Sensor-film vacuum laminator and sensor-film vacuum laminating method using the same

Abstract

The present invention discloses a sensor-film vacuum laminator and a sensor-film vacuum laminating method using the same, wherein the sensor loading part formed to load a tray on which a sensor is placed and supply it to a next process, and the sensor loading part formed to load the tray and the sensor receiving part, and the first chamber formed to be movable to a preset position, and the film loading part formed to adsorb one side of a film loaded in a film stack and supply it to a next process one sheet at a time, and the film receiving part formed to be rotatably formed around an axis and coupled to the first chamber at a preset position, and the second chamber formed to be rotatably formed around an axis and coupled to the first chamber, and a vacuum pump connected to at least one of the first chamber and the second chamber to form a vacuum state inside when the first chamber and the second chamber are coupled to each other, wherein when the first chamber and the second chamber are coupled to each other, the film is placed on the sensor and pressurized inside the vacuum state formed by the vacuum pump.

Description

Technology Field

[0001] The present invention relates to a sensor-film vacuum laminator configured to align a film and a sensor to a preset position and then laminate them by applying pressure in a vacuum state, a sensor-film vacuum laminating system including the same, and a sensor-film vacuum laminating method using the sensor-film vacuum laminator. Background Technology

[0002] A sensor-film vacuum laminator refers to a device used to laminate sensors applied to display panels and the like. More specifically, it involves laminating a film that becomes adhesive upon pressure onto one side of the sensor. Furthermore, as sensors become smaller, technological development is underway to improve production efficiency and quality by laminating the sensor and film more precisely.

[0003] Meanwhile, factors determining the lamination quality of the sensor include ensuring that there are no voids, such as air bubbles, in the laminated portion of the film, and preventing defects by precisely controlling each position during lamination.

[0004] Accordingly, the development of a sensor-film vacuum laminator capable of precisely controlling the positions of the sensor and the film during lamination without creating empty spaces in the sensor to which the film is laminated can be considered. The problem to be solved

[0005] One objective of the present invention is to provide a sensor-film vacuum laminator capable of precisely controlling the positions of the sensor and the film during lamination while preventing the occurrence of empty spaces in the sensor to which the film is laminated.

[0006] Another objective of the present invention is to provide a sensor-film vacuum laminating system in which the supply, transfer, inspection, and laminating processes are systematized for the efficient lamination of a sensor and a film.

[0007] Another objective of the present invention is to provide a sensor-film vacuum laminating method that can easily perform lamination of a sensor and a film. means of solving the problem

[0008] To achieve the objective of the present invention, a sensor-film vacuum laminator according to one embodiment of the present invention comprises: a sensor loading portion formed to load a tray on which a sensor is placed and supply it to a next process; a first chamber formed to be movable to a preset position and having a first receiving portion for receiving the sensor; a film loading portion formed to adsorb one side of a film loaded in a film stack and supply it to a next process one sheet at a time; a second chamber formed to be rotatable around an axis and coupled to the first chamber at a preset position and having a second receiving portion for receiving the film; and a vacuum pump connected to at least one of the first chamber and the second chamber to form a vacuum inside when the first chamber and the second chamber are coupled to each other, wherein when the first chamber and the second chamber are coupled to each other, the film is placed on the sensor and pressurized inside the vacuum formed by the vacuum pump.

[0009] According to one example related to the present invention, the apparatus may further include: a first peeling unit configured to adsorb and peel off a protective film arranged to cover the sensor before the sensor is accommodated in the first chamber; and a second peeling unit configured to move onto the second chamber before the second chamber is rotated to adsorb and peel off a protective film arranged to cover the film.

[0010] According to one example related to the present invention, the apparatus further includes a shuttle unit configured to transport the sensor supplied from the sensor loading unit to the first chamber, and the first peeling unit may be configured to peel off a protective film placed to cover the sensor on the shuttle unit before the shuttle unit reaches the first chamber.

[0011] According to one example related to the present invention, the invention may further include an ionizer configured to remove electrostatic charges from the film before the film loading unit adsorbs the film, thereby preventing the film from overlapping; and a sensing device configured to detect the thickness of the film adsorbed by the film loading unit and to detect whether the film overlaps.

[0012] According to one example related to the present invention, the sensor mounting jig is provided with a sensor mounting portion on which the sensor is mounted and is movably installed within the first receiving portion, and is formed to be finely positionable so that the sensor is positioned on the film before the first chamber and the second chamber are coupled together; and further comprises a holder disposed within the second receiving portion and having a film mounting portion on which a film to be laminated to the sensor is mounted, wherein when the first chamber and the second chamber are coupled together, the sensor positioned on the sensor mounting jig through fine positioning can be positioned to correspond to the film located on the holder.

[0013] According to one example related to the present invention, after the fine position adjustment of the sensor mounting jig is completed, at least one of the sensor mounting jig and the holder may be moved in a direction toward each other so that the film is pressed onto the sensor.

[0014] According to one example related to the present invention, the invention may further include a sensor position detection unit configured to detect the alignment state of the sensor by photographing the position of the sensor mounted on the sensor mounting jig and comparing it with a preset position; and an alignment stage configured to finely adjust the position of the sensor mounting jig so that the sensor mounted on the sensor mounting portion is positioned correctly on the film based on the result detected by the sensor position detection unit.

[0015] According to one example related to the present invention, the sensor mounting jig is provided in a plurality and each is movably installed within the first receiving portion, and the alignment stage may be a UVW stage configured to finely adjust the individual position of each of the plurality of sensor mounting jigs.

[0016] According to one example related to the present invention, the holder comprises: a holder body installed within the second receiving portion; and a pad installed in the holder body and formed of a silicone material having an adhesive surface so as to be able to hold the film even when the second chamber rotates, wherein an air injection hole may be formed in the portion of the holder body that overlaps with the center of the pad so as to allow the center of the pad to be inflated into a convex shape so as to easily separate the laminated sensor-film from the pad.

[0017] According to one example related to the present invention, the pad comprises: a flat portion formed to hold an inner portion excluding the edge portion of the film; and an inclined portion extending downwardly from the flat portion and having a portion that overlaps with the edge portion of the film. In the process of applying pressure to the film on the sensor, the inner portion of the inclined portion adjacent to the flat portion is gradually elastically deformed into a flat shape by the pressure, thereby generating a force that pushes from the inner portion of the film toward the edge portion.

[0018] In addition, the present invention discloses a sensor-film vacuum laminating system characterized in that the sensor-film vacuum laminators described above are provided in two units and are arranged symmetrically with respect to one axis, and the vacuum pump is integrated and provided as a single unit, thereby forming a vacuum state in the interior where the first chamber and the second chamber of each sensor-film vacuum laminator are mutually combined.

[0019] To achieve the objective of the present invention, the sensor-film vacuum laminating method of the present invention is configured such that, for laminating a sensor-film, the step of supplying a sensor and the step of supplying a film are performed independently, wherein the step of supplying a sensor comprises: (a) a step in which a sensor loading unit supplies a sensor placed on a tray; (b) a step in which the sensor supplied from the sensor loading unit is transferred to a first receiving portion of a first chamber; and (c) a step in which the first chamber moves downward toward a second chamber, and the step of supplying a film comprises: (1) a step in which a film loading unit adsorbs one side of a film loaded on a film stack and supplies it one sheet at a time; and (2) a step in which the film supplied from the film loading unit is transferred to the second chamber. and (3) a step in which the second chamber rotates around an axis while holding the film, and after step (c) and step (3), the first chamber and the second chamber are coupled to each other, and the film is laminated to one surface of the sensor in an internal space formed in a vacuum state.

[0020] According to one example related to the present invention, prior to step (b), a sensor protective film peeling step in which a first peeling unit adsorbs and peels off a protective film positioned to cover the sensor; and prior to step (3), a film protective film peeling step in which a second peeling unit adsorbs and peels off a protective film positioned to cover the film may be further included. Effects of the invention

[0021] The effects of the present invention obtained through the above-described solution are as follows.

[0022] The sensor-film vacuum laminator of the present invention forms an interior in which a vacuum is formed by a vacuum pump when the first chamber and the second chamber are coupled together, and since lamination of the film and the sensor is performed in the interior in which the vacuum is formed, it is possible to prevent the occurrence of empty spaces such as bubbles in the sensor.

[0023] In addition, during lamination, the sensor and film are finely adjusted to be in the correct positions through the configuration of the sensor mounting jig and the film alignment unit, thereby enabling more precise sensor-film lamination.

