Organic Light Emitting Display device having a dummy pattern for repair process

Abstract

The present invention relates to an organic light-emitting display device comprising a dummy pattern for a repair process, and is characterized by the technical feature of improving the reliability of the repair process by preventing the absorption and refraction of a laser used in the repair process by insulating films laminated on the dummy pattern.

Description

Technology Field

[0001] The present invention relates to an organic light-emitting display device in which a repair process is performed using a dummy pattern. Background Technology

[0002] Generally, electronic devices such as monitors, TVs, laptops, and digital cameras include a display device for displaying images. For example, the display device may include a liquid crystal display and an organic light-emitting display.

[0003] The above organic light-emitting display device may be a transparent display device. For example, each pixel area of ​​the organic light-emitting display device may include a light-emitting area and a transmission area. A light-emitting structure and components for controlling the light-emitting structure may be located within the light-emitting area. The transmission area may transmit external light.

[0004] The above-mentioned light-emitting region may display various colors for realizing an image. For example, a blue light-emitting structure displaying blue, a red light-emitting structure displaying red, a green light-emitting structure displaying green, and a white light-emitting structure displaying white may be located within the light-emitting region. Each light-emitting structure may include a lower light-emitting electrode, an organic light-emitting layer, and an upper light-emitting electrode stacked in sequence.

[0005] The above-described organic light-emitting display device may have defects in some light-emitting structures due to foreign matter generated during the formation process. The formation process of the above-described organic light-emitting display device may include a repair process to minimize image quality degradation caused by the defective light-emitting structures. For example, the repair process of the above-described organic light-emitting display device may include a process of connecting the defective light-emitting structure to a light-emitting structure displaying the same color in an adjacent pixel area using a dummy pattern and a repair electrode.

[0006] The process of connecting the above-mentioned light-emitting structures may include a laser welding process. For example, the repair process of the organic light-emitting display device may include a process of connecting the repair electrodes and the dummy pattern by irradiating a laser onto an area where the repair electrodes of the light-emitting structures and the dummy pattern overlap.

[0007] However, since a plurality of insulating films are stacked on the dummy pattern and the repair electrode, there is a problem in that the laser irradiated for the repair process in the organic light-emitting display device is absorbed and / or refracted by the stacked insulating films, causing damage to adjacent insulating films. In addition, although the absorption and refraction of the laser by the insulating films can be prevented by irradiating the laser from the direction of the lower substrate, this requires the organic light-emitting display device to be inverted vertically, which may cause physical damage and increase the processing time. The problem to be solved

[0008] The problem that the present invention aims to solve is to provide an organic light-emitting display device capable of preventing damage to adjacent insulating films caused by a laser irradiated for a repair process.

[0009] Another problem that the present invention aims to solve is to provide an organic light-emitting display device capable of performing a repair process without physical damage while preventing the absorption and refraction of lasers by insulating films.

[0010] The problems that the present invention aims to solve are not limited to those mentioned above. Problems not mentioned herein will be clearly understood by a person skilled in the art from the description below. means of solving the problem

[0011] An organic light-emitting display device according to the technical concept of the present invention for achieving the above-mentioned problem includes a dummy pattern located on a lower substrate. A lower protective film is located on the lower substrate. The lower protective film covers the dummy pattern. A repair electrode is located on the lower protective film. The repair electrode includes an area that overlaps with the dummy pattern. An upper overcoat layer is located on the repair electrode. The upper overcoat layer includes an upper through-hole that overlaps with the dummy pattern. A bank insulating film is located on the upper overcoat layer. The bank insulating film includes a bank through-hole that overlaps with the upper through-hole. A capping insulating film is located within the upper through-hole on the repair electrode.

[0012] The capping insulating film can come into direct contact with the repair electrode.

[0013] The capping insulating film can extend laterally along the upper overcoat layer overlapping the dummy pattern.

[0014] The thickness of the capping insulating film on the repair electrode may be the same as the thickness of the capping insulating film on the side of the upper overcoat layer.

[0015] The capping insulating film may contain the same material as the bank insulating film.

[0016] A thin-film transistor may be located between the lower substrate and the lower protective film. The thin-film transistor may be spaced apart from a dummy pattern. The dummy pattern may contain the same material as one of the conductive layers of the thin-film transistor.

[0017] A lower overcoat layer may be located between the lower substrate and the repair electrode. The lower overcoat layer may include a lower through-hole that overlaps with the upper through-hole. The repair electrode may extend along the side of the lower overcoat layer toward the inside of the lower through-hole.

[0018] The size of the upper through hole may be smaller than the size of the lower through hole.

[0019] An organic light-emitting display device according to the technical concept of the present invention for achieving other problems to be solved as described above includes a lower substrate. The lower substrate includes a light-emitting region and a transmission region. A repair electrode is located on the transmission region of the lower substrate. A lower protective film is located between the lower substrate and the repair electrode. An upper overcoat layer is located on the repair electrode. The upper overcoat layer includes an upper through-hole that exposes a portion of the repair electrode. A bank insulating film is located on the upper overcoat layer. The bank insulating film includes a bank through-hole that overlaps with the upper through-hole. A dummy pattern is located between the lower substrate and the lower protective film. The dummy pattern overlaps with the upper through-hole. The repair electrode exposed by the upper through-hole is covered by a capping insulating film.

[0020] The horizontal length of a portion of the repair electrode may be smaller than the horizontal length of the upper surface of the dummy pattern facing the repair electrode.

[0021] The capping insulating film can extend between the repair electrode and the upper overcoat layer.

[0022] The capping insulating film can cover the repair electrode.

