Display device and method of manufacturing electronic device using the same

Abstract

A display device according to the present invention comprises a window, a display module disposed below the window and including a bending region that is bent along a bending axis, and a protective cover film disposed below the display module to protect the display module. The protective cover film comprises an insulating base layer and an adhesive layer disposed between the insulating base layer and the display module. An air gap overlapping with the bending region is provided within the insulating base layer.

Description

Technology Field

[0001] The present invention relates to a display device and a method for manufacturing an electronic device using the same, and more specifically, to a display device with improved protection performance and a method for manufacturing an electronic device using the same. Background Technology

[0002] Electronic devices such as smartphones, tablets, laptop computers, and smart televisions are being developed. These electronic devices are equipped with display devices to provide information. In addition to display devices, these electronic devices further include various electronic modules.

[0003] An electronic device is manufactured by assembling display devices and electronic modules. At this time, the electronic modules are organically arranged using the external case and bracket of the electronic device. The problem to be solved

[0004] The object of the present invention is to provide a display device capable of protecting a display module during a product assembly process, and a method for manufacturing an electronic device using said display device. means of solving the problem

[0005] A display device according to one feature of the present invention includes a window, a display module disposed below the window and including a bending area that is bent along a bending axis, and a protective cover film disposed below the display module to protect the display module.

[0006] The above protective cover film comprises an insulating base layer and an adhesive layer disposed between the insulating base layer and the display module, and an air gap overlapping with the bending region is provided within the insulating base layer.

[0007] A display device according to one feature of the present invention includes a window, a display module disposed below the window and including a bending area that is bent along a bending axis, and a protective cover film disposed below the display module to protect the display module.

[0008] The protective cover film comprises an insulating base layer and an adhesive layer disposed between the insulating base layer and the display module. The insulating base layer includes a shaped portion that overlaps with the bending area.

[0009] A method for manufacturing an electronic device according to one feature of the present invention comprises the steps of: preparing a display device comprising a window, a display module disposed below the window, and a protective cover film disposed below the display module to protect the display module; removing the protective cover film from the display device; and combining the display module with a component of the electronic device.

[0010] The protective cover film comprises an insulating base layer and an adhesive layer disposed between the insulating base layer and the display module. The insulating base layer includes a shaped portion that overlaps with the bending area. Effects of the invention

[0011] According to the present invention, a display device is provided with a protective cover film for protecting a display module, thereby enabling stable protection of the display module during the manufacture of an electronic device. The protective cover film may improve the protective performance of the protective cover film by including an air gap or a shaped portion for cushioning impact provided to the bending area of ​​the display module. Brief explanation of the drawing

[0012] FIG. 1a is a perspective view of an electronic device according to one embodiment of the present invention. FIG. 1b is an exploded perspective view of a display device according to one embodiment of the present invention. FIG. 1c is a cross-sectional view taken along the cutting line I-I' shown in FIG. 1b. FIG. 2a is a cross-sectional view of a display module cut along the cutting line II-II' shown in FIG. 1b. FIG. 2b is a cross-sectional view of a display module according to one embodiment of the present invention. FIG. 3a is a plan view of a display panel according to one embodiment of the present invention. FIG. 3b is a plan view of an input sensing layer according to one embodiment of the present invention. FIG. 4a is a rear view of a display device according to one embodiment of the present invention. FIG. 4b is a cross-sectional view of a display device cut along the cutting line Ⅲ-Ⅲ' shown in FIG. 4a. FIG. 4c is a cross-sectional view of a display device according to one embodiment of the present invention. FIGS. 5a to 5c are partially enlarged cross-sectional views of a protective cover film according to embodiments of the present invention. FIGS. 6a to 6d are plan views of a protective cover film according to embodiments of the present invention. Figure 7a is a partial enlarged cross-sectional view of the protective cover film shown in Figure 6b. Figure 7b is a partial enlarged cross-sectional view of the protective cover film shown in Figure 6d. FIG. 8a is an exploded perspective view of a display device according to one embodiment of the present invention. FIG. 8b is a combined cross-sectional view of a display device according to one embodiment of the present invention. FIG. 9a is a plan view of a protective cover film according to one embodiment of the present invention. FIG. 9b is a cross-sectional view taken along the cutting line Ⅳ-Ⅳ' shown in FIG. 9a. FIG. 10a is an exploded perspective view of a display device according to one embodiment of the present invention. FIG. 10b is a combined cross-sectional view of a display device according to one embodiment of the present invention. FIGS. 11a and FIGS. 11b are perspective views of a protective cover film according to embodiments of the present invention. FIG. 12a is an exploded perspective view of a display device according to one embodiment of the present invention. FIG. 12b is a combined cross-sectional view of a display device according to one embodiment of the present invention. FIG. 13 is a flowchart illustrating a method for manufacturing an electronic device according to one embodiment of the present invention. Specific details for implementing the invention

[0013] In this specification, where a component (or region, layer, part, etc.) is described as being “on,” “connected,” or “joined” another component, it means that it may be directly placed / connected / joined on the other component, or that a third component may be placed between them.

[0014] Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the effective illustration of the technical content. “And / or” includes all one or more combinations that the associated components may define.

[0015] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0016] Additionally, terms such as “below,” “lower,” “on,” and “upper” are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0017] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0018] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an overly ideal or overly formal sense unless explicitly defined herein.

[0019] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0020] FIG. 1a is a perspective view of an electronic device according to one embodiment of the present invention, and FIG. 1b is an exploded perspective view of a display device according to one embodiment of the present invention. FIG. 1c is a cross-sectional view taken along the cutting line I-I' shown in FIG. 1b.

[0021] Referring to FIGS. 1a through 1c, the electronic device (ED) may be a device that is activated by an electrical signal. The electronic device (ED) may include various embodiments. For example, the electronic device (ED) may be an electronic device such as a smart watch, tablet, laptop, computer, smart television, etc.

[0022] The electronic device (ED) can display an image (IM) toward a third direction (DR3) on a display surface (IS) parallel to each of the first direction (DR1) and the second direction (DR2). The display surface (IS) on which the image (IM) is displayed may correspond to the front surface of the electronic device (ED). The image (IM) may include a still image as well as a dynamic image.

[0023] In this embodiment, the front (or top) and back (or bottom) surfaces of each member are defined based on the third direction (DR3) in which the image (IM) is displayed. The front and back surfaces are opposed to each other in the third direction (DR3), and the normal direction of each of the front and back surfaces may be parallel to the third direction (DR3).

[0024] The distance between the front and back surfaces in the third direction (DR3) may correspond to the thickness of the electronic device (ED) in the third direction (DR3). Meanwhile, the directions indicated by the first to third directions (DR1, DR2, DR3) are relative concepts and can be converted to other directions.

[0025] The electronic device (ED) can detect external inputs applied from the outside. The external input may include various forms of inputs provided from the outside. For example, the external input may include contact by parts of the body, such as a user's hand, as well as external inputs applied when in close proximity to the electronic device (ED) or at a certain distance (e.g., hovering). Additionally, it may take various forms such as force, pressure, temperature, light, etc.

[0026] The front surface of the electronic device (ED) can be divided into a transparent area (TA) and a bezel area (BZA). The transparent area (TA) may be an area where an image (IM) is displayed. The user perceives the image (IM) through the transparent area (TA). In this embodiment, the transparent area (TA) is depicted as a square shape with rounded vertices. However, this is illustrated as an example, and the transparent area (TA) may have various shapes and is not limited to any single embodiment.

[0027] The bezel region (BZA) is adjacent to the transparent region (TA). The bezel region (BZA) may have a predetermined color. The bezel region (BZA) may surround the transparent region (TA). Accordingly, the shape of the transparent region (TA) may be substantially defined by the bezel region (BZA). However, this is illustrated as an example, and the bezel region (BZA) may be positioned adjacent to only one side of the transparent region (TA) or may be omitted. An electronic device (ED) according to one embodiment of the present invention may include various embodiments and is not limited to any one embodiment.

[0028] The electronic device (ED) may include a display device (DD) and an external case (EDC). The display device (DD) may include a window (WM), a display module (DM), a driving module (EM), an optical film (OTF), a sub-module (LM), and a protective cover film (PCF).

[0029] The window (WM) may be made of a transparent material capable of emitting an image. For example, it may be composed of glass, sapphire, plastic, etc. Although the window (WM) is illustrated as a single layer, it is not limited thereto and may include multiple layers. Meanwhile, although not illustrated, the bezel area (BZA) of the display device (DD) described above may be provided as an area in which a material containing a predetermined color is printed on a portion of the window (WM). As an example of the present invention, the window (WM) may include a bezel pattern (WBM) for defining the bezel area (BZA). The bezel pattern (WBM) may be formed as a colored organic film, for example, by a coating method.

[0030] A display module (DM) may include a display panel (DP) and an input sensing layer (ISP). A display panel (DP) according to one embodiment of the present invention may be a light-emitting display panel and is not particularly limited. For example, the display panel (DP) may be an organic light-emitting display panel, an inorganic light-emitting display panel, or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include an organic light-emitting material, and the light-emitting layer of an inorganic light-emitting display panel may include an inorganic light-emitting material. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots and quantum rods, etc. Hereinafter, the display panel (DP) is described as an organic light-emitting display panel.

[0031] The input sensing layer (ISP) can be placed directly on the display panel (DP). According to one embodiment of the present invention, the input sensing layer (ISP) can be formed on the display panel (DP) by a continuous process. That is, when the input sensing layer (ISP) is placed directly on the display panel (DP), an adhesive film is not placed between the input sensing layer (ISP) and the display panel (DP).

[0032] The display panel (DP) generates an image (IM), and the input sensing layer (ISP) acquires coordinate information of an external input (e.g., a touch event).

[0033] An optical film (OTF) reduces the reflectance of external light incident from the upper side of a window (WM). An optical film (OTF) according to one embodiment of the present invention may include a phase retarder and a polarizer. The phase retarder may be of the film type or the liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be of the film type or the liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may be implemented as a single polarizing film. The optical film (OTF) may further include a protective film disposed on the upper or lower side of the polarizing film.

[0034] An optical film (OTF) can be placed on an input sensing layer (ISP). That is, the optical film (OTF) can be placed between the input sensing layer (ISP) and a window (WM). The input sensing layer (ISP), the optical film (OTF), and the window (WM) can be joined together through an adhesive film. A first adhesive film (AF1) is placed between the input sensing layer (ISP) and the optical film (OTF), and a second adhesive film (AF2) is placed between the optical film (OTF) and the window (WM). Thus, the optical film (OTF) is joined to the input sensing layer (ISP) by the first adhesive film (AF1), and the window (WM) is joined to the optical film (OTF) by the second adhesive film (AF2).

