Substrate separation and transport apparatus

Abstract

A substrate separation and transfer device is disclosed. A substrate separation and transfer device according to one embodiment of the present invention may include: a support mechanism capable of stacking and supporting a plurality of substrates; a guide pin provided on the support mechanism, supporting a side of the substrate and guiding the positional movement of the substrate in a first direction; and a transfer mechanism positioned opposite to the upper part of the support mechanism and moving a substrate placed at the top of the substrates to a conveyor.

Description

Technology Field

[0001] The present invention relates to substrate processing technology, and more specifically, to a substrate separation and transfer device. Background Technology

[0003] Various processes are performed on the substrate, such as depositing thin films or etching deposited films to form circuit patterns on the substrate. To increase productivity, the process is carried out in units of several to tens of substrates. Prior to the process, individual substrates are provided using a substrate transfer device, which allows an operator to manually place individual substrates onto a conveyor that provides a fixed path or to pick up and transport the substrates individually.

[0004] To save space and improve process efficiency, substrates are stacked vertically, and then sequentially lifted and separated starting from the topmost substrate. However, there was a problem where the topmost substrate, along with the adjacent lower substrate, was lifted together due to causes such as electrostatic forces between the substrates, or where substrate damage occurred during the lifting process due to adhesive forces with the lower substrate.

[0005] Korean Published Patent No. 10-2016-0001603 (Publication Date: January 6, 2016) discloses a method in which compressed air is concentrated and sprayed from a nozzle at a position adjacent to the substrate to release the adhesion between the substrates when the substrate is sucked up and raised by an adsorption pad, but the individual substrate sheets are not smoothly separated from the substrates adhered by the compressed air and still cause difficulties in substrate transport, such as substrate damage during the substrate transport process. Prior art literature

[0007] Korean Patent Publication No. 10-2016-0001603 (Date of publication: January 6, 2016) The problem to be solved

[0008] The technical problem that the present invention aims to solve is a substrate separation and transfer device capable of separating and transferring individual substrate sheets from a plurality of stacked substrates without damage. means of solving the problem

[0010] To solve the above technical problem, the present invention provides a substrate separation and transfer device.

[0011] A substrate separation and transfer device according to one embodiment of the present invention may include: a support mechanism capable of stacking and supporting a plurality of substrates; a guide pin provided on the support mechanism, supporting the side of the substrate and guiding the positional movement of the substrate in a first direction; and a transfer mechanism positioned opposite to the upper part of the support mechanism and moving the substrate placed at the top of the substrates to a conveyor.

[0012] According to one embodiment, the support mechanism may include a friction force applying member capable of providing friction force between the upper and lower stacked substrates.

[0013] According to one embodiment, the position compensation mechanism may be further included, which is capable of moving in the first direction and extends to the end of the support mechanism.

[0014] According to one embodiment, the transfer mechanism may include: a picker capable of adsorbing one surface of the substrate; a lifting / lowering mechanism extending from the end of the picker and capable of moving in the first direction; and a horizontal movement mechanism extending from the end of the lifting / lowering mechanism and capable of moving in the second direction orthogonal to the first direction.

[0015] According to one embodiment, the pickers are provided as a pair spaced apart in a third direction orthogonal to the first direction and the second direction, and the pair of pickers can move in synchronization with each other.

[0016] According to one embodiment, the lifting and lowering mechanism can move the picker in a first section path, and the position compensation mechanism can move the substrate in a second section path different from the first section path.

[0017] According to one embodiment, the end of the first section path has a first height, the end of the second section path has a second height, and the first height may be spaced apart from the second height by the thickness of the substrate.

[0018] According to one embodiment, the position compensation mechanism may include a position sensing sensor located on the second height and capable of detecting whether one surface of a substrate placed on the top is located at the second height.

[0019] According to one embodiment, the support mechanism may include a base plate having at least one side grip groove formed on its side; and a support plate disposed on the base plate and having a substrate mounting surface on which the substrate is mounted.

