Display device

Abstract

The present invention provides a display device capable of minimizing the occurrence of defects during the manufacturing process or during the use process after manufacturing, comprising: (i) a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and having a thin portion located at the edge of the bending region, which extends from the second region toward the first region and has a thickness thinner than the thickness at the center of the bending region; and (ii) an inorganic insulating layer disposed on the substrate, which exposes the thin portion in the bending region.

Description

Technology Field

[0001] Embodiments of the present invention relate to a display device, and more specifically, to a display device capable of minimizing the occurrence of defects during the manufacturing process or during the use process after manufacturing. Background Technology

[0002] Generally, a display device has a display portion located on a substrate. In such a display device, by bending at least a portion, visibility at various angles can be improved or the area of ​​the non-display region can be reduced. The problem to be solved

[0003] However, in the case of conventional display devices, there was a problem in that defects could occur in the bending part or adjacent parts during the manufacturing process of such a bent display device or during use after manufacturing.

[0004] The present invention aims to solve various problems, including those mentioned above, by providing a display device capable of minimizing the occurrence of defects during the manufacturing process or during the use process after manufacturing. However, these problems are exemplary and do not limit the scope of the present invention. means of solving the problem

[0005] According to one aspect of the present invention, a display device is provided comprising: (i) a substrate having a bending region located between a first region and a second region, which is bent about a bending axis, and having a thin portion located at the edge of the bending region and extending from the second region toward the first region, having a thickness thinner than the thickness at the center of the bending region; and (ii) an inorganic insulating layer disposed on the substrate, which exposes the thin portion in the bending region.

[0006] The above thin portion is a first groove extending from the second region toward the first region, and the inorganic insulating layer may have a first opening corresponding to the first groove.

[0007] The width of the first groove may be wider than the width of the first opening.

[0008] The inner surface of the first opening may protrude from the edge of the first groove toward the center of the first opening.

[0009] The substrate is located between the edge of the substrate and the first groove in the bending region and has a second groove extending in the direction of the first region in the second region, and the inorganic insulating layer may have a second opening corresponding to the second groove in the bending region.

[0010] At this time, the width of the second groove may be wider than the width of the second opening.

[0011] The inner surface of the second opening may protrude from the edge of the second groove toward the center of the second opening.

[0012] The second groove above may not be parallel to the first groove above.

[0013] The first groove above may be extended to have a straight shape, and the second groove above may be extended to have a curved shape.

[0014] Meanwhile, a metal layer covering the inner surface of the first opening and the bottom surface of the first groove may be further provided.

[0015] At this time, the portion on the inner surface of the first opening of the metal layer and the portion on the bottom surface of the first groove of the metal layer can be interconnected.

[0016] An additional insulating layer may be further provided, which is located on the above-mentioned inorganic insulating layer and has an additional opening corresponding to the first opening in the bending region.

[0017] The width of the additional opening above may be wider than the width of the first opening above.

[0018] The inner surface of the first opening may protrude from the edge of the additional opening toward the center of the first opening.

[0019] The above thin portion can reach the end portion of the substrate in the direction of the bending axis.

[0020] The edge of the above-mentioned inorganic insulating layer in the direction of the above-mentioned thin portion may correspond to the edge in the direction of the center of the above-mentioned bending region of the above-mentioned thin portion.

[0021] The edge in the central direction of the bending region of the above thin portion includes a straight line shape extending from the second region toward the first region, and the edge in the direction of the thin portion of the inorganic insulating layer may include a straight line shape extending from the second region toward the first region.

[0022] The end of the substrate in the direction of the bending axis may include a curved shape.

[0023] The end of the inorganic insulating layer in the direction of the thin portion protrudes toward the center of the thin portion, so that the lower surface of the end portion in the direction of the thin portion of the inorganic insulating layer can be spaced apart from the substrate.

[0024] A metal layer covering the side of the end of the thin portion direction of the above-mentioned inorganic insulating layer and the upper surface of the above-mentioned thin portion may be further provided.

[0025] The portion on the side of the inorganic insulating layer of the metal layer and the portion on the upper surface of the thin portion of the metal layer can be interconnected.

[0026] An additional insulating layer may be further provided, which is located on the inorganic insulating layer and exposes the upper surface of the end portion in the direction of the thin portion of the inorganic insulating layer.

[0027] The metal layer can cover a portion of the upper surface of the inorganic insulating layer.

[0028] A touch sensor layer is further provided that is located on the upper part of the first region of the substrate and includes a first touch conductive layer, and the metal layer may include the same material as the material included in the first touch conductive layer.

[0029] The apparatus further comprises a protective layer interposed between the inorganic insulating layer and the touch sensor layer, in contact with the touch sensor layer, and located on the first region and the bending region, and the metal layer may be located on the protective layer to contact the protective layer.

[0030] The above metal layer may have a multilayer structure.

[0031] A touch sensor layer is further provided that is located on the upper portion of the first region of the substrate and includes a first touch conductive layer and a second touch conductive layer, and the metal layer may include a first metal layer that includes a material identical to the material included in the first touch conductive layer, and a second metal layer that includes a material identical to the material included in the second touch conductive layer and is located on the first metal layer.

[0032] The apparatus further comprises a protective layer interposed between the inorganic insulating layer and the touch sensor layer, in contact with the touch sensor layer, and located on the first region and the bending region, and the first metal layer may be located on the protective layer to contact the protective layer.

[0033] The thickness of the portion of the inorganic insulating layer corresponding to the bending region may be thinner than the thickness of the portion corresponding to the center of the first region of the inorganic insulating layer.

[0034] According to another aspect of the present invention, a display device is provided comprising: (i) a substrate having a bending region located between a first region and a second region, which is bent about a bending axis, and having a first groove located at the edge of the bending region and extending from the second region toward the first region; and (ii) an inorganic insulating layer disposed on the substrate, which exposes the first groove in the bending region.

[0035] The above-mentioned inorganic insulating layer may have a first opening corresponding to the first groove.

[0036] The width of the first groove may be wider than the width of the first opening.

[0037] The inner surface of the first opening may protrude from the edge of the first groove toward the center of the first opening.

[0038] The substrate is located between the edge of the substrate and the first groove in the bending region and has a second groove extending in the direction of the first region in the second region, and the inorganic insulating layer may have a second opening corresponding to the second groove in the bending region.

[0039] The width of the second groove may be wider than the width of the second opening.

[0040] The inner surface of the second opening may protrude from the edge of the second groove toward the center of the second opening.

[0041] The second groove above may not be parallel to the first groove above.

[0042] The first groove above may be extended to have a straight shape, and the second groove above may be extended to have a curved shape.

[0043] A metal layer covering the inner surface of the first opening and the bottom surface of the first groove may be further provided.

[0044] The portion on the inner surface of the first opening of the metal layer and the portion on the bottom surface of the first groove of the metal layer can be interconnected.

[0045] An additional insulating layer may be further provided, which is located on the above-mentioned inorganic insulating layer and has an additional opening corresponding to the first opening in the bending region.

[0046] The width of the additional opening above may be wider than the width of the first opening above.

[0047] The inner surface of the first opening may protrude from the edge of the additional opening toward the center of the first opening.

[0048] The metal layer can cover a portion of the upper surface of the inorganic insulating layer.

[0049] A touch sensor layer is further provided that is located on the upper part of the first region of the substrate and includes a first touch conductive layer, and the metal layer may include the same material as the material included in the first touch conductive layer.

[0050] The apparatus further comprises a protective layer interposed between the inorganic insulating layer and the touch sensor layer, in contact with the touch sensor layer, and located on the first region and the bending region, and the metal layer may be located on the protective layer to contact the protective layer.

[0051] The above metal layer may have a multilayer structure.

[0052] A touch sensor layer is further provided that is located on the upper portion of the first region of the substrate and includes a first touch conductive layer and a second touch conductive layer, and the metal layer may include a first metal layer that includes a material identical to the material included in the first touch conductive layer, and a second metal layer that includes a material identical to the material included in the second touch conductive layer and is located on the first metal layer.

[0053] The apparatus further comprises a protective layer interposed between the inorganic insulating layer and the touch sensor layer, in contact with the touch sensor layer, and located on the first region and the bending region, and the first metal layer may be located on the protective layer to contact the protective layer.

[0054] The thickness of the portion of the inorganic insulating layer corresponding to the bending region may be thinner than the thickness of the portion corresponding to the center of the first region of the inorganic insulating layer.

