Probe card and semiconductor test device including the same

Abstract

The present invention relates to a probe card and a semiconductor test device including the same. According to the present invention, the probe card may include a substrate having one side facing a chuck that supports a test target, a plurality of probes disposed on one side of the substrate and in contact with the test target, and a plurality of contact members disposed on one side of the substrate and in contact with the chuck.

Description

Technology Field

[0001] The present invention relates to a probe card and a semiconductor test device including the same. Background Technology

[0002] After the manufacturing process is completed, semiconductor devices are determined to be good by inspecting their electrical characteristics. During this process, the die or wafer to be tested is loaded into test equipment, and the test is performed through contact with each probe on a probe card.

[0003] The probe contacts the electrode pad or solder bump of the die and determines electrical characteristics, such as conduction status, by applying a test signal to the electrical circuit connected to each electrode.

[0004] In this case, contact resistance and contact stability between the probe and the mobile chuck supporting the test target have a significant impact on the reliability of the test results. If contact resistance is excessively high or the contact is unstable, it can impair test accuracy. Contact resistance and contact instability reduce test efficiency and, in some cases, may lead to retesting or mismeasurements.

[0005] Environmental conditions within the test chamber also affect contact. High contact resistance, excessive probing force, or unnecessary power dissipation are factors that degrade test reliability. Applying an appropriate probing force is important; if it is too low, it causes poor contact and high contact resistance, while if it is too high, it can damage the probe or the device under test.

[0006] In particular, in high-voltage / high-current test environments using a transfer-type mobile chuck, the upper part of the chuck must be electrically isolated from the base. In this case, the condition of the contact surface between the mobile chuck and the base significantly affects the reduction of thermal resistance. As the roughness and parallelism of the contact surface are maintained at a high level, thermal resistance decreases, contributing to efficient heat dissipation. This is essential to effectively remove the heat generated by current resistance when a die is placed on the mobile chuck and testing is performed.

[0007] However, if the surface roughness or flatness of the contact surface deteriorates due to thermal deformation or wear, the thermal resistance of the contact surface increases, interfering with temperature control, such as test temperature uniformity and power dissipation management. Furthermore, while strong pressure on the chuck can facilitate contact during inspections where high probing forces are applied, there are limitations to improving the chuck's contact state in tests where touches are divided due to high heat generation, or when the device is large or the probing force is low. In particular, when contact surface flatness is damaged due to thermal deformation, there is a problem in that it is difficult to sufficiently press the mobile chuck against the base with low probing force. The problem to be solved

[0008] An embodiment of the present invention provides a probe card and a semiconductor test device including the same. means of solving the problem

[0009] A probe card according to an embodiment of the present invention may include a substrate having one side facing a chuck that supports a test target, a plurality of probes disposed on one side of the substrate and in contact with the test target, and a plurality of contact members disposed on one side of the substrate and in contact with the chuck.

[0010] A semiconductor test device according to an embodiment of the present invention may include a chuck that supports a test target on one surface, a chuck base disposed at the lower part of the chuck and supporting the chuck, and a probe card disposed at the upper part of the chuck and including a plurality of probes that contact the test target and a plurality of contact members that contact one surface of the chuck. Effects of the invention

[0011] According to the present invention, a probe card capable of effectively improving heat dissipation of a test target by increasing the adhesion between the chuck and the chuck base and reducing contact failures is provided, and a semiconductor test device including the same is provided. Brief explanation of the drawing

[0012] FIGS. 1a and 1b are drawings for illustrating an example of a probe card for testing a die according to an embodiment of the present invention. FIGS. 2a and 2b are drawings for illustrating other examples of a probe card for testing a die according to one embodiment of the present invention. FIGS. 3a and 3b are drawings for illustrating an example of a probe card for testing a wafer according to an embodiment of the present invention. FIGS. 4a and 4b are drawings for illustrating other examples of a probe card for testing a wafer according to one embodiment of the present invention. FIG. 5 is a drawing for explaining a semiconductor test device according to one embodiment of the present invention. Specific details for implementing the invention

[0013] Specific structural or functional descriptions regarding embodiments according to the concept of the present invention disclosed in this specification or application are provided merely for the purpose of explaining embodiments according to the concept of the present invention, and embodiments according to the concept of the present invention may be implemented in various forms and should not be interpreted as being limited to the embodiments described in this specification or application.

