Electronic device including antenna structure

Abstract

The various embodiments disclosed in this document relate to electronic devices including antenna structures. An electronic device according to the present disclosure comprises: a housing; a display; a printed circuit board disposed within the housing; and an antenna disposed within the housing, comprising a first antenna radiator structure and a second antenna radiator structure extending from the first antenna radiator structure, wherein the housing comprises a recess structure for disposing of the second antenna radiator structure, a first portion of the first antenna radiator structure is located on the bottom surface of the recess structure, the recess structure comprises a hole structure for aligning the second antenna radiator structure, and the second antenna radiator structure may be disposed to overlap with the first portion of the first antenna radiator structure. Various other embodiments may be applied.

Description

Technology Field

[0001] Various embodiments of the present disclosure relate to an electronic device including an antenna structure. Background Technology

[0002] Driven by remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. Electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, and functions such as schedule management or electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently. The problem to be solved

[0004] In electronic devices, conventional antennas are designed to be mounted in fixed locations when placed in or printed on the housing of the electronic device, which meant that only designated antennas could be used. In particular, recently, flexible film-type antennas or printed antennas with patterns printed on molds are being used in consideration of cost and mountability. These antennas each have a pattern shape optimized for mounting on terminals. Since the pattern shape is affected by the housing structure and circuit structure of the terminal, it is difficult to use the same antenna on various types of terminals. means of solving the problem

[0005] An electronic device according to various embodiments of the present disclosure comprises: a housing; a display; a printed circuit board disposed within the housing; and an antenna disposed within the housing and comprising a first antenna radiator structure and a second antenna radiator structure extending from the first antenna radiator structure, wherein the housing comprises a recess structure for disposing of the second antenna radiator structure, a first portion of the first antenna radiator structure is located on the bottom surface of the recess structure, the recess structure comprises a hole structure for aligning the second antenna radiator structure, and the second antenna radiator structure may be disposed to overlap with the first portion of the first antenna radiator structure.

[0006] An antenna according to various embodiments of the present disclosure comprises a first antenna radiator structure and a second antenna radiator structure extending from the first antenna radiator structure, wherein a first portion of the first antenna radiator structure is disposed in contact with at least a portion of the second antenna radiator structure, and the second antenna radiator structure may be disposed to overlap with the first portion of the first antenna radiator structure. Effects of the invention

[0008] According to various embodiments of the present disclosure, an antenna can be extended by connecting an additional antenna radiator structure by forming a recess structure for placing an antenna in a housing included in an electronic device.

[0009] According to various embodiments of the present disclosure, the antenna structure of an existing electronic device can be recycled by forming a recess structure for placing an antenna in a housing included in the electronic device.

[0010] According to various embodiments of the present disclosure, the resonant frequency of a terminal can be adjusted by connecting an additional antenna radiator structure to an antenna included in an electronic device.

[0011] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below. Brief explanation of the drawing

[0012] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 5a is a drawing showing the antenna structure of an electronic device according to one of the various embodiments of the present disclosure. FIG. 5b is a cross-sectional view of the antenna radiator structure part included in the antenna structure. FIG. 5c is a drawing showing another antenna structure of an electronic device according to one of the various embodiments of the present disclosure. FIG. 6a is a perspective view of an electronic device including an antenna structure according to one of the various embodiments of the present disclosure. FIG. 6b is a perspective view of an electronic device having an additional antenna radiator structure arranged according to one of the various embodiments of the present disclosure. FIG. 7a is a cross-sectional view taken from the side of an electronic device including an antenna structure according to one of the various embodiments of the present disclosure. Figure 7b is a cross-sectional view taken along line A-A' of Figure 6B. FIG. 8 is a cross-sectional view taken from the side of an electronic device including an antenna structure according to another embodiment of the present disclosure. FIG. 9a is a perspective view of an electronic device including an antenna structure according to one of the various embodiments of the present disclosure. FIG. 9b is a perspective view of an electronic device having an additional antenna radiator structure arranged according to one of the various embodiments of the present disclosure. FIG. 10a is a perspective view of an electronic device with an additional antenna radiator structure attached to the back cover of the electronic device and a view of one side of the back cover. FIG. 10b is a cross-sectional view of an electronic device viewed from the side, in which an additional antenna radiator structure is attached to the back cover of the electronic device. FIG. 11 is a block diagram showing the structure of one of the various embodiments of the present disclosure. FIG. 12 is an experimental graph showing the shift of the antenna frequency according to one of the various embodiments of the present disclosure. Specific details for implementing the invention

[0013] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0014] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with an electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0015] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0016] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0017] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0018] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0019] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0020] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0021] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0022] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0023] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0024] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0025] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0026] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0027] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0028] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0029] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0030] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0031] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0032] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). The antenna module may be described as a radiator structure. According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). The signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0033] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0034] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0035] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0036] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0037] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0038] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0039] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0040] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0041] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0043] FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0044] Referring to FIGS. 2 and FIGS. 3, an electronic device (101) according to one embodiment may include a housing (310) comprising a front (310A), a rear (310B), and a side (310C) surrounding the space between the front (310A) and the rear (310B). In other embodiments (not shown), the housing (310) may refer to a structure forming some of the front (310A) of FIG. 2, the rear (310B) and the side (310C) of FIG. 3. According to one embodiment, the front (310A) may be formed by a front plate (302) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The rear (310B) may be formed by a rear plate (311). The rear plate (311) may be formed, for example, by glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (310C) may be formed by a side bezel structure (or "side member") (318) comprising metal and / or polymer, which is combined with the front plate (302) and the rear plate (311). In some embodiments, the rear plate (311) and the side bezel structure (318) may be formed integrally and may comprise the same material (e.g., glass, a metal material such as aluminum, or ceramic).

