Device for processing substrates in-line

Abstract

An inline substrate processing device is disclosed. An inline substrate processing device according to one aspect of the present invention comprises: a winding unit that winds and supplies a wide first substrate wound on a winding roller; a cutting unit that cuts the first substrate supplied from the winding unit to form N second substrates having a narrow width; an inspection unit that determines the quality of N second substrates delivered from the cutting unit; a winding unit having N winding rollers and N power members that rotate N winding rollers to individually wind N second substrates delivered from the inspection unit; and an external force application unit disposed between the cutting unit and the inspection unit and having N external force application members that apply an external force to one side of N second substrates to change the direction of advancement of N second substrates; wherein the N external force application members are driven independently of each other in response to a tension deviation formed between N second substrates due to a difference in rotational speed between N winding rollers.

Description

Technology Field

[0001] The present invention relates to an inline substrate processing apparatus capable of continuously performing a plurality of processes for manufacturing printed circuit boards within a single apparatus. Background Technology

[0002] During the manufacturing process, printed circuit boards are formed in one or more rows in the width direction on a base substrate, and the number of rows formed in the width direction is determined based on the width size of the base substrate and the size of the final shipped product. For example, as shown in FIG. 2, when the width (W1) of the base substrate (11) is approximately three times the size (W2, W3, W4) of the final shipped product (12, 13, 14), printed circuit boards are formed in three rows in the width direction on the base substrate, and multiple printed circuit boards are formed in each row.

[0003] Afterward, three rows are cut lengthwise into final shipment units and separated so that one row of printed circuit boards is wound onto a single winding roller. Before shipment, an inspection process is performed on the three individually separated printed circuit boards to determine if they are defective.

[0004] At this time, there was a problem where floating foreign matter generated during the cutting process to the final product size scattered and adhered to printed circuit boards or post-processing equipment, causing product defects. Furthermore, since the cutting and inspection processes for printed circuit boards are separated into different equipment due to their distinct characteristics, the flow of products was divided; consequently, productivity was reduced as time was required to attach, detach, or move products between the two process facilities.

[0005] Meanwhile, conventional substrate processing devices have also recognized the aforementioned problems and proposed in-line devices that perform substrate cutting and inspection within a single facility. However, this technology involves the individual flow of substrates cut in the width direction as sheet-type substrates, which presents a problem in that it is not suitable for the roll-to-roll flow process of film-type substrates. The problem to be solved

[0006] The present invention aims to solve the above-mentioned problems, and the objective of the present invention is to provide an inline substrate processing device capable of continuously performing processes of cutting, inspecting, and winding a film-type substrate material, such as a printed circuit board.

[0007] Another objective of the present invention is to provide an inline substrate processing apparatus capable of smoothly performing a process without problems regarding the flow of substrate materials when individually winding a plurality of cut substrate materials.

[0008] The problems of the present invention are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art to which the present invention pertains from the description below. means of solving the problem

[0009] According to one aspect of the present invention, an inline substrate processing apparatus is provided, comprising: a winding unit that winds and supplies a wide first substrate wound on a winding roller; a cutting unit that cuts the first substrate supplied from the winding unit to form N second substrates having a narrow width; an inspection unit that determines the quality of the N second substrates delivered from the cutting unit; a winding unit having N winding rollers and N power members that rotate the N winding rollers respectively to wind the N second substrates delivered from the inspection unit individually; and an external force application unit disposed between the cutting unit and the inspection unit and having N external force application members that apply an external force to one side of the N second substrates respectively to change the direction of advancement of the N second substrates, wherein the N external force application members are driven independently of each other in response to a tension deviation formed between the N second substrates due to a difference in rotational speed between the N winding rollers. Effects of the invention

[0010] According to the above configuration, the inline substrate processing device according to the embodiment of the present invention has a cutting unit, an inspection unit, and a winding unit sequentially arranged within a single device, thereby enabling the continuous execution of a substrate cutting process, an inspection process for inspecting the cut substrate, and a process for individually winding the inspected substrate in each cut unit through a single line.

[0011] In addition, the inline substrate processing device according to an embodiment of the present invention can effectively prevent problems of substrate flow or entanglement that may occur due to rotational speed deviations of a plurality of winding rollers by arranging one or more external force application units.