[0015] FIGS. 1a and 1b are drawings for illustrating an example of a probe card for testing a die according to an embodiment of the present invention. Specifically, FIG. 1a is a drawing showing the state before the probe card (100) and the dies (300) come into contact, and FIG. 1b is a drawing showing the state after the probe card (100) and the dies (300) come into contact.

[0016] In one embodiment, the test for the dies (300) can be performed in a test chamber (10).

[0017] In one embodiment, the test chamber (10) may be a space for inspecting the electrical characteristic state of dies (300) placed on the upper surface of the chuck (210) using a probe (120).

[0018] In one embodiment, the test chamber (10) may include a probe card (100), a chuck (210), a chuck base (220), a support (230), and a lower base (240).

[0019] In one embodiment, the probe card (100) may be a device that connects the dies (300) and a tester (not shown) to check the operation of the dies (300). After a plurality of probes (120) connected to the probe card (100) come into contact with the dies (300), the defect of the dies (300) can be determined based on the signal that returns after sending electricity to the dies (300).

[0020] In one embodiment, the probe card (100) may be positioned above the lower base (231) and the support (230) within the test chamber (10). The probe card (100) may be positioned facing the lower base (240) and the support (230).

[0021] In one embodiment, the probe card (100) may include a substrate (110), a plurality of probes (120), and a plurality of contact members (130a).

[0022] In one embodiment, the substrate (110) may be configured to receive test results for a test subject.

[0023] In one embodiment, a plurality of probes (120) may be disposed on one surface of a substrate (110) facing a chuck (210) on which a test object is supported. Specifically, the probes (120) may be disposed on the lower surface of the substrate (110). The probes (120) may be formed in a direction perpendicular to one surface of the substrate (110). Specifically, the probes (120) may be formed extending downward from the substrate (110).

[0024] In one embodiment, the probe (120) can be configured in various forms such as a pogo pin, a cantilever, a vertical, or a rubber.

[0025] In one embodiment, the probe (120) may come into contact with the dies (300) that are the subject of the test during testing. Although FIGS. 1a and 1b are illustrated as two probes (120) coming into contact with one die (300), this is not necessarily limited thereto. For example, one probe (120) may come into contact with one die (300), or two or more probes (120) may come into contact with it.

[0026] In one embodiment, a plurality of contact members (130a) may be disposed on one surface of the substrate (110). Specifically, the contact members (130a) may be disposed on the lower surface of the substrate (110). The contact members (130a) may be formed in a direction perpendicular to one surface of the substrate (110). Specifically, the contact members (130a) may be formed extending downward from the substrate (110).

[0027] In one embodiment, a plurality of contact members (130a) may be spaced apart from a plurality of probes (120) at a certain distance.

[0028] In one embodiment, a plurality of contact members (130a) may come into contact with the chuck (210) during testing. For example, the plurality of contact members (130a) may be composed of probes for applying pressure to one surface of the chuck (210).

[0029] In one embodiment, the chuck (210) may support a plurality of dies (300) to be tested. The chuck (210) may have a disc shape. However, this is exemplary and the shape of the chuck (210) is not limited thereto.

[0030] In one embodiment, the chuck (210) can be placed on the chuck base (220) by a loader. The chuck (210) can be placed directly on the upper surface of the chuck base (220).

[0031] In one embodiment, the chuck (210) may be a mobile chuck. For example, the chuck (210) may be detachable from the chuck base (220). When the arrangement of the dies (300) is changed, the inspection process of the dies (300) can be performed by replacing only the chuck (210) without changing the chuck base (220). Accordingly, even if the arrangement shape of the dies (300) is changed, dies (300) having various arrangement shapes can be inspected quickly and easily.

[0032] In one embodiment, the chuck base (220) may be placed on the support member (230).

[0033] In one embodiment, the chuck base (220) may have a cylindrical shape. However, this is exemplary, and the shape of the chuck base (220) is not limited thereto. The thickness of the chuck base (220) may be thicker than the thickness of the chuck (210).

[0034] In one embodiment, the chuck base (220) may be placed below the chuck (210).

