Heater for Semiconductor Wafer Testing and Method of Manufacturing the Same

Abstract

A semiconductor wafer test heater and a method for manufacturing the same are disclosed, which minimize deformation caused by thermal expansion and contraction by using an inorganic ceramic material as the material of the heating plate and can maintain dimensional stability and flatness for a long period even under repetitive thermal cycles. A heater for testing semiconductor wafers includes a disc-shaped heating plate processed to the same specifications as the wafer, a heating wire formed on one side of the heating plate that generates heat and heats the heating plate when power is applied, and a terminal module coupled to the heating plate and connecting the heating wire to external wires, and the heating plate is formed of an inorganic ceramic material having thermal conductivity.

Description

Technology Field

[0001] The present invention relates to a heater for testing semiconductor wafers and a method for manufacturing the same. Background Technology

[0002] Recently, demand for large-capacity, high-speed memory has been surging in fields such as artificial intelligence, high-performance computing, and graphics processing.

[0003] Accordingly, three-dimensional semiconductor devices that vertically stack multiple memory chips, such as HBM (High Bandwidth Memory), are attracting attention.

[0004] HBM generally has a structure in which 8 to 12 or more layers of memory chips are stacked vertically, and the chips in each layer are electrically connected.

[0005] In such a multilayer stacked structure, a massive amount of heat is generated when the chips in each layer operate simultaneously.

[0006] For example, when power is applied to a 12-layer stacked HBM wafer, heat is generated simultaneously in numerous chips, and the total amount of heat can reach approximately 12kW to 20kW.

[0007] This implies a very high thermal density per unit area, and if proper thermal management is not performed, it can lead to chip malfunction or damage.

[0008] In order to test high-heat semiconductor devices such as HBM, the setup of test equipment including a cooling system, temperature sensor, and control algorithm must be done in advance.

[0009] However, using actual HBM wafers in this equipment setup process is impossible for the following reasons.

[0010] First, HBM wafers are ultra-expensive products produced through a multi-layer stacking process, making it difficult to accept the risk of damage that may occur during the equipment setup process.

[0011] Second, the trial-and-error process to find the optimal equipment conditions can result in the consumption of a large number of wafers, leading to significant economic losses.

[0012] Third, the production and preparation of actual wafers take a significant amount of time, which may delay the development schedule.

[0013] Therefore, it is common practice to perform equipment setup and optimization using a heat emulation heater before using the actual wafer.

[0014] The heat simulation heater must have the same size and heating characteristics as the actual wafer and be reusable.

[0015] Conventionally, metal heaters made of metal material were used to simulate a heating capacity of 12kW to 20kW.

[0016] Metal heaters are generally made of metal materials such as stainless steel or aluminum alloy and have a structure with a heating coil or heating element built inside.

[0017] However, metal heaters have the following fundamental problems.

[0018] First, the metal material constituting the metal heater has a significantly higher coefficient of thermal expansion compared to ceramic materials or silicon.

[0019] Therefore, due to this difference in thermal expansion coefficients, metal heaters had the problem of significant expansion during heating and contraction during cooling.

[0020] In addition, thermal stress occurs in metal heaters due to uneven heating or cooling, which causes problems such as warpage or twisting.

[0021] In particular, under high-output heat generation conditions such as 12kW, a large temperature difference is observed between the center and the outer part, and the resulting deformation becomes more severe.

[0022] In addition, metal heaters had a problem in which permanent deformation occurred due to the accumulation of metal creep and fatigue as they underwent repetitive heating and cooling cycles.

[0023] In addition, in semiconductor test environments, complete contact between the wafer and the heater is important.

[0024] If a contact failure occurs, heat transfer becomes uneven, which leads to errors in the test results.

[0025] However, metal heaters had a problem in that it was difficult to achieve perfect flatness from the time of manufacturing, and the flatness continuously deteriorated as deformation caused by thermal cycles accumulated during use.

[0026] In particular, there was a problem in that creep deformation accelerates as the yield strength of the metal decreases at high temperatures, and surface roughness increases due to oxidation and corrosion.

[0027] In addition, since the dimensions, shape, and flatness of metal heaters change as the number of uses increases, there was a problem in that different conditions were applied each time even when the same test was repeated.

[0028] As a result, there was a problem that significantly reduced the reliability of the test data. Prior art literature

[0029] Registered Patent Publication No. 10-2098470 The problem to be solved

[0030] The present invention has been devised to solve the above-mentioned problems, and the objective of the present invention is to provide a semiconductor wafer test heater and a method for manufacturing the same, which minimizes deformation caused by thermal expansion and contraction by using an inorganic ceramic material as the material of the heating plate and can maintain dimensional stability and flatness for a long period even under repetitive thermal cycles.

[0031] Another objective of the present invention is to provide a semiconductor wafer test heater capable of achieving thermal characteristics similar to a silicon wafer and enabling precise heating pattern control by using aluminum nitride (AlN) or silicon dioxide (SiO2) as the material for the heating plate and printing and curing a heating paste mixed with silver (Ag) and palladium (Pd) using a print screen method to form a heating wire, and a method for manufacturing the same.

[0032] Another objective of the present invention is to provide a semiconductor wafer test heater and a method for manufacturing the same, which can optimize thermal expansion matching with a ceramic heating plate and minimize stress concentration due to thermal cycling by using a terminal member made of Kovar material and a terminal fixing bolt made of Invar material.

