Substrate treating apparatus and method of replacing the polishing pad of substrate treating apparatus

Abstract

A substrate processing device according to one embodiment includes a substrate support member that supports the lower surface of a substrate; a first polishing pad that polishes the upper surface of the substrate; and a polishing pad replacement member that replaces the first polishing pad with a second polishing pad, wherein the polishing pad replacement member includes a first container in which the second polishing pad is provided; and a polishing pad transport member that transports the second polishing pad from the first container to one end of the substrate support member, and the one end of the substrate support member includes a modification area for modifying the second polishing pad, and during the process of the first polishing pad polishing the substrate, the second polishing pad is modified in the modification area.

Description

Technology Field

[0001] The present disclosure relates to a substrate processing apparatus and a method for replacing a polishing pad of the substrate processing apparatus. Background Technology

[0002] Liquid Crystal Display Devices (LCDs) or Organic Light Emitting Diode Displays (OLEDs) are attracting attention as flat panel display devices.

[0003] Glass substrates with excellent strength and transmittance are used in liquid crystal displays or organic light-emitting displays. However, if the flatness of the glass substrate is low, the image is distorted and image quality deteriorates due to transmittance variations caused by surface thickness variations; therefore, the glass substrate must be able to be polished to achieve high surface uniformity.

[0004] One method capable of precisely polishing the surface of a substrate is Chemical Mechanical Polishing (CMP), which combines mechanical polishing and chemical polishing. Chemical mechanical polishing is a method in which a slurry for chemical polishing is supplied simultaneously with the substrate being polished by rotating contact with a polishing pad. At this time, the polishing pad must be replaced periodically to ensure uniform polishing of the substrate.

[0005] However, in the process of replacing or pre-aging the polishing pad, the polishing process of the substrate may be interrupted, which may reduce the processing efficiency and productivity of the substrate. The problem to be solved

[0006] The embodiments are intended to provide a substrate processing apparatus and a polishing pad replacement method that can improve the processing efficiency and productivity of a substrate without interrupting the polishing process of the substrate when modifying the polishing pad. means of solving the problem

[0007] A substrate processing device according to one embodiment includes a substrate support member that supports the lower surface of a substrate; a first polishing pad that polishes the upper surface of the substrate; and a polishing pad replacement member that replaces the first polishing pad with a second polishing pad, wherein the polishing pad replacement member includes a first container in which the second polishing pad is provided; and a polishing pad transport member that transports the second polishing pad from the first container to one end of the substrate support member, and the one end of the substrate support member includes a modification area for modifying the second polishing pad, and during the process of the first polishing pad polishing the substrate, the second polishing pad is modified in the modification area.

[0008] The above substrate support may include a conditioner located in the modification region.

[0009] The above polishing pad replacement part further includes a second container in which the first polishing pad is provided, and can transport the first polishing pad from one end of the substrate support to the second container.

[0010] The first container or the second container may include an opening into which a liquid is introduced; and an attachment portion for attaching the first polishing pad or the second polishing pad.

[0011] The polishing pad transporter may include a central part positioned spaced apart from one end of the substrate support; a head part to which the first polishing pad or the second polishing pad is detached; and a rotating part connecting the central part and the head part.

[0012] The head portion may be positioned overlapping with one end of the first container, the second container, or the substrate support portion.

[0013] The above-mentioned rotating part includes a rotary motor, a pressure port, a shaft, and a cylinder, and can move the head part in the up and down direction.

[0014] The above polishing pad transport unit can be rotated by the above rotary motor.

[0015] The centers of the first container, the second container, and the modified region may each be located at the vertices of an equilateral triangle.

[0016] It may include a polishing head that polishes the substrate with the attached first polishing pad or second polishing pad by detaching the first polishing pad or the second polishing pad.

[0017] The above polishing head may include a pressure member located on the upper surface of the first polishing pad or the second polishing pad.

[0018] The polishing head may further include an attachment portion for attaching or detaching the first polishing pad or the second polishing pad.

[0019] The above substrate support may include a cleaning nozzle located in the modification area.

[0020] A method for replacing a polishing pad of a substrate processing apparatus according to one embodiment comprises: providing a second polishing pad to a first container while a polishing head including a first polishing pad polishes the upper surface of a substrate supported by a substrate support member; a polishing pad carrier transporting the second polishing pad from the first container to a modification area formed on the substrate support member for modifying the second polishing pad; modifying the second polishing pad in the modification area during a process in which the first polishing pad polishes the substrate; when the first polishing pad completes the polishing process, the first polishing pad is separated from the polishing head; and the second polishing pad is attached to the separated polishing head to start polishing the substrate.

[0021] After the step of providing the second polishing pad, the polishing pad carrier may further include the step of moving to the upper side of the first container and attaching the second polishing pad to the polishing pad carrier.

