Metal connector in semiconductor device package

Abstract

A connector for a semiconductor device package. The connector may include an intermediate portion having a curved concave shape in a front view with respect to a given surface. The connector may include a first contact portion integrally connected to the intermediate portion on a first side, as well as a second contact portion integrally connected to the intermediate portion on a second side, and the first contact portion and the second contact portion define a curved convex surface in a front view with respect to a given surface. In some embodiments, the connector may include a slot assembly as well as one or more indents defining a serpentine path, and this structure imparts greater elastic flexibility, such as under mechanical load.

Description

Technology Field

[0001] The embodiments relate to packages for supplying power to semiconductor devices, particularly semiconductor chips. Background Technology

[0002] Semiconductor device packages (or simply "semiconductor packages"), such as power modules or separate packages, may include components such as semiconductor chips, substrates, and connectors, the latter of which may include wires, clips, and other connectors. In particular, power semiconductor packages may include power chips such as thyristors, field-effect transistors (FETs), isolated-gate bipolar transistors (IGBTs), and auxiliary chips including diodes. The main purpose of the clips is to electrically connect these chips to each other or to substrates. These substrates may generally be formed as a sandwich structure having an inner insulating substrate, such as alumina or aluminum nitride, and a layer of copper or aluminum on the main surfaces opposite the inner insulating substrate.

[0003] Metal clips offer advantages over wire bonds for use as electrical connectors in that a single metal clip can demonstrate a significantly larger cross-section to conduct current, unlike a wire. Furthermore, wire bonding, which attaches wires to semiconductor chips or substrates, can be more complex and less reliable compared to attaching metal clips to substrates or semiconductor chips.

[0004] Known clips have been developed that have a pair of flat sections used for bonding to a chip or substrate surface. The flat sections of these clips are separated from each other by a curved intermediate section. The overall structure of these clips can exhibit a C-shape in a front view, and these connectors can be referred to as "C-clips." This design can reduce stress accumulation during mechanical or thermomechanical loads, thereby increasing the reliability of the C-clip connector during the operation of the semiconductor package.

[0005] Considering the above, the embodiments are provided.

[0006] In one embodiment, a connector for a semiconductor device package is provided. The connector may include an intermediate portion having a curved concave shape in a front view with respect to a given surface. The connector may include a first contact portion integrally connected to the intermediate portion on a first side. The connector may further include a second contact portion integrally connected to the intermediate portion on a second side, and the first contact portion and the second contact portion define a curved convex surface in a front view with respect to a given surface.

[0007] In another embodiment, a semiconductor device package is provided. The semiconductor device package may include a plurality of components, including a housing and at least one semiconductor chip disposed within the housing. The semiconductor device package may also include a connector, and the connector is coupled to a pair of components among the plurality of components. The connector may include an intermediate portion having a curved concave shape in a front view with respect to a given surface. The connector may also include a first contact portion integrally connected to the intermediate portion on a first side and attached to the first component of the pair of components, and a second contact portion integrally connected to the intermediate portion on a second side and attached to the second component of the pair of components. Thus, the first contact portion and the second contact portion may define a curved convex surface in a front view with respect to a given surface, and the connector provides an electrical connection between the pair of components. Brief explanation of the drawing

[0008] FIGS. 1a through 1d illustrate various views of a connector according to embodiments of the present disclosure; FIGS. 2a through 2d depict various views of another connector according to other embodiments of the present disclosure; FIGS. 3a through 3d illustrate various views of a connector according to additional embodiments of the present disclosure; FIGS. 4a through 4d illustrate various views of a connector according to still other embodiments of the present disclosure; FIGS. 5a through 5d illustrate various views of a connector according to other embodiments of the present disclosure; FIG. 6 illustrates a side view of a semiconductor device package arranged according to embodiments of the present disclosure; FIG. 7a depicts the semiconductor device package of FIG. 6 as a configuration of warpage; FIG. 7b depicts the semiconductor device package of FIG. 6 in another configuration of bending; FIG. 8a depicts an exemplary connector of the embodiments as one configuration of bending; and Figure 8b depicts the connector of Figure 8a in another configuration of bending. Specific details for implementing the invention

[0009] The embodiments will now be described more fully below with reference to the accompanying drawings, in which exemplary embodiments are illustrated. The embodiments should not be interpreted as being limited to those presented herein. Rather, these embodiments are provided to ensure that this disclosure is thorough and complete and to fully convey its scope to those skilled in the art. In the drawings, similar numbers refer to similar elements throughout.

