Substrate processing apparatus

Abstract

According to one embodiment of the present invention, a substrate processing apparatus may be provided, comprising a chamber, a substrate support member located within the chamber and supporting a substrate, and a shaft connected to the substrate support member and driven to perform at least one of rotation and lifting / lowering movements of the substrate support member, wherein the shaft comprises a first shaft connected to the substrate support member and a second shaft arranged to be coupled with the first shaft to generate at least one of rotation and lifting / lowering movements of the substrate support member.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus used in the manufacturing process of semiconductor devices, display devices, and other electronic devices. Background Technology

[0003] In the manufacturing processes of semiconductor devices, display devices, and other electronic devices, various processes such as forming thin films on substrates, etching substrates, or altering the physical properties of substrates are performed, and substrate processing devices that process substrates in a vacuum environment are widely used for these processes.

[0004] The above substrate processing device includes a substrate support for supporting a substrate within a processing space in which a vacuum state is formed, and the substrate support may be configured to perform a rotational movement or a lifting and lowering movement depending on the process conditions.

[0005] In conventional substrate processing devices, a drive shaft or connecting member penetrating the processing space is provided for the rotation or lifting / lowering operation of the substrate support, and in this process, a vacuum sealing structure is generally applied around the drive shaft.

[0006] However, the above vacuum sealing structure may be worn out or deformed by the repetitive rotation and lifting / lowering movements of the substrate support, which may cause the vacuum level of the processing space to decrease or lead to the problem of external air entering.

[0007] In addition, if rotational and lifting / lowering movements are performed simultaneously or alternately, the load applied to the sealing structure increases, which may shorten the lifespan of the seal or increase the likelihood of vacuum leakage.

[0008] Therefore, there is an increasing demand for a new substrate processing device capable of stably maintaining a vacuum state in the processing space even during the rotation and lifting / lowering movements of the substrate support. Prior art literature

[0010] Korean Patent Publication No. 10-2353256 (Date of publication: January 18, 2022.) The problem to be solved

[0011] In order to solve the technical problem that the present invention aims to achieve, one objective is to provide a substrate processing device capable of stably maintaining a vacuum state in the processing space even during the process in which a substrate support part of the substrate processing device performs rotation and lifting / lowering operations.

[0012] In addition, the present invention has another objective of providing a substrate processing device capable of suppressing vacuum leakage caused by rotational and lifting / lowering movements of a substrate support and improving the reliability and durability of the device.

[0013] In addition, another objective of the present invention is to provide a substrate processing device that can stably perform rotation and lifting / lowering operations of a substrate support, while simplifying the driving structure to reduce structural complexity and maintenance burden of the device.

[0014] In addition, the present invention has another objective of providing a substrate processing apparatus that is applicable to various substrate processing processes and can improve process reproducibility and processing uniformity by achieving the above-mentioned objectives. means of solving the problem

[0016] A substrate processing device according to one embodiment of the present invention is,

[0017] Chamber;

[0018] A substrate support member located within the chamber and supporting the substrate; and

[0019] It may include a second shaft assembly configured to be coupled with the first shaft to generate at least one of the rotation and lifting / lowering movements of the substrate support.

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[0023] According to one embodiment of the present invention, the second shaft assembly comprises: a second shaft including an interlocking member for transmitting at least one of rotational force or linear motion to the first shaft; a rotating member for rotating the second shaft; and

[0024] It may include a lifting / lowering unit that moves the second shaft in the up and down direction.

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[0028] According to one embodiment of the present invention,

[0029] The above rotating part is,

[0030] A shaft housing into which the second shaft is inserted and which is arranged to rotate together with the second shaft;

[0031] A rotary drive unit that provides rotational force to the second shaft and the shaft housing;

[0032] A rotating housing into which the above shaft housing is inserted;

[0033] A bearing member that rotatably supports the shaft housing with respect to the rotation housing; and

[0034] It may include a sealing member provided to seal the gap between the inner surface of the rotating housing and the outer surface of the shaft housing, thereby maintaining a vacuum state inside the chamber even during the rotation of the second shaft and the shaft housing.