[0012] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention. Brief explanation of the drawing

[0013] FIG. 1 is a conceptual diagram illustrating an inline substrate processing apparatus according to one embodiment of the present invention. FIG. 2 is a drawing showing a part including a winding section and a cutting section among an inline substrate processing device according to one embodiment of the present invention. FIG. 3 is a drawing illustrating that a plurality of second substrates are formed from a first substrate by a cutting part of an inline substrate processing device according to an embodiment of the present invention. FIG. 4 is a perspective view illustrating an external force application unit of an inline substrate processing device according to one embodiment of the present invention. FIG. 5 is a side view illustrating an external force application part of an inline substrate processing device according to one embodiment of the present invention. FIG. 6 is a plan view illustrating an inspection section of an inline substrate processing device according to one embodiment of the present invention. Specific details for implementing the invention

[0014] Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the description in the drawings have been omitted, and the same reference numerals have been used throughout the specification for identical or similar components.

[0015] The words and terms used in this specification and claims are not limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention in accordance with the principles by which the inventor defines terms and concepts to best describe his invention.

[0016] FIG. 1 is a conceptual diagram illustrating an inline substrate processing device according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a part of an inline substrate processing device according to an embodiment of the present invention, including a winding unit and a cutting unit. FIG. 3 is a diagram illustrating that a plurality of second substrates are formed from a first substrate by the cutting unit of an inline substrate processing device according to an embodiment of the present invention. FIG. 4 is a perspective view illustrating an external force application unit of an inline substrate processing device according to an embodiment of the present invention. FIG. 5 is a side view illustrating an external force application unit of an inline substrate processing device according to an embodiment of the present invention. FIG. 6 is a plan view illustrating an inspection unit of an inline substrate processing device according to an embodiment of the present invention.

[0017] An inline substrate processing device (100) according to one embodiment of the present invention is, for example, a device capable of continuously processing the entire process without delay or stopping, including unwinding a flexible printed circuit board (or flexible metal plate) (10) that is continuously long in the longitudinal direction while in a wound state, cutting it in the direction of travel (longer direction), determining the quality of the product, and winding it up for each cut product.

[0018] At this time, the inline substrate processing device (100) according to one embodiment of the present invention further comprises an external force application unit (50), so that even if the plurality of processes are performed continuously, the entire process provided within the inline substrate processing device (100) can be stably carried out without winding error of the plurality of cut products.

[0019] Hereinafter, we will examine in detail the configuration and effects of the substrate inline substrate processing device (100) according to one embodiment of the present invention.

[0020] Referring to FIG. 1, an inline substrate processing device (100) according to one embodiment of the present invention may include a winding unit (30), a cutting unit (40), an external force application unit (50), a cleaning unit (60), an inspection unit (70), and a winding unit (80).

[0021] In one embodiment of the present invention, the unwinding unit (30) is a module for unwinding a first substrate (11), which has been wound several times along the outer surface of the unwinding roller (32) as shown in FIG. 2, into a flat shape and supplying it to the cutting unit (40) to be described later. At this time, the first substrate (11) may have a wider width (W1) compared to the second substrate (12, 13, 14) to be described later, as shown in FIG. 3.

[0022] At this time, a separate actuator (not shown) is mechanically connected to the unwinding roller (32) to rotate the unwinding roller (32).

[0023] Meanwhile, referring again to FIG. 2, the first substrate (11) unwound from the unwinding unit (30) can be cut and separated into a plurality of second substrates (12, 13, 14) having a narrow width (W2, W3, W4) by the cutting unit (40). At this time, the width size (W2, W3, W4) of the second substrates (12, 13, 14) may correspond to the size of the final product to be shipped, or may correspond to a size that can be moved in a post-processing facility.

[0024] In addition, to cut the first substrate (11), the cutting portion (40) may be provided with one or more cutting members (not shown) at positions corresponding to the widthwise edges of the second substrates (12, 13, 14).

[0025] Meanwhile, the inline substrate inspection device (100) according to one embodiment of the present invention may not immediately wind up a plurality of second substrates (12, 13, 14) moved from the cutting unit (40), but may wind them up through the winding unit (80) after completing processes such as cleaning and inspection while passing through the external force application unit (50), cleaning unit (60), inspection unit (70), etc., which will be described later.

