Processing apparatus

Abstract

(Project) Provides a processing device capable of automatically performing the operation of integrating a wafer and an annular frame through a tape. (Solution) A processing device comprises a wafer table supporting a wafer, a frame table supporting an annular frame, a first tape pressing unit having a first pressing roller for pressing a tape onto an annular frame, and a second tape pressing unit having a second pressing roller for pressing a tape of a tape-attached annular frame onto the surface or back surface of a wafer. A first heating unit is installed on either or both of the frame table and the first pressing roller, and a second heating unit is disposed on either or both of the wafer table and the second pressing roller.

Description

Technology Field

[0001] The present invention relates to a processing device that automatically performs the operation of integrating a wafer and an annular frame through a tape. Background Technology

[0002] A wafer having a device area partitioned by multiple planned division lines where multiple devices such as ICs and LSIs intersect, and an outer surplus area surrounding the device area formed on its surface, is formed to a desired thickness by grinding the back surface, then divided into individual device chips by a dicing device and a laser processing device, and each divided device chip is used in electrical devices such as mobile phones and personal computers.

[0003] Before being processed by a dicing device or a laser processing device, the wafer is placed in the opening of an annular frame having an opening for receiving the wafer and is supported on the annular frame through adhesive tape.

[0004] However, if an adhesive tape is attached to the surface or back of a wafer, there is a concern that a portion of the adhesive layer may remain on the wafer, thereby degrading the quality of the device. Therefore, the applicant has proposed a method for processing a wafer by supporting the wafer on an annular frame using a heat-press tape that does not have an adhesive layer (e.g., a thermoplastic synthetic resin tape such as a polyolefin-based or polyester-based tape) and performing processing on the wafer (e.g., see Patent Documents 1 and 2). However, there is a problem that productivity is poor because integrating the wafer and the annular frame through the heat-press tape is a manual process.

[0005] In addition, the applicant proposed a technique to facilitate the transport of a ground wafer by leaving a ring-shaped reinforcing member on the back surface corresponding to the outer surplus area, performing a predetermined processing, attaching a dicing tape to the back surface of the wafer, supporting the wafer with an annular frame, and removing the ring-shaped reinforcing member from the wafer (see, for example, Patent Document 3).

[0006] However, there is a problem that productivity is poor because it is difficult to attach tape to the back of a wafer in which a ring-shaped reinforcement is formed convexly on the back side corresponding to the outer excess area and to integrate it with an annular frame, and it is difficult to cut and remove the ring-shaped reinforcement from the wafer. Prior art literature

[0007] Patent Document 1: Japanese Published Patent Application No. 2019-201016 Patent Document 2: Japanese Published Patent Application No. 2019-201049 Patent Document 3: Japanese Published Patent Application No. 2010-62375 The problem to be solved

[0008] Accordingly, the objective of the present invention is to provide a processing device capable of automatically performing the operation of integrating a wafer and an annular frame through a tape, even in a wafer in which a ring-shaped reinforcing member is formed convexly on the back surface corresponding to the outer surplus area. means of solving the problem

[0009] According to the present invention, a processing device comprises: a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed; a wafer removal unit for removing a wafer from the wafer cassette placed on the wafer cassette table; a wafer table for supporting the wafer removed by the wafer removal unit; a frame receiving unit for receiving a plurality of annular frames having an opening formed therein for receiving the wafer; a frame removal unit for removing the annular frames from the frame receiving unit; a frame table for supporting the annular frames removed by the frame removal unit; a first tape compression unit having a first compression roller disposed above the frame table for compressing a tape onto the annular frame; a tape attachment frame conveying unit for conveying the annular frame with the tape compressed thereon to the wafer table and positioning the opening of the annular frame on the surface or back side of the wafer supported on the wafer table to place the tape-attached annular frame on the wafer table; and a tape attachment frame conveying unit for compressing the tape of the tape-attached annular frame onto the surface or back side of the wafer. A processing device is provided that comprises a second tape compression unit having a second compression roller, a frame unit removal means for removing a frame unit from a wafer table in which the tape of the tape attachment annular frame and the surface or back surface of the wafer are compressed by the second tape compression unit, and a frame cassette table on which a frame cassette accommodating the frame unit is placed, wherein a first heating unit is disposed on either or both of the frame table and the first compression roller, and a second heating unit is disposed on either or both of the wafer table and the second compression roller, and wherein the tape can selectively use either an adhesive tape having an adhesive layer attached to a sheet or a heat compression tape not having an adhesive layer on a sheet.

[0010] Preferably, the processing device further comprises a ring-shaped reinforcing member formed convexly on the back surface corresponding to the outer surplus area of ​​the wafer, a reinforcing member removal unit for cutting and removing the ring-shaped reinforcing member from the wafer of the frame unit removed by the frame unit removal means, and a ring-less unit removal means for removing the ring-less unit from which the ring-shaped reinforcing member has been removed from the reinforcing member removal unit.

[0011] Preferably, the first tape compression unit comprises a roll tape support member that supports a roll tape wound with the tape before use, a tape winding member that winds the tape after use, a tape withdrawal member that withdraws the tape from the roll tape, a first compression roller that compresses the withdrawn tape onto the annular frame, and a cutting member that cuts the tape protruding from the outer circumference of the annular frame along the annular frame.

[0012] Preferably, if the tape is a heat-press tape, the first heating unit is operated to heat either or both of the frame table and the first pressing roller to heat-press the heat-press tape onto the annular frame.

[0013] Preferably, the second tape compression unit comprises an upper chamber positioned above the wafer table, a lower chamber accommodating the wafer table, a lifting mechanism that raises the upper chamber to create a closed state in which it contacts the lower chamber and an open state in which it is separated from the lower chamber, a vacuum section that creates a vacuum in the upper chamber and the lower chamber in the closed state, and an atmospheric opening section that opens the upper chamber and the lower chamber to the atmosphere. When the tape of the tape-attached annular frame is positioned on the surface or back side of the wafer supported on the wafer table, the lifting mechanism is operated to create a vacuum in the upper chamber and the lower chamber while maintaining the closed state, and the tape of the tape-attached annular frame is compressed on the surface or back side of the wafer using the second compression roller positioned in the upper chamber.

[0014] Preferably, if the tape is a heat-press tape, the second heating unit is operated to heat either or both of the wafer table and the second pressing roller to heat-press the heat-press tape onto the surface or back surface of the wafer.

[0015] Preferably, a camera is positioned in the upper chamber of the second tape compression unit and detects whether the exposed surface of the wafer supported on the wafer table is the surface or the back surface before the tape-attached annular frame is returned.

[0016] Preferably, the camera acquires an ID written on the surface of the wafer when the exposed surface of the wafer supported on the wafer table is a surface.

[0017] Preferably, the camera detects whether the tape of the tape attachment annular frame is properly compressed on the wafer after the tape is compressed on the wafer supported on the wafer table. Effects of the invention

[0018] According to the processing apparatus of the present invention, as a tape to be adhered to an annular frame, either an adhesive tape having an adhesive layer attached to a sheet or a heat-press tape not having an adhesive layer on a sheet can be selectively used, and even in the case of a wafer having a ring-shaped reinforcing portion formed convexly on the back surface corresponding to the outer surplus area, the operation of integrating the wafer and the annular frame through the tape can be automatically performed. Brief explanation of the drawing

[0019] FIG. 1 is a perspective view of a processing device of an embodiment of the present invention. FIG. 2(a) is a perspective view of a wafer with a reinforcing part processed by the processing device shown in FIG. 1, and FIG. 2(b) is a perspective view of a wafer without a reinforcing part processed by the processing device shown in FIG. 1. FIG. 3 is a perspective view of the wafer cassette table, etc., shown in FIG. 1. FIG. 4 is a perspective view of the hand shown in FIG. 1. FIG. 5 is a perspective view of the frame receiving unit, etc., shown in FIG. 1. FIG. 6 is a perspective view of the frame table and the first tape compression unit, etc., shown in FIG. 1. FIG. 7 is a schematic diagram of the first tape compression unit shown in FIG. 1. FIG. 8 is a schematic diagram illustrating the state in which a tape is compressed on one end of an annular frame by positioning the first compression roller at the compression position. FIG. 9 is a schematic diagram illustrating the state in which the first compression roller is moved from the state shown in FIG. 8. FIG. 10 is a schematic diagram illustrating a state in which the first compression roller is further moved from the state shown in FIG. 9. FIG. 11 is an exploded perspective view of the second tape compression unit shown in FIG. 1. FIG. 12(a) is a perspective view from below showing the back surface of a wafer with a reinforcing member as shown in FIG. 2(a) being pressed against the tape of a tape-attached annular frame, and FIG. 12(b) is a perspective view from below showing the surface of a wafer with a reinforcing member as shown in FIG. 2(a) being pressed against the tape of a tape-attached annular frame. FIG. 13(a) is a perspective view from below showing the back surface of a wafer without reinforcement shown in FIG. 2(b) being pressed against the tape of a tape-attached annular frame, and FIG. 13(b) is a perspective view from below showing the surface of a wafer without reinforcement shown in FIG. 2(b) being pressed against the tape of a tape-attached annular frame. FIG. 14 is a perspective view of the reinforcement removal unit shown in FIG. 1. FIG. 15 is a schematic diagram illustrating the state of irradiating a laser beam onto the bottom of a wafer during the reinforcement removal process. FIG. 16 is a perspective view of the first lifting table of the reinforcement removal unit shown in FIG. 1. FIG. 17(a) is a perspective view of the separation part of the reinforcement removal unit shown in FIG. 1, and FIG. 17(b) is an enlarged perspective view of the support substrate shown in FIG. 17(a). FIG. 18 is a perspective view of the waste section of the reinforcement removal unit shown in FIG. 1. FIG. 19 is a schematic diagram illustrating the state of detecting the outer diameter of a table head by contacting a coma to the table head shown in FIG. 1. FIG. 20 is a schematic diagram illustrating the state in which a wafer is sucked and held by a second lifting table in the process of removing the reinforcement part. FIG. 21 is a schematic diagram illustrating the state in which the coma of the reinforcement removal unit is applied to the outer circumference of the ring-shaped reinforcement in the reinforcement removal process. FIG. 22 is a schematic diagram illustrating the state in which a reinforcement part is separated from a wafer in a reinforcement part removal process. FIG. 23 is a perspective view of the inversion mechanism of the ring-less unit ejection means shown in FIG. 1. FIG. 24 is a perspective view of the ring-less unit support and press-fit part of the ring-less unit ejection means shown in FIG. 1. FIG. 25 is a perspective view illustrating the state of carrying out a ring-less unit receiving process. Specific details for implementing the invention

[0020] Hereinafter, a processing apparatus of an embodiment of the present invention will be described with reference to the drawings.

[0021] (Processing device (2))

[0022] Referring to FIG. 1, the processing device, which is illustrated in its entirety by reference numeral 2, comprises a wafer cassette table (8) on which a wafer cassette (6) containing a plurality of wafers is placed, a wafer removal unit (10) for removing a wafer from the wafer cassette (6) placed on the wafer cassette table (8), and a wafer table (12) for supporting the wafer removed by the wafer removal unit (10).

[0023] (Wafer (4))

[0024] FIG. 2 illustrates a wafer (4) that is processed by a processing device (2). The surface (4a) of the wafer (4) shown in FIG. 2(a) has a device area (18) in which a plurality of devices (14), such as ICs and LSIs, are partitioned by grid-shaped partition lines (16), and an outer surplus area (20) surrounding the device area (18). In FIG. 2(a), the boundary (22) between the device area (18) and the outer surplus area (20) is shown as a dotted line for convenience, but in reality, there is no line showing the boundary (22). Additionally, an ID (23) for identifying the wafer (4) is assigned to the surface (4a) of the wafer (4). The ID (23) can be configured, for example, in the form of a barcode. On the back side (4b) of the wafer (4), a ring-shaped reinforcing portion (24) is formed convexly in the outer surplus area (20), and the thickness of the outer surplus area (20) is greater than the thickness of the device area (18). A cutout (26) indicating a crystal orientation is formed on the periphery edge of the wafer (4).

