Display device and method for manufacturimg display device

Abstract

The display device includes a panel portion and a protective window coupled to the panel portion. The panel portion includes a base substrate, a support film disposed below the base substrate, a driving element disposed on the base substrate and including an active pattern, and a UV blocking member disposed below the driving element.

Description

Technology Field

[0001] The present invention relates to a display device, and more specifically, to a method for manufacturing a display device having a UV blocking member and a bending part. Background Technology

[0002] Recently, display devices with parts that are bent or curved are being developed to improve the design and usability of display devices.

[0003] Therefore, it is necessary to develop an efficient method for forming the bending area of ​​a display device. The problem to be solved

[0004] The object of the present invention is to provide a display device having a UV blocking layer.

[0005] Another objective of the present invention is to provide a method for manufacturing a display device having a bending portion.

[0006] However, the present invention is not limited to the purposes described above and may be extended in various ways without departing from the spirit and scope of the invention. means of solving the problem

[0007] To achieve the aforementioned objectives of the present invention, a display device according to exemplary embodiments of the present invention comprises a panel portion and a protective window coupled to the panel portion. The panel portion comprises a base substrate, a support film disposed below the base substrate, a driving element disposed on the base substrate and including an active pattern, and a UV blocking member disposed below the driving element.

[0008] According to one embodiment, the UV blocking member comprises at least one selected from the group consisting of metal oxides, dyes, pigments, and carbon-based light-blocking materials.

[0009] According to one embodiment, the UV blocking member includes a UV blocking layer bonded to at least one surface of the support film.

[0010] According to one embodiment, the UV blocking member comprises UV blocking particles dispersed within the support film.

[0011] According to one embodiment, the UV blocking member includes a UV blocking layer bonded to the lower surface of the base substrate.

[0012] According to one embodiment, the UV blocking member comprises UV blocking particles dispersed within the base substrate.

[0013] According to one embodiment, a buffer layer disposed between the base substrate and the active pattern is included, and the UV blocking member includes a UV shielding layer disposed between the buffer layer and the base substrate.

[0014] According to one embodiment, a buffer layer disposed between the base substrate and the active pattern is included, the buffer layer includes an upper buffer layer and a lower buffer layer, and the UV blocking member includes a UV shielding layer disposed between the upper buffer layer and the lower buffer layer.

[0015] According to one embodiment, the UV blocking member comprises at least one selected from the group consisting of zinc oxide and titanium oxide.

[0016] According to one embodiment, the display device includes a front area having a flat shape and a side area having at least a portion of curvature.

[0017] A method for manufacturing a display device according to an embodiment of the present invention comprises: a base substrate, a support film disposed below the base substrate, a panel portion comprising a driving element disposed on the base substrate and including an active pattern, and a UV blocking member disposed below the driving element, and a guide film coupled through a guide adhesive member; a step of bringing the lower surface of the guide film into contact with a mounting pad; a step of forming a bending region of the panel portion coupled to the guide film by adhering the guide film to the upper and lower surfaces of the mounting pad; a step of coupling the panel portion with a protective window; a step of separating the mounting pad from the guide film; a step of irradiating UV light onto the guide adhesive member through the lower surface of the guide film; and a step of separating the guide film from the panel portion. Effects of the invention

[0018] According to exemplary embodiments of the present invention, by providing a UV blocking member below the active pattern of a display device, a driving element including the active pattern can be prevented from being degraded by UV. Brief explanation of the drawing

[0019] FIG. 1 is a plan view showing a display device according to one embodiment of the present invention. FIGS. 2 and FIGS. 3 are side views showing a display device according to embodiments of the present invention. FIG. 4 is a cross-sectional view of a display area of ​​a display device according to one embodiment of the present invention. FIGS. 5 to 10 are cross-sectional views showing a partially enlarged display device according to embodiments of the present invention. FIGS. 11 to 14 are cross-sectional views illustrating a method for manufacturing a display device according to an embodiment of the present invention. Specific details for implementing the invention

[0020] Hereinafter, a display device and a method for manufacturing a display device according to exemplary embodiments of the present invention will be described in detail with reference to the attached drawings. In the attached drawings, identical or similar reference numerals are used for identical or similar components.

