Substrate processing device

Abstract

A substrate processing device is provided that can stably position a substrate at the center of rotation by synchronously positioning a plurality of clamp pins. A substrate processing device (1) of an embodiment comprises: a clamp lever (12) that moves at least three clamp pins (11) between an open position spaced apart from the outer edge We of a substrate W and a closed position in contact with the outer edge We to hold and support the substrate W, according to rotation around a horizontal axis; a lifting ring (15) that rotates the clamp lever (12) according to lifting; a rotating body (30) that rotates the substrate W held and supported by the clamp pins (11); a rotating mechanism (40) that rotates the rotating body (30) around axis Ax; a lifting mechanism (50) that lifts the lifting ring (15); a pressing member (56) that presses the clamp lever (12) in a direction to become a closed position; a synchronous ring (61) provided to be rotatable around axis Ax and unable to lift; and, while converting the lifting of the lifting ring (15) into rotation of the synchronous ring (61), the lifting ring (15) It has a conversion mechanism (62) that maintains the posture in a horizontal state and a supply unit (70) that supplies a processing liquid to the substrate W.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus. Background Technology

[0002] In manufacturing processes for semiconductor devices or flat panel displays, an etching solution is supplied to a film formed on the surface of a substrate, such as a wafer or a glass substrate, to form a desired pattern. As a device for performing such etching treatment, a substrate processing device is proposed that supplies an etching solution to the central region of a rotated substrate. In this case, the etching solution supplied to the central region of the substrate spreads toward the periphery of the substrate by centrifugal force, so that the surface of the substrate is etched by the supplied etching solution.

[0003] In such substrate processing, the presence of contact marks or similar marks supporting the substrate on the surface of the substrate leads to a deterioration in the quality of the substrate. Furthermore, the presence of contact marks or similar marks on the back surface of the substrate, as well as on the surface of the substrate, is also undesirable as it affects the quality of the substrate. For this reason, processing is performed by rotating the substrate while holding and supporting the outer edge of the substrate—rather than the surface or back surface—using multiple holding support members. As such holding support members, for example, multiple clamp pins that move in a direction of separation from contact with the outer edge of the substrate are used (see Patent Document 1). Prior art literature

[0004] Japanese Patent Publication No. Hei 10-209254 The problem to be solved

[0005] Multiple clamp pins need to move between an open position spaced apart from the substrate and a closed position that holds and supports the substrate in contact with the outer edge of the substrate. However, if each clamp pin is driven independently, there is a possibility that the position of the substrate's center and rotation center may fluctuate. Furthermore, even if the substrate is held and supported so that its center and rotation center align by independently driven clamp pins, there is a possibility that the clamp pins may open due to centrifugal force acting from the substrate on the clamp pins during rotation, thereby causing the substrate's center to deviate from the axis of rotation.

[0006] The problem that the present invention aims to solve is to provide a substrate processing device in which a plurality of clamp pins synchronize to stably position a substrate at the center of rotation. means of solving the problem

[0007] The substrate processing device of the present invention comprises at least three clamp pins that hold and support the outer edge of a substrate; a clamp lever on which the clamp pins are provided and which moves the clamp pin between an open position spaced apart from the outer edge of the substrate and a closed position in contact with the outer edge of the substrate to hold and support the substrate, according to rotation around a horizontal axis of rotation; a lifting ring that rotates the clamp lever according to lifting; a rotating body on which the axis of rotation of the clamp lever is provided and which rotates the substrate held and supported by the clamp pin together with the clamp lever and the lifting ring; a rotating mechanism that rotates the rotating body around a vertical axis of rotation; a lifting mechanism that lifts the lifting ring in a direction along the axis of rotation; a pressing member that presses the clamp lever in a direction in which the clamp pin becomes the closed position; a synchronous ring provided to be rotatable around the axis of rotation and also unable to lift; and while converting the lifting of the lifting ring by the lifting mechanism into rotation of the synchronous ring, the It has a conversion mechanism that maintains the position of the lifting ring in a horizontal state, and a supply unit that supplies a processing liquid to the substrate, which is held and supported by the clamp pin and rotated by the rotating body. Effects of the invention

[0008] According to the present invention, a substrate processing device can be provided in which a plurality of clamp pins synchronize to stably position a substrate at the center of rotation. Brief explanation of the drawing

[0009] Figure 1 is a drawing illustrating the configuration of a substrate processing device of an embodiment. FIG. 2 is a perspective view illustrating the internal structure of the substrate processing device of FIG. 1. FIG. 3 is a perspective view illustrating the configuration of the substrate holding support portion of FIG. 2. FIG. 4 is a longitudinal cross-sectional view passing through the central axis showing the substrate holding support state (A) and open state (B) of FIG. 2. FIG. 5 is a simplified cross-sectional view in two directions showing the case where the clamp pin is in the closed position. FIG. 6 is a simplified cross-sectional view showing the case where the retaining support of the clamp pin is normal (A) and the case where the retaining support is abnormal (B). FIG. 7 is a simplified cross-sectional view showing the case where one clamp pin is in the closed position and the other clamp pin is in the open position. Figure 8 is an explanatory diagram illustrating the principle of tilting of the lifting ring when the retaining support of the clamp pin is abnormal. Figure 9 is a flowchart showing the sequence of substrate processing. FIG. 10 is a simplified cross-sectional view showing an ideal embodiment of the retaining support of a clamp pin in a substrate processing device without a synchronization ring. Figure 11 is an explanatory diagram showing an example of a conversion mechanism. FIG. 12 is a perspective view illustrating a modified example of a conversion mechanism using a slide axis. FIG. 13 is a perspective view illustrating a modified example of a conversion mechanism using a cam. FIG. 14 is a perspective view illustrating a modified example in which the synchronization ring is made into a single ring. Specific details for implementing the invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0011] [outline]

[0012] As shown in FIG. 1, the substrate processing device (1) of the present embodiment is a device that processes a substrate W while holding and supporting it and rotating it. The substrate W to be processed is, for example, a wafer or glass substrate used in the manufacturing process of a microstructure such as a semiconductor device or a flat panel display. The processing by the substrate processing device (1) is, for example, a wet processing that processes by supplying a processing liquid while rotating the substrate W. The surface of the substrate W to be processed is called the surface, and the opposite surface is called the back surface. The wet processing of the present embodiment includes an etching process in which a film formed on the surface of the substrate W is etched by a chemical solution, and a cleaning process in which a film is cleaned by a cleaning solution.

[0013] As shown in FIGS. 1 and 2, the substrate processing device (1) has a holding support part (10), a rotating body (30), a rotating mechanism (40), a lifting mechanism (50), a synchronous mechanism (60), a supply part (70), a detection part (80) (see FIG. 5), and a control device (90).

[0014] (Holding support)

[0015] As shown in FIG. 1, the holding support member (10) holds and supports the substrate W in a horizontal direction. As shown in FIG. 2 to FIG. 4, the holding support member (10) has a clamp pin (11), a clamp lever (12), a pivot shaft (13), a cover (14), a lifting ring (15), and a clamp base (16).

[0016] The clamp pin (11) is a plurality of members that hold and support the outer end We of the substrate W. The clamp pin (11) has a truncated cone shape with a reduced diameter at the bottom. The clamp pin (11) may be a portion having a surface that can hold and support the substrate W in contact with the outer end We of the substrate W. For this reason, it includes cylinders, prismatics, and pyramids having rotational symmetry, but is not limited to these shapes. In the state of contact with the outer end We, it is desirable to have a height that does not affect the surface and back surface of the substrate W in a non-contact manner and suppresses the influence on the flow of the processing liquid.

[0017] Additionally, a support member (11a) is provided at the lower part of the clamp pin (11). The support member (11a) is wedge-shaped, and its pointed tip is formed to face the rotation axis Ax of the rotating body (30) described later. The upper surface of the support member (11a) is formed as an inclined surface that slopes downward toward the axis Ax.

[0018] A clamp lever (12) is provided with a clamp pin (11) at one end thereof and moves between a closed position (see (A) in FIG. 4) in which it contacts and holds / supports the outer end We of the substrate W according to rotation around a horizontal axis, and an open position (see (B) in FIG. 4) in which the clamp pin (11) is spaced apart from the outer end We of the substrate W. The clamp lever (12) is an L-shaped member.

[0019] The pivot shaft (13) is the pivot shaft of the clamp lever (12). The pivot shaft (13) is provided in the tangential direction (horizontal direction) of the rotation circle of the rotating body (30) with respect to the rotating body (30) described later. The clamp lever (12) rotates with the pivot shaft (13) as a support point. As a result, the clamp pin (11) moves between an open position and a closed position.

