An organic light-emitting display device

Abstract

An organic light-emitting display device may include a plurality of anode electrodes in a plurality of subpixels, a plurality of organic light-emitting layers on a plurality of anode electrodes, a plurality of cathode electrodes on a plurality of organic light-emitting layers, a plurality of first banks between a plurality of subpixels in a second direction intersecting a first direction, a plurality of first power lines along a first direction below a plurality of first banks, a plurality of connection structures disposed in a plurality of first grooves of some of the first banks, and a plurality of undercut structures on the lower side of some of the first banks in contact with the plurality of first grooves. The organic light-emitting layers and cathode electrodes are disposed across some of the first banks, and the connection structures may electrically connect the cathode electrodes to the first power lines in the undercut structures.

Description

Technology Field

[0001] The example relates to an organic light-emitting display device. Background Technology

[0002] With the increasing demand for portable information media, attempts to apply organic light-emitting diodes (OLEDs) to various lightweight and thin information electronic devices are expanding. Recently, there has been a trend toward applying OLEDs to product categories such as mobile PCs and automobiles rather than TVs or mobile phones. Since OLEDs applied to mobile PCs and automobiles operate with still images for extended periods, a long lifespan is required. To ensure a long lifespan, the extraction of light from the organic light-emitting diodes equipped in the OLED must be maximized. Furthermore, to achieve low costs, it is necessary to expand technology to enable the production of OLEDs on 10.5th generation (3370x2940mm) substrates as well as 8.5th generation (2200x2500mm) substrates. To produce long-life OLEDs, subpixels with a top-emission structure and a side-by-side structure must be implemented in a structure of at least two stacks of OLEDs.

[0003] The structure of such organic light-emitting diodes can be obtained through deposition equipment using a fine metal mask (FMM, hereinafter referred to as FMM). However, the deposition method using FMM has the problem of low productivity because production logistics must be carried out in a cluster manner rather than an inline manner. In addition, there is a problem of low pixel position accuracy (PPA) at the subpixel level between the FMM and the substrate. Consequently, the emission area ratio (EAR) is small, which limits the product lifespan. Here, EAR is the value obtained by dividing the light-emitting area of ​​a subpixel by the total area of ​​the subpixel.

[0004] Therefore, it is very urgent to develop a new deposition method to solve the aforementioned problems and an organic light-emitting display device having a new structure of an organic light-emitting element using the new deposition method. The problem to be solved

[0005] The embodiments aim to solve the aforementioned problems and other problems.

[0006] Another objective of the embodiment is to provide an organic light-emitting display device having a new structure.

[0007] In addition, another objective of the embodiment is to provide an organic light-emitting display device capable of improving lifespan.

[0008] In addition, another objective of the embodiment is to provide an organic light-emitting display device capable of improving productivity and yield.

[0009] In addition, another objective of the embodiment is to provide an organic light-emitting display device capable of improving image quality.

[0010] The technical problems of the embodiments are not limited to those described in this section and include those that can be identified through the description of the invention. means of solving the problem

[0011] According to one aspect of an embodiment for achieving the above or other purposes, an organic light-emitting display device comprises: a plurality of subpixels having different colors along a first direction and the same color along a second direction intersecting the first direction; a plurality of anode electrodes on the plurality of subpixels; a plurality of organic light-emitting layers on the plurality of anode electrodes; a plurality of cathode electrodes on the plurality of organic light-emitting layers; a plurality of first banks between the plurality of subpixels in the second direction; a plurality of first power lines along the first direction below the plurality of first banks; a plurality of connection structures disposed in a plurality of first grooves of some of the plurality of first banks; and a plurality of undercut structures on the lower side of the portion of the first banks in contact with the plurality of first grooves; wherein the organic light-emitting layers and the cathode electrodes are disposed across the portion of the first banks, and the connection structures electrically connect the cathode electrodes to the first power lines in the undercut structures.

[0012] The above organic light-emitting display device further includes an intermediate insulating layer below the bank; and the undercut structure may be formed such that the side of the interlayer insulating layer in contact with the first groove extends outward from the inner side of the first bank.

[0013] The above connection structure includes an auxiliary electrode extended from the first power wiring, and the organic light-emitting layer is severed by the undercut structure so that a portion of the auxiliary electrode is exposed, and the cathode electrode can come into contact with a portion of the exposed auxiliary electrode in the undercut structure.

[0014] The above organic light-emitting display device may include: a plurality of inorganic insulating layers on the plurality of cathode electrodes; a plurality of second banks having second grooves arranged lengthwise along the second direction between the plurality of subpixels on the first direction; and a plurality of waterproof structures in each of the plurality of second banks.

[0015] The plurality of waterproof structures may include a first waterproof structure on the second bank; a second waterproof structure on the first side of the second groove of the second bank; and a third waterproof structure on the second side of the second groove of the second bank.

[0016] The first waterproof structure above may be configured such that at least two of the plurality of inorganic insulating layers are superimposed on the second bank.

[0017] The second waterproof structure is configured such that one of the plurality of inorganic insulating layers is formed in a curved shape by the first undercut structure, and the third waterproof structure is configured such that another inorganic insulating layer among the plurality of inorganic insulating layers is formed in a curved shape by the second undercut structure, and the first undercut structure and the second undercut structure may be formed on the lower side of the second bank that contacts the second groove of the second bank.

[0018] The above waterproof structure can surround at least one subpixel among a plurality of subpixels on the second direction.

[0019] The above organic light-emitting display device further includes a plurality of second power wires along the second direction in the plurality of second grooves of the plurality of second banks; and the at least two inorganic insulating layers may be disposed on the second power wires.

[0020] The above plurality of undercut structures may be positioned differently from each other in the plurality of first grooves.

[0021] The above cathode electrode may include a first conductive layer; and a second conductive layer on the first conductive layer.

[0022] The above organic light-emitting display device further includes a blocking structure in the edge region of at least one of the first bank and the second bank; and the hole injection layer or charge generation layer of the organic light-emitting layer may be cut off by the blocking structure.

[0023] The above organic light-emitting display device may further include a plurality of dummy subpixels having a stripe shape along the first direction in a non-display area; and a plurality of waterproof structures between the plurality of dummy subpixels on the second direction. Effects of the invention

[0024] The effects of the organic light-emitting display device according to the embodiment are described as follows.

[0025] According to at least one of the embodiments, there is no need to use FMM, so the process can be simplified and process costs can be reduced.

[0026] According to at least one of the embodiments, there is no need to use FMM, so the EAR within the subpixel is increased, and the lifespan can be improved.

[0027] According to at least one of the embodiments, by depositing an organic light-emitting diode on a large-area substrate in an inline deposition system, productivity, yield, and material utilization efficiency can be improved.

[0028] According to at least one of the embodiments, as illustrated in FIGS. 1 and 2, a connection structure (130) may be disposed in a first groove (131-1) of a plurality of first banks (111-1) between a plurality of subpixels (SPr, SPg, SPb) having the same color along a second direction (Y). Accordingly, electrical connection between the cathode electrodes (123r, 123g) of the plurality of subpixels (SPr, SPg, SPb) and the first power wiring (PL1) is facilitated and a short circuit is prevented, thereby preventing operational failure or light emission failure of the subpixels (SPr, SPg, SPb) and improving reliability.

[0029] According to at least one of the embodiments, as illustrated in FIGS. 1 to 4, a plurality of waterproof structures (143 to 145) may be disposed in each of a plurality of first banks (111-1) and / or a plurality of second banks (111-2). Accordingly, moisture, oxygen, etc. penetrating along the second direction (Y) do not penetrate into the plurality of subpixels (SPr, SPg, SPb), thereby preventing operational failure or light emission failure of the subpixels (SPr, SPg, SPb) and improving reliability.

[0030] According to at least one of the embodiments, as illustrated in FIGS. 2 and 3, the hole injection layer, charge generation layer, etc. of each of the plurality of subpixels (SPr, SPg, SPb) are cut off by a blocking structure (134-1, 134-2), thereby blocking the leakage current flowing to the hole injection layer, charge generation layer, etc., so that image quality defects can be prevented.

[0031] According to at least one of the embodiments, as illustrated in FIGS. 7 to 9, a plurality of undercut structures (138) may be formed in a plurality of connecting structures (130) on a plurality of row lines along a second direction (Y) such that they are positioned differently from each other in a plurality of first banks (111-1) and / or a first groove (104, 131-1) of an interlayer insulating layer (103). Accordingly, a cathode electrode may be formed on a plurality of auxiliary electrodes (132) through a plurality of undercut structures (138) formed at different positions.

[0032] As illustrated in FIGS. 7 to 9, four connection structures (130) may be provided through undercuts (138) formed at different positions. Of the four sides of the first groove (104, 131-1), undercut structures (138) may be formed on two sides, and undercut structures (138) may not be formed on the remaining two sides.

[0033] An organic light-emitting material evaporated in a certain direction and at a certain angle in a deposition machine may not be deposited in a portion of the auxiliary electrode (132) due to a shadow effect in the undercut structure (138), thereby exposing that portion of the material. Subsequently, when a green cathode electrode material is deposited, the green cathode electrode material may continue uninterruptedly in the area where the undercut structure (138) is not formed, while coming into contact with the auxiliary electrode (132) through the exposed portion of the material.

[0034] Depending on the direction of travel of the substrate (110) and the angle and position of the evaporation source during deposition, at least one of the four connection structures (130) is electrically connected to the green cathode electrode (123g) and the auxiliary electrode (132) of the connection structure (130), thereby increasing reliability.

[0035] Therefore, electrical connection failure between the cathode electrode and the first power wiring (PL1) through the connection structure (130) is prevented, thereby preventing light emission failure or operation failure and improving reliability.