[0035] As an example of the present invention, each of the first and second adhesive films (AF1, AF2) may comprise an optically clear adhesive film (OCA film). However, the material of each of the first and second adhesive films (AF1, AF2) is not limited thereto and may comprise a conventional adhesive or pressure-sensitive adhesive. For example, each of the first and second adhesive films (AF1, AF2) may comprise a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR).

[0036] Between the display module (DM) and the window (WM), a functional layer that performs other functions, such as a protective layer, may be additionally placed in addition to the optical film (OTF).

[0037] The display module (DM) can display images based on electrical signals and transmit / receive information regarding external inputs. The display module (DM) can be defined as an active area (AA) and a peripheral area (NAA). The active area (AA) can be defined as an area that emits images provided by the display module (DM).

[0038] The surrounding area (NAA) is adjacent to the active area (AA). For example, the surrounding area (NAA) may surround the active area (AA). However, this is illustrated as an example, and the surrounding area (NAA) may be defined in various shapes and is not limited to any one embodiment. According to one embodiment, the active area (AA) of the display module (DM) may correspond to at least a portion of the transparent area (TA).

[0039] According to the present invention, a display module (DM) may include a first region (A1), a second region (A2), and a third region (A3) arranged in a second direction (DR2). The first region (A1) may be a region corresponding to a display surface (IS). The second region (A2) and the third region (A3) may be included in a surrounding region (NAA). The second region (A2) may be a bending region that is bent with respect to a bending axis, and the first and third regions (A1, A3) may be non-bending regions. The lengths of the second region (A2) and the third region (A3) in the first direction (DR1) may be less than or equal to the length of the first region (A1). Regions with shorter lengths in the direction of the bending axis may be more easily bent.

[0040] The driving module (EM) can control the driving of the display module (DM). The driving module (EM) may include a flexible circuit film (FCB) and a driving chip (DIC). The flexible circuit film (FCB) may be electrically connected to the display panel (DP). The flexible circuit film (FCB) may be bonded to the end of the third region (A3) of the display module (DM) through a bonding process. The flexible circuit film (FCB) may be electrically connected to the display module (DM) through an anisotropic conductive adhesive layer. The driving chip (DIC) may be mounted on the third region (A3) of the display module (DM). The driving chip (DIC) may include driving circuits for driving pixels of the display panel (DP), for example, a data driving circuit.

[0041] The driving module (EM) may further include a plurality of driving elements (DEL) mounted on a flexible circuit film (FCB). The plurality of driving elements (DEL) may include a circuit portion for converting a signal input from the outside into a signal required by a driving chip (DIC) or into a signal required to drive a display module (DM). The flexible circuit film (FCB) may be placed below the display module (DM).

[0042] The lower module (LM) is positioned on the back surface of the display module (DM). The lower module (LM) can be positioned on the back surface of the display module (DM) to improve the impact resistance of the display device (DD). The lower module (LM) can be fixed to the back surface of the display module (DM) via an adhesive film. The adhesive film may be a pressure-sensitive adhesive (PSA), an optical clear adhesive (OCA), or an optical clear resin (OCR). The third region (A3) and the flexible circuit film (FCB) of the display module (DM) can be positioned on the rear surface of the lower module (LM).

[0043] A protective cover film (PCF) is placed below the display module (DM) and the lower module (LM). Specifically, the protective cover film (PCF) is placed below the rear surface of the lower module (LM) and the third area (A3) of the display module (DM) to protect the bending area of ​​the display module (DM) and the flexible circuit film (FCB). The protective cover film (PCF) may have a rectangular tape shape. However, the shape of the protective cover film (PCF) is not limited thereto. The protective cover film (PCF) may have various shapes within a range of sizes sufficient to cover the flexible circuit film (FCB).

[0044] The protective cover film (PCF) comprises an insulating base layer (IBL), an adhesive layer (AL), and a step layer (SDL). The insulating base layer (IBL) may include an insulating material. The insulating material may be a synthetic resin film and may include at least one of polyethylene terephthalate (PET), polyimide (PI), polyamide (PAI), polyethylene naphthalate (PEN), and polycarbonate (PC). The insulating base layer (IBL) may include a transparent insulating material.

[0045] The adhesive layer (AL) is partially placed on the insulating base layer (IBL). The adhesive layer (AL) is placed between the insulating base layer (IBL) and the lower module (LM) so that the insulating base layer (IBL) can be fixed to the lower module (LM).

[0046] A step layer (SDL) is disposed on an insulating base layer (IBL). In one example of the present invention, the step layer (SDL) may have adhesive properties. The step layer (SDL) may be disposed spaced apart from the adhesive layer (AL). However, the present invention is not limited thereto. The step layer (SDL) may have an integral shape with the adhesive layer (AL). The protective cover film (PCF) will be described later with reference to FIGS. 4a to 7b.

[0047] The outer case (EDC) accommodates a display device (DD). The outer case (EDC) can be combined with a window (WM) to define the appearance of the electronic device (ED). The outer case (EDC) absorbs shocks applied from the outside and prevents foreign substances / moisture, etc. from penetrating the electronic device (ED), thereby protecting the components housed in the outer case (EDC). Meanwhile, as an example of the present invention, the outer case (EDC) may be provided in a form in which a plurality of storage members are combined.

[0048] FIG. 2a is a cross-sectional view of a display module cut along the cutting line II-II' shown in FIG. 1b, and FIG. 2b is a cross-sectional view of a display module according to an embodiment of the present invention.

[0049] Referring to FIG. 2a, the display panel (DP) may include a panel base layer (110), a circuit element layer (120), a light-emitting element layer (130), and an encapsulation layer (140). The panel base layer (110) may be a member that provides a base surface on which the circuit element layer (120) is placed. The panel base layer (110) may be a glass substrate, a metal substrate, or a polymer substrate, etc. However, the embodiments are not limited thereto, and the panel base layer (110) may be an inorganic layer, an organic layer, or a composite material layer.

[0050] The panel base layer (110) may have a multilayer structure. For example, the panel base layer (110) may include a first synthetic resin layer, a silicon oxide (SiOx) layer disposed on the first synthetic resin layer, an amorphous silicon (a-Si) layer disposed on the silicon oxide layer, and a second synthetic resin layer disposed on the amorphous silicon layer. The silicon oxide layer and the amorphous silicon layer may be referred to as base barrier layers.

[0051] Each of the first and second synthetic resin layers may comprise a polyimide-based resin. Additionally, each of the first and second synthetic resin layers may comprise at least one of an acrylate-based resin, a methacrylate-based resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. Meanwhile, in this specification, "~~"-based resin means that it comprises a functional group of "~~".

[0052] A circuit element layer (120) may be placed on a panel base layer (110). The circuit element layer (120) may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line, etc. An insulating layer, a semiconductor layer, and a conductive layer are formed on the panel base layer (110) by means such as coating or deposition, and subsequently, the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned through a plurality of photolithography processes. After that, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit element layer (120) may be formed.

[0053] At least one inorganic layer is formed on the upper surface of the panel base layer (110). The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed in multiple layers. The multiple inorganic layers may constitute a barrier layer and / or a buffer layer. In this embodiment, the display panel (DP) is shown to include a buffer layer (BFL).

[0054] The buffer layer (BFL) can improve the bonding strength between the panel base layer (110) and the semiconductor pattern. The buffer layer (BFL) may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer (BFL) may include a structure in which a silicon oxide layer and a silicon nitride layer are alternately stacked.

[0055] A semiconductor pattern may be placed on a buffer layer (BFL). The semiconductor pattern may include polysilicon. However, it is not limited thereto, and the semiconductor pattern may include amorphous silicon, low-molecular-weight silicon, or oxide semiconductor.

[0056] FIG. 2a illustrates only a portion of the semiconductor pattern, and additional semiconductor patterns may be placed in other areas. The semiconductor patterns may be arranged according to specific rules across the pixels. The electrical properties of the semiconductor patterns may differ depending on whether they are doped. The semiconductor patterns may include high-conductivity regions with high conductivity and low-conductivity regions with low conductivity. The high-conductivity regions may be doped with an N-type dopant or a P-type dopant. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The low-conductivity regions may be un-doped regions or regions doped at a lower concentration compared to the high-conductivity regions.

[0057] The conductivity of the high-conductivity region is greater than that of the low-conductivity region and can effectively function as an electrode or signal line. The low-conductivity region can effectively correspond to the channel region of the transistor. In other words, a part of the semiconductor pattern may be the channel region of the transistor, another part may be the source or drain region of the transistor, and yet another part may be a connecting electrode or a connecting signal line.

[0058] Each pixel may have an equivalent circuit comprising a plurality of transistors, at least one capacitor, and a light-emitting element, and the equivalent circuit diagram of the pixel may be modified in various forms. In FIG. 2a, one transistor (100PC) and a light-emitting element (100PE) included in each pixel are illustrated as examples.

[0059] The source region (SC), channel region (CH), and drain region (DR) of the transistor (100PC) can be formed from a semiconductor pattern. The source region (SC) and the drain region (DR) can extend in opposite directions from the channel region (CH) in a cross-section. FIG. 2a shows a portion of the connection signal wiring (SCL) formed from the semiconductor pattern. Although not separately illustrated, the connection signal wiring (SCL) can be connected to the drain region (DR) of the transistor (100PC) in a planar view.

[0060] The first insulating layer (10) may be placed on the buffer layer (BFL). The first insulating layer (10) may overlap in common with a plurality of pixels and cover a semiconductor pattern. The first insulating layer (10) may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The first insulating layer (10) may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer (10) may be a single-layer silicon oxide layer. The insulating layer of the circuit element layer (120) described below, as well as the first insulating layer (10), may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the materials described above, but is not limited thereto.

[0061] The gate (GT) of the transistor (100PC) is placed on the first insulating layer (10). The gate (GT) may be part of a metal pattern. The gate (GT) overlaps the channel region (CH). In the process of doping the semiconductor pattern, the gate (GT) can function as a mask.