[0035] In one embodiment, the chuck base (220) may be placed directly on the lower surface of the chuck (210). As the chuck base (220) comes into direct contact with the chuck (210), heat generated from the dies (300) can be conducted to the chuck (210) and the chuck base (220).

[0036] In one embodiment, the support member (230) may be placed on the lower base (240). The support member (230) may reciprocate in the up and down direction on the lower base (240).

[0037] In one embodiment, the lower base (240) may be positioned at the bottom within the test chamber (10). The lower base (240) may be positioned on the bottom surface of the test chamber (10).

[0038] In one embodiment, when the support member (230) moves in an upward direction, the chuck base (220) and the chuck (210) can be moved in an upward direction. A plurality of probes (120) can be positioned on one side of the substrate (110) such that they can come into contact with dies (300) placed on the upper surface of the chuck (210) when the chuck (210) moves in an upward direction. Accordingly, the dies (300) can be tested by coming into contact with the plurality of probes (120).

[0039] In one embodiment, a plurality of contact members (130a) may be arranged on one surface of the substrate (110) at a certain distance from each other. The plurality of contact members (130a) may be arranged on one surface of the substrate (110) at a position where they do not come into contact with the dies (300) arranged on the upper surface of the chuck (210) when the chuck (210) moves upward. For example, the plurality of contact members (130a) may be arranged on the upper surface of the chuck (210) at a position facing an idle area between the dies (300) or an outermost area where the dies (300) are not supported.

[0040] Additionally, the plurality of contact members (130a) may have a longer overall length than the plurality of probes (120). Accordingly, the plurality of contact members (130a) may contact the chuck (210) while the plurality of probes (120) are in contact with the dies (300). Specifically, the plurality of contact members (130a) may contact the area of ​​one side of the chuck (210) excluding the area where the dies (300) are supported. In this case, the plurality of contact members (130a) may press the chuck (210) evenly over the entire chuck (210) to bring the chuck (210) and the chuck base (220) into close contact.

[0041] Accordingly, since multiple contact members (130a) apply additional force to the idle space of the chuck (210), the force pressing the chuck (210) is evenly distributed over the entire area, thereby increasing the adhesion between the chuck (210) and the chuck base (220) and reducing contact failures, so that the heat dissipation of the dies (300) can be effectively improved.

[0042] In addition, since multiple contact members (130a) are composed of probes, the structure is simple, so design and manufacturing costs can be lowered.

[0044] FIGS. 2a and 2b are drawings for illustrating other examples of a probe card for testing a die according to one embodiment of the present invention. Specifically, FIG. 2a is a drawing showing the state before the probe card (100) and the dies (300) come into contact, and FIG. 2b is a drawing showing the state after the probe card (100) and the dies (300) come into contact.

[0045] The description of the probe card (100), substrate (110), plurality of probes (120), chuck (210), chuck base (220), support (230), and lower base (240) described with reference to FIGS. 1a and 1b can be applied in the same way to FIGS. 2a and 2b, so a detailed description will be omitted.

[0046] In one embodiment, the plurality of contact members (130b) may be composed of springs for applying pressure to one surface of the chuck (210). That is, FIGS. 2a and 2b differ from FIGS. 1a and 1b in that the shape of the plurality of contact members (130b) is different.

[0047] In one embodiment, a plurality of contact members (130b) may be spaced apart from each other on one surface of the substrate (110). The plurality of contact members (130b) may be positioned on one surface of the substrate (110) such that they do not come into contact with the dies (300) placed on the upper surface of the chuck (210) when the chuck (210) moves upward. Additionally, the plurality of contact members (130b) may have a longer overall length than the plurality of probes (120).

[0048] When the support member (230) moves in an upward direction, the chuck base (220) and the chuck (210) can be moved in an upward direction. In this case, a plurality of probes (120) contact the dies (300), and at the same time, a plurality of contact members (130b) can contact an idle area on one side of the chuck (210) where the dies (300) are not supported. In this case, the plurality of contact members (130b) can press the chuck (210) evenly over the entire chuck (210) to bring the chuck (210) and the chuck base (220) into close contact.

[0049] In addition, since the multiple contact members (130b) are composed of springs, they have excellent durability due to their elasticity and can prevent scratches or damage to the surface of the chuck (210) when in contact with the chuck (210).

