LED module and method for manufacturing the same

Abstract

An LED module according to one embodiment of the present invention comprises a circuit board including a first conductive pattern, a second conductive pattern, and an insulating layer interposed between the first conductive pattern and the second conductive pattern on a base substrate, a plurality of LED chips disposed on the upper side of the second conductive pattern of the circuit board and electrically connected to the second conductive pattern, and a connecting circuit board joined to the first conductive pattern, wherein the connecting circuit board may be formed by inserting at least a portion of it into the circuit board.

Description

Technology Field

[0001] Embodiments of the present invention relate to an LED module and a method for manufacturing the same. Background Technology

[0002] To drive an LED module, a connector is required to connect the driving board and the LED module. To this end, the connector is bonded to the top or bottom of the LED module board. However, if the connector is placed on the outside of the LED module board, the thickness and area of ​​the connector result in an unnecessary PCB area on the display, limiting the ability to create a slim display. Additionally, the bonding portion of the connector is exposed to the outside, which can lead to damage from physical force.

[0003] In addition, due to the thickness of the connector bonded to the top of the substrate, there is a problem of shading or light interference occurring with respect to the light generated from the LED chip.

[0004] In addition, when assembling the first LED module and the second LED module, there is a problem in that the LED chips included in the first LED module and the LED chips included in the second LED module are not seamlessly arranged due to the space occupied by the connector. That is, due to the space occupied by the connector, the gap between the LED chips at the boundary between the first LED module and the second LED module widens, causing the boundary to become visible. The problem to be solved

[0005] The present invention was devised to improve upon the above-mentioned problems and aims to provide an LED module capable of removing external connectors and connector terminals, and a method for manufacturing the same.

[0006] However, these tasks are exemplary and do not limit the scope of the invention. means of solving the problem

[0007] An LED module assembly according to one embodiment of the present invention comprises a first LED module and a second LED module arranged side by side, wherein each of the first LED module and the second LED module comprises: a circuit board comprising a first conductive pattern, a second conductive pattern, and an insulating layer interposed between the first conductive pattern and the second conductive pattern on a base substrate; a plurality of LED chips arranged on the upper side of the second conductive pattern of the circuit board and electrically connected to the second conductive pattern; and a connecting circuit board having at least a portion inserted into the insulating layer and bonded to the first conductive pattern. The insulating layer has a plurality of via holes penetrating the insulating layer to electrically connect the first conductive pattern and the second conductive pattern, and an insertion portion that exposes a portion of the first conductive pattern to electrically connect the first conductive pattern and the connecting circuit board. The connecting circuit board can be formed in the insertion portion and bent.

[0008] According to one embodiment, a portion of the connecting circuit board is inserted into the insulating layer, and the remaining portion of the connecting circuit board is exposed to the outside and can be connected to a driving board.

[0009] According to one embodiment, the connecting circuit board of each of the first LED module and the second LED module may be formed at the boundary portion where the first LED module and the second LED module meet.

[0010] According to one embodiment, the gap between the LED chip adjacent to the connecting circuit board in the first LED module and the boundary portion is smaller than the gap between the LED chips within the first LED module, and the gap between the LED chip adjacent to the connecting circuit board in the second LED module and the boundary portion is smaller than the gap between the LED chips within the second LED module.

[0011] According to one embodiment, the spacing between LED chips in the first LED module and the spacing between LED chips in the second LED module may be the same.

[0012] According to one embodiment, a concave portion may be formed in the base substrate at the boundary portion where the first LED module and the second LED module meet.

[0013] According to one embodiment, the concave portion may be formed to overlap at least a portion of the area where the insertion portion is formed.

[0014] According to one embodiment, the length from one side to the opposite side where the concave portion of the base substrate is formed may be shorter than the length from one side to the opposite side of the insulating layer.

[0015] According to one embodiment, the thickness of the base substrate in the area where the insertion part is formed may be thinner than the thickness of the base substrate in the area where the insertion part is not formed.

[0016] According to one embodiment, the plurality of LED chips includes a first LED chip, a second LED chip, and a third LED chip, and the circuit board includes a first insulating layer in which at least a first connecting circuit board for driving the first LED chip is partially inserted, a second insulating layer in which a second connecting circuit board for driving the second LED chip is partially inserted, and a third insulating layer in which a third connecting circuit board for driving the third LED chip is partially inserted, and the first connecting circuit board may be bonded to a conductive pattern formed on the bottom surface of the first insulating layer, the second connecting circuit board may be bonded to a conductive pattern formed on the bottom surface of the second insulating layer, and the third connecting circuit board may be bonded to a conductive pattern formed on the bottom surface of the third insulating layer.

