Metal Heater for Semiconductor Wafer Testing

Abstract

A metal heater for testing semiconductor wafers is disclosed, which improves space efficiency and prevents interference with surrounding equipment by having a connection tab disposed on the outer surface of the heater body guide both ends of the heating wire in different directions. A metal heater for semiconductor wafer testing comprises a heater body having a groove formed therein, a heating wire housed in the groove that emits heat to heat the heater body, and a connection terminal connecting both ends of the heating wire exposed to the outside of the heater body to external wires. A connection tab is disposed on the outer surface of the heater body, protruding radially in the direction of the heater body to guide both ends of the heating wire toward the circumferential direction of the heater body, and to which the connection terminal is coupled. The connection tab guides one end and the other end of the heating wire in different directions on the plane of the heater body.

Description

Technology Field

[0001] The present invention relates to a metal heater for testing semiconductor wafers. Background Technology

[0002] Generally, semiconductor probe test heaters are key components used to heat wafers during the wafer testing phase to inspect the performance of semiconductor devices.

[0003] The probe test process, which examines the electrical characteristics of semiconductor wafers, is often conducted under specific temperature conditions and is essential for verifying device operation under various temperature conditions and, in particular, evaluating device reliability through high-temperature testing.

[0004] Accordingly, a heater is required to heat or cool the wafer under the probe card to obtain accurate test results in high or low temperature environments.

[0005] Meanwhile, conventional heaters for semiconductor probe testing are formed with a pedestal structure.

[0006] However, conventional semiconductor probe testing heaters of this type have significant space constraints due to the aforementioned structure, which leads to problems such as interference with probe cards, wafers, and peripheral equipment.

[0007] In addition, temperature uniformity is very important for heaters used for semiconductor probe testing.

[0008] If the temperature of the heater used for semiconductor probe testing is not uniform, there is a high probability that a normal chip will be identified as defective in the test environment, leading to a major problem where the chip must be discarded.

[0009] However, conventional heaters for semiconductor probe testing were made of materials with low thermal conductivity, resulting in a relatively uneven surface temperature and consequently reduced test reliability. Prior art literature

[0010] Published Patent Application No. 10-2025-0149894 The problem to be solved

[0011] The present invention has been devised to solve the above-mentioned problems, and the objective of the present invention is to provide a metal heater for semiconductor wafer testing that can improve space efficiency and prevent interference with surrounding equipment by having a connecting tab disposed on the outer surface of the heater body guide both ends of the heating wire in different directions.

[0012] Another objective of the present invention is to provide a metal heater for semiconductor wafer testing that can improve temperature uniformity and ensure test reliability by maximizing thermal conductivity through forming the heater body from oxygen-free copper material and joining it into an integrated structure via silver brazing in a vacuum.

[0013] Another objective of the present invention is to provide a metal heater for semiconductor wafer testing that can ensure electrical connection stability and insulation performance in a high-temperature environment by configuring the connection terminal with a multilayer structure of a terminal cap, a terminal sleeve, and a ceramic mold.

[0014] The problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0015] A metal heater for testing a semiconductor wafer according to an embodiment of the present invention for solving the above problem comprises: a heater body having a groove formed therein; a heating wire received in the groove and emitting heat to heat the heater body; and a connection terminal connecting both ends of the heating wire exposed to the outside of the heater body to external wires; wherein a connection tab is disposed on the outer surface of the heater body, protruding in the radial direction of the heater body to guide both ends of the heating wire toward the circumferential direction of the heater body, and to which the connection terminal is coupled, wherein the connection tab guides one end and the other end of the heating wire in different directions on the plane of the heater body.

[0016] The heater body comprises a first heating plate having a groove formed on one surface; and a second heating plate joined to one surface of the first heating plate; wherein the first heating plate and the second heating plate are formed of oxygen-free copper material and can have an integrated structure by joining through silver brazing in a vacuum.