[0025] In addition, the wafer processed by the processing device (2) may not have a ring-shaped reinforcing portion formed on the back surface (4b'), such as the wafer (4') shown in FIG. 2(b). Also, the following description mainly describes the case of processing a wafer (4) having a reinforcing portion (24).

[0026] (Wafer cassette (6), wafer cassette table (8))

[0027] As illustrated in FIG. 3, a wafer cassette (6) accommodates a plurality of wafers (4) spaced apart in the vertical direction with the surface (4a) or back surface (4b) facing upward. The wafer cassette table (8) of the present embodiment has a top plate (28) on which the wafer cassette (6) is placed and a support plate (30) that supports the top plate (28). Additionally, the top plate (28) may be movable, and a lifting means may be installed to raise the top plate (28) to position it at any height.

[0028] (Wafer outflow unit (10))

[0029] Referring to FIG. 3, the wafer ejection unit (10) is equipped with a Y-axis movable member (32) movable in the Y-axis direction, indicated by the arrow (Y) in FIG. 3, and a Y-axis transfer mechanism (34) that moves the Y-axis movable member (32) in the Y-axis direction. The Y-axis transfer mechanism (34) has a ball screw (36) connected to the lower end of the Y-axis movable member (32) and extending in the Y-axis direction, and a motor (38) that rotates the ball screw (36). The Y-axis transfer mechanism (34) converts the rotational motion of the motor (38) into linear motion by the ball screw (36) and transmits it to the Y-axis movable member (32), and moves the Y-axis movable member (32) in the Y-axis direction along a pair of guide rails (40) that extend in the Y-axis direction.

[0030] In addition, the X-axis direction, indicated by the arrow (X) in FIG. 3, is a direction orthogonal to the Y-axis direction, and the Z-axis direction, indicated by the arrow (Z) in FIG. 3, is an up-and-down direction orthogonal to the X-axis direction and the Y-axis direction. The XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

[0031] As shown in FIG. 3, the wafer ejection unit (10) of the present embodiment comprises a return arm (42) and a hand (44) disposed at the tip of the return arm (42) and supporting the surface (4a) or back surface (4b) of a wafer (4) contained in a wafer cassette (6) to reverse the front and back of the wafer (4). The return arm (42) is installed on the upper surface of a Y-axis movable member (32) and is driven by a suitable driving source (not shown), such as an air driving source or an electric driving source. This driving source drives the return arm (42) to position the hand (44) at any position in each of the X-axis, Y-axis, and Z-axis directions, and reverses the hand (44) up and down.

[0032] Referring to FIG. 4, the hand (44) is preferably a Bernoulli pad that supports the wafer (4) non-contactually by generating negative pressure through the ejection of air. The hand (44) of this embodiment is generally C-shaped, and a plurality of air outlets (46) connected to a compressed air supply source (not shown) are formed on one side of the hand (44). A plurality of guide pins (48) are installed at intervals in the circumferential direction on the outer circumferential edge of the hand (44). Each guide pin (48) is configured to be movable in the diameter direction of the hand (44).

[0033] As illustrated in FIGS. 3 and 4, the wafer ejection unit (10) positions the hand (44) on the lower side of the wafer (4) in the wafer cassette (6) placed on the wafer cassette table (8), then blows compressed air from the air outlet (46) of the hand (44) to create negative pressure on the lower side of the hand (44) by the Bernoulli effect, and the wafer (4) is sucked and supported from the lower side by the hand (44) in a non-contact manner. The horizontal movement of the wafer (4) sucked and supported by the hand (44) is regulated by each guide pin (48). Then, the wafer ejection unit (10) ejects the wafer (4) sucked and supported by the hand (44) from the wafer cassette (6) by moving the Y-axis movable member (32) and the transport arm (42).

[0034] (Cut-off detection unit (50) of wafer outflow unit (10))

[0035] The wafer ejection unit (10) of the present embodiment is equipped with a cut detection unit (50) that detects the position of the cut (26) of the wafer (4), as shown in FIG. 4. The cut detection unit (50) may be configured to include, for example, a light-emitting element (52) and a light-receiving element (54) spaced apart from each other in the vertical direction, and a driving source (not shown) that rotates at least one of the guide pin (48) of the hand (44).

[0036] The light-emitting element (52) and the light-receiving element (54) can be installed on the Y-axis movable member (32) or the transport path via a suitable bracket (not shown). Additionally, when the guide pin (48) is rotated by the driving source, the wafer (4) held by the hand (44) is rotated due to the rotation of the guide pin (48). In order to reliably transmit rotation from the guide pin (48) to the wafer (4), it is suitable for the outer surface of the guide pin (48) that is rotated by the driving source to be formed of suitable synthetic rubber.

[0037] The cut detection unit (50) can detect the position of the cut (26) by rotating the wafer (4) through the guide pin (48) as a driving source while the wafer (4) is supported by suction by the hand (44) and the outer circumference of the wafer (4) is positioned between the light-emitting element (52) and the light-receiving element (54). By doing so, it becomes possible to adjust the orientation of the wafer (4) to any direction.

[0038] (Wafer table (12))

[0039] As illustrated in FIG. 3, the wafer table (12) is positioned adjacent to the wafer ejection unit (10). The wafer table (12) of the present embodiment has a wafer support member (56) that supports a wafer (4) and a frame support member (58) that is positioned on the outer circumference of the wafer support member (56) and supports an annular frame (64) (see FIG. 5) described later. A plurality of suction holes (60) are formed on the upper surface of the wafer support member (56), and each suction hole (60) is connected to a suction means (not shown).

[0040] When the hand (44) is inverted 180° to reverse the front and back of the wafer (4) and the wafer (4) is placed on the wafer table (12), the wafer (4) is supported by the wafer support member (56). Additionally, after the wafer table (12) supports the wafer (4) by the wafer support member (56), it operates the suction means to generate suction force in each suction hole (60) and holds the wafer (4) in suction.

[0041] Additionally, when a wafer (4) is supported on a wafer table (12), the surface (4a) of the wafer (4) may face downward, or the back surface (4b) of the wafer (4) may face downward. However, when the back surface (4b) of a wafer (4) having a ring-shaped reinforcing member (24) on the back surface (4b) is supported on the wafer table (12) with the back surface (4b) facing downward, an annular concave portion (62) capable of accommodating the ring-shaped reinforcing member (24) is installed on the upper surface of the wafer table (12). Then, when the wafer (4) is placed on the wafer table (12), the reinforcing member (24) is accommodated in the annular concave portion (62), and the portion inside the reinforcing member (24) on the back surface (4b) of the wafer (4) comes into contact with the upper surface of the wafer table (12).

[0042] Referring to FIG. 5, the processing device (2) also includes a frame receiving unit (66) that receives a plurality of annular frames (64) having an opening (64a) formed therein for receiving a wafer (4), a frame receiving unit (68) that receives annular frames (64) from the frame receiving unit (66), and a frame table (70) that supports the annular frames (64) received by the frame receiving unit (68).

[0043] (Frame receiving unit (66))

[0044] As illustrated in FIG. 5, the frame receiving unit (66) of the present embodiment comprises a housing (72), a lifting plate (74) positioned to be vertically movable within the housing (72), and a lifting means (not shown) for lifting the lifting plate (74).

[0045] In FIG. 5, a Z-axis guide member (78) extending in the Z-axis direction is disposed on the inner side of the housing (72) in the X-axis direction. A lifting plate (74) is supported so as to be vertically movable on the Z-axis guide member (78), and a lifting means for lifting the lifting plate (74) is disposed inside the Z-axis guide member (78). The lifting means may be configured, for example, to have a ball screw connected to the lifting plate (74) and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0046] In FIG. 5, a door (76) with a handle (76a) is installed on the front side of the housing (72) in the X-axis direction, and in the frame receiving unit (66), an annular frame (64) can be received inside the housing (72) by opening the door (76) by gripping the handle (76a). In addition, an opening (80) is installed at the top of the housing (72).

[0047] As shown in FIG. 5, the annular frame (64) is stacked and received on the upper surface of the lifting plate (74) inside the housing (72). Among the stacked multiple annular frames (64), the uppermost annular frame (64) is removed from the opening (80) of the housing (72) by the frame removal unit (68). Additionally, when the annular frame (64) is removed from the opening (80), the frame receiving unit (66) appropriately raises the lifting plate (74) by means of a lifting means to position the uppermost annular frame (64) at a position where it can be removed by the frame removal unit (68).

[0048] (Frame removal unit (68))

[0049] Referring to FIG. 5, the explanation continues as follows: the frame ejection unit (68) includes an X-axis guide member (82) that is fixed to a suitable bracket (not shown) and extends in the X-axis direction, an X-axis movable member (84) supported by the X-axis guide member (82) so as to be movable in the X-axis direction, an X-axis transfer mechanism (not shown) that moves the X-axis movable member (84) in the X-axis direction, a Z-axis movable member (86) supported by the X-axis movable member (84) so ​​as to be movable in the Z-axis direction, and a Z-axis transfer mechanism (not shown) that moves the Z-axis movable member (86) in the Z-axis direction.

[0050] The X-axis transfer mechanism of the frame removal unit (68) is preferably configured to have a ball screw connected to an X-axis movable member (84) and extending in the X-axis direction, and a motor that rotates the ball screw, and the Z-axis transfer mechanism is preferably configured to have a ball screw connected to a Z-axis movable member (86) and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0051] The Z-axis movable member (86) of the frame ejection unit (68) has a holding member (88) that holds the annular frame (64). The holding member (88) of the present embodiment has a rectangular substrate (90) and a plurality of suction pads (92) installed on the lower surface of the substrate (90), and each suction pad (92) is connected to a suction means (not shown).

[0052] The frame removal unit (68) holds the uppermost annular frame (64) held in the frame receiving unit (66) by suctioning it with the suction pad (92) of the holding unit (88), and then removes the uppermost annular frame (64) held by suction from the frame receiving unit (66) by moving the X-axis movable member (84) and the Z-axis movable member (86).

[0053] (Frame table (70))

[0054] As shown in FIG. 5, the frame table (70) is supported by a Z-axis guide member (94) so ​​as to be vertically movable. A suitable driving source (e.g., an air driving source or an electric driving source) for raising and lowering the frame table (70) is installed on the Z-axis guide member (94).

[0055] As illustrated in FIGS. 1 and 5, the processing device (2) comprises: a first tape pressing unit (98) (see FIG. 1) having a first pressing roller (110) positioned above a frame table (70) to press a tape (96) onto an annular frame (64); a tape-attached frame conveying unit (100) (see FIG. 5) that conveys the annular frame (64) (hereinafter referred to as "tape-attached annular frame (64')" with the tape (96) pressed onto it to a wafer table (12), positions the opening (64a) of the annular frame (64) on the surface (4a) or back surface (4b) of a wafer (4) supported on the wafer table (12), and places the tape-attached annular frame (64') onto the wafer table (12); and the tape (96) of the tape-attached annular frame (64') on the surface (4a) or It includes a second tape compression unit (102) (see FIG. 1) equipped with a second compression roller (174) that compresses on the back side (4b).

[0056] (First tape compression unit (98))

[0057] Referring to FIG. 6, the first tape compression unit (98) of the present embodiment comprises a roll tape support (104) that supports a roll tape (96R) on which a tape (96) before use is wound, a tape winding unit (106) that winds a tape (96) that has been used, a tape withdrawal unit (108) that withdraws a tape (96) from the roll tape (96R), a first compression roller (110) that compresses the withdrawn tape (96) onto an annular frame (64), and a cutting unit (12) that cuts the tape (96) that protrudes from the outer circumference of the annular frame (64) along the annular frame (64).

[0058] (Roll tape support (104) of the first tape compression unit (98))

[0059] As illustrated in FIG. 6, the roll tape support (104) includes a support roller (114) supported by a suitable bracket (not shown) so as to be rotatable about an axis extending in the X-axis direction. The support roller (114) supports a roll tape (96R) wound in a cylindrical shape, on which a release liner (116) for protecting the compression surface of the tape (96) is attached to the compression surface of the tape (96).