[0036] Further scopes of the applicability of the embodiments will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the embodiments are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments, should be understood as being given merely as examples. Brief explanation of the drawing

[0037] FIG. 1 is a schematic plan view illustrating an organic light-emitting display device according to a first embodiment. FIG. 2 is a cross-sectional view illustrating an organic light-emitting display device according to a first embodiment. FIG. 3 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment. FIG. 4 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment. FIGS. 5a to 5k illustrate the manufacturing process of an organic light-emitting display device along the A-A' line of FIG. 1. FIGS. 6a to 6k illustrate the manufacturing process of an organic light-emitting display device along the D-D' line of FIG. 1. FIG. 7 illustrates the different positions of the grooves of the photosensitive pattern relative to the grooves of the interlayer insulating layer along the second direction (Y). Figure 8 illustrates the positional relationship between the grooves of the interlayer insulating layer and the grooves of the photosensitive pattern. Figure 9 illustrates a configuration in which grooves of a photosensitive pattern are arranged on different sides of the grooves of an interlayer insulating layer. FIG. 10 is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment. FIG. 11 illustrates a waterproof structure according to a first embodiment. FIG. 12 illustrates a waterproof structure according to a second embodiment. FIG. 13 illustrates a waterproof structure according to a third embodiment. FIG. 14 is a schematic plan view illustrating an organic light-emitting display device according to a second embodiment. FIG. 15 is a cross-sectional view illustrating an organic light-emitting display device according to a fifth embodiment. The size, shape, numerical value, etc., of the components depicted in the drawings may differ from the actual product. Furthermore, even if the same components are depicted with different sizes, shapes, numerical values, etc., across different drawings, this is merely an example, and the same components may have the same size, shape, numerical value, etc., across different drawings. Specific details for implementing the invention

[0038] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components are assigned the same reference number regardless of drawing symbols, and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' for components used in the following description are assigned or used interchangeably for the sake of ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, the attached drawings are intended to facilitate an easy understanding of the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited by the attached drawings. Additionally, when an element such as a layer, region, or substrate is referred to as existing 'on' another component, this includes existing directly on the other element or having other intermediate elements existing between them.

[0039] In the following, an organic light-emitting display device having a side-by-side structure manufactured using a photolithography process is disclosed. This structure is referred to as Ph-SbS (side-by-side structure by photolithography). By using a photolithography process, there is no need to use an FMM, which simplifies the process and reduces process costs. Additionally, the lifespan can be improved by increasing the EAR within the subpixel. Furthermore, by depositing an organic light-emitting device on a large-area substrate using an inline deposition system, productivity, yield, and material utilization efficiency can be improved.

[0040] In the following, the red subpixel may be named the first subpixel, the green subpixel may be named the second subpixel, and the blue subpixel may be named the third subpixel. Additionally, the red organic light-emitting element may be named the first organic light-emitting element, the green organic light-emitting element may be named the second organic light-emitting element, and the blue organic light-emitting element may be named the third organic light-emitting element.

[0041] In the following description, the organic light-emitting display device is an upper light-emitting method in which light is emitted in the upper direction of the substrate to display an image, but a lower light-emitting method in which light is emitted in the lower direction of the substrate to display an image may also be included in the technical concept of the present invention.

[0042] FIG. 1 is a schematic plan view illustrating an organic light-emitting display device according to a first embodiment.

[0043] As illustrated in FIG. 1, an organic light-emitting display device according to the first embodiment may include a plurality of pixels (P) arranged in a matrix. The plurality of pixels (P) may be arranged in a display area (AA). The remaining area excluding the display area (AA) may be defined as a non-display area (NAA).

[0044] A plurality of pixels (P) may include, for example, a plurality of red subpixels (SPr), a plurality of green subpixels (SPg), a plurality of blue subpixels (SPb), etc. The plurality of subpixels (SPr, SPg, SPb) may have different colors along a first direction (X) and the same color along a second direction (Y) that intersects the first direction (X), but are not limited thereto. That is, the plurality of subpixels (SPr, SPg, SPb) may have the same color along the second direction (Y) and have a long stripe pattern.

[0045] As will be explained later, the organic light-emitting layer and cathode electrode of each of the plurality of organic light-emitting elements (120r, 120g, 120b) may have a stripe pattern arranged in a long shape along the second direction (Y) with the same color. For example, a plurality of red subpixels (SPr) emitting red light may be arranged in a stripe shape along the second direction (Y). For example, a plurality of green subpixels (SPg) emitting green light may be arranged in a stripe shape along the second direction (Y). For example, a plurality of blue subpixels (SPb) emitting blue light may be arranged in a stripe shape along the second direction (Y).

[0046] A side-by-side organic light-emitting display device can be realized by arranging the red subpixel (SPr), green subpixel (SPg), and blue subpixel (SPb) alternately in column-line units along the first direction (X). For example, they may be arranged alternately in the order of the red subpixel (SPr), green subpixel (SPg), and blue subpixel (SPb) along the first direction (X), but are not limited thereto.

[0047] For example, a red organic light-emitting element (120r) may be placed in a red subpixel (SPr), a green organic light-emitting element (120g) may be placed in a green subpixel (SPg), and a blue organic light-emitting element (120b) may be placed in a blue subpixel (SPb).

[0048] For example, the luminous efficiency of the blue organic light-emitting element (120b) in the blue subpixel (SPb) may be smaller than the luminous efficiency of the red organic light-emitting element (120r) in the red subpixel (SPr) or the green organic light-emitting element (120g) in the green subpixel (SPg). In this case, the area of ​​the blue subpixel (SPb) is designed to be larger than the area of ​​the red subpixel (SPr) or the area of ​​the green subpixel (SPg), thereby making the luminous efficiency among multiple subpixels (SPr, SPg, SPb) uniform and improving the image quality.

[0049] A plurality of subpixels (SPr, SPg, SPb) may each include a light-emitting region (EA) and a non-light-emitting region (NEA). The light-emitting region (EA) is an area where an organic light-emitting element (120r, 120g, 120b) is placed, and the non-light-emitting region (NEA) may be defined as the remaining area excluding the light-emitting region (EA).

[0050] The red organic light-emitting diode (120r), the green organic light-emitting diode (120g), and the blue organic light-emitting diode (120b) may each include an anode electrode, an organic light-emitting layer, a cathode electrode, etc. The organic light-emitting layer may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, a charge generation layer, etc. The red organic light-emitting diode (120r), the green organic light-emitting diode (120g), and the blue organic light-emitting diode (120b) may each include at least two stack structures. Each stack structure may include an organic light-emitting layer that emits light.

[0051] The organic light-emitting layer and the cathode electrode may be disposed only in each of the plurality of subpixels (SPr, SPg, SPb) along the first direction (X). That is, the organic light-emitting layer and the cathode electrode may not be disposed continuously along the first direction (X) but may be separated from each other. Alternatively, as described above, the organic light-emitting layer and the cathode electrode of each of the plurality of organic light-emitting elements (120r, 120g, 120b) may have a long stripe pattern having the same color along the second direction (Y). That is, the organic light-emitting layer and the cathode electrode may each be disposed across the plurality of subpixels (SPr, SPg, SPb) along the second direction (Y). That is, the organic light-emitting layer and the cathode electrode may each be disposed along the second direction (Y) to extend not only the plurality of subpixels (SPr, SPg, SPb) but also the regions between the plurality of subpixels (SPr, SPg, SPb).

[0052] Although not shown, the organic light-emitting layer and the cathode electrode can be separated into at least two subpixel units or two row line units along the second direction (Y).

[0053] The anode electrode may be placed only within a plurality of subpixels (SPr, SPg, SPb) along the first direction (X) and the second direction (Y). That is, the anode electrode may not be placed between the plurality of subpixels (SPr, SPg, SPb) along the first direction (X) and the second direction (Y). Accordingly, the light-emitting region (EA) of each of the plurality of subpixels (SPr, SPg, SPb) may be distinguished by the anode electrodes individually provided in the plurality of subpixels (SPr, SPg, SPb).

[0054] Meanwhile, a plurality of power lines (PL1 to PL3) may be provided to supply power to a plurality of subpixels (SPr, SPg, SPb). The power terminal (101) is electrically connected to the third power line (PL3) and can receive a first potential voltage from a power supply unit (not shown).

[0055] A plurality of power lines (PL1 to PL3) may be placed in a non-display area (NAA) and a display area (AA). The first and second power lines (PL1, PL2) may be placed between a plurality of subpixels (SPr, SPg, SPb) in the display area (AA) and may be electrically connected to the plurality of subpixels (SPr, SPg, SPb). The first and second power lines (PL1, PL2) may be electrically connected to a plurality of cathode electrodes of a plurality of organic light-emitting elements (120r, 120g, 120b) provided in the plurality of subpixels (SPr, SPg, SPb).

[0056] A plurality of first power lines (PL1) and a plurality of second power lines (PL2) can intersect and be connected to each other. A plurality of first power lines (PL1) and a plurality of second power lines (PL2) can have a matrix structure.

[0057] The third power wiring (PL3) is placed in the non-display area (NAA) and can be electrically connected to, for example, a plurality of second power wirings (PL2).

[0058] Although not shown, another power wiring may be provided to supply a second potential voltage greater than the first potential voltage. The other power wiring may be electrically connected to the driving transistor of each subpixel (SPr, SPg, SPb), but is not limited thereto.

[0059] A plurality of subpixels (SPr, SPg, SPb) may each include a driving circuit including a driving transistor, etc.

[0060] When a specific subpixel is selected by a scan transistor responding to a scan signal, light having a brightness corresponding to the current flowing through the driving transistor can be emitted from the specific subpixel using the first potential voltage of the first and second power lines (PL1, PL2) and the second potential voltage of another power line.

[0061] Meanwhile, a plurality of connection structures (130), a plurality of waterproof structures, a plurality of blocking structures, etc., can be placed between a plurality of subpixels (SPr, SPg, SPb).

[0062] Multiple connection structures (130) can be placed between multiple subpixels (SPr, SPg, SPb) in the second direction (Y).

[0063] The connection structure (130) can electrically connect a second power wiring (PL2) placed between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) to a plurality of cathode electrodes of a plurality of organic light-emitting elements (120r, 120g, 120b) of a plurality of subpixels (SPr, SPg, SPb).

[0064] Multiple blocking structures may be placed between multiple subpixels (SPr, SPg, SPb) on the first direction (X) and / or the second direction (Y).

