Pickup apparatus

Abstract

The problem is to provide a pickup device that easily picks up a chip component to be picked up while preventing the chip component prior to pickup from peeling off and falling off. A solution means is provided in a device for picking up chip components attached to a sheet via an adhesive layer, The adhesive layer has the characteristic that the holding and supporting force of the chip component weakens due to heating, and A laser heating unit that irradiates a laser beam to heat an adhesive layer toward a chip attachment area on which a chip component to be picked up is attached, and A collet is provided for picking up a chip component that is a pickup target irradiated with a laser beam and detached from a sheet. The laser heating unit is, In the chip attachment area, multiple heating zones are set to heat the adhesive layer, and the intensity of the laser beam is set to a different intensity for each heating zone.

Description

Technology Field

[0001] The present invention relates to a device for picking up chip components attached to an adhesive sheet. Background Technology

[0002] A semiconductor device is formed by arranging a plurality of chip components embedded in the device in a matrix on a single semiconductor wafer (so-called front-end process), and then reorganizing and wiring and packaging in a process called dicing (so-called back-end process).

[0003] In the post-process, a flexible adhesive sheet (also called a dicing tape or expand sheet) is attached to the wafer before cutting, and after dicing to the size of the chip components, the chip components are picked up one by one using a suction head (also called a pick-up or collet) and transported to a mounting target such as a lead frame or substrate, where wiring and mounting are performed.

[0004] At this time, the diced chip component is held and supported by interposing an adhesive layer on an elastic adhesive sheet (also called a dicing tape or expand sheet), and is picked up when the adhesive sheet is stretched (in an expanded state). Furthermore, when picking up the chip component from the adhesive sheet, a method is known in which the chip component is detached (i.e. picked up) from the adhesive sheet using a pushing member called a needle.

[0005] In addition, to prevent chip components from being damaged by the pushing up of the needle, a method is known to heat the adhesive sheet to weaken the adhesion to the chip components (e.g., Patent Document 1). Prior art literature

[0006] Japanese Patent Publication No. 2004-281660 The problem to be solved

[0007] In recent years, as chip components have become smaller, a large number of chip components are densely packed on a single semiconductor wafer, and in the back-end process, pickup is required when the spacing between diced chip components is only tens to 100 microns.

[0008] FIG. 7 is a schematic diagram showing the positional relationship of a laser beam L irradiated onto a chip component and the distribution (i.e., profile) of the intensity B.

[0009] Figure 7 illustrates an example of the positional relationship between the chip attachment area (23) of the chip component Dp to be picked up and the laser beam L being irradiated, and the profile of the intensity B of the laser beam L.

[0010] Conventionally, when picking up a chip component Dp that is to be picked up and attached to a sheet (2) via an adhesive layer (22), the adhesive layer (22) was heated over the entire surface of the chip attachment area (23) to which the chip component Dp is attached in order to weaken the adhesive force between the chip component Dp and the adhesive layer (22). Then, a part (29) of the area where an adjacent chip component Dn that is not to be picked up is held and supported is also heated by the laser beam L, and the holding and supporting force of the chip component Dn becomes insufficient, so there is a risk that it will peel off and fall off or be misaligned before picking up.

[0011] In addition, when the adhesive layer (22) is heated over the entire surface of the chip attachment area (23) to which the chip component Dp to be picked up is attached, there is a risk that problems may occur during pickup, such as warping of the chip component Dp and the collet not adhering.

[0012] Therefore, the present invention aims to provide a pickup device that easily picks up a chip component to be picked up, while preventing the chip component prior to pickup from peeling off, falling off, or becoming misaligned. means of solving the problem

[0013] To solve the above problems, one aspect of the present invention is,

[0014] In a device for picking up chip components attached to a sheet via an adhesive layer,

[0015] The adhesive layer has the characteristic that the holding and supporting force of the chip component weakens due to heating, and

[0016] A laser heating unit that irradiates a laser beam to heat an adhesive layer toward a chip attachment area on which a chip component to be picked up is attached, and

[0017] A collet is provided for picking up a chip component that is a pickup target irradiated with a laser beam and detached from a sheet.