[0024] Furthermore, during the vacuum lamination of sensors and films, the processes of supplying, transporting, inspecting, and laminating the sensors and films are automated, providing a systematic system that can improve production efficiency. Brief explanation of the drawing

[0025] Figure 1 is a conceptual diagram of a sensor-film vacuum laminating system. FIG. 2 is a perspective view of the sensor-film vacuum laminator illustrated in FIG. 1. FIG. 3 is a perspective view of the rotate unit and defective discharge unit shown in FIG. 2. FIG. 4 is a perspective view of the first filling unit shown in FIG. 2. FIG. 5 is a perspective view of the first chamber and the second chamber and some adjacent components shown in FIG. 2. Figure 6 is an enlarged view of the sensor mounting jig illustrated in Figure 5. Figure 7 is a perspective view of the film loading section illustrated in Figure 2. FIG. 8 is a perspective view of the film alignment unit and film position-position detection unit illustrated in FIG. 2. FIG. 9 is a perspective view of the second chamber shown in FIG. 2. FIG. 10 is a perspective view of the second filling unit shown in FIG. 2. FIG. 11 is a perspective view of the holder shown in FIG. 9. FIG. 12 is a perspective view of the combined form of the first chamber and the second chamber. Figure 13 is a conceptual diagram showing the change in the holder during sensor-film lamination. Specific details for implementing the invention

[0026] Hereinafter, a sensor-film vacuum laminator and a sensor-film vacuum laminating method including the same will be described in more detail with reference to the drawings.

[0027] In describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description is omitted.

[0028] The attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that all modifications, equivalents, and substitutions included within the concept and technical scope of the present invention are included.

[0029] In this specification, the same reference numerals are assigned to identical components even in different embodiments, and redundant descriptions thereof are omitted.

[0030] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0031] In this application, terms such as “comprising” or “having” are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not excluding in advance the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0032] FIG. 1 is a conceptual diagram of a sensor-film vacuum laminating system (10). FIG. 2 is a perspective view of the sensor-film vacuum laminator (100) shown in FIG. 1. FIG. 3 is a perspective view of the rotate unit (110) and the defective discharge unit (120) shown in FIG. 2. FIG. 4 is a perspective view of the first filling unit (130) shown in FIG. 2. FIG. 5 is a perspective view of the first chamber (100c) and the second chamber (100d) shown in FIG. 2 and some components adjacent thereto. FIG. 6 is an enlarged view of the sensor mounting jig (J) shown in FIG. 5. FIG. 7 is a perspective view of the film loading unit (100b) shown in FIG. 2.

[0033] Referring to FIGS. 1 to 7, the sensor-film vacuum laminator (100, 100') refers to equipment that laminates a film (F) placed on a sensor (S) by applying pressure. The film (F) may be an adhesive film (F) made of a pressure-sensitive adhesive (PSA) that generates adhesive force when pressure is applied. Therefore, lamination between the sensor (S) and the film (F) can be achieved simply by applying a certain pressure to the film (F) placed on the sensor (S).

[0034] Meanwhile, if the lamination of the sensor-film is performed in a normal atmospheric environment, air may be introduced between the sensor (S) and the film (F), forming voids such as bubbles (Void). These voids can degrade the lamination quality of the sensor (S) and may cause the sensor (S) to malfunction. To prevent such problems, the sensor-film vacuum laminator (100, 100') may be configured to perform the lamination of the sensor-film in a vacuum state.

[0035] Meanwhile, the sensor-film vacuum laminators (100, 100') may be provided in two for process efficiency and arranged symmetrically with respect to one axis. At this time, it is preferable that the two sensor-film vacuum laminators (100, 100') have the same configuration. In the following embodiment, only one of the sensor-film vacuum laminators (100) will be described.

[0036] In addition, in this specification, a state in which a film (F) is placed on a sensor (S) or a state in which a film (F) is laminated on a sensor (S) is referred to as a sensor-film.

[0037] The sensor-film vacuum laminator (100) includes a sensor loading section (100a), a first chamber (100c), a film loading section (100b), a second chamber (100d), and a vacuum pump (P).

[0038] The sensor loading unit (100a) is configured to load a tray on which a sensor (S) is placed and supply it to the next process, and is formed to load the tray. At this time, the sensor (S) placed on the tray may be provided in multiple numbers.

[0039] Although not shown in the drawing, the sensor loading section (100a) may include a lower transfer device (not shown), a tray lift (not shown), an upper transfer device (not shown), and a tray loading section (not shown).

[0040] As an example related to this, when a tray on which a sensor (S) is placed is fed into a lower transfer device (not shown), the tray can be transported from one side to the other along the lower transfer device (not shown). A tray lift (not shown) is provided on the other side of the lower transfer device (not shown) to raise and lower the tray on which the sensor (S) is placed to an upper transfer device (not shown). Subsequently, the sensor (S) placed on the tray is transported to the next process, and the remaining empty tray can be loaded into a tray loading section (not shown) along the upper transfer device (not shown).

[0041] More specifically, the tray loading section (not shown) may be provided in the direction in which the tray is discharged on the upper conveying device (not shown). The tray loading section (not shown) may be provided on both the left and right sides relative to the upper conveying device (not shown) and may be configured to lift upward by clamping both the left and right sides of the tray. Accordingly, the tray that is conveyed first may be loaded on top, and the tray that is loaded subsequently may be loaded on the bottom.

[0042] The first chamber (100c) is provided with a first receiving portion (100c1) in which a sensor (S) is received. The first chamber (100c) is formed to be movable to a preset position during the sensor-film laminating process.

[0043] As an example related to this, the first chamber (100c) may be configured to move downward to the second chamber (100d) along a chamber moving device (R) provided in the sensor-film laminating process.

[0044] Additionally, a sensor mounting jig (J) is movably installed within the first receiving portion (100c1). The sensor mounting jig (J) is provided with a sensor mounting portion (J1) so that a sensor (S) is mounted thereon.

[0045] The film loading unit (100b) can be configured to adsorb one side of the film (F) loaded in the film stack (100b11, 100b21) and supply it to the next process one sheet at a time.

[0046] As an example related thereto, the film loading unit (100b) may include a first lift (100b1), a second lift (100b2), a plate transfer device (100b3), a mounting plate (100b4), and a film supply unit (100b5).

[0047] Each of the first lift (100b1) and the second lift (100b2) is equipped with a film stack (100b11, 100b21) to load a plurality of films (F) and then raise and lower the films (F) to supply them to the next process one by one.

[0048] As an example related to this, the first lift (100b1) is configured to load a film (F) to be supplied to the next process, and the second lift (100b2) may be configured to serve as a buffer to store multiple films (F) in advance in preparation for the case where the film (F) loaded in the first lift (100b1) is depleted.

[0049] Meanwhile, height sensing sensors (S1, S2) may be provided on the upper side of the first lift (100b1) and the second lift (100b2) to detect the storage amount of the film (F).

[0050] As an example related to this, height sensing sensors (S1, S2) may be configured to measure the height of a film (F) loaded in a film stack (100b11, 100b21). At this time, if the height of the film (F) loaded in the film stack (100b11, 100b21) is lower than a preset height, a control signal may be generated to supply the film (F) to the film stack (100b11, 100b21).

[0051] The plate transfer device (100b3) is positioned on one side of the first and second lifts (100b1, 100b2) and can be formed to extend forward in the process. A guide rail can be formed on the plate transfer device (100b3).

[0052] According to this configuration, a plurality of films (F) supplied from the first lift (100b1) can be placed on the mounting plate (100b4) at predetermined positions. The mounting plate (100b4) can be mounted on the plate transfer device (100b3) and moved along the guide rail to supply the films (F) to the next process.

[0053] The film supply unit (100b5) can be configured to adsorb one side of the film (F) and place it onto the mounting plate (100b4) one sheet at a time.

[0054] As an example related thereto, the film supply unit (100b5) may include a film supply module (100b51), a lifting rail (100b521), a first rail (100b522), and a second rail (100b523). In addition, a vacuum pad (100b511) may be provided at the end of the film supply module (100b51).

[0055] According to this configuration, the film supply module (100b51) can descend along the lifting rail (100b521) to adsorb one side of the film (F) with the vacuum pad (100b511) provided at the end, move sideways (left and right in the drawing) along the second rail (100b523), and then move forward along the first rail (100b522) to place the film on the mounting plate (100b4) one sheet at a time.

[0056] As another example related to this, the film supply module (100b51) may be configured to move the film (F) loaded on the second lift (100b2) onto the first lift (100b1) or the mounting plate (100b4) after adsorption based on a control signal from a height detection sensor (S1) on the first lift (100b1).

[0057] The second chamber (100d) is provided with a second receiving portion (100d1) in which a film (F) is received. Additionally, the second chamber (100d) is formed to be rotatable around an axis so as to be coupled with the first chamber (100c) at a predetermined position.

[0058] Additionally, a holder (H) is placed within the second receiving portion (100d1). The holder (H) is provided with a film mounting portion (H21) so that the film (F) is mounted thereon.

[0059] As an example related thereto, the second chamber (100d) may be configured to rotate above the first chamber (100c) around a rotation axis provided on one side and be coupled with the first chamber (100c) while the film (F) supplied from the film loading unit (100b) is placed on the film mounting unit (H21) provided on the holder (H).

[0060] More specifically, the second chamber (100d) may be supported by support frames (100d2) positioned on both the left and right sides. At this time, at least one support frame (100d2) may be equipped with a rotating device (100d3) connected to the second chamber (100d) via a rotation axis to rotate the second chamber (100d). At this time, the rotating device (100d3) may be configured to receive rotational force from a servo motor, etc.