[0020] According to one embodiment, the support mechanism may further include a support block provided on the support mechanism and capable of supporting the end of the guide pin.

[0021] According to one embodiment, the support block may include a fixed support block having a gap hole formed in the shape of an elongated slot facing the substrate.

[0022] According to one embodiment, the support block includes a rotational support block having a rotational reference hole formed therein into which a rotational shaft can be inserted and coupled, and the rotational support block can rotate around the rotational shaft as an axis to move the guide pin to a different position.

[0023] According to one embodiment, the guide pin is movable in a third section path, and a first hole and a second hole are formed in the base plate, and a fixing member is optionally inserted into the first hole and the second hole to fix the position of the guide pin. Effects of the invention

[0025] According to an embodiment of the present invention, by providing a friction force applying member, the adsorption force between substrates caused by static electricity between a plurality of stacked substrates is offset, thereby providing the advantage of easily separating the uppermost substrate sheet.

[0026] According to one embodiment of the present invention, by including a position compensation mechanism that moves the support mechanism, the position of the substrate placed on the uppermost part of the support mechanism can be compensated to a certain height, and the movement of the transfer mechanism is shortened to simplify the movement path while increasing the accuracy of the process.

[0027] According to another embodiment of the present invention, as the transfer mechanism and the position compensation mechanism operate simultaneously, there is an advantage in that the operating speed of transporting the substrate from the support mechanism can be increased.

[0028] According to another embodiment of the present invention, the first section path and the second section path do not overlap with each other in the first direction, and the behavior of the transfer mechanism in the first direction can be implemented with less due to the position compensation mechanism, thus providing the advantage of being able to integrate the facility area of ​​the substrate separation transfer device itself.

[0029] According to another embodiment of the present invention, by rotating the rotary support block around a rotary shaft as an axis and varying the position of some guide pins, the degree of freedom of movement of the substrate is increased, thereby providing the advantage that an operator can easily place the substrate on the support mechanism.

[0030] According to another embodiment of the present invention, by providing a first section path in which a picker moves and a second section path in which a support mechanism moves separately from each other, the adsorption position of the substrate placed at the top is maintained constant despite changes in the number of stacked substrates, thereby providing the advantage of improving the transfer yield by stably separating and transferring only the substrate placed at the top among a plurality of substrates. Brief explanation of the drawing

[0031] FIG. 1 is a perspective view schematically showing a substrate separation and transfer device according to one embodiment of the present invention. FIG. 2 is a planar perspective view schematically showing a support mechanism, a guide pin, and a friction force applying member according to one embodiment of the present invention. FIG. 3 is a perspective view schematically showing a position sensing sensor according to one embodiment of the present invention. FIG. 4 is a rear perspective view schematically showing a support mechanism and a friction force applying member according to one embodiment of the present invention. FIGS. 5(a) and FIGS. 5(b) are schematic drawings showing a support mechanism according to one embodiment of the present invention. FIGS. 6(a) to 6(d) are drawings for explaining the operation of a support mechanism and a guide pin before and after according to an embodiment of the present invention. FIG. 7 is a perspective view schematically showing a transfer mechanism according to one embodiment of the present invention. FIGS. 8(a) and FIGS. 8(b) are drawings for explaining a first section path and a first height according to an embodiment of the present invention. FIG. 9 is a perspective view schematically showing a support mechanism, a guide pin, a friction force applying member, and a position compensation mechanism according to one embodiment of the present invention. FIG. 10 is a left side view schematically showing a position compensation mechanism according to one embodiment of the present invention. FIGS. 11(a) and FIGS. 11(b) are drawings for explaining a second section path and a second height according to an embodiment of the present invention. FIGS. 12(a) and FIGS. 12(b) are drawings for explaining a first height and a second height according to an embodiment of the present invention. FIG. 13(a) is an enlarged view of area A in FIG. 12(a), and FIG. 13(b) is an enlarged view of area B in FIG. 12(b). Specific details for implementing the invention

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical concept of the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed content is thorough and complete and to ensure that the concept of the present invention is sufficiently conveyed to a person skilled in the art.

