Contactless card and assembly method

Abstract

A method for forming a contactless transaction card is provided. The method may include the steps of providing a card body, defining a window, and attaching an antenna assembly layer to the card body. The antenna assembly layer comprises an antenna, a set of curable connectors disposed on a set of terminal regions of the antenna within the window, and a UV-transparent layer supporting the antenna. Additionally, the method may include the steps of providing a contactless chip module within a window on a first side of the antenna assembly layer and directing radiation through the UV-transparent layer, wherein the contactless chip module is electrically connected to the antenna through the curable connectors.

Description

Technology Field

[0001] The present invention claims priority to U.S. Patent Application No. 16 / 731,337, titled “Contactless Card and Assembly Method,” filed on December 31, 2019. The contents of the aforementioned patent application are incorporated by reference to the present invention in their entirety. Embodiments of the present invention relate to a transaction card, and more specifically to a transaction card having a metal body. Background Technology

[0002] Generally, transaction cards such as smart credit / debit cards, access cards, and EMV cards may include components such as electronic chips that perform memory storage, computing, or communication functions. Transaction cards containing electronic chips typically include an area on or near the surface of the card for embedding the electronic chip. These cards may or may not have contactless capabilities. Contactless capabilities enable wireless communication using radio frequency (RF) signals provided by wireless communication functions embedded in the contactless card.

[0003] Metal transaction cards, such as metal credit cards, have been gaining popularity in recent years. Because the body of a metal credit card is electrically conductive, there are various challenges in manufacturing metal credit cards, especially in the case of contactless cards with embedded conductive antennas, such as coils. One approach is to laminate a coil onto one side of the metal card.

[0004] When assembling plastic trading cards, a laminated stack consisting of a front layer, a back layer, and a coil is pre-assembled so that an electronic chip can be placed on the pre-assembled layer stack and bonded to other components of the card using conductive materials. However, this bonding method is somewhat inaccurate and does not present a robust approach for forming metal contactless cards because there is a possibility of accidental contact between the metal card body and the conductive material.

[0005] In relation to the above considerations, the present embodiment is provided. means of solving the problem

[0006] This summary is provided to introduce a selection of concepts in a simplified form, which is further disclosed in the following detailed description of the invention. This summary is not intended to identify the primary or essential functions of the claimed subject matter, nor is it intended to aid in determining the scope of the claimed subject matter.

[0007] In one embodiment, a method for forming a contactless transaction card is provided. The method may include the steps of providing a card body, defining a window, and attaching an antenna assembly layer to the card body, wherein the antenna assembly layer comprises an antenna, a set of curable connectors disposed on a set of terminal regions of the antenna within the window, and a UV-transparent layer supporting the antenna. The method may include the steps of providing a contactless chip module within a window on a first side of the antenna assembly layer and directing radiation through the UV-transparent layer, wherein the contactless chip module is electrically connected to the antenna through the curable connectors.

[0008] In additional embodiments, a contactless transaction card is provided. The contactless transaction card may include a card body defining a window and an antenna assembly layer disposed below the card body. The antenna assembly layer comprises an antenna including a set of terminal regions, a UV-transparent layer supporting the antenna, and a set of curable connectors disposed on the set of terminal regions. The set of terminal regions and the set of curable connectors may be disposed within the window. The contactless transaction card may further include a contactless chip module disposed within the window and electrically connected to the set of terminal regions through the set of curable connectors.

[0009] In another embodiment, a method for forming a contactless transaction card may include the steps of providing a card body defining a window and coupling an antenna assembly layer to the card body, wherein the antenna assembly layer includes an antenna and a transparent layer supporting the antenna. The method may include the step of providing a first curable connector on a first end region of the antenna and a second curable connector on a second end region of the antenna, wherein the first end region, the second end region, the first curable connector, and the second curable connector are disposed within the window. The method may also include the step of providing a contactless chip module within a window on a first side of the transparent layer and the step of directing radiation through the transparent layer from a second side of the transparent layer facing the first side. Thus, the contactless chip module may be electrically connected to the antenna through the first curable connector and the second curable connector. Brief explanation of the drawing