[0033] The problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0034] A semiconductor wafer test heater according to an embodiment of the present invention for solving the above problem comprises: a heating plate in the shape of a disc processed to the same specifications as the wafer; a heating wire formed on one surface of the heating plate and generating heat to heat the heating plate when power is applied; and a terminal module coupled to the heating plate and connecting the heating wire to external wires; wherein the heating plate is formed of an inorganic ceramic material having thermal conductivity.

[0035] An insulating layer may be formed on the surface of the heating plate on which the heating wire is formed through a ceramic fusible coating or physical vapor deposition (PVD) method.

[0036] The above inorganic ceramic material is aluminum nitride (AlN) or silicon dioxide (SiO2), and the heating wire can be formed by printing a heating paste of silver (Ag) and palladium (Pd) using a print screen method and then curing it.

[0037] The terminal module comprises: terminal members that are bonded to one surface of the heating plate and contact both ends of the heating wire and connected to the external wires; and terminal fixing bolts that penetrate the terminal members and are fastened to the heating plate and fix the terminal members. The terminal members are made of Kovar material, and the terminal fixing bolts may be made of Invar or Kovar material.

[0038] The above terminal members may include: a first terminal member that is fixed to the terminal fixing bolt and joined to one surface of the heating plate via vacuum brazing, contacting one end of the heating wire and connected to a first external wire; and a second terminal member that is fixed to the terminal fixing bolt and joined to one surface of the heating plate via vacuum brazing, contacting the other end of the heating wire, having a different length from the first terminal member, and connected to a second external wire.

[0039] The first terminal member and the second terminal member may each include: a terminal body having a bolt through-hole formed therein through which the terminal fixing bolt passes, and which is joined to the heating plate and contacts the end of the heating wire; and a connecting bar extending from the terminal body and contacting the external wire, having a wire connection hole formed therein for connection with the external wire, and having a thickness smaller than that of the terminal body.

[0040] The above terminal module further includes an insulating cover that is fixed to the outer surface of the heating plate through the terminal fixing bolts and surrounds the terminal members, and the insulating cover may be made of aluminum oxide (Al2O3).

[0041] The insulating cover may include: a cover body that is fixed in close contact with the outer surface of the heating plate through the terminal fixing bolts and accommodates the terminal members inside; an upper cover that shields the upper surface of the cover body by contacting the upper surface of the cover body exposed to the outside; a lower cover that shields the lower surface of the cover body by contacting the lower surface of the cover body exposed to the outside; wire fixing members that penetrate the upper cover, the cover body, and the terminal members and are coupled to the external wires and press the external wires against the terminal members; upper cover fixing members that penetrate the upper cover and are fastened to the cover body and fix the upper cover in close contact with the cover body; and lower cover fixing members that penetrate the lower cover and are fastened to the cover body and fix the lower cover in close contact with the cover body.

[0042] The above cover body comprises: terminal receiving grooves in which the ends of the terminal members and the external wires are received; first communication holes in which the terminal fixing bolts pass through and which are in communication with the bolt penetration holes; second communication holes in which the wire fixing members pass through and which are in communication with the wire connection holes; a lower cover seating groove in which the lower cover is seated, which is recessed to a predetermined depth from the lower surface of the cover body and exposed to the outside of the heating plate; first fastening holes in which the upper cover fixing members are fastened, which are recessed to a predetermined depth from the upper surface of the cover body; and second fastening holes in which the lower cover fixing members are fastened, which are recessed to a predetermined depth from the lower cover seating groove; wherein the upper cover comprises first cover communication holes in which the upper cover fixing members pass through and which are in communication with the first fastening holes; and the lower cover comprises second cover communication holes in which the lower cover fixing members pass through and which are in communication with the second fastening holes.

[0043] Each of the above terminal receiving grooves may include: a first groove portion in which the terminal member is received and which is arranged parallel to the radial direction of the heating plate; and a second groove portion in which the external wire is received and which extends in a direction orthogonal to the first groove portion in a plane and communicates with the external space.

[0044] The wire guide module is further configured to be detachably coupled to the outer surface of the insulating cover, wherein a portion of the portion grips the external wires from the outside of the insulating cover to restrict the axial movement of the external wires, and another portion bends the external wires to adjust the distance between the external wires and the heating plate; wherein the wire guide module may include: a detachable bracket detachably coupled to the outer surface of the insulating cover; a first clamp unit connected to the detachable bracket and gripping the external wires to restrict the axial movement of the external wires; a second clamp unit spaced apart from the first clamp unit along the longitudinal direction of the external wires to grip the external wires; and a distance adjustment unit installed on the detachable bracket to support the second clamp unit and to vary the position of the second clamp unit to bend the external wires.

[0045] The first clamp unit and the second clamp unit each comprise: a hinge shaft; a first clamp body rotatably coupled to the hinge shaft and wrapping around a portion of the external wires; a second clamp body rotatably coupled to the hinge shaft and wrapping around another portion of the external wires; a clamp fixing member for fixing the mutually coupled first clamp body and the second clamp body; first elastic support protrusions made of an elastic material protruding from the inner circumference of the first clamp body and supporting a portion of the external wires; second elastic support protrusions made of an elastic material protruding from the inner circumference of the second clamp body and supporting another portion of the external wires; and first gripping parts received inside the first clamp body and pressing the external wires, wherein the pressing force is automatically adjusted in correspondence with the diameter of the external wires. and second gripping parts that are received inside the second clamp body and pressurize the external wires, with the pressing force automatically adjusted in correspondence with the diameter of the external wires; wherein the first gripping parts and the second gripping parts each include: a gripping grip that contacts the outer surface of the external wire to support the external wire and slides along the radial direction of the external wire in correspondence with the diameter of the external wire; and an elastic coil that elastically supports the gripping grip toward the external wire side and is compressed or extended by the gripping grip to adjust the pressing force of the gripping grip.