[0045] In the illustrated embodiment, the front plate (302) may include two first edge regions (310D) that curve seamlessly extend from the front (310A) toward the rear plate (311) at both ends of the long edge of the front plate (302). In the illustrated embodiment (see FIG. 3), the rear plate (311) may include two second edge regions (310E) that curve seamlessly extend from the rear (310B) toward the front plate (302) at both ends of the long edge. In some embodiments, the front plate (302) (or the rear plate (311)) may include only one of the first edge regions (310D) (or the second edge regions (310E)). In other embodiments, some of the first edge regions (310D) or the second edge regions (310E) may not be included. In the above embodiments, when viewed from the side of the electronic device (101), the side bezel structure (318) may have a first thickness (or width) on the side that does not include the first edge regions (310D) or the second edge regions (310E), and may have a second thickness that is thinner than the first thickness on the side that includes the first edge regions (310D) or the second edge regions (310E).

[0046] According to one embodiment, the electronic device (101) may include at least one of a display (301), an audio module (303, 307, 314) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (305, 312) (e.g., the camera module (180) of FIG. 1), a key input device (317) (e.g., the input module (150) of FIG. 1), and a connector hole (308, 309) (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the connector hole (309)) or additionally include other components.

[0047] According to one embodiment, the display (301) may be visually exposed, for example, through a significant portion of the front plate (302). In some embodiments, at least a portion of the display (301) may be exposed through the front plate (302) forming the front (310A) and the first edge regions (310D). In some embodiments, the corners of the display (301) may be formed to be largely identical to the adjacent outer shape of the front plate (302). In other embodiments (not shown), to expand the area where the display (301) is exposed, the gap between the outer edge of the display (301) and the outer edge of the front plate (302) may be formed to be largely identical.

[0048] According to one embodiment, the surface of the housing (310) (or the front plate (302)) may include a screen display area formed as the display (301) is visually exposed. For example, the screen display area may include a front (310A) and a first edge area (310D).

[0049] In another embodiment (not shown), a recess or opening may be formed in a part of the screen display area (e.g., front (310A), first edge area (310D)) of the display (301), and at least one of an audio module (314), a sensor module (not shown), a light-emitting element (not shown), and a camera module (305) may be included that are aligned with the recess or the opening. In another embodiment (not shown), at least one of an audio module (314), a sensor module (not shown), a camera module (305), a fingerprint sensor (not shown), and a light-emitting element (not shown) may be included on the back surface of the screen display area of ​​the display (301). In another embodiment (not shown), the display (301) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the key input device (317) may be positioned in the first edge regions (310D) and / or the second edge regions (310E).

[0050] According to various embodiments, among the camera modules (305, 312), the first camera module (205) and / or sensor module may be positioned in the internal space of the electronic device (101) so as to be in contact with the external environment through a transparent area of ​​the display (301). According to one embodiment, the area of ​​the display (301) facing the first camera module (305) may be formed as a transparent area having a specified transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. Such a transparent area may include an area overlapping with the effective area (e.g., field of view area) of the first camera module (305) through which light passes to form an image by an image sensor to generate an image. For example, the transparent area of ​​the display (301) may include an area with a lower pixel density and / or wiring density than the surrounding area. For example, the transparent area may replace a recess or an opening.

[0051] According to one embodiment, the audio module (303, 307, 314) may include, for example, a microphone hole (303) and a speaker hole (307, 314). A microphone for acquiring external sound may be placed inside the microphone hole (303), and in some embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (307, 314) may include an external speaker hole (307) and a receiver hole (314) for communication. In some embodiments, the speaker hole (307, 314) and the microphone hole (303) may be implemented as a single hole, or a speaker may be included without the speaker hole (307, 314) (e.g., a piezo speaker). The audio module (303, 307, 314) is not limited to the above structure and may be designed in various ways, such as by mounting only some audio modules or adding new audio modules, depending on the structure of the electronic device (101).

[0052] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (101) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (e.g., proximity sensor) and / or a second sensor module (e.g., fingerprint sensor) disposed on the front (310A) of the housing (310), and / or a third sensor module (e.g., HRM sensor) and / or a fourth sensor module (e.g., fingerprint sensor) disposed on the rear (310B) of the housing (310). In some embodiments (not shown), the fingerprint sensor may be disposed on the rear (310B) as well as on the front (310A) (e.g., display (301)) of the housing (310). The electronic device (101) may further include at least one sensor module not shown, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The sensor module is not limited to the above structure and can be designed in various ways depending on the structure of the electronic device (101), such as by mounting only some sensor modules or adding new sensor modules.

[0053] According to one embodiment, the camera module (305, 312) may include, for example, a first camera module (305) disposed on the front (310A) of the electronic device (101), a second camera module (312) disposed on the rear (310B), and / or a flash (not shown). The camera module (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101). The camera module (305, 312) is not limited to the above structure and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0054] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., dual cameras, or triple cameras) each having different attributes (e.g., angle of view) or functions. For example, a plurality of camera modules (305, 312) including lenses having different angles of view may be formed, and the electronic device (101) may control the change of the angle of view of the camera modules (305, 312) performed in the electronic device (101) based on the user's selection. For example, at least one of the camera modules (305, 312) may be a wide-angle camera and at least another may be a telephoto camera. Similarly, at least one of the camera modules (305, 312) may be a front camera and at least another may be a rear camera. Additionally, the camera modules (305, 312) may include at least one of a wide-angle camera, a telephoto camera, or an IR (infrared) camera (e.g., a TOF (time of flight) camera, a structured light camera). According to one embodiment, an IR camera may be operated as at least part of a sensor module. For example, a TOF camera may be operated as at least part of a sensor module (not shown) for detecting the distance to a subject.

[0055] According to one embodiment, a key input device (317) may be disposed on a side (310C) of the housing (310). In another embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (317), and the key input devices (317) that are not included may be implemented in other forms, such as soft keys, on the display (301). In some embodiments, the key input device may include a sensor module (316) disposed on a second side (310B) of the housing (310).

[0056] According to one embodiment, a light-emitting element (not shown) may be disposed, for example, on the front (310A) of the housing (310). The light-emitting element (not shown) may, for example, provide state information of the electronic device (101) in the form of light. In another embodiment, the light-emitting element (not shown) may, for example, provide a light source that is coupled with the operation of the front camera module (305). The light-emitting element (not shown) may include, for example, an LED, an IR LED and / or a xenon lamp.