[0060] (Tape winding section (106) of the first tape compression unit (98))

[0061] The tape winding unit (106) includes a winding roller (118) supported by a suitable bracket (not shown) so as to be rotatable around an axis extending in the X-axis direction, and a motor (not shown) for rotating the winding roller (1118). As shown in FIG. 6, the tape winding unit (106) winds a used tape (96) having a circular opening (120) formed in the part attached to the annular frame (64) by rotating the winding roller (118) by the motor.

[0062] (Tape extraction part (108) of the first tape compression unit (98))

[0063] Referring to FIG. 6, the tape extraction unit (108) includes an extraction roller (122) positioned below the support roller (114) of the roll tape support unit (104), a motor (not shown) that rotates the extraction roller (122), and a driven roller (124) that rotates according to the rotation of the extraction roller (122). The tape extraction unit (108) extracts the tape (96) inserted between the extraction roller (122) and the driven roller (124) from the roll tape (96R) by rotating the driven roller (124) together with the extraction roller (122) by the motor.

[0064] A release liner (116) is peeled off from the tape (96) that has passed between the pull-out roller (122) and the driven roller (124), and the peeled release liner (116) is wound by the release liner winding unit (126). The release liner winding unit (126) of this embodiment has a release liner winding roller (128) positioned above the driven roller (124) and a motor (not shown) that rotates the release liner winding roller (128). Additionally, the tape (96) from which the release liner (116) has been peeled is guided to the winding roller (118) via a pair of guide rollers (130) positioned apart from the pull-out roller (122) in the Y-axis direction.

[0065] (First compression roller (110) of the first tape compression unit (98))

[0066] Referring to FIGS. 7 and 8, the first compression roller (110) is configured to be raised and lowered by a Z-axis transfer mechanism (not shown) and is positioned at an upper standby position shown in FIG. 7 and a lower compression position shown in FIG. 8. Additionally, while positioned at the lower compression position, the first compression roller (110) is configured to be moved in the Y-axis direction by a Y-axis transfer mechanism not shown. The Y-axis transfer mechanism and the Z-axis transfer mechanism may be composed of a suitable driving source (e.g., an air driving source or an electric driving source).

[0067] (Cutting part (112) of the first tape compression unit (98))

[0068] As illustrated in FIG. 6, the cutting section (112) includes a Z-axis guide member (134) that is fixed to a suitable bracket (not shown) and extends in the Z-axis direction, a Z-axis movable member (136) that is supported by the Z-axis guide member (134) so ​​as to be movable in the Z-axis direction, and a Z-axis transfer mechanism (not shown) that moves the Z-axis movable member (136) in the Z-axis direction. The Z-axis transfer mechanism of the cutting section (112) may be configured to have a ball screw connected to the Z-axis movable member (136) and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0069] Additionally, the cutting section (112) includes a motor (138) fixed to the lower end of the front end of the Z-axis movable member (136) and a arm (140) that is rotated by the motor (138) around an axis extending in the Z-axis direction. On the lower surface of the arm (140), first and second lower sections (142a, 142b) are installed at a distance from each other. A circular cutter (144) is supported on the first lower section (142a) so as to be rotatable around an axis perpendicular to the Z-axis direction, and a pressing roller (146) is supported on the second lower section (142b) so as to be rotatable around an axis perpendicular to the Z-axis direction.

[0070] (Tape (96))

[0071] The tape (96) may be an adhesive tape having an adhesive layer (glue layer) attached to one side of a sheet, or a heat-press tape in which no adhesive layer is attached to the sheet. The heat-press tape is a tape made of a thermoplastic synthetic resin (e.g., a polyolefin-based resin) and is a tape that softens or melts and exerts adhesive force when heated to a temperature near its melting point.

[0072] While a release liner (116) is attached to the compression surface (adhesive surface) of the adhesive tape, there are cases where a release liner (116) is attached to the compression surface of the heat compression tape, and cases where a release liner (116) is not attached. When a heat compression tape without a release liner (116) attached is used, the first tape compression unit (98) does not need to retrieve the release liner (116), so it may not be provided with a release liner winding unit (126).

[0073] In the case where the tape (96) is a heat-press tape, a first heating unit (not shown) is placed on either or both of the frame table (70) or the first pressing roller (110), and when the heat-press tape is pressed on the annular frame (64), either or both of the frame table (70) or the first pressing roller (110) is heated to a temperature near the melting point of the heat-press tape.

[0074] When the tape (96) is compressed onto the annular frame (64) by the first tape compression unit (98), first, before the annular frame (64) is placed on the frame table (70), the frame table (70) is lowered to position the frame table (70) at a position where the annular frame (64) can be received (e.g., the position shown in FIG. 6), and at the same time, the first compression roller (110) is positioned at an upper standby position (e.g., the position shown in FIG. 6).

[0075] Additionally, the tape (96) is drawn out from the roll tape (96R), and the tape (96) from which the release liner (116) has been peeled off is placed above the frame table (70) in a taut state without being loose. Also, if the tape (96) is an adhesive tape, the compression surface (adhesive surface) of the tape (96) placed above the frame table (70) is directed downward.

[0076] Next, when the annular frame (64) that has been removed by the frame removal unit (68) is placed on the frame table (70), the frame table (70) is positioned at the compression start position (position shown in FIG. 8), and the first compression roller (110) is positioned at the lower compression position (position shown in FIG. 8), and tension is applied to the tape (96) so that the tape (96) is compressed on one end of the annular frame (64).

[0077] Next, while pressing the tape (96) against the annular frame (64) with the first compression roller (110), the first compression roller (110) is moved in the Y-axis direction toward the other end of the annular frame (64). As a result, the tape (96) is compressed against the annular frame (64) while uniform tension is applied to the tape (96).

[0078] After the tape (96) is pressed onto the annular frame (64), the first tape pressing unit (98) lowers the Z-axis movable member (136) of the cutting part (112) by means of a Z-axis transfer mechanism, and presses the tape (96) on the annular frame (64) with the tape (96) using a cutter (144) and presses the annular frame (64) from above the tape (96) using a pressing roller (146).

[0079] Next, the arm piece (140) is rotated by the motor (138) to move the cutter (144) and the pressing roller (146) in a circle along the annular frame (64). By doing so, the tape (96) protruding from the outer circumference of the annular frame (64) can be cut along the annular frame (64).

[0080] Additionally, since the annular frame (64) is pressed from above the tape (96) by the pressing roller (146), misalignment of the annular frame (64) or the tape (96) is prevented when the tape (96) is being cut. Then, after lowering the frame table (70), the used tape (96), which has a circular opening (120) formed in the part attached to the annular frame (64), is wound by the tape winding unit (106).

[0081] (Tape attachment frame return unit (100))

[0082] As illustrated in FIG. 5, the tape attachment frame transport unit (100) includes a Y-axis guide member (148) that is fixed to a suitable bracket (not shown) and extends in the Y-axis direction, a Y-axis movable member (150) supported by the Y-axis guide member (148) so as to be movable in the Y-axis direction, a Y-axis transport mechanism (not shown) that moves the Y-axis movable member (150) in the Y-axis direction, a Z-axis movable member (152) supported by the Y-axis movable member (150) so as to be movable in the Z-axis direction, and a Z-axis transport mechanism (not shown) that moves the Z-axis movable member (152) in the Z-axis direction.

[0083] The Y-axis transfer mechanism of the tape attachment frame return unit (100) may be configured to have a ball screw connected to a Y-axis movable member (150) and extending in the Y-axis direction, and a motor that rotates the ball screw, and the Z-axis transfer mechanism may be configured to have a ball screw connected to a Z-axis movable member (152) and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0084] The Z-axis movable member (152) of the tape attachment frame return unit (100) has a holding member (154) that holds the tape attachment annular frame (64'). The holding member (154) of the present embodiment has a rectangular substrate (156) and a plurality of suction pads (158) installed on the lower surface of the substrate (156), and each suction pad (158) is connected to a suction means (not shown).

[0085] The tape attachment frame return unit (100) holds the upper surface of the tape attachment annular frame (64') supported on the frame table (70) by suctioning it with each suction pad (158) of the holding member (154), and by moving the Y-axis movable member (150) and the Z-axis movable member (152), returns the tape attachment annular frame (64') held by suctioning it with the holding member (154) from the frame table (70) to the wafer table (12), and places the tape attachment annular frame (64') on the wafer table (12) by positioning the opening (64a) of the annular frame (64) on the surface (4a) or back surface (4b) of the wafer (4) supported on the wafer table (12).

[0086] (Second tape compression unit (102))

[0087] As illustrated in FIG. 11, the second tape compression unit (102) comprises an upper chamber (160) positioned above the wafer table (12), a lower chamber (162) that accommodates the wafer table (12), a lifting mechanism (164) that raises the upper chamber (160) to create a closed state in which it contacts the lower chamber (162) and an open state in which it is separated from the lower chamber (162), a vacuum section (166) that creates a vacuum in the upper chamber (160) and the lower chamber (162) in the closed state, and an atmospheric opening section (168) that opens the upper chamber (160) and the lower chamber (162) to the atmosphere.

[0088] (Upper chamber (160) of the second tape compression unit (102), lifting mechanism (164))

[0089] As shown in FIG. 11, the upper chamber (160) of the present embodiment includes a circular top plate (170) and a cylindrical side wall (172) that hangs down from the periphery edge of the top plate (170). On the upper surface of the top plate (170), a lifting mechanism (164) that can be composed of a suitable actuator such as an air cylinder is mounted. In the receiving space defined by the lower surface of the top plate (170) and the inner circumference of the side wall (172), a second compression roller (174) for compressing the tape (96) of the tape-attached annular frame (64') on the surface (4a) or back surface (4b) of the wafer (4) supported on the wafer table (12), a support piece (176) that rotatably supports the second compression roller (174), and a Y-axis transfer mechanism (178) that moves the support piece (176) in the Y-axis direction are arranged.

[0090] The Y-axis transfer mechanism (178) has a ball screw (180) connected to a support member (176) and extending in the Y-axis direction, and a motor (182) that rotates the ball screw (180). The Y-axis transfer mechanism (178) converts the rotational motion of the motor (182) into linear motion by the ball screw (180) and transmits it to the support member (176), and moves the support member (176) along a pair of guide rails (184) extending in the Y-axis direction.

[0091] As illustrated in FIG. 11, a camera (185) is disposed in the upper chamber (160) to image a wafer (4) supported on a wafer table (12). The camera (185) images the wafer (4) on the wafer table (12) and detects whether the exposed surface (upper surface) of the wafer (4) is the surface (4a) or the back surface (4b). Additionally, if the exposed surface (upper surface) of the wafer (4) supported on the wafer table (12) is the surface (4a), the camera (185) acquires an ID (23) written on the surface (4a) of the wafer (4). Additionally, the camera (185) is configured to detect whether the tape (96) of the tape attachment annular frame (64') is properly pressed onto the wafer (4) after the tape (96) of the tape attachment annular frame (64') is pressed onto the wafer (4) supported on the wafer table (12).

[0092] (Lower chamber (162), vacuum section (166), atmospheric opening (168) of the second tape compression unit (102))

[0093] As illustrated in FIG. 11, the lower chamber (162) has a cylindrical side wall (186), the upper part of the side wall (186) is open, and the lower part of the side wall (186) is closed. A connection opening (188) is formed in the side wall (186). A vacuum section (166), which can be configured as a suitable vacuum pump, is connected to the connection opening (188) through a flow path (190). An atmospheric opening (168), which can be configured as a suitable valve to open the flow path (190) to the atmosphere, is installed in the flow path (190).

[0094] The second tape compression unit (102) lowers the upper chamber (160) by means of a lifting mechanism (164) while the tape (96) of the tape attachment annular frame (64') is positioned on the surface (4a) or back surface (4b) of the wafer (4) supported on the wafer table (12), thereby bringing the lower end of the side wall (172) of the upper chamber (160) into contact with the upper end of the side wall (186) of the lower chamber (162), thereby closing the upper chamber (160) and the lower chamber (162), and bringing the second compression roller (174) into contact with the tape attachment annular frame (64').