[0017] An LED module according to one embodiment of the present invention comprises: a circuit board including a first conductive pattern, a second conductive pattern, and an insulating layer interposed between the first conductive pattern and the second conductive pattern on a base substrate; a plurality of LED chips disposed on the upper side of the second conductive pattern of the circuit board and electrically connected to the second conductive pattern; and a connecting circuit board joined to the first conductive pattern; wherein the connecting circuit board may be formed by inserting at least a portion of it into the circuit board.

[0018] According to one embodiment, an insertion portion may be formed between the insulating layer and the first conductive pattern, and at least a portion of the connecting circuit board may be formed in the insertion portion.

[0019] According to one embodiment, the thickness of the insulating layer formed on the upper part of the insertion portion may be thinner than the thickness of the insulating layer formed on the upper part of the first conductive pattern.

[0020] According to one embodiment, the connecting circuit board is made of a flexible circuit board, and the connecting circuit board can be bent and exposed to the lower part of the circuit board through a concave portion formed in the base substrate.

[0021] According to one embodiment, an etching portion is formed on the upper part of the base substrate, an insertion portion is formed on the upper part of the first conductive pattern at a position corresponding to the etching portion, and at least a portion of the connecting circuit board is formed in the insertion portion.

[0022] According to one embodiment, the thickness of the insulating layer formed on the upper part of the connecting circuit board and the thickness of the insulating layer formed on the upper part of the first conductive pattern may be the same.

[0023] According to one embodiment, a portion of the connecting circuit board is inserted into the insulating layer, and the remaining portion of the connecting circuit board is exposed to the outside and can be connected to a driving board.

[0024] According to one embodiment, a recess for accommodating the connecting circuit board may be formed at the edge of the base substrate.

[0025] According to one embodiment, the concave portion may be formed in at least a portion of the area overlapping the insertion portion.

[0026] According to one embodiment, an insertion portion penetrating the interior of the insulating layer is formed, and at least a portion of the connecting circuit board is formed in the insertion portion.

[0027] Other aspects, features, and advantages other than those described above will become clear from the following drawings, claims, and detailed description of the invention. Effects of the invention

[0028] According to one embodiment of the present invention as described above, the connector and connector terminal exposed to the outside of the LED module can be removed, thereby significantly reducing unnecessary space in the display.

[0029] In addition, shading and optical interference caused by the thickness of the connector can be eliminated, and a slim display can be realized.

[0030] In addition, since the connector is inserted inside the LED module, durability can be increased.

[0031] Of course, the scope of the present invention is not limited by these effects. Brief explanation of the drawing

[0032] Figure 1 is a diagram illustrating a typical LED module. Figure 2 is a plan view illustrating a typical LED module. FIG. 3 is a schematic diagram of an LED module according to one embodiment of the present invention. FIG. 4 is a plan view for explaining an LED module according to one embodiment of the present invention. FIG. 5 is a schematic diagram of an LED module (100-3) according to another embodiment of the present invention. FIG. 6 is a schematic diagram of an LED module (200) according to another embodiment of the present invention. FIG. 7 is a schematic diagram of an assembly of a first LED module (100-1) and a second LED module (100-2) according to one embodiment of the present invention. FIG. 8 is an enlarged view of the contact area between the first LED module (100-1) and the second LED module (100-2) shown in FIG. 7. FIG. 9 is a plan view for explaining the first LED module (100-1) and the second LED module (100-2) shown in FIG. 7. FIG. 10 is a drawing for explaining the base substrate (110) of the first LED module (100-1) and the second LED module (100-2) shown in FIG. 7. FIG. 11 is a drawing for explaining an example of a method for manufacturing an LED module according to an embodiment of the present invention. FIG. 12 is a drawing for explaining another example of a method for manufacturing an LED module according to one embodiment of the present invention. FIG. 13 is a drawing for explaining another example of a method for manufacturing an LED module according to one embodiment of the present invention. Specific details for implementing the invention

[0033] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0035] In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0036] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0037] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0038] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated.

[0039] In the following embodiments, when a part such as a region, component, section, block, or module is described as being on or above another part, it includes not only cases where it is directly on top of another part, but also cases where another region, component, section, block, or module is interposed therein.

[0040] In the following embodiments, when regions, components, parts, blocks, modules, etc. are described as being connected, the cases include not only those where regions, components, parts, blocks, and modules are directly connected, but also those where other regions, components, parts, blocks, and modules are interposed between them to be indirectly connected.

[0042] FIG. 1 is a drawing for explaining a general LED module (10). FIG. 2 is a plan view for explaining a general LED module (10).

