Substrate procssing apparatus and method

Abstract

The present invention provides an apparatus for processing a substrate. The substrate processing apparatus comprises a liquid processing chamber; a drying chamber; and a light processing chamber, wherein the light processing chamber may include: a processing housing having a processing space in which a substrate is processed; a support member supporting the substrate in the processing space; a light source irradiating light in a pulsed form onto the substrate supported by the support member; and a light filter that selects and passes wavelengths of a set range of light generated by the light source.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] The semiconductor process includes a cleaning process to remove thin films, foreign substances, particles, etc. attached to a substrate, such as a wafer. These processes are carried out by placing the substrate on a spin head with the pattern surface facing up or down, supplying a processing solution onto the substrate while the spin head is rotating, and subsequently drying the wafer.

[0003] Recently, supercritical fluids are used in the process of cleaning substrates. According to one example, a liquid treatment chamber is provided to supply a treatment liquid to a substrate for liquid treatment, and a drying chamber is provided to remove the treatment liquid from the substrate using a supercritical fluid after liquid treatment. The substrate, after treatment is completed in the liquid treatment chamber, is transported to the drying chamber by a transport robot.

[0004] The liquid treatment chamber(s) supply a rinse solution, such as pure water, onto the substrate, and then supply an organic solvent, such as isopropyl alcohol, to replace the rinse solution supplied onto the substrate. Then, the substrate is introduced into a drying chamber with a liquid film formed by the organic solvent. In the drying chamber, supercritical carbon dioxide fluid is used to remove the rinse solution and / or organic solvent remaining on the substrate.

[0005] Organic matter may remain on a substrate after liquid treatment in a liquid treatment chamber and drying treatment in a drying chamber. Organic matter remaining on the substrate may cause defects in semiconductor devices manufactured using the substrate. Prior art literature

[65535] Published Patent Application No. 10-2020-0141346 (Published Dec. 18, 2020) Published Patent Application No. 10-1998-0087141 (Published Dec. 05, 1998) The problem to be solved

[0006] One objective of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of efficiently removing organic matter remaining on a substrate by irradiating light onto the substrate.

[0007] In addition, the present invention has the objective of providing a substrate processing apparatus and a substrate processing method that minimize the occurrence of warpage or broken phenomena of the substrate when processing the substrate by irradiating light onto the substrate, while maintaining a high efficiency in removing organic matter remaining on the substrate.

[0008] In addition, the present invention has one objective of providing a substrate processing apparatus and a substrate processing method configured to select the wavelength of light transmitted to a substrate according to the type of organic material remaining on the substrate.

[0009] The objectives of the present invention are not limited thereto, and other unmentioned objectives will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0010] The present invention provides an apparatus for processing a substrate. The substrate processing apparatus comprises: a liquid processing chamber for liquid processing the substrate by supplying a processing liquid to the substrate; a drying chamber for drying the substrate processed in the liquid processing chamber; and a light processing chamber for removing organic matter remaining on the substrate by irradiating light onto the substrate processed in the drying chamber. The light processing chamber may include: a processing housing having a processing space in which the substrate is processed; a support member for supporting the substrate in the processing space; a light source for irradiating light in a pulsed form onto the substrate supported by the support member; and a light filter for selectively passing wavelengths within a set range of light generated by the light source.

[0011] According to one embodiment, the light filter may be configured to filter wavelengths outside the visible light range among the wavelengths of light generated by the light source.

[0012] According to one embodiment, the light filter may have a tube shape that surrounds the light source.

[0013] According to one embodiment, the light filter is formed from a material including quartz, and its surface may have a film attached to it that filters wavelengths outside the visible light range or a coating layer formed thereon.

[0014] According to one embodiment, the light processing chamber further comprises a light source housing that defines a space in which the light source is disposed, and a light filter is disposed between the light source housing and the processing housing, wherein the light filter has a plate shape that separates the processing space of the processing housing from the space of the light source housing, and the surface thereof may have a film attached or a coating layer formed thereon that filters wavelengths outside the visible light range.

[0015] According to one embodiment, the optical filter may be configured to filter wavelengths outside the range of 350 to 700 nm among the wavelengths of light generated by the light source.

[0016] According to one embodiment, the light source is a xenon flash lamp and can generate light having a wavelength in the range of 300 to 1000 nm.

[0017] According to one embodiment, the device further includes a light source controller for controlling the operation of the light source, and the light source controller may be configured to control at least one of the output of light generated by the light source, the duty cycle in a unit pulse of light, and the period of a unit pulse of light.

[0018] According to one embodiment, the light source controller can control the light source such that the output is constant in the On state or High state of the unit pulse of light generated by the light source while the substrate supported by the support member is photoprocessed.

[0019] According to one embodiment, the light source controller can control the light source such that the output gradually decreases in the On state or High state of the unit pulse of light generated by the light source while the substrate supported by the support member is photoprocessed.

[0020] According to one embodiment, the light source controller can control the light source such that the duty ratio of the unit pulse of light generated by the light source changes while the substrate supported on the support member is light-processed.

[0021] According to one embodiment, the light source controller can control the light source such that the duty ratio of the single pulse of light generated by the light source gradually decreases while the substrate supported by the support member is light-processed.

[0022] In addition, the present invention provides a method for treating a substrate. The substrate treatment method comprises: a liquid treatment step of liquid-treating the substrate by supplying a treatment liquid to the substrate; a drying step of drying the substrate by supplying a supercritical fluid to the liquid-treated substrate; and a light treatment step of removing organic matter remaining on the substrate by irradiating light onto the dried-treated substrate. In the light treatment step, the light is generated in a pulse form, and the wavelength of the light within a set range is selected by a light filter and irradiated onto the substrate.

[0023] According to one embodiment, in the light treatment step, a wavelength within the visible light range among the wavelengths of the light may be selected and irradiated onto the substrate.

[0024] According to one embodiment, in the light treatment step, a wavelength in the range of 350 to 700 nm among the wavelengths of the light may be selected and irradiated onto the substrate.

[0025] According to one embodiment, the light has a wavelength in the range of 300 to 1000 nm and can be generated by a xenon flash lamp.

[0026] According to one embodiment, the light processing step may cause the duty ratio of the unit pulse of the light to decrease, or the output may gradually decrease in the On state or High state of the unit pulse of the light.

[0027] According to one embodiment, the optical filters are provided in plurality and configured to selectively pass different ranges of wavelengths, and depending on the type of organic material remaining on the substrate, the wavelength range of the light irradiated on the substrate can be selected using any one of the optical filters.

[0028] In addition, the present invention provides an apparatus for processing a substrate. The substrate processing apparatus comprises: a liquid processing chamber for liquid processing the substrate by supplying an organic solvent to the substrate; a drying chamber for drying the substrate by supplying a supercritical fluid to the substrate processed in the liquid processing chamber; and a light processing chamber for removing organic matter remaining on the substrate by irradiating light onto the substrate processed in the drying chamber. The light processing chamber comprises: a processing housing having a processing space in which the substrate is processed; a support member supporting the substrate in the processing space; and a light irradiation unit located above the processing housing and irradiating light onto the substrate supported by the support member. The light irradiation unit comprises: a xenon flash lamp that irradiates light in a pulsed form onto the substrate supported by the support member—the xenon flash lamp is configured to generate light having a wavelength in the range of 300 to 1000 nm—; a light source housing providing a space in which the xenon flash lamp is installed; and a light filter configured to selectively pass wavelengths in the visible light range among the wavelengths of light generated by the xenon flash lamp. A reflective member installed above the xenon flash lamp and reflecting light generated by the xenon flash lamp toward a substrate; and a refrigerant supply unit disposed between the light source housing and the processing housing, comprising a middle plate having a middle plate refrigerant flow path formed therein and supplying the refrigerant, wherein the refrigerant supply unit may include: a refrigerant source for supplying the refrigerant; a first supply line for supplying the refrigerant from the refrigerant source to a reflective member refrigerant flow path formed in the reflective member; and a first transfer line for transferring the refrigerant from the reflective member refrigerant flow path to the middle plate refrigerant flow path.