[0095] Next, the second tape compression unit (102) operates a vacuum pump constituting a vacuum section (166) while closing the valve constituting the atmospheric opening (168) to create a vacuum inside the upper chamber (160) and lower chamber (162), and then rolls the second compression roller (174) in the Y-axis direction with the Y-axis transfer mechanism (178) to compress the tape (96) onto the surface (4a) or back side (4b) of the wafer (4) to create a frame unit (U).

[0096] When a tape (96) is pressed against the back surface (4b) of a wafer (4) having a reinforcing member (24), a small gap is formed between the wafer (4) and the tape (96) at the bottom of the ring-shaped reinforcing member (24). However, since the wafer (4) and the tape (96) are pressed while the inside of the upper chamber (160) and the lower chamber (162) are under vacuum, the pressure in the small gap between the wafer (4) and the tape (96) is lower than atmospheric pressure. After pressing the tape (96), when the atmospheric opening (168) is opened, the tape (96) is pressed against the wafer (4) by atmospheric pressure. As a result, the gap between the wafer (4) and the tape (96) at the bottom of the reinforcing member (24) is eliminated, and the tape (96) adheres to the back surface (4b) of the wafer (4) along the bottom of the reinforcing member (24).

[0097] In the case where the tape (96) is a heat-press tape, a second heating unit (not shown) is placed on either or both of the wafer table (12) or the second pressing roller (174), and when the wafer (4) is pressed against the tape (96) of the tape-attached annular frame (64'), either or both of the wafer table (12) or the second pressing roller (174) is heated to a temperature near the melting point of the heat-press tape.

[0098] As illustrated in FIGS. 1 and 14, the processing device (2) of the present embodiment further comprises: a frame unit removal means (192) for removing a frame unit (U) from a wafer table (12) in which the tape (96) of a tape-attached annular frame (64') and the surface (4a) or back surface (4b) of a wafer (4) are compressed by a second tape compression unit (102); a reinforcement removal unit (194) for cutting and removing a ring-shaped reinforcement (24) from the wafer (4) of the frame unit (U) removed by the frame unit removal means (192); a ring-less unit removal means (196) (see FIG. 1) for removing a ring-less unit from the reinforcement removal unit (194) in which the ring-shaped reinforcement (24) has been removed; and a frame cassette (198) in which a frame cassette for receiving the ring-less unit removed by the ring-less unit removal means (196) is placed. Includes a table (200) (see FIG. 1).

[0099] (Means for removing frame units (192))

[0100] The frame unit removal means (192) of the present embodiment comprises, as shown in FIG. 14, a frame unit retaining part (202) including a wafer retaining part (202a) for retaining a wafer (4) and a frame retaining part (202b) for retaining an annular frame (64), and a conveying part (206) for conveying the frame unit retaining part (202) to a temporary placement table (204).

[0101] (Frame unit maintenance part (202) of the frame unit removal means (192))

[0102] The wafer holding portion (202a) of the frame unit holding portion (202) includes a circular substrate (208) and a circular suction piece (210) mounted on the lower surface of the substrate (208). A plurality of suction holes (not shown) are formed on the lower surface of the suction piece (210), and each suction hole is connected to a suction means (not shown). The frame holding portion (202b) includes a plurality of protruding pieces (212) (four in this embodiment) that protrude outward in the diameter direction at intervals in the circumferential direction from the periphery edge of the substrate (208) of the wafer holding portion (202a), and a suction pad (214) attached to the lower surface of the protruding pieces (212), and each suction pad (214) is connected to a suction means (not shown).

[0103] (Return portion (206) of the frame unit outbound means (192))

[0104] The transport unit (206) includes an X-axis guide member (216) that is fixed to a suitable bracket (not shown) and extends in the X-axis direction, an X-axis movable member (218) supported by the X-axis guide member (216) so as to be movable in the X-axis direction, an X-axis transfer mechanism (not shown) that moves the X-axis movable member (218) in the X-axis direction, a Z-axis movable member (220) supported by the X-axis movable member (218) so as to be movable in the Z-axis direction, a Z-axis transfer mechanism (not shown) that moves the Z-axis movable member (220) in the Z-axis direction, a Y-axis movable member (222) supported by the Z-axis movable member (220) so as to be movable in the Y-axis direction, and a Y-axis transfer mechanism (not shown) that moves the Y-axis movable member (222) in the Y-axis direction. A substrate (208) of a wafer holding unit (202a) is connected to the tip of the Y-axis movable member (222). Each of the X-axis, Y-axis, and Z-axis transfer mechanisms of the return unit (206) may be configured to have a ball screw and a motor that rotates the ball screw.

[0105] The frame unit removal means (192) preferably comprises a two-dimensional movement mechanism that moves the frame unit holding part (202) in a two-dimensional horizontal direction and an imaging part (224) that captures the outer circumference of the wafer (4) of the frame unit (U) held in the frame unit holding part (202). In this embodiment, the frame unit holding part (202) is configured to move in a two-dimensional horizontal direction in the XY plane by means of the X-axis transfer mechanism and the Y-axis transfer mechanism of the transport part (206), and the two-dimensional movement mechanism is configured by the transport part (206). In addition, the imaging part (224) of this embodiment is positioned between the wafer table (12) and the temporary placement table (204) and is configured to capture the outer circumference of the wafer (4) of the frame unit (U) held in the frame unit holding part (202) from below the wafer (4).

[0106] The frame unit ejection means (192) ejects the frame unit (U) held by the frame unit holding part (202) from the wafer table (12) by operating the return part (206) while the wafer (4) is sucked and held by the suction piece (210) of the wafer holding part (202a) and the annular frame (64) is sucked and held by the suction pad (214) of the frame holding part (202b).

[0107] In addition, the frame unit removal means (192) of the present embodiment operates a transport unit (206) constituting a two-dimensional movement mechanism to capture at least three points on the outer circumference of the wafer (4) of the frame unit (U) held by the frame unit holding unit (202) using an imaging unit (224), thereby measuring the coordinates of at least three points on the outer circumference of the wafer (4), and obtains the center coordinates of the wafer (4) based on the measured coordinates of the three points. Then, the frame unit removal means (192) aligns the center of the wafer (4) with the center of the temporary placement table (204) and temporarily places the frame unit (U) on the temporary placement table (204).

[0108] (Temporary batch table (204))

[0109] As shown in FIG. 14, the temporary placement table (204) is spaced apart from the wafer table (12) in the X-axis direction. The temporary placement table (204) is equipped with a heater (not shown), and it is preferable that the tape (96) of the frame unit (U) temporarily placed on the temporary placement table (204) is heated by the heater to soften the tape (96), thereby further pressing the tape (96) against the base of the ring-shaped reinforcing part (24) by atmospheric pressure.

[0110] (Temporary batch table return section (232))

[0111] The processing device (2) of the present embodiment includes a temporary placement table conveying unit (232) that conveys a temporary placement table (204) in the Y-axis direction. The temporary placement table conveying unit (232) comprises a Y-axis guide member (234) extending in the Y-axis direction, a Y-axis movable member (236) supported by the Y-axis guide member (234) so ​​as to be movable in the Y-axis direction, and a Y-axis transfer mechanism (238) that moves the Y-axis movable member (236) in the Y-axis direction. The temporary placement table (204) is fixed to the upper part of the Y-axis movable member (236). The Y-axis transfer mechanism (238) has a ball screw (240) connected to the Y-axis movable member (236) and extending in the Y-axis direction, and a motor (242) that rotates the ball screw (240). And, the temporary placement table return unit (232) converts the rotational motion of the motor (242) into linear motion by means of the ball screw (240) and transmits it to the Y-axis movable member (236), and returns the temporary placement table (204) in the Y-axis direction together with the Y-axis movable member (236).

[0112] (Reinforcement part removal unit (194))

[0113] As illustrated in FIGS. 1 and FIGS. 14, the reinforcement removal unit (194) comprises a laser beam irradiation unit (244) that irradiates a laser beam toward the base of a ring-shaped reinforcement (24) formed on the outer circumference of a wafer (4) to form a cutting groove, a first lifting table (246) (see FIG. 1) that holds and raises a frame unit (U) temporarily placed on a temporary placement table (204) and moves it in the X-axis direction to position it on the laser beam irradiation unit (244), and a separation unit (248) that separates the ring-shaped reinforcement (244) from the cutting groove.

[0114] (Laser beam irradiation unit (244) of the reinforcement removal unit (194))

[0115] As illustrated in FIG. 14, the laser beam irradiation unit (244) comprises a housing (250) positioned adjacent to a temporary placement table (204) in the X-axis direction, a laser oscillator (not shown) housed in the housing (250) and emitting a laser, a condenser (252) that concentrates the laser beam emitted by the laser oscillator and irradiates it onto the base of a ring-shaped reinforcing part (24) formed on the outer circumference of a wafer (4), a suction nozzle (254) that sucks up debris generated when the laser beam is irradiated onto the wafer (4), and a suction means (not shown) connected to the suction nozzle (254).

[0116] The concentrator (252) is extended upward from the upper surface of the housing (250) at an angle toward the suction nozzle (254), thereby preventing debris generated during laser beam irradiation from falling onto the concentrator (252). Additionally, the suction nozzle (254) is extended upward from the upper surface of the housing (250) at an angle toward the concentrator (252).

[0117] As shown in FIG. 15, the laser beam irradiation unit (244) rotates the frame unit (U) held by the first lifting table (246) and irradiates a laser beam (LB) toward the bottom of the ring-shaped reinforcement (24) formed on the outer circumference of the wafer (4) to form a ring-shaped cutting groove (256) along the bottom of the reinforcement (24) by ablation processing. Additionally, the laser beam irradiation unit (244) sucks up debris generated by ablation processing by the suction nozzle (254).

[0118] (First lifting table (246) of the reinforcement removal unit (194))

[0119] As illustrated in FIG. 1, the first lifting table (246) is positioned above the temporary placement table (204) so ​​as to be movable in the X-axis direction and also movable in the Z-axis direction. Referring to FIG. 16, the first lifting table (246) includes an X-axis guide member (258) that is fixed to a suitable bracket (not shown) and extends in the X-axis direction, an X-axis movable member (260) supported by the X-axis guide member (258) so as to be movable in the X-axis direction, an X-axis transfer mechanism (not shown) that moves the X-axis movable member (260) in the X-axis direction, a Z-axis movable member (262) supported by the X-axis movable member (260) so as to be movable in the Z-axis direction, and a Z-axis transfer mechanism (not shown) that moves the Z-axis movable member (262) in the Z-axis direction. Each of the X-axis and Z-axis transfer mechanisms of the first lifting table (246) may be configured to have a ball screw and a motor that rotates the ball screw.

[0120] A support shaft (264) extending downward is rotatably supported on the lower end of the front end of the Z-axis movable member (262), and a motor (266) that rotates the support shaft (264) around an axis extending in the Z-axis direction is mounted on the upper end of the front end of the Z-axis movable member (262). A circular suction piece (268) is fixed to the lower end of the support shaft (264). On the lower surface of the suction piece (268), a plurality of suction holes (not shown) are formed at intervals in the circumferential direction on a circumference corresponding to the size of the annular frame (64), and each suction hole is connected to a suction means.

[0121] The first lifting table (246) holds the annular frame (64) portion of the frame unit (U) by suctioning it with the suction piece (268), and then moves the Z-axis movable member (262) and the X-axis movable member (260) to raise the frame unit (U) held by suctioning it with the suction piece (268) and move it in the X-axis direction to position it at the laser beam irradiation unit (244). Additionally, if the annular frame (64) is formed of a magnetic material, an electromagnet (not shown) may be installed on the lower surface of the suction piece (268) so that the suction piece (268) attracts the annular frame (64) by magnetic force.