[0033] In this specification, when a component is described as being on another component, it means that it may be formed directly on the other component or that a third component may be interposed between them. Additionally, in the drawings, shapes and sizes are exaggerated for the effective description of the technical content.

[0034] Additionally, although terms such as first, second, third, etc., have been used to describe various components in the various embodiments of this specification, these components should not be limited by such terms. These terms are used merely to distinguish one component from another. Accordingly, what is referred to as the first component in one embodiment may be referred to as the second component in another embodiment. Each embodiment described and illustrated herein also includes its complementary embodiment. Furthermore, in this specification, "and / or" is used to mean including at least one of the components listed before and after it.

[0035] In the specification, singular expressions include plural expressions unless the context clearly indicates otherwise. Furthermore, terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, components, or combinations thereof described in the specification, and should not be understood as excluding the existence or addition of one or more other features, numbers, steps, components, or combinations thereof. Additionally, in this specification, "connection" is used to include both indirectly connecting multiple components and directly connecting them.

[0036] In addition, in describing the present invention below, if it is determined that a detailed description of related known functions or configurations could unnecessarily obscure the essence of the invention, such detailed description will be omitted.

[0038] For the sake of convenience of explanation, the first direction refers to the Z-axis of the Cartesian coordinate system, the second direction refers to the X-axis of the Cartesian coordinate system, and the third direction refers to the Y-axis of the Cartesian coordinate system. In this case, the first, second, and third directions are orthogonal to each other.

[0040] FIG. 1 is a perspective view schematically showing a substrate separation transfer device according to an embodiment of the present invention; FIG. 2 is a planar perspective view schematically showing a support mechanism, a guide pin, and a friction force applying member according to an embodiment of the present invention; FIG. 3 is a perspective view schematically showing a position sensing sensor according to an embodiment of the present invention; FIG. 4 is a rear perspective view schematically showing a support mechanism and a friction force applying member according to an embodiment of the present invention; FIG. 5(a) and FIG. 5(b) are drawings schematically showing a support mechanism according to an embodiment of the present invention; FIG. 6(a) to FIG. 6(d) are drawings for explaining the operation before and after of a support mechanism and a guide pin according to an embodiment of the present invention; FIG. 7 is a perspective view schematically showing a transfer mechanism according to an embodiment of the present invention; FIG. 8(a) and FIG. 8(b) are drawings for explaining a first section path and a first height according to an embodiment of the present invention; FIG. 9 is a perspective view schematically showing a support mechanism, a guide pin, a friction force applying member, and a position compensation mechanism according to an embodiment of the present invention. FIG. 10 is a left side view schematically showing a position compensation mechanism according to an embodiment of the present invention, FIG. 11(a) and FIG. 11(b) are drawings for explaining a second section path and a first height according to an embodiment of the present invention, FIG. 12(a) and FIG. 12(b) are drawings for explaining a first height and a second height according to an embodiment of the present invention, FIG. 13(a) is an enlarged view of area A in FIG. 12(a), and FIG. 13(b) is an enlarged view of area B in FIG. 12(b).

[0042] Hereinafter, the configuration and operation relationship of a substrate separation and transfer device (10) according to one embodiment of the present invention will be examined with reference to FIGS. 1 to 14.

[0044] Referring to FIGS. 1 to 14, the substrate separation and transfer device (10) can separate and transfer substrates (S) in individual sheets from a plurality of stacked substrates (S). More specifically, the substrate separation device (10) can transfer substrates (S) brought into a manufacturing facility (not shown) to a conveyor (600) for a series of substrate processing.

[0045] The substrate separation transfer device (10) includes a support mechanism (100), a guide pin (200), and a conveying mechanism (300), and further may include a friction force applying member (400) and a position compensation mechanism (500).