[0035] According to one embodiment of the present invention,

[0036] The above sealing member is,

[0037] A magnetic material that forms a magnetic field around the shaft housing; and

[0038] It may include a magnetic fluid that fills the space between the magnetic body and the shaft housing and maintains a liquid ring shape by the magnetic field, thereby blocking gas flow between the inside and outside of the chamber.

[0039] According to one embodiment of the present invention,

[0040] The above lifting and lowering unit is,

[0041] A lifting / lowering drive unit that moves the second shaft in the up and down direction;

[0042] A shaft guide provided on the inner circumference of the shaft housing to guide the second shaft; and

[0043] It may include a sealing part that is configured to be expandable or expandable according to the upward and downward movement of the second shaft and seals the space between the shaft housing and the interlocking part.

[0044] According to one embodiment of the present invention,

[0045] The above sealing part is,

[0046] One end of the shaft housing and the linkage part may be hermetically coupled to each other, so as to seal the space between the shaft housing and the linkage part even during the upward and downward movement or rotation of the second shaft.

[0047] According to one embodiment of the present invention,

[0048] The above-mentioned rotating housing is,

[0049] It can be formed in a hollow shape to accommodate the second shaft.

[0050] According to one embodiment of the present invention,

[0051] The above second shaft is,

[0052] The second shaft may be configured to selectively perform at least one of the rotational movement and the lifting / lowering movement, or to perform both movements simultaneously.

[0053] According to one embodiment of the present invention,

[0054] The above sealing member is,

[0055] It can be configured so that a vacuum state inside the chamber is maintained even while at least one of the rotational movement and the lifting / lowering movement of the second shaft is performed.

[0056] According to one embodiment of the present invention,

[0057] The above substrate processing device is provided with a material supply unit within the chamber, and

[0058] The above material supply unit may be configured to adjust its position in conjunction with the rotation or lifting / lowering movement of the second shaft.

[0059] According to one embodiment of the present invention,

[0060] The above material supply unit includes a plurality of magnets, and some or all of the magnets are arranged to be movable, so that the plasma distribution or material distribution within the chamber can be controlled through the movement of the magnets.

[0061] According to one embodiment of the present invention,

[0062] The above magnet is,

[0063] It can be configured to move in conjunction with the rotation and lifting / lowering movements of the second shaft during the process setting stage or during the process.

[0064] According to one embodiment of the present invention,

[0065] The above substrate processing device is,

[0066] It can be applied to at least one of the deposition, etching, or modification processes for processing a substrate in a vacuum environment. Effects of the invention

[0068] According to one embodiment of the present invention, a substrate processing device can be provided that can stably maintain a vacuum state in the processing space even during the process in which a substrate support member performs rotation and lifting / lowering operations in the substrate processing device.

[0069] According to one embodiment of the present invention, a substrate processing device can be provided that suppresses the occurrence of vacuum leakage caused by rotational and lifting / lowering movements of a substrate support member and improves the reliability and durability of the device.

[0070] According to one embodiment of the present invention, a substrate processing device can be provided that can stably perform rotation and lifting / lowering operations of a substrate support, while simplifying the driving structure to reduce structural complexity and maintenance burden of the device.

[0071] According to one embodiment of the present invention, by achieving the above-mentioned objectives, a substrate processing apparatus applicable to various substrate processing processes and capable of improving process reproducibility and processing uniformity can be provided. Brief explanation of the drawing

[0073] FIG. 1 is a cross-sectional view of a substrate processing apparatus according to one embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view of one side of a substrate support according to an embodiment of the present invention, and FIGS. 3 to 5 are a perspective view and a cross-sectional view of a substrate support according to an embodiment of the present invention, and FIG. 6 is a cross-sectional view of a second shaft, a rotating part, and a part of a lifting / lowering part according to an embodiment of the present invention. Specific details for implementing the invention

[0074] Hereinafter, an embodiment of a substrate processing apparatus according to the present invention will be described in detail with reference to the attached drawings.