[0043] Referring to FIGS. 1 and 2, generally, an LED module (10) may have metal pattern layers (12, 14) formed on a substrate (11) with an insulating layer (13) in between, and via holes (18) may be formed in the insulating layer (13) to electrically connect the upper and lower metal pattern layers (12, 14). An LED chip (15) may be mounted on the upper metal pattern layer (14), so that the LED chip (15) can be electrically connected to the metal pattern layer (14).

[0044] In a general LED module (10), a connector (16, 17) for connecting to a driving board is bonded to the upper surface of the LED module (10) substrate. Due to the area of ​​the connector (16, 17) located on the upper surface of the substrate (11), there is a disadvantage that an unnecessary area is expanded in the LED module (10) and the display. In addition, the light emitted from the LED chip (15) is interfered with due to the thickness of the connector (16, 17), causing a shading problem. Furthermore, there is a problem that the bonding portion of the connector (16, 17) is exposed to the outside, making it highly susceptible to damage from physical force.

[0045] Therefore, the present invention was devised to improve these problems.

[0047] FIG. 3 is a schematic diagram of an LED module (100) according to one embodiment of the present invention. FIG. 4 is a plan view for explaining an LED module (100) according to one embodiment of the present invention.

[0048] Referring to FIGS. 3 and 4, an LED module (100) according to one embodiment of the present invention includes a circuit board (101), a plurality of LED chips (150), and a connecting circuit board (160). In this case, one embodiment of the present invention is characterized in that the connecting circuit board (160) is inserted into the circuit board (101) without a separate connector to directly transmit a signal.

[0049] A circuit board (101) may include a first conductive pattern (121), a second conductive pattern (122), and an insulating layer (130) separated between the first conductive pattern (121) and the second conductive pattern (122) on a base board (110).

[0050] The base substrate (110) can be formed not only of a glass substrate, but also of a plastic substrate including PET (Polyethylene terephthalate), PEN (Polyethylene naphthalate), polyimide, etc.

[0051] The first conductive pattern (121) and the second conductive pattern (122) can be electrically connected with an insulating layer (130) interposed between them. The first conductive pattern (121) is electrically connected to a connecting circuit board (160), and the second conductive pattern (122) is electrically connected to a plurality of LED chips (150) mounted on the second conductive pattern (122), thereby enabling the plurality of LED chips (150) to be driven according to a signal provided from the connecting circuit board (160).

[0052] The first conductive pattern (121) and the second conductive pattern (122) may be formed from one or more metals selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu).

[0053] The insulating layer (130) may be made of an insulating material such as epoxy or PI. At this time, a plurality of via holes (140) penetrating the insulating layer (130) may be formed to electrically connect the first conductive pattern (121) and the second conductive pattern (122) in the insulating layer (130). Additionally, an insertion portion (133) exposing a part of the first conductive pattern (121) may be formed in the insulating layer (130) to electrically connect the first conductive pattern (121) and the connecting circuit board (160).

[0054] The insertion portion (133) is a part that exposes a portion of the first conductive pattern (121) and is joined to the connecting circuit board (160), and can be formed to have a predetermined width from the edge of the LED module (100) toward the inner direction of the LED module (100). Additionally, the insertion portion (133) can be formed in a shape corresponding to a part of the connecting circuit board (160).

[0055] In another embodiment, the insertion portion (133) may not be formed with a predetermined width at the edge of the LED module (100), but may be formed inside the LED module (100) spaced apart from the edge. In this case, a through hole is formed in the base substrate (110) in a portion corresponding to the insertion portion (133), so that a part of the connecting circuit board (160) may be positioned in the insertion portion (133) which is placed inside the LED module (100).

[0056] The insertion portion (133) may be formed using the same mask for forming a plurality of via holes (140) in the insulating layer (130), but the present invention is not necessarily limited thereto. In another embodiment, the insertion portion (133) may be provided by bonding a part of the connecting circuit board (160) to the first conductive pattern (121) in advance before forming the insulating layer (130) on the first conductive pattern (121). A more detailed description will be provided later.

[0057] Meanwhile, the upper surface of the insulating layer (130) can be flat even when the connecting circuit board (160) is inserted. In other words, the height from the first conductive pattern (121) to the upper surface of the insulating layer (130) in the area where the insertion part (133) is formed can be the same as the height from the first conductive pattern (121) to the upper surface of the insulating layer (130) in the area where the insertion part is not formed.

