Camera module assembly device capable of measuring photocurable adhesive pressing ratio

Abstract

A camera module assembly device according to one aspect of the present invention uses a laser displacement sensor to measure the height of the photocurable adhesive applied on the image sensor PCB before active alignment and the distance between the lens housing and the image sensor PCB after active alignment, and calculates the compression ratio of the photocurable adhesive due to active alignment.

Description

Technology Field

[0001] The present invention relates to a camera module assembly device, and more specifically, to a camera module assembly device capable of determining the possibility of product defects by measuring the compression ratio of a photocurable adhesive applied to a PCB, etc., to attach a lens housing after active alignment is completed. Background Technology

[0002] In the manufacturing process of camera modules, particularly ultra-miniaturized ones, optical alignment and precision optical positioning are extremely demanding and time-consuming tasks. Even a slight misalignment between components during optical element assembly significantly impacts performance, leading to product defects.

[0003] In the camera module manufacturing process, the batch process affects not only the image quality of individual camera modules but also the consistency of image quality among identical camera modules manufactured in mass production units. It is important to minimize variations between units and ensure consistent quality for each camera unit during the manufacturing process.

[0004] Active alignment is a critical process in the manufacturing of camera modules, involving the placement of a lens onto an image sensor. Active alignment minimizes the tilt and rotation of the image sensor and aligns the center of the sensor with the lens optical axis. This is achieved through real-time analysis and adjustment of the image plane during the placement process.

[0005] Active alignment is performed after applying a photocurable adhesive to the image sensor PCB and attaching the lens housing thereto. Depending on the depth of the lens, the distance between the lens housing and the image sensor PCB may become too close. If the distance between the lens housing and the image sensor PCB becomes too close, excessive compression of the photocurable adhesive may occur, causing problems with the bonding force between the lens housing and the image sensor PCB and potentially resulting in product defects. The problem to be solved

[0006] The present invention aims to provide a camera module assembly device capable of measuring the compression of a photocurable adhesive connecting a lens housing and an image sensor PCB using a laser displacement sensor, and determining whether the measured amount of compression is appropriate to determine in advance the possibility of product defects occurring. means of solving the problem

[0007] A camera module assembly device according to one aspect of the present invention includes a dispensing unit, a first laser displacement sensor unit, a second laser displacement sensor unit, and a compression ratio calculation unit.

[0008] The dispensing section applies a photocurable adhesive along the upper edge of the PCB to which the lens housing will be attached.

[0009] The first laser displacement sensor unit measures the first separation distance between the lens housing and the image sensor PCB, which have been transferred to the active alignment area, after active alignment.

[0010] The second laser displacement sensor unit measures the first height of the photocurable adhesive applied to the image sensor PCB.

[0011] The indentation ratio calculation unit calculates the indentation ratio of the photocurable adhesive after active alignment from the first separation distance and the first height.

[0012] The first laser displacement sensor unit measures the first separation distance based on the distance from the lens housing, the height of the lens housing, and the distance from the image sensor PCB.

[0013] A camera module assembly device according to an additional aspect of the present invention may further include an alarm generating unit.

[0014] The alarm generating unit can generate an alarm when the compression ratio of the photocurable adhesive is greater than or equal to a preset first threshold.

[0015] In addition, the alarm generating unit can generate an alarm when the compression ratio of the photocurable adhesive is below a preset second threshold. Effects of the invention

[0016] According to the present invention, a laser displacement sensor is used to measure the pressure of the photocurable adhesive connecting the lens housing and the image sensor PCB, and by determining whether the measured amount of pressure is appropriate, the possibility of product defects occurring can be determined in advance. Brief explanation of the drawing

[0017] Figure 1 illustrates a concept of calculating the amount of compression of the photocurable adhesive connecting the lens housing and the image sensor PCB after active alignment using a laser displacement sensor. FIG. 2 is a block diagram including a configuration added to a camera module assembly device for measuring the photocurable adhesive compression ratio according to one aspect of the present invention. Specific details for implementing the invention

[0018] The foregoing and additional aspects are embodied in the embodiments described with reference to the attached drawings. It is understood that the components of each embodiment may be combined in various ways within the embodiment unless otherwise stated or contradictory. Each block in the block diagram may represent a physical part in some cases, but in others, it may be a logical representation of a part of the function of a single physical part or a function spanning multiple physical parts. Sometimes, the entity of a block or part thereof may be a set of program instructions. These blocks may be implemented in whole or in part by hardware, software, or a combination thereof.