[0021] FIG. 1 is a plan view showing a display device according to one embodiment of the present invention. FIG. 2 and FIG. 3 are side views showing a display device according to embodiments of the present invention. Specifically, FIG. 2 and FIG. 3 are side views showing an enlarged view of area A of FIG. 1.

[0022] Referring to FIGS. 1 and 2, a display device (10) according to one embodiment of the present invention includes a front area (FA) and a side area (SA). The display device (10) may be partially bent or folded to have the side area (SA). However, for convenience of explanation, FIG. 1 shows a display device (10) in a flat state that is not bent.

[0023] The front area (FA) may have a flat shape. For example, the front area (FA) may extend along the horizontal direction. A pixel (PX) array may be disposed in the front area (FA) to emit light according to a driving signal.

[0024] According to one embodiment, the side region (SA) may include a bending region (BA) having curvature and a vertical region (VA) extending vertically from the bending region (BA). For example, the bending region (BA) may have curvature with respect to an axis extending in a first direction (D1).

[0025] A pixel array may be disposed in the bending region (BA) and the vertical region (VA) to function as a display region. However, embodiments of the present invention are not limited thereto, and at least one of the bending region (BA) and the vertical region (VA) may be a non-display region that does not include a pixel array.

[0026] Additionally, referring to FIG. 3, the side region (SA) of the display device (20) may have a curvature throughout. The side region (SA) may or may not include a pixel array.

[0027] FIG. 4 is a cross-sectional view of a display area of ​​a display device according to an embodiment of the present invention. FIG. 4 illustrates a display area (DA) including a pixel (PX).

[0028] Referring to FIG. 4, a pixel unit placed in a display area (DA) may include a driving element placed on a base substrate (110) and a light-emitting element electrically connected to the driving element. According to one embodiment, the light-emitting element may be an organic light-emitting diode.

[0029] A support film (400) that supports the base substrate (110) may be disposed on the lower surface of the base substrate (110). The support film (400) may be bonded to the base substrate (110) by a lower adhesive member (AD1). The adhesive member (AD1) may be an adhesive or an adhesive film comprising acrylic resin, etc. According to one embodiment, the support film (400) may be patterned to reduce stress caused by folding in the bending area. For example, the support film (400) may include a polymer material such as polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), etc.

[0030] A buffer layer (120) may be disposed on the base substrate (110). An active pattern (AP) may be disposed on the buffer layer (120).

[0031] For example, the base substrate (110) may be formed from a highly flexible polymer material. For example, the base substrate (110) may include polyethylene terephthalate, polyethylene naphthalate, polyether ketone, polycarbonate, polyarylate, polyether sulfone, polyimide, or a combination thereof. In another embodiment, the base substrate (110) may include a hard material such as glass, quartz, sapphire, etc.

[0032] The buffer layer (120) can reduce or block the penetration of foreign matter, moisture, or external air from the bottom of the base substrate (110) and can flatten the upper surface of the base substrate (110). For example, the buffer layer (120) may include silicon oxide, silicon nitride, silicon carbide, or a combination thereof.

[0033] A gate electrode (GE) may be disposed on the active pattern (AP), and a first insulating layer (130) may be disposed between the active pattern (AP) and the gate electrode (GE).

[0034] A gate wiring pattern (GP) may be disposed on the gate electrode (GE). The gate wiring pattern (GP) may include a capacitor electrode for forming a capacitor, wiring for transmitting various signals, etc.

[0035] A second insulating layer (140) may be disposed between the gate electrode (GE) and the gate wiring pattern (GP). A third insulating layer (150) may be disposed on the gate wiring pattern (GP).