[0010] In the following description and / or claims, the terms “on,” “placed upon,” “placed upon,” and “on” may be used in the following description and claims. “On,” “placed upon,” “placed upon,” and “on” may be used to indicate that two or more elements are in direct physical contact with each other. Additionally, the terms “on,” “placed upon,” “placed upon,” and “on” may mean that two or more elements are not in direct contact with each other. For example, “on” may mean that one element is on another element without being in contact with each other, and that there may be another element or elements between the two elements. Additionally, the term “and / or” may mean “and,” even though the scope of the claimed subject matter is not limited in this regard, which may mean “or,” which may mean “exclusive or,” which may mean “one,” which may mean “part but not all,” which may mean “not both,” and / or, which may mean “both.”

[0011] In various embodiments, as disclosed in the following description, a novel connector and a semiconductor device package are provided.

[0012] Returning to FIGS. 1a through 1d, various views of a connector according to embodiments of the present disclosure are illustrated. In the following FIGS. 1a through 5d, each drawing having the suffix "A" represents a front view of the relevant connector; each drawing having the suffix "B" represents a side view of the relevant connector; each drawing having the suffix "C" represents a top view of the relevant connector; and each drawing having the suffix "D" represents a perspective isometric view of the relevant connector.

[0013] As mentioned in FIG. 1a, the connector (100) is illustrated in a front view. The connector (100) and other connectors disclosed in subsequent embodiments may be formed from a highly conductive metal, such as copper, a copper alloy, or other conductive metal materials suitable for use as electrical connectors between components of a semiconductor device package, such as semiconductor chips and substrates. In various embodiments, the connector (100) may be formed from a single or monolithic piece of sheet metal, which is formed and cut to form a final structure as illustrated. Generally, in a front view as depicted in FIG. 1a, the connector (100) and other subsequent connectors may have a curved shape as illustrated, which may be referred to as an omega-like shape, and "omega-like" generally refers to the shape of the uppercase Greek letter Omega. The omega-like shape of the connectors of the embodiments may each be characterized by three different parts defining three different curvatures. As illustrated, the connector (100) includes a middle portion (102) having a curved shape in the front view, as well as a first contact portion (104) integrally connected to the middle portion (102) on the first side, indicated by L. The connector (100) further includes a second contact portion (106) integrally connected to the middle portion (102) on the second side, indicated by R. Note that the first contact portion (104) and the second contact portion (106) may define a curved surface in the front view, as illustrated in FIG. 1a, according to some embodiments. In the embodiment of FIG. 1a, the curved surfaces of the contact portions (104, 106) are opposite to the curved surface of the intermediate portion (102) in that if the curvature of the intermediate portion (102) is considered to be a concave curve (same as for surface (S)), the curved surfaces of the first contact portion (104) and the second contact portion (106) can be considered to be convex curves.

[0014] As also illustrated in FIGS. 1b through 1d, the first contact portion (104) and the second contact portion (106) may include a plurality of fingers extending from the intermediate portion (102). The plurality of fingers are illustrated as fingers (108), and thus, each of the fingers (108) may define a curved shape in the front view as illustrated in FIGS. 1a and 1d. The advantages of the structure imparted by the connector (100) are described in detail with respect to the following FIGS. 6 and FIGS. 7a and 7b. However, simply put, the structure of the connector (100) provides improved thermomechanical stability under device operation in a semiconductor device package, as well as a lower intrinsic strain within the connector after assembly into the package.