[0017] The above-mentioned connecting terminal comprises: a first connecting terminal coupled to one end of the connecting tab and connecting one end of the heating wire protruding to one side of the connecting tab on the plane of the heater body and one external wire; and a second connecting terminal coupled to the other end of the connecting tab and connecting another external wire protruding to the other side of the connecting tab on the plane of the heater body; wherein the first connecting terminal and the second connecting terminal each comprise: a first terminal cap supported at the end of the connecting tab and having a heating wire penetration hole through which the heating wire passes and a fastening hole formed therein; a fastening member that passes through the fastening hole and is fastened to the connecting tab and fixes the first terminal cap; a tubular terminal sleeve having one end coupled to and supported by the first terminal cap; and a second terminal cap coupled to the other end of the terminal sleeve, shielding the internal space of the terminal sleeve and having a round bar penetration hole formed therein. A nickel round bar coupled to the through hole of the round bar, with a portion received in the terminal sleeve and connected to the heating wire, and another portion connected to the external wire; and a ceramic mold filled inside the terminal sleeve; wherein the first terminal cap may include a sleeve support portion inserted into the interior of the terminal sleeve to support the inner surface of the terminal sleeve; and a heating wire support portion protruding outside the sleeve support portion to support the outer surface of the heating wire.

[0018] The apparatus further includes a sleeve support bracket configured to be coupled to the heater body to support the terminal sleeve and to dampen the impact applied to the terminal sleeve; wherein the sleeve support bracket comprises: a guide rail fixedly coupled to the outer surface of the heater body; a slider coupled to the guide rail so as to be slidably movable along the longitudinal direction of the terminal sleeve; a bracket body detachably coupled to the outer surface of the terminal sleeve and formed with a C-shaped cross-sectional structure; an elastic pad made of an elastic material attached to the inner surface of the bracket body to elastically support the outer surface of the terminal sleeve; and a shock damping member interposed between the bracket body and the slider, which dampens the impact by elastically deforming when an impact is applied from the outside; wherein the shock damping member may include elastic beams of an arch structure connecting the bracket body and the slider; and a coil spring interposed between the bracket body and the slider.

[0019] The device further includes a wire support clamp coupled to the outer surface of the terminal sleeve and supporting the external wire to prevent separation of the external wire from the connection terminal; wherein the wire support clamp may include: a clamp base detachably coupled to the outer surface of the terminal sleeve; a first rotating arm rotatably coupled to the clamp base; a second rotating arm rotatably coupled to the first rotating arm; a wire fixing clip rotatably coupled to the second rotating arm and wrapping the external wire; and a cushion pad disposed on the inner surface of the wire fixing clip to elastically support the outer surface of the external wire. Effects of the invention

[0020] According to an embodiment of the present invention, a connecting tab protruding radially is arranged on the outer surface of a heater body, and by guiding one end and the other end of a heating wire in different directions, the arrangement space of the heating wire can be optimized and a compact structure compared to a conventional pedestal structure can be realized.

[0021] In addition, the present invention can prevent electrical interference between external wires and improve wiring efficiency by having the connecting tab guide both ends of the heating wire toward the circumferential side of the heater body while separating them in different directions.

[0022] In addition, the present invention minimizes spatial interference between probe cards and peripheral equipment that occurred in conventional pedestal structures, thereby improving the freedom of placement of test equipment and increasing maintenance convenience.

[0023] In addition, by forming the heater body from an oxygen-free copper material, the present invention secures high thermal conductivity, thereby enabling rapid and uniform heat distribution across the entire surface of the heater.

[0024] In addition, the present invention forms an integrated structure by joining a first heating plate and a second heating plate through silver brazing in a vacuum, thereby minimizing thermal resistance at the joint surface and maximizing the temperature uniformity of the entire heater body.

[0025] In addition, as temperature uniformity is improved, the present invention can prevent misjudgments caused by temperature deviations during wafer testing and reduce unnecessary chip waste, thereby improving yield.

[0026] In addition, the present invention allows the electrical connection between the heating wire and the external wire to be firmly maintained by forming the connection terminal as a multilayer structure composed of a first terminal cap, a terminal sleeve, a second terminal cap, a nickel rod, and a ceramic mold.

[0027] In addition, by filling the inside of the terminal sleeve with a ceramic mold, the present invention can secure excellent insulation performance even in high-temperature environments and prevent electrical leakage and short circuits.