[0020] At the other end of the clamp lever (12), a connecting hole (12a) for connecting to the clamp base (16) described later is formed. The connecting hole (12a) is a long hole following the radial direction of the rotating body (30). The cover (14) is a cylindrical member provided such that one end of the clamp lever (12) protrudes upward so that the clamp pin (11) is exposed. The cover (14) has an inclined surface (14a) on its upper surface that is provided on the side of the rotating mechanism (40) rather than the pivot axis (13) of the clamp lever (12).

[0021] A plurality of clamp pins (11) and clamp levers (12) are arranged at equal intervals along the periphery of the substrate W. Six clamp pins (11) are provided, arranged in sets of three at intervals of one around the axis Ax. Thus, six clamp pins (11) are arranged at 60-degree intervals. One set of three clamp pins (11) is called a clamp pin (11A), and the other set of three clamp pins (11) is called a clamp pin (11B). Furthermore, the number of clamp pins (11) is not limited to this, and at least six may be provided, arranged in sets of three or more.

[0022] Additionally, a clamp lever (12) provided with a clamp pin (11A) is referred to as a clamp lever (12A), and a clamp lever (12) provided with a clamp pin (11B) is referred to as a clamp lever (12B). In the following description, if the clamp pins (11A, 11B) are not distinguished, they are referred to as a clamp pin (11), and if the clamp levers (12A, 12B) are not distinguished, they are referred to as a clamp lever (12).

[0023] The lifting ring (15) rotates the clamp lever (12) according to the lifting motion. The lifting ring (15) is an annular part centered on axis Ax and is arranged around the rotation axis (41) described later. Each clamp lever (12) is arranged in the lifting ring (15) of this embodiment. In addition, a magnet (15a) (see FIGS. 5 to 7) is provided in the lifting ring (15). The lifting ring (15) has a pair of lifting rings (15A, 15B). The lifting rings (15A, 15B) are concentric annular, and the lifting ring (15A), which has a smaller diameter than the lifting ring (15B), is arranged on the inner side of the lifting ring (15B). The inner lifting ring (15A) corresponds to the clamp lever (12A) and the clamp pin (11A), and the outer lifting ring (15B) corresponds to the clamp lever (12B) and the clamp pin (11B). Hereinafter, if the lifting rings (15A, 15B) are not distinguished, they are referred to as the lifting ring (15).

[0024] As shown in FIGS. 3, 5 to 7, the lifting ring (15) is provided with a height detection plate (151) for detecting a height position. The height detection plate (151) is a ring-shaped plate arranged to surround the outer circumference of the lifting ring (15) coaxially with the lifting ring (15). The height detection plate (151) is fixed to the lifting ring (15) through a plurality of connecting parts extending from its inner circumference. Since the relative position between the height position of the height detection plate (151) and the height position of the lifting ring (15) is constant, the height position of the height detection plate (151) reflects the height position of the lifting ring (15).

[0025] This embodiment has two height detection plates (151A, 151B). The height detection plate (151A) is provided on the lifting ring (15A). The height detection plate (151B) is provided on the lifting ring (15B). The height detection plate (151A) indicates the height position of the lifting ring (15A), and the height detection plate (151B) indicates the height position of the lifting ring (15B). Hereinafter, if the height detection plates (151A, 151B) are not distinguished, they are simply referred to as the height detection plate (151).

[0026] The clamp base (16) rotatably supports each clamp lever (12) on the lifting ring (15). More specifically, the clamp base (16) is supported on the lifting ring (15) via the lifting guide (622) described later. That is, the clamp base (16) is installed above the lifting guide (622). The clamp base (16) has a lifting shaft (16a) that is inserted through the connecting hole (12a) of the clamp lever (12) and is provided in a horizontal direction. As the lifting ring (15) moves along the connecting hole (12a), the lifting shaft (16a) presses the connecting hole (12a) up and down, causing the clamp lever (12) to rotate, thereby moving the clamp pin (11) in the opening and closing directions.

[0027] As shown in FIGS. 5 to 7, three clamp bases (16A) are provided on the inner lifting ring (15A) and each is connected to a clamp lever (12A). Therefore, when the lifting ring (15A) is raised, the three clamp levers (12A) rotate in sync, and the three clamp pins (11A) come into contact with and separate from the substrate W. Three clamp bases (16B) are provided on the outer lifting ring (15B) and each is connected to a clamp lever (12B). Therefore, when the lifting ring (15B) is raised, the three clamp levers (12B) rotate in sync, and the clamp pins (11B) come into contact with and separate from the substrate W. Hereinafter, if the clamp bases (16A, 16B) are not distinguished, they will be referred to as clamp bases (16).

[0028] (rotating body)

[0029] The rotating body (30) is provided with a pivot axis (13) of the clamp lever (12) and rotates the substrate W, which is held and supported by the clamp pin (11), together with the clamp lever (12) and the lifting ring (15). The rotating body (30) has a rotating cover (31) and a rotating base (32), as shown in FIGS. 1 and 2. The rotating cover (31) is cylindrical in shape, with one end blocked by a table (31a). The table (31a) is a circular surface with a diameter larger than that of the substrate W. An outlet (31c), which is a through hole for discharging a processing liquid, is formed on the side (31b) of the rotating cover (31). Also, FIG. 4 is a cross-sectional view taken of the rotating cover (31) in a vertical plane including the axis Ax.

[0030] The rotating base (32) is provided on the lower surface of the table (31a) and is a disc-shaped member coaxial with the table (31a). This axis is the axis Ax which is the center of rotation. The rotation axis (13) of the clamp lever (12) is provided on the rotating base (32). The rotating body (30) is rotatably provided by the rotation mechanism (40) described later on a base part B fixed to a frame installed on an installation surface not shown.

[0031] The lifting ring (15), the clamp base (16), and the other end of the clamp lever (12) (the part connected to the clamp base (16)) are positioned below the table (31a). In addition, the table (31a) has a plurality of through holes (31d) provided along the periphery of the substrate W. In this embodiment, six through holes (31d) are provided at 60-degree intervals. From the through holes (31d), one end of the clamp lever (12) protrudes upward, and the clamp pin (11) is exposed.

[0032] Here, the clamp pin (11) protrudes from the upper surface of the table (31a) through the through hole (31d), and the cover (14) of the clamp pin (11) is supported so as to be positioned on the lower surface of the table (31a). In addition, in order to prevent the processing liquid from entering the interior of the rotating mechanism (40) through the through hole (31d), the gap between the lower surface of the table (31a) and the upper surface of the cover (14) of the clamp pin is made to an extremely small dimension, and when the entire surface of the upper surface of the cover (14) is horizontal, the upper surface of the cover (14) and the lower surface of the table (31a) come into contact due to the rotation of the cover (14), and there is a risk of interference with the opening and closing operation.

[0033] As described above, the cover (14) has an inclined surface (14a) on its upper surface that is positioned on the side of the rotating mechanism (40) rather than the pivot axis (13) of the clamp lever (12). By doing so, the gap between the lower surface of the table (31a) and the cover (14) is reduced, and even if the clamp lever (12) rotates and the clamp pin (11) moves between the open position and the closed position, the cover (14) can be prevented from contacting the lower surface of the table (virtual line α) and interfering with the opening and closing operation.

[0034] The through hole (31d) is sized to allow the opening and closing operation of the clamp lever (12). Six clamp pins (11) exposed from the table (31a) move in a closing direction and come into contact with the outer edge We of the substrate W, thereby holding and supporting the substrate W with respect to the table (31a).

[0035] (Rotating mechanism)

[0036] The rotation mechanism (40) rotates the rotating body (30) around the axis Ax, as shown in FIGS. 1 and 4. The rotating body (30) of the present embodiment is connected to the rotation axis (41). The rotation axis (41) is a tubular body whose upper end is fixed coaxially to the rotation base (32). Additionally, the rotation axis (41) includes cases where a plurality of tubular bodies are connected in the axial direction and configured, and in the present embodiment, the entire assembly is referred to as the rotation axis (41). The axis Ax is a virtual axis that serves as the rotation center of the rotating body (30). The axis Ax of the present embodiment is also the rotation center of the vertical rotation axis (41). When the substrate W is normally held and supported, the center C of the substrate W, on which the outer end We is held and supported by the clamp pin (11), is positioned on this axis Ax. Additionally, the rotation mechanism (40) may be a mechanism in which the rotation axis (41) is positioned offset from the axis Ax and transmits rotation from the rotation axis (41) using gears or the like. That is, the rotation axis (41) connected to the rotating body (30) may be directly or indirectly connected to the rotating body (30) so as to be able to rotate the rotating body (30).

