Multilayer electronic component

Abstract

A stacked electronic component according to one embodiment of the present invention comprises a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, a body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion to a part of the first surface, and a third band portion extending from the first connection portion to a part of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion to a part of the first surface, and a fourth band portion extending from the second connection portion to a part of the second surface; and an insulating layer disposed on the first and second connection portions and disposed to cover the second surface and the third and fourth band portions. It includes a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion; wherein the insulating layer may include a silicone-based resin.

Description

Technology Field

[0001] The present invention relates to a stacked electronic component. Background Technology

[0003] A Multi-Layered Ceramic Capacitor (MLCC), a type of multilayer electronic component, is a chip-shaped capacitor mounted on the printed circuit boards of various electronic products—such as video devices like Liquid Crystal Displays (LCDs) and Plasma Display Panels (PDPs), computers, smartphones, and mobile phones—that serves to charge or discharge electricity.

[0005] These multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being compact, guaranteeing high capacitance, and being easy to mount. As various electronic devices, such as computers and mobile devices, become smaller and more powerful, the demand for miniaturization and high capacitance in multilayer ceramic capacitors is increasing.

[0006] In addition, with the recent increase in industry interest in automotive electronic components, multilayer ceramic capacitors are also required to possess high reliability characteristics for use in automobiles or infotainment systems.

[0008] To achieve miniaturization and high capacitance of multilayer ceramic capacitors, it is necessary to increase the number of layers by forming the internal electrodes and dielectric layers thinly, and to increase the effective volume fraction required for capacitance implementation by minimizing the volume of parts that do not affect capacitance formation.

[0009] In addition, in order to mount the maximum number of components within a limited substrate area, it is necessary to minimize the mounting space.

[0010] In addition, as multilayer ceramic capacitors become smaller and have higher capacitance, the margin thickness becomes thinner, which can make it easier for external moisture or plating solution to penetrate, and this can compromise reliability. Therefore, a method is required to protect multilayer ceramic capacitors from external moisture or plating solution penetration. The problem to be solved

[0012] One of the various objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0013] One of the various objectives of the present invention is to provide a stacked electronic component with improved reliability.

[0014] One of the various objectives of the present invention is to provide a stacked electronic component that can minimize mounting space.

[0016] However, the purpose of the present invention is not limited to the above description and may be more easily understood in the process of explaining specific embodiments of the present invention. means of solving the problem

[0018] A stacked electronic component according to one embodiment of the present invention comprises a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, a body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion to a part of the first surface, and a third band portion extending from the first connection portion to a part of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion to a part of the first surface, and a fourth band portion extending from the second connection portion to a part of the second surface; and an insulating layer disposed on the first and second connection portions and disposed to cover the second surface and the third and fourth band portions. It includes a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion; wherein the insulating layer may include a silicone-based resin.

[0020] A stacked electronic component according to one embodiment of the present invention comprises a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, a body comprising first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first external electrode comprising a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface; a second external electrode comprising a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; an insulating layer disposed on the second surface and extending onto the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion; wherein the insulating layer may comprise a silicone-based resin.

[0022] A stacked electronic component according to one embodiment of the present invention comprises a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, a body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion to a part of the first surface, and a first corner portion disposed extending from the first connection portion to a corner connecting the second surface and the third surface; and a second external electrode including a second connection portion disposed on the fourth surface, a second band portion extending from the second connection portion to a part of the first surface, and a second corner portion disposed extending from the second connection portion to a corner connecting the second surface and the fourth surface. The structure comprises: an insulating layer disposed on the first and second connection portions and disposed to cover the second surface, the first and second corner portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion; wherein B3 is the second direction average size from the extension line of the third surface to the end of the first corner portion, B4 is the second direction average size from the extension line of the fourth surface to the end of the second corner portion, G1 is the second direction average size of the area separated from the third surface and the second internal electrode, and G2 is the second direction average size of the area separated from the fourth surface and the first internal electrode, satisfying B3≤G1 and B4≤G2, and the insulating layer may include a silicone-based resin.

[0024] A stacked electronic component according to one embodiment of the present invention comprises a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, a body comprising first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first external electrode comprising a first connecting electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connecting electrode; a second external electrode comprising a second connecting electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connecting electrode; a first insulating layer disposed on the first connecting electrode; a second insulating layer disposed on the second connecting electrode; a first plating layer disposed on the first band electrode; and a second plating layer disposed on the second band electrode; wherein the first and second insulating layers may comprise a silicon-based resin. Effects of the invention

[0026] One of the various effects of the present invention is that by placing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, the capacity per unit volume of the stacked electronic component is improved while also improving reliability.

[0027] One of the various effects of the present invention is that the mounting space of stacked electronic components is minimized.

[0028] One of the various effects of the present invention is that the insulating layer includes a silicone-based resin, thereby preventing the penetration of moisture and plating solution, improving moisture resistance reliability, and suppressing the occurrence and propagation of cracks.

[0030] However, the various and beneficial advantages and effects of the present invention are not limited to those described above and may be more easily understood in the process of explaining specific embodiments of the present invention. Brief explanation of the drawing

[0032] FIG. 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. Figure 2 is a schematic perspective view of the body of the stacked electronic component of Figure 1. Figure 3 is a cross-sectional view according to II' of Figure 1. FIG. 4 is an exploded perspective view schematically illustrating the body of FIG. 2 disassembled. FIG. 5 is a schematic perspective view of a substrate on which the stacked electronic components of FIG. 1 are mounted. FIG. 6 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 7 is a cross-sectional view taken along II-II' of FIG. 6. FIG. 8 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 9 is a cross-sectional view taken along III-III' of FIG. 8. FIG. 10 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 11 is a cross-sectional view taken along IV-IV' of FIG. 10. FIG. 12 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 13 is a cross-sectional view according to VV' of FIG. 12. FIG. 14 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 15 is a cross-sectional view taken along VI-VI' of FIG. 14. FIG. 16 illustrates a modified example of FIG. 14. FIG. 17 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 18 is a cross-sectional view along VII-VII' of FIG. 17. FIG. 19 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 20 is a cross-sectional view along VIII-VIII' of FIG. 19. FIG. 21 illustrates a modified example of FIG. 19. FIG. 22 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 23 is a cross-sectional view along IX-IX' of FIG. 22. FIG. 25 illustrates a modified example of FIG. 22. FIG. 25 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 26 is a cross-sectional view according to XX' of FIG. 25. FIG. 27 illustrates a modified example of FIG. 25. FIG. 28 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 29 is a cross-sectional view taken along XI-XI' of FIG. 28. FIG. 30 illustrates a modified example of FIG. 28. FIG. 31 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 32 is a cross-sectional view taken along XII-XII' of FIG. 31. FIG. 33 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 34 is a cross-sectional view taken along XIII-XIII' of FIG. 33. FIG. 35 illustrates a modified example of FIG. 33. FIG. 36 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention. FIG. 37 is a cross-sectional view along XIV-XIV' of FIG. 36. FIG. 38 is an enlarged view of the K1 region of FIG. 36. Specific details for implementing the invention

[0033] Embodiments of the present invention will be described below with reference to specific embodiments and the attached drawings. However, embodiments of the present invention may be modified in various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0034] Furthermore, in order to clearly explain the invention in the drawings, parts unrelated to the explanation are omitted, and the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation; thus, the invention is not necessarily limited to what is illustrated. Additionally, components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0035] In the drawing, the first direction may be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0037] FIG. 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention.

[0038] Figure 2 is a schematic perspective view of the body of the stacked electronic component of Figure 1.

[0039] Figure 3 is a cross-sectional view according to II' of Figure 1.

[0040] FIG. 4 is an exploded perspective view schematically illustrating the body of FIG. 2 disassembled.

[0041] FIG. 5 is a schematic perspective view of a substrate on which the stacked electronic components of FIG. 1 are mounted.

[0043] Hereinafter, with reference to FIGS. 1 to 5, a stacked electronic component (1000) according to one embodiment of the present invention will be described.

[0045] A stacked electronic component (1000) according to one embodiment of the present invention comprises: a dielectric layer (111); first and second internal electrodes (121, 122) alternately arranged with the dielectric layer in between; a body (110) comprising first and second surfaces (1, 2) facing in a first direction, third and fourth surfaces (3, 4) connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces (5, 6) connected to the first to fourth surfaces and facing in a third direction; and a first external electrode (131) comprising a first connection portion (131a) disposed on the third surface, a first band portion (131b) extending from the first connection portion to a part of the first surface, and a third band portion (131c) extending from the first connection portion to a part of the second surface. A second external electrode (132) comprising a second connection portion (132a) disposed on the fourth surface, a second band portion (132b) extending from the second connection portion to a part of the first surface, and a fourth band portion (132c) extending from the second connection portion to a part of the second surface; an insulating layer (151) disposed on the first and second connection portions and disposed to cover the second surface, the third and fourth band portions (131c, 132c); a first plating layer (141) disposed on the first band portion (131b); and a second plating layer (142) disposed on the second band portion (132b); wherein the insulating layer (151) may include a silicone-based resin.

[0047] The body (110) has dielectric layers (111) and internal electrodes (121, 122) alternately stacked.

[0048] There are no specific restrictions on the specific shape of the body (110), but as illustrated, the body (110) may be formed in a cuboid shape or a similar shape. Due to the shrinkage of the ceramic powder contained in the body (110) during the firing process, the body (110) may not have a cuboid shape with perfect straight lines, but may have a substantially cuboid shape.

[0049] The body (110) may have first and second surfaces (1, 2) facing each other in a first direction, third and fourth surfaces (3, 4) connected to the first and second surfaces (1, 2) and facing each other in a second direction, and fifth and sixth surfaces (5, 6) connected to the first and second surfaces (1, 2) and facing each other in a third direction.

[0050] In one embodiment, the body (110) includes a first-3 corner connecting a first surface and a third surface, a first-4 corner connecting the first surface and a fourth surface, a second-3 corner connecting the second surface and a third surface, and a second-4 corner connecting the second surface and a fourth surface, wherein the first-3 corner and the second-3 corner have a shape that contracts toward the center of the first direction of the body as they get closer to the third surface, and the first-4 corner and the second-4 corner may have a shape that contracts toward the center of the first direction of the body as they get closer to the fourth surface.

[0051] As the margin region where the internal electrodes (121, 122) are not placed on the dielectric layer (111) overlaps, a step difference occurs due to the thickness of the internal electrodes (121, 122), so that the corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces may have a shape that is contracted toward the center of the first direction of the body (110) when viewed with respect to the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the body, the corner connecting the first surface (1) and the third to sixth surfaces (3, 4, 5, 6) and / or the corner connecting the second surface (2) and the third to sixth surfaces (3, 4, 5, 6) may have a shape that is contracted toward the center of the first direction of the body (110) when viewed with respect to the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the body (110) may be rounded by performing a separate process, so that the corner connecting the first face and the third to sixth faces and / or the corner connecting the second face and the third to sixth faces may have a round shape.

[0052] The above corners may include a 1-3 corner connecting the first surface and the third surface, a 1-4 corner connecting the first surface and the fourth surface, a 2-3 corner connecting the second surface and the third surface, and a 2-4 corner connecting the second surface and the fourth surface. Additionally, the corners may include a 1-5 corner connecting the first surface and the fifth surface, a 1-6 corner connecting the first surface and the sixth surface, a 2-5 corner connecting the second surface and the fifth surface, and a 2-6 corner connecting the second surface and the sixth surface. The first to sixth surfaces of the body (110) may generally be flat surfaces, and uneven areas may be viewed as corners. Hereinafter, the extension line of each surface may mean a line extended based on the flat part of each surface.

[0053] At this time, among the external electrodes (131, 132), the area placed on the corner of the body (110) may be called the corner portion, the area placed on the third and fourth surfaces of the body (110) may be called the connection portion, and the area placed on the first and second surfaces of the body may be called the band portion.

[0054] Meanwhile, in order to suppress the step difference caused by the internal electrodes (121, 122), after lamination, the internal electrodes are cut so that they are exposed to the fifth and sixth surfaces (5, 6) of the body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both sides of the capacitance forming part (Ac) to form a margin part (114, 115), the part connecting the first surface and the fifth and sixth surfaces and the part connecting the second surface and the fifth and sixth surfaces may not have a shrunken shape.

[0056] A plurality of dielectric layers (111) forming the body (110) are in a sintered state, and the boundary between adjacent dielectric layers (111) can be integrated to such an extent that it is difficult to verify without using a scanning electron microscope (SEM).

