Double sided cooling device

Abstract

The bidirectional element cooling device according to the present invention may include a cooling fluid port portion through which a cooling fluid is introduced and discharged, and a plurality of cooling panel portions arranged in a stacked structure such that the cooling fluid flows in an internal space and contacts both sides of a structure to be cooled, coupled to the cooling fluid port portion.

Description

Technology Field

[0001] The present invention relates to a bidirectional element cooling device, and more specifically, to a bidirectional element cooling device in which a cooling panel portion is arranged in a stacked structure to cool both sides of a structure to be cooled. Background Technology

[0003] The inverter, which supplies power to the motor generating the driving force of an electric vehicle, is a critical component where component failure can affect the vehicle's safety and durability. Among the inverter's constituent parts, the core component for power conversion is the power module, which consists of semiconductor switching devices (IGBTs and diodes). IGBT devices present a heat generation issue due to losses occurring during turn-on and turn-off switching, and cooling measures must be implemented to address this problem.

[0004] Recently, various cooling methods have been developed to reduce semiconductor chip size and improve output density. A method has also been proposed in which devices are arranged in a line and cooling panels are in contact with them in the vertical direction to cool both sides. However, there is a problem in that there are limitations in achieving uniform cooling because a temperature difference occurs between the inlet and outlet sections depending on the direction of the cooling fluid flow in the cooling panel.

[0005] The background technology of the present invention is disclosed in Korean Registered Patent Publication No. 10-2579440 (published September 18, 2023, Title of Invention: Double-sided Cooling Power Module). The problem to be solved

[0007] The purpose of the present invention is to provide a bidirectional device cooling device capable of uniformly performing cooling for each device by arranging cooling panel portions in a stacked structure to cool both directions of a structure to be cooled. means of solving the problem

[0009] The bidirectional element cooling device according to the present invention may include a cooling fluid port portion through which a cooling fluid is introduced and discharged, and a plurality of cooling panel portions that are coupled to the cooling fluid port portion, allow the cooling fluid to flow in an internal space, and are arranged in a stacked structure to contact both sides of a structure to be cooled.

[0010] The above cooling fluid port section may include a cooling fluid supply line that supplies cooling fluid to the cooling panel section, a cooling fluid discharge line through which cooling fluid flowing through the cooling panel section is discharged, a supply connection line connecting the cooling fluid supply line and the cooling panel section, and a discharge connection line connecting the cooling fluid discharge line and the cooling panel section.

[0011] The above supply connection line and the above discharge connection line are provided in multiple numbers, and the supply connection line and the above discharge connection line can be connected to each of the cooling panel parts.

[0012] The above cooling panel section may include a supply channel coupled to the supply connection line, a discharge channel coupled to the discharge connection line, and a panel body connected to the supply channel and the discharge channel, having a cooling fluid flowing inside and a partition wall provided in the center.

[0013] The panel body may include a first flow path through which a cooling fluid is supplied from the supply path and flows, a second flow path through which the cooling fluid is discharged to the discharge path, and a guide path connecting the first flow path and the second flow path.

[0014] The panel body may further include a first cooling fluid distribution structure disposed in the first flow path and having a plurality of supply fluid flow channels for distributing cooling fluid, and a second cooling fluid distribution structure disposed in the second flow path and having a plurality of discharge fluid flow channels for distributing cooling fluid. Effects of the invention

[0016] According to the present invention, since the cooling panel section is arranged in a parallel stacked structure to cool both directions of the structure to be cooled, the maximum / minimum temperature difference according to the arrangement is reduced compared to a serial cooling method, thereby enabling uniform cooling.

[0017] According to the present invention, since the cooling panel section is arranged in a parallel stacked structure to cool both directions of the structure to be cooled, the circulation of the cooling fluid is increased, thereby reducing pressure loss.

