Display module, display apparatus and method for manufacturing the same

Abstract

A display module including a plurality of pixels comprises: a first substrate; a plurality of micropixel packages arranged in two dimensions on the upper surface of the first substrate; and a plurality of voltage lines electrically connecting micropixel packages adjacent in a first direction; wherein each of the plurality of micropixel packages comprises: a second substrate; a plurality of inorganic light-emitting elements disposed on the upper surface of the second substrate; a micropixel controller disposed on the second substrate and controlling the plurality of inorganic light-emitting elements; and an internal connection line disposed on the second substrate and electrically connecting a voltage line electrically connected to one of the micropixel packages adjacent in a first direction and a voltage line electrically connected to another of the micropixel packages adjacent in a first direction.

Description

Technology Field

[0001] The present invention relates to a display module that implements an image using an inorganic light-emitting element, a display device, and a method for manufacturing the same. Background Technology

[0002] Display devices can be classified into self-emissive displays, where each pixel emits light on its own, and light-emitting displays, which require a separate light source.

[0003] Liquid Crystal Displays (LCDs) are representative light-emitting displays that require a backlight unit to supply light from the back of the display panel, a liquid crystal layer that acts as a switch to pass or block light, and a color filter to convert the supplied light into the desired color. Because of this, they are structurally complex and have limitations in achieving thin thicknesses.

[0004] On the other hand, self-emissive displays, in which each pixel is equipped with a light-emitting element to emit light independently, do not require components such as backlight units and liquid crystal layers, and can also omit color filters. This results in a structurally simple design that offers high design freedom. Furthermore, not only can a thin thickness be achieved, but excellent contrast ratio, brightness, and viewing angle can also be realized.

[0005] Among self-emissive displays, micro LED displays are flat-panel displays composed of multiple LEDs with a size of approximately 100 micrometers. Compared to LCDs that require a backlight, micro LED displays can provide excellent contrast, response time, and energy efficiency.

[0006] In addition, inorganic light-emitting diodes (Micro LEDs) are brighter, have superior luminous efficiency, and a longer lifespan than OLEDs, which require a separate encapsulation layer to protect organic materials. The problem to be solved

[0007] By forming a portion of the power wiring on a micropixel controller or micropixel package, the present invention provides a power wiring with improved resistance compared to the case where the power wiring is formed on a module substrate, and a method for manufacturing a display module, a display device, and a display module that minimizes IR drop. means of solving the problem

[0008] A display module including a plurality of pixels comprises: a first substrate; a plurality of micropixel packages arranged in two dimensions on the upper surface of the first substrate; and a plurality of voltage lines electrically connecting micropixel packages adjacent in a first direction; wherein each of the plurality of micropixel packages comprises: a second substrate; a plurality of inorganic light-emitting elements disposed on the upper surface of the second substrate; a micropixel controller disposed on the second substrate and controlling the plurality of inorganic light-emitting elements; and an internal connection line disposed on the second substrate and electrically connecting a voltage line electrically connected to one of the micropixel packages adjacent in a first direction and a voltage line electrically connected to another of the micropixel packages adjacent in a first direction.

[0009] Each of the above plurality of voltage wires can transmit voltage between the micropixel packages.

[0010] Each of the above plurality of micropixel packages receives a voltage through a voltage wiring electrically connected to one of the micropixel packages adjacent in the first direction, and can output the input voltage through the internal connection wiring to a voltage wiring electrically connected to another of the micropixel packages adjacent in the first direction.

[0011] The above internal connection wiring may have a higher electron mobility compared to the plurality of voltage wirings.

[0012] The plurality of micropixel packages above may include: a plurality of first micropixel packages that receive voltage from a power board and transmit voltage to an adjacent micropixel package in a first direction through voltage wiring; and a plurality of second micropixel packages that receive voltage from an adjacent micropixel package in a first direction.

[0013] The above internal connection wiring is electrically connected to the plurality of inorganic light-emitting elements and the micropixel controller, and can transmit a voltage input from any one of the micropixel packages adjacent in a first direction to each of the plurality of inorganic light-emitting elements and the micropixel controller.

[0014] The above internal connection wiring includes a first internal connection wiring through which a power supply voltage flows; and a second internal connection wiring through which a reference voltage flows; wherein the first internal connection wiring is electrically connected to the micropixel controller to transmit the power supply voltage, and the second internal connection wiring is electrically connected to the plurality of inorganic light-emitting elements to transmit the reference voltage.

[0015] Each of the above plurality of pixels is composed of two or more inorganic light-emitting elements among the above plurality of inorganic light-emitting elements, and the above plurality of inorganic light-emitting elements can constitute two or more pixels among the above plurality of pixels.

[0016] The micropixel controller comprises a third substrate; and at least one thin-film transistor disposed on the third substrate; and the at least one thin-film transistor can switch the plurality of inorganic light-emitting elements and supply a driving current to the plurality of inorganic light-emitting elements.

[0017] A display device according to one embodiment comprises: a plurality of display modules including a plurality of pixels arranged in two dimensions; and a frame supporting the plurality of display modules; wherein each of the plurality of display modules comprises: a first substrate; a plurality of micropixel packages arranged in two dimensions on the upper surface of the first substrate; and a plurality of voltage lines electrically connecting between micropixel packages adjacent in a first direction; and each of the plurality of micropixel packages comprises: a second substrate; a plurality of inorganic light-emitting elements disposed on the upper surface of the second substrate; a micropixel controller disposed on the second substrate and controlling the plurality of inorganic light-emitting elements; and an internal connection line disposed on the second substrate and electrically connecting a voltage line electrically connected to one of the micropixel packages adjacent in a first direction and a voltage line electrically connected to another of the micropixel packages adjacent in a first direction among the plurality of voltage lines.

[0018] Each of the above plurality of voltage wires can transmit voltage between the micropixel packages.

[0019] Each of the above plurality of micropixel packages receives a voltage through a voltage wiring electrically connected to one of the micropixel packages adjacent in the first direction, and can output the input voltage through the internal connection wiring to a voltage wiring electrically connected to another of the micropixel packages adjacent in the first direction.

[0020] The above internal connection wiring may have a higher electron mobility compared to the plurality of voltage wirings.

[0021] The plurality of micropixel packages above may include: a plurality of first micropixel packages that receive voltage from a power board and transmit voltage to an adjacent micropixel package in a first direction through voltage wiring; and a plurality of second micropixel packages that receive voltage from an adjacent micropixel package in a first direction.