[0046] The above separation distance adjustment unit may include: a rotating socket rotatably coupled to the above detachable bracket and adjusting the rotation angle of the second clamp unit; a length adjustment member slidably coupled to the inside of the rotating socket along the longitudinal direction of the rotating socket and protruding to the outside of the rotating socket or housed inside the rotating socket to adjust the position of the second clamp unit; and a rotating bracket that supports the second clamp unit and rotatably coupled to the end of the length adjustment member to adjust the rotation angle of the second clamp unit.

[0047] A method for manufacturing a heater for testing a semiconductor wafer according to an embodiment of the present invention for solving the above problem comprises the steps of: processing an inorganic ceramic material to the same specifications as the wafer to form a disc-shaped heating plate; printing a heating paste mixed with silver (Ag) and palladium (Pd) on one side of the heating plate using a print screen method, and then curing it in a sintering furnace to form a heating wire; fixing terminal members to the heating plate with terminal fixing bolts, and then joining them to the heating plate through vacuum brazing to electrically connect them to the heating wire; and assembling an insulating cover surrounding the terminal members to the heating plate to insulate the terminal members. and a step of forming an insulating layer on the surface of the heating plate on which the heating wire is formed by a ceramic melt coating or physical vapor deposition (PVD) method; wherein the inorganic ceramic material is aluminum nitride (AlN) or silicon dioxide (SiO2), the terminal members are Kovar material, the terminal fixing bolts are Invar material, and the insulating cover is aluminum oxide (Al2O3) material. Effects of the invention

[0048] According to an embodiment of the present invention, by precisely machining an inorganic ceramic material (AlN or SiO2) to the same specifications as a wafer, a heating plate having the same size and shape as an actual wafer can be manufactured, thereby ensuring the accuracy of the test equipment setup.

[0049] In addition, the present invention allows for the precise and reproducible formation of heating wires of a desired pattern by printing a heating paste mixed with silver (Ag) and palladium (Pd) using a print screen method, and can reduce manufacturing costs and minimize quality variations through a process suitable for mass production.

[0050] In addition, the present invention first fixes the Koba terminal member to a heating plate with an Invar fixing bolt and then performs vacuum brazing, thereby preventing positional movement of the terminal during brazing and maintaining precise alignment, so that high-quality joining is achieved and process yield can be improved.

[0051] In addition, the present invention can ensure electrical safety by insulating the terminal member by assembling an aluminum oxide (Al2O3) insulating cover.

[0052] In addition, the present invention forms an insulating layer on the surface of a heating plate on which a heating wire is formed using a ceramic fusion coating or PVD method, thereby achieving electrical insulation, mechanical protection, and oxidation prevention of the heating wire, and improving the overall lifespan and reliability of the heater.

[0053] The effects according to the present invention are not limited to those exemplified above, and a wider variety of effects are included within the present invention. Brief explanation of the drawing

[0054] FIG. 1 is a plan view showing a ceramic heater according to an embodiment of the present invention. FIG. 2 is a right side view showing a ceramic heater according to an embodiment of the present invention. FIG. 3 is a bottom view showing a ceramic heater according to an embodiment of the present invention. FIG. 4 is a plan view showing a terminal module according to an embodiment of the present invention. FIG. 5 is a left side view showing a terminal module according to an embodiment of the present invention. FIG. 6 is a cross-sectional view showing a terminal member according to an embodiment of the present invention. FIG. 7 is a left side view showing a disassembled state of a terminal module according to an embodiment of the present invention. FIG. 8 is a bottom view showing a cover body according to an embodiment of the present invention. FIG. 9 is a plan view showing a cover body according to an embodiment of the present invention. FIG. 10 is a plan view showing an upper cover according to an embodiment of the present invention. FIG. 11 is a bottom view showing an upper cover according to an embodiment of the present invention. FIG. 12 is a diagram showing the operation process of a wire guide module according to an embodiment of the present invention. FIG. 13 is a left side view showing a clamp unit according to an embodiment of the present invention. FIG. 14 is a flowchart showing a method for manufacturing a ceramic heater according to an embodiment of the present invention. Specific details for implementing the invention

[0055] Hereinafter, embodiments are described in detail with reference to the attached drawings. However, various modifications may be made to the embodiments, and thus the scope of the patent application is not limited or restricted by these embodiments. It should be understood that all modifications, equivalents, and substitutions to the embodiments are included within the scope of the rights.

[0056] Specific structural or functional descriptions of the embodiments are disclosed for illustrative purposes only and may be modified and implemented in various forms. Accordingly, the embodiments are not limited to the specific disclosed forms, and the scope of this specification includes modifications, equivalents, or substitutions that fall within the technical concept.

[0057] Terms such as "first" or "second" may be used to describe various components, but these terms should be interpreted solely for the purpose of distinguishing one component from another. For example, the first component may be named the second component, and similarly, the second component may be named the first component.

[0058] When it is stated that a component is "connected" to another component, it should be understood that it may be directly connected to or joined to that other component, or that there may be other components in between.

[0059] The terms used in the embodiments are for illustrative purposes only and should not be interpreted as intended to be limiting. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0060] In addition, when describing with reference to the attached drawings, identical components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. In describing the embodiments, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the embodiments, such detailed description is omitted.