[0022] After the step of modifying the second polishing pad, the method may further include the step of storing the modified second polishing pad in the first container.

[0023] When the first polishing pad completes the polishing process, the method may further include the step of transporting the first polishing pad, which has been moved to one end of the substrate support, to a second container by the polishing pad transporter.

[0024] The polishing pad transporter may further include the step of transporting the second polishing pad from the first container to one end of the support portion of the substrate.

[0025] The centers of the first container, the second container, and the modified region may each be located at the vertices of an equilateral triangle.

[0026] A conditioner and a cleaning nozzle may be located in the modified area of ​​the substrate support. Effects of the invention

[0027] According to the embodiments, by providing a device capable of modifying the polishing pad while the polishing process of the substrate is being performed, the processing efficiency of the substrate can be increased and productivity can be improved.

[0028] In addition, by introducing the modified polishing pad into the polishing process immediately after replacing the used polishing pad, the polishing pad modification time can be shortened and equipment operation efficiency can be improved. Brief explanation of the drawing

[0029] FIG. 1 is a perspective view of a substrate processing device according to one embodiment. FIG. 2 is a plan view of a substrate processing apparatus according to one embodiment. FIG. 3 schematically illustrates a polishing head in a substrate processing apparatus according to one embodiment from the side. FIG. 4 is a schematic side view of a container among a substrate processing apparatus according to one embodiment. FIG. 5 is a schematic side view of one end of a substrate support portion of a substrate processing apparatus according to one embodiment. FIG. 6 is a schematic side view of a polishing pad transport unit among a substrate processing apparatus according to one embodiment. FIGS. 7 to 14 illustrate, in sequence, a method for replacing a polishing pad of a substrate processing device according to one embodiment. Specific details for implementing the invention

[0030] Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein.

[0031] To clearly explain the present invention, parts unrelated to the explanation have been omitted, and the same reference numerals are used for identical or similar components throughout the specification.

[0032] Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present invention is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, for convenience of explanation, the thickness of some layers and regions has been exaggerated in the drawings.

[0033] Furthermore, when a part such as a layer, membrane, region, or plate is said to be "on" or "on" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when a part is said to be "directly above" another part, it means that there is no other part in between. Also, being "on" or "on" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "on" in the direction opposite to gravity.

[0034] Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0035] Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side.

[0036] Below, we will examine a substrate processing apparatus according to one embodiment.

[0037] In one embodiment, the substrate processing device can perform a CMP process that chemically and mechanically polishes the substrate.

[0038] FIG. 1 is a perspective view of a substrate processing device according to one embodiment, and FIG. 2 is a plan view of a substrate processing device according to one embodiment.

[0039] Referring to FIGS. 1 and 2, a substrate processing device according to one embodiment includes a polishing head (100), a substrate support (30), a substrate transfer unit (20), and a polishing pad replacement unit (400).

[0040] The substrate (10) is a transparent substrate comprising glass for a flat panel display device (FPD), such as an LCD (liquid crystal display) or a PDP (plasma display panel), and may be rectangular. In one embodiment, the substrate (10) refers to a rectangular substrate with at least one side length greater than 1 m. Here, the type of substrate (10) is not limited to glass and may be a silicon wafer for manufacturing semiconductor devices.

[0041] The polishing head (100) moves repeatedly over the substrate (10) to polish the upper surface of the substrate (10). The polishing head (100) includes a polishing pad (200) attached to the lower surface of the polishing head (100). Here, the polishing pad may be a first polishing pad (200).

[0042] The polishing head (100) and the polishing pad (200) are formed in a circular shape having a size smaller than that of the substrate (10) and move by repeatedly rotating left and right on the substrate (10). The polishing head (100) may include a driving motor (not shown) inside, and the driving motor can rotate and move the polishing head (100) to polish the surface of the substrate (10) in a certain trajectory. That is, it can rotate and move in a zigzag trajectory on the upper surface of the substrate (10) to evenly polish the surface of the substrate (10).

[0043] The polishing pad (200) comes into direct contact with the upper surface of the substrate (10) to evenly polish the surface of the substrate (10). The polishing pad (200) is formed from a material suitable for mechanical polishing. For example, the polishing pad (200) can be formed using polyurethane, polyurea, polyester, polyether, epoxy, polyamide, polycarbonate, polyethylene, polypropylene, fluoropolymer, vinyl polymer, acrylic and methacrylic polymer, silicone, latex, rubber nitride, isoprene rubber, butadiene rubber, and various copolymers of styrene, butadiene and acrylonitrile, and the material and characteristics of the polishing pad (200) can be varied according to the required conditions and design specifications.