[0028] In addition, the present invention can improve the bonding strength between the connection terminal, the heating wire, and the terminal sleeve and ensure durability against vibration or shock by having the sleeve support portion of the first terminal cap support the inner surface of the terminal sleeve and the heating wire support portion support the outer surface of the heating wire.

[0029] In addition, the present invention blocks the intrusion of external contaminants through a multi-layer sealing structure of the connection terminal (first terminal cap - terminal sleeve - ceramic mold - second terminal cap - nickel rod) and can maintain the reliability of the connection for a long period even in high temperature and thermal shock environments.

[0030] The effects according to the present invention are not limited to those exemplified above, and a wider variety of effects are included within the present invention. Brief explanation of the drawing

[0031] FIG. 1 is a plan view showing a metal heater according to an embodiment of the present invention. FIG. 2 is a side view showing a metal heater according to an embodiment of the present invention. FIG. 3 is a front view showing a connection terminal according to an embodiment of the present invention. FIG. 4 is a plan view showing a sleeve support bracket according to an embodiment of the present invention. FIG. 5 is a front view showing a bracket body according to an embodiment of the present invention. FIG. 6 is a plan view showing a wire support clamp according to an embodiment of the present invention. Specific details for implementing the invention

[0032] Hereinafter, embodiments are described in detail with reference to the attached drawings. However, various modifications may be made to the embodiments, and thus the scope of the patent application is not limited or restricted by these embodiments. It should be understood that all modifications, equivalents, and substitutions to the embodiments are included within the scope of the rights.

[0033] Specific structural or functional descriptions of the embodiments are disclosed for illustrative purposes only and may be modified and implemented in various forms. Accordingly, the embodiments are not limited to the specific disclosed forms, and the scope of this specification includes modifications, equivalents, or substitutions that fall within the technical concept.

[0034] Terms such as "first" or "second" may be used to describe various components, but these terms should be interpreted solely for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, a second component may be named a first component.

[0035] When it is stated that a component is "connected" to another component, it should be understood that it may be directly connected to or coupled with that other component, or that there may be other components in between.

[0036] The terms used in the embodiments are for illustrative purposes only and should not be interpreted as intended to be limiting. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0037] In addition, when describing with reference to the attached drawings, identical components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. In describing the embodiments, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the embodiments, such detailed description is omitted.

[0038] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0039] In the embodiments of the present invention, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the embodiments of the present invention.

[0040] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the depicted details. Furthermore, in describing the present invention, if it is determined that a detailed description of related known technology may unnecessarily obscure the essence of the present invention, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in this specification, other parts may be added unless "only" is used. Where a component is expressed in the singular, it includes cases where it includes the plural unless specifically stated otherwise.

[0041] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0042] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used.

[0043] When elements or layers are referred to as "on" another element or layer, this includes cases where another layer or element is placed directly on top of or in between. Throughout the specification, the same reference numerals refer to the same components.

[0044] The size and thickness of each component shown in the drawings are illustrated for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the illustrated components.

[0045] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and as will be fully understood by those skilled in the art, various technical interlocking and operation are possible, and each embodiment may be implemented independently of one another or together in an interlocking relationship.

[0046] FIG. 1 is a plan view showing a metal heater according to an embodiment of the present invention, and FIG. 2 is a side view showing a metal heater according to an embodiment of the present invention.

[0047] Referring to FIGS. 1 and 2, a metal heater (100) for testing a semiconductor wafer according to an embodiment of the present invention (hereinafter referred to as 'metal heater (100)') includes a heater body (1), a heating wire (2), and a connection terminal (3).

[0048] The heater body (1) is formed into a circular disc structure. Also, the surface of the heater body (1) can be nickel-plated.

[0049] A groove (G) in which a heating wire (2) is placed is formed inside the heater body (1).

[0050] For example, the groove (G) can be formed as a corrugated structure extending radially from the center of the heater body (1). Accordingly, the heating wire (2) can be uniformly distributed throughout the heater body (1).

