Electronic device cooling apparatus having a dual-loop heat exchange structure

Abstract

The present invention relates to an electronic device cooling system (20). Such an electronic device cooling system (20) comprises: a case (21) that forms an exterior and is composed of upper and lower covers (22, 24); upper and lower cases (26, 28) that correspond to each other and are disposed inside the case (21); a main heat transport loop (30) that primarily cools by transporting cooling water while wrapping the exterior of the upper and lower cases (26, 28) in a coil shape; a re-cooling loop (32) disposed between the upper case (26) and the lower case (28) that secondarily cools the cooling water passing through the main heat transport loop (30); and an inlet port (31) disposed at the inlet side of the main heat transport loop (30) and the re-cooling loop (32) to share the incoming cooling water. It also includes a discharge port (33) that shares the discharged cooling water, which is positioned at the outlet side of the main heat transport loop (30) and the re-cooling loop (32).

Description

Technology Field

[0001] The present invention relates to a cooling system for effectively dissipating heat generated from electronic components, and more specifically, to a technology for a cooling system that applies a dual-loop structure combining a main heat transport loop and a re-cooling loop to efficiently handle heat generation from highly integrated electronic components such as AI chips, semiconductor chips, power devices, and server processors. Background Technology

[0002] Recently, electronic technology has been rapidly advancing, centering on the performance enhancement and increased integration of semiconductors. Following this trend, heat generation per unit area—that is, heat density—is increasing rapidly in server processors, high-performance graphics processing units (GPUs), and power devices.

[0003] If electronic components overheat above a certain temperature, their performance may degrade or they may malfunction, and in severe cases, they may suffer permanent damage. Therefore, the importance of cooling technology that effectively controls and dissipates such high heat is growing day by day.

[0004] However, conventional cooling methods that have been widely used, such as air-cooled coolers using air, flat-plate coolers with a simple structure, or water-cooled coolers based on a single channel, are facing fundamental limitations.

[0005] These conventional technologies have physical limitations on the heat transfer area where the cooling fins and the heat source (chip) come into contact, making it difficult to rapidly remove the massive amount of heat generated by current high-heat electronic components.

[0006] In particular, due to the recent increase in demand for data centers and AI computing, ultra-high power AI chips reaching 4 to 5 kW are emerging, and heat control is becoming a key challenge.

[0007] The cooling technology for these AI chips applies a micro-channel or mini-channel method as shown in Fig. 1, but has the following limitations.

[0008] First, although the microchannel method offers excellent cooling performance, the flow path is very narrow, ranging from tens to hundreds of μm, resulting in a very large pressure drop. Additionally, a high-pressure pump is essential to drive it, and there is a high risk of blockage by fine particles or erosion due to high-pressure operation. Furthermore, there are issues with a limited operating range, such as a rapid decline in performance at flow rates outside the design point.

[0009] Second, although the mini-channel method has a lower pressure drop compared to micro-channels, its cooling capacity remains at the 2-3 kW level, so it faces technical limitations in handling the thermal load of next-generation 4-5 kW high-power chips.

[0010] Third, in the case of a single-flow path, the temperature of the cooling water increases towards the latter part of the path, reducing the amount of heat absorbed; consequently, this leads to a problem where the temperature distribution across the entire chip area becomes uneven. Prior art literature

[0011] Patent Registration No. 2877725 (Title: High-efficiency IGBT stack using open-type cold plate-based immersion cooling) The problem to be solved

[0012] Accordingly, the present invention is proposed to solve the above-mentioned problem, and the objective of the present invention is to provide a cooling system that applies a dual-loop structure combining a main heat transport loop and a re-cooling loop to efficiently handle heat generation of highly integrated electronic components such as AI chips, semiconductor chips, power devices, and server processors. means of solving the problem

[0013] The present invention is proposed to solve the above-mentioned problem, and one embodiment of the present invention provides an electronic device cooling system (20).

[0014] The electronic component cooling system (20) is,

[0015] A case (21) that forms an exterior and is composed of upper and lower covers (22, 24);

[0016] Upper and lower cases (26, 28) that correspond to each other and are disposed inside the case (21);

[0017] A main heat transport loop (30) that primarily cools by transporting cooling water while wrapping the exterior of the upper and lower cases (26, 28) in a coil shape;

[0018] A re-cooling loop (32) positioned between the upper case (26) and the lower case (28) to secondarily cool the cooling water passing through the main heat transport loop (30);

[0019] An inlet port (31) that shares the incoming cooling water and is positioned at the inlet side of the main heat transport loop (30) and the re-cooling loop (32); and

[0020] It includes a discharge port (33) that shares the discharged cooling water, which is positioned at the outlet side of the main heat transport loop (30) and the re-cooling loop (32).