[0044] A substrate transfer unit (20) is located below the substrate (10) and transfers the substrate (10) in a certain direction. According to one embodiment, the substrate transfer unit (20) includes a transfer belt (21) that moves the substrate (10) in a first direction (x) and a driving roller (22) that circulates the transfer belt (21).

[0045] A substrate (10) is placed on the outer surface of the conveyor belt (21). The conveyor belt (21) is wound in a tensioned state by applying a predetermined tension by a pair of drive rollers (22), and rotates continuously as the drive rollers (22) rotate, thereby moving the substrate (10) in a first direction (x). The conveyor belt (21) may be implemented as an elastic composite containing an elastomer to grip the inner surface that contacts the drive rollers (22) and the outer surface that contacts the substrate (10). The conveyor belt (21) may be driven by a conveyor belt drive unit (not shown), the tension of the conveyor belt (21) may be adjusted by a tension control unit (not shown), and the belt may be prevented from meandering by a meandering prevention unit (not shown). Additionally, a polishing protection unit (not shown) that protects the surface of the belt may be located on the outer surface of the conveyor belt (21).

[0046] The drive rollers (22) are spaced apart in pairs on the inner side of the conveyor belt (21). The rotation axes of the pair of drive rollers (22) are arranged parallel to each other. In one embodiment, the rotation axes of the drive rollers (22) are arranged in a second direction (y) perpendicular to the direction of movement of the substrate (10). However, according to the embodiment, the rotation axes of the pair of drive rollers (22) may be arranged parallel to the direction of movement of the substrate (10).

[0047] The substrate support (30) is located at the bottom of the substrate (10) and supports the substrate (10) such that the surface to be polished (the part in contact with the polishing pad) of the substrate (10) faces upward. The substrate support (30) is formed in the shape of a rectangular plate (462) long in the second direction (y) and includes a concave shape in the center portion to support the substrate (10) and the conveyor belt (21).

[0048] The outer portion of the substrate support (30) is formed to be longer than the width of the substrate (10) and the conveyor belt (21). Accordingly, a conditioner (300) and a detachable portion (32) are located at both ends of the outer portion where the substrate support (30), the substrate (10), and the conveyor belt (21) do not overlap, spaced apart from the conveyor belt (21). One end of the substrate support (30) where the conditioner (300) is formed includes a modification area (AA) capable of modifying a new polishing pad (210).

[0049] The conditioner (300) is located at both ends of the substrate support (30). That is, the conditioner (300) is located within the modification area (AA) formed at both ends of the substrate support (30). Although only one end of the substrate support (30) is shown in the drawing, the conditioner (300) may also be located at the other end of the substrate support (30) extended in the second direction (y).

[0050] The detachable parts (32) are positioned as a pair facing each other in the first direction (x) at both ends of the substrate support (30). The pair of detachable parts (32) allows the polishing head (100) or the polishing pad replacement part (400) and the polishing pad (200) to be detached when the polishing pad (200) is positioned in the modification area (AA). Although only one end of the substrate support (30) is shown in the drawing, a pair of detachable parts (32) may also be positioned at the other end of the substrate support (30) extended in the second direction (y).

[0051] The polishing pad replacement part (400) is positioned spaced apart from one end of the substrate support part (30) and replaces the polishing pad (200) that has been used with a new polishing pad (210), and allows the new polishing pad (210) to be modified. Here, the polishing pad that has been used refers to the first polishing pad (200), and the new polishing pad refers to the second polishing pad (210).

[0052] The polishing pad replacement unit (400) includes a first container (410), a second container (420), and a polishing pad transport unit (430) for replacing and modifying the polishing pad.

[0053] The first container (410) includes a bath shape of a certain height for wetting the polishing pad (210). The interior of the first container (410) is formed with a circular concave groove, and the exterior of the first container (410) can be formed in various shapes such as a circle or a polygon. The concave groove is formed larger than the polishing pad (210), and a new polishing pad (210) requiring replacement and modification is provided in the first container (410).

[0054] The second container (420) includes a tank shape of a certain height. The interior of the second container (420) is formed as a circular concave groove, and the exterior of the second container (420) can be formed in various shapes such as a circle or a polygon. The concave groove is formed larger than the polishing pad (200), and the polishing pad (200), on which the substrate polishing process is completed, is provided in the second container (420).

[0055] The polishing pad transport unit (430) is located between the first container (410) and the second container (420) and is positioned to overlap with at least one of the first container (410), the second container (420), or the substrate support (30). The polishing pad transport unit (430) transports a new polishing pad (210) from the first container (410) to one end of the substrate support (30). The new polishing pad (210) transported to the modification area (AA) formed at one end of the substrate support (30) undergoes a modification process. Additionally, the polishing pad transport unit (430) transports a used polishing pad (200) from one end of the substrate support (30) to the second container (420).