[0057] According to one embodiment, the connector holes (308, 309) may include, for example, a first connector hole (308) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (309) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0058] According to one embodiment, among the camera modules (305, 312), the first camera module (305) and / or some of the sensor modules (not shown) may be positioned so as to be exposed to the outside through at least a portion of the display (301). For example, the camera module (305) may include a punch-hole camera positioned inside a hole or recess formed on the back surface of the display (301). According to one embodiment, the second camera module (312) may be positioned inside the housing (310) so as to have a lens exposed to the second surface (310B) of the electronic device (101). For example, the second camera module (312) may be positioned on a printed circuit board (e.g., the printed circuit board (340) of FIG. 4).

[0059] According to one embodiment, the first camera module (305) and / or sensor module may be positioned in the internal space of the electronic device (101) so as to be in contact with the external environment through a transparent area up to the front plate (302) of the display (301). Additionally, some sensor modules (304) may be positioned in the internal space of the electronic device so as not to be visually exposed through the front plate (302) to perform their functions.

[0060] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0061] Referring to FIG. 4, an electronic device (101) according to various embodiments (e.g., electronic device (101) of FIG. 1 to 3) may include a support bracket (370), a front plate (320) (e.g., front plate (302) of FIG. 2), a display (330) (e.g., display (301) of FIG. 2), a printed circuit board (340) (e.g., PCB, FPCB (flexible PCB), or RFPCB (rigid flexible PCB)), a battery (350) (e.g., battery (189) of FIG. 1), a second support member (360) (e.g., rear case), an antenna (390) (e.g., antenna module (197) of FIG. 1), and a rear plate (380) (e.g., rear plate (311) of FIG. 2). A support bracket (370) of an electronic device (101) according to one embodiment may include a side bezel structure (318) (e.g., the side bezel structure (318) of FIG. 2), and a first support member (372).

[0062] In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the first support member (372), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and redundant descriptions are omitted below.

[0063] According to various embodiments, the first support member (372) may be disposed inside the electronic device (101) and connected to the side bezel structure (318), or may be formed integrally with the side bezel structure (318). The first support member (372) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (372) may have a display (330) attached to one side and a printed circuit board (340) attached to the other side.

[0064] According to various embodiments, the printed circuit board (340) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to various embodiments, the printed circuit board (340) may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board (340) may be placed on at least a portion of the first support member (372) and may be electrically connected to an antenna module (e.g., antenna module (197) of FIG. 1) and a communication module (e.g., communication module (190) of FIG. 1).

[0065] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0066] According to one embodiment, the interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0067] According to various embodiments, the battery (350) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the printed circuit board (340). The battery (350) may be disposed integrally inside the electronic device (101) or may be disposed detachably from the electronic device (101).

[0068] According to various embodiments, a second support member (360) (e.g., a rear case) may be positioned between a printed circuit board (340) and an antenna (390). For example, the second support member (360) may include one side to which at least one of the printed circuit board (340) or the battery (350) is attached, and the other side to which the antenna (390) is attached.

[0069] According to various embodiments, the antenna (390) may be positioned between the rear plate (380) and the battery (350). The antenna (390) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (390) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In other embodiments, the antenna structure may be formed by a side bezel structure (318) and / or a part or combination thereof of the first support member (372).

[0070] According to various embodiments, the rear plate (380) may form at least a portion of the rear surface (e.g., the second surface (310B) of FIG. 3) of the electronic device (101).

[0071] It will be obvious to those skilled in the art that the antenna structures of the various embodiments of the present disclosure described above and the electronic devices including them are not limited by the aforementioned embodiments and drawings, and that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0073] FIG. 5a is a drawing showing an antenna structure of an electronic device according to one of the various embodiments of the present disclosure. FIG. 5b is a cross-sectional view of an antenna radiator structure portion included in the antenna structure. FIG. 5c is a drawing showing another antenna structure of an electronic device according to one of the various embodiments of the present disclosure.

[0074] According to various embodiments, an electronic device according to various embodiments (e.g., electronic device (101) of FIGS. 1 to 4) may include a housing (e.g., housing (310) of FIG. 3) and an antenna (e.g., antenna module (197) of FIG. 1, antenna (390) of FIG. 3).

[0075] According to various embodiments, the antenna may include at least one printed circuit board and a radiator structure. The antenna radiator structure may represent a structure including an antenna radiator, an insulator surrounding the antenna radiator, and an adhesive portion. The antenna may be classified as a film antenna (500) or a printed antenna (550). The film antenna (500) may be formed in a form that is detachable from an electronic device. The film antenna (500) may be formed on a flexible printed circuit board (FPCB) or a metal foil. The printed antenna (550) may be formed by printing a pattern on a device injection mold. The antennas may have a pattern (or shape) formed to correspond to the shape of the electronic device so that optimal performance can be achieved.

[0076] According to FIG. 5b, this is a cross-sectional view of an antenna according to one embodiment, cut vertically. The antenna (500) may include an antenna stacking structure (510). The antenna stacking structure (510) may include a metal layer (520) (or antenna radiator layer) composed of a metal (e.g., copper or nickel), an insulating layer (530a, 540a) having insulating properties to protect the metal layer (520) composed of a coveray or PET, and an adhesive layer (530b, 540b, 540c) composed of an adhesive to bond the metal layer (520) to an external component or external insulator.

[0077] The antenna (500) can be defined as a single-sided taping portion (530) when the adhesive layer (530b) is attached to only one side of the insulating layer (530a), and as a double-sided taping portion (540) when the adhesive layers (540b, 540c) are attached to both sides of the insulating layer (540a). The structure of the antenna (500) is not limited to the above configuration and may include various configurations. The single-sided taping portion (530) protects the outer side of the metal layer (520), and the double-sided taping portion (540) protects the inner side of the metal layer (520) and can be attached to the housing of an electronic device. The single-sided taping portion (530) protects the inner side of the metal layer (520), and the double-sided taping portion (540) protects the outer side of the metal layer (520).