[0023] A light-emitting structure may be located on the light-emitting region of the lower substrate. The light-emitting structure may include a lower light-emitting electrode, an organic light-emitting layer, and an upper light-emitting electrode stacked in sequence. The organic light-emitting layer and the upper light-emitting electrode may extend into the interior of the upper through-hole through a bank through-hole.

[0024] The capping insulating film can come into direct contact with the organic light-emitting layer.

[0025] The upper overcoat layer may further include a contact hole that is spaced apart from the upper through-hole and overlaps with the repair electrode. The lower light-emitting electrode may be connected to the repair electrode through the contact hole. Effects of the invention

[0026] An organic light-emitting display device according to the technical concept of the present invention irradiates a laser for a repair process from the direction of the upper substrate, while preventing absorption and refraction of the laser by insulating films. Accordingly, in the organic light-emitting display device according to the technical concept of the present invention, damage to adjacent insulating films caused by the laser irradiated for the repair process can be prevented. Therefore, in the organic light-emitting display device according to the technical concept of the present invention, the time for the repair process can be shortened and reliability can be improved. Brief explanation of the drawing

[0027] FIG. 1 is a schematic diagram showing the layout of an organic light-emitting display device according to an embodiment of the present invention. FIG. 2a is a schematic diagram showing a cross-section of an organic light-emitting display device according to an embodiment of the present invention. Figure 2b is a drawing showing a cross-section cut along the line I-I' of Figure 1. FIGS. 3 to 5 are drawings showing an organic light-emitting display device according to another embodiment of the present invention. Specific details for implementing the invention

[0028] Detailed information regarding the above-mentioned objectives, technical configuration, and resulting effects of the present invention will be more clearly understood through the following detailed description with reference to the drawings illustrating embodiments of the present invention. Here, since the embodiments of the present invention are provided to ensure that the technical concept of the present invention is sufficiently conveyed to those skilled in the art, the present invention may be embodied in other forms so as not to be limited to the embodiments described below.

[0029] Additionally, parts indicated by the same reference number throughout the specification refer to the same components, and the length and thickness of layers or regions in the drawings may be exaggerated for convenience. Furthermore, where it is stated that a first component is "on" a second component, this includes not only the case where the first component is located on the upper side in direct contact with the second component, but also the case where a third component is located between the first component and the second component.

[0030] Here, the terms first, second, etc. are used to describe various components and to distinguish one component from another. However, within the scope of the technical concept of the present invention, the first component and the second component may be named arbitrarily for the convenience of those skilled in the art.

[0031] The terms used in the specification of the present invention are used merely to describe specific embodiments and are not intended to limit the invention. For example, a component expressed in the singular includes a plurality of components unless the context clearly implies only the singular. Furthermore, in the specification of the present invention, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0032] Additionally, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the specification of the present invention.

[0033] (Example)

[0034] FIG. 1 is a schematic diagram showing the layout of an organic light-emitting display device according to an embodiment of the present invention. FIG. 2a is a schematic diagram showing a cross-section of an organic light-emitting display device according to an embodiment of the present invention. FIG. 2b is a diagram showing a cross-section cut along the line I-I' of FIG. 1.

[0035] Referring to FIGS. 1, 2a and 2b, an organic light-emitting display device according to an embodiment of the present invention may include a lower substrate (100), a lower protective film (130), an auxiliary electrode (410), a repair electrode (430), a light-emitting structure (500), and a capping insulating film (600).

[0036] The lower substrate (100) can support the light-emitting structure (500). The lower substrate (100) may include an insulating material. For example, the lower substrate (100) may include glass or plastic.

[0037] The lower substrate (100) may include pixel regions. Each pixel region may include a light-emitting region (EA) and a transmission region (TA). The light-emitting region (EA) may display a color for displaying an image. A plurality of light-emitting structures (500) may be located within the light-emitting region (EA). For example, a blue light-emitting structure displaying blue, a red light-emitting structure displaying red, a green light-emitting structure displaying green, and a white light-emitting structure displaying white may be located within the light-emitting region (EA). The transmission region (TA) may be transparent.

[0038] A gate line (GL), data lines (DL1-DL4), a sensing line (SL), a reference voltage line (Vref), and a power supply voltage line (VDD) may be located on the lower substrate (100). The gate line (GL) may extend in one direction. The data lines (DL1-DL4) may intersect the gate line (GL). The data lines (DL1-DL4) may transmit a data signal to a light-emitting structure (500) located within the light-emitting region (EA). For example, an organic light-emitting display device according to an embodiment of the present invention may include four data lines (DL1-DL4). The sensing line (SL) may be parallel to the gate line (GL). The reference voltage line (Vref) and the power supply voltage line (VDD) may be parallel to the data lines (DL1-DL4).

[0039] The gate line (GL), the data line (DL1-DL4), the sensing line (SL), the reference voltage line (Vref), and the power supply voltage line (VDD) may define sub-emissive regions within the light-emitting region (EA). For example, a circuit for controlling one of the light-emitting structures (500) may be located within each sub-emissive region. In an organic light-emitting display device according to an embodiment of the present invention, each light-emitting region (EA) may include four sub-emissive regions partitioned by the gate line (GL), the data line (DL1-DL4), the sensing line (SL), the reference voltage line (Vref), and the power supply voltage line (VDD). For example, a selection thin-film transistor (TR1), a driving thin-film transistor (TR2), a sensing thin-film transistor (TR3), and a storage capacitor (Cst) may be located within each sub-emissive region.