[0029] According to one embodiment, the light irradiation unit further includes: a tube-shaped light source tube surrounding the xenon flash lamp, and a light source tube refrigerant flow path is formed within the light source tube; and the refrigerant supply unit may further include a second supply line that supplies refrigerant from the refrigerant supply source to the light source tube refrigerant flow path; and a third transfer line that transfers refrigerant from the light source tube refrigerant flow path to a cooling plate refrigerant flow path of a cooling plate—the cooling plate is provided by the processing housing and is located on the lower side of the support member. Effects of the invention

[0030] According to one embodiment of the present invention, when removing organic matter remaining on a substrate by irradiating light onto the substrate, particles generated by photodecomposition can be smoothly removed from the substrate.

[0031] The effects of the present invention are not limited to the effects described above, and unmentioned effects will be clearly understood by those skilled in the art from this specification and the attached drawings. Brief explanation of the drawing

[0032] FIG. 1 is a plan view schematically showing a substrate processing apparatus according to one embodiment of the present invention. Figure 2 is a schematic diagram showing one embodiment of the liquid treatment chamber of Figure 1. Figure 3 is a schematic diagram showing one embodiment of the drying chamber of Figure 1. FIG. 4 is a perspective view schematically showing an example of the second processing module of FIG. 1. Figure 5 is a planar cross-sectional view of the processing housing of the light processing chamber of Figure 4. FIG. 6 is a flowchart schematically showing a substrate processing method according to one embodiment of the present invention. Figure 7 is a drawing showing the appearance of a substrate processing device performing the liquid processing step of Figure 6. Figure 8 is a drawing showing the appearance of a substrate processing device performing the drying step of Figure 6. Figure 9 is a drawing showing the appearance of a substrate processing device performing the light processing step of Figure 6. Figure 10 is a graph showing an example of the change in output of light over time when performing the light processing step of Figure 9. Figure 11 is a graph showing the particle removal efficiency according to the wavelength range passing through the optical filter. Figure 12 is a graph showing another example of the change in output of light over time when performing the light processing step of Figure 9. Figure 13 is a graph showing another example of the change in output of light over time when performing the light processing step of Figure 9. Figure 14 is a graph showing another example of the change in output of light over time when performing the light processing step of Figure 9. Figure 15 is a drawing showing the appearance of a substrate processing device performing the cooling step of Figure 6. FIG. 16 is a perspective view schematically showing another example of the second processing module of FIG. 1. FIG. 17 is a drawing showing the appearance of light source tubes that can be applied to the light irradiation unit of the present invention. FIG. 18 is a drawing showing the appearance of middle plates that can be applied to the light irradiation unit of the present invention. FIG. 19 is a plan view schematically showing a substrate processing apparatus according to another embodiment of the present invention. FIG. 20 is a plan view schematically showing a substrate processing apparatus according to another embodiment of the present invention. Specific details for implementing the invention

[0033] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited to the embodiments below. These embodiments are provided to more fully explain the present invention to those with average knowledge in the art. Accordingly, the shapes of the elements in the drawings are exaggerated to emphasize clearer explanations.

[0034] FIG. 1 is a plan view schematically showing a substrate processing apparatus according to one embodiment of the present invention.

[0035] Referring to FIG. 1, the substrate processing device (1) includes an index module (10), a first processing module (20), a second processing module (30), and a controller (40). According to one embodiment, the index module (10) and the first processing module (20) are arranged along one direction. Hereinafter, the direction in which the index module (10) and the first processing module (20) are arranged is called the first direction (92), the direction perpendicular to the first direction (92) when looking at the substrate processing device (1) from above is called the second direction (94), and the direction perpendicular to both the first direction (92) and the second direction (94) is called the third direction (96).

[0036] The index module (10) transfers a substrate (W), such as a wafer, from a container (80) containing a substrate (W) to a first processing module (20), and receives the substrate (W) that has been processed in the first processing module (20) back into the container (80). The longitudinal direction of the index module (10) is provided as a second direction (94). The index module (10) has a load port (12) and an index frame (14). The load port (12) is located on the opposite side of the first processing module (20) relative to the index frame (14). A container (80) containing substrates (W) is placed in the load port (12). Multiple load ports (12) may be provided, and multiple load ports (12) may be arranged along the second direction (94).

[0037] As the container (80), a sealed container such as a Front Open Unified Pod (FOUP) may be used. The container (80) may be placed at the load port (12) by a transport means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle, or by a worker.

[0038] An index robot (120) is provided in the index frame (14). A guide rail (140) is provided within the index frame (14) with a longitudinal direction in the second direction (94), and the index robot (120) can be provided to be movable on the guide rail (140). The index robot (120) includes a hand (122) on which a substrate (W) is placed, and the hand (122) can be provided to move forward and backward, rotate about the third direction (96) as an axis, and move along the third direction (96). A plurality of hands (122) are provided spaced apart in the vertical direction, and the hands (122) can move forward and backward independently of each other.

[0039] The first processing module (20) includes a buffer unit (200), a return chamber (300), a liquid treatment chamber (400), and a drying chamber (500). The buffer unit (200) provides a space for the substrate (W) introduced into the first processing module (20) and the substrate (W) removed from the first processing module (20) to temporarily stay. The liquid treatment chamber (400) performs a liquid treatment process by supplying liquid onto the substrate (W) to treat the substrate (W) with liquid. The drying chamber (500) performs a drying process to remove the liquid remaining on the substrate (W). The return chamber (300) returns the substrate (W) between the buffer unit (200), the liquid treatment chamber (400), and the drying chamber (500).

[0040] The return chamber (300) may be provided with its length direction in the first direction (92). The buffer unit (200) may be positioned between the index module (10) and the return chamber (300). The liquid processing chamber (400) and the drying chamber (500) may be positioned on the side of the return chamber (300). The liquid processing chamber (400) and the return chamber (300) may be positioned along the second direction (94). The drying chamber (500) and the return chamber (300) may be positioned along the second direction (94). The buffer unit (200) may be located at one end of the return chamber (300).

[0041] According to one example, liquid treatment chambers (400) are positioned on both sides of the return chamber (300), and drying chambers (500) are positioned on both sides of the return chamber (300), and the liquid treatment chambers (400) may be positioned closer to the buffer unit (200) than the drying chambers (500). On one side of the return chamber (300), the liquid treatment chambers (400) may be provided in an AXB arrangement (where A and B are each 1 or a natural number greater than 1) along the first direction (92) and the third direction (96). Additionally, on one side of the return chamber (300), drying chambers (500) may be provided in CXD arrangements (where C and D are each 1 or a natural number greater than 1) along the first direction (92) and the third direction (96). Unlike the above, only liquid treatment chambers (400) may be provided on one side of the return chamber (300), and only drying chambers (500) may be provided on the other side.

[0042] The return chamber (300) has a return robot (320). A guide rail (340) is provided within the return chamber (300) in a longitudinal direction in the first direction (92), and the return robot (320) can be provided to be movable on the guide rail (340). The return robot (320) includes a hand (322) on which a substrate (W) is placed, and the hand (322) can be provided to move forward and backward, rotate about the third direction (96) as an axis, and move along the third direction (96). A plurality of hands (322) are provided spaced apart in the vertical direction, and the hands (322) can move forward and backward independently of each other.

[0043] The buffer unit (200) is provided with a plurality of buffers (220) on which a substrate (W) is placed. The buffers (220) may be spaced apart from each other along a third direction (96). The front face and rear face of the buffer unit (200) are open. The front face is the side facing the index module (10), and the rear face is the side facing the return chamber (300). The index robot (120) can access the buffer unit (200) through the front face, and the return robot (320) can access the buffer unit (200) through the rear face.

[0044] The second processing module (30) may be installed in the index module (10). The second processing module (30) may be positioned alongside the load ports (12) of the index module (10). For example, when viewing the substrate processing device (1) from above, the second processing module (30) may be positioned alongside the load ports (12) in the second direction (94). The second processing module (30) may perform light processing on the substrate (W). Additionally, the second processing module (30) may perform cooling processing on the substrate (W).

[0045] The controller (40) can control the configurations of the substrate processing device (1). For example, the controller (40) can control the configurations of the index module (10), the first processing module (20), and the second processing module (30). In addition, the controller (40) controls the return robot (320) and the index robot (120) so that the substrate (W) is processed in a preset substrate processing sequence.

[0046] The controller (40) may be equipped with a process controller comprising a microprocessor (computer) that executes control of the substrate processing device (1), a user interface comprising a keyboard for which an operator performs command input operations to manage the substrate processing device (1), a display for visualizing and displaying the operating status of the substrate processing device (1), a control program for executing processing in the substrate processing device (1) under the control of the process controller, and a memory unit storing a program for executing processing in each component according to various data and processing conditions, i.e., a processing recipe. Additionally, the user interface and the memory unit may be connected to the process controller. The processing recipe may be stored in a storage medium within the memory unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or DVD, or a semiconductor memory such as a flash memory.

