Substrate processing apparatus and leakage detection method

Abstract

We provide a technology capable of detecting leakage from the flow path of a structure provided inside a vacuum vessel with high precision. A substrate processing device processes a substrate. The substrate processing device comprises a vacuum vessel having an internal space capable of depressurizing to a vacuum environment, a structure provided inside the vacuum vessel having a flow path through which a liquid temperature control medium flows, a pressure measuring device provided in a temperature control medium path communicating with the flow path to measure the pressure of the temperature control medium, and a notification device that notifies information regarding a decrease in the pressure value when the pressure value measured by the pressure measuring device becomes below a preset threshold.

Description

Technology Field

[0001] The present disclosure relates to a substrate processing apparatus and a leak detection method. Background Technology

[0002] A substrate processing device is equipped with a substrate transport device (structure) within a vacuum transport module capable of depressurizing to a vacuum environment. Additionally, to regulate the temperature of the substrate being transported, the substrate processing device circulates a temperature control medium (e.g., cooling water) through a flow path formed inside the transport device. If the temperature control medium leaks from the flow path of the transport device, there is a risk of problems occurring, such as corrosion within the vacuum transport module or process abnormalities caused by pressure fluctuations. Therefore, the substrate processing device is required to detect leakage within the vacuum transport module at an early stage.

[0003] Although it is not a vacuum conveying module, for example, Patent Document 1 discloses a technology for detecting a leaked temperature control medium by a leak sensor in a chiller unit placed under an atmospheric environment. Prior art literature

[0004] Japanese Patent Publication No. 2020-190494 The problem to be solved

[0005] The present disclosure provides a technology capable of detecting leakage from a flow path of a structure provided within a vacuum vessel with high precision. means of solving the problem

[0006] According to one aspect of the present disclosure, a substrate processing apparatus for processing a substrate is provided, comprising: a vacuum vessel having an internal space capable of reducing pressure to a vacuum environment; a structure provided inside the vacuum vessel having a flow path through which a liquid temperature control medium flows; a pressure measuring device provided in a temperature control medium path communicating with the flow path to measure the pressure of the temperature control medium; and a notification device that notifies information regarding a decrease in the pressure value when the pressure value measured by the pressure measuring device becomes below a preset threshold. Effects of the invention

[0007] According to one embodiment, leakage from the flow path of a structure provided within a vacuum vessel can be detected with high precision. Brief explanation of the drawing

[0008] FIG. 1 is a schematic plan view showing a substrate processing apparatus according to one embodiment. Figure 2 is a schematic side view showing the conveying device of the vacuum conveying module. Figure 3 is an explanatory diagram showing the configuration of the regulator box of the external temperature control device. Figure 4 is a partial side view schematically showing the installation status of the vacuum conveying module and the regulator box. Figure 5 is an explanatory diagram of a leak detection method, (A) shows pressure measurement accompanying leakage of cooling water from the flow path of the return device, and (B) is a graph showing the relationship between the amount of leakage from the flow path and the pressure value of the pressure switch. Figure 6 is a flowchart showing the processing flow of the leak detection method. Specific details for implementing the invention

[0009] Hereinafter, embodiments for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant descriptions may be omitted.

[0010] FIG. 1 is a schematic plan view showing a substrate processing apparatus (1) according to one embodiment. As shown in FIG. 1, the substrate processing apparatus (1) according to one embodiment is configured as a multi-chamber type having a plurality of vacuum vessels capable of processing a substrate in a vacuum environment. For example, the substrate processing apparatus (1) performs substrate processing such as etching of a metal film or insulating film, ashing of a photoresist, and film formation on a substrate for an FPD formed of glass material (hereinafter simply referred to as substrate G).

[0011] FPDs manufactured by processing substrate G include Liquid Crystal Displays (LCDs), Electro-Luminescence (ELs), and Plasma Display Panels (PDPs). Additionally, as a material for substrate G, synthetic resins or the like may be used in addition to glass. Substrate G may be either a substrate with a circuit patterned on its surface or a support substrate without a circuit. The planar dimensions of substrate G are not particularly limited, but, for example, the long side may be in the range of approximately 1800 mm to 3400 mm and the short side may be in the range of approximately 1500 mm to 3000 mm.

[0012] Specifically, the substrate processing device (1) includes one vacuum transport module (10), a plurality of process modules (20), and one load lock module (30). In addition, the substrate processing device (1) has a control unit (60) that controls the operation of each module.

[0013] A vacuum conveying module (10) is positioned at the center of a substrate processing device (1) and conveys a substrate G to a plurality of process modules (20) and load lock modules (30). This vacuum conveying module (10) is equipped with a vacuum container for conveying (one example of a vacuum container) (11) and a vacuum conveying device (vacuum conveying robot: hereinafter simply referred to as a conveying device (12)) installed inside the vacuum container for conveying the substrate G.