[0040] The selection thin-film transistor (TR1) can turn the driving thin-film transistor (TR2) on / off according to a gate signal applied through the gate line (GL). The driving thin-film transistor (TR2) can supply a driving current to the corresponding light-emitting structure (500) according to the signal of the selection thin-film transistor (TR1) and a data signal applied through the corresponding data lines (DL1-DL4). The degree of degradation of each driving thin-film transistor (TR2) and / or each light-emitting structure (500) can be detected by the corresponding sensing thin-film transistor (TR3). The storage capacitor (Cst) can maintain the signal of the selection thin-film transistor (TR1) applied to the driving thin-film transistor (TR2) for a certain period of time.

[0041] The structure of the above-mentioned selection thin film transistor (TR1) and the above-mentioned sensing thin film transistor (TR3) may be the same as the structure of the above-mentioned driving thin film transistor (TR2). For example, the above-mentioned driving thin film transistor (TR2) may include a semiconductor pattern (210), a gate insulating film (220), a gate electrode (230), an interlayer insulating film (240), a source electrode (250), and a drain electrode (260).

[0042] The semiconductor pattern (210) may be located close to the lower substrate (100). The semiconductor pattern (210) may include a semiconductor material. For example, the semiconductor pattern (210) may include amorphous silicon or polycrystalline silicon. The semiconductor pattern (210) may include an oxide semiconductor material. For example, the semiconductor pattern (210) may include IGZO.

[0043] The semiconductor pattern (210) may include a source region, a drain region, and a channel region. The channel region may be located between the source region and the drain region. The conductivity of the channel region may be lower than the conductivity of the source region and the conductivity of the drain region. For example, the source region and the drain region may include conductive impurities.

[0044] An organic light-emitting display device according to an embodiment of the present invention is described such that the semiconductor pattern (210) of each thin-film transistor (TR1, TR2, TR3) is in direct contact with a lower substrate (100). However, an organic light-emitting display device according to another embodiment of the present invention may further include a buffer insulating film located between the lower substrate (100) and the thin-film transistors (TR1, TR2, TR3). The buffer insulating film may extend outwardly from the semiconductor pattern (210). For example, the buffer insulating film may cover the entire surface of the lower substrate (100). The buffer insulating film may include an insulating material. For example, the buffer insulating film may include silicon oxide.

[0045] The gate insulating film (220) may be positioned on the semiconductor pattern (210). The gate insulating film (220) may include an insulating material. For example, the gate insulating film (220) may include silicon oxide and / or silicon nitride. The gate insulating film (220) may have a multilayer structure. The gate insulating film (220) may include a High-K material. For example, the gate insulating film (220) may include hafnium oxide (HfO) or titanium oxide (TiO).

[0046] The gate electrode (230) may be located on the gate insulating film (220). The gate electrode (230) may overlap with the channel region of the semiconductor pattern (210). The gate electrode (230) may be insulated from the semiconductor pattern (210) by the gate insulating film (220). For example, the gate electrode (230) may include a side that is vertically aligned with the side of the gate insulating film (220). The side of the gate insulating film (220) may be continuous with the side of the gate electrode (230).

[0047] The gate electrode (230) may include a conductive material. For example, the gate electrode (230) may include a metal such as aluminum (Al), chromium (Cr), copper (Cu), titanium (Ti), molybdenum (Mo), or tungsten (W). The gate electrode (230) may have a multilayer structure. The gate line (GL) may include the same material as the gate electrode (230). The gate electrode (230) may be located in the same layer as the gate line (GL). For example, the structure of the gate line (GL) may be the same as the structure of the gate electrode (230).

[0048] The interlayer insulating film (240) may be located on the semiconductor pattern (210) and the gate electrode (230). The interlayer insulating film (240) may extend outward from the semiconductor pattern (210). For example, at the outer side of the semiconductor pattern (210), the interlayer insulating film (240) may be in direct contact with the buffer insulating film (110). The interlayer insulating film (240) may include an insulating material. For example, the interlayer insulating film (240) may include silicon oxide.

[0049] The source electrode (250) and the drain electrode (260) may be located on the interlayer insulating film (240). The source electrode (250) may be electrically connected to the source region of the semiconductor pattern (210). The drain electrode (260) may be electrically connected to the drain region of the semiconductor pattern (210). For example, the interlayer insulating film (240) may include a first interlayer contact hole (241h) exposing the source region of the semiconductor pattern (210) and an interlayer contact hole (242h) exposing the drain region. The drain electrode (260) may be spaced apart from the source electrode (250).

[0050] The source electrode (250) and the drain electrode (260) may include a conductive material. For example, the source electrode (250) and the drain electrode (260) may include a metal such as aluminum (Al), chromium (Cr), copper (Cu), titanium (Ti), molybdenum (Mo), or tungsten (W). The drain electrode (260) may include the same material as the source electrode (250). The source electrode (250) may have a multilayer structure. The structure of the drain electrode (260) may be the same as the structure of the source electrode (250). For example, the drain electrode (260) may have a multilayer structure.

[0051] The data lines (DL1-DL4), the reference voltage lines (Vref), and the power voltage lines (PL) may include the same material as the source electrode (250) and the drain electrode (260). The data lines (DL1-DL4), the reference voltage lines (Vref), and the power voltage lines (PL) may be located in the same layer as the source electrode (250) and the drain electrode (260). For example, the data lines (DL1-DL4), the reference voltage lines (Vref), and the power voltage lines (PL) may be located on the interlayer insulating film (240). The structure of the data lines (DL), the structure of the reference voltage lines (Vref), and the structure of the power voltage lines (PL) may be the same as the structure of the source electrode (250) and the structure of the drain electrode (260). For example, the data lines (DL) and the power voltage lines (PL) may have a multilayer structure.

