) and may include at least one first opening (421a, 521a, 621a) formed in an area corresponding to the at least one through hole and at least one second opening (422, 521b, 522b, 622a) formed in an area corresponding to at least one area of ​​the slot. The second solder resist layer (422, 522, 622) may be located in at least one area of ​​the lower surface of the insulating layer (341, 410, 510, 610) and may include at least one third opening formed in an area corresponding to the at least one through hole and at least one fourth opening formed in an area corresponding to at least one area of ​​the slot. The first conductive via (530, 531) may be located within the at least one through hole and formed to have a first height. The first conductive via (530, 531) may include a first protruding portion (431, 531a, 631) formed by protruding in the direction of the at least one first opening (421a, 521a, 621a) and a second protruding portion (432, 531b, 632) formed by protruding in the direction of the at least one third opening. The second conductive via (532) may be located within the slot and formed to have a second height lower than the first height.The first pre-solder (441, 541, 641) may be placed on top of the first conductive via (530, 531) and the second conductive via (532). The second pre-solder (442, 542, 642) may be placed on the bottom of the first conductive via (530, 531) and the second conductive via (532).

[0200] The first conductive via (530, 531) of the interposer structure (400, 500, 600) of the present disclosure may be formed in a cylindrical shape.

[0201] The second conductive via (532) of the interposer structure (400, 500, 600) of the present disclosure may be formed in a bar shape having a specified length when viewed from the top of the interposer structure (400, 500, 600).

[0202] The second conductive via (532) of the interposer structure (400, 500, 600) of the present disclosure can operate as a ground that electromagnetically shields the interposer structure (400, 500, 600).

[0203] The second conductive via (532) of the interposer structure (400, 500, 600) of the present disclosure may be formed at the same height as the insulating layer (341, 410, 510, 610).

[0204] The first protruding portion (431, 531a, 631) of the first conductive via (530, 531) of the interposer structure (400, 500, 600) of the present disclosure may be formed to protrude from the upper surface of the insulating layer (341, 410, 510, 610) to the first solder resist layer (421, 521, 621).

[0205] The second protruding portion (432, 531b, 632) of the first conductive via (530, 531) of the interposer structure (400, 500, 600) of the present disclosure may be formed to protrude from the bottom surface of the insulating layer (341, 410, 510, 610) to the second solder resist layer (422, 522, 622).

[0206] The interposer structure (400, 500, 600) of the present disclosure may further include a first conductive pad (650) and a second conductive pad (650). The first conductive pad (650) may be positioned inside the at least one through hole and arranged to surround the outer surface of the first conductive via (530, 531). The second conductive pad (650) may be positioned inside the slot and arranged to surround the outer surface of the second conductive via (532).

[0207] The interposer structure (400, 500, 600) of the present disclosure may include a first printed circuit board (331), a second printed circuit board (332), electronic components, and an interposer. The second printed circuit board (332) may be spaced apart from the first printed circuit board (331) and positioned to face at least one side of the first printed circuit board (331). The electronic components may be positioned on the first printed circuit board (331) or the second printed circuit board (332). The interposer may be positioned between the first printed circuit board (331) and the second printed circuit board (332) and may be positioned to surround the space between the first printed circuit board (331) and the second printed circuit board (332). The above interposer may include an insulating layer (341, 410, 510, 610), a first solder resist layer (421, 521, 621), a second solder resist layer (422, 522, 622), and a first conductive via (530, 531). The insulating layer (341, 410, 510, 610) may include a first surface facing the first printed circuit board (331) and a second surface facing the second printed circuit board (332), and may include at least one through hole formed through the first surface and the second surface. The first solder resist layer (421, 521, 621) may be disposed in at least one area of ​​the first surface of the insulating layer (341, 410, 510, 610) and may include a first opening (421a, 521a, 621a) formed in an area corresponding to the at least one through hole. The second solder resist layer (422, 522, 622) may be disposed in at least one area of ​​the second surface of the insulating layer (341, 410, 510, 610) and may include a second opening (422, 521b, 522b, 622a) formed in an area corresponding to the at least one through hole.The first conductive via (530, 531) may be located inside the at least one through hole and may include a first protruding portion (431, 531a, 631) formed protruding from the first surface of the insulating layer (341, 410, 510, 610) to the first solder resist layer (421, 521, 621) and a second protruding portion (432, 531b, 632) formed protruding from the second surface of the insulating layer (341, 410, 510, 610) to the second solder resist layer (422, 522, 622). The first printed circuit board (331) may be electrically connected to the second printed circuit board (332) through the first conductive via (530, 531).