[0010] The attached drawings illustrate an exemplary approach to the present invention, including the practical application of the following principles. FIG. 1 is a plan view illustrating a contactless card according to embodiments of the present invention. FIG. 2 is a side exploded view of a modification of the contactless card of FIG. 1 according to an embodiment of the present invention. FIG. 3 is a side exploded view of another variation of the contactless card of FIG. 1 according to an embodiment of the present invention. FIG. 4a is a plan view illustrating an antenna assembly layer according to some embodiment of the present invention. FIG. 4b is a plan view illustrating details of an antenna terminal region according to an embodiment of the present invention. FIG. 5 is a side exploded view of a contactless card showing one example during the manufacture of a contactless card according to an embodiment of the present invention. FIG. 6 is an upper perspective view of parts of a contactless card in the example of FIG. 5 according to an embodiment of the present invention. FIG. 7 illustrates a flowchart for carrying out a method according to an embodiment of the present invention. FIG. 8 illustrates another flowchart for carrying out a method according to an embodiment of the present invention. FIG. 9 illustrates another flowchart for carrying out a method according to an embodiment of the present invention. The drawings are not necessarily scaled to the required size. The drawings are merely representations and are not intended to depict specific parameters of the invention. The drawings are intended to depict exemplary embodiments of the invention and are therefore not to be construed as limiting the scope. In the drawings, similar numbers indicate similar elements. Additionally, certain elements in some drawings may be omitted or illustrated out of scale for the sake of illustrative clarity. Sections may be in the form of "slices" or "near-discretions" for illustrative clarity by omitting certain background lines visible in "actual" sections. Furthermore, some reference numbers may be omitted in some drawings. Specific details for implementing the invention

[0011] The present embodiment will be described more fully below with reference to the accompanying drawings, some of which are illustrated. The essence of the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Such embodiments are provided to ensure that the present invention is thorough and complete and will fully convey the scope of the claims to those skilled in the art. In the drawings, the same number indicates the same element throughout.

[0012] An embodiment of the present invention relates to a contactless transaction card comprising an antenna as well as an electronic chip module or a semiconductor chip module. The present embodiment may be suitable for a transaction card having, for example, a metallic or electrically conductive body.

[0013] FIG. 1 is a plan view illustrating a contactless card (100) arranged according to an embodiment of the present invention. FIG. 2 is a side exploded view of a variation of the contactless card of FIG. 1 according to an embodiment of the present invention, and FIG. 3 is a side exploded view of another variation of the contactless card of FIG. 1 according to an embodiment of the present invention.

[0014] As used in the present invention, the term contactless card may refer to transaction cards such as credit cards, debit cards, or other cards. A contactless card may include electronic components such as semiconductor chips or semiconductor chip modules, as well as circuits for wireless communication such as antennas. In various embodiments, the contactless cards described herein may be arranged according to SO / IEC 7816, an international standard relating to electronic identification cards with contacts, which is jointly administered by the International Organization for Standardization (ISO) and the International Electrotechnical Commission (IEC).

[0015] As illustrated in FIG. 2, for example, a contactless card (100) may be arranged together with a card body (102). According to various embodiments, the card body (102) may be formed of a metallic material. In such embodiments, the contactless card (100) may therefore be considered a metallic contactless card. Generally, the card body of the contactless card of the present embodiment may constitute a relatively thick transaction card layer in contrast to other layers laminated together with the card body to form a complete contactless card. As illustrated in FIG. 1, for example, the contactless card (100) includes a window (104) representing a hole or recess for accommodating an electronic chip module, which may include packaging such as an electronic chip and contacts for electrically coupling to an external component.

[0016] In the embodiments of FIGS. 1 to 3, the electronic chip module is shaped to contact, for example, an antenna and is referred to herein as a non-contact chip module (140). The non-contact card (100) may include an antenna assembly layer (106), which is attached to the card body (102) after assembly. The antenna assembly layer (106) may include an antenna (110), a set of curable connectors (112) placed on a set of end regions of the antenna (110) placed within a window (104), and a UV-transparent layer (109) supporting the antenna (110). The set of end regions is illustrated as a serrated region located at the opposite end of the antenna (110). In various embodiments, these components of the antenna assembly layer (106) may be assembled together before being attached to other components of the non-contact card (100) as disclosed below.