[0021] An electronic device cooling system (20) according to another embodiment of the present invention is,

[0022] A case (21) that forms an exterior and is composed of upper and lower covers (22, 24);

[0023] Upper and lower cases (26, 28) that correspond to each other and are disposed inside the case (21);

[0024] A main heat transport loop (30) that cools by transporting cooling water while wrapping the exterior of the upper and lower cases (26, 28) in a coil shape;

[0025] A 10th pipe body (75) connected to one side of the main heat transport loop (30) through which cooling water flows;

[0026] A first pipe body (73) connected to the other side of the main heat transport loop (30) through which cooling water flows;

[0027] An inlet port (31) that is positioned at the inlet side of the main heat transport loop (30), shares the incoming cooling water, and is connected to the 11th pipe body (73); and

[0028] It includes a discharge port (33) connected to a 10th pipe body (75) that shares the discharged cooling water and is positioned at the outlet side of the main heat transport loop (30). Effects of the invention

[0029] As described above, the cooling system for electronic components according to the present invention has the following effects.

[0030] First, by configuring the cooling loop into a dual-loop structure combining a main heat transport loop (primary flow path) and a re-cooling loop (secondary flow path), the secondary flow path continuously re-cools the cooling water flowing through the primary flow path, thereby effectively mitigating the problems of temperature rise and reduced heat absorption occurring in the latter part of the flow path. Additionally, by precisely controlling the temperature distribution within the chip area to prevent localized overheating (hot spot) phenomena and improving the overall cooling balance, it is possible to secure performance capable of stably handling the heat generated by high-power AI chips, exceeding the limitations of a single flow path.

[0031] Second, by configuring multiple flow paths of the main heat transport loop in a parallel structure, a counter-flow can be formed to uniformly cool the temperature of the semiconductor chip.

[0032] Third, by selectively arranging a structure that includes only the main heat transport loop or both the main heat transport loop and the re-cooling loop, the cooling process can be managed more efficiently depending on the heat generation level of the semiconductor.

[0033] Fourth, the primary flow path closest to the chip is designed with a structure resistant to clogging to increase system reliability, and the design can be implemented in the range of V≤2-3 m / s, which is the recommended flow rate for data centers, thereby reducing the risk of piping erosion even during high-flow operation.

[0034] Fifth, unlike microchannels where blockage in some channels leads to a fatal failure, performance degrades gradually, allowing operators sufficient time to detect and respond.

[0035] Sixth, by reducing the pump load through a low pressure drop design, the pump life can be extended and the risk of leakage minimized.

[0036] Seventh, by lowering the chip temperature, leakage current is reduced, which can reduce the total chip power consumption by about 10%, and thanks to the low pressure drop characteristics, the required pump power can be lowered while achieving the same cooling performance.

[0037] Eighth, by simultaneously reducing cooling and IT power, the Power Usage Effectiveness (PUE) of the data center can be improved, and electricity costs and carbon emissions can be reduced.

[0038] Ninth, unlike conventional microchannels that produce optimal performance only at specific flow rates, performance is maintained consistently over a wide flow rate range of 3-10 L / min, allowing for flexible response to load changes or seasonal environmental changes. Brief explanation of the drawing

[0039] FIG. 1 is a drawing showing a microchannel type cooling system according to the prior art, and FIG. 2 is a perspective view showing the overall appearance of a cooling system according to an embodiment of the present invention, and FIG. 3 is an exploded perspective view showing the internal structure of the cooling system illustrated in FIG. 2, and FIG. 4 is a perspective view showing the internal structure of the cooling system illustrated in FIG. 2, and FIG. 5 is a plan view showing a structure in which the main heat transport channel and the re-cooling channel illustrated in FIG. 3 are arranged, and FIG. 6 is a cross-sectional view along line AA of FIG. 5, and FIG. 7 is a cross-sectional view along line BB of FIG. 5, and FIG. 8 is a perspective view showing the combined structure of the first Euro shown in FIG. 3, the upper case, and the lower case. FIG. 9 is a drawing showing a parallel arrangement as another embodiment of the arrangement structure of the first euro and the second euro shown in FIG. 3. FIG. 10 is a plan view schematically showing the arrangement structure of the first and second Euros illustrated in FIG. 9. Fig. 11 is a side cross-sectional view of Fig. 10. FIG. 12 is a drawing showing a state in which the inlet and outlet are arranged in different directions as another embodiment of the first and second Euros shown in FIG. 9. FIG. 13 is a plan view schematically showing a structure in which a first flow path and a second flow path are arranged between each other as another embodiment of the main heat transport loop shown in FIG. 9. FIG. 14 is a plan view schematically showing a structure in which the first to fourth flow paths are arranged between each other as another embodiment of the main heat transport loop shown in FIG. 9. FIG. 15 is a side view showing the combined structure of the first and second Euros and the re-cooling loop shown in FIG. 13 and FIG. 14. FIG. 16 is a drawing showing another embodiment of the parallel arrangement structure of the first and second flow paths of the main heat transport loop shown in FIG. 9, and a state in which the re-cooling loop is omitted. Specific details for implementing the invention