[0037] Additionally, the rotating mechanism (40) has a driving source (42) as shown in FIG. 1. The driving source (42) is a hollow motor having a hollow rotor and a stator that rotates it, and is fixed to a base part B (see FIG. 2). The lower end of the rotating shaft (41) is connected to the rotor of the driving source (42). The driving source (42) rotates the rotating shaft (41) together with the rotor by energizing the coil of the stator.

[0038] (Elevator)

[0039] The lifting mechanism (50) raises the lifting ring (15) non-contactually by the repulsive force of a magnet. As shown in FIG. 2, the lifting mechanism (50) has an opening / closing cylinder (51), an opening / closing lever (52), an opening / closing lifter (53), an opening / closing rod (54), an opening / closing ring (55), a pressing member (56), and a stopper cylinder (57). The opening / closing cylinder (51) is fixed to the lower part of the base part B so that the driving rod faces downward in the vertical direction. The opening / closing cylinder (51) has two opening / closing cylinders (51A, 51B) to raise the lifting rings (15A, 15B) independently.

[0040] The opening / closing lever (52) is a member provided to be rotatable around a support point (52a) on the base part B. This support point (52a) is installed on a support member (52b) that extends vertically downward from the base part B. The end of the opening / closing lever (52) is rotatably connected to the drive rod of the opening / closing cylinder (51). The opening / closing lever (52) is shaped like an inverted U to surround the drive source (42). The opening / closing lever (52) has two opening / closing levers (52A, 52B) corresponding to the two opening / closing cylinders (51A, 51B). However, one opening / closing lever (52A) is obscured in FIG. 2 because it is shaped like an overlapping box placed inside the other opening / closing lever (52B).

[0041] The opening / closing lifter (53) is provided to be vertically movable on the base part B. More specifically, the opening / closing lifter (53) is supported via a linear guide (53b) on a support member (53a) that extends vertically downward from the base part B, so that it can be vertically movable. The opening / closing lifter (53) is configured as a pair with a driving source (42) in between, and is rotatably connected to each end of an inverted C-shaped opening / closing lever (52). The pair of opening / closing lifters (53) connected to the opening / closing lever (52B) is the opening / closing lifter (53B). The pair of opening / closing lifters connected to the opening / closing lever (52A) is the opening / closing lifter (53A) described later, which is located inside the opening / closing lifter (53B), and is hidden in FIG. 2.

[0042] The opening / closing rod (54) is a cylindrical member and is configured to be movable by the opening / closing lifter (53), and protrudes from the upper part of the base portion B. Two opening / closing rods (54) are provided for each opening / closing lifter (53). The opening / closing rod (54) provided for a pair of opening / closing lifters (53A) is the opening / closing rod (54A), and the opening / closing rod (54) provided for a pair of opening / closing lifters (53B) is the opening / closing rod (54B).

[0043] The opening / closing ring (55) is a ring-shaped member provided with a magnet (55a) (see FIGS. 5 to 7). This magnet is positioned to generate a repulsive force against the magnet (15a) of the lifting ring (15). The opening / closing ring (55) is positioned facing downward from the lifting ring (15) and presses the lifting ring (15) upward without contact by utilizing the repulsive force of the magnets (15a, 55a). The opening / closing ring (55) has a pair of opening / closing rings (55A, 55B), each facing the lifting ring (15A, 15B).

[0044] The opening / closing ring (55) is supported on the upper end of the opening / closing rod (54) and moves up and down together with the opening / closing lifter (53) by the opening / closing lever (52) which rotates by the opening / closing cylinder (51). A pair of opening / closing rings (55A, 55B) are each driven independently. When the opening / closing cylinder (51A) moves up and down, the opening / closing lever (52A) rotates and the opening / closing lifter (53A) moves up and down, so the opening / closing rod (54A) moves the opening / closing ring (55A) up and down. When the opening / closing cylinder (51B) moves up and down, the opening / closing lever (52B) rotates and the opening / closing lifter (53B) moves up and down, so the opening / closing rod (54B) moves the opening / closing ring (55B) up and down.

[0045] The pressing member (56) is a member that presses the clamp lever (12) in a direction such that the clamp pin (11) is in a closed position. The pressing member (56) is provided between the rotation axis (41) and each clamp base (16) (see FIG. 4) and presses the lower end of the clamp lever (12) downward. The pressing member (56) is, for example, a tension coil spring with both ends connected between a pin protruding horizontally from the rotation axis (41) and a pin penetrating the lifting guide (622) described later. The pressing member (56) presses the lower end of each clamp lever (12) downward so that each clamp pin (11) is in a closed position.

[0046] The pressure members (56) of this embodiment are six in number, the same number as the clamp levers (12). Three pressure members (56) correspond to three clamp levers (12A), and three pressure members (56) correspond to clamp levers (12B). Since the six pressure members (56) are arranged at equal intervals on the circumference, the force exerted by the pressure members (56) from the clamp pins (11) on the outer end We of the substrate W acts evenly and is balanced, and the center C of the substrate W, which is held and supported by the clamp pins (11), is positioned to coincide with the axis Ax. When the two opening / closing rings (55A, 55B) are raised by the opening / closing cylinders (51A, 51B), the six clamp levers (12A, 12B) rotate in resistance to the pressing force of the pressing member (56), and the six clamp pins (11A, 11B) become open.

[0047] When only the opening / closing ring (55A) rises, the three clamp levers (12A) rotate in resistance to the pressing force of the pressing member (56), the three clamp pins (11A) become open, and the three clamp pins (11B) remain in the closed position. When only the opening / closing ring (55B) rises, the three clamp levers (12B) rotate in resistance to the pressing force of the pressing member (56), the three clamp pins (11B) become open, and the three clamp pins (11A) remain in the closed position.

[0048] If at least three clamp pins (11) are in a closed position and are in contact with the outer edge We of the substrate W, the substrate W can be held and supported. In this embodiment, by switching the lifting and lowering of the opening and closing rings (55A, 55B), three holding and supporting states can be switched: a state in which the substrate W is held and supported by six clamp pins (11A, 11B), a state in which the substrate W is held and supported by three clamp pins (11A), and a state in which the substrate W is held and supported by three clamp pins (11B).

[0049] The stopper cylinder (57) is provided in a position opposite to the drive rod of the opening / closing cylinder (51), with the drive rod facing upward in the vertical direction. By adjusting the protrusion amount of the drive rod of the stopper cylinder (57), the position where the drive rod of the opening / closing cylinder (51) stops can be adjusted, so the opening position of the clamp pin (11) by the lifting and lowering of the opening / closing ring (55) can be adjusted.

[0050] (Synchronization mechanism)

[0051] The synchronization mechanism (60) is a mechanism that synchronizes the rotation of a plurality of clamp levers (12). As shown in FIGS. 2 and 3, the synchronization mechanism (60) has a synchronization ring (61) and a conversion mechanism (62). The synchronization ring (61) is a member provided to be rotatable around an axis Ax and immovable. The synchronization ring (61) is a ring shape that is coaxial with the rotation axis (41) and installed along the outer circumference of the rotation axis (41). The synchronization ring (61) rotates together with the rotation axis (41), but rotates around the rotation axis (41) independently of the rotation axis (41) when a horizontal tangential force is applied.

[0052] A fixed ring (41a) is fixed to the outer circumference of the rotation axis (41). A portion of the outer edge of the fixed ring (41a) protrudes outwardly from the outer edge of the synchronous ring (61), and a cylindrical roller (41b) that rotates around an axis parallel to axis Ax is provided. Since there are multiple portions of the fixed ring (41a) that protrude outwardly and a roller (41b) is provided in each, multiple rollers (41b) are arranged along the outer edge of the fixed ring (41a). A groove is formed on the outer circumference of the roller (41b) to contact the outer edge of the synchronous ring (61), and guides the rotation of the synchronous ring (61) around the rotation axis (41). Two rollers (41b) are arranged in an overlapping vertical direction to guide two synchronous rings (61) that will be described later. In addition, the protruding portion of the outer edge of the fixed ring (41a) and the roller (41b) are configured so as not to interfere with the protruding portion of the outer edge of the synchronous ring (61) described later.

[0053] Two synchronous rings (61) are arranged vertically. The upper side is a synchronous ring (61A) that rotates by the lifting of the lifting ring (15A), and the lower side is a synchronous ring (61B) that rotates by the lifting of the lifting ring (15B). Hereinafter, if the synchronous rings (61A, 61B) are not distinguished, they will be referred to as the synchronous ring (61).