[0036] For example, the active pattern (AP) may include silicon or a metal oxide semiconductor. According to one embodiment, the active pattern (AP) may include polycrystalline silicon (polysilicon) and may be doped with N-type impurities or P-type impurities.

[0037] In other embodiments, or in other transistors not illustrated, the active pattern may include a metal oxide semiconductor. For example, the active pattern may include a binary compound (ABx), a ternary compound (ABxCy), a quaternary compound (ABxCyDz), etc. containing indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. For example, the second active pattern (AP2) may include zinc oxide (ZnOx), gallium oxide (GaOx), titanium oxide (TiOx), tin oxide (SnOx), indium oxide (InOx), indium-gallium oxide (IGO), indium-zinc oxide (IZO), indium-tin oxide (ITO), gallium-zinc oxide (GZO), zinc-magnesium oxide (ZMO), zinc-tin oxide (ZTO), zinc-zirconium oxide (ZnZrxOy), indium-gallium-zinc oxide (IGZO), indium-zinc-tin oxide (IZTO), indium-gallium-hafnium oxide (IGHO), tin-aluminum-zinc oxide (TAZO), and indium-gallium-tin oxide (IGTO), etc.

[0038] The first insulating layer (130), the second insulating layer (140), and the third insulating layer (150) may include silicon oxide (SiOx), silicon nitride (SiNx), silicon carbide, or a combination thereof, and may also include insulating metal oxides such as aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. For example, each of the first insulating layer (130), the second insulating layer (140), and the third insulating layer (150) may have a single layer or multilayer structure of silicon nitride or silicon oxide, and may have different structures.

[0039] The gate electrode (GE) and the gate wiring pattern (GP) may include metals, metal alloys, metal nitrides, conductive metal oxides, etc. For example, the gate electrode (GE) may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or alloys thereof, and may have a single layer or a multilayer structure including different metal layers. According to one embodiment, the gate electrode (GE) and the gate wiring pattern (GP) may have a multilayer structure including molybdenum.

[0040] A first source metal pattern may be disposed on the third insulating layer (150). The first source metal pattern may include a source electrode (SE) and a drain electrode (DE) that contact the active pattern (AP). The source electrode (SE) and the drain electrode (DE) may each penetrate the lower insulating layer and contact the active pattern (AP).

[0041] A fourth insulating layer (160) may be disposed on the first source metal pattern. A second source metal pattern may be disposed on the fourth insulating layer (160). The second source metal pattern may include a connecting electrode (CE) for electrically connecting the drain electrode (DE) to the organic light-emitting diode (210). According to one embodiment, the second source metal pattern may further include mesh power wiring, etc., to prevent voltage drop of the power supplied to the organic light-emitting diode. A fifth insulating layer (170) may be disposed on the second source metal pattern.

[0042] The first source metal pattern and the second source metal pattern may include metals, metal alloys, metal nitrides, conductive metal oxides, etc. For example, the first source metal pattern and the second source metal pattern may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or alloys thereof, and may have a single layer or a multilayer structure including different metal layers. According to one embodiment, the first source metal pattern and the second source metal pattern may have a multilayer structure including aluminum. For example, the first source metal pattern and the second source metal pattern may have a stacked structure of an aluminum layer and a titanium layer.

[0043] The fourth insulating layer (160) and the fifth insulating layer (170) may include organic materials. For example, the fourth insulating layer (160) and the fifth insulating layer (170) may include organic insulating materials such as phenolic resin, acrylic resin, polyimide resin, polyamide resin, siloxane resin, epoxy resin, etc.

[0044] An organic light-emitting diode (210) may be disposed on the fifth insulating layer (170). The organic light-emitting diode (210) may include a first electrode (212) in contact with the connecting electrode (CE), a light-emitting layer (214) disposed on the first electrode (212), and a second electrode (216) disposed on the light-emitting layer (214). The light-emitting layer (214) of the organic light-emitting diode (210) may be disposed within an opening of a pixel defining layer (180) disposed on the fifth insulating layer (170). The first electrode (212) may be the lower electrode of the organic light-emitting diode (210), and the second electrode (216) may be the upper electrode.