[0052] An organic light-emitting display device according to an embodiment of the present invention is described as having an interlayer insulating film (240) located between the gate electrode (230), source electrode (250), and drain electrode (260) of each thin-film transistor (TR1, TR2, TR3). However, an organic light-emitting display device according to another embodiment of the present invention may include a gate insulating film (220) located between the gate electrode (230), source electrode (250), and drain electrode (260) of each thin-film transistor (TR1, TR2, TR3) located within each light-emitting region (EA).

[0053] The storage capacitor (Cst) may be spaced apart from the thin-film transistors (TR1, TR2, TR3). The storage capacitor (Cst) may be electrically connected to the thin-film transistors (TR1, TR2, TR3). For example, the storage capacitor (Cst) may include a lower capacitor electrode (310), a capacitor insulating film (320), and an upper capacitor electrode (330) stacked in sequence.

[0054] The lower capacitor electrode (310) and the upper capacitor electrode (330) may include a conductive material. For example, the lower capacitor electrode (310) may include the same material as the gate electrode (230). The structure of the lower capacitor electrode (310) may be the same as the structure of the gate electrode (230). The upper capacitor electrode (330) may include the same material as the source electrode (250) and the drain electrode (260). The structure of the upper capacitor electrode (330) may be the same as the structure of the source electrode (250) and the structure of the drain electrode (260). For example, the upper capacitor electrode (330) may be connected to the drain electrode (260) of the driving thin-film transistor (TR2). The upper capacitor electrode (330) may have a multilayer structure.

[0055] The capacitor insulating film (320) may include an insulating material. For example, the capacitor insulating film (320) may include silicon oxide. The capacitor insulating film (320) may include the same material as the interlayer insulating film (240). For example, the capacitor insulating film (320) may be connected to the interlayer insulating film (240).

[0056] An organic light-emitting display device according to an embodiment of the present invention may further include a lower insulating film (301) located between a lower substrate (100) and a storage capacitor (Cst). The side of the lower insulating film (301) may be continuous with the side of the lower capacitor electrode (310). For example, the lower insulating film (301) may include the same material as the gate insulating film (220).

[0057] A dummy pattern (WL) may be positioned on the lower substrate (100). For example, the dummy pattern (WL) may extend parallel to the data lines (DL1-DL4). The dummy pattern (WL) may extend along the space between the light-emitting region (EA) and the transmission region (TA). For example, the dummy pattern (WL) may include a region that overlaps with the transmission region (TA) of the lower substrate (100).

[0058] The dummy pattern (WL) may include a conductive material. The dummy pattern (WL) may include a material identical to one of the conductive layers of the thin-film transistors (TR1, TR2, TR3). For example, the dummy pattern (WL) may include a material identical to the source electrode (250) and the drain electrode (260). The dummy pattern (WL) may include a material identical to the data lines (DL1-DL4).

[0059] An organic light-emitting display device according to an embodiment of the present invention may further include a lower protective film (130) located on thin-film transistors (TR1, TR2, TR3), a storage capacitor (Cst), and a dummy pattern (WL). The lower protective film (130) can prevent external moisture and hydrogen, etc., from penetrating into the thin-film transistors (TR1, TR2, TR3). The thin-film transistors (TR1, TR2, TR3), the storage capacitor (Cst), and the dummy pattern (WL) may be covered by the lower protective film (130). The lower protective film (130) may include an insulating material. For example, the lower protective film (130) may include silicon oxide and / or silicon nitride.

[0060] The auxiliary electrode (410) may be located on the lower protective film (130). The auxiliary electrode (410) may be located within the light-emitting region (EA). For example, the auxiliary electrode (410) may be located on the thin-film transistors (TR1, TR2, TR3). The auxiliary electrode (410) may include a conductive material. For example, the auxiliary electrode (410) may include a metal such as copper (Cu), molybdenum (Mo), titanium (Ti), aluminum (Al), tungsten (W), etc. The auxiliary electrode (410) may have a multilayer structure. For example, the auxiliary electrode (410) may include a lower auxiliary electrode (411) and an upper auxiliary electrode (412) located on the lower auxiliary electrode (411).

[0061] An organic light-emitting display device according to an embodiment of the present invention may further include an auxiliary clad layer (415) located on an auxiliary electrode (410). The auxiliary clad layer (415) may prevent damage to the auxiliary electrode (410) by a subsequent process. For example, the auxiliary electrode (410) may be covered by the auxiliary clad layer (415). The auxiliary clad layer (415) may include a conductive material. The auxiliary clad layer (415) may include a material with low reactivity. For example, the auxiliary clad layer (415) may include a transparent conductive material such as ITO.

[0062] An organic light-emitting display device according to an embodiment of the present invention may further include a lower overcoat layer (140) located between a lower protective film (130) and an auxiliary electrode (410). The lower overcoat layer (140) may eliminate step differences caused by the thin-film transistors (TR1, TR2, TR3) and the storage capacitor (Cst). For example, the upper surface of the lower overcoat layer (140) facing the lower substrate (100) may be a flat surface. The upper surface of the lower overcoat layer (140) may be parallel to the surface of the lower substrate (100). The lower overcoat layer (140) may include an insulating material. For example, the lower overcoat layer (140) may include an organic insulating material.

[0063] The lower overcoat layer (140) may include a lower through-hole (142h). The lower through-hole (142h) may be located on the dummy pattern (WL). For example, the dummy pattern (WL) located on the transparent area (TA) of the lower substrate (100) may overlap with the lower through-hole (142h) of the lower overcoat layer (140).