[0026] That is, an inline substrate processing device (100) according to one embodiment of the present invention can perform the unwinding, cutting, inspection, and winding processes for a substrate inline so as to resolve process delays caused by moving the substrate to a separate facility equipped with inspection equipment after cutting the substrate. The present invention is not limited thereto, and additional cleaning or foreign matter removal processes may be added to the pre- and post-stages of each process.

[0027] Below, we will describe an embodiment in which a cleaning process is further added after the cutting process.

[0028] A plurality of second substrates (12, 13, 14) cut from the cutting section (40) can be handled individually until they are finally wound by the winding section (80) after passing through the external force application section (50), the cleaning section (60), and the inspection section (70). At this time, the plurality of second substrates (12, 13, 14) flow continuously at one end with the first substrate (11) of the unwinding section.

[0029] In one embodiment of the present invention, the cleaning unit (60) is a module disposed between the cutting unit (40) and the inspection unit (70) for removing foreign matter attached to the second substrate (12, 13, 14) before supplying the second substrate (12, 13, 14) to the inspection unit (70).

[0030] At this time, the foreign matter is generated during the process of cutting the first substrate (11) by the cutting unit (40), and may be, for example, floating foreign matter crushed from the first substrate (11) that is scattered and attached to the substrate. To this end, the cleaning unit (60) may be equipped with, for example, a spraying member that sprays a chemical substance to remove the attached foreign matter or an air knife that sprays compressed air.

[0031] As such, the inline substrate processing device (100) according to one embodiment of the present invention can prevent an error in which the second substrate (12, 13, 14) is determined to be defective due to the presence of foreign matter during a subsequent quality inspection by the inspection unit (70) by removing foreign matter from the second substrate (12, 13, 14) that may be partially contaminated during the cutting process through the cleaning unit (60).

[0032] Next, a plurality of second substrates (12, 13, 14) cleaned by the cleaning unit (60) can be supplied directly to the inspection unit (70) without moving the location. That is, the inline substrate processing device (100) according to one embodiment of the present invention, as described above, does not separately wind the second substrates (12, 13, 14) that have been cut and perform the inspection process through another device, but rather places the inspection unit (70) directly at the rear end of the cleaning unit (60) to perform the inspection process inline. Therefore, the time required for a worker to attach and detach the cut substrates to the inspection equipment can be reduced, and worker safety issues caused by the weight of the roller on which the printed circuit boards are wound can also be resolved.

[0033] At this time, the inspection unit (70) includes a plurality of sensing sensors (71, 72, 73) arranged adjacent to each of the plurality of second substrates (12, 13, 14) as shown in FIG. 1, so as to be able to individually determine the quality of the plurality of second substrates (12, 13, 14).

[0034] As a specific example, the inspection unit (70) may be equipped with a plurality of inspection cameras as detection sensors (71, 72, 73) to acquire an image of the outer surface of the second substrate (12, 13, 14) and then determine the quality of the second substrate (12, 13, 14) from the image. However, the image sensors such as the inspection cameras are merely examples of detection sensors (71, 72, 73), and in addition, the detection sensors (71, 72, 73) may be composed of various sensors, such as current detection sensors that monitor quality by passing current through them.

[0035] In addition, the inspection unit may be equipped with one or more chambers, and different inspection methods may be performed within each chamber. Of course, the same inspection method may also be performed. As an example, an external inspection of the second substrate may be performed in the first inspection unit as described above, and a circuit inspection of the second substrate may be performed in the second inspection unit.

[0036] Meanwhile, the inspection unit (70) can arrange the multiple detection sensors (71, 72, 73) so that they are not aligned along the width direction of the second substrate (12, 13, 14), that is, adjacent detection sensors are offset from each other in the length direction of the second substrate.

[0037] For example, as shown in FIG. 6, a plurality of sensing sensors (71a, 71b, 72a, 72b, 73a, 73b) can be arranged in a line with an inclined shape with respect to the width direction of the second substrate (12, 13, 14).