[0019] FIG. 1 illustrates a concept of calculating the amount of compression of a photocurable adhesive connecting a lens housing and an image sensor PCB after active alignment using a laser displacement sensor, and FIG. 2 is a block diagram including a configuration added to a camera module assembly device for measuring the compression ratio of a photocurable adhesive according to one aspect of the present invention.

[0020] A camera module assembly device (10) according to one aspect of the present invention includes a dispensing unit (11), a first laser displacement sensor unit (12), a second laser displacement sensor unit (13), and an adhesive pressure ratio calculation unit (14).

[0021] The camera module assembly device (10) is a device for assembling a lens housing and an image sensor PCB by aligning the optical axis, and may include a dispensing unit (11), a first laser displacement sensor unit (12), a second laser displacement sensor unit (13), and an adhesive pressing ratio calculation unit (14), as well as a loading stand, a lens housing carrier unit, a lens housing clamp unit, an image sensor PCB alignment unit, an adhesive unit, a handler unit, a control unit, etc., although not shown.

[0022] A stack loads multiple lens housings and multiple image sensor PCBs. At this time, one or more lenses are mounted in each lens housing, and an image sensor is mounted on each image sensor PCB.

[0023] The lens housing carrier transports the lens housing transferred from the loading platform to the alignment area.

[0024] The lens housing clamp is placed in the alignment area and clamps the lens housing transported by the lens housing carrier.

[0025] The image sensor PCB alignment unit transfers the image sensor PCB transferred from the loading platform to the active alignment area and aligns the optical axis of the image sensor PCB with respect to the lens housing clamped in the lens housing clamp using an active alignment method.

[0026] The adhesive part applies a photocurable adhesive to the image sensor PCB through the dispensing part (11) before actively aligning the lens housing to the image sensor PCB, and after active alignment by the image sensor PCB alignment part, the photocurable adhesive is cured to bond the lens housing and the image sensor PCB.

[0027] The handler transfers the lens housing loaded on the loading platform to the active alignment area via the lens housing carrier, transfers the image sensor PCB loaded on the loading platform to the image sensor PCB alignment section located in the active alignment area, and receives the camera module with the lens housing and image sensor PCB bonded together from the lens housing clamp and transfers it to the loading platform.

[0028] The control unit controls the lens housing carrier, lens housing clamp, image sensor PCB alignment unit, bonding unit, handler, etc.

[0029] The camera module assembly device (10) can increase assembly efficiency by automating a series of processes for assembling the lens housing and the image sensor PCB into a camera module by aligning the optical axes. In addition, since the camera module assembly device (10) can precisely align the optical axes between the lens and the image sensor, it can assemble a high-performance camera module with high reliability.

[0030] The dispensing unit (11) includes a dispenser and applies a photocurable adhesive to the image sensor PCB transferred to the active alignment area before the lens housing is actively aligned to the image sensor PCB. The photocurable adhesive applied by the dispensing unit (11) may be a UV-curing adhesive, and epoxy, acrylic, silicone, urethane, etc. may be used. The dispensing unit (11) is controlled to maintain a constant amount of photocurable adhesive and dispenses a constant amount along the upper edge of the image sensor PCB.

[0031] The second laser displacement sensor unit (13) includes a 3D laser displacement sensor, also known as a 3D scanner, and measures a first height of the photocurable adhesive applied on the image sensor PCB under the control of the control unit. The second laser displacement sensor unit (13) measures the height of the photocurable adhesive applied on the image sensor PCB before active alignment.

[0032] The first laser displacement sensor unit (12) measures the first separation distance between the lens housing transferred to the active alignment area and the PCB after active alignment. The first laser displacement sensor unit (12) measures the position of the image sensor PCB after active alignment. The first laser displacement sensor unit (12) measures the position of the lens housing after active alignment. The first laser displacement sensor unit (12) can measure the distance to the upper surface of the actively aligned lens housing.