[0062] The second insulating layer (20) is disposed on the first insulating layer (10) and can cover the gate (GT). The second insulating layer (20) can overlap the pixels in common. The second insulating layer (20) may be an inorganic layer and / or an organic layer and may have a single layer or a multilayer structure. The second insulating layer (20) may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In this embodiment, the second insulating layer (20) may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0063] A third insulating layer (30) may be placed on top of a second insulating layer (20). The third insulating layer (30) may have a single layer or a multilayer structure. For example, the third insulating layer (30) may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0064] The first connecting electrode (CNE1) can be placed on the third insulating layer (30). The first connecting electrode (CNE1) can be connected to the connecting signal wiring (SCL) through a contact hole (CNT-1) penetrating the first, second, and third insulating layers (10, 20, 30).

[0065] The fourth insulating layer (40) may be placed on the third insulating layer (30). The fourth insulating layer (40) may be a single layer of silicon oxide. The fifth insulating layer (50) may be placed on the fourth insulating layer (40). The fifth insulating layer (50) may be an organic layer.

[0066] The second connecting electrode (CNE2) can be placed on the fifth insulating layer (50). The second connecting electrode (CNE2) can be connected to the first connecting electrode (CNE1) through a contact hole (CNT-2) that penetrates the fourth insulating layer (40) and the fifth insulating layer (50).

[0067] The sixth insulating layer (60) is placed on the fifth insulating layer (50) and can cover the second connecting electrode (CNE2). The sixth insulating layer (60) may be an organic layer.

[0068] A light-emitting element layer (130) may be disposed on a circuit element layer (120). The light-emitting element layer (130) may include a light-emitting element. For example, the light-emitting element layer (130) may include an organic light-emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED. In the following description, the light-emitting element (100PE) is described as an example of being an organic light-emitting element, but is not particularly limited thereto.

[0069] The light-emitting element (100PE) may include a first electrode (AE), a light-emitting layer (EL), and a second electrode (CE). The first electrode (AE) may be placed on the sixth insulating layer (60). The first electrode (AE) may be connected to the second connecting electrode (CNE2) through a contact hole (CNT-3) penetrating the sixth insulating layer (60).

[0070] The pixel defining film (70) is placed on the sixth insulating layer (60) and can cover a portion of the first electrode (AE). An opening (70-OP) is defined in the pixel defining film (70). The opening (70-OP) of the pixel defining film (70) exposes at least a portion of the first electrode (AE).

[0071] The active region (AA, see FIG. 1b) may include a light-emitting region (PXA) and a non-light-emitting region (NPXA) adjacent to the light-emitting region (PXA). The non-light-emitting region (NPXA) may surround the light-emitting region (PXA). In this embodiment, the light-emitting region (PXA) is defined to correspond to a portion of the first electrode (AE) exposed by the opening (70-OP).

[0072] The light-emitting layer (EL) can be placed on the first electrode (AE). The light-emitting layer (EL) can be placed in an area corresponding to the opening (70-OP). That is, the light-emitting layer (EL) can be formed separately for each pixel. When the light-emitting layer (EL) is formed separately for each pixel, each of the light-emitting layers (EL) can emit light of at least one color among blue, red, and green. However, it is not limited thereto, and the light-emitting layer (EL) may be connected to the pixels and provided in common. In this case, the light-emitting layer (EL) may provide blue light or white light.

[0073] The second electrode (CE) can be placed on the light-emitting layer (EL). The second electrode (CE) has a single shape and can be placed commonly on a plurality of pixels.

[0074] Although not shown, a hole control layer may be disposed between the first electrode (AE) and the light-emitting layer (EL). The hole control layer may be disposed in common in the light-emitting region (PXA) and the non-light-emitting region (NPXA). The hole control layer includes a hole transport layer and may further include a hole injection layer. An electronic control layer may be disposed between the light-emitting layer (EL) and the second electrode (CE). The electronic control layer includes an electron transport layer and may further include an electron injection layer. The hole control layer and the electronic control layer may be formed in common across a plurality of pixels using an open mask.

[0075] The encapsulation layer (140) may be disposed on the light-emitting element layer (130). The encapsulation layer (140) may include sequentially stacked inorganic layers, organic layers, and inorganic layers, but the layers constituting the encapsulation layer (140) are not limited thereto.

[0076] Inorganic layers can protect the light-emitting element layer (130) from moisture and oxygen, and organic layers can protect the light-emitting element layer (130) from foreign substances such as dust particles. Inorganic layers may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. Organic layers may include an acrylic-based organic layer, but are not limited thereto.

[0077] The input sensing layer (ISP) can be formed on the display panel (DP) through a continuous process. In this case, the input sensing layer (ISP) may be described as being 'directly placed' on the display panel (DP). Being directly placed may mean that no third component is placed between the input sensing layer (ISP) and the display panel (DP). That is, a separate adhesive member may not be placed between the input sensing layer (ISP) and the display panel (DP). Alternatively, the input sensing layer (ISP) may be provided as a separate module and joined to the display panel (DP) through an adhesive member. The adhesive member may include a conventional adhesive or a pressure-sensitive adhesive.

[0078] The input sensing layer (ISP) may include a first sensing insulating layer (201), a first conductive layer (202), a second sensing insulating layer (203), a second conductive layer (204), and a cover insulating layer (205).

[0079] The first sensing insulating layer (201) may be an inorganic layer comprising at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the first sensing insulating layer (201) may be an organic layer comprising epoxy resin, acrylic resin, or imide-based resin. The first sensing insulating layer (201) may have a single-layer structure or a multi-layer structure stacked along the third direction (DR3).

[0080] Each of the first conductive layer (202) and the second conductive layer (204) may have a single-layer structure or a multilayer structure stacked along the third direction (DR3). In this embodiment, the single-layer metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The multilayer conductive layer may include metal layers. The metal layers may have a three-layer structure, for example, titanium / aluminum / titanium. The multilayer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0081] When the first conductive layer (202) and the second conductive layer (204) include a metal layer, the first conductive layer (202) and the second conductive layer (204) may be opaque. Accordingly, the first conductive layer (202) and the second conductive layer (204) may be patterned to overlap with the light-emitting region (PXA) and to overlap with the non-light-emitting region (NPXA).

[0082] At least one of the second sensing insulating layer (203) and the cover insulating layer (205) may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0083] At least one of the second sensing insulating layer (203) and the cover insulating layer (205) may include an organic film. The organic film may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0084] A portion of the first conductive layer (202) and the second conductive layer (204) can be connected through a contact hole (CNT) defined in the second sensing insulating layer (203).

[0085] As illustrated in FIG. 2b, a display module (DMa) according to one embodiment of the present invention may further include an anti-reflective layer (OTFa) disposed on an input sensing layer (ISP). The anti-reflective layer (OTFa) may be disposed directly on the input sensing layer (ISP) through a continuous process. In this case, the optical film (OTF) illustrated in FIG. 1c and the first adhesive film (AF1, see FIG. 1c) disposed between the optical film (OTF) and the input sensing layer (ISP) may be omitted.

[0086] The anti-reflection layer (OTFa) may include a light-blocking pattern (310), a color filter (320), and a flattening layer (330).

[0087] The material constituting the light-blocking pattern (310) is not particularly limited as long as it is a material that absorbs light. The light-blocking pattern (310) is a layer having a black color, and in one embodiment, the light-blocking pattern (310) may include a black coloring agent. The black coloring agent may include black dyes or black pigments. The black coloring agent may include carbon black, metals such as chromium, or oxides thereof.

[0088] The light-blocking pattern (310) can be superimposed on the first and second conductive layers (202, 204) on a flat surface. The light-blocking pattern (310) can prevent external light reflection by the first and second conductive layers (202, 204).

[0089] An opening (310-OP) may be defined in the light-blocking pattern (310). The opening (310-OP) of the light-blocking pattern (310) may overlap with the first electrode (AE) and may have an area larger than or equal to the opening (70-OP) of the pixel defining film (70). The opening (310-OP) of the light-blocking pattern (310) may define a light-emitting region (PXA). The light-emitting region (PXA) may be defined as an area where light generated from the light-emitting element (100PE) is emitted to the outside. The larger the area of ​​the light-emitting region (PXA), the higher the brightness of the image may be.

[0090] The color filter (320) may overlap at least the light-emitting region (PXA). The color filter (320) may also overlap further with the non-light-emitting region (NPXA). A portion of the color filter (320) may be placed on the light-blocking pattern (310). The color filter (320) transmits light generated by the light-emitting element (100PE) and can block some wavelengths of external light. Thus, the reflection of external light by the first electrode (AE) or the second electrode (CE) of the color filter (320) can be reduced.

[0091] The flattening layer (330) can cover the light-blocking pattern (310) and the color filter (320). The flattening layer (330) may include an organic insulating material, and the flattening layer (330) may provide a flat upper surface.

[0092] In one example of the present invention, the anti-reflection layer (OTFa) may further include a first light control layer (340) and a second light control layer (350). The first light control layer (340) is disposed on a flattening layer (330). The first light control layer (340) may overlap with a light-blocking pattern (310) on a plane. An opening (340-OP) may be defined in the first light control layer (340). The opening (340-OP) of the first light control layer (340) may overlap with the first electrode (AE) and may have an area larger than or equal to the opening (310-OP) of the light-blocking pattern (310). The opening (340-OP) of the first light control layer (340) may correspond to a light-emitting region (PXA).

[0093] The first light control layer (340) may include an organic insulating material. The organic insulating material may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin. However, this is exemplary and the organic insulating material is not limited to the examples described above.

[0094] A second light control layer (350) is disposed on a flattening layer (330) to cover a first light control layer (340). The second light control layer (350) may have a higher refractive index than the first light control layer (340). The second light control layer (350) may include an organic insulating material having a higher refractive index than the first light control layer (340). The second light control layer (350) may be provided to fill an opening (340-OP) of the first light control layer (340). The second light control layer (350) may have a flat upper surface.

[0095] Light emitted from the light-emitting element (100PE) can be emitted in a front direction, for example, a third direction (DR3), as well as in a side direction. Light efficiency can be determined based on the light emitted in the front direction. According to an embodiment of the present invention, the front light emitted in the front direction from the light-emitting element (100PE) can be output through the second light control layer (350). The side light emitted in the side direction from the light-emitting element (100PE) can be output at an angle tilted relative to the front light.

[0096] Side light can be refracted or totally reflected due to the difference in refractive index between the first light control layer (340) and the second light control layer (350). Accordingly, the light path of the side light can be changed to the front direction, that is, the third direction (DR3) or a direction close to the third direction (DR3). As such, as the light path of the side light is changed to the front direction, the light efficiency of the display device (DD) can be improved.