[0056] The first container (410) and the second container (420) are located on both sides of the polishing pad carrier (430), centered on the polishing pad carrier (430). Specifically, the center points of the first container (410), the second container (420), and the modification area (AA) formed at one end of the substrate support (30) can be located at the vertices of an equilateral triangle so that the distance between them is constant. Accordingly, the polishing pad carrier (430) can replace the polishing pad (200) that has been used up within the replacement area (a semicircle shown as a dotted line) and allow a new polishing pad (210) to be modified in the modification area (AA).

[0057] That is, according to one embodiment, while one polishing pad (200) is performing a polishing process on a substrate, a modification process is performed on the other polishing pad (210), and a replacement process of the polishing pad is performed, thereby shortening the time required for modification of the new polishing pad (210) and improving the processing efficiency and productivity of the substrate.

[0058] Hereinafter, with reference to FIGS. 3 to 6, the structure of the polishing head, substrate support, and polishing pad replacement part will be examined in detail.

[0059] FIG. 3 schematically illustrates a polishing head in a substrate processing device according to one embodiment from the side, and FIG. 4 schematically illustrates one end of a substrate support in a substrate processing device according to one embodiment from the side. Additionally, FIG. 5 schematically illustrates a container in a substrate processing device according to one embodiment from the side, and FIG. 6 schematically illustrates a polishing pad transporter in a substrate processing device according to one embodiment from the side.

[0060] First, referring to FIG. 3, the polishing head (100) further includes a polishing pad (200), a pressure part (110), and an attachment part (130).

[0061] The polishing pad (200) is formed with a length similar to that of the polishing head (100) so as to overlap the lower surface of the polishing head (100), and includes magnetic members (23) at both ends. The magnetic members (23) are formed to overlap with the position of the attachment part (130) of the polishing head (100), allowing the polishing head (100) and the polishing pad (200) to be detachable.

[0062] The pressure member (110) is located on the upper surface of the polishing pad (200) and presses the polishing pad (200) to ensure that the CMP process occurs properly during the polishing process.

[0063] The attachment portion (130) is located on the side of the pressure portion (110), and the magnetic member (23) of the polishing pad (200) is attached to the attachment portion (130). The attachment portion (130) is formed to overlap with the position where the magnetic member (23) of the polishing pad (200) is formed, and applies magnetic force so that the polishing pad (200) can be detachably attached to the polishing head (100). That is, when the polishing head (100) replaces the polishing pad (200), the polishing pad (200) that has finished use can be separated by the attachment portion (130), and a new polishing pad (210) can be attached.

[0064] Referring to FIG. 4, the support portion (30) of the substrate includes detachable portions (32) located at both ends, and includes a conditioner (300) and a cleaning nozzle (310) located at the center.

[0065] The detachable parts (32) are positioned in pairs facing each other, centered on the modified area (AA) formed at both ends of the substrate support (30). The pair of detachable parts (32) separate a new polishing pad (210) transported from the polishing pad replacement part (400) from the polishing pad replacement part (400). Accordingly, the new polishing pad (210) is positioned in the modified area (AA). Additionally, when the polishing head (100) that has finished use is positioned in the modified area (AA), the pair of detachable parts (32) can separate the polishing pad (200) that has finished use from the polishing head (100). The position of the pair of detachable parts (32) can be adjusted in a second direction (y) depending on the size of the polishing pad or the position where the polishing pad is placed.

[0066] The conditioner (300) modifies the new polishing pad (210) separated from the polishing pad replacement part (400). The conditioner (300) can rotate inside the substrate support part (30) and can make rotational contact with the lower surface of the polishing pad (200, 210).

[0067] The conditioner (300) pressurizes the surface of the polishing pad (200, 210) and finely cuts it to modify the surface of the polishing pad (200, 210) so that the micropores formed on the surface of the polishing pad (200, 210) come out on the surface. That is, the conditioner (300) finely cuts the surface of the polishing pad (200, 210) so that the numerous foam micropores, which serve to hold a slurry mixed with abrasive and chemical substances on the outer surface of the polishing pad (200, 210), do not get clogged, thereby allowing the slurry filled in the foam pores of the polishing pad (200, 210) to be smoothly supplied to the substrate.

[0068] The cleaning nozzle (310) is located in the center of the conditioner (300) and removes foreign matter remaining on the lower surface of the polishing pad (200) after use. Additionally, the cleaning nozzle (310) wets the surface of the new polishing pad (210). The cleaning nozzle (310) can spray a cleaning solution onto the surface of the polishing pad (200) and remove foreign matter using a brush or a vacuum suction method. According to an embodiment, the cleaning nozzle (310) may be used together with the conditioner (300) when modifying the new polishing pad (210).

[0069] Referring to FIG. 5, the container (410) of the polishing pad replacement part (400) includes an opening (41) and an attachment part (42). Although FIG. 5 shows the first container (410), the second container (420) can also be implemented with the same shape as the first container (410).