[0057] According to one embodiment of the present invention, the raw material forming the dielectric layer (111) is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material may be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and examples of the ceramic powder include BaTiO3, or BaTiO3 in which Ca (calcium), Zr (zirconium), etc. are partially dissolved (Ba 1-x Ca x )TiO3(0 <x<1), Ba(Ti 1-y Ca y )O3(0 <y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 <x<1, 0<y<1)또는 Ba(Ti1-y Zr y )O3(0 <y<1) 등을 들 수 있다.

[0058] In addition, the raw material forming the dielectric layer (111) may have various ceramic additives, organic solvents, binders, dispersants, etc. added to a powder such as barium titanate (BaTiO3) according to the purpose of the present invention.

[0060] Meanwhile, the average thickness (td) of the dielectric layer (111) does not need to be specifically limited.

[0061] However, generally, when the dielectric layer is formed thinly with a thickness of less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, there was a concern that reliability would be reduced.

[0062] According to one embodiment of the present invention, by placing an insulating layer on the connection portion of an external electrode and placing a plating layer on the band portion of an external electrode, the penetration of external moisture and plating solution can be prevented, thereby improving reliability, so excellent reliability can be secured even when the average thickness of the dielectric layer (111) is 0.35 μm or less.

[0063] Therefore, when the average thickness of the dielectric layer (111) is 0.35 μm or less, the reliability improvement effect according to the present invention can be more pronounced.

[0064] The average thickness (td) of the dielectric layer (111) may refer to the average thickness of the dielectric layer (111) disposed between the first and second internal electrodes (121, 122).

[0065] The average thickness of the dielectric layer (111) can be measured by scanning an image of the cross-section of the body (110) in the length and thickness direction (LT) using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average value can be measured by measuring the thickness of a dielectric layer at 30 equally spaced points in the length direction from the scanned image. The 30 equally spaced points can be designated in the capacitance forming unit (Ac). In addition, if this average value measurement is extended to 10 dielectric layers and the average value is measured, the average thickness of the dielectric layer can be further generalized.

[0067] The body (110) may include a capacitance forming part (Ac) in which a capacitance is formed by including a first internal electrode (121) and a second internal electrode (122) that are positioned facing each other with a dielectric layer (111) in between, and cover parts (112, 113) formed on the upper and lower sides of the first direction of the capacitance forming part (Ac).

[0068] In addition, the capacitance forming part (Ac) is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes (121, 122) with a dielectric layer (111) in between.

[0070] The cover portion (112, 113) may include an upper cover portion (112) positioned above the first direction of the capacity forming portion (Ac) and a lower cover portion (113) positioned below the first direction of the capacity forming portion (Ac).

[0071] The upper cover portion (112) and lower cover portion (113) can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion (Ac), respectively, and can basically perform the role of preventing damage to the internal electrode due to physical or chemical stress.

[0072] The upper cover portion (112) and lower cover portion (113) do not include an internal electrode and may include the same material as the dielectric layer (111).

[0073] That is, the upper cover portion (112) and the lower cover portion (113) may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0074] Meanwhile, the average thickness of the cover portions (112, 113) does not need to be specifically limited. However, in order to more easily achieve miniaturization and high capacity of the stacked electronic component, the average thickness (tc) of the cover portions (112, 113) may be 15 μm or less. In addition, according to one embodiment of the present invention, by placing an insulating layer on the connection portion of the external electrode and placing a plating layer on the band portion of the external electrode, the penetration of external moisture and plating solution can be prevented, thereby improving reliability. Therefore, excellent reliability can be secured even when the average thickness (tc) of the cover portions (112, 113) is 15 μm or less.

[0075] The average thickness (tc) of the cover portion (112, 113) may mean the first direction size and may be the average value of the first direction sizes of the cover portion (112, 113) measured at five equally spaced points on the upper or lower part of the capacitance forming portion (Ac).

[0077] In addition, a margin portion (114, 115) may be disposed on the side of the above-mentioned capacity forming portion (Ac).

[0078] The margin portions (114, 115) may include a first margin portion (114) disposed on the fifth surface (5) of the body (110) and a second margin portion (115) disposed on the sixth surface (6). That is, the margin portions (114, 115) may be disposed on both end surfaces in the width direction of the body (110).

[0079] The margin portion (114, 115) may refer to the area between the two ends of the first and second internal electrodes (121, 122) and the boundary surface of the body (110) in a cross-section cut in the width-thickness (WT) direction of the body (110), as shown in FIG. 3.

[0080] The margin portion (114, 115) can basically perform the role of preventing damage to the internal electrode due to physical or chemical stress.

[0081] The margin portion (114, 115) may be formed by applying a conductive paste to the ceramic green sheet, excluding the area where the margin portion is to be formed, to form an internal electrode.

[0082] In addition, to suppress the step difference caused by the internal electrodes (121, 122), after lamination, the internal electrodes may be cut so that they are exposed to the fifth and sixth sides (5, 6) of the body, and then a single dielectric layer or two or more dielectric layers may be laminated in the third direction (width direction) on both sides of the capacitance forming part (Ac) to form a margin part (114, 115).

[0083] Meanwhile, the width of the margin portion (114, 115) does not need to be specifically limited. However, in order to more easily achieve miniaturization and high capacity of the stacked electronic component, the average width of the margin portion (114, 115) may be 15 μm or less. In addition, according to one embodiment of the present invention, by placing an insulating layer on the connection portion of the external electrode and placing a plating layer on the band portion of the external electrode, the penetration of external moisture and plating solution can be prevented, thereby improving reliability. Therefore, excellent reliability can be secured even when the average width of the margin portion (114, 115) is 15 μm or less.

[0084] The average width of the margin portion (114, 115) may mean the average size of the third direction of the margin portion (114, 115), and may be the average value of the third direction sizes of the margin portion (114, 115) measured at five equally spaced points on the side of the capacitance forming portion (Ac).

[0086] The internal electrodes (121, 122) are alternately stacked with the dielectric layer (111).

[0087] The internal electrodes (121, 122) may include first and second internal electrodes (121, 122). The first and second internal electrodes (121, 122) are alternately arranged to face each other with the dielectric layer (111) constituting the body (110) in between, and may be exposed to the third and fourth surfaces (3, 4) of the body (110), respectively.

[0088] Referring to FIG. 3, the first internal electrode (121) may be spaced apart from the fourth surface (4) and exposed through the third surface (3), and the second internal electrode (122) may be spaced apart from the third surface (3) and exposed through the fourth surface (4). A first external electrode (131) may be disposed on the third surface (3) of the body and connected to the first internal electrode (121), and a second external electrode (132) may be disposed on the fourth surface (4) of the body and connected to the second internal electrode (122).

[0089] That is, the first internal electrode (121) is connected to the first external electrode (131) but is not connected to the second external electrode (132), and the second internal electrode (122) is connected to the second external electrode (132) but is not connected to the first external electrode (131). Accordingly, the first internal electrode (121) can be formed at a certain distance from the fourth surface (4), and the second internal electrode (122) can be formed at a certain distance from the third surface (3).

[0090] At this time, the first and second internal electrodes (121, 122) can be electrically separated from each other by a dielectric layer (111) placed in the middle.

[0091] The body (110) can be formed by alternately stacking a ceramic green sheet with a first internal electrode (121) printed thereon and a ceramic green sheet with a second internal electrode (122) printed thereon, and then firing them.

[0092] The material forming the internal electrode (121, 122) is not particularly limited and a material with excellent electrical conductivity may be used. For example, the internal electrode (121, 122) may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0093] Additionally, the internal electrodes (121, 122) can be formed by printing a conductive paste for internal electrodes, comprising one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, onto a ceramic green sheet. The printing method of the conductive paste for internal electrodes may include screen printing or gravure printing, but the present invention is not limited thereto.

[0095] Meanwhile, the average thickness (te) of the internal electrodes (121, 122) does not need to be specifically limited.

[0096] However, generally, when the internal electrode is formed thinly with a thickness of less than 0.6 μm, especially when the thickness of the internal electrode is 0.35 μm or less, there was a concern that reliability would be reduced.

[0097] According to one embodiment of the present invention, by placing an insulating layer on the connection portion of an external electrode and placing a plating layer on the band portion of an external electrode, the penetration of external moisture and plating solution can be prevented, thereby improving reliability, so excellent reliability can be secured even when the average thickness of the internal electrode (121, 122) is 0.35 μm or less.

[0098] Accordingly, when the thickness of the internal electrodes (121, 122) is 0.35 μm or less on average, the effect according to the present invention can be more pronounced, and the miniaturization and high capacity of the stacked electronic component can be achieved more easily.

[0099] The average thickness (te) of the internal electrodes (121, 122) above may mean the average thickness of the internal electrodes (121, 122).

[0100] The average thickness of the internal electrodes (121, 122) can be measured by scanning an image of the cross-section of the body (110) in the length and thickness direction (LT) using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average value can be measured by measuring the thickness of one internal electrode at 30 equally spaced points in the length direction from the scanned image. The 30 equally spaced points can be designated in the capacitance forming unit (Ac). Additionally, if this average value measurement is extended to 10 internal electrodes and the average value is measured, the average thickness of the internal electrodes can be further generalized.

[0102] The external electrodes (131, 132) may be disposed on the third surface (3) and the fourth surface (4) of the body (110). The external electrodes (131, 132) may include first and second external electrodes (131, 132) respectively disposed on the third and fourth surfaces (3, 4) of the body (110) and connected to the first and second internal electrodes (121, 122) respectively.

[0103] The external electrodes (131, 132) may include a first external electrode (131) comprising a first connection portion (131a) disposed on a third surface and a first band portion (131b) extending from the first connection portion to a part of the first surface, and a second external electrode (132) comprising a second connection portion (132a) disposed on a fourth surface and a second band portion (132b) extending from the second connection portion to a part of the first surface. The first connection portion (131a) may be connected to the first internal electrode (121) on the third surface, and the second connection portion (132a) may be connected to the second internal electrode (122) on the fourth surface.

[0104] Additionally, the first external electrode (131) may include a third band portion (131c) extending from the first connection portion (131a) to a part of the second surface, and the second external electrode (132) may include a fourth band portion (132c) extending from the second connection portion (132a) to a part of the second surface. Furthermore, the first external electrode (131) may include a first side band portion extending from the first connection portion (131a) to a part of the fifth and sixth surfaces, and the second external electrode (132) may include a second side band portion extending from the second connection portion (132a) to a part of the fifth and sixth surfaces.

[0105] However, the third band portion, the fourth band portion, the first side band portion, and the second side band portion may not be essential components of the present invention. The first and second external electrodes (131, 132) may not be disposed on the second surface, nor may they be disposed on the fifth and sixth surfaces. Since the first and second external electrodes (131, 132) are not disposed on the second surface, the first and second external electrodes (131, 132) may be disposed below the extension line of the second surface of the body. Additionally, the first and second connection portions (131a, 132a) may be disposed spaced apart from the fifth and sixth surfaces, and the first and second connection portions (131a, 132a) may be disposed spaced apart from the second surface. Additionally, the first and second band portions (131b, 132b) may also be disposed spaced apart from the fifth and sixth surfaces.

[0106] Meanwhile, when the first and second external electrodes (131, 132) include third and fourth band portions (131c, 132c), an insulating layer is shown disposed on the third and fourth band portions (131c, 132c), but is not limited thereto, and a plating layer may be disposed on the third and fourth band portions (131c, 132c) to improve ease of mounting. Additionally, the first and second external electrodes (131, 132) may be in a form that includes the third and fourth band portions (131c, 132c) but does not include the side band portions, in which case the first and second connection portions (131a, 132a) and the first to fourth band portions (131a, 132b, 131c, 132c) may have a form that is spaced apart from the fifth and sixth surfaces.

[0108] In this embodiment, a structure is described in which a stacked electronic component (1000) has two external electrodes (131, 132), but the number or shape of the external electrodes (131, 132) may change depending on the shape of the internal electrodes (121, 122) or other purposes.

[0110] Meanwhile, the external electrodes (131, 132) can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc., and furthermore, they can have a multilayer structure.

[0111] The external electrode (131, 132) may be a fired electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and resin.

[0112] Additionally, the external electrodes (131, 132) may be formed such that a sintered electrode and a resin-based electrode are sequentially formed on the body. Additionally, the external electrodes (131, 132) may be formed by transferring a sheet containing a conductive metal onto the body, or by transferring a sheet containing a conductive metal onto the sintered electrode.