[0208] The interposer of the interposer structure (400, 500, 600) of the present disclosure may further include a slot penetrating the first surface and the second surface of the insulating layer (341, 410, 510, 610) and a second conductive via (532) located inside the slot and electrically connecting the first printed circuit board (331) and the second printed circuit board (332).

[0209] The first conductive via (530, 531) of the interposer structure (400, 500, 600) of the present disclosure may be formed in a cylindrical shape. The second conductive via (532) may be formed in a bar shape having a specified length when viewed from the top of the interposer.

[0210] The second conductive via (532) of the interposer structure (400, 500, 600) of the present disclosure can operate as a ground for electromagnetically shielding the at least one electronic component.

[0212] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0213] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof. Explanation of the symbols

[0214] 400, 500, 600: Interposer structure 341, 410, 510, 610: Insulation layer 421, 521, 621: First solder resist layer 422, 522, 622: Second solder resist layer 342, 430, 630: Challenging vias 441, 541, 641: 1st pre-solder 442, 542, 642: 2nd pre-solder 341, 410, 510, 610: Insulation layer 421a, 521a, 621a: First opening 422, 521b, 522b, 622a: Second opening 431, 531a, 631: First protrusion 432, 531b, 632: Second protrusion 650: Conductive pad 450, 660: Side plating