[0040] Hereinafter, a cooling system for an electronic component according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0041] As illustrated in FIGS. 2 to 8, the cooling system (20) of the electronic device proposed by the present invention is a dual-loop cooling method in which a main heat transport loop and a re-cooling loop are combined, and both the main heat transport loop and the re-cooling loop are configured as single flow paths (30, 32).

[0042] This electronic device cooling system (20) is,

[0043] A device for cooling a semiconductor element placed at the bottom, comprising: a case (21) that forms an exterior and is composed of top and bottom covers (22, 24); upper and lower cases (26, 28) that correspond to each other and are placed inside the case (21); a first flow path (30) that primarily cools the semiconductor element by wrapping the exterior of the upper and lower cases (26, 28) in a coil shape and transporting cooling water; a second flow path (32) that is horizontally placed between the upper case (26) and the lower case (28) and is connected to the first flow path (30) to secondarily cool the cooling water passing through the first flow path (30); and an inlet port (31) that is placed at the inlet side of the first flow path (30) and the second flow path (32) and shares the incoming cooling water. It includes a discharge port (33) that shares the discharged cooling water, which is positioned at the outlet side of the first Euro (30) and the second Euro (32).

[0044] In a cooling system having such a structure,

[0045] The upper and lower covers (22, 24) may be fastened and fixed by bolts, etc., or connected by drilling holes, and any method that allows the upper and lower covers to be combined as a single unit is included.

[0046] A plurality of mounting grooves (27) are formed on the outer surface, such as the upper and lower surfaces of the upper case (26) and lower case (28), and the mounting grooves (27) have a shape inclined at a certain angle with respect to the side of the case (21). Accordingly, the first tube (34) of the first flow path (30) is mounted in the mounting grooves (27), thereby allowing the structure to stably wind the exterior of the upper and lower cases (26, 28) in a coil shape.

[0047] This first Euro (30) performs the function of a main heat transport loop that primarily dissipates heat generated from the chip, and includes a first tubular body (34) that coils the outer surface of the upper and lower cases (26, 28) in an up-and-down direction in a tubular shape; a first inlet port (29) provided at the inlet side of the first tubular body (34) and connected to an inlet port (31); and a first outlet port (35) provided at the outlet side of the first tubular body (34) and connected to an outlet port (33).

[0048] Accordingly, external cooling water is supplied to the inlet port (31) through the cooling water inlet (36), and from this inlet port (31), it flows into the first pipe body (34) through the first inlet port (29) and is cooled primarily while flowing in a coil shape, then is supplied to the discharge port (33) through the first discharge port (35) and then discharged through the cooling water discharge port (38).

[0049] And, a portion of the cooling water from the inlet port (31) flows into the second flow path (32), and the second flow path (32) is arranged in a zigzag shape in the inner space between the upper and lower cases (26, 28) and performs the function of an auxiliary heat transport loop (re-cooling loop) that secondarily dissipates heat.

[0050] This second Euro (32) includes a second pipe body (47) through which cooling water flows; a second inlet (40) connected to the inlet side of the second pipe body (47) and connected to an inlet port (31) through which cooling water flows; a third pipe body (49) arranged parallel to the second pipe body (47) at a certain distance from which cooling water flows; a plurality of branch pipes (45) connecting the second pipe body (47) and the third pipe body (49) to allow cooling water to flow; and a second outlet (42) connected to the outlet side of the third pipe body (49) and connected to an outlet port (33) through which cooling water is discharged.

[0051] Accordingly, the cooling water of the inlet port (31) flows into the second pipe body (47) through the second inlet port (40), then flows into the third pipe body (49) through a plurality of branch pipes (45), and is supplied to the discharge port (33) through the second discharge port (42) and discharged. In this process, the heat of the first flow path (30) is cooled secondarily, thereby performing a re-cooling function so that the chip can pass through again at a low temperature in the next rotation of the first flow path (30).