[0070] Two openings (41) are formed at both ends of the container (410) to allow liquid (e.g., ultrapure water) to flow into the polishing pad (200). One opening (41) allows liquid to flow in, and the other opening (41) allows liquid to be discharged. Thus, the polishing pad (200) provided in the container (410) can be wetted.

[0071] Two attachment portions (42) are formed on one side of the container (410), and the magnetic member (23) of the polishing pad (200, 210) is attached. The attachment portion (42) is formed to correspond to the position where the magnetic member (23) of the polishing pad (200, 210) is formed, and magnetic force is applied so that the polishing pad (200, 210) can be detachably attached. Accordingly, the polishing pad (200, 210) is attached to the attachment portion (42) of the container (410) and can be stably fixed.

[0072] Referring to FIG. 6, the polishing pad transport part (430) of the polishing pad replacement part (400) includes a center (440), a rotating part (450), and a head part (460).

[0073] The center (440) is positioned spaced apart from one end of the substrate support (30) and extends long in the third direction (z). The center (440) becomes the central axis of the polishing pad carrier (430). That is, the center (440) can be positioned at the center point of an equilateral triangle when the center points of the first container (410), the second container (420), and the modified area (AA) formed at one end of the substrate support (30) are located at the vertices of the equilateral triangle, so that the distance between the first container (410), the second container (420), and the modified area (AA) formed at one end of the substrate support (30) is constant.

[0074] The rotating part (450) extends in a second direction (y) from the center (440) and includes a rotating motor (451), a pressure port (452), a shaft (453), and a cylinder (454). The rotating motor (451) enables the rotating part (450) to rotate on the first and second planes (xy) with respect to the center (440) which extends in a third direction (z). Since the length of the rotating part (450) extended in the second direction (y) is maintained constant, when the modified region (AA) formed at one end of the first container (410), the second container (420), and the substrate support part (30) is rotated in the first and second plane directions (xy), a constant distance can be maintained from the center (440) to each end of the first container (410), the second container (420), and the substrate support part (30). Additionally, the pressure port (452), shaft (453), and cylinder (454) allow the polishing pad carrier (430) to move in a third direction (z). The pressure port (452), shaft (453), and cylinder (454) are connected to the head part (460) described later, so that the polishing pad (200, 210) can be moved in a third direction (z).

[0075] The head portion (460) is connected to the rotating portion (450) to directly detach and transport the polishing pads (200, 210), and includes a body (461), a plate (462), and an attachment portion (463). The body (461) is connected to the shaft (453) and cylinder (454) of the rotating portion (450), and the body (461) is moved in a third direction (z) by the shaft (453). A plate (462) is formed on the lower surface of the head portion (460), and the polishing pads (200, 210) can be positioned to overlap the plate (462). Additionally, a magnetic member (23) of the polishing pads (200, 210) can be positioned on the attachment portion (463) of the head portion (460). The attachment portion (463) is formed to overlap with the position where the magnetic member (23) of the polishing pad (200, 210) is formed, and applies magnetic force so that the polishing pad (200, 210) can be detachably attached to the head portion (460).

[0076] Additionally, the head portion (460) is positioned to overlap with at least one of the first container (410), the second container (420), or the substrate support portion (30). The polishing pad transport portion (430) rotates in the first and second plane directions (xy) so that when the head portion (460) is positioned above one end of the first container (410), the second container (420), or the substrate support portion (30), the head portion (460) is moved in the third direction (z) by means of the pressure port (452), shaft (453), and cylinder (454). The head portion (460) descends in the third direction (z) so that the polishing pad (200, 210) placed in the first container (410), the second container (420), or the substrate support portion (30) can be attached to the head portion (460). Additionally, the head portion (460) may rise in the third direction (z) to provide a polishing pad (200, 210) to the first container (410), the second container (420), or the substrate support portion (30), and may separate the head portion (460) from the polishing pad (200, 210).

[0077] In the substrate processing apparatus according to the comparative example, a substrate modification process was performed separately before the substrate polishing process. Accordingly, since the substrate polishing process was interrupted while the polishing pad modification process was being performed, there was a problem in that the processing efficiency and productivity of the substrate were reduced and the processing time of the substrate increased. In particular, the polishing pad modification process takes several minutes (e.g., 10 minutes) or more, and since the polishing process of the substrate by the polishing pad is interrupted during the polishing pad modification process, there was a problem in that the processing time of the substrate inevitably increased and the processing efficiency decreased.

[0078] However, the present invention can achieve the advantageous effect of shortening the time required for modifying the polishing pads and improving the processing efficiency and productivity of the substrate by allowing a modification process to be performed on the other polishing pad while one polishing pad is performing a polishing process on the substrate. That is, when a polishing process is performed using a substrate processing device according to one embodiment, approximately 10 minutes of time can be saved compared to a substrate processing device of a comparative example.