[0018] The laser heating unit is,

[0019] In the chip attachment area, multiple heating zones are set to heat the adhesive layer, and the intensity of the laser beam is set to a different intensity for each heating zone. Effects of the invention

[0020] It is possible to easily pick up the chip component to be picked up while preventing the chip component prior to pickup from peeling off, falling off, or becoming misaligned. Brief explanation of the drawing

[0021] FIG. 1 is a schematic diagram showing the overall configuration of an example of a form embodying the present invention. FIG. 2 is a schematic diagram showing the main parts of an example of a form embodying the present invention. FIG. 3 is a schematic diagram showing the positional relationship and intensity B profile of a laser beam L irradiated onto a chip component Dp in an example of an embodiment of the present invention. FIG. 4 is a flowchart of an example of a form embodying the present invention. FIG. 5 is a schematic diagram showing the main parts of an example of a form embodying the present invention. FIG. 6 is a schematic diagram showing specific examples and variations of the main parts of an example of a form embodying the present invention. FIG. 7 is a schematic diagram showing the positional relationship and intensity B profile of a laser beam L irradiated onto a chip component in an example of the prior art. Specific details for implementing the invention

[0022] FIG. 1 is a schematic diagram showing the overall configuration of an example of a form embodying the present invention. FIG. 1 shows a schematic diagram of a pickup device (1) according to the present invention.

[0023] The pickup device (1) is a device for picking up chip component D attached to the sheet (2).

[0024] Specifically, the pickup device (1) picks up by irradiating a laser beam L toward the chip attachment area (23) where a chip component D is attached via an adhesive layer (22) on the sheet (2).

[0025] More specifically, the pickup device (1) is equipped with a laser heating part (3), a collet (4), a sheet holding support part H, a moving part M, an alignment camera C, a control part CN, etc.

[0026] The sheet (2) holds and supports the chip component D in a predetermined position and enables multiple reorganized chip components D to be moved at once (i.e., facilitates handling).

[0027] Specifically, the sheet (2) is supported by having a diced chip component D attached to a supporting surface (e.g., an upper surface). Additionally, the plurality of chip components D attached to the sheet (2) may be appropriately distinguished from the attached chip component Dp and the chip component Dn that is not to be picked up.

[0028] FIG. 2 is a schematic diagram showing the main parts of an example of a form embodying the present invention. FIG. 2 shows a cross-sectional view of a sheet (2), etc., to which a chip component D to be picked up is attached.

[0029] More specifically, the sheet (2) is composed of a substrate (21) and an adhesive layer (22), and the outer periphery is attached to a ring-shaped frame Wf.

[0030] The substrate (21) is composed of a resin film or the like that has elasticity while transmitting a laser beam L.

[0031] The adhesive layer (22) has the characteristic that the force supporting the attached chip component Dp is weakened by heating.

[0032] Specifically, the adhesive layer (22) is composed of a binding material called a binder, and the binding strength of this binder has the property of decreasing upon heating.

[0033] More specifically, the adhesive layer (22) may exemplify a decrease in bonding strength as the binder hardens or softens due to heating.

[0034] In addition, among the adhesive layer (22), the area where the chip component D is attached (i.e., the inner side of the outer edge of the chip component D) is called the chip attachment area (23).

[0035] The frame Wf holds and supports the sheet (2) in a predetermined position, enables multiple chip components D to be moved at once (i.e., facilitates handling), and fixes the sheet (2) so that it does not shift position when picking up the chip components D, and is also called a carrier.

[0036] Specifically, the frame Wf is composed of materials such as resin or metal that are difficult to deform.

[0037] The seat holding support H holds and supports the seat (2) in a predetermined position.

[0038] Specifically, the sheet holding support member H is configured to hold and support a ring-shaped frame Wf to which the sheet (2) is attached in a predetermined position.

[0039] More specifically, the sheet holding support member H can be exemplified by a configuration in which it supports the frame Wf from the lower side and fixes it by vacuum suction, or inserts and fixes the frame Wf from the upper and lower sides.

[0040] The laser heating unit (3) heats the adhesive layer (22) on the sheet (2) by irradiating a laser beam L toward the chip attachment area (23) on which the chip component Dp to be picked up is attached.