[0113] The conductive metal included in the external electrodes (131, 132) may be a material with excellent electrical conductivity and is not specifically limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes (131, 132) may include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes (121, 122) containing Ni.

[0115] The insulating layer (151) can be placed on the first and second connection parts (131a, 132a).

[0116] Since the first and second connection portions (131a, 132a) are parts connected to the internal electrodes (121, 122), they can become a path for the penetration of plating solution during the plating process or for moisture penetration during actual use. In the present invention, since an insulating layer (151) is disposed on the connection portions (131a, 132a), the penetration of external moisture or plating solution can be prevented.

[0117] The insulating layer (151) may be positioned to be in contact with the first and second plating layers (141, 142). At this time, the insulating layer (151) may be in contact with the first and second plating layers (141, 142) in a manner that partially covers the ends of the insulating layer (151), or the first and second plating layers (141, 142) may be in contact with the insulating layer (151) in a manner that partially covers the ends of the insulating layer (151).

[0118] An insulating layer (151) is disposed on the first and second connection portions (131a, 132a) and may be disposed to cover the second surface and the third and fourth band portions (131c, 132c). At this time, the insulating layer (151) may be disposed to cover the area of ​​the second surface where the third and fourth band portions (131c, 132c) are not disposed, and the third and fourth band portions (131c, 132c). Accordingly, the insulating layer (151) can further improve moisture resistance reliability by covering the area where the ends of the third and fourth band portions (131c, 132c) and the body (110) come into contact, thereby blocking the moisture penetration path.

[0119] The insulating layer (151) may be disposed on the second surface and extended to the first and second connection parts (131a, 132a). Additionally, if the external electrodes (131, 132) are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer (151) does not necessarily have to be disposed on the second surface; the insulating layer may not be disposed on part or all of the second surface, and the insulating layer may be separated into two parts and disposed on the first and second connection parts (131a, 132a), respectively. If the insulating layer is not disposed on the entire second surface, it may be disposed below the extension line of the second surface. Additionally, the insulating layer may not be disposed on the second surface but may extend to the fifth and sixth surfaces on the first and second connection parts (131a, 132a) to form a single insulating layer.

[0120] Furthermore, the insulating layer (151) may be positioned to cover parts of the first and second side band portions, the fifth surface, and the sixth surface. At this time, parts of the fifth surface and the sixth surface that are not covered by the insulating layer (151) may be exposed to the outside.

[0121] Additionally, the insulating layer (151) may be arranged to cover all of the first and second side band portions, the fifth surface, and the sixth surface. In this case, the fifth surface and the sixth surface are not exposed to the outside, thereby improving moisture resistance reliability, and the connection portions (131a, 132a) are also not directly exposed to the outside, thereby improving the reliability of the stacked electronic component (1000). More specifically, the insulating layer may cover all of the first and second side band portions and cover all of the fifth and sixth surfaces except for the area where the first and second side band portions are formed.

[0123] The insulating layer (151) can prevent the formation of a plating layer (141, 142) on the external electrode (131, 132) on which the insulating layer (151) is placed, and can improve sealing characteristics to minimize the penetration of moisture or plating solution from the outside.

[0124] The insulating layer (151) may include a silicone-based resin.

[0125] Conventionally, glass-based materials were generally used for the insulating layer; however, due to the characteristics of glass-based materials, severe clumping occurs during sintering, making it difficult to form a uniform film. Furthermore, since heat is required during the sintering process, it generates stress within the body, which can cause cracks or delamination. Additionally, when using an insulating layer containing glass-based materials, a method is used in which the insulating layer containing glass-based materials is sintered after the external electrode; however, there is a risk that metallic material from the external electrode may diffuse into the internal electrode during the sintering process, causing radiating cracks. Moreover, since glass-based materials generally have rigid properties, there is a concern that they may break even from a small impact.

[0126] In this invention, the problems associated with glass-based insulating layers were resolved by applying a silicone-based resin instead of a glass-based material to the insulating layer.

[0127] Silicone-based resins refer to thermosetting synthetic resins produced by the polymerization of organic derivatives of silicone. Since silicone-based resins can be cured at temperatures below 400°C, which is relatively lower than the sintering temperature of glass-based resins, they can suppress cracks caused by thermal shrinkage and radiation cracks caused by metal diffusion. Furthermore, while glass-based insulating layers must be formed with a minimum thickness of several μm, insulating layers using silicone-based resins have the advantage of easily controlling thickness from several nanometers to several μm. Additionally, unlike glass-based, acrylic, or epoxy resins, silicone-based resins possess excellent water repellency, which effectively prevents the penetration of plating solutions. Moreover, silicone-based resins have excellent bonding strength with the body; in particular, if hydroxyl groups are formed on the surface of the body, the bonding strength can be further enhanced by easily bonding with and depositing the resin onto these hydroxyl groups. In addition, while it is difficult to form insulating layers using vapor deposition and liquid deposition methods with acrylic and epoxy resins, silicone resins have the advantage of being easy to form using vapor deposition and liquid deposition, allowing for the application of various formation methods.

[0129] In addition, silicone-based resins may contain siloxane bonds (Si-O bonds) formed by the bonding of silicon (Si) atoms and oxygen (O) atoms. Accordingly, silicone-based resins can exhibit excellent heat resistance, chemical resistance, and high durability.

[0130] While general resins such as acrylic resins and epoxy resins have carbon as the backbone of their composition, the molecular structure of silicone resins can have a structure in which siloxane bonds (Si-O bonds) are used as the backbone and methyl groups, phenyl groups, hydroxyl groups, etc. are added thereto.

[0131] Whether a silicone-based resin contains siloxane bonds (Si-O bonds) can be confirmed by whether a peak of siloxane bonds (Si-O bonds) appears during analysis such as FT-IR or GC-MS (gas chromatograph-mass spectrometer).

[0133] In one embodiment, the silicone resin may include a methyl group (-CH3). Since the silicone resin includes a methyl group, heat resistance can be significantly improved, so the laminated electronic component (1000) can be used in a high-temperature environment and high-temperature reliability can be improved.

[0135] Meanwhile, the content of the silicone-based resin included in the insulating layer (151) does not need to be specifically limited, but, for example, it may be 10 wt% or more. If the content of the silicone-based resin is less than 10 wt%, there is a risk of being vulnerable to external impact. On the other hand, the upper limit of the content of the silicone-based resin included in the insulating layer (151) does not need to be specifically limited, and the insulating layer (151) may be made of silicone-based resin excluding impurities.

[0137] In one embodiment, the insulating layer (151) may include one or more ceramic additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc., in addition to the silicon-based resin. Since the ceramic additive has excellent bonding strength with the dielectric material included in the body (100) and the glass included in the external electrodes (131, 132), it can improve the bonding strength between the body (100) and the external electrodes (131, 132).

[0138] At this time, the content of the ceramic additive may be 10 wt% or less (excluding 0 wt%). If the content of the ceramic additive exceeds 10 wt%, it may be vulnerable to external shock and the strength of the multilayer electronic component may be reduced.

[0140] The method of forming the insulating layer (151) does not need to be specifically limited. For example, after forming external electrodes (131, 132) on the body (100), the insulating layer (151) can be formed by printing a silicone-based resin, making a silicone-based resin into a sheet and transferring it, or by dipping it into a paste containing silicone-based resin. Furthermore, since silicone-based resin is easy to form by vapor deposition and liquid deposition, the insulating layer (151) can be formed by vapor deposition and liquid deposition. In addition, the insulating layer (151) can be formed by applying one or more of the above methods.

[0142] In one embodiment, the insulating layer (151) is positioned to be in direct contact with the first and second external electrodes (131, 132), and the first and second external electrodes (131, 132) may include a conductive metal and glass. Accordingly, since the plating layer (141, 142) may not be positioned in the area where the insulating layer (151) is positioned on the outer surface of the first and second external electrodes (131, 132), the prevention of external electrode erosion by the plating solution can be effectively suppressed.

[0143] At this time, the first plating layer (141) is positioned to cover the end of the first external electrode (131) of the insulating layer (151), and the second plating layer (142) can be positioned to cover the end of the second external electrode (132) of the insulating layer (151). By forming the insulating layer (151) first before forming the plating layer (141, 142) on the external electrodes (131, 132), the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layer (141, 142) can have a shape that covers the end of the insulating layer (151). Since silicone-based resins have excellent water repellency unlike glass-based, acrylic-based, or epoxy-based resins, the penetration of the plating solution during the plating process can be effectively prevented by forming the insulating layer (151) first.

[0145] In one embodiment, the insulating layer (151) is positioned to be in direct contact with the first and second external electrodes (131, 132), and the first and second external electrodes (131, 132) may include a conductive metal and a resin. Accordingly, since the plating layer (141, 142) may not be positioned in the area where the insulating layer (151) is positioned on the outer surface of the first and second external electrodes (131, 132), the prevention of external electrode erosion by the plating solution can be effectively suppressed.

[0146] At this time, the first plating layer (141) is positioned to cover the end of the first external electrode (131) of the insulating layer (151), and the second plating layer (142) can be positioned to cover the end of the second external electrode (132) of the insulating layer (151). By forming the insulating layer (151) first before forming the plating layer (141, 142) on the external electrodes (131, 132), the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layer (141, 142) can have a shape that covers the end of the insulating layer (151). Since silicone-based resins have excellent water repellency unlike glass-based, acrylic-based, or epoxy-based resins, the penetration of the plating solution during the plating process can be effectively prevented by forming the insulating layer (151) first.

[0148] In one embodiment, the average thickness (t2) of the insulating layer (151) may be 20 nm or more and 2 μm or less.

[0149] Glass-based insulating layers must be formed with a minimum thickness of several μm, whereas insulating layers using silicone resin can be easily controlled from several nm to several μm. Additionally, while it is difficult to form insulating layers using vapor deposition and liquid deposition methods with acrylic resin and epoxy resin, it is possible to form insulating layers using silicone resin. Therefore, using silicone resin allows for the formation of a thin insulating layer, and since silicone resin has excellent water repellency, sufficient moisture resistance reliability can be secured when the average thickness (t2) of the insulating layer (151) is 20 nm or more. If the average thickness (t2) of the insulating layer (151) is less than 20 nm, there is a concern that the effect of suppressing cracks caused by thermal shrinkage and radiation cracks caused by metal diffusion, as well as the effect of improving moisture resistance reliability, may not be sufficiently secured.

[0150] On the other hand, if the average thickness (t2) of the insulating layer (151) exceeds 2 μm, the overall size of the stacked electronic component increases, and there is a concern that the capacity per unit volume may decrease.

[0151] The average thickness (t2) of the insulating layer (151) may be the average of the thicknesses measured at five equally spaced points on the first and second connecting parts (131a, 132a). More specifically, it may be the average of the thickness values ​​of the insulating layer measured at the first central point in the first direction of the first and second connecting parts (131a, 132a), two points spaced 5 μm apart in the first direction relative to the first central point, and two points spaced 10 μm apart in the first direction.

[0153] The first and second plating layers (141, 142) can be placed on the first and second band portions (131b, 132b), respectively. The plating layers (141, 142) can perform a role in improving mounting characteristics, and as the plating layers (141, 142) are placed on the band portions (131b, 132b), the mounting space can be minimized and reliability can be improved by minimizing the penetration of the plating solution into the internal electrode. One end of the first and second plating layers (141, 142) can be in contact with the first surface, and the other end can be in contact with the insulating layer (151).

[0154] The type of plating layer (141, 142) is not specifically limited and may be a plating layer comprising one or more of Cu, Ni, Sn, Ag, Au, Pd and alloys thereof, and may be formed into multiple layers.

[0155] As a more specific example regarding the plating layer (141, 142), the plating layer (141, 142) may be a Ni plating layer or a Sn plating layer, and may be in the form where the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band portions (131b, 132b).

[0157] In one embodiment, the first and second plating layers (141, 142) may be extended and arranged to partially cover the first and second connection portions (131a, 132a), respectively. When the average size in the first direction to the internal electrode closest to the first surface (1) among the first and second internal electrodes (121, 122) is denoted as H1, and the average size in the first direction to the end of the first and second plating layers (141, 142) arranged on the first and second connection portions (131a, 132a) from the extension line of the first surface (1) is denoted as H2, H1 > H2 can be satisfied. Accordingly, the penetration of the plating solution into the internal electrode during the plating process can be suppressed, thereby improving reliability.