[0122] Additionally, the first lifting table (246) operates the motor (266) to rotate the frame unit (U) held in place by suction with the suction piece (268) when the laser beam (LB) is irradiated onto the wafer (4) by the laser beam irradiation unit (244). Additionally, the first lifting table (246) moves the frame unit (U), in which a cutting groove (256) is formed at the base of the reinforcing part (24), in the X-axis and Z-axis directions and temporarily places it on the temporary placement table (204).

[0123] (Separation part (248) of the reinforcement removal unit (194))

[0124] As shown in FIG. 1, the separation section (248) is positioned at a distance in the Y-axis direction from the first lifting table (246) in the operating range in the Y-axis direction of the temporary placement table (204). Referring to FIGS. 17 and 18, the separation unit (248) comprises an ultraviolet irradiation unit (270) (see FIG. 17) that reduces the adhesive strength of the tape (96) by irradiating ultraviolet rays onto the tape (96) corresponding to the cutting groove (256), a second lifting table (272) (see FIG. 17) that maintains suction on the inside of the wafer (4) by exposing the ring-shaped reinforcing unit (24) to the outer circumference, a separator (274) (see FIG. 17) that separates the ring-shaped reinforcing unit (24) by applying a coma (402) having a wedge portion to the outer circumference of the ring-shaped reinforcing unit (24), and a disposal unit (276) (see FIG. 18) where the separated ring-shaped reinforcing unit (24) is disposed of.

[0125] As illustrated in FIG. 17, the separating part (248) of the present embodiment includes a Z-axis guide member (278) that is fixed to a suitable bracket (not shown) and extends in the Z-axis direction, a Z-axis movable member (280) that is supported by the Z-axis guide member (278) so as to be movable in the Z-axis direction, and a lifting means (not shown) that moves the Z-axis movable member (280) in the Z-axis direction. The lifting means may be configured to have a ball screw connected to the Z-axis movable member (280) and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0126] A support piece (282) is supported on the lower end of the front end of the Z-axis movable member (280), and a second lifting table (272) is rotatably supported thereon. A motor (284) for rotating the second lifting table (272) is mounted on the upper end of the front end of the Z-axis movable member (280). In this embodiment, a pair of the above-mentioned ultraviolet irradiation units (270) are installed on the support piece (282) at a distance in the Y-axis direction.

[0127] The second lifting table (272) has a support shaft (286) extending downward from the lower end of the front end of the Z-axis movable member (280), and a circular table head (287) detachably mounted on the lower end of the support shaft (286). A plurality of suction holes (not shown) are formed on the lower surface of the table head (287), and each suction hole is connected to a suction means.

[0128] The table head (287) has an outer diameter corresponding to the inner diameter of the reinforcing portion (24) of the wafer (4). Specifically, the diameter of the table head (287) is slightly smaller than the diameter of the device area (18) of the wafer (4). Additionally, the table head (287) is detachably mounted on a support shaft (286) and is interchangeable according to the diameter of the wafer (4). The support shaft (286) on which the table head (287) is mounted is connected to the lifting means of the separation portion (248) through a Z-axis movable member (280). Thus, the second lifting table (272) includes two or more types of table heads (287) having an outer diameter corresponding to the inner diameter of the reinforcing portion (24) of the wafer (4), and the table head (287) is detachably mounted to the lifting means of the separation portion (248).

[0129] Additionally, the separator (274) is mounted on the support member (282). The separator (274) includes a pair of movable members (288) spaced apart on the lower surface of the support member (282) and movably arranged in the longitudinal direction of the support member (282), a pair of transfer means (290) for moving the pair of movable members (288), a pair of support substrates (400) supported so as to be vertically movable on each movable member (288), and a pair of Z-axis transfer mechanisms (294) for moving the pair of support substrates (400) up and down in the Z-axis direction. Each of the pair of transfer means (290) and the Z-axis transfer mechanisms (294) may be composed of a suitable actuator, such as an air cylinder or an electric cylinder.

[0130] Referring to FIG. 17, the upper surface of each support substrate (400) is equipped with a coma (402) having a wedge portion, a frame support portion (404) that supports an annular frame (64), and an ionizer (406) that removes static electricity from the frame unit (U).

[0131] The coma (402) has an inverted frustum shape with a diameter that gradually decreases from the top to the bottom, and a wedge portion is formed by the upper surface (402a) of the coma (402) and the side surface (402b) of the coma (402). The comas (402) are arranged in pairs spaced apart from each other on the upper surface of each support substrate (400) and are also supported on the support substrate (400) so as to be rotatable about an axis line extending in the Z-axis direction.

[0132] A pair of frame support members (404) are arranged adjacent to the coma (402) on the upper surface of each support substrate (400). The frame support members (404) have a housing (404a) fixed to the support substrate (400) and a sphere (404b) rotatably supported in the housing (404a). In the frame support members (404), each sphere (404b) is configured to support an annular frame (64).

[0133] The ionizer (406) is positioned adjacent to the coma (402). The ionizer (406) is configured to remove static electricity from the frame unit (U) by spraying ionizing air toward the frame unit (U).

[0134] The separation unit (248) of the present embodiment is equipped with a detection means (not shown) for detecting whether the type of table head (287) input to a control unit (not shown) that controls the operation of the processing device (2) matches the type of table head (287) actually mounted on the processing device (2).

[0135] The control unit is composed of a computer having a central processing unit (CPU) that performs calculations according to a control program, a read-only memory (ROM) that stores the control program, etc., and a read-and-write random access memory (RAM) that stores calculation results, etc. Processing conditions, such as the diameter of the wafer (4), the width of the reinforcing part (24), and the outer diameter of the table head (287), are input to the control unit by an operator.

[0136] The detection means of the present embodiment includes a coma (402) of the separator (274) and a transfer means (290) that moves the coma (402) closer to and further away from the table head (287) by operating a movable piece (288). In the detection means, before starting the processing of the wafer (4), the movable piece (288) is operated by the transfer means (290) to contact the coma (402) of the separator (274) with the outer circumference of the table head (287) as shown in FIG. 19, and the outer diameter of the table head (287) obtained from this contact is detected to match the outer diameter of the table head (287) input to the control unit. If the two do not match, an error notification (e.g., an indication of non-match on a control panel (not shown)) is made.

[0137] Even if the diameter of the wafer (4) is, for example, 200 mm, the width of the ring-shaped reinforcing part (24) may differ from 3 mm, 5 mm, etc. For this reason, the processing device (2) needs to be equipped with a table head (287) corresponding to the device area (18) of the wafer (4). If the type of table head (287) input to the control unit does not match the type of table head (287) actually mounted, the ring-shaped reinforcing part (24) cannot be properly removed from the wafer (4).

[0138] In this aspect, the processing device (2) of the present embodiment is equipped with a detection means for detecting whether the type of table head (287) input to the control unit matches the type of table head (287) actually mounted on the processing device (2), so that before starting the processing of the wafer (4), it is possible to check whether an appropriate table head (287) corresponding to the wafer (4) is mounted, and the ring-shaped reinforcing part (24) can be appropriately removed from the wafer (4) during the processing of the wafer (4).

[0139] Referring to FIG. 18, the waste disposal unit (276) includes a belt conveyor (300) that transports a separated ring-shaped reinforcing member (24) and a dust box (302) that receives the ring-shaped reinforcing member (24) transported by the belt conveyor (300). The belt conveyor (300) is positioned by an actuator (not shown) suitable for a recovery position that extends substantially horizontally (a position shown by a solid line in FIG. 18) and a standby position that extends substantially vertically (a position shown by a dashed line in FIG. 18).

[0140] In FIG. 18, a door (304) with a handle (304a) is installed on the front side of the dust box (302) in the X-axis direction. Inside the dust box (302), a crusher (not shown) for crushing the recovered ring-shaped reinforcing part (24) is installed. In the dust box (302), the crushed debris of the ring-shaped reinforcing part (24) contained in the dust box (302) can be extracted by gripping the handle (304a) and opening the door (304).

[0141] When a temporary placement table (204), on which a frame unit (U) having a cutting groove (256) formed at the base of a reinforcing member (24) is temporarily placed, is positioned below the separation member (248) by the temporary placement table return unit (232), the separation member (248) exposes the ring-shaped reinforcing member (24) to the outer circumference as shown in FIG. 20 and holds the inner side of the wafer (4) by suction using the second lifting table (272). Subsequently, the support substrate (400) is moved by the Z-axis transfer mechanism (294) while moving the movable member (288) by the transfer means (290), and the coma (402) having a wedge portion is applied to the outer circumference of the ring-shaped reinforcing member (24) as shown in FIG. 21. Specifically, the wedge portion of the coma (402) is positioned between the tape (96) and the reinforcing member (24). In addition, the lower surface of the annular frame (64) is brought into contact with the sphere (404b) of the frame support member (404), and the annular frame (64) is supported by the sphere (404b).

[0142] Next, ultraviolet rays are irradiated from a pair of ultraviolet irradiation units (270) to reduce the adhesive force of the tape (96) attached to the ring-shaped reinforcing member (24), and the frame unit (U) is rotated by the motor (284) together with the second lifting table (272) relative to the separator (274). As a result, the tape (96) with reduced adhesive force and the reinforcing member (24) are separated by the wedge portion of the coma (402), so the ring-shaped reinforcing member (24) can be separated from the frame unit (U) as shown in FIG. 22. The separated reinforcing member (24) is returned to the dust box (302) by the belt conveyor (300) and recovered. Additionally, when separating the reinforcing member (24), the separator (274) may be rotated relative to the frame unit (U).

[0143] Additionally, when separating the reinforcing part (24), ionizing air is sprayed from the ionizer (406) toward the frame unit (U). As a result, even if static electricity is generated due to the contact of the coma (402) with the tape (96) and the reinforcing part (24), the static electricity is removed by the ionizing air sprayed from the ionizer (406). Because of this, the tape (96) and the reinforcing part (24) are not attracted to each other by static electricity, so the reinforcing part (24) is reliably separated from the frame unit (U).

[0144] Additionally, when separating the reinforcing part (24), the coma (402) acting on the frame unit (U) rotates in accordance with the relative rotation of the frame unit (U) and the separator (274), and the sphere (404b) in contact with the lower surface of the annular frame (64) rotates, so the relative rotation of the frame unit (U) and the separator (274) is performed smoothly.

[0145] (Method for removing a ring-less unit (196))

[0146] As shown in FIG. 1, the ring-less unit removal means (196) is positioned adjacent to the reinforcement removal unit (194). Referring to FIGS. 23 and 24, the ring-less unit ejection means (196) of the present embodiment comprises a frame retaining part (306) that holds an annular frame (64) facing a ring-less unit supported on a second lifting table (272), an inversion mechanism (308) (see FIG. 23) that inverts the frame retaining part (306) while moving toward a frame cassette table (200), a ring-less unit support part (310) (see FIG. 24) that supports the ring-less unit inverted by the inversion mechanism (308), and a press-fitting part (312) (see FIG. 24) that inserts and receives the ring-less unit supported by the ring-less unit support part (310) into a frame cassette (198) placed on a cassette table (200).

[0147] (Reversal mechanism (308) of the ring-less unit removal means (196))

[0148] As illustrated in FIG. 23, the inversion mechanism (308) includes a Y-axis guide member (314) extending in the Y-axis direction, a Y-axis movable member (316) supported by the Y-axis guide member (314) so ​​as to be movable in the Y-axis direction, a Y-axis transfer mechanism (not shown) for moving the Y-axis movable member (316) in the Y-axis direction, an arm (318) supported by the Y-axis movable member (316) so as to be movable in the Z-axis direction, and a Z-axis transfer mechanism (not shown) for moving the arm (318) in the Z-axis direction. Each of the Y-axis and Z-axis transfer mechanisms of the inversion mechanism (308) may be configured to have a ball screw and a motor that rotates the ball screw.

[0149] The arm (318) is equipped with a motor (320) that inverts the frame holding member (306) up and down, and supports the frame holding member (306) so that it can be inverted up and down. The frame holding member (306) of this embodiment includes a substrate (324) that is rotatably supported on the arm (318) via a pair of rotation shafts (322), and a plurality of suction pads (326) attached to one side of the substrate (324), and each suction pad (326) is connected to a suction means (not shown). Additionally, one of the rotation shafts (322) is connected to the motor (320).