[0052] At this time, the inlet port (31) is connected to and shared not only with the second inlet port (40) but also with the first inlet port (29) of the first flow path (30), and the outlet port (33) is connected to and shared not only with the second outlet port (42) but also with the first outlet port (35) of the first flow path (30).

[0053] Additionally, the multiple branch pipes (45) may include various components, for example, a pipe body may be connected and arranged between the second pipe body (47) and the third pipe body (49), or a hollow plate may be processed into a zigzag shape and connected between the second pipe body (47) and the third pipe body (49).

[0055] Meanwhile, the cooling process using a cooling system having this structure is explained in more detail as follows.

[0056] As illustrated in FIGS. 2 to 8, external coolant flows into the inlet port (31) through the coolant inlet (36). The coolant reaching the inlet port (31) branches into the first inlet (29) of the first flow path (30) and the second inlet (40) of the second flow path (32), which are connected in parallel with each other, and begins to flow simultaneously.

[0057] First, to explain the primary cooling, i.e., the main heat transport stage, through the first Euro (30), the cooling water introduced through the first inlet (29) passes through the first pipe body (34), which is coiled vertically along the outer mounting groove (27) of the upper case (26) and the lower case (28). In this way, the cooling water is primarily cooled, then supplied to the discharge port (33) through the first outlet (35), and then discharged through the cooling water outlet (38).

[0058] In this process, the cooling water acts as a main heat transport loop that directly absorbs and carries the high heat generated from the semiconductor chip adjacent to the bottom of the cooling system.

[0059] The first Euro (30) has a relatively large diameter and a simple structure, so high flow rate operation is possible, allowing the heat of the chip to be transported quickly and safely to the outside.

[0060] To explain the secondary cooling, or re-cooling, step through the second Euro (32), the cooling water flowing from the inlet port (31) into the second pipe body (47) through the second inlet port (40) flows into the third pipe body (49) through a plurality of zigzag-shaped branch pipes (45) arranged horizontally in the inner space between the upper case (26) and the lower case (28), and is supplied to the discharge port (33) through the second discharge port (42) and discharged. In this process, the second Euro (32) acts as a re-cooling loop and performs the role of lowering the temperature of the rising fluid before the first Euro (30) goes around the case once and comes down towards the chip again.

[0061] Through this re-cooling process, the cooling water of the first Euro (30) can pass over the top of the chip again while maintaining a low temperature in the next turn, thereby preventing the problem of reduced heat absorption occurring in the latter part of the cooling path and maintaining a uniform temperature distribution over the entire surface area of ​​the chip.

[0062] In this way, the cooling water that has completed primary cooling by passing through the first flow path (30) is supplied to the discharge port (33) through the first discharge port (35), and the cooling water that has performed re-cooling by passing through the second flow path (32) likewise joins at the same discharge port (33) through the second discharge port (42).

[0063] The combined coolant is finally discharged through the coolant outlet (38) connected to the discharge port (33), completing one cooling cycle.

[0064] Through such organic combination, the present invention can ensure stable operation of ultra-high performance AI chips by simultaneously achieving high flow rate operation and efficient temperature control while maintaining a lower pressure drop than the microchannel method.

[0066] Meanwhile, the arrangement structure of the main heat transport loop and the re-cooling loop is not limited to the structure described above and may be changed to a different arrangement structure.

[0067] As shown in FIGS. 9 to 11, the main heat transport loops (50, 52) are arranged in a parallel structure, and the re-cooling loop (32) has the same structure as the above-described embodiment.

[0068] The main heat transport loop (50, 52) has two flow paths, namely the third flow path (50) and the fourth flow path (52), arranged in parallel. The third flow path (50) includes a third inlet (51) provided on the inlet side and connected to the inlet port (31); and a third outlet (54) provided on the outlet side and discharges cooling water to the fourth pipe body (55) through the second connector (58).

[0069] At this time, the third inlet (51) is connected to the inlet port (31) and shares the flow of cooling water with the re-cooling loop (32).

[0070] Accordingly, the cooling water introduced through the inlet port (31) and the third inlet (51) flows along the third flow path (50) and is then supplied to the fourth pipe (55) through the third outlet (54) and the second connection port (58).

[0071] The above-mentioned fourth Euro (52) includes a fourth inlet (56) provided on the inlet side and connected to the first connector (57) of the fifth pipe body (53); and a fourth outlet (38) provided on the outlet side and connected to the discharge port (33) to discharge cooling water.