[0022] The above internal connection wiring is electrically connected to the plurality of inorganic light-emitting elements and the micropixel controller, and can transmit a voltage input from any one of the micropixel packages adjacent in a first direction to each of the plurality of inorganic light-emitting elements and the micropixel controller.

[0023] The above internal connection wiring includes a first internal connection wiring through which a power supply voltage flows; and a second internal connection wiring through which a reference voltage flows; wherein the first internal connection wiring is electrically connected to the micropixel controller to transmit the power supply voltage, and the second internal connection wiring is electrically connected to the plurality of inorganic light-emitting elements to transmit the reference voltage.

[0024] Each of the above plurality of pixels is composed of two or more inorganic light-emitting elements among the above plurality of inorganic light-emitting elements, and the above plurality of inorganic light-emitting elements can constitute two or more pixels among the above plurality of pixels.

[0025] The micropixel controller comprises a third substrate; and at least one thin-film transistor disposed on the third substrate; and the at least one thin-film transistor can switch the plurality of inorganic light-emitting elements and supply a driving current to the plurality of inorganic light-emitting elements. Effects of the invention

[0026] According to a display module and display device of one embodiment, by forming a portion of the power wiring on a micropixel controller or micropixel package, a power wiring with improved resistance can be provided compared to the case where the power wiring is formed on a module substrate, and IR drop can be minimized. Brief explanation of the drawing

[0027] FIG. 1 is a perspective view showing an example of a display module according to one embodiment and a display device including the same. FIG. 2 is a diagram showing an example of a pixel array constituting a unit module of a display device according to one embodiment. FIG. 3 is a control block diagram of a display device according to one embodiment. FIG. 4 is a control block diagram showing the configuration of a display module included in a display device according to one embodiment. FIG. 5 is a control block diagram showing the configuration of a display panel included in a display module according to one embodiment. FIG. 6 is a diagram showing an example of a signal transmitted to a plurality of tiled display modules in a display device according to one embodiment. FIG. 7 is a diagram conceptually illustrating the method of driving each pixel in a display module according to one embodiment. FIG. 8 is a simplified circuit diagram illustrating a pixel circuit controlling a single subpixel in a display module according to one embodiment. FIGS. 9 and FIGS. 10 are diagrams illustrating the change in driving current according to power supply voltage or reference voltage in a pixel circuit according to one embodiment. FIG. 11 is a conceptual diagram illustrating the relationship between a micropixel controller and a pixel controlled by the micropixel controller in a display module according to one embodiment. FIG. 12 is a side cross-sectional view of a micropixel package included in a display module according to one embodiment. FIG. 13 is a drawing showing the top surface of a micropixel package included in a display module according to one embodiment. FIG. 14 is a side cross-sectional view of a module substrate on which a micropixel package is disposed in a display module according to one embodiment. FIG. 15 is a drawing showing the upper surface of a module substrate on which a micropixel package is placed, in a display module according to one embodiment. FIG. 16 is a diagram showing power wiring of a module substrate on which a micropixel package is placed, in a display module according to one embodiment. FIG. 17 is a side cross-sectional view of the power wiring of a module substrate on which a micropixel package is placed, in a display module according to one embodiment. FIGS. 18 and 19 are drawings showing power wiring in a single micropixel package in a side cross-section according to one embodiment of a display module. FIG. 20 is a diagram showing an example of an array of a micropixel controller and an inorganic light-emitting element constituting a display module according to one embodiment. FIG. 21 is a diagram showing power wiring of a module substrate on which a micropixel controller is placed in a display module according to one embodiment. FIG. 22 is a side cross-sectional view of the power wiring of a module substrate on which a micropixel controller is placed, in a display module according to one embodiment. FIG. 23 is a side cross-sectional view of power wiring in a micropixel controller in a display module according to one embodiment. FIG. 24 is a drawing showing an example of a method in which a plurality of display modules are coupled to a housing in a display device according to one embodiment. FIG. 25 is a flowchart of a method for manufacturing a display module according to one embodiment. FIGS. 26 to 31 are drawings showing a display module drawn by some steps shown in FIG. 25. Specific details for implementing the invention

[0028] The embodiments described in this specification and the configurations illustrated in the drawings are merely preferred examples of the disclosed invention, and various modifications that may replace the embodiments and drawings of this specification may exist at the time of filing this application.

[0029] Throughout this specification, when a part is described as being "connected" to another part, this includes not only cases where they are directly connected but also cases where they are indirectly connected, and indirect connection includes being connected via a wireless communication network.

[0030] Furthermore, the terms used in this specification are for describing embodiments and are not intended to limit or / or restrict the disclosed invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0031] Additionally, terms including ordinal numbers, such as "first," "second," etc., used in this specification may be used to describe various components, but said components are not limited by said terms, and said terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0032] In addition, terms such as "~part," "~unit," "~block," "~part," and "~module" may refer to a unit that processes at least one function or operation. For example, the above terms may refer to at least one piece of hardware such as an FPGA (field-programmable gate array) or ASIC (application specific integrated circuit), at least one piece of software stored in memory, or at least one process processed by a processor.

[0033] The symbols attached to each step are used to identify each step and do not indicate the order of the steps relative to one another; the steps may be performed differently from the specified order unless a specific order is clearly indicated in the context.

[0034] Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0035] FIG. 1 is a perspective view showing an example of a display module according to one embodiment and a display device including the same, and FIG. 2 is a drawing showing an example of a pixel array constituting a unit module of a display device according to one embodiment.

[0036] A display device (1) according to one embodiment is a self-emissive display device in which a light-emitting element is arranged for each pixel, so that each pixel can emit light on its own. Therefore, unlike a liquid crystal display device, it does not require components such as a backlight unit or a liquid crystal layer, so a thin thickness can be achieved, and various design changes are possible due to the simple structure.

[0037] In addition, the display device (1) according to one embodiment may employ an inorganic light-emitting element, such as an inorganic light-emitting diode, as a light-emitting element placed in each pixel. The inorganic light-emitting element has a faster response speed compared to an organic light-emitting element, such as an OLED (Organic Light-Emitting Diode), and can achieve high brightness with low power consumption.