[0014] The return vacuum container (11) is formed in a box shape that is approximately hexagonal when viewed in planar form and has an internal space (11a) inside the container. The return vacuum container (11) can reduce the internal space (11a) to a vacuum environment by means of a pressure reduction mechanism not shown. The substrate processing device (1) has a load lock module (30) connected to one side of the return vacuum container (11) and process modules (20) connected to the remaining five sides of the return vacuum container (11).

[0015] Between the vacuum container (11) for return and each process module (20), a gate valve (21) is provided that allows the substrate G to pass through, communicating with each other's space. Inside each gate valve (21), a valve body (22) is installed to open and close the inlet / outlet on the process module (20) side. Likewise, between the vacuum container (11) for return and the load lock module (30), a gate valve (31) is provided that allows the substrate G to pass through, communicating with each other's space. Inside the gate valve (31), a valve body (32) is installed to open and close the inlet / outlet on the vacuum container (11) side.

[0016] Each process module (20) is provided with a processing vessel (an example of a vacuum vessel) (23) having an internal space (23a) and a loading platform (24) for loading a substrate G within the processing vessel (23). Each process module (20) transfers the substrate G onto the loading platform (24) by means of a vacuum transport module (10), then depressurizes the internal space (23a) by means of a depressurization mechanism not shown, generates plasma, and performs substrate processing. As described above, substrate processing may include etching, ashing, and film deposition. The process module (20) may be configured to perform substrate processing that does not generate plasma within the internal space (23a). Furthermore, the five process modules (20) of the substrate processing device (1) may perform the same substrate processing together, or may perform different types of substrate processing for each of the process modules (20).

[0017] The load lock module (30) performs the receipt or transfer of substrate G between a load module (not shown) in an atmospheric environment and a vacuum transport module (10) in a vacuum environment. For this reason, the load lock module (30) has a load lock container (one example of a vacuum container) (33) having an internal space that can be switched between an atmospheric environment and a vacuum environment. Between the load lock module (30) and the load module, a gate valve (34) is provided that communicates with the space between them and allows substrate G to pass through. Inside the gate valve (34), a valve body (35) is installed to open and close the inlet / outlet on the load lock module (30) side. Additionally, the load lock container (33) may separately provide an inlet space for bringing substrate G into the vacuum transport module (10) and an outlet space for taking substrate G out to the load module in the vertical direction.

[0018] FIG. 2 is a schematic side view showing a conveying device (12) of a vacuum conveying module (10). As shown in FIG. 1 and FIG. 2, the conveying device (12) of the vacuum conveying module (10) conveys substrate G in a vacuum environment in which the inside of the vacuum container (11) for conveying is depressurized. For example, the conveying device (12) moves back and forth from the vacuum conveying module (10) to each process module (20) to bring in and take out substrate G between each process module (20). In addition, the conveying device (12) moves back and forth from the vacuum conveying module (10) to the load lock module (30) to bring in and take out substrate G between the load lock module (30).

[0019] Specifically, the conveying device (12) has a fixed shaft (13), a support shaft (14), a rotating operating part (15), a lifting operating part (16), a base (17), a slider unit (18), and an end effector (19).

[0020] The fixed shaft (13) is formed in a cylindrical shape extending in the vertical direction. The upper end of the fixed shaft (13) is inserted into a vacuum container (11) for transport and is fixed to the vacuum container (11) for transport. The fixed shaft (13) is fixed in a suitable configuration that supports the vacuum transport module (10) on the outside of the vacuum container (11) for transport. A support shaft (14) is arranged on the inner axis of the fixed shaft (13) to follow the axial direction of the fixed shaft (13).

[0021] The support shaft (14) is provided to support the base (17) at its upper end, and is also rotatably and vertically movable relative to the fixed shaft (13). That is, the conveying device (12) rotates the components (base (17), slider unit (18), end effector (19)) supported by the support shaft (14) by rotating the support shaft (14) around the axis by θ. In addition, the conveying device (12) raises the components supported by the support shaft (14) by raising the support shaft (14) in the vertical direction.

[0022] The rotary operating unit (15) has a motor and a drive transmission mechanism not shown and is connected to the control unit (60). The rotary operating unit (15) rotates the motor based on the command of the control unit (60) and transmits the driving force of the motor to the support shaft (14) by the drive transmission mechanism, thereby rotating the support shaft (14) around the axis. The conveying device (12) adjusts the direction of the end effector (19) around the θ-axis by the rotation of the support shaft (14). By doing so, the conveying device (12) can position the leading edge of the end effector (19) facing forward toward each process module (20) or load lock module (30).

[0023] The lifting operation unit (16) has a driving source (cylinder, motor, etc.) not shown and a driving transmission mechanism, and is connected to the control unit (60). The lifting operation unit (16) drives the driving source based on the command of the control unit (60) and transmits the driving force to the support shaft (14) by the driving transmission mechanism, thereby lifting the support shaft (14). The conveying device (12) adjusts the height of the end effector (19) by the lifting of the support shaft (14). For example, the conveying device (12) can move the end effector (19) forward and backward to each space by adjusting the height of the end effector (19) to the internal space for receiving or the internal space for taking out, which are located at different heights in the load lock module (30).

