Jif for wiring deeping

KR103030911B1Active Publication Date: 2026-10-13KYONGSIN
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Patent Information

Application Number
KR1020240141519
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-10-16
Publication Date
2026-10-13
Estimated Expiration
2044-10-16

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Abstract

An invention is disclosed regarding a dipping jig for wiring. The disclosed dipping jig for wiring is characterized by comprising: a body having a circular or polygonal circumferential surface; and a fixing part that fixes each of the wires to the circumferential surface of the body at a circumferentially spaced apart, in order to simultaneously and normally dipping the conductors of each of a plurality of wires.
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Description

Technology Field

[0001] The present invention relates to a dipping jig for wiring, and more specifically, to a dipping jig for wiring that can solder and dip multiple strands of wire at once after fixing them in a spaced-apart state, thereby reducing the number of times and time required for lead plating treatment on the conductors of the wires and preventing plating defects caused by the conductors overlapping. Background Technology

[0002] As automotive environmental regulations become increasingly stringent, customer demand for energy conservation and exhaust gas reduction is rising. In response, wire harness manufacturers are seeking to improve fuel efficiency and reduce exhaust emissions by lightweighting vehicles through the application of aluminum wires, which are lighter than conventional copper wires. Aluminum has a specific gravity approximately one-third that of copper.

[0003] Generally, when connecting aluminum wires to copper terminals, there is a risk of connection failure due to galvanic corrosion and aluminum oxide film formation resulting from the connection between dissimilar metals. Galvanic corrosion, or dissimilar metal corrosion, refers to corrosion that occurs when moisture enters the connection between aluminum and copper. This corrosion is caused by the formation of a galvanic cell between the aluminum, copper, and moisture due to the potential difference between the metals, leading to the ionization of the aluminum, which has a lower potential.

[0004] Aluminum oxide film is formed when the conductor surface of an aluminum wire stripped of its insulation is exposed to air and oxidizes easily. Although the oxide film formed when the conductor surface of an aluminum wire is exposed to air is extremely thin, approximately 100 Å (100 x 10 m) or less, it is dense, hard, and insulating. Therefore, the oxide film is usually removed manually using a wire brush or similar tool just before connecting the aluminum wire to a terminal.

[0005] In order to improve connection failures caused by such galvanic corrosion and aluminum oxide films, conventionally, when connecting aluminum wires and copper terminals, the stripped aluminum wire conductor is inserted into a standard press terminal and crimped, after which the entire press terminal is immersed in a solder solution; or, the outer surface of the stripped aluminum wire conductor is wrapped in a circular shape using the terminal barrel and crimped, after which the exposed portion of the aluminum conductor at the top of the terminal is soldered to minimize moisture ingress.

[0006] As prior art, the "method for connecting terminals of a wire" was proposed in Korean Registered Patent Publication No. 10-1282631 (Registration date: July 1, 2013).

[0007] The technical configuration described above is provided as background technology to aid in understanding the present invention and does not constitute prior art widely known in the technical field to which the present invention belongs. The problem to be solved

[0008] Although the existing wiring dipping process is simple, there is a problem that the process must be performed multiple times as the amount (number of strands) of wire harness increases, and if flux-coated wire harnesses are bundled together and put into the dipping machine at once, if the ends overlap, the wire harnesses will clump together due to the solder and must be put back into the dipping machine to be separated.

[0009] Therefore, there is a need to improve this.

[0010] The present invention was devised to improve the above-mentioned problems, and aims to provide a dipping jig for wiring that reduces the number of soldering and time required for lead plating on the conductors of wires and prevents plating defects caused by overlapping of conductors by using a jig that can solder and dip multiple strands of wires at once after fixing them in a spaced-apart state. means of solving the problem

[0011] A dipping jig for wiring according to the present invention comprises: a body having a circular or polygonal circumferential surface in the circumferential direction; and a fixing part that fixes each of the wires at a circumferentially spaced apart from each other in the circumferential surface of the body in order to simultaneously and normally dipping each of the conductors of a plurality of wires.

[0012] A dipping jig for wiring according to the present invention comprises: a hand provided on one side along the axial direction of the body.