[0072] At this time, the fourth discharge port (38) is connected to the discharge port (33) and shares cooling water with the re-cooling loop (32).

[0073] Accordingly, the cooling water can flow from the fifth pipe body (53) through the first connector (57) and the fourth inlet (56) along the fourth path (52) and then be discharged to the outside through the fourth outlet (33).

[0074] In this way, the third Euro (50) and the fourth Euro (52) are connected to the fourth and fifth tubes (55, 53) and arranged in parallel, so that when cooling water flows through these channels, a counter-flow is formed, thereby allowing the temperature of the semiconductor chip to be cooled uniformly.

[0075] In addition, in the main heat transport loop (50, 52) and re-cooling loop (32) of this parallel structure, the inlet of the second pipe (47) and the outlet of the third pipe (49) may be arranged in the same direction as shown in FIG. 10, or the inlet of the second pipe (47) and the outlet of the third pipe (49) may be arranged in opposite directions as shown in FIG. 12.

[0077] Meanwhile, another embodiment of such a main heat transport loop is illustrated in FIG. 13 and FIG. 15. In this embodiment, the main heat transport loop (80, 81) is arranged in two parallel passages, with the two parallel passages positioned between each other, and is connected to a re-cooling loop (83, 88, 89) to share and circulate cooling water.

[0078] To explain in more detail, the main heat transport loop (80, 81) consists of two passages, namely the ninth passage (80) and the tenth passage (81), arranged in parallel. The re-cooling loop (83, 88, 89) consists of a sixth pipe (83) and a seventh pipe (88) arranged side by side, and a connecting pipe (89) connecting the sixth and seventh pipes (83, 88), and is structured to share and circulate cooling water.

[0079] That is, the ninth Euro (80) includes a ninth inlet (84) connected to the inlet side of the sixth pipe body (83) of the re-cooling loop; and a ninth outlet (85) provided on the outlet side and connected to the opposite side of the outlet of the seventh pipe body (88) to discharge cooling water.

[0080] And the 10th Euro (81) includes a 10th inlet (86) connected to the opposite side of the inlet of the 6th pipe body (83) of the re-cooling loop; and a 10th outlet (87) provided on the outlet side and connected to the outlet side of the 7th pipe body (88) to discharge cooling water.

[0081] At this time, the 9th Euro (80) is wound in a coil shape, and the 10th Euro (81) is placed between the wound 9th Euro (80) and wound in a coil shape.

[0082] Additionally, it is preferable that the ninth inlet (84) and the ninth outlet (85) be positioned below the sixth and seventh pipe bodies (83, 88), and that the tenth inlet (86) and the tenth outlet (87) be positioned above the sixth and seventh pipe bodies (83, 88). Of course, it is also possible to position them upside down.

[0083] When cooling a semiconductor using the main heat transport loop (80, 81) and pipe of this structure, when cooling water flows in through the 6th pipe (83), the cooling water flows along the 9th path (80) through the 9th inlet (84), is discharged to the 7th pipe (88) through the 9th outlet (85), and then is discharged to the outside through the outlet.

[0084] Additionally, the cooling water that does not flow from the 6th pipe (83) to the 9th inlet (84) flows along the 6th pipe (83), then flows into the 10th flow path (81) through the 10th inlet (86), and then is discharged to the outside through the outlet of the 7th pipe (88) through the 10th outlet (87).

[0085] At this time, the cooling water flowing through the 6th and 7th pipes (83, 88) can be circulated to each other through the connecting pipe (89).

[0086] In this way, the semiconductor can be cooled as cooling water flows through the main heat transport loop (80, 81) and the pipe (83, 88).

[0088] Meanwhile, another embodiment of the arrangement structure of the main heat transport loop is illustrated in FIG. 14. In this embodiment, the main heat transport loop (30) is arranged in four parallel passages, and the four parallel passages are arranged in a structure where they are placed between each other. The re-cooling loop (103, 104, 105) is composed of an 8th pipe body (103) and a 9th pipe body (104) arranged side by side, and a connecting pipe (105) connecting the 8th and 9th pipe bodies (103, 104), and is a structure that shares and circulates cooling water.

[0089] To explain in more detail, the main heat transport loop (30) has four euros, namely the 11th euro (90), the 12th euro (91), the 13th euro (92), and the 14th euro (93), arranged in parallel, and the 8th pipe (103) and the 9th pipe (104) are arranged side by side at a certain distance apart.