[0047] FIG. 2 is a schematic diagram showing one embodiment of the liquid treatment chamber of FIG. 1. Referring to FIG. 2, the liquid treatment chamber (400) can liquid treat the substrate (W) by supplying a treatment liquid to the substrate (W). The liquid treatment chamber (400) has a housing (410), a cup (420), a support unit (440), a liquid supply unit (460), and a lifting unit (480). The housing (410) is provided in a generally rectangular shape. The cup (420), the support unit (440), and the liquid supply unit (460) are disposed within the housing (410).

[0048] The cup (420) has a processing space with an open top, and the substrate (W) is liquid-processed within the processing space. The support unit (440) supports the substrate (W) within the processing space. The liquid supply unit (460) supplies liquid onto the substrate (W) supported by the support unit (440). The liquid is provided in multiple types and can be supplied sequentially onto the substrate (W). The lifting unit (480) adjusts the relative height between the cup (420) and the support unit (440).

[0049] According to one example, the cup (420) has a plurality of recovery containers (422, 424, 426). Each of the recovery containers (422, 424, 426) has a recovery space for recovering the liquid used in the substrate processing. Each of the recovery containers (422, 424, 426) is provided in a ring shape that surrounds the support unit (440). When the liquid processing process is performed, the processing liquid scattered by the rotation of the substrate (W) flows into the recovery space through the inlets (422a, 424a, 426a) of each recovery container (422, 424, 426). According to one example, the cup (420) has a first recovery container (422), a second recovery container (424), and a third recovery container (426). The first recovery container (422) is positioned to surround the support unit (440), the second recovery container (424) is positioned to surround the first recovery container (422), and the third recovery container (426) is positioned to surround the second recovery container (424). The second inlet (424a) for introducing liquid into the second recovery container (424) is located above the first inlet (422a) for introducing liquid into the first recovery container (422), and the third inlet (426a) for introducing liquid into the third recovery container (426) may be located above the second inlet (424a).

[0050] The support unit (440) has a support plate (442) and a drive shaft (444). The upper surface of the support plate (442) is generally provided in a circular shape and may have a diameter larger than that of the substrate (W). A support pin (442a) is provided in the central part of the support plate (442) to support the rear surface of the substrate (W), and the upper end of the support pin (442a) is provided to protrude from the support plate (442) so that the substrate (W) is spaced a certain distance from the support plate (442). A chuck pin (442b) is provided at the edge of the support plate (442). The chuck pin (442b) is provided to protrude upward from the support plate (442) and supports the side of the substrate (W) so that the substrate (W) does not detach from the support unit (440) when the substrate (W) is rotated. The drive shaft (444) is driven by the drive unit (446) and is connected to the center of the bottom surface of the substrate (W), and rotates the support plate (442) around its center axis.

[0051] According to one example, the liquid supply unit (460) has a first nozzle (462), a second nozzle (464), and a third nozzle (466).

[0052] The first nozzle (462) supplies the first liquid onto the substrate (W). The first liquid may be a liquid that removes a film or foreign matter remaining on the substrate (W).

[0053] The second nozzle (464) supplies the second liquid onto the substrate (W). The second liquid may be a liquid that dissolves well in the third liquid. For example, the second liquid may be a liquid that dissolves better in the third liquid than the first liquid. The second liquid may be a liquid that neutralizes the first liquid supplied onto the substrate (W). Additionally, the second liquid may be a liquid that neutralizes the first liquid and simultaneously dissolves better in the third liquid than the first liquid. In one example, the second liquid may be water.

[0054] The third nozzle (466) supplies the third liquid onto the substrate (W). The third liquid may be a liquid that dissolves well in the supercritical fluid used in the drying chamber (500). For example, the third liquid may be a liquid that dissolves well in the supercritical fluid used in the drying chamber (500) compared to the second liquid. According to one example, the third liquid may be an organic solvent. The organic solvent may be isopropyl alcohol.

[0055] The first nozzle (462), the second nozzle (464), and the third nozzle (466) are supported on different arms (461), and these arms (461) can be moved independently. Optionally, the first nozzle (462), the second nozzle (464), and the third nozzle (466) can be mounted on the same arm and moved simultaneously.

[0056] The lifting unit (480) moves the cup (420) in an up-and-down direction. The relative height between the cup (420) and the substrate (W) is changed by the up-and-down movement of the cup (420). As a result, the recovery containers (422, 424, 426) that recover the processing liquid are changed according to the type of liquid supplied to the substrate (W), so that the liquids can be separated and recovered. Unlike the above, the cup (420) is fixedly installed, and the lifting unit (480) can move the support unit (440) in an up-and-down direction.

[0057] FIG. 3 is a schematic diagram showing one embodiment of the drying chamber (500) of FIG. 1. The drying chamber (500) can dry the substrate (W) by supplying a supercritical fluid to the substrate (W) that has been liquid-treated in the liquid treatment chamber (400). According to one embodiment, the drying chamber (500) removes the liquid on the substrate (W) using a supercritical fluid. The drying chamber (500) has a body (520), a support (540), a fluid supply unit (560), and a blocking plate (580).

[0058] The body (520) provides an internal space (502) in which a drying process is performed. The body (520) has an upper body (522) and a lower body (524), and the upper body (522) and the lower body (524) are combined to provide the internal space (502) described above. The upper body (522) is provided on the upper part of the lower body (524). The position of the upper body (522) is fixed, and the lower body (524) can be raised or lowered by a driving member (590), such as a cylinder. When the lower body (524) is separated from the upper body (522), the internal space (502) is opened, and at this time, a substrate (W) is brought in or taken out. During the process, the lower body (524) is in close contact with the upper body (522), and the internal space (502) is sealed from the outside.

[0059] The drying chamber (500) has a heater (570). In one example, the heater (570) is located inside the wall of the body (520). The heater (570) heats the internal space (502) of the body (520) so that the fluid supplied into the internal space of the body (520) remains in a supercritical state.

[0060] The support (540) supports the substrate (W) within the internal space (502) of the body (520). The support (540) has a fixed rod (542) and a mounting bracket (544).

[0061] A fixed rod (542) is fixedly installed on the upper body (522) so as to protrude downward from the bottom surface of the upper body (522). The fixed rod (542) is provided with a longitudinal direction in the vertical direction. Multiple fixed rods (542) are provided and positioned spaced apart from each other. The fixed rods (542) are arranged so that when a substrate (W) is brought in or taken out of the space enclosed by them, the substrate (W) does not interfere with the fixed rods (542). A mounting bracket (544) is attached to each fixed rod (542).

[0062] The mounting bracket (544) extends from the bottom of the fixed rod (542) toward the space enclosed by the fixed rods (542). Due to the structure described above, the substrate (W) introduced into the internal space (502) of the body (520) has its edge region placed on the mounting bracket (544), and the entire upper surface area of ​​the substrate (W), the central area of ​​the lower surface of the substrate (W), and a portion of the edge region of the lower surface of the substrate (W) are exposed to the drying fluid supplied into the internal space (502).

[0063] The fluid supply unit (560) supplies a drying fluid to the internal space (502) of the body (520). In one example, the drying fluid may be supplied to the internal space (502) in a supercritical state. Alternatively, the drying fluid may be supplied to the internal space (502) in a gaseous state and undergo a phase change to a supercritical state within the internal space (502). In one example, the fluid supply unit (560) has a main supply line (562), an upper branch line (564), and a lower branch line (566).

[0064] The upper branch line (564) and the lower branch line (566) branch off from the main supply line (562). The upper branch line (564) is connected to the upper body (522) and supplies a drying fluid from the upper part of the substrate (W) placed on the support (540). In one example, the upper branch line (564) is connected to the center of the upper body (522).

[0065] The lower branch line (566) is connected to the lower body (524) and supplies a drying fluid from the lower part of the substrate (W) placed on the support (540). In one example, the lower branch line (566) is connected to the center of the lower body (524). An exhaust line (550) is connected to the lower body (524). The supercritical fluid within the internal space (502) of the body (520) is exhausted to the outside of the body (520) through the exhaust line (550).