[0097] FIG. 3a is a plan view of a display panel according to one embodiment of the present invention. FIG. 3b is a plan view of an input sensing layer according to one embodiment of the present invention.

[0098] Referring to FIG. 3a, a display panel (DP) according to one embodiment of the present invention may be divided into a first area (A1), a second area (A2), and a third area (A3). The first to third areas (A1, A2, A3) of the display panel (DP) illustrated in FIG. 3a correspond to the first to third areas (A1, A2, A3) of the display module (DM) described in FIG. 1b, respectively. In this specification, "areas / parts correspond to areas / parts" means that they overlap and is not limited to meaning that they have the same area.

[0099] A display panel (DP) according to one embodiment may include an active area (AA) in which a pixel (PX) is placed and a surrounding area (NAA) adjacent to the active area (AA). The active area (AA) and the surrounding area (NAA) correspond to the active area (AA) and the surrounding area (NAA) described in FIG. 1b, respectively. The active area (AA) corresponds to the area in which the pixel (PX) is placed among the first area (A1), and the surrounding area (NAA) includes the remaining first area (A1) excluding the area in which the pixel (PX) is placed, as well as the second area (A2) and the third area (A3).

[0100] The display panel (DP) may include a scan driver (SDV), an emission driver (EDV), and a driver chip (DIC) in the peripheral area (NAA). The driver chip (DIC) may be a data driver.

[0101] A display panel (DP) may include a plurality of pixels (PX), a plurality of scan lines (SL1~SLm), a plurality of data lines (DL1~DLn), a plurality of light-emitting lines (EL1~ELm), first and second control lines (CSL1, CSL2), a power line (PL), and a plurality of pads (PD). Here, m and n are natural numbers. The pixels (PX) may be connected to the scan lines (SL1~SLm), data lines (DL1~DLn), and light-emitting lines (EL1~ELm).

[0102] Scan lines (SL1~SLm) can be extended in a first direction (DR1) and connected to a scanning driver (SDV). Data lines (DL1~DLn) can be extended in a second direction (DR2) and connected to a driver chip (DIC) located in a third area (A3) via a second area (A2) from a first area (A1). Light emission lines (EL1~ELm) can be extended in a first direction (DR1) and connected to a light emission driver (EDV).

[0103] The power line (PL) may include a portion extending in a first direction (DR1) and a portion extending in a second direction (DR2). The portion extending in the first direction (DR1) and the portion extending in the second direction (DR2) may be placed on different layers. The portion of the power line (PL) extending in the second direction (DR2) may extend from a first region (A1) to a third region (A3) via a second region (A2). The power line (PL) may provide a reference voltage to the pixels (PX).

[0104] The first control line (CSL1) is connected to the scanning drive unit (SDV) and can be extended from the first area (A1) through the second area (A2) to the third area (A3). The second control line (CSL2) is connected to the light emission drive unit (EDV) and can be extended from the first area (A1) through the second area (A2) to the third area (A3).

[0105] Pads (PDs) may be positioned adjacent to the end of the third region (A3). A driving chip (DIC), a power line (PL), a first control line (CSL1), and a second control line (CSL2) may be connected to the pads (PDs). A flexible circuit film (FCB) may be placed on the display panel (DP) and overlapped at the end of the third region (A3) of the display panel (DP). The flexible circuit film (FCB) includes pads corresponding to the pads (PDs) and may be electrically connected to the pads (PDs) through an anisotropic conductive adhesive layer.

[0106] A display panel (DP) according to one embodiment may include a first contact hole (CN-H1) defined in a first area (A1). The display panel (DP) may include extended sensing wires (TL-L) extending from the first contact hole (CN-H1) to a third area (A2) via the first area (A1) and the second area (A2). The extended sensing wires (TL-L) may be connected one-to-one with corresponding sensing wires among the sensing wires (TL1, TL2, TL3) described below.

[0107] FIG. 3a illustrates that extended sensing wires (TL-L) are arranged between data lines (DL1~DLn), but is not limited thereto. Data lines (DL1~DLn) may be arranged between extended sensing wires (TL-L), and accordingly, the first contact hole (CN-H1) may be provided in multiple places with the data lines (DL1~DLn) in between, and is not limited to any one embodiment.

[0108] Referring to FIG. 3b, an input sensing layer (ISP) according to one embodiment may include sensing electrodes (TE1, TE2) and sensing wires (TL1, TL2, TL3). When the input sensing layer (ISP) is placed directly on a display panel (DP) by a continuous process, it may be formed only on an area that overlaps with a first area (A1) of the display panel (DP).

[0109] The input sensing layer (ISP) can obtain information about an external input through a change in capacitance between first sensing electrodes (TE1) and second sensing electrodes (TE2). The first sensing electrodes (TE1) are arranged along a first direction (DR1) and each extends along a second direction (DR2). Each of the first sensing electrodes (TE1) may include a first sensing pattern (SP1) and a first connection pattern (BP1).

[0110] The first detection pattern (SP1) is placed in the active area (AA). The first detection pattern (SP1) may have a rhombus shape. However, this is illustrated as an example, and the first detection pattern (SP1) may have various shapes and is not limited to any one embodiment.

[0111] The first connection pattern (BP1) is placed in the active area (AA). The first connection pattern (BP1) may be placed between adjacent first detection patterns. The first connection pattern (BP1) may be placed on a different layer from the first detection pattern (SP1) and connected through a contact hole.

[0112] The second sensing electrodes (TE2) are arranged along the second direction (DR2) and each extends along the first direction (DR1). Each of the second sensing electrodes (TE2) may include a second sensing pattern (SP2) and a second connection pattern (BP2).

[0113] The second detection pattern (SP2) can be spaced apart from the first detection pattern (SP1). The first detection pattern (SP1) and the second detection pattern (SP2) can transmit and receive independent electrical signals without contact.

[0114] The second detection pattern (SP2) may have the same shape as the first detection pattern (SP1). For example, the second detection pattern (SP2) may have a rhombus shape. However, this is illustrated as an example, and the second detection pattern (SP2) may have various shapes and is not limited to any one embodiment.

[0115] The second connection pattern (BP2) may be placed between adjacent second detection patterns. For convenience of explanation, the second detection electrode (TE2) has been described by separating it into the second detection pattern (SP2) and the second connection pattern (BP2), but the second detection electrode (TE2) can substantially be provided as a single pattern.

[0116] According to one embodiment, the first connection pattern (BP1) may correspond to the first conductive layer (202) described in FIG. 2a. The first sensing pattern (SP1), the second sensing pattern (SP2), and the second connection pattern (BP2) may correspond to the second conductive layer (204) described in FIG. 2a. That is, the second sensing electrode (TE2) may be disposed on the same layer as the first sensing pattern (SP1), and in this case, the first sensing pattern (SP1) and the second sensing electrode (TE2) may be provided as a plurality of mesh lines extended in the diagonal direction of the first direction (DR1) and the second direction (DR2), respectively.

[0117] The detection lines (TL1, TL2, TL3) are placed in the surrounding area (NAA). The detection lines (TL1, TL2, TL3) may include first detection lines (TL1), second detection lines (TL2), and third detection lines (TL3).

[0118] The first sensing lines (TL1) are each connected to the first sensing electrodes (TE1). In this embodiment, the first sensing lines (TL1) are each connected to the lower ends of the two ends of the first sensing electrodes (TE1). The second sensing lines (TL2) are each connected to the upper ends of the two ends of the first sensing electrodes (TE1). According to the present invention, the first sensing electrodes (TE1) can be connected to the first sensing lines (TL1) and the second sensing lines (TL2), respectively. Accordingly, the sensitivity according to the region can be maintained uniformly for the first sensing electrodes (TE1), which have a relatively longer length compared to the second sensing electrodes (TE2).

[0119] Meanwhile, this is illustrated as an example, and the second sensing lines (TL2) in the input sensing layer (ISP) according to one embodiment of the present invention may be omitted and are not limited to any one embodiment.

[0120] The third sensing lines (TL3) are each connected to one end of the second sensing electrodes. In this embodiment, the third sensing lines (TL3) are each connected to the left end of the two ends of the second sensing electrodes (TE2).

[0121] The input sensing layer (ISP) may include a second contact hole (CN-H2) that overlaps with the surrounding area (NAA). The second contact hole (CN-H2) may overlap with the first contact hole (CN-H1) of the display panel (DP). Sensing lines (TL1, TL2, TL3) may be connected to corresponding extended sensing lines (TL-L) through the second contact hole (CN-H2) defined in the input sensing layer (ISP) and the first contact hole (CN-H1) defined in the display panel (DP). Accordingly, sensing electrodes (TE1, TE2) may be electrically connected to the flexible circuit film (FCB).

[0122] FIG. 4a is a rear view of a display device according to one embodiment of the present invention, and FIG. 4b is a cross-sectional view of the display device cut along the cutting line III-III' shown in FIG. 4a. FIG. 4c is a cross-sectional view of a display device according to one embodiment of the present invention.

[0123] Referring to FIGS. 1b, FIGS. 4a and FIGS. 4b, the second region (A2) of the display module (DM) is bent along the bending axis (RX) and seated on the back surface of the lower module (LM).

[0124] The display device (DD) may further include a bending protection layer (BPL) disposed on a second region (A2) of the display module (DM). The bending protection layer (BPL) may further be disposed on a portion of the first region (A1) and a portion of the third region (A3). The bending protection layer (BPL) may be bent together with the second region (A2). The bending protection layer (BPL) protects the second region (A2) from external impact and controls the neutral plane of the second region (A2). The bending protection layer (BPL) controls the stress of the second region (A2) so that the neutral plane is brought closer to the signal lines disposed in the second region (A2).

[0125] One end of the flexible circuit film (FCB) can be bonded to the third area (A3) of the display module (DM) through a bonding process. A driving chip (DIC) can be mounted on the third area (A3) of the display module (DM).

[0126] The display device (DD) further includes a cover film (CIC). The cover film (CIC) can block noise formed near the flexible circuit film (FCB) and the driver chip (DIC) and protect the flexible circuit film (FCB) and the driver chip (DIC) from risks such as shocks provided from the outside.