[0038] As such, the detection sensors (71a, 71b, 72a, 72b, 73a, 73b) of the inspection unit (70) are arranged so as to be offset from each other, in order to design the inspection unit (70) to be more compact, thereby allowing the overall length or width size of the inline substrate processing device (100) according to the present invention to be reduced. That is, for example, when large detection sensors such as an inspection camera are arranged side by side, spatial interference occurs between adjacent sensors, so the adjacent second substrates (12, 13, 14) must be spaced further apart. However, as described above, if the detection sensors are arranged so as to be offset from each other, the interference can be minimized, and the width-direction volume of the inspection unit (70) can also be minimized.

[0039] In one embodiment of the present invention, a plurality of second substrates (12, 13, 14) that have passed through the inspection unit (70) can be individually wound through the winding unit (80) to complete the inline substrate processing process.

[0040] At this time, the winding unit (80) may be equipped with a plurality of winding rollers (81, 82, 83) to wind a plurality of second substrates (12, 13, 14) respectively, as shown in FIGS. 1 and 6. At this time, the winding rollers may be provided in a quantity equal to the number of second substrates being cut.

[0041] And the winding unit (80) may include a plurality of power members (not shown) individually coupled to the winding rollers (81, 82, 83) to rotate the winding rollers (81, 82, 83). That is, the winding unit (80) may be equipped with N winding rollers (81, 82, 83) (N is a natural number greater than or equal to 1) and N power members corresponding thereto. The present invention is not limited thereto and may drive N winding rollers through a single power member.

[0042] At this time, the power members are equipped with electric motors that are individually controlled and driven, so they can be driven independently without being affected by other power members.

[0043] In addition, the N power members can be driven by receiving a control signal of the same magnitude from a control unit (not shown) so as to rotate multiple winding rollers (81, 82, 83) at the same speed. However, even if a control signal of the same magnitude is applied, the multiple winding rollers (81, 82, 83) may rotate at different rotational speeds at a time due to a slight output deviation between individual power members, for example, motors, or due to output deviations or aging effects of parts applied during flow.

[0044] In this case, a slight change in tension may be formed in multiple second substrates (12, 13, 14) due to the difference in rotational speed of the winding rollers (81, 82, 83). More specifically, in the case of the second substrate (14) connected to the winding roller (83) which has a faster rotational speed than other winding rollers (81, 82, 83), the tension increases as it is pulled taut momentarily. Conversely, in the case of the second substrate (12) connected to the winding roller (81) which has a slower rotational speed, the tension decreases as it is loosened momentarily.

[0045] If these changes in tension are left unchecked, a problem may occur where a part of the second substrate (14) in the subsequent process is cut off by the increased tension while the first substrate (11) is continuously being provided in the unwinding section (30), or conversely, a part of the second substrate (12, 13, 14) gets tangled in the inspection section (70) or the winding section (80) due to the loosened second substrate (12), and the entire equipment may become unable to operate.

[0046] In order to prevent such problems, an inline substrate processing device (100) according to one embodiment of the present invention may have an external force application unit (50) positioned between a cutting unit (40) and an inspection unit (70). In addition, the external force application unit (50) may be positioned at a location where the tension of the first substrate (11) or the second substrate (12, 13, 14) is to be controlled, without being limited thereto.

[0047] At this time, the external force application unit (50) is provided with N external force application members (52, 53, 54) corresponding to N second substrates (12, 13, 14) so ​​as to apply an external force to each of the N second substrates (12, 13, 14).

[0048] Here, the meaning of applying external force to the second substrate (12, 13, 14) can mean both transmitting physical force while the external force applying member (52, 53, 54) is in direct contact with the second substrate (12, 13, 14) and transmitting force indirectly by applying, for example, ultrasonic vibration, wind pressure, etc., while in a non-contact state.

[0049] These external force applying members (52, 53, 54) can control the flow velocity of a plurality of second substrates (12, 13, 14) cut from the first substrate (11) as shown in FIG. 1 by applying pressure to one side of the second substrate (12, 13, 14).

[0050] At this time, the external force applying members (52, 53, 54) can be driven independently of each other to correspond to the tension deviation formed between the plurality of second substrates (12, 13, 14) according to the difference in rotational speed of the winding rollers (81, 82, 83) described above. That is, the plurality of external force applying members (52, 53, 54) can each be driven individually in response to the change in tension of the individual second substrates (12, 13, 14).