[0054] The conversion mechanism (62) is a mechanism that converts the lifting of the lifting ring (15) by the lifting mechanism (50) into rotation of the synchronous ring (61) while maintaining the posture of the lifting ring (15) in a horizontal state. The conversion mechanism (62) has a oscillating lever (621), a lifting guide (622), and a rotation guide (623). The oscillating lever (621) is an L-shaped member and is provided to be oscillating with a fixed shaft (621a) fixed to the outer circumference of the rotation axis (41) as a support point. An up-and-down movement axis (621b) is provided at the bottom of the oscillating lever (621), and a lateral movement axis (621c) is provided at the top of the oscillating lever (621).

[0055] The lifting guide (622) is fixed to each of the lifting rings (15A, 15B). Additionally, the lifting guide (622) is positioned at a location corresponding to each clamp base (16), that is, at a location corresponding to each clamp lever (12) and each clamp pin (11). A guide hole (622a) that is long in the horizontal direction is formed in the lifting guide (622). An up-and-down movement axis (621b) is inserted through the guide hole (622a) so as to be rotatable and slide-movable. The rotation guide (623) is fixed to the synchronization ring (61) in a state where it can be rotated around a vertical axis but cannot be moved up or down. More specifically, there are protrusions (61a) at multiple locations on the synchronization ring (61), and an axis (62a) extending vertically from the rotation guide (623) is fitted into a through hole provided in the protrusion (61a). The protrusion (61a) is provided on each of the upper and lower synchronous rings (61) and is positioned so as not to interfere with each other as the synchronous rings (61) rotate. A guide groove (623a) that is long in the vertical direction is formed in the rotation guide (623). A transverse movement axis (621c) is inserted through the guide groove (623a) so as to be rotatable and slideable.

[0056] As the lifting ring (15) is raised, the lifting guide (622) presses the vertical movement axis (621b) through the guide hole (622a) to raise it, causing the oscillating lever (621) to oscillate. As a result, the horizontal movement axis (621c) of the oscillating lever (621) presses the rotation guide (623) through the guide groove (623a) to move it horizontally, causing the synchronization ring (61) to rotate.

[0057] The conversion mechanism (62) is provided in at least one set, with a pair arranged in opposing positions with axis Ax in between. In this embodiment, the conversion mechanism (62) has a pair of conversion mechanisms (62A) connecting the lifting ring (15A) and the synchronous ring (61A), and a pair of conversion mechanisms (62B) connecting the lifting ring (15B) and the synchronous ring (61B). That is, this embodiment has two sets of a pair of conversion mechanisms (62). It is preferable that the pair of conversion mechanisms (62A) and the pair of conversion mechanisms (62B) are each arranged on a straight line passing through axis Ax. Hereinafter, if the conversion mechanisms (62A, 62B) are not distinguished, they will be referred to as conversion mechanisms (62). In addition, since one set only restricts one direction of the horizontal plane, it is desirable to provide two or more sets to restrict two or more directions of the horizontal plane so that the center of the lifting ring (15) aligns with the axis Ax. Thus, the center of the lifting ring (15) aligning with the axis Ax leads to the center of the substrate W aligning with the axis Ax.

[0058] Additionally, as described below, if an abnormality in the clamp pin (11) can be detected by the inclination of the lifting ring (15), the pair of conversion mechanisms (62) may be positioned at a location slightly offset from the straight line passing through axis Ax. For example, to avoid interference with other members such as the clamp base (16), they may be positioned at a location slightly offset from the straight line passing through axis Ax. In this case, they are also included in positions facing each other with the rotation axis (41) in between. Furthermore, it is preferable that the straight line passing through the pair of conversion mechanisms (62A) and the straight line passing through the pair of conversion mechanisms (62B) be orthogonal, but as described above, to avoid interference with other members, they do not have to be orthogonal.

[0059] (Supply Department)

[0060] The supply unit (70) supplies a processing liquid to a substrate W that is held and supported by a clamp pin (11) as shown in FIG. 1 and rotated by a rotating body (30). The supply unit (70) supplies the processing liquid to the surface of the substrate W, that is, the side opposite to the table (31a) side of the substrate W held and supported by the holding support unit (10). The supply unit (70) has a processing liquid supply mechanism (71), a processing liquid holding support unit (72), a lifting unit (73), and a heating unit (74).

[0061] The treatment liquid supply mechanism (71) is a mechanism for supplying multiple types of treatment liquids. In this embodiment, for example, as treatment liquids, pure water (H2O), an aqueous solution containing phosphoric acid (H3PO4) (hereinafter referred to as a phosphoric acid solution), and an aqueous solution containing hydrogen fluoride (HF) (hereinafter referred to as a hydrofluoric acid solution) are supplied. The treatment liquid supply mechanism (71) has a treatment liquid tank (71a) for storing each treatment liquid.

[0062] From each treatment liquid tank (71a), individual delivery pipes (71b) are connected in parallel to treatment liquid supply pipes (71c). The tip of the treatment liquid supply pipe (71c) faces the substrate W, which is supported by the holding support member (10). Accordingly, the treatment liquid from each treatment liquid tank (71a) is supplied to the surface of the substrate W through the individual delivery pipes (71b) and the treatment liquid supply pipes (71c). Each individual delivery pipe (71b) is provided with a flow control valve (71d) and a flow meter (71e).

[0063] The treatment liquid holding support (72) is circular in diameter larger than that of the substrate W, and forms a dish shape by forming a wall that rises on the side opposite to the rotating body (30) at the periphery. The outer bottom surface of the treatment liquid holding support (72) faces the substrate W. A discharge port (72a) is formed in the treatment liquid holding support (72) through which the tip of the treatment liquid supply pipe (71c) is inserted and penetrates, and which is exposed toward the substrate W.

[0064] The lifting unit (73) is a mechanism that moves the processing liquid holding support (72) in a direction that separates it from contact with the substrate W. As the lifting unit (73), various mechanisms that move the processing liquid holding support (72) in a direction parallel to the axis of the rotating body (30), such as a cylinder or a ball screw mechanism, can be applied, but details are omitted.

[0065] The heating unit (74) heats the processing liquid supplied onto the surface of the substrate W by the supply unit (70). The heating unit (74) has a heater (741) provided on the side opposite to the side facing the substrate W of the processing liquid holding support unit (72). The heater (741) is in the form of a circular sheet. A through hole (741a) is formed in the heater (741) through which a processing liquid supply pipe (71c) is inserted.

[0066] (Detection unit)

[0067] The detection unit (80) detects the height position of the lifting ring (15) as shown in FIGS. 5 to 7. The detection unit (80) is a reflective optical sensor that detects the distance to the detection target non-contactually. The detection unit (80) is fixed to the base unit B below the height detection plate (151) and detects the distance from the height detection plate (151). The detection unit (80) has detection units (80A, 80B). The detection unit (80A) is positioned below the height detection plate (151A) and detects the height position of the lifting ring (15A) based on the distance from the height detection plate (151A). The detection unit (80B) is positioned below the height detection plate (151B) and detects the height position of the lifting ring (15B) based on the distance from the height detection plate (151B). In the following cases, if the detection unit (80A, 80B) and the height detection plate (151A, 151B) are not distinguished, they are simply referred to as the detection unit (80) and the height detection plate (151).

[0068] The detection unit (80) may be a single unit or multiple units. In the case of a single unit, the lifting ring (15) is rotated together with the rotating body (30) to detect height positions at multiple locations in the circumferential direction. In the case of multiple units, each detection unit (80) detects height positions at multiple locations in the circumferential direction.

[0069] (controller)

[0070] The control device (90) controls each part of the substrate processing device (1). To realize various functions of the substrate processing device (1), the control device (90) has a processor that executes a program, a memory that stores various information such as a program or operating conditions, and a driving circuit that drives each element. That is, the control device (90) controls the rotating mechanism (40), the lifting mechanism (50), the supply unit (70), etc. In addition, the control device (90) has an input device that inputs information and a display device that displays information.

[0071] In this embodiment, the control device (90) has an opening / closing control unit (91), a rotation control unit (92), and a judgment unit (93). The opening / closing control unit (91) controls the opening / closing cylinder (51) of the lifting mechanism (50) to raise the opening / closing ring (55) and raises the lifting ring (15) by the repulsive force of the magnets (15a, 55a) to open / close the clamp pin (11). When the opening / closing ring (55) rises and the lifting ring (15) rises, the clamp lever (12) rotates in resistance to the pressing force of the pressing member (56), and the clamp pin (11) becomes open, separated from the outer edge We of the substrate W. When the opening / closing ring (55) descends and the lifting ring (15) descends, the clamp lever (12) rotates due to the pressing force of the pressing member (56), and the clamp pin (11) comes into contact with the outer edge We of the substrate W, resulting in a closed state.

[0072] The rotation control unit (92) controls the rotation of the substrate W held and supported by the rotating body (30) and the clamp pin (11) by controlling the driving source (42) of the rotation mechanism (40). Additionally, the rotation control unit (92) can rotate the lifting ring (15) together with the rotating body (30) to change the location detected by the detection unit (80) in the lifting ring (15).

