Display panel, manufacturing method of display panel, and electronic device

Abstract

The present invention provides a display panel, a method for manufacturing a display panel, and an electronic device, wherein the display panel comprises a substrate, a wiring layer, an organic layer, and a pixel defining layer, wherein the wiring layer is located on one side of the substrate and the wiring layer includes a first wiring; wherein the organic layer is located on one side of the wiring layer away from the substrate and the organic layer includes an overlap hole that exposes at least a portion of the first wiring; wherein the pixel defining layer is located on one side of the organic layer away from the substrate and the pixel defining layer extends into the overlap hole and covers one side of the organic layer facing the overlap hole, and the portion of the pixel defining layer located within the overlap hole exposes at least a portion of the first wiring. By configuring the pixel defining layer of the overlap hole to cover the side of the organic layer facing the overlap hole, the organic layer is prevented from being exposed in the overlap hole, thereby reducing the risk of water vapor intrusion into the organic layer in the overlap hole and ensuring a subsequent film layer manufacturing yield.

Description

Technology Field

[0001] The present application relates to display technology, specifically to a display panel, a method for manufacturing a display panel, and an electronic device. Background Technology

[0002] With the continuous advancement of display technology, the scope of application for display panels is becoming increasingly extensive, and consumer demand for them is also rising. However, the quality of existing display panels needs to be improved.

[0003] To overcome the above disadvantages of the prior art, the object of the present application is to provide a display panel, wherein the display panel comprises a substrate, a wiring layer, an organic layer, and a pixel defining layer,

[0004] The wiring layer is located on one side of the substrate, and the wiring layer includes a first wiring;

[0005] The organic layer is located on one side of the wiring layer away from the substrate, and the organic layer includes an overlap hole that exposes at least a portion of the first wiring;

[0006] The pixel definition layer is located on one side of the organic layer away from the substrate, and the pixel definition layer extends into the overlap hole and covers the side of the organic layer facing the overlap hole, and the portion located within the overlap hole in the pixel definition layer exposes at least a portion of the first wiring.

[0007] In some possible embodiments, the material of the pixel definition layer includes an inorganic material.

[0008] In some possible embodiments, the display panel further includes an isolation structure located on one side away from the substrate of the organic layer, and the isolation structure extends into the overlap hole and contacts the first wiring.

[0009] In some possible embodiments, the display panel includes a display area, and a pixel definition layer located in the display area includes a pixel opening, and the isolation structure is installed on one side of the pixel definition layer away from the substrate, and the isolation structure located in the display area includes an isolation opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0010] In some possible embodiments, the organic layer comprises a planarization layer;

[0011] Preferably, the display area of ​​the display panel further includes a first electrode, a light-emitting unit, and a second electrode, wherein

[0012] The first electrode is located on one side of the planarization layer away from the substrate, and at least a portion of the first electrode is located within the pixel opening;

[0013] At least a portion of the light-emitting unit is located within the pixel opening and is also located on one side of the first electrode away from the substrate, and the light-emitting unit is in contact with the first electrode;

[0014] At least a portion of the second electrode is located within the pixel opening and is also located on one side away from the substrate of the light-emitting unit, and the second electrode is in contact with the light-emitting unit.

[0015] In some possible embodiments, the second electrode is in contact with the isolation structure.

[0016] The present application also provides a display panel, said display panel comprising a substrate, a wiring layer, an organic layer, a first material layer, and an auxiliary electrode, wherein

[0017] The wiring layer is located on one side of the substrate, and the wiring layer includes a first wiring;

[0018] The organic layer is located on one side of the wiring layer away from the substrate, and the organic layer includes an overlap hole that exposes at least a portion of the first wiring;

[0019] The first material layer covers one side facing the overlap hole of the organic layer and exposes the first wiring; and the absorbency of the first material layer is lower than the absorbency of the organic layer;

[0020] The auxiliary electrode is located on one side of the first material layer away from the substrate and extends into the overlap hole to contact the first wiring.

[0021] In some possible embodiments, the display panel includes a display area and an overlap area located on one side of the display area, and the overlap hole is located in the overlap area.

[0022] In some possible embodiments, the material of the first material layer includes an inorganic material.

[0023] In some possible embodiments, the organic layer further comprises a pixel defining layer located on one side away from the substrate, and the first material layer and the pixel defining layer are installed on the same layer.

[0024] In some possible embodiments, the first material layer and the pixel definition layer have an integrated structure.

[0025] In some possible embodiments, the display panel further comprises an isolation structure and a light-emitting unit, wherein the isolation structure is located on one side away from the substrate of the first material layer and has an isolation opening installed therein; the light-emitting unit is located at the isolation opening; and the isolation structure is used as an auxiliary electrode.

[0026] In some possible embodiments, the isolation structure comprises a first layer, a second layer, and a third layer installed by stacking in a direction away from the substrate; or the isolation structure comprises a second layer and a third layer installed by stacking in a direction away from the substrate.

[0027] In some possible embodiments, the material of the second layer comprises aluminum, and the material of the third layer comprises titanium;

[0028] Preferably, the material of the first layer comprises molybdenum.