[0064] The repair electrode (430) may be located between the light-emitting region (EA) and the transmission region (TA) of the lower substrate (100). For example, the repair electrode (430) may include a region overlapping with the dummy pattern (WL). The repair electrode (430) may be located on the lower overcoat layer (140). The repair electrode (430) may extend into the lower through-hole (142h). Within the lower through-hole (142h), the repair electrode (430) may come into direct contact with the lower protective film (130). For example, the area between the dummy pattern (WL) and the repair electrode (430) may be insulated by the lower protective film (130). The horizontal length of the portion of the repair electrode (430) that overlaps with the dummy pattern (WL) may be smaller than the horizontal length of the upper surface of the dummy pattern (WL) facing the repair electrode (430).

[0065] The repair electrode (430) may include a conductive material. For example, the repair electrode (430) may include a metal such as copper (Cu), molybdenum (Mo), titanium (Ti), aluminum (Al), tungsten (W), etc. The structure of the repair electrode (430) may be the same as the structure of the auxiliary electrode (410). For example, the repair electrode (430) may include a lower repair electrode (431) and an upper repair electrode (432) located on the lower repair electrode (431).

[0066] An organic light-emitting display device according to an embodiment of the present invention may further include a repair clad layer (435) located on a repair electrode (430). The repair clad layer (435) may cover the repair electrode (430). The repair clad layer (435) may include a conductive material. The repair clad layer (435) may include the same material as the auxiliary clad layer (415). For example, the repair clad layer (435) may include a transparent conductive material such as ITO.

[0067] The light-emitting structure (500) can implement a specific color. The light-emitting structure (500) can be located within the light-emitting region (EA). For example, the light-emitting structure (500) can be located on the auxiliary electrode (410). The light-emitting structure (500) may include a lower light-emitting electrode (510), a light-emitting layer (520), and an upper light-emitting electrode (530) stacked in order.

[0068] An organic light-emitting display device according to an embodiment of the present invention may further include an upper overcoat layer (150) located between an auxiliary electrode (410) and a light-emitting structure (500). The upper overcoat layer (150) may eliminate a step difference caused by the auxiliary electrode (410). For example, the upper surface of the upper overcoat layer (150) facing the light-emitting structure (500) may be a flat surface. The upper surface of the upper overcoat layer (150) may be parallel to the upper surface of the lower overcoat layer (140). The upper overcoat layer (150) may include an insulating material. For example, the upper overcoat layer (150) may include an organic insulating material. The upper overcoat layer (150) may include a material different from that of the lower overcoat layer (140).

[0069] The upper overcoat layer (150) may extend onto the transmission area (TA) of the lower substrate (100). The upper overcoat layer (150) may include an upper through-hole (154h) that overlaps with a portion of the dummy pattern (WL). The upper through-hole (154h) may overlap with the lower through-hole (142h). The upper through-hole (154h) may expose a portion of the repair electrode (430) located within the lower through-hole (142h). For example, the size of the upper through-hole (154h) may be smaller than the size of the lower through-hole (142h). The upper overcoat layer (150) may extend onto the repair electrode (430) covering the side of the lower overcoat layer (140).

[0070] The light-emitting structure (500) can be controlled by the corresponding thin-film transistors (TR1, TR2, TR3). For example, the lower light-emitting electrode (510) of the light-emitting structure (500) can be electrically connected to the drain electrode (260) of the corresponding driving thin-film transistor (TR2). For example, the lower protective film (130), the lower overcoat layer (140), and the upper overcoat layer (150) may each include electrode contact holes (131h, 141h, 151h) that expose a portion of the upper capacitor electrode (330) connected to the drain electrode (260) of the corresponding driving thin-film transistor (TR2).

[0071] An organic light-emitting display device according to an embodiment of the present invention may further include a connecting electrode (420) located between a lower overcoat layer (140) and an upper overcoat layer (150). The connecting electrode (420) may electrically connect the lower light-emitting electrode (510) of the light-emitting structure (500) to the drain electrode (260) of the corresponding driving thin-film transistor (TR2). For example, the lower light-emitting electrode (510) may be connected to the connecting electrode (420) through an electrode contact hole (151h) of the upper overcoat layer (150). The connecting electrode (420) may be connected to the upper capacitor electrode (330), which is connected to the drain electrode (260) of the corresponding driving thin-film transistor (TR2), through an electrode contact hole (131h) of the lower protective film (130) and an electrode contact hole (141h) of the lower overcoat layer (140). The connecting electrode (420) may include a conductive material. For example, the connecting electrode (420) may include a metal such as copper (Cu), molybdenum (Mo), titanium (Ti), aluminum (Al), tungsten (W), etc. The connecting electrode (420) may include the same material as the auxiliary electrode (410). The connecting electrode (420) may have a multilayer structure. For example, the structure of the connecting electrode (420) may be the same as the structure of the auxiliary electrode (410). The connecting electrode (420) may include a lower connecting electrode (421) and an upper connecting electrode (422) located on the lower connecting electrode (421).

[0072] An organic light-emitting display device according to an embodiment of the present invention may further include a connecting clad layer (425) located between a connecting electrode (420) and an upper overcoat layer (150). The connecting clad layer (425) may cover the connecting electrode (420). The connecting clad layer (425) may include a conductive material. For example, the connecting clad layer (425) may include the same material as the auxiliary clad layer (410). The connecting clad layer (425) may include a transparent conductive material such as ITO.