[0078] FIG. 6a is a perspective view of an electronic device including an antenna structure according to one of the various embodiments of the present disclosure. FIG. 6b is a perspective view of an electronic device having an additional antenna radiator structure arranged according to one of the various embodiments of the present disclosure.

[0079] According to various embodiments, an electronic device (600) (e.g., electronic device (101) of FIGS. 1 to 4) according to various embodiments may include a housing (605) (e.g., housing (310) of FIG. 3), an antenna (610) (e.g., antenna module (197) of FIG. 1, antenna (390) of FIG. 3, antenna (500, 510, 520) of FIGS. 5a to 5c), and a recess structure (630).

[0080] In some embodiments, the electronic device (600) may omit at least one of the components (e.g., housing (605), antenna (610), recess structure (630), guide hole structure (640)) or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 4, and redundant descriptions are omitted below.

[0081] According to various embodiments, the electronic device (600) may include a housing (605), an antenna (610), and a recess structure (630). The antenna (610) may be a film antenna (e.g., the film antenna (500) of FIG. 5a). The location where the antenna (610) is placed on the electronic device (600) may be determined according to the design of the housing (605). For example, the antenna may be located on the edge portion of the electronic device (600). The recess structure (630) may be formed at the location of one end of the antenna in the portion where the antenna (610) is placed. The antenna (610) may include the laminated structure described in FIG. 5b. The antenna (610) may include an antenna radiator structure (620). The antenna radiator structure (620) may be a structure for transmitting and receiving signals.

[0082] According to various embodiments, an additional antenna radiator structure (e.g., the second antenna radiator structure (660) of FIG. 6b) may be disposed on the recessed surface (or bottom surface) (650) of the recessed structure (630). A guide hole structure (640) may be formed in the recessed structure (630) for disposing of the additional antenna radiator structure on the recessed surface (650). The guide hole structure (640) may be intended to guide the second antenna radiator structure (650) to be disposed or bonded in an accurate position when it is disposed in the recessed structure (630). At least a portion of the antenna radiator structure (620) may be disposed on the recessed surface (650) of the recessed structure (630).

[0083] Referring to FIG. 6b, the second antenna radiator structure (660) may be placed in the recess structure (630). When the second antenna radiator structure (660) is placed in the recess structure (630), it may be placed in an adhesive manner. The second antenna radiator structure (660) may include a protruding structure that can be combined with the guide hole structure (640) of the recess structure (630). The second antenna radiator structure (660) may be placed overlappingly on a first surface that is the opposite side to the direction toward the housing of at least a portion of the antenna radiator structure (620). The second surface that is the opposite side to the direction toward the housing of the second antenna radiator structure (660) and the first surface of the antenna radiator structure (620) may be located on the same plane. The antenna radiator structure (620) and the second antenna radiator structure (660) may be placed overlappingly but may not be electrically connected by a non-determining member. The second antenna radiator structure (660) is adhesively connected to the antenna radiator structure (620) to achieve the effect of extending the total length of the antenna (610). When the antenna (610) is extended, the frequency used may change, and the detailed effect thereof is described in FIG. 12.

[0084] FIG. 7a is a side view of an electronic device including an antenna structure according to one of the various embodiments of the present disclosure. FIG. 7b is a cross-sectional view taken along line A-A' of FIG. 6b. FIG. 8 is a side view of an electronic device including an antenna structure according to another of the various embodiments of the present disclosure.

[0085] According to various embodiments, an electronic device (700) (e.g., electronic device (101) of FIGS. 1 to 4, electronic device (600) of FIGS. 6a to 6b) may include a housing (760) (e.g., housing (310) of FIG. 3, housing (605) of FIGS. 6a to 6b), an antenna (e.g., antenna module (197) of FIG. 1, antenna (390) of FIG. 3, antenna (500, 510, 520) of FIGS. 5a to 5b, antenna (610) of FIGS. 6a to 6b), a recess structure (705) (e.g., recess structure (630) of FIGS. 6a to 6b), and a back cover (750).

[0086] FIG. 7a shows a cross-sectional view of an electronic device (700) according to one embodiment of the present disclosure viewed from the side, and may be arranged in the order of a housing (760), a recess structure (705), a first antenna radiator structure (710), a second antenna radiator structure (720), and a back cover (750) from the bottom in the +z-axis direction. An antenna may be placed between the housing (760) and the back cover (750). The antenna may include a first antenna radiator structure (710), a second antenna radiator structure (720), a first printed circuit board (730), and a second printed circuit board (740). At least one of the above components may be omitted. The first antenna radiator structure (710) may be formed as a bent structure. At least a part of the first antenna radiator structure (710) may be located in the recess structure (705). The portion of the first antenna radiator structure (710) located in the recess structure (705) is referred to as the first portion (710a). A portion of the bottom surface of the recess structure (705) may be composed of the first portion (710a). The portion of the first antenna radiator structure (710) not located in the recess structure (705) is referred to as the second portion (710b). The first portion (710a) may be connected to the first printed circuit board (730). The second antenna radiator structure (720) may be connected to the second printed circuit board (740). The second antenna radiator structure (720) may not be electrically connected to the first printed circuit board (730). The second antenna radiator structure (720) may be placed in the recess structure (705) and may be placed overlapping with a portion of the first antenna radiator structure (710). For example, the second antenna radiator structure (720) may be positioned to overlap with the first part (710a). The second antenna radiator structure (720) may be positioned above the first part (710a) in the +z-axis direction. By positioning the second antenna radiator structure (720) to overlap only a part of the first antenna radiator structure (710), the antenna has the effect of being extended and expanded.The first antenna radiator structure (710) and the second antenna radiator structure (720) may be bonded and arranged using an adhesive component. The first antenna radiator structure (710) and the second antenna radiator structure (720) may be joined by a non-conductive member and may not be electrically connected. The first surface in the +z-axis direction of the second antenna radiator structure (720) and the second surface in the +z-axis direction of the second part (710b) of the first antenna radiator structure (720) may be located on the same plane.