[0058] In one embodiment, the upper surface of the insulating layer (130) may be flattened during the process of forming via holes (140) and insertion portions (133) in the insulating layer (130). In another embodiment, the upper surface of the insulating layer (130) may be flattened by forming the thickness of the base substrate (110) in the area where the insertion portion (133) is formed thinner than the thickness of the base substrate (110) in the area where the insertion portion (133) is not formed. FIG. 5 is a schematic diagram of an LED module (100-3) according to another embodiment of the present invention. According to another embodiment of the present invention, in order to insert a connecting circuit board (160) into one side of the LED module (100-3), the thickness of the base substrate (110) in the area where the insertion portion (133) is formed may be formed thinner than the thickness of the base substrate (110) in the area where the insertion portion (133) is not formed. To this end, the base substrate (110) in the area where the insertion portion (133) is to be formed may be etched by the thickness of the connecting circuit board (160), so that the thickness may be thinner than the thickness of the base substrate (110) in the remaining area. Referring to FIG. 5, in the area where the insertion portion (133) into which the connecting circuit board (160) is inserted is formed in the LED module (100-3), an etched portion (111) may be formed on the upper surface of the base substrate (110). The thickness of the etched portion (111) etched on the upper surface of the base substrate (110) may correspond to the thickness of the connecting circuit board (160).

[0059] A plurality of LED chips (150) include a first LED chip (150R), a second LED chip (150G), and a third LED chip (150B) that emit light of different wavelengths. For example, the first, second, and third LED chips (150R, 150G, 150B; collectively referred to as 150) may each be composed of a red LED chip (150R), a green LED chip (150G), and a blue LED chip (150B). However, they are not limited thereto, and according to an embodiment, the first, second, and third LED chips (150) may all be composed of LED chips of the same wavelength range.

[0060] FIG. 3 illustrates a case where multiple LED chips (150) are driven using a single connecting circuit board (160), but the first LED chip (150R), the second LED chip (150G), and the third LED chip (150B) may be driven individually using their respective connecting circuit boards (160). In this case, the circuit board (101) may have a structure in which multiple conductive patterns and multiple insulating layers are stacked in multiple layers, and the connecting circuit board (160) may be inserted into each insulating layer to drive the first LED chip (150R), the second LED chip (150G), and the third LED chip (150B) individually.

[0061] FIG. 6 is a schematic diagram of an LED module (200) according to another embodiment of the present invention. The LED module (200) according to the embodiment of FIG. 6 may have a structure in which a plurality of conductive patterns and a plurality of insulating layers are stacked in multiple layers. According to this embodiment, a first connecting circuit board (261) is inserted into a first insulating layer (210) to drive a first LED chip (250R), a second connecting circuit board (262) is inserted into a second insulating layer (220) to drive a second LED chip (250G), and a third connecting circuit board (263) is inserted into a third insulating layer (230) to drive a third LED chip (250B).

[0062] For example, the LED module (200) may have a first LED chip (250R), a second LED chip (250G), and a third LED chip (250B) mounted on each of the first LED pixel (2a) and the second LED pixel (2b). The LED module (200) may be formed into a multilayer structure in which a plurality of insulating layers (210, 220, 230, 240, 250) having electrode pads and conductive patterns formed thereon are stacked. The multilayer structure includes a first insulating layer (210), a second insulating layer (220), a third insulating layer (230), a fourth insulating layer (240), and a fifth insulating layer (250).

[0063] On the upper surface of the first insulating layer (210), electrode patterns including electrode patterns (201) corresponding to electrode pads (4) of LED chips (250R, 250G, 250B) are formed. Additionally, a plurality of via holes (212) are formed to penetrate the first insulating layer (210), and a first conductive connection pad (214) is formed in each of the plurality of via holes (212). The first conductive connection pad (214) may be a connection pad that completely fills the via hole (212) or has a hollow center.

[0064] In addition, second, third, fourth, and fifth via holes (222, 232, 242, 252) are formed from top to bottom in each of the second insulating layer (220), third insulating layer (230), fourth insulating layer (240), and fifth insulating layer (250), and second, third, fourth, and fifth conductive connection pads (224, 234, 244, 254) are formed in each of the second, third, fourth, and fifth via holes (222, 232, 242, 252).

[0065] Between the first insulating layer (210) and the second insulating layer (220), a first conductive pattern (203) is formed in contact with the lower surface of the first insulating layer (210) and the upper surface of the second insulating layer (220), a second conductive pattern (204) is formed in contact with the lower surface of the second insulating layer (220) and the upper surface of the third insulating layer (230), a third conductive pattern (205) is formed in contact with the lower surface of the third insulating layer (230) and the upper surface of the fourth insulating layer (240), and a fourth conductive pattern (206) is formed in contact with the lower surface of the fourth insulating layer (240) and the upper surface of the fifth insulating layer (250).

