Hearable device comprising integrated device and wireless functionality

Abstract

The present invention relates to a device comprising a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device, and a power source configured to provide power to the first integrated device, the speaker, and the microphone. The device has a length of about 2.4 cm or less and a diameter of about 1.2 cm or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit for enabling wireless charging of the power source.

Description

Technology Field

[0001] This application claims priority and advantage to Provisional Application No. 62 / 376,738 filed with the U.S. Patent and Trademark Office on August 18, 2016 and Formal Application No. 15 / 677,427 filed with the U.S. Patent and Trademark Office on August 15, 2017, the entire contents of said applications are incorporated herein by reference.

[0002] The various features generally relate to hearable devices, and more specifically, to integrated devices and hearable devices including wireless functions. Background Technology

[0003] FIG. 1 illustrates a hearing aid (100) comprising a shell (102), a tube (104), and an earpiece (106). The shell (102) includes a battery (120), a microphone (122), and a speaker (124). The shell (102) encapsulates the battery (120), the microphone (122), and the speaker (124). The shell (102) is coupled to the tube (104). The tube (104) is coupled to the earpiece (106). An ear (e.g., a human ear) includes an outer ear, a middle ear, and an inner ear. The outer ear includes an ear canal, an auricle, and an earlobe. The earpiece (106) is designed to fit into the ear canal. The shell (102) and tube (104) are located outside the ear. For example, the shell (102) may be located behind the auricle of the outer ear.

[0004] The hearing aid (100) operates by using a microphone (122) to pick out sound. Then, a speaker (124) emits sounds through a tube (104) to an earpiece (106). Then, the sound coming from the earpiece (106) travels through the external auditory canal to the middle and inner ear. A battery (120) provides power to operate the microphone (122) and the speaker (124). Once the battery (120) runs out of power or is discharged, the battery (120) is replaced with another battery.

[0005] There are many disadvantages to the hearing aid (100). One is that the hearing aid (100) has limited functionality. Another is that the hearing aid (100) is designed to fit awkwardly on the outside of the ear. Therefore, there is a continuing need for better hearable devices with better form factors and more functions and capabilities.

[0006] The various features generally relate to hearable devices, and more specifically, to hearable devices including integrated devices and wireless functions.

[0007] One example provides a device comprising a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device, and a power source configured to provide power to the first integrated device, the speaker, and the microphone. The device has a length of about 2.4 cm (centimeter) or less, and a diameter of about 1.2 cm (centimeter) or less.

[0008] Another example provides an apparatus comprising a board, a first integrated device coupled to the board, means for generating a sound wave—the means for generating a sound wave is coupled to the first integrated device—, means for detecting a sound wave—the means for detecting a sound wave is coupled to the first integrated device—, and means for providing power to the first integrated device, a speaker, and a microphone. The apparatus has a length of about 2.4 cm or less, and a diameter of about 1.2 cm or less. Brief explanation of the drawing

[0009] Various features, characteristics, and advantages may become apparent from the detailed description presented below in relation to drawings in which similar reference characters are identified correspondingly throughout.

[0010] Figure 1 illustrates a hearing aid.

[0011] FIG. 2 illustrates a tilted drawing of a hearable device including an integrated device.

[0012] FIG. 3 illustrates a plan view of a non-folding hearable device including an integrated device.

[0013] FIG. 4 illustrates a tilted drawing of another hearable device including an integrated device.

[0014] FIG. 5 illustrates another tilted drawing of a different hearable device including an integrated device.

[0015] FIG. 6 illustrates a drawing of another hearable device including an integrated device.

[0016] FIG. 7 illustrates a profile drawing of an integrated device that can be implemented in a hearable device.

[0017] FIG. 8 illustrates a profile diagram of a transistor that can be implemented in a low-power consumption integrated device.

[0018] FIG. 9 illustrates a drawing of another hearable device including an integrated device.

[0019] FIG. 10 illustrates a cross-sectional view of another hearable device including an integrated device. Specific details for implementing the invention

[0020] In the following description, specific details are provided to provide a complete understanding of the various aspects of the present disclosure. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details. For example, circuits may be illustrated in block diagrams to avoid obscuring the aspects with unnecessary details. In other cases, well-known circuits, structures, and techniques may not be illustrated in detail to avoid obscuring the aspects of the present disclosure.