[0055] Other aspects, features, and advantages other than those described above will become clear from the following specific details, claims, and drawings for implementing the invention. Effects of the invention

[0056] According to one embodiment of the present invention as described above, a display device capable of minimizing the occurrence of defects during the manufacturing process or during the use process after manufacturing can be implemented. Of course, the scope of the present invention is not limited by such effects. Brief explanation of the drawing

[0057] FIG. 1 is a perspective view schematically illustrating a part of a display device according to one embodiment of the present invention. FIG. 2 is a cross-sectional view schematically illustrating a part of the display device of FIG. 1. FIG. 3 is a cross-sectional view schematically illustrating a part of the display device of FIG. 1 from a different direction. FIG. 4 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 5 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 6 is a plan view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 7 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 8 is a plan view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 9 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 10 is a plan view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 11 is a plan view schematically illustrating a part of a display device according to another embodiment of the present invention. FIGS. 12 to 15 are cross-sectional views schematically illustrating the processes of a method for manufacturing a display device according to another embodiment of the present invention. FIG. 16 is a cross-sectional view schematically illustrating one process of a method for manufacturing a display device according to another embodiment of the present invention. FIG. 17 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 18 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 19 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 20 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. FIG. 21 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. Specific details for implementing the invention

[0058] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0059] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0060] In the following embodiments, when various components such as layers, films, regions, and plates are described as being "on" another component, this includes not only cases where they are "directly on" another component, but also cases where other components are interposed between them. Furthermore, for convenience of explanation, the size of components in the drawings may be exaggerated or reduced. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and therefore the present invention is not necessarily limited to what is illustrated.

[0061] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to three axes in an orthogonal coordinate system and can be interpreted in a broader sense that includes them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but they may also refer to different directions that are not orthogonal to each other.

[0062] FIG. 1 is a perspective view schematically illustrating a part of a display device according to one embodiment of the present invention, FIG. 2 is a cross-sectional view schematically illustrating a part of the display device of FIG. 1, and FIG. 3 is a cross-sectional view schematically illustrating a part of the display device of FIG. 1 from another direction.

[0063] As illustrated in FIG. 1, the substrate (100, see FIG. 2 and FIG. 3) of the display device according to the present embodiment has a bending region (BA) extended in a first direction (+y direction) and has a bent shape in the bending region (BA). In FIG. 2, for convenience of illustration and explanation, the substrate (100) is depicted as not being bent. In the manufacturing process of the display device, the display device as depicted in FIG. 2 is bent in the bending region (BA) as depicted in FIG. 1. FIG. 2 is a cross-sectional view taken along the first region (1A), the bending region (BA), and the second region (2A) as described below. FIG. 3 is also depicted as not being bent for convenience of illustration and explanation. FIG. 3 is a cross-sectional view taken along a direction parallel to the bending axis (BAX) as described below in the bending region (BA).

[0064] The substrate (100) has a roughly flat shape before being bent during the manufacturing process of the display device. When the substrate (100) has such a flat shape, the bending region (BA) is located between the first region (1A) and the second region (2A) in the second direction (+x direction) that intersects the first direction. The substrate (100) is bent around a bending axis (BAX) that extends in the first direction (+y direction) as shown in FIG. 1. Although FIG. 1 shows the first region (1A) having a shape similar to a rectangle in the xy plane, the present invention is not limited thereto. For example, the first region (1A) may have a shape similar to a circle, and various variations are possible. This is also true for the embodiments and variations described below.

[0065] The substrate (100) may include various materials having flexible or bendable properties, such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. Of course, the substrate (100) may have a multilayer structure including two layers (101, 105) containing such polymer resins and a barrier layer (103) containing inorganic material interposed between the layers (101, 105), as shown in FIGS. 2 and 3, and various modifications are possible. In this case, the barrier layer (103) may include silicon oxide, silicon nitride and / or silicon oxynitride, etc.

[0066] For reference, FIG. 1 illustrates that the width of the substrate (100) in the y-axis direction is not constant in the first region (1A), the bending region (BA), and the second region (2A), but the present invention is not limited thereto. For example, the width of the substrate (100) in the y-axis direction may be constant in the first region (1A), the bending region (BA), and the second region (2A). FIG. 1 illustrates that the width in the y-axis direction begins to narrow in the part adjacent to the bending region (BA) within the first region (1A), continues to narrow until it reaches the part adjacent to the first region (1A) within the bending region (BA), and then the width in the y-axis direction is maintained constant in the part adjacent to the second region (2A) of the bending region (BA), so that the width in the y-axis direction is constant in the second region (2A).

[0067] The first region (1A) includes a display region (DA). Of course, as shown in FIG. 2, the first region (1A) may include a part of a non-display region outside the display region (DA) in addition to the display region (DA). The second region (2A) also includes a non-display region.

[0068] In addition to the display element (300), a thin-film transistor (210) to which the display element (300) is electrically connected may also be located in the display area (DA) of the substrate (100), as shown in FIG. 2. FIG. 2 illustrates that an organic light-emitting element is located in the display area (DA) as the display element (300). The fact that such an organic light-emitting element is electrically connected to the thin-film transistor (210) can be understood as the pixel electrode (310) being electrically connected to the thin-film transistor (210).

[0069] A thin-film transistor (210) may include a semiconductor layer (211) comprising amorphous silicon, polycrystalline silicon, or an organic semiconductor material, a gate electrode (213), a source electrode (215a), and a drain electrode (215b). To ensure insulation between the semiconductor layer (211) and the gate electrode (213), a gate insulating film (120) comprising an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride may be interposed between the semiconductor layer (211) and the gate electrode (213). Additionally, an interlayer insulating film (130) comprising an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride may be disposed on the upper portion of the gate electrode (213), and the source electrode (215a) and the drain electrode (215b) may be disposed on such an interlayer insulating film (130). In this way, an insulating film containing inorganic materials can be formed through CVD or ALD (atomic layer deposition). This is also true for the embodiments and variations described below.

[0070] A barrier layer (111) and a buffer layer (113) containing inorganic materials such as silicon oxide, silicon nitride, and / or silicon oxynitride may be interposed between the thin film transistor (210) of this structure and the substrate (100). The barrier layer (111) and the buffer layer (113) may serve to increase the smoothness of the upper surface of the substrate (100) or to prevent or minimize the penetration of impurities from the substrate (100) into the semiconductor layer (211) of the thin film transistor (210). These barrier layer (111) and the buffer layer (113) may be collectively referred to as an inorganic insulating layer (110).

[0071] And a planarization layer (140) may be disposed on the thin-film transistor (210). For example, when an organic light-emitting diode is disposed on top of the thin-film transistor (210) as shown in FIG. 2, the planarization layer (140) may serve to generally planarize the upper surface of the protective film covering the thin-film transistor (210). This planarization layer (140) may be formed from organic materials such as acrylic, BCB (Benzocyclobutene), or HMDSO (hexamethyldisiloxane). Although the planarization layer (140) is shown as a single layer in FIG. 2, various variations are possible, such as it being multi-layered. Also, as shown in FIG. 2, the planarization layer (140) may have an opening outside the display area (DA) so that the portion of the planarization layer (140) in the display area (DA) and the portion of the planarization layer (140) in the second area (2A) are physically separated. This is to prevent impurities that have penetrated from the outside from reaching the inside of the display area (DA) through the inside of the flattening layer (140).

[0072] In the display area (DA) of the substrate (100), a display element (300) may be positioned on the planarization layer (140). The display element (300) may be, for example, an organic light-emitting element having a pixel electrode (310), a counter electrode (330), and an intermediate layer (320) interposed between them and including a light-emitting layer. The pixel electrode (310) is electrically connected to a thin-film transistor (210) by contacting either the source electrode (215a) or the drain electrode (215b) through an opening formed in the planarization layer (140), as shown in FIG. 2.

[0073] A pixel defining film (150) may be disposed on the upper portion of the flattening layer (140). This pixel defining film (150) serves to define pixels by having openings corresponding to each subpixel, that is, openings that expose at least the central portion of the pixel electrode (310). In addition, as shown in FIG. 2, the pixel defining film (150) serves to prevent arcs from occurring at the edge of the pixel electrode (310) by increasing the distance between the edge of the pixel electrode (310) and the opposing electrode (330) above the pixel electrode (310). Such a pixel defining film (150) may be formed from an organic material such as polyimide or HMDSO (hexamethyldisiloxane).

[0074] In FIG. 2, the pixel defining film (150) is shown as being located only in the first region (1A), but the present invention is not limited thereto. For example, when forming the pixel defining film (150), an insulating layer (not shown) may also be formed on the flattening film (140) in the bending region (BA) simultaneously using the same material. This is also true for the embodiments and variations described below.

[0075] The pixel electrode (310) of the organic light-emitting diode can be formed as a multilayer structure including crystalline ITO, etc. For example, the pixel electrode (310) may include a reflective layer including a metal such as Al or Cu, and a transparent conductive layer including crystalline ITO, etc. located on top of it. The counter electrode (330) may also include a transparent conductive layer.