[0015] Referring to FIG. 1c, this embodiment and subsequent embodiments may arrange fingers (108) or similar fingers having a relatively shorter length (along the Y-axis in the drawing), denoted as l, compared to the total length (L) of the connector (100). For example, in some non-limiting embodiments, the total length (L) may be about 1 cm, such as 0.5 cm, 1 cm, or 2 cm. This arrangement ensures that the connector (100) is attached directly to the external component at the fingers (108), and thus, the length of the interface between the external component and the connector (100) is limited to length (l). For example, in some non-limiting embodiments, the length (l) may be about 1 mm. By limiting the interface to a shorter interface as defined by l, the total thermal mismatch strain generated between the connector (100) and the external component during temperature changes will be reduced. In addition, the multiple fingers (108) together represent a cross-sectional area sufficient to carry a relatively higher current across the connector (100).

[0016] FIGS. 2a through 2d depict various views of another connector according to other embodiments of the present disclosure. In this embodiment, as with the embodiment of FIGS. 1a through 1d, the connector (120) defines a shape similar to an omega when viewed from the front view. As with the previous embodiment, the connector (120) has a middle portion (122), a first contact portion (124), and a second contact portion (126). These contact portions also consist of a plurality of fingers, illustrated as fingers (128). The difference in this embodiment is that the middle portion (122) extends between the first side (L) and the second side (R) and includes a slot assembly (130) that divides the middle portion (122) into a plurality of middle regions along the length of the connector. In this particular embodiment, the slot assembly (130) is formed with two slots, illustrated as slot (130A) and slot (130B), and the intermediate portion (122) is divided into intermediate regions consisting of a central region (122A) and two end regions, illustrated as end region (122B) and end region (122C). These intermediate regions are arranged in sequence along the length of the connector (120) from the front (F) to the rear (B) to form the intermediate portion (122) as a whole. The slots (130A) and slot (130B) provide an arrangement that allows the connector (120) to more easily undergo elastic deformation under mechanical load.

[0017] In this embodiment, the central region (122A) further includes a first indent (132A) positioned on the first side (L) and a second indent (132B) positioned on the second side (R). With respect to the illustrated Cartesian coordinate system, the slot assembly (130) and the first indent (132A) and the second indent (132B) impart stress-absorbing properties to the connector (120) to reduce mechanical and thermomechanical stress in the X, Y, and Z directions. In particular, the slot assembly (130) and the indent (132A) and the indent (132B) together serve to define a meandering path illustrated as P1, and this structure allows for greater elastic deformation, such as under mechanical load.

[0018] FIGS. 3a through 3d illustrate various views of a connector according to additional embodiments of the present disclosure. In this embodiment, as with the embodiments of FIGS. 1a through 1d and FIGS. 2a through 2d, the connector (140) defines a shape resembling an omega when viewed from the front view. As with the previous embodiment, the connector (140) has a middle portion (142), a first contact portion (144), and a second contact portion (146). These contact portions also consist of a plurality of fingers, illustrated as fingers (148). The difference in this embodiment is that the middle portion (142) includes a slot assembly (150) extending between the first side (L) and the second side (R), and the slot assembly (150) is a single slot dividing the middle portion (142) into an end region (142A) and an end region (142B). These regions are arranged in sequence along the length of the connector (140) from the front (F) to the rear (B) to form the middle section (142) as a whole.

[0019] In this embodiment, end regions (142A) and end regions (142B) each include a pair of indents: end region (142A) includes a side indent (152A) positioned on the first side (L) and a side indent (152B) positioned on the second side (R). End region (142B) includes a side indent (152C) positioned on the first side (L) and a side indent (152D) positioned on the second side (R). With respect to the illustrated Cartesian coordinate system, the slot assembly (150) and the indents (152A to 152D) impart stress-relief properties to the connector (140) to reduce mechanical and thermomechanical stress in the X, Y, and Z directions. In particular, the slot assembly (150) and indents (152A to 152D) serve to define the meandering path illustrated as P2, and this feature allows for greater elastic deformation, such as under mechanical load.