[0051] The heating element (2) is received in the groove (G) and emits heat to heat the heater body (1).

[0052] At this time, although not shown in the drawing, a cooling channel through which a cooling fluid circulates may be further formed inside the heater body (1). Through this, rapid cooling may be possible. Additionally, although not shown in the drawing, a plurality of vacuum suction holes for vacuum suctioning a wafer may be formed on the upper surface of the heater body (1), and a vacuum flow path connected to the vacuum suction holes may be formed inside the heater body (1).

[0053] The connection terminal (3) connects both ends of the heating wire (2) exposed to the outside of the heater body (1) to the external wires (W).

[0054] Meanwhile, a connection tab (11) is arranged on the outer surface of the heater body (1).

[0055] The connection tab (11) protrudes radially from the outer surface of the heater body (1) and guides both ends of the heating wire (2) toward the circumferential side of the heater body (1). Additionally, a connection terminal (3) is connected to the connection tab (11).

[0056] At this time, the connecting tab (11) guides one end and the other end of the heating wire (2) in different directions on the plane of the heater body (1).

[0057] That is, the present invention has a connecting tab (11) protruding radially on the outer surface of a heater body (1), and by the connecting tab (11) guiding one end and the other end of a heating wire (2) in different directions, the arrangement space of the heating wire (2) can be optimized and a compact structure compared to a conventional pedestal structure can be realized.

[0058] In addition, the connection tab (11) guides both ends of the heating wire (2) toward the circumferential side of the heater body (1) and separates them in different directions, thereby preventing electrical interference between external wires (W) and improving wiring efficiency.

[0059] In addition, by minimizing spatial interference with probe cards and peripheral equipment that occurred in conventional pedestal structures, the freedom of placement of test equipment can be improved and maintenance convenience can be increased.

[0060] Meanwhile, the heater body (1) may include a first heating plate (12) having a groove (G) formed on one surface and a second heating plate (13) joined to one surface of the first heating plate (12).

[0061] At this time, the first heating plate (12) and the second heating plate (13) may be formed from oxygen-free copper material. Additionally, the first heating plate (12) and the second heating plate (13) may be joined by silver brazing in a vacuum to form an integrated structure.

[0062] Through this, high thermal conductivity can be secured, allowing heat to be rapidly and uniformly distributed across the entire surface of the heater body (1).

[0063] In addition, the first heating plate (12) and the second heating plate (13) are joined by silver brazing in a vacuum to form an integrated structure, thereby minimizing thermal resistance at the joint surface and maximizing the temperature uniformity of the entire heater body (1).

[0064] In addition, as temperature uniformity is improved, it is possible to prevent misjudgments caused by temperature deviations during wafer testing and reduce unnecessary chip waste, thereby improving yield.

[0065] In addition, the oxygen-free copper heater body (1) with an integrated structure has excellent mechanical strength and durability, so it can be used stably for a long time without deformation or damage even during repeated heating and cooling cycles.

[0066] FIG. 3 is a front view showing a connection terminal according to an embodiment of the present invention.

[0067] Referring to FIGS. 1 and FIGS. 3, the connection terminal (3) may include a first connection terminal (3A) and a second connection terminal (3B).

[0068] The first connection terminal (3A) is connected to one end of the connection tab (11) and can connect one end of the heating wire (2) protruding to one side of the connection tab (11) on the plane of the heater body (1) with one external wire (W).

[0069] The second connection terminal (3B) is connected to the other end of the connection tab (11) and can connect another external wire (W) to the other end of the heating wire (2) protruding from the other side of the connection tab (11) on the plane of the heater body (1).

[0070] The first connection terminal (3A) and the second connection terminal (3B) may each include a first terminal cap (31), a fastening member (32), a terminal sleeve (33), a second terminal cap (34), a nickel rod (36), and a ceramic mold (35).

[0071] The first terminal cap (31) is supported at the end of the connection tab (11) and can be fixed to the connection tab (11) through a fastening member (32). Additionally, a heating wire penetration hole (311) through which a heating wire (2) passes and a fastening hole (312) through which a fastening member (32) passes can be formed inside the first terminal cap (31).