[0087] Referring to FIG. 7b, a cross-sectional view is shown when A-A' of FIG. 6b, which is the part where the first antenna radiator structure and the second antenna radiator structure overlap, is cut. A recess structure (705) is included in the housing (760), and the first antenna radiator structure (770, the first part (710a) of FIG. 7a) is positioned upward in the +z-axis direction, the second antenna radiator structure (780, the second antenna radiator structure (720) of FIG. 7a) is positioned upward, and a back cover (750) can be positioned upward. The first antenna radiator structure (770) and the second antenna radiator structure (780) may include a metal layer (770a, 780a) composed of a metal (e.g., copper or nickel), an insulating layer having insulating properties to protect the first and second metal layers (770a, 780a) composed of a coveray or PET, and an adhesive layer composed of an adhesive for bonding the metal layer to an external component or external insulator. The housing (760) of FIG. 5B may include a recess structure (705) for the first insulating adhesive layer (770b) and the second insulating adhesive layer (780b). The first antenna radiator structure (770) may be positioned in the recess structure (750). It may be bonded through the first insulating adhesive layer (770b) of the first antenna radiator structure (770). The second antenna radiator structure (780) may be positioned above the first antenna radiator structure (770) in the +z-axis direction. The first antenna radiator structure (770) and the second antenna radiator structure (780) may be bonded by a first insulating adhesive layer (770b) and a second insulating adhesive layer (780b), and may form an adhesive surface (790). The first antenna radiator structure (770) and the second antenna radiator structure (780) may not be electrically connected by the insulating adhesive layers (770b, 780b) having non-conductive properties.

[0088] FIG. 8 shows a cross-sectional view of an electronic device (800) viewed from the side according to another embodiment of the present disclosure, and may be arranged in the order of a housing (860), a recess structure (805), a second antenna radiator structure (820), a first antenna radiator structure (810), and a back cover (850) from the bottom in the +z-axis direction. An antenna may be placed between the housing (860) and the back cover (850). The antenna may include a first antenna radiator structure (810), a second antenna radiator structure (820), a first printed circuit board (830), and a second printed circuit board (840). At least one of the above components may be omitted. The first antenna radiator structure (810) may be formed as a flat structure. The second antenna radiator structure (820) may be placed in the recess structure (805). The second antenna radiator structure (820) may be connected to the second printed circuit board (840). The first antenna radiator structure (810) may be connected to the first printed circuit board (830). A portion of the first antenna radiator structure (810) may be adhesively placed on the upper side of the second antenna radiator structure (820). The second antenna radiator structure (820) may not be electrically connected to the first printed circuit board. Only the second antenna radiator structure (820) may be placed in the recess structure (805) and may be placed overlapping with a portion of the first antenna radiator structure (810). The first portion (810a) of the first antenna radiator structure (810) may be placed on the upper side in the +z-axis direction of the second antenna radiator structure (820). By placing the second antenna radiator structure (820) overlapping only with a portion of the first antenna radiator structure (810), the antenna has the effect of being extended and expanded. The first antenna radiator structure (810) and the second antenna radiator structure (820) can be bonded and arranged using an adhesive component. The first antenna radiator structure (810) and the second antenna radiator structure (820) may be composed of non-conductive members and may not be electrically connected.

[0089] FIG. 9a is a perspective view of an electronic device including an antenna structure according to one of the various embodiments of the present disclosure. FIG. 9b is a plan view of an electronic device in which an additional antenna radiator structure is arranged in FIG. 9a.

[0090] According to various embodiments, an electronic device (900) (e.g., electronic device (101) of FIGS. 1 to 4, electronic device (600) of FIGS. 6a to 6b, electronic device (700) of FIG. 7a) comprises a housing (905) (e.g., housing (310) of FIG. 3, housing (605) of FIG. 6a to 6b, housing (760) of FIG. 7a, housing (860) of FIG. 8), an antenna (e.g., antenna module (197) of FIG. 1, antenna (390) of FIG. 3, antennas (510, 520) of FIG. 5a to 5b, antenna (610) of FIG. 6a to 6b, first antenna radiator structure and second antenna radiator structure (710, 720, 770, 780, 810, 820) of FIG. 7a to 7b and FIG. 8), and a guide hole structure (940) (e.g., FIG. It may include guide hole structures (640) of FIGS. 6a to 6b), recess structures (e.g., recess structures (630) of FIGS. 6a to 6b, recess structures (705) of FIGS. 7a and 7b, and recess structures (805) of FIG. 8).

[0091] According to various embodiments, the electronic device (900) may include a housing (905), an antenna (910), and a recess structure (930). The antenna (910) may be a printed antenna (e.g., the printed antenna (550) of FIG. 5c). The location where the antenna (910) is placed on the electronic device (900) may be determined according to the design of the housing (905). For example, the antenna may be located on the edge portion of the electronic device (900). The recess structure (930) may be formed at the location of one end of the antenna in the portion where the antenna (910) is placed. The antenna (910) may include a stacked structure as described in FIG. 5b. The antenna (910) may include an antenna radiator structure (920). The antenna radiator structure (920) may be a structure for transmitting and receiving signals.

[0092] According to various embodiments, an additional antenna radiator structure (e.g., the second antenna radiator structure (960) of FIG. 9B) may be disposed on the recessed surface (or bottom surface) (950) of the recessed structure (930). A guide hole structure (940) may be formed in the recessed structure (930) for disposing of the additional antenna radiator structure on the recessed surface (950). The guide hole structure (940) may be intended to guide the second antenna radiator structure (960) to be disposed or bonded in an accurate position when disposed in the recessed structure (930). At least a portion of the antenna radiator structure (920) may be disposed on the recessed surface (950) of the recessed structure (930).

[0093] Referring to FIG. 9b, the second antenna radiator structure (960) may be placed in the recess structure (930). When the second antenna radiator structure (960) is placed in the recess structure (930), it may be placed in an adhesive manner. The second antenna radiator structure (960) may include a protruding structure that can be combined with the guide hole structure (940) of the recess structure (930). The second antenna radiator structure (960) may be placed overlappingly on the side opposite to the direction facing the housing of at least a portion of the antenna radiator structure (920). The side opposite to the direction facing the housing of the second antenna radiator structure (960) and the side opposite to the direction facing the housing of the antenna (910) may be located on the same plane. The antenna radiator structure (920) and the second antenna radiator structure (960) may be placed overlappingly but may not be electrically connected by a non-determining member. The second antenna radiator structure (960) is adhesively connected to the antenna radiator structure (920) to achieve the effect of extending the entire length of the antenna (910).