[0021] Some features relate to a hearable device comprising a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device, and a power source configured to provide power to the first integrated device, the speaker, and the microphone. The hearable device has a length of about 2.4 cm or less and a diameter of about 1.2 cm or less. The first integrated device includes a processor. The first integrated device may include a low-power processor configured to operate with a processor power consumption of 5 to 2000 microwatts. The hearable device further includes a flex board coupled to the board (e.g., a printed circuit board (PCB)). The hearable device further includes another integrated device configured to provide wireless communication capabilities. The hearable device further includes a wireless charging circuit and a coil that enable wireless charging of the power source. The hearable device includes another integrated device configured to provide CODEC (compression / decompression) functions. Exemplary hearable device

[0022] FIG. 2 illustrates an example of a hearable device (200) comprising several functions and capabilities. The hearable device (200) comprises a first board (202), a second board (204), a third board (206), a flex board (208), a power supply (210), a first integrated device (212), a speaker (214), a microphone (216), a coil (218), a second integrated device (220), and an encapsulant (230). In some embodiments, the hearable device (200) may have a length of about 2.4 cm or less and a diameter of about 1.2 cm or less. In some embodiments, the hearable device (200) is small enough to fit substantially into the external auditory canal of the outer ear. In some implementations, the hearable device (200) may be positioned in the ear such that the microphone (216) faces outward and the speaker (214) faces the inner ear.

[0023] The flex board (208) may be a flexible printed circuit (FPC) or any flexible board. The flex board (208) is coupled to a first board (202), a second board (204), and a third board (206). The flex board (208) may include one or more flex boards. Each of the first board (202), the second board (204), and the third board (206) may include a printed circuit board (PCB). The power source (210) may be a means (e.g., a battery) for providing power to one or more components of the hearable device (200). The first board (202) is coupled to a first portion of the flex board (208). The second board (204) is coupled to a second portion of the flex board (208). The third board (206) is coupled to a third portion of the flex board (208). The board (e.g., the first board (202), the flex board (208)) includes one or more interconnects configured to provide one or more electrical paths between two or more points or components. The board may include one or more dielectric layers (e.g., polyimide layers) that at least partially encapsulate the interconnects. In some embodiments, the interconnects are formed between two dielectric layers of the board. The board may include a substrate (e.g., a silicon substrate) that is sufficiently thin to be flexible.

[0024] As illustrated in FIG. 2, a flex board (208) is wound at least partially around a power source (210) (e.g., along the length and / or periphery of the power source (210)). A first board (202) and a second board (204) are positioned along the length of the power source (210). A third board (206) is positioned on top of the power source (210). A microphone (216) (e.g., a means for detecting sound waves) is coupled to the third board (206). A first integrated device (212) is coupled to the first board (202). The first integrated device (212) may include a processor (e.g., a low-power processor, a CPU (central processing unit)). The first integrated device (212) may include a System-in-Package (SiP) configured to provide several functions. In some implementations, the System in Package (SiP) may be a package having a number of chips, active and passive components packaged within a single package to reduce the footprint by stacking components and / or reducing the spacing between components and / or by stricter line and space design rules. A speaker (214) (e.g., a means for generating sound waves) may be coupled to the first board (202).

[0025] The second integrated device (220) is coupled to the second board (204). The second integrated device (220) may include a CODEC (compression / decompression) device for providing a CODEC (compression / decompression) function (e.g., means for providing a CODEC (compression / decompression) function). An example of a CODEC function is an audio CODEC function.

[0026] Although not illustrated in FIG. 2, the hearable device (200) may include other integrated devices that can be configured to provide different functions and capabilities. For example, in some embodiments, the hearable device (200) may include an integrated device (e.g., means for wireless communication) configured to provide wireless communication, such as Bluetooth wireless communication. In some embodiments, the wireless communication may be implemented as a separate integrated device or as a part of the hearable device (200) or as another integrated device. In some embodiments, some or all of the functions of the hearable device are implemented as a single integrated device (e.g., a SiP including several chips).

[0027] FIG. 2 illustrates a coil (218) wound around a power source (210), a portion of a flex board (208), a first board (202), and a second board (204). The coil (218) may be wound around the power source (210), a portion of the flex board (208), the first board (202), and the second board (204) in a solenoid pattern or a spring pattern. The coil (218) may be a wireless charging coil. The coil (218) may be coupled to the power source (210) and a wireless charging circuit. The coil (218) and the wireless charging circuit are configured to enable wireless charging of the power source (210). The wireless charging circuit may be a separate integrated device or may be a part of another integrated device (e.g., a first integrated device (212)). In some implementations, means for wireless charging may include the coil (218) and the wireless charging circuit.