[0018] According to the present invention, since the cooling panel portion is arranged in a parallel stacked structure to cool both directions of the structure to be cooled, packaging can be easily performed because it occupies relatively less space compared to serial cooling. Brief explanation of the drawing

[0020] FIG. 1 is a perspective view of a bidirectional element cooling device according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of a bidirectional element cooling device according to a first embodiment of the present invention. FIG. 3 is a drawing illustrating a cooling fluid port portion of a bidirectional element cooling device according to a first embodiment of the present invention. Figure 4 is a drawing showing the CC cross-sectional view of Figure 3. Figure 5 is a drawing showing a cross-sectional view of DD of Figure 3. Figure 6 is a drawing showing the EE cross-sectional view of Figure 3. FIG. 7 is a drawing illustrating a cooling panel section of a bidirectional element cooling device according to a first embodiment of the present invention. Figure 8 is a drawing showing a cross-sectional view of the FF of Figure 7. Figure 9 is a drawing showing a cross-sectional view of AA of Figure 1. Figure 10 is a drawing showing a cross-sectional view of BB of Figure 1. Figure 11 is a drawing showing a cross-sectional view of the GG of Figure 1. FIG. 12 is a perspective view of a bidirectional element cooling device according to a second embodiment of the present invention. FIG. 13 is a drawing illustrating a first application example of a bidirectional element cooling device according to a second embodiment of the present invention. FIG. 14 is a drawing illustrating a second application example of a bidirectional element cooling device according to a second embodiment of the present invention. FIG. 15 is a perspective view of a bidirectional element cooling device according to a third embodiment of the present invention. Figure 16 is an enlarged cross-sectional view of region H of Figure 15. Specific details for implementing the invention

[0021] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. Prior to this, terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings. Instead, based on the principle that the inventor may appropriately define the concepts of terms to best describe his invention, they should be interpreted in a meaning and concept consistent with the technical spirit of the present invention. Therefore, it should be understood that the embodiments described in this specification and the configurations illustrated in the drawings are merely some of the most preferred embodiments of the present invention and do not represent all of the technical spirit of the present invention; thus, various equivalents and modifications that can replace them may exist at the time of filing this application. Furthermore, as used in this specification, "comprise" or "include" and / or "comprising" or "including" specify the presence of the mentioned features, numbers, steps, actions, parts, elements, and / or groups thereof, and do not exclude the presence or addition of one or more other features, numbers, actions, parts, elements, and / or groups. In addition, when describing embodiments of the present invention, "may" and "may be" may include "one or more embodiments of the present invention."

[0022] Additionally, to aid in understanding the invention, the attached drawings are not drawn to actual scale, and the dimensions of some components may be exaggerated. Furthermore, the same reference numerals may be assigned to identical components in different embodiments.

[0023] The statement that two subjects of comparison are 'identical' means that they are 'substantially identical.' Therefore, substantial identity may include deviations considered low in the industry, for example, deviations within 5%. Additionally, the statement that a parameter is uniform in a given area may mean that it is uniform from an average perspective.

[0024] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless specifically stated otherwise, the first component may also be the second component.

[0025] Throughout the specification, unless specifically stated otherwise, each component may be singular or plural.

[0026] The fact that any configuration is placed on the "upper (or lower)" of a component or on the "upper (or lower)" of a component may mean not only that any configuration is placed in contact with the upper (or lower) surface of said component, but also that another configuration may be interposed between said component and any configuration placed on (or below) said component.

[0027] Furthermore, where it is stated that one component is "connected," "coupled," or "connected" to another component, it should be understood that while said components may be directly connected or connected to each other, another component may be "interposed" between each component, or that each component may be "connected," "coupled," or "connected" through another component. Additionally, when it is stated that a part is electrically coupled with another part, this includes not only cases where they are directly connected but also cases where they are connected with another component in between.

[0028] Throughout the specification, "A and / or B" means A, B, or A and B unless specifically stated otherwise. That is, "and / or" includes any combination or any combination of the enumerated items. "C to D" means C or more and D or less, unless specifically stated otherwise.