[0150] The inversion mechanism (308) holds the lower surface of the annular frame (64) of the ringless unit (U') supported on the second lifting table (272) with the suction pad (326) facing upward, and receives the ringless unit (U') from the second lifting table (272). Additionally, the inversion mechanism (308) moves the ringless unit (U') held by the frame holding part (306) by the motor (320) and then moves the Y-axis movable member (316) toward the frame cassette table (200).

[0151] (Ringless unit support (310) of the ringless unit removal means (196))

[0152] As illustrated in FIG. 24, the ring-less unit support (310) of the present embodiment comprises a pair of support plates (328) supported so as to be movable in the X-axis direction through a suitable bracket (not shown) and a spacing adjustment means (not shown) for adjusting the spacing of the pair of support plates (328) in the X-axis direction. The spacing adjustment means may be composed of a suitable actuator such as an air cylinder or an electric cylinder.

[0153] A pair of support plates (328) supporting the ring-less unit (U') are equipped with a heater (not shown). When the spacing between the pair of support plates (328) is narrowed, the pair of support plates (328) heat the tape (96) of the ring-less unit (U') by the heater, thereby straightening out the stretching and wrinkling of the tape (96) caused by the removal of the reinforcing part (24).

[0154] (Press-in part (312) of the ring-less unit release means (196))

[0155] Referring to FIG. 24, the press-fit section (312) of the present embodiment includes a Y-axis guide member (330) extending in the Y-axis direction, a Y-axis movable member (332) supported by the Y-axis guide member (330) so as to be movable in the Y-axis direction, and a Y-axis transfer mechanism (not shown) for moving the Y-axis movable member (332) in the Y-axis direction. The Y-axis movable member (332) has a base (334) supported by the Y-axis guide member (330), a support (336) extending upward from the upper surface of the base (334), and a compression piece (338) attached to the upper end of the support (336). The Y-axis transfer mechanism of the press-fit section (312) may be configured to have a ball screw connected to the Y-axis movable member (332) and extending in the Y-axis direction, and a motor that rotates the ball screw.

[0156] As illustrated in FIG. 25, the ringless unit support member (310) widens the gap between a pair of support plates (328) using a gap adjustment means before receiving the ringless unit (U'), and then receives the ringless unit (U') held on the suction pad (326). Then, when the ringless unit support member (310) receives the ringless unit (U'), the press-fit member (312) moves the Y-axis movable member (332) in the Y-axis direction by means of a Y-axis transfer mechanism, thereby allowing the ringless unit (U') supported by the ringless unit support member (310) to be inserted into the frame cassette (198) placed on the frame cassette table (200) by means of a compression piece (338) and received.

[0157] (Frame cassette (198), frame cassette table (200))

[0158] In the frame cassette (198) illustrated in FIGS. 1 and 25, a plurality of ring-less units (U') (frame units (U) in the case of a wafer (4') without a reinforcement) are accommodated at intervals in the vertical direction. As illustrated in FIGS. 24 and 25, the frame cassette table (200) includes a mounting section (340) on which the frame cassette (198) is mounted, and a lifting section (342) for raising and lowering the mounting section (340) to position it at an arbitrary height. The lifting section (342) may be configured to have a ball screw connected to the mounting section (340) and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0159] Next, a processing method is described in which a tape (96) is pressed onto a wafer (4) in which a ring-shaped reinforcing member (24) is formed convexly on the back surface (4b) corresponding to the outer surplus area (20) using the processing device (2) described above, to form an integral with an annular frame (64), and the ring-shaped reinforcing member (24) is cut and removed from the wafer (4).

[0160] (Wafer cassette placement process)

[0161] In this embodiment, first, as shown in FIGS. 1 and 3, a wafer cassette placement process is performed in which a wafer cassette (6) containing a plurality of wafers (4) is placed on a wafer cassette table (8). In the wafer cassette (6) of this embodiment, a plurality of wafers (4) are placed at intervals in the vertical direction.

[0162] (Frame acceptance process)

[0163] In addition, as shown in FIGS. 1 and 5, a frame receiving process is performed in which a ring-shaped annular frame (64) having an opening (64a) for receiving a wafer (4) is received in a frame receiving unit (66). The frame receiving process may be performed before the wafer cassette placement process or after the wafer cassette placement process.

[0164] In the frame receiving process, the lifting plate (74) of the frame receiving unit (66) is lowered to an arbitrary position, the door (76) is opened by grasping the handle (76a), and a plurality of annular frames (64) are stacked and received on the upper surface of the lifting plate (74). Additionally, the height of the lifting plate (74) is appropriately adjusted so that the uppermost annular frame (64) is positioned at a location where it can be removed by the frame removal unit (68).

[0165] (Wafer Outbound Process)

[0166] After performing the wafer cassette placement process and the frame acceptance process, a wafer removal process is performed to remove a wafer (4) from the wafer cassette (6) placed on the wafer cassette table (8).

[0167] Referring to FIG. 3, in the wafer removal process, first, the Y-axis transfer mechanism (34) of the wafer removal unit (10) is operated to position the Y-axis movable member (32) near the wafer cassette table (8). Next, the return arm (42) is driven to position the hand (44), with the air outlet (46) facing upward, on the lower side of the wafer (4) inside the wafer cassette (6). When the hand (44) is positioned on the lower side of the wafer (4), a gap is formed between the lower side of the wafer (4) and the hand (44), and each guide pin (48) is positioned outward in the radial direction.

[0168] Next, compressed air is ejected from the air outlet (46) of the hand (44) to create negative pressure on the lower side of the hand (44) by the Bernoulli effect, and the wafer (4) is sucked and supported from the lower side by the hand (44) in a non-contact manner. Next, each guide pin (48) is moved inward in the radial direction to restrict the horizontal movement of the wafer (4) sucked and supported by the hand (44) by each guide pin (48). Then, the Y-axis movable member (32) and the transport arm (42) of the wafer ejection unit (10) are moved to eject the wafer (4) sucked and supported by the hand (44) from the wafer cassette (6).

[0169] (Separation detection process)

[0170] After performing the wafer removal process, it is preferable to perform a cut detection process to detect the position of the cut (26) of the wafer (4). In the cut detection process, as shown in FIG. 4, the outer circumference of the wafer (4) that is suctioned and supported by the hand (44) is positioned between the light-emitting element (52) and the light-receiving element (54) of the cut detection unit (50). Subsequently, the position of the cut (26) of the wafer (4) is detected by rotating the wafer (4) through the guide pin (48) using a driving source. By doing so, it becomes possible to adjust the direction of the wafer (4) to any direction.

[0171] (Wafer support process)

[0172] After performing the cut detection process, a wafer support process is performed to support the wafer (4) removed by the wafer removal unit (10) onto the wafer table (12).

[0173] Referring to FIG. 3, in the wafer support process, first, the hand (44) of the wafer ejection unit (10) is inverted vertically. Next, the Y-axis movable member (32) and the return arm (42) of the wafer ejection unit (10) are moved to bring the wafer (4) sucked and supported by the hand (44) into contact with the wafer support portion (56) of the wafer table (12). At this time, the surface (4a) of the wafer (4) may face downward, or the back surface (4b) of the wafer (4) may face downward. When the back surface (4b), on which the ring-shaped reinforcing portion (24) is installed, faces downward, the ring-shaped reinforcing portion (24) is received in the annular concave portion (62) of the wafer table (12).

[0174] Next, the suction means of the wafer table (12) is operated to generate suction force in each suction hole (60), thereby maintaining the wafer (4) in suction. Next, the suction support of the wafer (4) by the hand (44) is released, and the hand (44) is moved away from the wafer table (12). In this way, the wafer (4) is transferred from the wafer discharge unit (10) to the wafer table (12). Since the wafer (4) transferred to the wafer table (12) is maintained in suction by each suction hole (60), the position of the wafer (4) does not become misaligned.

[0175] After transferring the wafer (4) to the wafer table (12), the wafer (4) on the wafer table (12) is captured from above by a camera (185) (see FIG. 11) positioned in the upper chamber (160). By doing so, it is possible to detect whether the exposed surface (upper surface) of the wafer (4) is the surface (4a) or the back surface (4b), and to determine whether the surface to be exposed is facing upward or not. If the surface to be exposed of the wafer (4) is not facing upward, this is indicated on a control panel (not shown). Additionally, if the exposed surface of the wafer (4) is the surface (4a), the ID (23) written on the surface (4a) of the wafer (4) can be obtained from the image captured by the camera (185).

[0176] (Frame removal process)

[0177] In addition, after performing the wafer cassette placement process and the frame receiving process, a frame removal process is performed to remove the annular frame (64) from the frame receiving unit (66) in parallel with the wafer removal process or the wafer support process.

[0178] Referring to FIG. 5, in the frame removal process, first, the X-axis movable member (84) and the Z-axis movable member (86) of the frame removal unit (68) are moved to bring the suction pad (92) of the holding unit (88) into contact with the upper surface of the uppermost annular frame (64) that is received in the frame receiving unit (66). Next, the suction means of the frame removal unit (68) is operated to generate a suction force on the suction pad (92), thereby suctioning and holding the uppermost annular frame (64) with the suction pad (92). Then, the X-axis movable member (84) and the Z-axis movable member (86) of the frame removal unit (68) are moved to remove the uppermost annular frame (64) that has been suctioned and held by the suction pad (92) of the holding unit (88) from the frame receiving unit (66).

[0179] (Frame support process)

[0180] After performing the frame removal process, a frame support process is performed to support the annular frame (64) removed by the frame removal unit (68) onto the frame table (70).

[0181] Referring to FIG. 5, the explanation continues as follows: In the frame support process, first, the X-axis movable member (84) and the Z-axis movable member (86) of the frame release unit (68) are moved, and the annular frame (64), which is held by suction with the suction pad (92), is brought into contact with the upper surface of the frame table (70). At this time, the frame table (70) is positioned so that the annular frame (64) can be received. Next, the suction force of the suction pad (92) of the frame release unit (68) is released, and the annular frame (64) is placed on the frame table (70). Then, the X-axis movable member (84) and the Z-axis movable member (86) of the frame release unit (68) are moved to separate the holding member (88) from the upper side of the frame table (70).

[0182] (1st Tape Compression Process)

[0183] After performing the frame support process, a first tape compression process is performed to compress the tape (96) onto the annular frame (64).

[0184] Referring to FIGS. 6 and 7, in the first tape compression process, first, the tape (96) is drawn out from the roll tape (96R), and the tape (96) from which the release liner (116) has been peeled is placed above the frame table (70) in a taut state without being loose. In addition, if the tape (96) is an adhesive tape, the compression surface of the tape (96) located above the frame table (70) is oriented downward.

[0185] Next, the frame table (70) is raised to the compression start position (position shown in FIG. 8), and the first compression roller (110) is lowered to the lower compression position (position shown in FIG. 8). By doing so, tension is applied to the tape (96) to compress the tape (96) onto one end of the annular frame (64).

[0186] As described above, when the frame table (70) is positioned at the compression start position and the first compression roller (110) is positioned at the lower compression position, as shown in FIG. 8, the tape (96) forms an angle (α) from the first compression roller (110) toward the lower guide roller (130).

[0187] Next, while pressing the tape (96) against the annular frame (64) with the first compression roller (110), the first compression roller (110) is moved in the Y-axis direction toward the other end of the annular frame (64). By doing so, the tape (96) can be compressed against the annular frame (64) while applying uniform tension to the tape (96).

[0188] When moving the first compression roller (110), it is desirable to maintain a constant tension applied to the tape (96) by raising the frame table (70) in synchronization with the movement of the first compression roller (110). Specifically, as shown in FIGS. 9 and 10, the frame table (70) is gradually raised in synchronization with the movement of the first compression roller (110) so that the angle of elevation (α) becomes constant.