[0094] FIG. 10a is a perspective view of an electronic device with an additional antenna radiator structure attached to the back cover of the electronic device and a view of the inside of the back cover. FIG. 10b is a cross-sectional view of an electronic device with an additional antenna radiator structure attached to the back cover of the electronic device, viewed from the side.

[0095] According to various embodiments, an electronic device (1000) (e.g., electronic device (101) of FIG. 1 to 4, electronic device (600) of FIG. 6a to 6b, electronic device (700) of FIG. 7a, electronic device (800) of FIG. 8, electronic device (900) of FIG. 9a to 9b) comprises a housing (905) (e.g., housing (310) of FIG. 3, housing (605) of FIG. 6a to 6b, housing (760) of FIG. 7a, housing (860) of FIG. 8, housing (905) of FIG. 9a to 9b), an antenna (e.g., antenna module (197) of FIG. 1, antenna (390) of FIG. 3, antennas (510, 520) of FIG. 5a to 5b, antenna (610) of FIG. 6a to 6b, first antenna radiator structure of FIG. 7a to 7b, and second antenna It may include a radiator structure (710, 720, 770, 780, 810, 820), an antenna (910) of FIGS. 9a to 9b), a guide hole structure (940) (e.g., a guide hole structure (640) of FIGS. 6a to 6b), and a recess structure (705) (e.g., a recess structure (630) of FIGS. 6a to 6b, a recess structure (705) of FIGS. 7a and 7b, a recess structure (805) of FIGS. 8, and a recess structure (930) of FIGS. 9a to 9b).

[0096] According to various embodiments, the second antenna radiator structure (1060) may be attached to the back cover (1070) of the electronic device (1000) using an adhesive member (1080). When the second antenna radiator structure (1060) is coupled to the back cover (1070) of the electronic device (1000), the first antenna radiator structure (1020) and the second antenna radiator structure (1060) may not be connected by an adhesive member. The back cover (1070) may be coupled to the housing (1005) so that the second antenna radiator structure (1060) is placed in the recess structure (1030). The second antenna radiator structure (1060) may be fixed by the force with which the back cover (1070) is coupled to the housing (1005).

[0097] Referring to FIG. 10b, the components may be arranged in the order of a housing (1005), a recess structure (1030), a first antenna radiator structure (1020), a second antenna radiator structure (1060), an adhesive member (1080), and a back cover (1070) from the bottom in the +z-axis direction. The antenna may include a first antenna radiator structure (1020), a second antenna radiator structure (1060), a first printed circuit board (1040), and a second printed circuit board (1050). At least one of the above components may be omitted. The first antenna radiator structure (1020) may be formed as a bent structure. At least a portion of the first antenna radiator structure (1020) may be placed in the recess structure (1030). The portion of the first antenna radiator structure (1020) placed in the recess structure (1030) is referred to as the first portion (1020a). The portion of the first antenna radiator structure (1020) that is not placed in the recess structure (1030) is referred to as the second portion (1020b). The first portion (1020a) may be connected to the first printed circuit board (1040). The second antenna radiator structure (1060) may be connected to the second printed circuit board (1050). The second antenna radiator structure (1060) may not be electrically connected to the first printed circuit board (1040). The second antenna radiator structure (1060) may be placed in the recess structure (1030) and may be placed overlapping a portion of the first antenna radiator structure (1020). For example, the second antenna radiator structure (1060) may be placed overlapping the first portion (1020a). The second antenna radiator structure (1060) may be positioned above the first part (1020a) in the +z-axis direction. By positioning the second antenna radiator structure (1060) to overlap only a part of the first antenna radiator structure (1020), the antenna has the effect of being extended and expanded. The first antenna radiator structure (1020) and the second antenna radiator structure (1060) may be joined by a non-conductive member and may not be electrically connected.The first plane in the +z-axis direction of the second antenna radiator structure (1060) and the second plane in the +z-axis direction of the second part (1020b) of the first antenna radiator structure (1020) may be located on the same plane.

[0098] FIG. 11 is a block diagram showing the structure of one of the various embodiments of the present disclosure. FIG. 12 is an experimental graph showing the shift of the antenna frequency according to one of the various embodiments of the present disclosure.

[0099] According to various embodiments, an electronic device (e.g., electronic device (101) of FIG. 1 to 4, electronic device (600) of FIG. 6a to 6b, electronic device (700) of FIG. 7a, electronic device (800) of FIG. 8, electronic device (900) of FIG. 9a to 9b, electronic device (1000) of FIG. 10a to 10b) is a housing (e.g., housing (310) of FIG. 3, housing (605) of FIG. 6a to 6b, housing (760) of FIG. 7a, housing (860) of FIG. 8, housing (905) of FIG. 9a to 9b), antenna (1110, 1120) (e.g., antenna module (197) of FIG. 1, antenna (390) of FIG. 3, antenna (510, 520) of FIG. 5a to 5b, antenna (610) of FIG. 6a to 6b, FIG. 7a It may include the first antenna radiator structure and the second antenna radiator structure (710, 720, 770, 780, 810, 820) of FIGS. 7b and FIGS. 8, the antenna (910) of FIGS. 9a and FIGS. 9b, and the antenna (1020, 1060) of FIGS. 10a and FIGS. 10b.

[0100] Referring to FIG. 11, the electronic device may include an antenna structure (1100) and a printed circuit board (1140). The antenna structure (1100) may include a first antenna radiator structure (1110) and a second antenna radiator structure (1120). The number of antenna radiator structures is at least two, but is not limited to two. The printed circuit board (1140) may include at least one processor (1170), a transceiver (1160), an RF front end (1150), and an antenna matcher (1130).