[0061] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0062] In the embodiments of the present invention, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the embodiments of the present invention.

[0063] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the depicted details. Furthermore, in describing the present invention, if it is determined that a detailed description of related known technology may unnecessarily obscure the essence of the present invention, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in this specification, other parts may be added unless "only" is used. Where a component is expressed in the singular, it includes cases where it includes the plural unless specifically stated otherwise.

[0064] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0065] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used.

[0066] When elements or layers are referred to as "on" another element or layer, this includes cases where another layer or element is placed directly on top of or in between. Throughout the specification, the same reference numerals refer to the same components.

[0067] The size and thickness of each component shown in the drawings are illustrated for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the illustrated components.

[0068] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and as will be fully understood by those skilled in the art, various technical interlocking and operation are possible, and each embodiment may be implemented independently of one another or together in an interlocking relationship.

[0069] FIG. 1 is a plan view showing a heater according to an embodiment of the present invention, FIG. 2 is a right side view showing a heater according to an embodiment of the present invention, and FIG. 3 is a bottom view showing a heater according to an embodiment of the present invention.

[0070] Referring to FIGS. 1 to 3, a semiconductor wafer test heater (100) according to an embodiment of the present invention (hereinafter referred to as 'semiconductor wafer test heater (100)') includes a heating plate (1), a heating wire (2), and a terminal module (3).

[0071] The heating plate (1) is processed to the same specifications as the wafer and formed into a disc shape.

[0072] The heating plate (1) is formed of an inorganic ceramic material having thermal conductivity.

[0073] More specifically, the heating plate (1) is formed of aluminum nitride (AlN) or silicon dioxide (SiO2).

[0074] Through this, thermal stress can be minimized while achieving rapid heat diffusion and uniform temperature distribution, and data reliability can be enhanced by maintaining consistent test conditions.

[0075] In addition, dimensional changes are minimized during heating and cooling, and accordingly, the dimensions such as the diameter and thickness of the heater (100) can be maintained at a constant level even during repeated thermal cycles.

[0076] In addition, since the heating plate (1) maintains its mechanical strength without creep occurring even at high temperatures, structural deformation such as bending or warping does not occur even with long-term use, and accordingly, the flatness of the heater (100) is permanently maintained, ensuring complete contact with the wafer and allowing for uniform heat transfer.

[0077] A heating wire (2) is formed on one side of the heating plate (1), and when power is applied, it generates heat to heat the heating plate (1).

[0078] The heating element (2) can be formed by printing a heating paste of silver (Ag) and palladium (Pd) using a print screen method and then curing it.

[0079] Through this, it is possible to implement complex heat patterns such as spiral, zigzag, or those with different densities by zone, achieve a uniform temperature distribution across the entire wafer, or precisely simulate the heat patterns of an actual HBM wafer.

[0080] At this time, an insulating layer (11) may be formed on the surface of the heating plate (1) on which the heating wire (2) is formed through a ceramic melt coating or physical vapor deposition (PVD) method.

[0081] By doing so, electrical contact between the heating wire (2) and the wafer or external environment is blocked to improve safety, and the heating wire (2) is physically protected to prevent mechanical damage, wear, scratches, etc.

[0082] In addition, since the ceramic melt coating or PVD insulation layer (11) is stable even at high temperatures, insulation performance is maintained even during repeated thermal cycles and no cracks or peeling occur, and oxidation of the heating wire (2) is prevented, thereby minimizing changes in electrical resistance.

[0083] The terminal module (3) is coupled to the heating plate (1) and connects the external wires (W) and the heating wire (2).

[0084] FIG. 4 is a plan view showing a terminal module according to an embodiment of the present invention, and FIG. 5 is a left side view showing a terminal module according to an embodiment of the present invention.

[0085] Referring to FIGS. 4 and FIGS. 5, the terminal module (3) may include terminal members (31) and terminal fixing bolts (32).

[0086] The terminal members (31) are bonded to one side of the heating plate (1) and are in contact with both ends of the heating wire (2), and can be connected to external wires (W).

[0087] The terminal fixing bolts (32) pass through the terminal members (31) and are fastened to the heating plate (1), thereby fixing the terminal members (31).

[0088] At this time, the terminal members (31) may be formed from Kovar material, and the terminal fixing bolts (32) may be formed from Invar material.

[0089] Through this, the fatal problem of a heating plate (1) being damaged due to excessive thermal expansion of the general metal can be completely solved.

[0090] That is, the heating plate (1) formed from aluminum nitride (AlN) or silicon dioxide (SiO2) material has high brittleness and low strain, so if the terminal members (31) and terminal fixing bolts (32) that are bonded and joined to the heating plate (1) are made of metal materials such as nickel or copper, there is a possibility that the heating plate (1) may break due to expansion.

[0091] Accordingly, the terminal members (31) can be formed from a Kovar material, which has a coefficient of thermal expansion most similar to that of ceramic.

[0092] Additionally, since the terminal members (31) are formed from Kovar material, they are not precisely fixed to the outer surface of the heating plate (1). As a result, the operation becomes difficult due to the movement of the terminal members (31) during brazing.

[0093] Accordingly, before performing brazing, the terminal members (31) are fixed to the heating plate (1) in advance using terminal fixing bolts (32). At this time, the terminal fixing bolts (32) are formed of Invar material, which has an extremely low coefficient of thermal expansion and does not deform even with temperature changes, so that the fastening force can be maintained at a constant level.