[0038] In addition, unlike organic light-emitting diodes, which are vulnerable to exposure to moisture and oxygen, require an encapsulation process, and have poor durability, it does not require an encapsulation process and has strong durability. Hereinafter, the inorganic light-emitting diode mentioned in the embodiments described below refers to an inorganic light-emitting diode.

[0039] The inorganic light-emitting element employed in the display device (1) according to one embodiment may be a micro LED having a short side length of approximately 100 μm. In this way, by employing a micro LED, the pixel size can be reduced and high resolution can be achieved even within the same screen size.

[0040] In addition, manufacturing LED chips in micro-sized units can solve the problem of inorganic materials breaking when bent due to their characteristics. That is, if micro LED chips are transferred onto a flexible substrate, the LED chips do not break even if the substrate is bent, making it possible to realize flexible display devices.

[0041] A display device employing micro LEDs can be applied in various fields by utilizing ultra-small pixel size and thin thickness. For example, as shown in FIG. 1, a large-area screen can be realized by tiling a plurality of display modules (10) on which a plurality of micro LEDs are transferred and fixing them to a housing (20), and such a large-area screen display device can be used as signage, an electronic display board, etc.

[0042] Meanwhile, the three-dimensional coordinate system of the XYZ axes shown in FIG. 1 is based on the display device (1), and the plane where the screen of the display device (1) is located is the XZ plane, and the direction in which the image is output or the direction of light emission of the inorganic light-emitting element is the +Y direction. Since the coordinate system is based on the display device (1), the same coordinate system can be applied whether the display device (1) is lying down or standing up.

[0043] Generally, the display device (1) is used in an upright position, and the user views the image from the front of the display device (1), so the +Y direction in which the image is output can be called the front, and the opposite direction can be called the rear.

[0044] In addition, the display device (1) is generally manufactured in a lying position. Therefore, it is possible to refer to the -Y direction of the display device (1) as the lower direction and the +Y direction as the upper direction. That is, in the embodiment described below, the +Y direction may be referred to as the upper direction or the front, and the -Y direction may be referred to as the lower direction or the rear.

[0045] The remaining four sides, excluding the top and bottom surfaces of the flat-panel display device (1) or display module (10), are all referred to as sides regardless of the orientation of the display device (1) or display module (10).

[0046] In the example of FIG. 1, a case is illustrated in which a display device (1) includes a plurality of display modules to implement a large-area screen, but the embodiment of the display device (1) is not limited thereto. It is also possible for the display device (1) to include a single display module (10) to be implemented as a TV, a wearable device, a portable device, a PC monitor, etc.

[0047] Referring to FIG. 2, the display module (10) may have a two-dimensional pixel structure of an M x N (M, N is two or more integers) array. That is, the display module (10) may have a pixel array consisting of M rows and N columns. In other words, the display module (10) may include multiple pixels arranged in two dimensions. FIG. 2 conceptually illustrates a pixel array, and it is obvious that in addition to the active area where pixels are arranged in the display module (10), there may also be a bezel area where an image is not displayed or a wiring area.

[0048] In the embodiments thereof, the fact that certain components are arranged in two dimensions may include not only cases where the components are placed on the same plane, but also cases where they are placed on different planes parallel to each other. Additionally, when the components are placed on the same plane, the tops of the placed components must not necessarily be located on the same plane, and may include cases where the tops of the placed components are located on different planes parallel to each other.

[0049] A unit pixel (P) may consist of at least three subpixels that output light of different colors. For example, a unit pixel (P) may consist of three subpixels (SP(R), SP(G), SP(B)) corresponding to R, G, and B, respectively. Here, the red subpixel (SP(R)) may output red light, the green subpixel (SP(G)) may output green light, and the blue subpixel (SP(B)) may output blue light.

[0050] However, the pixel arrangement of FIG. 2 is merely an example that can be applied to a display module (10) and a display device (1) according to one embodiment, and it is possible for the subpixels to be arranged along the Z-axis direction, not arranged in a row, and for the sizes of the subpixels to be different. It is sufficient for a single pixel to include multiple subpixels to implement multiple colors, and there are no restrictions on the size or arrangement method of each subpixel.

[0051] In addition, a unit pixel (P) is not necessarily composed of a red subpixel (SP(R)) that outputs red light, a green subpixel (SP(G)) that outputs green light, and a blue subpixel (SP(B)) that outputs blue light; it is also possible to include subpixels that output yellow light or white light. In other words, there are no restrictions on the color or type of light output from each subpixel, or on the number of subpixels.

[0052] However, for the sake of specific explanation in the embodiments described below, the case in which a unit pixel (P) is composed of a red subpixel (SP(R)), a green subpixel (SP(G)), and a blue subpixel (SP(B)) will be described as an example.

[0053] As previously mentioned, the display module (10) and the display device (1) according to one embodiment are self-emissive display devices in which each pixel can emit light on its own. Accordingly, an inorganic light-emitting element emitting light of a different color may be disposed in each subpixel. For example, a red inorganic light-emitting element may be disposed in the red subpixel (SP(R)), a green inorganic light-emitting element may be disposed in the green subpixel (SP(G)), and a blue inorganic light-emitting element may be disposed in the blue subpixel (SP(B)).

[0054] Accordingly, in the present embodiment, the pixel (P) may represent a cluster including a red inorganic light-emitting element, a green inorganic light-emitting element, and a blue inorganic light-emitting element, and the subpixel may represent each inorganic light-emitting element.

[0055] FIG. 3 is a control block diagram of a display device (1) according to one embodiment.

[0056] Referring to FIG. 3, as previously described with reference to FIG. 1, a display device (1) according to one embodiment may include a plurality of display modules (10-1, 10-2, ..., 10-n, where n is two or more integers), a main control unit (300) and a timing control unit (500) that control the plurality of display modules (10), a communication unit (430) that communicates with an external device, a source input unit (440) that receives source images, a speaker (410) that outputs sound, and an input unit (420) that receives commands from a user to control the display device (1).

[0057] The input unit (420) may include a button or a touch pad provided in one area of ​​the display device (1), and if the display panel (11, see FIG. 4) is implemented as a touch screen, the input unit (420) may include a touch pad provided on the front of the display panel (11). Additionally, the input unit (420) may include a remote controller.

[0058] The input unit (420) can receive various commands from the user to control the display device (1), such as turning the power on / off, adjusting the volume, adjusting the channel, adjusting the screen, and changing various settings.

[0059] The speaker (410) may be provided in one area of ​​the housing (20), and it is also possible to provide a separate speaker module that is physically separated from the housing (20).