[0127] The cover film (CIC) can be coupled to the flexible circuit film (FCB) and the display module (DM). According to one embodiment, the cover film (CIC) can be fixed to the flexible circuit film (FCB) and the display module (DM) by an adhesive method. The cover film (CIC) can cover a portion of the flexible circuit film (FCB) and cover a driving chip (DIC) mounted on a third area (A3) of the display module (DM). In one example of the present invention, the driving chip (DIC) can be entirely covered by the cover film (CIC). Meanwhile, a plurality of driving elements (DEL) mounted on the flexible circuit film (FCB) may be exposed without being covered by the cover film (CIC).

[0128] The lower module (LM) may include a panel protection film (PF) and a cover panel (CP). The cover panel (CP) may include a barrier layer (BRL) and a cushion layer (CHL). The panel protection film (PF) may be placed on the lower side of the display module (DM) to protect the display module (DM). The panel protection film (PF) may include polyethylene terephthalate. The panel protection film (PF) may include a first protection film (PF1-1) that protects a first area (A1) of the display module (DM) and a second protection film (PF1-2) that protects a third area (A3) of the display module (DM). Since the panel protection film (PF) is not placed in the second area (A2) of the display module (DM), bending can be performed smoothly in the second area (A2) of the display module (DM).

[0129] A barrier layer (BRL) may be placed below the panel protection film (PF). The barrier layer (BRL) can increase resistance to compressive force caused by external pressure. Therefore, the barrier layer (BRL) can serve to prevent deformation of the display module (DM). The barrier layer (BRL) may include flexible plastic materials such as polyimide or polyethylene terephthalate. Additionally, the barrier layer (BRL) may be a colored film with low light transmittance. The barrier layer (BRL) can absorb light incident from the outside. For example, the barrier layer (BRL) may be a black synthetic resin film. When viewing the display device (DD) from the upper side of the window (WM), components placed below the barrier layer (BRL) may not be visible to the user.

[0130] The cover panel (CP) further includes a first lower adhesive layer (LAL1), a second lower adhesive layer (LAL2), and a third lower adhesive layer (LAL3). The first lower adhesive layer (LAL1) is positioned between the first protective film (PF1-1) and the barrier layer (BRL) to bond the first protective film (PF1-1) and the barrier layer (BRL). The second lower adhesive layer (LAL2) is positioned between the cushion layer (CHL) and the barrier layer (BRL) to bond the cushion layer (CHL) and the barrier layer (BRL). The second protective film (PF1-2) can be bonded to the back surface of the cushion layer (CHL) by the third lower adhesive layer (LAL3).

[0131] The cushion layer (CHL) can protect the display module (DM) from impact transmitted from the lower side of the electronic device (ED). In other words, the shock resistance characteristics of the electronic device (ED) can be improved by the cushion layer (CHL).

[0132] In addition to the functions of shock absorption or protection, a layer for other functions (e.g., a heat dissipation layer) may be added to the cover panel (CP).

[0133] A window (WM) is placed on a display module (DM). An optical film (OTF) may be placed between the window (WM) and the display module (DM). The optical film (OTF) and the display module (DM) are joined by a first adhesive film (AF1), and the window (WM) and the optical film (OTF) may be joined by a second adhesive film (AF2). In one example of the present invention, the optical film (OTF) may not overlap with the bending protection layer (BPL). That is, the optical film (OTF) may be spaced apart from one end of the bending protection layer (BPL) in a second direction (DR2).

[0134] As illustrated in FIG. 2b, when the anti-reflective layer (OTFa) is included in the display module (DM), the optical film (OTF) and the first adhesive film (AF1) may be omitted from the display device (DD). In this case, as illustrated in FIG. 4c, the window (WM) may be bonded to the display module (DMa) by the second adhesive film (AF2).

[0135] The end of the window (WM) may extend outward beyond the bending protection layer (BPL) covering the second area (A2) of the display module (DM). According to one embodiment, the second adhesive film (AF2) may overlap with the bending protection layer (BPL).

[0136] A protective cover film (PCF) is positioned beneath the display module (DM) and the lower module (LM). Specifically, the protective cover film (PCF) is positioned beneath the rear surface of the lower module (LM) and the third area (A3) of the display module (DM) to protect the display module (DM) and the flexible circuit film (FCB). When viewed in a planar view, the protective cover film (PCF) may overlap with the flexible circuit film (FCB), the second area (A2) and the third area (A3) of the display module (DM). The end of the protective cover film (PCF) may be positioned outside the end of the window (WM).

[0137] The protective cover film (PCF) comprises an insulating base layer (IBL), an adhesive layer (AL), and a step layer (SDL). The insulating base layer (IBL) includes an air gap (AG) that overlaps with a second region (A2) when viewed in a planar view. The air gap (AG) may be provided within the insulating base layer (IBL). The air gap (AG) may extend in a first direction (DR1) parallel to the bending axis (RX). The air gap (AG) may have a rectangular shape extending in the first direction (DR1) when viewed in a planar view. However, the shape of the air gap (AG) is not limited thereto and may be modified in various ways. The shape of the air gap (AG) will be described later with reference to FIGS. 5a and FIGS. 7b.

[0138] The adhesive layer (AL) is placed between the insulating base layer (IBL) and the first region (A1) of the display module (DM). In particular, the adhesive layer (AL) is placed between the insulating base layer (IBL) and the lower module (LM). The adhesive layer (AL) can be placed so as not to overlap with the flexible circuit film (FCB) on a plane.

[0139] A step layer (SDL) is disposed on an insulating base layer (IBL). In one example of the present invention, the step layer (SDL) may be disposed between the insulating base layer (IBL) and the flexible circuit film (FCB). The step layer (SDL) may separate the insulating base layer (IBL) and the flexible circuit film (FCB) at a certain distance. The step layer (SDL) may be disposed at a position that does not overlap with the driving chip (DIC) and the driving elements (DEL). A gap may be formed between the insulating base layer (IBL) and the driving chip (DIC) and the driving elements (DEL) through the step layer (SDL). Accordingly, the step layer (SDL) can prevent shocks, etc., from being transmitted to the driving chip (DIC) and the driving elements (DEL) through the insulating base layer (IBL), thereby preventing the driving chip (DIC) and the driving elements (DEL) from being damaged by the shock. In addition, the driving chip (DIC) and driving elements (DEL) may not come into contact with the upper surface of the insulating base layer (IBL). This prevents the driving chip (DIC) and driving elements (DEL) from being damaged by contact or friction with the protective cover film (PCF).

[0140] The step layer (SDL) and the insulating base layer (IBL) do not have an integral shape with each other. In one example of the present invention, the step layer (SDL) may have adhesive properties. The step layer (SDL) may be spaced apart from the adhesive layer (AL) on a plane. However, the present invention is not limited thereto. The step layer (SDL) may have an integral shape with the adhesive layer (AL). The step layer (SDL) may include the same material as the adhesive layer (AL). In one example of the present invention, the step layer (SDL) and the adhesive layer (AL) may each include an adhesive having light-blocking properties.

[0141] The end of the window (WM) may extend outward beyond the second region (A2) of the display module (DM). The end of the protective cover film (PCF) may extend beyond the end of the window (WM). The end of the protective cover film (PCF) may be positioned outward beyond the end of the window (WM). By having a structure in which the end of the protective cover film (PCF) and the end of the window (WM) extend outward beyond the second region (A2) of the display module (DM), the protection performance for the second region (A2) of the display module (DM) can be improved.

[0142] In addition, an air gap (AG) is provided in the protective cover film (PCF) so as to overlap with the second region (A2) of the display module (DM), thereby allowing impacts applied from the outside toward the second region (A2) to be cushioned by the air gap (AG). Thus, the protective performance of the protective cover film (PCF) can be further improved by the air gap (AG). As a result, the protective cover film (PCF) can reliably protect the bending portion (i.e., the second region (A2)) of the display module (DM) during the process of transporting the display device (DD) for the manufacture of the electronic device (ED, see FIG. 1a).

[0143] FIGS. 5a to 5c are partially enlarged cross-sectional views of a protective cover film according to embodiments of the present invention.

[0144] Referring to FIG. 5a, a protective cover film (PCF) according to one embodiment of the present invention includes an air gap (AG) formed within an insulating base layer (IBL).

[0145] The insulating base layer (IBL) includes a first base layer (BL1) and a second base layer (BL2) facing the first base layer (BL1). The air gap (AG) may be an air layer formed between the first and second base layers (BL1, BL2). The first base layer (BL1) may include a first groove (GV1) recessed in a third direction (DR3), and the second base layer (BL2) may include a second groove (GV2) recessed in a fourth direction (DR4) opposite to the third direction (DR3). When the first and second base layers (BL1, BL2) are joined facing each other, an air gap (AG) may be formed between the first and second base layers (BL1, BL2) by the first groove (GV1) and the second groove (GV2). In the area where the air gap (AG) is formed, the thickness of the first base layer (BL1) can be reduced by the depth of the first groove (GV1), and the thickness of the second base layer (BL2) can be reduced by the depth of the second groove (GV2).

[0146] When viewed in cross-section, the air gap (AG) may have a square shape, but the cross-sectional shape of the air gap (AG) is not particularly limited. For example, the cross-sectional shape of the air gap (AG) may have an elliptical shape, a circular shape, or a polygonal shape.

[0147] FIG. 5a illustrates an exemplary structure in which the gap between the first and second base layers (BL1, BL2) is maintained constant in the second direction (DR2) by an air gap (AG). However, the present invention is not limited thereto. As shown in FIG. 5b, the protective cover film (PCFa) may include an air gap (AGa) having an elliptical cross-sectional shape within the insulating base layer (IBLa). In this case, the gap between the first and second base layers (BLa, BLb) may not be constant in the second direction (DR2).

[0148] The air gap (AGa) illustrated in FIG. 5b may be an air layer formed by the separation of the first and second base layers (BLa, BLb). In this case, the thickness of each of the first and second base layers (BLa, BLb) may remain constant and not decrease in the area where the air gap (AG) is formed.

[0149] Referring to FIG. 5c, a protective cover film (PCFb) according to one embodiment of the present invention includes a plurality of air gaps (U_AG, L_AG) formed within an insulating base layer (IBLb). In one example of the present invention, the insulating base layer (IBLb) includes first to fourth base layers (BL1, BL2, BL3, BL4) sequentially stacked in a fourth direction (DR4). The first and second base layers (BL1, BL2) are joined facing each other, and the second and third base layers (BL2, BL3) are joined facing each other. The third and fourth base layers (BL3, BL4) are also joined facing each other.

[0150] A plurality of air gaps (U_AG, L_AG) may include an upper air gap (U_AG) (or first air gap) formed between a first base layer (BL1) and a second base layer (BL2), and a lower air gap (L_AG) (or second air gap) formed between a third base layer (BL3) and a fourth base layer (BL4).