[0094] The terminal members (31) may include a first terminal member (31A) and a second terminal member (31B).

[0095] The first terminal member (31A) is fixed to the terminal fixing bolt (32) and joined to one side of the heating plate (1) through vacuum brazing, and can be connected to one end of the heating wire (2) and connected to the first external wire (W1).

[0096] The second terminal member (31B) is fixed to the terminal fixing bolt (32) and joined to one side of the heating plate (1) through vacuum brazing, contacting the other end of the heating wire (2) and can be connected to the second external wire (W2). Additionally, the second terminal member (31B) may have a different length from the first terminal member (31A).

[0097] That is, in the present invention, the first terminal member (31A) and the second terminal member (31B) are fixed to the terminal fixing bolt (32) and joined to the heating plate (1) through vacuum brazing, so that the positional movement of the terminal members (31) during brazing is prevented and precise alignment is maintained, thereby improving the process yield.

[0098] In addition, since the two terminal members (31A, 31B) have different lengths, it is possible to clearly distinguish between the (+) and (-) poles, thereby preventing incorrect wiring and improving user convenience.

[0099] FIG. 6 is a cross-sectional view showing a terminal member according to an embodiment of the present invention.

[0100] Referring to FIGS. 4 to 6, the first terminal member (31A) and the second terminal member (31B) may each include a terminal body (311) and a connecting bar (312).

[0101] The terminal body (311) is joined to the heating plate (1) and can come into contact with the end of the heating wire (2). Additionally, a bolt through-hole (311A) through which a terminal fixing bolt (32) passes can be formed inside the terminal body (311).

[0102] The connecting bar (312) extends from the terminal body (311) and contacts the external wire (W), and may have a smaller thickness than the terminal body (311). Additionally, a wire connection hole (312A) for connection with the external wire (W) may be formed inside the connecting bar (312).

[0103] FIG. 7 is a left side view showing a disassembled state of a terminal module according to an embodiment of the present invention, FIG. 8 is a bottom view showing a cover body according to an embodiment of the present invention, FIG. 9 is a top view showing a cover body according to an embodiment of the present invention, FIG. 10 is a top view showing an upper cover according to an embodiment of the present invention, and FIG. 11 is a bottom view showing an upper cover according to an embodiment of the present invention.

[0104] Referring to FIGS. 4, 5 and 7, the terminal module (3) may further include an insulating cover (33).

[0105] The insulating cover (33) is fixed to the outer surface of the heating plate (1) through terminal fixing bolts (32) and can wrap around and protect the terminal members (31).

[0106] At this time, the insulating cover (33) can be formed from aluminum oxide (Al2O3) material.

[0107] Through this, the terminal members (31) are completely insulated so there is no risk of electric shock, and short circuits caused by contact with external conductive materials can also be prevented.

[0108] In addition, since aluminum oxide has high hardness and mechanical strength, it can firmly protect the terminal members (31) from external impact, pressure, wear, etc.

[0109] In addition, the insulating cover (33) is directly fixed to the outer surface of the heating plate (1) through terminal fixing bolts (32), so it can be firmly mounted without separate adhesive or fastening parts.

[0110] The insulating cover (33) may include a cover body (331), an upper cover (332), a lower cover (333), wire fixing members (334), upper cover fixing members (335), and lower cover fixing members (336).

[0111] Referring to FIGS. 7 to 9, the cover body (331) can be fixed in close contact with the outer surface of the heating plate (1) through terminal fixing bolts (32). Additionally, terminal members (31) can be accommodated inside the cover body (331).

[0112] At this time, terminal receiving grooves (331A) may be formed in the cover body (331).

[0113] The terminal receiving grooves (331A) can accommodate the terminal members (31) and the ends of the external wires (W).

[0114] Each of the terminal receiving grooves (331A) may include a first groove portion (331A1) and a second groove portion (331A2).

[0115] The first groove (331A1) accommodates a terminal member (31) and can be arranged parallel to the radial direction of the heating plate (1).

[0116] The second groove (331A2) accommodates an external wire (W) and extends in a direction orthogonal to the first groove (331A1) in a planar manner so as to be connected to an external space.

[0117] Through this, the terminal member (31) can be naturally arranged along the circumferential direction of the heating plate (1), thereby optimizing space utilization.

[0118] In addition, since the second groove (331A2) extends in a direction perpendicular to the first groove (331A1) on a plane, it is possible to prevent bending of the wire (W) and to prevent interference and entanglement between the wires (W).

[0119] Additionally, the cover body (331) may further have first communication holes (331B), second communication holes (331C), lower cover seating groove (331D), first fastening holes (331E), and second fastening holes (331F) formed therein.

[0120] The first communication holes (331B) are connected to the bolt penetration holes (311A), and terminal fixing bolts (32) can pass through them.

[0121] The second communication holes (331C) are connected to the wire connection holes (312A), and wire fixing members (334) can pass through them.

[0122] The lower cover seating groove (331D) is recessed to a predetermined depth from the lower surface of the cover body (331) and exposed to the outside of the heating plate (1), so that the lower cover (333) can be seated thereon.

[0123] The first fastening holes (331E) are recessed to a predetermined depth from the upper surface of the cover body (331) so that upper cover fixing members (335) can be fastened.

[0124] The second fastening holes (331F) are recessed to a predetermined depth from the lower cover seating groove (331D) so that the lower cover fixing members (336) can be fastened.

[0125] Referring to FIGS. 5, 7 and 10, the upper cover (332) can shield the upper surface of the cover body (331) by contacting the upper surface of the cover body (331) that is exposed to the outside.