[0060] The communication unit (430) can communicate with a relay server or other electronic device to exchange necessary data. The communication unit (430) may adopt at least one of various wireless communication methods such as 3G (3rd Generation), 4G (4th Generation), Wireless LAN, Wi-Fi, Bluetooth, Zigbee, WFD (Wi-Fi Direct), UWB (Ultra wideband), Infrared Data Association (IrDA), BLE (Bluetooth Low Energy), NFC (Near Field Communication), and Z-Wave. In addition, it is also possible to adopt wired communication methods such as PCI (Peripheral Component Interconnect), PCI-express, and USB (Universe Serial Bus).

[0061] The source input unit (440) can receive a source signal input from a set-top box, USB, antenna, etc. Accordingly, the source input unit (440) may include at least one selected from a group of source input interfaces including an HDMI cable port, a USB port, an antenna, etc.

[0062] The source signal received by the source input unit (440) can be processed by the main control unit (300) and converted into a form that can be output to the display panel (11) and the speaker (410).

[0063] The main control unit (300) and the timing control unit (500) may include at least one memory for storing a program and various data for performing operations described later, and at least one processor for executing the stored program.

[0064] The main control unit (300) can process a source signal input through the source input unit (440) to generate an image signal corresponding to the input source signal.

[0065] For example, the main control unit (300) may include a source decoder, a scaler, an image enhancer, and a graphics processor. The source decoder can decode a source signal compressed in a format such as MPEG, and the scaler can output image data of a desired resolution through resolution conversion.

[0066] The image enhancer can improve the image quality of the image data by applying corrections of various techniques. The graphics processor can separate the pixels of the image data into RGB data and output them together with control signals, such as a syncing signal for display timing on the display panel (11). That is, the main control unit (300) can output image data and control signals corresponding to the source signal.

[0067] The operation of the main control unit (300) described above is merely an example applicable to the display device (1), and it is also possible to perform other operations or omit some of the operations described above.

[0068] The image data and control signal output from the main control unit (300) can be transmitted to the timing control unit (500).

[0069] The timing control unit (500) can convert the image data transmitted from the main control unit (300) into image data that can be processed by the driver IC (200, see FIG. 4) and generate various control signals, such as timing control signals, necessary to display the image data on the display panel (11).

[0070] Although the display device (1) according to one embodiment does not necessarily have to include a plurality of display modules (10), for the sake of specific explanation in the embodiments described below, a display device (1) including a plurality of display modules (10) will be described as an example.

[0071] FIG. 4 is a control block diagram showing the configuration of a display module (10) included in a display device (1) according to one embodiment, FIG. 5 is a control block diagram showing the configuration of a display panel (11) included in a display module (10) according to one embodiment, and FIG. 6 is a diagram showing an example of a signal transmitted to a plurality of tiled display modules (10) in a display device (1) according to one embodiment.

[0072] Referring to FIG. 4, each of the plurality of display modules (10-1, 10-2, ..., 10-n) may include a display panel (11) for displaying images and a driver IC (200) for driving the display panel (11).

[0073] The driver IC (200) can generate a driving signal so that the display panel (11) can display an image based on image data and a timing control signal transmitted from the timing control unit (500).

[0074] The driving signal generated by the driver IC (200) may include a gate signal and a data signal, and the generated driving signal is input to the display panel (11).

[0075] Referring to FIG. 5, the display panel (11) includes a plurality of micropixel packages (100-1, 100-2, ..., 100-q), and each of the plurality of micropixel packages (100-1, 100-2, ..., 100-q) includes an inorganic light-emitting element (120) and a micropixel controller (130). In this example, it is shown that three or more micropixel packages (100) are provided, but the embodiment of the display module (10) is not limited thereto. The micropixel packages (100) only need to be provided in a plurality (q is an integer greater than or equal to 2), and there is no limit to the number thereof.

[0076] The display panel (11) may include a plurality of pixels arranged in two dimensions as described above, and each pixel may be composed of a plurality of sub-pixels to implement various colors.

[0077] In addition, as previously mentioned, the display device (1) according to one embodiment is a self-emissive display device in which each pixel can emit light on its own. Accordingly, an inorganic light-emitting element (120) may be disposed in each subpixel. That is, each of the plurality of pixels may be composed of two or more inorganic light-emitting elements (120).

[0078] Each inorganic light-emitting element (120) can be driven by an AM (Active Matrix) method or a PM (Passive Matrix) method, but for the sake of specific explanation in the embodiments described below, the case where the inorganic light-emitting element (120) is driven by an AM method will be explained as an example.

[0079] In a display module (10) according to one embodiment, each inorganic light-emitting element (120) can be individually controlled by a micropixel controller (130), and the micropixel controller (130) can operate based on a driving signal output from a driver IC (200).

[0080] Micropixel packages (100) can be arranged in rows and columns on a module substrate of a display module (10). That is, the micropixel packages (100) can have a two-dimensional array consisting of multiple rows and multiple columns. At this time, each of the multiple micropixel packages (100) can be electrically connected to a micropixel package (100) placed in an adjacent row while being placed in the same column.

[0081] In the embodiments thereof, the arrangement of certain components in the same column may include not only cases where the components are arranged in columns that are numerically completely identical, but also cases where they are arranged in columns that are identical within a certain error range. Furthermore, in the embodiments thereof, the arrangement of certain components in the same row may likewise include not only cases where the components are arranged in rows that are numerically completely identical, but also cases where they are arranged in rows that are identical within a certain error range.

[0082] In other words, a plurality of micropixel packages (100) can be arranged in two dimensions on a module substrate (a first substrate described later) of a display module (10), and each of the plurality of micropixel packages (100) can be electrically connected to an adjacent micropixel controller in a first direction. The first direction may correspond, for example, to a column direction, i.e., the Z-axis direction.

[0083] Referring to FIG. 6, a plurality of display modules (10-1, 10-2, ..., 10-n) can be electrically connected to a driving board (501). For example, a display panel (11) can be connected to an FPCB through a film on which a driver IC (200) is mounted. The FPCB is connected to the driving board (501) to electrically connect the display modules (10) to the driving board (501).

[0084] A timing control unit (500) may be provided in the driving board (501). Accordingly, the driving board (501) may be referred to as a T-con board. A plurality of display modules (10-1, 10-2, ..., 10-n) may receive image data, timing control signals, etc. from the driving board (501).