[0013] The above fixing member includes: a band member in which the wire is wrapped around the periphery of the body so as to be positioned at a set interval to protrude the conductor outwardly, thereby causing the wire to come into contact with the periphery of the body; and an attachment member detachably attached to the band member to fix the position of the wire on the band member.

[0014] The above attachment member is characterized by protruding outwardly from the band member, and after the band member wraps around the perimeter surface of the body, it is attached to at least one of the outer surface of the band member and the perimeter surface of the body.

[0015] The above band member is characterized by being fixed in an initially positioned state, wrapped around the body by an initial positioning unit. Effects of the invention

[0016] As explained above, unlike the prior art, the dipping jig for wiring according to the present invention can reduce the number of times and time required for lead plating on the conductors of the wires by fixing multiple strands of wires in a spaced-apart state and then performing soldering and dipping processing all at once, and can prevent plating defects caused by the conductors overlapping. Brief explanation of the drawing

[0017] FIG. 1 is a perspective view of a dipping jig for wiring according to one embodiment of the present invention. FIG. 2 is an exploded perspective view of a dipping jig for wiring according to one embodiment of the present invention. FIG. 3 is a cross-sectional view of a dipping jig for wiring according to one embodiment of the present invention. FIG. 4 is a diagram showing the usage state of a dipping jig for wiring according to one embodiment of the present invention. Specific details for implementing the invention

[0018] Hereinafter, an embodiment of a dipping jig for wiring according to the present invention will be described with reference to the attached drawings. In this process, the thickness of lines or the size of components shown in the drawings may be exaggerated for clarity and convenience of explanation. Furthermore, the terms described below are defined considering their functions in the present invention, and these may vary depending on the intention or convention of the user or operator. Therefore, the definitions of these terms should be based on the content throughout this specification.

[0019] FIG. 1 is a perspective view of a dipping jig for wiring according to one embodiment of the present invention, FIG. 2 is an exploded perspective view of a dipping jig for wiring according to one embodiment of the present invention, and FIG. 3 is a cross-sectional view of a dipping jig for wiring according to one embodiment of the present invention.

[0020] FIG. 4 is a diagram showing the usage state of a dipping jig for wiring according to one embodiment of the present invention.

[0021] Referring to FIGS. 1 to 4, a dipping jig (100) for wiring according to one embodiment of the present invention includes a body (110), a hand (120), a fixing part (130), and an initial position setting part (140).

[0022] In particular, the dipping jig (100) according to the present invention is a tool capable of soldering and deepening each conductor (20) of a wire (10) at once while preventing defects after fixing multiple wires (10) in a spaced-apart state.

[0023] The body (110) forms the frame of the dipping jig (100) and has a circular or polygonal circumferential surface. Additionally, the body (110) is formed in the shape of a solid or hollow column. Furthermore, the body (110) can be made of various materials.

[0024] In addition, a hand (120) is provided on one side along the axial direction of the body (110). The hand (120) is provided for ease of handling, such as holding and moving the body (110).

[0025] At this time, the hand (120) may be detachably connected to the body (110) or may be integrally manufactured with the body (110). Of course, the hand (120) can be transformed into various shapes.

[0026] Additionally, the fixing part (130) serves to fix each of the wires (10) to the circumferential surface of the body (110) at a spaced-out circumferential direction so as to simultaneously and normally dipping each conductor (20) of the multiple wires (10).

[0027] In detail, the fixing part (130) may include a band member (132) and an attachment member (134).

[0028] The band member (132) is wrapped around the circumference of the body (110) so that the conductor (20) protrudes outwardly and the wires (10) are spaced apart by a set interval, thereby causing the wires (10) to come into contact with the circumference of the body (110).

[0029] That is, each wire (10) is positioned between the body (110) and the band member (132) and is maintained at a set distance in the circumferential direction of the body (110).

[0030] And, the attachment member (134) is detachably attached to the band member (132) to position and fix the wire (10) to the band member (132).

[0031] At this time, the attachment member (134) is applied in such a way that it can be attached to at least the band member (132). For example, the band member (132) may be made of cotton or non-woven fabric, and the attachment member (134) may be made of Teflon tape (also known as 'Velcro').