[0065] The blocking structure may be a structure that separates layers containing low-resistance organic light-emitting materials of each organic light-emitting element (120r, 120g, 120b), such as a hole injection layer and a charge generation layer, to prevent an electrical short circuit between the anode electrode and the cathose electrode and reduce leakage current between subpixels.

[0066] As will be explained later, lateral leakage current or longitudinal leakage current between multiple subpixels (SPr, SPg, SPb) can be prevented by a blocking structure. Lateral leakage current is leakage current flowing between adjacent subpixels (SPr, SPg, SPb) along a first direction (X), and longitudinal leakage current may be leakage current flowing between adjacent subpixels (SPr, SPg, SPb) along a second direction (Y). Additionally, electrical short circuits between the anode electrode and the cathode electrode in the corresponding subpixels (SPr, SPg, SPb) can be prevented by the blocking structure. Therefore, by using a blocking structure, color staining caused by leakage current can be improved, and luminous efficiency and brightness can be significantly enhanced.

[0067] Multiple waterproof structures may be placed in a non-display area (NAA) and a display area (AA). For example, multiple waterproof structures may be placed between multiple subpixels (SPr, SPg, SPb) in a first direction (X) and / or a second direction (Y) in the non-display area (NAA) and the display area (AA). Multiple waterproof structures may be placed in the non-luminous area (NEA) of each of the multiple subpixels (SPr, SPg, SPb) in the first direction (X) and / or the second direction (Y).

[0068] Meanwhile, organic light-emitting layers are vulnerable to moisture and oxygen; if these layers are damaged by such substances, the corresponding subpixels (SPr, SPg, SPb) may not function, resulting in light emission failures. If many subpixels (SPr, SPg, SPb) fail to function due to moisture or oxygen, display defects such as point light emission failures or area light emission failures may occur, potentially reducing product reliability.

[0069] However, multiple waterproof structures such as those in the embodiment prevent moisture, oxygen, etc. from penetrating into the non-display area (NAA) or display area (AA), thereby preventing operational failures or light emission failures of multiple subpixels (SPr, SPg, SPb). Accordingly, the organic light-emitting layer of each subpixel (SPr, SPg, SPb) is not affected by moisture, oxygen, etc., and reliability can be dramatically improved.

[0070] FIG. 2 is a cross-sectional view illustrating an organic light-emitting display device according to a first embodiment. FIG. 3 is a cross-sectional view illustrating an organic light-emitting display device according to a second embodiment. FIG. 4 is a cross-sectional view illustrating an organic light-emitting display device according to a third embodiment. FIG. 2 to FIG. 4 are cross-sectional views cut along the A-A' line, B-B' line, and C-C' line in FIG. 1, respectively.

[0071] Referring to FIGS. 1 to 4, an organic light-emitting display device according to an embodiment may include a plurality of banks (111-1, 111-2), a plurality of power wires (PL1 to PL3), a plurality of organic light-emitting elements (120r, 120g), a plurality of connection structures (130), etc.

[0072] A plurality of banks (111-1, 111-2), a plurality of power wirings (PL1 to PL3), a plurality of organic light-emitting elements (120r, 120g), and a plurality of connection structures (130) can be disposed on a substrate (110).

[0073] An interlayer insulating layer (103) is disposed on a substrate (110), and a plurality of banks (111-1, 111-2), a plurality of organic light-emitting elements (120r, 120g), and a plurality of connecting structures (130) can be disposed on the interlayer insulating layer (103).

[0074] A plurality of driving circuits may be formed on the substrate (110). Each of the plurality of driving circuits may be provided in a plurality of subpixels (SPr, SPg, SPb). The plurality of driving circuits may include a plurality of transistors, at least one capacitor, etc. The plurality of transistors may include a scan transistor, a driving transistor, a sensing transistor, etc.

[0075] The interlayer insulation layer (103) may be disposed on a plurality of driving circuits. The interlayer insulation layer (103) may be a flattening layer having a flat surface.

[0076] Meanwhile, a plurality of power lines (PL1 to PL3) may be disposed on the substrate (110). The plurality of power lines may include a plurality of first power lines (PL1), a plurality of second power lines (PL2), a third power line (PL3), etc.

[0077] The third power wiring (PL3) can be electrically connected to the power terminal (101). The first power wiring (PL1) and the second power wiring (PL2) can electrically connect the third power wiring (PL3) to a plurality of subpixels (SPr, SPg, SPb) on the display area (AA).

[0078] The third power wiring (PL3) is placed on a different layer from the first and second power wirings (PL1, PL2), and the first and second power wirings (PL1, PL2) may be placed on the same layer, but are not limited thereto.

[0079] The first and second power lines (PL1, PL2) can be electrically connected to the third power line (PL3) using a contact pad. For example, the second power line (PL2) may be extended from the display area (AA) to the non-display area (NAA) and electrically connected to the third power line (PL3) using a contact pad in the non-display area (NAA). The contact pad may be placed in the non-display area (NAA), but is not limited thereto.

[0080] For example, the first and second power lines (PL1, PL2) can be formed together with the source and drain electrodes of the driving transistor. That is, the source and drain electrodes of the driving transistor and the first and second power lines (PL1, PL2) can be formed on the same layer using the same material with the same process.

[0081] For example, the third power wiring (PL3) can be formed together with the cathode electrode. That is, the cathode electrode and the third power wiring (PL3) can be formed on the same layer using the same material with the same process.

[0082] Meanwhile, a plurality of first power lines (PL1) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y), and a plurality of second power lines (PL2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). A plurality of first power lines (PL1) may be arranged lengthwise along the first direction (X) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). A plurality of second power lines (PL2) may be arranged lengthwise along the second direction (Y) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X).

[0083] A plurality of banks may include a plurality of first banks (111-1) and a plurality of second banks (111-2). The first banks (111-1) and the second banks (111-2) may intersect and be connected to each other. The plurality of first banks (111-1) and the plurality of second banks (111-2) may have a matrix structure.

[0084] A plurality of first banks (111-1) may be arranged to correspond to a plurality of first power lines (PL1), and a plurality of second banks (111-2) may be arranged to correspond to a plurality of second power lines (PL2). That is, a plurality of first banks (111-1) may be arranged on a plurality of first power lines (PL1), and a plurality of second banks (111-2) may be arranged on a plurality of second power lines (PL2).

[0085] A plurality of first banks (111-1) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y), and a plurality of second banks (111-2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). A plurality of first banks (111-1) may be arranged lengthwise along the first direction (X) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). A plurality of second banks (111-2) may be arranged lengthwise along the second direction (Y) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X).

[0086] Multiple subpixels (SPr, SPg, SPb) may each include a light-emitting region (EA) and a non-light-emitting region (NEA).

[0087] For example, the light-emitting region (EA) may be separated by a first bank (111-1) and a second bank (111-2). The light-emitting region (EA) may be surrounded by the first bank (111-1) and the second bank (111-2).

[0088] As another example, the light-emitting region (EA) can be separated by an anode electrode (121r, 121g) individually provided in each of the subpixels (SPr, SPg, SPb).

[0089] As another example, the light-emitting region (EA) can be defined by the organic light-emitting layer (122r, 122g) exposed by the first bank (111-1) and the second bank (111-2).

[0090] Meanwhile, the region corresponding to each of the first and second banks (111-1, 111-2) may be defined as a non-emissive region (NEA). In this case, the first and second banks (111-1, 111-2) may be shared by adjacent subpixels. That is, a portion of the first and second banks (111-1, 111-2) may be included in one subpixel, and another portion of the first and second banks (111-1, 111-2) may be included in another subpixel adjacent to one subpixel.

[0091] A plurality of organic light-emitting elements (120r, 120g) may be arranged in a plurality of subpixels (SPr, SPg, SPb). A plurality of organic light-emitting elements (120r, 120g) may include a plurality of anode electrodes (121r, 121g), a plurality of organic light-emitting layers (122r, 122g), and a plurality of cathode electrodes (123r, 123g).

[0092] Anode electrodes (121r, 121g) may be placed only in each subpixel (SPr, SPg, SPb) along the first direction (X) and the second direction (Y). A red anode electrode (121r) may be placed only in a plurality of red subpixels (SPr) along the second direction (Y), and a green anode electrode (121g) may be placed only in a plurality of green subpixels (SPg) along the second direction (Y). Although not illustrated, a blue anode electrode may be placed only in a plurality of blue subpixels (SPb) along the second direction (Y).

[0093] The organic light-emitting layers (122r, 122g) may be separated from each other along the first direction (X) but may be arranged along the second direction (Y). The red organic light-emitting layer (122r) may be arranged along the second direction (Y) in multiple red subpixels (SPr) as well as in multiple first banks (111-1). The green organic light-emitting layer (122g) may be arranged along the second direction (Y) in multiple green subpixels (SPg) as well as in multiple first banks (111-1). The blue organic light-emitting layer (not shown) may be arranged along the second direction (Y) in multiple subpixels (SPr, SPg, SPb) as well as in multiple first banks (111-1). The red organic light-emitting layer (122r), the green organic light-emitting layer (122g), and the blue organic light-emitting layer may be referred to as the first organic light-emitting layer, the second organic light-emitting layer, and the third organic light-emitting layer, respectively.

[0094] The cathode electrodes (123r, 123g) are separated from each other along the first direction (X) but can be arranged along the second direction (Y). The red cathode electrode (123r) can be arranged in multiple subpixels (SPr, SPg, SPb) as well as multiple first banks (111-1) along the second direction (Y). The green cathode electrode (123g) can be arranged in multiple green subpixels (SPg) as well as multiple first banks (111-1) along the second direction (Y). Although not illustrated, the blue cathode electrode can be arranged in multiple subpixels (SPr, SPg, SPb) as well as multiple first banks (111-1) along the second direction (Y). The red cathode electrode (123r), green cathode electrode (123g), and blue cathode electrode can be called the first cathode electrode, the second cathode electrode, and the third cathode electrode, respectively.

[0095] Multiple connection structures (130) may be placed in multiple first banks (111-1). Although the drawing shows that the connection structures (130) are placed in all of the multiple first banks (111-1), they may not be placed in all of the multiple first banks (111-1). That is, the connection structures (130) may be placed in some of the multiple first banks (111-1).