[0047] Referring again to FIGS. 1 to 5 and FIG. 9, the support mechanism (100) can support a plurality of substrates (S) stacked together. The support mechanism (100) may be an area where a thin-film substrate (S) is introduced from the outside.

[0049] The support mechanism (100) includes a base plate (110) and a support plate (120), and may further include support blocks (131, 132).

[0050] A side grip groove (111) may be formed on the side of the base plate (110) according to one embodiment. A hole (112) may be formed in the base plate (110) according to one embodiment. A first hole (113a) and a second hole (113b) may be formed in the base plate (110) according to one embodiment.

[0052] At least one side grip groove (111) may be formed on the base plate (110). The side grip groove (111) may be formed to minimize interference with the support mechanism (100) and improve the worker's work efficiency during the process of the worker loading the substrate (S) onto the support mechanism (100). According to one embodiment, one side grip groove (111) may be formed on each side of the square plate-shaped base plate (110).

[0053] A hole (112) may be formed to combine the base plate (110) with a fixed support block (131) to be described later. A fixing member (134) may be inserted and coupled into the hole (112).

[0055] A support plate (120) may be placed on a base plate (110). A substrate (S) may be supported on the support plate (120). The support plate (120) may include a substrate mounting surface (121) on which the substrate (S) is mounted.

[0057] The support blocks (131, 132, 133) can support the guide pin (200) described later and the friction force applying member described later on the base plate (110).

[0058] The support blocks (131, 132) can support the ends of the guide pin (200).

[0059] The support blocks (131, 132) may include a fixed support block (131). The support blocks (131, 132) may include a rotatable support block (132).

[0061] A gap hole (131a) may be formed in the fixed support block (131). The gap hole (131a) may be a true elongated hole shape having a length in the direction facing the substrate (S).

[0062] Two gap holes (131a) can be formed side by side in the fixed support block (131) in a direction orthogonal to the direction facing the substrate (S).

[0063] A portion of the clearance hole (131a) may face the hole (112) of the base plate (110) in a first direction. A fixing member (134) may be inserted and coupled into the clearance hole (131a) and the hole (112).

[0065] In the rotational support block (132), a rotational reference hole (132a) and a position fixing hole (132b) may be formed. At least two position fixing holes (132b) may be formed in the rotational support block (132).

[0066] The rotation reference hole (132a) may be opposite to the rotation reference hole (113a) of the base plate (110) in a first direction. The rotation reference hole (132a) and the rotation reference hole (113a) may be inserted and coupled to the rotation shaft (135).

[0067] The rotational support block (132) can rotate around the rotational shaft (135) as an axis. The guide pin (200) can be repositioned by the rotation of the rotational support block (132). Some of the guide pins (200) that were supported on all sides of the substrate (S) may have their positions changed by the rotation of the rotational support block (132) as an axis.

[0068] The guide pin (200), which can be moved by the rotational support block (132), may be two guide pins (200) facing one side of the substrate (S). The degree of freedom of movement of the substrate (S) can be increased in the direction in which a part of the guide pin (200) is moved.

[0070] FIGS. 6(a) and FIGS. 6(b) are drawings for explaining the order of operation of the rotating fixed block (132) and the guide pin (200), and FIGS. 6(c) and FIGS. 6(d) correspond to FIGS. 5(a) and FIGS. 5(b), respectively, and are drawings for explaining the position of the hole where the fixed member (134) is inserted and coupled at each position.

[0071] The guide pin (200) can be moved to a third section path (R3). As illustrated in FIG. 5(c) and FIG. 5(d), the guide pin (200) can be fixed in position at a first position and a second position on the third section path (R3).

[0072] More specifically, as shown in FIGS. 6(a) and 6(b), as the rotational support block (132) rotates, the position of the guide pin (200) may change. As shown in FIGS. 6(c) and 6(d), as the rotational support block (132) rotates about the rotation shaft (135), the position of the position fixing hole (132b) of the rotational support block (132) may change, and the position of connection with the base plate (110) may change.