[0024] The base (17) is a member that supports the slider unit (18) and the end effector (19), and extends along the sliding direction of the slider unit (18). Inside the base (17), electronic components for operating the slider unit (18), a timing belt (not shown), etc. are accommodated.

[0025] The slider unit (18) has one or more rails (181), a movable body (182) movable along the rail (181), and an operating part (including a timing belt) not shown that operates the movable body (182). The movable body (182) supports an end effector (19). The operating part is connected to a control unit (60) and slides the movable body (182) along the rail (181) based on a command from the control unit (60).

[0026] The end effector (19) moves horizontally in accordance with the slide of the movable body (182). By doing so, the end effector (19) advances and retracts into the interior of each process module (20) or the interior of the load lock module (30).

[0027] For example, the end effector (19) has a plurality of support peaks (191) that contact and support the lower surface of the substrate G. The conveying device (12) transfers or receives the substrate G between a plurality of lift pins (not shown) of each process module (20) by moving each support peak (191) above the loading platform (24) of each process module (20). Additionally, the conveying device (12) transfers or receives the substrate G between the load lock module (30) by introducing each support peak (191) into a groove formed in the loading platform (not shown) of the load lock module (30).

[0028] In addition, the vacuum transport module (10) is equipped with an internal temperature control mechanism (40) in the transport device (12) for cooling electronic components, etc. Furthermore, in this embodiment, the internal temperature control mechanism (40) may be equipped with a heating function to heat or maintain the temperature of the substrate G in addition to the cooling function.

[0029] In detail, the internal temperature control mechanism (40) includes a cooling plate (temperature control plate) (41) provided on the base (17), a passage (41a) formed inside the cooling plate (41) through which cooling water can flow, and a passage (42) through which cooling water (temperature control medium) flows to the cooling plate (41). Additionally, the passage (42) has an internal supply passage (43) for supplying cooling water to the cooling plate (41) and an internal discharge passage (44) for discharging cooling water from the cooling plate (41). The temperature control medium is a liquid fluid (liquid), and is not limited to water (H2O) in particular, but may be any of other commonly used refrigerants such as methanol, ethanol, ethylene glycol, etc.

[0030] The internal supply channel (43) and the internal discharge channel (44) are composed of a plurality of pipes (43a, 44a) provided inside the support shaft (14) and inside the base (17). Each pipe (43a) is connected to each other by a joint not shown. Each pipe (44a) is also connected to each other by a joint not shown. One end of the internal supply channel (43) is connected to an inlet side connector (141) provided on the support shaft (14) extending outside the vacuum container (11) for return. The other end of the internal supply channel (43) is connected to the inlet side of the communication channel (41a) of the cooling plate (41) through the pipe (43a). Additionally, one end of the internal discharge channel (44) is connected to an outlet side connector (142) provided on the support shaft (14) extending outside the vacuum container (11) for return. The other end of the internal discharge path (44) is connected to the outlet side of the passage (41a) of the cooling plate (41) through the pipe (44a).

[0031] The internal temperature control mechanism (40) of the conveying device (12) is connected to an external temperature control device (50) installed outside (atmospheric environment) of the conveying vacuum container (11). The external temperature control device (50) is provided with a chiller unit (51) and a temperature control medium path (52) that circulates cooling water between the chiller unit (51) and the conveying device (12). The temperature control medium path (52) is provided with an external supply path (52A) that supplies cooling water to the conveying device (12) and an external discharge path (52B) that returns the cooling water circulated within the conveying device (12) to the chiller unit (51). Additionally, the external temperature control device (50) has a regulator box (54) that regulates the pressure of the cooling water at an intermediate position in the external supply path (52A).

[0032] The chiller unit (51) circulates the cooling water between the return device (12) and the cooling water while adjusting the temperature of the cooling water. The chiller unit (51) is equipped within the housing with a tank for storing the cooling water, a pump for pressurizing the cooling water to an external supply path (52A), a heat exchanger for cooling the cooling water recovered from the return device (12), etc. (all not shown).

[0033] The temperature control medium path (52) is composed of, for example, a plurality of hoses having flexibility and pressure resistance. This makes it possible to supply the temperature control medium to the cooling plate (41) even when the base (17) rotates. At one end of the external supply path (52A), a connection connector (53a) connected to the inlet side connector (141) is provided. Likewise, at one end of the external discharge path (52B), a connection connector (53b) connected to the outlet side connector (142) is provided.