[0066] The first conductive pattern (203) connects at least one of the first conductive connection pads (214) and at least one of the second conductive connection pads (224) between the first insulating layer (210) and the second insulating layer (220), the second conductive pattern (204) connects at least one of the second conductive connection pads (224) and at least one of the third conductive connection pads (234) between the second insulating layer (220) and the third insulating layer (230), the third conductive pattern (205) connects at least one of the third conductive connection pads (234) and at least one of the fourth conductive connection pads (244) between the third insulating layer (230) and the fourth insulating layer (240), and the fourth conductive pattern (206) connects at least one of the fourth conductive connection pads (244) and the fifth conductive pad between the fourth insulating layer (240) and the fifth insulating layer (250). At least one of the connection pads (254) is connected. A conductive pattern constituting an input terminal and an output terminal may be formed on the bottom surface of the fifth insulating layer (250).

[0067] According to one embodiment, corresponding electrode pads (4) of first LED chips (250R, 250R) included in different LED pixels (2a, 2b) are connected to corresponding electrode patterns (201) by solder bumps (3), and the corresponding electrode patterns (201) are connected to corresponding first connection pads (214) connected to a corresponding first conductive pattern (203), and the corresponding first conductive pattern (203) can be connected to a terminal (71) which is part of a fifth conductive pattern through wiring including a corresponding second connection pad (224), a third connection pad (234), a fourth connection pad (244), and a fifth connection pad (254).

[0068] According to one embodiment of the present invention, the first LED chip (250R), the second LED chip (250G), and the third LED chip (250B) can be individually driven using their respective connecting circuit boards (261, 262, 263). In this case, the first connecting circuit board (261) can be inserted into at least a portion of the first insulating layer (210) and bonded to the first conductive pattern (203), and can be electrically connected to the first LED chip (250R). Additionally, the second connecting circuit board (262) can be inserted into at least a portion of the second insulating layer (220) and bonded to the second conductive pattern (204), and can be electrically connected to the second LED chip (250G). Additionally, the third connecting circuit board (263) can be inserted into at least a portion of the third insulating layer (230) and bonded to the third conductive pattern (205), and can be electrically connected to the third LED chip (250B).

[0069] A first connecting circuit board (261) is inserted into the first insulating layer (210) to drive the first LED chip (250R), a second connecting circuit board (262) is inserted into the second insulating layer (220) to drive the second LED chip (250G), and a third connecting circuit board (263) is inserted into the third insulating layer (230) to drive the third LED chip (250B).

[0071] In the various embodiments described above, the LED chip (150, 250R, 250G, 250B) may be, for example, a flip-chip type micro LED chip with at least one side length of 100 μm or less, or a mini LED chip, but is not limited thereto.

[0072] Referring again to FIG. 3, at least a portion of the connecting circuit board (160) is formed to be inserted into the insulating layer (130), and the remaining portion of the connecting circuit board (160) is exposed to the outside and can be connected to the driving board. The connecting circuit board (160) may be a PCB that connects the LED module (100) and the driving board.

[0073] According to one embodiment, the connecting circuit board (160) may be a flexible circuit board and may be formed of a flexible material. According to another embodiment, the connecting circuit board (160) may be a PCB made of a rigid material.

[0074] The description of the insulating layer (130) and the connecting circuit board (160) applies likewise to the insulating layer (210, 220, 230) and the connecting circuit board (261, 262, 263) of the embodiment shown in FIG. 6.

[0076] In the LED module (100) having the structure described above, since a portion of the connecting circuit board (160) is inserted into the insulating layer (130) and the remainder is exposed to the outside, interference may occur at the edges when a plurality of LED modules (100) are arranged and assembled. To minimize such interference, as an alternative embodiment not illustrated, the LED module (100) may be formed in such a structure that a certain portion of the base board (110) in the area where the connecting circuit board (160) is inserted is removed so that the remaining portion of the connecting circuit board (160) that is not inserted is not exposed outside the edges of the LED module (100).

[0077] FIG. 7 is a schematic diagram of an assembly of a first LED module (100-1) and a second LED module (100-2) according to an embodiment of the present invention. FIG. 8 is an enlarged view of the contact portion between the first LED module (100-1) and the second LED module (100-2) shown in FIG. 7. FIG. 9 is a plan view for explaining the first LED module (100-1) and the second LED module (100-2) shown in FIG. 7. FIG. 10 is a drawing for explaining the base substrate (110) of the first LED module (100-1) and the second LED module (100-2) shown in FIG. 7.

[0078] Referring to FIG. 7, the first LED module (100-1) and the second LED module (100-2) each correspond to the aforementioned LED module (100).

[0079] The connecting circuit board (160) of the first LED module (100-1) and the second LED module (100-2) can be formed at the boundary portion where the first LED module (100-1) and the second LED module (100-2) meet.