[0073] The lower light-emitting electrode (510) may include a conductive material. The lower light-emitting electrode (510) may include a material with high reflectivity. For example, the lower light-emitting electrode (510) may include a metal such as aluminum (Al) and silver (Ag). The lower light-emitting electrode (510) may have a multilayer structure. For example, the lower light-emitting electrode (510) may have a structure in which a reflective electrode containing a material with high reflectivity is positioned between transparent electrodes containing a transparent conductive material such as ITO.

[0074] The lower light-emitting electrode (510) may include a region located on the transmission region (TA) of the lower substrate (100). For example, the lower light-emitting electrode (510) may be electrically connected to the repair electrode (430) on the transmission region (TA). The upper overcoat layer (150) may further include a repair contact hole (153h) that exposes a portion of the repair electrode (430). The repair contact hole (153h) may be spaced apart from the upper through hole (154h). The lower light-emitting electrode (510) may overlap with the repair contact hole (153h). The lower light-emitting electrode (510) may be connected to the repair electrode (430) through the repair contact hole (153h).

[0075] The organic light-emitting layer (520) can generate light of brightness corresponding to the voltage difference between the lower light-emitting electrode (510) and the upper light-emitting electrode (530). For example, the organic light-emitting layer (520) may include an emitting material layer (EML) containing an organic light-emitting material. The organic light-emitting layer (520) may have a multilayer structure for high light-emitting efficiency. For example, the organic light-emitting layer (520) may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0076] The upper light-emitting electrode (530) may include a conductive material. The upper light-emitting electrode (530) may include a material different from that of the lower light-emitting electrode (510). For example, the upper light-emitting electrode (530) may be a transparent electrode. Accordingly, in an organic light-emitting display device according to an embodiment of the present invention, light generated by the organic light-emitting layer (520) may be emitted through the upper light-emitting electrode (530).

[0077] An organic light-emitting display device according to an embodiment of the present invention may further include a bank insulating film (160) for insulating adjacent light-emitting structures (500). For example, the bank insulating film (160) may cover the edge of the lower light-emitting electrode (510) of each light-emitting structure (500). The light-emitting layer (520) and the upper light-emitting electrode (530) may be laminated on the surface of the lower light-emitting electrode (510) exposed by the bank insulating film (160). The bank insulating film (160) may include an insulating material. For example, the bank insulating film (160) may include an organic insulating material such as benzocyclobutene (BCB), polyimide, or photoacryl. The lower overcoat layer (140) and the upper overcoat layer (150) may include a material different from the bank insulating film (160).

[0078] The bank insulating film (160) may extend over the transmission area (TA) of the lower substrate (100). The bank insulating film (160) may include a bank through-hole (160h) that overlaps with the upper through-hole (154h). Accordingly, in an organic light-emitting display device according to an embodiment of the present invention, a portion of the repair electrode (430) that overlaps with the dummy pattern (WL) may be exposed by the upper overcoat layer (150) and the bank insulating film (160). Thus, in an organic light-emitting display device according to an embodiment of the present invention, a repair process can be performed without damaging adjacent insulating films by welding the dummy pattern (WL) and the repair electrode (430) by irradiating a laser through the upper through-hole (154h) and the bank through-hole (160h).

[0079] The organic light-emitting layer (520) and the upper light-emitting electrode (530) can be extended onto the bank insulating film (160). The upper light-emitting electrode (530) can be electrically connected to the auxiliary electrode (410). Accordingly, the organic light-emitting display device according to an embodiment of the present invention can prevent brightness non-uniformity caused by voltage drop of the upper light-emitting electrode (530).

[0080] An organic light-emitting display device according to an embodiment of the present invention may further include a partition (700) for providing a space in which an upper light-emitting electrode (530) can be electrically connected to an auxiliary electrode (410). For example, a portion of the light-emitting layer (520) may be separated from other portions by the partition (700). The upper light-emitting electrode (530) may be electrically connected to the auxiliary electrode (410) through the space between the separated portions of the light-emitting layer (520) by the partition (700). The vertical length of the partition (700) may be greater than the vertical thickness of the bank insulating film (160). For example, the partition (700) may include a lower partition (710) and an upper partition (720) located on the lower partition (710). The lower partition (710) and the upper partition (720) may include an insulating material. For example, the lower partition (710) may contain the same material as the bank insulating film (160). The upper partition (720) may contain a different material from the lower partition (610). For example, the upper partition (720) may contain silicon oxide and / or silicon nitride.

[0081] An organic light-emitting display device according to an embodiment of the present invention may further include an intermediate electrode (550) located between an auxiliary electrode (410) and a bank insulating film (160). The intermediate electrode (550) may be connected to the auxiliary electrode (410). For example, the upper overcoat layer (150) may include a through hole (152h) that exposes a portion of the auxiliary electrode (410). The partition (700) may overlap with the intermediate electrode (550). For example, the light-emitting layer (520) may expose a portion of the intermediate electrode (550) by the partition (700). The bank insulating film (160) may cover the edge of the intermediate electrode (550). The partition (700) may be located between the bank insulating films (160). The upper light-emitting electrode (530) may come into contact with a portion of the intermediate electrode (550) where the light-emitting layer (520) is not formed by the partition (700). The upper light-emitting electrode (530) may be electrically connected to the auxiliary electrode (410) through the intermediate electrode (550). The intermediate electrode (550) may include a conductive material. For example, the intermediate electrode (550) may include the same material as the lower light-emitting electrode (510). The intermediate electrode (550) may have a multilayer structure. For example, the structure of the intermediate electrode (550) may be the same as the structure of the lower light-emitting electrode (510).

[0082] The organic light-emitting layer (520) and the upper light-emitting electrode (530) may extend onto the transmission region (TA) of the lower substrate (100). For example, the organic light-emitting layer (520) and the upper light-emitting electrode (530) may extend onto a portion of the repair electrode (430) that overlaps with the dummy pattern (WL) through the bank through-hole (160h) and the upper through-hole (154h).