[0061] Furthermore, a pressure drive device (100c2) configured to move the first chamber (100c) up and down may be installed at the bottom of the first chamber (100c), and at least one of the support frames (100d2) arranged on both the left and right sides of the second chamber (100d) may be provided with a lifting part (100d4) configured to move the second chamber (100d) up and down.

[0062] Accordingly, when the second chamber (100d) is rotated by the driving device to achieve an up-and-down inversion, the first chamber (100c) is moved upward by the pressurizing driving device (100c2) while positioned below the second chamber (100d), and the second chamber (100d) is moved downward by a predetermined distance by the lifting part (100d4), so that the opening of the second chamber (100d) can be mutually coupled to cover the opening of the first chamber (100c).

[0063] The vacuum pump (P) may be configured to form a vacuum inside the first chamber (100c) and the second chamber (100d) while they are coupled to each other. The vacuum pump (P) may be connected to at least one of the first chamber (100c) and the second chamber (100d).

[0064] Accordingly, when the first chamber (100c) and the second chamber (100d) are combined, the film (F) can be placed on the sensor (S) and pressurized inside, which is formed into a vacuum state by the vacuum pump (P).

[0065] More specifically, before the first chamber (100c) and the second chamber (100d) are combined, the sensor mounting jig (J) can be formed to allow for fine position adjustment within the first receiving portion (100c1) so that the sensor (S) mounted on the sensor mounting portion (J1) is positioned correctly on the film (F).

[0066] Additionally, after the fine position adjustment of the sensor mounting jig (J) is completed, when the first chamber (100c) and the second chamber (100d) are combined, the first chamber (100c) is moved upward by the pressure driving device (100c2), and the second chamber (100d) is moved downward by a predetermined distance by the lifting part (100d4), so that the sensor mounting jig (J) in the first receiving part (100c1) and the holder (H) in the second receiving part (100d1) can be moved in a direction that brings them closer to each other.

[0067] At this time, since the second chamber (100d) is rotated to achieve an up-and-down inversion, the film (F) is placed on the sensor (S), and sensor-film lamination can be performed by mutually pressing the sensor mounting jig (J) and the holder (H).

[0068] The sensor-film vacuum laminator (100) may further include a sensor pickup unit (not shown) positioned adjacent to the sensor loading section (100a) and configured to transfer a plurality of sensors (S) placed on a tray to the next process.

[0069] The sensor pickup unit (not shown) may include a sensor supply unit (not shown) and a sensor moving unit (not shown) formed to enable the sensor supply unit to move along the X, Y, and Z axes. A vacuum pad may be provided at the end of the sensor supply unit (not shown). Additionally, the sensor moving unit (not shown) may consist of an X-axis rail, a Y-axis rail, and a Z-axis rail.

[0070] As an example related to this, a sensor supply unit (not shown) may be configured to move onto a sensor (S) placed on a tray along a sensor moving unit (not shown), and then adsorb one side of the sensor (S) with a vacuum pad provided at the end to transfer the sensor (S) to the next process.

[0071] Furthermore, the sensor supply unit (not shown) may be provided in a number corresponding to each of the plurality of sensors (S) supplied by the sensor loading unit (100a). At this time, the plurality of sensor supply units (not shown) may be arranged side by side at a predetermined distance from each other in the sensor moving unit (not shown).

[0072] Meanwhile, a protective film (not shown) may be attached to one side of the sensor (S) and the film (F). The protective film (not shown) may be positioned to cover one side of the sensor (S) and the film (F) to protect them from external contaminants.

[0073] On the other hand, since the sensor (S) and the film (F) are pressed together while in contact with each other during the lamination of the sensor-film, it is desirable that a process of peeling off each protective film (not shown) be performed before the lamination of the sensor-film is carried out.

[0074] As an example related thereto, the sensor-film vacuum laminator (100) may further include a first peeling unit (130) configured to peel off a protective film (not shown) of each of the sensor (S) and the film (F), and a second peeling unit (170) to be described later.

[0075] The first peeling unit (130) may be configured to absorb and peel off a protective film (not shown) positioned to cover the sensor (S) before the sensor (S) is accommodated in the first chamber (100c). The first peeling unit (130) may include a peeling absorption module (131), a first moving module (132), a lifting cylinder (133), a second moving module (134), and a moving rail (135).

[0076] In addition, the peeling adsorption module (131) is provided with a peeling adsorption pad (131a) so that the protective film (not shown) covering the sensor (S) can be peeled off by adsorbing one side of the protective film (not shown).

[0077] In addition, a protective film collection box (136) for a sensor, configured to receive a peeled protective film (not shown), may be provided on one side of the first peeling unit (130).

[0078] As an example related to this, the peeling adsorption modules (131) may be provided in a number corresponding to each of the plurality of sensors (S) supplied by the sensor loading unit (100a). Each peeling adsorption module (131) may be mounted on a first moving module (132). At this time, the first moving module (132) may be equipped with a distance adjustment rail (132a). The distance adjustment rail (132a) may be configured to allow adjustment of the distance between the peeling adsorption modules (131) mounted on the first moving module (132).

[0079] For example, when three peeling adsorption modules (131) are mounted on the first moving module (132), a distance adjustment rail (132a) may be provided only at a position corresponding to the location where two peeling adsorption modules (131) are mounted on the left and right sides relative to one peeling adsorption module (131). Accordingly, the two peeling adsorption modules (131) can be moved to the left and right sides along the distance adjustment rail (132a) relative to the remaining one peeling adsorption module (131), thereby facilitating distance adjustment between the peeling adsorption modules (131).

[0080] Meanwhile, the first moving module (132) can be mounted on the lifting cylinder (133) to enable movement up and down. Accordingly, the peeling adsorption pad (131a) can be moved downward by the lifting cylinder (133) to adsorb a protective film (not shown).

[0081] Additionally, the lifting cylinder (133) can be mounted on the second moving module (134). At this time, the second moving module (134) can be mounted on the moving rail (135) so as to be movable left and right during the process.

[0082] Accordingly, the peeling adsorption module (131) can be configured to peel off a protective film (not shown) from the sensor (S), then move along the moving rail (135) to a protective film collection container (136) for the sensor and discharge the peeled protective film (not shown).

[0083] The sensor-film vacuum laminator (100) may further include a shuttle unit (100s) configured to transport a sensor (S) supplied from a sensor loading unit (100a) and transported from a sensor pickup unit (not shown) to a first chamber (100c).

[0084] As an example related thereto, the shuttle unit (100s) may include a shuttle rail (100s1), a base part (100s2) coupled to the shuttle rail (100s1), and a sensor mounting part (100s3) disposed on the base part (100s2) and having the sensor (S) mounted thereon.

[0085] More specifically, a sensor (S) supplied from a sensor loading unit (100a) can be placed at a preset position on the sensor mounting unit (100s3). At this time, the base unit (100s2) on which the sensor mounting unit (100s3) is placed can be moved along a shuttle rail (100s1) to transport the sensor (S) to the first chamber (100c).

[0086] As an example related to this, a groove with a shape corresponding to the shape of the sensor (S) is formed in the sensor mounting portion (100s3), so that the sensor (S) can be fixed so that it does not detach even when the shuttle unit (100s) moves along the shuttle rail (100s1).

[0087] As another example related to this, a suction hole may be formed in the sensor mounting part (100s3) so that the sensor (S) is fixed by suction so that it does not detach even when the shuttle unit (100s) moves along the shuttle rail (100s1).

[0088] Furthermore, the first peeling unit (130) described above may be positioned before the shuttle unit (100s) reaches the first chamber (100c) to peel off a protective film (not shown) positioned to cover the sensor (S) on the shuttle unit (100s).

[0089] The sensor-film vacuum laminator (100) may further include a rotate unit (110) configured to supply each sensor (S) transferred from a sensor pickup unit (not shown) to the shuttle unit (100s).

[0090] According to one example related thereto, the rotate unit (110) may include a support unit (111), a vacuum plate (112), and a rotating device (113). Additionally, a plurality of suction holes may be formed on one side of the vacuum plate (112) to adsorb and fix each of the plurality of sensors (S).

[0091] The left and right sides of the vacuum plate (112) are mounted on the inner side of each of the support units (111) arranged to face each other, and a rotation device (113) may be provided on one side of at least one of the support units (111). Accordingly, the vacuum plate (112) may be formed to be rotatable so as to achieve an up-and-down inversion by the rotation device (113).

[0092] As an example related to this, the plurality of suction holes can adsorb and fix each sensor (S) when the vacuum plate (112) rotates, thereby preventing the sensor (S) from falling to the bottom surface of the process.

[0093] A vacuum plate lifting section (114) is formed in each of the above support units (111), so that the vacuum plate (112) can be moved up and down while supported by the support unit (111).