[0096] A plurality of first banks (111-1) may have a plurality of first grooves (131-1). The first grooves (131-1) may be formed locally only in a portion of the first bank (111-1) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). That is, the first grooves (131-1) may have a dot shape. The first grooves (131-1) may have a circular or square shape when viewed from above, but are not limited thereto. The first grooves (131-1) may be formed penetrating from the upper surface to the lower surface of the first bank (111-1), but are not limited thereto.

[0097] As illustrated in FIG. 2, the connection structure (130) can be placed in the first groove (131-1) of the first bank (111-1). The connection structure (130) can electrically connect the green cathode electrode (123g) to the first power wiring (PL1) in the first groove (131-1) of the first bank (111-1).

[0098] The green organic light-emitting layer (122g) and the green cathode electrode (123g) may be arranged across the first bank (111-1) along the second direction (Y). In this case, the green organic light-emitting layer (122g) and the green cathode electrode (123g) may each be separated from the first groove (131-1) of the first bank (111-1). That is, the green organic light-emitting layer (122g) on ​​the upper side of the first bank (111-1) and the green organic light-emitting layer (122g) in the first groove (131-1) may be separated from each other. The green cathode electrode (123g) on ​​the upper side of the first bank (111-1) and the green cathode electrode (123g) in the first groove (131-1) may be separated from each other. In this case, the green cathode electrode (123g) can be electrically connected to the connection structure (130) through the separated green organic light-emitting layer (122g) in the first groove (131-1).

[0099] Although not shown, the red cathode electrode (123r) and the blue cathode electrode can each be electrically connected to the connection structure (130) in the first groove (131-1).

[0100] The undercut structure (138) may be formed on the lower side of the first bank (111-1) that contacts the first groove (131-1). For example, the undercut structure (138) may be formed by the side of the interlayer insulating layer (103) that contacts the first groove (131-1) moving inward from the inner side of the first bank (111-1) toward the outer side.

[0101] The connection structure (130) may include an auxiliary electrode (132) extending from the first power wiring (PL1). Among the first power wiring (PL1) arranged lengthwise along the first direction (X), the first power wiring (PL1) corresponding to the first groove (131-1) of the first bank (111-1) may be formed as the auxiliary electrode (132). Thus, the auxiliary electrode (132) may be part of the first power wiring (PL1). The width of the auxiliary electrode (132) may be greater than the width of the first power wiring (PL1), but is not limited thereto.

[0102] Although FIG. 2 illustrates a plurality of connection structures (130) arranged between a plurality of green subpixels (SPg) in the second direction (Y), a plurality of connection structures (130) arranged between a plurality of red subpixels (SPr) in the second direction (Y) and a plurality of connection structures (130) between a plurality of blue subpixels (SPb) in the second direction (Y) may also be identical to the plurality of connection structures (130) arranged between a plurality of green subpixels (SPg).

[0103] By disconnecting the green organic light-emitting layer (122g) by the undercut structure (138), a portion of the auxiliary electrode (132) may be exposed. Accordingly, the green cathode electrode (123g) may come into contact with the portion of the exposed auxiliary electrode (132) in the undercut structure (138). In other words, the green cathode electrode (123g) may be electrically connected to the first power wiring (PL1) through the connection structure (130).

[0104] Since the undercut structure (138) cuts off the green organic light-emitting layer (122g) and causes the green cathode electrode (123g) to come into contact with the auxiliary electrode (132), the undercut structure (138) may also be included in the connection structure (130), but is not limited thereto.

[0105] The interlayer insulating layer (103) may have a first groove (104) corresponding to the first groove (131-1) of the first bank (111-1). The first groove (104) of the interlayer insulating layer (103) may be formed between a plurality of green subpixels (SPg) in the second direction (Y), corresponding to the first groove (131-) of the first bank (111-1).

[0106] The undercut structure (138) may come into contact with the first layer (131-1) of the first bank (111-1) and the first groove (104) of the interlayer insulating layer (103). In this case, the auxiliary electrode (132) of the connection structure (130) is exposed in the undercut structure (138), and the green cathode electrode (123g) may come into contact with a portion of the exposed auxiliary electrode (132).

[0107] Meanwhile, as illustrated in FIG. 4, a plurality of second banks (111-2) may be arranged between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). A plurality of second banks (111-2) may be arranged lengthwise along the second direction (Y) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X). A plurality of second grooves (131-2) may be formed in the plurality of second banks (111-2). A plurality of second grooves (131-2) may be arranged lengthwise along the second direction (Y) between a plurality of subpixels (SPr, SPg, SPb) in the first direction (X), but this is not limited thereto. A second groove (131-2) may be formed penetrating from the upper surface to the lower surface of the second bank (111-2), but this is not limited thereto.

[0108] The interlayer insulating layer (103) may have a second groove (105) corresponding to the second groove (131-2) of the second bank (111-2). The second groove (105) of the interlayer insulating layer (103) may be formed between the red subpixel (SPr) and the green subpixel (SPg), corresponding to the second groove (131-2) of the second bank (11-2).

[0109] Meanwhile, referring to FIGS. 1 to 4, the organic light-emitting display device according to the embodiment may include a plurality of inorganic insulating layers (135-1, 135-2, 135-4), an organic insulating layer (141-4), a plurality of waterproof structures (143 to 145), etc.

[0110] A plurality of inorganic insulating layers may include a first inorganic insulating layer (135-1), a second inorganic insulating layer (135-2), a third inorganic insulating layer (135-3), and a fourth inorganic insulating layer (135-4). The first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), the third inorganic insulating layer (135-3), and the fourth inorganic insulating layer (135-4) may each include at least one inorganic insulating film.

[0111] A first inorganic insulating layer (135-1) may be placed on the green cathode electrode (123g) of a green organic light-emitting element (120g) in a green subpixel (SPg), and a second inorganic insulating layer (135-2) may be placed on the red cathode electrode (123r) of a red organic light-emitting element (120r) in a red subpixel (SPr). Although not illustrated, a third inorganic insulating layer (135-3) may be placed on the blue cathode electrode of a blue organic light-emitting element (120b) in a blue subpixel (SPb).

[0112] The first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) may be composed of a double layer comprising a silicon oxide layer and a silicon nitride layer. The silicon nitride layer may be disposed on the silicon oxide layer. For example, the silicon oxide layer may be formed using an atomic layer deposition (ALD) process, and the silicon nitride layer may be formed using a chemical vapor deposition (CVD) process.

[0113] When each of the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) is formed as a double layer, each of the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) can be formed without interruption on the lower side of the second bank (111-2), the side of the interlayer insulating layer (103), and the upper side of the second power wiring (PL2) in the first undercut structure (151) and the second undercut structure (152).

[0114] The first waterproof structure (143) may be formed by overlapping two or more inorganic insulating layers among the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) in the second groove (131-2) of the second bank (111-2). The waterproof performance of the first waterproof structure (143) can be enhanced by not only having each of the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) form a double layer, but also by overlapping two or more inorganic insulating layers among the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3).

[0115] Each of the first inorganic insulating layer (135-1), the second inorganic insulating layer (135-2), and the third inorganic insulating layer (135-3) can be formed in a curved shape in the first undercut structure (151) and the second undercut structure (152).

[0116] The second waterproof structure (144) can be formed by the curved shape of the first inorganic insulating layer (135-1) formed in the first undercut structure (151). The third waterproof structure (145) can be formed by the curved shape of the second inorganic insulating layer (135-2) formed in the second undercut structure (152). Since the penetration path of moisture, oxygen, etc. is further increased by the curved shape of the first inorganic insulating layer (135-1) or the curved shape of the second inorganic insulating layer (135-2), the waterproof performance of each of the second waterproof structure (144) and the third waterproof structure (145) can be enhanced. Accordingly, the penetration of moisture, oxygen, etc. is prevented by the second waterproof structure (144) and the third waterproof structure (145), so that the organic light-emitting layer (122r, 122g) and the cathode electrode (123r, 123g) can be protected from moisture, oxygen, etc. Therefore, operational failures or light emission failures of the red subpixel (SPr) and green subpixel (SPg) can be prevented, thereby improving reliability.

[0117] Although not shown, the operation or light emission failure of the blue subpixel (SPb) can be prevented by the waterproof structure formed by the third inorganic insulating layer (135-3).

[0118] The fourth inorganic insulating layer (135-4) may be disposed over the entire area of ​​the substrate (110). The fourth inorganic insulating layer (135-4) may include at least one inorganic insulating film.

[0119] Accordingly, by placing a plurality of inorganic insulating layers (135-1, 135-2, 135-4) on each of the plurality of subpixels (SPr, SPg, SPb) or on the entire area of ​​the substrate (110), the penetration of moisture, oxygen, etc. can be completely blocked.

[0120] Meanwhile, as illustrated in FIG. 4, a plurality of waterproof structures (143 to 145) may be placed in the second groove (131-2) of the second bank (111-2) between the red subpixel (SPr) and the green subpixel (SPg).

[0121] By placing a plurality of waterproof structures, namely the first waterproof structure (143), the second waterproof structure, and the third waterproof structure (145), in the second groove (131-2) of the second bank (111-2), the penetration of moisture, oxygen, etc. can be completely blocked.

[0122] The first waterproof structure (143) may be configured such that two or more inorganic insulating layers among a plurality of inorganic insulating layers (135-1, 135-2) are superimposed on the second bank (111-2).

[0123] As illustrated in FIG. 4, a first inorganic insulating layer (135-1), a second inorganic insulating layer (135-2), and a third inorganic insulating layer (135-3) may be superimposed in the second groove (131-2) of the second bank (111-2) positioned between the red subpixel (SPr) and the green subpixel (SPg) to form a first waterproof structure (143). For example, the second inorganic insulating layer (135-2) may be placed on the first inorganic insulating layer (135-1), and the third inorganic insulating layer (135-3) may be placed on the second inorganic insulating layer (135-2). The third inorganic insulating layer (135-3), which is the uppermost layer, may be an island insulating pattern. The island insulation pattern is part of the third inorganic insulation layer (135-3) disposed on the blue cathode electrode of the blue subpixel (SPb) and can be spaced apart from the third inorganic insulation layer (135-3). Since the island insulation pattern is included in the first waterproof structure (143), waterproof performance can be further improved.