[0029] The present application also provides a method for manufacturing a display panel, said method,

[0030] Step of providing a substrate;

[0031] A step of installing a wiring layer on one side of the above substrate, wherein the wiring layer includes a first wiring;

[0032] A step of installing an organic layer on one side of the wiring layer away from the substrate, and etching the organic layer to form an overlap hole that exposes at least a portion of the first wiring; and

[0033] The step of installing a pixel definition layer on one side of the organic layer away from the substrate, wherein the pixel definition layer extends into the overlap hole and covers one side of the organic layer facing the overlap hole, and the pixel definition layer exposes at least a portion of the first wiring within the overlap hole.

[0034] In some possible embodiments, the wiring layer further comprises a second wiring; and the step of forming the overlap hole in the organic layer is

[0035] The method includes the step of etching the organic layer to form an electrode connection hole that exposes at least a portion of the second wiring and an overlap hole that exposes at least a portion of the first wiring;

[0036] Preferably, prior to the step of installing a pixel definition layer on one side of the organic layer away from the substrate, the method comprises:

[0037] The method further includes the step of forming a first electrode on one side of the organic layer away from the substrate, wherein the first electrode extends into the electrode connection hole and is electrically connected to the second wiring.

[0038] In some possible embodiments, after the step of installing a pixel definition layer on one side of the organic layer away from the substrate, the method,

[0039] The method further includes the step of installing an isolation structure on one side of the organic layer away from the substrate, wherein the isolation structure extends into the overlap hole and contacts the first wiring.

[0040] The present application also provides a method for manufacturing a display panel, said method,

[0041] Step of providing a substrate;

[0042] A step of installing a wiring layer on one side of the above substrate, wherein the wiring layer includes a first wiring;

[0043] A step of installing an organic layer on one side of the wiring layer away from the substrate, and etching the organic layer to form an overlap hole that exposes at least a portion of the first wiring;

[0044] A step of installing a first material layer on one side of the organic layer away from the substrate, wherein the first material layer covers one side facing the overlap hole of the organic layer and exposes the first wiring; and wherein the absorbency of the first material layer is lower than the absorbency of the organic layer; and

[0045] The step of installing an auxiliary electrode on one side of the first material layer away from the substrate, wherein the auxiliary electrode extends into the overlap hole and contacts the first wiring.

[0046] In some possible embodiments, the step of installing an auxiliary electrode on one side of the first material layer away from the substrate is

[0047] The step of installing an isolation structure on one side of the first material layer away from the substrate, wherein the isolation structure includes an isolation opening and the isolation structure is used as an auxiliary electrode.

[0048] Another object of the present application is to provide an electronic device, said electronic device comprising the display panel provided by the present application.

[0049] Compared to prior art, the present application has the following beneficial effects.

[0050] In the display panel, method for manufacturing the display panel, and electronic device provided by the present application, in the display panel having an isolation structure, by configuring the pixel definition layer of the overlap hole to cover the side facing the overlap hole of the organic layer, the organic layer is prevented from being exposed at the overlap hole, thereby reducing the risk of water vapor intrusion into the organic layer at the overlap hole and ensuring a subsequent film layer manufacturing yield. Brief explanation of the drawing

[0051] To more clearly explain the technical solution of the embodiments of the present application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the drawings below illustrate only some embodiments of the present application and should not be construed as a limitation on the scope, and that those skilled in the art may obtain other related drawings based on these drawings without needing to strive to create an inventive step. FIG. 1 is a first cross-sectional schematic diagram of a display panel of the prior art. FIG. 2 is a schematic diagram of a second cross-section of a display panel of the prior art. FIG. 3 is a first cross-sectional schematic diagram of a display panel provided by the present embodiment. FIG. 4 is a second cross-sectional schematic diagram of a display panel provided by the present embodiment. FIG. 5 is a schematic diagram of the area of ​​a display panel provided by the present embodiment. FIG. 6 is a third cross-sectional schematic diagram of a display panel provided by the present embodiment. FIG. 7 is a first schematic diagram of an isolation structure provided by the present embodiment. FIG. 8 is a schematic diagram of the fourth cross-section of a display panel provided by the present embodiment. FIG. 9 is a schematic diagram of the fifth cross-section of a display panel provided by the present embodiment. FIG. 10 is a schematic diagram of the sixth cross-section of a display panel provided by the present embodiment. FIG. 11 is a schematic cross-sectional view of the seventh display panel provided by the present embodiment. FIG. 12 is a second schematic diagram of an isolation structure provided by the present embodiment. FIG. 13 is an eighth cross-sectional schematic diagram of a display panel provided by the present embodiment. FIG. 14 is a ninth cross-sectional schematic diagram of a display panel provided by the present embodiment. FIG. 15 is a first flowchart of the steps of the method for manufacturing a display panel provided by the present embodiment. FIG. 16 is a schematic diagram of the second flow of the manufacturing method step of the display panel provided by the present embodiment. Specific details for implementing the invention

[0052] To further clarify the purpose, technical solution, and advantages of the embodiments of the present application, the technical solution of the embodiments of the present application is described below with reference to the drawings of the embodiments of the present application in a clear and complete manner; however, it is obvious that the described embodiments are only a part of the embodiments of the present application and not the whole. In general, the components of the embodiments of the present application described and illustrated in the drawings of this specification may be arranged and designed in various different configurations.

