Liquid immersion cooling type server system

Abstract

A liquid immersion cooling type server system according to one embodiment may include: a plurality of server units; a case accommodating the plurality of server units; an inlet passage guiding a refrigerant flowing into the case; and a first porous plate disposed between the part of the case connected to the inlet passage and the plurality of server units, having a plurality of first holes formed therein.

Description

Technology Field

[0001] The following disclosure relates to a liquid immersion cooling server system. Background Technology

[0003] A server system refers to a computer system that enables the sharing of resources (e.g., files, printers, communication lines, etc.) among multiple workstations connected via a Local Area Network (LAN). Generally, a server system consists of multiple racks installed in rows, each equipped with a data server containing communication devices and a database. Heat is generated during the operation of a server system; if this heat exceeds a certain temperature, the system's operation becomes impaired, necessitating a cooling device to cool it down. As server systems have become more high-performance, conventional air-conditioning cooling systems have proven insufficient in terms of cooling capacity, leading to active recent research on immersion cooling methods. Immersion cooling removes heat by directly immersing the server in a non-conductive liquid refrigerant; this method offers higher cooling efficiency than air-based cooling, thereby reducing power consumption. However, servers located close to the refrigerant supply unit benefit significantly from the cooling effect, whereas servers located farther away receive relatively less cooling because the refrigerant temperature has already risen.

[0004] The aforementioned background technology was possessed or acquired during the process of deriving the present disclosure and cannot be considered as prior art disclosed to the general public prior to the filing of the present disclosure.

[0006] A liquid immersion cooling type server system according to one embodiment may include: a plurality of server units; a case accommodating the plurality of server units; an inlet passage guiding a refrigerant flowing into the case; and a first porous plate disposed between the part of the case connected to the inlet passage and the plurality of server units, having a plurality of first holes formed therein.

[0007] In one embodiment, the liquid immersion cooling type server system may further include a second porous plate having a plurality of second holes formed therein, located between the part of the case connected to the inlet passage and the first porous plate.

[0008] In one embodiment, at least one of the plurality of second holes may be arranged offset from at least one of the plurality of first holes based on the direction in which the first porous plate and the second porous plate are spaced apart.

[0009] In one embodiment, the second porous plate may be positioned below the first porous plate.

[0010] In one embodiment, the case may include a receiving body that provides a space capable of accommodating a refrigerant for cooling the plurality of server units; and a server rack formed inside the receiving body and supporting the plurality of server units spaced apart from the first perforated plate.

[0011] In one embodiment, the server rack is formed lengthwise on the side wall of the receiving body in a direction parallel to the ground, and the plurality of server units may be arranged spaced apart from each other along the length direction of the server rack.

[0012] In one embodiment, each computing unit provided in the plurality of server units may be positioned at a biased position toward the first perforated plate with respect to the center of the case.

[0013] In one embodiment, at least one of the first hole and the second hole may have a shape in which the cross-sectional area increases as it moves toward the plurality of server units.

[0014] In one embodiment, the second porous plate is composed of a plurality of divided plates, and the distance between at least one of the plurality of divided plates and the first porous plate may be different from the distance between the remaining of the plurality of divided plates and the first porous plate.

[0015] In one embodiment, at least one of the first porous plate and the second porous plate may be installed in a height-adjustable manner within the case.

[0016] In one embodiment, the liquid immersion cooling type server system may further include a lifting device capable of adjusting the height of the second porous plate within the case; and a processor capable of controlling the lifting device.

[0017] In one embodiment, the liquid immersion cooling method server system further includes an interface for receiving information regarding the viscosity of the refrigerant from a user or an external terminal, and the processor can control the lifting device such that if the viscosity of the refrigerant received from the interface is higher than a set value, the distance between the first porous plate and the second porous plate becomes greater than a set distance.

[0018] In one embodiment, the liquid immersion cooling server system further includes a plurality of temperature sensors capable of detecting information regarding the temperature distribution within the case, and the processor can control the lifting device based on the information regarding the temperature distribution so that the temperature distribution is within a set deviation.

[0019] In one embodiment, the second porous plate is composed of a plurality of divided plates, at least some of which are movable independently of the others, and the lifting device can adjust the height of at least some of the plurality of divided plates.

[0020] In one embodiment, the processor can control, based on information regarding the temperature distribution, that the distance between the first porous plate and the dividing plate that overlaps the area with the highest temperature in the case among the plurality of dividing plates, relative to the height direction of the case, is greater than the distance between the remaining dividing plates among the plurality of dividing plates and the first porous plate.

[0021] In one embodiment, the plurality of first holes and the plurality of second holes may not overlap with each other based on the direction in which the first porous plate and the second porous plate are spaced apart.

[0022] In one embodiment, at least one of the first porous plate and the second porous plate may include an insulating material.

[0023] In one embodiment, the inlet passages are provided in a plurality, and the plurality of inlet passages are spaced apart along the periphery of the case, and the liquid immersion cooling method server system may further include: a plurality of inlet valves each installed in the plurality of inlet passages to locally control the flow rate of refrigerant flowing into the case; a plurality of temperature sensors capable of detecting information regarding the temperature distribution within the case; and a processor that controls the plurality of inlet valves based on the information regarding the temperature distribution so that the temperature distribution is within a set deviation.

[0024] In one embodiment, the sum of the cross-sectional areas of the plurality of first holes per unit area for a first region located close to the inflow passage among the first porous plates may be smaller than the sum of the cross-sectional areas of the plurality of first holes per unit area for a second region located farther from the inflow passage than the first region among the first porous plates.

[0025] In one embodiment, at least some of the plurality of first holes may include an inner wall with a shape inclined toward a direction away from the inflow passage.

[0026] In one embodiment, the first porous plate may be positioned higher than the part of the case connected to the inflow passage.

[0027] A liquid immersion cooling server system according to one embodiment may include: a plurality of server units; a case accommodating the plurality of server units; a plurality of inlet passages spaced apart along the periphery of the case to guide refrigerant flowing into the case; a plurality of inlet valves each installed in the plurality of inlet passages to locally control the flow rate of refrigerant flowing into the case; a plurality of temperature sensors capable of detecting information regarding a temperature distribution within the case; and a processor that controls the plurality of inlet valves based on the information regarding the temperature distribution so that the temperature distribution is within a set deviation.

[0028] In one embodiment, the processor can control the plurality of inlet valves based on information regarding the temperature distribution, such that the flow rate of the refrigerant flowing into the inlet passage closest to the region with the highest temperature in the case among the plurality of inlet passages is greater than the flow rate of the refrigerant flowing into the remaining inlet passages.

[0029] In one embodiment, the plurality of temperature sensors may be installed at different locations within the case when viewed in the height direction of the case.

[0030] In one embodiment, the liquid immersion cooling method server system further includes a plurality of discharge passages spaced apart along the periphery of the case to guide the refrigerant discharged from the case, and the plurality of temperature sensors are each installed in the plurality of discharge passages to detect the temperature of the refrigerant discharged into the plurality of discharge passages.