[0017] As illustrated in FIG. 2, the contactless card (100) may also include a contactless chip module (140) within a window (104) and may be placed on a first side of an antenna assembly layer (106), wherein the first side (111) is the top side in the drawing of FIG. 2. When fully assembled, the contactless chip module (140) may be electrically connected to a set of terminal regions through a set of curable connectors (112). For example, the electronic chip module (140) may include a semiconductor die (not separately illustrated) and a set of contacts or leads that come into contact with the curable connectors (112).

[0018] As illustrated in FIG. 1, the hardenable connector (112) can be placed within the window (104) so ​​as not to come into contact with the card body (102). Thus, if the card body (102) is a metal body, the hardenable connector (112) and the antenna (110) will not be electrically short-circuited to the card body (102). As additionally illustrated in FIG. 2, the non-contact chip module (140) can be placed within the window (104) so ​​as not to come into electrical contact with the card body (102) at the edge (114) of the window (104).

[0019] In particular, the antenna (110) may be placed on the first side (111) of the UV-transmitting layer (109) and facing the card body (102), but an insulating material, which is an electrical insulator, may be placed between the antenna (110) and the card body (102). In one example, the antenna (110) may be formed of a metal core covered with an insulating coating. Thus, where the card body (102) is bonded to the UV-transmitting layer (109) when assembled, the metal core of the antenna (110) remains electrically insulated from the card body (102), thereby preventing an electrical short circuit between the antenna (110) and the card body (102) in an embodiment where the card body (102) is formed of a metal material.

[0020] As further illustrated in FIGS. 1 and 2, the UV-transparent layer (109) may define a recess (108). As shown in FIG. 2, the recess (108) is aligned within the window (104), such as being located in the center of the window (104). In FIG. 2, the window (104) defines a first region (A1, the region within the dotted line, where the region is defined within the XY plane of the Cartesian coordinate system shown in FIG. 1), whereas the recess (108) is a second region (A2, the region within the solid line), which is a smaller region than the first region. In particular, the non-contact chip module (140) defines a third region (A3) of intermediate size between the first and second regions.

[0021] FIG. 3 illustrates another embodiment of a contactless card (150), wherein the contactless card (150) comprises various components of the contactless card (100) as described above. In this embodiment, an electrical insulation layer, illustrated as a layer (152), is disposed between the antenna assembly layer (106) and the card body (102) to provide electrical insulation between the antenna (110) of the antenna assembly layer (106) and the card body (102). The layer (152) may include an opening to form part of a window (104) in an area of ​​the contactless chip module (140) to accommodate a contactless chip module (140) for connection to the antenna (110).

[0022] To assemble a contactless card (100) or a contactless card (150), when the contactless chip module (140) is coupled to the antenna assembly layer (106), the contactless chip module (140) can be aligned within the window (104), such as being centrally located within the window (104). Thus, when assembled, in the embodiment of FIGS. 2 and 3, the contactless chip module (140) is arranged within the window (104) and does not come into contact with the card body (102), but is electrically in contact with the antenna (110) through the hardened connector (112).

[0023] To illustrate additional details of the geometric structure for assembling a contactless card, FIG. 4a is a plan view illustrating details of an antenna assembly layer (106) according to some embodiment of the present invention. In this figure, a portion of the antenna assembly layer (106) placed within the window (104) and an outer portion (116) of the antenna assembly layer (106) placed on the lower part of the card body (102) as previously described are shown. The antenna (110) may define any suitable shape as generally illustrated in FIG. 4a. The antenna (110) terminates within the window (104) at two different end regions as illustrated. In particular, the end regions (122) and (124) of the antenna (110) are arranged toward the opposite side of the window (104). In an embodiment in which the UV-transparent layer (109) includes a recess (108), the end region (122) and the end region (124) may be arranged on opposite sides of the recess (108).

[0024] In certain embodiments, a set of end regions of the antenna, such as end regions (122) and end regions (124), may be arranged in a wavy pattern (shown in FIG. 4a), a spiral pattern, or other patterns. As additionally shown in FIG. 4a, a first curable connector (132) and a second curable connector (134) are arranged over end regions (122) and end regions (124), respectively. Additionally, the first curable connector (132) extends partially over the end region (122) of the antenna (110) and partially over the exposed area of ​​the UV-transparent layer (109).

