Electronic device and method including flexible display

Abstract

An electronic device according to various embodiments of the present disclosure comprises: a housing including a first housing forming a side and rear surface of the electronic device and a second housing connected to the first housing so as to be slidable within a designated range; a heating component disposed in at least one area of ​​the first housing and the second housing; a driving unit disposed in one area within the housing; a flexible display comprising a metal plate, wherein at least one area is visible to the outside of the electronic device through the front surface of the electronic device; the flexible display comprises a first portion exposed to the outside of the housing and a second portion extending from the first portion and being drawn into or drawn out of the housing as the second housing moves relative to the first housing; a support structure attached to the rear surface of the second portion; at least one temperature sensing sensor disposed within the housing; and at least one processor electrically connected to the heating component, the driving unit, the flexible display, the support structure, or the temperature sensing sensor, wherein the at least one processor [is connected] to the second portion of the flexible display through the at least one temperature sensing sensor A temperature in a deployed area is detected, and whether an event to move the second housing occurs is determined. When an event to move the second housing occurs, if the detected temperature is greater than or equal to a first temperature, the movement speed of the second housing is controlled to a first driving speed. When an event to move the second housing occurs, if the detected temperature is less than the first temperature, the movement speed of the second housing is controlled to a second driving speed different from the first driving speed, or the movement of the second housing is restricted. A first power can be supplied to at least one of the heating component, the driving unit, the metal plate, or the support structure.

Description

Technology Field

[0001] The present disclosure relates to an electronic device and method including a flexible display. Background Technology

[0002] Portable electronic devices are advancing in various forms to secure an expanded display area without compromising portability. For example, an electronic device may have a slide-type structure that unfolds in a sliding manner relative to each other when a first housing and a second housing are used in an overlapping position. Furthermore, an electronic device having a slide-type structure may be implemented in various forms (e.g., rollable or slideable type) that can expand the externally visible display area using a flexible display.

[0003] Conventional bar-type electronic devices do not change the screen area of ​​the display visible to the outside, but electronic devices including a flexible display may change the display area visible to the outside as the flexible display folds, rolls, or slides depending on the usage state of the electronic device. Accordingly, a repulsive force may be generated in the variable area where the shape of the flexible display changes physically. The problem to be solved

[0004] When using a rollable or slideable electronic device, the entire area or a significant portion of the flexible display may be physically deformed depending on the usage conditions, which may cause repulsive forces to occur across the entire area of ​​the flexible display. Consequently, if the rollable or slideable electronic device is used at low temperatures (e.g., about -5°C or lower) that affect the repulsive forces, cracks may occur in the flexible display, or furthermore, it may cause malfunctions in the operation of the electronic device.

[0005] Various embodiments disclosed in this document can provide an electronic device capable of controlling the operation of a flexible display according to the ambient temperature of a flexible display of a rollable or slideable electronic device, and controlling the power supplied to an electronic component placed inside the electronic device to maintain an appropriate temperature. means of solving the problem

[0006] An electronic device according to various embodiments of the present disclosure comprises: a housing including a first housing forming a side and rear surface of the electronic device and a second housing connected to the first housing so as to be slidable within a designated range; a heating component disposed in at least one area of ​​the first housing and the second housing; a driving unit disposed in one area within the housing; a flexible display comprising a metal plate, wherein at least one area is visible to the outside of the electronic device through the front surface of the electronic device; the flexible display comprises a first portion exposed to the outside of the housing and a second portion extending from the first portion and being drawn into or drawn out of the housing as the second housing moves relative to the first housing; a support structure attached to the rear surface of the second portion; at least one temperature sensing sensor disposed within the housing; and at least one processor electrically connected to the heating component, the driving unit, the flexible display, the support structure, or the temperature sensing sensor, wherein the at least one processor [is connected] to the second portion of the flexible display through the at least one temperature sensing sensor A temperature in a deployed area is detected, and whether an event to move the second housing occurs is determined. When an event to move the second housing occurs, if the detected temperature is greater than or equal to a first temperature, the movement speed of the second housing is controlled to a first driving speed. When an event to move the second housing occurs, if the detected temperature is less than the first temperature, the movement speed of the second housing is controlled to a second driving speed different from the first driving speed, or the movement of the second housing is restricted. A first power can be supplied to at least one of the heating component, the driving unit, the metal plate, or the support structure.

[0007] A method of operation of an electronic device according to various embodiments of the present disclosure, comprising a housing including a first housing and a second housing movable relative to the first housing, and a flexible display including a first portion exposed to the outside of the housing and a second portion extending from the first portion, wherein the method comprises: detecting an ambient temperature in an area where the second portion of the flexible display is disposed through a temperature sensing sensor disposed within the electronic device; determining whether an event to move the second housing occurs; if an event to move the second housing occurs and the detected temperature is greater than or equal to a first temperature, controlling the movement speed of the second housing to a first driving speed; if an event to move the second housing occurs and the detected temperature is less than the first temperature, controlling the movement speed of the second housing to a second driving speed different from the first driving speed or restricting the movement of the second housing; a heating component disposed in at least one area among the first housing and the second housing; a driving unit disposed in one area of ​​the housing; a metal plate included in the flexible display; and the second It may include an operation of supplying a first power to at least one of the support structures attached to the rear of the part. Effects of the invention

[0008] According to the various embodiments disclosed in this document, when a rollable or slideable electronic device is used at a low temperature, the occurrence of breakage or cracking of the flexible display can be prevented, thereby improving the durability of the flexible display.

[0009] According to the various embodiments disclosed in this document, user convenience can be improved by allowing the user to recognize when the operation of a flexible display of a rollable or slideable electronic device is restricted. Brief explanation of the drawing

[0010] FIG. 1 is a front perspective view showing an electronic device in a first state (e.g., reduced state) according to one embodiment. FIG. 2 is a front perspective view showing an electronic device in a second state (e.g., extended state) according to one embodiment. FIG. 3 shows an exploded view of an electronic device according to one embodiment. FIG. 4a shows a cross-section AA' of the electronic device of FIG. 1 according to one embodiment. FIG. 4b shows a cross-section AA' of the electronic device of FIG. 2 according to one embodiment. FIG. 5 is a block diagram showing the components of an electronic device according to one embodiment. FIG. 6a shows the interior of a second state electronic device including a temperature sensing sensor according to one embodiment. FIG. 6b shows the interior of a second state electronic device including a temperature sensing sensor according to one embodiment. FIG. 7 is a flowchart illustrating a method for controlling the temperature of an electronic device according to one embodiment. FIG. 8 is a flowchart illustrating a method for controlling the temperature of an electronic device according to one embodiment. FIG. 9a shows a user interface (UI) displayed on the screen of a flexible display according to one embodiment. FIG. 9b shows a user interface (UI) displayed on the screen of a flexible display according to one embodiment. FIG. 10a shows the interior of an electronic device including a driving unit according to one embodiment. FIG. 10b shows the interior of an electronic device including a driving unit according to another embodiment. FIG. 11 shows a perspective view of an electronic device including a metal plate according to one embodiment. FIG. 12 shows the interior of an electronic device including a μ plate according to one embodiment. FIG. 13a shows a cross-section AA' of the electronic device of FIG. 12 according to one embodiment. FIG. 13b shows a cross-section of BB' of the electronic device of FIG. 12 according to one embodiment. FIG. 14 shows the interior of an electronic device including a metal plate and a heating wire according to one embodiment. FIG. 15a shows a cross-section AA' of the electronic device of FIG. 14 according to one embodiment. FIG. 15b shows a cross-section of BB' of the electronic device of FIG. 14 according to one embodiment. FIG. 16a shows a cross-section AA' of the electronic device of FIG. 14 according to another embodiment. FIG. 16b shows a cross-section of BB' of the electronic device of FIG. 14 according to another embodiment. FIG. 17 shows the interior of an electronic device including a printed circuit board according to one embodiment. FIG. 18 shows the front and rear of an electronic device including a support structure according to one embodiment. FIG. 19 shows a support structure and a rail member according to one embodiment. FIG. 20 shows a first fixed member and a first rail member according to one embodiment. FIG. 21 shows a structure for supplying power to a support structure according to one embodiment. FIG. 22 shows a structure for supplying power to a support structure according to another embodiment. FIG. 23 shows a cross-section AA' of the electronic device of FIG. 22 according to one embodiment. FIG. 24 shows the interior of an electronic device including electronic components according to one embodiment. FIG. 25 shows a portion of an electronic device including a heat transfer structure according to one embodiment. FIG. 26a shows a heating path of an electronic device that switches to a first state according to one embodiment. FIG. 26b shows a heating path of an electronic device that switches to a second state according to one embodiment. FIG. 27a shows a circuit for controlling the temperature of an electronic device according to one embodiment. FIG. 27b shows a circuit for controlling the temperature of an electronic device according to another embodiment. FIG. 27c shows a circuit for controlling the temperature of an electronic device according to another embodiment. FIG. 28 is a diagram illustrating a network environment including electronic devices according to various embodiments. Specific details for implementing the invention

[0011] FIG. 1 is a front perspective view showing an electronic device (101) in a first state (e.g., reduced state) according to one embodiment. FIG. 2 is a front perspective view showing an electronic device (101) in a second state (e.g., expanded state) according to one embodiment.

[0012] According to the various embodiments disclosed in this disclosure, a surface facing substantially the same direction as the direction in which at least a portion (e.g., a first portion (120a)) of a flexible display (120) located outside the electronic device (101) faces may be defined as the front (or front) of the electronic device (101), and a surface facing the front may be defined as the rear (or back) of the electronic device (101). A surface surrounding the space between the front and the rear may be defined as the side of the electronic device (101).

[0013] A flexible display (120) may be disposed on at least a portion of an electronic device (101) according to one embodiment. In one embodiment, the flexible display (120) may include at least a portion of a flat shape and at least a portion of a curved shape. In one embodiment, a slideable housing (110) may be disposed on the front of the electronic device (101) and surrounding at least a portion of the edges of the flexible display (120).

[0014] In one embodiment, the sliderable housing (110) may form a portion of the front (e.g., the side of the electronic device (101) facing the +z direction in FIG. 1 and FIG. 2), a rear (e.g., the side of the electronic device (101) facing the -z direction in FIG. 1 and FIG. 2), and a side (e.g., a side connecting the front and rear of the electronic device (101). According to another embodiment, the sliderable housing (110) may form a portion of the side and the rear of the electronic device (101).