[0079] Hereinafter, with reference to FIGS. 7 to 14, a method for replacing and modifying the polishing pad of a substrate processing apparatus will be examined in detail. This will be explained with reference to FIGS. 1 to 6 described above.

[0080] FIGS. 7 to 14 illustrate, in sequence, a method for replacing a polishing pad of a substrate processing device according to one embodiment.

[0081] First, while performing the substrate polishing process, a new polishing pad is prepared in a container.

[0082] Referring to FIG. 7, during the process in which the first polishing pad (200) polishes the upper surface of a substrate (10) supported by a substrate support member (30), a second polishing pad (210) is provided to the first container (410). The second polishing pad (210) may be provided to the first container (410) by a user or an automatic insertion system.

[0083] For example, let us consider the case where a user provides a second polishing pad (210). The polishing process of the substrate can be performed inside, separated by a door, and the user can notify a substrate processing system (not shown) using an input unit, etc., to open the door. When a door opening notification is transmitted to the substrate processing system, the substrate processing device can move the head unit (460) of the polishing pad transport unit (430) to the upper side of the second container (420). This is to ensure that the user is not obstructed by the head unit (460) when providing the second polishing pad (210) to the first container (410). The head unit (460) can move to the upper side of the second container (420) when the first polishing head (100) has completely moved out of the replacement area (semicircle shown as a dotted line) of the substrate support unit (30). The replacement area (the semicircle shown as a dotted line) refers to the area excluding the area required for the polishing head (100) to polish the substrate (10) from the substrate support (30).

[0084] The user provides the second polishing pad (210) to the first container (410), and at this time, the polishing head (100) does not stop the process even if it is performing the polishing process. After the user provides the second polishing pad (210) to the first container (410) and closes the door, when the user sends a notification that the polishing pad provision is complete to the substrate processing system, the substrate processing system detects whether the polishing pad has been provided to the first container (410). The substrate processing system may generate an alarm, such as when the polishing pad is not properly provided to the first container (410) or when the door is not closed normally.

[0085] Then, referring to FIG. 8, the polishing pad carrier (430) moves to the upper side of the first container (410) and attaches the second polishing pad (210) to the head part (460). The magnetic member (23) of the second polishing pad (210) is coupled to the attachment part (463) of the head part (460), so that the second polishing pad (210) can be attached to the head part (460). At this time, the head part (460) can move from the upper side of the second container (420) to the upper side of the first container (410) when the polishing head (100) has completely moved out of the replacement area (semicircle shown as a dotted line) of the substrate support part (30).

[0086] Referring to FIG. 9, the polishing pad transporter (430) transports the second polishing pad (210) from the first container (410) to one end of the substrate support (30), and the second polishing pad (210) is modified in the modification area (AA) of the substrate support (30).

[0087] Specifically, when the second polishing pad (210) is positioned at one end of the substrate support (30), the polishing pad transporter (430) operates the rotary motor (451) to rotate the second polishing pad (210) and operates the cylinder (454) and the pressure port (452) to move the second polishing pad (210) downward (third direction, z). Accordingly, the lower surface of the second polishing pad (210) comes into direct contact with the conditioner (300). That is, the second polishing pad (210) is positioned in the modification area (AA) of the substrate support (30). The modification area (AA) is the part of the substrate support (30) where the conditioner (300) is located, and a process of modifying the surface of the new polishing pad (210) is performed in the modification area (AA). The modification area (AA) overlaps with a part of the replacement area (semicircle shown as a dotted line). The conditioner (300) can modify the surface of the second polishing pad (210) by rotating inside the substrate support (30).

[0088] Here, modification of the second polishing pad (210) can be performed only when the first polishing pad (200) has completely moved out of the replacement area (semicircle shown as a dotted line). When the first polishing pad (200) approaches the modification area (AA) within the replacement area (semicircle shown as a dotted line), the modification process of the second polishing pad (210) is stopped, and the polishing pad carrier (430) can return the second polishing pad (210) back to the first container (410).

[0089] The second polishing pad (210), after modification is complete, is moved to the first container (410) by the polishing pad transport unit (430).

[0090] Afterwards, when the usage time of the first polishing pad (200) reaches a certain time, the substrate processing system notifies the user that the use of the first polishing pad (200) is completed, and the substrate processing system stops the input of a new substrate.

[0091] Referring to FIG. 10, when the polishing process is completed, the first polishing pad (200) is separated from the polishing head (100).