[0025] In particular, as illustrated in the detailed view of FIG. 4b, the serrated pattern of the end region (122) or end region (124) defines an open area of ​​the UV-transparent layer (109) that is not covered by the antenna (110). The first curable connector (132) or the second curable connector (134) will be placed directly over the material of the antenna (110), and this material may be an opaque metal wire or foil. The second area (138) of the first curable connector (132) or the second curable connector (134) will be placed directly over the exposed area of ​​the UV-transparent layer (109). These second areas (138) will be directly exposed to light, such as UV radiation and / or visible radiation, directed toward the underside of the UV-transparent layer (109), that is, the side opposite to the first side (111) defined above.

[0026] To facilitate the assembly of the contactless card (100) or the contactless card (150), for example, a curable connector (112) (shown as the first curable connector (132) and the second curable connector (134) in FIG. 4a) may be formed from a conductive adhesive. Examples of suitable conductive adhesives according to the present embodiment include a conductive epoxy material or a similar conductive composite. The conductive adhesive may be applied as a dot or a similar shaped object on top of the end region (122) and the end region (124), as suggested by the example in FIG. 4a. Since the first hardenable connector (132) and the second hardenable connector (134) can be positioned far from the edge (114) of the window (104), when the card body (102) comes into contact with the antenna assembly layer (106), the first hardenable connector (132) and the second hardenable connector (134) prevent electrical connection between the antenna (110) and the card body (102) so that they are not deformed enough to come into contact with the edge (114).

[0027] Accordingly, referring to FIGS. 2 and 3, the aforementioned embodiment of a contactless card can be formed by a process of attaching an antenna assembly layer (106) to a card body (102), and an optional layer is disposed between the antenna assembly layer (106) and the card body. This is as disclosed in the embodiment of FIG. 3. In this way, a window (104) that is at least partially already defined within the card body (102) will form a recess extending at least to the upper surface of the antenna assembly layer (106).

[0028] Afterward, a non-contact chip module (140) may be provided within a window (104) on the first side (111) of the antenna assembly layer (106). The chip module (140) may come into contact with a curable connector (112) (or a first curable connector (132), a second curable connector (134)), and thus the curable connector (112) may be cured while in contact with the non-contact chip module (140). After curing in this manner, a mechanical coupling and an electrical connection are established between the antenna (110) and the non-contact chip module (140).

[0029] Advantageously, while the non-contact chip module (140) is in place within the window (104), the curing of the curable connector (112) can occur by directing a short exposure of radiation through the UV-transparent layer (109). The curable connector (112) may be formed of a chemical or set of chemicals that can be cured when exposed to appropriate radiation, such as ultraviolet light.

[0030] To illustrate this process, FIG. 5 shows a side exploded view of a contactless card illustrating one example during the manufacture of a contactless card according to an embodiment of the present invention. FIG. 6 shows a top perspective view of the same operation as illustrated in FIG. 5, with the card body (102) removed for clarity. In the operation illustrated in FIG. 5 and FIG. 6, a light source, such as a laser source (160), is positioned on the lower surface (115) of the UV-transparent layer (109). In the embodiment of FIG. 5, the laser source (160) connects the UV-transparent layer (109) to a pair of curable connectors (112) positioned on the first side (111) of the UV-transparent layer (109).

[0031] According to a different embodiment, the laser source (160) may include two laser beams to simultaneously direct, for example, two different laser beams, each beam being illustrated as a laser beam (162) and directed toward two different curable connectors. Thus, a first exposure, such as a first UV laser beam exposure, may be directed toward the first curable connector of a pair of curable connectors (112), while a second exposure, such as a second UV laser beam exposure, may be directed toward the second curable connector of a pair of curable connectors (112).

[0032] Alternatively, the laser source (160) may use a single laser to direct the laser beam (162) sequentially through the UV-transparent layer (109) toward the first curable connector (112) and then toward the second curable connector (112). In various non-limiting embodiments, the wavelength of the radiation of the laser beam (162) may be in the ultraviolet range, such as less than approximately 400 nm. The wavelength may be selected to suit the given material of the curable connector (112). For example, some known epoxy may be suitable for curing using radiation in the range of 320 nm to 380 nm.

[0033] Accordingly, the wavelength of the laser beam (162) may be set to a range of 320 nm to 380 nm for embodiments in which the curable connector (112) is manufactured from epoxy that is curable in this wavelength range. Of course, for epoxy or other curable materials suitable for curing in different wavelength ranges, the wavelength of the laser beam (162) may be in a different range. According to various non-limiting embodiments, the UV transparent layer (109) may transmit more than 5%, more than 10%, more than 20%, and more than 50% of the radiation from the side (115) to the first side (111) for UV ultraviolet rays in a range suitable for curing the curable connector (112), such as less than 400 nm.