[0051] To this end, the plurality of external force applying members (52, 53, 54) may individually be equipped with external force adjusting members (52a, 53a, 54a) capable of adjusting the magnitude of the external force as shown in FIG. 5. At this time, the external force adjusting members (52a, 53a, 54a) may be applied as known actuators capable of adjusting the force applied by the external force applying members (52, 53, 54) to the second substrate (12, 13, 14), including pneumatic or hydraulic cylinders, weights, springs, etc.

[0052] As a specific example, the external force applying member (52, 53, 54) may be formed as a roller type that moves in response to changes in tension, as shown in FIG. 4. In this case, the plurality of rollers may be formed spaced apart from the inner wall or adjacent parts of the inline substrate processing device according to the present invention and may move freely according to changes in tension. As another embodiment, a part may be supported by the body (51).

[0053] Specifically, referring to FIG. 5, when the rotational speed of any one of the winding rollers (81, 82, 83) is increased, the roller is moved upward due to the increased tension (moving from the second height (h2) to the third height (h3)), thereby reducing the extension length of the second substrate (14) from the cutting section (40) to the winding roller (83).

[0054] Conversely, when the rotational speed of the winding roller (81) is reduced, the tension is reduced and the roller is moved toward the ground by the second substrate (12) which has become loose (moving from the second height (h2) to the first height (h1)), and the extension length of the second substrate (12) between the cutting section (40) and the winding roller (81) can be increased.

[0055] In this way, an external force applying member (52, 53, 54), such as a roller, is driven independently to adjust the extension length of the second substrate (12, 13, 14), thereby forming a buffer area that can cushion whether the rotational speed of any one of the multiple winding rollers (81, 82, 83) is excessive or insufficient.

[0056] Meanwhile, in FIG. 4 and the above description, the external force applying member (52, 53, 54) is described as moving as a whole in response to changes in tension, such as a roller, but the external force applying member (52, 53, 54) may be moved partially, not entirely.

[0057] As an exemplary example, the external force applying member (52, 53, 54) applies an external force by having only one end in contact with the second substrate (12, 13, 14) while one side is fixed to the body (51), and the said end may be partially moved by the change in tension described above.

[0058] As another example, the external force applying member (52, 53, 54) may not be a member that moves passively due to changes in tension, such as the roller described above, but may actively adjust the external force applied to the second substrate (12, 13, 14) by detecting individual changes in tension of the second substrate (12, 13, 14). For example, after preemptively detecting changes in tension of the second substrate (12, 13, 14) through a pressure sensing sensor such as a load cell sensor, the external force applying member (52, 53, 54) may adjust the magnitude of the external force applied to the second substrate (12, 13, 14) according to the magnitude of the changed tension to appropriately respond to the changes in tension.

[0059] As such, in one embodiment of the present invention, the external force applying member (52, 53, 54) is sufficient if it is a member that is driven independently to individually respond to the tension deviation between a plurality of second substrates (12, 13, 14) formed by the difference in rotational speed of the winding roller (81, 82, 83), and various members can be used without being limited to a specific method.

[0060] Meanwhile, the external force application unit (50) may include a sensor member to detect the limit position of the external force application member (52, 53, 54) that moves according to the tension change described above. At this time, the sensor member may be provided by distinguishing between upper and lower limit position detection members (55, 56).

[0061] As a result, if the external force application member (52, 53, 54) moves beyond the permissible range, there is a high probability that problems such as cutting or entanglement of the second substrate (12, 13, 14) will occur immediately, so the overall operation of the inline substrate processing device (100) can be temporarily stopped.

[0062] Hereinafter, an inline substrate processing device (100) according to another embodiment of the present invention will be described.

[0063] An inline substrate processing device (100) according to another embodiment of the present invention may further include a back surface cleaning unit (20) disposed at the front end of the unwinding unit (30) in addition to the configuration described above.

[0064] At this time, the back surface cleaning unit (20) can remove foreign matter attached to the first substrate (11) before the first substrate (11) wound on the unwinding roller (32) is unwound. At this time, the foreign matter may be, for example, adhesive foreign matter attached to the back surface of the printed circuit board.