[0073] By selectively inserting and coupling the fixing member (134) into the first hole (113a) and the second hole (113b), the position of the guide pin (200) can be fixed at a different position.

[0074] Referring to FIG. 6(c), the position fixing hole (132b) of the rotational support block (132) faces the first hole (113a) of the base plate (110), and a fixing member (134) is inserted and coupled to the first hole (113a) and the position fixing hole (132b) to fix the guide pin (200) in the first position. Referring to FIG. 6(d), the position fixing hole (132b) of the rotational support block (132) faces the second hole (113b) of the base plate (110), and a fixing member (134) is inserted and coupled to the second hole (113b) and the position fixing hole (132b) to fix the guide pin (200) in the second position.

[0075] As illustrated in FIGS. 6(a) and 6(c), when the guide pin (200) is positioned in a first position, the guide pin (200) can guide the positional movement of the substrate (S) in a first direction while supporting the side of the substrate (S). As illustrated in FIGS. 6(b) and 6(d), when the guide pin (200) is positioned in a second position, the positional freedom of the substrate (S) increases in a second direction other than the first direction, so that the substrate (S) can be brought into the support mechanism (100) in a second direction.

[0077] The support block (133) can support the end of the friction force applying member (400).

[0079] Referring again to FIGS. 1, 2, 7, and 9, a guide pin (200) may be provided in a support mechanism (100). The guide pin (200) may guide the positional movement of a substrate (S) that is brought into or taken out of the support mechanism (100). A plurality of guide pins (200) may be spaced apart from each other on the upper surface of the support mechanism (100). More specifically, at least two guide pins (200) may be spaced apart from each other on each side of the substrate (S). The guide pin (200) supports one side of the substrate (S) and may guide the positional movement of the substrate (S) in a first direction.

[0080] According to one embodiment, two guide pins (200) may be spaced apart and arranged on each of the four sides of a square plate-shaped substrate (S).

[0081] According to one embodiment, a plurality of guide pins (200) may be provided to face the corners of a substrate (S) having a plurality of faces. The distance between two guide pins (200) located on different adjacent sides may be relatively closer than the distance between two guide pins (200) located on the side of the substrate (S). To minimize the misalignment of the stacked substrates (S), the side of the substrate (S) may be supported at a position close to the corner of the substrate.

[0082] According to one embodiment, the guide pin (200) may be in the form of a round bar having a certain length. The guide pin (200) in the form of a round bar may have a contact area with the substrate (S) minimized so as to make point contact or line contact on the side of the substrate (S). An inclined surface may be formed on the upper side of the guide pin (200). By forming an inclined surface on the guide pin (200), interference is minimized when the substrate (S) is moved from the support mechanism (100), and the positional movement of the substrate (S) can be easily guided.

[0083] According to one embodiment, the guide pin (200) may be made of a conductive material. The guide pin (200) may be made of a conductive metal material so as to eliminate static electricity between a plurality of stacked substrates (S).

[0085] Referring again to FIG. 1 and FIG. 7, the transfer mechanism (300) can transfer a substrate (S) from the support mechanism (100). More specifically, the return mechanism (300) can transfer the substrate (S) from the support mechanism (100) to the conveyor (600).

[0086] The transfer mechanism (300) may be provided to face the upper part of the support mechanism (100). The transfer mechanism (300) may move the substrate (S1) positioned at the top among the plurality of substrates (S) to the conveyor (600).

[0087] The transfer mechanism (300) may include a picker (310), a lifting / lowering mechanism (320), and a horizontal movement mechanism (not shown).

[0089] A picker (310) can adsorb one side of a substrate (S). A picker (310) can adsorb one area of ​​a substrate (S) with a vacuum pressure lower than atmospheric pressure. A plurality of pickers (310) may be spaced apart to adsorb individual substrates (S). According to one embodiment, four pickers (310) may be spaced apart from each other to correspond to the size of the substrate (S) and adsorb the upper edge surface of the substrate (S).