[0031] In one embodiment, the immersion cooling server system comprises: a plurality of discharge passages spaced apart along the periphery of the case to guide the refrigerant discharged from the case; and a plurality of discharge valves each installed in the plurality of discharge passages to locally control the flow rate of the refrigerant discharged from the case, and the processor can control the plurality of discharge valves based on information regarding the temperature distribution such that the flow rate of the refrigerant discharged from the discharge passage closest to the region with the highest temperature in the case among the plurality of discharge passages is greater than the flow rate of the refrigerant discharged from the remaining discharge passages. Brief explanation of the drawing

[0033] FIG. 1 is a perspective view showing a liquid immersion cooling type server system according to one embodiment. FIG. 2 is a plan view showing the positional relationship between a first porous plate and a second porous plate according to one embodiment. FIG. 3 is a drawing showing the interior of a liquid immersion cooling type server system according to one embodiment. FIG. 4 is a diagram showing how a refrigerant flows into and reaches a server in a liquid immersion cooling type server system according to one embodiment. FIG. 5 is a diagram showing a refrigerant circuit diagram of a liquid immersion cooling type server system according to one embodiment. FIG. 6 is a cross-sectional view showing the shape of a porous plate according to one embodiment. FIG. 7 is a block diagram of a liquid immersion cooling type server system according to one embodiment. FIG. 8 is a flowchart illustrating a control method for a liquid immersion cooling type server system according to one embodiment. FIG. 9 is a flowchart illustrating a control method for a liquid immersion cooling type server system according to one embodiment. FIG. 10 is a flowchart illustrating a porous plate height adjustment operation according to one embodiment. FIG. 11 is a flowchart illustrating a control method for a liquid immersion cooling type server system according to one embodiment. FIG. 12a is a plan view showing the positional relationship of a plurality of porous plates according to one embodiment. FIG. 12b is a plan view showing the positional relationship of a plurality of porous plates according to one embodiment. FIG. 12c is a plan view showing the positional relationship of a plurality of porous plates according to one embodiment. FIG. 13 is a drawing showing the interior of a liquid immersion cooling type server system according to one embodiment. FIG. 14 is a drawing showing the interior of a liquid immersion cooling type server system according to one embodiment. FIG. 15 is a flowchart illustrating a control method for a liquid immersion cooling type server system according to one embodiment. FIG. 16a is a plan view showing a porous plate according to one embodiment. FIG. 16b is a plan view showing a perforated plate according to one embodiment. FIG. 16c is a cross-sectional view showing a porous plate according to one embodiment. Specific details for implementing the invention

[0034] Hereinafter, embodiments are described in detail with reference to the attached drawings. However, various modifications may be made to the embodiments, and thus the scope of the patent application is not limited or restricted by these embodiments. It should be understood that all modifications, equivalents, and substitutions to the embodiments are included within the scope of the rights.

[0035] The terms used in the embodiments are for illustrative purposes only and should not be interpreted as intended to be limiting. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0036] In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0037] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the embodiments pertain. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0038] In addition, when describing with reference to the attached drawings, identical components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. When describing embodiments, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the embodiment, such detailed description is omitted.

[0039] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments. These terms are intended merely to distinguish the components from other components, and the nature, order, or sequence of the components is not limited by these terms. Where it is stated that a component is "connected," "combined," or "connected" to another component, it should be understood that while the component may be directly connected or connected to the other component, another component may also be "connected," "combined," or "connected" between each component.

[0040] Components included in any one embodiment and components having common functions shall be described using the same names in other embodiments. Unless otherwise stated, the description in any one embodiment may also apply to other embodiments, and specific descriptions shall be omitted to the extent of overlap.

[0042] FIG. 1 is a perspective view showing a liquid immersion cooling type server system according to one embodiment. FIG. 2 is a plan view showing the positional relationship between a first perforated plate and a second perforated plate according to one embodiment. FIG. 3 is a drawing showing the interior of a liquid immersion cooling type server system according to one embodiment. FIG. 4 is a drawing showing a refrigerant flowing into a liquid immersion cooling type server system according to one embodiment and reaching the server.

[0043] Referring to FIGS. 1 to 4, according to an embodiment of the liquid immersion cooling method server system (1), the server unit (12) can be efficiently cooled by cooling it in a refrigerant in a liquid immersion manner. For example, the liquid immersion cooling method server system (1) can effectively remove heat from the server unit (12) by completely immersing the server unit (12) in a non-conductive refrigerant, thereby allowing the refrigerant to directly absorb heat generated from the server unit (12) and release the refrigerant that has absorbed heat. For example, the liquid immersion cooling method server system (1) can ensure that all server units (12) have a constant temperature within a set deviation regardless of location by increasing the uniformity of the temperature distribution of the refrigerant contained within. For example, the liquid immersion cooling method server system (1) may include a case (11), a server unit (12), an inlet passage (13), an outlet passage (14), a lifting device (17), a first porous plate (P1), and a second porous plate (P2). Hereinafter, the case in which the liquid immersion cooling method server system (1) includes a plurality of porous plates (P1, P2) is described as an example, but it should be noted that the liquid immersion cooling method server system (1) may be equipped with only one porous plate (e.g., the first porous plate (P1)).

[0044] The case (11) can accommodate a plurality of server units (12). For example, the case (11) may include a receiving body (111) that provides a space for accommodating a refrigerant for cooling a plurality of server units (12), a body cover (112) that covers a portion open upward from the receiving body (111), and a server rack (113) formed inside the receiving body (111) and supporting a plurality of server units (12). For example, the body cover (112) may be provided in a form that is rotatable relative to the receiving body (111). For example, the server rack (113) may support the server units (12) in a spaced-away state from the first perforated plate (P1). For example, the server rack (113) may be formed lengthwise on the side wall of the receiving body (111) in a direction parallel to the ground. Meanwhile, for the convenience of understanding, the case (11) is shown with a dotted line, but it should be noted that unless otherwise stated, the scope of the present invention is not limited to cases where the case (11) is formed of a transparent material.

[0045] A plurality of server units (12) may be provided. For example, a plurality of server units (12) may be arranged spaced apart from each other along the longitudinal direction of the server rack (113). For example, a server unit (12) may include a server body (121) forming the external shape of the server unit (12), a support member (122) formed protruding from the sub-body and supported on the server rack (113), and a computing unit (123) (e.g., a central processing unit (CPU), a graphics processing unit (GPU)) that performs the function of processing and calculating data in the server unit (12). For example, each computing unit (123) provided in a plurality of server units (12) may be positioned at a position biased toward the first perforated plate (P1) with respect to the center of the case (11) (e.g., the lower side of the case (11)). For example, by positioning electronic components (e.g., CPU, GPU) with a relatively high heat output among the server units (12) on the side where the refrigerant is introduced, the uniformity of the temperature distribution in the vertical direction within the case (11) can be improved.