[0126] At this time, the upper cover (332) may be formed with first cover communication holes (332A) that communicate with the first fastening holes (331E) and through which the upper cover fixing members (335) pass.

[0127] Referring to FIGS. 5, 7 and 11, the lower cover (333) can shield the lower surface of the cover body (331) by contacting the lower surface of the cover body (331) that is exposed to the outside.

[0128] At this time, the lower cover (333) may have second cover communication holes (333A) that communicate with the second fastening holes (331F) and through which the lower cover fixing members (336) pass.

[0129] As illustrated in FIG. 7, the wire fixing members (334) penetrate the upper cover (332), the cover body (331), and the terminal members (31) to be connected to the external wires (W), and the external wires (W) can be brought into close contact with the terminal members (31).

[0130] The upper cover fixing members (335) pass through the upper cover (332) and are fastened to the cover body (331), and the upper cover (332) can be fixed in close contact with the cover body (331).

[0131] The lower cover fixing members (336) pass through the lower cover (333) and are fastened to the cover body (331), and the lower cover (333) can be fixed in close contact with the cover body (331).

[0132] That is, the present invention has a three-layer assembly structure in which the insulating cover (33) is composed of a cover body (331), an upper cover (332), and a lower cover (333), so that assembly and disassembly are very easy, making it easy to install terminal members (31) and external wires (W) during the manufacturing process, and allowing selective access to only the necessary parts during maintenance.

[0133] In addition, the upper cover (332) and the lower cover (333) completely shield the cover body (331) from the top and bottom, so that the terminal members (31) are not exposed to the outside at all, thereby maximizing electrical safety and blocking the penetration of dust and moisture.

[0134] In addition, since each cover part (331, 332, 333) can be replaced individually, maintenance costs can be reduced by replacing only the relevant part in the event of partial damage, without having to replace the entire thing.

[0135] FIG. 12 is a diagram showing the operation process of a wire guide module according to an embodiment of the present invention.

[0136] Referring to FIG. 12, the semiconductor wafer test heater (100) may further include a wire guide module (4).

[0137] The wire guide module (4) can be detachably coupled to the outer surface of the insulation cover (33).

[0138] A part of the wire guide module (4) can hold the external wires (W) outside the insulation cover (33) to restrict the axial flow of the external wires (W). Additionally, another part of the wire guide module (4) can be configured to bend the external wires (W) to adjust the distance between the external wires (W) and the heating plate (1).

[0139] The wire guide module (4) may include a detachable bracket (41), a first clamp unit (42A), a second clamp unit (42B), and a separation distance adjustment unit (43).

[0140] The detachable bracket (41) can be detachably attached to the outer surface of the insulating cover (33).

[0141] The first clamp unit (42A) is connected to the detachable bracket (41) and can grip the external wires (W) to restrict the axial movement of the external wires (W).

[0142] Through this, the tensile force applied to the wires (W) from the outside can be blocked at the first clamp unit (42A) without being directly transmitted to the terminal members (31). This prevents damage, peeling, and cracking of the terminal joint and can maintain the reliability of the connection between the terminal members (31) and the heating plate (1) for a long period of time.

[0143] The second clamp unit (42B) is spaced apart from the first clamp unit (42A) along the longitudinal direction of the external wires (W) and can grip the external wires (W).

[0144] Through this, the wires (W) can be bent between the two clamp units (42A, 42B) to create a strain relief effect. This prevents fatigue failure of the wires (W) and extends the lifespan of the wires (W) even under repeated bending and vibration.

[0145] FIG. 13 is a left side view showing a clamp unit according to an embodiment of the present invention.

[0146] Referring to FIG. 13, the first clamp unit (42A) and the second clamp unit (42B) may each include a hinge shaft (421), a first clamp body (422) rotatably coupled to the hinge shaft (421) and covering a portion of the external wires (W), a second clamp body (423) rotatably coupled to the hinge shaft (421) and covering another portion of the external wires (W), and a clamp fixing member (424) that fixes the mutually coupled first clamp body (422) and second clamp body (423).

[0147] Additionally, the first clamp unit (42A) and the second clamp unit (42B) may each further include first elastic support protrusions (425) made of an elastic material that protrude from the inner circumference of the first clamp body (422) and support a portion of the external wires (W), and second elastic support protrusions (426) made of an elastic material that protrude from the inner circumference of the second clamp body (423) and support another portion of the external wires (W).

[0148] That is, the first elastic support protrusions (425) and the second elastic support protrusions (426) are formed of an elastic material (silicone, rubber, polyurethane, etc.) so as to gently support the external wires (W), prevent damage to the insulation of the wires (W), and stably fix the wires (W) by absorbing slight positional deviations through elastic deformation.

[0149] Additionally, the first clamp unit (42A) and the second clamp unit (42B) may each further include a first gripping part (427A) which is housed inside the first clamp body (422) and presses the external wires (W), with the pressing force automatically adjusted in correspondence with the diameter of the external wires (W), and a second gripping part (427B) which is housed inside the second clamp body (423) and presses the external wires (W), with the pressing force automatically adjusted in correspondence with the diameter of the external wires (W).

[0150] That is, since the first gripping parts (427A) and the second gripping parts (427B) have an adaptive mechanism in which the pressure is automatically adjusted in correspondence with the diameter of the external wires (W), optimal fixing force can be provided for wires (W) of various diameters without separate adjustment.