[0085] Additionally, the display device (1) may further include a main board (301) and a power board (601). The main board (301) is provided with the aforementioned main control unit (300), and the power board (601) may be provided with a power circuit necessary to supply power to a plurality of display modules (10-1, 10-2, ..., 10-n).

[0086] The power board (601) can be electrically connected to a plurality of display modules (10-1, 10-2, ..., 10-n) through an FPCB, and the power voltage (V) to the plurality of display modules (10-1, 10-2, ..., 10-n) connected through the FPCB. DD ), reference voltage (V SSIt can supply ) etc.

[0087] For example, the power voltage (V) supplied from the power board (601) DD ) and reference voltage (V SS ) can be applied to a micropixel package (100) placed on a module substrate through the wiring of the module substrate. Specifically, a power voltage (V) supplied from a power board (601) DD ) and reference voltage (V SS ) can be applied to the micropixel packages (100) arranged in the first row.

[0088] At this time, the micropixel package (100) arranged in a row other than the first row can receive voltage from the micropixel package (100) of the previous row and can transmit the input voltage to the micropixel package (100) of the next row.

[0089] Specifically, each of the plurality of micropixel packages (100) can be electrically connected to the micropixel packages (100) of adjacent rows placed in the same column and via voltage wiring placed on the module substrate.

[0090] At this time, each of the plurality of micropixel packages (100) may include an internal connection wire that electrically connects a voltage wire electrically connected to the previous row of micropixel packages (100) and a voltage wire electrically connected to the next row of micropixel packages (100).

[0091] That is, the voltage (V) supplied from the power board (601). DD , V SS ) can be input to the micropixel package (100) through a voltage line provided on the module substrate and connected to the micropixel package (100) of the previous row, and output to the voltage line provided on the module substrate and connected to the micropixel package (100) of the next row through an internal connection line provided inside the micropixel package (100).

[0092] At this time, the internal connection wiring provided in the micropixel package (100) may have improved wiring resistance compared to the voltage wiring provided in the module substrate, thereby increasing electron mobility. Specifically, the difficulty of the process may be lower when mounting wiring in the micropixel package (100) compared to mounting wiring in the module substrate. Accordingly, the internal connection wiring provided in the micropixel package (100) may be mounted thicker than the voltage wiring provided in the module substrate, thereby increasing electron mobility.

[0093] In other words, each of the plurality of micropixel packages (100) can be electrically connected to a micropixel package (100) adjacent in a first direction through a voltage line provided on a module substrate, and may include an internal connection line that electrically connects a voltage line electrically connected to one of the micropixel packages (100) adjacent in the first direction and a voltage line electrically connected to another of the micropixel packages (100) adjacent in the first direction. Each of the plurality of micropixel packages (100) can transmit a voltage input from one of the micropixel packages (100) electrically connected through the internal connection line to another of the electrically connected micropixel packages (100).

[0094] Thus, the display module (10) of the present invention arranges voltage wiring that electrically connects between micropixel packages (100) on the module substrate and arranges internal connection wiring that electrically connects between voltage wiring inside the micropixel packages (100), thereby providing a portion of power wiring in the micropixel packages (100).

[0095] The display module (10) can reduce the rate at which voltage passes through the voltage wiring of a module substrate with low electron mobility through the internal connection wiring inside the micropixel package (100), and can minimize the IR drop of voltage compared to when voltage is supplied to the micropixel package (100) only through the voltage wiring in the module substrate.

[0096] Through this, the display module (10) enables multiple micropixel controllers (130) to be driven at the same voltage regardless of the distance from the power board (601), thereby preventing IR drop that may occur depending on the distance from the power board (601). Voltage transfer between micropixel packages (100) will be explained in detail later.

[0097] In the example described above, it was explained that multiple display modules (10-1, 10-2, ..., 10-P) share a driving board (501) and a power board (601), but it is also possible to have a separate driving board (501) and a power board (601) connected to each individual display module (10). Alternatively, it is possible to group multiple display modules (10-1, 10-2, ..., 10-P) and connect one driving board (501) and one power board (601) per group.

[0098] Since FIG. 6 is a drawing showing a display device (1) on an XY plane, only a one-dimensional arrangement of display modules (10-1, 10-2, ..., 10-n) is shown, but as explained above with reference to FIG. 1, it is of course possible for a plurality of display modules (10-1, 10-2, ..., 10-n) to be arranged in two dimensions.

[0099] FIG. 7 is a diagram conceptually illustrating the method of driving each pixel in a display module (10) according to one embodiment, FIG. 8 is a circuit diagram briefly illustrating a pixel circuit controlling a single sub-pixel in a display module (10) according to one embodiment, and FIG. 9 and FIG. 10 are diagrams illustrating the change in driving current according to a power supply voltage or reference voltage in a pixel circuit according to one embodiment.

[0100] Referring to FIG. 7, the driver IC (200) may include a scan driver (210) and a data driver (220). The scan driver (210) may output a gate signal for turning subpixels on / off, and the data driver (220) may output a data signal for implementing an image. However, depending on various design changes, it is also possible for the micropixel controller (130) to perform some of the operations of the driver IC (200). For example, the operation of the scan driver (210) may be performed by the micropixel controller (130), and in such cases, it is possible for the driver IC (200) not to include the scan driver (210). In the embodiment described below, for the sake of specific explanation, the case in which the driver IC (200) includes both the scan driver (210) and the data driver (220) will be described as an example.

[0101] The scan driver (210) can generate a gate signal based on a control signal transmitted from the timing control unit (500), and the data driver (220) can generate a data signal based on image data transmitted from the timing control unit (500).

[0102] The micropixel controller (130) may include a pixel circuit (131) for individually controlling each inorganic light-emitting element (120), and a gate signal output from a scan driver (210) and a data signal output from a data driver (220) may be input to the pixel circuit (131).

[0103] For example, the gate voltage (V) to the pixel circuit (131) GATE ), data voltage (V DATA ) and power supply voltage (V DD When ) is input, the pixel circuit (131) provides a driving current (C) for driving the inorganic light-emitting element (120). D Can output ).

[0104] Driving current (C) output from pixel circuit (131) D ) can be input to the inorganic light-emitting element (120), and the inorganic light-emitting element (120) has an input driving current (C D It can create an image by emitting light through ).