[0046] The inlet passage (13) can guide the refrigerant flowing into the case (11). For example, the inlet passage (13) may be located on the side of the case (11). For example, the inlet passage (13) may be located on the lower side of the case (11). Meanwhile, it should be noted that the location of the inlet passage (13) is not necessarily limited to this, and the inlet passage (13) may be placed on the upper side of the case (11). For example, it should be noted that the inlet passage (13) may be placed at a location corresponding to the part with the highest average heat generation compared to the rest of the server unit (12) during normal operation. For example, the inlet passage (13) may be provided in multiple numbers, and the multiple inlet passages (13) may be spaced apart along the perimeter direction (e.g., horizontal direction and / or vertical direction) of the case (11). According to this arrangement, the uniformity of the temperature distribution according to the position of the case (11) can be improved compared to the case where only one inlet passage (13) is provided. For example, the inlet passage (13) may be connected to a portion located below the second porous plate (P2) of the case (11). Meanwhile, this is merely an example, and it should be noted that at least one or all of the plurality of inlet passages (13) may be connected to a portion located between the first porous plate (P1) and the second porous plate (P2) of the case (11).

[0047] The discharge passage (14) can guide the refrigerant discharged from the case (11). For example, the discharge passage (14) may be located on the upper side of the case (11). For example, the discharge passage (14) may be provided in multiple numbers, and the multiple discharge passages (14) may be spaced apart along the circumferential direction (e.g., horizontal direction and / or vertical direction) of the case (11). With such an arrangement, the refrigerant in a relatively high temperature area may be discharged faster than in the remaining area, thereby improving the uniformity of the temperature distribution within the case (11). For example, the discharge passage (14) may be located at a position higher than the multiple server units (12). Meanwhile, this is merely one example, and it should be noted that at least one of the multiple discharge passages (14) may be connected to a part of the case (11) located at the same height as the multiple server units (12) or to a part of the case (11) located below the multiple server units (12).

[0048] The first perforated plate (P1) includes a plurality of first holes (H1) and can be positioned between the part of the case (11) connected to the inflow passage (13) and the plurality of server units (12). For example, the first perforated plate (P1) can be positioned higher than the part of the case (11) connected to the inflow passage (13). For example, the first perforated plate (P1) can be positioned below the plurality of server units (12). For example, refrigerant introduced from the inflow passage (13) can flow through the plurality of first holes (H1) to the server units (12). If the first perforated plate (P1) is not provided, the refrigerant introduced from the inflow passage (13) will first reach the server unit (12) closest to the inflow passage (13) among the plurality of server units (12), so an imbalance in cooling efficiency may occur between the plurality of server units (12). For example, even if multiple inlet passages (13) are provided, the cooling effect for the server unit (12) located in the area furthest from the multiple inlet passages (13) may be reduced because the refrigerant supplied to the server unit (12) is already at a raised temperature. However, the first porous plate (P1) can reduce the unevenness of cooling by dispersing the flow of such refrigerant to some extent.

[0049] The second porous plate (P2) includes a plurality of second holes (H2) and may be located between the part of the case (11) connected to the inflow passage (13) and the first porous plate (P1). For example, the second porous plate (P2) may be located below the first porous plate (P1). For example, when the first porous plate (P1) and the second porous plate (P2) are viewed in a spaced-away direction (e.g., the up-down direction in FIG. 3), at least one of the second holes (H2) may be offset from the plurality of first holes (H1). For example, when the first perforated plate (P1) is located on the lower side of the server unit (12) and the second perforated plate (P2) is located on the lower side of the first perforated plate (P1), the plurality of second holes (H2) may be arranged such that at least one of them is offset from the plurality of first holes (H1) when viewed in the height direction of the case (11). According to such a structure, within the space between the first perforated plate (P1) and the second perforated plate (P2), the diffusion of the refrigerant in a direction parallel to the plurality of perforated plates (P1, P2) (e.g., a direction horizontal to the ground) can be actively promoted. For example, when the second perforated plate (P2) is not present and only the first perforated plate (P1) is present, the refrigerant can flow rapidly through the plurality of first holes (H1). However, according to the second porous plate (P2), as shown in FIG. 3, not only does it gradually reduce the tendency of the refrigerant flowing from the inlet passage (13) to flow in a specific direction, but it can also help the flow of the refrigerant to spread uniformly in the horizontal direction through the vortex phenomenon of the refrigerant occurring between the first porous plate (P1) and the second porous plate (P2). For example, as shown in FIG. 2, when the first porous plate (P1) and the second porous plate (P2) are viewed in a separated direction (e.g., the height direction of the case (11)), the plurality of first holes (H1) and the plurality of second holes (H2) may not overlap each other.Meanwhile, it should be noted that this is merely an example, and that parts of the multiple first holes (H1) and parts of the multiple second holes (H2) may be arranged to overlap each other. For example, the multiple first holes (H1) and the multiple second holes (H2) may all be arranged to overlap each other. Even in such a case, the refrigerant passing through the second porous plate (P2) flows toward the first porous plate (P1) in a diffused form from the second holes (H2), and consequently, can be further diffused by the first porous plate (P1).

[0050] According to one embodiment, at least one of the first porous plate (P1) and the second porous plate (P2) may include an insulating material. With such a configuration, the problem of the refrigerant performing a cooling action through conduction, regardless of the refrigerant flow path formed by the first porous plate (P1) and / or the second porous plate (P2), can be reduced. For example, the first porous plate (P1) and / or the second porous plate (P2) may be formed of an insulating material (e.g., synthetic resin). For example, the first porous plate (P1) and / or the second porous plate (P2) may include an insulating coating layer formed of an insulating material (e.g., synthetic resin) on at least one surface (e.g., the surface facing the server unit (12)) or the outer front surface.

[0051] According to one embodiment, at least one of the first porous plate (P1) and the second porous plate (P2) can be installed in a height-adjustable manner within the case (11). For example, when considering the viscosity of the refrigerant, if the distance between the first porous plate (P1) and the second porous plate (P2) is too narrow, the proper flow of the refrigerant may be obstructed, or in some cases, the pressure between the first porous plate (P1) and the second porous plate (P2) may rise excessively, potentially causing damage to the immersion cooling server system (1). According to the above-described structure, the distance between the first porous plate (P1) and the second porous plate (P2) can be appropriately adjusted by considering the viscosity of the refrigerant, etc. As a means for the height adjustment described above, for example, the case (11) may include a plurality of height adjustment jaws that are formed protruding from the inner wall of the receiving body (111) and support the first perforated plate (P1) and / or the second perforated plate (P2). For example, the first perforated plate (P1) and / or the second perforated plate (P2) may be provided in a structure that can be fixed at different heights of the inner wall of the receiving body (111) by a separate fixing body (e.g., a screw). According to the above example, the user can adjust the distance between the first perforated plate (P1) and the second perforated plate (P2) by manually adjusting the height of the first perforated plate (P1) and / or the second perforated plate (P2). Meanwhile, the distance between the first perforated plate (P1) and the second perforated plate (P2) may also be adjusted by the lifting device (17) described below.