[0090] A bellows may be formed at the end joint of the picker (310). At the moment the picker (310) adsorbs or releases the substrate (S) due to a pressure difference, the shape of the picker (310) changes flexibly, thereby providing a gap between the substrates (S) and providing a stable adsorption force on the substrate (S).

[0091] Pickers (310) can be spaced apart in the third direction to form a pair of multiple pickers.

[0092] A pair of pickers (310) can move in synchronization with each other. A substrate (S) is supported on a pair of support plates (120) spaced apart in a third direction and can be transported simultaneously by a pair of pickers (310).

[0094] The lifting / lowering mechanism (320) can be moved in a first direction. The lifting / lowering mechanism (320) can be extended and provided at the end of the picker (310). The lifting / lowering mechanism (320) can move the picker (310) in a first section path (R1).

[0095] Referring again to FIG. 8(a) and FIG. 8(b), the picker (310) may have a constant height for ascending or descending along the first section path (R1). The end of the first section path (R1) may have a first height (H1). At the first height (H1), the picker (310) may adsorb the substrate (S) before transporting it.

[0097] The horizontal movement mechanism (not shown) can be positioned in a second direction. The horizontal movement mechanism (not shown) can be extended and provided at the end of the lifting / lowering mechanism (320). The horizontal movement mechanism (not shown) can move the picker (310) in a horizontal direction between the support mechanism (100) and the conveyor (600) and move the substrate (S) to a position.

[0099] Referring again to FIGS. 1, FIGS. 2, FIGS. 4, and FIGS. 9, the frictional force applying member (400) can provide frictional force between a plurality of stacked substrates (S). More specifically, the frictional force applying member (400) can offset the adsorption force between substrates (S) caused by static electricity between the plurality of substrates (S) by making surface contact with one side of the stacked substrates (S).

[0100] A friction force applying member (400) may be provided in the support mechanism (100). As shown in FIG. 2, the friction force applying member (400) may be provided in the support mechanism (100) so as to be interposed between two guide pins (200).

[0101] According to one embodiment, the end of the friction force applying member (400) may have a brush shape. The friction force applying member (400) provides friction to the substrates (S) by forming a space between the substrates (S) and separating the substrates (S) that are in close contact with each other by making surface contact between the upper and lower layers of the stacked substrates (S) with a brush arranged in a direction toward the substrate (S).

[0102] The adsorption process of the substrate (S1) placed at the top by the transfer mechanism (300), particularly the picker (310), and the process of applying frictional force to the lower substrate (S) in surface contact with the substrate (S1) placed at the top by the frictional force applying member (400) can be performed continuously or simultaneously.

[0104] Referring again to FIGS. 1, 9, and 10, the position compensation mechanism (500) can move the support mechanism (100) in a first direction. More specifically, the position compensation mechanism (500) can compensate the position so that the substrate (S1) placed at the top of the plurality of substrates (S) is positioned at a certain height, that is, at a set adsorption height, as the support mechanism (100) in which a plurality of substrates (S) are stacked moves up and down in the first direction.

[0105] The position compensation mechanism (500) can be positioned in a first direction. The position compensation mechanism (500) can be extended at the end of the support mechanism (100) by moving the support mechanism (100) in the first direction. The position compensation mechanism (500) can move the substrate (S) along a second section path (R2).

[0106] As illustrated in FIGS. 11(a) and FIGS. 11(b), the substrate (S) can move up and down along a second section path (R2) while supported by a support mechanism (100). The second section path (R2) may provide a different section path from the first section path (R1). The second section path (R2) may be extended along the first direction in the same way as the first section path (R1), but may be formed spaced apart from the first section path (R1) in the horizontal direction. Accordingly, the second section path (R2) may provide a separate movement path that does not overlap with the first section path (R1) in the horizontal direction. By placing the first section path (R1) in which the picker (310) moves and the second section path (R2) in which the support mechanism (100) moves at different spatial locations, the lifting operation of the support mechanism (100) can be performed without interfering with the lifting operation of the picker (310).