[0101] According to various embodiments, only the first antenna radiator structure (1110) in the antenna structure (1100) may be electrically connected to the printed circuit board (1140). The second antenna radiator structure (1120) may not be electrically connected to the printed circuit board (1140). According to the embodiments of FIGS. 6a to 10b, the second antenna radiator structure (1120) may be physically contacted with the first antenna radiator structure (1110) but may not be electrically connected. By physically contacting the second antenna radiator structure (1120), it is coupled, thereby extending the overall length of the antenna structure (1100) and shifting the resonance, which has the effect of adjusting the frequency band used. The antenna matcher (1130) is connected to the first antenna radiator structure (1110), but if the second antenna radiator structure (1120) is connected, it can recognize this and transmit it to the RF front end (1150).

[0102] Referring to FIG. 12, the frequency band of the terminal before and after combining the second antenna radiator structure can be observed. In the graph, it can be seen that the resonant frequency differs by approximately 30 MHz (megahertz) between before (1210) combining the second antenna radiator structure and after (1220) combining the second antenna radiator structure. The degree of shift in the resonant frequency can be determined by the properties of the second antenna radiator structure. The degree of shift in the resonant frequency may vary depending on the material and length of the second antenna radiator structure.

[0104] An electronic device according to various embodiments of the present disclosure (e.g., electronic device (100) of FIG. 1, electronic device (600) of FIG. 6a to 6b, electronic device (700) of FIG. 7a to 7b, electronic device (800) of FIG. 8, electronic device (900) of FIG. 9a to 9b, electronic device (1000) of FIG. 10a to 10b) comprises a housing (e.g., housing (310) of FIG. 3, housing (605) of FIG. 6a to 6b, housing (760) of FIG. 7a to 7b, housing (860) of FIG. 8, housing (905) of FIG. 9a to 9b, housing (1005) of FIG. 10a to 10b), a display (e.g., display module (160) of FIG. 1, display (301) of FIG. 3), and a printed circuit board disposed within the housing (e.g., printed circuit of FIG. 4). A substrate (340, printed circuit board (730) of FIG. 7a), and disposed within the housing, a first antenna radiator structure (e.g., first antenna radiator structure (620) of FIG. 6a to 6b, first antenna radiator structures (710, 770) of FIG. 7a to 7b, first antenna radiator structure (810) of FIG. 8, first antenna radiator structure (920) of FIG. 9a to 9b, first antenna radiator structure (1020) of FIG. 10a to 10b, first antenna radiator structure (1110) of FIG. 11) and a second antenna radiator structure extending from the first antenna radiator structure (e.g., second antenna radiator structure (660) of FIG. 6b, second antenna radiator structures (720, 780) of FIG. 7a to 7b, second antenna radiator structure (820) of FIG. 8, second antenna of FIG. 9b). An antenna comprising a radiator structure (960), a second antenna radiator structure (1060) of FIG. 10a to 10b, and a second antenna radiator structure (1120) of FIG. 11 (e.g., antennas (500, 510, 550) of FIG. 5a to 5b, antennas (610) of FIG. 6a to 6b, antennas (910) of FIG. 9a to 9b),The housing includes an antenna (1010) of FIGS. 10a to 10b, and the housing includes a recess structure for arranging the second antenna radiator structure (e.g., recess structure (630) of FIGS. 6a to 6b, recess structure (705) of FIGS. 7a to 7b, recess structure (805) of FIGS. 8, recess structure (930) of FIGS. 9a to 9b, recess structure (1030) of FIGS. 10a to 10b), and a first part of the first antenna radiator structure (e.g., first part (710a) of FIGS. 7a to 7b, first part (810a) of FIGS. 8, first part (1020a) of FIGS. 10a to 10b)) is a bottom surface of the recess structure (e.g., recess surface (650) of FIGS. 6a to 6b, recess of FIGS. 9a to 9b). The recess structure is located on a surface (950), and the recess structure includes a hole structure for aligning the second antenna radiator structure (e.g., guide hole structure (650) of FIG. 6a to 6b, guide hole structure (940) of FIG. 9a to 9b), and the second antenna radiator structure may be arranged to overlap with a first part of the first antenna radiator structure.

[0105] According to various embodiments, a first surface facing a first direction opposite to the direction of the second antenna radiator structure toward the display (e.g., the +Z-axis direction in FIG. 7a to 7b, the +Z-axis direction in FIG. 8, and the +Z-axis direction in FIG. 10b) and a second surface facing the first direction of a first part of the first antenna radiator structure may be located on the same plane.

[0106] According to various embodiments, the second antenna radiator structure and the first portion of the first antenna radiator structure may be connected by being bonded with a non-conductive adhesive member (e.g., adhesive layers (530b, 540b, 540c) of FIG. 5b, adhesive layers (770b, 780b) of FIG. 7b).

[0107] According to various embodiments, the first antenna radiator structure may be electrically connected to the printed circuit board, and the second antenna radiator structure may not be electrically connected to the first antenna radiator structure.

[0108] According to various embodiments, the height of the first antenna radiator structure may differ from that of the first part and the remaining part excluding the first part (e.g., the second part (710b) of FIG. 7a to 7b, the second part (810b) of FIG. 8, and the second part (1020b) of FIG. 10a to 10b).

[0109] According to various embodiments, the antenna may be located on the outer edge portion of the housing.

[0110] According to various embodiments, the printed circuit board may be a flexible printed circuit board.

[0111] According to various embodiments, the second antenna radiator structure may be attached to and disposed on the back cover of the electronic device (e.g., the back cover (1070) of FIG. 10a to FIG. 10b).

[0112] According to various embodiments, the second antenna radiator structure may be a film-type antenna that is detachable from the electronic device (e.g., antenna (500) of FIG. 5a).

[0113] According to various embodiments, the first antenna radiator structure may be a film-type antenna that is detachably attached to the electronic device (e.g., antenna (500) of FIG. 5a) or a printed-type antenna that is injected and printed onto the electronic device (e.g., antenna (550) of FIG. 5c).

[0114] According to various embodiments, the first antenna radiator structure and the second antenna radiator structure may include a metal layer composed of metal (e.g., the metal layer (520) of FIG. 5b, the metal layers (770a, 780a) of FIG. 7a to 7b)) and an insulating layer composed of an insulator (e.g., the insulating layer (530a, 540a) of FIG. 5b).