[0053] Accordingly, the following detailed description of the embodiments of the present application provided in the attached drawings is not intended to limit the scope of the present application to be protected, but merely represents selected embodiments of the present application. All other embodiments obtained by a person skilled in the art without creative effort based on the embodiments of the present application fall within the scope of protection of the present application.

[0054] It should be noted that similar symbols and characters represent similar items in the drawings below, so if an item is defined in one drawing, no additional definition or interpretation is required in subsequent drawings.

[0055] In the description of this application, it should be noted that the directional or positional relationships indicated by terms such as "center," "up," "down," "vertical," "horizontal," "inside," and "outside" are based solely on the directional or positional relationships depicted in the drawings or the directional or positional relationships conventionally arranged when the product of the present invention is used, and are intended only for the convenience of describing this application and to simplify the description; they do not indicate or imply that the mentioned device or component must have a specific direction or be configured and operated in a specific direction, and should not be understood as limiting this application. Furthermore, terms such as "first," "second," and "third" are used solely to distinguish descriptions and should not be understood as indicating or implying relative importance.

[0056] It should be noted that different components of the embodiments of the present application may be combined with each other, provided they do not conflict.

[0057] Referring to FIG. 1, some conventional display panels using an isolation structure (140) generally include a substrate (111'), a plurality of array function film layers (112') located on one side of the substrate (111'), a wiring layer (113') located on one side of the array function film layer (112') away from the substrate (111'), a flattening layer (114') located on one side of the wiring layer (113') away from the substrate (111'), a pixel definition layer (120') located on one side of the flattening layer (114') away from the substrate (111'), and an isolation structure (140') located on one side of the pixel definition layer (120') away from the substrate (111'). Here, the isolation structure (140') must be extended to be electrically connected to the wiring layer (113') through an overlap hole penetrating the pixel definition layer (120') and the flattening layer (114').

[0058] In this case, referring to FIG. 2, during the manufacturing process of the display panel, some locations of the flattening layer (114') in the overlap hole are not covered by the pixel defining layer (120'), so the flattening layer (114') formed of organic material is susceptible to water vapor intrusion, and water vapor released during the subsequent manufacturing process affects the formation effect of other film layers.

[0059] In light of this, the present embodiment provides a solution that can reduce water vapor intrusion during the manufacturing process of a display panel. The solution provided by the present embodiment will be described in detail below.

[0060] FIG. 3 is a schematic diagram of a display panel provided by the present embodiment. Referring to FIG. 3, the display panel may include a substrate (111), a wiring layer (113), an organic layer (114), and a pixel definition layer (120).

[0061] In this embodiment, the first wiring layer (113) is located on one side of the substrate (111), and one or more array function film layers (112) may be further included between the first wiring layer (113) and the substrate (111), for example, a buffer layer, a semiconductor layer, one or more other wiring layers (113), and one or more insulating layers may be further included.

[0062] The wiring layer (113) includes a first wiring (1131). The wiring layer (113) may include additional wiring other than the first wiring (1131), and this is not further described in this embodiment.

[0063] The organic layer (114) is located on one side away from the substrate (111) of the wiring layer (113), and the organic layer (114) includes an overlap hole that exposes at least a portion of the first wiring (1131). Optionally, in this embodiment, the organic layer (114) has a certain fluidity during the manufacturing process.

[0064] The pixel defining layer (120) is located on one side away from the substrate (111) of the organic layer (114), and the pixel defining layer (120) extends into the overlap hole and covers the side facing the overlap hole of the organic layer (114), and the portion of the pixel defining layer (120) located within the overlap hole exposes at least a portion of the first wiring (1131). That is, in the overlap hole, the pixel defining layer (120) can cover the exposed portion of the organic layer (114), and the pixel defining layer (120) still exposes the first wiring (1131).

[0065] Based on the above design, in this embodiment, the pixel definition layer (120) of the overlap hole is configured to cover the side facing the overlap hole of the organic layer (114), thereby preventing the organic layer (114) from being exposed in the overlap hole, which reduces the risk of water vapor intrusion into the organic layer (114) in the overlap hole and ensures the subsequent film layer manufacturing yield.

[0066] In some possible embodiments, the material of the pixel defining layer (120) includes an inorganic material. Accordingly, the blocking effect of the pixel defining layer (120) against water vapor is superior, so the organic layer (114) can be better protected from water vapor intrusion.

[0067] In some possible embodiments, referring to FIG. 4, the display panel further includes an isolation structure (140) located on one side away from the substrate (111) of the pixel definition layer (120), and the isolation structure (140) extends into an overlap hole and contacts a first wiring (1131). Accordingly, the isolation structure (140) can overlap with the first wiring (1131) through the overlap hole to implement an electrical connection.

[0068] By configuring the pixel definition layer (120) of the overlap hole to cover the side of the organic layer (114) facing the overlap hole, the organic layer (114) can be prevented from coming into direct contact with the isolation structure (140) extending into the overlap hole, thereby preventing water vapor absorbed by the organic layer (114) from affecting the manufacture of the isolation structure (140) during the coating and molding process of the isolation structure (140) and reducing the risk of abnormalities in the film layer appearing on the isolation structure (140).