[0151] The first base layer (BL1) may include a first groove (GV1) recessed in the third direction (DR3), and the second base layer (BL2) may include a second groove (GV2) recessed in the fourth direction (DR4) opposite to the third direction (DR3). The third base layer (BL3) may include a third groove (GV3) recessed in the third direction (DR3), and the fourth base layer (BL4) may include a fourth groove (GV4) recessed in the fourth direction (DR4). When the first and second base layers (BL1, BL2) are joined facing each other, an upper air gap (U_AG) (or a first sub-air gap) is formed between the first and second base layers (BL1, BL2) by the first groove (GV1) and the second groove (GV2). In addition, when the third and fourth base layers (BL3, BL4) are joined facing each other, a lower air gap (L_AG) (or a second sub-air gap) is formed between the third and fourth base layers (BL3, BL4) by the third groove (GV3) and the fourth groove (GV4).

[0152] FIG. 5c illustrates two air gaps (U_AG, L_AG) arranged vertically as an example, but the number of air gaps is not limited thereto. Three or more air gaps arranged sequentially in a third direction (DR3) may be formed within the insulating base layer (IBLb).

[0153] FIGS. 6a to 6d are plan views of a protective cover film according to embodiments of the present invention. FIG. 7a is a partial enlarged cross-sectional view of the protective cover film shown in FIG. 6b, and FIG. 7b is a partial enlarged cross-sectional view of the protective cover film shown in FIG. 6d.

[0154] Referring to FIG. 6a, a protective cover film (PCFc) according to one embodiment of the present invention includes first and second sub-air gaps (S_AG1, S_AG2) formed within an insulating base layer (IBLc). The first and second sub-air gaps (S_AG1, S_AG2) may be spaced apart from each other in a first direction (DR1). Each of the first and second sub-air gaps (S_AG1, S_AG2) may have a rectangular shape extending in the first direction (DR1) when viewed in a planar view. However, the shape of each of the first and second sub-air gaps (S_AG1, S_AG2) is not particularly limited.

[0155] Referring to FIG. 6b and FIG. 7a, a protective cover film (PCFd) according to one embodiment of the present invention includes a plurality of sub-air gaps (S_AGa) formed within an insulating base layer (IBLd). When viewed in a planar view, each of the plurality of sub-air gaps (S_AGa) may have a rectangular shape extending in a first direction (DR1). The plurality of sub-air gaps (S_AGa) may be spaced apart from each other in a second direction (DR2).

[0156] As illustrated in FIG. 7a, the insulating base layer (IBLd) includes a first base layer (BL1) and a second base layer (BL2) facing the first base layer (BL1). A plurality of sub-air gaps (S_AGa) may be a plurality of air layers formed between the first and second base layers (BL1, BL2). The first base layer (BL1) may include a plurality of first sub-grooves (S_GV1) recessed in a third direction (DR3), and the second base layer (BL2) may include a plurality of second sub-grooves (S_GV2) recessed in a fourth direction (DR4) opposite to the third direction (DR3). When the first and second base layers (BL1, BL2) are joined facing each other, a plurality of sub-air gaps (S_AGa) may be formed between the first and second base layers (BL1, BL2) by a plurality of first sub-grooves (S_GV1) and a plurality of second sub-grooves (S_GV2). In the region where the plurality of sub-air gaps (S_AGa) are formed, the thickness of the first base layer (BL1) may be reduced by the depth of each of the plurality of first sub-grooves (S_GV1), and the thickness of the second base layer (BL2) may be reduced by the depth of each of the plurality of second sub-grooves (S_GV2).

[0157] When viewed in cross-section, each of the multiple sub-air gaps (S_AGa) may have a square shape, but the cross-sectional shape of the multiple sub-air gaps (S_AGa) is not particularly limited. For example, the cross-sectional shape of the multiple sub-air gaps (S_AGa) may have an elliptical shape, a circular shape, or a polygonal shape.

[0158] Referring to FIG. 6c, a protective cover film (PCFe) according to one embodiment of the present invention includes a plurality of first sub-air gaps (S_AGb) and a plurality of second sub-air gaps (S_AGc) formed within an insulating base layer (IBLe). A plurality of first sub-air gaps (S_AGb) are spaced apart from each other in a second direction (DR2), and a plurality of second sub-air gaps (S_AGc) are spaced apart from each other in a second direction (DR2). A plurality of first sub-air gaps (S_AGb) may be spaced apart from a plurality of second sub-air gaps (S_AGc) in a first direction (DR1). Each of the plurality of first sub-air gaps (S_AGb) may have a rectangular shape extending in a first direction (DR1) when viewed in a planar view. Each of the plurality of second sub-air gaps (S_AGc) may have a rectangular shape extending in a first direction (DR1) when viewed in a planar view. However, the shape of each of the first and second sub-air gaps (S_AGb, S_AGc) is not particularly limited.

[0159] Referring to FIG. 6d and FIG. 7b, a protective cover film (PCFf) according to one embodiment of the present invention includes a plurality of sub-air gaps (S_AGd) formed within an insulating base layer (IBLf). When viewed in a planar view, each of the plurality of sub-air gaps (S_AGd) may have a circular or elliptical shape. The plurality of sub-air gaps (S_AGd) may be spaced apart from each other in first and second directions (DR1, DR2).

[0160] As illustrated in FIG. 7b, the insulating base layer (IBLf) includes a first base layer (BLa) and a second base layer (BLb) facing the first base layer (BLa). A plurality of sub-air gaps (S_AGd) may be a plurality of air layers formed between the first and second base layers (BLa, BLb). Each of the plurality of sub-air gaps (S_AGd) may have an elliptical cross-sectional shape within the insulating base layer (IBLf). In this case, the spacing between the first and second base layers (BLa, BLb) may not be constant in the second direction (DR2).

[0161] A plurality of sub-air gaps (S_AGd) may be air layers formed by the separation of the first and second base layers (BLa, BLb). In this case, the thickness of each of the first and second base layers (BLa, BLb) may remain constant and not decrease in the area where the plurality of sub-air gaps (S_AGd) are formed.

[0162] FIG. 8a is an exploded perspective view of a display device according to an embodiment of the present invention, and FIG. 8b is a combined cross-sectional view of a display device according to an embodiment of the present invention. Among the components shown in FIG. 8a and FIG. 8b, components identical to those shown in FIG. 1b and FIG. 4b are given the same reference numerals, and a detailed description thereof is omitted.

[0163] Referring to FIGS. 8a and 8b, a display device (DDa) according to one embodiment of the present invention may include a protective cover film (PCF1).

[0164] A protective cover film (PCF1) is placed below the display module (DM) and the lower module (LM). Specifically, the protective cover film (PCF1) is placed below the rear surface of the lower module (LM) and the third area (A3) of the display module (DM) to protect the bending area of ​​the display module (DM) and the flexible circuit film (FCB). The protective cover film (PCF1) may have a rectangular tape shape. However, the shape of the protective cover film (PCF1) is not limited thereto. The protective cover film (PCF1) may have various shapes within a range of sizes sufficient to cover the flexible circuit film (FCB).

[0165] The protective cover film (PCF1) includes an insulating base layer (IBL1), an adhesive layer (AL), and a step layer (SDL). The insulating base layer (IBL1) may include a transparent insulating material.

[0166] The adhesive layer (AL) is partially placed on the insulating base layer (IBL1). The adhesive layer (AL) is placed between the insulating base layer (IBL1) and the lower module (LM) so that the insulating base layer (IBL1) can be fixed to the lower module (LM).

[0167] A step layer (SDL) is disposed on an insulating base layer (IBL1). In one example of the present invention, the step layer (SDL) may have adhesive properties. The step layer (SDL) may be disposed spaced apart from the adhesive layer (AL). However, the present invention is not limited thereto. The step layer (SDL) may have an integral shape with the adhesive layer (AL).

[0168] The insulating base layer (IBL1) may include a shaped portion (SPP) positioned to overlap with a second region (A2) of the display module (DM). The shaped portion (SPP) may have an uneven structure. In one example of the present invention, the shaped portion (SPP) may include a plurality of convex portions (CVP) protruding in a third direction (DR3) toward the second region (A2) and a plurality of concave portions (CCP) recessed in a fourth direction (DR4) opposite to the third direction (DR3).

[0169] Each of the plurality of convex portions (CVP) may be extended in a first direction (DR1) and spaced apart in a second direction (DR2). A single concave portion (CCP) may be disposed between two adjacent convex portions among the plurality of convex portions (CVP). Alternatively, each of the plurality of convex portions (CVP) may be extended in a second direction (DR2) and spaced apart in a first direction (DR1).

[0170] In one example of the present invention, when viewed in cross-section, the convex portions (CVP) and the concave portions (CCP) each have a hemispherical shape, but the shape of the convex portions (CVP) and the concave portions (CCP) each is not particularly limited. The convex portions (CVP) and the concave portions (CCP) each may have a triangular shape or a rounded triangular shape.

[0171] The end of the window (WM) may extend outward beyond the second region (A2) of the display module (DM). The end of the protective cover film (PCF1) may extend beyond the end of the window (WM). The end of the protective cover film (PCF1) may be positioned outward beyond the end of the window (WM). By having a structure in which the end of the protective cover film (PCF1) and the end of the window (WM) extend outward beyond the second region (A2) of the display module (DM), the protection performance for the second region (A2) of the display module (DM) can be improved.

[0172] In addition, the shape processing part (SPP) is provided on the protective cover film (PCF1) so as to overlap with the second area (A2) of the display module (DM), so that impact applied from the outside toward the second area (A2) can be cushioned by the shape processing part (SPP). Accordingly, the protective performance of the protective cover film (PCF1) can be further improved by the shape processing part (SPP). Thus, the protective cover film (PCF1) can reliably protect the bending part (i.e., the second area (A2)) of the display module (DM) during the process of transporting the display device (DDa) for manufacturing the electronic device (ED, see FIG. 1a).

[0173] FIG. 9a is a plan view of a protective cover film according to one embodiment of the present invention, and FIG. 9b is a cross-sectional view cut along the cutting line Ⅳ-Ⅳ' shown in FIG. 9a.

[0174] Referring to FIGS. 9a and 9b, the protective cover film (PCF2) includes an insulating base layer (IBL2), an adhesive layer (AL), and a step layer (SDL).