[0083] The capping insulating film (600) may be located within the upper through-hole (154h) on the repair electrode (430). A portion of the repair electrode (430) exposed by the bank through-hole (160h) and the upper through-hole (154h) may be covered by the capping insulating film (600). The organic light-emitting layer (520) and the upper light-emitting electrode (530) may extend onto the capping insulating film (600). For example, the capping insulating film (600) may be in direct contact with the repair electrode (430) and the organic light-emitting layer (520).

[0084] The capping insulating film (600) may include an insulating material. Accordingly, in an organic light-emitting display device according to an embodiment of the present invention, the repair electrode (430) may be insulated from the upper light-emitting electrode (530) by the capping insulating film (600) and the organic light-emitting layer (520). The capping insulating film (600) may include a material different from the upper overcoat layer (150) and the bank insulating film (160). For example, the capping insulating film (600) may include an inorganic insulating material. The capping insulating film (600) may include silicon oxide, silicon nitride, and / or silicon oxynitride. The capping insulating film (600) may have a multilayer structure. Accordingly, the organic light-emitting display repair electrode (430) according to an embodiment of the present invention may be prevented from being shorted to the upper light-emitting electrode (530).

[0085] The capping insulating film (600) may extend along the side of the upper overcoat layer (150) overlapping with the dummy pattern (WL). For example, the capping insulating film (600) may extend between the upper overcoat layer (150) and the bank insulating film (160). The capping insulating film (600) may be in the shape of a liner. For example, the thickness of the capping insulating film (600) on the repair electrode (430) may be the same as the thickness of the capping insulating film (600) on the side of the upper overcoat layer (150).

[0086] The capping insulating film (600) may be located only on the transmission region (TA) of the lower substrate (100). For example, the capping insulating film (600) may not extend onto the light-emitting region (EA) of the lower substrate (100). Accordingly, in an organic light-emitting display device according to an embodiment of the present invention, the efficiency of the light-emitting structure (500) may not be reduced by the capping insulating film (600).

[0087] An organic light-emitting display device according to an embodiment of the present invention may further include an upper substrate (800) facing a lower substrate (100). The upper substrate (800) may overlap with the light-emitting region (EA) and the transmission region (TA) of the lower substrate (100). For example, the upper substrate (800) may be positioned on the light-emitting structure (500) and the repair electrode (430). The upper substrate (800) may include an insulating material. The upper substrate (800) may include a transparent material. For example, the upper substrate (800) may include glass or plastic.

[0088] An organic light-emitting display device according to an embodiment of the present invention may have light-emitting structures (500) in each sub-light-emitting region that can produce the same color. For example, the light-emitting structures (500) in each sub-light-emitting region may include a white light-emitting layer (520). An organic light-emitting display device according to an embodiment of the present invention may further include a black matrix (810) and a color filter (820) located on an upper substrate (800). Accordingly, an organic light-emitting display device according to an embodiment of the present invention may have different colors in each sub-light-emitting region where the light-emitting structures (500) that produce the same color are located.

[0089] An organic light-emitting display device according to an embodiment of the present invention may further include a filler (900) that fills the space between a lower substrate (100) and an upper substrate (800). The filler (900) can prevent damage to the light-emitting structure (500) caused by external impact. For example, the filler (900) may extend between the light-emitting structure (500), the black matrix (810), and the color filter (820).

[0090] An organic light-emitting display device according to an embodiment of the present invention is described as having a light-emitting structure (500) in direct contact with a filler (900). However, an organic light-emitting display device according to another embodiment of the present invention may further include an upper protective film located between the light-emitting structure (500) and the filler (900). The upper protective film can prevent external moisture, etc. from penetrating into the light-emitting structure (500). The upper protective film may include a multilayer structure. For example, the upper protective film may have a structure in which an inorganic film containing an inorganic material and an organic film containing an organic material are laminated.

[0091] Consequently, the organic light-emitting display device according to an embodiment of the present invention includes an upper through-hole (154h) and a bank through-hole (160h) in which the upper overcoat layer (150) and the bank insulating film (160) respectively overlap with the repair electrode (430), and a capping insulating film (600) is positioned on the repair electrode (430) exposed by the upper through-hole (154h) to insulate the repair electrode (430) from the upper light-emitting electrode (530), thereby maintaining insulation between the repair electrode (430) and the upper light-emitting electrode (530) and preventing the laser irradiated for the repair process from being absorbed and refracted by the insulating films. Therefore, in the organic light-emitting display device according to an embodiment of the present invention, damage to adjacent insulating films by the laser used in the repair process is prevented, and the required process time for the repair process can be shortened without physical damage.

[0092] An organic light-emitting display device according to an embodiment of the present invention is described as having a capping insulating film (600) extending between an upper overcoat layer (150) and a bank insulating film (160). However, an organic light-emitting display device according to another embodiment of the present invention may have the capping insulating film (600) extend to various positions. For example, an organic light-emitting display device according to another embodiment of the present invention may have the capping insulating film (600) extending between a repair electrode (430) and an upper overcoat layer (150), as shown in FIG. 3. In this case, the capping insulating film (600) of the organic light-emitting display device according to another embodiment of the present invention may include a capping contact hole (600h) for connecting between the repair electrode (430) and the lower electrode (510). Alternatively, an organic light-emitting display device according to another embodiment of the present invention may include a capping insulating film (600) extending between a bank insulating film (160) and a light-emitting layer (520), as shown in FIG. 4. Accordingly, in an organic light-emitting display device according to another embodiment of the present invention, the formation order of the capping insulating film (600) can be adjusted according to the convenience of the process. Therefore, in an organic light-emitting display device according to another embodiment of the present invention, the reliability of the repair process can be efficiently improved and the process time can be effectively shortened.