[0094] As an example related to this, when a sensor pickup unit (not shown) places a plurality of sensors (S) on a vacuum plate (112), the vacuum plate (112) can be rotated by a rotating device (113) to invert the top and bottom so as to place the sensors (S) on a sensor mounting unit (100s3) while the plurality of suction holes formed in the vacuum plate (112) adsorb and fix each sensor (S). At this time, the sensor mounting unit (100s3) may be provided in a number corresponding to the plurality of sensors (S) supplied by the rotate unit (110).

[0095] Accordingly, it is preferable that the initial process position of the aforementioned shuttle unit (100s) is such that when the rotate unit (110) rotates, one side of the vacuum plate (112) faces the sensor mounting part (100s3).

[0096] Meanwhile, a problem may occur in which a plurality of sensors (S) mounted on the rotate unit (110) are supplied to the shuttle unit (100s) in a state deviating from a preset alignment position.

[0097] To prevent such problems, a position adjustment rail (100s21) may be provided on the base portion (100s2) of the shuttle unit (100s). At least one of the plurality of sensor mounting portions (100s3) may be coupled to the position adjustment rail (100s21) so as to be movable in the forward and backward directions along the position adjustment rail (100s21). Accordingly, the sensor mounting portion (100s3) may be moved to a position corresponding to the location of each sensor (S) mounted on the vacuum plate (112) so as to receive the sensor (S) at the correct position.

[0098] In addition, the sensor-film vacuum laminator (100) may further include a defect detection unit (not shown) mounted on a part of a sensor pickup unit (not shown) to detect defects in a sensor (S) supplied from a sensor loading unit (100a).

[0099] As an example related to this, a code may be formed on one side of the sensor (S). The code may be configured to record defect information that occurred during a process prior to the sensor (S) being placed on the tray. At this time, a defect detection unit (not shown) may detect whether the sensor (S) is defective by reading the code formed on the sensor (S) using a laser or the like.

[0100] The above defect detection unit (not shown) may consist of a code reader, a scanner, etc., but since this is a previously disclosed technology, further explanation is omitted.

[0101] At this time, the sensor (S) may be supplied such that the side on which the code is formed faces upward so that a defect detection unit (not shown) can easily read the code, but when the sensor-film laminating, the side opposite to the side on which the code is formed comes into contact with the film (F) and is laminated, so the above-described rotate unit (110) rotates the sensor (S) while adsorbing and fixing it so that it is supplied to the shuttle unit (100s).

[0102] The sensor-film vacuum laminator (100) may further include a defective discharge unit (120) positioned behind the process rotation unit (110) to remove a sensor (S) that is read as defective among the sensors (S) mounted on one surface of the vacuum plate (112) before the rotation unit (110) rotates.

[0103] The above defective discharge unit (120) may include a discharge module (121), a guide rail (123), and a lifting cylinder (122). In addition, a plurality of vacuum pads (121a) may be provided at the end of the discharge module (121).

[0104] As an example related thereto, the discharge module (121) is mounted on a lifting cylinder (122), and the lifting cylinder (122) can be mounted on a guide rail (123). The discharge module (121) can move along the guide rail (123) to the left and right sides of the defective discharge unit (120), and can be configured to move up and down by the lifting cylinder (122).

[0105] In addition, a discharge plate (124) may be provided at a location adjacent to the defective discharge unit (120) to accommodate a sensor (S) that has been identified as defective.

[0106] As an example related to this, the discharge module (121) may be configured to move along the guide rail (123) to an area where a sensor (S) identified as defective on the vacuum plate (112) is placed, and then lower by the lifting cylinder (122) to adsorb the defective sensor (S) to the vacuum pad (121a). After adsorption, it may be configured to move to the discharge plate (124) to discharge the defective sensor (S).

[0107] As an example related to this, an ionizer (IO) may be installed in the defective discharge unit (120) to remove electrostatic charges from a protective film (not shown) positioned to cover the sensor (S). Accordingly, the first peeling unit (130) can easily peel off the protective film (not shown) of the sensor (S).

[0108] The above ionizer (IO) is a device configured to remove electrostatic charges by ionizing air molecules of an electrostatically charged object, but since this is a known technology, further explanation is omitted.

[0109] The sensor-film vacuum laminator (100) may further include a first transfer unit (140) positioned in front of the first chamber (100c) in the process and configured to adsorb each of the plurality of sensors (S) positioned in the sensor mounting portion (100s3) and transfer them into the first receiving portion (100c1).

[0110] As an example related thereto, the first transfer unit (140) may include a first clamp (141), a first clamp lifting unit (142), and a first clamp transfer unit (143).

[0111] More specifically, the first clamp (141) may be mounted on the first clamp lifting unit (142) to enable vertical movement. The first clamp lifting unit (142) may be coupled to the first clamp transfer unit (143) to enable movement in the forward and backward directions during the process. A plurality of sensor adsorption units (141a) may be provided on one side of the first clamp (141) to enable adsorption of each of the plurality of sensors (S) mounted on the shuttle unit (100s).

[0112] As an example related thereto, the first clamp (141) may be configured to move along the first clamp transfer section (143) to the upper side of the sensor mounting section (100s3) and then lower by the first clamp lifting section (142). When the first clamp (141) is lowered, a plurality of sensor adsorption sections (141a) provided on one side of the first clamp (141) may adsorb one side of the sensor (S) to clamp each of the sensors (S). Subsequently, the first clamp (141) may move to the upper side of the first chamber (100c) and each of the sensors (S) may be placed at a preset position on the sensor mounting section (J1).

[0113] At this time, a plurality of adsorption pads are formed on each sensor adsorption part (141a), and each of the plurality of adsorption pads can be configured to adsorb different parts of one surface of a single sensor (S). Accordingly, when the sensor (S) is transferred into the first receiving part (100c1) by the first transfer unit (140), it can be stably adsorbed and fixed during transfer.

[0114] The sensor-film vacuum laminator (100) may further include a sensor position detection unit (150) configured to detect the alignment state of the sensor (S) by photographing the position of the sensor (S) mounted on the sensor mounting jig (J) and comparing it with a preset position.

[0115] As an example related thereto, the sensor position detection unit (150) may be positioned before the first chamber (100c) moves along the chamber moving device (R) for sensor-film lamination and reaches the lower part of the second chamber (100d). The sensor position detection unit (150) may include a sensor vision unit (151) and a sensor illumination unit (152).

[0116] More specifically, the sensor position detection unit (150) may be configured to capture the leading edge position of the sensor (S) using the sensor vision unit (151) on the first chamber (100c). Then, by comparing the captured leading edge position of the sensor (S) with preset position information, the alignment state of the sensor (S) may be detected.

[0117] Additionally, the sensor illumination unit (152) may be configured to irradiate light so that the sensor vision unit (151) can easily detect the edge end of the sensor.

[0118] Hereinafter, in this specification, the end portion of the edge of the object will be referred to as the tip.

[0119] Meanwhile, an alignment stage (100c3) may be installed on the pressure drive device (100c2) to finely adjust the position of the sensor mounting jig (J) based on the alignment state of the sensor (S) detected by the sensor position detection unit (150).

[0120] More specifically, the sensor mounting jigs (J) are provided in multiple numbers and can be installed so as to be movable within the first receiving portion (100c1). Additionally, the alignment stage (100c3) can be configured to finely adjust the individual positions of each of the multiple sensor mounting jigs (J).

[0121] Accordingly, each of the plurality of sensors (S) accommodated in the first receiving portion (100c1) can have their individual positions finely adjusted so that when the first chamber (100c) and the second chamber (100d) are combined, they are positioned in each of the plurality of films (F) accommodated in the second receiving portion (100d1).

[0122] As an example related to this, the alignment stage (100c3) may be a UVW stage. A UVW stage refers to a positioning mechanism that enables multi-axis movement, including rotation, through the linear motion of each drive axis by arranging multiple drive axes on a plane, but since this is a previously known technology, further explanation is omitted.

[0123] In addition, the sensor vision unit (151) described above may be provided in a number corresponding to each sensor mounting jig (J) at a position that is superior to the first chamber (100c) to detect the leading edge position of the sensor (S) mounted on each sensor mounting jig (J).

[0124] Meanwhile, since multiple films (F) are loaded in the film loading section (100b) so as to overlap each other, static electricity may be generated on the films (F), and two or more films (F) may be supplied in an overlapping state. In this case, multiple films (F) may be laminated onto a single sensor (S), which may result in a defect.

[0125] In order to prevent the above-mentioned problem, the film loading section (100b) may be equipped with an ionizer (IO) configured to prevent the film (F) from overlapping and a sensing device (S3) that detects whether the film (F) is overlapping.

[0126] As an example related to this, an ionizer (IO) may be installed on the upper side of the first lift (100b1). The ionizer (IO) may be configured to remove electrostatic charges from the film (F) before the film supply module (100b51) adsorbs the film (F), thereby preventing the film (F) from overlapping. The description related to the ionizer (IO) is the same as the description above and is therefore omitted.