[0066] A blocking plate (580) may be placed within the internal space (502) of the body (520). The blocking plate (580) may be provided in the shape of a disc. The blocking plate (580) is supported by a support (582) so as to be spaced upward from the bottom surface of the body (520). The support (582) is provided in the shape of a rod and a plurality of them are arranged so as to be spaced apart from each other by a certain distance. When viewed from above, the blocking plate (580) may be provided to overlap with the discharge port of the lower branch line (566) and the inlet port of the exhaust line (550). The blocking plate (580) can prevent the drying fluid supplied through the lower branch line (566) from being directly discharged toward the substrate (W) and causing damage to the substrate (W).

[0067] FIG. 4 is a perspective view schematically showing an example of the second processing module of FIG. 1. Referring to FIG. 4, the second processing module (30) has a light processing chamber (600) and a cooling chamber (800).

[0068] The light treatment chamber (600) uses a supercritical fluid to irradiate light onto a substrate (W) dried in a drying chamber (500) to remove organic matter remaining on the substrate (W). Organic matter may be material that is not completely removed from the substrate (W) during the drying process. Alternatively, organic matter may be material generated when the substrate (W) is treated with a supercritical fluid. The cooling chamber (800) cools the substrate (W) that has been light-treated in the light treatment chamber (600). The light treatment chamber (600) and the cooling chamber (800) are arranged to be stacked on top of each other. In one example, the light treatment chamber (600) is located above the cooling chamber (800). Alternatively, the light treatment chamber (600) may be located below the cooling chamber (800). Optionally, the light treatment chamber (600) may be located to the side of the cooling chamber (800). One light processing chamber (600) and one cooling chamber (800) may be provided. Optionally, at least one of the light processing chamber (600) and the cooling chamber (800) may be provided in multiple numbers.

[0069] Below, the light processing chamber (600) will be described. FIG. 5 is a cross-sectional view of the processing housing of the light processing chamber of FIG. 4.

[0070] Referring to FIGS. 4 and 5, the light processing chamber (600) may include a processing housing (610), a gas distribution plate (620), a gas supply unit (630), a gas exhaust unit (640), a light irradiation unit (650), a refrigerant supply unit (660), and a support member (670).

[0071] The processing housing (610) may provide a space where a substrate (W) is processed. The processing housing (610) may provide a processing space (613) where the substrate (W) is photo-processed. The processing housing (610) may include a housing body (611), a cooling plate (612), and a door (615).

[0072] The housing body (611) may have a tubular shape with an open bottom. An opening may be formed in the upper central region of the housing body (611). A cooling plate (612) may be installed on the lower side of the housing body (611). A middle plate (652), described later, may be inserted and installed in the opening formed in the upper central region of the housing body (611). The housing body (6112), the cooling plate (612), and the middle plate (652), described later, may be combined to define a processing space (613).

[0073] An inlet (614) may be formed on one side of the housing body (611). The inlet (614) may be opened and closed by a door (615) installed on the outside of the housing body (611). The inlet (614) may be formed at a position facing the index robot (120) described above. While the substrate (W) is being photoprocessed, the door (615) may close the inlet (614). When the substrate (W) is being brought into or taken out of the photoprocessing chamber (600), the door (615) may open the inlet (614).

[0074] A cooling plate (612) installed on the lower side of a housing body (611) can minimize the transfer of heat generated when the substrate (W) is photoprocessed, or heat generated by light irradiated by a light source (653), to a cooling chamber (800) located on the lower side of a photoprocessing chamber (600). A cooling plate refrigerant flow path (612a) may be formed in the cooling plate (612). A refrigerant supplied by a refrigerant supply unit (660), which will be described later, may flow through the cooling plate refrigerant flow path (612a).

[0075] The gas distribution plate (620) helps to uniformly supply the gas supplied by the gas supply unit (630) to the processing space (613). The gas distribution plate (620) can be installed in the processing space (613). The gas distribution plate (620) can be installed facing the inner wall of the processing housing (610). The gas distribution plate (620) may include a gas supply plate (621) and a gas exhaust plate (622).

[0076] The gas supply plate (621) may be installed to face the gas supplied by the gas supply line (633) of the gas supply unit (630) described later. Supply holes (621a) may be formed in the gas supply plate (621). The gas supplied by the gas supply unit (630) described later may flow into the processing space (613) through the supply holes (621a) of the gas supply plate (621).

[0077] The gas exhaust plate (622) may be installed to face the inlet (614) formed in the processing housing (610). Exhaust holes (622a) may be formed in the gas exhaust plate (622). The gas exhaust plate (622) may be installed at a position symmetrical with respect to the center of the processing space (613) with respect to the gas supply plate (621).

[0078] The gas supplied by the gas supply unit (630) can be exhausted by sequentially passing through the gas supply plate (621), the processing space (613), and the gas exhaust plate (622). That is, in the processing space (613), an airflow is formed that flows along the first direction (X) by the gas supplied by the gas supply unit (630), and this airflow can perform the function of discharging organic matter decomposed and / or removed from the substrate (W) to the outside.

[0079] The gas supply unit (630) can supply gas to the processing space (613). The gas supplied by the gas supply unit (630) may be an inert gas. For example, the gas supplied by the gas supply unit (630) may be an inert gas such as nitrogen or argon. The gas supply unit (630) may include a gas source (631), a gas supply valve (632), and a gas supply line (633).

[0080] The gas source (631) may be a source that stores and / or supplies the inert gas described above. The gas source (631) may be a gas storage tank that stores and / or supplies the inert gas. The gas source (631) may be connected to a gas supply line (633). A gas supply valve (632) may be installed in the gas supply line (633) to control whether gas is supplied to the gas supply unit (630) and / or the gas supply flow rate per unit time. The gas supply valve (632) may be a flow control valve or an on / off valve.

[0081] The gas supply line (633) can be connected to a gas source (631) and a processing housing (610). The gas supply line (633) can be connected to a side wall of the processing housing (610). The gas supply line (633) can supply gas into the space between the processing housing (610) and the gas supply plate (621). The inert gas supplied by the gas supply line (633) can flow into the processing space (613) through the gas supply plate (621).

[0082] The gas exhaust unit (640) can exhaust the gas supplied by the gas supply unit (630). The gas exhaust unit (640) may include a gas exhaust line (642) and a gas exhaust valve (643). The gas exhaust line (642) may be connected to an exhaust device (not shown), such as a pump. The exhaust device may generate a reduction in pressure, and the reduction in pressure generated by the exhaust device may exhaust the gas supplied to the processing space (613). The gas exhaust line (642) may be connected between the gas exhaust plate (622) and the inner wall of the processing housing (610). The gas exhaust line (642) may be connected between the inner wall of the processing housing (610), where the inlet (614) is formed, and the gas exhaust plate (622).

[0083] The gas exhaust valve (643) can control whether gas is exhausted from the gas exhaust unit (640) and / or the gas exhaust flow rate per unit time. The gas exhaust valve (643) may be a flow control valve or an opening / closing valve.

[0084] The gas supplied by the gas supply unit (630) flows into the processing space (613) via the gas supply plate (621), and the gas flowing into the processing space (613) can be discharged to the outside through the gas exhaust unit (640) via the gas exhaust plate (622). The location where the gas is supplied and the location where the gas is exhausted face each other when viewed from above the processing space (613). Therefore, an airflow is generated in the processing space (613) by the gas flowing along the first direction (92). This airflow discharges the organic material removed from the substrate (W) to the outside of the photoprocessing chamber (600).

[0085] The light irradiation unit (650) can irradiate light onto a substrate (W) supported in a processing space (613). The light irradiation unit (650) can irradiate pulsed light onto the substrate (W). The light irradiation unit (650) can irradiate light having a wavelength in the visible light range onto the substrate (W).

[0086] The light irradiation unit (650) may include a light source housing (651), a middle plate (652), a light source (653), a light source controller (653a), a reflective member (654), a light source tube (655), an air supply module (656a, 656b, 656c), and an air exhaust module (657a, 657b).

[0087] The light source housing (651) may have a tubular shape with an open bottom. The light source housing (651) may be located on the upper side of the processing housing (610). The light source housing (651) may define a light source placement space where a light source (653) can be placed. The light source housing (651) may be combined with a middle plate (652) to define a light source placement space. The light source housing (651) may be formed with a width in the first direction (X) smaller than that of the processing housing (610).