[0029] When syntax such as "at least one of A, B, and C", "at least one of A, B, or C", "at least one selected from the group of A, B, and C", or "at least one selected from A, B, and C" is used to specify a list of elements A, B, and C, the syntax can refer to any suitable combination.

[0030] The term "use" may be considered synonymous with the term "utilize." As used herein, "substantially," "about," and similar terms are used as terms of approximation rather than degree, and are intended to account for the inherent variation of measured or calculated values ​​that a person skilled in the art would recognize.

[0031] In this specification, terms such as first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or sections, but these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Accordingly, the first element, component, region, layer, or section discussed below may be named the second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0032] Spatial relative terms such as "beneath," "below," "lower," "above," and "upper" may be used herein for ease of explanation to describe the relationship between one element or feature and another element(s) or feature(s) as illustrated in the drawings. Spatially relative positions are to be understood as encompassing different orientations of the device in use or operation, in addition to the orientations depicted in the figures. For example, if the device in the drawing is inverted, an element described as "below" or "below" is understood as "above" or "upper" of another element. Thus, the term "below" may encompass both the up and down directions.

[0033] The terms used in this specification are intended to describe embodiments of the present disclosure and are not intended to limit the present disclosure.

[0034] FIG. 1 is a perspective view of a bidirectional device cooling device according to a first embodiment of the present invention; FIG. 2 is an exploded perspective view of a bidirectional device cooling device according to a first embodiment of the present invention; FIG. 3 is a drawing showing a cooling fluid port portion of a bidirectional device cooling device according to a first embodiment of the present invention; FIG. 4 is a drawing showing a CC cross-sectional view of FIG. 3; FIG. 5 is a drawing showing a DD cross-sectional view of FIG. 3; FIG. 6 is a drawing showing an EE cross-sectional view of FIG. 3; FIG. 7 is a drawing showing a cooling panel portion of a bidirectional device cooling device according to a first embodiment of the present invention; FIG. 8 is a drawing showing an FF cross-sectional view of FIG. 7; FIG. 9 is a drawing showing an AA cross-sectional view of FIG. 1; FIG. 10 is a drawing showing a BB cross-sectional view of FIG. 1; FIG. 11 is a drawing showing a GG cross-sectional view of FIG. 1; FIG. 12 is a perspective view of a bidirectional device cooling device according to a second embodiment of the present invention; FIG. 13 is a drawing of a bidirectional device cooling device according to a second embodiment of the present invention. FIG. 14 is a drawing illustrating a first application example, FIG. 15 is a perspective view of a bidirectional device cooling device according to a third embodiment of the present invention, FIG. 16 is an enlarged cross-sectional view of region H of FIG. 15.

[0035] Although this specification is written based on the bidirectional device cooling device according to various embodiments of the present invention cooling a semiconductor switch device, the bidirectional device cooling device according to various embodiments of the present invention can be applied to all objects requiring cooling other than semiconductor switch devices.

[0036] First, referring to FIGS. 1 to 11, a bidirectional element cooling device (1) according to the first embodiment of the present invention will be described as follows.

[0037] As shown in FIGS. 1 and 2, the bidirectional element cooling device (1) according to the first embodiment of the present invention includes a cooling fluid port section (100) and a cooling panel section (200).

[0038] The cooling fluid port section (100) allows the cooling fluid flowing through the cooling panel section (200) to flow in and out in order to cool a structure to be cooled. For example, the cooling fluid port section (100) allows the cooling fluid to flow into the cooling panel section (200) and then provides a path for the cooling fluid, after it has finished flowing from the cooling panel section (200), to be discharged to the outside, thereby enabling efficient cooling. Additionally, the material of the cooling fluid port section (100) may be made of an insulating material so that the temperature of the cooling fluid does not rise due to the temperature of the cooling fluid port section (100) when the cooling fluid is supplied, or a device may be provided to perform cooling in the cooling fluid port section (100).