[0034] FIG. 3 is an explanatory diagram showing the configuration of a regulator box (54) of an external temperature control device (50). As shown in FIG. 3, the regulator box (54) has a case (541) and an inlet side joint (542) and an outlet side joint (543) to which each hose of an external supply path (52A) is connected. A hose of the external supply path (52A) fixed to the inlet side joint (542) is connected to a chiller unit (51), while a hose of the external supply path (52A) fixed to the outlet side joint (543) is connected to a return device (12).

[0035] The regulator box (54) is located inside the case (541) and has an internal path (544) extending between the inlet side joint (542) and the outlet side joint (543). The internal path (544) is composed of, for example, a plurality of metal pipes. Additionally, the regulator box (54) is equipped with a stop valve (545), a regulator (546), and a pressure switch (547) in sequence from the upstream side (inlet side joint (542)) of the internal path (544) to the downstream side (outlet side joint (543)). A user of the substrate processing device (1) can operate the stop valve (545) or the regulator (546) by separating an unillustrated cover portion constituting the case (541). The pressure switch (547) may be installed between the external discharge path (52B).

[0036] The stop valve (545) is connected to the control unit (60) and is an open / close valve capable of opening and closing the flow path of the internal path (544) under the control of the control unit (60). For example, the stop valve (545) is open during normal operation of the vacuum conveying module (10) and is closed in the event of an abnormality in the vacuum conveying module (10), such as leakage of the conveying device (12). By doing so, the external temperature control device (50) can block the inflow of cooling water into the vacuum container (11) for conveying.

[0037] The regulator (546) is connected to the control unit (60) and adjusts the pressure on the downstream side of the regulator (546) to a set pressure Pr (see (B) in FIG. 5) indicated by the control unit (60), thereby maintaining the set pressure Pr. The set pressure Pr is not particularly limited, but, for example, it may be set to a range of about 0.1 MPa to 1 MPa. The regulator (546) in this embodiment has a set pressure Pr of 0.3 MPa. Additionally, the set pressure Pr of the regulator (546) may be adjusted by manual operation by a user.

[0038] The pressure switch (547) is provided on the downstream side (secondary side) of the regulator (546) and functions as a pressure measuring device for measuring the downstream pressure that is constantly regulated by the regulator (546). The pressure switch (547) is connected to the control unit (60) and transmits information on the measured pressure (signal of pressure drop) to the control unit (60). The precision of the pressure measurement of the pressure switch (547) may vary depending on the set pressure Pr of the regulator (546), but it is preferable to set it to a unit of, for example, about 0.01 MPa. Additionally, the pressure switch (547) should be used such that the pressure measurement error is smaller than ±0.05 MPa.

[0039] The pressure switch (547) in this embodiment has the function of transmitting a pressure drop signal to the control unit (60) when the pressure value of the cooling water becomes less than or equal to a predetermined value. Upon receiving this pressure drop signal, the control unit (60) can issue an alarm, change the flow rate of the cooling water of the chiller unit (51), or take measures such as stopping the operation of the external temperature control device (50).

[0040] FIG. 4 is a partial side view schematically showing the installation state of the vacuum conveying module (10) and the regulator box (54). As shown in FIG. 4, the vacuum container (11) for conveying the vacuum conveying module (10) is supported by a frame structure (55) standing upright from the floor surface in the installation state within the factory. The frame structure (55) includes a plurality of vertical frames (56) and a plurality of horizontal frames (57) connecting the plurality of vertical frames (56).

[0041] The regulator box (54) is fixed to the horizontal frame (57) at the vertical lower side of the return vacuum container (11), for example. That is, the regulator box (54) is provided in a position that is easily visible and accessible to the user outside the return vacuum container (11). Since the external supply path (52A), external discharge path (52B) of the external temperature control device (50), and the regulator box (54) are visible to the user, the user can easily recognize, for example, that cooling water leaks outside the return vacuum container (11).

[0042] Returning to FIG. 1, the control unit (60) of the substrate processing device (1) has a controller body (61) and a user interface (65) connected to the controller body (61). The controller body (61) may be a control computer having one or more processors (62), memory (63), an input / output interface not shown, and electronic circuits. In addition, in this embodiment, a configuration in which the controller body (61) controls the vacuum conveying module (10), each process module (20), and load lock module (30) is illustrated, but the control of each module may be performed by a control device (not shown) provided in each module.

[0043] The processor (62) is a combination of one or more of the following: a CPU, a GPU, an ASIC, an FPGA, or a circuit composed of multiple discrete semiconductors. The memory (63) includes volatile memory and non-volatile memory (e.g., compact disc, DVD, hard disk, flash memory, etc.) and stores recipes such as a program for operating the substrate processing device (1) and process conditions for substrate processing.

[0044] The user interface (65) may include a keyboard for the user to perform command input operations to manage the board processing device (1), a display that visualizes and displays the operating status of the board processing device (1), or a touch panel having both display and input functions. Additionally, the user interface (65) may be equipped with a configuration such as a lamp or a speaker capable of notifying an alarm of the board processing device (1). That is, the user interface (65) functions as a notification device for the board processing device (1).