[0075] It should be noted that when assigning reference numerals to the components of each drawing, the same components are assigned the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the embodiments of the present invention, if it is determined that a detailed description of related known components or functions would hinder understanding of the embodiments of the present invention, such detailed description is omitted.

[0076] In describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are intended merely to distinguish the components from other components, and the essence, order, or sequence of the components is not limited by such terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0078] Embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0079] A substrate processing apparatus according to FIGS. 1 to 6 includes a chamber (100), and the chamber (100) may be designed so that its interior can be maintained in a vacuum state. The chamber (100) provides a space where processes such as deposition, etching, and modification for processing a substrate can be performed, and may be configured with a hermetic structure to minimize the inflow of gas from the outside. The material of the chamber (100) may be formed of a metal or alloy that is stable in a vacuum environment and has chemical resistance, but is not limited thereto. If necessary, a process gas inlet, an exhaust port, an observation window, or a sensor may be installed on the wall of the chamber (100).

[0081] A substrate support member (110) for supporting a substrate may be disposed inside the chamber (100), and the substrate support member (110) may be connected to a shaft (120) to perform rotation and lifting / lowering movements. The substrate support member (110) may be made of a heat-resistant material to minimize thermal deformation during high-temperature processes and may be designed to fit the size and shape of the substrate.

[0082] At this time, a process shield (150) may be further disposed on the inner wall of the chamber (100) to prevent process by-products from adhering directly to the inner surface of the chamber (100). The process shield (150) serves to protect the inner wall of the chamber (100) to prevent corrosion of the chamber, and is provided to be detachable from the inner wall of the chamber (100) so that only the shield can be replaced or cleaned in case of contamination.

[0084] The substrate processing device (10) may include a shaft (120) that drives the substrate support (110) to perform at least one of rotation and raising / lowering. By including the shaft (120), the substrate support (110) can be rotated or raised / lowered to process the substrate located on the substrate support (110).

[0085] The shaft (120) may include a first shaft (121) connected to the substrate support (110) and a second shaft assembly configured to be coupled with the first shaft (121) to cause at least one operation of rotation and raising / lowering of the substrate support (110). The second shaft assembly may include a second shaft (122), a rotation part (130), and a raising / lowering part (140). One end of the first shaft (121) may be connected to the substrate support (110), and the other end may be connected to be coupled with the second shaft (122). The second shaft (122) may be configured to be rotatable or raised / lowering, so that the first shaft (121) coupled with the second shaft (122) may be rotatable or raised / lowered.

[0086] More specifically, an interlocking member (1221) may be provided at one end of the second shaft (122). The interlocking member (1221) is provided on the second shaft (122) and may be configured to transmit at least one of the rotational motion and the lifting / lowering motion performed by the second shaft (122) to the first shaft (121). The interlocking member (1221) can induce the substrate support member (110) to perform rotational and lifting / lowering motions by transmitting rotational force or linear motion to the first shaft (121) at the contact point where the second shaft (122) and the first shaft (121) are connected. At the other end of the second shaft (122), a lifting / lowering interlocking member (1222) connected to and linked with the lifting / lowering drive member (141) to be described later is provided so that the second shaft (122) can be lifted / lowered.

[0088] A rotating part (130) for rotating the second shaft (122) may be provided, and the rotating part (130) can maintain a vacuum state inside the chamber (100) while transmitting rotational force to the second shaft (122) inside the chamber (100) where a vacuum environment is required. That is, the rotating part (130) may include a rotational transmission structure designed to allow rotational movement while ensuring airtightness.

[0089] More specifically, the rotating part (130) may include a shaft housing (132) into which the second shaft (122) is inserted and which rotates integrally with the second shaft (122). The shaft housing (132) may be formed along the outer circumference of the second shaft (122) to support and reinforce the second shaft (122), and may be configured to rotate as a single structure combined with the second shaft (122).