[0045] The first electrode (212) can operate as an anode. For example, the first electrode (212) may be formed as a transmissive electrode or a reflective electrode depending on the light emission type. When the first electrode (212) is formed as a transmissive electrode, the first electrode (212) may include indium tin oxide, indium zinc oxide, zinc tin oxide, indium oxide, zinc oxide, tin oxide, etc. When the first electrode (212) is formed as a reflective electrode, it may include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), etc., and may have a stacked structure with the material used in the transmissive electrode.

[0046] The pixel defining layer (180) has an opening that exposes at least a portion of the first electrode (212). For example, the pixel defining layer (180) may include an organic insulating material.

[0047] The light-emitting layer (214) may include at least one of the functional layers, such as a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer, in a single-layer or multi-layer structure. The light-emitting layer (214) may include a low-molecular-weight organic compound or a high-molecular-weight organic compound.

[0048] In one embodiment, the light-emitting layer (214) may emit red, green, or blue light. In another embodiment, when the light-emitting layer (214) emits white light, the light-emitting layer (214) may include a multilayer structure including a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer, or a single layer structure including red, green, and blue light-emitting materials.

[0049] The second electrode (216) may be formed as a transparent electrode or a reflective electrode depending on the light emission type of the display device including the thin-film transistor substrate. For example, the second electrode (216) may include a metal, an alloy, a metal nitride, a metal fluoride, a conductive metal oxide, or a combination thereof.

[0050] For example, the second electrode (216) may be continuously extended over a display area across a plurality of pixels. According to one embodiment, a capping layer and a blocking layer may be further formed on the second electrode (216).

[0051] The above display device further includes an encapsulation layer (220) covering the organic light-emitting diode (210). The encapsulation layer (220) may be continuously extended to cover the entire display area (DA).

[0052] For example, the encapsulation layer (220) may include a stacked structure of an organic thin film and an inorganic thin film. For example, as shown in FIG. 3, it may include a first inorganic thin film (222), an organic thin film (224) disposed on the first inorganic thin film (222), and a second inorganic thin film (226) disposed on the organic thin film. However, embodiments of the present invention are not limited thereto, and the encapsulation layer (220) may have a structure comprising two or more organic thin films and three or more inorganic thin films.

[0053] For example, the organic thin film (224) may include a polymer cured material such as polyacrylate. For example, the polymer cured material may be formed by a cross-linking reaction of monomers. For example, the inorganic thin film (222, 226) may include silicon oxide, silicon nitride, silicon carbide, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc.

[0054] According to one embodiment, a touch sensing unit may be disposed on the sealing layer (220). The touch sensing unit may detect an input position through contact. The touch sensing unit may be formed directly on the sealing layer (220) or manufactured as a separate screen panel and coupled to the sealing layer (220).

[0055] For example, a touch sensing electrode (TSE) and a touch insulating layer (230) covering it may be disposed on the above-mentioned encapsulation layer (220). For example, the touch sensing electrode (TSE) may include a transparent conductive material such as indium tin oxide, indium zinc oxide, etc.

[0056] A polarizing layer (240) and a protective window (300) may be disposed on the touch sensing portion. An adhesive or a transparent adhesive film may be provided between the polarizing layer (240) and the touch sensing portion, and between the polarizing layer (240) and the protective window (300). For example, a window adhesive member (AD2) may be disposed between the protective window (300) and the polarizing layer (240).

[0057] In the following, the configuration from the support film (400) to the polarization layer (240) may be referred to as a panel part (PN).

[0058] According to one embodiment, the display device further includes a UV shielding member to prevent the active pattern (AP) from deteriorating due to ultraviolet (UV) rays incident from below. Hereinafter, various embodiments including the UV shielding member will be described.