[0039] A plurality of cooling panel sections (200) are provided and are combined with a cooling fluid port section (100) so that a cooling fluid flows in the internal space and is arranged in a stacked structure to come into contact with both sides of a structure (Z) to be cooled. For example, a cooling panel section (200) has a cooling fluid flowing in the internal space and removes heat by coming into contact with both sides of a structure to be cooled. At this time, a plurality of cooling panel sections (200) are combined with the cooling fluid port section (100) and are arranged in a stacked state spaced apart at a certain distance in the vertical direction (based on FIG. 1). As a result, a structure (Z) to be cooled is inserted into the area between the cooling panel sections (200) and the cooling panel sections (200) come into contact with both sides of the structure (Z) to be cooled, thereby allowing a plurality of structures (Z) to be cooled simultaneously, so that more efficient cooling of the cooling panel sections (200) can be achieved.

[0040] In addition, since the cooling panel section (200) is arranged in a parallel stacked structure to cool both sides of the structure (Z) to be cooled, the maximum / minimum temperature difference according to the arrangement is reduced compared to the serial cooling method, allowing for uniform cooling, and the high circulation of the cooling fluid can reduce pressure loss, and since it occupies relatively less space compared to serial cooling, packaging can be performed easily.

[0041] FIGS. 3 to 6 are drawings illustrating a cooling fluid port section (100) of a bidirectional element cooling device (1) according to a first embodiment of the present invention, wherein the cooling fluid port section (100) includes a cooling fluid supply line (110), a cooling fluid discharge line (120), a fluid communication line (130), a supply connection line (140), and a discharge connection line (150).

[0042] The cooling fluid supply line (110) supplies cooling fluid to the cooling panel section (200). For example, the cooling fluid supply line (110) is connected to a cooling fluid tank (not shown) to receive cooling fluid from the cooling fluid tank and supply it to the cooling panel section (200), and it is desirable to adjust the flow rate and pressure of the cooling fluid so as to provide the cooling performance required by the cooling panel section (200).

[0043] The cooling fluid discharge line (120) discharges the cooling fluid that has flowed through the cooling panel section (200). For example, the cooling fluid discharge line (120) provides a path for the cooling fluid to flow through the cooling panel section (200), absorb heat from the structure (Z) to be cooled, and then be discharged outside the cooling panel section (200). By discharging the cooling fluid that has absorbed heat through the cooling fluid discharge line (120), the supply of cooling fluid into the cooling panel section (200) is maintained, allowing cooling to be performed at a constant temperature.

[0044] The fluid communication line (130) connects the cooling fluid supply line (110) and the supply connection line (140), and connects the cooling fluid discharge line (120) and the discharge connection line (150). For example, the fluid communication line (130) may include a communication partition structure (131), a supply fluid communication line (132), and a discharge fluid communication line (133).

[0045] The connecting partition structure (131) is a partition structure that physically separates the flow of the supply fluid and the discharge fluid of the cooling fluid flowing within the fluid connecting line (130), and provides a path through which the supply fluid and the discharge fluid do not mix with each other and can flow independently. In addition, since the connecting partition structure (131) is provided with an insulating material, it can perform the function of blocking heat exchange between the supply fluid and the discharge fluid of the cooling fluid.

[0046] The supply fluid communication line (132) is a part of the area where the fluid communication line (130) is partitioned by the communication partition structure (131), and connects the cooling fluid supply line (110) and the supply connection line (140) so that the cooling fluid can be supplied to the cooling panel section (200).

[0047] The discharge fluid communication line (133) connects the cooling fluid discharge line (120) and the discharge connection line (150) to another area of ​​the region partitioned by the communication partition structure (131) of the fluid communication line (130), thereby providing a path through which the cooling fluid flowing through the cooling panel section (200) can be discharged.

[0048] The supply connection line (140) connects the cooling fluid supply line (110) and the cooling panel section (200). For example, the supply connection line (140) may be provided in multiple numbers corresponding to the number of cooling panel sections (200) and is coupled to the supply path (210) of the cooling panel section (200). The supply connection line (140) may include a supply fluid movement section (141) and a supply connection coupling section (142), wherein the supply fluid movement section (141) provides a path for the cooling fluid to move toward the cooling panel section (200), and the supply connection coupling section (142) is coupled to the supply path (210).