[0015] In one embodiment, the sliderable housing (110) may include a first housing (111) and a second housing (112) movably coupled to the first housing (111) within a predetermined range.

[0016] In one embodiment, the flexible display (120) may include a first part (120a) that can be coupled to a second housing (112) and a second part (120b) that extends from the first part (120a) and can be inserted into the interior of an electronic device (101).

[0017] In one embodiment, the electronic device (101) may include a first state (101a) and a second state (101b). For example, the first state (101a) and the second state (101b) of the electronic device (101) may be determined according to the relative position of the second housing (112) with respect to the slideable housing (110), and the electronic device (101) may be configured to be changeable between the first state (101a) and the second state (101b) by user operation or mechanical operation.

[0018] In various embodiments, the first state (101a) of the electronic device (101) may mean a state before the slideable housing (110) is extended. The second state (101b) of the electronic device (101) may mean a state where the slideable housing (110) is extended.

[0019] In one embodiment, when the electronic device (101) is switched from a first state (101a) to a second state (101b) as the second housing (112) moves, the second part (120b) of the flexible display (120) may be withdrawn (or exposed) from inside the electronic device (101) to the outside. In various embodiments, being withdrawn (or exposed) of the flexible display (120) may mean that it is viewable from outside the electronic device (101). In another embodiment, when the electronic device (101) is switched from a second state (101b) to a first state (101a) as the second housing (112) moves, the second part (120b) of the flexible display (120) may be drawn into the inside of the electronic device (101). In various embodiments, the flexible display (120) being inserted may mean that it is not visible from the outside of the electronic device (101).

[0020] FIG. 3 shows an exploded view of an electronic device (101) according to one embodiment.

[0021] At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 and FIG. 2, and redundant descriptions are omitted below.

[0022] Referring to FIG. 3, the electronic device (101) may include a flexible display (120), a sliding cover (131) (e.g., the second housing (112) of FIG. 1), a first mid plate (132), a second mid plate (133), a rear cover (134), support structures (bars) (140), a driving unit (150), a side cover (160), a fixing member (161), a rail member (162), a printed circuit board (170), and / or a battery (180). In one embodiment, the electronic device (101) may omit at least one of the components or additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and redundant descriptions are omitted below.

[0023] In one embodiment, the slideable housing (110) of the electronic device (101) may include a front cover (not shown) positioned to cover a portion of the flexible display (120), a rear cover (134) forming the rear of the electronic device (101), a sliding cover (131) movably coupled between the front cover (not shown) and the rear cover (134) through a sliding motion, and a side cover (160) positioned to cover a side in a direction substantially perpendicular to the direction of movement of the sliding cover (131).

[0024] In one embodiment, the rear cover (134) may further include a portion extending toward the front of the electronic device (101), and such an extended portion may form a side of the electronic device (101). In one example, the rear cover (134) may be attached to the rear of the second mid plate (133).

[0025] In one embodiment, electronic components may be placed in the internal space of the slideable housing (110). For example, a battery (180) and a printed circuit board (170) on which various electronic components (e.g., processor, control circuit, memory and / or interface) are placed may be placed in the space.

[0026] In one embodiment, the sliding cover (131) may be slidably positioned on the first mid plate (132). For example, a sliding structure may be provided between the sliding cover (131) and the first mid plate (132) to support and guide the connection between them and the movement of the sliding cover (131). In one example, the sliding structure may include at least one elastic structure (132a). When the sliding cover (131) is moved to a set distance by an external force, it may transition from the contracted state of FIG. 1 to the expanded state of FIG. 2 without further external force due to the at least one elastic structure (132a). The at least one elastic structure (132a) may be implemented using various elastic members, such as a torsion spring. For example, as at least one elastic structure (132a), the torsion spring may include one end connected to the sliding cover (131), the other end connected to the first mid plate (132), and a spring portion between the one end and the other end. When the sliding cover (131) is moved by an external force to a distance set in a first direction of sliding out, the position of the one end relative to the other end is changed so that the sliding cover (131) can be moved in the first direction due to the elasticity of the spring portion without further external force, thereby transitioning from the contracted state of FIG. 1 to the expanded state of FIG. 2. When the sliding cover (131) is moved by an external force to a distance set in a second direction opposite to the first direction, the position of the one end relative to the other end is changed so that the sliding cover (131) can be moved in the second direction due to the elasticity of the spring portion without further external force, thereby transitioning from the expanded state of FIG. 2 to the contracted state of FIG. 1.

[0027] In one embodiment, the flexible display (120) may include a display panel layer and one or more plates (e.g., the metal plate (121) of FIG. 5 described below) that are seated on the display panel layer. In one example, the flexible display (120) may include a first portion (120a) exposed to the outside and a second portion (120b) extending from the first portion (120a) and being drawn into or drawn out of the slideable housing (110) as the sliding cover (131) moves relative to the first mid plate (132).

[0028] In one embodiment, the flexible display (120) may be movably coupled to the slideable housing (110). In one example, the flexible display (120) may be coupled to the sliding cover (131) and the first mid plate (132).

[0029] In one embodiment, the support structure (140) may be attached to the rear surface of the second part (120b) of the flexible display (120). The support structure (140) may be arranged in a manner that bends along the outer surface of the driving unit (150) by connecting a plurality of support structures so as to be interlocked. In one example, the support structure (140) may guide the bending of the flexible display (120). In one example, the second part (120b) of the flexible display (120) may be guided by being rolled (or bent) by the outer surface of the support structure (140). In one example, the support structure (140) may be coupled to a rail member (162) and move.

[0030] In one embodiment, the printed circuit board (170) may be placed between the first mid plate (132) and the second mid plate (133). In one example, the printed circuit board (170) may include a first printed circuit board (171), a second PCB (172), a third PCB (173), and a fourth PCB (174). In another example, the printed circuit board (170) may include at least one of the first PCB (171), the second PCB (172), the third PCB (173), and the fourth PCB (174), or may include an additional fifth PCB. At least one of the first PCB (171), the second PCB (172), the third PCB (173), and the fourth PCB (174) may be implemented as an FPCB.

[0031] In one embodiment, the side cover (160) may include a first side cover (160a) and a second side cover (160b). The first side cover (160a) may be coupled to the assembly (130) on the side of the first fixing member (161a). The second side cover (160b) may be coupled to the assembly (130) on the side of the second fixing member (161b).

[0032] In one embodiment, a first fixing member (161a) including a first rail member (162a) may be attached to one side of an assembly (130) in which a sliding cover (131), a first mid plate (132), a second mid plate (133), and a rear cover (134) are combined. A second fixing member (161b) including a second rail member (162b) may be attached to the other side of an assembly (130) in which a sliding cover (131), a first mid plate (132), a second mid plate (133), and a rear cover (134) are combined. In one example, the second fixing member (161b) may be located on the opposite side of the first fixing member (161a). In one example, a rail member (162) including a first rail member (162a) and a second rail member (162b) may be arranged so as to induce a sliding cover (131) to slide relative to the first mid plate (132).

[0033] In one embodiment, at least a portion of the sliding cover (131), the first mid plate (132), the second mid plate (133), and the rear cover (134) may comprise a metallic material or a non-metallic material (e.g., a polymer). In one example, at least a portion of the sliding cover (131), the first mid plate (132), the second mid plate (133), and the rear cover (134) may be implemented integrally. In one example, the assembly (130) may refer to a structure forming at least a portion of the sliding cover (131), the first mid plate (132), the second mid plate (133), and the rear cover (134).

[0034] In one embodiment, the driving unit (150) may include a cylindrical roller extending in a direction (e.g., -y-axis direction) from the first side cover (160a) to the second side cover (160b).

[0035] According to one embodiment, the battery (180) is disposed inside the electronic device (101) and can supply power to at least one component of the electronic device (101). For example, the battery (180) may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. According to one embodiment, the battery (180) may be disposed integrally inside the electronic device (101), but is not limited thereto, and according to another embodiment, the battery (180) may be disposed detachably from the electronic device (101).

[0036] FIG. 4a shows a cross-section along line A-A' of the electronic device (101) of FIG. 1 according to one embodiment. FIG. 4b shows a cross-section along line A-A' of the electronic device (101) of FIG. 2 according to one embodiment.

[0037] Referring to FIGS. 4a and 4b, the electronic device (101) may include a flexible display (120), a sliding cover (131), a first mid plate (132), a second mid plate (133), a support structure (140), a driving unit (150), a first PCB (171), and a second PCB (172).

[0038] In one embodiment, the printed circuit board (170) may be placed in at least one area of ​​the electronic device (101). In one example, the first PCB (171) and the second PCB (172) may be placed between the first mid plate (132) and the second mid plate (133). In one example, a structure in which an interposer (410) and the second PCB (172) are stacked in order with respect to the first PCB (171) may be placed between the first mid plate (132) and the second mid plate (133).

[0039] In one embodiment, the first PCB (171) may be placed in at least one area inside the electronic device (101). For example, the second PCB (172) may be placed facing one side of the first PCB (171) toward the front of the electronic device (101). In one example, the first PCB (171) and / or the second PCB (172) may be printed circuit boards formed of a material having non-bendable properties (e.g., FR4). In another example, the first PCB (171) and / or the second PCB (172) may be flexible printed circuit boards having bendable properties (or flexible properties).

[0040] In one embodiment, the interposer (410) is positioned between the first PCB (171) and the second PCB (172) and can be coupled with the first PCB (171) and the second PCB (172). In one example, the first PCB (171) and the second PCB (172) can be electrically connected through at least one conductive via of the interposer (410). In one example, the first PCB (171) may have a first size, and the second PCB (172) may have a second size smaller than the first size. In one example, the first PCB (171) may include a first region corresponding to the second PCB (172) and a second region excluding the first region. In one example, the interposer (410) may be positioned between the first region of the first PCB (171) and the second PCB (172). For example, the interposer 410) can be positioned to surround the space between the first area of ​​the first PCB (171) and the second PCB (172).

[0041] In one embodiment, a processor (e.g., processor (510) of FIG. 5), memory (e.g., memory (2830) of FIG. 28), control circuit and / or interface (e.g., interface (2877) of FIG. 28) may be placed on the first PCB (171) and / or the second PCB (172). For example, a radio frequency integrated circuit (RFIC) may be placed on the second PCB (172). In one example, a plurality of electronic components placed on the first PCB (171) and a plurality of electronic components placed on the second PCB (172) may be electrically and / or operatively connected through an interposer (410). In one example, a plurality of electronic components placed on the first PCB (171) and a plurality of electronic components placed on the second PCB (172) may be electrically connected through a separate connection structure.