[0028] In some implementations, the flex board (208) is configured in such a way that electrical paths (e.g., electrical connections) between a power supply (210), a first integrated device (212), a speaker (214), a microphone (216), a coil (218), a second integrated device (220), and / or any other components described in the present disclosure (e.g., passive devices) are enabled while keeping the form factor of the hearable device (200) as small and compact as possible.

[0029] FIG. 2 illustrates a capsule fire (230) encapsulating a first board (202), a second board (204), a third board (206), a flex board (208), a power supply (210), a first integrated device (212), a speaker (214), a microphone (216), a coil (218), and a second integrated device (220). Different implementations may use different materials for the capsule fire (230). The capsule fire (230) may include a malleable material so that the capsule fire (230) can substantially take on the shape of the external auditory canal when the hearable device (200) is positioned in the external auditory canal. In some implementations, the capsule fire (230) may include one or more cavities (240) near the speaker (214). In some implementations, the cavities (240) may travel through the capsule fire (230) and be composed of waveguides for the speaker (214). That is, the cavities (240) may allow sound waves generated by the speaker (214) to pass through the capsule fire (230).

[0030] FIG. 3 illustrates an exemplary drawing of a hearable device (200) that is not folded. The drawing of FIG. 3 crosses line AA of FIG. 2. As shown in FIG. 3, the hearable device (200) includes a first board (202), a second board (204), a third board (206), a flex board (208), a first integrated device (212), a speaker (214), a microphone (216), and a second integrated device (220). The hearable device (200) also includes a second integrated device (220) and a third integrated device (320).

[0031] FIG. 3 illustrates a hearable device (200) comprising a flex board (208) (e.g., a first flex board) and a flex board (308) (e.g., a second flex board). In some implementations, the flex board (208) and the flex board (308) are the same flex board.

[0032] The second integrated device (220) and the third integrated device (320) are coupled to the second board (204). In some implementations, the second integrated device (220) is a CODEC (compression / decompression) device configured to provide a CODEC (compression / decompression) function (e.g., means for providing a CODEC (compression / decompression) function). An example of a CODEC function is an audio CODEC function. In some implementations, the third integrated device (320) is configured to provide power management (e.g., means for power management). An example of power management includes voltage regulation. It is noted that in some implementations, the functions of the second integrated device (220) and the third integrated device (320) may be implemented in the same integrated device. For example, in some implementations, the functions of the second integrated device (220) and the third integrated device (320) may be implemented in the first integrated device (212).

[0033] In some implementations, integrating various functions into hearable devices faces two major challenges. First, the requirement to fit the device into the ear canal imposes extreme form factor (e.g., volume) constraints. Hearable devices need to be small enough to fit within the ear canal, and a significant portion or percentage of the volume must be dedicated to power (e.g., battery). This requires that the volume of the electronics (chips, passives, flexible PCBs, components) be minimized through advanced packaging technologies, such as using a System in Package (SiP) design that involves stacking and integrating multiple chips and components into individual packages. This reduces the power and parasitic losses required to supply energy to long traces on printed circuit boards. An example of such an integrated device (e.g., SiP) is illustrated and described in Fig. 7 below.

[0034] Second, although most of the form factor of the hearable device (200) can be dedicated to the power source (210) (e.g., battery), the size of the battery is considerably small. In some implementations, to provide adequate battery life, the integration of various chips and their functions needs to be carefully selected to reduce the amount of power drawn from the power source (210) (e.g., battery). Two exemplary focus areas for reducing power are the use of ultra-low power logic processors and ultra-low power radios. For example, in some implementations, processors based on advanced node CMOS (Complementary Metal-Oxide-Semiconductor), such as 28 nanometer (nm) low power (LP) or 28 nm FD-SOI (Fully Depleted Silicon on Insulator) technology, which enable ultra-low power processors with processor power consumption of 5 to 2000 microwatts while supporting always-on functionality, may be used in the hearable device (200) or any of the hearable devices described in this disclosure. Additionally, the availability of a low-power processor (e.g., an ultra-low power processor) within the hearable device (200) enables data processing and signal processing to occur locally. This eliminates the power consumption of transmitting data from the hearable device to a secondary device, such as a smartphone. Due to the availability of local ultra-low power processors, most signal processing is performed locally, and only a small portion of the data is transmitted to secondary devices (e.g., phones). Furthermore, data transmission is performed via radios designed similarly to ultra-low power advanced node CMOS, and these radios are required to have low-power (e.g., sub-microwatt) wake-up circuits to keep leakage current draw to a minimum and support effective battery life.Accordingly, in some embodiments, the hearable device (200) may include one or more processors that draw about 5 to 2000 microwatts of power (e.g., processor power) and process at least most of the audio data (e.g., audio CODEC) locally. In some embodiments, the ultra-low power processor or low power processor may be configured to use about 2 milliwatts or less of power (5 to 2000 microwatts). In some embodiments, one or more of the low power processors described in this disclosure may operate at a clock rate or clock speed of about 30 to 50 megahertz (MHz).