[0090] The above-mentioned rotating part (130) may also include a rotating housing (131) into which the shaft housing (132) is inserted. The rotating housing (131) may rotatably support a rotating body composed of a second shaft (122) and a shaft housing (132), while simultaneously maintaining a vacuum environment inside the chamber (100).

[0091] A bearing member (133) that rotatably supports a shaft housing (132) may be provided inside the rotating housing (131). The bearing member (133) stably supports the rotation of the shaft housing (132), thereby reducing friction and vibration that occur during rotation and improving the reliability and durability of the rotating part (130).

[0092] Meanwhile, a predetermined gap may be formed between the inner surface of the rotating housing (131) and the outer surface of the shaft housing (132), and a sealing member (134) may be provided to prevent gas from flowing through the gap. The sealing member (134) may be configured to maintain a vacuum state inside the chamber (100) even when rotational movement is performed. More specifically, the sealing member (134) may include a magnetic body (not shown) that forms a magnetic field around the shaft housing (132) and a magnetic fluid (not shown) that fills the gap between the magnetic body and the shaft housing (132). The magnetic fluid maintains a liquid ring shape by the magnetic field formed by the magnetic body, thereby blocking the flow of gas between the rotating housing and the shaft housing (132). Accordingly, the vacuum environment inside the chamber (100) is stably maintained even while the second shaft (122) is rotating, and stable rotational force transmission becomes possible.

[0093] Additionally, the rotational part (130) may include a rotational drive unit (135) that provides rotational force to the second shaft (122), and the rotational drive unit (135) may be coupled with the shaft housing (132) to drive the second shaft (122) to rotate at a predetermined speed and direction. Accordingly, the rotational force generated by the rotational drive unit (135) can be transmitted to the second shaft (122) through the shaft housing (132) supported within the rotational housing (131).

[0094] The second shaft (122) can be raised or lowered by the lifting / lowering unit (140). The lifting / lowering unit (140) can be configured to provide linear movement force to the second shaft (122) to change the position of the second shaft (122) in the up and down direction. Accordingly, the first shaft (121) and the substrate support (110) linked to the second shaft (122) can be selectively raised or lowered.

[0095] More specifically, the lifting / lowering unit (140) may include a lifting / lowering drive unit (141) that lifts or lowers the second shaft (122). The lifting / lowering drive unit (141) may be configured to include at least one of a motor, a linear actuator, a ball screw, or an equivalent linear driving means, and may provide linear driving force to the second shaft (122).

[0096] Additionally, the lifting / lowering unit (140) may include a shaft guide (142) provided on the inner circumference of the shaft housing (132) to guide the second shaft (122). The shaft guide (142) guides the second shaft (122) to maintain its central axis while the second shaft (122) moves up and down, thereby suppressing shaking or eccentricity that may occur during movement and improving the precision of the lifting / lowering operation.

[0097] Meanwhile, the lifting / lowering unit (140) may include a sealing unit (143). Both ends of the sealing unit (143) are respectively connected to one end of the shaft housing (132) and the interlocking unit (1221), thereby sealing the space between the shaft housing (132) and the interlocking unit so that it does not communicate with the outside even while the second shaft (122) moves up and down or rotates. The sealing unit (143) may be formed of a bellows structure or an elastic material, and may be configured to be expandable and retractable so that its length can be varied in response to the lifting / lowering movement of the second shaft (122). Accordingly, the vacuum state inside the chamber (100) can be stably maintained even while the second shaft (122) is moving up and down.

[0098] In this way, the second shaft (122) can be rotated and moved up and down simultaneously by the lifting / lowering unit (140) and the rotating unit (130), and the rotational and lifting / lowering operations can be performed selectively or simultaneously. At this time, the vacuum state inside the chamber (100) can be maintained by the sealing member (134) of the rotating unit (130) even while the second shaft (122) is rotating, and the space between the shaft housing (132) and the interlocking unit (1221) can be sealed so that it does not communicate with the outside by the sealing part (143) of the lifting / lowering unit (140) even while the second shaft (122) is moving up or down. Accordingly, the vacuum environment inside the chamber (100) can be stably maintained throughout the entire process of the second shaft (122) performing rotational and lifting / lowering operations, and the position and orientation of the substrate support unit (110) can be precisely controlled.