[0020] FIGS. 4a through 4d illustrate various views of a connector according to other embodiments of the present disclosure. In this embodiment, as with the embodiments of FIGS. 1a through 1d, FIGS. 2a through 2d, and FIGS. 3a through 3d, the connector (160) defines a shape resembling an omega when viewed from the front view. As with the previous embodiments, the connector (160) has a middle portion (162), a first contact portion (164), and a second contact portion (166). These contact portions are also composed of a plurality of fingers, illustrated as fingers (168). In this embodiment, the middle portion (162) includes a slot assembly (170) extending between the first side (L) and the second side (R), and the slot assembly (170), such as in the embodiment of FIG. 2a, is formed by two slots, illustrated as slot (170A) and slot (170B), and the middle portion (162) is divided into two end regions, illustrated as a central region (162A) and end region (162B) and end region (162C). These middle regions are arranged in sequence along the length of the connector (160) from the front (F) to the rear (B) to form the middle portion (162) as a whole.

[0021] In relation to the embodiment of FIG. 2a, in this embodiment, the central region (162A) is relatively narrower and the end regions (162B, 162C) are relatively wider. Furthermore, the first slot (170A) is aligned with the first pair of fingers located on the first contact portion (164) and the second contact portion (166), respectively, and the second slot (170B) is aligned with the second pair of fingers on the first contact portion (164) and the second contact portion (166).

[0022] In addition, each of the central region (162A), the end region (162B), and the end region (162C) includes a pair of indentations: the end region (162B) includes an indentation (172A) positioned on the first side (L) and an indentation (172B) positioned on the second side (R). The central region (162A) includes an indentation (172C) positioned on the first side (L) and an indentation (172D) positioned on the second side (R). The end region (162C) includes an indentation (172E) positioned on the first side (L) and an indentation (172F) positioned on the second side (R). In relation to the illustrated Cartesian coordinate system, the slot assembly (170) and indents (172A to 172F) impart stress-relaxing properties to the connector (160) to reduce mechanical and thermomechanical stress in the X, Y, and Z directions.

[0023] FIGS. 5a through 5d illustrate various views of a connector according to other embodiments of the present disclosure. In this embodiment, as with the embodiments of FIGS. 1a through 1d, FIGS. 2a through 2d, FIGS. 3a through 3d, and FIGS. 4a through 4d, the connector (180) defines a shape resembling an omega when viewed from the front view. As with the previous embodiments, the connector (180) has an intermediate portion (182), a first contact portion (184), and a second contact portion (186). These contact portions are also composed of a plurality of fingers, illustrated as fingers (188). In this embodiment, the middle portion (182) includes a slot assembly (190) extending between the first side (L) and the second side (R), and as in the embodiment of FIG. 4a, the slot assembly (190) is formed with two slots, illustrated as slot (190A) and slot (190B), and the middle portion (182) is divided into two end regions, illustrated as a central region (182A) and end region (182B) and end region (182C). These middle regions are arranged in sequence along the length of the connector (180) from the front (F) to the rear (B) to form the middle portion (182) as a whole.

[0024] In relation to the embodiment of FIG. 4b, in this embodiment, the slots (190A, 190B) are relatively wider than their counterparts in FIG. 4b. As in the embodiment of FIG. 4b, the first slot (190A) is aligned with the first pair of fingers located on the first contact portion (184) and the second contact portion (186), respectively, and the second slot (190B) is aligned with the second pair of fingers on the first contact portion (184) and the second contact portion (186).

[0025] In addition, each of the central region (182A), the end region (182B), and the end region (182C) includes a pair of indentations: the end region (182B) includes an indentation (192A) positioned on the first side (L) and an indentation (192B) positioned on the second side (R). The central region (182A) includes an indentation (192C) positioned on the first side (L) and an indentation (192D) positioned on the second side (R). The end region (182C) includes an indentation (192E) positioned on the first side (L) and an indentation (192F) positioned on the second side (R). Note that the indents (192A, 192B) are not centered with respect to the end region (182B), and the indents (192E, 192F) are not centered with respect to the end region (182B). In relation to the illustrated Cartesian coordinate system, the slot assembly (190) and the indents (192A to 192F) impart stress-relief properties to the connector (180) to reduce mechanical and thermomechanical stress in the X, Y, and Z directions.