[0073] The judgment unit (93) determines whether the holding support of the substrate W by the clamp pin (11) is normal based on the height position of the lifting ring (15) detected by the detection unit (80). As shown in FIG. 5, if the difference in the height position (Da) of each location of the lifting ring (15) detected by the detection unit (80) is within a predetermined threshold range, it can be determined that the holding support of the substrate W by the clamp pin (11) is normal. FIG. 5 (A) indicates that the holding support by the clamp pin (11A) is normal, and FIG. 5 (B) indicates that the holding support by the clamp pin (11B) is normal.

[0074] FIG. 6 (A) shows a lifting ring in which the holding support by the clamp pin (11) is normal and the height position is normal. FIG. 6 (B) shows a lifting ring in which the holding support by the clamp pin (11) is abnormal and an abnormality occurs in the height position. As shown in FIG. 6 (B), when the difference in the height position Db of each location of the lifting ring (15) detected by the detection unit (80) is outside the range of a predetermined threshold, it can be determined that an inclination of the lifting ring (15) is occurring due to an abnormality in the holding support of the substrate W by the clamp pin (11). FIG. 6 (B) is a case where an abnormality occurs in the holding support of the clamp pin (11B). In this case, the inclination of the lifting ring (15A) of the clamp pin (11A) with normal holding support increases, and the height detection plate (151A) becomes lower. Meanwhile, the lifting ring (15B) of the clamp pin (11B) that has an abnormal support is also lowered from the normal height (see (A) in FIG. 6). Because of this, both detection units (80A, 80B) can detect the occurrence of an abnormality by the difference in height position Db becoming greater than a predetermined threshold, and depending on which of the detection units (80A, 80B) detects a larger difference in height position Db, it can detect that an abnormality has occurred in the clamp pin (11A or 11B) corresponding to the side with the larger difference in height position Db.

[0075] Additionally, the judgment unit (93) can determine that the clamp pin (11) is in an open position separated from the substrate W if the difference in height position Dc of each location of the lifting ring (15) detected by the detection unit (80), as shown in FIG. 7, is within a predetermined threshold range. FIG. 7 (A) shows the clamp pin (11A) in an open position while holding support is provided only by the clamp pin (11B), and FIG. 7 (B) shows the clamp pin (11B) in an open position while holding support is provided only by the clamp pin (11A).

[0076] The principle and method of such determination will be explained with reference to FIG. 8. In the following description, the mechanism for opening and closing the clamp pin (11A) may be referred to as the A-side mechanism, and the mechanism for opening and closing the clamp pin (11B) may be referred to as the B-side mechanism. Additionally, a straight line connecting the locations where a pair of conversion mechanisms (62A) are arranged is denoted as M, and a straight line connecting the locations where a pair of conversion mechanisms (62B) are arranged is denoted as N.

[0077] FIG. 8 (A) shows a state in which all clamp pins (11A, 11B) normally hold and support the substrate W. In this normal state, the center C of the substrate W coincides with the axis of rotation Ax, and the substrate W and the lifting ring (15A, 15B) are kept horizontal.

[0078] Fig. 8 (B) shows a state in which an abnormality occurs in the holding support of the clamp pin (11B) on the B side. In this state, the abnormal clamp pin (11B) (hereinafter shown in black) is pressed by the opposing clamp pin (11A) in the direction indicated by the white arrow in the drawing. Because of this, as indicated by the arc-shaped arrow, the corresponding lifting ring (15B) tilts downward to a lower position than in the normal case with M as the axis, and the center C of the substrate W deviates from the axis of rotation Ax in the direction of the black arrow in the drawing. Following this deviation of the substrate W's position, the normal clamp pin (11A) also deviates from the normal position, so the lifting ring (15A) also moves downward to a lower position than in the normal case.

[0079] Then, since there is a location where the distance to the lifting ring (15A, 15B) detected by the detection unit (80A, 80B) becomes smaller than a predetermined threshold, it can be determined that an abnormality has occurred. And, for the lifting ring (15B) corresponding to the clamp pin (11B) where the abnormality occurred, the slope increases, and since the difference in distance between multiple locations detected by the detection unit (80B) becomes larger than a predetermined threshold, it can be determined that there was an abnormality in the holding support of any of the clamp pins (11B).

[0080] Fig. 8 (C) shows a state in which an abnormality has occurred in the holding support of a clamp pin (11A) on the A side, and Fig. 8 (D) shows a state in which an abnormality has occurred in the holding support of a clamp pin (11A) on the A side different from Fig. 8 (C). Even in this case, since the distance to the lifting ring (15A, 15B) detected by the detection unit (80A, 80B) becomes smaller than a predetermined threshold, it can be determined that an abnormality has occurred. And, for the lifting ring (15A) corresponding to the clamp pin (11A) in which an abnormality has occurred, since the inclination with N as the axis increases, it can be determined that there was an abnormality in the holding support of one of the clamp pins (11A).

[0081] [movement]

[0082] The operation of the substrate processing device (1) of the present embodiment as described above will be explained with reference to the flowchart of FIG. 9, in addition to FIG. 1 to 8 above. Furthermore, a substrate processing method that processes a substrate by the following steps is also an aspect of the present embodiment.

[0083] First, as shown in FIG. 2, by raising the lifting ring (15) by means of the opening / closing cylinder (51), the clamp lever (12) is rotated to resist the pressing force of the pressing member (56), and the plurality of clamp pins (11) are placed in an open position. In addition, the processing liquid holding support part (72) of the supply part (70) shown in FIG. 1 is in an upward standby position.

[0084] In this state, the substrate W mounted on the robot hand of the return robot is brought in between the processing liquid holding support (72) and the rotating body (30) (Step S01). The opening / closing cylinder (51) is operated to lower the lifting ring (15), thereby rotating the clamp lever (12) by the pressing force of the pressing member (56) to move the plurality of clamp pins (11) to the closed position (Step S02).

[0085] Then, the inclined surface of the support member (11a), which moves together with the clamp pin (11), slides and supports the lower edge of the outer end We of the substrate W, and the clamp pin (11) comes into contact with and holds the outer end We of the substrate W.

[0086] At this time, the opening / closing cylinder (51A, 51B) lowers the lifting ring (15A, 15B) so that all six clamp pins (11A, 11B) hold the outer edge We of the substrate W. By doing so, the center C of the substrate W is positioned on the axis of rotation Ax by the six clamp pins (11A, 11B).

[0087] As described above, when the judgment unit (93) determines that the height position of a plurality of the lifting ring (15) detected by the detection unit (80) is normal ("Yes" of step S03) (state of FIG. 5), the driving source (42) operates and the rotating body (30) starts to rotate (step S06). The rotating body (30) rotates at a relatively low speed (e.g., about 50 rpm) and the substrate W together with the holding support unit (10) at the said speed.

[0088] If the judgment unit (93) determines that the clamp pin (11A or 11B) of either one is not in a normal position ("No" in step S03), a recovery operation of the substrate W is performed (step S04). That is, by raising the lifting ring (15), the clamp pin (11) is moved slightly away from the outer edge We of the substrate W while maintaining support of the substrate W by the support unit (11a). Then, the lifting ring (15) is lowered again to maintain support of the outer edge We of the substrate W by the clamp pin (11).

[0089] After this recovery operation, if the judgment unit (93) determines that the clamp pin (11) is in a normal position ("Yes" in Step S05), the driving source (42) is operated and the rotating body (30) begins to rotate (Step S06). Even after the recovery operation, if the judgment unit (93) determines that the holding support of the clamp pin (11) is not normal ("No" in Step S05), the multiple clamp pins (11) are moved to an open position (Step S18). Then, the substrate W is removed by the robot hand (Step S19).

[0090] When the clamp pin (11) is in a normal state and the rotating body (30) starts to rotate, the etching solution, which is the processing solution, is supplied to the gap between the processing solution holding support (72) and the surface of the substrate W by the processing solution supply mechanism (71) from the discharge port (72a) of the processing solution holding support (72) (Step S07). That is, when the hydrofluoric acid solution is supplied to the surface of the rotating substrate W, the etching solution moves sequentially toward the outer edge We of the substrate W, so the surface of the substrate W is etched and the oxide film and organic material are removed.

[0091] Next, the treatment solution supply mechanism (71) stops supplying the etching solution (step S08) and supplies pure water from the discharge port (72a) into the gap between the treatment solution holding support (72) and the surface of the substrate W (step S09). When pure water is supplied to the surface of the rotating substrate W, the pure water moves sequentially toward the outer edge We of the substrate W, thereby washing away the hydrofluoric acid solution on the surface of the substrate W. Then, the treatment solution supply mechanism (71) stops supplying the pure water (step S10).