[0034] In particular, the transmittance (%) of the UV-transmitting layer (109) suitable for curing the curable connector (112) will depend on the epoxy material or other material used in the curable connector and its sensitivity to radiation. In some cases, the low transmittance can be compensated for by increasing the exposure time required for complete curing. Additionally, the power output of the laser beam (162) can be increased to accommodate the lower transmittance.

[0035] Also, referring again to FIG. 4b, the wavy pattern of the end regions (122, 124) may be arranged to provide a large portion of the exposed area of ​​the curable connector (112), which signifies the area of ​​the second region (138) (A138). For example, the ratio of A138 (A136+138) to the total area of ​​the first region (136) and the second region (138) may be greater than 10%, greater than 20%, greater than 30%, or greater than 50% in some non-limiting embodiments. Again, the power or duration of the exposure to the laser beam (162) may be adjusted according to the transmittance of the UV-transparent layer (109) and the ratio of A138 / (A136+138). Thus, the curable connector may be exposed for a period of 0.1 to several seconds to allow the curable connector to cure.

[0036] In particular, the curing time can vary depending on the energy intensity and the exact material of the curable connector. For example, curing using a mercury vapor lamp source with an energy density in the 200 watt / inch range can cure a curable connector in a time frame of seconds to one minute when positioned approximately 6 to 10 inches from the curable connector. Using a laser source to cure provides a higher energy density, allowing the curing to occur, for example, within tens of seconds to a few seconds.

[0037] In an embodiment of a conductive adhesive material such as conductive epoxy, exposure to a laser beam (162) can cause rapid curing of the curable connector (112) and form a solid bond between the antenna (110) and the non-contact chip module (140) through the curable connector. Thus, UV exposure induces a polymerization (curing) reaction to promote adhesion between the non-contact chip module (140) and the antenna assembly layer (106).

[0038] Since the curable connector is electrically conductive, an electrically conductive path is established between the antenna (110) and the non-contact chip module (140). The exposure to the laser beam (162) may be sufficiently short, and since the curable connector (112) is not excessively deformed or spread, the curable connector (112) does not come into contact with the edge (114) of the window (104) defined by the card body (102).

[0039] Referring again to FIGS. 1 through 3, according to some embodiments, the recess (108) may accommodate a portion of the curable connector (112) during the process of coupling the non-contact chip module (140) to the antenna (110). Because the recess (108) is located below the main surface of the UV transparent layer, the curable connector (112) on the first side (111) may tend to deform to flow into the recess (108) rather than toward the edge (114) under pressure.

[0040] FIG. 7 illustrates a flowchart (700) for carrying out a method according to an embodiment of the present invention. In block 710, a card body of a transaction card is provided, wherein the card body includes a window. In some embodiments, the card body may be formed of a metallic material, while the window extends through the card body.

[0041] In block 720, an antenna assembly layer is attached to the card body. The antenna assembly layer may include a thin transparent layer, such as a UV transparent layer, wherein the transparent layer supports an antenna on a first side of the transparent layer. The antenna assembly layer may further include a set of curable connectors disposed over the terminal region of the antenna. In various embodiments, the set of curable connectors may be two curable connectors that are electrically conductive and disposed over the opposite terminal region of the antenna in an uncured state. Suitable materials for the set of curable connectors include conductive epoxy or other conductive composites.

[0042] In block 730, a non-contact chip module is provided within a window on the first side of the antenna assembly layer. In various embodiments, the curable connector may extend over the antenna. In this way, the non-contact chip module may come into direct contact with a set of curable connectors. The non-contact chip module may include, for example, two electrical contacts that come into contact with two respective curable connectors.

[0043] In Block 740, when the non-contact chip module is placed in the window, radiation is directed through the transparent layer from the second side facing the first side of the antenna assembly layer. The radiation may consist of UV radiation that cures the curable connector and facilitates adhesion between the curable connector and the non-contact chip module. In certain embodiments, the radiation may be directed as one or more laser beams characterized by electromagnetic wavelengths in the ultraviolet range that strike each curable connector of the curable connector set. At least a portion of the curable connector may be placed directly on the UV transparent layer, while another portion is placed over the terminal region of the antenna. In this way, the curable connector is sufficiently exposed to radiation to cause rapid curing, whereby the non-contact chip module is electrically connected to the antenna through the curable connector set.