[0032] Thus, after multiple strands of wire (10) are placed on one side of the band member (132), an attachment member (134) is overlapped with the multiple strands of wire (10) and attached to the band member (132). As a result, the multiple strands of wire (10) are fixed to one side of the band member (132). At this time, each of the multiple strands of wire (10) is aligned so that the conductor (20) protrudes to the outside of the band member (132).

[0033] In particular, the hand (120) is provided on one side of the body (110) along the axial direction, and the conductor (20) can be aligned to protrude outward from the band member (132) in the other direction of the body (110) along the axial direction.

[0034] Of course, the attachment member (134) can be made of various shapes and sizes.

[0035] In addition, the attachment member (134) protrudes outward from the band member (132), and after the band member (132) wraps around the circumferential surface of the body (110), it is attached to at least one of the outer surface of the band member (132) and the circumferential surface of the body (110).

[0036] More specifically, the attachment member (134) is formed with a length that protrudes outward along the axial direction of the band member (132). Thus, after the band member (132) is completely wrapped around the circumference of the body (110), the corresponding portion of the attachment member (134) that protrudes outward from one side of the band member (132) is attached to the other side of the band member (132). As a result, the band member (132) is not arbitrarily unraveled from the circumference of the body (110).

[0037] Additionally, the band member (132) can be fixed in an initially positioned state, wrapped around the body (110) by the initial positioning unit (140).

[0038] For example, the initial position setting part (140) may include an edge pin (142) and an edge groove part (144).

[0039] The edge pin (142) is fixed to one edge of the band member (132) that first contacts the circumference of the body (110). At this time, the edge pin (142) can be fixed by wrapping around one edge of the band member (132).

[0040] And, the edge groove (144) is formed by being recessed along the axial direction of the body (110) on the periphery surface of the body (110). Thus, after one edge of the edge pin (142) or the band member (132) surrounding the edge pin (142) is received and fixed in position in the edge groove (144), the band member (132) can be easily wrapped around the periphery surface of the body (110).

[0041] Of course, one side of the attachment member (134) can be fixedly connected to the edge pin (142). In particular, one side of the attachment member (134) can be wrapped around the edge pin (142), and the edge pin (142) can be wrapped around one side of the band member (132).

[0042] In particular, one side of the band member (132) covering the edge pin (142) is stitched to prevent the edge pin (142) from coming off unintentionally.

[0043] Consequently, the dipping jig (100) according to the present invention is a tool capable of soldering and dipping each conductor (20) of a wire (10) at once while preventing defects after fixing multiple wires (10) in a spaced-apart state. As such, the number of wires (10) to be soldered (applied) is increased, thereby reducing the amount of work required. Additionally, by providing a hand (120) on the body (110) and holding the hand (120) while dipping the body (110) into a soldering iron (not shown), the risk of burns is reduced.

[0044] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom.

[0045] Therefore, the true technical scope of protection of the present invention should be determined by the claims below. Explanation of the symbols

[0046] 10: Wire 20: Conductor 100: Dipping jig 110: Body 120: Hand 130: Fixed part 132: Band member 134: Attachment member 140: Initial position setting section 142: Edge pin 144: Edge Home

Claims

Claim 1 A dipping jig for wiring, characterized by comprising: a body having a circular or polygonal circumferential surface in the circumferential direction; and a fixing member for fixing each of the wires to the circumferential surface of the body while spaced apart in the circumferential direction to simultaneously and normally dipping each of the conductors of a plurality of wires, wherein the fixing member comprises: a band member in which the wires are wrapped around the circumferential surface of the body after being spaced apart by a set interval so as to protrude the conductors outwardly, thereby causing the wires to come into contact with the circumferential surface of the body; and an attachment member detachably attached to the band member to fix the wires in position on the band member. Claim 2 A dipping jig for wiring according to claim 1, characterized by including a hand provided on one side along the axial direction of the body. Claim 3 delete Claim 4 A dipping jig for wiring according to claim 1, wherein the attachment member protrudes outward from the band member, and after the band member wraps around the periphery of the body, is attached to at least one of the outer surface of the band member and the periphery of the body. Claim 5 A dipping jig for wiring according to claim 1, characterized in that the band member is fixed in an initially positioned state, wrapped around the body by an initial positioning part.

Citation Information

Patent Citations

  • Apparatus for dipping the plastic mold exclusively

    KR1020070101671A