[0042] Referring to FIGS. 4a and 4b, the flexible display (120) can be coupled to a first mid plate (132), a flat portion corresponding to the front of the sliding cover (131), and a curved portion corresponding to the side of the sliding cover (131). The curved portion can be formed by a support structure (bars) (140) connected to the sliding cover (131). In one example, the support structure (140) may include a plurality of bar forms, but is not limited thereto. For example, the support structure (140) may be in the form of a lattice. The support structure (140) can be attached to the rear of the flexible display (120) to guide the bending of the flexible display (120).

[0043] In one embodiment, the first mid plate (132) and the sliding cover (131) can support the flexible display (120). The sliding cover (131) can slide in a lateral direction (e.g., the +x direction in FIG. 3) on the first mid plate (132). Accordingly, the flexible display (120) coupled to the sliding cover (131) can also slide in the lateral direction, so that the display area of ​​the flexible display (120) exposed to the outside can be expanded or reduced.

[0044] In one embodiment, the second mid plate (133) may be coupled to the rear of the first mid plate (132) to support the sliding cover (131). In one example, the rear cover (134) may be coupled to the rear of the second mid plate (133).

[0045] In one embodiment, the driving unit (150) is connected to the support structure (140) to cause the sliding cover (131) to slide. In one example, the driving unit (150) may be provided in the shape of a bar and may rotate. In another example, the driving unit (150) may not rotate but may guide the sliding movement of the support structure (140) in contact with the outer surface of the driving unit (150) according to the driving of an actuator (not shown), such as a motor. The support structure (140) in contact with the outer surface of the driving unit (150) may be bent and moved relative to the driving unit (150).

[0046] Referring to FIG. 4a, when the driving unit (150) rotates in a first rotational direction or guides the support structure (140) moving in the first rotational direction, the support structure (140) can be rolled inward along the outer surface of the driving unit (150) toward the inside of the electronic device (101), and accordingly, the display area of ​​the flexible display (120) exposed to the outside can be reduced.

[0047] Referring to FIG. 4b, when the driving unit (150) rotates in a second rotational direction opposite to the first rotational direction or guides the support structure (140) moving in the second rotational direction, the support structure (140) can be extended outward along the outer surface of the driving unit (150) to the outside of the electronic device (101), and accordingly, the display area of ​​the flexible display (120) exposed to the outside can be expanded.

[0048] FIG. 5 is a block diagram showing the components of an electronic device (101) according to one embodiment.

[0049] In one embodiment, the electronic device (101) may include a flexible display (120), a driving unit (150), a processor (510), and / or a temperature sensing sensor (520). The electronic device (101) may include additional components in addition to the components shown in FIG. 5 (e.g., memory (not shown)), or at least one of the components shown in FIG. 5 may be omitted.

[0050] In one embodiment, the processor (510) (e.g., the processor (2820) of FIG. 28) may be electrically or operatively connected to the flexible display (120), the driving unit (150), and the temperature sensing sensor (520). In one example, the processor (510) may execute operations or data processing regarding the control and / or communication of at least one other component of the electronic device (101) using instructions stored in memory (not shown). In an example, the processor (510) may include at least one of a central processing unit (CPU), a graphics processing unit (GPU), a micro controller unit (MCU), a sensor hub, a supplementary processor, a communication processor, an application processor, an application specific integrated circuit (ASIC), and a field programmable gate array (FPGA), and may have multiple cores.

[0051] In one embodiment, the flexible display (120) can visually output information to a user through a flexible display (120) based on at least one of an OLED (organic light emitting), an LCD (liquid crystal display), and an LED (light emitting diode). To enable more intuitive control of the user interface output through the flexible display (120), the electronic device (101) may include a touch sensor panel (TSP, touch screen panel) placed on the flexible display (120). The touch sensor panel can detect the position of an object (e.g., a user's finger or stylus pen) that touches the flexible display (120) or hovers over the flexible display (120) using at least one of a resistive film, capacitive components, surface acoustic waves, and infrared.

[0052] In one embodiment, the flexible display (120) may include a first part (120a) exposed to the outside of the electronic device (101) and a second part (120b) extending from the first part (120a) and being drawn into or drawn out of the electronic device (101) as the second housing (112) moves relative to the first housing (111).

[0053] In one embodiment, the flexible display (120) can control the area of ​​the flexible display (120) that is determined to be exposed to the outside to an active state. Additionally, the flexible display (120) can control the remaining area excluding the area determined to be exposed to the outside to an inactive state.

[0054] In one embodiment, the flexible display (120) may include a plurality of layers. In one example, the flexible display (120) may include a display panel (not shown) including a plurality of pixels and a metal plate (121). In one example, the metal plate (121) may be disposed on the back surface of the display panel. The back surface of the display panel may be a surface located opposite to the surface from which light is emitted from the display panel.

[0055] In one embodiment, the metal plate (121) can contribute to the durability of the flexible display (120). For example, the metal plate (121) can reduce the impact of load or stress on the flexible display (120) that may occur during the transition between the first state (101a) and the second state (101b). The metal plate (121) can prevent the flexible display (120) from being damaged by the force transmitted from the sliding cover (131) when it is moved.

[0056] In one embodiment, the metal plate (121) may comprise various metallic materials and / or non-metallic materials (e.g., polymers). In one example, the metal plate (121) may comprise stainless steel (STS). In another example, the metal plate (121) may comprise engineering plastic.

[0057] In one embodiment, the metal plate (121) may include a lattice structure in at least a portion of the first part of the flexible display (120) (e.g., the first part (120a) in FIG. 2) and a portion that is bent (e.g., the second part (120b) in FIG. 2). The lattice structure may include a plurality of openings or a plurality of slits. The plurality of openings or a plurality of slits may contribute to the flexibility of the flexible display (120). In one example, the lattice structure may be referred to as a 'pattern structure'. In one example, the metal plate (121) may include a recess pattern including a plurality of recesses instead of the lattice structure. The recess pattern may contribute to the flexibility and rigidity of the flexible display (120).

[0058] In one embodiment, the temperature sensing sensor (520) can measure the ambient temperature of the flexible display (120). The processor (510) can measure the ambient temperature of the flexible display (120) detected through the temperature sensing sensor (520). In one example, the temperature sensing sensor (520) may include a temperature control IC. In one example, a memory (not shown) may store instructions that cause the processor (510) to detect the temperature of the flexible display (120). For example, the processor (510) can detect the temperature of the flexible display (120) through the temperature sensing sensor (520).

[0059] In one embodiment, the electronic device (101) may include at least one temperature sensing sensor (520). In one example, at least one temperature sensing sensor (520) may be positioned adjacent to a second part (120b) of the flexible display (120).

[0060] In one example, the temperature sensing sensor (520) may include at least one of a thermistor, a resistance thermometer, a thermoelectric, a silicon transducer, or a critical temperature resistor (CTR) as a component for converting temperature into an electrical characteristic value. In one example, the temperature sensing sensor (520) may include various other temperature detection elements.

[0061] In one embodiment, a memory (not shown) may store instructions for the processor (510) to control the driving of a driving unit (150) physically and / or electrically connected to the flexible display (120) based on the ambient temperature of the flexible display (120), and / or instructions to control the ambient temperature of the flexible display (120). In one example, the driving unit (150) may be provided in a bar shape and may rotate. In another example, the driving unit (150) may not rotate but may guide the sliding movement of a support structure (140) in contact with the outer surface of the driving unit (150) according to the driving of an actuator (not shown), such as a motor.

[0062] In one embodiment, the electronic device (101) may include at least one heat-generating component (530) in a region inside the electronic device. In one example, the heat-generating component (530) may be mounted on a printed circuit board (e.g., the printed circuit board (170) of FIG. 3). The heat-generating component (530) may include an SSD controller, a non-volatile memory device (e.g., NAND flash memory), and a buffer memory device. In one example, the heat-generating component (530) may include a display drive IC (DDI) and / or a processor (510) that generates heat.

[0063] In one embodiment, the heating component (530) may include a resistive component. When power is supplied to the heating component (530), a portion of the power may be dissipated as thermal energy by the resistive component.

[0064] FIG. 6a shows the interior of an electronic device (101) in a second state (101b) including a temperature sensing sensor (520) according to one embodiment. FIG. 6b shows the interior of an electronic device (101) in a second state (101b) including a temperature sensing sensor (520) according to one embodiment.

[0065] Referring to FIGS. 6a and 6b, the electronic device (101) may include a temperature sensing sensor (520) and a connecting member (610).

[0066] In one embodiment, the electronic device (101) may include at least one temperature sensing sensor (520). In one example, at least one temperature sensing sensor (520) may be positioned adjacent to the driving unit (150). At least one temperature sensing sensor (520) positioned adjacent to the driving unit (150) may acquire the ambient temperature of a flexible display (120) positioned adjacent to the driving unit (150).

[0067] In one embodiment, in a second state (101b) of the electronic device (101), the first mid plate (132) may include a first surface facing the support structure (140) and a second surface located opposite to the first surface. Referring to FIG. 4a, a first temperature sensing sensor (521) and / or a second temperature sensing sensor (522) may be attached to the second surface of the first mid plate (132). In one example, the first temperature sensing sensor (521) may be attached to one end of the first mid plate (132) at a location adjacent to the driving unit (150). The second temperature sensing sensor (522) may be attached to the other end of the first mid plate (132). In one example, the first temperature sensing sensor (521) may be electrically connected to the second PCB (172) through the first connecting member (611a). The second temperature sensing sensor (522) can be electrically connected to the second PCB (172) and the second connecting member (612a).

[0068] In one embodiment, in a second state (101b) of the electronic device (101), the second mid plate (133) may include a first surface facing the first PCB (171) and a second surface located opposite to the first surface. Referring to FIG. 6a, a third temperature sensing sensor (523) and / or a fourth temperature sensing sensor (524) may be attached to the first surface of the second mid plate (133). In one example, the third temperature sensing sensor (523) may be attached to one end of the second mid plate (133) at a location adjacent to the driving unit (150). The fourth temperature sensing sensor (524) may be attached to the other end of the second mid plate (133). In one example, the third temperature sensing sensor (523) may be electrically connected to the first PCB (171) through a third connecting member (613a). The fourth temperature sensing sensor (524) can be electrically connected to the first PCB (171) through the fourth connecting member (614a). In one example, the placement of the temperature sensing sensor (520) is not limited thereto and may be further placed in a location adjacent to the driving unit (150).