[0072] The fastening member (32) passes through the fastening hole (312) and is fastened to the connecting tab (11), thereby allowing the first terminal cap (31) to be fixed to the connecting tab (11).

[0073] The terminal sleeve (33) may be formed in a tubular shape with a hollow interior. Additionally, one end of the terminal sleeve (33) may be connected to and supported by the first terminal cap (31). At this time, the terminal sleeve (33) may be connected to the first terminal cap (31) through brazing.

[0074] The second terminal cap (34) can be coupled to the other end of the terminal sleeve (33) to shield the internal space of the terminal sleeve (33). Additionally, a bar through-hole (341) into which a nickel bar (36) is coupled can be formed inside the second terminal cap (34). At this time, the second terminal cap (34) can be coupled to the terminal sleeve (33) through brazing.

[0075] A nickel rod (36) is joined to a rod through hole (341), with a portion received in a terminal sleeve (33) and connected to a heating wire (2) through welding, and another portion connected to an external wire (W). This allows for use at high power and increases heat resistance, thereby preventing overheating of the connection terminal (3).

[0076] The ceramic mold (35) can be filled inside the terminal sleeve (33).

[0077] For example, the ceramic mold (35) may be formed by hardening a liquid mold resin mixed with ceramic powder.

[0078] That is, the present invention can maintain a robust electrical connection between the heating wire (2) and the external wire (W) by forming the connection terminal (3) as a multilayer structure composed of a first terminal cap (31), a terminal sleeve (33), a second terminal cap (34), a nickel rod (36), and a ceramic mold (35).

[0079] In addition, by filling the inside of the terminal sleeve (33) with a ceramic mold (35), excellent insulation performance can be secured even in a high-temperature environment, and electrical leakage and short circuits can be prevented.

[0080] In addition, by directly fixing the first terminal cap (31) to the heater body (1) through the fastening member (32), the fastening stability of the entire connection terminal (3) can be improved and a structure that is easy to assemble and disassemble can be provided.

[0081] In addition, the multi-layer sealing structure of the connection terminal (3) (first terminal cap (31) - terminal sleeve (33) - ceramic mold (35) - second terminal cap (34) - nickel rod (36)) prevents the penetration of external contaminants and allows the reliability of the connection part to be maintained for a long time even in high temperature and thermal shock environments.

[0082] Meanwhile, the first terminal cap (31) may further include a sleeve support (313) and a heating wire support (314).

[0083] The sleeve support (313) can be inserted into the interior of the terminal sleeve (33) to support the inner surface of the terminal sleeve (33).

[0084] The heating wire support (314) protrudes outside the sleeve support (313) and can support the outer surface of the heating wire (2).

[0085] That is, by the sleeve support portion (313) of the first terminal cap (31) supporting the inner surface of the terminal sleeve (33) and the heating wire support portion (314) supporting the outer surface of the heating wire (2), the bonding force between the connection terminal (3), the heating wire (2), and the terminal sleeve (33) can be improved and durability against vibration or shock can be secured.

[0086] FIG. 4 is a plan view showing a sleeve support bracket according to an embodiment of the present invention, and FIG. 5 is a front view showing a bracket body according to an embodiment of the present invention.

[0087] Referring to FIGS. 4 and FIGS. 5, the metal heater (100) may further include a sleeve support bracket (4).

[0088] The sleeve support bracket (4) can be configured to be coupled to the heater body (1) to support the terminal sleeve (33) and to dampen the impact applied to the terminal sleeve (33).

[0089] More specifically, the sleeve support bracket (4) may include a guide rail (41) fixedly coupled to the outer surface of the heater body (1), and a slider (42) coupled to the guide rail (41) so as to be slidably movable along the longitudinal direction of the terminal sleeve (33). Additionally, the sleeve support bracket (4) may further include a bracket body (43) formed with a C-shaped cross-sectional structure and detachably coupled to the outer surface of the terminal sleeve (33), an elastic pad (44) made of an elastic material attached to the inner surface of the bracket body (43) to elastically support the outer surface of the terminal sleeve (33), and a shock absorbing part (45) interposed between the bracket body (43) and the slider (42) that elastically deforms when an impact is applied from the outside to dampen the impact.