[0069] In some possible embodiments, referring to FIG. 5, the display panel includes a display area (10) and an overlap area (20) located on one side of the display area (10), and an overlap hole is located in the overlap area (20). The display panel further includes a binding area, and the overlap area (20) is located between the display area (10) and the binding area (20). The binding area is used to bind a chip.

[0070] In some possible embodiments, referring to FIG. 6, a pixel definition layer (120) located in a display area (10) includes a pixel opening, and an isolation structure (140) located in a display area (10) includes an isolation opening, and the orthographic projection of the pixel opening in the substrate (111) is located within the orthographic projection of the isolation opening in the substrate (111). Patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 describe relevant technical solutions for an isolation structure (140) located in a display area (10), the contents of which are incorporated herein by reference.

[0071] Optionally, in some possible embodiments, in the display area (10), the isolation structure (140) may include a support and a blocking portion located on one side away from the substrate (111) of the support, and the orthographic projection of the support on the substrate (111) is located within the orthographic projection of the blocking portion on the substrate (111). That is, the isolation structure (140) located in the display area (10) has an undercut structure, so that the organic film layer between adjacent pixel openings can be better separated when forming another organic film layer in a subsequent deposition.

[0072] In some possible embodiments, referring to FIG. 7, the isolation structure (140) comprises a first layer (141), a second layer (142), and a third layer (143) installed by stacking in a direction away from the substrate (111). For example, the material of the first layer (141) comprises molybdenum, the material of the second layer (142) comprises aluminum, and the material of the third layer (143) comprises titanium. Here, the support portion may be formed by the first layer (141) and the second layer (142), and the blocking portion may be formed by the third layer (143). In another embodiment, the isolation structure (140) comprises a second layer (142) and a third layer (143) installed by stacking in a direction away from the substrate (111).

[0073] Referring to FIG. 8, in the overlap hole, after the isolation structure (140) extends into the overlap hole, the first layer (141) comes into contact with the first wiring (1131) to establish an electrical connection.

[0074] In some possible embodiments, referring again to FIG. 6, the display area (10) of the display panel further includes a first electrode (130), a light-emitting unit (150), and a second electrode (160).

[0075] The first electrode (130) is located on one side away from the substrate (111) of the organic layer (114), and a plurality of first electrodes (130) may be spaced apart. At least a portion of the first electrode (130) is located within a pixel opening, for example, one pixel opening exposes at least a portion of one first electrode (130).

[0076] At least a portion of the light-emitting unit (150) is located within the pixel opening and is also located on one side away from the substrate (111) of the first electrode (130), and the light-emitting unit (150) is in contact with the first electrode (130).

[0077] At least a portion of the second electrode (160) is located within the pixel opening and is also located on one side away from the substrate (111) of the light-emitting unit (150), and the second electrode (160) is in contact with the light-emitting unit (150).

[0078] When there is a potential difference between the first electrode (130) and the second electrode (160), the light-emitting unit (150) located between the first electrode (130) and the second electrode (160) is driven to emit light.

[0079] In some possible embodiments, referring again to FIG. 6, at least a portion of the second electrode (160) extends away from the substrate (111) of the pixel defining layer (120) within the pixel opening and comes into contact with the isolation structure (140).

[0080] Thus, the second electrode (160) corresponding to the adjacent pixel opening can be electrically connected through the isolation structure (140) to be connected to a common voltage (Vss) providing circuit, or the isolation structure (140) can connect each second electrode (160) relatively independently to the common voltage providing circuit.

[0081] In some possible embodiments, referring to FIG. 9, the display panel further includes a first packaging layer (170) located on one side away from the substrate (111) of the second electrode (160).

[0082] Optionally, the first packaging layer (170) may extend from within the pixel opening to one side away from the substrate (111) of the isolation structure (140). The first packaging layer (170) corresponding to the adjacent pixel opening may be disconnected from one side away from the substrate (111) of the isolation structure (140).

[0083] Furthermore, in some possible embodiments, the display panel further includes a second packaging layer (180) and a third packaging layer (190) installed laminated on one side away from the substrate (111) of the first packaging layer (170).

[0084] Optionally, the materials of the first packaging layer (170) and the third packaging layer (190) include inorganic materials, and the material of the second packaging layer (180) includes organic materials. For example, the first packaging layer (170) and the third packaging layer (190) can be formed using a Chemical Vapor Deposition (CVD) method, and the second packaging layer (180) can be formed using an Ink-jet Printing (IJP) method.

[0085] Optionally, a gap may be provided between a portion of the first packaging layer (170) located on one side away from the substrate (111) of the isolation structure (140) and the isolation structure (140). A second packaging layer (180) may fill the gap.

[0086] FIG. 10 is a schematic diagram of a display panel provided by the present embodiment. Referring to FIG. 10, the display panel may include a substrate (211), a wiring layer (213), an organic layer (214), a first material layer (221), and an auxiliary electrode (310).