[0035] It is noted that different implementations may include different numbers of integrated devices coupled to the first board (202), the second board (204), and / or the third board (206). FIGS. 2 and 3 are merely examples of configurations of the hearable device. For instance, in some implementations, a speaker (214) may be coupled to the second board (204) instead of the first board (202). The flex board (208) and the flex board (308) are flexible (e.g., bendable) so that the first board (202), the second board (204), and / or the third board (206) can be wrapped at least partially around the power supply (210). In some implementations, at least one flex board (e.g., 208, 308) has a bending radius of 5 mm (millimeter) or less. In some implementations, at least one flex board (e.g., 208, 308) may be flexible in such a way that the flex board can be bent at least 45 degrees or more (e.g., 45 degrees to 360 degrees). In some implementations, the flex board(s) (e.g., 208, 308) allow the components to wrap around the power supply (210), thereby allowing the hearable device (200) to have a small form factor (e.g., volume), thus saving a lot of space.

[0036] Different implementations may use components that occupy different real estates or footprints. For example, an integrated device may occupy about 120 square millimeters. A component (e.g., a surface mounted technology (SMT) component) may occupy about 60 to 100 square millimeters. As illustrated in FIG. 3, the first board (202) may have a size of about 48 square millimeters or less, and the second board (204) may have a size of about 40 square millimeters or less. However, different implementations may use boards (e.g., 202, 204) having different sizes. In some embodiments, the hearable device (200) comprises a length of about 2.4 cm (centimeter) or less (e.g., about 1.8-2.4 centimeters), a diameter of about 1.2 cm (centimeter) or less (e.g., about 1-1.2 centimeters), and a width and height (W x H) similar to about 1.2 cm (centimeter) or less (e.g., about 1-1.2 centimeters).

[0037] Different implementations of hearable devices may have different designs, configurations, and / or components. For example, different components (e.g., SMT components, passive devices) may be coupled to boards. The following are additional examples of hearable devices. Exemplary hearable device

[0038] FIGS. 4 and 5 illustrate drawings of a hearable device (400). The hearable device (400) is similar to the hearable device (200) but has a different design. The hearable device (400) may have the same or different functions as the hearable device (200). A hearable device (400) without a capsule fire (230) is illustrated. However, in some embodiments, the hearable device (400) may include a capsule fire (230). In some embodiments, the hearable device (400) may have a length of about 2.4 cm or less and a diameter of about 1.2 cm or less. In some embodiments, the hearable device (400) is small enough to fit substantially into the external auditory canal of the outer ear. In some implementations, the hearable device (400) may have dimensions similar to those of the hearable device (200).

[0039] As illustrated in FIGS. 4 and 5, the hearable device (400) includes a first board (202), a second board (204), a flex board (208), a power supply (210), a first integrated device (212), a speaker (214), a microphone (216), a coil (218), and a second integrated device (220).

[0040] The first board (202), the second board (204), the flex board (208), the first integrated device (212), the speaker (214), the microphone (216), the coil (218), and the second integrated device (220) are all located on one side of the power supply (210). The first board (202) can be coupled to the first side of the flex board (208). The second board (204) can be coupled to the second side of the flex board (208).

[0041] The first integrated device (212) and / or the second integrated device (220) may be low-power consumption processors as described in FIG. 2. Accordingly, in some embodiments, the hearable device (400) may include one or more processors that draw about 5 to 2000 microwatts of power (e.g., processor power) and process at least most of the audio data (e.g., audio CODEC) locally. In some embodiments, the ultra-low power processor or low-power processor may be configured to use about 2 milliwatts of power or less (5 to 2000 microwatts). In some embodiments, one or more of the low-power processors described in this disclosure may operate at a clock rate or clock speed of about 30 to 50 megahertz (MHz).

[0042] The coil (218) is formed so that the coil (218) surrounds the first board (202), the second board (204), the flex board (208), and the microphone (216).