[0044] FIG. 8 illustrates another flowchart (800) for carrying out a method according to another embodiment of the present invention.

[0045] Block 810 provides an antenna assembly layer comprising an antenna, a set of curable connectors disposed on the antenna, and a transparent layer supporting the antenna. In various embodiments, the set of curable connectors may be two curable connectors that are electrically conductive and disposed over opposing end regions of the antenna in an uncured state. Suitable materials for the set of curable connectors include conductive epoxy or other conductive composites.

[0046] In block 820, a non-contact chip module is placed on the first side of the antenna assembly layer. A set of hardened connectors extends over the surface of the antenna so that the non-contact chip module comes into direct contact with the set of hardened connectors. The non-contact chip module may include two electrical contacts that come into contact with, for example, two respective hardened connectors.

[0047] In block 830, radiation is directed from the second side of the antenna assembly layer through a transparent layer, where a non-contact chip module is electrically connected to the antenna via a set of curable connectors. The radiation may consist of UV radiation that cures the curable connectors and facilitates adhesion between the curable connectors and the non-contact chip module. In certain embodiments, the radiation may be directed as one or more laser beams characterized by electromagnetic wavelengths in the ultraviolet range striking each curable connector of the set of curable connectors. In this way, the curable connectors can undergo rapid curing, where the non-contact chip module is electrically connected to the antenna via the set of curable connectors.

[0048] In block 840, the card body having a window is attached to the antenna assembly layer in such a way that the contactless chip is placed within the window and does not come into contact with the card body. In other words, the card body can be positioned to be aligned with the antenna assembly layer by positioning the window around the contactless chip.

[0049] FIG. 9 illustrates another flowchart (900) for carrying out a method according to an embodiment of the present invention. A metal card body is provided in block 910, wherein the metal card body defines a chip window. The chip window can be fully extended through the metal card body.

[0050] In block 920, the antenna assembly layer is aligned adjacent to the metallic card body, and the antenna assembly layer includes an antenna and a transparent layer supporting the antenna. The antenna may include a first end region and a second end region such that the alignment of the antenna assembly layer places a first end region and a second end region within the chip window. In some embodiments, the antenna assembly layer may be coupled to the card body at this stage.

[0051] In block 930, a first curable connector is provided on a first end region of the antenna, and a second curable connector is provided on a second end region of the antenna. Placing the first curable connector and the second curable connector on each of the first end region and the second end region may occur when the first end region and the second end region are located within the window of the card body. The first curable connector and the second curable connector may be electrically conductive, such as conductive epoxy or other conductive composites.

[0052] In block 940, a contactless chip module is provided on a first curable connector and a second curable connector in such a way that the contactless chip module does not come into contact with the metal card body. The contactless chip module may include a semiconductor chip and two electrical contacts that come into contact with the first curable connector and the second curable connector, for example, when the contactless chip module is placed in a window of the metal card body.

[0053] In block 950, a laser (beam) is directed through a transparent layer toward the first curable connector and the second curable connector to cure the first curable connector and the second curable connector. In some examples, the transparent layer may be a UV transparent layer, and the laser may be formed of radiation having a wavelength in the UV range. In some non-limiting embodiments, the laser may expose the first curable connector and the second curable connector for a period of 0.1 seconds to several seconds. In this way, the non-contact chip module can be electrically connected to the antenna in such a manner that the first curable connector and the second curable connector do not come into contact with the metal card body.

[0054] The foregoing discussion is provided for illustrative and illustrative purposes only and is not intended to limit the invention to the forms or types disclosed in the invention. For example, various features of the invention may be grouped together into one or more aspects, embodiments, or embodiments for the purpose of simplifying the invention. However, it should be understood that various features of a particular aspect, embodiment, or embodiment of the invention may be combined into alternative aspects, embodiments, or embodiments. Furthermore, the following claims are incorporated into the detailed description of the invention by reference, and each claim exists in itself as a separate embodiment of the invention.