[0090] At this time, the shock absorbing member (45) may include elastic beams (451) of an arch structure connecting the bracket body (43) and the slider (42), and a coil spring (452) interposed between the bracket body (43) and the slider (42).

[0091] Accordingly, by attaching a sleeve support bracket (4) equipped with a guide rail (41) and a slider (42) to the heater body (1), the terminal sleeve (33) can slide in the longitudinal direction, thereby effectively absorbing thermal stress generated during thermal expansion and contraction of the heater body (1).

[0092] In addition, by moving the slider (42) along the guide rail (41), it is possible to flexibly respond to dimensional changes due to temperature changes of the heater body (1) and allow relative displacement between the connection terminal (3) and the heater body (1), thereby ensuring structural stability.

[0093] In addition, the bracket body (43) with a C-shaped cross-sectional structure partially wraps around and supports the outer surface of the terminal sleeve (33), thereby restricting the lateral movement of the terminal sleeve (33) and improving positional stability.

[0094] In addition, by attaching an elastic pad (44) to the inner surface of the bracket body (43), the outer surface of the terminal sleeve (33) is elastically supported, thereby preventing wear caused by direct metal contact and improving vibration damping performance.

[0095] In addition, by placing an impact damping member (45) including arch-structured elastic beams (451) and coil springs (452) between the bracket body (43) and the slider (42), the impact applied from the outside can be double dampened to effectively prevent mechanical damage to the terminal sleeve (33) and the connection terminal (3).

[0096] In addition, the elastic beams (451) are formed into an arch structure, thereby converting and absorbing impact energy into bending deformation of the beams, and the coil spring (452) provides additional shock absorption through compression deformation, so that the shock mitigation performance can be maximized.

[0097] In addition, since the sleeve support bracket (4) is formed in a detachable structure, the sleeve support bracket (4) can be easily detached when replacing or maintaining the connection terminal (3), thereby improving work convenience.

[0098] In addition, by simultaneously implementing a slide movement structure and a shock absorption structure, both the thermal expansion response function and the shock protection function are satisfied, thereby ensuring long-term reliability of the connection terminal (3) even in a repetitive thermal cycle and external shock environment.

[0099] FIG. 6 is a plan view showing a wire support clamp according to an embodiment of the present invention.

[0100] Referring to FIG. 6, the metal heater (100) may further include a wire support clamp (5).

[0101] The wire support clamp (5) is coupled to the outer surface of the terminal sleeve (33) and supports the external wire (W) to prevent the external wire (W) from being separated from the connection terminal (3).

[0102] More specifically, the wire support clamp (5) may include a clamp base (51) detachably coupled to the outer surface of the terminal sleeve (33), a first rotating arm (52) rotatably coupled to the clamp base (51), a second rotating arm (53) rotatably coupled to the first rotating arm (52), a wire fixing clip (54) rotatably coupled to the second rotating arm (53) and wrapping around an external wire (W), and a cushion pad (55) disposed on the inner surface of the wire fixing clip (54) to elastically support the outer surface of the external wire (W).

[0103] Accordingly, by attaching a wire support clamp (5) to the outer surface of the terminal sleeve (33), the external wire (W) is directly fixed to the terminal sleeve (33), thereby preventing the tensile force or bending stress applied to the external wire (W) from being concentrated in the wire penetration hole (341) of the second terminal cap (34).

[0104] In addition, since the clamp base (51) is detachably coupled to the outer surface of the terminal sleeve (33), the wire support clamp (5) can be easily detached when replacing the external wire (W) or maintaining the connection terminal (3), thereby improving work convenience.

[0105] In addition, by forming a multi-joint structure in which the first rotating arm (52), the second rotating arm (53), and the wire fixing clip (54) are sequentially rotatably combined, it is possible to flexibly respond to the arrangement direction or angle of the external wire (W) and secure versatility that can be applied to various wiring paths.

[0106] In addition, the wire fixing clip (54) is positioned at the end of the rotating arm structure to wrap around and fix the external wire (W), thereby allowing the position and direction of the external wire (W) to be precisely adjusted and effectively preventing sagging or shaking of the external wire (W).