[0158] H1 and H2 may be the average of values ​​measured at cross-sections (LT cross-sections) cut in the first and second directions at five points that are equally spaced in the third direction of the body (110). H1 may be the average of values ​​measured at the point where the internal electrode placed closest to the first surface (1) in each cross-section is connected to the external electrode, and H2 may be the average of values ​​measured based on the end of the plating layer in contact with the external electrode, and the extension line of the first surface that serves as the reference when measuring H1 and H2 may be the same.

[0160] In one embodiment, the first plating layer (141) is positioned to cover the end portion disposed on the first external electrode (131) of the insulating layer (151), and the second plating layer (142) may be positioned to cover the end portion disposed on the second external electrode (132) of the insulating layer (151). Accordingly, the bonding strength between the insulating layer (151) and the plating layers (141, 142) can be strengthened to improve the reliability of the stacked electronic component (1000).

[0161] In one embodiment, the insulating layer (151) is positioned to cover the end positioned on the first external electrode (131) of the first plating layer (141), and the insulating layer (151) may be positioned to cover the end positioned on the second external electrode (132) of the second plating layer (142). Accordingly, the bonding strength between the insulating layer (151) and the plating layers (141, 142) can be strengthened to improve the reliability of the stacked electronic component (1000).

[0163] In one embodiment, when the second direction average size of the body (110) is L, the second direction average size from the extension line of the third surface to the end of the first band portion is B1, and the second direction average size from the extension line of the fourth surface to the end of the second band portion is B2, then 0.2 B1 / L ≤ 0.4 and 0.2 B2 / L ≤ 0.4 can be satisfied.

[0164] If B1 / L and B2 / L are less than 0.2, it may be difficult to secure sufficient adhesion strength. On the other hand, if B2 / L is greater than 0.4, there is a risk that leakage current may occur between the first band portion (131b) and the second band portion (132b) under high voltage current, and there is a risk that the first band portion (131b) and the second band portion (132b) may become electrically connected due to plating bleeding during the plating process.

[0165] B1, B2 and L may be the average of values ​​measured at cross-sections (LT cross-sections) cut in the first and second directions at five equally spaced points in the third direction of the body (110).

[0167] Referring to FIG. 5, which illustrates a mounting substrate (1100) on which a stacked electronic component (1000) is mounted, the plating layer (141, 142) of the stacked electronic component (1000) can be joined by electrode pads (181, 182) disposed on the substrate (180) and solder (191, 192).

[0168] Meanwhile, when the internal electrodes (121, 122) are stacked in a first direction, the stacked electronic component (1000) can be horizontally mounted on the substrate (180) so that the internal electrodes (121, 122) are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes (121, 122) are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes (121, 122) are perpendicular to the mounting surface.

[0170] The size of the stacked electronic component (1000) does not need to be specifically limited.

[0171] However, in order to achieve both miniaturization and high capacity simultaneously, the thickness of the dielectric layer and internal electrode must be reduced to increase the number of layers, so the reliability and capacity improvement effects per unit volume according to the present invention can be more pronounced in a stacked electronic component (1000) having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less.

[0172] Accordingly, considering manufacturing error, external electrode size, etc., if the length of the stacked electronic component (1000) is 1.1 mm or less and the width is 0.55 mm or less, the reliability improvement effect according to the present invention may be more pronounced. Here, the length of the stacked electronic component (1000) refers to the maximum size in the second direction of the stacked electronic component (1000), and the width of the stacked electronic component (1000) may refer to the maximum size in the third direction of the stacked electronic component (1000).

[0174] FIG. 6 is a schematic perspective view of a stacked electronic component (1001) according to one embodiment of the present invention, and FIG. 7 is a cross-sectional view according to II-II' of FIG. 6.

[0175] Referring to FIGS. 6 and 7, in a stacked electronic component (1001) according to one embodiment of the present invention, the first and second plating layers (141-1, 142-1) may be arranged below the extension line (E1) of the first surface. Accordingly, the height of the solder can be minimized during mounting and the mounting space can be minimized.

[0176] Additionally, the insulating layer (151-1) may be extended below the extension line of the first surface and arranged to be in contact with the first and second plating layers (141-1, 142-1).

[0178] FIG. 8 is a schematic perspective view of a stacked electronic component (1002) according to one embodiment of the present invention, and FIG. 9 is a cross-sectional view along III-III' of FIG. 8.

[0179] Referring to FIGS. 8 and 9, a stacked electronic component (1002) according to one embodiment of the present invention may further include an additional insulating layer (161) disposed on a first surface (1) and disposed between a first band portion (131b) and a second band portion (132b). Accordingly, leakage current, etc., that may occur between the first band portion (131b) and the second band portion (132b) under high voltage current can be prevented.

[0180] There is no need to specifically limit the type of additional insulating layer (161). For example, the additional insulating layer (161) may include a silicone-based resin, similar to the insulating layer (151). However, there is no need to limit the additional insulating layer (161) and the insulating layer (151) to the same material, and they may be formed from different materials. For example, they may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or glass. In addition, the additional insulating layer (161) may include one or more selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. as additives in addition to the polymer resin. Accordingly, the bonding strength with the body or external electrode can be improved.

[0182] FIG. 10 is a schematic perspective view of a stacked electronic component (1003) according to one embodiment of the present invention, and FIG. 11 is a cross-sectional view according to IV-IV' of FIG. 10.

[0183] Referring to FIGS. 10 and 11, in the multilayer electronic component 1003 according to an embodiment, when the average dimension in the first direction from the first surface 1 to the inner electrode, which is the closest to the first surface 1 among the first and second inner electrodes 121 and 122, is defined as H1, and the average dimension in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is defined as H2, H1<H2 may be satisfied. Accordingly, the area in contact with solder during mounting is increased, so that the bonding strength can be improved.

[0184] More preferably, when the average dimension of the body 110 in the first direction is defined as T, H2<T / 2 may be satisfied. That is, H1<H2<T / 2 may be satisfied. This is because if H2 is equal to or greater than T / 2, the effect of improving moisture resistance reliability by the insulating layer may be reduced.

[0185] H1, H2 and T may be values obtained by averaging the values measured on cross-sections (L-T cross-sections) of the body 110 cut in the first and second directions at five equally spaced points in the third direction. H1 may be a value obtained by averaging the values measured at the points where the inner electrode disposed closest to the first surface 1 is connected to the outer electrode on each cross-section, H2 may be a value obtained by averaging the values measured based on the end of the plating layer in contact with the outer electrode on each cross-section, and the extension line of the first surface serving as the reference when measuring H1 and H2 may be the same. In addition, T may be a value obtained by measuring the maximum dimension of the body 110 in the first direction on each cross-section and then averaging the measured values.

[0187] FIG. 12 schematically shows a perspective view of a multilayer electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along line V-V' of FIG. 12.

[0188] Referring to FIG. 12 and FIG. 13, in a stacked electronic component (1004) according to one embodiment of the present invention, the average length (B1) of the first band portion (131b-4) may be longer than the average length (B3) of the third band portion (131c-4), and the average length of the second band portion (132b-4) may be longer than the average length (B4) of the fourth band portion (132c-4). Accordingly, the area in contact with the solder during mounting can be increased to improve adhesion strength.

[0189] More specifically, when the second direction average size from the extension line of the third surface (3) to the end of the first band portion (131b-4) is denoted as B1, the second direction average size from the extension line of the fourth surface (4) to the end of the second band portion (132b-4) is denoted as B2, the second direction average size from the extension line of the third surface (3) to the end of the third band portion (131c-4) is denoted as B3, and the second direction average size from the extension line of the fourth surface (4) to the end of the fourth band portion (132c-4) is denoted as B4, B3 <B1 및 B4<B2를 만족할 수 있다.

[0190] At this time, when the average size of the second direction of the body (110) is L, 0.2≤B1 / L≤0.4 and 0.2≤B2 / L≤0.4 can be satisfied.

[0191] B1, B2, B3, B4 and L may be the average of values ​​measured at cross-sections (LT cross-sections) cut in the first and second directions at five points with equal intervals in the third direction of the body (110).

[0192] Additionally, the first external electrode (131-4) may include a first side band portion extending from the first connection portion (131a-4) to a part of the fifth and sixth surfaces, and the second external electrode (132-4) may include a second side band portion extending from the second connection portion (132a-4) to a part of the fifth and sixth surfaces. In this case, the size of the second direction of the first and second side band portions may gradually increase as it approaches the first surface. That is, the first and second side band portions may be arranged in a tapered shape or a trapezoidal shape.

[0194] Furthermore, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion (131c-4), B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion (132c-4), G1 is the average size in the second direction of the area separated from the third surface and the second internal electrode (122), and G2 is the average size in the second direction of the area separated from the fourth surface and the first internal electrode (121), then B3≤G1 and B4≤G2 can be satisfied. Accordingly, the volume occupied by the external electrode can be minimized, thereby increasing the capacity per unit volume of the stacked electronic component (1004).

[0195] The above G1 and G2 may be such that, in a cross-section where the body is cut in the first and second directions from the center of the third direction, the average value of the second direction size spaced apart to the third surface measured for any five second internal electrodes located in the center of the first direction is G1, and the average value of the second direction size spaced apart to the fourth surface measured for any five first internal electrodes located in the center of the first direction is G2.

[0196] Furthermore, G1 and G2 can be obtained from cross-sections (LT cross-sections) in which the body (110) is cut in the first and second directions at five points with equal intervals in the third direction, and the average values ​​of them can be further generalized as G1 and G2.

[0197] However, the present invention is not intended to be limited to B3≤G1 and B4≤G2, and cases satisfying B3≥G1 and B4≥G2 may also be included as embodiments of the present invention. Accordingly, in one embodiment, when B3 is the second direction average size from the extension line of the third surface to the end of the third band portion, B4 is the second direction average size from the extension line of the fourth surface to the end of the fourth band portion, G1 is the second direction average size of the area separated from the third surface and the second internal electrode, and G2 is the second direction average size of the area separated from the fourth surface and the first internal electrode, B3≥G1 and B4≥G2 may be satisfied.

[0199] In one embodiment, when the average size in the second direction from the extension line of the third surface (E3) to the end of the first band portion is denoted as B1 and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is denoted as B2, B1 ≥ G1 and B2 ≥ G2 can be satisfied. Accordingly, the adhesion strength with the substrate (180) of the stacked electronic component (1004) can be improved.

[0201] FIG. 14 is a schematic perspective view of a stacked electronic component (1005) according to one embodiment of the present invention, and FIG. 15 is a cross-sectional view according to VI-VI' of FIG. 14.

[0202] Referring to FIGS. 14 and 15, the first and second external electrodes (131-5, 132-5) of a stacked electronic component (1005) according to one embodiment of the present invention may not be placed on the second plane but may be placed on the third, fourth, and first planes to have an L-shape. That is, the first and second external electrodes (131-5, 132-5) may be placed below the extension line of the second plane.

[0203] The first external electrode (131-5) may include a first connection portion (131a-5) disposed on the third surface (3) and a first band portion (131b-5) extending from the first connection portion (131a-5) to a part of the first surface (1), and the second external electrode (132-5) may include a second connection portion (132a-5) disposed on the fourth surface (4) and a second band portion (132b-5) extending from the second connection portion (132a-5) to a part of the first surface (1). The external electrodes (131-5, 132-5) may not be disposed on the second surface (2), so that the insulating layer (151-5) may be disposed to cover the entire second surface (2). Accordingly, since the volume occupied by the external electrodes (131-5, 132-5) can be minimized, the capacity per unit volume of the stacked electronic component (1005) can be further improved. However, it is not necessary to limit the insulating layer (151-5) to a form that covers the entire second surface (2), and the insulating layer may not cover part or all of the second surface (2), but may be separated and cover the first and second connection parts (131a-5, 132a-5) respectively.

[0204] Additionally, the insulating layer (151-5) may be positioned to cover a portion of the fifth and sixth surfaces to further improve reliability. At this time, a portion of the fifth and sixth surfaces not covered by the insulating layer (151-5) may be exposed to the outside.

[0205] Furthermore, the insulating layer 151-5 may be disposed to cover the entirety of the fifth surface and the sixth surface. In this case, the fifth surface and the sixth surface are not exposed to the outside, so that moisture resistance reliability can be further improved.

[0207] The first plating layer 141-5 is disposed on the first band portion 131b-5, the second plating layer 142-5 is disposed on the second band portion 132b-5, and the first and second plating layers 141-5, 142-5 may be disposed to extend to portions on the first and second connection portions 132a-5, 132b-5.