[0069] In one embodiment, the first connecting member (611a), the second connecting member (612a), the third connecting member (613a) and / or the fourth connecting member (614a) may be referred to as the connecting member (610a). In one example, the connecting member (610a) may be a conductive connecting member.

[0070] In one embodiment, the second PCB (172) may include a first surface facing the first mid plate (132) and a second surface located opposite the first surface. Referring to FIG. 6b, the first temperature sensing sensor (521) and / or the second temperature sensing sensor (522) may be placed on the first surface of the second PCB (172). In one example, the first temperature sensing sensor (521) may be placed at one end of the second PCB (172). The second temperature sensing sensor (522) may be placed at the other end of the second PCB (172). In one example, the first temperature sensing sensor (521) may be electrically connected to the second PCB (172) through a first connecting member (611b). The second temperature sensing sensor (522) may be electrically connected to the second PCB (172) through a second connecting member (612b).

[0071] In one embodiment, the first PCB (171) may include a first surface facing the second mid plate (133) and a second surface located opposite the first surface. Referring to FIG. 4b, a third temperature sensing sensor (523) and / or a fourth temperature sensing sensor (524) may be placed on the second surface. In one example, the third temperature sensing sensor (523) may be placed at one end of the first PCB (171). The fourth temperature sensing sensor (524) may be placed at the other end of the first PCB (171). The third temperature sensing sensor (523) may be electrically connected to the first PCB (171) through a third connecting member (613b). The fourth temperature sensing sensor (524) may be electrically connected to the first PCB (171) through a fourth connecting member (614b).

[0072] In one embodiment, the first connecting member (611b), the second connecting member (612b), the third connecting member (613b) and / or the fourth connecting member (614b) may be referred to as the connecting member (610b). The connecting member (610) may be a conductive connecting member (e.g., a conductive tape).

[0073] In one embodiment, the first temperature sensing sensor (521), the second temperature sensing sensor (522), the third temperature sensing sensor (523), and / or the fourth temperature sensing sensor (524) may be referred to as the temperature sensing sensor (520).

[0074] In one embodiment, the temperature sensing sensor (520) is electrically connected to the first PCB (171) and / or the second PCB (172) and can transmit temperature information of the flexible display (120) obtained through the temperature sensing sensor (520) to a processor (510) mounted on the first PCB (171) or the second PCB (172). In one example, the temperature information of the flexible display (120) may include temperature information around the area where the temperature sensing sensor (520) is placed within the electronic device (101). For example, if the temperature sensing sensor (520) is placed at a location adjacent to the driving unit (150) and / or at a location adjacent to the area where the support structure (140) is placed, the processor (510) can obtain temperature information of the section where the flexible display (120) rolls along the outer surface of the driving unit (150) through the temperature sensing sensor (520). That is, the processor (510) can obtain temperature information of the area where the second part (122) of the flexible display (120) can be placed through the temperature sensing sensor (520).

[0075] FIG. 7 is a flowchart (700) illustrating a method for controlling the temperature of an electronic device (101) according to one embodiment.

[0076] In the following embodiments, each operation may be performed sequentially, but is not necessarily performed sequentially. For example, the order of each operation may be changed, and at least two operations may be performed in parallel.

[0077] According to one embodiment, an electronic device (101) (e.g., the processor (510) of FIG. 5) can detect the ambient temperature of a flexible display (120) through at least one temperature sensing sensor (520) in operation 701. In one example, the processor (510) can obtain temperature information in a rolling area of ​​the flexible display (120) through at least one temperature sensing sensor (520).

[0078] In one embodiment, the electronic device (101) may include at least one temperature sensing sensor (520) for detecting the ambient temperature of the flexible display (120). In one example, the at least one temperature sensing sensor (520) may be placed within a second part (120b) of the flexible display (120). In one example, the second part (120b) of the flexible display (120) may be placed around an area where it moves as it switches between the state and the extended state of FIG. 2.

[0079] In one embodiment, the ambient temperature of the flexible display (120) obtained through at least one temperature sensing sensor (520) may vary depending on the external temperature conditions in which the electronic device (101) is placed.

[0080] In one embodiment, the processor (510) can obtain information about the ambient temperature of the flexible display (120) through at least one temperature sensing sensor (520).

[0081] According to one embodiment, the electronic device (101) (e.g., the processor (510) of FIG. 5) can determine whether an event to move the second housing (112) occurs in operation 703. In one example, the processor (510) can detect the movement of the second housing (112) through a sliding detection sensor (not shown). For example, when the processor (510) receives user input to move the second housing (112), it can transmit a control signal to the driving unit (150) to move the second housing (112). In one example, the processor (510) can receive user input to move the second housing (112) through a touch sensor panel (TSP) placed on top of the flexible display (120). In another example, the processor (510) can receive user input for moving the second housing (112) through a key input device (not shown) placed in the electronic device (101).

[0082] In one embodiment, the processor (510) can determine whether an event to move the second housing (112) occurs based on various instructions stored in memory (not shown). For example, the processor (510) can determine that an event to move the second housing (112) has occurred when it receives user input to expand from the first state (101a) of the electronic device (101) to the second state (101b). In one example, user input to expand from the first state (101a) of the electronic device (101) to the second state (101b) can be obtained through a touch sensor panel (TSP) placed on top of the flexible display (120). In another example, user input that extends from a first state (101a) of the electronic device (101) to a second state (101b) can be received through a key input device (not shown) placed in the electronic device (101).

[0083] According to one embodiment, an electronic device (101) (e.g., processor (510) of FIG. 5) can determine whether the detected temperature is less than the first temperature in response to the occurrence of an event that moves the second housing (112) in operation 705 through operation 701.

[0084] In one embodiment, the processor (510) can determine whether the detected temperature is below a first temperature through operation 701. In one example, a temperature lower than the first temperature (e.g., -5°C) may correspond to a low temperature that is highly likely to cause damage to the flexible display (120). For example, if the ambient temperature of the flexible display (120) is lower than the first temperature, there may be a high likelihood of damage to the flexible display (120) when the second housing (112) moves.

[0085] According to one embodiment, when an event occurs that moves the second housing (112) and the detected temperature is greater than or equal to the first temperature, the electronic device (101) (e.g., the processor (510) of FIG. 5) can control the movement speed of the second housing (120b) to the first driving speed in operation 707.

[0086] In one embodiment, when the detected temperature corresponds to a first temperature or higher, the processor (510) may have a low probability of damage to the flexible display (120) as it corresponds to an appropriate temperature range of the flexible display (120). In one example, when the detected temperature corresponds to a first temperature or higher, the processor (510) may control the driving speed of the second housing (112) to a first driving speed in response to an event that moves the second housing (112). In one example, the first driving speed may correspond to the driving speed of the second housing (112) within the appropriate temperature range of the flexible display (120).

[0087] According to one embodiment, when an event occurs that moves the second housing (112) and the detected temperature is below the first temperature, the electronic device (101) (e.g., the processor (510) of FIG. 5) can control the second housing (112) at a second driving speed in operation 709.

[0088] In one embodiment, when the detected temperature is below the first temperature, the processor (510) controls the driving speed of the second housing (112) to the first driving speed in response to an event in which the second housing (112) is moved. In this case, stress may be relatively more concentrated within the flexible display (120) than when the detected temperature is above the first temperature, and the possibility of damage may be higher. In one example, when the detected temperature is below the first temperature, the processor (510) may control the driving speed of the second housing (112) to a second driving speed, which is slower than the first driving speed, thereby reducing the possibility of damage to the flexible display (120). In one example, the second driving speed may correspond to the driving speed of the second housing (112) when the ambient temperature of the flexible display (120) deviates from the appropriate temperature.

[0089] According to one embodiment, when an event occurs in which the second housing (112) is moved and the detected temperature is below the first temperature, the electronic device (101) (e.g., the processor (510) of FIG. 5) can provide the first power to at least one of the heating component (530), the driving unit (150), the metal plate (121), or the support structure (140) in operation 711.

[0090] In one embodiment, the processor (510) can control at least one component to emit heat so that when the detected temperature is below a first temperature, the ambient temperature of the flexible display (120) is within an appropriate temperature range (e.g., above the first temperature). In one example, the at least one component may include at least one of a heat-generating component (530), a driving unit (150), a metal plate (121) of the flexible display (120), or a support structure (140).

[0091] In one embodiment, the processor (510) can supply a first power so that at least one of the heat-generating component (530), the driving unit (150), the metal plate (121), or the support structure (140) can emit heat.

[0092] In one embodiment, when the processor (510) is performing or is scheduled to perform a function (e.g., signal transmission and reception through an antenna module, or communication through a wired / wireless communication circuit) through a heating component (530) disposed within the electronic device (101), the processor (510) may limit the supply of power to at least one of the driving unit (150), the metal plate (121), and the support structure (140). Since the heating component (530) generates or is scheduled to generate heat as the processor (510) performs a function through the heating component (530), the power supplied to the driving unit (150), the metal plate (121), or the support structure (140) may be limited to prevent the temperature of the electronic device (101) from rising excessively.

[0093] In one embodiment, the operation of the processor (510) supplying power to at least one of the heat-generating component (530), the driving unit (150), the metal plate (121), or the support structure (140) is described in detail with reference to FIGS. 10a to 26.

[0094] FIG. 8 is a flowchart (800) illustrating a method for controlling the temperature of an electronic device (101) according to one embodiment.

[0095] In the explanation of Fig. 8, parts that overlap or are repeated with those explained in Fig. 7 are omitted.

[0096] According to one embodiment, an electronic device (101) (e.g., the processor (510) of FIG. 5) can determine in operation 801 whether the detected temperature is lower than a second temperature that is lower than a first temperature.

[0097] In one embodiment, the processor (510) can determine whether the detected temperature is lower than a second temperature that is lower than a first temperature through operation 801 of FIG. 8. In one example, the first temperature (e.g., -5°C) may be a reference temperature that may cause damage to the flexible display (120). In one example, the second temperature (e.g., -10°C) may be a reference temperature that causes material deformation of the flexible display (120). In one example, the first temperature and the second temperature may vary depending on the material contained in the flexible display (120).

[0098] According to one embodiment, when an event occurs in which the second housing (112) is moved and the detected temperature corresponds to a second temperature lower than the first temperature, the electronic device (101) (e.g., the processor (510) of FIG. 5) can control the movement speed of the second housing (112) to a second driving speed in operation 803.