[0100] The above substrate processing device may be equipped with a material supply unit (200) within a chamber (100), and the material supply unit (200) may be a target for use in deposition, etching, or other modification processes, for example, a material such as a metal, an insulator, or an alloy. The material supply unit (200) is configured to adjust its position in conjunction with the rotation and lifting / lowering movements of the second shaft (122), and may be designed so that the material is supplied uniformly according to changes in the position and orientation of the substrate support (110).

[0101] Additionally, the material supply unit (200) may include a plurality of magnets (210), and some or all of the magnets (210) may be configured to be movable. This movable structure allows for the adjustment of the magnetic field distribution within the material supply unit (200), thereby enabling precise control of the plasma or material distribution inside the chamber (100). The movement of the magnets (210) may be performed in conjunction with the rotation and lifting / lowering movements of the second shaft (122) during the pre-process setting stage or during the process, thereby allowing the magnetic field and material distribution to be optimized according to process conditions.

[0102] In addition, the material supply unit (200) may include a magnetic field control unit (220), and the magnetic field control unit (220) may be configured to control the magnetic field distribution inside the chamber (100) by rotating the magnet (210) or changing its arrangement direction. Through this, the distribution of plasma or material generated in the material supply unit (200) can be controlled more precisely, and process stability and uniformity associated with the substrate support unit (110) can be improved.

[0103] Additionally, the substrate processing device (10) can process a substrate by generating plasma within a chamber (100). A material supply unit (200) and a magnetic field control unit (220) are arranged inside the chamber (100), and by linking the rotation and lifting / lowering movements of these devices with the substrate support unit (110), a uniform plasma distribution and material distribution can be formed inside the chamber (100). The plasma can perform desired material deposition, etching, or modification on the surface of the substrate by interacting with the deposition or etching raw material emitted from the material supply unit (200). The magnetic field control unit (220) may be composed of a plurality of movable magnets (210), and plasma density and current distribution can be controlled by adjusting the position of the magnets. In this way, by integrally controlling the position, orientation, rotation, and lifting / lowering movements of the substrate support unit (110) and the position control of the material supply unit and the magnetic field control unit (220), process stability and processing uniformity can be improved during the plasma processing process.

[0105] High-frequency power (RF power) can be transmitted to the substrate support (110) to apply bias to the substrate, and for this purpose, an RF impedance adjustment unit (R) linked to the substrate support (110) may be provided. The RF impedance adjustment unit (R) may be designed to provide a stable RF bias to the substrate support (110) by adjusting the impedance mismatch that may occur during the high-frequency power transmission process, and may form a uniform and controlled electric field on the surface of the substrate during the plasma process.

[0107] Additionally, the substrate support (110) may be equipped with a heater (not shown), and a cooling unit (160) may be provided in parallel as needed. The heater and the cooling unit (160) can heat or cool the substrate to provide temperature conditions necessary for deposition, etching, or other modification processes, and may be designed to maintain a uniform heat distribution in conjunction with the rotation and lifting / lowering movements of the substrate support (110). The cooling unit (160) may be configured to receive cold air from a cryogenic cooler (C), such as a cryo pump, and to be linked with the substrate support (110), thereby stably maintaining the low-temperature environment required during the process. In this way, the position, orientation, rotation, and lifting / lowering movements of the substrate support (110), the heating control of the heater, the temperature control by the cooling unit (160), the position control of the material supply unit (200), and the magnet distribution control are integrated, thereby improving process stability and precision.

[0109] The above substrate processing device (10) can be applied to at least one of deposition, etching, plasma processing, or modification processes for processing a substrate in a vacuum environment, and the rotation and lifting / lowering movements of the second shaft (122) and the shaft housing (132), the sealing and sealing structure, the material supply unit and the movable magnet, and the heater of the substrate support unit (110) are combined to simultaneously ensure precision and efficiency of substrate processing.