[0208] At this time, the external electrodes 131-5, 132-5 may not be disposed on the fifth and sixth surfaces 5, 6 either. That is, the external electrodes 131-5, 132-5 may be arranged to be disposed only on the third, fourth, and first surfaces.

[0209] When the average size in the first direction from the first surface 1 to the inner electrode, which is disposed closest to the first surface 1 among the first and second inner electrodes 121, 122, is defined as H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5, 142-5 disposed on the first and second connection portions 131a-5, 132a-5 is defined as H2, H1<H2 can be satisfied. Accordingly, the area in contact with solder during mounting can be increased to improve fixing strength, and the contact area between the external electrodes 131-5, 132-5 and the plating layers 141-5, 142-5 can be increased to suppress an increase in ESR (Equivalent Series Resistance).

[0210] More preferably, when the average size of the body 110 in the first direction is defined as T, H2<T / 2 can be satisfied. That is, H1<H2<T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving moisture resistance reliability by the insulating layer may be reduced.

[0211] Additionally, the first and second plating layers (141-5, 142-5) may be arranged to cover a portion of the insulating layer (151-1) on the third and fourth sides. That is, the plating layers (141-5, 142-5) may be arranged to cover the ends of the insulating layer (151-5) on the third and fourth sides. Accordingly, the bonding strength between the insulating layer (151-5) and the plating layers (141-5, 142-5) can be strengthened, thereby improving the reliability of the stacked electronic component (1005).

[0212] Additionally, the insulating layer (151-5) may be positioned to cover a portion of the first and second plating layers (141-5, 142-5) on the third and fourth sides. That is, the insulating layer (151-5) may be positioned to cover the ends of the plating layers (141-5, 142-5) on the third and fourth sides. Accordingly, the reliability of the stacked electronic component (1005) can be improved by strengthening the bonding strength between the insulating layer (151-5) and the plating layers (141-5, 142-5).

[0214] FIG. 16 illustrates a variation of FIG. 14. Referring to FIG. 16, a variation (1006) of a stacked electronic component (1005) according to one embodiment of the present invention may have a first additional electrode layer (134) disposed between a first connection portion (131a-6) and a third surface, and a second additional electrode layer (135) disposed between a second connection portion (132a-6) and a fourth surface. The first additional electrode layer (134) may be disposed within a range that does not extend beyond the third surface, and the second additional electrode layer (135) may be disposed within a range that does not extend beyond the fourth surface. The first and second additional electrode layers (134, 135) can improve electrical connectivity between the internal electrode (121, 122) and the external electrode (131-6, 132-6), and have excellent bonding strength with the external electrode (131-6, 132-6), thereby performing the role of further improving the mechanical bonding strength of the external electrode (131-6, 132-6).

[0215] The first and second external electrodes (131-6, 132-6) may have an L-shape in which the first and second external electrodes are not disposed on the second surface.

[0216] The first external electrode (131-6) may include a first connection portion (131a-6) disposed on the first additional electrode layer (134) and a first band portion (131b-6) extending from the first connection portion (131a-6) to a part of the first surface (1), and the second external electrode (132-6) may include a second connection portion (132a-6) disposed on the second additional electrode layer (135) and a second band portion (132b-6) extending from the second connection portion (132a-6) to a part of the first surface (1).

[0217] Meanwhile, the first and second additional electrode layers (131-6, 132-6) can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Additionally, the first and second additional electrode layers (131-6, 132-6) may be fired electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and resin. Additionally, the first and second additional electrode layers (131-6, 132-6) may be formed by transferring a sheet containing a conductive metal onto a body.

[0218] The conductive metal included in the first and second additional electrode layers (131-6, 132-6) may be a material with excellent electrical conductivity and is not specifically limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the first and second additional electrode layers (131-6, 132-6) may include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrode (121, 122) containing Ni.

[0220] FIG. 17 is a schematic perspective view of a stacked electronic component (1007) according to one embodiment of the present invention, and FIG. 18 is a cross-sectional view according to VII-VII' of FIG. 17.

[0221] Referring to FIGS. 17 and 18, the average thickness (t1) of the first and second plating layers (141-6, 142-6) of a stacked electronic component (1007) according to one embodiment of the present invention may be thinner than the average thickness (t2) of the insulating layer (151-6).

[0222] The insulating layer (151-6) serves to prevent external moisture penetration or plating solution penetration, but its weak connectivity with the plating layer (141-6, 142-6) may cause delamination of the plating layer (141-6, 142-6). When the plating layer is delaminated, the adhesion strength with the substrate (180) may decrease. Here, delamination of the plating layer (141-6, 142-6) may mean that the plating layer is partially detached or physically separated from the external electrode (131-5, 132-5). Because the connectivity between the plating layer and the insulating layer is weak, there is a higher possibility that a gap will open at the interface between the insulating layer and the plating layer or that foreign substances will penetrate, and it may become vulnerable to external impacts, thereby increasing the likelihood of delamination.

[0223] According to one embodiment of the present invention, the average thickness (t1) of the plating layer can be made thinner than the average thickness (t2) of the insulating layer to reduce the contact area between the plating layer and the insulating layer, thereby suppressing the occurrence of delamination and improving the adhesion strength with the substrate (180) of the stacked electronic component (1000).

[0224] The average thickness (t1) of the first and second plating layers (141-6, 142-6) may be the average of the thicknesses measured at five equally spaced points on the first and second connection portions (131a-5, 132a-5) or the first and second band portions (131b-5, 132b-5), and the average thickness (t2) of the insulating layer (151-6) may be the average of the thicknesses measured at five equally spaced points on the first and second connection portions (131a-5, 132a-5).

[0227] FIG. 19 schematically illustrates a perspective view of a stacked electronic component (2000) according to one embodiment of the present invention. FIG. 20 is a cross-sectional view according to VIII-VIII' of FIG. 19.

[0228] Hereinafter, a stacked electronic component (2000) according to an embodiment of the present invention will be described in detail with reference to FIGS. 19 and 20. However, content that overlaps with the above description may be omitted to avoid redundant explanation.

[0229] A stacked electronic component (2000) according to one embodiment of the present invention comprises: a dielectric layer (111); first and second internal electrodes (121, 122) alternately arranged with the dielectric layer in between; a body (110) comprising first and second surfaces (1, 2) facing in a first direction, third and fourth surfaces (3, 4) connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces (5, 6) connected to the first to fourth surfaces and facing in a third direction; a first external electrode (231) comprising a first connecting electrode (231a) disposed on the third surface and a first band electrode (231b) disposed on the first surface and connected to the first connecting electrode; and a second external electrode (232) comprising a second connecting electrode (232a) disposed on the fourth surface and a second band electrode (232b) disposed on the first surface and connected to the second connecting electrode. It includes a first insulating layer (251) disposed on the first connecting electrode; a second insulating layer (252) disposed on the second connecting electrode; a first plating layer (241) disposed on the first band electrode; and a second plating layer (242) disposed on the second band electrode; wherein the first and second insulating layers (251, 252) may include a silicone-based resin.

[0231] The first connecting electrode (231a) may be placed on the third surface (3) and connected to the first internal electrode (121), and the second connecting electrode (231b) may be placed on the fourth surface (4) and connected to the second internal electrode (122). Additionally, a first insulating layer (251) may be placed on the first connecting electrode (231a'), and a second insulating layer (252) may be placed on the second connecting electrode (232a).

[0232] Conventionally, when forming external electrodes, a paste containing a conductive metal was used, and a method of dipping the exposed surface of the internal electrode of the body into the paste was mainly used. However, the thickness of the external electrode formed by the dipping method could be too thick at the center in the thickness direction. Furthermore, even without the problem of thickness imbalance of the external electrode due to this dipping method, since the internal electrode is exposed on the third and fourth surfaces of the body, the thickness of the external electrode placed on the third and fourth surfaces was formed to be greater than a certain level in order to suppress the penetration of moisture and plating solution through the external electrode.

[0233] On the other hand, in the present invention, since an insulating layer (251, 252) is placed on the connecting electrode (231a, 232a), sufficient reliability can be ensured even if the thickness of the connecting electrode (231a, 232a) on the third and fourth surfaces where the internal electrode is exposed is thin.

[0235] The first and second connecting electrodes (231a, 232a) may each have a shape corresponding to the third and fourth surfaces, and the surfaces of the first and second connecting electrodes (231a, 232a) facing the body (110) may each have the same area as the third and fourth surfaces of the body (110). The first and second connecting electrodes (231a, 232a) may be positioned within a range that does not extend beyond the third and fourth surfaces (3, 4). The connecting electrodes (231a, 232a) may be positioned so as not to extend to the first, second, fifth, and sixth surfaces (1, 2, 5, 6) of the body (110). Specifically, in one embodiment, the first and second connecting electrodes (231a, 232a) may be positioned spaced apart from the fifth and sixth surfaces. Accordingly, sufficient connectivity between the internal electrodes (121, 122) and the external electrodes (231, 232) can be secured while minimizing the volume occupied by the external electrodes, thereby increasing the capacity per unit volume of the stacked electronic component (2000).

[0236] In this regard, the first and second connecting electrodes (231a, 232a) may be spaced apart from the second surface (2). That is, since the external electrodes (231, 232) are not placed on the second surface, the volume occupied by the external electrodes (231, 232) can be further minimized, thereby further increasing the capacity per unit volume of the stacked electronic component (2000).

[0238] However, the connecting electrodes (231a, 232a) may include a corner portion that extends to the corner of the body (110) and is disposed on the corner. That is, in one embodiment, the first connecting electrode includes a corner portion that extends to and is disposed on the first-3 corner and the second-3 corner, and the second connecting electrode may include a corner portion that extends to and is disposed on the first-4 corner and the second-4 corner.

[0240] In addition, the connecting electrodes (231a, 232a) may have a uniform and thin thickness compared to the external electrodes formed by the conventional dipping method.

[0241] The method of forming the connecting electrodes (231a, 232a) does not need to be specifically limited, but, for example, they can be formed by transferring a sheet containing a conductive metal, an organic material such as a binder, etc., to the third and fourth surfaces, but is not limited thereto, and they can be formed by plating a conductive metal on the third and fourth surfaces. That is, the connecting electrodes (231a, 232a) may be a fired layer of a conductive metal or a plated layer.

[0242] The thickness of the connecting electrode (231a, 232a) is not specifically limited, but may be, for example, 2 to 7 μm. Here, the thickness of the connecting electrode (231a, 232a) may mean the maximum thickness and may mean the second direction size of the connecting electrode (231a, 232a).

[0243] In one embodiment, the first and second connecting electrodes (231a, 232a) may include a metal and glass identical to the metal included in the internal electrodes (121, 122). As the first and second connecting electrodes (231a, 232a) include a metal identical to the metal included in the internal electrodes (121, 122), electrical connectivity with the internal electrodes (121, 122) can be improved, and as the first and second connecting electrodes (231a, 232a) include glass, bonding strength with the body (110) and / or insulating layer (251, 252) can be improved. In this case, the metal identical to the metal included in the internal electrodes (121, 122) may be Ni.

[0245] The first and second insulating layers (251, 252) are each placed on the first and second connecting electrodes (231a, 232a) and can perform the function of preventing a plating layer from being formed on the first and second connecting electrodes (231a, 232a). In addition, the first and second insulating layers (251, 252) can perform the function of improving sealing characteristics to minimize the penetration of moisture or plating solution from the outside.

[0246] The first and second insulating layers (251, 252) may include a silicone-based resin. Accordingly, moisture resistance reliability can be further improved, and cracks caused by thermal shrinkage and radiation cracks caused by metal diffusion can be suppressed.

[0248] The first and second band electrodes (231b, 232b) may be placed on the first surface (1) of the body (110). The first and second band electrodes (231b, 232b) may be electrically connected to the first and second internal electrodes (121, 122), respectively, by contacting the first and second connecting electrodes (231a, 232a), respectively.

[0249] The external electrode formed by the conventional dipping method was formed thickly on the third and fourth surfaces and partially extended on the first, second, fifth, and sixth surfaces, which made it difficult to secure a high effective volume ratio.

[0250] On the other hand, according to one embodiment of the present invention, the first and second connecting electrodes (231a, 232a) are placed on the surface where the internal electrode is exposed, and the first and second band electrodes (231b, 232b) are placed on the surface mounted on the substrate, thereby securing a high effective volume ratio.