[0052] The lifting device (17) is connected to, for example, the second porous plate (P2) to adjust the height of the second porous plate (P2) within the case (11). For example, the lifting device (17) may be driven by a driving source such as a motor and / or a pump. For example, the lifting device (17) may have a piston-cylinder structure. For example, the cylinder may be installed on the bottom surface of the case (11), and the piston may be installed so as to be slidable relative to the cylinder, thereby raising or lowering the second porous plate (P2) located at the end of the piston. For example, the lifting device (17) may have a rack-and-pinion structure. For example, the pinion may be rotatably installed on the inner wall of the case (11), and the rack may be installed to be able to move linearly in the height direction of the case (11) by engaging with the pinion, thereby raising or lowering the second porous plate (P2) connected to the rack. Meanwhile, the configuration of the lifting device (17) described above is merely an example, and a person skilled in the art will fully understand that by applying a known structure capable of linear movement to the lifting device (17), a structure can be realized in which the second perforated plate (P2) can be raised or lowered in the height direction of the case (11).

[0054] FIG. 5 is a diagram showing a refrigerant circuit diagram of a liquid immersion cooling type server system according to one embodiment.

[0055] Referring to FIG. 5, a liquid immersion cooling type server system (1) according to one embodiment may include a case (11), a plurality of server units (12), a plurality of inlet passages (13), a plurality of discharge passages (14), a plurality of temperature sensors (15) and a plurality of flow valves (16).

[0056] A plurality of inlet passages (13) can be connected to a pair of mutually facing side walls of the case (11), for example, when viewed in the height direction of the case (11). With such a structure, the case (11) can receive refrigerant from the plurality of inlet passages (13) connected to both side walls, thereby improving the uniformity of the temperature distribution. For example, the plurality of inlet passages (13) can be spaced apart in a direction parallel to the direction in which the plurality of server units (12) are arranged.

[0057] A plurality of discharge passages (14) may each be connected to a pair of mutually facing side walls of the case (11) when viewed in the height direction of the case (11), for example. With such a structure, the refrigerant contained in the case (11) can be discharged from the plurality of discharge passages (14) connected to both side walls, thereby improving the uniformity of the temperature distribution. For example, the plurality of discharge passages (14) may be spaced apart in a direction parallel to the direction in which the plurality of server units (12) are arranged.

[0058] A plurality of temperature sensors (15) can detect information regarding the temperature distribution within the case (11). The information regarding the temperature distribution described above may include the temperature detected by each temperature sensor (15). For example, the plurality of temperature sensors (15) may include an inlet sensor (151), an outlet sensor (152), and a server sensor (153).

[0059] An inlet sensor (151) is installed in an inlet passage (13) and can detect the temperature of the refrigerant before it flows into the case (11) to cool the server unit (12). For example, a plurality of inlet sensors (151) may be installed in each of the plurality of inlet passages (13) to detect the temperature of the refrigerant flowing into the plurality of inlet passages (13). For example, a plurality of inlet sensors (151) may be installed in each individual branch passage connected to the side wall of the case (11).

[0060] A discharge sensor (152) is installed in a discharge passage (14) and can detect the temperature of the refrigerant after cooling the server unit (12) located inside the case (11). For example, a plurality of discharge sensors (152) can be installed in each of the plurality of discharge passages (14) to detect the temperature of the refrigerant discharged into the plurality of discharge passages (14). For example, a plurality of discharge sensors (152) can be installed in each individual branch passage connected to the side wall of the case (11). For example, based on the temperature information detected by the discharge sensors (152) installed in each discharge passage (14), the temperature of each area located close to the discharge passage (14) where each discharge sensor (152) is installed in the case (11) can be indirectly detected.

[0061] A server sensor (153) is located inside the case (11) and can detect the temperature of the surrounding refrigerant of a server unit (12) located inside the case (11). For example, multiple server sensors (153) may be installed at different locations inside the case (11) when viewed in the height direction of the case (11). In this way, the temperature of each area inside the case (11) can be directly detected by multiple server sensors (153).

[0062] The flow valve (16) may include an inlet valve (161) and a discharge valve (162). For example, a plurality of inlet valves (161) may be installed in each of a plurality of inlet passages (13) to locally control the flow rate of refrigerant flowing into the case (11). For example, a plurality of discharge valves (162) may be installed in each of a plurality of discharge passages (14) to locally control the flow rate of refrigerant discharged from the case (11).

[0064] FIG. 6 is a cross-sectional view showing the shape of a porous plate according to one embodiment.

[0065] Referring to FIG. 6, according to one embodiment, at least one hole (H) among the first hole (H1) of the first porous plate (P1) and / or the second hole (H2) of the second porous plate (P2) may have a shape in which the cross-sectional area is expanded toward a plurality of server units (12). With such a shape, when the refrigerant introduced from the inlet passage (13) passes through the porous plate (P), the cross-sectional area (A_out) of the outlet portion of the hole (H) is larger than the cross-sectional area (A_in) of the inlet portion of the hole (H), so the flow velocity of the refrigerant at the outlet portion is reduced due to the Bernoulli effect. This reduction in flow velocity helps the diffusion of the refrigerant in the horizontal direction, and consequently, the uniformity of the temperature distribution within the case (11) can be improved.

[0067] FIG. 7 is a block diagram of a liquid immersion cooling type server system according to one embodiment.

[0068] Referring to FIG. 7, a liquid immersion cooling type server system (1) according to one embodiment may include a temperature sensor (15), a flow valve (16), a lifting device (17), an interface (18), and a processor (19).

[0069] The interface (18) can receive information regarding the viscosity of the refrigerant from a user or an external terminal. Here, the information regarding the viscosity may include the viscosity value of the refrigerant, the material name and / or product name. For example, the immersion cooling method server system (1) may include data regarding the viscosity value corresponding to the material name and / or product name of the refrigerant, or receive it from the outside. The interface (18) can transmit the received information regarding the viscosity of the refrigerant to the processor (19).

[0070] The processor (19) can control the flow valve (16) and / or the lifting device (17) based on information received from the temperature sensor (15) and / or the interface (18). Referring to the drawings below, the process of the processor (19) controlling the flow valve (16) and / or the lifting device (17) will be described by example.

[0072] FIG. 8 is a flowchart illustrating a control method for a liquid immersion cooling type server system according to one embodiment.

[0073] Referring to FIGS. 7 and 8, a processor (19) of a liquid immersion cooling server system (1) according to one embodiment can control a plurality of inlet valves (161) based on information regarding the temperature distribution so that the temperature distribution is within a set deviation. A control method of the liquid immersion cooling server system (1) according to one embodiment may include an operation (51) of receiving temperature information and an operation (52) of controlling the flow rate valve (16) at each location.

[0074] In operation 51, the processor (19) can receive information about the temperature distribution from a plurality of temperature sensors (15). Based on the information about the temperature distribution described above, the processor (19) can determine the temperature distribution by region within the case (11).