[0092] The treatment liquid holding support (72) descends to bring the heater (741) close to the substrate W (Step S11). The treatment liquid supply mechanism (71) supplies the phosphoric acid solution into the gap between the treatment liquid holding support (72) and the surface of the substrate W (Step S12). In this way, the phosphoric acid solution supplied between the treatment liquid holding support (72) and the surface of the substrate W is heated to a high temperature by the treatment liquid holding support (72), which is heated by the heater (741).

[0093] In this state, when the phosphoric acid solution is continuously supplied from the discharge port (72a) of the treatment solution holding support (72), the phosphoric acid solution moves sequentially toward the outer edge We of the substrate W on the surface of the substrate W, thereby replacing the pure water on the surface of the substrate W with phosphoric acid and removing the nitride film by etching.

[0094] Next, the treatment solution supply mechanism (71) stops supplying the phosphoric acid solution, and the treatment solution holding support (72) rises (step S13). The treatment solution supply mechanism (71) supplies pure water from the discharge port (72a) into the gap between the treatment solution holding support (72) and the surface of the substrate W (step S14). When pure water is supplied to the surface of the rotating substrate W, the pure water moves sequentially toward the outer edge We of the substrate W, thereby washing away the phosphoric acid on the surface of the substrate W.

[0095] Then, when a predetermined cleaning time has elapsed, the treatment liquid supply mechanism (71) stops supplying pure water (step S15). Then, the treatment liquid holding support (72) rises (step S16), and the driving source (42) stops, causing the rotating body (30) to stop rotating, thereby stopping the rotation of the substrate W (step S17).

[0096] Then, as the robot hand is inserted into the lower part of the substrate W, the opening / closing cylinder (51) is operated to raise the lifting ring (15), thereby rotating the clamp lever (12) and moving the plurality of clamp pins (11) to an open position (step S18). Then, the substrate W is removed by the robot hand (step S19).

[0097] In addition, during the processing of the substrate W, the occurrence of processing non-uniformity is suppressed by replacing the clamp pins (11A, 11B). That is, the state in which the substrate W is held and supported by six clamp pins (11A, 11B) is switched to a state in which the substrate W is held and supported by only three clamp pins (11A) with three clamp pins (11B) in an open position, and a state in which the substrate W is held and supported by only three clamp pins (11B) with three clamp pins (11A) in an open position. By doing so, the time that a specific clamp pin (11A, 11B) is in contact with the substrate W is prevented from becoming prolonged, thereby suppressing the occurrence of processing non-uniformity caused by the processing liquid remaining at the contact position.

[0098] However, when switching between a holding support state using only three clamp pins (11A) and a holding support state using only three clamp pins (11B), a holding support state using six clamp pins (11A, 11B) is interposed in between to prevent misalignment of the center position of the substrate W or a failure in holding support. That is, for example, a switching operation is performed such that the holding support with six clamp pins (11A, 11B) → ​​holding support with three clamp pins (11A) → holding support with six clamp pins (11A, 11B) → ​​holding support with three clamp pins (11B) → ​​holding support with six clamp pins (11A, 11B) → ​​holding support with three clamp pins (11A) → holding support with six clamp pins (11A, 11B) → ​​holding support with three clamp pins (11B) → ​​holding support with six clamp pins (11A, 11B)… And, before starting rotation and before stopping rotation, it must be held in a supported state by the six clamp pins (11A, 11B).

[0099] Additionally, when the judgment unit (93) determines that an abnormality has occurred in the holding support of the clamp pin (11) based on the height position of the lifting ring (15) detected by the detection unit (80) during the processing of the substrate W (steps S06 to S17), the control device (90) stops the substrate processing. That is, if the fluctuation range of the height position of the rotating lifting ring (15) becomes outside the range of a predetermined threshold, it is determined that an abnormality has occurred in the holding support of the clamp pin (11), and the control device (90) immediately takes measures such as stopping the device.

[0100] [effect]

[0101] (1) The substrate processing device (1) of the present embodiment as described above comprises at least three clamp pins (11) that hold and support the outer edge We of a substrate W, a clamp lever (12) that moves the clamp pin (11) between an open position spaced apart from the outer edge We of the substrate W and a closed position that holds and supports the substrate W in contact with the outer edge We of the substrate W according to rotation around a horizontal axis (rotation axis (13)), a lifting ring (15) that rotates the clamp lever (12) according to lifting and lowering, a rotating body (30) that rotates the substrate W held and supported by the clamp pin (11) together with the clamp lever (12) and the lifting ring (15) provided with a rotation axis (13) of the clamp lever (12), a rotating mechanism (40) that rotates the rotating body (30) around an axis Ax (vertical rotation axis (41)), and lifting and lowering The apparatus has a lifting mechanism (50) that raises and lowers a ring (15) in a direction along axis Ax, a pressing member (56) that presses a clamp lever (12) in a direction in which the clamp pin (11) becomes a closed position, a synchronous ring (61) that is rotatably and immovably arranged around axis Ax, a conversion mechanism (62) that converts the lifting of the lifting ring (15) by the lifting mechanism (50) into rotation of the synchronous ring (61) while maintaining the position of the lifting ring (15) in a horizontal state, and a supply unit (70) that supplies a processing liquid to a substrate W that is held and supported by the clamp pin (11) and rotates by a rotating body (30).

[0102] For this reason, as the lifting ring (15) is raised by the lifting mechanism (50), the clamp lever (12) rotates in resistance to the pressure of the pressure member (56), and the clamp pin (11) becomes open. As the lifting ring (15) is lowered by the lifting mechanism (50), the clamp lever (12) rotates in accordance with the pressure of the pressure member (56), and the clamp pin (11) becomes closed. At this time, since the lifting ring (15) is connected to the synchronous ring (61), which is rotatable and non-liftable, via the conversion mechanism (62), it lowers while maintaining a horizontal direction. For this reason, there is no variation in the operation of each clamp pin (11) due to the tilt of the lifting ring (15), and the clamp pin (11) contacts the outer edge We of the substrate W in synchronization. The pressing force of the pressing member (56) acts on at least three clamp pins (11) to hold and support the outer edge We of the substrate W, so that the combined force of all clamp pins (11) becomes zero, i.e., the center C of the substrate W is aligned with the axis Ax.

[0103] For example, as shown in FIG. 10, the clamp pin (11) is configured to open and close by the up and down movement of the lifting ring (15), and even in the absence of a synchronization mechanism (60) (synchronizing ring (61)), the combined force of the clamp pin (11) becomes zero, making it possible to hold and support the substrate W. However, in the absence of a synchronization mechanism (60), when the substrate W is held and supported in a state where the force of all clamp pins (11) is balanced by the combined force of the force of the pressing member (56), the substrate W moves in the direction in which the centrifugal force is applied due to the centrifugal force acting by the rotation of the substrate W, and misalignment occurs between the center C of the substrate W and the axis Ax (rotation axis (41)). In addition, if there is a problem with the clamp pin (11) or the clamp lever (12), the center C of the substrate W becomes misaligned from the axis Ax. In this state, the fact that the force of all clamp pins (11) gripping the substrate W is balanced by the combined force of the pressing member (56) means that the state is balanced, and the pressing force of the pressing member (56) is not applied. If there is no pressing force of the pressing member (56), a problem arises in that the lifting ring (15) can tilt as shown in FIG. 10. This is because the lifting ring (15) is restricted in the direction of rotation but not in the vertical direction. In this embodiment, since the movement in the vertical direction is restricted without applying restriction to rotation by the conversion mechanism (62) and the synchronization mechanism (60), the lifting ring can be maintained in a horizontal state and the center of the substrate W can be aligned with the axis Ax.

[0104] That is, in this embodiment, the lifting ring (15) is connected to the synchronous ring (61) through the conversion mechanism (62), and as the lifting ring (15) moves, the synchronous ring (61) rotates without moving. Because of this, when the substrate W is rotating, even if a force is applied to rotate the clamp lever (12) by the centrifugal force applied to one of the clamp pins (11), the movement of the lifting ring (15) supporting the clamp lever (12) to rise is suppressed by the synchronous ring (61). Even if a force is applied to rotate one of the clamp pins (11) and the clamp lever (12) by the centrifugal force to raise the lifting ring (15), since the other clamp pin (11) is also synchronous, a force is required to open the other clamp pin (11) and the clamp lever (12) in order for the lifting ring (15) to actually rise. Therefore, the force that raises the lifting ring (15) to rotate the synchronous ring (61) acts as resistance, so even if the substrate W presses the clamp pin (11) and clamp lever (12) by centrifugal force, the clamp pin (11) and clamp lever (12) cannot be opened. As a result, it becomes difficult for the clamp lever (12) to rotate, and since the movement of the clamp pin (11) to the open position is suppressed, the positioning of the substrate W is stabilized.