[0251] Meanwhile, when the internal electrodes (121, 122) are stacked in a first direction, the stacked electronic component (2000) can be horizontally mounted on a substrate such that the internal electrodes (121, 122) are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes (121, 122) are stacked in a third direction, the stacked electronic component can be vertically mounted on a substrate such that the internal electrodes (121, 122) are perpendicular to the mounting surface.

[0253] The first and second band electrodes (231b, 232b) can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. For example, the first and second band electrodes (231, 232b) may be fired electrodes including a conductive metal and glass, and may be formed by applying a paste including a conductive metal and glass to the first surface of the body, but is not limited thereto, and may be a plating layer in which a conductive metal is plated on the first surface of the body.

[0254] The conductive metal included in the first and second band electrodes (231b, 232b) may be a material with excellent electrical conductivity and is not specifically limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys, and may include the same metal as the metal included in the internal electrodes (121, 122).

[0256] Meanwhile, in one embodiment, the first external electrode (231) further includes a third band electrode (not shown) disposed on the second surface (2) and connected to the first connecting electrode (231a), and the second external electrode (232) may further include a fourth band electrode (not shown) disposed on the second surface (2) and connected to the second connecting electrode (232a).

[0258] In one embodiment, when the distance from the extension line (E3) of the third surface to the end of the first band electrode (231b) is B1, the distance from the extension line (E4) of the fourth surface to the end of the second band electrode (232b) is B2, the distance from the extension line of the third surface to the end of the third band electrode (not shown) is B3, the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown) is B4, the average size in the second direction of the area separated from the third surface and the second internal electrode (122) is G1, and the average size in the second direction of the area separated from the fourth surface and the first internal electrode (121) is G2, then B1 ≥ G1, B3 ≤ G1, B2 ≥ G2, and B4 ≤ G2 can be satisfied. Accordingly, the volume occupied by the external electrode is minimized to increase the capacity per unit volume of the stacked electronic component (2000), and at the same time, the contact area with the solder during mounting is increased to improve the adhesion strength.

[0259] However, the present invention is not intended to be limited to B1≥G1, B3≤G1, B2≥G2, and B4≤G2, and cases satisfying B1≥G1, B3≥G1, B2≥G2, and B4≥G2 may also be included as embodiments of the present invention. Accordingly, in one embodiment, when the distance from the extension line (E3) of the third surface to the end of the first band electrode (231b) is B1, the distance from the extension line (E4) of the fourth surface to the end of the second band electrode (232b) is B2, the distance from the extension line of the third surface to the end of the third band electrode (not shown) is B3, the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown) is B4, the average size in the second direction of the area separated from the third surface and the second internal electrode (122) is G1, and the average size in the second direction of the area separated from the fourth surface and the first internal electrode (121) is G2, then B1≥G1, B3≥G1, B2≥G2, and B4≥G2 can be satisfied. Accordingly, either the first or second surface can be used as the mounting surface, thereby improving mounting convenience.

[0261] The first and second plating layers (241, 242) may be disposed on the first and second band electrodes (231b, 232b). The first and second plating layers (241, 242) serve to improve mounting characteristics. The types of the first and second plating layers (241, 242) are not specifically limited and may be plating layers comprising one or more of Ni, Sn, Pd, and alloys thereof, and may be formed in multiple layers.

[0262] As a more specific example regarding the first and second plating layers (241, 242), the first and second plating layers (241, 242) may be a Ni plating layer or a Sn plating layer, and may be in the form where the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band electrodes (231b, 232b).

[0264] In one embodiment, the first and second plating layers (241, 242) may be extended and arranged to partially cover the first and second connecting electrodes (231a, 232a), respectively.

[0265] When the average size in the first direction from the first surface (1) to the internal electrode closest to the first surface (1) among the first and second internal electrodes (121, 122) is denoted as H1, and the average size in the first direction from the extension line of the first surface (1) to the end of the first and second plating layers (241, 242) placed on the first and second connecting electrodes (231a, 232a) is denoted as H2, H1 > H2 can be satisfied. Accordingly, the penetration of the plating solution into the internal electrode during the plating process can be suppressed, thereby improving reliability.

[0267] In one embodiment, the first and second insulating layers (251, 252) are arranged to be in direct contact with the first and second connecting electrodes (231a, 232a), respectively, and the first and second connecting electrodes (231a, 232a) may include a conductive metal and glass. Accordingly, since the plating layer (241, 242) may not be arranged in the area where the insulating layer (251, 252) is arranged on the outer surface of the first and second connecting electrodes (231a, 232a), the prevention of external electrode erosion by the plating solution can be effectively suppressed.

[0269] In one embodiment, the first and second insulating layers (251, 252) are arranged to be in direct contact with the first and second connecting electrodes (231a, 232a), respectively, and the first and second connecting electrodes (231a, 232a) may include a conductive metal and a resin. Accordingly, since the plating layer (241, 242) may not be arranged in the area where the insulating layer (251, 252) is arranged on the outer surface of the first and second connecting electrodes (231a, 232a), the prevention of external electrode erosion by the plating solution can be effectively suppressed.

[0271] In one embodiment, the first plating layer (241) is positioned to cover the end of the first external electrode (231) of the first insulating layer (251), and the second plating layer (242) may be positioned to cover the end of the second external electrode (232) of the second insulating layer (252). Accordingly, the reliability of the stacked electronic component (3000) can be improved by strengthening the bonding strength between the insulating layer (251, 252) and the plating layer (241, 242). In addition, by forming the first and second insulating layers (251, 252) first before forming the plating layer (241, 242) on the external electrode (231, 232), the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layer (241, 242) may have a shape that covers the ends of the insulating layer (251, 252).

[0273] In one embodiment, the first insulating layer (251) is positioned to cover the end positioned on the first external electrode (231) of the first plating layer (241), and the second insulating layer (252) may be positioned to cover the end positioned on the second external electrode (232) of the second plating layer (242). Accordingly, the bonding strength between the insulating layer (251) and the plating layers (241, 242) can be strengthened to improve the reliability of the stacked electronic component (3000).

[0275] FIG. 21 illustrates a variation of FIG. 19. Referring to FIG. 21, a variation (2001) of a stacked electronic component (2000) according to one embodiment of the present invention may be connected to a single insulating layer (253-1) by extending the first and second insulating layers (251-1, 252-1) to the fifth and sixth surfaces (5, 6) and connecting them to each other. At this time, the connected first and second insulating layers (253-1) may be arranged to cover a portion of the fifth and sixth surfaces.

[0277] FIG. 22 schematically illustrates a perspective view of a stacked electronic component (2002) according to one embodiment of the present invention. FIG. 23 is a cross-sectional view according to IX-IX' of FIG. 22.

[0278] Referring to FIGS. 22 and 23, in a stacked electronic component (2002) according to one embodiment of the present invention, the first and second plating layers (241-2, 242-2) may be arranged below the extension line of the first surface. Accordingly, the height of the solder can be minimized during mounting and the mounting space can be minimized.

[0279] Additionally, the first and second insulating layers (251-2, 252-2) may be arranged to extend below the extension line of the first surface and to be in contact with the first and second plating layers (241-2, 242-2).

[0281] FIG. 25 illustrates a variation of FIG. 22. Referring to FIG. 25, a variation (2003) of a stacked electronic component (2002) according to one embodiment of the present invention may be connected to a single insulating layer (253-3) by extending the first and second insulating layers (251-3, 252-3) to the fifth and sixth surfaces (5, 6) and connecting them to each other. At this time, the connected first and second insulating layers (253-3) may be arranged to cover the entirety of the fifth and sixth surfaces.

[0283] FIG. 25 schematically illustrates a perspective view of a stacked electronic component (2004) according to one embodiment of the present invention. FIG. 26 is a cross-sectional view according to XX' of FIG. 25.

[0284] Referring to FIGS. 25 and 26, a stacked electronic component (2004) according to one embodiment of the present invention may further include an additional insulating layer (261) disposed on a first surface (1) and between a first band electrode (231b) and a second band electrode (232b). Accordingly, leakage current, etc., that may occur between the first band electrode (231b) and the second band electrode (232b) under high voltage current can be prevented.

[0285] There is no need to specifically limit the type of additional insulating layer (261). For example, the additional insulating layer (261) may include a silicone-based resin, similar to the first and second insulating layers (251-2, 252-2). However, there is no need to limit the additional insulating layer (261) and the first and second insulating layers (251-2, 252-2) to the same material, and they may be formed from different materials. For example, they may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or they may include glass.

[0287] FIG. 27 illustrates a variation of FIG. 25. Referring to FIG. 27, a variation (2005) of a stacked electronic component (2004) according to one embodiment of the present invention can be connected to a single insulating layer (253-5) by extending the first and second insulating layers (251-5, 252-5) to the fifth and sixth surfaces (5, 6) and connecting them to each other.

[0289] FIG. 28 schematically illustrates a perspective view of a stacked electronic component (2006) according to one embodiment of the present invention. FIG. 29 is a cross-sectional view along XI-XI' of FIG. 28.

[0290] Referring to FIGS. 28 and 29, the multilayer electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on the first connection electrode 231a, and a second insulating layer 252-6 disposed on the second connection electrode 232a, wherein a first average dimension in the first direction from the first surface 1 to the inner electrode, which is the closest to the first surface 1 among the first and second inner electrodes 121 and 122, is defined as H1, and a second average dimension in the first direction from an extension line of the first surface 1 to ends of the first and second plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is defined as H2, H1<H2 may be satisfied. Accordingly, it is possible to improve the bonding strength by increasing the area in contact with solder during mounting.

[0291] More preferably, when the average dimension of the body 110 in the first direction is defined as T, H2<T / 2 may be satisfied. That is, H1<H2<T / 2 may be satisfied. This is because when H2 is equal to or greater than T / 2, there is a concern that the effect of improving moisture resistance reliability by the insulating layer may be reduced.

[0293] FIG. 30 shows a modified example of FIG. 28. Referring to FIG. 30, in a modified example 2007 of the multilayer electronic component 2006 according to an embodiment of the present disclosure, the first and second insulating layers 251-7 and 252-7 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so as to be connected as a single insulating layer 253-7.

[0295] FIG. 31 schematically shows a perspective view of a multilayer electronic component 2008 according to an embodiment of the present disclosure. FIG. 32 is a cross-sectional view taken along line XII-XII' of FIG. 31.

[0296] Referring to FIG. 31 and FIG. 32, a stacked electronic component (2008) according to one embodiment of the present invention may be connected to a single insulating layer (253-8) by extending the first and second insulating layers (251-8, 252-8) to the second, fifth, and sixth surfaces (2, 5, 6) and connecting them to each other. As shown in FIG. 33, the insulating layer (253-8) may be in a form that covers the entire second surface, and may be in a form that covers only a portion of the fifth and sixth surfaces.

[0298] FIG. 33 schematically illustrates a perspective view of a stacked electronic component (2009) according to one embodiment of the present invention. FIG. 34 is a cross-sectional view according to XIII-XIII' of FIG. 33.

[0299] Referring to FIGS. 35 and 36, the average thickness (t1) of the first and second plating layers (241-9, 242-9) of a stacked electronic component (2009) according to one embodiment of the present invention may be thinner than the average thickness (t2) of the first and second insulating layers (251-9, 252-9).

[0300] According to one embodiment of the present invention, the average thickness (t1) of the first and second plating layers (241-9, 242-9) can be made thinner than the average thickness (t2) of the first and second insulating layers (251-9, 252-9) to reduce the contact area between the plating layer and the insulating layer, thereby suppressing the occurrence of delamination and improving the adhesion strength with the substrate (180) of the stacked electronic component (2009).

[0301] The average thickness (t1) of the first and second plating layers (241-9, 242-9) may be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes (231a, 232a) or the first and second band electrodes (231b, 232b), and the average thickness (t2) of the insulating layer (251-9, 252-9) may be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes (231a, 232a).

[0303] FIG. 35 illustrates a variation of FIG. 33. Referring to FIG. 35, a variation (2010) of a stacked electronic component (2009) according to one embodiment of the present invention can be connected to a single insulating layer (253-10) by extending the first and second insulating layers (251-10, 252-10) to the fifth and sixth surfaces (5, 6) and connecting them to each other.

[0305] FIG. 36 schematically illustrates a perspective view of a stacked electronic component (3000) according to one embodiment of the present invention. FIG. 37 is a cross-sectional view along XIV-XIV' of FIG. 36. FIG. 38 is an enlarged view of the K1 region of FIG. 36.