[0059] FIGS. 5 to 10 are partially enlarged cross-sectional views of a display device according to embodiments of the present invention. Specifically, FIGS. 5 and 6 illustrate a base substrate and a support film, and FIGS. 7 to 10 illustrate a buffer layer, a base substrate, and a support film.

[0060] Referring to FIG. 5, the support film (400) comprises a support layer (402) and a UV blocking layer bonded to at least one surface of the support layer (402). According to one embodiment, the support film (400) may include a first UV blocking layer (402) disposed between the support layer (402) and the lower adhesive member (AD1), and a second UV blocking layer (406) bonded to the lower surface of the support layer (404).

[0061] The above UV blocking layer (402, 406) may include a metal oxide capable of absorbing UV. For example, the above UV blocking layer (402, 406) may include zinc oxide, titanium oxide, etc. Considering the manufacturing process and efficiency, zinc oxide may preferably be used as the material for the above UV blocking layer (402, 406).

[0062] For example, the UV blocking layer (402, 406) can be formed on the support film (400) by depositing the metal oxide or coating a paste containing the metal oxide.

[0063] In another embodiment, the UV blocking layer (402, 406) may include other inorganic or organic pigments, dyes, carbon-based light-blocking materials such as carbon black that can absorb UV.

[0064] Referring to FIG. 6, the support film (410) may include UV blocking particles (412) dispersed within the support film (410). The UV blocking particles (412) may include a previously described UV blocking material.

[0065] Referring to FIG. 7, the base substrate (110) may include UV blocking particles (112) dispersed within the base substrate (110). The UV blocking particles (112) may include a previously described UV blocking material.

[0066] Referring to FIG. 8, the base substrate (114) may include a base layer (114a) and a UV blocking layer (114b) bonded to the lower surface of the base layer (114a). The UV blocking layer (114b) may include a previously described UV blocking material.

[0067] Referring to FIG. 9, the buffer layer (120) may include an upper buffer layer (120a) and a UV blocking layer (120b) disposed between the upper buffer layer (120a) and the base substrate (110). The upper buffer layer (120a) may include silicon oxide, silicon nitride, silicon carbide, or a combination thereof. The UV blocking layer (120b) may include a previously described UV blocking material.

[0068] Referring to FIG. 10, the buffer layer (122) may include an upper buffer layer (122a), a lower buffer layer (122c), and a UV blocking layer (122b) disposed between the upper buffer layer (122a) and the lower buffer layer (122c). According to one embodiment, the upper buffer layer (122a) may include silicon oxide, and the lower buffer layer (122c) may include silicon nitride.

[0069] If the above UV blocking layer (120b, 122b) includes a metal oxide such as zinc oxide, the relatively high electrical conductivity of the metal oxide may affect the operation of the driving element. Therefore, it may be desirable for the UV blocking layer (120b, 122b) included in the above buffer layer (120, 122) to be spaced apart from the active pattern.

[0070] According to embodiments of the present invention, by providing a UV blocking member below the active pattern of a display device, a driving element including the active pattern can be prevented from being degraded by UV.

[0071] FIGS. 11 to 14 are cross-sectional views illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0072] Referring to FIG. 11, a panel portion (PN) of a display device is placed on a guide film (500). The guide film (500) and the display device can be joined by a guide adhesive member (AD3). A window adhesive member (AD2) is attached to the upper surface of the panel portion (PN).

[0073] One end of the guide film (500) can be fixed by the first fixing device (622), and the other end can be fixed by the second fixing device (624).

[0074] A mounting pad (612) is placed below the guide film (500). According to one embodiment, the top surface and side surface of the mounting pad (612) may have a flat top surface and a curved side surface so as to correspond to the bottom surface of the protective window (300). The mounting pad (612) may be placed on a support plate (614).