[0124] Although not shown, a plurality of waterproof structures (143 to 145) may be disposed in the second groove (131-2) of the second bank (111-2) positioned between the blue subpixel (SPb) and the red subpixel (SPr). Additionally, a plurality of waterproof structures (143 to 145) may be disposed in the second groove (131-2) of the second bank (111-2) positioned between the green subpixel (SPg) and the blue subpixel (SPb).

[0125] Meanwhile, as illustrated in FIG. 4, the second waterproof structure and the third waterproof structure (145) may be configured such that one of the plurality of inorganic insulating layers (135-1, 135-2) is formed in a curved shape by the first undercut structure (151) and the second undercut structure (152). The first undercut structure (151) and the second undercut structure (152) may be formed on the lower side of the second bank (111-2) that contacts the second groove (131-2) of the second bank (111-2). The first undercut structure (151) and the second undercut structure (152) may be formed by removing the interlayer insulating layer (103) located on the lower side of the second bank (111-2) that contacts the second groove (131-2) of the second bank (111-2). That is, the side of the interlayer insulation layer (103) may be moved outward from the inner part of the second bank (111-2) that contacts the second groove (131-2) of the second bank (111-2), thereby forming the first undercut structure (151) and the second undercut structure (152). The second waterproof structure and the third waterproof structure (145) may be placed on the second power wiring (PL2) located in the second groove (131-2) of the second bank (111-2).

[0126] Meanwhile, a plurality of second power wirings (PL2) may be disposed below a plurality of second banks (111-2). The plurality of second power wirings (PL2) may be exposed by a plurality of second grooves (131-2) of the plurality of second banks (111-2). In this case, a first waterproof structure (143) in which at least two of the plurality of inorganic insulating layers (135-1, 135-2) are superimposed may be positioned on the plurality of second power wirings (PL2). The first waterproof structure (143) composed of at least two inorganic insulating layers may be disposed on the second power wirings (PL2) located in the second grooves (131-2) of the second banks (111-2). At this time, the second power wirings (PL2) may be omitted. When the second power wiring (PL2) is omitted, at least one of the plurality of first power wirings (PL1) may be extended to a non-display area (NAA) and electrically connected to a power terminal (101).

[0127] According to the embodiment, a connection structure (130) is arranged between a plurality of subpixels (SPr, SPg, SPb) having the same color along the second direction (Y), thereby ensuring smooth power supply and preventing supply failures such as voltage drop, which can improve image quality and increase reliability.

[0128] According to the embodiment, at least two waterproof structures are arranged in the first bank (111-1), so that moisture, oxygen, etc. penetrating along the second direction (Y) do not penetrate into the plurality of subpixels (SPr, SPg, SPb), thereby preventing malfunction or light emission failure of the subpixels and improving reliability.

[0129] Meanwhile, referring to FIGS. 1 to 3, an organic light-emitting display device according to an embodiment may include a blocking structure (134-1, 134-2). The blocking structure (134-1, 134-2) may have an undercut structure (115, 116) formed in the edge region of the first bank (111-1). For example, the blocking structure (134-1, 134-2) may be disposed in the lower edge region of each of the plurality of banks (111-1, 111-2), but is not limited thereto.

[0130] The blocking structure (134-1, 134-2) may include at least one blocking layer (113) for forming an undercut structure (115, 116) that extends inward from the side of the first bank (111-1). A first undercut structure (151) and a second undercut structure (152) may be formed in the edge region of the first bank (111-1) by the blocking layer (113). The blocking layer (113) may include a silicon-based inorganic material, a metal, etc. Aluminum (Al), molybdenum (Mo), a molybdenum alloy, etc. may be used as the metal, but are not limited thereto.

[0131] Although not shown in FIG. 4, the blocking structure (134-1, 134-2) may be placed in the edge area of ​​the second bank (111-2), but may be omitted.

[0132] Hereinafter, with reference to FIGS. 5a to 5k and FIGS. 6a to 6k, a process for sequentially manufacturing a green organic light-emitting element (120g) and a red organic light-emitting element (120r) will be described. Although not illustrated, a blue organic light-emitting element (120b) may be manufactured after the red organic light-emitting element (120r) is manufactured.

[0133] FIGS. 5a to 5k illustrate the manufacturing process of an organic light-emitting display device along the A-A' line of FIG. 1. FIGS. 6a to 6k illustrate the manufacturing process of an organic light-emitting display device along the D-D' line of FIG. 1. A green organic light-emitting element (120g) can be manufactured through the manufacturing process illustrated in FIGS. 5a to 5k, and a red organic light-emitting element (120r) can be manufactured through the manufacturing process illustrated in FIGS. 6a to 6k. The manufacturing process of a blue organic light-emitting element (120b) can be easily understood through the manufacturing process of a red organic light-emitting element (120r) illustrated in FIGS. 6a to 6k.

[0134] FIGS. 5a to 5k and FIGS. 6a to 6k are shown as being manufactured in the order of a green organic light-emitting element (120g), a red organic light-emitting element (120r), and a blue organic light-emitting element (120b), but the order can also be changed.

[0135] As illustrated in FIGS. 1, 5a and 6a, a driving circuit, a first power wiring (PL1), a second power wiring (PL2), an auxiliary electrode (132), and an interlayer insulating layer (103) may be formed on a substrate (110).

[0136] The substrate (110) may include a material with excellent insulation performance. For example, the substrate (110) may include a plastic material, a resin material, glass, etc. The substrate (110) may include a rigid material or a flexible material.

[0137] The driving circuit may include a plurality of transistors including a driving transistor, at least one capacitor, etc. The driving circuit may be formed on a substrate (110) using a semiconductor process. Each of the plurality of transistors may include a gate electrode, a source electrode, and a drain electrode.

[0138] The first power wiring (PL1), the second power wiring (PL2), and the auxiliary electrode (132) can be formed of the same material as the source electrode and the drain electrode.

[0139] The auxiliary electrode (132) is formed by extending from the first power wiring (PL1) and may constitute a part of the first power wiring (PL1). The auxiliary electrode (132) may be formed between a plurality of green subpixels (SPg) in the second direction (Y). Although not illustrated, the auxiliary electrode (132) may be formed between a plurality of red subpixels (SPr) in the second direction (Y) and / or between a plurality of blue subpixels (SPb) in the second direction (Y).

[0140] An interlayer insulating layer (103) may be formed on the first power wiring (PL1), the second power wiring (PL2), and the auxiliary electrode (132). Subsequently, the interlayer insulating layer (103) may be removed so that the auxiliary electrode (132) is exposed, and a first groove (104) may be formed in the interlayer insulating layer (103).

[0141] The interlayer insulating layer (103) may be a single organic insulating film or may include a plurality of insulating films including an organic insulating film and an inorganic insulating film.

[0142] By removing the interlayer insulating layer (103) between a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y) through an etching process, a first groove (104) can be formed. The upper surface of the auxiliary electrode (132) can be exposed by the first groove (104). A connection structure (130) can be formed by the auxiliary electrode (132).

[0143] As illustrated in FIGS. 5b and 6b, a green anode electrode (121g) and a red anode electrode (121r) may be formed on the interlayer insulating layer (103). The red anode electrode (121r) may be formed on a red subpixel (SPr), and the green anode electrode (121g) may be formed on a green subpixel (SPg). Although not illustrated, a blue anode electrode may be formed on a blue subpixel (SPb).

[0144] A blocking layer (113) can be formed on the green anode electrode (121g) and the red anode electrode (121r).

[0145] For example, a conductive film and a blocking film may be formed and patterned on a substrate to form a green anode electrode (121g), a red anode electrode (121r), and a blocking layer (113). When the conductive film and the blocking film are etched using the same photosensitive pattern, the side of the patterned green anode electrode (121g) and the side of the patterned blocking layer (113) may be located on the same vertical line or diagonal, and the side of the patterned red anode electrode (121r) and the side of the patterned blocking layer (113) may be located on the same vertical line or diagonal.

[0146] As illustrated in FIGS. 5c and 6c, an inorganic film (111a) can be formed on the interlayer insulating layer (103).

[0147] As illustrated in FIGS. 5d and 6d, a first photosensitive pattern (210) and a second photosensitive pattern (212) can be formed on an inorganic film (111a).

[0148] The first photosensitive pattern (210) may have a groove (215) on an auxiliary electrode (132) between a plurality of green subpixels (SPg) in the second direction (Y). The upper surface of the inorganic film (111a) may be exposed by the groove (215).

[0149] A second photosensitive pattern (212) can be formed on a plurality of red subpixels (SPr) in the second direction (Y) as well as on an auxiliary electrode (132) between the plurality of red subpixels (SPr). At this time, the thickness of the second photosensitive pattern (212) on the auxiliary electrode (132) can be formed as a half mask that is thicker than the thickness of the red subpixels (SPr).

[0150] As illustrated in FIGS. 5e and 6e, a dry etching process is performed using a first photosensitive pattern (210) and a second photosensitive pattern (212) so that an inorganic film (111a) can be removed.

[0151] The inorganic film (111a) exposed by the first photosensitive pattern (210) can be removed so that the blocking layer (113) and the auxiliary electrode (132) are exposed. That is, the inorganic film (111a) on the green anode electrode (121g) can be removed, and the inorganic film (111a) on the auxiliary electrode (132) between the green subpixels (SPg) can be removed. By removing the inorganic film (111a) on the auxiliary electrode (132) between the green subpixels (SPg), a first bank (111-1) having a first groove (131-1) can be formed. The first groove (131-1) can be formed locally only in the first bank (111-1) between adjacent green subpixels (SPg) in the second direction (Y).

[0152] In contrast, since the inorganic film (111a) is protected by the second photosensitive pattern (212), the inorganic film (111a) on the plurality of red subpixels (SPr) and auxiliary electrode (132) may not be removed.