[0087] In this embodiment, the first wiring layer (213) may be located on one side of the substrate (211), and one or more array function film layers (212) may be further included between the first wiring layer (213) and the substrate (211), for example, a buffer layer, a semiconductor layer, one or more other wiring layers (213), and one or more insulating layers may be further included.

[0088] The wiring layer (213) includes a first wiring (2131). The wiring layer (213) may include additional wiring other than the first wiring (2131), and this is not further described in this embodiment.

[0089] The organic layer (214) is located on one side away from the substrate (211) of the wiring layer (213), and the organic layer (214) includes an overlap hole that exposes at least a portion of the first wiring (2131).

[0090] The first material layer (221) is located on one side away from the substrate (211) of the organic layer (214) and exposes at least a portion of the first wiring (2131). That is, in the overlap hole, the first material layer (221) can cover the exposed portion of the organic layer (214), and the first material layer (221) still exposes the first wiring (2131). The absorbency of the first material layer (221) is lower than that of the organic layer (214).

[0091] Based on the above design, in this embodiment, by configuring the first material layer (221) of the overlap hole to cover the side of the organic layer (214) facing the overlap hole, the organic layer (214) is prevented from being exposed in the overlap hole, thereby reducing the risk of water vapor intrusion into the organic layer (214) in the overlap hole and ensuring a subsequent film layer manufacturing yield.

[0092] In some possible embodiments, the material of the first material layer (221) includes an inorganic material. Accordingly, the blocking effect of the first material layer (221) against water vapor is superior, so the organic layer (214) can be better protected from water vapor intrusion.

[0093] The auxiliary electrode (310) is located on one side away from the substrate (211) of the first material layer (221), and the auxiliary electrode (310) extends into the overlap hole and contacts the first wiring (2131). Thus, the auxiliary electrode (310) overlaps with the first wiring (2131) through the overlap hole to enable an electrical connection.

[0094] By configuring the first material layer (221) of the overlap hole to cover the side of the organic layer (214) facing the overlap hole, direct contact between the organic layer (214) and the auxiliary electrode (310) extending into the overlap hole can be prevented, thereby preventing water vapor absorbed by the organic layer (214) from affecting the manufacturing of the auxiliary electrode (310) during the coating and molding process of the auxiliary electrode (310) and reducing the risk of abnormal film layer appearance on the auxiliary electrode (310).

[0095] In some possible embodiments, referring again to FIG. 5, the display panel includes a display area (10) and an overlap area (20) located on one side of the display area (10), and an overlap hole is located in the overlap area (20).

[0096] In some possible embodiments, referring to FIG. 11, the display panel provided by the present embodiment further comprises a pixel defining layer (220), and the pixel defining layer (220) is located on one side away from the substrate (211) of the organic layer (214). Here, the pixel defining layer (220) and the first material layer (221) are installed on the same layer. The pixel defining layer (220) and the first material layer (221) have an integral structure, that is, the pixel defining layer (220) and the first material layer (221) are integrally molded and come into contact with each other.

[0097] In some possible embodiments, referring again to FIG. 11, the display panel provided by the present embodiment may further include an isolation structure (240) and a light-emitting unit (250).

[0098] The isolation structure (240) is located on one side away from the substrate (211) of the first material layer (221), and the isolation structure (240) includes an isolation opening, and the light-emitting unit (250) is located within the isolation opening. The isolation structure (240) is also used as an auxiliary electrode (310).

[0099] Here, patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 describe relevant technical solutions for an isolation structure (240) located in a display area (10), the contents of which are incorporated into this application by reference.

[0100] Optionally, in some possible embodiments, the isolation structure (240) may include a support and a blocking portion located on one side away from the substrate (211) of the support, and the orthographic projection of the support on the substrate (211) is located within the orthographic projection of the blocking portion on the substrate (211). That is, the isolation structure (240) located in the display area (10) has an undercut structure, so that the organic film layer between adjacent pixel openings can be better separated when forming another organic film layer in a subsequent deposition.

[0101] In some possible embodiments, referring to FIG. 12, the isolation structure (240) includes a first layer (241), a second layer (242), and a third layer (243) installed by stacking in a direction away from the substrate (211). For example, the material of the first layer (241) includes molybdenum, the material of the second layer (242) includes aluminum, and the material of the third layer (243) includes titanium. Here, the support portion may be formed by the first layer (241) and the second layer (242), and the blocking portion may be formed by the third layer (243). Correspondingly, referring to FIG. 13, the auxiliary electrode (310) may include a first layer (241), a second layer (242), and a third layer (243) installed by stacking in a direction away from the substrate (211).

[0102] In some other possible embodiments, the isolation structure (240) includes a second layer (242) and a third layer (243) installed by stacking in a direction away from the substrate (211). For example, the material of the second layer (242) includes aluminum, and the material of the third layer (243) includes titanium. Here, the support portion may be formed by the second layer (242), and the blocking portion may be formed by the third layer (243). Correspondingly, the auxiliary electrode (310) may include the second layer (242) and the third layer (243) installed by stacking in a direction away from the substrate (211).

[0103] In some possible embodiments, referring to FIG. 11, the display panel further includes a first electrode (230) and a second electrode (260).