[0127] In addition, the sensing device (S3) may be configured to detect whether the film (F) overlaps by detecting the thickness of the film (F) adsorbed by the film loading unit (100b). Also, a defective film buffer (100b6) configured to accommodate a defective film (F) may be provided at a location adjacent to the film loading unit (100b).

[0128] As an example related to this, a sensing device (S3) may be positioned between the first lift (100b1) and the plate transfer device (100b3). It may also be configured to detect the thickness of a film (F) that is adsorbed by the film loading unit (100b) and transferred onto the mounting plate (100b4). At this time, if the detected thickness of the film (F) differs from a preset thickness, the film supply module (100b51) may adsorb the film (F) and discharge it to a defective film buffer (100b6).

[0129] FIG. 8 is a perspective view of the film alignment unit (160) and film position-orientation detection unit (V) shown in FIG. 2. FIG. 9 is a perspective view of the second chamber (100d) shown in FIG. 2. FIG. 10 is a perspective view of the second filling unit (170) shown in FIG. 2.

[0130] Referring to FIGS. 8 to 10, the sensor-film vacuum laminator (100) may further include a film alignment unit (160) formed to adsorb a film (F) supplied from a film loading unit (100b) and to be able to adjust the position and orientation of the adsorbed film (F).

[0131] The above film alignment unit (160) may include a film pickup unit (161), an alignment lifting unit (162) on which the film pickup unit (161) is mounted, an alignment guide (163) on which the alignment lifting unit (162) is mounted, an alignment moving member (164) on which the alignment guide (163) is installed, and an alignment rail (165) on which the alignment moving member (164) is installed. In addition, a tilting module (161a) is mounted at the end of the film pickup unit (161), and a vacuum pad (161b) may be provided at the end of the tilting module (161a).

[0132] More specifically, the film pickup unit (161) may be mounted on the alignment lifting unit (162) and configured to move up and down. The alignment lifting unit (162) may be mounted on the alignment guide (163) and configured to move in the left and right directions of the film alignment unit (160). The alignment guide (163) is installed on the alignment moving member (164), and the alignment moving member (164) may be mounted on the alignment guide (163), which is formed to be extended forward and arranged to face each other, so as to be movable forward and backward during the process.

[0133] As an example related thereto, the film pickup unit (161) may be configured to lower by the alignment lifting unit (162), adsorb the film (F) supplied by the mounting plate (100b4) onto the vacuum pad (161b), and then move along the alignment guide (163) and alignment rail (165) while mounted on the alignment moving member (164) to finely adjust the position of the film (F).

[0134] In addition, the tilting module (161a) is formed to allow adjustment of θ at a predetermined angle centered on the vertical line, so that the position of the film (F) can be finely adjusted.

[0135] More specifically, the tilting module (161a) is formed to be rotatable at a predetermined angle so as to adjust θ around a vertical line. That is, it can be configured to finely adjust the horizontal position for the film (F) to be seated on the holder (H).

[0136] In addition, the film pickup unit (161) may be provided in a number corresponding to each of the plurality of films (F) supplied by the mounting plate (100b4). Thus, the position of each of the plurality of films (F) can be individually finely adjusted.

[0137] Meanwhile, the sensor-film vacuum laminator (100) may further include a film position-position detection unit (V) configured to detect the position and position of a film (F) adsorbed to a film alignment unit (160).

[0138] The film position-orientation detection unit (V) may be configured to detect the position and orientation of the film (F) by photographing the film (F) adsorbed to the film alignment unit (160). Additionally, the detected position and orientation of the film (F) may be configured to detect the alignment state of the film (F) by comparing it with preset position and orientation information.

[0139] At this time, the film alignment unit (160) can be configured to adjust the position and orientation of the film (F) based on the result detected by the film position-orientation detection unit (V) and to place it on the holder (H).

[0140] As an example related thereto, the film position-position detection unit (V) may include a vision housing (V1) and a film vision unit (not shown). The vision housing (V1) may be a structure having a vision hole formed on its upper side. The film vision unit (not shown) may be positioned to view an image inside the vision housing (V1) and configured to photograph the lower surface of the film (F).

[0141] At this time, the film vision unit (not shown) can be configured to photograph the film (F) by setting a more precise focus in an environment shielded from external light, because it photographs the lower surface of the film (F) attached to the film alignment unit (160) through the vision hole.

[0142] Meanwhile, in order to precisely detect the position and orientation of the film (F), it is desirable to provide a lighting device capable of detecting the leading edge of the film (F). At this time, since the film (F) is made of a transparent material, the film vision unit (not shown) may not be able to easily detect the leading edge of the film (F) with a general lighting device.

[0143] To solve the above-mentioned problem, the film position-attitude detection unit (V) may further include an infrared lamp (V2). In this case, the infrared lamp (V2) may be an IR lamp.

[0144] As an example related to this, an infrared lamp (V2) is positioned above a film vision section (not shown) and is formed in a donut shape with a hole having a diameter corresponding to the vision hole, so that even if the infrared lamp (V2) irradiates infrared light onto the lower surface of the film (F) from above the film vision section (not shown), the film vision section (not shown) can secure a shooting area.

[0145] According to the above configuration, the film alignment unit (160) can adjust the position of the film (F) based on the leading angle of the film (F) detected by the film vision unit (not shown), and then finely adjust the position of the film (F) based on the position of the leading edge of the film (F) detected so that it can be placed on the holder (H).

[0146] At this time, the holder (H) may be provided in a number corresponding to each of the plurality of films (F) supplied by the film alignment unit (160) within the second receiving section (100d1). In addition, since each of the film pickup sections (161) is formed to individually control the position of the adsorbed film (F), the film (F) can be precisely seated at a preset position of each of the plurality of holders (H).

[0147] Meanwhile, the above-described second peeling unit (170) may be configured to absorb and peel off a protective film (not shown) that is positioned to cover the film (F) by moving onto the second chamber (100d) before the second chamber (100d) rotates around an axis.

[0148] According to one example related thereto, the second peeling unit (170) may include a guide rail (171), a support bracket (172), a lifting cylinder (173), a lifting member (174), and a peeling adsorption pad (175). Additionally, the second peeling unit (170) may be positioned above the second chamber (100d), but may be positioned behind the second chamber (100d) during the process.

[0149] More specifically, the guide rail (171) of the second filling unit (170) is provided on both the left and right sides of the process and arranged to face each other, and can be formed to extend long up to the upper side of the second chamber (100d).

[0150] Additionally, a support bracket (172) may be mounted on the guide rail (171). A lifting cylinder (173) may be mounted on the support bracket (172), and a lifting member (174) may be mounted on the lifting cylinder (173). Furthermore, a peeling adhesive pad (175) may be mounted on one side of the lifting member (174).

[0151] Meanwhile, the peeling adsorption pads (175) may be provided in a number corresponding to the film (F) accommodated in the second chamber (100d). A plurality of peeling adsorption pads (175) may be arranged on the lifting member (174) at a predetermined distance from each other. A protective film collection container (176) for film (not shown) configured to receive a peeled protective film may be provided at the bottom of the second peeling unit (170). The protective film collection container (176) for film may be provided in a number corresponding to the peeling adsorption pads (175) under the peeling adsorption pads (175).

[0152] According to this configuration, when the protective film (not shown) of the film (F) is peeled off, the support bracket (172) can move along the guide rail to the upper side of the second chamber (100d). At this time, when the lifting member (174) is lowered by the lifting cylinder (173), the peeling suction pad (175) mounted on one side of the lifting member (174) can be configured to absorb and peel off the protective film (not shown) covering the film (F), then move to the initial position and discharge it into the protective film collection container (176).

[0153] FIG. 11 is a perspective view of the holder (H) illustrated in FIG. 9. FIG. 12 is a perspective view of the combined form of the first chamber (100c) and the second chamber (100d). FIG. 13 is a conceptual diagram showing the change of the holder (H) during sensor-film lamination.

[0154] Referring to FIGS. 11 to 13, when the second chamber (100d) is rotated to invert up and down, a problem may occur in which the film (F) aligned and seated on the holder (H) detaches from the holder (H) and falls to the bottom surface of the process.

[0155] Furthermore, when the second peeling unit (170) adsorbs and peels off the protective film (not shown), a problem may occur in which the film (F) placed on the holder (H) is adsorbed and discharged together with the protective film (not shown).

[0156] To solve the above-mentioned problem, the holder (H) may include a holder body (H1) installed within the second receiving portion (100d1) and a pad (H2) installed on the holder body (H1) and formed of a material having an adhesive surface.

[0157] More specifically, the holder body (H1) is fixedly installed inside the second chamber (100d), and the pad (H2) is formed of a material with an adhesive surface, and the pad (H2) can be installed to cover a portion of one side of the holder body (H1). In addition, the aforementioned film seating portion (H21) can be formed on one side of the pad (H2) so that the film (F) can be seated thereon.

[0158] As an example related to this, the surface of the pad (H2) may be made of a silicone material that has adhesive properties. In this case, the adhesive force of the pad (H2) is formed such that the film (F) does not fall off even when the second chamber (100d) rotates, and can be formed to be stronger than the adsorption force of the second filling unit (170).