[0099] According to one embodiment, when an event occurs in which the second housing (112) is moved and the detected temperature corresponds to a second temperature lower than the first temperature, the electronic device (101) (e.g., the processor (510) of FIG. 5) may supply a first power to at least one of the heating component (530), the driving unit (150), the metal plate (121), or the support structure (140) in operation 805.

[0100] In one embodiment, operation 803 may correspond to operation 709 of FIG. 7. Operation 805 may correspond to operation 711 of FIG. 7.

[0101] According to one embodiment, when an event occurs in which the second housing (112) is moved and the detected temperature is lower than the first temperature, the electronic device (101) (e.g., the processor (510) of FIG. 5) may restrict the movement of the second housing (112) in operation 807. That is, in an environment below the second temperature, the electronic device (101) may not move the housing until it recovers to an appropriate temperature.

[0102] In one embodiment, when the detected temperature is lower than a second temperature that is lower than a first temperature, the processor (510) controls the movement of the second housing (112) in response to an event that moves the second housing (112), and stress is relatively more concentrated within the flexible display (120) than when the detected temperature is lower than a first temperature or higher than a second temperature, so the possibility of breakage may be higher. In one example, when the detected temperature is lower than a second temperature that is lower than a first temperature, the processor (510) can restrict the movement of the second housing (112) to prevent breakage of the flexible display (120) and / or deformation of the material of the flexible display (120).

[0103] In one embodiment, the processor (510) may output a notification when controlling the driving speed of the second housing (112) or restricting the movement of the second housing (112). In one example, the processor (510) may output the notification through an audio module (e.g., audio module (2870) of FIG. 28), a flexible display (120), and / or a haptic module (e.g., haptic module (2879) of FIG. 28).

[0104] In one embodiment, when the processor (510) controls the driving speed of the second housing (112) to a second driving speed or restricts the movement of the second housing (112), the processor (510) may output a notification about this through an audio module (e.g., the audio module (2870) of FIG. 28). For example, the processor (510) may output a voice message through the audio module saying, "The display expansion speed is limited according to the device temperature control, so it is expanding slowly." In one example, when the processor (510) restricts the movement of the second housing (112), the processor (510) may output a voice message through the audio module saying, "Display expansion is limited according to the device temperature control."

[0105] In one embodiment, when the processor (510) controls the driving speed of the second housing (112) to a second driving speed, the processor (510) may output a first vibration pattern through a haptic module. In one example, when the processor (510) restricts the movement of the second housing (112), the processor (510) may output a second vibration pattern different from the first vibration pattern through a haptic module.

[0106] In one embodiment, the processor (510) can control the movement speed of the second housing (112) to the second driving speed through the flexible display (120) or output a screen indicating that the movement of the second housing (112) is restricted.

[0107] In one embodiment, the operation of the processor (510) outputting a screen indicating that the movement speed of the second housing (112) is controlled by the second driving speed or that the movement of the second housing (112) is restricted through the flexible display (120) is described in detail with reference to FIG. 9a and FIG. 9b.

[0108] According to one embodiment, when an event occurs in which the second housing (112) is moved and the detected temperature is lower than the first temperature, the electronic device (101) (e.g., the processor (510) of FIG. 5) may supply second power to at least one of the heating component (530), the driving unit (150), the metal plate (121), or the support structure (140) in operation 809.

[0109] In one embodiment, the processor (510) can control at least one component to emit heat so that the ambient temperature of the flexible display (120) is within an appropriate temperature range (e.g., above the first temperature) when the detected temperature is below a second temperature which is lower than the first temperature. In one example, at least one component may include at least one of a heat-generating component (530), a metal plate (121) of the flexible display (120), a driving unit (150), or a support structure (140). In one example, the processor (510) may supply a second power to at least one of the heat-generating component (530), the metal plate (121) of the flexible display (120), the driving unit (150), or the support structure (140). In one example, the second power may be a higher value than the first power. In one example, when the detected temperature is lower than a second temperature which is lower than a first temperature, power can be supplied at a higher level than when the detected temperature is higher than the second temperature to control the dissipation of more heat through the at least one component. In another example, the first power can be supplied at the same level even when the temperature is lower than the second temperature. That is, operation 809 can be implemented in the same way as operation 805.

[0110] In one embodiment, a method for controlling power supplied by the processor (510) to at least one of a heat-generating component (530), a metal plate (121) of a flexible display (120), a driving unit (150), or a support structure (140) is described in detail with reference to FIGS. 27a to 27c.

[0111] FIG. 9a shows a user interface (UI) displayed on the screen of a flexible display (120) according to one embodiment. FIG. 9b shows a user interface (UI) displayed on the screen of a flexible display (120) according to one embodiment.

[0112] Referring to FIG. 9a, when an event occurs in which the second housing (112) moves, and the ambient temperature of the flexible display (120) detected by the temperature sensing sensor (520) is below the first temperature, the processor (510) can control the movement speed of the second housing (112) to the second driving speed. In one example, the processor (510) can output a notification regarding this through the flexible display (120) in response to the operation of controlling the movement speed of the second housing (112) to the second driving speed. In one example, the processor (510) can output a guidance message (901) through the flexible display (120) stating, "The display expansion speed is limited according to the device temperature adjustment and is expanding slowly." Through this, the electronic device (101) can provide a user experience that allows the user to recognize the limitation on the driving speed of the second housing (112) of the electronic device (101).

[0113] Referring to FIG. 9b, when an event occurs in which the second housing (112) is moved and the ambient temperature of the flexible display (120) detected by the temperature sensing sensor (520) is lower than the second temperature which is lower than the first temperature, the processor (510) may restrict the movement of the second housing (112). In one example, the processor (510) may output a notification regarding this through the flexible display (120) in response to the action of restricting the movement of the second housing (112). In one example, the processor (510) may output a guidance message (902) through the flexible display (120) stating, "Display expansion is restricted according to device temperature adjustment."

[0114] FIG. 10a shows the interior of an electronic device (101) including a driving unit (150) according to one embodiment. FIG. 10b shows the interior of an electronic device (101) including a driving unit (150) according to another embodiment.

[0115] Referring to FIGS. 10a and 10b, the electronic device (101) may include a driving unit (150) and a first PCB (171). In one example, a processor (510) may be placed on the first PCB (171) so that when the processor (510) supplies power to the driving unit (150), the processor (510) may supply power to the driving unit (150) through the first PCB (171). In one example, the driving unit (150) that receives power from the processor (510) may emit heat. In one example, the heat emitted from the driving unit (150) may be transferred to a flexible display (120) and diffused from the flexible display (120).

[0116] Referring to FIG. 10a, the processor (510) can supply power to the driver (150) through a first connecting member (1001) (e.g., a c-clip or a pogo pin) connected to the first PCB (171). In one example, the driver (150) and the first PCB (171) can be connected to each other through the first connecting member (1001).

[0117] Referring to FIG. 10b, the processor (510) can supply power to the driver (150) through a second connecting member (1002) (e.g., FPCB) connected to the first PCB (171). In one example, the driver (150) and the first PCB (171) can be connected to each other through the second connecting member (1002).

[0118] In one embodiment, the driving unit (150) supplied with power can generate heat. In one example, the heat generated from the driving unit (150) can be transferred to the flexible display (120).

[0119] FIG. 11 shows a perspective view of an electronic device (101) including a metal plate (121) according to one embodiment.

[0120] Referring to FIG. 11, the electronic device (101) may include a metal plate (121). The flexible display (120) may include a metal plate (121).

[0121] In one embodiment, the metal plate (121) can contribute to the durability of the flexible display (120). For example, the metal plate (121) can reduce the effect of load or stress on the flexible display (120) that may occur during the transition between the first state (101a) and the second state (101b) of the electronic device (101).

[0122] In one embodiment, the metal plate (121) may include a first portion (121a) of the metal plate (121) corresponding to a first portion (120a) of the flexible display (120) and a second portion (121b) of the metal plate (121) corresponding to a second portion (e.g., the second portion (120b) of FIG. 2) of the flexible display (120). In another example, the second portion (121b) of the metal plate (121) may correspond to at least a portion of the first portion (120a) of the flexible display (120) and the second portion (120b).

[0123] In one embodiment, a second portion (121b) of the metal plate (121) may include a grid structure. The grid structure may include a plurality of openings or a plurality of slits. The plurality of openings or a plurality of slits may contribute to the flexibility of the flexible display (120).

[0124] FIG. 12 shows the interior of an electronic device (101) including a metal plate (121) according to one embodiment.

[0125] Referring to FIG. 12, the electronic device (101) may include a metal plate (121), a display FPCB (1201), a connection pad (1202), a wire (1203), and an electrical connector (1204).

[0126] In one embodiment, a display FPCB (1201), a connection pad (1202), and / or an electrical connector (1204) may be disposed in an area corresponding to a first portion (121a) of the metal plate (121).

[0127] In one embodiment, the connection pad (1202) may be disposed on a first surface where the display FPCB (1201) faces the metal plate (121). In one example, the connection pad (1202) may be electrically connected to the display FPCB (1201). In one example, the connection pad (1202) may include a control circuit. In one example, the connection pad (1202) may include a DDI (display driver IC) and / or a TDDI (touch display driver IC). In one example, the connection pad (1202) may include a first connection pad (1202a) and / or a second connection pad (1202b). In one example, the first connection pad (1202a) and the second connection pad (1202b) may be formed integrally.

[0128] In one embodiment, a control circuit included in the first connection pad (1202a) can supply power to the second part (121b) of the metal plate (121) through the first wire (1203a). A control circuit included in the second connection pad (1202b) can supply power to the second part (121b) of the metal plate (121) through the second wire (1203b).

[0129] In one embodiment, the second portion (121b) having a grid structure of the metal plate (121) may include a heat cable and / or a heater electrode. In one example, the second portion (121b) of the metal plate (121), which receives power from a control circuit placed on the first connection pad (1202a) and / or the second connection pad (1202b), may generate heat using the heat cable or heater electrode.

[0130] In one embodiment, the display FPCB (1201) may include an area where a plurality of elements are placed and an electrical connector (1204) placed at the end of the display FPCB (1201) and electrically connected to a first PCB of an electronic device (101) (e.g., the first PCB (171) of FIG. 3).

[0131] FIG. 13a shows a cross-section AA' of the electronic device (101) of FIG. 12 according to one embodiment. FIG. 13b shows a cross-section BB' of the electronic device (101) of FIG. 12 according to one embodiment.

[0132] Referring to FIG. 13a, the second connection pad (1202b) may be placed in a portion (121a) of the metal plate (121). In another example, the second connection pad (1202b) may be attached to the first surface of the metal plate (121) facing the display FPCB (1201) through a connection member (1205).