[0043] A speaker (214), a microphone (216), and a power supply (210) are coupled to a flex board (208). The flex board (208) is coupled to a first board (202) and a second board (204). A first integrated device (212) and a second integrated device (220) are coupled to the first board (202). In some implementations, the speaker (214), the microphone (216), and / or the power supply (210) may be coupled to the first board (202) and / or the second board (204).

[0044] The hearable device (400) may include other components and / or devices as described for the hearable device (200). These other components and / or devices (e.g., passive devices, wireless communication devices, CODEC devices) may be coupled to the first board (202), the second board (204), and / or the flex board (208). These and other functions may be implemented in a single integrated device (e.g., SiP) or in two or more integrated devices. In some embodiments, the hearable device (400) has a length of about 2.4 cm (centimeter) or less (e.g., about 1.8-2.4 centimeters), a diameter of about 1.2 cm (centimeter) or less (e.g., about 1-1.2 centimeters), or a width and depth similar to about 1.2 cm (centimeter) or less (e.g., about 1-1.2 centimeters). Exemplary hearable device

[0045] FIG. 6 illustrates a drawing of a hearable device (600). The hearable device (600) is similar to the hearable device (200) but has a different design. The hearable device (600) may have the same or different functions as the hearable device (200). A hearable device (600) without a capsule fire (230) is illustrated. However, in some embodiments, the hearable device (600) may include a capsule fire (230). In some embodiments, the hearable device (600) may have a length of about 2.4 cm (centimeter) or less (e.g., about 1.8-2.4 centimeters) and a diameter of about 1.2 cm (centimeter) or less (e.g., about 1-1.2 centimeters). In some implementations, the hearable device (600) is small enough to fit substantially into the external auditory canal of the outer ear.

[0046] As illustrated in FIG. 6, the hearable device (600) includes a first board (602), a second board (604), a third board (606), a first flex board (608), a second flex board (618), a third flex board (628), a power supply (610), a first integrated device (612), a second integrated device (620), a speaker (214), and a microphone (216).

[0047] The first board (602) is coupled to the first flex board (608). The first flex board (608) is coupled to the second board (604). The second board (604) is coupled to the second flex board (618) and the third flex board (628). The second flex board (618) and the third flex board (628) are coupled to the third board (606). The flex board(s) (e.g., 608, 618, 628) are flexible (e.g., bendable) so that the board(s) (602, 604, 606) can be wound at least partially around the power source (610). In some embodiments, at least one flex board (e.g., 608, 618, 628) has a bending radius of 5 mm (mm) or less. In some implementations, at least one flex board (e.g., 608, 618, 628) may be flexible so that the flex board can be bent by at least 45 degrees or more (e.g., 45 degrees to 360 degrees). In some implementations, the flex board(s) (e.g., 608, 618, 628) allow the components to wrap around the power supply (610), thereby allowing the hearable device (600) to have a small form factor (e.g., volume), thus saving a lot of space.

[0048] The power source (610) includes a plurality of batteries (e.g., button cell batteries). The power source (610) is coupled to a second board (604), a first flex board (608), and a second flex board (618). In some implementations, the first flex board (608) and the second flex board (618) may at least partially wrap around the power source (610).

[0049] The speaker (214) is coupled to the first board (602). The first integrated device (612) is coupled to the third board (606). The first integrated device (612) is located below the third board (606). However, the first integrated device (612) may be located at different locations. The first integrated device (612) may include a System-in-Package (SiP) that includes various functions. The first integrated device (612) may include, for example, a processor, memory, and / or a wireless communication device (e.g., a Bluetooth device). The microphone (216) and the second integrated device (620) are coupled to the third board (606). The second integrated device (620) may include various functions, CODEC, and / or power management. It is noted that in some implementations, the functions of the first integrated device (612) and the second integrated device (620) may be implemented in the same integrated device. Other components (e.g., passive devices) may also be coupled to the boards.

[0050] The first integrated device (612) and / or the second integrated device (620) may be low-power consumption processors as described in FIG. 2. Accordingly, in some embodiments, the hearable device (600) may include one or more processors that draw about 5 to 2000 microwatts of power (e.g., processor power) and process at least most of the audio data (e.g., audio CODEC) locally. In some embodiments, the ultra-low power processor or low-power processor may be configured to use about 2 milliwatts of power or less (5 to 2000 microwatts). In some embodiments, one or more of the low-power processors described in this disclosure may operate at a clock rate or clock speed of about 30 to 50 megahertz (MHz).