[0153] Meanwhile, by performing a dry etching process, the second photosensitive pattern (212) on the remaining area, excluding the periphery of the auxiliary electrode (132) between the plurality of red subcells (SPr), can be removed. As the second photosensitive pattern (212) on the remaining area is removed, the upper surface of the inorganic film (111a) can be exposed. The upper surface of the exposed inorganic film (111a) may be removed by the dry etching process, and the thickness of the inorganic film (111a) may be reduced, but this is not limited thereto.

[0154] Next, a wet etching process can be performed using the first photosensitive pattern (210) and the second photosensitive pattern (212).

[0155] As illustrated in FIG. 5f, the blocking layer (113) in the green subpixel (SPg) can be removed through a wet etching process. As the wet etching process is continuously performed to remove the blocking layer (113) located under the first bank (111-1), an undercut structure (115, 116) can be formed. That is, as the side of the blocking layer (113) moves inward from the outer part of the first bank (111-1) to the inner direction, a blocking structure (134-1, 134-2) having an undercut structure (115, 116) can be formed.

[0156] Subsequently, another etching process is additionally performed so that the interlayer insulating layer (103) exposed in the first groove (131-1) of the first bank (111-1) moves inward from the lower side of the first bank (111-1) toward the outside, thereby forming an undercut structure (138). The connection structure (130) may include the undercut structure (138) along with the auxiliary electrode (132), but is not limited thereto.

[0157] In contrast, as illustrated in FIGS. 6e and 6f, the inorganic film (111a) is removed through a wet etching process,

[0158] A blocking layer (113) in a red subpixel (SPr) may be exposed, and a first bank (111-1) having a first groove (131-1) may be formed. An auxiliary electrode (132) may be exposed by the first groove (131-1).

[0159] As illustrated in FIGS. 5g and 6g, after the first photosensitive pattern (210) and the second photosensitive pattern (212) are removed, a cleaning process can be performed.

[0160] As illustrated in FIGS. 5h to 5j and FIGS. 6h, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) may be formed on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110).

[0161] First, as illustrated in FIG. 5h, a green organic light-emitting layer (122g) may be deposited on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110). The green organic light-emitting layer (122g) may be deposited on the red subpixel (SPr), green subpixel (SPg), blue subpixel (SPb), and first and second banks (111-1, 111-2).

[0162] The green organic light-emitting layer (122g) may have at least two stacked structures. The green organic light-emitting layer (122g) may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, a charge generation layer, etc.

[0163] The green organic light-emitting layer (122g) can be separated by the undercut structure (138). That is, the green organic light-emitting layer (122g) formed in the first groove (131-1) of the first bank (111-1) and the green organic light-emitting layer (122g) formed on the upper side of the first bank (111-1) can be separated from each other by the undercut structure (138).

[0164] By the undercut structure (115, 116) of the blocking structure (134-1, 134-2), some layers of the green organic light-emitting layer (122g), such as the hole injection layer and / or charge generation layer, are cut off, thereby blocking leakage current flowing to the hole injection layer, charge generation layer, etc., so that image quality defects can be prevented.

[0165] As illustrated in FIG. 5i, a green cathode electrode (123g) can be deposited on a green organic light-emitting layer (122g). The green organic light-emitting layer (122g) and the green cathode electrode (123g) can be deposited using different deposition angles (θ1, θ2). The deposition angles can be defined with respect to a vertical line.

[0166] The deposition angle (θ2) for depositing the green cathode electrode (123g) may be greater than the deposition angle (θ1) for depositing the green organic light-emitting layer (122g). In this case, the green organic light-emitting layer (122g) may be deposited at the entrance of the undercut structure (138). Conversely, the green cathode electrode (123g) may be deposited into the interior of the undercut structure (138) and may come into contact with a portion of the upper surface of the auxiliary electrode (132) in the undercut structure (138).

[0167] As shown in FIG. 5j, a first inorganic insulating layer (135-1) can be formed on a green cathode electrode (123g).

[0168] As illustrated in FIG. 6h, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) may be formed on a red subpixel (SPr). Although not illustrated, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) may also be formed on a blue subpixel (SPb).

[0169] The first inorganic insulating layer (135-1) may be composed of a double layer including a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer may be formed using an ALD process, and the silicon nitride layer may be formed using a CVD process.

[0170] As illustrated in FIG. 6i, the green organic light-emitting layer (122g), green cathode electrode (123g), and first inorganic insulating layer (135-1) formed on a plurality of red subpixels (SPr) in the second direction (Y) can be removed. That is, the green organic light-emitting layer (122g), green cathode electrode (123g), and first inorganic insulating layer (135-1) can be formed only on a plurality of auxiliary electrodes (130) between a plurality of green subpixels (SPg) in the second direction (Y).

[0171] Accordingly, the blocking layer (113) formed in the red subpixel (SPr) and the auxiliary electrode (132) formed in the first groove (131-1) of the first bank (111-1) may be exposed. Although not illustrated, the green organic light-emitting layer (122g), green cathode electrode (123g), and the first inorganic insulating layer (135-1) formed in the blue subpixel (SPb) in the second direction (Y) may be removed. Accordingly, a green organic light-emitting layer (122g), a green cathode electrode (123g), and a first inorganic insulating layer (135-1) are formed only on the auxiliary electrode (132) between the plurality of green subpixels (SPg) in the second direction (Y), thereby manufacturing a plurality of green organic light-emitting elements (120g) on ​​the plurality of green subpixels (SPg) in the second direction (Y), and the green cathode electrode (123g) of the green organic light-emitting element (120g) can be electrically connected to the first power wiring (PL1) through the connection structure (130).

[0172] At the stage where the deposition of the green cathode electrode (123g) is completed (Fig. 5i), the cross-sectional structure of the connection structure (130) of the red subpixel (SPr) can be shown in Fig. 6h.

[0173] When comparing the cross-sectional structures of the drawing shown in FIG. 5i and the drawing shown in FIG. 6h, it can be seen that when the green organic light-emitting element (120g) is formed in the red subpixel (SPr), there is no undercut structure or blocking structure in the red subpixel (SPr).

[0174] Although not shown, at the stage where the manufacturing of the green subpixel (SPg) is completed (Fig. 5k), an organic insulating layer is formed on the red subpixel (SPr) and then removed (same structure as Fig. 6h), and the first inorganic insulating layer (135-1) and the organic light-emitting element (122g, 123g) are removed from the green subpixel (SPg) through a dry etching process.

[0175] By performing the aforementioned process in a state where the undercut structure is not formed (Fig. 6h), residual film that may occur in the undercut structure can be fundamentally blocked.

[0176] Meanwhile, an undercut structure, a blocking structure, etc., may be formed immediately before the red organic light-emitting diode (120r) is formed on the red subpixel (Pr) (Fig. 6j).

[0177] After the green organic light-emitting element (120g) is manufactured, a red organic light-emitting element (120r) can be manufactured as shown in FIGS. 6j to 6k. Although not shown, after the red organic light-emitting element (120r) is manufactured, a blue organic light-emitting element (120r) can be manufactured. Subsequently, as shown in FIG. 5k, an organic insulating layer (141-4) and a fourth inorganic insulating layer (135-4) are formed, thereby manufacturing an organic light-emitting display device according to the embodiment.

[0178] Hereinafter, the manufacturing process of a red organic light-emitting diode (120r) will be described with reference to FIGS. 6j to 6k.

[0179] As described above, the final process for completing the patterning of the green subpixel (SPg) is a step in which a connection structure, a blocking structure, etc. is formed on the red subpixel (SPr). A separate photolithography process may be required to form the connection structure, the blocking structure, etc., but is not limited thereto.

[0180] As illustrated in FIG. 6j, a photosensitive pattern can be formed on the remaining area excluding the plurality of red subpixels (SPr) in the second direction (Y), namely the plurality of green subpixels (SPg) and the plurality of blue subpixels (SPb) in the second direction (Y).

[0181] Subsequently, a wet etching process is performed using a photosensitive pattern, thereby removing the blocking layer (113) exposed to a plurality of red subpixels (SPr) and the blocking layer (113) located below the first bank (111-1), so that an undercut structure (115, 116) can be formed. That is, by moving the side of the blocking layer (113) inward from the outer part of the first bank (111-1), a blocking structure (134-1, 134-2) having an undercut structure (115, 116) can be formed.

[0182] Subsequently, another etching process is additionally performed so that the interlayer insulating layer (103) exposed in the first groove (131-1) of the first bank (111-1) moves inward from the lower side of the first bank (111-1) toward the outside, thereby forming an undercut structure (138). The connection structure (130) may include the undercut structure (138) along with the auxiliary electrode (132), but is not limited thereto.

[0183] As illustrated in FIG. 6k, a red organic light-emitting layer (122r), a red cathode electrode (123r), and a second inorganic insulating layer (135-2) may be formed on the entire area of ​​the substrate (110) or on the display area (AA) of the substrate (110). That is, the red organic light-emitting layer (122r), the red cathode electrode (123r), and the second inorganic insulating layer (135-2) may be formed on a plurality of red subpixels (SPr), a plurality of green subpixels (SPg), and a plurality of blue subpixels (SPb).

[0184] The second inorganic insulating layer (135-2) may be composed of a double layer including a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer may be formed using an ALD process, and the silicon nitride layer may be formed using a CVD process.

[0185] Afterwards, a photosensitive pattern is formed on a plurality of red subpixels (SPr) in the second direction (Y), and then an etching process can be performed using the photosensitive pattern.

[0186] Through an etching process, the red organic light-emitting layer (122r), red cathode electrode (123r), and second inorganic insulating layer (135-2) on the remaining area excluding the plurality of red subpixels (SPr), namely the plurality of green subpixels (SPg) and the plurality of blue subpixels (SPb), can be removed. Accordingly, the red organic light-emitting layer (122r), red cathode electrode (123r), and second inorganic insulating layer (135-2) are formed only on the plurality of red subpixels (SPr) in the second direction (Y), thereby allowing a plurality of red organic light-emitting elements (120r) to be manufactured on the plurality of green subpixels (SPg) in the second direction (Y).

[0187] Although not illustrated, a blue organic light-emitting diode (120b) can be manufactured through a process similar to the manufacturing process of a plurality of red organic light-emitting diodes (120r). That is, a blue organic light-emitting diode can be manufactured by stacking and patterning a blue green light-emitting layer, a blue cathode electrode, and a third inorganic insulating layer (135-3).