[0041] Specifically, the laser heating unit (3) is equipped with a laser oscillator (31), a modulator (32), a mirror (33), etc. Additionally, the laser beam L is described in detail below by distinguishing between laser beams L1 to L3, but it may also be simply referred to as laser beam L.

[0042] The laser oscillator (31) emits a laser beam L1.

[0043] Specifically, the laser oscillator (31) can be an example of a continuous-wave fiber laser that emits a laser beam L1 of near-infrared wavelength and is connected to a control unit CN.

[0044] The modulator (32) adjusts (i.e., modulates) the profile of the intensity B of the incident laser beam L1 and emits it.

[0045] Specifically, the modulator (32) modulates the profile of the intensity B of the emitted laser beam L2 by locally changing the phase of the incident laser beam L1.

[0046] More specifically, the modulator (32) can be exemplified by being connected to a control unit CN and performing a predetermined phase modulation, and being equipped with a reflective spatial optical phase modulation module (SLM).

[0047] The mirror (33) changes the direction of the laser beam L2 emitted from the modulator (32). The laser beam L3 reflected from the mirror (33) is irradiated onto the sheet (2).

[0048] Specifically, the laser beam L3 heats the adhesive layer (22) on the sheet (2) to make it easier to peel off the chip component Dp, which is to be picked up, from the sheet (2).

[0049] In addition, the laser heating unit (3) has multiple heating areas for heating the adhesive layer (22) in the chip attachment area (23), and the intensity of the laser beam L3 is set to a different intensity for each heating area.

[0050] FIG. 3 is a schematic diagram showing the positional relationship and the profile of intensity B of a laser beam L3 irradiated onto a chip component Dp in an example of an embodiment of the present invention. FIG. 3 shows an example of the positional relationship between a chip attachment area (23) of a chip component Dp to be picked up and a plurality of heating areas (25a, 25b) irradiated by the laser beam L3, and the profile of intensity B of the laser beam L3.

[0051] The moving part M moves the sheet (2) and the laser heating part (3) relative to each other.

[0052] Specifically, the moving part M moves the sheet holding support part H in the XY direction and stops it at a predetermined position, thereby changing the irradiation position of the laser beam L3 that irradiates the chip component D held and supported in the sheet (2).

[0053] More specifically, the moving part M may be equipped with a mechanism combining a ball screw and a servo motor or a linear motor, and may be exemplified by a configuration that drives the seat holding support part H based on a command from the control part CN.

[0054] Alignment camera C detects the position of chip component Dp.

[0055] Specifically, the alignment camera C captures a chip component Dp to be picked up, detects the position or angle of the outer edge of the chip component Dp, the position of the reference area or the center of gravity based on the captured image, calculates where the chip component Dp is within the field of view (furthermore, where the chip component Dp is on the sheet (2)), and outputs the position information of the chip component Dp.

[0056] More specifically, the alignment camera C is equipped with an imaging camera C1 and an image processing unit (not shown).

[0057] The imaging camera C1 captures all or part of the chip component Dp to be picked up and outputs the captured image to the image processing unit.

[0058] The image processing unit processes the acquired image and calculates where the outer edge, reference area, center of gravity, etc. of the chip component Dp are located within the image, and outputs the position information of the chip component Dp (coordinates of the center or outer edge, etc.) to the control unit CN.

[0059] The collet (4) picks up the chip component Dp, which is the pickup target irradiated by the laser beam L3, by detaching it from the sheet (2).

[0060] Specifically, the collet (4) is composed of a flat rod-shaped member having a holding support surface (41) (i.e., the side in contact with the upper surface of the chip component Dp; also referred to as the lower surface) that holds and supports the chip component Dp, and a hole or groove is formed in the holding support surface (41). These holes or grooves are connected to a negative pressure suction means (vacuum pump, ejector, etc.) via a switching valve, and when the negative pressure suction means is operated while the chip component Dp is in contact with the holding support surface (41), a suction force is generated in the space formed by these holes or grooves and the chip component Dp. Therefore, the chip component Dp is sucked into the holding support surface (41) of the collet (4) and adsorbed and held.

[0061] More specifically, the collet (4) is connected to the collet moving part (42) and can separate (i.e. detach) the chip component Dp from the sheet (2) by moving away from the sheet (2) while adsorbing and supporting the chip component Dp.