[0080] When assembling multiple LED modules (100-1, 100-2) in an arrangement, a recess (112) for accommodating the connecting circuit board (160) can be formed at the edge of the base substrate (110) to eliminate interference between the connecting circuit boards (160). For example, a recess (112) can be formed at a part of the edge of the base substrate (110) by etching from the top surface to the bottom surface.

[0081] A portion of the connecting circuit board (160) is bonded to the upper surface of the first conductive pattern (121) formed around the concave portion (112), and the remaining portion of the connecting circuit board (160) can be bent downwards through the concave portion (112) to the bottom of the circuit board. To this end, the connecting circuit board (160) can be formed as a flexible circuit board and made of a flexible material. The bent connecting circuit board (160) can be received in the concave portion (112) of the base board (110). Thus, the connecting circuit boards (160) can be arranged seamlessly between the first LED module (100-1) and the second LED module (100-2) without interference between them.

[0082] Due to the presence of a concave portion (112) formed in the base substrate (110), the length (A) from one side to the opposite side where the concave portion (112) is formed in the base substrate (110) of the first LED module (100-1) may be shorter than the length (B) from one side to the opposite side of the insulating layer (130) of the first LED module (100-1). This is also the case for the second LED module (100-2).

[0083] The LED chips (150) mounted on the first LED module (100-1) and the LED chips (150) mounted on the second LED module (100-2) can all be arranged at the same interval (L1) so as to be arranged seamlessly.

[0084] Accordingly, the gap (L2) between the boundary of the LED chip (150) located at the edge of the first LED module (100-1) and the circuit board (101) is formed to be smaller than the gap (L1) between the LED chips (150). The same applies to the second LED module (100-2).

[0085] In other words, the gap (L1) between the LED chip located at the edge of the first LED module (100-1) and the LED chip located at the edge of the second LED module (100-2) may be the same as the gap (L1) between the LED chips (150) within the first LED module (100-1) and the gap (L1) between the LED chips (150) within the second LED module (100-1).

[0087] FIG. 11 is a drawing for explaining an example of a method for manufacturing an LED module (100) according to an embodiment of the present invention.

[0088] Referring to FIG. 11, in (a), a first conductive pattern (121) may first be formed on a base substrate (110), and a first insulating layer (130-1) may be formed on the first conductive pattern (121). At this time, the thickness of the first insulating layer (130-1) may be formed to correspond to the thickness of the connecting circuit board (160).

[0089] In (b), the first insulating layer (130-1) can be etched to expose a portion of the first conductive pattern, thereby forming a first via hole (141) and an insertion portion (133) into which a connecting circuit board (160) is inserted. The insertion portion (133) is a portion that exposes a portion of the first conductive pattern (121) and is joined to the connecting circuit board (160), and can be formed to have a predetermined width from the edge of the LED module (100) toward the inner direction of the LED module (100). Additionally, the insertion portion (133) can be formed in a shape corresponding to a portion of the connecting circuit board (160).

[0090] (c) In the above insertion part (133), a connecting circuit board (160) can be bonded or joined to the first conductive pattern (121). At this time, the height of the upper surface of the connecting circuit board (160) may correspond to the height of the upper surface of the first insulating layer (130-1). Through this, even if the second insulating layer (130-2) described later is laminated, the upper surface of the insulating layer (130) in the area overlapping with the connecting circuit board (160) can maintain flatness.

[0091] (d) A second insulating layer (130-2) may be laminated and formed on the first insulating layer (130-1). The second insulating layer (130-2) may be laminated to partially cover the upper surface of the connecting circuit board (160). The first insulating layer (130-1) and the second insulating layer (130-2) may constitute the insulating layer (130) shown in FIG. 3.

[0092] (e) A second via hole (142) may be formed in the second insulating layer (130-2). The second via hole (142) may be formed to correspond to the first via hole (141) formed in the first insulating layer (130-1). The first via hole (141) formed in the first insulating layer (130-1) and the second via hole (142) formed in the second insulating layer (130-2) may form the via hole (140) shown in FIG. 3.

[0093] In (f), a conductive material is formed in the via hole (140), and a second conductive pattern (122) is formed on the insulating layer (130), and an LED chip (150) is mounted on the second conductive pattern (122). The LED chip (150) is electrically connected to the second conductive pattern (122).

[0095] FIG. 12 is a drawing for explaining another example of a method for manufacturing an LED module (100) according to one embodiment of the present invention.

[0096] Referring to FIG. 12, in (a), a first conductive pattern (121) is first formed on a base substrate (110), and a connecting circuit board (160) can be joined or bonded on a portion of the first conductive pattern (121).