[0076] The intermediate layer (320) of the organic light-emitting diode may include low-molecular-weight or high-molecular-weight materials. If it includes low-molecular-weight materials, it may have a stacked structure including a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL), and may include various organic materials including copper phthalocyanine (CuPc), N,N-di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (NPB), and tris-8-hydroxyquinoline aluminum (Alq3). These layers may be formed by vacuum deposition.

[0077] When the intermediate layer (320) includes a polymer material, it may generally have a structure including a hole transport layer (HTL) and an emitting layer (EML). In this case, the hole transport layer may include PEDOT, and the emitting layer may include polymer materials such as PPV (Poly-Phenylenevinylene) and Polyfluorene. Such an intermediate layer (320) can be formed by screen printing, inkjet printing, laser thermal imaging (LITI), etc.

[0078] Of course, the intermediate layer (320) is not necessarily limited to this and may have various structures. Also, the intermediate layer (320) may include a layer that is integral across a plurality of pixel electrodes (310), or may include a layer patterned to correspond to each of the plurality of pixel electrodes (310).

[0079] The counter electrode (330) is positioned above the display area (DA), and can be positioned to cover the display area (DA) as shown in FIG. 2. That is, the counter electrode (330) is formed as a single unit in a plurality of organic light-emitting elements and can correspond to a plurality of pixel electrodes (310).

[0080] Since these organic light-emitting elements can be easily damaged by moisture or oxygen from the outside, an encapsulation layer (410) can cover and protect these organic light-emitting elements. The encapsulation layer (410) covers the display area (DA) and can extend to the outside of the display area (DA). This encapsulation layer (410) may include a first inorganic encapsulation layer (411), an organic encapsulation layer (412), and a second inorganic encapsulation layer (413), as shown in FIG. 2.

[0081] The first inorganic encapsulation layer (411) covers the counter electrode (330) and may include silicon oxide, silicon nitride and / or silicon oxynitride, etc. Of course, other layers such as a capping layer may be interposed between the first inorganic encapsulation layer (411) and the counter electrode (330) as needed. Since this first inorganic encapsulation layer (411) is formed along the structure below it, its upper surface is not flat as shown in FIG. 2. The organic encapsulation layer (412) covers this first inorganic encapsulation layer (411), and unlike the first inorganic encapsulation layer (411), its upper surface can be made approximately flat. Specifically, the upper surface of the organic encapsulation layer (412) can be made approximately flat in the portion corresponding to the display area (DA). This organic encapsulation layer (412) may include one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. The second inorganic encapsulation layer (413) covers the organic encapsulation layer (412) and may include silicon oxide, silicon nitride and / or silicon oxynitride, etc. This second inorganic encapsulation layer (413) may prevent the organic encapsulation layer (412) from being exposed to the outside by contacting the first inorganic encapsulation layer (411) at the magnetic edge located outside the display area (DA).

[0082] In this way, the encapsulation layer (410) includes a first inorganic encapsulation layer (411), an organic encapsulation layer (412), and a second inorganic encapsulation layer (413). Through this multilayer structure, even if a crack occurs within the encapsulation layer (410), such cracks can be prevented from connecting between the first inorganic encapsulation layer (411) and the organic encapsulation layer (412), or between the organic encapsulation layer (412) and the second inorganic encapsulation layer (413). This prevents or minimizes the formation of a path for moisture or oxygen from the outside to penetrate into the display area (DA).

[0083] A polarizing plate (520) can be positioned on the encapsulation layer (410) by means of a transparent adhesive (510, OCA; optically clear adhesive). This polarizing plate (520) can serve to reduce external light reflection. Of course, the polarizing plate (520) can also be formed on the encapsulation layer (410) without using the adhesive (510).

[0084] For example, the polarizer (520) may include a linear polarizer that allows only linearly polarized light in one direction to pass through, and a λ / 4 wavelength plate located below it that converts linearly polarized light into circularly polarized light. External light passes through the polarizer (520), is reflected from the upper surface of the counter electrode (330), and then re-enters the polarizer (520). At this time, as the external light passes through the linear polarizer first and then passes through the λ / 4 wavelength plate twice, when the light re-enters the linear polarizer, it has a linearly polarized state in a direction that prevents it from passing through the linear polarizer. As a result, the visibility of the display device can be improved by reducing the reflection of external light.

[0085] These transparent adhesive (510) and polarizing plate (520) can cover the opening of the flattening layer (140), for example, as shown in FIG. 2. Of course, the display device according to the present embodiment is not always equipped with a polarizing plate (520), and the polarizing plate (520) may be omitted or replaced with other components as needed. For example, the polarizing plate (520) may be omitted and external light reflection may be reduced using a black matrix and a color filter.

[0086] Meanwhile, a gate insulating film (120) and an interlayer insulating film (130) containing inorganic materials may be collectively referred to as an inorganic insulating film. Such an inorganic insulating film has an opening corresponding to a bending region (BA) as shown in FIG. 2. That is, each of the gate insulating film (120) and the interlayer insulating film (130) may have openings (120a, 130a) corresponding to a bending region (BA). That such an opening corresponds to a bending region (BA) can be understood as the opening overlapping with the bending region (BA). In this case, the area of ​​the opening may be larger than the area of ​​the bending region (BA). To this end, FIG. 2 is illustrated as having a width (OW) of the opening that is larger than the width (BAw) of the bending region (BA). Here, the area of ​​the opening can be defined as the area of ​​the narrowest opening among the openings (120a, 130a) of the gate insulating film (120) and the interlayer insulating film (130).

[0087] Of course, as illustrated in FIG. 2, a portion of the upper portion of the inorganic insulating layer (110) located below the inorganic insulating film, that is, a portion of the upper portion of the buffer layer (113), can also be removed together when forming an opening in the inorganic insulating film. FIG. 2 is illustrated as having a thinner thickness in the portion of the buffer layer (113) corresponding to the opening in the inorganic insulating film. In this way, the thickness in the portion corresponding to the bending region (BA) of the inorganic insulating layer (110) may be thinner than the thickness in the portion corresponding to the center of the first region (1A) of the inorganic insulating layer (110). In this case, the area of ​​the portion (110a) where the thickness of the inorganic insulating layer (110) has thinned may be defined as the area of ​​the opening in the inorganic insulating film. In FIG. 2, the portion (110a) where the thickness of the inorganic insulating layer (110) is reduced is shown as defining the opening of the inorganic insulating film.

[0088] For reference, during the manufacturing process, the opening (120a) of the gate insulating film (120) and the opening (130a) of the interlayer insulating film (130) can be formed simultaneously. When forming the thin-film transistor (210), contact holes penetrating the gate insulating film (120) and the interlayer insulating film (130) must be formed so that the source electrode (215a) and the drain electrode (215b) contact the semiconductor layer (211). When forming these contact holes, the opening (120a) of the gate insulating film (120) and the opening (130a) of the interlayer insulating film (130) can be formed simultaneously. Accordingly, the inner surface of the opening (120a) of the gate insulating film (120) and the inner surface of the opening (130a) of the interlayer insulating film (130) can form a continuous surface as shown in FIG. 2. And when forming such openings, a portion of the upper part of the inorganic insulating layer (110) can also be removed.

[0089] The display device according to the present embodiment has an organic layer (160) that fills at least a portion of the opening of the inorganic insulating film. In FIG. 2, the organic layer (160) is shown to fill the entire opening. The display device according to the present embodiment also has a first conductive layer (215c), which extends from the first region (1A) through the bending region (BA) to the second region (2A) and is located on the organic layer (160). Of course, where the organic layer (160) is not present, the first conductive layer (215c) may be located on an inorganic insulating film such as an interlayer insulating film (130). This first conductive layer (215c) may be simultaneously formed from the same material as the source electrode (215a) or the drain electrode (215b).

[0090] As described above, in FIG. 2, the display device is shown in an unbent state for convenience, but in reality, the display device according to the present embodiment is in a state where the substrate (100), etc., is bent in the bending area (BA) as shown in FIG. 1. To this end, the display device is manufactured in a state where the substrate (100) is approximately flat as shown in FIG. 2 during the manufacturing process, and then the substrate (100), etc., is bent in the bending area (BA) so that the display device has a shape approximately as shown in FIG. 1. At this time, tensile stress may be applied to the first conductive layer (215c) during the process of bending the substrate (100), etc., in the bending area (BA), but in the case of the display device according to the present embodiment, defects in the first conductive layer (215c) during such bending process can be prevented or minimized.

[0091] If an inorganic insulating film, such as a gate insulating film (120) and / or an interlayer insulating film (130), has a continuous shape from the first region (1A) to the second region (2A) without having an opening in the bending region (BA), and the first conductive layer (215c) is located on such an inorganic insulating film, then a large tensile stress is applied to the first conductive layer (215c) during the bending process of the substrate (100), etc. In particular, since the hardness of the inorganic insulating film is higher than that of the organic layer, there is a very high probability that cracks will occur in the inorganic insulating film in the bending region (BA), and if cracks occur in the inorganic insulating film, cracks will also occur in the first conductive layer (215c) on the inorganic insulating film, and there is a very high probability that defects such as open circuits will occur in the first conductive layer (215c).