[0151] At this time, the first gripping parts (427A) and the second gripping parts (427B) may each include a gripping grip (4271) and an elastic coil (4272).

[0152] The grip (4271) is in surface contact with the outer surface of the outer wire (W) to support the outer wire (W), and can slide along the radial direction of the outer wire (W) in correspondence with the diameter of the outer wire (W).

[0153] Through this, the contact area is larger compared to point contact, so stress concentration is prevented, and the pressure applied to the wire (W) is evenly distributed, so that deformation or damage to the wire (W) sheath can be minimized.

[0154] The elastic coil (4272) elastically supports the grip (4271) toward the external wire (W) side and can adjust the pressure of the grip (4271) by being compressed or extended by the grip (4271).

[0155] Through this, the pressure can be automatically adjusted according to the change in the diameter of the wire (W). That is, the thicker the wire, the more the elastic coil (4272) is compressed to generate a large restoring force (pressure), and the thinner the wire, the less the elastic coil (4272) is compressed to generate a small pressure.

[0156] Referring to FIG. 12, the separation distance adjustment unit (43) is installed on the detachable bracket (41) to support the second clamp unit (42B), and the position of the second clamp unit (42B) can be varied to bend the external wires (W).

[0157] Through this, the user can freely adjust the distance between the external wires (W) and the heating plate (1), which allows for flexible response to various installation environments and space constraints, and optimizes the placement path of the wires (W) to prevent interference with other equipment parts. In addition, it can prevent tangling, twisting, and excessive bending of the cables.

[0158] The separation distance adjustment unit (43) may include a rotating socket (431), a length adjustment member (432), and a rotating bracket (433).

[0159] The rotating socket (431) is rotatably coupled to the detachable bracket (41) and can adjust the rotation angle of the second clamp unit (42B).

[0160] The length adjustment member (432) is coupled to the inside of the rotating socket (431) so as to be slidably movable along the longitudinal direction of the rotating socket (431), and can protrude to the outside of the rotating socket (431) or be housed inside the rotating socket (431) to adjust the position of the second clamp unit (42B).

[0161] The rotating bracket (433) supports the second clamp unit (42B) and is rotatably coupled to the end of the length adjustment member (432) to adjust the rotation angle of the second clamp unit (42B).

[0162] That is, the separation distance adjustment unit (43) is composed of a rotating socket (431), a length adjustment member (432), and a rotating bracket (433), so that the position and angle of the second clamp unit (42B) can be adjusted in three dimensions, thereby allowing the direction in which external wires (W) go out to avoid interference with surrounding equipment and to optimize the wiring path.

[0163] Hereinafter, a method for manufacturing a heater for semiconductor wafer testing according to an embodiment of the present invention (hereinafter referred to as the "method for manufacturing a heater for semiconductor wafer testing") will be described.

[0164] For reference, for the convenience of explanation, the same reference numerals used in describing the semiconductor wafer test heater are used for each component of the semiconductor wafer test heater described herein, and identical or redundant descriptions are omitted.

[0165] FIG. 14 is a flowchart showing a method for manufacturing a heater according to an embodiment of the present invention.

[0166] Referring to FIG. 14, first, an inorganic ceramic material is processed to the same specifications as a wafer to form a disc-shaped heating plate (1) (S110).

[0167] In this case, aluminum nitride (AlN) or silicon dioxide (SiO2) is selected as the inorganic ceramic material, and an appropriate material is selected considering the required heat generation characteristics, heat distribution, cost, etc.

[0168] Then, when the heating plate (1) is precisely machined to the same specifications as the wafer, a surface flattening operation is performed through double-sided lapping or polishing.

[0169] Then, when the surface leveling operation is completed, contaminants, processing residues, organic matter, etc. on the surface of the heating plate (1) are completely removed through ultrasonic cleaning, alcohol cleaning, or plasma cleaning.

[0170] Next, a heating paste mixed with silver (Ag) and palladium (Pd) is printed on one side of a heating plate (1) using a print screen method, and then cured in a sintering furnace to form a heating wire (2) (S120).

[0171] At this time, the heating paste is manufactured by mixing silver (Ag) powder and palladium (Pd) powder in an optimal ratio. Also, the pattern of the heating wire (2) can be designed in a spiral, concentric, zigzag shape, or a combination thereof, from the center of the heating plate (1) outwards.

[0172] Next, the terminal members (31) are fixed to the heating plate (1) with terminal fixing bolts (32), and then joined to the heating plate (1) through vacuum brazing to be electrically connected to the heating wire (2) (S130).

[0173] At this time, the terminal members (31) are made of Kovar material, and the terminal fixing bolts (32) are formed of Invar material.

[0174] That is, the heating plate (1) formed from aluminum nitride (AlN) or silicon dioxide (SiO2) material has high brittleness and low strain, so if the terminal members (31) and terminal fixing bolts (32) that are bonded and joined to the heating plate (1) are made of metal materials such as nickel or copper, there is a possibility that the heating plate (1) may break due to expansion.

[0175] Accordingly, the terminal members (31) are made of Kovar material, which has a coefficient of thermal expansion most similar to ceramic.

[0176] Additionally, since the terminal members (31) are formed from Kovar material, they are not precisely fixed to the outer surface of the heating plate (1). As a result, the operation becomes difficult due to the movement of the terminal members (31) during brazing.

[0177] Accordingly, before performing brazing, the terminal members (31) are fixed to the heating plate (1) in advance using terminal fixing bolts (32). At this time, the terminal fixing bolts (32) are made of Invar material, which has an extremely low coefficient of thermal expansion and does not deform even with temperature changes, thereby maintaining a constant fastening force of the terminal fixing bolts (32).