[0055] As used in the present invention, an element or step cited in the singular and proceeding with the word "a" or "an" should be understood not to exclude a plurality of elements or steps unless such exclusion is explicitly cited. Furthermore, reference to "one embodiment" of the present invention is not intended to be interpreted as excluding the existence of additional embodiments that also include the cited features.

[0056] In this invention, the use of "including," "comprising," or "having" and variations thereof encompasses the items listed below, their equivalents, and additional items. Accordingly, the terms "including," "comprising," or "having" and variations thereof are open expressions and may be used interchangeably in this invention.

[0057] The phrases “at least one,” “one or more,” and / or “and / or” used in the present invention are open expressions that are both conjunctions and disjunctions when in operation. For example, each of the expressions “at least one of A, B, and C,” “at least one of A, B, or C,” “one or more of A, B, and C,” “one or more of A, B, or C,” and “A, B, and / or C” means A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B, and C together.

[0058] All directional references, e.g., near, far, up, down, upward, downward, left, right, lateral, longitudinal, front, back, up, downward, upper, lower, vertical, horizontal, radial, axial, clockwise, and counterclockwise, are used solely for identification purposes to aid the reader's understanding of the invention and are not limited in particular with respect to the position, orientation, or use of the invention. Connection references, e.g., attachment, joining, connection, and joining, should be interpreted broadly and may include relative movement between intermediate members and elements between sets of elements unless otherwise indicated. As such, connection references do not necessarily imply that two elements are directly connected and in a fixed relationship with each other.

[0059] Additionally, identification references (e.g., primary, secondary, first, second, third, fourth) are used to distinguish one function from another, rather than implying importance or priority. The drawings are for illustrative purposes only, and the dimensions, positions, order, and relative sizes reflected in the drawings attached to the present invention may differ. Although not limited, the contactless card (150) and contactless card (150) described in the present invention may have standardized dimensions. For example, ISO / IEC 7816 is an international standard regarding contactless electronic identification cards, particularly smart cards, jointly managed by the International Organization for Standardization (ISO) and the International Electrotechnical Commission (IEC). However, other standards also exist, such as ISO / IEC 14443 for contactless cards (PayPass, PayWave, ExpressPay). An additional standard ISO / IEC 7810 ID-1, which most credit cards comply with, defines the dimensions as 85.60 × 53.98 mm (3.370 × 2.125 inches) and a thickness of 0.76 mm (0.030 inches).

[0060] Additionally, the terms “substantial” or “substantially,” as well as the terms “approximate” or “approximately,” may be used interchangeably in some embodiments and may be described using any relative measurement acceptable to those skilled in the art. For example, these terms may indicate a deviation from a reference parameter that can provide the intended function. Without limitation, the deviation from the reference parameter may be an amount such as, for example, less than 1%, less than 3%, less than 5%, less than 10%, less than 15%, less than 20%, etc.

[0061] Furthermore, although the exemplary method described above has been explained as a series of actions or events, the present invention is not limited by the illustrated order of such actions or events unless specifically stated otherwise. For example, some actions may occur in a different order and / or simultaneously with actions or events different from those illustrated and / or described in the present invention. Additionally, not all illustrated actions or events are required to implement the methodology according to the present invention. Furthermore, the method may be implemented in relation to the formation and / or processing of structures illustrated and described in the present invention, as well as in relation to other structures not illustrated.

[0062] The scope of the present invention is not limited by the specific embodiments described herein. In fact, various other embodiments and variations of the present invention, in addition to those described herein, will be apparent to those skilled in the art from the foregoing description and the accompanying drawings. Accordingly, such other embodiments and variations are intended to fall within the scope of the present invention. Furthermore, the present invention has been described in the context of a specific implementation in a specific environment for a specific purpose. Those skilled in the art will recognize that utility is not limited thereto and that the present invention may be advantageously implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be interpreted in consideration of the full scope and spirit of the present invention as described herein.