[0093] An organic light-emitting display device according to an embodiment of the present invention is described as having a capping insulating film (600) comprising an inorganic insulating material. However, an organic light-emitting display device according to another embodiment of the present invention may include a capping insulating film (600) of an organic insulating material. For example, as illustrated in FIG. 5, an organic light-emitting display device according to another embodiment of the present invention may include a capping insulating film (160p) comprising the same material as the bank insulating film (160). In an organic light-emitting display device according to another embodiment of the present invention, the capping insulating film (160p) may be formed simultaneously with the bank insulating film (160). For example, a method for forming an organic light-emitting display device according to another embodiment of the present invention may include the steps of forming an insulating layer for a bank insulating film (160) on a lower light-emitting electrode (510), fully exposing a first region of the insulating layer and partially exposing a second region through an exposure process using a halftone mask, and removing the exposed region of the insulating layer to simultaneously form a bank insulating film (160) that partially exposes the lower light-emitting electrode (510) and a capping insulating film (160p) that covers a portion of the repair electrode (430) exposed by an upper through-hole (154h). The capping insulating film (160p) may extend along the side of the upper overcoat layer (150) and be connected to the bank insulating film (160). Accordingly, the organic light-emitting display device according to another embodiment of the present invention can perform a repair process without physical damage, while shortening the process time and improving the reliability of the repair process. Explanation of the symbols

[0094] 100: Lower substrate 130: Lower protective film 140: Lower overcoat layer 150: Upper overcoat layer 320: Repair electrode 435: Repair clad layer 500: Luminous structure 510: Lower luminous electrode 600 : Capping insulating film

Claims

Claim 1 An organic light-emitting display device comprising: a repair electrode located on a lower substrate; an upper insulating layer located on the repair electrode and including an upper through-hole that overlaps with a portion of the repair electrode; a lower light-emitting electrode located on the upper insulating layer and connected to the repair electrode; a bank insulating film located on the upper insulating layer to overlap with the upper through-hole and covering at least a portion of the repair electrode; and a capping insulating film covering a portion of the repair electrode that overlaps with the upper through-hole. Claim 2 In claim 1, the organic light-emitting display device wherein the upper insulating layer is an overcoat layer Claim 3 An organic light-emitting display device according to claim 1, wherein the capping insulating film extends along the side of the upper through-hole to cover the lower light-emitting electrode. Claim 4 An organic light-emitting display device according to claim 3, wherein the thickness of the capping insulating film on the repair electrode is the same as the thickness of the capping insulating film on the side of the upper through hole. Claim 5 In claim 3, the capping insulating film comprises the same material as the bank insulating film in an organic light-emitting display device. Claim 6 An organic light-emitting display device according to claim 1, further comprising: a lower protective film located between the lower substrate and the repair electrode; a dummy pattern located between the lower substrate and the lower protective film and including a region overlapping with the repair electrode; and a thin-film transistor located between the lower substrate and the lower protective film and spaced apart from the dummy pattern, wherein the dummy pattern comprises the same material as one of the conductive layers of the thin-film transistor. Claim 7 An organic light-emitting display device according to claim 6, further comprising a lower overcoat layer located between the lower substrate and the repair electrode, wherein the lower overcoat layer includes a lower through-hole that overlaps with the upper through-hole and the dummy pattern, and the repair electrode extends into the inner side of the lower through-hole. Claim 8 In claim 7, an organic light-emitting display device in which the size of the upper through-hole is smaller than the size of the lower through-hole. Claim 9 An organic light-emitting display device comprising: a lower substrate including a light-emitting region and a transmission region; a repair electrode located on the transmission region of the lower substrate; an upper insulating layer located on the repair electrode and including an upper through-hole that exposes a portion of the repair electrode; a lower light-emitting electrode located on the upper insulating layer and overlapping with the light-emitting region of the lower substrate; a bank insulating film that overlaps with the upper through-hole and covers at least a portion of the repair electrode; and a capping insulating film that covers the repair electrode exposed by the upper through-hole. Claim 10 An organic light-emitting display device according to claim 9, further comprising: a filler located on the bank insulating film and extending into the interior of the upper through-hole; and an upper substrate located on the filler and overlapping with the light-emitting region and the transmission region. Claim 11 In claim 9, the capping insulating film extends between the repair electrode and the upper insulating layer in an organic light-emitting display device. Claim 12 In claim 11, the end of the repair electrode is covered by the capping insulating film in an organic light-emitting display device. Claim 13 An organic light-emitting display device according to claim 9, further comprising: an organic light-emitting layer located on a portion of the lower light-emitting electrode exposed by the bank insulating film; and an upper light-emitting electrode located on the organic light-emitting layer, wherein the organic light-emitting layer and the upper light-emitting electrode extend into the interior of the upper through-hole. Claim 14 In claim 13, the capping insulating film is an organic light-emitting display device in direct contact with the organic light-emitting layer. Claim 15 An organic light-emitting display device according to claim 9, wherein the upper insulating layer further comprises a contact hole spaced apart from the upper through-hole and overlapping with the repair electrode, wherein the upper insulating layer is an overcoat layer and the lower light-emitting electrode is connected to the repair electrode through the contact hole. Claim 16 In claim 9; the repair electrode is an organic light-emitting display device electrically connected to the lower light-emitting electrode.

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