[0075] A protective window (300) is placed on the panel portion (PN) coupled to the guide film (500). The protective window (300) may have a shape with a bent edge.

[0076] The above protective window (300) can be fixed by an adsorption device (632). The adsorption device (632) has a shape corresponding to the curved surface of the protective window (300) and may include a contact portion (636) that contacts the upper surface of the protective window (300) and an adsorption portion (634) that provides negative pressure.

[0077] Referring to FIG. 12, the first fixing device (622) and the second fixing device (624) are lowered, or the seating pad (612) is raised to bring the upper surface of the seating pad (612) into contact with the lower surface of the guide film (500).

[0078] Next, the two ends of the guide film (500) are moved to bring the guide film (500) into contact with the upper surface and side of the mounting pad (612). For example, the first contact member (626) coupled to the first fixing device (622) and the second contact member (628) coupled to the second fixing device (624) are moved to bring them into contact with the side of the mounting pad (612). The mounting pad (612) may have a groove formed on the side to guide the position of the contact members (626, 628).

[0079] Consequently, the guide film (500), the panel portion (PN) combined with the guide film (500), and the window adhesive member (AD2) combined with the panel portion (PN) are deformed to have a bending area along the surface of the mounting pad (612).

[0080] Referring to FIG. 13, the adsorption device (632) or the mounting member (612) is moved in a vertical direction to bond the protective window (300) to the window adhesive member (AD2). Thus, the protective window (300) and the panel part (PN) can be combined.

[0081] Referring to FIG. 14, the mounting member (612) is separated from the guide film (500), and UV is irradiated from the bottom of the guide film (500). Accordingly, UV is irradiated onto the guide adhesive member (AD3) through the bottom surface of the guide film (500).

[0082] The guide adhesive member (AD3) includes a UV-separable type adhesive. The adhesive strength of the adhesive decreases due to UV exposure. Therefore, the guide film (500) can be easily separated from the panel portion (PN).

[0083] The lower adhesive member that combines the base substrate and the support film in the above panel portion (PN) includes a conventional acrylic adhesive, etc., rather than a UV separation type. Therefore, the reliability of the above panel portion (PN) is not reduced during the above exposure process.

[0084] According to embodiments of the present invention, the panel portion (PN) includes a UV blocking member. Accordingly, it is possible to prevent the driving element from deteriorating due to high-energy UV during the separation process of the guide film (500) as described above.

[0085] Although the foregoing description refers to exemplary embodiments of the present invention, those skilled in the art will understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the invention as set forth in the following claims. Industrial applicability

[0086] The present invention can be applied to various display devices. For example, the present invention can be applied to various display devices such as display devices for vehicles, ships, and aircraft, portable communication devices, display devices for exhibition or information transmission, medical display devices, etc.

Claims

Claim 1 A display device comprising: a base substrate, a support film disposed below the base substrate, a driving element disposed on the base substrate and including an active pattern, a light-emitting element disposed above the driving element and electrically connected to the driving element, and an encapsulation layer covering the light-emitting element; and a protective window coupled to the panel portion, wherein the panel portion further comprises a buffer layer disposed between the base substrate and the active pattern, the buffer layer comprising an upper buffer layer and a lower buffer layer, each of the upper buffer layer and the lower buffer layer comprising at least one of silicon oxide and silicon nitride, and the panel portion further comprises a UV blocking layer disposed between the upper buffer layer and the lower buffer layer and continuously extending in a horizontal direction on the base substrate, wherein the UV blocking layer comprises at least one selected from the group consisting of metal oxides, dyes, pigments, and carbon-based light-blocking materials. Claim 2 delete Claim 3 In claim 1, the display device comprises a front area having a flat shape and a side area having at least a portion of curvature. Claim 4 delete Claim 5 delete Claim 6 A display device according to claim 1, wherein the active pattern comprises silicon or a metal oxide. Claim 7 delete Claim 8 delete Claim 9 delete Claim 10 delete

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