[0051] As illustrated in FIG. 6, the first integrated device (612) is about 5 mm (millimeter) x 5 mm (millimeter) x 0.4 mm (millimeter) or less. The power source (610) (e.g., battery) is about 5.8 mm (millimeter) x 3.6 mm (millimeter) or less. However, different implementations may use components having different dimensions. It is noted that the hearable device (600) may be modified to include components and / or functions different from those described for other hearable devices in this disclosure. Exemplary integrated devices

[0052] Various integrated devices (e.g., a first integrated device (212), a second integrated device (220), a first integrated device (612), and a second integrated device (620)) are described in this disclosure. These integrated devices may be implemented in any of the hearable devices described in this disclosure. These integrated devices may also include different functions and / or capabilities. An integrated device may include a semiconductor device, an integrated circuit, a die, an interposer, a package or PoP (package-on-package), and / or SiP (System-in-Package).

[0053] FIG. 7 illustrates an example of an integrated device (700) that can be implemented in a hearable device of the present disclosure. For example, the integrated device (700) may be implemented as a first integrated device (212), a second integrated device (220), a first integrated device (612) and / or a second integrated device (620). The integrated device (700) includes a substrate (702), a first die (704), a second die (706), a third die (708), a spacer (710), and an encapsulation layer (712).

[0054] The substrate (702) includes one or more dielectric layers (720) and a plurality of interconnects (722). A plurality of solder interconnects (730) (e.g., solder balls) are coupled to the plurality of interconnects (722).

[0055] The first die (704) is coupled to the substrate (702). The second die (706) is coupled to the first die (704) (e.g., mounted thereon). The spacer (710) is coupled to the second die (706). The third die (708) is coupled to the spacer (710) (e.g., mounted thereon). The second die (706) is electrically coupled to the substrate (702) through a plurality of first wire bonds (760). The third die (708) is electrically coupled to the substrate (702) through a plurality of second wire bonds (780).

[0056] The encapsulation layer (712) encapsulates at least partially the first die (704), the second die (706), the third die (708), and the spacer (710). The encapsulation layer (712) may comprise a mold compound, an epoxy filler, and / or a resin. FIG. 7 is merely an example of an integrated device. Different implementations may use integrated devices having different configurations and arrangements.

[0057] The first die (704) includes a processor. The second die (706) includes a Bluetooth communication device. The third die (708) includes a memory device. However, different implementations may have dies having different configurations and / or functions. For example, a die may include a wireless charging function, a near field communication (NFC) function, and / or a CODEC function.

[0058] In some implementations, the integrated device (700) has dimensions of about 5 mm (millimeter) x 0.4 mm (millimeter) x 5 mm (millimeter) or less. In some implementations, the integrated device (700) is configured to use ultra-low power logic processors and ultra-low power radios. For example, in some implementations, processors based on advanced node CMOS, such as 28 nm LP or 28 nm FD-SOI technology, which enable ultra-low power processors to operate with processor power consumption of 5 to 2000 microwatts while supporting always-on operation, may be used in the integrated device (700). An example of a transistor for a low-power processor is illustrated and described in FIG. 8 below.

[0059] Additionally, the availability of an ultra-low power processor within the hearable device enables data processing and signal processing to occur locally. This eliminates the power consumption of transmitting data from the hearable device to a secondary device, such as a smartphone. Due to the availability of a local ultra-low power processor, most signal processing takes place locally, and only a small portion of the data is transmitted to the secondary device (e.g., phone). Furthermore, data transmission is performed via radios designed similarly to an ultra-low power advanced node CMOS, and these radios are required to have low-power (e.g., less than 1 microwatt) wake-up circuits to keep leakage current draw to a minimum and support effective battery life. Thus, in some implementations, the second integrated device (220) may include one or more processors that draw about 5 to 2000 microwatts of power (e.g., processor power) and process at least most of the audio data (e.g., audio CODEC) locally. In some implementations, an ultra-low power processor or a low power processor may be configured to use about 2 milliwatts of power or less (e.g., 5-2000 microwatts).

[0060] FIG. 8 illustrates a profile drawing of a transistor (800) that can be implemented in a low-power processor. For example, the transistor (800) may be implemented in the integrated device (700) of FIG. 7 and / or any other integrated device described in the present disclosure. The transistor (800) is an example of a transistor using a Fully Depleted Silicon on Insulator (FD-SOI) process.