[0051] FIGS. 3a and 3b are drawings for illustrating an example of a probe card for testing a wafer according to an embodiment of the present invention. Specifically, FIG. 3a is a drawing showing the state before the probe card (100) and the wafer (400) come into contact, and FIG. 3b is a drawing showing the state after the probe card (100) and the wafer (400) come into contact.

[0052] The description of the probe card (100), substrate (110), plurality of probes (120), chuck (210), chuck base (220), support (230), and lower base (240) described with reference to FIGS. 1a and 1b can be applied in the same way to FIGS. 3a and 3b, so a detailed description will be omitted.

[0053] In one embodiment, the test chamber (10) may be a space for inspecting the electrical characteristic state of a wafer (400) placed on the upper surface of a chuck (210) using a probe (120).

[0054] In one embodiment, the probe card (100) may be a device that connects the wafer (400) and a tester to inspect the operation of the wafer (400). After a plurality of probes (120) connected to the probe card (100) come into contact with the wafer (400), the wafer (400) can be identified as defective based on the signal that returns after sending electricity to the wafer (400).

[0055] In one embodiment, the chuck (210) can support the wafer (400) to be tested.

[0056] In one embodiment, the chuck base (220) may be placed directly on the lower surface of the chuck (210). As the chuck base (220) comes into direct contact with the chuck (210), heat generated from the wafer (400) may be conducted to the chuck (210) and the chuck base (220).

[0057] In one embodiment, when the support member (230) moves in an upward direction, the chuck base (220) and the chuck (210) may move in an upward direction. A plurality of probes (120) may be positioned on one side of the substrate (110) at a location where they can contact a wafer (400) placed on the upper surface of the chuck (210) when the chuck (210) moves in an upward direction. Accordingly, the wafer (400) may be contacted with the plurality of probes (120) and tested.

[0058] In one embodiment, a plurality of contact members (130a) may be spaced apart from each other on one surface of the substrate (110). The plurality of contact members (130a) may be positioned on one surface of the substrate (110) such that they do not come into contact with the wafer (400) placed on the upper surface of the chuck (210) when the chuck (210) moves upward. For example, the plurality of contact members (130a) may be positioned on the upper surface of the chuck (210) such that they face the outermost region where the wafer (400) is not supported or the region where an integrated circuit is not formed.

[0059] Additionally, the plurality of contact members (130a) may have a longer overall length than the plurality of probes (120). Accordingly, the plurality of contact members (130a) may contact the chuck (210) while the plurality of probes (120) are in contact with the wafer (400). Specifically, the plurality of contact members (130a) may contact the remaining area of ​​one surface of the chuck (210) excluding the area where the wafer (400) is supported. In this case, the plurality of contact members (130a) may press the chuck (210) evenly over the entire chuck (210) to bring the chuck (210) and the chuck base (220) into close contact.

[0060] Accordingly, since the multiple contact members (130a) apply additional force to the idle space of the chuck (210), the force pressing the chuck (210) is evenly distributed over the entire area, thereby increasing the adhesion between the chuck (210) and the chuck base (220) and reducing contact failures, so that the heat dissipation of the wafer (400) can be effectively improved.

[0061] In addition, since multiple contact members (130a) are composed of probes, the structure is simple, so design and manufacturing costs can be lowered.

[0063] FIGS. 4a and 4b are drawings for illustrating other examples of a probe card for testing a wafer according to one embodiment of the present invention. Specifically, FIG. 4a is a drawing showing the state before the probe card (100) and the wafer (400) come into contact, and FIG. 4b is a drawing showing the state after the probe card (100) and the wafer (400) come into contact.

[0064] The description of the probe card (100), substrate (110), plurality of probes (120), chuck (210), chuck base (220), support (230), and lower base (240) described with reference to FIGS. 1a, 1b, 3a, and 3b can be similarly applied to FIGS. 4a and 4b, so a detailed description will be omitted.

[0065] In one embodiment, a plurality of contact members (130b) may be composed of springs for applying pressure to one surface of the chuck (210). That is, FIGS. 4a and 4b differ from FIGS. 3a and 3b in that the shape of the plurality of contact members (130b) is different.