[0092] However, in the case of the display device according to the present embodiment, as described above, the inorganic insulating film has an opening in the bending region (BA), and the portion of the bending region (BA) of the first conductive layer (215c) is located on an organic layer (160) that fills at least a portion of the opening of the inorganic insulating film. Since the inorganic insulating film has an opening in the bending region (BA), the probability of cracks occurring in the inorganic insulating film is extremely low, and in the case of the organic layer (160), the probability of cracks occurring is low due to the characteristics of containing organic material. Therefore, it is possible to prevent cracks from occurring in the portion of the bending region (BA) of the first conductive layer (215c) located on the organic layer (160) or to minimize the probability of such occurrence. Of course, since the organic layer (160) has a lower hardness than the inorganic layer, the organic layer (160) can absorb the tensile stress caused by bending of the substrate (100), etc., thereby effectively minimizing the concentration of tensile stress on the first conductive layer (215c).

[0093] Of course, an inorganic insulating layer (110) formed of inorganic material exists in the bending region (BA), but since the thickness of the inorganic insulating layer (110) is relatively thin, the probability of defects occurring due to bending is very low. In particular, as described above, since the thickness of the inorganic insulating layer (110) in the bending region (BA) is thinner than the thickness of the inorganic insulating layer (110) in the first region (1A), etc., when the substrate (100), etc. is bent, the bending can be performed smoothly and defects can be prevented. In addition, since an organic layer (160) exists in the bending region (BA) and the first conductive layer (215c) is located on this organic layer (160), the first conductive layer (215c) can be effectively prevented from being damaged by bending.

[0094] The display device according to the present embodiment may also have a second conductive layer (213a, 213b) in addition to the first conductive layer (215c). These second conductive layers (213a, 213b) are positioned in a first region (1A) or a second region (2A) such that they are located on a different layer from the layer where the first conductive layer (215c) is located, and may be electrically connected to the first conductive layer (215c). In FIG. 2, the second conductive layer (213a, 213b) is shown as being located on the same layer, that is, on the gate insulating film (120), using the same material as the gate electrode (213) of the thin-film transistor (210). The first conductive layer (215c) is shown as contacting the second conductive layer (213a, 213b) through a contact hole formed in the interlayer insulating film (130). In addition, it is illustrated that the second conductive layer (213a) is located in the first region (1A) and the second conductive layer (213b) is located in the second region (2A).

[0095] The second conductive layer (213a) located in the first region (1A) may be electrically connected to a thin-film transistor, etc., within the display region (DA), and accordingly, the first conductive layer (215c) may be electrically connected to a thin-film transistor, etc., within the display region (DA) through the second conductive layer (213a). Of course, the second conductive layer (213b) located in the second region (2A) may also be electrically connected to a thin-film transistor, etc., within the display region (DA) by the first conductive layer (215c). In this way, the second conductive layer (213a, 213b) may be located outside the display region (DA) and electrically connected to components located within the display region (DA), or it may be located outside the display region (DA) and extend in the direction of the display region (DA), with at least a portion located within the display region (DA).

[0096] As described above, in FIG. 2, the display device is depicted in an unbent state for convenience, but in reality, the display device according to the present embodiment is in a state where the substrate (100), etc., is bent in the bending region (BA) as shown in FIG. 1. To this end, the display device is manufactured in a state where the substrate (100) is approximately flat as shown in FIG. 2 during the manufacturing process, and then the substrate (100), etc., is bent in the bending region (BA) so that the display device has a shape approximately as shown in FIG. 1. At this time, tensile stress may be applied to the components located within the bending region (BA) during the process of bending the substrate (100), etc., in the bending region (BA).

[0097] Therefore, by including a material with a high elongation rate in the first conductive layer (215c) that crosses the bending region (BA), defects such as cracks occurring in the first conductive layer (215c) or the first conductive layer (215c) being disconnected can be prevented. In addition, in the first region (1A) or the second region (2A), the second conductive layer (213a, 213b) is formed with a material having a lower elongation rate than the first conductive layer (215c) but different electrical / physical properties from the first conductive layer (215c), thereby increasing the efficiency of electrical signal transmission in the display device or lowering the defect rate during the manufacturing process.

[0098] For example, the second conductive layer (213a, 213b) may contain molybdenum, and the first conductive layer (215c) may contain aluminum. Of course, the first conductive layer (215c) or the second conductive layer (213a, 213b) may have a multilayer structure as needed. For example, the first conductive layer (215c) may have a multilayer structure of titanium layer / aluminum layer / titanium layer, and the second conductive layer (213a, 213b) may have a multilayer structure of molybdenum layer / titanium layer. However, the present invention is not limited thereto, and the first conductive layer (215c) may be extended to a display area (DA) and directly electrically connected to the source electrode (215a), drain electrode (215b), or gate electrode (213) of the thin-film transistor (210). In addition, if necessary, various modifications are possible, such as a conductive layer formed simultaneously with the same material as the gate electrode (213) as shown in FIG. 2 being located on the organic layer (160) and extending in the direction of the display area (DA).

[0099] Meanwhile, as illustrated in FIG. 2, it may be considered that the organic layer (160) covers the inner surface of the opening of the inorganic insulating film. As described above, the first conductive layer (215c) can be formed simultaneously with the source electrode (215a) and the drain electrode (215b) using the same material. To do this, a conductive layer can be formed on the interlayer insulating film (130), etc., over most of the entire surface of the substrate (100), and then patterned to form the source electrode (215a), the drain electrode (215b), and the first conductive layer (215c). If the organic layer (160) does not cover the inner surface of the opening (120a) of the gate insulating film (120) or the inner surface of the opening (130a) of the interlayer insulating film (130), the conductive material may remain in the area without being removed from the inner surface of the opening (120a) of the gate insulating film (120) or the inner surface of the opening (130a) of the interlayer insulating film (130) during the patterning process of the conductive layer. In such a case, the remaining conductive material may cause a short circuit between other conductive layers. Therefore, when forming the organic layer (160), it is desirable to ensure that the organic layer (160) covers the inner surface of the opening of the inorganic insulating film.

[0100] For reference, in FIG. 2, the organic layer (160) is shown as having a uniform thickness, but unlike this, it may have different thicknesses depending on the location, so that the slope of the curvature of the upper surface of the organic layer (160) becomes gentle near the inner surface of the opening (120a) of the gate insulating film (120) or the inner surface of the opening (130a) of the interlayer insulating film (130). Accordingly, during the process of patterning the conductive layer to form the source electrode (215a), drain electrode (215b), and first conductive layer (215c), it is possible to effectively prevent the conductive material in the part that needs to be removed from remaining without being removed.

[0101] Meanwhile, a bending protection layer (600, BPL) may be located on the outer side of the display area (DA). That is, the bending protection layer (600) may be positioned on the first conductive layer (215c) corresponding to at least the bending area (BA).

[0102] When a laminate is bent, a stress neutral plane exists within the laminate. If this bending protection layer (600) does not exist, excessive tensile stress may be applied to the first conductive layer (215c) within the bending region (BA) as a result of bending the substrate (100), etc. This is because the position of the first conductive layer (215c) may not correspond to the stress neutral plane.

[0103] However, by ensuring the existence of a bending protection layer (600) and adjusting its thickness and modulus, the position of the stress neutral plane in a laminate including the substrate (100), the first conductive layer (215c), and the bending protection layer (600) can be adjusted. Thus, by positioning the stress neutral plane near or above the first conductive layer (215c) through the bending protection layer (600), the tensile stress applied to the first conductive layer (215c) can be minimized, or compressive stress can be applied to the first conductive layer (215c). Such a bending protection layer (600) can be formed from acrylic or the like. For reference, when compressive stress is applied to the first conductive layer (215c), the probability of the first conductive layer (215c) being damaged is extremely low compared to when tensile stress is applied.

[0104] Meanwhile, in FIG. 2, the upper surface of the bending protection layer (600) in the display area (DA) direction (-x direction) is shown to coincide with the upper surface of the polarizer (520) in the (+z direction), but the present invention is not limited thereto. For example, the end of the bending protection layer (600) in the display area (DA) direction (-x direction) may cover a part of the edge upper surface of the polarizer (520). Alternatively, the end of the bending protection layer (600) in the display area (DA) direction (-x direction) may not come into contact with the polarizer (520) and / or the transparent adhesive (510). In particular, in the latter case, it is possible to prevent gas generated in the bending protection layer (600) from moving in the display area (DA) direction (-x direction) during or after the formation of the bending protection layer (600) and degrading a display device (300), such as an organic light-emitting diode.