[0105] Additionally, when lowering the lifting ring (15), the clamp lever (12) is closed, and the clamp pin (11) in contact with the outer edge We of the substrate W moves the substrate W, moving the center of the substrate W to the center of rotation (axis Ax). At this time, not all clamp pins (11) contact the outer edge We of the substrate W simultaneously. When the substrate W is transported by the robot, it is loaded in a deviated state due to the inclined surface of the clamp pin (11). That is, when the lifting ring (15) is lowered and operated in the direction of closing the clamp pin (11), some of the clamp pins (11) initially come into contact with the outer edge We of the substrate W. For example, if there is no synchronous mechanism (60), if the movement is stopped during this process, only the clamp pins (11) that are not in contact with the outer edge We move, thereby holding and supporting the substrate W while the lifting ring (15) is in an inclined state. In this embodiment, since the lifting ring (15) is raised while maintaining a horizontal state by means of the conversion mechanism (62) and the synchronization mechanism (60), even if there is a misalignment in the timing when the clamp pin (11) contacts the outer edge We of the conveyed substrate W, the tilt of the lifting ring (15) is suppressed, so that when the clamp pin (11) is finally closed, the center of the substrate W and the axis Ax can be aligned.

[0106] Additionally, for example, it is conceivable to install an axis slider (linear guide), which is parallel to the axis Ax of the rotating body (30), on the lifting ring (15) to raise and lower the lifting ring (15). However, in this case, installing the axis slider increases the weight of the rotating body (30) and the rotating shaft (41), thereby increasing the load on the motor. Furthermore, in order to raise and lower while maintaining a horizontal position and preventing eccentric rotation, it becomes necessary to arrange multiple axis sliders facing each other with the rotating shaft (41) in between, which further increases the weight. In this embodiment, since a synchronous ring (61) that rotates coaxially with the rotating shaft (41) is used through a conversion mechanism (62), the weight of the rotating part can be reduced, and eccentric rotation can also be suppressed.

[0107] Additionally, for example, one can consider moving a cylindrical slide that is long in the axial direction along the axis to raise the lifting ring (15) with this slide, thereby suppressing the occurrence of tilt in the lifting ring (15). However, in the case of a cylindrical slide, in order to raise the axis smoothly relative to the cylindrical part, it is necessary to make the diameter of the hole in the cylindrical part larger than the diameter of the axis to provide clearance. That is, since a gap (play) is created between the hole in the cylindrical part and the axis, the axis becomes prone to tilting. Consequently, the lifting ring (15) also tilts, causing the clamp lever (12) to tilt, and the substrate W cannot be positioned on the axis Ax of the rotation center. Furthermore, if the diameter of the hole in the cylindrical part is made such that there is no play with the axis, the contact between the axis and the cylindrical part increases, creating resistance, and it cannot be said that the lifting ring (15) can be raised smoothly. In this embodiment, the lifting of the lifting ring (15) is converted into rotation of the synchronous ring (61) by the conversion mechanism (62), and since the position of the lifting ring (15) is maintained in a horizontal state, such rattling does not occur.

[0108] (2) It has a detection unit (80) that detects the height position of the lifting ring (15) and a determination unit (93) that determines whether the holding support of the substrate W by the clamp pin (11) is normal based on the height position of the lifting ring (15) detected by the detection unit (80).

[0109] When an abnormality occurs in the clamp pin (11) or clamp lever (12) and the clamp pin (11) is unable to hold and support the substrate W, an inclination occurs in the lifting ring (15) with the line connecting the pair of conversion mechanisms (62) as the axis. Because of this, based on the height position of the lifting ring (15), the judgment unit (93) determines an abnormality in the holding and support of the substrate W by the clamp pin (11), thereby preventing misalignment of the holding and support of the substrate W or failure of the device.

[0110] (3) The lifting mechanism (50) lifts the lifting ring (15) without contact by means of the repulsive force of the magnets (15a, 55a). Because of this, the lifting ring (15) can be lifted while rotating together with the rotating body (30). In addition, since a gap is created between the lifting mechanism (50) and the lifting ring (15), an abnormality in the holding support of the substrate W can be determined according to the change in the height position of the lifting ring (15).

[0111] (4) At least six clamp pins (11) are arranged in sets of three or more at intervals around the rotation axis (41), and the lifting mechanism (50), lifting ring (15), synchronization ring (61), and conversion mechanism (62) are provided on at least one set of clamp pins (11). Because of this, it is possible to replace the substrate W with three clamp pins (11) during processing, thereby preventing uneven processing caused by the retention of the processing liquid.

[0112] Additionally, the three clamp pins (11) are the minimum number capable of holding and supporting the substrate W. If the load on one of the clamp pins (11) increases due to centrifugal force, the other two clamp pins (11) cannot support the substrate W, and the misalignment increases. However, in the holding and supporting of the substrate W by the clamp pins (11) of the present embodiment, as described above, by using a synchronous ring (61) and a conversion mechanism (62), it is difficult for the three clamp pins (11) to misalign even when centrifugal force is applied, so the substrate W can be replaced stably.

[0113] In addition, if an abnormality occurs in the holding support by the clamp pin (11) of one side of the jaw, as described above, the tilt of the lifting ring (15) on the other side of the jaw becomes larger, and thus a difference occurs depending on the jaw, so it can be determined that an abnormality has occurred in the clamp pin (11) of which side of the jaw.

[0114] (5) The conversion mechanism (62) has a oscillating lever (621) that oscillates using a fixed axis in a horizontal direction perpendicular to the axis Ax as a support point and converts the lifting of the lifting ring (15) into the rotation of the synchronous ring (61). Because of this, the lifting motion of the lifting ring (15) can be efficiently converted into a horizontal motion by means of the oscillating lever (621) that oscillates using the fixed axis as a support point, thereby allowing the synchronous ring (61) to rotate. In addition, by providing a plurality of conversion mechanisms (62) around the rotation axis (41), the lifting ring (15) can be raised and lowered more stably while maintaining a horizontal state, and the position of the clamp pin (11) is stabilized.

[0115] [Variation Example]

[0116] (1) The conversion mechanism (62) can convert the lifting motion of the lifting ring (15) into the rotation of the synchronous ring (61). In the above embodiment, as shown in (A) of FIG. 11, the lifting motion was converted into rotation in principle by an L-shaped link L, but, for example, as shown in FIG. 12, the conversion mechanism (62) may be provided on the lifting ring (15) and configured by a slide shaft (624) inclined with respect to axis Ax and a slider (625) connected to the synchronous ring (61) and moving along the slide shaft (624) which moves up and down together with the lifting ring (15) to rotate the synchronous ring (61).

[0117] More specifically, the slide shaft (624) is a cylindrical member and is provided on a slide shaft base (624a) fixed to the lifting ring (15). The slider (625) has a sleeve through which the slide shaft (624) is inserted. In the synchronization ring (61), a conversion member (625a) is provided so as to be rotatable in a horizontal direction on a pivot axis (625b) parallel to the rotation axis (41). With respect to the conversion member (625a), the slider (625) is connected so as to be slidable in a radial direction through a diameter axis (625c) in the radial direction of the rotation circle of the rotation axis (41).

[0118] When the lifting ring (15) rises, the slide shaft (624) rises, and as the slider (625) moves along the inclination of the slide shaft (624), the radial axis (625c) is pressed in the tangential direction of the rotation circle of the synchronous ring (61). Then, as the conversion member (625a) is pressed together with the radial axis (625c), the conversion member (625a) rotates around the pivot axis (625b), and the synchronous ring (61) is pressed in the circumferential direction and rotates.

[0119] In this way, the radial deviation occurring between the linear movement of the slider (625) and the rotational movement of the synchronization ring (61) can be absorbed by the sliding movement of the slider (625) about the radial axis (625c) and the rotation of the conversion member (625a). That is, by having two degrees of freedom, the operation of the conversion mechanism (62) can be stabilized.

[0120] In addition, as shown in (B) of FIG. 11, the lifting motion may be changed to rotation by a link L using a cam. That is, as shown in FIG. 13, a conversion mechanism (62) may be provided on the lifting ring (15), and configured by a cam (626) inclined with respect to axis Ax and a cam shaft (627) connected to the synchronous ring (61) and moving along the cam (626) which lifts together with the lifting ring (15) to rotate the synchronous ring (61).