[0189] Additionally, if the tape (96) is a heat-pressed tape, the temperature of the upper surface of the frame table (70) or the temperature of the outer surface of the first compression roller (110) is adjusted to a temperature at which the tape (96) softens or melts, and then the tape (96) can be heat-pressed onto the annular frame (64) by rolling the first compression roller (110) in the Y-axis direction while applying a constant tension to the tape (96) by the first compression roller (110). Of course, when heat-pressing the tape (96), the frame table (70) is gradually raised in synchronization with the movement of the first compression roller (110) so that the angle of elevation (α) becomes constant.

[0190] Next, the cutter (144) and the pressing roller (146) of the cutting section (112) of the first tape compression unit (98) are lowered so that the cutter (144) is pressed against the tape (96) on the annular frame (64), and the annular frame (64) is pressed from above the tape (96) with the pressing roller (146). Subsequently, the female member (140) is rotated by the motor (138) to move the cutter (144) and the pressing roller (146) in a circle along the annular frame (64). By doing so, the tape (96) that protrudes from the outer circumference of the annular frame (64) can be cut along the annular frame (64).

[0191] Additionally, since the annular frame (64) is pressed from above the tape (96) by the pressing roller (146), misalignment of the annular frame (64) or the tape (96) is prevented when the tape (96) is being cut. Furthermore, the used tape (96) having a circular opening (120) formed therein is wound by the tape winding unit (106).

[0192] (Tape Attachment Frame Return Process)

[0193] After performing the first tape compression process, the tape (96) is compressed into an annular frame (64) and then the tape-attached annular frame (64) is compressed and then the opening (64a) of the annular frame (64) is positioned on the surface (4a) or back surface (4b) of the wafer (4) supported on the wafer table (12), and the tape-attached annular frame (64') is placed on the wafer table (12), and the tape-attached frame is then transferred to the wafer table (12).

[0194] In the tape attachment frame return process, first, the frame table (70) is lowered to a position where the tape attachment annular frame (64') can be removed by the tape attachment frame return unit (100). Next, the Y-axis movable member (150) and the Z-axis movable member (152) of the tape attachment frame return unit (100) (see FIG. 5) are moved to bring the suction pads (158) of the holding part (154) of the tape attachment frame return unit (100) into contact with the upper surface of the tape attachment annular frame (64') (see FIG. 11) supported on the frame table (70).

[0195] Next, the suction means of the tape attachment frame return unit (100) is operated to generate suction force on the suction pad (158), thereby suctioning and holding the upper surface of the tape attachment annular frame (64') onto the suction pad (158). Then, the Y-axis movable member (150) and the Z-axis movable member (152) of the tape attachment frame return unit (100) are moved to remove the tape attachment annular frame (64') that has been suctioned and held onto the suction pad (158) from the frame table (70).

[0196] Next, the tape-attached annular frame (64'), which is held in place by suction by the suction pad (158) of the tape-attached frame return unit (100), is returned to the wafer table (12). Then, as shown in FIG. 11, the opening (64a) of the annular frame (64) is positioned on the wafer (4) supported on the wafer table (12) to bring the tape-attached annular frame (64') into contact with the frame support (58) of the wafer table (12). At this time, the compression surface of the tape (96) of the tape-attached annular frame (64') is facing downward. In addition, in this embodiment, as shown in FIG. 11, the back surface (4b) of the wafer (4) faces upward and is in contact with the compression surface of the tape (96).

[0197] Next, the suction force of the suction pad (158) of the tape attachment frame return unit (100) is released, and the tape attachment annular frame (64') is placed on the frame support (58) of the wafer table (12). Then, the Y-axis movable member (150) and the Z-axis movable member (152) of the tape attachment frame return unit (100) are moved to separate the holding member (154) from the upper side of the wafer table (12).

[0198] (2nd tape crimping process)

[0199] After performing the tape attachment frame return process, a second tape compression process is performed to compress the tape (96) of the tape attachment annular frame (64') onto the surface (4a) or back surface (4b) of the wafer (4).

[0200] Referring to FIG. 11, in the second tape compression process, the upper chamber (160) is first lowered by the lifting mechanism (164) of the second tape compression unit (102) so that the lower end of the side wall (172) of the upper chamber (160) comes into contact with the upper end of the side wall (186) of the lower chamber (162). By doing so, the upper chamber (160) and the lower chamber (162) are closed, and the second compression roller (174) comes into contact with the tape attachment annular frame (64'). In this way, the upper end of the ring-shaped reinforcement (24) of the wafer (4) is attached to the compression surface of the tape (96) of the tape attachment annular frame (64').

[0201] Next, with the atmospheric opening (168) of the second tape compression unit (102) closed, the vacuum unit (166) is operated to create a vacuum inside the upper chamber (160) and the lower chamber (162). Subsequently, the tape (96) is compressed onto the wafer (4) by rolling the second compression roller (174) of the second tape compression unit (102) in the Y-axis direction. By doing so, a frame unit (U) formed by compressing the wafer (4) and the tape (96) can be created. Subsequently, the atmospheric opening (168) is opened, and the tape (96) is pressed against the wafer (4) along the base of the ring-shaped reinforcement (24) by atmospheric pressure. Then, the upper chamber (160) is raised by the lifting mechanism (164).

[0202] If the tape (96) is a heat-press tape, the tape (96) can be heat-pressed onto the wafer (4) by rolling the second compression roller (174) after adjusting the temperature of the upper surface of the wafer table (12) or the temperature of the outer surface of the second compression roller (174) to a temperature at which the tape (96) softens or melts.

[0203] If a frame unit (U) is created by compressing the tape (96) of the tape-attached annular frame (64') and the wafer (4), it is desirable to capture the frame unit (U) using a camera (185) placed in the upper chamber (160) and to detect whether the tape (96) is properly compressed on the wafer (4). If the wafer (4) (e.g., the bottom of the reinforcing part (24)) and the tape (96) are not in close contact and there is a gap between the wafer (4) and the tape (96), processing by the processing device (2) is stopped. By doing so, in the subsequent process, when the wafer (4) is diced onto the device chip of each device (14), it is possible to suppress the occurrence of defects in the device (14).

[0204] Meanwhile, in this embodiment, as shown in FIG. 12(a), the tape (96) of the tape-attached annular frame (64') is pressed onto the back surface (4b) of the wafer (4) having a ring-shaped reinforcing part (24), but as shown in FIG. 12(b), the tape (96) may be pressed onto the surface (4a) of the wafer (4).

[0205] In addition, as illustrated in FIG. 13(a) and FIG. 13(b), when the tape (96) of the tape-attached annular frame (64') is pressed onto a wafer (4') without a reinforcing member, the surface on which the tape (96) of the tape-attached annular frame (64') is pressed may be either the surface (4a') or the back surface (4b') of the wafer (4').

[0206] For reference, if a tape (96) is pressed onto the surface (4a, 4a') of a wafer (4, 4'), in a subsequent process, cutting processing can be performed from the back side (4b, 4b') of the wafer (4, 4') using a cutting blade, and high-quality processing can be achieved for a wafer of a material (e.g., SiC wafer) for which processing from the back side is preferred due to its crystal structure.

[0207] In addition, when a tape (96) is pressed onto the surface (4a, 4a') of the wafer (4, 4'), there is an advantage when performing laser processing on the wafer (4). Specifically, when performing ablation processing by irradiating the wafer (4, 4') with a laser beam of a wavelength that is absorbent to the wafer (4, 4') from the back side (4b, 4b'), the device (14) on the surface (4a, 4a') is prevented from being contaminated by debris. In addition, when performing processing on the inside of the wafer (4, 4') by positioning a point of focus of a laser beam of a wavelength that is transmittable to the wafer (4, 4') from the back side (4b, 4b') and irradiating the laser beam onto the wafer (4, 4'), processing can be performed without being affected by the device (14).

[0208] When applying tape (96) to wafers (4, 4') (especially, surfaces (4a, 4a')), it is preferable to use a heat-press tape that does not leave an adhesive layer.

[0209] (Frame Unit Removal Process)

[0210] After performing the second tape compression process, a frame unit removal process is performed to remove the frame unit (U), in which the tape (96) of the tape-attached annular frame (64') and the surface (4a) or back surface (4b) of the wafer (4) are compressed, from the wafer table (12).

[0211] Referring to FIG. 5, in the frame unit removal process, first, the conveyor (206) of the frame unit removal means (192) is operated to bring the lower surface of the suction piece (210) of the wafer holding part (202a) of the frame unit holding part (202) into contact with the wafer (4) through the tape (96), and at the same time, the suction pad (214) of the frame holding part (202b) is brought into contact with the annular frame (64).

[0212] Next, suction force is generated on the suction piece (210) of the wafer holding section (202a) and the suction pad (214) of the frame holding section (202b), thereby suctioning and holding the wafer (4) with the suction piece (210) of the wafer holding section (202a), and simultaneously suctioning and holding the annular frame (64) with the suction pad (214) of the frame holding section (202b). Next, the suction holding of the wafer (4) by the wafer table (12) is released. Then, the return section (206) is operated to remove the frame unit (U) held by the frame unit holding section (202) from the wafer table (12).

[0213] (Temporary batch process)

[0214] After performing the frame unit removal process, the center of the wafer (4) is aligned with the center of the temporary placement table (204), and a temporary placement process is performed to temporarily place the frame unit (U) on the temporary placement table (204). However, regarding the wafer (4') without a reinforcement as shown in FIG. 2(b), the temporary placement process and the reinforcement removal process described later are not performed, and the frame unit (U) removed from the wafer table (12) is received in the frame cassette (198).

[0215] Referring to FIG. 14, in the temporary placement process, first, the frame unit (U) held by the frame unit holding unit (202) is positioned on the upper side of the imaging unit (224). Next, the transport unit (206), which constitutes the two-dimensional movement mechanism of the frame unit ejection means (192), is operated to image at least three points on the outer circumference of the wafer (4) of the frame unit (U) held by the frame unit holding unit (202) with the imaging unit (224). By doing so, the coordinates of at least three points on the outer circumference of the wafer (4) are measured. Subsequently, the center coordinates of the wafer (4) are determined based on the coordinates of the three measured points.

[0216] Next, the return unit (206) is operated to position the center of the wafer (4) at the center of the temporary placement table (204), and the frame unit (U) is brought into contact with the upper surface of the temporary placement table (204). Next, the suction holding of the wafer (4) by the wafer holding unit (202a) is released, and the suction holding of the annular frame (64) by the frame holding unit (202b) is released, and the frame unit (U) is transferred to the temporary placement table (204) from the frame unit discharge means (192).

[0217] Next, the heater of the temporary placement table (204) is operated to heat the tape (96) of the frame unit (U) temporarily placed on the temporary placement table (204) by the heater. As a result, the tape (96) is softened and adheres to the bottom of the ring-shaped reinforcement (24) of the wafer (4).

[0218] (Reinforcement part removal process)

[0219] After performing a temporary placement process, a reinforcement removal process is performed in which a ring-shaped reinforcement (24) is cut and removed from the wafer (4) of the frame unit (U) that has been removed by the frame unit removal means (192).

[0220] Referring to FIGS. 1, 14 and 16, in the reinforcement removal process, first, the X-axis movable member (260) and the Z-axis movable member (262) of the first lifting table (246) of the reinforcement removal unit (194) are moved to bring the lower surface of the suction piece (268) into contact with the upper surface of the annular frame (64) of the frame unit (U) temporarily placed on the temporary placement table (204). Subsequently, suction force is generated in each suction hole of the suction piece (268) of the first lifting table (246) to suction and maintain the annular frame (64) of the frame unit (U).

[0221] Next, the X-axis movable member (260) and Z-axis movable member (262) of the first lifting table (246) are operated to position the frame unit (U), which is held by suction with the suction piece (268) as shown in FIG. 15, above the laser beam irradiation unit (244). Next, the point of concentration of the laser beam (LB) is positioned at the bottom of the ring-shaped reinforcement (24) of the wafer (4) of the frame unit (U). In addition, in FIG. 15, the tape (96) is pressed against the back side (4b) of the wafer (4) where the reinforcement (24) is installed, but the tape (96) may also be pressed against the surface (4a) of the wafer (4).