[0175] The insulating base layer (IBL2) may include an element open portion (EOP) and a shaped portion (SSPa). The element open portion (EOP) may expose driving elements (DEL, see FIG. 8a) mounted on the flexible circuit film (FCB) to the outside. Thus, the driving elements (DEL) may not come into contact with the upper surface of the insulating base layer (IBL2). In this way, the element open portion (EOP) can prevent the driving elements (DEL) from being damaged by contact or friction with the protective cover film (PCF2).

[0176] The insulating base layer (IBL2) may include a shaped processing portion (SPPa) arranged to overlap with the second region (A2) of the display module (DM). In one example of the present invention, the insulating base layer (IBL2) includes a first base layer (BL1) and a second base layer (BL2) arranged to face each other.

[0177] The shape processing section (SPPa) includes a first shape processing section (SPP1a) provided on the first base layer (BL1) and a second shape processing section (SPP2a) provided on the second base layer (BL2). The first shape processing section (SPP1a) includes a plurality of first convex sections (CVP1) protruding in a third direction (DR3) and a plurality of first concave sections (CCP1) sunken in a fourth direction (DR4). The second shape processing section (SPP2a) includes a plurality of second convex sections (CVP2) protruding in a third direction (DR3) and a plurality of second concave sections (CCP2) sunken in a fourth direction (DR4).

[0178] Each of the plurality of first convex portions (CVP1) extends in the second direction (DR2) and may be arranged spaced apart in the first direction (DR1). A first concave portion (CCP1) may be disposed between two of the plurality of first convex portions (CVP1). Each of the plurality of second convex portions (CVP2) extends in the second direction (DR2) and may be arranged spaced apart in the first direction (DR1). A second concave portion (CCP2) may be disposed between two of the plurality of second convex portions (CVP2).

[0179] In one example of the present invention, the first concave portions (CCP1) are arranged to correspond to the second convex portions (CVP2), and the second concave portions (CCP2) are arranged to correspond to the first convex portions (CVP1). Accordingly, an air gap (AG1) is formed between the first convex portions (CVP1) and the second concave portions (CCP2), and the first concave portions (CCP1) and the second convex portions (CVP2) can come into contact with each other.

[0180] In one example of the present invention, when viewed in cross-section, the first convex portions (CVP1) and the first concave portions (CCP1) may each have a triangular shape or a rounded triangular shape. The first convex portions (CVP1) may have the same cross-sectional shape as the second convex portions (CVP2). However, alternatively, the first convex portions (CVP1) may have a different cross-sectional shape from the second convex portions (CVP2).

[0181] By providing a protective cover film (PCF2) such that a shaped processing portion (SPPa) overlaps with the second region (A2) of the display module (DM), impacts applied from the outside toward the second region (A2) can be cushioned by the shaped processing portion (SPPa). In particular, since the shaped processing portion (SPPa) includes more air gaps (AG1) compared to the shaped processing portion (SPP) shown in FIG. 8b, the cushioning performance can be further improved by the air gaps (AG1). Thus, the protective cover film (PCF2) can reliably protect the bending portion (i.e., the second region (A2)) of the display module (DM) during the process of transporting the display device (DDa) for the manufacture of an electronic device (ED, see FIG. 1a).

[0182] FIG. 10a is an exploded perspective view of a display device according to an embodiment of the present invention, and FIG. 10b is a combined cross-sectional view of a display device according to an embodiment of the present invention. Among the components shown in FIG. 10a and FIG. 10b, components identical to those shown in FIG. 8a and FIG. 8b are given the same reference numerals, and a detailed description thereof is omitted.

[0183] Referring to FIG. 10a and FIG. 10b, a display device (DDb) according to one embodiment of the present invention may include a protective cover film (PCF3).

[0184] A protective cover film (PCF3) is placed under the display module (DM) and the lower module (LM). Specifically, the protective cover film (PCF3) is placed under the rear surface of the lower module (LM) and the third region (A3) of the display module (DM) to protect the bending region (i.e., the second region (A2)) and the flexible circuit film (FCB) of the display module (DM).

[0185] The protective cover film (PCF3) includes an insulating base layer (IBL3), an adhesive layer (AL), and a step layer (SDL). The insulating base layer (IBL3) may include a shaped portion (SPPb) positioned to overlap with a second region (A2) of the display module (DM). The shaped portion (SPPb) may include a protrusion (PP1) protruding in a fourth direction (DR4) opposite to a third direction (DR3) facing the second region (A2).

[0186] When viewed in a planar view, the protrusion (PP1) may have a rectangular shape extending in a first direction (DR1). The protrusion (PP1) may include a planar section (FP), a first side section (IP1) extending from one end of the planar section (FP), and a second side section (IP2) extending from the other end of the planar section (FP). The first side section (IP1) may have an inclined structure inclined with respect to the planar section (FP), and the second side section (IP2) may have an inclined structure inclined with respect to the planar section (FP). However, the shapes of the first and second side sections (IP1, IP2) are not limited thereto. The first and second side sections (IP1, IP2) may be perpendicular to the planar section (FP).

[0187] The shape processing part (SPPb) may further include a support part (GP1, GP2) having a planar structure and positioned adjacent to the protrusion (PP1). In one example of the present invention, the support part (GP1, GP2) may include a first support part (GP1) that overlaps with the display module (DM) and a second support part (GP2) that does not overlap with the display module (DM). A step may exist between the first support part (GP1) and the second support part (GP2). The step between the first support part (GP1) and the second support part (GP2) may occur due to a difference in length between the first and second side parts (IP1, IP2). The second side part (IP2) may have a longer length than the first side part (IP1). Accordingly, the second support part (GP2) may be closer to the window (WM) than the first support part (GP1). In addition, as an example of the present invention, the end of the second support member (GP2) may be positioned outside the end of the window (WM).

[0188] A sufficient buffer space (SS1) (or separation space) can be secured between the second region (A2) of the display module (DM) and the protective cover film (PCF3) by the shape processing part (SPPb). Impacts applied from the outside to the second region (A2) can be buffered by the buffer space (SS1) and the shape processing part (SPPb). Accordingly, the protective performance of the protective cover film (PCF3) can be further improved. As a result, the protective cover film (PCF3) can reliably protect the bending part (i.e., the second region (A2)) of the display module (DM) during the process of transporting the display device (DDb) for the manufacture of an electronic device (ED, see FIG. 1a).

[0189] FIGS. 11a and FIGS. 11b are perspective views of a protective cover film according to embodiments of the present invention.

[0190] Referring to FIGS. 10a and FIGS. 11a, a protective cover film (PCF4) according to one embodiment of the present invention comprises an insulating base layer (IBL4), an adhesive layer (ALa), and a step layer (SDL). The insulating base layer (IBL4) may include a shape processing portion (SPPc) arranged to overlap with a second region (A2) of a display module (DM). The shape processing portion (SPPc) may include a protrusion (PPa) protruding in a fourth direction (DR4) opposite to a third direction (DR3) facing the second region (A2). The shape processing portion (SPPc) may further include a support portion (GPa) arranged to surround the protrusion (PPa). As the support portion (GPa) is arranged around the protrusion (PPa), the impact applied toward the protrusion (PPa) is offset by the support portion (GPa), thereby preventing the shape of the protective cover film (PCF4) from being deformed.

[0191] The insulating base layer (IBL4) may include a body region (BA) and first and second extension regions (EA1, EA2) extending in a second direction from the body region (BA). The adhesive layer (ALa) may include a first sub-adhesive layer (S_AL1) disposed in the body region (BA), and second and third sub-adhesive layers (S_AL2, S_AL3) disposed respectively in the first and second extension regions (EA1, EA2). Although a structure in which the first to third sub-adhesive layers (S_AL1, S_AL2, S_AL3) are separated is illustrated, the present invention is not limited thereto. For example, the first sub-adhesive layer (S_AL1) may have an integral shape with the second sub-adhesive layer (S_AL2), and the first sub-adhesive layer (S_AL1) may have an integral shape with the third sub-adhesive layer (S_AL3).

[0192] Impacts applied to the protrusion (PPa) can be offset by the adhesive layer (ALa), and as a result, the deformation of the shape of the protective cover film (PCF4) can be prevented.

[0193] Referring to FIG. 10a and FIG. 11b, a protective cover film (PCF5) according to one embodiment of the present invention comprises an insulating base layer (IBL5), an adhesive layer (ALb), and first and second step layers (SDLa, SDLb). The first and second step layers (SDLa, SDLb) may be spaced apart from each other in a first direction (DR1). The first and second step layers (SDLa, SDLb) are provided at positions that do not overlap with driving elements (DEL) disposed on a flexible circuit film (FCB). The shape and number of the first and second step layers (SDLa, SDLb) are not particularly limited.

[0194] The insulating base layer (IBL5) may include a shaped portion (SPPd) positioned to overlap with the second region (A2) of the display module (DM). The shaped portion (SPPd) may include first and second protrusions (S_PPa, S_PPb) protruding in a fourth direction (DR4). The first and second protrusions (S_PPa, S_PPb) may be spaced apart from each other in the first direction (DR1).

[0195] The shape processing part (SPPd) may further include a support part (GPb) positioned to surround the first and second protrusions (S_PPa, S_PPb). As the support part (GPb) is positioned around the first and second protrusions (S_PPa, S_PPb), the impact applied toward the first and second protrusions (S_PPa, S_PPb) is offset by the support part (GPb), thereby preventing the shape of the protective cover film (PCF5) from being deformed.

[0196] The insulating base layer (IBL5) may include a body region (BA) and first to third extension regions (EA1, EA2, EA3) extending in a second direction from the body region (BA). The adhesive layer (ALb) includes first and second sub-adhesive layers (S_ALa, S_ALb) disposed in the body region (BA). The adhesive layer (ALb) may include third to fifth sub-adhesive layers (S_ALc, S_ALd, S_ALe) disposed in the first to third extension regions (EA1, EA2, EA3), respectively. Although a structure in which the first to fifth sub-adhesive layers (S_Ala~S_ALe) are separated is illustrated, the present invention is not limited thereto. For example, the first sub-adhesive layer (S_ALa) may have an integral shape with the third and fourth sub-adhesive layers (S_ALc, S_ALd), and the second sub-adhesive layer (S_ALb) may have an integral shape with the fourth and fifth sub-adhesive layers (S_ALd, S_ALe).

[0197] Impacts applied to the first and second protrusions (S_PPa, S_PPb) can be offset by the adhesive layer (ALb), and as a result, the phenomenon of deformation of the shape of the protective cover film (PCF5) can be prevented.