[0159] For reference, adhesive strength is also called peel strength and refers to the 180° peel strength when the adhesive surface is sufficiently in contact with the substrate. In other words, the stronger the adhesive strength of the pad (H2), the stronger the film (F) can be held.

[0160] As an example related to this, the surface area of ​​the pad (H2) may be made of a silicone pad (H2) that has adhesive properties only in the area where the film attachment portion (H21) is formed.

[0161] According to the configuration of the holder (H) described above, the film (F) can be maintained in a held state from the pad (H2) even when the second chamber (100d) rotates, and since the adhesive force of the pad (H2) is formed to be stronger than the adsorption force of the second peeling unit (170), the second peeling unit (170) can easily adsorb and peel off only the protective film (not shown).

[0162] Meanwhile, when the edge of the pad (H2) is formed at a right angle during sensor-film lamination, the portion of the pad (H2) edge may come into contact with the sensor (S) first. In this case, residual air cannot escape to the outside and becomes trapped between the film (F) and the sensor (S), which may create empty spaces such as bubbles.

[0163] In addition, if the side of the pad (H2) is formed flat, when the film (F) placed on the sensor (S) is pressed, the sharp edge of the pad (H2) may cause damage to the sensor (S) and the film (F).

[0164] To prevent the above-mentioned problem, the pad (H2) may include a flat portion (H22) formed to hold the film (F) and an inclined portion (H23) that overlaps with the edge portion of the film (F). The inclined portion (H23) may be formed to have a curved shape. At this time, the flat portion (H22) may be one side of the pad (H2) on which the film seating portion (H21) is formed.

[0165] More specifically, the flat portion (H22) may be formed to hold the inner portion excluding the edge portion of the film (F). Additionally, the inclined portion (H23) may be extended downwardly from the flat portion (H22) and form a curved shape, and may be formed so that a part of the inclined portion (H23) overlaps with the edge portion of the film (F).

[0166] With this configuration, during the process in which a film (F) placed on a sensor (S) for sensor-film lamination is pressed, the inner side of the inclined portion (H23) adjacent to the flat portion (H22) can be elastically deformed into a flat shape by the pressure. The pad (H2) can be formed to generate a force that pushes from the inner part of the film (F) toward the edge portion by the elastic deformation.

[0167] That is, when laminating the sensor-film, the edge portion of the film (F) is not pressed at the beginning of the press, but as the pad (H2) undergoes elastic deformation, the film (F) can be gradually pressed in a direction toward the outside of the edge portion by the pushing force.

[0168] At this time, due to the pushing force mentioned above, residual air during sensor-film lamination is expelled to the outside, thereby preventing the formation of empty spaces such as bubbles between the sensor (S) and the film (F).

[0169] Furthermore, since the inclined portion (H23) is formed to have a curved shape, it is possible to prevent the film (F) and the sensor (S) from being damaged by the sharp edge of the pad (H2).

[0170] Meanwhile, after the sensor-film lamination, a problem may occur in which the laminated sensor-film remains in a held state without detaching from the surface of the adhesive pad (H2).

[0171] To prevent the above-mentioned problem, an air injection hole (H3) is formed in the holder (H) to inflate the pad (H2), thereby allowing the sensor-film to be easily separated from the pad (H2).

[0172] More specifically, the air injection hole (H3) may be formed in a portion of the holder body (H1) that overlaps with the center of the pad (H2) to inject air into the pad (H2). When air is injected into the pad (H2) through the air injection hole (H3), the center of the pad (H2) may be inflated into a convex shape.

[0173] At this time, if the center of the pad (H2) is bulged into a convex shape, the contact area between the pad (H2) and the sensor-film is reduced, so the adhesive force of the pad (H2) holding the sensor-film is weakened, allowing the sensor-film to be easily separated from the surface of the pad (H2). Afterward, the sensor-film separated from the pad (H2) can be placed on the sensor mounting jig (J).

[0174] The sensor-film vacuum laminator (100) may further include a second transfer unit (180) configured to adsorb and transfer each sensor-film laminated and mounted on a sensor mounting jig (J).

[0175] According to one example related thereto, the second transfer unit (180) may include a second clamp (181), a second clamp lifting part (182), and a second clamp transfer part (183).

[0176] More specifically, the second clamp (181) may be mounted on the second clamp lifting unit (182) to enable vertical movement. The second clamp lifting unit (182) may be coupled to the second clamp transfer unit (183) to enable movement in the left and right directions during the process. A plurality of sensor-film adsorption units (181a) may be provided on one side of the second clamp (181) to adsorb sensor-films mounted on a plurality of sensor mounting jigs (J), respectively.

[0177] As an example related to this, the second clamp (181) may be configured to move to the upper side of the sensor mounting jig (J) along the second clamp transfer section (183) and then lower by the second clamp lifting section (182). When the second clamp (181) is lowered, a plurality of sensor-film adsorption sections (181a) provided on one side of the second clamp (181) may adsorb one side of the sensor-film to clamp each sensor-film. Subsequently, the second clamp (181) may transfer the sensor-film to the next process along the second clamp transfer section (183).

[0178] As an example related to this, a plurality of adsorption pads are formed in each of the sensor-film adsorption portions (181a), and each of the plurality of adsorption pads may be configured to adsorb different parts of one surface of a single sensor-film. Accordingly, the sensor-film can be stably adsorbed and fixed by the second transfer unit (180) and transferred to the next process.

[0179] The sensor-film vacuum laminator (100) may further include a function inspection unit (190) configured to determine whether the sensor-film is normal.

[0180] As an example related to this, the function inspection unit (190) is configured to supply an electrical signal to the sensor-film transported by the second clamp (181). At this time, if the sensor-film responds normally in response to the electrical signal, it is determined to be normal, and if it does not respond to the supplied electrical signal, it is determined to be defective.

[0181] The sensor-film laminator may further include a sensor-film unloading section (100e) and a defective sensor-film discharge section (100f).

[0182] As an example related to this, a sensor-film determined to be normal in the function inspection unit (190) can be transferred and placed on a tray provided on the sensor-film unloading unit (100e). At this time, the sensor-film unloading unit (100e) can be placed on one side of the sensor loading unit (100a). The sensor-film unloading unit (100e) can be made of the same structure as the sensor loading unit (100a) described above.

[0183] Furthermore, a sensor film determined to be defective in the function inspection unit (190) may be transferred to a defective sensor film discharge unit (100f). The defective sensor film discharge unit (100f) may be configured to load the sensor film determined to be defective. At this time, the defective sensor film discharge unit (100f) may be positioned on one side of the sensor film unloading unit (100e).

[0184] As an example related thereto, the sensor-film laminator may further include a defective product shuttle unit (not shown). The defective product shuttle unit (not shown) may include a defective product shuttle rail (not shown) and a defective product mounting part (not shown) mounted on the defective product shuttle rail.

[0185] The above defective product shuttle rail (not shown) may be formed to extend from the functional inspection unit (190) to the defective sensor-film discharge unit (100f). The above defective product loading unit (not shown) may be configured to move along the defective product shuttle rail (not shown) to transport the defective sensor-film to the defective sensor-film discharge unit (100f).

[0186] According to the configuration of the sensor-film vacuum laminator (100) described above, the lamination process of the sensor and film is performed in a vacuum state, thereby preventing the formation of empty spaces, such as bubbles, between the sensor and the film. In addition, the sensor is placed on the sensor mounting jig (J), and the sensor mounting jig (J) is configured to align the sensor within the first receiving section (100c1) based on the alignment state of the sensor detected by the sensor position detection unit (150). The film alignment unit (160) is configured to align the position and orientation of the film (F) based on the alignment state of the film (F) detected by the film position-orientation detection unit (V), and then place the film (F) on the holder (H) placed within the second receiving section (100d1), so precise lamination of the sensor (S) and the film (F) can be performed.

[0187] Hereinafter, as another example for achieving the above-mentioned purpose, a sensor-film laminating system equipped with the sensor-film vacuum laminator (100) will be described.

[0188] Referring again to FIG. 1, the sensor-film vacuum laminating system (10) comprises at least two sensor-film vacuum laminators (100) arranged symmetrically with respect to one axis. At this time, the two sensor-film vacuum laminators (100, 100') are identical to those described above and thus serve as a substitute for the description.

[0189] Meanwhile, the aforementioned vacuum pump (P) is integrated and provided as a single unit on the sensor-film vacuum laminating system (10). The single vacuum pump (P) can be positioned between two sensor-film vacuum laminators (100). And, the interior formed when the first chamber (100c) and the second chamber (100d) of each sensor-film vacuum laminator (100) are combined can be formed into a vacuum state.

[0190] More specifically, a single vacuum pump (P) may be configured to be connected to at least one of the first chamber (100c) and second chamber (100d) of either of the two sensor-film vacuum laminators (100), and at the same time connected to at least one of the other first chamber (100c) and second chamber (100d).