[0026] FIG. 6 illustrates a side view of a semiconductor device package (200) arranged according to embodiments of the present disclosure. The semiconductor device package (200) may include a plurality of components, including a housing (218) and at least one semiconductor chip illustrated as a chip (206) disposed within the housing (218). In the illustrated example, a base plate (202) is provided on which a substrate (204) is disposed. The substrate (204) may be, for example, a directly bonded copper (DCB) substrate having a metal layer disposed on the upper and lower surfaces of a ceramic body as is known in the art. Note that the semiconductor device package (200) may include a plurality of substrates, and for clarity of example, only one substrate is illustrated. Likewise, in FIG. 6, only one semiconductor chip is illustrated disposed on the upper surface of the substrate (204) as the chip (206). In addition, a plurality of connectors (210) having a connector structure as generally disclosed in the present embodiments are illustrated. As illustrated, the connectors (210) can be coupled to the chip (206) through a contact layer (207), such as a copper tab. Two of the connectors (210) are illustrated in a front view, and two of the connectors (210) are illustrated in a side view. One side portion of the connectors (210) can be attached to chips such as the chip (206), and another side portion is attached to another component such as a substrate (204). In the illustrated example, for the connectors (210) illustrated in a front view, the first contact portion (214) is attached to the substrate (204), and the second contact portion (216) is attached to the contact layer (207).

[0027] Note that because the upper surface of the chip (206) is positioned on the upper surface of the substrate (204) along the Z direction, the connectors (210) can be rotated about the Y-axis with respect to the XZ plane. Because the first contact portion (214) and the second contact portion (216) have curved surfaces in the side view, the connectors (210) can be more easily attached to the substrate (204) and the contact layer (207) without causing excessive stress within the connector (210), the chip (206), the substrate (204), and the bonding material (not separately shown) used to attach the connectors to the substrate (204) and the chip (206). Furthermore, under operation, the connectors (210) or similar connectors arranged according to the embodiments mentioned above can better accommodate mechanical stress and thermomechanical stress that may be generated during the use of the semiconductor device package. To illustrate this point, FIG. 7a depicts the semiconductor device package of FIG. 6 as one configuration of bending, and FIG. 7b depicts the semiconductor device package of FIG. 6 as another configuration of bending.

[0028] In the views of FIGS. 7a and 7b, side views of the connectors (210) illustrate how various slots and indents can serve to accommodate stresses in the X, Y, and Z directions by providing space for deformation of the regions of the connectors (210), thereby enabling these movements to reduce stresses otherwise present at the interfaces between the connector (210), the chip (206), and the substrate (204).

[0029] FIG. 8a depicts an enlarged view of an exemplary connector of the embodiments shown as a connector (220) in one configuration of bending, and FIG. 8b depicts the connector of FIG. 8a in another configuration of bending. Due to the provision of slots (224A to 224C), thus forming regions (222A to 222D), and due to the provision of an indent (226), the regions (222A to 222D) can be displaced relative to each other under bending conditions of a chip / substrate / baseplate (S / B) system placed under the connector (220). In this way, stress can be relieved at an interface (I) where an electrical connection to the chip or substrate may occur, for example. Note that the bending shown in FIGS. 7a through 8b may be exaggerated for illustrative purposes, and that this means the radius of curvature of the substrate or base plate may be several times larger than that shown in the drawings, so that the given chip / substrate / base plate becomes flatter than shown with respect to the length scale of the connector.

[0030] In summary, the embodiments provide novel connector structure configurations to facilitate easier assembly of the connector structure, and provide more robust resistance to stresses, thereby providing a more reliable semiconductor device package. It should be noted that while the disclosed embodiments illustrate connectors having four fingers on one side, in various embodiments the length (L) of the connector may be longer or shorter and may include fewer fingers / slots / indents or a greater number of fingers / slots / indents.

[0031] Although the embodiments are disclosed with reference to specific embodiments, numerous modifications, alterations, and changes to the described embodiments are possible without departing from the scope and range of the present disclosure, as defined in the appended claims. Accordingly, the embodiments are not to be limited to the described embodiments and may have the full scope defined by the language of the following claims and their equivalents.