[0198] FIG. 12a is an exploded perspective view of a display device according to an embodiment of the present invention, and FIG. 12b is a combined cross-sectional view of a display device according to an embodiment of the present invention. Among the components shown in FIG. 12a and FIG. 12b, components identical to those shown in FIG. 10a and FIG. 10b are given the same reference numerals, and a detailed description thereof is omitted.

[0199] Referring to FIG. 12a and FIG. 12b, a display device (DDc) according to one embodiment of the present invention may include a protective cover film (PCF6).

[0200] A protective cover film (PCF6) is placed under the display module (DM) and the lower module (LM). Specifically, the protective cover film (PCF6) is placed under the rear surface of the lower module (LM) and the third region (A3) of the display module (DM) to protect the bending region (i.e., the second region (A2)) and the flexible circuit film (FCB) of the display module (DM).

[0201] The protective cover film (PCF3) includes an insulating base layer (IBL6), an adhesive layer (AL), and a step layer (SDL). The insulating base layer (IBL6) may include a shaped portion (SPPd) positioned to overlap with a second region (A2) of the display module (DM). The shaped portion (SPPd) may include a protrusion (PP2) protruding in a fourth direction (DR4) opposite to a third direction (DR3) facing the second region (A2). When viewed in a planar view, the protrusion (PP2) may have a shape extending in a first direction (DR1). The protrusion (PP2) may have a rounded cross-sectional shape.

[0202] The shape processing part (SPPd) may further include a support part (GP3, GP4) having a planar structure parallel to the window (WM) and positioned adjacent to the protrusion (PP2). In one example of the present invention, the support part (GP3, GP4) may include a first support part (GP3) that overlaps with the display module (DM) and a second support part (GP4) that does not overlap with the display module (DM). A step may exist between the first support part (GP3) and the second support part (GP4). The second support part (GP4) may be closer to the window (WM) than the first support part (GP3). Also, in one example of the present invention, the end of the second support part (GP4) may be positioned outside the end of the window (WM).

[0203] In one example of the present invention, a protrusion (PP2) may be positioned to surround a second region (A2) of a display module (DM). A sufficient buffer space (SS2) (or separation space) may be secured between the second region (A2) of the display module (DM) and the protective cover film (PCF6). Therefore, when an impact is applied from the outside toward the second region (A2), the buffer space (SS2) and the shaped processing part (SPPd) can buffer the impact. Thus, the protective performance of the protective cover film (PCF6) can be further improved. As a result, the protective cover film (PCF6) can reliably protect the bending part (i.e., the second region (A2)) of the display module (DM) during the process of transporting the display device (DDc) for the manufacture of an electronic device (ED, see FIG. 1a).

[0204] FIG. 13 is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the present invention. Reference numerals refer to FIGS. 1a to 12b.

[0205] First, a display device (DD, DDa, DDb, DDc) is provided (S10). The display device (DD) may be the display device (DD, DDa, DDb, DDc) described with reference to FIGS. 1a to 12. The display device (DD, DDa, DDb, DDc) includes a window (WM), a display module (DM), and a protective cover film (PCF, PCFa~PCFf, PCF1~PCF6). Accordingly, the step of providing the display device (DD, DDa, DDb, DDc) may include the step of attaching the protective cover film (PCF, PCFa~PCFf, PCF1~PCF6) to the rear surface of the display module (DM).

[0206] While transporting the display device (DD, DDa, DDb, DDc), the display module (DM) is protected by a protective cover film (PCF, PCFa~PCFf, PCF1~PCF6), so that the display module (DM) can be provided without defects.

[0207] Next, the protective cover film (PCF, PCFa~PCFf, PCF1~PCF6) is removed from the display device (DD, DDa, DDb, DDc) (S20).

[0208] Afterward, the display module (DM) is combined with a component of the electronic device (ED) (S30). The component of the electronic device (ED) may include an external case (EDC, shown in FIG. 1b) that is physically combined with the display module (DM).

[0209] When physically combining the components of the electronic device (ED) and the display module (DM), adhesive members and additional structures may be used.

[0210] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the relevant technical field will understand that various modifications and changes can be made to the invention without departing from the spirit and technical scope of the invention as set forth in the claims below. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims. Explanation of the symbols

[0211] ED: Electronic device DD: Display device DP: Display panel DM, DMa: Display module PCF: Protective cover film tape WM: Window AG: Air gap IBL: Insulating base layer AL: Adhesive layer SDL: Step layer SPP: Shaped part CCP: Concave part CVP: Convex part PP1, PP2: Protrusion DEL: Driving elements

Claims

Claim 1 A display device comprising: a window; a display module including a bending area disposed below the window and bent along a bending axis; and a protective cover film disposed below the display module to protect the display module, wherein the protective cover film includes an insulating base layer; and an adhesive layer disposed between the insulating base layer and the display module, and wherein an air gap overlapping with the bending area is provided within the insulating base layer. Claim 2 In claim 1, the air gap is a display device having a shape extending in a first direction parallel to the bending axis. Claim 3 In paragraph 2, the air gap comprises a plurality of sub-air gaps, and the plurality of sub-air gaps are arranged in a second direction intersecting the bending axis. Claim 4 A display device according to claim 1, wherein the air gap comprises a plurality of sub-air gaps, and the plurality of sub-air gaps are arranged in a first direction parallel to the bending axis and a second direction intersecting the first direction. Claim 5 In claim 1, the air gap is a display device having any one of a polygonal shape, a circular shape, and an elliptical shape on a plane. Claim 6 A display device according to claim 1, wherein the insulating base layer comprises a first base layer; and a second base layer facing the first base layer, and the air gap is an air layer formed between the first base layer and the second base layer. Claim 7 A display device according to claim 1, wherein the insulating base layer comprises: a first base layer; a second base layer disposed on the first base layer; a third base layer disposed on the second base layer; and a fourth base layer disposed on the third base layer, and the air gap comprises a first sub-air gap formed between the first base layer and the second base layer and a second sub-air gap formed between the third base layer and the fourth base layer. Claim 8 In claim 1, the protective cover film further comprises a step layer disposed between the insulating base layer and the display module. Claim 9 In claim 8, the step layer is an adhesive display device. Claim 10 A display device according to claim 8, further comprising: a flexible circuit film connected to one side of the display module; and a plurality of driving elements mounted on the flexible circuit film, wherein the step layer does not overlap with the plurality of driving elements. Claim 11 A display device comprising: a window; a display module including a bending area disposed below the window and bent along a bending axis; and a protective cover film disposed below the display module to protect the display module, wherein the protective cover film includes an insulating base layer; and an adhesive layer disposed between the insulating base layer and the display module, wherein the insulating base layer includes a shape processing portion that overlaps with the bending area, and the shape processing portion has a shape protruding in a third direction toward the bending area or in a fourth direction opposite to the third direction. Claim 12 In claim 11, the shape processing part comprises a convex portion protruding in the third direction and a concave portion sunken in the fourth direction, forming a display device. Claim 13 In claim 11, the insulating base layer comprises: a first base layer; and a second base layer facing the first base layer, in a display device. Claim 14 A display device according to claim 13, wherein the shape processing part comprises: a first shape processing part provided on the first base layer and including a first convex part protruding in the third direction and a first concave part sunken in the fourth direction; and a second shape processing part provided on the second base layer and including a second convex part protruding in the third direction and a second concave part sunken in the fourth direction. Claim 15 A display device according to claim 14, wherein the first convex portion is positioned corresponding to the second concave portion, and the second convex portion is positioned corresponding to the first concave portion. Claim 16 In claim 11, the shape processing part is a display device including a protrusion protruding in the fourth direction. Claim 17 In claim 16, the insulating base layer further comprises a support having a planar structure disposed adjacent to the protrusion and a display device. Claim 18 In claim 17, the support member comprises a first support member that overlaps with the display module; and a second support member that does not overlap with the display module, and a display device having a step difference between the first support member and the second support member. Claim 19 In paragraph 18, the end of the second support member is a display device positioned outside the end of the window. Claim 20 In claim 11, the shape processing part comprises first and second protrusions spaced apart from each other in a first direction parallel to the bending axis, and each of the first and second protrusions protrudes in the fourth direction. Claim 21 In claim 20, the insulating base layer is arranged to surround the first and second protrusions and further comprises a support having a planar structure. Claim 22 In claim 11, the protective cover film further comprises a step layer disposed between the insulating base layer and the display module. Claim 23 A display device according to claim 22, further comprising: a flexible circuit film connected to one side of the display module; and a plurality of driving elements mounted on the flexible circuit film, wherein the step layer does not overlap with the plurality of driving elements. Claim 24 A method for manufacturing an electronic device comprising: a window, a display module including a bending area disposed below the window and bent along a bending axis, and a protective cover film disposed below the display module and protecting the display module; a step of removing the protective cover film from the display device; and a step of combining the display module with a component of an electronic device, wherein the protective cover film comprises an insulating base layer; and an adhesive layer disposed between the insulating base layer and the display module, wherein the insulating base layer comprises a shape processing portion that overlaps with the bending area, and the shape processing portion has a shape protruding in a third direction toward the bending area or in a fourth direction opposite to the third direction. Claim 25 A method for manufacturing an electronic device according to claim 24, wherein the insulating base layer comprises: a first base layer; and a second base layer facing the first base layer. Claim 26 A method for manufacturing an electronic device according to claim 25, wherein the shape processing part comprises: a first shape processing part provided on the first base layer and including a first convex part protruding in the third direction and a first concave part recessed in the fourth direction; and a second shape processing part provided on the second base layer and including a second convex part protruding in the third direction and a second concave part recessed in the fourth direction. Claim 27 A method for manufacturing an electronic device according to claim 26, wherein the first convex portion is positioned corresponding to the second concave portion, and the second convex portion is positioned corresponding to the first concave portion. Claim 28 A method for manufacturing an electronic device according to claim 24, wherein the shape processing part comprises a protrusion protruding in the fourth direction, and the insulating base layer further comprises a support part having a planar structure disposed adjacent to the protrusion. Claim 29 A method for manufacturing an electronic device according to claim 28, wherein the support member comprises a first support member that overlaps with the display module; and a second support member that does not overlap with the display module, and a step difference exists between the first support member and the second support member. Claim 30 In claim 29, a method for manufacturing an electronic device wherein the end of the second support member is positioned outside the end of the window.

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