[0033] The first laser displacement sensor unit (12) can measure the first separation distance based on the distance from the lens housing, the height of the lens housing, and the distance from the image sensor PCB.

[0034] The first laser displacement sensor unit (12) can calculate the position of the bottom surface of the lens housing from the specification information of the lens housing, particularly the height information of the lens housing, and can obtain the first separation distance between the lens housing and the image sensor PCB from this position and the measured position of the image sensor PCB.

[0035] Depending on the aspect of the invention, the first laser displacement sensor unit (12) and the second laser displacement sensor unit (13) may be a single laser displacement sensor device.

[0036] The adhesive compression ratio calculation unit (14) calculates the compression ratio of the photocurable adhesive after active alignment from the first separation distance and the first height.

[0037] The adhesive pressure ratio calculation unit (14) may be implemented as a set of computer program instructions that are executed in the control unit of the camera module assembly device (10) or in the processor of a separate computing device connected to the device, at least part of its function.

[0038] The adhesive compression ratio calculation unit (14) first calculates the difference between the first separation distance and the first height, and then calculates the ratio of this value to the first height as the compression ratio. For example, if the first height is 300 μm and the first separation distance is 150 μm, the compression ratio is calculated as 50%.

[0039] A camera module assembly device (10) according to an additional aspect of the present invention may further include an alarm generating unit (15).

[0040] The alarm generating unit (15) can generate an alarm when the compression ratio of the photocurable adhesive is greater than or equal to a preset first threshold.

[0041] For example, if the first threshold is set to 50%, the alarm generating unit (15) generates an alarm if the compression ratio of the photocurable adhesive is 50% or more. This can be determined as the distance between the lens and the image sensor PCB becoming too close after active alignment.

[0042] Additionally, the alarm generating unit (15) can generate an alarm when the compression ratio of the photocurable adhesive is below a preset second threshold.

[0043] For example, if the second threshold is set to 20%, the alarm generating unit (15) generates an alarm if the compression ratio of the photocurable adhesive is 20% or less. This can be determined that the amount of compression of the photocurable adhesive between the lens housing and the image sensor PCB after active alignment is too small.

[0044] The various embodiments disclosed in this specification and drawings are provided merely as specific examples to aid understanding and are not intended to limit the scope of the various embodiments of the invention.

[0045] Accordingly, the scope of the various embodiments of the present invention should be interpreted as including all modifications or variations derived based on the technical concept of the various embodiments of the present invention, in addition to the embodiments described herein. Explanation of the symbols

[0046] 10: Camera module assembly device 11: Dispensing Department 12: First laser displacement sensor unit 13: Second laser displacement sensor unit 14 : Adhesive Indentation Ratio Calculation Unit 15 : Alarm generator

Claims

Claim 1 A camera module assembly device comprising: a dispensing unit for applying a photocurable adhesive along the upper edge of an image sensor PCB to which a lens housing is to be attached; a first laser displacement sensor unit for measuring a first separation distance between the lens housing and the PCB after active alignment, which is transferred to an active alignment area; a second laser displacement sensor unit for measuring a first height of the photocurable adhesive applied to the PCB; and an adhesive compression ratio calculation unit for calculating the compression ratio of the photocurable adhesive after active alignment from the first separation distance and the first height; wherein the first laser displacement sensor unit measures the first separation distance based on the distance from the lens housing, the height of the lens housing, and the distance from the PCB. Claim 2 A camera module assembly device according to claim 1, wherein the first laser displacement sensor unit and the second laser displacement sensor unit are a single laser displacement sensor device. Claim 3 delete Claim 4 A camera module assembly device according to claim 1, further comprising an alarm generating unit that generates an alarm when the compression ratio of the photocurable adhesive is greater than or equal to a preset first threshold value. Claim 5 A camera module assembly device according to claim 4, wherein the alarm generating unit generates an alarm when the pressing ratio of the photocurable adhesive is below a preset second threshold value.

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