[0092] More specifically, when the polishing process is completed, the first polishing pad (200) moves to the modification area (AA), and a cleaning process is performed on the first polishing pad (200). When a cleaning solution is sprayed by the cleaning nozzle (310), the residual slurry remaining on the surface of the first polishing pad (200) is discharged, and the surface of the first polishing pad (200) can be cleaned. Since the cleaning solution can be sprayed and the cleaning nozzle (310) is located in the modification area (AA), the cleaning process can be performed in the same area as the modification area (AA).

[0093] The first polishing pad (200), after cleaning is complete, can be separated from the polishing head (100), and the polishing head (100) can be moved to a modified area (AA) located at the other end of the substrate support (30) to clean the inside of the polishing head (100). At this time, the polishing pad transport unit (430) separates the second polishing pad (210) from the head unit (460) and temporarily stores the second polishing pad (210) in the first container (410).

[0094] Referring to FIG. 11, the polishing pad transporter (430) moves to one end of the substrate support (30) and transports the first polishing pad (200) to the second container (420).

[0095] The polishing pad transporter (430) moves from the upper side of the first container (410) to the modification area (AA) of the substrate support (30) when the polishing head (100) has completely moved out of the modification area (AA). More specifically, when the head portion (460) is positioned at one end of the substrate support (30) (a), the polishing pad transporter (430) attaches the magnetic member (23) of the first polishing pad (200) to the attachment portion of the head portion (460) and provides (b) the attached first polishing pad (200) from one end of the substrate support (30) to the second container (420). The polishing pad transporter (430) located at the upper side of the second container (420) separates the first polishing pad (200) from the head portion (460) so that the first polishing pad (200) is stored in the second container (420). At this time, the new second polishing pad (210) is stored in the first container (410).

[0096] Referring to FIG. 12, the polishing pad transporter (430) transports the second polishing pad (210) from the first container (410) to one end of the substrate support (30).

[0097] More specifically, the polishing pad transport unit (430) separates the first polishing pad (200) from the second container (420), moves to the first container (410) to attach (a) the second polishing pad (210) to the head unit (460), and transports (b) the second polishing pad (210) to the modification area (AA) of the substrate support unit (30). When the second polishing pad (210) is located in the modification area (AA), the polishing pad transport unit (430) separates the second polishing pad (210) from the head unit (460) and positions (c) the upper side of the first container (410).

[0098] Referring to FIG. 13, when a second polishing pad (210) is placed on one end of the substrate support (30) while the polishing head (100) is cleaning at the other end of the substrate support (30), the polishing head (100) combines with the second polishing pad (210) to start a new substrate polishing process.

[0099] More specifically, the second polishing pad (210) is positioned in the modification area (AA) of the substrate support (30), and the polishing head (100) overlaps the upper surface of the second polishing pad (210), so that the attachment portion (130) of the polishing head (100) is coupled to the magnetic member (23) of the second polishing pad (210). When the second polishing pad (210) is coupled, the polishing head (100) re-enters the substrate (10) and performs a polishing process. At this time, if a new substrate is introduced, the second polishing pad (210) may additionally perform a modification process in the modification area (AA) until the new substrate is introduced.

[0100] Referring to FIG. 14, the first polishing pad (200) stored in the second container (420) is removed. The first polishing pad (200) can be removed by a user or by an automatic removal system.

[0101] For example, in the case where a user removes the first polishing pad (200), the user notifies the substrate processing system to open the door. Upon receiving the notification, the substrate processing system checks the location and status of the polishing pad carrier (430) and can stop the operation of the polishing pad carrier (430). Afterward, the substrate processing system checks whether the first polishing pad (200) is present in the second container (420), unlocks the door, and the user can open the door and remove the first polishing pad (200) once the door is unlocked. After removing the first polishing pad (200), the user can notify the substrate processing system that the first polishing pad (200) has been removed. Afterward, the substrate processing system receives a new polishing pad (210) and can repeatedly perform the polishing pad modification and replacement process. That is, the process of FIGS. 7 to 14 can be repeatedly performed by an automatic system.

[0102] Accordingly, the polishing pad replacement method of a substrate processing device according to one embodiment can modify the polishing pad and replace the polishing pad while the polishing process of the substrate is being performed, thereby increasing the processing efficiency of the substrate and improving productivity.