[0105] Meanwhile, as previously explained, according to the embodiment, each micropixel controller (130) may be electrically connected to the timing control unit (500) to receive a gate signal, and by processing the transmitted gate signal to control the pixel circuit (131), the driving current (C D It may also output ). In this case, the scan driver (210) may be omitted.

[0106] Referring to the example in FIG. 8, the pixel circuit (131) comprises thin-film transistors (TR1, TR2) and a capacitor (C) that switch or drive an inorganic light-emitting element (120). st It may include ). As described above, the inorganic light-emitting element (120) may be a micro LED.

[0107] For example, thin-film transistors (TR1, TR2) may include a switching transistor (TR1) and a driving transistor (TR2), and the switching transistor (TR1) and the driving transistor (TR2) may be implemented as PMOS type transistors. However, embodiments of the display module (10) and the display device (1) are not limited thereto, and it is also possible for the switching transistor (TR1) and the driving transistor (TR2) to be implemented as NMOS type transistors.

[0108] The gate electrode of the switching transistor (TR1) is connected to the scan driver (210), the source electrode is connected to the data driver (220), and the drain electrode is connected to the capacitor (C st It is connected to one end of ) and the gate electrode of the driving transistor (TR2). Capacitor (C st At the other end of ), the power supply voltage (V DD ) can be authorized.

[0109] In addition, the source electrode of the driving transistor (TR2) has a power supply voltage (V DD A voltage is supplied, and the drain electrode of the driving transistor (TR2) is connected to the anode of the inorganic light-emitting element (120). A reference voltage (V) is applied to the cathode of the inorganic light-emitting element (120). SS ) can be supplied. Reference voltage (V SS ) is the power supply voltage (V DD As a voltage level lower than ), ground voltage, etc., can be used to provide grounding.

[0110] The pixel circuit (131) of the above-described structure can operate as follows. First, the gate voltage (V) from the scan driver (210) GATE When ) is applied and the switching transistor (TR1) is turned on, the data voltage (V) applied from the data driver (220) DATA ) this capacitor (C st It can be delivered to one end of the and the gate electrode of the driving transistor (TR2).

[0111] Capacitor (C st The gate-source voltage (V) of the driven transistor (TR2) by ) GS A voltage corresponding to ) can be maintained for a certain period of time. The driving transistor (TR2) has a gate-source voltage (V GS Driving current (C) corresponding to ) D By applying ) to the anode of the inorganic light-emitting element (120), the inorganic light-emitting element (120) can be made to emit light.

[0112] At this time, a high data voltage (V) is applied to the gate electrode of the driving transistor (TR2). DATA When ) is transmitted, the gate-source voltage (V) of the driving transistor (TR2) GS As ) decreases, a small amount of driving current (C D ) is applied to the inorganic light-emitting element (120), so that the inorganic light-emitting element (120) can display a low gradation.

[0113] On the other hand, low data voltage (V DATA When ) is transmitted, the gate-source voltage (V) of the driving transistor (TR2) GS As ) increases, a large amount of driving current (C D ) is applied to the inorganic light-emitting element (120), and the inorganic light-emitting element (120) can display a high gradation.

[0114] However, the structure of the pixel circuit (131) described above is merely an example applicable to a display module (10) according to one embodiment, and various circuit structures for switching and driving a plurality of inorganic light-emitting elements (120) in addition to the example described above may be applied.

[0115] In addition, in this embodiment, there are no restrictions on the brightness control method of the inorganic light-emitting element (120). The brightness of the inorganic light-emitting element (120) can be controlled by one of various methods, such as a Pulse Amplitude Modulation (PAM) method, a Pulse Width Modulation (PWM) method, and a hybrid method combining the PAM and PWM methods.

[0116] At this time, as shown in FIG. 9, the power supply voltage (V) applied to the pixel circuit (131) of the micropixel controller (130) DD When ) changes, the gate-source voltage (V) of the driving transistor (TR2) GS The driving current (C) supplied to the inorganic light-emitting element (120) changes. D ) can change.

[0117] In addition, as shown in FIG. 10, the power supply voltage (V) applied to the pixel circuit (131) of the micropixel controller (130) DD ) or a reference voltage (V) applied to an inorganic light-emitting element (120) SS When ) changes, the drain-source voltage (V) of the driving transistor (TR2) DS The driving current (C) supplied to the inorganic light-emitting element (120) even in the saturation region changes. D ) can change.

[0118] Thus, the power supply voltage (V) applied to the micropixel controller (130) and the inorganic light-emitting element (120) DD ) and reference voltage (V SS When ) changes, the input data voltage (V DATA Driving current (C) corresponding to ) D ) may not be supplied to the inorganic light-emitting element (120) and thus the required brightness may not be provided, and accordingly, mura-effects or color change may occur.

[0119] If the micropixel controller (130) and the inorganic light-emitting element (120) are each electrically connected to the power board (601) and the power voltage (V DD ) and reference voltage (V SS If ) is supplied, the supplied power voltage (V) depending on the difference in wiring length DD ) and reference voltage (V SS The size of ) can change.

[0120] For example, the further a micropixel controller (130) is from the power board (601), the longer the wiring may be, and the power voltage (V) supplied due to the IR drop caused by the self-resistance of the wiring DD The size of ) can be reduced. Accordingly, as the difference in distance from the power board (601) increases, the brightness of the pixel controlled by the micropixel controller (130) can be reduced.

[0121] Accordingly, the display device (1) of the present invention has a power supply voltage (V) supplied to each of a plurality of micropixel controllers (130) disposed in a display module (10). DD ) and reference voltage (V SS In order to minimize the IR drop of ), a portion of the power wiring can be formed in the micropixel package (100) or micropixel controller (130).

[0122] Below, we will explain in more detail how to form a portion of the power wiring in the micropixel package (100) or micropixel controller (130).

[0123] FIG. 11 is a conceptual diagram illustrating the relationship between a micropixel controller (130) and a pixel controlled by the micropixel controller (130) in a display module (10) according to one embodiment.

[0124] Referring to FIG. 11, a single micropixel controller (130) can control four pixels (P1, P2, P3, P4). Controlling pixels may mean controlling a plurality of inorganic light-emitting elements (120) that constitute the pixels.

[0125] To this end, a plurality of pixel circuits (131) for controlling inorganic light-emitting elements (120) constituting four pixels (P1, P2, P3, P4) may be provided on the micro substrate (132) of the micro pixel controller (130). In the embodiment described below, the micro substrate (132) is to be referred to as a third substrate (132) to distinguish it from the module substrate (13, see FIG. 14) and the package substrate (110, see FIG. 12).