[0115] According to various embodiments, the metal layer may be composed of nickel or copper.

[0116] According to various embodiments, the insulating layer may be composed of a coverlay or PET.

[0117] According to various embodiments, the metal layer can be attached to the insulating layer in an adhesive manner.

[0118] Antennas according to various embodiments of the present disclosure (e.g., antennas of FIGS. 5a to 5c (500, 510, 550), antennas of FIGS. 6a to 6b (610), antennas of FIGS. 9a to 9b (910), antennas of FIGS. 10a to 10b (1010)) include a first antenna radiator structure (e.g., first antenna radiator structure of FIGS. 6a to 6b (620), first antenna radiator structure of FIGS. 7a to 7b (710, 770), first antenna radiator structure of FIG. 8 (810), first antenna radiator structure of FIGS. 9a to 9b (920), first antenna radiator structure of FIGS. 10a to 10b (1020), first antenna radiator structure of FIG. 11 (1110)) and a second antenna radiator structure extending from the first antenna radiator structure (e.g., FIG. The second antenna radiator structure (660) of FIG. 6b, the second antenna radiator structure (720, 780) of FIG. 7a to 7b, the second antenna radiator structure (820) of FIG. 8, the second antenna radiator structure (960) of FIG. 9b, the second antenna radiator structure (1060) of FIG. 10a to 10b, and the second antenna radiator structure (1120) of FIG. 11 are included, and the first part of the first antenna radiator structure (e.g., the first part (710a) of FIG. 7a to 7b, the first part (810a) of FIG. 8, the first part (1020a) of FIG. 10a to 10b)) is disposed in contact with at least a part of the second antenna radiator structure, and the second antenna radiator structure may be disposed to overlap with the first part of the first antenna radiator structure.

[0119] According to various embodiments, a first surface of the second antenna radiator structure facing a first direction opposite to the direction facing the display (e.g., the +Z-axis direction of FIG. 7a to 7b, the +Z-axis direction of FIG. 8, and the +Z-axis direction of FIG. 10b) and a second surface of the first part of the first antenna radiator structure facing the first direction may be located on the same plane.

[0120] According to various embodiments, the second antenna radiator structure and the second portion of the first antenna radiator structure may be connected by being bonded with a non-conductive adhesive member (e.g., adhesive layers (530b, 540b, 540c) of FIG. 5b, adhesive layers (770b, 780b) of FIG. 7b).

[0121] According to various embodiments, the first antenna radiator structure and the second antenna radiator structure may include a metal layer composed of metal (e.g., the metal layer (520) of FIG. 5b, the metal layers (770a, 780a) of FIG. 7a to 7b)) and an insulating layer composed of an insulator (e.g., the insulating layer (530a, 540a) of FIG. 5b).

[0122] According to various embodiments, the metal layer may be composed of nickel or copper.

[0123] According to various embodiments, the insulating layer may be composed of a coverlay or PET.

[0125] It will be obvious to those skilled in the art that the antenna structures of the various embodiments of the present disclosure described above and the electronic devices including them are not limited by the aforementioned embodiments and drawings, and that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure. Explanation of the symbols

[0127] Electronic devices: 101, 600, 700, 800, 900, 1000 Housing: 310, 605, 760, 860, 905, 1005 Antenna: 500, 510, 550, 610, 910, 1010, 1100 First antenna radiator structure: 620, 710, 770, 810, 920, 1020, 1110 Second antenna radiator structure: 660, 720, 780, 820, 960, 1060, 1120 Recess structure: 630, 705, 805, 930, 1030 Recessed surface: 650, 950 Guide hole structure: 640, 940 Metal layers: 520, 770a, 780a Insulation layer: 530a, 540a Adhesive layer: 530b, 540b, 540c, 770b, 780b Part 1: 710a, 810a, 1020a Part 2: 710b, 810b, 1020b Back cover: 750, 850, 1070

Claims

Claim 1 An electronic device comprising: a housing; a display; a back cover; a printed circuit board disposed within the housing; and an antenna disposed between the housing and the back cover, the antenna comprising a first antenna radiator structure disposed in the housing and a second antenna radiator structure disposed in the back cover so as to overlap with the first antenna radiator structure, wherein the housing comprises a recess structure for disposing of the second antenna radiator structure, a first portion of the first antenna radiator structure is located on the bottom surface of the recess structure, the recess structure comprises a hole structure for aligning the second antenna radiator structure, and the second antenna radiator structure is disposed so as to overlap with the first portion of the first antenna radiator structure, wherein the first antenna radiator structure forms a closed loop together with the printed circuit board, and the second antenna radiator structure is not directly connected to the closed loop but is electrically connected to the closed loop through coupling with the first antenna radiator structure. Claim 2 An electronic device according to claim 1, wherein a first surface facing a first direction opposite to the direction facing the display of the second antenna radiator structure and a second surface facing the first direction of the first part of the first antenna radiator structure are located on the same plane. Claim 3 An electronic device according to claim 1, wherein the second antenna radiator structure and the first part of the first antenna radiator structure are fixed to each other through a non-conductive adhesive member. Claim 4 delete Claim 5 In claim 1, the first antenna radiator structure is an electronic device in which the height of the first part and the height of the remaining part excluding the first part are different. Claim 6 In claim 1, the antenna is an electronic device located on the outer edge portion of the housing. Claim 7 delete Claim 8 In claim 1, the second antenna radiator structure is an electronic device attached to and disposed on the back cover. Claim 9 In claim 1, the second antenna radiator structure is an electronic device that is a film-type antenna detachably attached to the electronic device. Claim 10 In claim 1, the first antenna radiator structure is an electronic device that is a film-type antenna detachably attached to the electronic device or a printed-type antenna that is injection-molded and printed onto the electronic device. Claim 11 An electronic device according to claim 1, wherein the first antenna radiator structure and the second antenna radiator structure comprise a metal layer composed of metal and an insulating layer composed of an insulator. Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 delete Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete

Images