[0075] In operation 52, the processor (19) can control a plurality of inlet valves (161) and / or a plurality of discharge valves (162).

[0076] According to one embodiment, the processor (19) can control a plurality of inlet valves (161) such that the flow rate of the refrigerant flowing into the inlet passage (13) closest to the region with the highest temperature in the case (11) among the plurality of inlet passages (13) is greater than the flow rate of the refrigerant flowing into the remaining inlet passages (13). With such operation, the amount of cooling provided to the region with the highest temperature in the case (11) is increased compared to the remaining region, thereby improving the uniformity of the temperature distribution.

[0077] According to one embodiment, the processor (19) can control a plurality of discharge valves (162) such that the flow rate of the refrigerant discharged from the discharge passage (14) closest to the region with the highest temperature in the case (11) among the plurality of discharge passages (14) is greater than the flow rate of the refrigerant discharged from the remaining discharge passages (14). With such operation, the amount of refrigerant discharged from the region with the highest temperature in the case (11) is increased compared to the remaining region, and the amount of refrigerant having a temperature lower than that temperature can be increased in that region. Accordingly, the uniformity of the temperature distribution within the case (11) can be improved.

[0078] For example, operation 52 can be performed repeatedly based on information regarding the temperature distribution until the temperature distribution is within a set deviation. Here, it should be noted that whether the temperature distribution is within a set deviation can be determined, for example, by the difference between the highest and lowest values ​​among the temperatures measured by each of the multiple temperature sensors (15), but is not limited thereto.

[0080] FIG. 9 is a flowchart illustrating a control method of a liquid immersion cooling type server system according to one embodiment. FIG. 10 is a flowchart illustrating a porous plate height adjustment operation according to one embodiment.

[0081] Referring to FIGS. 7, 9 and 10, the processor (19) of the liquid immersion cooling method server system (1) according to one embodiment can adjust the distance between the first porous plate (P1) and the second porous plate (P2) according to the viscosity of the refrigerant contained in the case (11). The control method of the liquid immersion cooling method server system (1) according to one embodiment may include an operation (61) of receiving information about the viscosity of the refrigerant and an operation (62) of adjusting the height of the porous plate.

[0082] In operation 61, the processor (19) may receive information regarding the viscosity of the refrigerant (e.g., viscosity value of the refrigerant, material name and / or product name). Based on the information regarding the viscosity of the refrigerant described above, the processor (19) may determine the viscosity value of the refrigerant flowing into the case (11).

[0083] In operation 62, the processor (19) can adjust the height of the first porous plate (P1) and / or the second porous plate (P2) based on the viscosity value of the refrigerant. For example, the processor (19) can adjust the height of the first porous plate (P1) and / or the second porous plate (P2) by controlling the lifting device (17) so that the distance between the first porous plate (P1) and the second porous plate (P2) becomes greater than the set distance when the viscosity of the refrigerant is higher than the set value. For example, as illustrated in FIG. 10, operation 62 may include an operation (621) of determining the height of the porous plate according to information about the viscosity of the refrigerant, and an operation (622) of adjusting the height of the porous plate based on the height of the porous plate determined in operation 621.

[0084] In operation 621, the processor (19) may determine the height of the first porous plate (P1) and / or the second porous plate (P2) based on information regarding the viscosity of the refrigerant. For example, if the height of the first porous plate (P1) relative to the case (11) is fixed, in operation 621 the processor (19) may determine the height of the second porous plate (P2). For example, the immersion cooling method server system (1) may include or receive from an external source data regarding information on the distance between the first porous plate (P1) and the second porous plate (P2) corresponding to information regarding the viscosity of the refrigerant. For example, the above-described data may be provided in the form of a table that defines the height of the second porous plate (P2) in three stages (e.g., first height (h1), second height (h2), and third height (h)) according to the range of viscosity values, but it should be noted that it is not limited thereto.

[0085] In operation 622, the processor (19) can control the height of the first perforated plate (P1) and / or the second perforated plate (P2) by controlling the lifting device (17) based on the information determined in operation 621.

[0087] FIG. 11 is a flowchart illustrating a control method for a liquid immersion cooling type server system according to one embodiment.

[0088] Referring to FIG. 7 and FIG. 11, a processor (19) of a liquid immersion cooling method server system (1) according to one embodiment can control a lifting device (17) so that the temperature distribution is within a set deviation based on information regarding the temperature distribution. A control method of a liquid immersion cooling method server system (1) according to one embodiment may include an operation (71) of detecting a temperature deviation, an operation (72) of comparing the temperature deviation and the set deviation, and an operation (73) of adjusting the height of the perforated plate.

[0089] In operation 71, the processor (19) may receive information about the temperature distribution from a plurality of temperature sensors (15). Based on the information about the temperature distribution described above, the processor (19) may determine the temperature deviation within the case (11). For example, the temperature deviation described above may be determined as the difference between the highest value and the lowest value among the temperatures measured by each of the plurality of temperature sensors (15), but is not limited thereto.

[0090] In operation 72, the distance between the first porous plate (P1) and the second porous plate (P2) can be adjusted by performing operation 73 based on the result of comparing the temperature deviation and the set deviation described above. For example, the comparison result may include whether the temperature deviation described above is less than the set deviation. For example, the comparison result may include whether the temperature deviation described above is less than or equal to the set deviation. For example, if the comparison result is false, operation 73 can be performed.

[0091] In operation 73, the uniformity of the temperature distribution of the refrigerant can be increased by adjusting the distance between the first porous plate (P1) and the second porous plate (P2). For example, in operation 73, the processor (19) can increase the distance between the first porous plate (P1) and the second porous plate (P2) by controlling the lifting device (17) in a direction that decreases the height of the second porous plate (P2). For example, in operation 73, the processor (19) can decrease the distance between the first porous plate (P1) and the second porous plate (P2) by controlling the lifting device (17) in a direction that increases the height of the second porous plate (P2). For example, the uniformity of the temperature distribution of the refrigerant can be improved by controlling the time for the refrigerant to diffuse between the first porous plate (P1) and the second porous plate (P2), or by controlling the refrigerant flow resistance that may occur between the first porous plate (P1) and the second porous plate (P2). For example, if the distance between the first porous plate (P1) and the second porous plate (P2) is increased, the time for the refrigerant to diffuse between the first porous plate (P1) and the second porous plate (P2) is increased, so the diffusion of the refrigerant is better, and the uniformity of the temperature distribution of the refrigerant can be improved. For example, if the distance between the first porous plate (P1) and the second porous plate (P2) is decreased, the time for the refrigerant to diffuse decreases and the flow resistance of the refrigerant increases, which may impair the uniformity of the temperature distribution of the refrigerant. For example, operation 73 can be performed repeatedly until the temperature deviation becomes less than the set deviation.

[0092] According to one embodiment, it is noted that the distance between the first porous plate (P1) and the second porous plate (P2) may be adjusted based on the rate of temperature change of the refrigerant over time (e.g., amount of temperature change / time).