[0062] The collet moving part (42) moves the collet (4) in a horizontal or vertical direction.

[0063] Specifically, the collet moving part (42) can be exemplified by a multi-joint robot or a multi-axis robot having a range of motion in the horizontal or vertical direction, or a configuration combining multiple single-axis actuators, and is connected to a control unit CN.

[0064] The control unit CN controls each part of the pickup device (1).

[0065] Specifically, the control unit CN has the following functions.

[0066] · Type information indicating the size, placement location, pickup order, etc., of chip component Dp to be picked up is obtained directly from an inspection device in an upstream process or through a host computer.

[0067] · Control the sheet holding support member H to hold and support the sheet (2) frame Wf, or release the holding support.

[0068] · Calculate the irradiation position of laser beam L3 based on the placement information J of chip component D, the current position of the moving part M, and the position information of chip component Dp to be picked up acquired from the alignment camera C.

[0069] · Based on the size information of the chip component D included in the placement information J, a control signal is output to the modulator (32) of the laser heating unit (3) to modulate the profile of the intensity B of the laser beam L.

[0070] · Control the moving part M to adjust the irradiation position of laser beam L3 on chip component D.

[0071] · A control signal for irradiating a laser beam L1 is output to the laser oscillator (31) of the laser heating unit (3), and the laser beam L1 is irradiated for a predetermined time and with a predetermined intensity B.

[0072] · Drive the moving part M so that a laser beam L3 is irradiated into the chip attachment area (23) where the chip component Dp to be picked up is attached, thereby finely adjusting (i.e., aligning) the position of the sheet holding support part H (furthermore, the chip component Dp).

[0073] · By controlling the collet moving part (41), the collet (4) is moved to adsorb and hold the chip component Dp to be picked up, or to pick up the chip component Dp from the sheet (2).

[0074] More specifically, the control unit CN consists of a computer and its execution program.

[0075] [Action Flow]

[0076] Below, a detailed explanation is provided regarding the procedure for picking up a chip component D attached to a sheet (2) using the pickup device (1) described above, while illustrating the operation flow.

[0077] FIG. 4 is a flowchart of an example of a form embodying the present invention.

[0078] FIG. 5 is a schematic diagram showing the main parts of an example of a form embodying the present invention. FIG. 5 (a) to (d) shows, in steps, picking up a chip component D attached to a sheet (2) using a pickup device (1) according to the present invention.

[0079] First, type information indicating the size, placement position, pickup order, etc. of chip component D, which is held and supported on the sheet (2) by interposing an adhesive layer (22), is obtained (step s1).

[0080] Next, the sheet (2) is loaded onto the sheet holding support H and held (step s2: see (a) of FIG. 5).

[0081] After that, the chip component Dp to be picked up is captured by the alignment camera C, the position information of the chip component Dp is calculated, and output to the control unit CN (Step s3: see (b) in FIG. 5).

[0082] After that, the moving part (4) is controlled to move the sheet holding support part H so that the laser beam L3 is irradiated within the chip attachment area (23) of the chip component Dp (step s4).

[0083] Then, by controlling the collet moving part (42), the collet (4) is lowered so that the holding support surface (41) is brought into close contact with the chip component Dp to be picked up (step s5).

[0084] Then, a laser beam L3 is irradiated toward the adhesive layer (22) within the chip attachment area (23) where the chip component Dp to be picked up is held and supported, thereby weakening the holding and supporting force of the chip component Dp and the adhesive layer (22) (Step s6: see (c) of FIG. 5).

[0085] After that, the collet (4) is moved away from the sheet (2) to transfer the picked-up chip component Dp to another location (step s7: see (d) in FIG. 5).

[0086] After that, it is determined whether to process other chip component Dp (step s8), and if processed, steps s3 to s8 described above are repeated. On the other hand, if other chip component Dp is not processed, the sheet (2) is removed (step s9), and the series of flows is terminated.

[0087] Because it has this configuration, the pickup device (1) according to the present invention can easily pick up chip component D attached to the sheet (2), while preventing chip component Dn from peeling off and falling off or becoming misaligned.