[0088] A middle plate (652) may be installed on the lower side of the light source housing (651). The middle plate (652) may have a plate shape. The middle plate (652) may be placed between the light source housing (651) and the processing housing (610). The middle plate (652) may partition the processing space (613) and the light source placement space of the light source housing (651) from each other. The middle plate (652) may be formed of a transparent material so that light generated by the light source (653) can be transmitted. For example, the middle plate (652) may be formed of a transparent quartz material. In addition, a middle plate refrigerant flow path (652a) may be formed in the middle plate (652) through which refrigerant supplied by the refrigerant supply unit (660), described later, can flow.

[0089] The light source (653) can generate light that is irradiated onto the substrate (W). The light source (653) can irradiate light onto the substrate (W) to remove organic matter remaining on the substrate (W). The light source (653) may be a flash lamp. The light source (653) may be a xenon flash lamp. The light source (653) may generate a flash. The light source (653) may generate light in a pulsed form. The reason the light source (653) generates light in a pulsed form is that it can irradiate light onto the substrate (W) with a greater output (i.e., having greater energy) even if the same power is consumed.

[0090] For example, if the light source (653) generates light in the form of pulses, the light source (653) may include an On state and an Off state. The On state and the Off state may be repeated. The On state is a state in which the light source (653) generates light, and the Off state may be a state in which the light source (653) does not generate light. Additionally, if the light source (653) generates light in the form of pulses, the light source (653) may include a High state and a Low state. The High state is a state in which the output of light generated by the light source (653) is high, and the Low state may be a state in which the output of light generated by the light source (653) is low.

[0091] Assuming the same power consumption, compared to the case where the light source (653) continuously emits light, emitting light in a pulsed form can have a higher output peak when the light source (653) is in an On or High state. Therefore, if the light source (653) emits light in a pulsed form, there is an advantage that organic material can be effectively removed from the substrate (W) even if the light source (653) consumes the same power.

[0092] Additionally, the light source (653) may generally have a rod shape. The longitudinal direction of the light source (653) may be parallel to the second direction (94). Additionally, multiple light sources (653) may be installed. Two light sources (653) may be installed. The light sources (653) may be arranged side by side along the first direction (92).

[0093] Additionally, the light source (653) may be configured to generate light of the entire wavelength range (300 to 1000 nm), including the visible light wavelength range, the infrared wavelength range, and the ultraviolet wavelength range.

[0094] The light source controller (653a) can control the operation of the light source (653). The light source controller (653a) can be configured to control at least one of the output of light generated by the light source (653), the duty cycle of the unit pulse of light, and the period of the unit pulse of light. The light source controller (653a) can be composed of a processor or circuit element capable of controlling the operation of the light source (653).

[0095] The reflective member (654) can reflect light irradiated by the light source (653). The reflective member (654) can reflect light traveling upward from the light source (653) toward the substrate (W). The reflective member (654) may have a plate shape in which the length direction is the second direction (94), and may have a shape in which both ends are bent toward the light source (653). The reflective member (654) may be installed on the upper side of the light source (653). A reflective film capable of reflecting light irradiated by the light source (653) may be attached to the reflective member (654), or a reflective component capable of reflecting light may be coated. Additionally, a reflective member refrigerant flow path (654a) may be formed in the reflective member (654) through which refrigerant supplied by the refrigerant supply unit (660), described later, can flow.

[0096] The light source tube (655) may have a shape that encloses the light source (653). The light source tube (655) may have a tube shape into which a rod-shaped light source (653) can be inserted. For example, the light source tube (655) may have a tube shape in which the central region is open in the same direction as the length direction of the light source (653). The light source (653) can be inserted into the light source tube (655).

[0097] The light source tube (655) may be formed of a transparent material so that light generated by the light source (653) can be transmitted. For example, the light source tube (655) may be formed of a transparent quartz material. A light source tube refrigerant flow path (655a) may be formed within the light source tube (655) through which a refrigerant supplied by the refrigerant supply unit (660), described later, can flow. The refrigerant flowing through the light source tube refrigerant flow path (655a) can cool the light source (653). Accordingly, the temperature of the light source (653) can be prevented from rising excessively.

[0098] Additionally, an optical filter film may be attached to the inner surface of the light source tube (655) in contact with the light source (653) and / or the outer surface of the light source tube (655) to allow the wavelength of the light generated by the light source (653) to be selectively passed through. Alternatively, a coating layer may be coated on the inner surface of the light source tube (655) in contact with the light source (653) and / or the outer surface of the light source tube (655) to allow the wavelength of the light generated by the light source (653) to be selectively passed through. In this case, the light source tube (655) can function as an optical filter that selectively passes the wavelength of the light generated by the light source (653) within the set range.

[0099] The light source tube (655) may be configured to selectively pass wavelengths in the visible light range. For example, the light source tube (655) may be configured to selectively pass wavelengths in the range of 350 to 700 nm.

[0100] The air supply modules (656a, 656b, 656c) can supply CDA (Clean Dry Air) with controlled temperature and humidity into the space within the light source housing (651). The air supply modules (656a, 656b, 656c) may include an air supply source (656a) that supplies CDA, an air supply line (656b) that supplies CDA from the air supply source (656a) to the light source housing (651), and an air supply valve (656c) installed in the air supply line (656b).

[0101] The air exhaust module (657a, 657b) can exhaust CDA supplied into the space within the light source housing (651). The air exhaust module (657a, 657b) may include an air exhaust line (657b) connected to the light source housing (651) and an air exhaust valve (657a) installed in the air exhaust line (657b).

[0102] The refrigerant supply unit (660) can supply a refrigerant to the components of the light processing chamber (600) to suppress the temperature of the light processing chamber (600) from rising. If the light source (653) of the light processing chamber (600) continuously generates light, the energy transmitted by the light accumulates, and the temperature of the components of the light processing chamber (600) may rise excessively. The refrigerant supply unit (660) can supply a refrigerant, such as cooling water or cooling gas, to the components of the light processing chamber (600) to suppress the temperature of the light processing chamber (600) from rising.

[0103] The refrigerant supply unit (660) may include a refrigerant source (661), a refrigerant supply line (662), a first supply line (663), a second supply line (664), a first transfer line (665), a second transfer line (666), a second transfer line (667), a first refrigerant discharge line (668a), a second refrigerant discharge line (668b), and a main refrigerant discharge line (669). Additionally, the refrigerant supply unit (660) may include a refrigerant supply valve (662a) installed in the refrigerant supply line (662) and a refrigerant discharge valve (669a) installed in the main refrigerant discharge line (669). Each valve (662a, 669b) can control the supply and discharge of refrigerant. Additionally, each valve (662a, 669b) may be provided as an open / close valve or a flow control valve.

[0104] The refrigerant source (661) may be a refrigerant storage tank that stores the cooling water or cooling gas described above. The refrigerant source (661) may be configured to store and / or supply refrigerant. The refrigerant stored in the refrigerant source (661) may be supplied to the components of the light processing chamber (600) through the refrigerant supply line (662). The refrigerant supply line (662) may be branched into a first supply line (663) and a second supply line (664).

[0105] The first supply line (663) can supply refrigerant to the reflective member refrigerant flow path (654a). The refrigerant flowing through the reflective member refrigerant flow path (654a) can prevent the temperature of the reflective member (654) from rising excessively. The reflective member refrigerant flow path (654a) can be connected to the first transfer line (665). The first transfer line (665) can be connected to the middle plate refrigerant flow path (652a). The refrigerant flowing through the middle plate refrigerant flow path (654a) can prevent the temperature of the middle plate (652) from rising excessively.

[0106] The middle plate refrigerant flow path (654a) can be connected to the first refrigerant discharge line (668a). The first refrigerant discharge line (668a) can be connected to the main refrigerant discharge line (669). The refrigerant delivered to the main refrigerant discharge line (669) can be discharged outside the substrate processing device (1) or circulated and delivered to the refrigerant supply source (661).

[0107] The second supply line (664) can supply refrigerant to the refrigerant flow path (655a) of any one of the light source tubes (655). The second transfer line (666) can be connected to the refrigerant flow path (655a) of any one of the light source tubes (655) and the refrigerant flow path (655a) of another one of the light source tubes (655). The second transfer line (666) can transfer refrigerant from the refrigerant flow path (655a) of any one of the light source tubes (655) to the refrigerant flow path (655a) of another one of the light source tubes (655). The refrigerant flowing through the refrigerant flow path (655a) can prevent the temperature of the light source tube (655) from rising excessively, and also prevent the temperature of the light source (653) from rising excessively.