[0191] The sensor-film vacuum laminating system (10) may further include a chiller (C) to control the temperature during the process.

[0192] The chiller (C) may be provided as a single unit between two sensor-film laminators. The chiller (C) refers to a temperature control device used in the manufacturing process. Since the chiller (C) is a previously known technology, further explanation is omitted.

[0193] The sensor-film vacuum laminating system (10) may further include a control box (B) for controlling the plurality of equipment and supplying power.

[0194] A control box (B) refers to a facility configured to distribute power and control signals and transmit them to electronic devices. The control box (B) may be placed at each end of two sensor-film vacuum laminators (100) to easily supply power and control signals to a plurality of devices comprising the sensor-film vacuum laminator (100).

[0195] In addition, the control box (B) may be formed with an explosion-proof design structure to prevent explosions caused by fire, etc. Since the control box (B) is a previously known technology, further explanation is omitted.

[0196] According to the sensor-film vacuum laminating system (10) described above, the process time can be shortened because the sensor-film laminating operation is performed in at least two sensor-film vacuum laminators (100). In addition, since a vacuum pump (P) configured to form a vacuum state during sensor-film laminating is provided as a single unit and connected to each sensor-film vacuum laminator (100), the energy consumption of the entire process can be reduced and space efficiency can be increased.

[0197] Hereinafter, as another example for achieving the above-mentioned purpose, a sensor-film vacuum laminating method using the sensor-film vacuum laminator (100) is described. At this time, the sensor-film vacuum laminator (100) may be the sensor-film vacuum laminator (100) described above.

[0198] The sensor-film vacuum laminating method can be configured such that the step of supplying the sensor (S) and the step of supplying the film (F) are performed independently.

[0199] The step of supplying the sensor(S) may include the following steps.

[0200] (a) The sensor loading unit (100a) performs the step of supplying a sensor (S) placed on a tray.

[0201] As an example related to this, step (a) may include a tray insertion step, a tray lifting step, and a sensor (S) transfer step.

[0202] In the tray insertion step, the tray on which the sensor (S) is placed is inserted into the lower transfer device (not shown) of the sensor loading unit (100a) and can be transferred from one side of the sensor loading unit (100a) to the other side.

[0203] In the tray lifting stage, the tray transported by the lower transport device (not shown) can be lifted up to the upper transport device (not shown) along the tray lift (not shown).

[0204] In the sensor (S) movement step, after the tray lifting step, the sensor (S) placed on the tray can be transferred to the next process by a sensor pickup unit (not shown).

[0205] More specifically, a sensor pickup unit (not shown) can place the sensor (S) on the rotate unit (110).

[0206] At this time, as the sensor (S) is transferred onto the rotate unit (110), a defective sensor (S) detection step may be further performed. In the defective sensor (S) detection step, a defective detection unit (not shown) can detect whether there is a defect by reading a code formed on one side of the sensor.

[0207] (b) After step (a) above, a step is performed in which the sensor (S) supplied from the sensor loading unit (100a) is transferred to the first receiving unit (100c1) of the first chamber (100c).

[0208] More specifically, when a shuttle unit (100s) equipped with a sensor (S) reaches the first chamber (100c), a transfer unit can adsorb the sensor (S) and transfer it to the first receiving portion (100c1) of the first chamber (100c).

[0209] As an example related to this, prior to step (b), a defective sensor (S) ejection step, a normal sensor (S) mounting step, and a sensor (S) protective film (not shown) peeling step may be further performed.

[0210] In the defective sensor (S) discharge step, the defective discharge unit (120) can adsorb the sensor (S) read as defective by the defective detection unit (not shown) and discharge it to the discharge plate (124).

[0211] At this time, an additional step of removing electrostatic charge from the protective film (not shown) can be performed so that the ionizer (IO) installed in the defective discharge unit (120) facilitates the peeling of the protective film (not shown).

[0212] In the normal sensor (S) mounting step, the rotate unit (110) can be rotated to achieve an up-and-down inversion so that the normal sensor (S) can be mounted on the shuttle unit (100s).

[0213] In the step of peeling off the protective film (not shown) of the sensor (S), when the shuttle unit (100s) equipped with the sensor (S) moves downward to the first peeling unit (130), the first peeling unit (130) can peel off the protective film (not shown) positioned to cover the sensor (S) by adsorbing it.

[0214] (c) After step (b), the first chamber (100c) moves to the lower side of the second chamber (100d).

[0215] More specifically, the first chamber (100c) can move downward of the second chamber (100d) along a chamber moving device (R) provided in the sensor-film laminating process.

[0216] As an example related to this, a sensor (S) position detection step and a sensor (S) position alignment step may be further performed to align the sensor (S) to a preset position before the first chamber (100c) arrives at the bottom of the second chamber (100d).

[0217] In the sensor (S) position detection step, the sensor position detection unit (150) can detect the alignment state of the sensor (S) by photographing the position of the sensor (S) mounted on the sensor mounting jig (J) and comparing it with a preset position.

[0218] In the sensor (S) position alignment step, the sensor mounting jig (J) can finely adjust the position of the sensor (S) based on the alignment state of the sensor (S) detected by the sensor position detection unit (150).

[0219] Meanwhile, the step of supplying the film (F) may include the following steps.

[0220] (1) A film loading unit (100b) performs the step of adsorbing one side of a film (F) loaded in a film stack (100b11, 100b21) and supplying it one sheet at a time.

[0221] As an example related to this, step (1) may include a film (F) lifting step and a film (F) thickness detection step.

[0222] In the film (F) lifting stage, the first lift (100b1) and the second lift (100b2) can lift the film (F) loaded in the film stack (100b11, 100b21).

[0223] As an example related to this, if a small amount of film (F) loaded in the film stack (100b11) of the first lift (100b1) remains or is depleted, the step of supplying film (F) loaded in the film stack (100b21) of the second lift (100b2) to the film stack (100b11) of the first lift (100b1) may be further performed.

[0224] At this time, if a small amount of film (F) loaded in the film stack (100b21) of the second lift (100b2) remains or is depleted, a step of generating a control signal to supply film (F) to the film stack (100b21) may be further performed.

[0225] Afterwards, an ionizer (IO) installed in the film loading section (100b) may further perform a step of removing electrostatic charge from the film (F) to prevent the film (F) from overlapping.

[0226] In the film (F) thickness detection step, the sensing device (S3) can detect the thickness of the film (F). At this time, if the thickness of the film (F) differs from a preset thickness, the film (F) is considered to be overlapping, and the film loading unit (100b) can discharge the film (F) to the defective film buffer (100b6).

[0227] (2) A step is performed in which the film (F) supplied from the film loading unit (100b) is transferred to the second chamber (100d).

[0228] More specifically, the film (F) transferred from the film supply module (100b51) is placed on the mounting plate (100b4) and can be transferred to the next process.

[0229] As an example related to this, prior to step (2), a film (F) position-position detection step and a film (F) position-position alignment step for detecting the position and position of the film (F) may be further performed.

[0230] In addition, the film (F) position-position detection step and the film (F) position-position alignment step may be performed simultaneously.

[0231] In the step of detecting the position and orientation of the film (F), the film position-orientation detection unit (V) may detect the position and orientation of the film (F) by photographing the film (F) adsorbed to the film alignment unit (160).

[0232] In the film (F) position-position alignment step, the film alignment unit (160) can adjust the position and position of the film (F) based on the result detected by the film position-position detection unit (V).

[0233] As an example related to this, after the film (F) position-position alignment step, a holder (H) seating step can be further performed.

[0234] In the holder (H) seating step, the film alignment unit (160) can place the film (F), whose position and orientation have been finely adjusted, onto the holder (H) placed in the second chamber (100d).

[0235] (2) The second chamber (100d) performs a step of rotating around one axis while holding the film (F).

[0236] More specifically, when a film (F) is placed on a holder (H) disposed within the second chamber (100d), the holder (H) can rotate around an axis while holding the film (F).

[0237] As an example related to this, prior to step (3), a film (F) protective film (not shown) peeling step may be further performed, in which a second peeling unit (170) adsorbs and peels off a protective film (not shown) positioned to cover the film (F).

[0238] In the film (F) protective film (not shown) peeling step, the second peeling unit (170) moves upward in the second chamber (100d) and can peel off the protective film (not shown) positioned to cover the film (F) placed on the holder (H) by adsorbing it.

[0239] After the above steps (c) and (3), a sensor-film laminating step is performed.

[0240] More specifically, with the sensor (S) mounted on the sensor mounting jig (J) and the film (F) mounted on the holder (H), the first chamber (100c) and the second chamber (100d) are combined so that the film (F) can be laminated onto one surface of the sensor (S).

[0241] At this time, the internal space formed in the mutually combined state of the first chamber (100c) and the second chamber (100d) can be formed into a vacuum state by a vacuum pump (P). Therefore, when laminating the sensor-film, it is possible to prevent the occurrence of empty spaces, such as bubbles, between the sensor (S) and the film (F).