[0094] FIG. 12a is a plan view showing the positional relationship of a plurality of perforated plates according to one embodiment. FIG. 12b is a plan view showing the positional relationship of a plurality of perforated plates according to one embodiment. FIG. 12c is a plan view showing the positional relationship of a plurality of perforated plates according to one embodiment.

[0095] Referring to FIGS. 12a to 12c, the second porous plate (P2) according to one embodiment may be composed of a plurality of divided plates. For example, as described later in FIGS. 13 and 14, the distance (d_2) between at least one of the plurality of divided plates (e.g., second-2 porous plate (P2-2)) and the first porous plate (P1) may be different from the distance (d_1) between the remaining of the plurality of divided plates (e.g., second-1 porous plate (P2-1) and second-3 porous plate (P2-3)) and the first porous plate (P1). With such a configuration, the cooling efficiency can be designed to vary by location by taking into account the temperature distribution of the refrigerant within the case (11).

[0096] For example, in the case of an area where high cooling efficiency is required (e.g., an area located far from the inlet passage (13)), multiple dividing plates can be installed at different heights so that the distance between the dividing plate and the first porous plate (P1) located in that area is greater than the distance between the remaining dividing plates and the first porous plate (P1). With such a configuration, the proportion of refrigerant flowing into the area where high cooling efficiency is required among the refrigerants flowing in from the inlet passage (13) can be increased. For example, the narrower the gap between the dividing plate and the first porous plate (P1), the greater the resistance to the flow of refrigerant flowing through the space between the dividing plate and the first porous plate (P1). Therefore, more refrigerant can flow into the area where the gap between the dividing plate and the first porous plate (P1) is relatively wide. As a result, through such a configuration, the uniformity of the temperature distribution of the entire liquid immersion cooling server system (1) can be improved.

[0097] For example, as shown in FIG. 12a, the second perforated plate (P2) may include a plurality of divided plates divided in the vertical or horizontal direction of the case (11). For example, if a plurality of inflow passages (13) are spaced apart along either the vertical or horizontal direction of the case (11), the second perforated plate (P2) may include a plurality of divided plates separated from each other in a direction perpendicular to the direction in which the plurality of inflow passages (13) are arranged. For example, since a new refrigerant with a continuously low temperature is introduced into the edge region of the case (11) adjacent to the inflow passage (13), it may have a relatively lower temperature compared to the center region of the case (11). In such a case, as shown in FIG. 13 and / or FIG. 14, the uniformity of cooling can be increased by installing a distance between the first perforated plate (P1) and the divided plate located relatively closer to the center of the case (11) among the plurality of divided plates (e.g., the second perforated plate (P2-2)).

[0098] For example, as shown in FIG. 12b, the second porous plate (P2) may include a central dividing plate located at the center of the case (11) and a periphery dividing plate installed around the central dividing plate. For example, when a plurality of inflow passages (13) are spaced apart to surround the periphery of the case (11), the uniformity of cooling can be increased by installing the distance between the central dividing plate and the first porous plate (P1) such that the distance between the periphery dividing plate and the first porous plate (P1) is greater than the distance between the periphery dividing plate and the first porous plate (P1).

[0099] For example, as shown in FIG. 12c, the second porous plate (P2) may include a plurality of divided plates divided in the vertical and horizontal directions of the case (11). For example, the distance between each of the plurality of divided plates and the first porous plate (P1) may be determined differently by taking into account the temperature distribution of the case (11).

[0100] According to one embodiment, at least some of the plurality of dividing plates may be installed to be movable independently of the remainder. Hereinafter, an exemplary case in which the height of at least some of the plurality of dividing plates is adjusted by the lifting device (17) will be described. Meanwhile, this is merely an example, and it should be noted that even if the lifting device (17) is not provided, the height of at least some of the plurality of dividing plates may be manually adjusted by a user.

[0102] FIG. 13 is a drawing showing the interior of a liquid immersion cooling type server system according to one embodiment.

[0103] Referring to FIG. 7 and FIG. 13, a liquid immersion cooling type server system (1) according to one embodiment may include a case (11), a server unit (12), an inlet passage (13), a discharge passage (14), a temperature sensor (15), a flow valve (16), a lifting device (17), an interface (18), a processor (19), a first porous plate (P1), and a second porous plate (P2).

[0104] According to one embodiment, the second porous plate (P2) may include a plurality of porous plates (P2-1, P2-2, P2-3) that are movable independently of each other. For example, FIG. 13 illustrates an exemplary case in which the second porous plate (P2) is composed of three porous plates (P2-1, P2-2, P2-3), but it should be noted that the number of porous plates is not limited and may be composed of two or four or more divided porous plates. For example, it should be noted that the second porous plate (P2) may have the shape described in FIG. 12a to FIG. 12c above.

[0105] At least one of the 2-1 perforated plate (P2-1), the 2-2 perforated plate (P2-2), and the 2-3 perforated plate (P2-3) may be connected to a lifting device (17) capable of raising and lowering the perforated plate. For example, in the case of a server unit (12) located in the center of the case (11) among a plurality of server units (12), there is a possibility that cooling may not be properly performed compared to other server units (12). In this case, the processor (19) can control the lifting device (17) to adjust the height of the 2-2 perforated plate (P2-2) so that the 2-2 perforated plate (P2-2), which is located close to the server unit (12) located in the center of the case (11), moves away from the 1 perforated plate (P1). According to this operation, the flow rate of the refrigerant flowing toward the server unit (12) located in the center of the case (11) is increased, thereby improving the uniformity of the temperature distribution within the case (11).

[0107] FIG. 14 is a drawing showing the interior of a liquid immersion cooling type server system according to one embodiment.

[0108] Referring to FIG. 7 and FIG. 14, a liquid immersion cooling type server system (1) according to one embodiment may include a case (11), a server unit (12), an inlet passage (13), a discharge passage (14), a temperature sensor (15), a flow valve (16), a lifting device (17), an interface (18), a processor (19), a first porous plate (P1), and a second porous plate (P2).

[0109] According to one embodiment, the second porous plate (P2) may include a plurality of porous plates (P2-1, P2-2, P2-3) that are movable independently of each other. For example, FIG. 14 illustrates an exemplary case in which the second porous plate (P2) is composed of three porous plates (P2-1, P2-2, P2-3), but it should be noted that the number of porous plates is not limited and may be composed of two or four or more divided porous plates. For example, it should be noted that the second porous plate (P2) may have the shape described in FIG. 12a to FIG. 12c above.

[0110] At least one of the 2-1 perforated plate (P2-1), the 2-2 perforated plate (P2-2), and the 2-3 perforated plate (P2-3) may be connected to a lifting device (17) capable of raising the perforated plate. For example, in the case of an area within the case (11) that is located far from a plurality of inflow passages (13) (e.g., the central area of ​​the case (11)), there is a possibility that cooling may not be properly achieved compared to other areas (e.g., the edge area of ​​the case (11)). In this case, the processor (19) may control the lifting device (17) to adjust the height of the 2-2 perforated plate (P2-2) so that the 2-2 perforated plate (P2-2) located in the center of the case (11) moves away from the 1 perforated plate (P1). According to this operation, the flow rate of the refrigerant flowing into the area located far from the multiple inlet passages (13) within the case (11) is increased, thereby improving the uniformity of the temperature distribution within the case (11).