[0107] The end of the second section path (R2) may have a second height (H2). At the second height (H2), the substrate (S) may be adsorbed by the picker (310). When a plurality of stacked substrates (S) are adsorbed by the picker (310), the position compensation mechanism (500) may compensate for the position of the support mechanism (100) including the supported substrate (S) so that they can be positioned at the second height (H2). Even if the number of stacked substrates (S) changes, the position compensation mechanism (500) may compensate by moving the support mechanism (100) up and down so that the substrate (S1) placed at the top always remains at the second height (H2).

[0108] Referring to FIG. 11(a), a substrate (S1) placed at the top of a plurality of substrates (S), and referring to FIG. 11(b), a plurality of substrates (S) stacked on a support mechanism (100) are sequentially transferred, and then the substrate (S) supported by the support mechanism (100) has a second height (H2) by a position compensation mechanism (500) and can be moved by a transfer mechanism (300).

[0109] Referring again to FIG. 13(a) and FIG. 13(b), the first height (H1) can be spaced apart from the second height (H2) by a value corresponding to the thickness of the substrate (S). The height difference between the first height (H1) and the second height (H2) can be set to a value corresponding to the thickness of the substrate (S) so that the picker (310) selectively adsorbs only the substrate (S1) placed at the top.

[0111] The position compensation mechanism (500) includes a lifting / lowering mechanism (510), a position detection sensor (520a, 520b), and a stopper (530a, 530b), and further may include a substrate detection sensor (540).

[0112] The lifting / lowering mechanism (510) may include a motor (511), a screw (512), an LM rail (513), an LM guide (514), and a bracket (515).

[0113] The motor (511) can provide power.

[0114] The screw (512) can rotate by receiving power from the motor (511).

[0115] The LM rail (513) can provide a positional movement path for the support mechanism (100).

[0116] The LM guide (514) can slide and translate along the LM rail (513) in a first direction. One end of the LM guide (514) can be connected to slide on the screw (512). The LM guide (514) can slide and translate along the LM rail (513) in a first direction by the rotation of the screw (512).

[0117] One end of the bracket (515) is connected to the LM guide (514), and the other end of the bracket (515) can be connected to the support mechanism (100). The bracket (515) moves in position together with the LM guide (514) and can move the support mechanism (100) in a first direction.

[0119] The upper and lower limit sensors (520a, 520b) can detect the upper and lower limit position movement of the LM guide (514) according to the position of the upper and lowering mechanism (510) when the position of the upper and lowering mechanism (510) moves in the first direction.

[0121] The stoppers (530a, 530b) can provide an upper and lower height limit of the second section path (R2) relative to the first substrate (S) when the position of the lifting / lowering mechanism (510) is moved in the first direction. The stoppers (530a, 530b) can be provided at both ends of the LM rail (513). The positional movement of the LM guide (514) can be restricted by the stoppers (530a, 530b).

[0123] Referring again to FIG. 11(a) and FIG. 11(b), the position sensing sensor (540) can detect the position of a substrate (S1) placed at the top among a plurality of substrates (S) supported by a support mechanism (100) that moves in a first direction by a position compensation mechanism (500). More specifically, the position sensing sensor (540) can detect whether one side (F1) of the substrate placed at the top, as a substrate (S) supported by the support mechanism (100) in the horizontal direction, is located at a second height (H2).

[0124] The position sensing sensor (540) may be positioned at a second height (H2). The position sensing sensor (540) may be positioned adjacent to the support mechanism (100) but spaced apart in the first and second directions to check the movement of the support mechanism (100) that moves by the lifting / lowering mechanism (510). The position sensing sensor (540) can detect whether the height of one side of the substrate (S1) placed at the top is located at the second height (H2).