[0090] And, the 11th to 14th Euros (90, 91, 92, 93) are arranged to wind the 8th tube (103) and the 9th tube (104) in a coil shape.

[0091] That is, the 11th Euro (90) includes an 11th inlet (94) connected to the inlet side of the 8th pipe body (103) of the re-cooling loop; and an 11th outlet (98) provided on the outlet side and connected to the middle side of the 9th pipe body (104) to discharge cooling water.

[0092] And the 12th Euro (91) includes a 12th inlet (95) connected to the middle side of the 8th pipe body (103) of the re-cooling loop; and a 12th outlet (99) provided on the outlet side and connected to the opposite side of the outlet of the 9th pipe body (104) to discharge cooling water.

[0093] Additionally, the 13th Euro (92) includes a 13th inlet (96) connected to the middle side of the 8th pipe body (103) of the re-cooling loop; and a 13th outlet (100) provided on the outlet side and connected to the outlet side of the 9th pipe body (104) to discharge cooling water.

[0094] And the 14th Euro (93) includes a 14th inlet (97) connected to the opposite side of the inlet of the 8th pipe (103) of the re-cooling loop; and a 14th outlet (101) provided on the outlet side and connected to the middle side of the 9th pipe (104) to discharge cooling water.

[0095] At this time, the 11th to 14th Euros (90, 91, 92, 93) are wound in a coil shape, the 13th Euro (92) is placed between the wound 11th Euro (90) and wound in a coil shape, and the 14th Euro (93) is placed between the wound 12th Euro (92) and wound in a coil shape.

[0096] Additionally, it is preferable that the 11th inlet (94), 11th outlet (98), 12th inlet (95), and 12th outlet (99) be positioned below the 8th and 9th pipe bodies (103, 104), and that the 13th inlet (96), 13th outlet (100), 14th inlet (97), and 14th outlet (101) be positioned above the 8th and 9th pipe bodies (103, 104). Of course, it is also possible to have them positioned upside down.

[0097] When cooling a semiconductor using the main heat transport loop (30) and pipes (103, 104) of this structure, when cooling water flows in through the 8th pipe (103), the cooling water flows along the 11th path (90) through the 11th inlet (94), is discharged to the 9th pipe (104) through the 11th outlet (98), and then is discharged to the outside through the outlet.

[0098] Additionally, the cooling water that does not flow from the 8th pipe (103) to the 11th inlet (94) flows along the 8th pipe (103), then flows into the 12th flow path (91) through the 12th inlet (95), then flows out to the opposite side of the outlet of the 9th pipe (104) through the 12th outlet (99), and then is discharged to the outside through the outlet.

[0099] Then, the cooling water flows along the 13th flow path (92) through the 13th inlet (96) adjacent to the 12th inlet (95), and then is discharged to the outlet side of the 9th pipe body (104) through the 13th outlet (100) and then discharged to the outside.

[0100] Additionally, the cooling water that flows to the end of the 8th pipe (103) flows into the 14th flow path (93) through the 14th inlet (97), flows through, is discharged to the middle side of the 9th pipe (104), and then is discharged to the outside through the outlet.

[0101] At this time, the cooling water flowing through the 8th and 9th pipes (103, 104) can be circulated to each other through the connecting pipe (105).

[0102] In this way, the semiconductor can be cooled as cooling water flows through the main heat transport loop (30) and the pipes (103, 104).

[0104] Meanwhile, another embodiment of such a main heat transport loop is illustrated in FIG. 16. In this embodiment, the main heat transport loop (30) is arranged in a plurality of parallel structures, and the re-cooling loop is omitted. Additionally, a 10th pipe body (75) is connected to one side of the main heat transport loop (30) to allow cooling water to flow, and an 11th pipe body (73) is connected to the other side of the main heat transport loop (30) to allow cooling water to flow.

[0105] The main heat transport loop (30) has four passages, namely the fifth passage (60) to the eighth passage (66), arranged in parallel. The fifth passage (60) includes a fifth inlet (61) provided on the inlet side and connected to the inlet port (31); and a fifth outlet (68) provided on the outlet side and discharged cooling water to the tenth pipe body (75).

[0106] And the cooling water discharged from the 5th outlet (68) is supplied to and flows through the 10th pipe body (75).

[0107] At this time, the fifth inlet (61) is connected to the inlet port (31) and connected to the eleventh pipe body (73).

[0108] Accordingly, the cooling water introduced through the 5th inlet (61) flows along the 11th pipe body (73) or flows along the 5th path (60), then is discharged through the 5th outlet (68) and then flows into the 10th pipe body (75).