[0112] FIG. 15 is a flowchart illustrating a control method for a liquid immersion cooling type server system according to one embodiment.

[0113] Referring to FIG. 7 and FIG. 15, a processor (19) of a liquid immersion cooling server system (1) according to one embodiment can adjust the height of a porous plate (e.g., a first porous plate (P1) and / or a second porous plate (P2)) based on information regarding temperature distribution. A control method of a liquid immersion cooling server system (1) according to one embodiment may include an operation (81) of detecting the temperature at each location within a case (11) and an operation (82) of adjusting the height of the porous plate at each location.

[0114] In operation 81, a plurality of temperature sensors (15) can detect the temperature at different locations within the case (11). For example, the plurality of temperature sensors (15) may be installed at different locations when viewed in the height direction of the case (11). With such a configuration, the processor (19) can determine a dividing plate that overlaps the area with the highest temperature in the case (11) based on information received from the plurality of temperature sensors (15).

[0115] In operation 82, the processor (19) can control the distance between the first porous plate (P1) and the dividing plate that overlaps the area with the highest temperature in the case (11) among the plurality of dividing plates when viewed in the height direction of the case (11) to be greater than the distance between the remaining dividing plates among the plurality of dividing plates and the first porous plate (P1). According to such operation, the uniformity of the temperature distribution within the case (11) can be improved as described above in FIGS. 13 and 14. For example, operations 81 and 82 can be performed repeatedly until the temperature distribution is within a set deviation.

[0116] Meanwhile, a person skilled in the art will fully understand that the control method of the immersion cooling server system (1) according to the embodiments described in FIGS. 8, 9, 10, 11 and 15 may be performed independently, but some or all of the above-described embodiments may be used in combination with one another. For example, the distance of the dividing plate corresponding to the high temperature area within the case (11) may be adjusted, and at the same time, the flow rate of the refrigerant flowing into the inlet passage (13) closest to the area may be increased, and / or, the flow rate of the refrigerant discharged from the discharge passage (14) closest to the area may be increased.

[0118] FIG. 16a is a plan view showing a porous plate according to one embodiment.

[0119] Referring to FIG. 16a, a porous plate (P) according to one embodiment (e.g., the first porous plate (P1) and / or the second porous plate (P2) described above) may include a plurality of holes (H). For example, in the porous plate (P), the sum of the cross-sectional areas of the holes (H) per unit area in the first region (A1) located close to the area where the refrigerant is introduced may be smaller than the sum of the cross-sectional areas of the holes (H) per unit area in the second region (A2) located further from the area where the refrigerant is introduced than in the first region (A1). According to such a structure, the flow rate of the refrigerant introduced into the area far from the area where the refrigerant is introduced can be increased compared to the area close to the area where the refrigerant is introduced, thereby improving the uniformity of the temperature distribution within the case (11).

[0120] For example, the cross-sectional areas of at least some of the multiple holes (H) may differ from one another. For example, the cross-sectional area of ​​the first hole (H-1) located close to the area where the refrigerant flows in among the multiple holes (H) may be smaller than the cross-sectional area of ​​the third hole (H-3) located far from the area where the refrigerant flows in. For example, the cross-sectional area of ​​the second hole (H-2) located between the first hole (H-1) and the third hole (H-3) may be larger than the cross-sectional area of ​​the first hole (H-1) and smaller than the cross-sectional area of ​​the third hole (H-3). For example, if the first hole (H-1), the second hole (H-2), and the third hole (H-3) have a circular shape, the diameter (D1) of the first hole (H-1), the diameter (D2) of the second hole (H-2), and the diameter (D3) of the third hole (H-3) may be increased sequentially. Meanwhile, it should be noted that this is merely one example and the shape of the multiple holes (H) is not limited to a circular shape.

[0122] FIG. 16b is a plan view showing a perforated plate according to one embodiment.

[0123] Referring to FIG. 16b, a porous plate (P) according to one embodiment may include a plurality of holes (H). For example, in the porous plate (P), the sum of the cross-sectional areas of the holes (H) per unit area of ​​a first region (A1) located close to the area where the refrigerant is introduced may be smaller than the sum of the cross-sectional areas of the holes (H) per unit area of ​​a second region (A2) located further from the area where the refrigerant is introduced than the first region (A1).

[0124] For example, the spacing of at least some of the holes (H) among the plurality of holes (H) may differ from one another. For example, the spacing of the plurality of holes (H) located in the first region (A1) may be wider than the spacing of the plurality of holes (H) located in the second region (A2). Meanwhile, FIG. 16b illustrates an example where the shape of the plurality of holes (H) is identical, but it should be noted that the cross-sectional area of ​​the holes (H) formed in each region may differ, as explained in FIG. 16a.

[0126] FIG. 16c is a cross-sectional view showing a porous plate according to one embodiment.

[0127] Referring to FIG. 16c, a porous plate (P) according to one embodiment may include a plurality of holes (H). For example, at least a portion of the inner wall of the holes (H) may have a slanted shape. For example, the inner wall of the holes (H) may have a slanted shape toward an area located far from the area where the refrigerant is introduced. According to such a structure, the flow rate of the refrigerant introduced into the area far from the area where the refrigerant is introduced can be increased compared to the area close to the area where the refrigerant is introduced, thereby improving the uniformity of the temperature distribution within the case (11). For example, as illustrated, the degree to which the inner wall of the holes (H) is slanted toward the area far from the area where the refrigerant is introduced may be greater for the holes (H) located closer to the area where the refrigerant is introduced, but it should be noted that this is not necessarily limited to this.

[0129] The embodiments described above may be implemented as hardware components, software components, and / or combinations of hardware and software components. For example, the devices, methods, and components described in the embodiments may be implemented using a general-purpose computer or a special-purpose computer, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing unit may execute an operating system (OS) and software applications executed on said operating system. Additionally, the processing unit may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing unit may be described as being used as a single unit, but those skilled in the art will understand that the processing unit may include multiple processing elements and / or multiple types of processing elements. For example, the processing unit may include multiple processors or one processor and one controller. In addition, other processing configurations, such as parallel processors, are also possible.

[0130] Software may include computer programs, code, instructions, or a combination of one or more of these, and may configure a processing unit to operate as desired or instruct the processing unit independently or collectively. Software and / or data may be stored on any type of machine, component, physical device, virtual equipment, computer storage medium, or device so as to be interpreted by the processing unit or to provide instructions or data to the processing unit. Software may be distributed over networked computer systems and may be stored or executed in a distributed manner. Software and data may be stored on computer-readable recording media.