[0104] The first electrode (230) is located on one side away from the substrate (211) of the organic layer (214), and a plurality of first electrodes (230) may be spaced apart. At least a portion of the first electrode (230) is located within a pixel opening, for example, one pixel opening exposes at least a portion of one first electrode (230).

[0105] At least a portion of the light-emitting unit (250) is located within the pixel opening and is also located on one side away from the substrate (211) of the first electrode (230), and the light-emitting unit (250) is in contact with the first electrode (230).

[0106] At least a portion of the second electrode (260) is located within the pixel opening and is also located on one side away from the substrate (211) of the light-emitting unit (250), and the second electrode (260) is in contact with the light-emitting unit (250).

[0107] When there is a potential difference between the first electrode (230) and the second electrode (260), the light-emitting unit (250) located between the first electrode (230) and the second electrode (260) is driven to emit light.

[0108] In some possible embodiments, referring again to FIG. 11, at least a portion of the second electrode (260) extends away from the substrate (211) of the pixel defining layer (220) within the pixel opening and comes into contact with the isolation structure (240).

[0109] Thus, the second electrode (260) corresponding to the adjacent pixel opening can be electrically connected through the isolation structure (240) to be connected to the common voltage (Vss) providing circuit, or the isolation structure (240) can connect each second electrode (260) relatively independently to the common voltage providing circuit.

[0110] In some possible embodiments, referring to FIG. 14, the display panel further includes a first packaging layer (270) located on one side away from the substrate (211) of the second electrode (260).

[0111] Optionally, the first packaging layer (270) may extend from within the pixel opening to one side away from the substrate (211) of the isolation structure (240). The first packaging layer (270) corresponding to an adjacent pixel opening may be disconnected from one side away from the substrate (211) of the isolation structure (240).

[0112] Furthermore, in some possible embodiments, the display panel further includes a second packaging layer (280) and a third packaging layer (290) installed laminated on one side away from the substrate (211) of the first packaging layer (270).

[0113] Optionally, the materials of the first packaging layer (270) and the third packaging layer (290) include inorganic materials, and the material of the second packaging layer (280) includes organic materials. For example, the first packaging layer (270) and the third packaging layer (290) may be formed using a Chemical Vapor Deposition (CVD) method, and the second packaging layer (280) may be formed using an Ink-jet Printing (IJP) method.

[0114] Optionally, a gap may be provided between the portion located on one side away from the substrate (211) of the isolation structure (240) in the first packaging layer (270) and the isolation structure (240). The second packaging layer (280) may fill the gap.

[0115] Referring to FIG. 15, the present embodiment also provides a method for manufacturing a display panel, said method may include the following steps.

[0116] In step S110, a substrate (111) is provided.

[0117] In step S120, a wiring layer (113) is installed on one side of the substrate (111), wherein the wiring layer (113) includes a first wiring (1131).

[0118] In step S130, an organic layer (114) is installed on one side of the wiring layer (113) away from the substrate (111), wherein the organic layer (114) includes an overlap hole that exposes at least a portion of the first wiring (1131).

[0119] In step S140, a pixel defining layer (120) is installed on one side of the organic layer (114) away from the substrate (111), wherein the pixel defining layer (120) extends into an overlap hole and covers one side facing the overlap hole of the organic layer (114), and the pixel defining layer (120) exposes at least a portion of the first wiring (1131) within the overlap hole.

[0120] In some possible embodiments, the wiring layer (113) further includes a second wiring (1132). The second wiring (1132) can be used to provide a driving voltage to the first electrode (130).

[0121] In step S130, the organic layer (114) can be etched to form an electrode connection hole that exposes at least a portion of the second wiring (1132) and an overlap hole that exposes at least a portion of the first wiring (1131). That is, the organic layer (114) is etched to form an electrode connection hole, and at the same time, an overlap hole is formed through etching.

[0122] Optionally, after step S130, a first electrode (130) may also be formed on one side away from the substrate (111) of the organic layer (114), and the first electrode (130) extends into the electrode connection hole and is electrically connected to the second wiring (1132).

[0123] In some possible embodiments, in step S140, a pixel defining layer (120) is installed on one side of the organic layer (114) away from the substrate (111), and the pixel defining layer (120) is etched so that the pixel defining layer (120) within the overlap hole exposes at least a portion of the first wiring (1131).

[0124] Then, an isolation structure (140) is installed on one side away from the substrate (111) of the pixel definition layer (120), wherein the isolation structure (140) extends into an overlap hole and contacts the first wiring (1131). That is, the pixel definition layer is etched to expose the first wiring (1131), and then the isolation structure (140) is installed.

[0125] In some possible embodiments, after installing an isolation structure (140) on one side away from the substrate (111) of the pixel definition layer (120), the isolation layer can be etched to form an isolation opening.

[0126] Then, the pixel definition layer (120) can be etched to form a pixel opening that communicates with the isolation opening. That is, a pixel opening can be formed by etching the pixel definition layer (120) using the isolation structure (140) as a mask.

[0127] Referring to FIG. 16, the present embodiment also provides a method for manufacturing a display panel, said method may include the following steps.

[0128] In step S210, a substrate (211) is provided.