[0126] At this time, the pixel circuit (131) switches a plurality of inorganic light-emitting elements (120) constituting the pixel, and a driving current (C) to the plurality of inorganic light-emitting elements (120) constituting the pixel. D It may include at least one thin-film transistor that supplies ).

[0127] In other words, the micropixel controller (130) is disposed on the third substrate (132) and switches a plurality of inorganic light-emitting elements (120) constituting two or more pixels, and a driving current (C) to the plurality of inorganic light-emitting elements (120) constituting two or more pixels. D It may include at least one thin-film transistor that supplies ).

[0128] However, there is no limit to the number of pixels that can be controlled by a single micropixel controller (130), and for convenience of explanation, it is described below as if a single micropixel controller (130) controls four pixels (P1, P2, P3, P4). For example, a single micropixel controller (130) can control pixels arranged in a 2xn array or an nx2 array (where n is an integer greater than or equal to 1), and below, the case where a single micropixel controller (130) controls four pixels (P1, P2, P3, P4) arranged in a 2x2 array is described as an example.

[0129] It is possible to provide pixel circuits (131) as many times as the number of inorganic light-emitting elements (120) controlled by the micropixel controller (130), and it is also possible to implement one pixel circuit (131) to control two or more inorganic light-emitting elements (120).

[0130] The third substrate (132) can be implemented as one of various materials such as a silicon substrate, a glass substrate, a plastic substrate, a PCB, an FPCB, or a cavity substrate. Since the micropixel controller (130) does not have a heat source such as an inorganic light-emitting element, the type of substrate can be selected without limitation based on the heat resistance of the material.

[0131] The thin-film transistor formed on the third substrate (132) may be an LTPS (Low Temperature Polycrystalline Silicon) thin-film transistor or an oxide thin-film transistor. Additionally, it is possible for the thin-film transistor to be an a-Si thin-film transistor or a single-crystal thin-film transistor. However, for the sake of specific explanation, the case where the thin-film transistor is an LTPS thin-film transistor is used as an example in this embodiment.

[0132] As described above, the third substrate (132) can be implemented as a silicon substrate. Since silicon substrates have no limitations on electron mobility compared to glass substrates, if the third substrate (132) is implemented as a silicon substrate, the performance of the LTPS thin-film transistor can be improved.

[0133] Meanwhile, according to an embodiment of the display module (10), circuit inspection can be performed individually for each micropixel controller (130), and it is possible to mount only the micropixel controllers (130) that are determined to be good by the circuit inspection onto the display module (10). Therefore, compared to the case where a thin-film transistor circuit is mounted directly on the module substrate (the first substrate described later), circuit inspection and replacement of defective products are easy.

[0134] FIG. 12 is a side cross-sectional view of a micropixel package (100) included in a display module (10) according to one embodiment, FIG. 13 is a top cross-sectional view of a micropixel package (100) included in a display module (10) according to one embodiment, FIG. 14 is a side cross-sectional view of a module substrate on which a micropixel package (100) is placed in a display module (10) according to one embodiment, FIG. 15 is a top cross-sectional view of a module substrate on which a micropixel package (100) is placed in a display module (10) according to one embodiment.

[0135] Referring to FIG. 12, a single micropixel package (100) may be provided with a plurality of inorganic light-emitting elements (120) and at least one micropixel controller (130).

[0136] Specifically, a plurality of inorganic light-emitting elements (120) may be disposed on the upper surface of the package substrate (110) of a single micropixel package (100), and at least one micropixel controller (130) may be disposed on the package substrate (110). In the embodiments described below, the package substrate (110) is referred to as the second substrate (110) to distinguish it from other substrates.

[0137] In the embodiments of the display module (10) and the display device (1), there is no limit on the number of micropixel controllers (130) included in a single micropixel package (100). For example, assuming a case where one micropixel controller (130) controls four pixels, as shown in the examples of FIGS. 12 and 13, a single micropixel package (100) may be provided with four pixels and one micropixel controller (130) to control them, or eight pixels and two micropixel controllers (130) to control them, or twelve pixels and three micropixel controllers (130) to control them, or sixteen pixels and four micropixel controllers (130) to control them. For convenience of explanation, the following description will explain, as an example, that a single micropixel package (100) is provided with four pixels and one micropixel controller (130) to control them.

[0138] A plurality of inorganic light-emitting elements (120) and at least one micropixel controller (130) can be electrically connected to a second substrate (110).

[0139] The second substrate (110) can be implemented as one of various materials such as a silicon substrate, a glass substrate, a plastic substrate, a PCB, an FPCB, or a cavity substrate. Although there are no restrictions on the type of the second substrate (110), for the purpose of specific explanation in the embodiments described below, the case where the second substrate (110) is implemented as a glass substrate is used as an example.

[0140] In the present embodiment, the inorganic light-emitting element (120) may have a flip-chip structure in which a pair of electrodes are placed on opposite sides of the light-emitting surface of the diode.

[0141] A pair of electrodes may include an anode and a cathode. For example, the anode and the cathode may be provided at each end in the longitudinal direction (vertical direction) of the inorganic light-emitting element (120).

[0142] The inorganic light-emitting element (120) is positioned so that its light-emitting surface faces upward (+Y direction), and an electrode provided on the opposite side of the light-emitting surface can be electrically connected to an upper electrode pad provided on the upper surface of the second substrate (110).

[0143] In the embodiments thereof, the electrical connection of two components includes not only cases where electrically conductive materials are directly soldered, but also cases where they are connected via separate wiring or where a conductive adhesive is used. As long as current flows between the two connected components, there are no restrictions on the specific method of connection.

[0144] For example, when soldering two components, Au-In junctions, Au-Sn junctions, Cu pillar / SnAg bump junctions, Ni pillar / SnAg bump junctions, SnAgCu, SnBi, SnAg solder ball junctions, etc., can be used.

[0145] In addition, when using a conductive adhesive, a conductive adhesive such as an anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) can be placed between two components and pressure can be applied to allow current to flow in the direction of the applied pressure.

[0146] As previously explained, a pixel circuit (131) for switching and driving an inorganic light-emitting element (120) can be provided on a separate third substrate (132) rather than the second substrate (110) to form a micropixel controller (130).