[0188] As described above, a green organic light-emitting diode (120g), a red organic light-emitting diode (120r), and a blue organic light-emitting diode can be manufactured sequentially.

[0189] Afterward, as illustrated in FIG. 5k, after a blue organic light-emitting diode is manufactured, an organic insulating layer (141-4) is formed over the entire area of ​​the substrate (110) or the display area (AA) of the substrate (110), and a fourth inorganic insulating layer (135-4) can be formed on the organic insulating layer (141-4).

[0190] Although not shown, at least one inorganic insulating film may be formed under the organic insulating layer (141-4).

[0191] The organic insulating layer (141-4) may be formed using an inkjet process, but is not limited thereto. The fourth inorganic insulating layer (135-4) may be formed using an inorganic material such as silicon nitride (SiNx) using a PECVD process, but is not limited thereto.

[0192] FIG. 7 illustrates the different positions of the grooves of the photosensitive pattern relative to the grooves of the interlayer insulating layer along the second direction (Y). FIG. 8 illustrates the positional relationship between the grooves of the interlayer insulating layer and the grooves of the photosensitive pattern. FIG. 9 illustrates the arrangement of the grooves of the photosensitive pattern on different sides of the grooves of the interlayer insulating layer.

[0193] Multiple undercut structures (138) may be positioned differently from each other in multiple first grooves (131-1) of multiple first banks (111-1).

[0194] As illustrated in FIGS. 7 to 9, the placement position of the plurality of undercut structures (138) may vary depending on the position of the groove of the first photosensitive pattern (210) relative to the first groove (104) of the interlayer insulating layer (103).

[0195] For example, the first groove (104) of the interlayer insulating layer (103) and the groove of the first photosensitive pattern (210) may each have a square shape when viewed from above, but are not limited thereto.

[0196] As illustrated in FIG. 7, in the connection structure (130) on the m-th row line, the groove of the first photosensitive pattern (210) can be formed to the right and rearward relative to the first groove (104) of the interlayer insulating layer (103). When an etching process is performed using the first photosensitive pattern (210), an undercut structure (138) can be formed below the first bank (111-1) on the right and rearward side of the first groove (104).

[0197] In the connection structure (130) on the (m+1)th row line, the groove of the first photosensitive pattern (210) can be formed to be offset to the rear and left with respect to the first groove (104) of the interlayer insulating layer (103). When an etching process is performed using the first photosensitive pattern (210), an undercut structure (138) can be formed below the first bank (111-1) on the rear and left side of the first groove (104).

[0198] In the connection structure (130) on the (m+2)th row line, the groove of the first photosensitive pattern (210) can be formed to the left and front of the first groove (104) of the interlayer insulating layer (103). When an etching process is performed using the first photosensitive pattern (210), an undercut structure (138) can be formed below the first bank (111-1) on the left and front of the first groove (104).

[0199] In the connection structure (130) on the (m+3)th row line, the groove of the first photosensitive pattern (210) can be formed offset to the front and right with respect to the first groove (104) of the interlayer insulating layer (103). When an etching process is performed using the first photosensitive pattern (210), an undercut structure (138) can be formed below the first bank (111-1) on the front and right of the first groove (104).

[0200] The four connection structures shown on the left side of FIG. 7 will be described in detail. For example, as shown in FIGS. 7 to 9, two of the four sides of the first groove (104, 131-1) may have an undercut structure (138) formed on them, while the remaining two sides may not have an undercut structure (138) formed on them.

[0201] In the deposition apparatus, the organic light-emitting material can be evaporated in a certain direction and at a certain angle (Fig. 5i) by means of an angle limiting plate. In the area where the undercut structure (138) is formed, the organic light-emitting material is not deposited on part of the undercut structure due to the shadow effect, so a part of the auxiliary electrode (132) may be exposed. In addition, in the area where the undercut structure (138) is not formed, the organic light-emitting material can be continuously and without interruption.

[0202] Accordingly, within the same first groove (104, 131-1), an organic light-emitting material can be deposited so that a portion of the auxiliary electrode (132) remains exposed. Subsequently, in the next deposition machine, a cathode electrode material is deposited so that it contacts a portion of the exposed auxiliary electrode (132) in the undercut structure (138), and can be continuously deposited without interruption in the area where the undercut structure (138) is not formed.

[0203] Depending on the direction of travel of the substrate (110) and the angle and position of the evaporation source during deposition, at least one of the four connection structures (130) is electrically connected to the green cathode electrode (123g) and the auxiliary electrode (132) of the connection structure (130), thereby increasing reliability.

[0204] As illustrated in FIG. 5i, the green cathode electrode (123g) can be electrically connected to the auxiliary electrode (132) of the connection structure (130) in the undercut structure (138).

[0205] In this way, undercut structures (138) can be arranged differently from each other in multiple connection structures (130) on multiple row lines in the second direction (Y). Accordingly, a green cathode electrode (123g) arranged across multiple green subpixels (SPg) along the second direction (Y) can be electrically connected to different regions of multiple auxiliary electrodes (132) in multiple connection structures (130) on multiple row lines in the second direction (Y).

[0206] For example, a green cathode electrode (123g) can be electrically connected to an auxiliary electrode (132) at the right and rear sides of the first groove (104, 131-1) of the first bank (111-1) and the interlayer insulating layer (103) through an undercut structure (138) in a connection structure (130) on the m-th row line. For example, a green cathode electrode (123g) can be electrically connected to an auxiliary electrode (132) at the rear and left sides of the first groove (104, 131-1) of the interlayer insulating layer (103) through an undercut structure (138) in a connection structure (130) on the (m+1)-th row line. For example, a green cathode electrode (123g) can be electrically connected to an auxiliary electrode (132) through an undercut structure (138) in a connection structure (130) on the (m+2)th row line and on the left and front sides of the first groove (104, 131-1) of the interlayer insulating layer (103). For example, a green cathode electrode (123g) can be electrically connected to an auxiliary electrode (132) through an undercut structure (138) in a connection structure (130) on the (m+3)th row line and on the front and right sides of the first groove (104, 131-1) of the interlayer insulating layer (103).

[0207] Meanwhile, the groove of the first photosensitive pattern (210) may deviate to at least one side with respect to the first groove (104) of the interlayer insulating layer (103). For example, as shown in FIG. 9a, the groove of the first photosensitive pattern (210) may be formed deviate only to the left with respect to the first groove (104) of the interlayer insulating layer (103). For example, as shown in FIG. 9b, the groove of the first photosensitive pattern (210) may be formed deviate to the right and rear with respect to the first groove (104) of the interlayer insulating layer (103). As shown in FIG. 9c, the groove of the first photosensitive pattern (210) may be formed deviate to the front, right, and rear with respect to the first groove (104) of the interlayer insulating layer (103).

[0208] According to an embodiment, in a plurality of connection structures (130) on a plurality of row lines along a second direction (Y), a plurality of undercut structures (138) are formed to be positioned differently from each other in a plurality of first banks (111-1) and a first groove (104, 131-1) of an interlayer insulating layer (103), so that a cathode electrode can be formed on a plurality of auxiliary electrodes (132) of the plurality of connection structures (130) through a plurality of undercut structures (138) formed at different positions. Accordingly, electrical connection failure between the cathode electrode and the first power wiring (PL1) through the connection structure (130) is prevented, thereby preventing light emission failure or operation failure and improving reliability.

[0209] FIG. 10 is a cross-sectional view illustrating an organic light-emitting display device according to a fourth embodiment. The fourth embodiment is identical to the first embodiment (Fig. 2) except for a green cathode electrode (123g) made of a double layer. In the fourth embodiment, the same reference numerals are used for components having the same shape, structure, and / or function as in the first embodiment (Fig. 2), and detailed descriptions are omitted.

[0210] Although the drawing shows a plurality of green cathode electrodes (123g) of a plurality of green subpixels (SPg) in the second direction (Y), the same can be applied to a plurality of red cathode electrodes (123r) of a plurality of red subpixels (SPr) in the second direction (Y) and / or a plurality of blue cathode electrodes of a plurality of blue subpixels (SPb) in the second direction (Y).

[0211] Referring to FIG. 1 and FIG. 10, an organic light-emitting display device according to an embodiment may include a first bank (111-1), a green organic light-emitting element (120g), a connecting structure (130), etc.

[0212] The first bank (111-1) may be placed between adjacent green subpixels (SPg). A first groove (131-1) may be formed in the first bank (111-1), and an undercut structure (138) may be formed on the lower side of the first bank (111-1) in contact with the first groove (131-1).

[0213] The green organic light-emitting element (120g) may include a green anode electrode (121g), a green organic light-emitting layer (122g), and a green cathode electrode (123g).

[0214] The green cathode electrode (123g) can be electrically connected to the first power wiring (PL1) through the connection structure (130). For example, the green cathode electrode (123g) can come into contact with the upper surface of the auxiliary electrode (132) of the connection structure (130) at the undercut structure (138).

[0215] In an example, the green cathode electrode (123g) may include a first conductive layer (123-1) and a second conductive layer (123-2). The second conductive layer (123-2) may be disposed on the first conductive layer (123-1).

[0216] The first conductive layer (123-1) may include a material with excellent electrical conductivity, such as Mg:Ag, etc. The first conductive layer (123-1) including Mg:Ag, etc. may have poor step coverage. When the first conductive layer (123-1) is deposited on the substrate (110), the first conductive layer (123-1) in the first groove (131-1) and the first conductive layer (123-1) on the upper side of the first bank (111-1) may be separated without being connected to each other. In addition, the first conductive layer (123-1) in the first groove (131-1) may not come into contact with the upper surface of the auxiliary electrode (132) in the undercut structure (138). In this case, the first power wiring (PL1) is disconnected from the green cathode electrode (123g) on ​​the green subpixel (SPg) through the connection structure (130), so the green organic light-emitting element (120g) on ​​the green subpixel (SPg) does not operate or emit light, which may reduce the reliability of the product. In addition, if the first conductive layer (123-1) is formed with a very thin thickness of approximately 10 nm, the step coverage is poor, so the resistance may increase or the wire may be disconnected.