[0109] And the 6th Euro (62) is provided on the inlet side and includes a 6th inlet port (70) connected to the 11th pipe body (73) to allow cooling water to flow in; and a 6th outlet port (72) provided on the outlet side to discharge cooling water to the 10th pipe body (75).

[0110] Accordingly, the cooling water introduced from the 11th pipe body (73) through the 6th inlet (70) can flow along the 6th path (62) and then be supplied to the 10th pipe body (75) through the 6th outlet (72).

[0111] And the 7th Euro (64) is provided on the inlet side and includes a 7th inlet (74) connected to the 11th pipe body (73) to allow cooling water to flow in; and a 7th outlet (76) provided on the outlet side to discharge cooling water to the 10th pipe body (75).

[0112] Accordingly, the cooling water introduced from the 11th pipe body (73) through the 7th inlet (74) can flow along the 7th path (64) and then be supplied to the 10th pipe body (75) through the 7th outlet (76).

[0113] And the 8th Euro (66) is provided on the inlet side and includes an 8th inlet port (78) connected to the 11th pipe body (73) to allow cooling water to flow in; and an 8th outlet port (82) provided on the outlet side and connected to the discharge port (33) to discharge cooling water that has flowed through the 10th pipe body (75).

[0114] The tubular body described above includes all tubular bodies such as circular, square, and polygonal shapes, and cooling fins may be formed protruding from the surface as needed.