[0061] As illustrated in FIG. 8, the transistor (800) comprises a substrate (810), an oxide layer (820), a source (830), a drain (840), a silicon layer (850), and a gate (860). The source (830) and the drain (840) are formed on the substrate (810). In some embodiments, the oxide layer (820) is an oxide embedded in the substrate (810). The substrate (810) may be silicon. The silicon layer (850) may be a thin silicon layer formed on the substrate (810). The gate (860) is formed on the silicon layer (850).

[0062] In some implementations, the transistor (800) enables a low-power processor using about 5-2000 microwatts of processor power consumption while supporting always-on operation. In some implementations, such a low-power processor can operate at a clock rate or clock speed of about 30-50 megahertz (MHz). Exemplary hearable device

[0063] FIGS. 9 and 10 illustrate drawings of a hearable device (900). The hearable device (900) is similar to the hearable device (200) but has a different design. The hearable device (900) may have the same or different functions as the hearable device (200). A hearable device (900) without a capsule fire (230) is illustrated. However, in some embodiments, the hearable device (900) may include a capsule fire (230). In some embodiments, the hearable device (900) may have a length of about 2.4 cm (centimeter) or less (e.g., about 1.6-2.0 centimeters) and a diameter of about 1.2 cm (centimeter) or less (e.g., about 1-1.2 cm). However, different embodiments may have different dimensions. In some implementations, the hearable device (900) is small enough to fit substantially into the external auditory canal of the outer ear.

[0064] The hearable device (900) includes a first board (902), a second board (904), a third board (1002), a fourth board (1004), a power supply (210), a power supply (910), a first flex board (908), a second flex board (1008), a third flex board (1018), a first integrated device (912), a second integrated device (920), a third integrated device (930), one or more components (916) (e.g., surface mount technology components), a speaker (214), a microphone (216), and a coil (218).

[0065] The first board (902) is coupled to the second board (904) via the first flex board (908). The microphone (216) is coupled to the first board (902). One or more components (916) (e.g., passive devices) are coupled to the second board (904).

[0066] The third board (1002) is coupled to the fourth board (1004) through the second flex board (1008) and the third flex board (1018). The third board (1002), the fourth board (1004), the second flex board (1008), and the third flex board (1018) at least partially surround the power supply (210) and the power supply (910).

[0067] The flex board(s) (e.g., 1008, 1018, 1028) are flexible (e.g., bendable) so that the board(s) (e.g., 1002, 1004, 1006) can be wrapped at least partially around the power source (610). In some embodiments, at least one flex board (e.g., 1008, 1018, 1028) has a bending radius of 5 mm (millimeter) or less. In some embodiments, at least one flex board (e.g., 1008, 1018, 1028) may be flexible in such a way that the flex board can be bent by at least 45 degrees or more (e.g., 45 to 360 degrees). In some implementations, the flex board(s) (e.g., 1008, 1018, 1028) allow the components to wrap around the power(s) (e.g., 210, 910), thereby allowing the hearable device (900) to have a small form factor (e.g., volume), thus saving a lot of space.

[0068] Power supply (210) and power supply (910) are configured to provide power to the first integrated device (912), the second integrated device (920), the third integrated device (930), the speaker (214), and the microphone (216).

[0069] The speaker (214) and the first integrated device (912) are coupled to the third board (1002). The second integrated device (920) and the third integrated device (930) are coupled to the fourth board (1004).

[0070] The coil (218) encapsulates at least partially the power supply (210), the power supply (910), the third board (1002), the fourth board (1004), the speaker (214) and / or the first integrated device (912).

[0071] Different implementations may configure the integrated devices to perform different functions. In some implementations, the first integrated device (912) is configured to operate as a processor. In some implementations, the second integrated device (920) is configured to operate as a wireless communication device (e.g., a Bluetooth communication device). In some implementations, the third integrated device (1030) is configured to operate as a memory device (e.g., a flash memory).

[0072] It is noted that in some implementations, the functions of the first integrated device (912), the second integrated device (920), and / or the third integrated device (930) may be implemented in the same integrated device. The first integrated device (912), the second integrated device (920), and / or the third integrated device (930) may be low-power consumption processors, as described in FIG. 2. Thus, in some implementations, the hearable device (900) may include one or more processors that draw about 5 to 2000 microwatts of power (e.g., processor power) and process at least most of the audio data (e.g., audio CODEC) locally. In some implementations, the ultra-low power processor or low-power processor may be configured to use about 2 milliwatts of power or less (5 to 2000 microwatts). In some implementations, one or more of the low-power processors described in this disclosure may operate at a clock rate or clock speed of about 30 to 50 megahertz (MHz).