[0107] In addition, by placing a cushion pad (55) on the inner surface of the wire fixing clip (54), the outer surface of the external wire (W), particularly the insulation sheath, is elastically supported, thereby preventing excessive pressure from being applied to the external wire (W) and preventing damage to the insulation sheath.

[0108] In addition, the position of the wire fixing clip (54) can be adjusted three-dimensionally through the multi-joint rotating arm structure, so that the external wire (W) can be placed and fixed in an optimal path even in a complex wiring environment.

[0109] In addition, by fixing the external wire (W) to the terminal sleeve (33) with the wire support clamp (5), the connection can be prevented from being disconnected due to repeated movement of the external wire (W) or external impact, and long-term stability of the electrical connection can be ensured.

[0110] Although embodiments of the present invention have been described in more detail with reference to the attached drawings, the present invention is not necessarily limited to these embodiments and may be modified in various ways within the scope of the technical spirit of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of protection of the present invention shall be interpreted by the claims below, and all technical spirits within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

[0111] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims set forth below. Explanation of the symbols

[0112] 100. Metal heater 1. Heater main body G. Groove 11. Connection Tab 12. First heating plate 13. Second heating plate 2. Heating element 3. Connection terminal 3A. First connection terminal 3B. Second connection terminal 31. First terminal cap 311. Heating wire penetration hole 312. Fastening hole 313. Sleeve support 314. Heating wire support 32. Fastening member 33. Terminal Sleeve 34. Second terminal cap 341. Round bar through hole 35. Ceramic mold 36. Nickel round bar 4. Sleeve support bracket 41. Guide rail 42. Slider 43. Bracket body 44. Elastic pad 45. Shock absorber 451. Elastic beam 452. Coil Spring 5. Wire support clamp 51. Clamp Base 52. First rotating arm 53. Second rotating arm 54. Wire fixing clip 55. Cushion pad W. External wire

Claims

Claim 1 A heater body having a groove formed therein; a heating wire received in the groove and emitting heat to heat the heater body; and a connecting terminal connecting both ends of the heating wire exposed to the outside of the heater body to external wires; wherein a connecting tab is disposed on the outer surface of the heater body, protruding radially in the direction of the heater body to guide both ends of the heating wire toward the circumferential direction of the heater body and to which the connecting terminal is coupled, wherein the connecting tab guides one end and the other end of the heating wire in different directions on the plane of the heater body, and the heater body comprises a first heating plate having the groove formed on one surface; and a second heating plate joined to one surface of the first heating plate; wherein the first heating plate and the second heating plate are formed of oxygen-free copper material and joined by silver brazing in a vacuum to have an integrated structure, and the connecting terminal is a first connecting terminal coupled to one end of the connecting tab and connecting one external wire to one end of the heating wire protruding to one side of the connecting tab on the plane of the heater body; and a second connection terminal coupled to the other end of the connection tab and connecting the other end of the heating wire protruding to the other side of the connection tab on the plane of the heater body and another external wire; wherein the first connection terminal and the second connection terminal each include: a first terminal cap supported at the end of the connection tab and having a heating wire penetration hole through which the heating wire passes and a fastening hole formed therein; a fastening member that passes through the fastening hole and is fastened to the connection tab and fixes the first terminal cap; a tubular terminal sleeve having one end coupled to and supported by the first terminal cap; a second terminal cap coupled to the other end of the terminal sleeve to shield the internal space of the terminal sleeve and having a round bar penetration hole formed therein; a nickel round bar coupled to the round bar penetration hole, with a part thereof received in the terminal sleeve and connected to the heating wire, and another part thereof connected to the external wire; and a ceramic mold filled inside the terminal sleeve.A metal heater for semiconductor wafer testing, comprising: a first terminal cap including a sleeve support portion inserted into the interior of the terminal sleeve to support the inner surface of the terminal sleeve; and a heating wire support portion protruding outside the sleeve support portion to support the outer surface of the heating wire. Claim 2 delete Claim 3 delete

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