[0105] If, as illustrated in FIG. 2, the upper surface of the bending protection layer (600) in the display area (DA) direction (-x direction) coincides with the upper surface of the polarizer (520) in the (+z direction), or the end of the bending protection layer (600) in the display area (DA) direction (-x direction) covers a part of the edge upper surface of the polarizer (520), or the end of the bending protection layer (600) in the display area (DA) direction (-x direction) contacts the transparent adhesive (510), the thickness of the portion of the bending protection layer (600) in the display area (DA) direction (-x direction) may be thicker than the thickness of other portions of the bending protection layer (600). When forming the bending protection layer (600), a liquid or paste-type material may be applied and cured, and the volume of the bending protection layer (600) may be reduced during the curing process. At this time, when the portion of the bending protection layer (600) in the display area (DA) direction (-x direction) is in contact with the polarizing plate (520) and / or the transparent adhesive (510), the position of the corresponding portion of the bending protection layer (600) is fixed, so that a volume reduction occurs in the remaining portion of the bending protection layer (600). As a result, the thickness of the portion of the bending protection layer (600) in the display area (DA) direction (-x direction) can be thicker than the thickness of other portions of the bending protection layer (600).

[0106] As described above, since the inorganic insulating film has an opening corresponding to at least the bending region (BA), defects caused by bending can be minimized. However, since an inorganic insulating layer (110) exists in the bending region (BA) even though its thickness is thin, defects may occur in this inorganic insulating layer (110). In particular, as shown in FIG. 3, the inorganic insulating layer (110) is exposed at the edge (+y direction and -y direction) of the substrate (100) within the bending region (BA), or the inorganic insulating layer (110) is located near the edge (+y direction and -y direction) of the substrate. In such cases, stress is concentrated in such parts of the inorganic insulating layer (110) during the manufacturing process when bending the substrate (100), etc., and defects in the display device may occur. Furthermore, such parts of the inorganic insulating layer (110) are vulnerable to external shocks even after manufacturing and can be easily damaged, causing defects in the display device. Therefore, the display device according to the present embodiment takes a structure as shown in FIG. 3 to minimize the occurrence of such defects.

[0107] Specifically, the substrate (100) has a thin portion at the edge of the bending region (BA) that has a thickness thinner than the thickness at the center of the bending region (BA). In FIG. 3, the thin portion of the substrate (100) is shown as a first groove (100a). This thin portion, i.e., the first groove (100a), may have a shape that extends from the second region (2A) in the direction of the first region (1A) (in the case of the coordinate axes of FIG. 2 in the -x direction). When the substrate (100) has a multilayer structure comprising two layers (101, 105) containing a polymer resin as shown in FIG. 3 and a barrier layer (103) containing an inorganic material interposed between the layers (101, 105), the layer (105) located in the direction of the inorganic insulating layer (110) among the two layers (101, 105) may have a first groove (100a). For reference, FIG. 3 shows the central part of the display device within the bending region (BA) and the edge of the display device in the +y direction within the bending region (BA), but the edge in the -y direction within the bending region (BA) may also have the same / similar structure as the edge in the +y direction within the bending region (BA).

[0108] An inorganic insulating layer (110) located on such a substrate (100) exposes a thin portion of the substrate (100) in a bending region (BA). In FIG. 3, the inorganic insulating layer (110) is shown having a first opening (110b) corresponding to a first groove (100a) to expose the first groove (100a) of the substrate (100). Here, the first opening (110b) exposing the first groove (100a) does not mean that the first opening (110b) exposes the entire first groove (100a), but rather that at least a portion of the first groove (100a) is exposed. In FIG. 3, the first opening (110b) is shown exposing the central portion of the first groove (100a).

[0109] As such, since the substrate (100) has a first groove (100a) and the inorganic insulating layer (110) has a first opening (110b), the occurrence of defects can be drastically prevented or minimized. For example, in the bending region (BA), there is a high probability that an impact will be applied at the edge in the +y direction or the edge in the -y direction, and stress will be concentrated during the bending process. Consequently, cracks may occur at the edge in the +y direction or the edge in the -y direction of the inorganic insulating layer (110) in the bending region (BA). If such cracks progress to the center of the bending region (BA), cracks may also occur in wiring such as the first conductive layer (215c), which may cause problems in the display device.

[0110] However, in the case of the display device according to the present embodiment, the substrate (100) has a first groove (100a) and the inorganic insulating layer (110) has a first opening (110b). The first opening (110b) extends along the edge of the substrate (100) (in the +x direction when the bent state is ignored). Therefore, even if a crack occurs at the edge in the +y direction or the edge in the -y direction of the inorganic insulating layer (110), the crack may not proceed to the center of the bending region (BA) but may stop near the first opening (110b). Through this, even if stress is applied to the bending region (BA) during the manufacturing process or if an impact is applied to the outer edge of the bending region (BA) during the manufacturing process or during use after manufacturing, defects caused by cracks in the display device can be prevented or minimized.

[0111] As illustrated in FIG. 3, the width (w1) (in the y-axis direction) of the first groove (100a) of the substrate (100) may be wider than the width (w2) (in the y-axis direction) of the first opening (110b) of the inorganic insulating layer (110). Accordingly, the inner surface of the first opening (110b) of the inorganic insulating layer (110) may have a shape that protrudes from the edge of the first groove (100a) of the substrate (100) toward the center of the first opening (110b). Accordingly, a portion of the lower surface of the inorganic insulating layer (110) near the first opening (110b) may be spaced apart from the substrate (100).

[0112] Meanwhile, as shown in FIG. 3, an organic layer (160) and a flattening layer (140) are located on the inorganic insulating layer (110) in the bending region (BA). These organic layer (160) and / or flattening layer (140) can be referred to as additional insulating layers, and these additional insulating layers on the inorganic insulating layer (110) have an additional opening corresponding to the first opening (110b) in the bending region (BA) as shown in FIG. 3. The width of this additional opening is wider than the width of the first opening (110b), so that the inner surface of the first opening (110b) protrudes from the edge of the additional opening toward the center of the first opening (110b). This is also the case for the embodiments and variations thereof described later.

[0113] FIG. 4 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. The difference between this embodiment and the display device according to the embodiment described above with reference to FIG. 3, etc., is that the substrate (100) has a second groove (100b) in addition to the first groove (100a), and the inorganic insulating layer (110) also has a second opening (110c) in addition to the first opening (110b). The second groove (100b) is located between the edge of the substrate (100) and the first groove (100a) in the bending region (BA) and has a shape that extends from the second region (2A) toward the first region (1A). The second opening (110c) has a shape corresponding to the second groove (100b) in the bending region (BA). As such, since the display device has a second groove (100b) and a second opening (110c) in addition to the first groove (100a) and the first opening (110b), even if a crack occurs at the edge (+y direction or -y direction) of the inorganic insulating layer (110) within the bending region (BA), it is possible to effectively prevent defects from occurring in the display device.

[0114] At this time, the width (in the y-axis direction) of the second groove (100b) of the substrate (100) may be wider than the width (in the y-axis direction) of the second opening (110c) of the inorganic insulating layer (110). Accordingly, the inner surface of the second opening (110c) of the inorganic insulating layer (110) may have a shape that protrudes from the edge of the second groove (100b) of the substrate (100) toward the center of the second opening (110c).

[0115] As illustrated in FIGS. 3 and 4, a first conductive layer (215c), which can be described as wiring extending from the first region (1A) through the bending region (BA) to the second region (2A), is located on the organic layer (160) in the central part of the substrate (100) rather than at the edge (+y direction or -y direction) in the bending region (BA). As illustrated in FIG. 4, such a first conductive layer (215c) may not exist between the first groove (100a) and the second groove (100b) of the substrate (100), but the present invention is not limited thereto. For example, as shown in FIG. 5, which is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention, a first conductive layer (215c) may be located on an organic layer (160) between the first groove (100a) and the second groove (100b) of the substrate (100). In the case of a high-resolution display device, since the number of various wires increases, a structure as shown in FIG. 5 may be adopted. This is also the case for the embodiments and variations thereof described below.

[0116] FIG. 6 is a plan view schematically illustrating a part of a display device according to another embodiment of the present invention. For convenience, FIG. 6 is depicted as not being bent. A cross-sectional view such as that shown in FIG. 4 or FIG. 5 described above can be understood as a cross-sectional view in the bending region (BA) of FIG. 6.

[0117] As illustrated in FIG. 6, the second groove (100b) may not be parallel to the first groove (100a). That is, the first groove (100a) may have a straight shape extending from the second area (2A) toward the first area (1A), and the second groove (100b) may have a curved shape extending from the second area (2A) toward the first area (1A).