Claims

Claim 1 A step of providing a card body that limits a window; a curable connector disposed over a set of terminal regions of an antenna, and supporting an antenna including a curable connector in an uncured state. Limiting recess A method for forming a contactless transaction card comprising: attaching an antenna assembly layer including a transparent layer to a card body; providing a contactless chip module within a window on a first side of the antenna assembly layer; and irradiating radiation through a transparent layer, wherein the window includes a first region and a recess includes a second region smaller than the first region, and the method further comprises the step of aligning the window to the recess so as to be positioned away from the edge of the window to prevent electrical contact between the set of hardened connectors and the card body. Claim 2 A method according to claim 1, wherein the step of directing radiation through a transparent layer comprises: a step of directing a first UV laser beam exposure to a first curable connector disposed on a first terminal region of the antenna; and a step of directing a second UV laser beam exposure to a second curable connector disposed on a second terminal region of the antenna. Claim 3 A method according to claim 1, characterized in that the curable connector comprises a conductive epoxy material. Claim 4 A method according to claim 1, characterized in that the card body includes a metal body and the outer part of the antenna extends below the metal body, and further comprising the step of providing an insulating material between the outer part of the antenna and the card body prior to the step of attaching the antenna assembly layer. Claim 5 A method according to claim 1, wherein the transparent layer is a UV-transmitting layer, and the curable connector partially extends over a set of terminal regions of the antenna and is partially exposed over an exposed region of the UV-transmitting layer without being covered by the antenna. Claim 6 A method according to claim 1, characterized in that the set of terminal regions of the antenna includes a wavy pattern. Claim 7 delete Claim 8 A method according to claim 1, wherein the set of end portion regions includes a first end portion region and a second end portion region, and the recess is disposed between the first end portion region and the second end portion region. Claim 9 A method according to claim 8, wherein the hardening connector comprises a first connector disposed in a first terminal region of the antenna and a second connector disposed in a second terminal region of the antenna, and the step of aligning the window comprises the step of aligning the window to avoid contact with the first connector and the second connector. Claim 10 A contactless transaction card comprising: a card body defining a window; and an antenna assembly layer disposed below the card body; wherein the antenna assembly layer comprises: an antenna comprising a set of end regions; a UV transparent layer supporting the antenna and defining a recess; a set of end regions on which a composite material is disposed, comprising a curable connector comprising a chemical or a set of chemicals that can be cured when exposed to UV radiation; and a contactless chip module disposed within the window and electrically connected to the set of end regions of the antenna through the composite material; wherein the window comprises a first region and the recess comprises a second region smaller than the first region, and the composite material and the contactless chip module are positioned within the window so as not to be connected to the card body. Claim 11 delete Claim 12 A contactless transaction card characterized in that, in Clause 10, the composite material includes a conductive epoxy material. Claim 13 A contactless transaction card according to claim 10, wherein the card body is electrically conductive, the outer part of the antenna extends below the card body, and the contactless transaction card further comprises an insulating material disposed between the outer part of the antenna and the card body. Claim 14 A contactless transaction card according to claim 10, characterized in that the composite material partially extends over a set of terminal regions of the antenna and partially extends over an exposed region of a UV transparent layer not covered by the antenna. Claim 15 A contactless transaction card characterized in that, in Clause 10, the set of terminal regions of the antenna includes a wavy pattern. Claim 16 delete Claim 17 A contactless transaction card according to claim 10, characterized in that the set of end portion regions includes a first end portion region and a second end portion region, and a recess is disposed between the first end portion region and the second end portion region. Claim 18 A method for forming a contactless transaction card comprising: providing a card body that defines a window; bonding an antenna assembly layer to the card body, the antenna assembly layer including an antenna and a transparent layer that supports the antenna and defines a recess; a first end region, a second end region, and a composite material are disposed therein, wherein the composite material comprises a chemical or a set of chemical substances that are prone to hardening when exposed to radiation, and providing the composite material on the first end region and the second end region of the antenna; providing a contactless chip module within a window on a first side of the antenna assembly layer; and irradiating radiation from a second side of the transparent layer opposite the first side, wherein radiation hardens the composite material, the contactless chip module is electrically connected to the antenna through the composite material, and radiation is irradiated. Claim 19 In claim 18, the composite material forms a first connector in a first end portion region and a second connector in a second end portion region, and the step of directing radiation through a transparent layer comprises: a step of directing a UV laser beam exposure to the first connector; and a step of directing a second UV laser beam exposure to the second connector. Claim 20 A method according to claim 19, characterized in that the first connector partially extends over the first terminal region of the antenna and partially extends over the first exposed region of the transparent layer not covered by the antenna, and the second connector partially extends over the second terminal region of the antenna and partially extends over the second exposed region of the transparent layer not covered by the antenna.

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