[0133] In one example, the metal plate (121) can be attached to the display panel layer of the flexible display (120) via a connecting member (1506) (e.g., double-sided tape).

[0134] Referring to FIG. 13b, the second wire (1203b) may be formed integrally with a region corresponding to the first part (121a) of the metal plate (121). In another example, the second wire (1203b) may be placed on a region corresponding to the first part (121a) of the metal plate (121).

[0135] In one embodiment, the processor (510) can supply power to the second part (121b) through a second wire (1203b) disposed on the same plane as the second part (121b) of the metal plate (121). In one example, the second part (121b) that receives power can generate heat. The heat generated from the second part (121b) can enable the low-temperature flexible display (120) to maintain an appropriate temperature.

[0136] FIG. 14 shows the interior of an electronic device (101) including a metal plate (121) and a heating wire (1401) according to one embodiment.

[0137] Referring to FIG. 14, a heating element (1401) may be disposed in a portion corresponding to a second portion (121b) having a grid structure of the metal plate (121). In one example, the heating element (1401) may include a heat line and / or a heater electrode. In one example, a surface facing substantially the same direction as the direction in which the metal plate (121) faces may be defined as the front of the metal plate (121), and a surface facing the front may be defined as the rear of the metal plate (121). The heating element (1401) may be disposed in an area corresponding to the second portion (121b) of the front and / or rear of the metal plate (121).

[0138] In one embodiment, a control circuit included in the first connection pad (1202a) can supply power to the heating wire (1401) through the first wire (1402). A control circuit included in the second connection pad (1202b) can supply power to the heating wire (1401) through the second wire (1403). In one example, the heating wire (1401) receiving power from the control circuit placed in the first connection pad (1202a) and / or the second connection pad (1202b) can generate heat. The heat generated from the heating wire (1401) can be transferred to the flexible display (120).

[0139] FIG. 15a shows a cross-section AA' of the electronic device (101) of FIG. 14 according to one embodiment. FIG. 15b shows a cross-section BB' of the electronic device (101) of FIG. 14 according to one embodiment.

[0140] Referring to FIG. 15a, in one example, a heating wire (1401) may be placed in an area corresponding to a second part (121b) on the front of the metal plate (121). In one example, a step-compensating medium (1402) may be placed in a part corresponding to a first part (121a) on the front of the metal plate (121). In one example, the step-compensating medium (1402) may include tape, resin, or air.

[0141] In one example, the second connection pad (1202b) may be placed in a portion corresponding to the first portion (121a) on the front of the metal plate (121). In this case, a connection member (1205) may be placed in a portion of the first portion (121a) so that the second connection pad (1202b) and the display FPCB (1201) can be electrically connected.

[0142] Referring to FIG. 15b, in one example, a second wire (1403a) physically connected to the second connection pad (1202b) may be placed in a portion corresponding to the first portion (121a) on the front of the metal plate (121).

[0143] In one embodiment, when the ambient temperature of the flexible display (120) is low, the processor (510) can supply power to the heating wire (1401) through a second wire (1403a) placed on a plane parallel to the heating wire (1401). In one example, the heating wire (1401) supplied with power can generate heat. The heat generated from the heating wire (1401) can be transferred to a second part (120b) of the flexible display (120) to help the flexible display (120) maintain an appropriate temperature.

[0144] FIG. 16a shows a cross-section AA' of the electronic device (101) of FIG. 14 according to another embodiment. FIG. 16b shows a cross-section BB' of the electronic device (101) of FIG. 14 according to another embodiment.

[0145] Referring to FIG. 16a, in one example, a heating wire (1401) may be placed in an area corresponding to a second part (121b) on the rear surface of a metal plate (121). In one example, a step-compensating medium (1402) may be placed in an area corresponding to a first part (121a) on the rear surface of a metal plate (121).

[0146] Referring to FIG. 16b, in one example, a second wire (1203b) physically connected to the second connection pad (1202b) may be placed in a portion corresponding to the first portion (121a) on the rear surface of the metal plate (121).

[0147] FIG. 17 shows the interior of an electronic device (101) including a printed circuit board (170) according to one embodiment.

[0148] Referring to FIG. 17, the electronic device (101) may include a printed circuit board (170) and a display FPCB (1501). In one example, the printed circuit board (170) may include a first PCB (171), a second PCB (172), a third PCB (173), and a fourth PCB (174).

[0149] In one embodiment, the first PCB (171) corresponds to a main PCB, and a processor (e.g., the processor (510) of FIG. 5) may be placed on the first PCB (171). The second PCB (172) corresponds to an auxiliary PCB, and data obtained through a heat-generating component placed on the second PCB (172) may be transmitted to the processor (510) placed on the first PCB (171).

[0150] In one embodiment, the display FPCB (1501) may be connected to the first PCB (171) through a third PCB (173) (e.g., slide FPCB) and / or a fourth PCB (174).

[0151] In one embodiment, a processor (510) placed on the first PCB (171) can send an electrical signal to a control circuit placed on the display FPCB (1501) through the third PCB (173) and / or the fourth PCB (174). In one example, the control circuit placed on the display FPCB (1501) can supply power to a second part (121b) of the metal plate (121) through a battery (e.g., battery (180) of FIG. 3) based on the received electrical signal.

[0152] Hereinafter, with reference to FIGS. 18 to 20, the components required for a power-supplied support structure (140) to generate heat are described.

[0153] FIG. 18 shows the front and rear of an electronic device (101) including a support structure (140) according to one embodiment.

[0154] Referring to FIG. 18, the electronic device (101) may include a support structure (140). In one example, the support structure (140) may be attached to the rear of a second part (120b) of the flexible display (120).

[0155] In one embodiment, the support structure (140) can guide the bending of the flexible display (120) when the electronic device (101) is switched between a first state (101a) and a second state (101b).

[0156] FIG. 19 shows a support structure (140) and a rail member (162) according to one embodiment.

[0157] In one embodiment, the rail member (162) may include a first rail member (162a) and a second rail member (162b). In one example, the support structure (140) may guide the bending of the flexible display (120) using the first rail member (162a) and the second rail member (162b). In one example, the first rail member (162a) and the second rail member (162b) may include recesses so that they can be coupled with the support structure (140). In one example, the first rail member (162a) and / or the second rail member (162b) may be coupled with the support structure (140) to support the support structure (140).

[0158] FIG. 20 shows a first fixed member (161a) and a first rail member (162a) according to one embodiment.

[0159] Referring to FIG. 20, the first rail member (162a) may include a flange (163a) that protrudes inwardly into the electronic device (101). The first rail member (162a) may receive an electrical signal from the electronic device (101) (e.g., the processor (510) of FIG. 5) through the flange (163a). In one example, the description applied to the first rail member (162a) may be applied equally to the second rail member (162b).

[0160] FIG. 21 shows a structure for supplying power to a support structure (140) according to one embodiment.

[0161] Referring to FIG. 21, the support structure (140) can be combined with the first rail member (162a) through a region (e.g., a recessed area) of the first rail member (162a) to guide the bending of the flexible display (120).

[0162] In one embodiment, the first PCB (171) may be connected to a flange (163a) included in the first rail member (162a) through a connecting member (2101). In one example, the connecting member (2101) may include a c-clip. In one example, the connecting member (2101) may include a protrusion. By inserting the protrusion of the connecting member (2101) into at least one groove disposed in the flange (163a), the connecting member (2101) may come into contact with the flange (163a).

[0163] In one embodiment, the processor (510) can supply power to a support structure (140) coupled to a first rail member (162a) through a first PCB (171). In one example, the power-supplied support structure (140) can generate heat.

[0164] In one embodiment, the first rail member (162a) may include a shielding member (164) (e.g., insulating tape) to protect various components placed inside the electronic device (101). In one example, noise generated as power is transmitted to the support structure (140) through the first PCB (171) can be shielded through the shielding member (164). Additionally, electric shock that may occur through the conductive portion of the first rail member (162a) can be prevented.

[0165] FIG. 22 shows a structure that supplies power to a support structure (140) according to another embodiment.

[0166] In one embodiment, the display FPCB (1201) may include a first extension part (1201a) that can be connected to the upper part of the support structure (140) and a second extension part (1201b) that can be connected to the lower part of the support structure (140).

[0167] In one embodiment, the processor (510) can supply power to the support structure (140) through a first extension (1201a) and / or a second extension (1201b) connected to the display FPCB (1201). In one example, the support structure (140) supplied with power can generate heat.

[0168] FIG. 23 shows a cross-section AA' of the electronic device (101) of FIG. 22 according to one embodiment.

[0169] Referring to FIG. 23, a conductive connecting member (2305), a connecting pad (1202), a second extension part (1201b), a metal plate (121), a connecting member (2306), and a flexible display (120) may be arranged sequentially based on the back surface of the support structure (140).

[0170] In one embodiment, the connection pad (1202) may be attached to the back surface of the support structure (140) via a conductive connection member (2305) (e.g., conductive tape). In one example, the connection pad (1202) may be electrically connected to a second extension (1201b) extending from the display FPCB (1201). In one example, the processor (510) may supply power to the support structure (140) through the display FPCB (1201), the second extension (1201b) (and / or the first extension (1201a)), and the connection pad (1202). In one example, the power-supplying support structure (140) may generate heat.

[0171] FIG. 24 shows the interior of an electronic device (101) including electronic components according to one embodiment.

[0172] In one embodiment, the electronic device (101) may include components for dissipating heat emitted by a metal plate (121) comprising a driving unit (150), a support structure (140), and / or a flexible display (120).

[0173] Referring to FIG. 24, the first PCB (171) and the second PCB (172) may include a first surface facing the front of the electronic device (101) and a second surface facing the first surface.

[0174] In one embodiment, a heat-generating component (2404a) and a component for diffusing heat (e.g., a heat transfer material, a graphite sheet, and / or a vapor chamber) may be disposed on the first surface of the second PCB (172). In one example, the same component may be disposed on the second surface of the first PCB (171) so as to be symmetrical to the component disposed on the first surface of the second PCB (172).

[0175] In one embodiment, a high-temperature component (2404a), a third heat transfer member (2403a), a second heat transfer member (2402a) and / or a first heat transfer member (2401a) may be sequentially disposed on the first surface of the second PCB (172).

[0176] In one example, the first heat transfer member (2401a), the second heat transfer member (2402a), and the third heat transfer member (240a) may include a thermal interface material (TIM), a graphite sheet, a heat pipe, and / or a vapor chamber.