[0045] The control unit (60) controls the transport of the substrate G of the vacuum transport module (10). At this time, as shown in FIG. 2, the control unit (60) operates the external temperature control device (50) to supply cooling water from the chiller unit (51) to the transport device (12). As a result, the cooling plate (41) of the base (17) is cooled inside the vacuum transport module (10).

[0046] Additionally, when the control unit (60) circulates cooling water between the external temperature control device (50) and the conveying device (12), it detects leakage of cooling water within the vacuum conveying module (10) based on a pressure drop signal received from the pressure switch (547). The causes of leakage of cooling water from the flow path (42) of the conveying device (12) may include, for example, damage to the piping constituting the internal supply flow path (43) or the internal discharge flow path (44), deterioration over time, or loosening of the connection with the joint. For example, the flow path (42) within the base (17) extends long in the horizontal direction (see FIG. 2), so the location of the cooling water leakage during operation is unknown. Furthermore, if the conveying device (12) rotates while the cooling water is leaking, the location of the cooling water drop also changes.

[0047] As described above, the substrate processing device (1) allows the user to immediately notice when cooling water leaks from outside the vacuum container (11) for return. However, the user cannot notice when cooling water leaks from inside the vacuum container (11) for return. Therefore, the substrate processing device (1) according to the present embodiment detects cooling water leakage with high precision by using the pressure value of the pressure switch (547).

[0048] Hereinafter, a method for detecting leakage of cooling water based on pressure values ​​will be explained with reference to FIG. 5. FIG. 5 is an explanatory diagram of a leakage detection method, (A) shows pressure measurement accompanying leakage of cooling water from within the flow path (42) of the return device (12), and (B) is a graph showing the relationship between the amount of leakage from the flow path (42) and the pressure value of the pressure switch (547).

[0049] When leakage of cooling water occurs from the flow path (42) of the return device (12), the pressure of the cooling water flowing through the flow path (42) (pressure within the flow path) decreases according to the amount of leakage. This decrease in pressure within the flow path is transmitted to the pressure switch (547) on the upstream side of the direction of cooling water flow through the external supply path (52A). As a result, the pressure switch (547) detects a pressure value lower than the set pressure Pr. For example, referring to (B) of FIG. 5, it can be seen that as the amount of leakage of cooling water from the flow path (42) increases, the pressure value also gradually decreases.

[0050] When the pressure switch (547) recognizes that the pressure value of the pressure switch (547) has decreased by a predetermined pressure drop amount Pd with respect to the set pressure Pr, which is being regulated by the regulator (546), it transmits a pressure drop signal to the control unit (60). It is preferable that this pressure drop amount Pd be pre-set to an appropriate value based on the set pressure Pr or the flow rate of the cooling water. As for the ratio (Pd / Pr) of the pressure drop amount Pd to the set pressure Pr, it should be set to, for example, 7% to 20% of the set pressure, taking into account the error of the pressure switch (547). For instance, if the ratio is less than 7%, the possibility of including the measurement error of the pressure switch (547) increases, whereas if the ratio is greater than 20%, the leakage of the cooling water cannot be detected early, and the amount of leakage increases.

[0051] In this embodiment, the pressure drop amount Pd is set to 0.05 MPa by including a safety margin for error, given that the set pressure Pr is 0.3 MPa and the error of the pressure switch (547) is ±0.02 MPa. Therefore, the ratio of the pressure drop amount Pd to the set pressure Pr (Pd / Pr) is 16.7%.

[0052] The pressure switch (547) is configured to set a pressure judgment threshold Th calculated based on the set pressure Pr and the pressure drop amount Pd. That is, when the set pressure Pr is 0.3 MPa and the pressure drop amount Pd is 0.05 MPa, the pressure judgment threshold Th is set to 0.25 MPa by subtracting the pressure drop amount Pd from the set pressure Pr. As shown in (B) of FIG. 5, when the pressure judgment threshold Th of 0.25 MPa is set, the control unit (60) can detect the coolant leaking from the flow path (42) at a leakage amount of about 0.98 L / min by means of the pressure drop signal transmitted from the pressure switch (547).

[0053] Here, for example, a configuration is also considered in which a flow meter not shown is installed in the external supply path (52A) and the external discharge path (52B) to detect the difference in the flow rate of the cooling water and calculate the amount of leakage of the cooling water. In this case, the amount of leakage of the cooling water depends on the detection precision of the flow meter, but the detection precision of the flow meter is generally not very high. For example, when a flow meter is applied, the detectable change in flow rate is about 2.0 L / min.

[0054] In contrast, the substrate processing device (1) can detect leakage at a low leakage level (e.g., 0.98 L / min) by using the pressure value of the cooling water from the pressure switch (547) (pressure measuring device). By detecting at a low leakage level, it becomes possible to minimize the impact of the leaked cooling water on the return vacuum vessel (11). In particular, the substrate processing device (1) monitors the leakage of the cooling water of the return device (12) in the vacuum environment of the return vacuum vessel (11), where the pressure outside the piping is lower than the atmospheric environment. Since the pressure inside the flow path is lowered more significantly depending on the pressure difference between the flow path (42) through the hole that causes the leakage and the outside of the piping, it becomes possible to detect leakage more sensitively in the vacuum environment.