[0217] To solve this problem, a second conductive layer (123-2) with excellent step coverage is formed on the first conductive layer (123-1), thereby forming a green cathode electrode (123g) composed of the first conductive layer (123-1) and the second conductive layer (123-2). The second conductive layer (123-2) may include a conductive oxide material with excellent step coverage, such as ITO.

[0218] Since the second conductive layer (123-2) has excellent step coverage, the second conductive layer (123-2) in the first groove (131-1) and the second conductive layer (123-2) on the upper side of the first bank (111-1) can be formed so that they are connected to each other without being disconnected. Since the second conductive layer (123-2) is formed in the undercut structure (138), the second conductive layer (123-2) can come into contact with the upper surface of the auxiliary electrode (132) in the undercut structure (138).

[0219] According to the embodiment, by providing a green cathode electrode (123g) that includes not only a first conductive layer (123-1) but also a second conductive layer (123-2) with excellent step coverage, a connection failure between the green cathode electrode (123g) and the connection structure (130) can be prevented, thereby increasing reliability.

[0220] FIG. 11 illustrates a waterproof structure according to a first embodiment. FIG. 12 illustrates a waterproof structure according to a second embodiment. FIG. 13 illustrates a waterproof structure according to a third embodiment. FIG. 14 is a schematic plan view illustrating an organic light-emitting display device according to a second embodiment.

[0221] As illustrated in FIGS. 11 to 13, the waterproof structure can surround at least one subpixel among a plurality of subpixels (SPr, SPg, SPb) in the second direction (Y). Accordingly, the organic light-emitting element of at least one subpixel surrounded by the waterproof structure is not penetrated by moisture, oxygen, etc., thereby preventing operational failure of the subpixel and improving reliability.

[0222] For example, a connection structure (130) and a waterproof structure may be disposed between multiple subpixels (SPr, SPg, SPb) in the second direction (Y). For example, the waterproof structure may be disposed along the first direction (X) between multiple subpixels (SPr, SPg, SPb) in the second direction (Y), and the connection structure (130) may be disposed locally in the area between multiple subpixels (SPr, SPg, SPb) in the second direction (Y). For example, a waterproof structure may also be formed in the area where the connection structure (130) is formed, but is not limited thereto.

[0223] For example, the waterproof structure can surround each of the multiple subpixels (SPr, SPg, SPb) in the second direction (Y) (Fig. 11).

[0224] As another example, multiple subpixels (SPr, SPg, SPb) in the second direction (Y) can be grouped into units of two subpixels, thereby defining multiple groups of subpixels (SPr, SPg, SPb). In this case, a waterproof structure can surround each of the multiple groups of subpixels (SPr, SPg, SPb) (Fig. 12).

[0225] As another example, multiple subpixels (SPr, SPg, SPb) in the second direction (Y) can be grouped into units of four subpixels, thereby defining multiple groups of subpixels (SPr, SPg, SPb). In this case, a waterproof structure can surround each of the multiple groups of subpixels (SPr, SPg, SPb) (Fig. 13).

[0226] FIG. 14 is a schematic plan view illustrating an organic light-emitting display device according to a second embodiment.

[0227] As illustrated in FIG. 14, a plurality of subpixels (SPr, SPg, SPb) may be arranged in a stripe shape along a second direction (Y) on a display area (AA), and a plurality of dummy subpixels (SPrd, SPgd, SPbd) may be arranged in a stripe shape along a first direction (X) on a non-display area (NAA). The non-display area (NAA) may include a bezel area.

[0228] A plurality of waterproof structures (146-1 to 146-3) may be placed between a plurality of dummy subpixels (SPrd, SPgd, SPbd) in the second direction (Y).

[0229] Meanwhile, since the non-display area (NAA) or the bezel area is an area where an image is not displayed, the red organic light-emitting element (120r), the green organic light-emitting element (120g), and the blue organic light-emitting element (120b) may not be placed. For example, as shown in FIG. 15, the red organic light-emitting element (120r) may not be placed in the red dummy subpixel (SPrd), and the green organic light-emitting element (120g) may not be placed in the green dummy subpixel (SPgd). That is, at least one of the anode electrode, the organic light-emitting layer, and the cathode electrode constituting the red organic light-emitting element (120r) or the green organic light-emitting element (120g) may not be placed in the green dummy subpixel (SPgd) or the red dummy subpixel (SPrd).

[0230] Although not shown, a blue organic light-emitting diode (120b) may not be placed in a blue dummy subpixel (SPbd).

[0231] A third bank (111-3) is disposed between the red dummy subpixel (SPrd) and the red dummy subpixel (SPrd), and a third groove (131-3) may be formed in the third bank (111-3). A plurality of undercut structures (153, 154) may be formed on the lower side of the third bank (111-3) that contacts the third groove (131-3).

[0232] Each of the multiple waterproof structures (146-1 to 146-3) may include two or more waterproof structures (144-4, 145-4).

[0233] For example, a first waterproof structure (144-4) may be formed by the curved shape of a first inorganic insulating layer (135-1) disposed in a first undercut structure (153), and a second waterproof structure (145-4) may be formed by the curved shape of a second inorganic insulating layer (135-2) disposed in a second undercut structure (154).

[0234] The waterproof structure (144-4, 145-4) may be identical to the second waterproof structure (144) and the third waterproof structure (145) shown in the third embodiment (Fig. 4).

[0235] In this way, multiple waterproof structures (146-1 to 146-3) are formed between multiple dummy subpixels (SPrd, SPgd, SPbd) on the non-display area (NAA), thereby blocking moisture, oxygen, etc. from penetrating into the display area (AA) from the non-display area (NAA). Even if moisture, oxygen, etc. penetrate into the display area (AA) from the non-display area (NAA), moisture, oxygen, etc. are blocked by multiple waterproof structures (143 to 145 in FIG. 4) formed along the second direction (Y) between multiple subpixels (SPr, SPg, SPb) on the first direction (X) in the display area (AA), so that they do not penetrate into the multiple organic light-emitting elements (120r, 120g, 120b) of the multiple subpixels (SPr, SPg, SPb). Therefore, the performance of blocking the penetration of moisture, oxygen, etc. is dramatically improved, preventing operational failures or light emission failures of subpixels (SPr, SPg, SPb), and thus increasing reliability.

[0236] The foregoing detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the embodiments are included within the scope of the embodiments.

Claims

Claim 1 An organic light-emitting display device comprising: a plurality of subpixels having different colors along a first direction and the same color along a second direction intersecting the first direction; a plurality of anode electrodes on the plurality of subpixels; a plurality of organic light-emitting layers on the plurality of anode electrodes; a plurality of cathode electrodes on the plurality of organic light-emitting layers; a plurality of first banks between the plurality of subpixels in the second direction; a plurality of first power lines along the first direction below the plurality of first banks; a plurality of connection structures disposed in a plurality of first grooves of some of the plurality of first banks; and a plurality of undercut structures on the lower side of the portion of the first banks in contact with the plurality of first grooves; wherein the organic light-emitting layers and the cathode electrodes are disposed across the portion of the first banks, the connection structures electrically connect the cathode electrodes to the first power lines in the undercut structures, and the plurality of undercut structures are positioned differently from each other in the plurality of first grooves. Claim 2 An organic light-emitting display device according to claim 1, further comprising an interlayer insulating layer below the first bank; wherein the undercut structure is formed such that the side of the interlayer insulating layer in contact with the first groove extends inward from the inner part of the first bank toward the outer direction. Claim 3 An organic light-emitting display device according to claim 1, wherein the connection structure includes an auxiliary electrode extended from the first power wiring, the organic light-emitting layer is cut off by the undercut structure so that a portion of the auxiliary electrode is exposed, and the cathode electrode contacts a portion of the exposed auxiliary electrode in the undercut structure. Claim 4 An organic light-emitting display device according to claim 1, comprising: a plurality of inorganic insulating layers on the plurality of cathode electrodes; a plurality of second banks having second grooves arranged longitudinally along the second direction between the plurality of subpixels on the first direction; and a plurality of waterproof structures disposed in each of the second grooves of the plurality of second banks. Claim 5 An organic light-emitting display device according to claim 4, wherein the plurality of waterproof structures comprises: a first waterproof structure disposed in the second groove of the second bank; a second waterproof structure disposed in the first undercut structure located on the first side of the second groove of the second bank; and a third waterproof structure disposed in the second undercut structure located on the second side of the second groove of the second bank. Claim 6 An organic light-emitting display device according to claim 5, wherein the first waterproof structure is configured such that at least two of the plurality of inorganic insulating layers are superimposed on the second bank. Claim 7 An organic light-emitting display device according to claim 6, wherein the second waterproof structure is configured such that one of the plurality of inorganic insulating layers is formed in a curved shape by the first undercut structure, the third waterproof structure is configured such that another inorganic insulating layer among the plurality of inorganic insulating layers is formed in a curved shape by the second undercut structure, and the first undercut structure and the second undercut structure are formed on the lower side of the second bank that contacts the second groove of the second bank. Claim 8 An organic light-emitting display device according to claim 4, wherein the waterproof structure surrounds at least one subpixel among a plurality of subpixels in the second direction. Claim 9 An organic light-emitting display device according to claim 6, further comprising a plurality of second power wires along the second direction in a plurality of second grooves of a plurality of second banks, wherein at least two or more inorganic insulating layers are disposed on the second power wires. Claim 10 An organic light-emitting display device according to claim 4, further comprising a blocking structure in the edge region of at least one of the first bank and the second bank, wherein the hole injection layer or charge generation layer of the organic light-emitting layer is cut off by the blocking structure. Claim 11 An organic light-emitting display device according to claim 1, wherein the cathode electrode comprises: a first conductive layer; and a second conductive layer on the first conductive layer. Claim 12 delete Claim 13 An organic light-emitting display device according to claim 1, further comprising: a plurality of dummy subpixels having a stripe shape along the first direction in a non-display area; a plurality of third banks having a plurality of third grooves between the plurality of dummy subpixels; and a plurality of waterproof structures disposed in each of the third grooves of the plurality of third banks.

Images