[0177] In one embodiment, a high-temperature component (2404b), a third heat transfer member (2403b), a second heat transfer member (2402b) and / or a first heat transfer member (2401b) may be sequentially disposed on the second surface of the first PCB (171).

[0178] In one embodiment, the heating component (2404a) may include an electronic component placed on the second PCB (172). The heating component (2404b) may include an electronic component placed on the first PCB (171). In one example, the heating component (2404a) and the heating component (2404b) may include a processor (510), a memory (e.g., memory (2830) of FIG. 28), a control circuit antenna module (e.g., antenna module (2897) of FIG. 28) and / or an interface (e.g., interface (2877) of FIG. 28).

[0179] In one embodiment, heat generated in a high-temperature component (2404a, 2404b), a driving unit (150), a support structure (140), and / or a metal plate (121) can be transferred to a first mid plate (132) and a second mid plate (133) through a first heat transfer member (2401a, 2401b), a second heat transfer member (2402a, 2402b), and / or a third heat transfer member (2403a, 2403b). The heat transferred to the first mid plate (132) and the second mid plate (133) can be transferred to an area within the flexible display (120) where rolling or sliding motion takes place.

[0180] FIG. 25 shows a portion of an electronic device (101) including a heat transfer structure (2510) according to one embodiment.

[0181] Referring to FIG. 25, a heat transfer structure (2510) may be placed between the sliding cover (131) and the first mid plate (132).

[0182] In one embodiment, the heat transfer structure (2510) may include a first heat transfer structure (2511) and a second heat transfer structure (2512). In one example, the first heat transfer structure (2511) may be disposed on the surface facing the sliding cover (131) on the first mid plate (132). The second heat transfer structure (2512) may be disposed on the surface facing the first mid plate (132) on the sliding cover (131).

[0183] In one embodiment, the heat transfer structure (2510) may include any one of a thermal interface material (TIM), a heat dissipation fiber, or graphite, or a combination thereof.

[0184] In one embodiment, the heat transfer structure (2510) may be positioned between the second mid plate (133) and the rear cover (134).

[0185] FIG. 26a shows a heat generation path of an electronic device (101) that switches to a first state (101a) according to one embodiment. FIG. 26b shows a heat generation path of an electronic device (101) that switches to a second state (101b) according to one embodiment.

[0186] Referring to FIG. 26a, when the second part (120b) of the flexible display (120) is introduced into the interior of the electronic device (101), the processor (510) can supply power to the heating component (2404a). In one example, the heating component (2404a) that receives power generates heat and transfers heat to the flexible display (120) to prevent damage to the flexible display (120) due to low temperature.

[0187] Referring to FIG. 26b, when the second part (120b) of the flexible display (120) is drawn out of the electronic device (101), the processor (510) can supply power to the heating component (2404b). The heating component (2404a) that receives power generates heat and transfers heat to the flexible display (120), thereby preventing damage to the flexible display (120) due to low temperature.

[0188] FIG. 27a shows a circuit for controlling the temperature of an electronic device (101) according to one embodiment. FIG. 27b shows a circuit for controlling the temperature of an electronic device (101) according to another embodiment. FIG. 27c shows a circuit for controlling the temperature of an electronic device (101) according to another embodiment.

[0189] In one embodiment, the electronic device (101) may include a processor (510), a power circuit (2720), and a heating element (2710). In one example, the power circuit (2720) may receive a signal from the processor (510) and supply power to the heating element (2710).

[0190] In one embodiment, the heating element (2710) may include a metal plate (121), a support structure (140), a driving part (150), and / or a heating component (530).

[0191] In one embodiment, the processor (510) can control the amount of power supplied to the heating element (2710) based on the ambient temperature of the flexible display (120) obtained through the temperature sensing sensor (520). For example, if the detected temperature is less than a first temperature, the processor (510) can supply a first power to the heating element (2710). If the detected temperature is less than a second temperature which is lower than the first temperature, the processor (510) can supply a second power higher than the first power to the heating element (2710).

[0192] Referring to FIG. 27a, the processor (510) can control the magnitude of power supplied to the heating element (2720) by controlling the variable resistor (2721) of the power circuit (2720). In one example, the power circuit (2720) determines the magnitude of the variable resistor (2721) in response to a signal received from the processor (510), thereby controlling the magnitude of power supplied to the heating element (2710).

[0193] Referring to FIG. 27b, the processor (510) can control the magnitude of power supplied to the heating element (2710) through a pulse width modulation (PWM) control signal. In one example, the processor (510) can control the magnitude of power supplied to the heating element (2710) by the power circuit (2720) by changing the pulse width.

[0194] Referring to FIG. 27c, the power circuit (2720) may include a feedback control circuit (not shown). The power circuit (2720) may output power based on a signal received from the processor (510). The power circuit (2720) may detect a feedback voltage for the power and supply power to the heating element (2710) based on the feedback voltage.

[0195] FIG. 28 is a block diagram of an electronic device (2801) in a network environment (2800) according to various embodiments.

[0196] Referring to FIG. 28, in a network environment (2800), an electronic device (2801) may communicate with an electronic device (2802) through a first network (2898) (e.g., a short-range wireless communication network) or with an electronic device (2804) or a server (2808) through a second network (2899) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (2801) may communicate with the electronic device (2804) through a server (2808). According to one embodiment, the electronic device (2801) may include a processor (2820), memory (2830), input module (2850), sound output module (2855), display module (2860), audio module (2870), sensor module (2876), interface (2877), connection terminal (2878), haptic module (2879), camera module (2880), power management module (2888), battery (2889), communication module (2890), subscriber identification module (2896), or antenna module (2897). In some embodiments, at least one of these components (e.g., connection terminal (2878)) may be omitted from the electronic device (2801), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (2876), camera module (2880), or antenna module (2897)) may be integrated into a single component (e.g., display module (2860)).

[0197] The processor (2820) can, for example, execute software (e.g., program (2840)) to control at least one other component (e.g., hardware or software component) of the electronic device (2801) connected to the processor (2820) and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (2820) can store commands or data received from other components (e.g., sensor module (2876) or communication module (2890)) in volatile memory (2832), process the commands or data stored in volatile memory (2832), and store the resulting data in non-volatile memory (2834). According to one embodiment, the processor (2820) may include a main processor (2821) (e.g., a central processing unit or an application processor) or an auxiliary processor (2823) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (2801) includes a main processor (2821) and an auxiliary processor (2823), the auxiliary processor (2823) may be configured to use less power than the main processor (2821) or to be specialized for a designated function. The auxiliary processor (2823) may be implemented separately from the main processor (2821) or as part thereof.

[0198] The auxiliary processor (2823) may control at least some of the functions or states associated with at least one component of the electronic device (2801) (e.g., display module (2860), sensor module (2876), or communication module (2890)) on behalf of the main processor (2821) while the main processor (2821) is in an inactive (e.g., sleep) state, or together with the main processor (2821) while the main processor (2821) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (2823) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (2880) or communication module (2890)). According to one embodiment, the auxiliary processor (2823) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (2801) itself where the artificial intelligence is performed, or through a separate server (e.g., server (2808)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0199] The memory (2830) can store various data used by at least one component of the electronic device (2801) (e.g., processor (2820) or sensor module (2876)). The data may include, for example, input data or output data for software (e.g., program (2840)) and related commands. The memory (2830) may include volatile memory (2832) or non-volatile memory (2834).

[0200] The program (2840) may be stored as software in memory (2830) and may include, for example, an operating system (2842), middleware (2844), or an application (2846).

[0201] The input module (2850) can receive commands or data to be used for a component of the electronic device (2801) (e.g., processor (2820)) from outside the electronic device (2801) (e.g., user). The input module (2850) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0202] The sound output module (2855) can output a sound signal to the outside of the electronic device (2801). The sound output module (2855) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0203] The display module (2860) can visually provide information to an external (e.g., user) of the electronic device (2801). The display module (2860) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (2860) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0204] The audio module (2870) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (2870) can acquire sound through the input module (2850) or output sound through the sound output module (2855) or an external electronic device (e.g., electronic device (2802)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (2801).

[0205] The sensor module (2876) can detect the operating state of the electronic device (2801) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (2876) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0206] The interface (2877) may support one or more specified protocols that can be used for the electronic device (2801) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (2802)). According to one embodiment, the interface (2877) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0207] The connection terminal (2878) may include a connector through which the electronic device (2801) can be physically connected to an external electronic device (e.g., electronic device (2802)). According to one embodiment, the connection terminal (2878) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0208] The haptic module (2879) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (2879) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0209] The camera module (2880) can capture still images and video. According to one embodiment, the camera module (2880) may include one or more lenses, image sensors, image signal processors, or flashes.

[0210] The power management module (2888) can manage power supplied to the electronic device (2801). According to one embodiment, the power management module (2888) may be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0211] The battery (2889) can supply power to at least one component of the electronic device (2801). According to one embodiment, the battery (2889) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0212] The communication module (2890) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (2801) and an external electronic device (e.g., electronic device (2802), electronic device (2804), or server (2808)), and the performance of communication through the established communication channel. The communication module (2890) may include one or more communication processors that operate independently of the processor (2820) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (2890) may include a wireless communication module (2892) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (2894) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (2804) via a first network (2898) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (2899) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (2892) can identify or authenticate the electronic device (2801) within a communication network such as the first network (2898) or the second network (2899) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (2896).

[0213] The wireless communication module (2892) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (2892) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (2892) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (2892) can support various requirements specified in the electronic device (2801), external electronic device (e.g., electronic device (2804)), or network system (e.g., second network (2899)). According to one embodiment, the wireless communication module (2892) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0214] An antenna module (2897) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (2897) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (2897) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (2898) or a second network (2899), may be selected from the plurality of antennas, for example, by a communication module (2890). A signal or power may be transmitted or received between the communication module (2890) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (2897).