[0088] [Specific Examples · Variants]

[0089] FIG. 6 is a schematic diagram showing specific examples and variations of the main parts of an example of a form embodying the present invention.

[0090] FIGS. 6 (a) to (d) shows a plan view showing the positional relationship between the chip attachment area (23) and the beam heating area (25), and specific examples and variations of the positional relationship of the laser beam L3 and the profile of the intensity B.

[0091] In the specific example shown in FIG. 6(a), a first heating area (25a) is set slightly inward from the outer edge of the chip attachment area (23), and a second heating area (25b) is set inward from there. Additionally, the beam intensity B is set higher in the second heating area (25b) than in the first heating area (25a).

[0092] In the modified example shown in FIG. 6(b), a first heating area (25a) is set slightly inward from the outer edge of the chip attachment area (23), a second heating area (25b) is set inward from there, and a third heating area (25c) is set inward from there. Additionally, the beam intensity B is set highest in the second heating area (25b), and lower in the first heating area (25a) and the third heating area (25c) than in the second heating area (25b).

[0093] In the modified example shown in FIG. 6(c), a heating area (25) divided into three large blocks is set slightly inward from the outer edge of the chip attachment area (23), and in each heating area (25), a first heating area (25a) and a second heating area (25b) are set. In this case, the second heating area (25b) is set inward from the first heating area (25a), and the beam intensity B is set higher in the second heating area (25b) than in the first heating area (25a).

[0094] In the modified example shown in FIG. 6(d), a heating area (25) divided into 9 blocks on a 3×3 matrix is ​​set slightly inward from the outer edge of the chip attachment area (23), and in each heating area (25), a first heating area (25a) and a second heating area (25b) are set. In this case, the second heating area (25b) is set inward from the first heating area (25a), and the beam intensity B is set higher in the second heating area (25b) than in the first heating area (25a).

[0095] In addition, the above description illustrates an example in which the heating area (25) is set further inward than the outermost edge of the chip attachment area (23), with reference to (a) to (d) of FIG. 6.

[0096] With this configuration, since the outer edge of the chip attachment area (23) is not heated, when picking up the chip component Dp that is to be picked up, the outer edge of the adjacent chip component Dn that is not to be picked up is not heated, so the holding support of the adhesive layer (22) is not reduced, which is desirable.

[0097] However, when applying the present invention, the outer edge of the chip heating area (25) may be set to overlap with the dicing line (i.e., the gap between chip component Dp and chip component Dn) surrounding the chip attachment area (23). Even in this case, the outer periphery of the chip component Dn adjacent to the chip component Dp is not heated, so the holding support of the adhesive layer (22) is not reduced, which is preferable.

[0098] In addition, the above description illustrates an example in which the intensity B of the laser beam L3 irradiated onto the heating area (25) is set to be strongest in the inner part of the chip attachment area (23) and in the outer part of the center.

[0099] With this configuration, the retaining support of the adhesive layer (22) acting on the outer edge of the chip component Dp to be picked up is eliminated, so stress is not concentrated during pickup, and thus, cracks or breakage can be prevented in the chip component Dp. Meanwhile, since the retaining support of the adhesive layer (22) near the center of the chip component Dp remains slightly, positional misalignment does not occur, so it is desirable to be able to pick up without stress.

[0100] [Other Variations]

[0101] In addition, in the above description, a fiber laser emitting a laser beam L1 of near-infrared wavelength was exemplified as the laser oscillator (31), but it may emit a laser beam L1 of visible light wavelength, be a semiconductor laser, etc., or be a CO2 laser emitting a laser beam L1 of far-infrared wavelength.

[0102] At this time, as for the laser beam L, a wavelength that passes through the substrate (21), is absorbed by the adhesive layer (22), and heats the binder contained in the adhesive layer (22) can be appropriately selected.

[0103] Alternatively, a wavelength that is absorbed at the surface of the chip component Dp to be picked up may be selected as a laser beam L while passing through the substrate (21) and the adhesive layer (22). In this case, the adhesive layer (22) may be exemplified by the fact that the binder at the interface in contact with the chip component Dp is heated and hardened or softened by the heat propagated from the surface of the chip component Dp, thereby reducing the bonding strength, or that bubbles contained in the binder enlarge due to heating, thereby reducing the bonding strength.