[0055] The substrate processing device (1) according to the present embodiment is basically configured as described above, and the operation (leakage detection method) is described below.

[0056] FIG. 6 is a flowchart showing the processing flow of a leak detection method. As shown in FIG. 6, the control unit (60) of the substrate processing device (1) controls the operation of the external temperature control device (50) during the operation of the vacuum conveying module (10) to perform temperature control (cooling) of the conveying device (12). At this time, the control unit (60) operates the chiller unit (51) to circulate cooling water between the chiller unit (51) and the conveying device (12) (Step S1). When supplying cooling water to the conveying device (12), the regulator (546) pressure-regulates the pressure of the cooling water on the secondary side to a preset pressure Pr by the command of the control unit (60) or by manual operation by the user.

[0057] Additionally, during the period when the coolant is circulating, the pressure switch (547) installed on the secondary side of the regulator (546) continuously acquires pressure values ​​(step S2).

[0058] Then, the pressure switch (547) compares the pressure value with the pressure judgment threshold Th, which is calculated and set based on the set pressure Pr (Step S3), and determines a decrease in the pressure of the cooling water from the flow path of the conveying device (12). If it is determined that there is a decrease in pressure, the pressure switch (547) transmits a signal of pressure decrease to the control unit (60). When the pressure value is greater than the pressure judgment threshold Th (Step S3: "Yes"), the control unit (60) does not receive a signal of pressure decrease, so the cooling water continues to flow as if it were normal flow without leakage of cooling water; however, when the pressure value is less than or equal to the pressure judgment threshold Th (Step S3: "No"), it receives a signal of pressure decrease and determines that leakage of cooling water is occurring.

[0059] Additionally, if there is no leakage of the cooling water, the control unit (60) determines whether the operation of the vacuum conveying module (10) has ended (Step S4). If the operation of the vacuum conveying module (10) continues (Step S4: "No"), the process returns to Step S3 and repeats the same process below. Meanwhile, if the operation of the vacuum conveying module (10) ends (Step S4: "Yes"), the process proceeds to Step S5.

[0060] In step S5, the control unit (60) performs a normal stop process of the vacuum conveying module (10) including an external temperature control device (50). For example, in the normal stop process, the operation of the conveying device (12) is stopped, and the operation of the chiller unit (51) is stopped to stop the circulation of cooling water to the conveying device (12).

[0061] In addition, if it is determined that a leakage of cooling water is occurring because the pressure value is below the pressure judgment threshold Th, the control unit (60) notifies an alarm regarding the leakage of cooling water through the user interface (65) (step S6). By recognizing the alarm from the user interface (65), the user is able to immediately identify that a leakage of cooling water has occurred in the vacuum container (11) for return.

[0062] Additionally, the control unit (60) performs an abnormal stop process to temporarily stop the operation of the substrate processing device (1) (step S7). In this abnormal stop process, the operation of each module is stopped after the operation currently being performed in the vacuum conveying module (10), each process module (20), load lock module (30), etc. is completed. Additionally, the control unit (60) prevents cooling water from being supplied to the conveying device (12) by performing a control to stop the chiller unit (51).

[0063] As described above, the leak detection method can detect leakage of cooling water with high precision by monitoring the pressure value of the pressure switch (547). In addition, the user of the substrate processing device (1) can detect leakage of cooling water in the return vacuum container (11) at an early stage, and can promptly take measures such as maintenance.

[0064] In addition, in the above embodiment, leakage of cooling water in the vacuum conveying module (10) is detected, but the substrate processing device (1) and the leakage detection method can be applied to various configurations using a liquid temperature control medium. For example, the substrate processing device (1) and the leakage detection method can determine leakage of the temperature control medium flowing to the temperature control mechanism of a structure (loading stand (24), shower head not shown, etc.) placed in the processing vessel (23) of the process module (20). Alternatively, it is obvious that the same configuration can be taken even when the load lock module (30) has a temperature control mechanism.

[0065] The technical concept and effects of the present disclosure described in the above embodiments are described below.

[0066] A first aspect of the present invention is a substrate processing device (1) for processing a substrate, comprising a vacuum container (a vacuum container for transport (11)) having an internal space (11a) capable of reducing pressure to a vacuum environment, a structure (a transport device (12)) provided inside the vacuum container and having a flow path (42) through which a liquid temperature control medium (cooling water) flows, a pressure measuring device (a pressure switch (547)) provided in a temperature control medium path (52) communicating with the flow path (42) to measure the pressure of the temperature control medium, and a notification device (a user interface (65)) that notifies information regarding the decrease in pressure value when the pressure value measured by the pressure measuring device becomes less than or equal to a preset threshold (a pressure judgment threshold Th).