[0111] The foregoing description of the present invention is for illustrative purposes only, and those skilled in the art will understand that other specific forms can be easily modified without altering the technical spirit or essential features of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single unit may be implemented in a distributed manner, and components described as distributed may likewise be implemented in a combined form.

[0112] The scope of the present invention is defined by the claims set forth below, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof should be interpreted as being included within the scope of the present invention. Explanation of the symbols

[0114] 10: Substrate processing device 100: Chamber 110: Substrate support 120: Shaft 121: 1st shaft 122: Second shaft 130: Rotating part 131: Rotating housing 132: Shaft housing 133: Bearing member 134: Sealing member 135: Rotary drive unit 140: Lifting / Lowering Unit 141: Lifting / Lowering Drive Unit 142: Shaft Guide 143: Sealed part 150: Process Shield 160: Cooling section 200: Material Supply Unit 210: Magnet

Claims

Claim 1 A substrate processing apparatus comprising: a chamber; a substrate support member disposed inside the chamber and supporting a substrate; a first shaft connected to the substrate support member; and a second shaft assembly arranged to be coupled with the first shaft to generate at least one of rotation and lifting / lowering motions of the substrate support member; wherein the second shaft assembly comprises: a second shaft including a coupling member for transmitting at least one of rotational force or linear motion to the first shaft; a rotating member for rotating the second shaft; and a lifting / lowering member for moving the second shaft in an up-and-down direction; wherein the rotating member comprises: a shaft housing into which the second shaft is inserted; a rotating housing arranged to rotate the shaft housing; a bearing member disposed between the shaft housing and the rotating housing; and a sealing member arranged to seal the space between the shaft housing and the rotating housing. Claim 2 delete Claim 3 delete Claim 4 A substrate processing apparatus according to claim 1, wherein the sealing member comprises: a magnetic body that forms a magnetic field around the shaft housing; and a magnetic fluid that fills the spaced-apart space between the magnetic body and the shaft housing and blocks gas flow between the inside and outside of the chamber by maintaining a liquid ring shape by the magnetic field. Claim 5 A substrate processing apparatus according to claim 1, wherein the lifting / lowering unit comprises: a lifting / lowering driving unit for moving the second shaft in an up-and-down direction; a shaft guide provided on the inner circumference of the shaft housing for guiding the second shaft; and a sealing unit provided to be expandable or retractable according to the lifting / lowering movement of the second shaft for sealing the space between the shaft housing and the interlocking unit. Claim 6 A substrate processing device according to claim 5, wherein the sealing part is hermetically coupled to one end of the shaft housing and the interlocking part, respectively, to seal the space between the shaft housing and the interlocking part even when the second shaft moves up and down or rotates. Claim 7 A substrate processing device according to claim 1, wherein the rotating housing is formed in a hollow shape to accommodate the second shaft. Claim 8 A substrate processing device according to claim 1, wherein the second shaft is configured to selectively perform at least one of the rotational movement and the lifting / lowering movement, or to perform both movements simultaneously. Claim 9 A substrate processing apparatus according to claim 1, wherein the sealing member is configured to maintain a vacuum state inside the chamber even while at least one of the rotational movement and the lifting / lowering movement of the second shaft is performed. Claim 10 In claim 1, the substrate processing device is provided with a material supply unit within the chamber, and the material supply unit is configured to adjust its position in conjunction with the rotation or lifting / lowering movement of the second shaft. Claim 11 A substrate processing apparatus according to claim 10, wherein the material supply unit comprises a plurality of magnets, and some or all of the magnets are arranged to be movable, thereby controlling the plasma distribution or material distribution within the chamber through the movement of the magnets. Claim 12 In claim 11, the substrate processing device is configured such that the magnet is movable in conjunction with the rotation and lifting / lowering movements of the second shaft during the process-pre-setting stage or during the process. Claim 13 In claim 1, the substrate processing device is a substrate processing device applied to at least one of a deposition, etching, or modification process for processing a substrate in a vacuum environment.

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