[0073] It is noted that the hearable device (900) may be modified to include components and / or functions different from those described for other hearable devices in the present disclosure.

[0074] It is noted that various devices, components (e.g., SMT components, passive devices) and / or integrated devices may be coupled differently to board(s) (e.g., first board (202), flex board (208)). In some implementations, devices, components and / or integrated devices may be coupled to board(s) through a plurality of solder interconnects (e.g., solder balls, copper pillars and solder).

[0075] One or more of the components, processes, features, and / or functions exemplified in FIG. 2-10 may be rearranged and / or combined into a single component, process, feature, or function, or implemented as some components, processes, or functions. Additional elements, components, processes, and / or functions may also be added without departing from the present disclosure. It should also be noted that FIG. 2-10 and the corresponding description of the present disclosure are not limited to dies and / or ICs. In some embodiments, FIG. 2-10 and its corresponding description may be used to manufacture, create, provide, and / or produce devices and / or integrated devices. In some embodiments, a device may include a hearable device, a die, an integrated device, a die package, an integrated circuit (IC), a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, and / or an interposer.

[0076] The word “exemplary” is used herein to mean “serving as an example, case, or example.” Any embodiment or aspect described herein as “exemplary” is not to be interpreted as being more desirable or advantageous than other aspects of this disclosure. Likewise, the term “aspects” does not require that all aspects of this disclosure include the features, advantages, or modes of operation discussed. The term “coupled” is used herein to refer to direct or indirect coupling between two objects. For example, if object A physically touches object B and object B touches object C, objects A and C may still be considered coupled to each other, even if they do not physically touch each other directly.

[0077] It is also noted that the various disclosures contained herein may be described as processes illustrated as flowcharts, flow diagrams, structural diagrams, or block diagrams. While flowcharts may describe operations as sequential processes, many operations may be performed in parallel or simultaneously. Additionally, the order of operations may be rearranged. A process terminates when its operations are completed.

[0078] Various features of the present disclosure described herein may be implemented in other systems without departing from the present disclosure. It should be noted that the foregoing aspects of the present disclosure are merely examples and are not to be construed as limiting the present disclosure. The description of aspects of the present disclosure is intended to be illustrative and is not intended to limit the scope of the claims. As such, the present teachings can be easily applied to different types of devices, and many alternatives, modifications, and variations will be obvious to those skilled in the art.

Claims

Claim 1 As a device, a first printed circuit board (602), a second printed circuit board (604), and a third printed circuit board (606); a first integrated device (612) and a second integrated device (620) coupled to the third printed circuit board (606) — the first integrated device (612) includes means for providing wireless communication —; means for generating sound waves (214) — the means for generating sound waves is coupled to the first printed circuit board (602) —; means for detecting sound waves (216) — the means for detecting sound waves is coupled to the third printed circuit board (606) —; means (610) for providing power to the first integrated device and the second integrated device, the means for generating sound waves and the means for detecting sound waves — the means for providing power comprises a plurality of button cells including first and second button cell batteries spaced apart from each other. Includes batteries ―;and includes a first flex board (608), a second flex board (618), and a third flex board (628), each of the first flex board (608), the second flex board (618), and the third flex board (628) is at least partially wound around a button cell battery among the plurality of button cell batteries, and each of the first flex board (608), the second flex board (618), and the third flex board (628) includes one or more interconnects for providing electrical paths between two or more points or components, the first flex board (608) is coupled to the first printed circuit board (602) and the second printed circuit board (604), and the second and third flex boards (618, 628) are each coupled to both the second and third printed circuit boards (604, 606), and the first button cell A battery is positioned between the first printed circuit board (602) and the second printed circuit board (604), and the first and second flex boards (608, 618) are at least partially wound around the first button cell battery, and the second button cell battery is positioned between the second printed circuit board (604) and the third printed circuit board (606), and the third flex board (628) is at least partially wound around the second button cell battery, and the device has a length of 2.4 cm (centimeter) or less and a diameter of 1.2 cm (centimeter) or less. Claim 2 In claim 1, the first integrated device comprises a low-power processor using 5 to 2000 microwatts of power. Claim 3 In claim 1, the means for providing the wireless communication comprises an integrated device configured to provide Bluetooth wireless communication. Claim 4 A device according to claim 1, further comprising means for storing data. Claim 5 A device according to claim 1, further comprising means for providing magnetic NFC (near field communication). Claim 6 A device according to any one of claims 1 to 5, wherein the first integrated device has a footprint of 120 square millimeters or less.

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