[0108] The light source (653) heats the substrate (W) by means of an energy transfer method using light, rather than by directly generating heat to heat the substrate (W). Therefore, even if the light source (653) is cooled by the light source tube (655), the efficiency of removing organic matter attached to the substrate (W) is not reduced.

[0109] The third transfer line (667) can transfer refrigerant from the refrigerant flow path (655a) of one of the light source tubes (655) to the cooling plate refrigerant flow path (612a). The refrigerant flowing through the cooling plate refrigerant flow path (612a) lowers the temperature of the cooling plate (612). Additionally, the cooling plate (612) can minimize the transfer of heat generated during the process of handling the substrate (W) to the cooling chamber (800).

[0110] The cooling plate refrigerant flow path (612a) can be connected to the second refrigerant discharge line (668b). The second refrigerant discharge line (668b) can be connected to the main refrigerant discharge line (669). The refrigerant delivered to the main refrigerant discharge line (669) can be discharged outside the substrate processing device (1) or circulated and delivered to the refrigerant supply source (661).

[0111] The support member (670) can support the substrate (W). The support member (670) can be configured to support the lower surface of the substrate (W). The support member (670) may also be called a substrate holder. The support member (670) can be configured to support the lower edge region of the substrate (W).

[0112] Below, the cooling chamber (800) will be described.

[0113] Referring again to FIG. 4, the cooling chamber (800) may include a cooling housing (810), a gas injection plate (820), a cooling gas supply unit (830), and a support shelf (840).

[0114] The cooling chamber (800) can cool the substrate (W). The cooling chamber (800) can cool the substrate (W) that has been photo-processed in the photo-processing chamber (600).

[0115] The cooling housing (810) may have a tubular shape with an open side. For example, the cooling housing (810) may have a tubular shape with an open portion facing the index robot (120). The cooling housing (810) may define a cooling space (812).

[0116] A gas injection plate (820) may be installed in the cooling space (812). Injection holes (820a) may be formed in the gas injection plate (820).

[0117] The cooling gas supply unit (830) can supply cooling gas to the cooling space (812). The cooling gas may be an inert gas. For example, the cooling gas may be an inert gas such as nitrogen or argon. The cooling gas supply unit (830) may include a cooling gas source (831), a cooling gas supply line (832), and a cooling gas supply valve (833).

[0118] The cooling gas source (831) may supply and / or store inert gas. The cooling gas source (831) may be a gas storage tank that stores inert gas. In some cases, the cooling gas source (831) and the gas source (631) described above may have the same configuration. The inert gas supplied by the cooling gas source (831) may be supplied to the cooling space (812) through the cooling gas supply line (832). The cooling gas may be supplied to the space between the cooling housing (810) and the gas injection plate (820). The cooling gas supply valve (833) installed in the cooling gas supply line (832) may control whether the cooling gas supplied to the cooling space (812) is supplied, or the supply flow rate per unit time. The cooling gas supply valve (833) may be an open / close valve or provided as a flow control valve.

[0119] The support shelf (840) can support the substrate (W). The support shelf (840) can support the substrates (W) that have undergone photoprocessing in the photoprocessing chamber (600). The support shelf (840) may have the same or similar shape as the support member (670) described above. Multiple support shelves (840) may be installed in the cooling space (812) along the third direction (96).

[0120] Meanwhile, the side of the cooling housing (810) may be open. The open part of the cooling housing (810) may be opposite to the part where the gas injection plate (820) is installed. The cooling gas supplied through the gas injection plate (820) can form a continuous or intermittent airflow along the first direction (92). This cooling gas can minimize the inflow of particles that may be floating on the index module (10) into the cooling space (812). Additionally, since the substrates (W) introduced into the cooling housing (810) are substrates (W) from which organic matter has been removed in the light processing chamber (600), the possibility of the cooling space (812) being contaminated by organic matter attached to the substrates (W) is very low.

[0121] FIG. 6 is a flowchart schematically showing a substrate processing method according to one embodiment of the present invention.

[0122] Referring to FIG. 6, a substrate processing method according to one embodiment of the present invention may include a liquid processing step (S10), a drying step (S20), a light processing step (S30), and a cooling step (S40). The above steps may be performed sequentially. In addition, a conveyor robot (320) and an index robot (120) provided by the substrate processing device (1) to perform each step may sequentially convey the substrate (W). For example, the conveyor robot (320) and the index robot (120) may sequentially convey the substrate (W) to a liquid processing chamber (400), a drying chamber (500), a light processing chamber (600), and a cooling chamber (800). The substrates (W) cooled in the cooling chamber (800) may be conveyed by the index robot (120) to a container (80) placed in a load port (12) and then transported outside the substrate processing device (1).

[0123] Figure 7 is a drawing showing the appearance of a substrate processing device performing the liquid processing step of Figure 6.

[0124] Referring to FIGS. 6 and 7, in the liquid treatment step (S10), a treatment liquid (TL) can be supplied to a substrate (W) rotating in a liquid treatment chamber (400) to perform liquid treatment on the substrate (W). The treatment liquid (TL) may be a rinse liquid such as pure water, or an organic solvent such as IPA. FIG. 7 describes an example where the third nozzle (466) supplies an organic solvent. Additionally, the substrate (W) can be cleaned by sequentially supplying a rinse liquid and an organic solvent in the liquid treatment chamber (400). The rinse liquid can clean the substrate (W). If the rinse liquid is pure water, the surface tension of the pure water is relatively high, so it may be difficult to remove the rinse liquid that has penetrated between the patterns of the substrate (W). Accordingly, if an organic solvent is additionally supplied after the rinse liquid is supplied on the substrate (W), the rinse liquid on the substrate (W) can be replaced with an organic solvent having a relatively low surface tension. When the organic solvent is IPA, the surface tension of IPA is relatively low, so it can be easily removed from the substrate (W).

[0125] Figure 8 is a drawing showing the appearance of a substrate processing device performing the drying step of Figure 6.

[0126] Referring to FIGS. 6 and FIGS. 8, in the drying step (S20), a supercritical fluid (SF) can be supplied to a liquid-treated substrate (W) in a drying chamber (500) to dry the substrate (W). The substrate (W) may be introduced into the drying chamber (500) in a state where a liquid film formed by an organic solvent is formed on it. The supercritical fluid (SF) may be carbon dioxide gas in a supercritical state. The supercritical fluid (SF) can dry the liquid film formed on the substrate (W). In addition, since the supercritical fluid (SF) has excellent penetration power into the pattern formed on the substrate (W), it can very effectively remove the treatment liquid (TL) remaining on the substrate (W).

[0127] Figure 9 is a drawing showing the appearance of a substrate processing device performing the light processing step of Figure 6.

[0128] Referring to FIGS. 6 and 9, the light treatment step (S30) may be performed after the drying step (S20) has been performed. A substrate (W) that has been dried in a drying chamber (500) may be introduced into a light treatment chamber (600). A light source (653) in the light treatment chamber (600) may generate light (LI). The light (LI) may be selected to a set range of wavelengths by a light source tube (655), which may be a light filter. The light (LI) selected to a set range of wavelengths may be delivered to the substrate (W). The wavelengths of the set range may be wavelengths within the visible light range. For example, they may be wavelengths in the range of 350 to 700 nm. When the light (LI) is delivered to the substrate (W), the organic material attached to the substrate (W) may be thermally decomposed. The thermally decomposed organic material may be sublimated or vaporized into a treatment space (613). The sublimated or vaporized organic matter can be discharged to the outside through the gas exhaust unit (640) by riding the airflow generated by the gas supplied by the gas supply unit (630).

[0129] Figure 10 is a graph showing an example of the change in output of light over time when performing the light processing step of Figure 9.

[0130] Referring to FIGS. 9 and 10, the light (LI) irradiated by the light source (653) may be irradiated in a pulse form. The On state and Off state of the light source (653) may be repeated periodically, and the On state and Off state corresponding to one cycle may be defined as a unit pulse. Additionally, the pulse form may be defined as the High state and Low state of the light source (653) being repeated periodically, and the High state and Low state corresponding to one cycle may be defined as a unit pulse. The irradiation of the light (LI) in a pulse form may mean that the unit pulse is repeated at least once (e.g., repeated multiple times).

[0131] The On state of the light source (653) may mean a state in which light (LI) is output, the Off state may mean a state in which light (LI) is not output (a state in which the output is 0), the High state of the light source (653) may mean a state in which light (LI) is output but the output value is large, and the Low state of the light source (6553) may mean a state in which light (LI) is output but the thrust value is smaller than the High state.