[0118] For example, as illustrated in FIG. 6, the display device may have a concave shape at its edge near the bending region (BA). That is, the width of the substrate (100) in the y-axis direction begins to narrow in the part adjacent to the bending region (BA) within the first region (1A), and the width of the substrate (100) in the y-axis direction continues to narrow until it reaches the part adjacent to the first region (1A) within the bending region (BA), and then the width of the substrate (100) in the y-axis direction is maintained constant in the part adjacent to the second region (2A) of the bending region (BA), so that the width of the substrate (100) in the y-axis direction may be constant in the second region (2A).

[0119] In this case, the second groove (100b), which is located relatively closer to the edge of the substrate (100) than the first groove (100a), may have a curved shape corresponding to the edge shape of the substrate (100). The first groove (100a), which is not directly affected by the edge shape of the substrate (100), may have a roughly straight shape extending from the second region (2A) toward the first region (1A), unlike the second groove (100b), thereby effectively preventing cracks occurring at the edge (+y direction or -y direction) of the inorganic insulating layer (110) from advancing toward the center of the bending region (BA) or toward the first region (1A) or the second region (2A).

[0120] Cracks occurring at the edge (+y direction or -y direction) of the inorganic insulating layer (110) generally grow in a direction (+y direction or -y direction) approximately perpendicular to the straight line (parallel to the x-axis) connecting the first region (1A) and the second region (2A). Therefore, by making the first groove (100a) approximately perpendicular to the growth direction of such cracks, the occurrence of defects can be effectively prevented or minimized.

[0121] FIG. 7 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. The display device according to this embodiment differs from the display device according to the embodiment described above with reference to FIG. 4 in that the substrate (100) does not have a second groove (100b). Instead, the substrate (100) has a thin portion (100c) outside the first groove (100a), and this thin portion (100c) extends to the end portion of the substrate (100) in the direction of the bending axis (BAX) (+y direction).

[0122] At this time, the edge (110d) in the direction of the thin portion (100c) (+y direction) of the inorganic insulating layer (110) corresponds to the edge in the direction of the center (-y direction in the case of FIG. 7) of the bending region (BA) of the thin portion (100c). Of course, as shown in FIG. 7, the edge (110d) in the direction of the thin portion (100c) (+y direction) of the inorganic insulating layer (110) may not exactly coincide with the edge in the direction of the center (-y direction) of the bending region (BA) of the thin portion (100c). That is, as shown in FIG. 7, the end in the direction of the thin portion (100c) (+y direction) of the inorganic insulating layer (110) protrudes toward the center (+y direction) of the thin portion (100c), so that the lower surface of the end portion in the direction of the thin portion (100c) of the inorganic insulating layer (110) can be separated from the substrate (100).

[0123] This thin portion (100c) may have a curved shape extending along the edge of the substrate (100), similar to the second groove (100b) described above with reference to FIG. 6, as shown in FIG. 8, which is a plan view schematically illustrating a part of a display device according to another embodiment of the present invention. Of course, the first groove (100a) may still have a straight shape extending from the second region (2A) toward the first region (1A).

[0124] In FIG. 7, the substrate (100) is shown having a first groove (100a) and, in addition, a thin portion (100c), but the present invention is not limited thereto. For example, as shown in FIG. 9, which is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention, the substrate (100) may not have a first groove (100a) and may only have a thin portion (100c). That is, the substrate (100) may have a thin portion (100c) at the edge (in the +y direction and -y direction) within the bending region (BA), and this thin portion (100c) may extend to the end portion of the substrate (100) in the direction of the bending axis (BAX) (+y direction).

[0125] At this time, the edge (110d) in the direction of the thin portion (100c) (+y direction) of the inorganic insulating layer (110) corresponds to the edge in the direction of the center (-y direction in the case of FIG. 9) of the bending region (BA) of the thin portion (100c). Of course, as shown in FIG. 9, the edge (110d) in the direction of the thin portion (100c) (+y direction) of the inorganic insulating layer (110) may not exactly coincide with the edge in the direction of the center (-y direction) of the bending region (BA) of the thin portion (100c). That is, as shown in FIG. 9, the end in the direction of the thin portion (100c) (+y direction) of the inorganic insulating layer (110) protrudes toward the center (+y direction) of the thin portion (100c), so that the lower surface of the end portion in the direction of the thin portion (100c) of the inorganic insulating layer (110) can be separated from the substrate (100).

[0126] Meanwhile, as shown in FIG. 9, an organic layer (160) and a flattening layer (140) are located on the inorganic insulating layer (110) in the bending region (BA). These organic layer (160) and / or flattening layer (140) can be referred to as additional insulating layers. These additional insulating layers on the inorganic insulating layer (110) expose the upper surface of the end portion (110d) in the direction of the thin portion (100c) of the inorganic insulating layer (110) in the bending region (BA), as shown in FIG. 9. This can be applied to the embodiment described above with reference to FIG. 7, as well as to the embodiments and variations thereof described later.

[0127] The thin portion (100c) described above may have a curved shape extending along the edge of the substrate (100), similar to the second groove (100b) described above with reference to FIG. 6, as shown in FIG. 10, a plan view schematically illustrating a part of a display device according to another embodiment of the present invention. Alternatively, as shown in FIG. 11, a plan view schematically illustrating a part of a display device according to another embodiment of the present invention, the edge in the central direction of the bending region (BA) of the thin portion (100c) may include a straight shape extending from the second region (2A) toward the first region (1A). In this case, the edge of the inorganic insulating layer (110) in the direction of the thin portion (100c) may also include a straight shape extending from the second region (2A) toward the first region (1A). Of course, the end of the substrate (100) in the direction of the bending axis (BAX) (+y direction or -y direction) includes a curved shape.

[0128] Hereinafter, with reference to FIGS. 12 to 15, a method for forming a first groove (100a) and a first opening (110b) as shown in FIG. 3, i.e., a method for manufacturing a display device, is described. First, various layers are formed on a substrate (100) to form a pixel electrode (310) and a pixel defining film (150). Although not shown in FIG. 12, which illustrates a cross-sectional view in a bending region (BA), a pixel defining film (150) may also be located on a flattening layer (140) within the bending region (BA).

[0129] Subsequently, a layer is formed on the planarization layer (140) and / or the pixel definition film (150) and patterned to form a mask layer (ML) having an open area as shown in FIG. 13. The mask layer (ML) can be formed from IZO or amorphous ITO. For example, a layer corresponding to the entire surface of the substrate (100) can be formed from IZO or amorphous ITO, and a portion of the layer can be removed at the location where the first groove (100a) is to be formed using a photoresist to form an open area.

[0130] When dry etching is performed in such a situation, as shown in FIG. 14, the inorganic insulating layer (110) is removed from the part corresponding to the open area of ​​the mask layer (ML), and a first opening (110b) is formed in the inorganic insulating layer (110). Additionally, when dry etching is performed further, the substrate (100) is undercut, and a first groove (100a) is formed in the substrate (100). The mask layer (ML) also serves to protect other components already formed in the display area (DA), etc., during this dry etching process.

[0131] Afterward, a full wet etching process is performed to remove the mask layer (ML) as shown in FIG. 15, and then an intermediate layer (320), etc. is formed on the pixel electrode (310), thereby enabling the manufacture of a display device as shown in FIG. 3.

[0132] For reference, as described above, the mask layer (ML) is formed after the pixel electrode (310) and the pixel defining film (150) are formed. Therefore, the portion of the pixel electrode (310) that is not covered by the pixel defining film (150) comes into contact with the mask layer (ML). Thus, when removing the mask layer (ML) by wet etching, it is necessary to ensure that the pixel electrode (310), etc., is not damaged.

[0133] As described above, the mask layer (ML) is formed using IZO or amorphous ITO, and the etching rate of IZO or amorphous ITO is very different from the etching rate of crystalline ITO. The etching rate of IZO or amorphous ITO is also very different from the etching rate of silicon oxide or silicon nitride, etc. Therefore, even if the mask layer (ML) formed of IZO or amorphous ITO is removed by a wet etching method, other components including the pixel electrode (310) can be prevented from being damaged during the removal process.

[0134] Up until now, it has been explained that the first groove (100a) of the substrate (100) and the first opening (110b) of the inorganic insulating layer (110) come into direct contact with the bending protection layer (600). However, the present invention is not limited thereto.

[0135] For example, as shown in FIG. 15, a first groove (100a) of a substrate (100) and a first opening (110b) of an inorganic insulating layer (110) are formed, and then a metal layer (MTL) covering the inner surface of the first opening (110b) and the bottom surface of the first groove (100a) is formed as shown in FIG. 16, and subsequently, a bending protection layer (600), etc., is formed as shown in FIG. 17 to manufacture a display device. At this time, the portion on the inner surface of the first opening (110b) of the metal layer (MTL) and the portion on the bottom surface of the first groove (100a) of the metal layer (MTL) can be interconnected. Furthermore, the metal layer (MTL) can also cover a portion of the upper surface of the inorganic insulating layer (110).