Claims

Claim 1 A case (21) forming an exterior composed of upper and lower covers (22, 24); upper and lower cases (26, 28) positioned inside the case (21) and corresponding to each other; a main heat transport loop (30) that primarily cools by transporting cooling water while wrapping the exterior of the upper and lower cases (26, 28) in a coil shape; a re-cooling loop (32) positioned between the upper case (26) and the lower case (28) to secondarily cool the cooling water passing through the main heat transport loop (30); and an inlet port (31) positioned at the inlet side of the main heat transport loop (30) and the re-cooling loop (32) to share the incoming cooling water; The electronic device cooling system (20) includes a discharge port (33) that shares cooling water discharged by being positioned at the outlet side of the main heat transport loop (30) and the recooling loop (32), wherein the recooling loop (32) comprises a second pipe body (47) through which cooling water flows, a second inlet port (40) connected to the inlet side of the second pipe body (47) and connected to an inlet port (31) to allow cooling water to flow in, a third pipe body (49) arranged parallel to the second pipe body (47) at a certain distance and through which cooling water flows, a plurality of branch pipes (45) connecting the second pipe body (47) and the third pipe body (49) to allow cooling water to flow, and a second discharge port (42) connected to the outlet side of the third pipe body (49) and connected to a discharge port (33) to discharge cooling water. Claim 2 In claim 1, the main heat transport loop (30) comprises a first tube (34) that is shaped like a tube and wraps the outer surface of the upper and lower cases (26, 28) in a coil shape in the vertical direction; a first inlet (29) provided at the inlet side of the first tube (34) and connected to an inlet port (31); and a first outlet (35) provided at the outlet side of the first tube (34) and connected to an outlet port (33), thereby forming a first flow path (30), in an electronic device cooling system (20). Claim 3 In paragraph 2, a plurality of mounting grooves (27) are formed on the outer surface of the upper case (26) and the lower case (28), and the mounting grooves (27) have a shape inclined at a certain angle with respect to the side of the case, and the first tube (34) of the first flow path (30) is mounted in the mounting grooves (27), thereby forming a structure that winds the exterior of the upper and lower cases (26, 28) into a coil shape, an electronic device cooling system (20). Claim 4 delete Claim 5 In claim 1, the main heat transport loop (30) has a third flow path (50) and a fourth flow path (52) arranged in parallel, wherein the third flow path (50) includes a third inlet (51) provided on the inlet side and connected to an inlet port (31); and a third outlet (54) provided on the outlet side and discharges cooling water to a fourth pipe body (55) through a second connector (58), wherein the third inlet (51) is connected to the inlet port (31) and shares the flow of cooling water with the re-cooling loop (32), and the fourth flow path (52) includes a fourth inlet (56) provided on the inlet side and connected to a first connector (57) of a fifth pipe body (53); The electronic device cooling system (20) includes a fourth discharge port (38) provided on the outlet side and connected to the discharge port (33) to discharge cooling water, wherein the fourth discharge port (38) is connected to the discharge port (33) and shares cooling water with the re-cooling loop (32). Claim 6 In claim 1, the main heat transport loop (30) has a ninth flow path (80) and a tenth flow path (81) arranged in parallel, and the re-cooling loop (32) includes a sixth pipe body (83) and a seventh pipe body (88) arranged in parallel with each other, and a connecting pipe (89) connecting the sixth and seventh pipe bodies (83, 88) to share and circulate cooling water, the ninth flow path (80) includes a ninth inlet (84) connected to the inlet side of the sixth pipe body (83) of the re-cooling loop; and a ninth outlet (85) provided on the outlet side and connected to the opposite side of the outlet of the seventh pipe body (88) to discharge cooling water, and the tenth flow path (81) includes a tenth inlet (86) connected to the opposite side of the inlet of the sixth pipe body (83) of the re-cooling loop; An electronic device cooling system (20) comprising a 10th discharge port (87) that is provided on the outlet side and connected to the outlet side of the 7th pipe (88) to discharge cooling water. Claim 7 In claim 1, the main heat transport loop (30) is structured such that the 11th flow path (90), the 12th flow path (91), the 13th flow path (92), and the 14th flow path (93) are arranged in parallel, and the re-cooling loop (32) is structured such that the 8th pipe body (103) and the 9th pipe body (104) are arranged in parallel with each other, and a connecting pipe (105) connecting the 8th and 9th pipe bodies (103, 104) are shared and circulated with cooling water, and the 11th flow path (90) has an 11th inlet (94) connected to the inlet side of the 8th pipe body (103) of the re-cooling loop; It includes a 11th discharge port (98) provided on the outlet side and connected to the middle side of the 9th pipe body (104) to discharge cooling water; the 12th flow path (91) includes a 12th inlet port (95) connected to the middle side of the 8th pipe body (103) of the re-cooling loop; and a 12th discharge port (99) provided on the outlet side and connected to the opposite side of the outlet of the 9th pipe body (104) to discharge cooling water; the 13th flow path (92) includes a 13th inlet port (96) connected to the middle side of the 8th pipe body (103) of the re-cooling loop; and a 13th discharge port (100) provided on the outlet side and connected to the outlet side of the 9th pipe body (104) to discharge cooling water; and the 14th flow path (93) includes a 14th inlet port (97) connected to the opposite side of the inlet of the 8th pipe body (103) of the re-cooling loop; An electronic device cooling system (20) comprising a 14th discharge port (101) that is provided on the outlet side and connected to the middle side of the 9th pipe body (104) to discharge cooling water. Claim 8 A case (21) formed by upper and lower covers (22, 24) to form an exterior; upper and lower cases (26, 28) disposed inside the case (21) and corresponding to each other; a main heat transport loop (30) that cools by transporting cooling water while wrapping the exterior of the upper and lower cases (26, 28) in a coil shape; a tenth pipe body (75) connected to one side of the main heat transport loop (30) through which cooling water flows; an eleventh pipe body (73) connected to the other side of the main heat transport loop (30) through which cooling water flows; and an inlet port (31) disposed at the inlet side of the main heat transport loop (30), sharing the incoming cooling water, and connected to the eleventh pipe body (73); And it includes a discharge port (33) connected to a 10th pipe body (75) that shares the cooling water discharged and is positioned at the outlet side of the main heat transport loop (30); the main heat transport loop (30) has 5 to 8 flow paths (60, 62, 64, 66) arranged in a parallel structure; the 5th flow path (60) includes a 5th inlet port (61) provided at the inlet side and connected to an inlet port (31); and a 5th outlet port (68) provided at the outlet side and discharges cooling water to the 10th pipe body (75), and the cooling water discharged from the 5th outlet port (68) is supplied to and flows into the 10th pipe body (75); and the 6th flow path (62) includes a 6th inlet port (70) provided at the inlet side and connected to the 11th pipe body (73) through which cooling water flows in; The electronic device cooling system (20) includes a sixth outlet (72) provided on the outlet side for discharging cooling water to the tenth pipe body (75), and a seventh flow path (64) provided on the inlet side and connected to the eleventh pipe body (73) for introducing cooling water, a seventh inlet (74); a seventh outlet (76) provided on the outlet side for discharging cooling water to the tenth pipe body (75), and an eighth flow path (66) provided on the inlet side and connected to the eleventh pipe body (73) for introducing cooling water, an eighth inlet (78); and an eighth outlet (82) provided on the outlet side and connected to the discharge port (33) for discharging cooling water that has flowed through the tenth pipe body (75). Claim 9 delete

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