[0242] Afterwards, the laminated sensor-film may undergo a step of determining whether it is normal in the function inspection unit (190).

[0243] More specifically, the sensor-film may be judged as normal if it responds normally to the electrical signal supplied by the function inspection unit (190), and may be judged as defective if it does not respond to the supplied electrical signal.

[0244] As an example related to this, after the step of determining whether the sensor-film is normal in the function inspection unit (190), the normal sensor-film may be transferred to the sensor-film unloading unit (100e) and the defective sensor-film may be transferred to the defective sensor-film discharge unit (100f).

[0245] Therefore, the laminated sensor-film can be finally determined to be normal by the function inspection unit (190), and the sensor-film determined to be normal can be distinguished.

[0246] According to the sensor-film vacuum laminating method described above, since the supply, transfer, inspection, and laminating steps of the sensor (S) and film (F) proceed sequentially, systematic sensor-film vacuum laminating can be performed. Therefore, production efficiency can be improved.

[0247] In addition, since the lamination of the sensor-film is performed in a vacuum, it is possible to prevent the formation of empty spaces, such as bubbles, between the sensor and the film (F).

[0248] The foregoing description is merely illustrative, and various modifications may be made by those skilled in the art without departing from the scope and technical spirit of the described embodiments. The foregoing embodiments may be implemented individually or in any combination.

Claims

Claim 1 A sensor loading unit configured to load a tray on which a sensor is placed and supply it to the next process, and formed to load said tray; a first chamber configured to be movable to a preset position and having a first receiving portion for receiving said sensor; a film loading unit configured to adsorb one side of a film loaded in a film stack and supply it to the next process sheet by sheet; a second chamber configured to be rotatable around a single axis and coupled to said first chamber at a preset position, having a second receiving portion for receiving said film; a first peeling unit configured to adsorb and peel off a protective film placed to cover said sensor before the sensor is received in said first chamber; a second peeling unit configured to move onto said second chamber before the second chamber rotates and to adsorb and peel off a protective film placed to cover said film. A sensor-film vacuum laminator comprising a vacuum pump connected to at least one of the first chamber and the second chamber, configured to form a vacuum inside when the first chamber and the second chamber are coupled together, wherein when the first chamber and the second chamber are coupled together, the film is placed on the sensor and pressurized inside the vacuum formed by the vacuum pump. Claim 2 delete Claim 3 A sensor-film vacuum laminator according to claim 1, further comprising a shuttle unit configured to transport the sensor supplied from the sensor loading unit to the first chamber, wherein the first peeling unit is configured to peel off a protective film disposed to cover the sensor on the shuttle unit before the shuttle unit reaches the first chamber. Claim 4 A sensor-film vacuum laminator according to claim 1, further comprising: an ionizer configured to remove electrostatic charges from the film before the film loading unit adsorbs the film, thereby preventing the film from overlapping; and a sensing device configured to detect the thickness of the film adsorbed by the film loading unit and to detect whether the film overlaps. Claim 5 A sensor-film vacuum laminator according to claim 1, comprising: a sensor mounting jig having a sensor mounting portion on which the sensor is mounted, movably installed within the first receiving portion, and formed to allow for fine position adjustment so that the sensor is positioned on the film before the first chamber and the second chamber are coupled together; and further comprising a holder disposed within the second receiving portion and having a film mounting portion on which the film to be laminated to the sensor is mounted, wherein, when the first chamber and the second chamber are coupled together, the sensor positioned on the sensor mounting jig through fine position adjustment is positioned to correspond to the film positioned on the holder. Claim 6 A sensor-film vacuum laminator according to claim 5, characterized in that, after the fine position adjustment of the sensor mounting jig is completed, at least one of the sensor mounting jig and the holder is moved in a direction toward each other so that the film is pressed onto the sensor. Claim 7 A sensor-film vacuum laminator further comprising: a sensor position detection unit configured to detect the alignment state of the sensor by photographing the position of the sensor mounted on the sensor mounting jig and comparing it with a preset position in the 5th paragraph; and an alignment stage configured to finely adjust the position of the sensor mounting jig so that the sensor mounted on the sensor mounting portion is positioned correctly on the film based on the result detected by the sensor position detection unit. Claim 8 A sensor-film vacuum laminator according to claim 5, wherein the holder comprises: a holder body installed within the second receiving portion; and a pad installed on the holder body and formed of a silicone material having an adhesive surface so as to be able to hold the film even when the second chamber rotates, wherein an air injection hole is formed in the portion of the holder body that overlaps with the center of the pad to correspond to the center of the pad, so as to allow the center of the pad to be inflated into a convex shape so as to easily separate the laminated sensor-film from the pad. Claim 9 For laminating a sensor-film, the steps of supplying a sensor and supplying a film are configured to be performed independently, wherein the step of supplying the sensor comprises: (a) a step in which a sensor loading unit supplies a sensor placed on a tray; (b) a step in which the sensor supplied from the sensor loading unit is transferred to a first receiving portion of a first chamber; (c) a step in which the first chamber moves downward to a second chamber; and prior to step (b), a step of peeling a sensor protective film, wherein a first peeling unit adsorbs and peels off a protective film placed to cover the sensor, wherein the step of supplying the film comprises: (1) a step in which a film loading unit adsorbs one side of a film loaded on a film stack and supplies it one sheet at a time; (2) a step in which the film supplied from the film loading unit is transferred to the second chamber; (3) a step in which the second chamber rotates around an axis while holding the film. A sensor-film vacuum laminating method comprising, prior to step (3), a second peeling unit adsorbing and peeling a protective film positioned to cover the film, and after step (c) and step (3), the first chamber and the second chamber are coupled to each other, and the film is laminated to one surface of the sensor in an internal space formed in a vacuum state. Claim 10 delete Claim 11 A sensor loading unit configured to load a tray on which a sensor is placed and supply it to the next process, and formed to load said tray; a first chamber configured to be movable to a preset position and having a first receiving unit for receiving said sensor; a film loading unit configured to adsorb one side of a film loaded in a film stack and supply it to the next process one sheet at a time; an ionizer configured to remove electrostatic charge from said film before said film loading unit adsorbs said film to prevent said film from overlapping; a sensing device configured to detect the thickness of said film adsorbed by said film loading unit and to detect whether said film is overlapping; and a second chamber configured to be rotatable around a single axis and capable of being coupled to said first chamber at a preset position, having a second receiving unit for receiving said film. A sensor-film vacuum laminator comprising a vacuum pump connected to at least one of the first chamber and the second chamber, configured to form a vacuum inside when the first chamber and the second chamber are coupled together, wherein when the first chamber and the second chamber are coupled together, the film is placed on the sensor and pressurized inside the vacuum formed by the vacuum pump. Claim 12 A sensor loading unit configured to load a tray on which a sensor is placed and supply it to the next process, said tray; a first chamber configured to be movable to a preset position and having a first receiving portion for receiving the sensor; a sensor mounting jig configured to be movable within the first receiving portion and having a sensor mounting portion on which the sensor is placed; a film loading unit configured to adsorb one side of a film loaded in a film stack and supply it to the next process one sheet at a time; a second chamber configured to be rotatable around an axis and capable of being coupled with the first chamber at a preset position, said film receiving portion; and a holder configured to be disposed within the second receiving portion and having a film mounting portion on which the film to be laminated to the sensor is placed. A sensor-film vacuum laminator comprising a vacuum pump connected to at least one of the first chamber and the second chamber, configured to form a vacuum inside the first chamber and the second chamber while they are coupled together, wherein, before the first chamber and the second chamber are coupled together, the sensor mounting jig is formed to be finely positionable so that the sensor is positioned on the film, and when the first chamber and the second chamber are coupled together, the sensor positioned on the sensor mounting jig through fine positioning is arranged to correspond to the film positioned on the holder, and the film is placed on the sensor and pressurized inside the vacuum formed by the vacuum pump. Claim 13 A sensor-film vacuum laminator according to claim 12, characterized in that, after the fine position adjustment of the sensor mounting jig is completed, at least one of the sensor mounting jig and the holder is moved in a direction toward each other so that the film is pressed onto the sensor. Claim 14 A sensor-film vacuum laminator according to claim 12, further comprising: a sensor position detection unit configured to detect the alignment state of the sensor by photographing the position of the sensor mounted on the sensor mounting jig and comparing it with a preset position; and an alignment stage configured to finely adjust the position of the sensor mounting jig so that the sensor mounted on the sensor mounting portion is positioned correctly on the film based on the result detected by the sensor position detection unit. Claim 15 A sensor-film vacuum laminator according to claim 12, wherein the holder comprises: a holder body installed within the second receiving portion; and a pad installed in the holder body and formed of a silicone material having an adhesive surface so as to be able to hold the film even when the second chamber rotates, wherein an air injection hole is formed in the portion of the holder body that overlaps with the center of the pad to correspond to the center of the pad, so as to allow the center of the pad to be inflated into a convex shape so as to easily separate the laminated sensor-film from the pad.

Images