[0136] This metal layer (MTL) serves to protect the inner surface of the first opening (110b) of the inorganic insulating layer (110) and can also function to block the growth of cracks. If the display device also has a second opening (110c) and a second groove (100b) as shown in FIG. 4 or FIG. 5, the inner surface of the second opening (110c) and the bottom surface of the second groove (100b) may also be covered by a metal layer. In this case, the metal layer covering the inner surface of the first opening (110b) and the bottom surface of the first groove (100a) may be spaced apart from the metal layer covering the inner surface of the second opening (110c) and the bottom surface of the second groove (100b) without being connected to it.

[0137] When forming any metal layer on the display area (DA) or the first area (1A), such a metal layer (MTL) can be formed simultaneously with the same material. For example, when forming the counter electrode (330, see FIG. 2), the metal layer (MTL) can be formed simultaneously with the same material. Alternatively, after forming the encapsulation layer (410) and prior to attaching or forming the polarizer (520), a touch sensor layer including a touch conductive layer can be formed on the encapsulation layer (410), and the metal layer (MTL) can be formed simultaneously with the same material during the process of forming such a touch conductive layer. Here, the term "touch conductive layer" refers to various electrodes or bridge wiring, etc., for implementing a touch screen function. This applies to the embodiments and variations described below as well.

[0138] Of course, as shown in FIG. 18, a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention, even in cases where the substrate (100) has a thin portion (100c) extending to the end portion of the substrate (100) in the direction of the bending axis (BAX) (+y direction) without having a first groove (100a), the metal layer (MTL) can be made to cover the side of the end portion (100c) in the direction of the thin portion (100c) of the inorganic insulating layer (110) and the upper surface of the thin portion (100c). In this case, the portion of the metal layer (MTL) on the side of the inorganic insulating layer (110) and the portion of the metal layer (MTL) on the upper surface of the thin portion (100c) can be interconnected.

[0139] A metal layer (MTL) such as that shown in FIGS. 17 and 18 can be formed simultaneously with the same material during the process of forming a touch conductive layer as described above. For example, when a display device is located on a first region (1A) of a substrate (100) and further comprises a touch sensor layer including a first touch conductive layer, the metal layer (MTL) may include the same material as the material included in the first touch conductive layer.

[0140] Meanwhile, prior to forming the touch sensor layer, a protective layer may be formed on the encapsulation layer (410) using silicon oxide, silicon nitride, silicon oxynitride, etc., and the touch sensor layer may be formed on this protective layer. In this case, the protective layer is interposed between the inorganic insulating layer (110) and the touch sensor layer and comes into contact with the lower surface of the touch sensor layer. This protective layer may be formed not only in the first region (1A) but also in the bending region, and in this case, the metal layer (MTL) is located on such a protective layer and comes into contact with the protective layer.

[0141] FIG. 19 illustrates a case where the protective layer (CL) covers the side of the end of the thin portion (100c) of the inorganic insulating layer (110) in the direction of the thin portion (100c) and the upper surface of the thin portion (100c), and the metal layer (MTL) is located on such a protective layer (CL). Of course, the protective layer can also be located below the metal layer (MTL) in a structure as shown in FIG. 17. In this case, when forming the first touch conductive layer of the touch sensor layer, a process is performed to form a conductive layer on the protective layer (CL) and pattern it. When the first touch conductive layer is formed by patterning the conductive layer, the protective layer (CL) can also be patterned simultaneously with the conductive layer. Therefore, in the first region (1A), the protective layer has the same pattern as the first touch conductive layer, and similarly, as shown in FIG. 19, in the bending region (BA), the protective layer (CL) has the same pattern shape as the metal layer (MTL).

[0142] Of course, the metal layer (MTL) may have a multilayer structure. For example, the display device may further include a touch sensor layer comprising a first touch conductive layer and a second touch conductive layer, which is located on the first region (1A) of the substrate (100). In this case, the metal layer (MTL) may include a first metal layer comprising the same material as the material comprising the first touch conductive layer, and a second metal layer comprising the same material as the material comprising the second touch conductive layer and located on the first metal layer. Of course, in the first region (1A), an insulating layer may be interposed between the first touch conductive layer and the second touch conductive layer, but in the bending region (BA), such an insulating layer is not formed, so the first metal layer and the second metal layer come into contact with each other.

[0143] In this case as well, a protective layer is further provided that is interposed between the inorganic insulating layer (110) and the touch sensor layer, contacts the touch sensor layer, and is located on the first region (1A) and the bending region (BA). In the bending region (BA), the first metal layer may be located on the protective layer (CL, see FIG. 19) so as to contact the protective layer. Of course, the protective layer (CL) in the bending region (BA) may be spaced apart from the protective layer in the first region (1A). This is because when the first touch sensor layer is formed by patterning the conductive layer as described above, the protective layer below it is also patterned simultaneously with the same pattern.

[0144] FIG. 20 is a cross-sectional view schematically illustrating a part of a display device according to another embodiment of the present invention. In the case of the display device according to the present embodiment, as shown in FIG. 20, a protective conductive layer (215d) is further provided on the inorganic insulating layer (110) in the bending region (BA). Since the inorganic insulating layer (110) has a thin thickness, the substrate (100) can be bent without major problems when bent, but a crack may occur in the inorganic insulating layer (110) in the bending region (BA) due to stress generated during the bending process or shock applied during the use process after manufacturing the display device. Of course, since an organic layer (160) exists on the inorganic insulating layer (110) within the bending region (BA), such cracks may not be a problem, but to prevent the cracks from affecting the first conductive layer (215c) on the organic layer (160), a protective conductive layer (215d) may be positioned on the inorganic insulating layer (110) within the bending region (BA).

[0145] In this case, the protective conductive layer (215d) can be formed simultaneously with the same material when forming the source electrode (215a) and drain electrode (215b) of the thin-film transistor (210) within the first region (1A). In this case, the passivation layer (132) covers the thin-film transistor (210), and the first conductive layer (215c) can be formed simultaneously with the same material when forming wiring (not shown) located on such passivation layer (132).

[0146] In this case, when the display device has a protective conductive layer (215d), the protective conductive layer (215d) may also be located on a portion of the inorganic layer (110) located between the first groove (100a) of the substrate (100) and the edge (+y direction) of the substrate (100), as shown in FIG. 21, which is a cross-sectional view schematically illustrating a part of the display device according to another embodiment of the present invention.

[0147] As such, the present invention has been described with reference to the embodiments illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims. Explanation of the symbols

[0148] 1A: Area 1 2A: Area 2 BAX: Bending axis 100: Substrate 100a: Groove 1 110: Inorganic layer 110b: First opening 120: Gate insulating film 130: Interlayer insulation film 140: Planarization layer 150: Pixel defining layer 160: Organic layer 210: Thin-film transistor 211: Semiconductor layer 213: Gate electrode 213a, 213b: Second conductive layer 215a: Source electrode 215b: Drain electrode 215c: First conductive layer 300: Display element 310: Pixel electrode 320: Intermediate layer 330: Counter electrode 410: Encapsulation layer 411: First inorganic encapsulation layer 412: Organic encapsulation layer 413: Second inorganic encapsulation layer 510: Translucent adhesive 520: Polarizer 600: Bending protection layer