[0131] The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may store program instructions, data files, data structures, etc., either individually or in combination, and the program instructions recorded on the medium may be those specifically designed and configured for the embodiment or those known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes; optical recording media such as CD-ROMs and DVDs; magneto-optical media such as floptical disks; and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, and flash memory. Examples of program instructions include machine code, such as that generated by a compiler, as well as high-level language code that can be executed by a computer using an interpreter, etc.

[0132] The hardware device described above may be configured to operate as one or more software modules to perform the operation of the embodiment, and vice versa.

[0133] Although the embodiments have been described above with reference to the limited drawings, those skilled in the art can apply various technical modifications and variations based thereon. For example, suitable results may be achieved even if the described techniques are performed in a different order than described, and / or if the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

[0134] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims set forth below. Explanation of the symbols

[0136] 1: Immersion Cooling Server System 11: Case 111: Receiving body 112: Main body cover 113: Server Rack 12: Server Unit 121: Server body 122: Jijibu 123: Computing Unit 13: Inflow channel 14: Discharge passage 15: Temperature sensor 151: Inflow sensor 152: Discharge sensor 153: Server Sensor 16: Flow valve 161: Inlet valve 162: Discharge valve 17: Lifting device 18: Interface 19: System processor P1: 1st porous plate H1: 1st hole P2: Second porous plate H2: 2nd hole P2-1: Section 2-1 Perforated Plate P2-2: Section 2-2 Perforated Plate P2-3: 2-3 Perforated Plate

Claims

Claim 1 A liquid immersion cooling server system comprising: a case capable of accommodating a plurality of server units; an inlet passage guiding a refrigerant flowing into the case; a first porous plate disposed between the part of the case connected to the inlet passage and the plurality of server units, having a plurality of first holes formed therein; and a second porous plate located between the part of the case connected to the inlet passage and the first porous plate, having a plurality of second holes formed therein. Claim 2 delete Claim 3 A liquid immersion cooling type server system according to claim 1, wherein at least one of the plurality of second holes is arranged offset from at least one of the plurality of first holes based on the direction in which the first porous plate and the second porous plate are spaced apart. Claim 4 In claim 1, the second porous plate is a liquid immersion cooling type server system disposed below the first porous plate. Claim 5 A liquid immersion cooling server system according to claim 1, wherein the case comprises: a receiving body providing a space capable of accommodating a refrigerant for cooling the plurality of server units; and a server rack formed inside the receiving body and supporting the plurality of server units spaced apart from the first perforated plate. Claim 6 In claim 5, the server rack is formed lengthwise on the side wall of the receiving body in a direction parallel to the ground, and the plurality of server units are arranged spaced apart from each other along the length direction of the server rack, in a liquid immersion cooling type server system. Claim 7 In claim 6, each computing unit provided in the plurality of server units is positioned at a position biased toward the first perforated plate with respect to the center of the case, in a liquid immersion cooling type server system. Claim 8 A liquid immersion cooling server system comprising: a case capable of accommodating a plurality of server units; an inlet passage guiding a refrigerant flowing into the case; and a first porous plate disposed between the portion of the case connected to the inlet passage and the plurality of server units, and having a plurality of first holes formed therein, wherein the first porous plate is disposed at a position higher than the portion of the case connected to the inlet passage, and at least some of the plurality of first holes have a shape in which the cross-sectional area increases as it moves toward the plurality of server units. Claim 9 A liquid immersion cooling type server system according to claim 1, wherein the second porous plate is composed of a plurality of dividing plates, and the distance between at least one of the plurality of dividing plates and the first porous plate is different from the distance between the remaining of the plurality of dividing plates and the first porous plate. Claim 10 In claim 1, at least one of the first porous plate and the second porous plate is installed in a height-adjustable manner within the case, in a liquid immersion cooling type server system. Claim 11 A liquid immersion cooling server system comprising: a case capable of accommodating a plurality of server units; an inlet passage guiding a refrigerant flowing into the case; a first porous plate having a plurality of first holes and a second porous plate having a plurality of second holes, disposed between the portion of the case connected to the inlet passage and the plurality of server units; a lifting device capable of adjusting the height of the second porous plate within the case; and a processor capable of controlling the lifting device. Claim 12 In claim 11, the liquid immersion cooling method server system further includes an interface for receiving information regarding the viscosity of the refrigerant from a user or an external terminal, and the processor controls the lifting device such that if the viscosity of the refrigerant is higher than a set value, the distance between the first porous plate and the second porous plate becomes greater than a set distance, based on the information regarding the viscosity of the refrigerant received from the interface. Claim 13 In claim 11, the liquid immersion cooling method server system further comprises a plurality of temperature sensors capable of detecting information regarding the temperature distribution within the case, and the processor controls the lifting device based on the information regarding the temperature distribution so that the temperature distribution is within a set deviation. Claim 14 In claim 13, the second porous plate is composed of a plurality of divided plates, at least some of which are movable independently of the remainder, and the lifting device is capable of adjusting the height of at least some of the plurality of divided plates, in a liquid immersion cooling type server system. Claim 15 In claim 14, the processor controls, based on information regarding the temperature distribution, that the distance between the first porous plate and the portion of the plurality of portions that overlaps with the area of ​​the highest temperature in the case, relative to the height direction of the case, is greater than the distance between the remaining portion of the plurality of portions and the first porous plate, in a liquid immersion cooling server system. Claim 16 A liquid immersion cooling server system according to claim 1, wherein the plurality of first holes and the plurality of second holes do not overlap with each other based on the direction in which the first porous plate and the second porous plate are spaced apart. Claim 17 In claim 1, the first porous plate comprises an insulating material, in a liquid immersion cooling type server system. Claim 18 In claim 1, the inlet passage is provided in a plurality, and the plurality of inlet passages are spaced apart along the periphery of the case, and the liquid immersion cooling server system further comprises: a plurality of inlet valves each installed in the plurality of inlet passages to locally control the flow rate of refrigerant flowing into the case; a plurality of temperature sensors capable of detecting information regarding the temperature distribution within the case; and a processor that controls the plurality of inlet valves based on the information regarding the temperature distribution so that the temperature distribution is within a set deviation. Claim 19 A liquid immersion cooling server system comprising: a case capable of accommodating a plurality of server units; an inlet passage guiding a refrigerant flowing into the case; a first porous plate disposed between a portion of the case connected to the inlet passage and the plurality of server units, and having a plurality of first holes formed therein, wherein the sum of the cross-sectional areas of the plurality of first holes per unit area for a first region of the first porous plate located close to the inlet passage is smaller than the sum of the cross-sectional areas of the plurality of first holes per unit area for a second region of the first porous plate located further from the inlet passage than the first region. Claim 20 A liquid immersion cooling type server system according to claim 1, wherein at least some of the plurality of first holes include an inner wall having a shape inclined toward a direction away from the inlet passage. Claim 21 In claim 1, the first porous plate is positioned higher than the part of the case connected to the inflow passage, in a liquid immersion cooling type server system.

Images