[0103] Although embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims also fall within the scope of the present invention. Explanation of the symbols

[0104] 10: Substrate 100: Polishing head 10: Pressurizing part 200: Grinding pad 130: Attachment part 23: Magnetic member 20: Substrate transfer unit 21: Transfer belt 22: Drive roller 30: Substrate support 32: Attachment part 300: Conditioner 310: Cleaning Nozzle 200: 1st grinding pad 210: 2nd grinding pad 400: Grinding pad replacement part 410: First vessel 420: Second vessel 41: Opening 42: Attachment 430: Grinding pad carrier 440: Center 450: Rotating part 451: Rotary motor 452: Pressure port 453: Shaft 454: Cylinder 460: Head section 461: Body 462: Plate 463: Attachment AA: Modification zone

Claims

Claim 1 A substrate processing device comprising: a substrate support member supporting the lower surface of a substrate; a first polishing pad polishing the upper surface of the substrate; and a polishing pad replacement member replacing the first polishing pad with a second polishing pad, wherein the polishing pad replacement member comprises: a first container in which the second polishing pad is provided; a second container in which the first polishing pad is provided; and a polishing pad transport member transporting the second polishing pad from the first container to one end of the substrate support member, wherein one end of the substrate support member includes a modification area for modifying the second polishing pad, and during the process of the first polishing pad polishing the substrate, the second polishing pad is modified in the modification area, and the center of the first container, the second container, and the modification area are each located at the vertices of an equilateral triangle, and the polishing pad transport member rotates while overlapping with at least one of the first container, the second container, and the substrate support member. Claim 2 In claim 1, the substrate support is a substrate processing device comprising a conditioner located in the modification region. Claim 3 In claim 1, the first polishing pad is a substrate processing device that is transported from one end of the substrate support to the second container. Claim 4 In paragraph 3, the substrate processing device comprises: an opening into which a liquid is introduced in the first container or the second container; and an attachment portion for attaching the first polishing pad or the second polishing pad. Claim 5 In paragraph 4, the polishing pad carrier comprises: a central part positioned spaced apart from one end of the substrate support; a head part to which the first polishing pad or the second polishing pad is detached; and a rotating part connecting the central part and the head part, forming a substrate processing device. Claim 6 In paragraph 5, the head portion is a substrate processing device positioned overlapping with one end of the first container, the second container, or the substrate support portion. Claim 7 In paragraph 5, the above-mentioned rotating part includes a rotary motor, a pressure port, a shaft, and a cylinder, and a substrate processing device that moves the above-mentioned head part in an up-and-down direction. Claim 8 In paragraph 7, the polishing pad transporter is a substrate processing device rotated by the rotary motor. Claim 9 delete Claim 10 A substrate processing apparatus according to claim 1, comprising a polishing head that polishes the substrate with the attached first polishing pad or second polishing pad by detaching the first polishing pad or the second polishing pad. Claim 11 In claim 10, the polishing head comprises a pressure member located on the upper surface of the first polishing pad or the second polishing pad, forming a substrate processing device. Claim 12 In claim 11, the polishing head further comprises an attachment portion for detaching the first polishing pad or the second polishing pad, in a substrate processing device. Claim 13 In claim 1, the substrate support is a substrate processing device comprising a cleaning nozzle located in the modification area. Claim 14 A method for replacing a polishing pad in a substrate processing device, comprising: a step of providing a second polishing pad to a first container while a polishing head including a first polishing pad polishes the upper surface of a substrate supported by a substrate support member; a step of a polishing pad carrier transporting the second polishing pad from the first container to a modification area formed in the substrate support member for modifying the second polishing pad; a step of modifying the second polishing pad in the modification area during a process in which the first polishing pad polishes the substrate; a step in which, when the first polishing pad completes the polishing process, the first polishing pad is separated from the polishing head; and a step in which the second polishing pad is attached to the separated polishing head to start polishing the substrate, wherein the step of transporting the second polishing pad to a modification area for modifying the second polishing pad is a step in which the polishing pad carrier moves from a position at one vertex of an equilateral triangle centered on the polishing pad carrier to a position at another vertex while overlapping with at least one of the first container, a second container adjacent to the first container, and the substrate support member. Claim 15 A method for replacing a polishing pad of a substrate processing device according to claim 14, further comprising, after the step of providing the second polishing pad, the step of moving the polishing pad carrier to the upper side of the first container and attaching the second polishing pad to the polishing pad carrier. Claim 16 A method for replacing a polishing pad of a substrate processing device according to claim 15, further comprising the step of storing the modified second polishing pad in the first container after the step of modifying the second polishing pad. Claim 17 A method for replacing a polishing pad of a substrate processing device according to claim 16, further comprising the step of transporting the first polishing pad, which has been moved to one end of the substrate support, to the second container by the polishing pad transporter when the first polishing pad completes the polishing process. Claim 18 In claim 17, the polishing pad transporter further comprises the step of transporting the second polishing pad from the first container to one end of the substrate support, in a method for replacing a polishing pad of a substrate processing device. Claim 19 A method for replacing a polishing pad of a substrate processing device according to claim 18, wherein the center of the first container, the second container, and the modified region are each located at the vertices of an equilateral triangle. Claim 20 A method for replacing a polishing pad of a substrate processing device, wherein, in paragraph 15, a conditioner and a cleaning nozzle are located in the modified area of ​​the substrate support.

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