[0067] According to the above, the substrate processing device (1) can detect leakage from the flow path (42) of a structure (transport device (12)) provided within a vacuum vessel (transport vacuum vessel (11)) that has been depressurized to a vacuum environment with high precision. By doing so, the substrate processing device (1) can promptly take necessary measures regarding problems such as corrosion within the vacuum vessel caused by leakage of the temperature control medium and process abnormalities caused by pressure fluctuations.

[0068] Additionally, a regulator (546) is provided upstream of the pressure measuring device (pressure switch (547)) of the temperature control medium path (52) to pressure control the pressure of the temperature control medium within the temperature control medium path (52) to a set pressure Pr, and the pressure measuring device measures the pressure on the secondary side of the regulator (546). By doing so, the substrate processing device (1) can measure the pressure controlled to the set pressure Pr by the regulator (546) using the pressure measuring device, and thus it becomes possible to stably monitor the pressure drop of the temperature control medium accompanying leakage from the flow path (42).

[0069] Additionally, a control unit (60) for controlling the substrate processing device (1) is provided, and the control unit (60) obtains a signal of pressure drop from a pressure measuring device (pressure switch (547)). The pressure measuring device sets a threshold (pressure judgment threshold Th) based on a set pressure Pr, and determines normal flow of the temperature control medium when the pressure value of the pressure measuring device is greater than the threshold, while transmitting a signal of pressure drop to the control unit (60) when the pressure value of the pressure measuring device becomes less than or equal to the threshold, and the control unit (60) determines leakage of the temperature control medium. By doing so, the substrate processing device (1) can determine leakage of the temperature control medium with even higher precision based on the pressure value of the pressure measuring device.

[0070] Additionally, the device has a module (vacuum transport module (10)) comprising a vacuum vessel (a transport vacuum vessel (11)) and a structure (a transport device (12)), and when the control unit (60) determines that there is a leak of the temperature control medium, it cuts off the supply of cooling water to the structure and stops the operation of the module after the completion of the operation currently being performed by the module. By doing so, the substrate processing device (1) can prevent the substrate G currently being processed from being wasted and can suppress the effect on the substrate G caused by the leakage of the temperature control medium at an early stage.

[0071] Additionally, the structure is a conveying device (12) configured to convey the substrate G. By doing so, the substrate processing device (1) can easily detect the leakage when the temperature control medium leaks from the conveying device (12).

[0072] Additionally, the conveying device (12) includes an end effector (19) that supports the substrate G, a temperature control plate (cooling plate (41)) that is positioned opposite the end effector (19) and has a passage (41a) inside through which a temperature control medium flows, and a flow path (42) that communicates with the passage (41a) of the temperature control plate. By doing so, the substrate processing device (1) can detect leakage of the temperature control medium with high precision when the temperature control medium flows into the temperature control plate.

[0073] Additionally, the conveying device (12) can rotate the end effector (19) and the temperature control plate (cooling plate (41)). By doing so, the substrate processing device (1) can quickly detect leakage of the temperature control medium even when the flow path (42) of the temperature control medium moves along with the rotation of the temperature control plate within the conveying vacuum vessel (11), thereby reducing the impact of leakage.

[0074] In addition, the temperature control medium is cooling water. Accordingly, the substrate processing device (1) can reliably detect leakage of cooling water even within the vacuum container (11) for transport under a vacuum environment.

[0075] In addition, a second aspect of the present disclosure is a method for detecting leakage in a substrate processing device (1) having a vacuum container (a vacuum container for transport (11)) having an internal space (11a) capable of being depressurized to a vacuum environment, and a structure (a transport device (12)) provided inside the vacuum container and having a flow path (42) through which a liquid temperature control medium flows. The method comprises a process of acquiring a pressure value of the temperature control medium measured by a pressure measuring device (pressure switch (547)) provided in a temperature control medium path (52) communicating with the flow path (42), and a process of notifying information regarding the decrease in the pressure value by a notification device (user interface (65)) when the acquired pressure value becomes below a preset threshold. In this case as well, the leakage detection method can detect leakage with high precision from the flow path (42) of the structure provided inside the vacuum container depressurized to a vacuum environment.

[0076] Additionally, a regulator (546) is provided upstream of the pressure measuring device (pressure switch (547)) of the temperature control medium path (52) to pressure control the pressure of the temperature control medium within the temperature control medium path (52) to a set pressure Pr, and in the process of acquiring the pressure value of the temperature control medium, the pressure of the secondary side of the regulator (546) is acquired. Additionally, a control unit (60) that controls the substrate processing device (1) is provided, and a signal of pressure drop from the pressure measuring device is acquired by the control unit (60). The pressure measuring device sets a threshold based on the set pressure Pr, and when the pressure value of the pressure measuring device is greater than the threshold, it determines normal flow of the temperature control medium, while when the pressure value of the pressure measuring device becomes less than the threshold, it transmits a signal of pressure drop to the control unit (60), and the control unit (60) determines leakage of the temperature control medium. Additionally, the module (vacuum transport module (10)) includes a vacuum vessel (a transport vacuum vessel (11)) and a structure (a transport device (12)), and when a leak of the temperature control medium is detected, the operation of the module is stopped along with the supply of cooling water to the structure. The structure is a transport device (12) configured to transport a substrate G. Additionally, the temperature control medium is cooling water.