[0215] According to various embodiments, the antenna module (2897) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0216] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0217] According to one embodiment, commands or data may be transmitted or received between the electronic device (2801) and an external electronic device (2804) through a server (2808) connected to a second network (2899). Each of the external electronic devices (2802, or 2804) may be the same or a different type of device as the electronic device (2801). According to one embodiment, all or part of the operations performed on the electronic device (2801) may be performed on one or more of the external electronic devices (2802, 2804, or 2808). For example, if the electronic device (2801) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (2801) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (2801). The electronic device (2801) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (2801) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (2804) may include an Internet of Things (IoT) device. The server (2808) may be an intelligent server using machine learning and / or neural networks.According to one embodiment, an external electronic device (2804) or server (2808) may be included within the second network (2899). The electronic device (2801) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0218] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0219] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationally,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0220] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0221] Various embodiments of this document may be implemented as software (e.g., program (2840)) comprising one or more instructions stored in a storage medium (e.g., internal memory (2836) or external memory (2838)) readable by a machine (e.g., electronic device (2801)). For example, a processor (e.g., processor (2820)) of the machine (e.g., electronic device (2801)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0222] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0223] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0224] According to various embodiments, an electronic device comprises: a housing including a first housing forming the side and rear of the electronic device and a second housing connected to the first housing so as to be slidable within a designated range; a heating component disposed in at least one area of ​​the first housing and the second housing; a driving unit disposed in one area within the housing; a flexible display comprising a metal plate, wherein at least one area is visible to the outside of the electronic device through the front of the electronic device; the flexible display comprises a first portion exposed to the outside of the housing and a second portion extending from the first portion and being drawn into or drawn out of the housing as the second housing moves relative to the first housing; a support structure attached to the rear of the second portion; at least one temperature sensing sensor disposed within the housing; and at least one processor electrically connected to the heating component, the driving unit, the flexible display, the support structure, or the temperature sensing sensor, wherein the at least one processor is connected to the second portion of the flexible display disposed through the at least one temperature sensing sensor. A temperature in a region is detected, and whether an event to move the second housing occurs is determined. When an event to move the second housing occurs, if the detected temperature is greater than or equal to a first temperature, the movement speed of the second housing is controlled to a first driving speed. When an event to move the second housing occurs, if the detected temperature is less than the first temperature, the movement speed of the second housing is controlled to a second driving speed different from the first driving speed, or the movement of the second housing is restricted. A first power can be supplied to at least one of the heating component, the driving unit, the metal plate, or the support structure.

[0225] According to various embodiments, the first driving speed may be faster than the second driving speed.

[0226] According to various embodiments, the at least one processor may restrict the movement of the second housing when an event occurs that moves the second housing and the detected temperature is lower than the first temperature.

[0227] According to various embodiments, the support structure may include a plurality of bars.

[0228] According to various embodiments, when an event occurs in which the second housing is moved, and the detected temperature is lower than the first temperature, the at least one processor can supply a second power higher than the first power to at least one of the heating component, the driving unit, the metal plate, or the support structure.

[0229] According to various embodiments, the at least one processor may output a notification as it controls the second driving speed or restricts the movement of the second housing.

[0230] According to various embodiments, the at least one processor may output a screen as a notification indicating that the movement speed of the second housing is controlled to the second driving speed or that the movement of the second housing is restricted through the flexible display.

[0231] According to various embodiments, the at least one processor may limit the supply of power to at least one of the driving unit, the metal plate, or the support structure when the function is currently being performed or is scheduled to be performed through the heat-generating component.

[0232] According to various embodiments, the metal plate includes a pattern structure in the second part of the flexible display, and the at least one processor can supply the first power to the pattern structure of the metal plate.

[0233] According to various embodiments, the electronic device may include at least one of graphite, TIM (thermal interface material), or vapor chamber at a location adjacent to the second part of the flexible display.

[0234] According to various embodiments, a method of operation of an electronic device comprising a housing including a first housing and a second housing movable relative to the first housing, and a flexible display including a first portion exposed to the outside of the housing and a second portion extending from the first portion, wherein the method comprises: detecting an ambient temperature in an area where the second portion of the flexible display is disposed through a temperature sensing sensor disposed within the electronic device; determining whether an event to move the second housing occurs; if an event to move the second housing occurs and the detected temperature is greater than or equal to a first temperature, controlling the movement speed of the second housing to a first driving speed; if an event to move the second housing occurs and the detected temperature is less than the first temperature, controlling the movement speed of the second housing to a second driving speed different from the first driving speed or restricting the movement of the second housing; and a heating component disposed in at least one area among the first housing and the second housing, a driving unit disposed in one area of ​​the housing, a metal plate included in the flexible display, and the second portion It may include an operation of supplying a first power to at least one of the support structures attached to the rear.

[0235] According to various embodiments, the first driving speed may be faster than the second driving speed.

[0236] According to various embodiments, if an event occurs that moves the second housing and the detected temperature is lower than the second temperature which is lower than the first temperature, the operation to restrict the movement of the second housing may be included.

[0237] According to various embodiments, when an event occurs that moves the second housing and the detected temperature is lower than the first temperature, the operation may include supplying a second power to at least one of the heating component, the driving unit, the metal plate, or the support structure.

[0238] According to various embodiments, the driving unit may include at least one of a roller or a motor.

[0239] According to various embodiments, the operation may include outputting a notification by controlling at the second driving speed or by restricting the movement of the second housing.

[0240] According to various embodiments, the operation may include outputting a screen as a notification indicating that the second driving speed is controlled or the movement of the second housing is restricted through the flexible display.

[0241] According to various embodiments, when a function is being performed or is scheduled to be performed through the heating component, the operation may include limiting the supply of the first power to at least one of the driving unit, the metal plate, or the support structure.

[0242] According to various embodiments, the metal plate may include a pattern structure in the second part of the flexible display and may include an operation of providing the first power to the pattern structure of the metal plate.

[0243] According to various embodiments, the electronic device may include at least one of graphite, TIM (thermal interface material), or vapor chamber at a location adjacent to the second part of the flexible display.

Claims

Claim 1 An electronic device comprises: a housing including a first housing and a second housing slidably connected to the first housing; a flexible display having at least one region visible to the outside of the electronic device through the front of the electronic device; the flexible display comprising a first portion exposed to the outside of the housing and a second portion extending from the first portion and being drawn into or drawn out of the housing as the second housing moves relative to the first housing; a support structure attached to the rear of the second portion; and at least one temperature sensing sensor disposed within the housing. An electronic device comprising at least one processor electrically connected to the temperature sensing sensor, wherein the at least one processor: detects the temperature in an area where a second part of the flexible display is placed through the at least one temperature sensing sensor, determines whether an event to move the second housing occurs, and when the event to move the second housing occurs, if the detected temperature is greater than or equal to a first temperature, controls the movement speed of the second housing to a first driving speed, and when the event to move the second housing occurs, if the detected temperature is less than the first temperature, controls the movement speed of the second housing to a second driving speed slower than the first driving speed or limits the movement of the second housing. Claim 2 delete Claim 3 An electronic device according to claim 1, wherein at least one processor restricts the movement of the second housing when an event occurs in which the second housing is moved and the detected temperature is lower than a second temperature which is lower than the first temperature. Claim 4 An electronic device according to claim 1, wherein the support structure comprises a plurality of bars. Claim 5 An electronic device according to claim 1, further comprising: a heating component disposed in at least one of the first housing and the second housing; and a driving unit disposed within the housing, wherein the flexible display comprises a metal plate, and the at least one processor comprises: supplying a first power to at least one of the heating component, the driving unit, the metal plate, and the support structure; and, when an event occurs in which the second housing is moved and the detected temperature is less than a second temperature lower than the first temperature, supplying a second power higher than the first power to at least one of the heating component, the driving unit, the metal plate, or the support structure. Claim 6 An electronic device according to claim 1, wherein the at least one processor outputs a notification as it controls the second driving speed or limits the movement of the second housing. Claim 7 An electronic device according to claim 6, wherein the at least one processor outputs a screen through the flexible display indicating that the movement speed of the second housing is controlled to the second driving speed or that the movement of the second housing is restricted as a notification. Claim 8 An electronic device according to claim 1, further comprising: a heating element disposed in at least one of the first housing and the second housing; and a driving element disposed within the housing, wherein the flexible display comprises a metal plate, and the at least one processor limits the supply of power to at least one of the driving element, the metal plate, or the support structure when the processor is performing or is scheduled to perform a function through the heating element. Claim 9 An electronic device according to claim 1, wherein the flexible display comprises a metal plate, the metal plate comprises a pattern structure in the second portion of the flexible display, and the at least one processor supplies a first power to the pattern structure of the metal plate. Claim 10 The electronic device of claim 1, wherein the electronic device comprises at least one of graphite, a thermal interface material (TIM), or a vapor chamber at a location adjacent to the second portion of the flexible display. Claim 11 A method of operation of an electronic device comprising a housing including a first housing and a second housing movable relative to the first housing, and a flexible display including a first portion exposed to the outside of the housing and a second portion extending from the first portion, the method comprising: detecting an ambient temperature in an area where the second portion of the flexible display is disposed through a temperature sensing sensor disposed within the electronic device; determining whether an event to move the second housing occurs; if an event to move the second housing occurs and the detected temperature is greater than or equal to a first temperature, controlling the movement speed of the second housing to a first driving speed; if an event to move the second housing occurs and the detected temperature is less than the first temperature, controlling the movement speed of the second housing to a second driving speed slower than the first driving speed or restricting the movement of the second housing. A method comprising the operation of supplying a first power to at least one of a heating component disposed in at least one area of ​​the first housing and the second housing, a driving unit disposed in one area of ​​the housing, a metal plate included in the flexible display, and a support structure attached to the rear surface of the second part. Claim 12 delete Claim 13 A method according to claim 11, comprising an operation to restrict the movement of the second housing when an event occurs that moves the second housing and the detected temperature is lower than a second temperature which is lower than the first temperature. Claim 14 A method according to claim 11, comprising the operation of supplying a second power to at least one of the heating component, the driving unit, the metal plate, or the support structure when an event occurs that moves the second housing and the detected temperature is lower than the first temperature. Claim 15 The method of claim 11, wherein the driving unit comprises at least one of a roller or a motor. Claim 16 A method according to claim 11, comprising the operation of outputting a notification by controlling the second driving speed or restricting the movement of the second housing. Claim 17 A method according to claim 16, comprising the operation of outputting a screen as a notification indicating that the second driving speed is controlled or the movement of the second housing is restricted through the flexible display. Claim 18 A method according to claim 11, comprising an operation to limit the supply of the first power to at least one of the driving unit, the metal plate, or the support structure when the function is being performed or is scheduled to be performed through the heating component. Claim 19 A method according to claim 11, wherein the metal plate includes a pattern structure in the second portion of the flexible display and includes the operation of providing the first power to the pattern structure of the metal plate. Claim 20 The method of claim 11, wherein the electronic device comprises at least one of graphite, TIM (thermal interface material), or vapor chamber at a location adjacent to the second portion of the flexible display.

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