[0129] In step S220, a wiring layer (213) is installed on one side of the substrate (211), wherein the wiring layer (213) includes a first wiring (2131).

[0130] In step S230, an organic layer (214) is installed on one side of the wiring layer (213) away from the substrate (211), and the organic layer (214) is etched to form an overlap hole that exposes at least a portion of the first wiring (2131).

[0131] In step S240, a first material layer (221) is installed on one side of the organic layer (214) away from the substrate (211), wherein the first material layer (221) covers the side facing the overlap hole of the organic layer (214) and also exposes at least a portion of the first wiring (2131). The absorbency of the first material layer (221) is lower than that of the organic layer (214).

[0132] In step S250, an auxiliary electrode (310) is installed on one side away from the substrate (211) of the first material layer (221), and the auxiliary electrode (310) extends into an overlap hole and contacts the first wiring (2131).

[0133] In some possible embodiments, the wiring layer (213) further includes a second wiring (2132). The second wiring (2132) can be used to provide a driving voltage to the first electrode (230).

[0134] In step S230, the organic layer (214) can be etched to form an electrode connection hole that exposes at least a portion of the second wiring (2132) and an overlap hole that exposes at least a portion of the first wiring (2131). That is, the organic layer (214) is etched to form an electrode connection hole, and at the same time, an overlap hole is formed through etching.

[0135] In some possible embodiments, in step S240, a first material layer (221) may be installed on one side of the organic layer (214) away from the substrate (211), and the first material layer (221) may be etched so that the first material layer (221) within the overlap hole exposes at least a portion of the first wiring (2131).

[0136] In some possible embodiments, in step S250, an isolation structure (240) is installed on one side away from the substrate (211) of the first material layer (221), wherein at least a portion of the isolation structure (240) extends into an overlap hole and serves as an auxiliary electrode (310).

[0137] The present application also provides an electronic device, wherein the electronic device includes a display panel provided by the present application, and the electronic device may include a device having a display function such as a mobile phone, tablet computer, smart wearable device, TV, laptop, monitor, etc.

[0138] In summary, in the display panel, method for manufacturing the display panel, and electronic device provided by the present application, the display panel having an isolation structure is configured such that the pixel definition layer of the overlap hole covers the side of the organic layer facing the overlap hole, thereby preventing the organic layer from being exposed at the overlap hole, thereby reducing the risk of water vapor intrusion into the organic layer at the overlap hole and ensuring a subsequent film layer manufacturing yield.

[0139] Each technical component of the aforementioned embodiments may be combined at will, and for the sake of brevity of description, not all possible combinations of each technical component of the aforementioned embodiments are described; however, as long as there is no contradiction in the combinations of these technical components, they should all be deemed to fall within the scope described herein.

[0140] The foregoing embodiments merely represent a few embodiments of the present invention, and while the description is relatively specific and detailed, it should not be understood as limiting the scope of the present invention. Those skilled in the art should note that various modifications and improvements may be made without departing from the spirit of the present invention, and that all of these fall within the scope of protection of the present invention. Accordingly, the scope of protection of the patent for the present invention should be based on the appended claims. Explanation of the symbols

[0141] 111, 211-Substrate; 112, 212-Array functional film layer; 113, 213-Wiring layer; 1131, 2131-First wiring; 1132, 2132-Second wiring; 114, 214-Organic layer; 120, 220-Pixel defining layer; 221-First material layer; 130, 230-First electrode; 140, 240-Isolation structure; 1400, 2400-Isolation aperture; 150, 250-Emitting unit; 160, 260-Second electrode; 170, 270-First packaging layer; 180, 280-Second packaging layer; 190, 290-Third packaging layer; 141, 241-1st layer; 142, 242-2nd layer; 143, 243-3rd layer; 310-auxiliary electrode; 10-display area; 20-overlap area; 901, 902-overlap hole.