[0066] In one embodiment, a plurality of contact members (130b) may be spaced apart from each other on one surface of the substrate (110). The plurality of contact members (130b) may be positioned on one surface of the substrate (110) such that they do not come into contact with the wafer (400) placed on the upper surface of the chuck (210) when the chuck (210) moves upward. Additionally, the plurality of contact members (130b) may have a longer overall length than the plurality of probes (120).

[0067] When the support member (230) moves in an upward direction, the chuck base (220) and the chuck (210) can be moved in an upward direction. In this case, a plurality of probes (120) contact the wafer (400), and at the same time, a plurality of contact members (130b) can contact an idle area on one side of the chuck (210) where the wafer (400) is not supported. In this case, the plurality of contact members (130b) can press the chuck (210) evenly over the entire chuck (210) to bring the chuck (210) and the chuck base (220) into close contact.

[0068] In addition, since the multiple contact members (130b) are composed of springs, they have excellent durability due to their elasticity and can prevent scratches or damage to the surface of the chuck (210) when in contact with the chuck (210).

[0069] Meanwhile, although the above-described embodiments have described the plurality of contact members as probes or springs, they are not necessarily limited thereto, and the plurality of contact members can be configured in various forms capable of applying pressure to one surface of the chuck (210).

[0071] FIG. 5 is a drawing for explaining a semiconductor test device according to one embodiment of the present invention.

[0072] Referring to FIG. 5, the semiconductor test device (1) may include a sorter chamber (20), a loader (30), and a test chamber (10). The test chamber (10) of FIG. 5 may be the test chamber (10) of FIG. 1a and 1b.

[0073] The sorter chamber (20) can place a test object, such as a die (300) or a wafer (400), on the chuck (210).

[0074] In one embodiment, the sorter chamber (20) may be composed of various components such as a base, a transfer unit, and a picker for placing a test object on a chuck (210).

[0075] The loader (30) can transfer the chuck from the sorter chamber (20) to the test chamber (10).

[0076] In one embodiment, after a test object is placed on the upper surface of the chuck (210), the chuck (210) and the test object may be discharged from the sorter chamber (20) by a loader (30). The chuck and the test object may be transferred from the sorter chamber (20) to the test chamber (10). The chuck (210) transferred to the test chamber (10) may be placed on the chuck base (220) inside the test chamber (10). Explanation of the symbols

[0077] 10: Test chamber 100: Test card 110: Substrate 120: Probe 130a: First contact member 130b: Second contact member 210: Chuck 220: Chuck Base 230: Support 240: Lower base 300: Die 400: Wafer

Claims

Claim 1 A probe card comprising: a substrate facing a chuck that supports a test target on one side; a plurality of probes disposed on one side of the substrate and in contact with a plurality of test targets; and a plurality of contact members disposed on one side of the substrate and in contact with the chuck; wherein the plurality of contact members are disposed spaced apart from the plurality of probes at a certain interval between the plurality of probes and are disposed in a position facing a plurality of idle areas on one side of the chuck where the plurality of test targets are not supported, thereby pressing the entire side of the chuck to bring the chuck and a chuck base disposed below the chuck and supporting the chuck into close contact. Claim 2 In claim 1, the plurality of test targets are probe cards, which are wafers or plurality of dies. Claim 3 In claim 1, the plurality of contact members are probe cards that contact the chuck while the plurality of probes contact the plurality of test targets. Claim 4 delete Claim 5 In claim 1, the plurality of probes and the plurality of contact members are formed in a direction perpendicular to one surface of the substrate, forming a probe card. Claim 6 delete Claim 7 In claim 1, the plurality of contact members are probe cards, the total length of which is longer than that of the plurality of probes. Claim 8 A probe card according to claim 1, wherein the plurality of contact members are composed of a probe or a spring for applying pressure to one surface of the chuck. Claim 9 A semiconductor test device comprising: a chuck supporting a plurality of test targets on one surface; a chuck base disposed at the lower part of the chuck and supporting the chuck; and a probe card disposed at the upper part of the chuck and including a plurality of probes in contact with the plurality of test targets and a plurality of contact members in contact with one surface of the chuck; wherein the plurality of contact members are disposed spaced apart from the plurality of probes at a certain interval between the plurality of probes and are disposed in a position facing a plurality of idle areas on one surface of the chuck where the plurality of test targets are not supported, thereby pressing the entire surface of the chuck to bring the chuck and the chuck base into close contact.

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