[0065] To this end, the back cleaning unit (20) may be equipped with a spraying member that sprays a chemical substance to remove adhesive foreign matter similar to the cleaning unit (60) described above, or an air pump that sprays compressed air.

[0066] In addition, an inline substrate processing device (100) according to another embodiment of the present invention may additionally include the aforementioned unwinding unit (30), cutting unit (40), external force application unit (50), cleaning unit (60), and inspection unit (70) in the aforementioned continuous process.

[0067] As a specific example, the external force application unit (50) may be additionally positioned between the cleaning unit (60) and the inspection unit (70) in addition to the cutting unit (40) and the cleaning unit (60) to apply an external force multiple times along the longitudinal direction to the second substrate (12, 13, 14). Through this, the inline substrate processing device (100) according to another embodiment of the present invention can respond to changes in tension formed on the second substrate (12, 13, 14) in multiple stages and more effectively prevent winding errors by providing multiple buffer spaces.

[0068] As another example, in addition to the inspection unit (70) that performs an external inspection using an inspection camera as described above, an inspection unit (70) that performs a current inspection by applying current may be additionally placed, or multiple cleaning units (60) may be placed throughout the inline process by changing the cleaning method.

[0069] As seen above, the inline substrate processing device (100) according to various embodiments of the present invention can continuously perform a plurality of processes—a substrate cutting process, an inspection process for inspecting the cut substrate, and a process for winding the inspected substrate—through a single line without moving locations or delays in time, thereby maximizing the efficiency of the substrate processing process.

[0070] At this time, the inline substrate processing device (100) according to various embodiments of the present invention can effectively prevent cutting or entanglement problems that may occur due to variations in winding speed by arranging external force applying members that apply external force independently to the cut second substrates (12, 13, 14) while continuously performing a plurality of processes.

[0071] Although an embodiment of the present invention has been described above, the spirit of the present invention is not limited by the embodiments presented in this specification. Those skilled in the art who understand the spirit of the present invention may easily propose other embodiments within the scope of the same spirit by adding, changing, deleting, or adding components, and such are also to be considered to fall within the scope of the spirit of the present invention. Explanation of the symbols

[0072] 10: Substrate 20: Backside cleaning unit 30: Unwinding section 40: Cutting section 50: External Force Application Section 60: Cleaning Section 70: Inspection Section 80: Winding Section 100: In-line substrate processing unit

Claims

Claim 1 A winding unit for winding and supplying a first substrate; a cutting unit for cutting the first substrate supplied from the winding unit to form N second substrates; an inspection unit for determining the quality of the N second substrates delivered from the cutting unit; a winding unit comprising N winding rollers configured to individually wind the N second substrates delivered from the inspection unit; and an external force application unit disposed between the cutting unit and the inspection unit, comprising N external force application members for applying an external force to one side of each of the N second substrates. An inline substrate processing device comprising: N external force applying members are provided to correspond one-to-one with the N second substrates and are driven independently of each other; the position of the N external force applying members varies according to the change in tension of the second substrates corresponding one-to-one; further comprising a sensor member for detecting the position of the external force applying members, wherein the sensor member is provided by being divided into a sensing member for detecting an upper limit / lower limit position; wherein the N external force applying members are controlled so that the entire operation is stopped when at least one of the N external force applying members detects a limit position; and wherein the inspection unit includes a plurality of inspection cameras spaced apart from each other to individually determine the quality of the N second substrates, wherein the plurality of inspection cameras are provided to correspond one-to-one or many-to-one with respect to each of the N second substrates, and the inspection cameras are arranged offset from each other in the width direction of the second substrates. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 An inline substrate processing device according to claim 1, further comprising a cleaning unit disposed between the cutting unit and the inspection unit to clean foreign matter formed on the N second substrates, wherein the cleaning unit is provided at least one on the surface or back surface of the second substrate. Claim 7 In claim 1, the inline substrate processing device wherein the first substrate and the second substrate are flexible printed circuit boards. Claim 8 In claim 1, the inspection unit is provided in two or more ways, and the inspection items inspected for the second substrate in each inspection unit are different from each other in an inline substrate processing device. Claim 9 An inline substrate processing device according to claim 1, comprising a plurality of external force application units spaced apart from each other between the cutting unit and the inspection unit.

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