[0132] As described above, when the light source (653) is irradiated in a pulse form, assuming the light source (653) consumes the same power, it can have a higher light (LI) output peak, so there is an advantage in that organic material on the substrate (W) can be effectively removed.

[0133] Additionally, the light source controller (653a) may be configured to control the duty ratio in a unit pulse of light generated by the light source (653). The duty ratio may refer to the rate at which the light source (653) remains in an ON or H1 state per cycle (T). For example, the duty ratio may be defined as Ton / T.

[0134] Additionally, the light source controller (653a) can adjust the length of the period (T) of the unit pulse of light (LI) generated by the light source (653). For example, the light source controller (653a) can make the period (T) shorter or longer.

[0135] Additionally, the light source controller (653a) can increase or decrease the output of the light (LI) generated by the light source (653).

[0136] Figure 10 shows an example of optically processing a substrate (W) by setting the output of light (LI) in the ON state as the first output (P1), the duty cycle to 50%, and the period to T.

[0137] Figure 11 is a graph showing the particle removal efficiency according to the wavelength range passing through the optical filter.

[0138] FIG. 11 shows the experimental results of removing organic matter (particles) from a substrate (W) using the light source (653) described above, where [No] is the case where no light filter is used, [UV Pass] is the case where the light filter passes wavelengths in the ultraviolet range, [VIS Pass] is the case where wavelengths in the visible light range are passed, and [IR Pass] is the case where wavelengths in the infrared range are passed. In each case, the left side shows the number of particles before light treatment, and the right side shows the number of particles after light treatment.

[0139] As can be seen by referring to Fig. 11, the organic matter removal efficiency is best when no optical filter is used (when light of the entire wavelength range (LI) is irradiated onto the substrate) and when wavelengths in the visible light range are passed through (when light of the visible light wavelength range (LI) is irradiated onto the substrate). When light of the entire wavelength range (LI) was irradiated onto the substrate, an organic matter removal efficiency of 43.6% was observed, and when light of the visible light wavelength range (LI) was irradiated onto the substrate, an organic matter removal efficiency of 41.4% was observed.

[0140] However, when applying an optical filter, it may be most advantageous to allow wavelengths in the visible light range to pass through (when light in the visible light wavelength range (LI) is irradiated onto the substrate).

[0141] Specifically, when a light filter is not used (when light (LI) of the entire wavelength range is irradiated onto the substrate), the temperature of the substrate (W) rises to 350°C. In this case, warpage or brokenness of the substrate may occur on the substrate (W) due to thermal deformation, etc. The inventor confirmed through long-term experiments that this increase in temperature of the substrate (W) is caused by wavelengths in the infrared range.

[0142] On the other hand, when an optical filter that passes wavelengths in the visible light range is used (when light (LI) in the visible light wavelength range is irradiated onto the substrate), the temperature of the substrate (W) rises only up to 280°C. In this case, the occurrence of the aforementioned warpage or broken substrate phenomenon can be minimized.

[0143] In short, the present invention has the advantage of increasing the organic matter removal efficiency by irradiating light (LI) in a pulsed form, while preventing the temperature of the substrate (W) from rising excessively and maintaining the organic matter removal efficiency for the substrate (W).

[0144] Figure 12 is a graph showing another example of the change in output of light over time when performing the light processing step of Figure 9.

[0145] Referring to FIGS. 6, 8, and 12, the light source controller (653a) of the present invention can control the light source (653) such that the output gradually decreases in the order of the first output (P1), the second output (P2), and the third output (P3) while the light (LI) is being processed by light during the on or high state of a unit pulse of light (LI). When light (LI) is repeatedly irradiated onto the substrate (W), thermal energy may accumulate in the substrate (W). This may cause the temperature of the substrate (W) to rise excessively. Additionally, when the light processing of the substrate (W) is completed, the substrate (W) is cooled in a cooling chamber (800). During this process, if the temperature of the substrate (W) changes too rapidly, warping or broken phenomena may occur in the substrate (W). Accordingly, the present invention can resolve the above problem by causing the output to gradually decrease in the order of the first output (P1), the second output (P2), and the third output (P3) while the unit pulse of light (LI) is in the ON or high state during photo-processing of the substrate (W).

[0146] Figure 13 is a graph showing another example of the change in output of light over time when performing the light processing step of Figure 9.

[0147] Referring to FIGS. 6, FIGS. 8 and FIGS. 13, the light source controller (653a) of the present invention can control the light source (653) so that the on-duty ratio of a unit pulse of light (LI) gradually decreases while the substrate (W) is photoprocessed. For example, it can gradually decrease from a level of Ton1 / T = 50% to a level of Ton2 / T = 40%, and to a level of Ton3 / T = 30% (in FIG. 13, for convenience of explanation, Ton1, Ton2, and Ton3 are each shown as one time, but Ton1, Ton2, and Ton3 can each be repeated multiple times). In this case, there is an advantage of minimizing excessive temperature rise of the substrate (W) and rapid changes in the substrate (W).

[0148] Figure 14 is a graph showing another example of the change in output of light over time when performing the light processing step of Figure 9.

[0149] Referring to FIGS. 6, 8, and 14, the output of light (LI) can gradually increase from the third output (P3) through the second output (P2) to the first output (P1), and then gradually decrease to the third output (P3). The temperature of the substrate (W) may drop during the transport process. In this case, by slowly raising the temperature of the substrate (W), the rapid change in the temperature of the substrate (W) while the substrate (W) is phototreated can be minimized.

[0150] Figure 15 is a drawing showing the appearance of a substrate processing device performing the cooling step of Figure 6.

[0151] Referring to FIGS. 6 and FIGS. 15, in the cooling step (S40), substrates (W) that have undergone photo-processing are supported on a support shelf (840) inside a cooling chamber (800), and a cooling gas supply unit (830) supplies cooling gas (CG) to cool the substrates (W). The temperature of the cooling gas (CG) may be room temperature or may be controlled and supplied at a lower temperature.

[0152] In the example described above, the optical filter is described as being a light source tube (655), but it is not limited thereto. For example, as shown in FIG. 16, the optical filter may be a middle plate (652). In this case, a film (PI) that filters wavelengths outside the visible light range may be attached to the middle plate (652). Alternatively, a coating layer that filters wavelengths outside the visible light range may be formed on the middle plate (652).

[0153] In the example described above, the light filter is described as being a light source tube (655) or a middle plate (652), but it is not limited thereto. The light filter may also refer to a film or a coating layer attached to the light source tube (655) or the middle plate (652).

[0154] FIG. 17 is a drawing showing the appearance of light source tubes that can be applied to the light irradiation unit of the present invention. The user may have light source tubes (655) which are light filters that selectively pass different ranges of wavelengths. For example, the first light source tube (655-1) may selectively pass wavelengths in the visible light range, the second light source tube (655-2) may selectively pass wavelengths in the infrared range, and the third light source tube (655-3) may selectively pass wavelengths in the ultraviolet range. Depending on the type of organic material remaining on the substrate (W), the user may install any one of the above light source tubes (655) selected in the light irradiation unit (650) to process the substrate (W).

[0155] Similarly, as illustrated in FIG. 18, the user may have middle plates (652) which are optical filters that selectively pass different ranges of wavelengths. For example, the first middle plate (652-1) may selectively pass wavelengths in the visible light range, the second middle plate (655-2) may selectively pass wavelengths in the infrared range, and the third middle plate (655-3) may selectively pass wavelengths in the ultraviolet range. Depending on the type of organic material remaining on the substrate (W), the user may process the substrate (W) by installing any one of the above middle plates (652) selected in the light irradiation unit (650).

[0156] In the example described above, the second processing module (30) is shown as being installed in a location adjacent to the index frame (14). However, as shown in FIG. 19, the second processing module (30) may be placed within the first processing module (20). Optionally, the second processing module (30) may be placed stacked with the buffer unit (200) as shown in FIG. 20.