[0126] Although the present invention has been described in detail using preferred embodiments, the scope of the invention is not limited to specific embodiments and should be interpreted by the appended claims. Furthermore, those skilled in the art will understand that many modifications and variations are possible without departing from the scope of the invention. Explanation of the symbols

[0128] 10: Substrate separation and transfer device 100: Support mechanism 110: Base plate 111: Side grip groove 112: Hole 113a: Rotation reference hole 113b: First hole 113c: 2nd hole 120: Support plate 121: Substrate mounting surface 131: Fixed support block 131a: Clearance hole 132: Rotating support block 132a: Rotation reference hole 133: Support block 140: Substrate detection sensor 200 : Guide pin 300: Transfer mechanism 310: Picker 320: Lifting / lowering mechanism 330: Horizontal movement mechanism 400 : Friction-applying member 500: Position compensation mechanism 510: Lifting / lowering mechanism 520a, 520b: Upper and lower limit sensors 530a, 530b: Stopper 540: Position detection sensor R1: Section 1 path R2: Section 2 path R3: 3rd section path H1: 1st height H2: 2nd height S: Substrate S1: Substrate placed at the top F1: One side of the substrate

Claims

Claim 1 A substrate separation and transfer device comprising: a support mechanism capable of supporting a plurality of substrates stacked thereon; a guide pin provided on the support mechanism, capable of supporting the side of the substrate and guiding the positional movement of the substrate in a first direction; and a transfer mechanism positioned opposite to the upper part of the support mechanism and positioning the substrate placed at the top of the substrates on a conveyor, wherein the support mechanism comprises: a base plate having at least one side grip groove formed on its side; a support plate disposed on the base plate and having a substrate mounting surface on which the substrate is seated; and a support block provided on the support mechanism and capable of supporting the end of the guide pin, wherein the support block comprises a rotary support block having a rotary reference hole formed therein into which a rotary shaft can be inserted and coupled, and the rotary support block rotates around the rotary shaft as an axis to position the guide pin. Claim 2 A substrate separation and transfer device according to claim 1, comprising a friction force applying member provided in the support mechanism and capable of providing friction force between the upper and lower stacked substrates. Claim 3 A substrate separation and transfer device according to claim 1, further comprising a position compensation mechanism extending from the end of the support mechanism and capable of positional movement in the first direction. Claim 4 In claim 3, the transfer mechanism comprises: a picker capable of adsorbing one surface of the substrate; a lifting / lowering mechanism capable of moving in the first direction and extended at the end of the picker; and a horizontal movement mechanism capable of moving in the second direction orthogonal to the first direction and extended at the end of the lifting / lowering mechanism, forming a substrate separation transfer device. Claim 5 A substrate separation and transfer device according to claim 4, wherein the pickers are spaced apart in a third direction orthogonal to the first direction and the second direction and provided as a pair, and the pair of pickers are capable of moving in synchronization with each other. Claim 6 A substrate separation and transfer device according to claim 4, wherein the lifting and lowering mechanism moves the picker in position along a first section path, and the position compensation mechanism moves the substrate in position along a second section path different from the first section path. Claim 7 A substrate separation and transfer device according to claim 6, wherein the end of the first section path has a first height and the end of the second section path has a second height, and the first height is spaced apart from the second height by the thickness of the substrate. Claim 8 In claim 7, the position compensation mechanism comprises a position sensing sensor positioned on the second height and capable of detecting whether one surface of a substrate placed on the top is positioned on the second height. Claim 9 delete Claim 10 delete Claim 11 A substrate separation and transfer device according to claim 1, wherein the support block comprises a fixed support block having a long slot-shaped clearance hole formed in a direction facing the substrate. Claim 12 delete Claim 13 A substrate separation and transfer device according to claim 1, wherein the guide pin is movable in a third section path, the base plate has a first hole and a second hole formed therein, and a fixing member is optionally inserted into the first hole and the second hole to fix the position of the guide pin.

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