[0049] The discharge connection line (150) connects the cooling fluid discharge line (120) and the cooling panel section (200). For example, the discharge connection line (150) may be provided in multiple numbers corresponding to the number of cooling panel sections (200) and is coupled to the discharge path (220) of the cooling panel section (200). The discharge connection line (150) may include a discharge fluid movement section (151) and a discharge connection coupling section (152), the discharge fluid movement section (151) provides a path for the cooling fluid to move from the cooling panel section (200) to the cooling fluid discharge line (120), and the discharge connection coupling section (152) is coupled to the discharge path (220).

[0050] FIGS. 7 to 11 are drawings illustrating a cooling panel section (200) of a bidirectional element cooling device (1) according to a first embodiment of the present invention, wherein the cooling panel section (200) includes a supply channel (210), a discharge channel (220), and a panel body (230).

[0051] The supply channel (210) is connected to the supply connection line (140), and a cooling fluid is introduced so that the cooling fluid flows into the cooling panel section (200).

[0052] The discharge channel (220) is connected to the discharge connection line (150), and the cooling fluid that performs cooling of the structure (Z) to be cooled by flowing through the interior of the cooling panel section (200) through the discharge channel (220) is discharged from the cooling panel section (200).

[0053] The panel body (230) is connected to the supply channel (210) and the discharge channel (220), has a cooling fluid flowing inside, and is provided with a partition (230a) in the center. For example, the cooling fluid introduced into the supply channel (210) flows through the panel body (230) and is discharged through the discharge channel (220). At this time, the partition (230a) guides the path so that the cooling fluid flows from the supply channel (210) toward the discharge channel (220). The panel body (230) may include a first flow channel (231), a first cooling fluid distribution structure (232), a second flow channel (233), a second cooling fluid distribution structure (234), and a guide channel (235).

[0054] The first flow path (231) is supplied with cooling fluid from the supply path (210) and flows, and a first cooling fluid distribution structure (232) is inserted inside.

[0055] The first cooling fluid distribution structure (232) is disposed in the first flow path (231) and is provided with a plurality of supply fluid flow channels (2323) for distributing cooling fluid, and as an example, the first cooling fluid distribution structure (232) may include a first-1 distribution structure (2321) and a first-2 distribution structure (2322).

[0056] The first distribution structure (2321) separates the first flow path (231) into upper and lower sections, thereby dividing the fluid path so that the cooling fluid moves in the upper and lower directions along the first flow path (231). Accordingly, the cooling of the cooling target structure (Z) that contacts the upper and lower surfaces of the panel body (230), respectively, can be performed independently.

[0057] That is, by dividing the cooling fluid flow path by the first-1 distribution structure (2321), the cooling fluid can be evenly distributed to the upper and lower surfaces. In addition, even if cooling is performed in a situation where the temperatures of the cooling target structures (Z) in contact with the upper and lower surfaces, respectively, are formed differently, the mutual influence between the temperatures of the cooling target structures (Z) in contact with the upper and lower surfaces can be minimized because the passage through which the cooling fluid flows in the first flow path (231) is separated into upper and lower sections by the first-1 distribution structure (2321).

[0058] The first-2 distribution structure (2322) is provided on the upper and lower surfaces of the first-1 distribution structure (2321) and is formed in a box-shaped structure to form a supply fluid flow channel (2323) having a first-1 flow hole section (2324) and a first-2 flow hole section (2325). Accordingly, the cooling fluid is distributed and moves through the supply fluid flow channel (2323), and since the cross-sectional area of ​​the supply fluid flow channel (2323) that the cooling fluid contacts is widened, the cooling fluid absorbs more heat and increases the ability to disperse heat, thereby not only optimizing cooling performance but also enabling uniform cooling to be achieved over the entire area of ​​the panel body (230).