[0306] Referring to FIGS. 36 to 42, a stacked electronic component (3000) according to one embodiment of the present invention comprises a dielectric layer (111) and first and second internal electrodes (121, 122) alternately arranged with the dielectric layer in between, a body (110) comprising first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; and a first external electrode (331) comprising a first connection portion (331a) disposed on the third surface of the body, a first band portion (331b) extending from the first connection portion to a part of the first surface, and a first corner portion (331c) extending from the first connection portion to a corner connecting the second surface and the third surface of the body. A second external electrode (332) comprising a second connection portion (332a) disposed on the fourth surface of the body, a second band portion (332b) extending from the second connection portion to a part of the first surface, and a second corner portion (332c) extending from the second connection portion to a corner connecting the second surface and the fourth surface of the body; an insulating layer (351) disposed on the first and second connection portions (331a, 332a) and disposed to cover the second surface, the first and second corner portions; a first plating layer (341) disposed on the first band portion; and a second plating layer (342) disposed on the second band portion; wherein the first and second insulating layers may comprise a silicone-based resin.

[0308] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first corner portion (331c) is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion (332c) is B4, the average size in the second direction of the area separated from the third surface and the second internal electrode is G1, and the average size in the second direction of the area separated from the fourth surface and the first internal electrode is G2, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. Accordingly, the volume occupied by the external electrodes (331, 332) can be minimized, thereby increasing the capacity per unit volume of the stacked electronic component (3000).

[0309] At this time, when the average size in the second direction from the extension line of the third surface to the end of the first band portion (331b) is denoted as B1 and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion (332b) is denoted as B2, B1 ≥ G1 and B3 ≥ G2 can be satisfied. Accordingly, the bonding strength can be improved by increasing the surface area in contact with the solder during mounting.

[0311] A stacked electronic component (3000) according to one embodiment may include a dielectric layer (111) and first and second internal electrodes (121, 122) alternately arranged with the dielectric layer in between, and may include a body (110) comprising first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction. The body (110) of the stacked electronic component (3000) may have the same configuration as the body (110) of the stacked electronic component (1000), except that the end of the first or second surface of the body has a contracted shape as described below.

[0313] The external electrodes (331, 332) may be disposed on the third surface (3) and the fourth surface (4) of the body (110). The external electrodes (331, 332) may include first and second external electrodes (331, 332) respectively disposed on the third and fourth surfaces (3, 4) of the body (110) and connected to the first and second internal electrodes (121, 122) respectively.

[0314] The external electrodes (331, 332) may include a first external electrode (331) comprising a first connection portion (331a) disposed on a third surface, a first band portion (331b) extending from the first connection portion to a part of the first surface, and a first corner portion (331c) disposed extending from the first connection portion to a corner connecting the second surface and the third surface, and a second external electrode (132) comprising a second connection portion (332a) disposed on a fourth surface, a second band portion (332b) extending from the second connection portion to a part of the first surface, and a second corner portion (332c) disposed extending from the second connection portion to a corner connecting the second surface and the fourth surface. The first connection portion (331a) may be connected to the first internal electrode (121) on the third surface, and the second connection portion (332a) may be connected to the second internal electrode (122) on the fourth surface.

[0315] In one embodiment, the first and second connection portions (331a, 332a) may be spaced apart from the fifth and sixth surfaces. Accordingly, the proportion occupied by the external electrodes (331, 332) can be minimized, thereby making the stacked electronic component (3000) even smaller.

[0317] As the margin region where the internal electrodes (121, 122) are not placed on the dielectric layer (111) overlaps, a step difference occurs due to the thickness of the internal electrodes (121, 122), so that the corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces may have a shape that is contracted toward the center of the first direction of the body (110) when viewed with respect to the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the body, the corner connecting the first surface (1) and the third to sixth surfaces (3, 4, 5, 6) and / or the corner connecting the second surface (2) and the third to sixth surfaces (3, 4, 5, 6) may have a shape that is contracted toward the center of the first direction of the body (110) when viewed with respect to the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the body (110) may be rounded by performing a separate process, so that the corner connecting the first face and the third to sixth faces and / or the corner connecting the second face and the third to sixth faces may have a round shape.

[0318] The above corner may include a 1-3 corner (c1-3) connecting the first surface and the third surface, a 1-4 corner (c1-4) connecting the first surface and the fourth surface, a 2-3 corner (c2-3) connecting the second surface and the third surface, and a 2-4 corner (c2-4) connecting the second surface and the fourth surface. Additionally, the corner may include a 1-5 corner connecting the first surface and the fifth surface, a 1-6 corner connecting the first surface and the sixth surface, a 2-5 corner connecting the second surface and the fifth surface, and a 2-6 corner connecting the second surface and the sixth surface. However, in order to suppress the step difference caused by the internal electrodes (121, 122), after lamination, the internal electrodes are cut so that they are exposed to the fifth and sixth surfaces (5, 6) of the body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both sides of the capacitance forming part (Ac) to form a margin part (114, 115), the part connecting the first surface and the fifth and sixth surfaces and the part connecting the second surface and the fifth and sixth surfaces may not have a shrunken shape.

[0319] Meanwhile, the first to sixth surfaces of the body (110) may generally be flat surfaces, and the non-flat areas may be viewed as corners. Additionally, the area of ​​the external electrodes (131, 132) placed on the corner may be viewed as a corner section.

[0321] In this regard, the first and second corner portions (331c, 332c) may be positioned below the extension line (E2) of the second surface, and the first and second corner portions (331c, 332c) may be positioned spaced apart from the second surface. That is, as the external electrodes (331, 332) are not positioned on the second surface, the volume occupied by the external electrodes (331, 332) can be further minimized, thereby further increasing the capacity per unit volume of the stacked electronic component (3000). Additionally, the first corner portion (331c) may be positioned on a part of the second-third corner (C2-3) connecting the third surface and the second surface, and the second corner portion (332c) may be positioned on a part of the second-fourth corner (C2-4) connecting the fourth surface and the second surface.

[0323] The extension line (E2) of the second plane can be defined as follows.

[0324] In a length-thickness cross-section (LT cross-section) obtained by cutting a stacked electronic component (3000) at the center in the width direction, seven straight lines (P0, P1, P2, P3, P4, P5, P6, P7) in the thickness direction are drawn with equal spacing in the length direction from the third surface to the fourth surface, and the straight line passing through the point where P2 meets the second surface and the point where P4 meets the second surface can be defined as the extension line (E2) of the second surface.

[0326] Meanwhile, the external electrodes (331, 332) can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc., and furthermore, they can have a multilayer structure.

[0327] The external electrode (331, 332) may be a fired electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and resin.

[0328] Additionally, the external electrodes (331, 332) may be formed such that a sintered electrode and a resin-based electrode are sequentially formed on the body. Additionally, the external electrodes (331, 332) may be formed by transferring a sheet containing a conductive metal onto the body, or by transferring a sheet containing a conductive metal onto the sintered electrode.

[0329] The conductive metal included in the external electrodes (331, 332) may be a material with excellent electrical conductivity and is not specifically limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes (331, 332) may include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes (121, 122) containing Ni.

[0331] The insulating layer (351) can be placed on the first and second connection parts (331a, 332a).

[0332] Since the first and second connection portions (331a, 332a) are parts connected to the internal electrodes (121, 122), they can become a path for the penetration of plating solution during the plating process or for moisture penetration during actual use. In the present invention, since an insulating layer (351) is disposed on the connection portions (331a, 332a), the penetration of external moisture or plating solution can be prevented.

[0333] The insulating layer (351) may be positioned to be in contact with the first and second plating layers (341, 342). At this time, the insulating layer (351) may be in contact with the first and second plating layers (341, 342) in a manner that partially covers the ends of the insulating layer (351), or the first and second plating layers (341, 342) may be in contact with the insulating layer (351) in a manner that partially covers the ends of the insulating layer (351).

[0334] The insulating layer (353) is disposed on the first and second connection portions (331a, 332a) and may be disposed to cover the second surface and the first and second corner portions (331c, 332c). Additionally, the insulating layer (351) can further improve moisture resistance reliability by covering the area where the ends of the first and second corner portions (331c, 332c) and the body (110) come into contact, thereby blocking the moisture penetration path.

[0335] The insulating layer (351) may be disposed on the second surface and extended to the first and second connection portions (331a, 332a). Additionally, if the external electrodes (331, 332) are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer (351) is not necessarily disposed on the second surface, and the insulating layer may not be disposed on part or all of the second surface, or the insulating layer may be separated into two parts and disposed on the first and second connection portions (331a, 332a), respectively. However, even in this case, the insulating layer may be disposed to cover the entire first and second corner portions (331c, 332c). If the insulating layer is not disposed on the entire second surface, it may be disposed below the extension line of the second surface. Additionally, although the insulating layer is not placed on the second surface, it may extend to the fifth and sixth surfaces on the first and second connecting portions (331a, 332a) to form a single insulating layer.

[0336] In one embodiment, the insulating layer (351) may be positioned to cover a portion of the fifth and sixth surfaces to improve reliability. At this time, the portion of the fifth and sixth surfaces not covered by the insulating layer may be exposed to the outside.

[0337] Furthermore, the insulating layer (351) may be arranged to cover the entirety of the fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thereby further improving moisture resistance.

[0339] The insulating layer (351) can perform the role of preventing the formation of a plating layer (341, 342) on the external electrode (331, 332) on which the insulating layer (351) is disposed, and can perform the role of improving sealing characteristics to minimize the penetration of moisture or plating solution from the outside. Since the components, composition, average thickness, and resulting effects of the insulating layer (351) are the same as those of the insulating layer (151, 251, 252, 253) included in the stacked electronic component (1000, 2000) or various embodiments thereof, a description thereof will be omitted.

[0341] The first and second plating layers (341, 342) can be placed on the first and second band portions (331b, 332b), respectively. The plating layers (341, 342) can perform a role in improving mounting characteristics, and as the plating layers (341, 342) are placed on the band portions (331b, 332b), the mounting space can be minimized and reliability can be improved by minimizing the penetration of the plating solution into the internal electrode. One end of the first and second plating layers (341, 342) can be in contact with the first surface, and the other end can be in contact with the insulating layer (351).

[0342] The type of plating layer (341, 342) is not specifically limited and may be a plating layer comprising one or more of Cu, Ni, Sn, Ag, Au, Pd and alloys thereof, and may be formed in multiple layers.

[0343] As a more specific example regarding the plating layer (341, 342), the plating layer (341, 342) may be a Ni plating layer or a Sn plating layer, and may be in the form where the Ni plating layer and the Sn plating layer are sequentially formed on the first and second band portions (331b, 332b).

[0345] In one embodiment, the insulating layer (351) is positioned to be in direct contact with the first and second external electrodes (331, 332), and the first and second external electrodes (331, 332) may include a conductive metal and glass. Accordingly, since the plating layer (341, 342) may not be positioned in the area where the insulating layer (351) is positioned on the outer surface of the first and second external electrodes (331, 332), the prevention of external electrode erosion by the plating solution can be effectively suppressed.

[0347] In one embodiment, the insulating layer (351) is positioned to be in direct contact with the first and second external electrodes (331, 332), and the first and second external electrodes (331, 332) may include a conductive metal and a resin. Accordingly, since the plating layer (341, 342) may not be positioned in the area where the insulating layer (351) is positioned on the outer surface of the first and second external electrodes (331, 332), the prevention of external electrode erosion by the plating solution can be effectively suppressed.

[0349] In one embodiment, the first plating layer (341) is positioned to cover the end of the first external electrode (331) of the insulating layer (351), and the second plating layer (342) may be positioned to cover the end of the second external electrode (332) of the insulating layer (351). Accordingly, the reliability of the stacked electronic component (3000) can be improved by strengthening the bonding strength between the insulating layer (351) and the plating layers (341, 342). Additionally, by forming the insulating layer (351) first before forming the plating layers (341, 342) on the external electrodes (331, 332), the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layer (341, 342) may have a shape that covers the end of the insulating layer (351).

[0350] In one embodiment, the insulating layer 351 is disposed to cover the end of the first plating layer 341 arranged on the first external electrode 331, and the insulating layer 351 may be disposed to cover the end of the second plating layer 342 arranged on the second external electrode 332. Accordingly, the bonding force between the insulating layer 351 and the plating layers 341 and 342 can be enhanced, so that the reliability of the multilayer electronic component 3000 can be improved.