[0222] Next, while rotating the suction piece (268) and the frame unit (U) by the motor (266) of the first lifting table (246), a laser beam (LB) is irradiated onto the base of the ring-shaped reinforcement (24) of the wafer (4). By doing so, an ablation process is performed on the base of the ring-shaped reinforcement (24) of the wafer (4), thereby forming a ring-shaped cutting groove (256). Additionally, when irradiating the laser beam (LB) onto the wafer (4), the suction means of the laser beam irradiation unit (244) is operated to generate a suction force on the suction nozzle (254), and the debris generated by the ablation process is sucked in by the suction nozzle (254).

[0223] Next, the X-axis movable member (260) and Z-axis movable member (262) of the first lifting table (246) are moved to bring the frame unit (U), which is held by suction by the suction piece (268), into contact with the upper surface of the temporary placement table (204). Next, the suction force of the suction piece (268) of the first lifting table (246) is released, and the frame unit (U) is transferred from the first lifting table (246) to the temporary placement table (204).

[0224] Next, the temporary placement table (204) that received the frame unit (U) is positioned below the separation section (248) of the reinforcement removal unit (194) by the temporary placement table return section (232) (see FIG. 14). At this time, the belt conveyor (300) of the waste section (276) is positioned in a standby position. Subsequently, the second lifting table (272) of the separation section (248) is lowered so that the lower surface of the second lifting table (272) comes into contact with the tape (96) of the inner part of the wafer (4). Next, a suction force is generated on the lower surface of the second lifting table (272) so that the inner part of the frame unit (U) is sucked and held by the table head (287) of the second lifting table (272) with the ring-shaped reinforcement (24) exposed to the outer circumference as shown in FIG. 20.

[0225] Next, the second lifting table (272) holding the wafer (4) of the frame unit (U) is raised to separate the frame unit (U) from the temporary placement table (204), and the temporary placement table (204) is moved downwards by the first lifting table (246). Then, the movable piece (288) is moved by the transfer means (290), and the support substrate (400) is moved by the Z-axis transfer mechanism (294). As shown in FIG. 21, the coma (402) having a wedge portion is applied to the outer circumference of the ring-shaped reinforcement (24), and the wedge portion of the coma (402) is positioned between the tape (96) and the reinforcement (24), and the annular frame (64) is supported by the sphere (404b) of the frame support portion (404). In addition, the belt conveyor (300) of the waste disposal unit (276) is moved from the waiting position to the recovery position.

[0226] Next, ultraviolet rays are irradiated from a pair of ultraviolet irradiation units (270) to reduce the adhesive force of the tape (96) attached to the ring-shaped reinforcing member (24), and the frame unit (U) is rotated by the motor (284) together with the second lifting table (272) relative to the separator (274). Additionally, ionized air is sprayed from the ionizer (406) toward the frame unit (U). As a result, as shown in FIG. 22, the ring-shaped reinforcing member (24) can be separated from the frame unit (U), and static electricity generated when separating the reinforcing member (24) does not remain on the frame unit (U). The reinforcing member (24) that has fallen from the frame unit (U) is returned to the dust box (302) by the belt conveyor (300) and recovered. Additionally, when separating the reinforcing part (24), the separator (274) may be rotated relative to the frame unit (U).

[0227] (Ringless unit removal process)

[0228] After performing the reinforcement removal process, a ring-less unit removal process is performed to remove the ring-less unit (U') from the reinforcement removal unit (194) in which the ring-shaped reinforcement (24) has been removed.

[0229] In the ring-less unit removal process, first, the belt conveyor (300) of the waste section (276) of the reinforcement removal unit (194) is positioned from the recovery position to the waiting position. Next, the frame holding section (306) of the inversion mechanism (308) (see FIG. 23) of the ring-less unit removal means (196) is positioned below the ring-less unit (U') that is held in place by suction on the second lifting table (272).

[0230] Next, the arm (318) is raised so that the suction pad (326) of the frame retainer (306) is facing upward, and the suction pad (326) of the frame retainer (306) is brought into contact with the lower side of the annular frame (64) of the ringless unit (U') supported on the second lifting table (272).

[0231] Next, a suction force is generated on the suction pad (326) of the frame retaining part (306) to suction and hold the annular frame (64) of the ringless unit (U') with the suction pad (326). Next, the suction holding of the ringless unit (U') by the second lifting table (272) is released. By doing so, the ringless unit (U') is transferred from the second lifting table (272) of the reinforcement part removal unit (194) to the frame retaining part (306) of the ringless unit removal means (196).

[0232] (Ringless unit acceptance process)

[0233] After performing the ring-less unit removal process, a ring-less unit receiving process is performed to receive the ring-less unit (U') removed by the ring-less unit removal means (196).

[0234] In the process of receiving a ring-less unit, first, the inversion mechanism (308) of the ring-less unit ejection means (196) is inverted vertically, and the ring-less unit (U') that has been sucked and held by the frame holding part (306) is inverted vertically. As a result, the ring-less unit (U') is positioned below the frame holding part (306).

[0235] Next, the Y-axis movable member (316) and arm (318) of the inversion mechanism (308) are moved to bring the ringless unit (U') into contact with the upper surface of a pair of support plates (328) of the ringless unit support part (310). At this time, the gap between the pair of support plates (328) is narrowed by the gap adjustment means, and the pair of support plates (328) are in close contact with each other. Next, the suction holding of the ringless unit (U') by the frame holding part (306) is released, and the ringless unit (U') is placed on the pair of support plates (328). Next, the heaters mounted on each support plate (328) are operated to heat the tape (96) of the ringless unit (U'), thereby straightening the bending and wrinkles of the tape (96) caused by the removal of the reinforcing part (24). Then, the ring-less unit (U') is again sucked up and held in the frame holding part (306) to raise it.

[0236] Next, the gap between a pair of support plates (328) is widened by a gap adjustment means, and a ringless unit (U') is placed on the upper surface of the support plate (328). Then, as shown in FIG. 25, the ringless unit (U') supported on the ringless unit support part (310) is pressed by the pressing piece (338) of the press part (312), and is inserted into and received in the frame cassette (198) placed on the frame cassette table (200).

[0237] As described above, in the processing device (2) of the present embodiment, even if the wafer (4) has a ring-shaped reinforcing part (24) formed convexly on the back side (4b) corresponding to the outer surplus area (20), the operation of integrating the wafer (4) and the annular frame (64) through the tape (96) can be performed automatically, and the ring-shaped reinforcing part (24) can be automatically cut and removed from the wafer (4).

[0238] In addition, although the present embodiment mainly describes the case where the ring-shaped reinforcement (24) is removed, in the case of a wafer (4') without reinforcement, since there is no need to remove the reinforcement, the processing device (2) can be used without using the reinforcement removal unit (194) and the ring-less unit removal means (196). Explanation of the symbols

[0239] 2: Processing device 4: Wafer with reinforcement 4a: Surface of a wafer with reinforcement 4b: Back side of wafer with reinforcement 4': Wafer without reinforcement 4a': Surface of a wafer without reinforcement 4b': Back side of a wafer without reinforcement 6: Wafer Cassette 8: Wafer Cassette Table 10: Wafer Removal Unit 12: Wafer table 20: Outsourcing Surplus Area 24: Reinforcement part 64: Circular frame 64a: opening 64': Tape-attached circular frame 66: Frame receiving unit 68: Frame Export Unit 70: Frame table 96: Tape 96R: Roll tape 98: 1st tape crimping unit 100: Tape Attachment Frame Return Unit 102: Second tape crimping unit 104: Roll tape support 106: Tape winding unit 108: Tape Pull-out 110: 1st compression roller 112: Severing section 160: Upper chamber 162: Lower chamber 164: Elevator 166: Vacuum section 168: Atmospheric Opening 174: Second compression roller 185: Camera U: Frame Unit U': Unit without a ring 192: Means of removing frame units 194: Reinforcement removal unit 196: Means of exporting ring-less units 198: Frame Cassette 200: Frame Cassette Table

Claims

Claim 1 A processing device comprising: a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed; a wafer removal unit for removing a wafer from the wafer cassette placed on the wafer cassette table; a wafer table for supporting the wafer removed by the wafer removal unit; a frame receiving unit for receiving a plurality of annular frames having an opening formed to receive the wafer; a frame removal unit for removing the annular frames from the frame receiving unit; a frame table for supporting the annular frames removed by the frame removal unit; a first tape compression unit having a first compression roller disposed above the frame table for compressing a tape onto the annular frames; a tape attachment frame conveying unit for conveying the annular frames with the tape compressed thereon to the wafer table and positioning the opening of the annular frame on the surface or back side of the wafer supported on the wafer table to place the tape-attached annular frames on the wafer table; and a second compression unit for compressing the tape of the tape-attached annular frames onto the surface or back side of the wafer. A second tape compression unit equipped with a roller, a frame unit removal means for removing a frame unit from a wafer table in which the tape of the tape-attached annular frame and the surface or back surface of the wafer are compressed by the second tape compression unit, and a frame cassette table on which a frame cassette accommodating the frame unit is placed, wherein a first heating unit is disposed on either or both of the frame table and the first compression roller, and a second heating unit is disposed on either or both of the wafer table and the second compression roller, and wherein the tape can selectively use either an adhesive tape having an adhesive layer attached to a sheet or a heat compression tape not having an adhesive layer on a sheet.A processing device comprising a camera that captures an exposed surface of a wafer on which the tape of the tape-attached annular frame is compressed by the second tape compression unit, wherein the camera acquires an ID written on the surface of the wafer when the exposed surface of the wafer supported on the wafer table is a surface. Claim 2 A processing apparatus according to claim 1, wherein a ring-shaped reinforcing member is formed convexly on the back surface corresponding to the outer surplus area of ​​the wafer, a reinforcing member removal unit for cutting and removing the ring-shaped reinforcing member from the wafer of the frame unit removed by the frame unit removal means, and a ring-less unit removal means for removing the ring-less unit from which the ring-shaped reinforcing member has been removed from the reinforcing member removal unit. Claim 3 A processing device according to claim 1 or 2, wherein the first tape compression unit comprises a roll tape support portion that supports a roll tape wound with the tape before use, a tape winding portion that winds the tape after use, a tape withdrawal portion that withdraws the tape from the roll tape, a first compression roller that compresses the withdrawn tape onto the annular frame, and a cutting portion that cuts the tape protruding from the outer circumference of the annular frame along the annular frame. Claim 4 A processing device according to paragraph 3, wherein, when the tape is a heat-press tape, the first heating unit is operated to heat either or both of the frame table and the first pressing roller to heat-press the heat-press tape onto the annular frame. Claim 5 A processing device according to claim 1 or 2, wherein the second tape compression unit comprises an upper chamber disposed above the wafer table, a lower chamber accommodating the wafer table, a lifting mechanism that raises the upper chamber to create a closed state in which it contacts the lower chamber and an open state in which it is separated from the lower chamber, a vacuum section that creates a vacuum in the upper chamber and the lower chamber in the closed state, and an atmospheric opening section that opens the upper chamber and the lower chamber to the atmosphere, wherein, while the tape of the tape-attached annular frame is positioned on the surface or back surface of the wafer supported on the wafer table, the lifting mechanism is operated to create a vacuum in the upper chamber and the lower chamber while maintaining the closed state, and the tape of the tape-attached annular frame is compressed on the surface or back surface of the wafer using the second compression roller disposed in the upper chamber. Claim 6 A processing device according to claim 5, wherein, when the tape is a heat-press tape, the second heating unit is operated to heat either or both of the wafer table and the second pressing roller to heat-press the heat-press tape onto the surface or back surface of the wafer. Claim 7 A processing device according to claim 5, wherein the camera is disposed in the upper chamber of the second tape compression unit and detects whether the exposed surface of the wafer supported on the wafer table is a surface or a back surface before the tape-attached annular frame is returned. Claim 8 A processing device according to claim 1, wherein the camera detects whether the tape of the tape attachment annular frame is properly compressed on the wafer after the tape is compressed on the wafer supported on the wafer table. Claim 9 delete

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