[0097] In (b), an insulating layer (130) can be laminated on the first conductive pattern (121) to which the connecting circuit board (160) is bonded. At this time, the insulating layer (130) can be laminated to cover a part of the connecting circuit board (160). Thus, it may correspond to the connecting circuit board (160) being inserted into the insulating layer (130). In this case, the upper surface of the insulating layer (130) immediately above the connecting circuit board (160) can be formed higher by the height of the connecting circuit board (160) than the upper surface of the insulating layer (130) immediately above the first conductive pattern (121). As an example, the upper surface of the insulating layer (130) can be flattened by using a process of forming a via hole (140) in the insulating layer (130).

[0098] In (c), the manufacturing method of the LED module (100) may form a plurality of via holes (140) that expose a first conductive pattern (121) by etching the insulating layer (130). At this time, the plurality of via holes (140) are formed using a mask that includes a translucent area corresponding to the via holes (140), and the mask may be a halftone mask that includes a translucent area corresponding to a part of the connecting circuit board (160). Since the insulating layer (130) corresponding to the connecting circuit board (160) has only a certain thickness removed by the translucent area of ​​the halftone mask, the upper surface of the insulating layer (130) can be made flat overall.

[0099] (d) A conductive material is formed in the via hole (140), and a second conductive pattern (122) is formed on the insulating layer (130), and an LED chip (150) is mounted on the second conductive pattern (122). The LED chip (150) is electrically connected to the second conductive pattern (122).

[0101] FIG. 13 is a drawing for explaining another example of a method for manufacturing an LED module (100-3) according to one embodiment of the present invention.

[0102] Referring to FIG. 13, in (a), a portion of one side of the base substrate (110) can be etched to a predetermined depth to form an etched portion (111). The etched portion (111) corresponds to an area where a connecting circuit board (160) will be inserted thereafter.

[0103] Specifically, the thickness of the base substrate (110) in the overlapping area that overlaps with the connecting circuit board (160) may be thinner than the thickness of the base substrate (110) in the non-overlapping area that does not overlap with the connecting circuit board. At this time, the difference in thickness between the overlapping area and the non-overlapping area may be the same as the thickness of the connecting circuit board (160).

[0104] Subsequently, a first conductive pattern (121) can be formed on the base substrate (110). Since the upper surface of the etched portion (111) of the base substrate (110) is lower by a certain depth, the upper surface of the first conductive pattern (121) is also formed lower in this area.

[0105] A connecting circuit board (160) can be joined or bonded to a portion of the upper surface of the first conductive pattern (121) that is formed low (i.e., an area corresponding to the etching portion (111)). The height of the upper surface of the connecting circuit board (160) may correspond to the height of the upper surface of the first conductive pattern (121).

[0106] In (b), an insulating layer (130) can be laminated on the first conductive pattern (121) to which the connecting circuit board (160) is bonded. At this time, the insulating layer (130) can be laminated to cover a part of the connecting circuit board (160). A via hole (140) that exposes the first conductive pattern (121) can be formed in the insulating layer (130).

[0107] (c) A conductive material is formed in the via hole (140), and a second conductive pattern (122) is formed on the insulating layer (130), and an LED chip (150) is mounted on the second conductive pattern (122). The LED chip (150) is electrically connected to the second conductive pattern (122).

[0108] As described above, the LED module according to the embodiments of the present invention can eliminate connectors and connector terminals exposed to the outside of the LED module, thereby significantly reducing unnecessary space in the display. In addition, the LED module according to the embodiments of the present invention can eliminate shading and optical interference caused by the thickness of the connector and enable the realization of a slim display. Furthermore, since the connector is inserted inside the LED module, the durability of the LED module can be increased.

[0109] Although the present invention has been described with reference to an embodiment illustrated in the drawings, this is merely illustrative and those skilled in the art will understand that various modifications and variations of the embodiments are possible therefrom. Accordingly, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims. Explanation of the symbols

[0111] 100: LED module 110: Substrate 121, 122: 1st and 2nd conductive patterns 130: Insulating layer 140: Viahol 150, 150R, 150G, 150B: LED chip 160: Connecting circuit board