[0077] The substrate processing apparatus (1) and leakage detection method according to the embodiments disclosed herein are examples in all respects and are not restrictive. The embodiments may be modified and improved in various forms without departing from the appended claims and their common knowledge. The details described in the plurality of embodiments may also take other configurations within a non-contradictory scope and may be combined within a non-contradictory scope.

Claims

Claim 1 A substrate processing device for processing a substrate, comprising: a vacuum vessel having an internal space capable of depressurizing to a vacuum environment; a structure provided inside the vacuum vessel and having a flow path through which a liquid temperature control medium flows; a pressure measuring device provided in a temperature control medium path communicating with the flow path and measuring the pressure of the temperature control medium; a notification device that notifies information regarding the decrease in the pressure value when the pressure value measured by the pressure measuring device becomes below a preset threshold; and a regulator provided upstream of the pressure measuring device in the temperature control medium path and pressure-regulating the pressure of the temperature control medium in the temperature control medium path to a set pressure; wherein the structure is a conveying device configured to convey the substrate, and the pressure measuring device recognizes that the pressure value has decreased by a pressure decrease amount relative to the set pressure, wherein the pressure decrease amount is preset based on the set pressure or the flow rate of the temperature control medium, and wherein the threshold is calculated from the set pressure and the pressure decrease amount. Claim 2 In claim 1, the pressure measuring device measures the pressure on the secondary side of the regulator, a substrate processing device. Claim 3 A substrate processing device according to paragraph 2, comprising a control unit for controlling the substrate processing device, wherein the pressure measuring device acquires the pressure value, sets the threshold based on the set pressure, transmits a pressure drop signal to the control unit when the pressure value becomes below the threshold, and the control unit determines leakage of the temperature control medium when it receives the pressure drop signal. Claim 4 A substrate processing device according to paragraph 3, comprising a module including the vacuum vessel and the structure, wherein the control unit, upon determining a leak of the temperature control medium, cuts off the supply of the temperature control medium to the structure and stops the operation of the module after the completion of the operation currently being performed by the module. Claim 5 delete Claim 6 A substrate processing device according to claim 1, wherein the conveying device comprises an end effector supporting the substrate, a temperature control plate disposed opposite to the end effector and having a passage inside through which the temperature control medium flows, and a flow path communicating with the passage of the temperature control plate. Claim 7 In paragraph 6, the above-mentioned return device is a substrate processing device in which the end effector and the temperature control plate are rotatable. Claim 8 A substrate processing device, wherein in any one of claims 1 to 4, 6, and 7, the temperature control medium is cooling water. Claim 9 A leak detection method for a substrate processing device comprising a vacuum vessel having an internal space capable of depressurizing to a vacuum environment, and a structure provided inside the vacuum vessel having a flow path through which a liquid temperature control medium flows; a process of acquiring a pressure value of the temperature control medium measured by a pressure gauge provided in a temperature control medium path communicating with the flow path, and a process of notifying information regarding the decrease in the pressure value by a notification device when the acquired pressure value becomes below a preset threshold; wherein the substrate processing device is provided upstream of the pressure gauge in the temperature control medium path and pressure-regulates the pressure of the temperature control medium within the temperature control medium path to a set pressure; wherein the structure is a conveying device configured to convey a substrate; wherein the pressure gauge recognizes that the pressure value has decreased by a pressure decrease amount relative to the set pressure, the pressure decrease amount is preset based on the set pressure or the flow rate of the temperature control medium, and the threshold is calculated from the set pressure and the pressure decrease amount. Claim 10 In claim 9, a leak detection method wherein, in the process of acquiring the pressure value of the temperature control medium, the pressure on the secondary side of the regulator is acquired. Claim 11 A leak detection method according to claim 10, comprising a control unit that controls the substrate processing device, acquiring the pressure value by the pressure measuring device, setting the threshold based on the set pressure, transmitting a pressure drop signal to the control unit when the pressure value becomes below the threshold, and the control unit determining the leakage of the temperature control medium. Claim 12 A leak detection method according to claim 11, comprising a module including the vacuum vessel and the structure, wherein when a leak of the temperature control medium is determined, the operation of the module is stopped while blocking the supply of the temperature control medium to the structure. Claim 13 delete Claim 14 A leak detection method according to any one of claims 9 to 12, wherein the temperature control medium is a cooling water.

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