Claims

Claim 1 In an interposer structure, an insulating layer comprising through-hole regions and slot regions; a first solder resist layer disposed in at least one region of a first surface of the insulating layer, wherein the first solder resist layer comprises first openings corresponding to the through-hole regions and second openings corresponding to the slot regions; a second solder resist layer disposed in at least one region of a second surface of the insulating layer, wherein the second solder resist layer comprises third openings corresponding to the through-hole regions and fourth openings corresponding to the slot regions; first conductive materials disposed within the through-hole regions, wherein each of the first conductive materials comprises a first portion protruding toward the first openings and a second portion protruding toward the third openings; a second conductive material disposed within the slot regions; a first presolder disposed on the first portion; and a second presolder disposed on the second portion. An interposer structure comprising: a third pre-solder disposed in the second openings and electrically connected to the second conductive material; and a fourth pre-solder disposed in the fourth openings and electrically connected to the second conductive material, wherein the second conductive material is disposed adjacent to a side of the interposer structure and the second conductive material is a ground for electrical connection between the third pre-solder and the fourth pre-solder and for electromagnetic shielding of the side. Claim 2 delete Claim 3 The interposer structure according to claim 1, wherein the first portion of the first conductive materials is formed protruding from the first surface of the insulating layer to the first solder resist layer, the second portion is formed protruding from the second surface of the insulating layer to the second solder resist layer, and when viewed from the top of the interposer structure, the second conductive material within the slot region has a larger area than each of the first conductive materials within the through-hole regions, and the height of the second conductive material is lower than the height of each of the first conductive materials. Claim 4 An interposer structure according to claim 1, further comprising a conductive pad disposed inside the through-hole regions and disposed to surround the outer surface of the first conductive materials. Claim 5 delete Claim 6 The interposer structure according to claim 1, wherein the first conductive materials have a cylindrical shape. Claim 7 The interposer structure of claim 1 further comprises: a first printed circuit board disposed on the top of the interposer structure; and a second printed circuit board disposed on the bottom of the interposer structure, wherein the first printed circuit board is electrically connected to the second printed circuit board through the first conductive materials. Claim 8 An interposer structure according to claim 7, wherein the first printed circuit board is fixed to the top of the interposer structure through the first pre-solder, and the second printed circuit board is fixed to the bottom of the interposer structure through the second pre-solder. Claim 9 In claim 7, the insulating layer is formed along at least one edge of the first printed circuit board or the second printed circuit board when viewed from the top of the interposer structure, in an interposer structure. Claim 10 In an interposer structure, an insulating layer comprising through-hole regions and slot regions; a first solder resist layer disposed in at least one region of a first surface of the insulating layer, wherein the first solder resist layer comprises first openings corresponding to the through-hole regions and second openings corresponding to the slot regions; a second solder resist layer disposed in at least one region of a second surface of the insulating layer, wherein the second solder resist layer comprises third openings corresponding to the through-hole regions and fourth openings corresponding to the slot regions; first conductive materials disposed within the through-hole regions, wherein each of the first conductive materials comprises a first portion protruding toward the first openings and a second portion protruding toward the third openings; a second conductive material disposed within the slot regions; a first presolder disposed on the first portion; and a second presolder disposed on the second portion. An interposer structure comprising: a third pre-solder disposed in the second openings and electrically connected to the second conductive material; and a fourth pre-solder disposed in the fourth openings and electrically connected to the second conductive material, wherein the second conductive material is disposed adjacent to a side of the interposer structure, and the second conductive material is a ground for electrical connection between the third pre-solder and the fourth pre-solder and for electromagnetic shielding of the side, and the first conductive materials have a first height, and the second conductive material has a second height shorter than the first height. Claim 11 An interposer structure according to claim 10, wherein the first conductive materials are formed in a cylindrical shape. Claim 12 In claim 10, the interposer structure having a bar shape having a specified length when viewed from the top of the interposer structure. Claim 13 delete Claim 14 An interposer structure according to claim 10, wherein the second conductive material is formed at the same height as the insulating layer. Claim 15 An interposer structure according to claim 10, wherein the first portion of the first conductive materials is formed to protrude from the first surface of the insulating layer to the first solder resist layer, and the second portion is formed to protrude from the second surface of the insulating layer to the second solder resist layer. Claim 16 An interposer structure according to claim 10, further comprising: a first conductive pad disposed inside the through-hole regions and disposed to surround the outer surface of the first conductive materials; and a second conductive pad disposed inside the slot region and disposed to surround the outer surface of the second conductive material. Claim 17 In an electronic device, a first printed circuit board; a second printed circuit board; The invention includes an interposer structure that electrically connects the first printed circuit board and the second printed circuit board, wherein the interposer structure comprises: an insulating layer including through-hole regions and slot regions; a first solder resist layer disposed in at least one region of a first surface of the insulating layer, wherein the first solder resist layer comprises first openings corresponding to the through-hole regions and second openings corresponding to the slot region; a second solder resist layer disposed in at least one region of a second surface of the insulating layer, wherein the second solder resist layer comprises third openings corresponding to the through-hole regions and fourth openings corresponding to the slot region; first conductive materials disposed within the through-hole regions, wherein each of the first conductive materials comprises a first portion protruding toward the first openings and a second portion protruding toward the third openings; a second conductive material disposed within the slot region; a first presolder disposed on the first portion; and a second presolder disposed on the second portion. An electronic device comprising a third pre-solder disposed in the second openings and electrically connected to the second conductive material, and a fourth pre-solder disposed in the fourth openings and electrically connected to the second conductive material, wherein the second conductive material is disposed adjacent to the side of the interposer structure, and the second conductive material is a ground for electrical connection between the third pre-solder and the fourth pre-solder and for electromagnetic shielding of the side, and when viewed from the top of the interposer structure, the second conductive material within the slot region has a larger area than each of the first conductive materials within the through-hole regions, and the height of the second conductive material is lower than the height of each of the first conductive materials. Claim 18 An electronic device according to claim 17, wherein the first portion of the first conductive materials is formed to protrude from the first surface of the insulating layer to the first solder resist layer. Claim 19 An electronic device according to claim 17, wherein the first conductive materials have a cylindrical shape and the second conductive material has a bar shape when viewed from the top of the interposer structure. Claim 20 delete

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