Claims

Claim 1 A circuit board comprising a first LED module and a second LED module arranged side by side, wherein each of the first LED module and the second LED module comprises a first conductive pattern, a second conductive pattern, and an insulating layer interposed between the first conductive pattern and the second conductive pattern on a base substrate; and a plurality of LED chips disposed above the second conductive pattern of the circuit board and electrically connected to the second conductive pattern. An LED module assembly comprising: a connecting circuit board having at least a portion inserted into the insulating layer, bonded to the first conductive pattern, and connected to an external driving board; wherein the insulating layer has a plurality of via holes penetrating the insulating layer to electrically connect the first conductive pattern and the second conductive pattern, and an insertion portion that exposes a portion of the first conductive pattern to physically contact and electrically connect the first conductive pattern and the connecting circuit board, and the connecting circuit board is formed in the insertion portion and is bent, and a concave portion is formed on the base substrate, etched from the lower surface to the upper surface of the base substrate to accommodate a portion of the connecting circuit board not inserted into the insertion portion, so as to overlap at least a portion of the area where the insertion portion is formed at the boundary portion where the first LED module and the second LED module meet. Claim 2 An LED module assembly according to claim 1, wherein a portion of the connecting circuit board is inserted into the insulating layer and the remaining portion of the connecting circuit board is exposed to the outside. Claim 3 An LED module assembly according to claim 1, wherein the connecting circuit board of each of the first LED module and the second LED module is formed at the boundary portion where the first LED module and the second LED module meet. Claim 4 An LED module assembly according to claim 3, wherein the gap between the LED chip adjacent to the connecting circuit board in the first LED module and the boundary portion is smaller than the gap between LED chips within the first LED module, and the gap between the LED chip adjacent to the connecting circuit board in the second LED module and the boundary portion is smaller than the gap between LED chips within the second LED module. Claim 5 An LED module assembly according to claim 1, characterized in that the spacing between LED chips in the first LED module and the spacing between LED chips in the second LED module are the same. Claim 6 delete Claim 7 delete Claim 8 An LED module assembly according to claim 1, characterized in that the length from one side to the opposite side where the concave portion of the base substrate is formed is shorter than the length from one side to the opposite side of the insulating layer. Claim 9 An LED module assembly according to claim 1, wherein the thickness of the base substrate in the region where the insertion part is formed is thinner than the thickness of the base substrate in the region where the insertion part is not formed. Claim 10 An LED module assembly according to claim 1, wherein the plurality of LED chips includes a first LED chip, a second LED chip, and a third LED chip, and the circuit board includes a first insulating layer in which at least a first connecting circuit board for driving the first LED chip is partially inserted, a second insulating layer in which a second connecting circuit board for driving the second LED chip is partially inserted, and a third insulating layer in which a third connecting circuit board for driving the third LED chip is partially inserted, wherein the first connecting circuit board is bonded to a conductive pattern formed on the bottom surface of the first insulating layer, the second connecting circuit board is bonded to a conductive pattern formed on the bottom surface of the second insulating layer, and the third connecting circuit board is bonded to a conductive pattern formed on the bottom surface of the third insulating layer. Claim 11 An LED module comprising: a circuit board including a first conductive pattern, a second conductive pattern, and an insulating layer interposed between the first conductive pattern and the second conductive pattern on a base substrate; a plurality of LED chips disposed on the upper side of the second conductive pattern of the circuit board and electrically connected to the second conductive pattern; and a connecting circuit board joined to the first conductive pattern and connected to an external driving board; wherein an insertion portion is formed between the insulating layer of the circuit board and the first conductive pattern, and at least a portion of the connecting circuit board is inserted into the insertion portion so that the connecting circuit board and the first conductive pattern are physically in direct contact and electrically connected, and a concave portion is formed at the edge of the base substrate, etched from the lower surface to the upper surface of the base substrate to accommodate a portion of the connecting circuit board not inserted into the insertion portion, such that the concave portion is accommodating the portion of the connecting circuit board not inserted into the insertion portion, so as to overlap at least a portion of the area where the insertion portion is formed. Claim 12 delete Claim 13 An LED module according to claim 11, characterized in that the thickness of the insulating layer formed on the upper part of the insertion portion is thinner than the thickness of the insulating layer formed on the upper part of the first conductive pattern. Claim 14 An LED module according to claim 11, wherein the connecting circuit board is made of a flexible circuit board, and the connecting circuit board is bent and exposed to the lower part of the circuit board through a concave portion formed in the base board. Claim 15 An LED module according to claim 11, wherein an etching portion is formed on the upper part of the base substrate, an insertion portion is formed on the upper part of the first conductive pattern at a position corresponding to the etching portion, and at least a portion of the connecting circuit board is formed on the insertion portion. Claim 16 An LED module according to claim 15, characterized in that the thickness of the insulating layer formed on the upper part of the connecting circuit board and the thickness of the insulating layer formed on the upper part of the first conductive pattern are the same. Claim 17 An LED module according to claim 11, wherein a portion of the connecting circuit board is inserted into the insulating layer and the remaining portion of the connecting circuit board is exposed to the outside. Claim 18 delete Claim 19 delete Claim 20 An LED module according to claim 11, characterized in that an insertion portion penetrating the interior of the insulating layer is formed, and at least a portion of the connecting circuit board is formed in the insertion portion.

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