[0059] The second flow path (233) has a cooling fluid flowing inside and discharges the cooling fluid through the discharge path (220), and a second cooling fluid distribution structure (234) is inserted inside to form a discharge fluid flow channel (2341). At this time, since the structure and role of the second cooling fluid distribution structure (234) correspond to the first cooling fluid distribution structure (232) described above, a detailed description thereof is omitted.

[0060] The guide channel (235) connects the first flow channel (231) and the second flow channel (233). For example, it ensures that the flow of cooling fluid is evenly distributed between the first flow channel (231) and the second flow channel (233).

[0061] As illustrated in FIGS. 9 to 11, the guide channel (235) is provided with a first guide channel (2351), a second guide channel (2352), and a third guide channel (2353) to form a first guide hole (2354), a second guide hole (2355), and a third guide hole (2356), thereby allowing the cooling fluid to be distributed and moved. At this time, the distribution of the guide channel (235) may be changed according to the size of the panel body (230), the size and temperature of the object to be cooled, etc.

[0062] FIGS. 12 to 14 are drawings illustrating a bidirectional element cooling device (2) according to a second embodiment of the present invention.

[0063] Referring to FIGS. 12 to 14, a bidirectional element cooling device (2) according to a second embodiment of the present invention includes a cooling fluid port part (100), a cooling panel part (200), and a flow path connection part (300).

[0064] The cooling fluid port portion (100) and cooling panel portion (200) of the bidirectional element cooling device (2) according to the second embodiment of the present invention correspond to the cooling fluid port portion (100) and cooling panel portion (200) of the bidirectional element cooling device (1) according to the first embodiment of the present invention described above, so a description thereof is omitted.

[0065] The Euro connection part (300) is coupled to the supply connection line (140) and the supply flow path (210) to connect the supply connection line (140) and the supply flow path (210), and the discharge connection line (150) and the discharge flow path (220) are coupled to connect the discharge connection line (150) and the discharge flow path (220). For example, the Euro connection part (300) may be provided with an elastic material that can be bent or curved.

[0066] As the Euro connection part (300) is provided with an elastic material, the gap between the cooling panel parts (200) can be adjusted. That is, since the gap between the cooling panel parts (200) can be adjusted by bending or curving the Euro connection part (300), flexible response to the structural diversity of the cooling target structure (Z) is possible, and thus the cooling panel part (200) can be in close contact with the cooling target structure (Z) of various structures, thereby enabling efficient cooling.

[0067] As shown in FIG. 13, the spacing (t) between the cooling panel sections (200) can be adjusted equally to correspond to the thickness of the cooling target structure (Z) having the same thickness, or, as shown in FIG. 14, even if the thickness of the cooling target structure is formed with different thicknesses (Z1, Z2, Z3), the spacing (t1, t2, t3) between the cooling panel sections (200) can be adjusted differently to correspond to the thickness of each cooling target structure, thereby enabling cooling of various cooling target structures.

[0068] FIGS. 15 and FIGS. 16 are drawings illustrating a bidirectional element cooling device (3) according to a third embodiment of the present invention.

[0069] Referring to FIGS. 15 and 16, a bidirectional element cooling device (3) according to a third embodiment of the present invention includes a cooling fluid port section (100) and a cooling panel section (200).

[0070] The cooling panel portion (200) of the bidirectional element cooling device (3) according to the third embodiment of the present invention may include a female coupling portion (200a) and a male coupling portion (200b).

[0071] That is, a female coupling part (200a) is formed on one side adjacent to the discharge channel (220) among the two sides of the outer surface of the cooling panel part (200), and a male coupling part (200b) is formed on the other side adjacent to the supply channel (210) among the two sides of the outer surface of the cooling panel part (200). As the female coupling part (200a) and the male coupling part (200b) are fitted together in a sliding manner, the bidirectional element cooling device (3) according to the third embodiment of the present invention can be coupled to expand the cooling area.