[0157] The above detailed description is illustrative of the present invention. Furthermore, the foregoing describes preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, modifications or alterations are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the described disclosure, and / or the scope of the art or knowledge. The described embodiments describe the best state for implementing the technical concept of the present invention, and various modifications required in specific fields of application and uses of the present invention are possible. Accordingly, the above detailed description of the invention is not intended to limit the present invention to the disclosed embodiments. Furthermore, the appended claims should be interpreted as including other embodiments. Explanation of the symbols

[0158] Light processing chamber: 600 Processing Housing: 610 Housing Body: 611 Cooling plate: 612 Cooling plate refrigerant flow path: 612a Processing space: 613 Entrance: 614 Door: 615 Gas distribution plate: 620 Gas supply plate: 621 Supply hole: 621a Gas Exhaust Plate: 622 Exhaust hole: 622a Access / Exit Opening: 622b Gas supply unit: 630 Gas Source: 631 Gas supply valve: 632 Gas supply line: 633 Gas Exhaust Unit: 640 Gas exhaust line: 642 Gas exhaust valve: 643 Light Irradiation Unit: 650 Light source housing: 651 Middle Plate: 652 Middle Plate Refrigerant Euro: 652a Light Source: 653 Light source controller: 653a Reflective component: 654 Reflective element refrigerant flow path: 654a Light source tube: 655 Light source tube refrigerant flow path: 655a Air source: 656a Air supply line: 656b Air supply valve: 656c Air exhaust valve: 657a Air Exhaust Line: 657b Refrigerant supply unit: 660 Refrigerant Source: 661 Refrigerant supply line: 662 Refrigerant supply valve: 662a Supply Line 1: 663 2nd Supply Line: 664 1st Delivery Line: 665 Second transmission line: 666 Third transmission line: 667 1st Refrigerant Discharge Line: 668a Second refrigerant discharge line: 668b Main refrigerant discharge line: 669 Refrigerant discharge valve: 669a Support member: 670 Cooling chamber: 800 Cooling housing: 810 Cooling space: 812 Gas injection plate: 820 Injection hole: 820a Cooling gas supply unit: 830 Cooling gas source: 831 Cooling gas supply line: 832 Cooling gas supply valve: 833 Support shelf: 840

Claims

Claim 1 A substrate processing apparatus comprising: a liquid processing chamber for liquid processing the substrate by supplying a processing liquid to the substrate; a drying chamber for drying the substrate processed in the liquid processing chamber; and a light processing chamber for removing organic matter remaining on the substrate by irradiating light onto the substrate processed in the drying chamber, wherein the light processing chamber comprises: a processing housing having a processing space in which the substrate is processed; a support member for supporting the substrate in the processing space; a light source for irradiating light in a pulsed form onto the substrate supported by the support member; and a light filter for selectively passing a wavelength of a set range of light generated by the light source, wherein the light filter is configured to filter wavelengths outside the visible light range among the wavelengths of light generated by the light source. Claim 2 delete Claim 3 In claim 1, the above-mentioned optical filter has a tube shape that surrounds the light source, forming a substrate processing device. Claim 4 A substrate processing device according to paragraph 3, wherein the optical filter is formed of a material including quartz, and the surface thereof has a film attached or a coating layer formed thereon for filtering wavelengths outside the visible light range. Claim 5 A substrate processing device according to claim 1, wherein the light processing chamber further comprises: a light source housing defining a space in which the light source is disposed; a light filter disposed between the light source housing and the processing housing; the light filter having a plate shape to partition the processing space of the processing housing and the space of the light source housing from each other; and the surface thereof having a film attached or a coating layer formed thereon for filtering wavelengths outside the visible light range. Claim 6 A substrate processing device according to claim 1, wherein the optical filter is configured to filter out wavelengths in the range of 350 to 700 nm among the wavelengths of light generated by the light source. Claim 7 A substrate processing apparatus according to claim 1, wherein the light source is a xenon flash lamp and generates light having a wavelength in the range of 300 to 1000 nm. Claim 8 A substrate processing device according to claim 1, wherein the device further comprises a light source controller for controlling the operation of the light source, and the light source controller is configured to control at least one of the output of light generated by the light source, the duty ratio in a unit pulse of light, and the period of a unit pulse of light. Claim 9 In claim 8, the substrate processing device wherein the light source controller controls the light source such that the output is constant in the On state or High state of the unit pulse of light generated by the light source while the substrate supported by the support member is light-processed. Claim 10 In claim 8, the substrate processing device wherein the light source controller controls the light source such that the output of the unit pulse of light generated by the light source gradually decreases in the On or High state while the substrate supported by the support member is being light-processed. Claim 11 In claim 8, the substrate processing device wherein the light source controller controls the light source such that the duty ratio of the unit pulse of light generated by the light source changes while the substrate supported by the support member is light-processed. Claim 12 In claim 11, the substrate processing device wherein the light source controller controls the light source such that the duty ratio of the single pulse of light generated by the light source gradually decreases while the substrate supported by the support member is light-processed. Claim 13 A method for treating a substrate comprises: a liquid treatment step of liquid treating the substrate by supplying a treatment solution to the substrate; a drying step of drying the substrate by supplying a supercritical fluid to the liquid-treated substrate; and a light treatment step of removing organic matter remaining on the substrate by irradiating light onto the dried-treated substrate, wherein in the light treatment step, the light is generated in a pulse form, the wavelength of the light within a set range is selected by a light filter and irradiated onto the substrate, and the wavelength of the light within the visible light range is selected and irradiated onto the substrate. Claim 14 delete Claim 15 In claim 13, a substrate treatment method wherein, in the light treatment step, a wavelength in the range of 350 to 700 nm among the wavelengths of the light is selected and irradiated onto the substrate. Claim 16 In claim 15, the above light has a wavelength in the range of 300 to 1000 nm and is generated by a xenon flash lamp, a substrate processing method. Claim 17 In paragraph 13, the above light processing step is a substrate processing method in which the duty ratio of the unit pulse of the light decreases, or the output gradually decreases in the On state or High state of the unit pulse of the light. Claim 18 A method for treating a substrate comprises: a liquid treatment step of liquid treating the substrate by supplying a treatment solution to the substrate; a drying step of drying the substrate by supplying a supercritical fluid to the liquid-treated substrate; and a light treatment step of removing organic matter remaining on the substrate by irradiating light onto the dried-treated substrate, wherein in the light treatment step, the light is generated in a pulse form, and a wavelength of the light within a set range is selected by a light filter and irradiated onto the substrate, wherein the light filter is provided in a plurality of such filters and configured to selectively pass different ranges of wavelengths, and wherein the wavelength range of the light irradiated onto the substrate is selected using one of the light filters according to the type of organic matter remaining on the substrate. Claim 19 An apparatus for processing a substrate comprises: a liquid processing chamber for liquid processing the substrate by supplying an organic solvent to the substrate; a drying chamber for drying the substrate by supplying a supercritical fluid to the substrate processed in the liquid processing chamber; and a light processing chamber for removing organic matter remaining on the substrate by irradiating light onto the substrate processed in the drying chamber, wherein the light processing chamber comprises: a processing housing having a processing space in which the substrate is processed; and a support member for supporting the substrate in the processing space. and includes a light irradiation unit located on the upper side of the processing housing and irradiating light onto a substrate supported by the support member, wherein the light irradiation unit comprises: a xenon flash lamp that irradiates light in a pulsed form onto the substrate supported by the support member - the xenon flash lamp is configured to generate light having a wavelength in the range of 300 to 1000 nm -; a light source housing providing a space for installing the xenon flash lamp; a light filter configured to select and pass wavelengths in the visible light range among the wavelengths of light generated by the xenon flash lamp; a reflector installed on the upper side of the xenon flash lamp and reflecting the light generated by the xenon flash lamp toward the substrate; and a refrigerant supply unit disposed between the light source housing and the processing housing and including a middle plate having a middle plate refrigerant flow path formed therein, and supplying the refrigerant, wherein the refrigerant supply unit comprises: a refrigerant supply source that supplies refrigerant; and a first supply line that supplies refrigerant from the refrigerant supply source to a reflector refrigerant flow path formed in the reflector. A substrate processing device comprising a first transfer line that transfers refrigerant from the reflection member refrigerant path to the middle plate refrigerant path. Claim 20 In claim 19, the light irradiation unit further comprises: a tube-shaped light source tube surrounding the xenon flash lamp, wherein a light source tube refrigerant flow path is formed within the light source tube, and the refrigerant supply unit comprises: a second supply line for supplying refrigerant from the refrigerant supply source to the light source tube refrigerant flow path; and a third transfer line for transferring refrigerant from the light source tube refrigerant flow path to a cooling plate refrigerant flow path of a cooling plate—the cooling plate having the processing housing and located on the lower side of the support member.

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