[0352] In one embodiment, the first and second plating layers 341 and 342 may be respectively disposed to extend to partially cover the first and second connection portions 331a and 332a. When the average dimension in the first direction from the first surface 1 to the innermost one of the first and second internal electrodes 121 and 122 that is disposed closest to the first surface 1 is defined as H1, and the average dimension in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 disposed on the first and second connection portions 131a and 132a is defined as H2, H1>H2 can be satisfied. Accordingly, penetration of the plating solution into the internal electrodes during the plating process can be suppressed, so that reliability can be improved.

[0354] In one embodiment, when the average dimension in the first direction from the first surface to the one of the first and second internal electrodes 121 and 122 that is disposed closest to the first surface is defined as H1, and the average dimension in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is defined as H2, H1<H2 can be satisfied. Accordingly, the area in contact with solder during mounting can be increased, so that the bonding strength can be improved. More preferably, when the average dimension of the body 110 in the first direction is defined as T, H2<T / 2 can be satisfied. That is, H1<H2<T / 2 can be satisfied. This is because if H2 is T / 2 or more, there is a concern that the effect of improving moisture resistance reliability by the insulating layer may be reduced.

[0356] In one embodiment, the first and second plating layers (341, 342) may be positioned below the extension line of the first surface. Accordingly, the height of the solder can be minimized during mounting and the mounting space can be minimized. Additionally, the insulating layer (351) may be positioned to extend below the extension line of the first surface and be in contact with the first and second plating layers (341, 342).

[0358] In one embodiment, when the second direction average size of the body is L, the second direction average size from the extension line of the third surface to the end of the first band portion is B1, and the second direction average size from the extension line of the fourth surface to the end of the second band portion is B2, then 0.2≤B1 / L≤0.4 and 0.2≤B2 / L≤0.4 can be satisfied.

[0359] If B1 / L and B2 / L are less than 0.2, it may be difficult to secure sufficient adhesion strength. On the other hand, if B2 / L is greater than 0.4, there is a risk that leakage current may occur between the first band portion (331b) and the second band portion (332b) under high voltage current, and there is a risk that the first band portion (331b) and the second band portion (332b) may become electrically connected due to plating bleeding during the plating process.

[0361] In one embodiment, an additional insulating layer may be further included that is disposed on the first surface and disposed between the first band portion (331b) and the second band portion (332b). Accordingly, leakage current, etc., that may occur between the first band electrode (331b) and the second band electrode (332b) under high voltage current can be prevented.

[0362] There is no need to specifically limit the type of additional insulating layer. For example, the additional insulating layer may include a silicone-based resin, similar to the insulating layer (351). However, there is no need to limit the additional insulating layer and the insulating layer (351) to the same material, and they may be formed from different materials. For example, they may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or they may include glass.

[0364] In one embodiment, when the second direction average size from the extension line of the third surface to the end of the first band portion is denoted as B1 and the second direction average size from the extension line of the fourth surface to the end of the second band portion is denoted as B2, B3 <B1 및 B4<B2를 만족할 수 있다. 제1 밴드부(331b)의 평균 길이(B1)가 제1 코너부 (331c)의 평균 길이(B3)보다 길 수 있으며, 제2 밴드부(332b)의 평균 길이가 제2 코너부(332)의 평균 길이(B4)보다 길 수 있다. 이에 따라, 실장시 솔더와 접하는 면적을 증가시켜 고착 강도를 향상시킬 수 있다.

[0365] More specifically, when the second direction average size from the extension line of the third surface (3) to the end of the first band portion (331b) is denoted as B1, the second direction average size from the extension line of the fourth surface (4) to the end of the second band portion (332b) is denoted as B2, the second direction average size from the extension line of the third surface (3) to the end of the first corner portion (331c) is denoted as B3, and the second direction average size from the extension line of the fourth surface (4) to the end of the second corner portion (332c) is denoted as B4, B3 <B1 및 B4<B2를 만족할 수 있다.

[0367] In one embodiment, the average thickness of the first and second plating layers (341, 342) may be thinner than the average thickness of the insulating layer (351).

[0368] The insulating layer (351) serves to prevent external moisture penetration or the penetration of plating solution, but its weak connectivity with the plating layer (341, 342) can cause delamination of the plating layer. When the plating layer is delaminated, the adhesion strength with the substrate may decrease. Here, delamination of the plating layer may mean that the plating layer is partially detached or physically separated from the external electrode (331, 332). Because the connectivity between the plating layer and the insulating layer is weak, there is a higher possibility that a gap will open at the interface between the insulating layer and the plating layer or that foreign substances will penetrate, and it may become vulnerable to external impacts, thereby increasing the likelihood of delamination.

[0369] According to one embodiment of the present invention, the average thickness of the plating layer can be made thinner than the average thickness of the insulating layer to reduce the contact area between the plating layer and the insulating layer, thereby suppressing the occurrence of delamination and improving the adhesion strength of the stacked electronic component (3000).

[0371] The size of the stacked electronic component (3000) does not need to be specifically limited.

[0372] However, in order to achieve both miniaturization and high capacity simultaneously, the thickness of the dielectric layer and internal electrode must be reduced to increase the number of layers, so the reliability and capacity improvement effects per unit volume according to the present invention can be more pronounced in a stacked electronic component (3000) having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0373] Accordingly, considering manufacturing error, external electrode size, etc., if the length of the stacked electronic component (3000) is 1.1 mm or less and the width is 0.55 mm or less, the reliability improvement effect according to the present invention may be more pronounced. Here, the length of the stacked electronic component (3000) refers to the maximum size in the second direction of the stacked electronic component (3000), and the width of the stacked electronic component (3000) may refer to the maximum size in the third direction of the stacked electronic component (3000).

[0375] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the aforementioned embodiments and accompanying drawings, but is intended to be limited by the appended claims. Accordingly, various substitutions, modifications, and changes may be made by those skilled in the art within the scope of the technical concept of the present invention as described in the claims, and such are also to be considered to fall within the scope of the present invention.

[0377] Furthermore, the expression "one embodiment" as used in this disclosure does not imply identical embodiments, but is provided to emphasize distinct features of each. However, the presented one embodiment does not exclude implementation in combination with features of other one embodiments. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it may be understood as a description related to another one embodiment, provided that there is no description in another one embodiment that contradicts or conflicts with such matter.

[0378] The terms used in this disclosure are used merely to describe one embodiment and are not intended to limit this disclosure. Whereby, singular expressions include plural expressions unless the context clearly indicates otherwise. Explanation of the symbols

[0380] 1000, 2000, 3000: Stacked electronic components 1100: Mounting board for stacked electronic components 110: Body 111: Genome layer 112, 113: Cover section 114, 115: Margin 121, 122: Internal electrodes 131, 231, 331: First external electrode 132, 232, 332: Second external electrode 134, 135: Additional electrode layer 141, 142, 241, 242, 341, 342: Plating layer 151, 251, 252, 253, 351: Insulating layer 161, 261: Additional insulation layer 180: Substrate 181, 182: Electrode pads 191, 192: Solder

Claims

Claim 1 A body comprising a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, and comprising first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first external electrode comprising a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface; a second external electrode comprising a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; and an insulating layer comprising a first insulating layer disposed on the first connection portion to be in contact with the first connection portion and a second insulating layer disposed on the second connection portion to be in contact with the second connection portion. A stacked electronic component comprising: a plating layer including a first plating layer disposed on the first band portion and extending to an end near the first surface of the first insulating layer, and a second plating layer disposed on the second band portion and extending to an end near the first surface of the second insulating layer; wherein the insulating layer comprises a silicon-based resin, and the silicon-based resin comprises a siloxane bond formed by the bonding of silicon (Si) atoms and oxygen (O) atoms. Claim 2 delete Claim 3 In claim 1, the silicone-based resin is a laminated electronic component containing a methyl group (-CH3). Claim 4 A stacked electronic component according to claim 1, wherein the insulating layer further comprises one or more selected from TiO2, BaTiO3, Al2O3, SiO2, and BaO. Claim 5 A stacked electronic component according to claim 1, wherein H1 is the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes, and H2 is the average size in the first direction from the extension line of the first surface to the end of the plating layer disposed on the first and second connection portions, satisfying H1 > H2. Claim 6 In claim 1, when H1 is the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes, and H2 is the average size in the first direction from the extension line of the first surface to the end of the plating layer disposed on the first and second connection portions, H1 <H2를 만족하는 적층형 전자 부품. Claim 7 In paragraph 6, when the average size of the first direction of the above body is denoted as T, H2 <T / 2를 만족하는 적층형 전자 부품. Claim 8 A stacked electronic component according to claim 1, wherein the first and second plating layers are arranged below the extension line of the first surface. Claim 9 A stacked electronic component according to claim 1, wherein L is the average size in the second direction of the body, B1 is the average size in the second direction from the extension line of the third surface to the end of the first band portion, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion, satisfying 0.2≤B1 / L≤0.4 and 0.2≤B2 / L≤0.

4. Claim 10 A laminated electronic component according to claim 1, further comprising an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion. Claim 11 A stacked electronic component according to claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less. Claim 12 A stacked electronic component according to claim 1, wherein the average thickness of the first and second internal electrodes is each 0.35 μm or less. Claim 13 A stacked electronic component according to claim 1, comprising a capacitance forming portion including first and second internal electrodes alternately arranged with the dielectric layer in between, and a cover portion disposed on both ends of the first direction of the capacitance forming portion, wherein the average size of the cover portion in the first direction is 15 μm or less. Claim 14 A stacked electronic component according to claim 1, wherein the average thickness of the first and second plating layers is thinner than the average thickness of the region disposed on the first and second connection portions of the insulating layer. Claim 15 A stacked electronic component according to claim 1, wherein the first plating layer is arranged to cover an end near the first surface of the first insulating layer, and the second plating layer is arranged to cover an end near the first surface of the second insulating layer. Claim 16 A stacked electronic component according to claim 1, wherein the first insulating layer is disposed to cover the end disposed on the first external electrode of the first plating layer, and the second insulating layer is disposed to cover the end disposed on the second external electrode of the second plating layer. Claim 17 A stacked electronic component according to claim 1, wherein the first external electrode includes a first side band portion extending from the first connection portion to a part of the fifth and sixth surfaces, and the second external electrode includes a second side band portion extending from the second connection portion to a part of the fifth and sixth surfaces, and the second direction size of the first and second side band portions increases as it approaches the first surface. Claim 18 In claim 1, the first and second external electrodes are spaced apart from the fifth and sixth surfaces and are a stacked electronic component. Claim 19 In claim 1, the first and second external electrodes are arranged spaced apart from the second surface and are a stacked electronic component. Claim 20 A stacked electronic component according to claim 1, wherein the first and second insulating layers extend to the second surface and are connected to each other. Claim 21 A stacked electronic component according to claim 1, wherein the first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other. Claim 22 In claim 1, the insulating layer is not disposed on the second, fifth, and sixth surfaces of the laminated electronic component. Claim 23 A stacked electronic component according to claim 1, wherein the first external electrode includes a third band portion extending from the first connection portion to a part of the second surface, and the second external electrode includes a fourth band portion extending from the second connection portion to a part of the second surface. Claim 24 A stacked electronic component according to claim 1, wherein the body includes a 1-3 corner connecting the first surface and the third surface, a 1-4 corner connecting the first surface and the fourth surface, a 2-3 corner connecting the second surface and the third surface, and a 2-4 corner connecting the second surface and the fourth surface, wherein the 1-3 corner and the 2-3 corner have a shape that contracts toward the center of the first direction of the body as they approach the third surface, and the 1-4 corner and the 2-4 corner have a shape that contracts toward the center of the first direction of the body as they approach the fourth surface, and the first external electrode includes a first corner portion that extends from the first connection portion onto the 1-3 corner and the 2-3 corner, and the second external electrode includes a second corner portion that extends from the second connection portion onto the 1-4 corner and the 2-4 corner. Claim 25 A stacked electronic component according to claim 24, wherein B3 is the second direction average size from the extension line of the third surface to the end of the first corner portion, B4 is the second direction average size from the extension line of the fourth surface to the end of the second corner portion, G1 is the second direction average size of the area separated from the third surface and the second internal electrode, and G2 is the second direction average size of the area separated from the fourth surface and the first internal electrode, satisfying B3≤G1 and B4≤G2. Claim 26 A stacked electronic component according to claim 1, wherein the first external electrode comprises a first connecting electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connecting electrode, and the second external electrode comprises a second connecting electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connecting electrode. Claim 27 A stacked electronic component according to claim 26, wherein the first external electrode further comprises a third band electrode disposed on the second surface and connected to the first connecting electrode, and the second external electrode further comprises a fourth band electrode disposed on the second surface and connected to the second connecting electrode.

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