[0178] At this time, a bolt through hole (311A) through which a terminal fixing bolt (32) can pass is formed in the terminal members (31), and tap holes into which the terminal fixing bolts (32) are fastened can be formed in the heating plate (1).

[0179] Next, an insulating cover (33) that surrounds the terminal members (31) is assembled to the heating plate (1) to insulate the terminal members (31) (S140).

[0180] At this time, the insulating cover (33) is formed of aluminum oxide (Al2O3) material having excellent electrical insulation and high mechanical strength.

[0181] Next, an insulating layer (11) is formed on the surface of the heating plate (1) on which the heating wire (2) is formed by a ceramic thermal spray coating or physical vapor deposition (PVD) method (S150).

[0182] The insulating layer (11) electrically insulates the heating wire (2), mechanically protects it, and prevents oxidation.

[0183] Here, ceramic melt coating is a method of forming an insulating layer (11) by heating ceramic powder to a high temperature to make it melted or semi-melted, and then spraying it onto a heating plate (1) at high speed, and physical vapor deposition (PVD) is a method of forming an insulating layer (11) on a heating plate (1) by evaporating or ionizing a solid material by a physical method.

[0184] According to an embodiment of the present invention, by precisely processing an inorganic ceramic material (AlN or SiO2) to the same specifications as a wafer, a heating plate (1) having the same size and shape as an actual wafer can be manufactured, thereby ensuring the accuracy of the test equipment setup.

[0185] In addition, the present invention allows for the precise and reproducible formation of a heating wire (2) of a desired pattern by printing a heating paste mixed with silver (Ag) and palladium (Pd) using a print screen method, and can reduce manufacturing costs and minimize quality deviations through a process suitable for mass production.

[0186] In addition, the present invention first fixes the Koba terminal members (31) to the heating plate (1) with Invar fixing bolts (32) and then performs vacuum brazing, thereby preventing the terminal members (31) from shifting position during brazing and maintaining precise alignment, so that high-quality joining is achieved and process yield can be improved.

[0187] In addition, the present invention can ensure electrical safety by assembling an aluminum oxide insulating cover (33) to insulate the terminal members (31).

[0188] In addition, the present invention forms an insulating layer (11) on the surface of a heating plate (1) on which a heating wire (2) is formed using a ceramic fusion coating or PVD method, thereby achieving electrical insulation, mechanical protection, and oxidation prevention of the heating wire (2), and improving the overall lifespan and reliability of the heater (100).

[0189] Although embodiments of the present invention have been described in more detail with reference to the attached drawings, the present invention is not necessarily limited to these embodiments and may be modified in various ways within the scope of the technical spirit of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of protection of the present invention shall be interpreted by the claims below, and all technical spirits within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

[0190] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims set forth below. Explanation of the symbols

[0191] 100. Heater 1. Heating plate 11. Insulating layer 2. Heating element 3. Terminal Module 31. Terminal Absence 31A. First terminal component 31B. Second terminal component 311. Terminal Body 311A. Bolt through hole 312. Connecting bar 312A. Wire connection hole 32. Terminal fixing bolt 33. Insulation cover 331. Cover body 331A. Terminal receiving port 331A1. 1st Grooving 331A2. Second Home 331B. First connecting hole 331C. Second chimney hole 331D. Lower cover mounting groove 331E. First fastening hole 331F. Second fastening hole 332. Upper cover 332A. First cover connecting hole 333. Bottom cover 333A. Second cover chimney hole 334. Wire fixing member 335. Upper cover fixing member 336. Lower cover fixing member 4. Wire guide module 41. Detachable bracket 42A. First clamp unit 42B. Second clamp unit 421. Hinge shaft 422. First clamp body 423. Second clamp body 424. Clamp fixing member 425. First elastic support projection 426. Second elastic support projection 427A. 1st Grasp Part 427B. Second retention part 4271. Grip 4272. Elastic coil 43. Distance adjustment unit 431. Rotating Socket 432. Length adjustment member 433. Rotating bracket W. External wire W1. First external wire W2. Second external wire

Claims

Claim 1 A disc-shaped heating plate processed to the same specifications as a wafer; a heating wire formed on one surface of the heating plate and generating heat to heat the heating plate when power is applied; and a terminal module coupled to the heating plate and connecting the heating wire to external wires; wherein the heating plate is formed of an inorganic ceramic material having thermal conductivity, and the inorganic ceramic material is aluminum nitride (AlN) or silicon dioxide (SiO2), and the heating wire is formed by printing a heating paste composed of silver (Ag) and palladium (Pd) using a print screen method and then curing, and the terminal module comprises terminal members bonded to one surface of the heating plate, contacting both ends of the heating wire, and connected to the external wires. A semiconductor wafer test heater comprising: terminal fixing bolts that penetrate the terminal members and are fastened to the heating plate and fix the terminal members; wherein the terminal members are made of Kovar material, and the terminal fixing bolts are made of Invar or Kovar material; wherein the terminal members include: a first terminal member that is fixed to the terminal fixing bolt and is joined to one surface of the heating plate via vacuum brazing to contact one end of the heating wire and is connected to a first external wire; and a second terminal member that is fixed to the terminal fixing bolt and is joined to one surface of the heating plate via vacuum brazing to contact the other end of the heating wire, has a different length from the first terminal member, and is connected to a second external wire. Claim 2 delete Claim 3 delete

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