Claims

Claim 1 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and a thin portion which is a first groove located at the edge of the bending region, extending from the second region toward the first region, and having a thickness thinner than the thickness at the center of the bending region; an inorganic insulating layer disposed on the substrate, having a first opening corresponding to the first groove to expose the thin portion in the bending region; and a metal layer covering the inner surface of the first opening and the bottom surface of the first groove. Claim 2 delete Claim 3 A display device according to claim 1, wherein the width of the first groove is wider than the width of the first opening. Claim 4 A display device according to claim 1, wherein the inner surface of the first opening protrudes from the edge of the first groove toward the center of the first opening. Claim 5 A display device according to claim 1, wherein the substrate is located between the edge of the substrate and the first groove in the bending region and has a second groove extending in the direction of the first region in the second region, and the inorganic insulating layer has a second opening corresponding to the second groove in the bending region. Claim 6 A display device according to claim 5, wherein the width of the second groove is wider than the width of the second opening. Claim 7 A display device according to claim 5, wherein the inner surface of the second opening protrudes from the edge of the second groove toward the center of the second opening. Claim 8 In paragraph 5, the display device wherein the second groove is not parallel to the first groove. Claim 9 A display device according to claim 5, wherein the first groove is extended to have a straight shape and the second groove is extended to have a curved shape. Claim 10 delete Claim 11 A display device according to claim 1, wherein the portion on the inner surface of the first opening of the metal layer and the portion on the bottom surface of the first groove of the metal layer are interconnected. Claim 12 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and having a thin portion which is a first groove located at the edge of the bending region and extends from the second region toward the first region and has a thickness thinner than the thickness at the center of the bending region; an inorganic insulating layer disposed on the substrate and having a first opening corresponding to the first groove to expose the thin portion in the bending region; and an additional insulating layer located on the inorganic insulating layer and having an additional opening corresponding to the first opening in the bending region. Claim 13 A display device according to claim 12, wherein the width of the additional opening is wider than the width of the first opening. Claim 14 A display device according to claim 12, wherein the inner surface of the first opening protrudes from the edge of the additional opening toward the center of the first opening. Claim 15 A display device according to claim 1, wherein the thin portion extends to the end portion of the substrate in the direction of the bending axis that intersects the direction from the second region to the first region. Claim 16 A display device according to claim 15, wherein the edge in the direction of the thin portion from the center of the bending region of the inorganic insulating layer corresponds to the edge in the direction of the center of the bending region of the thin portion. Claim 17 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and a thin portion located at the edge of the bending region, extending from the second region toward the first region, and having a thickness thinner than the thickness at the center of the bending region; and an inorganic insulating layer disposed on the substrate, which exposes the thin portion in the bending region; wherein the thin portion extends to an end portion of the substrate in the direction of the bending axis that intersects the direction from the second region toward the first region, the edge of the thin portion in the direction of the center of the bending region includes a straight line shape extending from the second region toward the first region, and the edge of the inorganic insulating layer in the direction of the thin portion at the center of the bending region includes a straight line shape extending from the second region toward the first region. Claim 18 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and having a thin portion located at the edge of the bending region, extending from the second region toward the first region, and having a thickness thinner than the thickness at the center of the bending region; and an inorganic insulating layer disposed on the substrate, which exposes the thin portion in the bending region; wherein the thin portion extends to an end portion of the substrate in the direction of the bending axis that intersects the direction from the second region toward the first region, and the end portion of the substrate in the direction of the bending axis has a curved shape. Claim 19 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and a thin portion located at the edge of the bending region, extending from the second region toward the first region, and having a thickness thinner than the thickness at the center of the bending region; and an inorganic insulating layer disposed on the substrate, which exposes the thin portion in the bending region; wherein the thin portion extends to an end portion of the substrate in the direction of the bending axis that intersects the direction from the second region toward the first region, and the end portion of the inorganic insulating layer in the direction of the thin portion at the center of the bending region protrudes toward the center of the thin portion, and the lower surface of the end portion of the inorganic insulating layer in the direction of the thin portion is spaced apart from the substrate. Claim 20 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and having a thin portion located at the edge of the bending region, extending from the second region toward the first region, and having a thickness thinner than the thickness at the center of the bending region; and an inorganic insulating layer disposed on the substrate, which exposes the thin portion in the bending region; wherein the thin portion extends to an end portion of the substrate in the direction of the bending axis that intersects the direction from the second region toward the first region, and further comprising a metal layer covering the side of the end portion in the direction of the thin portion from the center of the bending region of the inorganic insulating layer and the upper surface of the thin portion. Claim 21 A display device according to claim 20, wherein a portion of the side surface of the inorganic insulating layer of the metal layer and a portion of the upper surface of the thin portion of the metal layer are interconnected. Claim 22 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and having a thin portion located at the edge of the bending region, extending from the second region toward the first region, and having a thickness thinner than the thickness at the center of the bending region; an inorganic insulating layer disposed on the substrate, which exposes the thin portion in the bending region; and an additional insulating layer located on the inorganic insulating layer, which exposes the upper surface of an end portion in the direction of the thin portion from the center of the bending region of the inorganic insulating layer; wherein the thin portion extends to an end portion of the substrate in the direction of the bending axis that intersects the direction from the second region toward the first region. Claim 23 A display device according to any one of claims 1, 11, 20 and 21, wherein the metal layer covers a portion of the upper surface of the inorganic insulating layer. Claim 24 A display device according to any one of claims 1, 11, 20 and 21, further comprising a touch sensor layer located above the first region of the substrate and including a first touch conductive layer, wherein the metal layer comprises the same material as the material included in the first touch conductive layer. Claim 25 A display device according to claim 24, further comprising a protective layer interposed between the inorganic insulating layer and the touch sensor layer, in contact with the touch sensor layer, and positioned on the first region and the bending region, wherein the metal layer is positioned on the protective layer to contact the protective layer. Claim 26 A display device according to any one of claims 1, 11, 20 and 21, wherein the metal layer has a multilayer structure. Claim 27 A display device according to claim 26, further comprising a touch sensor layer located above the first region of the substrate and including a first touch conductive layer and a second touch conductive layer, wherein the metal layer comprises a first metal layer having the same material as the material included in the first touch conductive layer and a second metal layer having the same material as the material included in the second touch conductive layer and located on the first metal layer. Claim 28 A display device according to claim 27, further comprising a protective layer interposed between the inorganic insulating layer and the touch sensor layer, in contact with the touch sensor layer, and positioned on the first region and the bending region, wherein the first metal layer is positioned on the protective layer to contact the protective layer. Claim 29 A display device according to any one of claims 1, 3 to 9 and 11 to 21, wherein the thickness of the portion corresponding to the bending region of the inorganic insulating layer is thinner than the thickness of the portion corresponding to the center of the first region of the inorganic insulating layer. Claim 30 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and having a first groove located at the edge of the bending region and extending from the second region toward the first region; an inorganic insulating layer disposed on the substrate, having a first opening corresponding to the first groove to expose the first groove in the bending region; and a metal layer covering the inner surface of the first opening and the bottom surface of the first groove. Claim 31 delete Claim 32 A display device according to claim 30, wherein the width of the first groove is wider than the width of the first opening. Claim 33 A display device according to claim 30, wherein the inner surface of the first opening protrudes from the edge of the first groove toward the center of the first opening. Claim 34 A display device according to claim 30, wherein the substrate is located between the edge of the substrate and the first groove in the bending region and has a second groove extending in the direction of the first region in the second region, and the inorganic insulating layer has a second opening corresponding to the second groove in the bending region. Claim 35 A display device according to claim 34, wherein the width of the second groove is wider than the width of the second opening. Claim 36 A display device according to claim 34, wherein the inner surface of the second opening protrudes from the edge of the second groove toward the center of the second opening. Claim 37 In paragraph 34, the display device wherein the second groove is not parallel to the first groove. Claim 38 A display device according to claim 34, wherein the first groove is extended to have a straight shape and the second groove is extended to have a curved shape. Claim 39 delete Claim 40 A display device according to claim 30, wherein the portion on the inner surface of the first opening of the metal layer and the portion on the bottom surface of the first groove of the metal layer are interconnected. Claim 41 A display device comprising: a substrate having a bending region located between a first region and a second region, which is bent around a bending axis, and having a first groove located at the edge of the bending region and extending from the second region toward the first region; an inorganic insulating layer disposed on the substrate and having a first opening corresponding to the first groove to expose the first groove in the bending region; and an additional insulating layer located on the inorganic insulating layer and having an additional opening corresponding to the first opening in the bending region. Claim 42 A display device according to claim 41, wherein the width of the additional opening is wider than the width of the first opening. Claim 43 A display device according to claim 41, wherein the inner surface of the first opening protrudes from the edge of the additional opening toward the center of the first opening. Claim 44 A display device according to claim 30 or 40, wherein the metal layer covers a portion of the upper surface of the inorganic insulating layer. Claim 45 A display device according to claim 30 or 40, further comprising a touch sensor layer located above the first region of the substrate and including a first touch conductive layer, wherein the metal layer comprises the same material as the material included in the first touch conductive layer. Claim 46 A display device according to claim 45, further comprising a protective layer interposed between the inorganic insulating layer and the touch sensor layer, in contact with the touch sensor layer, and positioned on the first region and the bending region, wherein the metal layer is positioned on the protective layer to contact the protective layer. Claim 47 A display device according to claim 30 or 40, wherein the metal layer has a multilayer structure. Claim 48 A display device according to claim 47, further comprising a touch sensor layer located above the first region of the substrate and including a first touch conductive layer and a second touch conductive layer, wherein the metal layer comprises a first metal layer having the same material as the material included in the first touch conductive layer and a second metal layer having the same material as the material included in the second touch conductive layer and located on the first metal layer. Claim 49 A display device according to claim 48, further comprising a protective layer interposed between the inorganic insulating layer and the touch sensor layer, in contact with the touch sensor layer, and positioned on the first region and the bending region, wherein the first metal layer is positioned on the protective layer to contact the protective layer. Claim 50 A display device according to any one of claims 30, 32 to 38 and 40 to 43, wherein the thickness of the portion corresponding to the bending region of the inorganic insulating layer is thinner than the thickness of the portion corresponding to the center of the first region of the inorganic insulating layer.

Images