[0104] In addition, the above description exemplifies that a reflective spatial optical phase modulation module (SLM) is provided as the modulator (32) of the laser heating unit (3).

[0105] With this configuration, the profile of the intensity B of the laser beam L3 is modulated based on the control signal output from the control unit CN, making it easy to handle multiple types, which is desirable.

[0106] However, in cases where single-product response or product switching by single replacement is permitted, a homogenizer or diffractive optical element (DOE) having a fine irregular shape formed on the surface of a mirror may be used as a modulator (32). In addition, the homogenizer or diffractive optical element (DOE) may be a reflective type as described above, but may also be a transmissive type having a fine irregular shape formed on the incident or exit surface of a transparent material.

[0107] In addition, the above description shows a configuration in which a collet (4) is placed in close contact with a chip component Dp to be picked up, and then a laser beam L3 is irradiated toward a heating area (25).

[0108] With this configuration, it is desirable because when most of the holding support of the chip attachment area (23) is lost due to heating of the laser beam L3, the chip component Dp can be picked up without misalignment.

[0109] However, by performing the heating exemplified in (b) to (d) of FIG. 6, if the retaining support force of the chip component Dp within the chip attachment area (23) is partially maintained and there is no concern about misalignment, the collet (4) may be pressed against the chip component Dp and picked up after heating with the laser beam L3.

[0110] Additionally, the configuration may be such that the chip component Dp is detached by pushing up with the needle and picked up with the collet (4). By applying the present invention, the holding support of the chip attachment area (23) is reduced, so that cracks or breakage do not occur even when the chip component Dp is pushed up by the needle.

[0111] In addition, although the above description exemplifies a method of irradiating a laser beam L that heats the adhesive layer (22) of the sheet (2) toward the substrate (21) of the sheet (2), it may also be a method of irradiating a laser beam L from the chip component Dp side.

[0112] In this case, a method can be exemplified in which the adhesive layer (22) is heated by heat propagating through a laser beam L of a wavelength that absorbs heat at the chip component Dp. Alternatively, the adhesive layer (22) may be heated by irradiating a laser beam L of a wavelength that absorbs heat at the adhesive layer (22) while passing through the chip component Dp.

[0113] In addition, in the above description, a resin film having elasticity was exemplified as the substrate (21) of the sheet (2), but the present invention can be applied regardless of whether it has elasticity. Explanation of the symbols

[0114] 1: Pickup device 2: Sheet 3: Laser heating unit 4: Colette D: Chip components Dp: Chip component to be picked up Dn: Chip parts not eligible for pickup 21: Entry 22: Adhesive layer 23: Chip attachment area 25: Heating zone 25a: First heating zone 25b: Second heating zone 25c: Third heating zone 31: Laser oscillator 32: Converter 33: Mirror 41: Collet moving part L: Laser beam B: Laser beam intensity H: Seat holding support M: Moving part C: Alignment camera CN: Control unit

Claims

Claim 1 A device for picking up a chip component attached to a sheet via an adhesive layer, wherein the adhesive layer has a characteristic in which the force holding and supporting the chip component is weakened by heating, and comprises a laser heating unit that irradiates a laser beam to heat the adhesive layer toward a chip attachment area on which the chip component to be picked up is attached, and a collet that picks up the chip component to be picked up by peeling it off from the sheet after the laser beam is irradiated, wherein the laser heating unit is characterized in that a plurality of heating areas for heating the adhesive layer are set in the chip attachment area, the intensity of the laser beam is set to a different intensity for each heating area, and the outer edge of the heating area is set to overlap with a dicing line surrounding the chip attachment area. Claim 2 A pickup device according to claim 1, characterized in that the heating area is set inward from the outermost periphery of the chip attachment area. Claim 3 delete Claim 4 A pickup device according to claim 1, characterized by having an alignment camera that detects the position of the chip component to be picked up, and irradiating the laser beam toward the chip attachment area where the chip component is attached, based on the position information of the chip component captured by the alignment camera. Claim 5 A pickup device characterized in that, in any one of claims 1, 2 and 4, the intensity of the laser beam irradiated onto the heating area is set to be strongest in an area inward from the outermost periphery of the chip attachment area and outward from the center.

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