[0072] Accordingly, by combining n bidirectional element cooling devices (3) according to the third embodiment of the present invention so as to correspond to the area of ​​the structure (Z) to be cooled, cooling of the structure (Z) to be cooled of various widths can be performed.

[0073] In addition, the cooling fluid port portion (100) and cooling panel portion (200) of the bidirectional element cooling device (3) according to the third embodiment of the present invention correspond to the cooling fluid port portion (100) and cooling panel portion (200) of the bidirectional element cooling device (1) according to the first embodiment of the present invention described above, so a description thereof is omitted.

[0074] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom.

[0075] Therefore, the technical scope of protection of the present invention should be determined by the following patent claims. Explanation of the symbols

[0077] 1, 2, 3: Bidirectional element cooling device 100: Cooling fluid port section 110: Cooling fluid supply line 120: Cooling fluid discharge line 130: Fluid communication line 131: Chimney bulkhead structure 132: Supply fluid communication line 133: Discharge fluid connecting line 140: Supply connection line 141: Supply fluid moving part 142: Supply connection joint 150: Discharge connection line 151: Discharge fluid transfer section 152: Discharge connection joint 200: Cooling panel section 210: Supply Euro 220: Discharge path 230: Panel body 230a: Bulkhead 231: First fluid flow path 232: First cooling fluid distribution structure 2321: 1-1 Separation Structure 2322: 1st-2nd separation structure 2323: Supply fluid flow channel 2324: Section 1-1 Fluid Hole 2325: 1st-2nd fluid hole section 233: Second fluid flow path 234: Second cooling fluid distribution structure 2341: Discharge fluid flow channel 235: Guide Euro 2351: Guide 1 Euro 2352: Guide 2 Euro 2353: 3rd Guide Euro 2354: First Guide Hall 2355: Second Guide Hall 2356: Third Guide Hall 200a: Female joint 200b: Male joint 300: Euro connection

Claims

Claim 1 A bidirectional element cooling device characterized by comprising: a cooling fluid port portion through which a cooling fluid is introduced and discharged; a plurality of cooling panel portions coupled to the cooling fluid port portion, wherein a cooling fluid flows in an internal space and is arranged in a stacked structure to contact both sides of a structure to be cooled; and a flow path connecting portion that connects the cooling fluid port portion and the plurality of cooling panel portions and is provided with an elastic material to adjust the spacing between the plurality of cooling panel portions. Claim 2 A bidirectional element cooling device according to claim 1, wherein the cooling fluid port part comprises: a cooling fluid supply line for supplying cooling fluid to the cooling panel part; a cooling fluid discharge line through which cooling fluid flowing through the cooling panel part is discharged; a supply connection line connecting the cooling fluid supply line and the cooling panel part; and a discharge connection line connecting the cooling fluid discharge line and the cooling panel part. Claim 3 A bidirectional element cooling device characterized in that, in paragraph 2, the supply connection line and the discharge connection line are provided in multiple numbers, and the supply connection line and the discharge connection line are connected to each of the cooling panel sections. Claim 4 A bidirectional element cooling device according to claim 2, wherein the cooling panel part comprises: a supply channel coupled to the supply connection line; a discharge channel coupled to the discharge connection line; and a panel body connected to the supply channel and the discharge channel, having a cooling fluid flowing inside and a partition wall provided in the center. Claim 5 A bidirectional element cooling device according to claim 4, wherein the panel body comprises: a first flow path through which a cooling fluid is supplied from the supply path and flows; a second flow path through which a cooling fluid is discharged to the discharge path; and a guide path connecting the first flow path and the second flow path. Claim 6 A bidirectional element cooling device according to claim 5, further comprising: a panel body having a first cooling fluid distribution structure disposed in the first flow path and having a plurality of supply fluid flow channels for distributing cooling fluid; and a second cooling fluid distribution structure disposed in the second flow path and having a plurality of discharge fluid flow channels for distributing cooling fluid.

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