[0121] More specifically, the cam (626) is an elongated hole formed in a cam base (626a) fixed to the lifting ring (15). This cam (626) is inclined with respect to axis Ax. The cam shaft (627) is a cylindrical member inserted through the cam (626). The synchronous ring (61) is provided such that the cam shaft (627) can rotate horizontally around an axis parallel to axis Ax. A horizontal axis (627b), fixed to the rotation axis (41) in a tangential direction to the rotation circle of the synchronous ring (61), is inserted through the cam shaft (627) so as to be slidably movable.

[0122] When the lifting ring (15) rises, the cam (626) rises, and as the camshaft (627) moves along the incline within the cam (626), the camshaft (627) moves horizontally along the horizontal axis (627b) and simultaneously presses the synchronous ring (61) in the tangential direction of the rotation circle. Then, the synchronous ring (61) is pressed in the circumferential direction and rotates.

[0123] In this conversion mechanism (62) by the cam (626), a greater force is required to open the clamp pin (11) due to the frictional force between the cam (626) and the cam shaft (627), so even if centrifugal force is applied, it is difficult for the position of the clamp pin (11) to become misaligned.

[0124] In addition, as shown in (C) of FIG. 11, the conversion mechanism (62) that converts a lifting motion into a rotational motion by means of a straight link L having two rotational support points may also be used.

[0125] (2) If replacement operation is not performed, a configuration using a single synchronous ring (61) may be used. For example, as shown in FIG. 14, three conversion mechanisms (62) are fixed to the inner lifting ring (15A) and connected to the synchronous ring (61), thereby allowing the lifting ring (15A) to be raised and lowered while maintaining it horizontally. Three clamp pins (11A) are arranged on this lifting ring (15A). The lifting ring (15B) is not provided with a conversion mechanism (62) and has three clamp pins (11B) arranged on it. The opening and closing ring (55) is common to the lifting rings (15A, 15B), and by raising and lowering the opening and closing ring (55), the lifting rings (15A, 15B) are raised and lowered simultaneously. By doing so, the center C of the substrate W can be positioned on the axis Ax by means of six clamp pins (11A, 11B). More specifically, the center C of the substrate W is positioned (centered) on axis Ax using three clamp pins (11A) provided on the lifting ring (15A), and the outer circumference of the centered substrate W is gripped using three clamp pins (11B). At this time, the substrate W is centered by moving the center C of the substrate W toward axis Ax from the direction in which the conversion mechanism (62) is positioned, due to the lifting movement of the two lifting rings and the rotational movement of the synchronization ring (61). When properly held and supported, it can be confirmed that the substrate W is properly centered and held by the lifting rings (15A, 15B) being at the same height in a horizontal state. In the event that there is a problem with either of the clamp pins (11A, 11B), the problem can be determined by the lowering and tilting of the lifting rings (15A, 15B), just as above. The number of clamp pins (11) is not limited, but at least three are required. For this reason, in the variation of FIG. 14, it may be an embodiment that does not have a lifting ring (15B) and three clamp pins (11B).

[0126] (3) The lifting mechanism (50) is not limited to the above-mentioned embodiment. For example, it may be configured as a contact type rather than a non-contact type based on the repulsive force of a magnet, for example, by using a cam follower that can be lifted and lowered, and by bringing the rotating roller of the cam follower into contact with the lifting ring (15) to lift and lower it, thereby enabling the rotation of the lifting ring (15).

[0127] (4) The processing contents and processing solution of the substrate processing device (1) are not limited to those exemplified above. The substrate W and film to be processed are also not limited to those exemplified above.

[0128] [Other embodiments]

[0129] Although embodiments and variations of each part of the present invention have been described above, these embodiments and variations of each part are presented as examples and are not intended to limit the scope of the invention. The novel embodiments described above may be implemented in various other forms, and various omissions, substitutions, and modifications may be made within the scope of not departing from the essence of the invention. These embodiments and variations thereof are included in the invention described in the patent claims as they are included within the scope and essence of the invention. Explanation of the symbols

[0130] 1: Substrate processing device 10: Holding support 11, 11A, 11B: Clamp pin 11a: Support 12, 12A, 12B: Clamp lever 12a: Connecting hole 13: Rotating shaft 14: Cover 14a: Inclined surface 15, 15A, 15B: Lifting ring 15a, 55a: Magnet 16, 16A, 16B: Clamp base 16a: Lifting shaft 30: Rotating body 31: Rotating cover 31a: Table 31b: Side 31c: Discharge port 31d: Through hole 32: Rotating base 40: Rotating mechanism 41: Rotating shaft 41a: Fixed ring 41b: Roller 42: Driving source 50: Lifting mechanism 51, 51A, 51B: Opening / closing cylinder 52, 52A, 52B: Opening / closing lever 52a: Support point 52b: Support member 53, 53A, 53B: Opening / closing Lifter 53a: Support member 53b: Linear guide 54, 54A, 54B: Opening / closing rod 55, 55A, 55B: Opening / closing ring 56: Pressurizing member 57: Stopper cylinder 60: Synchronizing mechanism 61, 61A, 61B: Synchronizing ring 61a: Protrusion 62, 62A, 62B: Conversion mechanism 62a: Shaft 70: Supply unit 71: Processing fluid supply mechanism 71a: Processing fluid tank 71b: Individual delivery pipe 71c: Processing fluid supply pipe 71d: Flow rate regulating valve 71e: Flow meter 72: Processing fluid holding support unit 72a: Discharge port 73: Lifting unit 74: Heating unit 80, 80A, 80B: Detector unit 90: Control device 91: Opening / closing control unit 92: Rotation control unit 93: Judgment unit 151, 151A, 151B: Height detection plate 621: Oscillation Lever 621a: Fixed shaft 621b: Vertical movement shaft 621c: Lateral movement shaft 622: Lifting guide 622a: Guide hole 623: Rotation guide 623a: Guide groove 624: Slide shaft 624a: Slide shaft base 625: Slider 625a: Converting member 625b: Swivel shaft 625c: Diameter shaft 626: Cam 626a: Cam base 627: Cam shaft 627b: Horizontal shaft 741: Heater 741a: Through hole

Claims

Claim 1 At least three clamp pins holding and supporting the outer edge of a substrate; a clamp lever on which the clamp pins are provided and which moves the clamp pin between an open position spaced apart from the outer edge of the substrate and a closed position in contact with the outer edge of the substrate to hold and support the substrate, according to rotation around a horizontal axis of rotation; a lifting ring that rotates the clamp lever according to lifting and lowering; a rotating body on which the axis of rotation of the clamp lever is provided and which rotates the substrate held and supported by the clamp pin together with the clamp lever and the lifting ring; a rotating mechanism that rotates the rotating body around a vertical axis of rotation; a lifting mechanism that lifts the lifting ring in a direction along the axis of rotation; a pressing member that presses the clamp lever in a direction in which the clamp pin becomes the closed position; a synchronous ring provided to be rotatable around the axis of rotation and also immobile; and the posture of the lifting ring while converting the lifting of the lifting ring by the lifting mechanism into rotation of the synchronous ring A substrate processing device characterized by having a conversion mechanism that maintains a horizontal state and a supply unit that supplies a processing liquid to a substrate that is held and supported by the clamp pin and rotates by the rotating body. Claim 2 A substrate processing device according to claim 1, characterized by having a detection unit for detecting the height position of the lifting ring and a determination unit for determining whether the holding support of the substrate by the clamp pin is normal based on the height position of the lifting ring detected by the detection unit. Claim 3 A substrate processing device according to paragraph 2, wherein the lifting mechanism raises the lifting ring non-contactually by the repulsive force of a magnet. Claim 4 A substrate processing apparatus according to claim 1 or 2, wherein the clamp pins are provided in sets of at least 6, arranged at intervals of 1 around the rotation center axis of the rotation axis, and the lifting mechanism, the lifting ring, the synchronization ring, and the conversion mechanism are provided in sets of at least 1 set of clamp pins. Claim 5 A substrate processing apparatus according to claim 1, wherein the conversion mechanism has a oscillating lever that oscillates using a fixed axis in a horizontal direction orthogonal to the rotation axis as a support point and converts the lifting of the lifting ring into the rotation of the synchronous ring. Claim 6 A substrate processing apparatus according to claim 1, wherein the conversion mechanism comprises a slide axis inclined with respect to the rotation center axis of the rotation axis provided in the lifting ring, and a slider connected to the synchronization ring and moving along the slide axis that moves up and down together with the lifting ring to rotate the synchronization ring. Claim 7 A substrate processing apparatus according to claim 1, wherein the conversion mechanism comprises a cam provided on the lifting ring and inclined with respect to the rotation center axis of the rotation axis, and a cam shaft connected to the synchronization ring and moving along the cam that moves up and down together with the lifting ring, thereby rotating the synchronization ring.

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