Claims

Claim 1 A display panel comprising a substrate, a wiring layer, an organic layer, a pixel defining layer, and an auxiliary electrode, wherein the wiring layer is located on one side of the substrate and the wiring layer includes a first wiring; the organic layer is located on one side of the wiring layer away from the substrate and the organic layer includes an overlap hole that exposes at least a portion of the first wiring; the pixel defining layer is located on one side of the organic layer away from the substrate and the pixel defining layer extends into the overlap hole and covers one side of the organic layer facing the overlap hole, and the portion of the pixel defining layer located within the overlap hole exposes at least a portion of the first wiring; and the auxiliary electrode is located on one side of the pixel defining layer away from the substrate and extends into the overlap hole to contact the first wiring. Claim 2 In claim 1, the material of the pixel definition layer comprises an inorganic material and is a display panel. Claim 3 In claim 1, the display panel further includes an isolation structure located on one side away from the substrate of the organic layer, and the isolation structure extends into the overlap hole and contacts the first wiring. Claim 4 In paragraph 3, the display panel includes a display area, and a pixel definition layer located in the display area includes a pixel opening, and the isolation structure is installed on one side of the pixel definition layer away from the substrate, and the isolation structure located in the display area includes an isolation opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate. Claim 5 In claim 4, the organic layer comprises a planarization layer; and the display area of ​​the display panel further comprises a first electrode, a light-emitting unit, and a second electrode, wherein the first electrode is located on one side of the planarization layer away from the substrate, and at least a portion of the first electrode is located within the pixel opening; at least a portion of the light-emitting unit is located within the pixel opening and is also located on one side of the first electrode away from the substrate, and the light-emitting unit is in contact with the first electrode; and at least a portion of the second electrode is located within the pixel opening and is also located on one side of the light-emitting unit away from the substrate, and the second electrode is in contact with the light-emitting unit. Claim 6 In paragraph 5, the second electrode is a display panel in contact with the isolation structure. Claim 7 A display panel comprising a substrate, a wiring layer, an organic layer, a first material layer, and an auxiliary electrode, wherein the wiring layer is located on one side of the substrate and the wiring layer includes a first wiring; the organic layer is located on one side of the wiring layer away from the substrate and the organic layer includes an overlap hole that exposes at least a portion of the first wiring; the first material layer covers one side of the organic layer facing the overlap hole and exposes the first wiring; the absorbency of the first material layer is lower than the absorbency of the organic layer; and the auxiliary electrode is located on one side of the first material layer away from the substrate and extends into the overlap hole to contact the first wiring. Claim 8 In claim 7, the display panel comprises a display area and an overlap area located on one side of the display area, and the overlap hole is located in the overlap area; the display panel further comprises a binding area, and the overlap area is located between the display area and the binding area. Claim 9 In claim 7, the material of the first material layer comprises an inorganic material, and the display panel further comprises a pixel defining layer located on one side away from the substrate of the organic layer, wherein the first material layer and the pixel defining layer are installed on the same layer, and the first material layer and the pixel defining layer have an integrated structure. Claim 10 In claim 7, the display panel further comprises an isolation structure and a light-emitting unit, wherein the isolation structure is located on one side away from the substrate of the first material layer and has an isolation opening installed therein; the light-emitting unit is located at the isolation opening; and the isolation structure is used as an auxiliary electrode. Claim 11 In claim 10, the isolation structure comprises a first layer, a second layer, and a third layer installed by stacking in a direction away from the substrate; or the isolation structure comprises a second layer and a third layer installed by stacking in a direction away from the substrate, forming a display panel. Claim 12 A display panel according to claim 11, wherein the material of the second layer comprises aluminum, the material of the third layer comprises titanium, and the material of the first layer comprises molybdenum. Claim 13 A method for manufacturing a display panel, wherein the method comprises: providing a substrate; installing a wiring layer on one side of the substrate, wherein the wiring layer includes a first wiring; installing an organic layer on one side of the wiring layer away from the substrate and etching the organic layer to form an overlap hole that exposes at least a portion of the first wiring; installing a pixel defining layer on one side of the organic layer away from the substrate, wherein the pixel defining layer extends into the overlap hole and covers one side of the organic layer facing the overlap hole, and the pixel defining layer exposes at least a portion of the first wiring within the overlap hole; and placing an auxiliary electrode on one side of the pixel defining layer away from the substrate, wherein the auxiliary electrode extends into the overlap hole and contacts the first wiring. Claim 14 A method for manufacturing a display panel according to claim 13, wherein the wiring layer further comprises a second wiring; and the step of forming the overlap hole in the organic layer comprises the step of etching the organic layer to form an electrode connection hole that exposes at least a portion of the second wiring and the overlap hole that exposes at least a portion of the first wiring. Claim 15 A method for manufacturing a display panel according to claim 14, prior to the step of installing a pixel definition layer on one side of the organic layer away from the substrate, the method further comprises the step of forming a first electrode on one side of the organic layer away from the substrate, wherein the first electrode extends into the electrode connection hole and is electrically connected to the second wiring. Claim 16 A method for manufacturing a display panel according to claim 13, wherein, after the step of installing a pixel definition layer on one side of the organic layer away from the substrate, the method further comprises the step of installing an isolation structure on one side of the organic layer away from the substrate, wherein the isolation structure extends into the overlap hole and contacts the first wiring. Claim 17 A method for manufacturing a display panel, wherein the method comprises: providing a substrate; installing a wiring layer on one side of the substrate, wherein the wiring layer includes a first wiring; installing an organic layer on one side of the wiring layer away from the substrate and etching the organic layer to form an overlap hole that exposes at least a portion of the first wiring; installing a first material layer on one side of the organic layer away from the substrate, wherein the first material layer covers one side of the organic layer facing the overlap hole and exposes the first wiring; wherein the absorbency of the first material layer is lower than the absorbency of the organic layer; and installing an auxiliary electrode on one side of the first material layer away from the substrate, wherein the auxiliary electrode extends into the overlap hole and contacts the first wiring. Claim 18 A method for manufacturing a display panel according to claim 17, wherein the step of installing an auxiliary electrode on one side of the first material layer away from the substrate comprises the step of installing an isolation structure on one side of the first material layer away from the substrate, wherein the isolation structure includes an isolation opening and the isolation structure serves as the auxiliary electrode. Claim 19 An electronic device, wherein the electronic device comprises a display panel according to any one of claims 1 to 12.

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