Claims

Claim 1 A connector for a semiconductor device package comprising: an intermediate portion having a curved concave shape in a front view with respect to a given surface; a first contact portion integrally connected to the intermediate portion on a first side; and a second contact portion integrally connected to the intermediate portion on a second side, wherein the first contact portion and the second contact portion define a curved convex surface in a front view with respect to the given surface, and the curved convex surface defined by the first contact portion and the second contact portion is opposite to the curved concave shape of the intermediate portion in a front view with respect to the given surface. Claim 2 In claim 1, the connector defines a shape similar to omega in the front view. Claim 3 A connector according to claim 1, wherein the first contact portion and the second contact portion comprise a plurality of fingers extending from the intermediate portion. Claim 4 A connector according to claim 1, wherein the intermediate portion extends between the first side and the second side and includes a slot assembly that divides the intermediate portion into a plurality of intermediate regions arranged relative to each other along the length of the connector. Claim 5 In paragraph 4, the slot assembly comprises two slots, and the intermediate portion is divided into a central region and two end regions, a connector. Claim 6 A connector according to claim 5, wherein the intermediate region further comprises a first indent disposed on the first side and a second indent disposed on the second side. Claim 7 A connector according to claim 4, wherein the slot assembly comprises a single slot, and the intermediate portion is divided into a first end region and a second end region. Claim 8 A connector according to claim 7, wherein the first end region comprises a first side indent disposed on the first side and a second side indent disposed on the second side, and the second end region comprises a third side indent disposed on the first side and a fourth side indent disposed on the second side. Claim 9 A connector according to claim 5, wherein the first slot is aligned with the first pair of fingers of the first contact portion and the second contact portion, and the second slot is aligned with the second pair of fingers of the first contact portion and the second contact portion. Claim 10 A semiconductor device package comprising: a housing; a plurality of components including at least one semiconductor chip disposed within the housing; and a connector, wherein the connector is coupled to a pair of components among the plurality of components, and the connector comprises: a middle portion having a curved concave shape in a front view with respect to a given surface; a first contact portion integrally connected to the middle portion on a first side and attached to a first component among the pair of components; and a second contact portion integrally connected to the middle portion on a second side and attached to a second component among the pair of components, wherein the first contact portion and the second contact portion define a curved convex surface in a front view with respect to the given surface, and the curved convex surface defined by the first contact portion and the second contact portion is opposite to the curved concave shape of the middle portion in a front view with respect to the given surface, and the connector provides an electrical connection between the pair of components. Claim 11 In claim 10, the above connector defines a shape similar to omega in the above front view, a semiconductor device package. Claim 12 A semiconductor device package according to claim 10, wherein the first contact portion and the second contact portion comprise a plurality of fingers extending from the intermediate portion. Claim 13 A semiconductor device package according to claim 10, wherein the intermediate portion extends between the first side and the second side and includes a slot assembly that divides the intermediate portion into a plurality of intermediate regions along the length of the connector. Claim 14 In claim 13, the slot assembly comprises two slots, and the intermediate portion is divided into a central region and two end regions, forming a semiconductor device package. Claim 15 A semiconductor device package according to claim 14, wherein the intermediate region further comprises a first indent disposed on the first side and a second indent disposed on the second side. Claim 16 A semiconductor device package according to claim 13, wherein the slot assembly comprises a single slot, and the intermediate portion is divided into a first end region and a second end region. Claim 17 A semiconductor device package according to claim 16, wherein the first end region comprises a first side indent disposed on the first side and a second side indent disposed on the second side, and the second end region comprises a third side indent disposed on the first side and a fourth side indent disposed on the second side. Claim 18 A semiconductor device package according to claim 14, wherein the first slot is aligned with a first pair of fingers of the first contact portion and the second contact portion, and the second slot is aligned with a second pair of fingers of the first contact portion and the second contact portion. Claim 19 A semiconductor device package according to claim 10, wherein the plurality of components further comprise a contact layer disposed on the at least one semiconductor chip, and the first contact portion of the connector is arranged in contact with the contact layer. Claim 20 A semiconductor device package according to claim 19, wherein the plurality of components further comprise a substrate, the semiconductor chip is disposed on the substrate, and the second contact portion is arranged in contact with the substrate.

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