[0147] A connection pin for electrical connection with the second substrate (110) may be provided on the third substrate (132), and the connection pin may be electrically connected to an electrode pad provided on the second substrate (110).

[0148] According to an embodiment of the display module (10), since circuit elements such as thin-film transistors for switching and driving a plurality of inorganic light-emitting elements (120) are provided on a separate micropixel controller (130) rather than on the second substrate (110), it is not necessary to form circuit elements such as thin-film transistors in addition to electrode pads or wiring on the second substrate (110). Therefore, the second substrate (110) can be implemented as a glass substrate with excellent durability against heat generation of the inorganic light-emitting elements (120), and even if the second substrate (110) is implemented as a glass substrate, it does not affect the performance of the thin-film transistors.

[0149] In addition, damage to circuit elements can be prevented during the cutting and wiring formation process of the second substrate (110) or the module substrate (the first substrate described later) or during the replacement process of the inorganic light-emitting element (120), and the difficulty of the manufacturing process of the display module (10) can be reduced.

[0150] In addition, according to an embodiment of the display module (10), since circuit elements such as thin-film transistors for switching and driving a plurality of inorganic light-emitting elements (120) are provided on a separate micropixel controller (130) rather than on the module substrate (the first substrate described later), the number of metal wires required to mount the circuit elements on the module substrate can be reduced, and thereby, IR drop caused by interference between the plurality of metal wires can be resolved. In other words, the display module (10) of the present invention can reduce wiring on the module substrate compared to the case where circuit elements are mounted directly on the module substrate, thereby resolving IR drop caused by interference between the wires.

[0151] Referring to FIG. 13, the micropixel controller (130) may be positioned on the upper surface of the second substrate (110) and positioned in the center of the space between the pixels (P1, P2, P3, P4) to be controlled. In this case, the micropixel controller (130) may be electrically connected to the anode of each pixel (P) to be controlled through an anode wire and may be electrically connected to the cathode of each pixel (P) to be controlled through a cathode wire.

[0152] However, according to the embodiment, the micropixel controller (130) may not be placed in the center of the space between the pixels (P1, P2, P3, P4), and may be placed without limitation as long as it is placed in a position that can be electrically connected to the pixels (P) to be controlled. For example, the micropixel controller (130) may be placed at a position corresponding to the pixel area of ​​the four pixels (P1, P2, P3, P4) that it controls. In the present embodiment, the pixel area is the area where each pixel is located, and when the active area of ​​the display panel (11) is divided into an array (MxN) identical to the array of pixels, the area containing each pixel may be defined as the pixel area of ​​the corresponding pixel. As a more specific example, the micropixel controller (130) may be placed in a single area that combines the pixel areas of the four pixels (P1, P2, P3, P4) that it controls, that is, the entire pixel area (PW). The micropixel controller (130) may be placed at a position corresponding to the center of the entire pixel area (PW).

[0153] Furthermore, according to the embodiment, the micropixel controller (130) may be placed on the lower surface rather than the upper surface of the second substrate (110), and in this case, the micropixel controller (130) may be electrically connected to the pixels (P) to be controlled through via hole wiring. Hereinafter, for convenience of explanation, the case where the micropixel controller (130) is placed on the upper surface of the first substrate (110) will be described as an example.

[0154] At this time, the spacing between adjacent pixels among the plurality of pixels included in the display module (10) may all be the same. In this embodiment, the fact that certain values ​​are the same may include not only cases where the values ​​match perfectly, but also cases where they match within a certain error range.

[0155] That is, the pixel spacing (PP) between pixels (P1, P2, P3, P4) that are controlled by a single micropixel controller (130) may be the same. Specifically, as illustrated in FIG. 13, the pixel spacing (PP) between adjacent pixels among the pixels (P1, P2, P3, P4) placed in a single micropixel package (100) may be the same. For example, among the pixels (P1, P2, P3, P4) placed on the upper surface of the second substrate (110), the spacing between the first pixel (P1) and the second pixel (P2) may be the same as the spacing between the first pixel (P1) and the fourth pixel (P4).

[0156] The micropixel package (100) can be placed on the upper surface of the module substrate (13) as shown in FIGS. 14 and 15. In the embodiments described below, the module substrate will be referred to as the first substrate.

[0157] The first substrate (13) can be implemented as one of various materials such as a silicon substrate, a glass substrate, a plastic substrate, a PCB, an FPCB, or a cavity substrate. Since an inorganic light-emitting element (120) or a thin-film transistor circuit is not directly mounted on the first substrate (13), the type of the first substrate (13) can be selected considering the ease and efficiency of the manufacturing process and the cost.

[0158] As described above, since a plurality of inorganic light-emitting elements (120) are disposed on the upper surface of the second substrate (110) of the micropixel package (100), the micropixel package (100) can be arranged such that the lower surface of the second substrate (110) faces the first substrate (13) and the upper surface faces the upward direction (+Y direction).

[0159] Additionally, the micropixel packages (100) can be arranged considering the entire pixel array and pixel pitch of the display module (10). For example, if the display module (10) has a pixel array of an M*N matrix and an inorganic light-emitting element (120) is arranged in a pixel array of an m*n matrix in the micropixel packages (100), then M / m (A) micropixel packages (100) can be arranged along the column direction, i.e., the Z-axis direction, and N / n (B) micropixel packages (100) can be arranged along the row direction, i.e., the X-axis direction.

[0160] That is, a plurality of micropixel packages (100) can be arranged in two dimensions on a first substrate (13), A micropixel packages (100) can be arranged along a first direction (column direction), i.e., the Z-axis direction, and B micropixel packages (100) can be arranged along a second direction (row direction), i.e., the X-axis direction.

[0161] In other words, the micropixel packages (100) can be arranged in a plurality of rows and a plurality of columns on the upper surface of the first substrate (13), and the display module (10) can include a plurality of micropixel packages (100) of an AXB (where A and B are two or more integers) array.

[0162] As previously explained, within the micropixel package (100), the pixel spacing (PP) between adjacent pixels in all directions (up, down, left, and right) relative to a single pixel can be maintained equally. This pixel spacing (PP) can also be maintained equally at the display module (10) level.

[0163] As illustrated in FIGS. 14 and 15, the arrangement and spacing of the micropixel packages (100) can be determined so that even when two adjacent pixels (P) are placed in different micropixel packages (100), the pixel spacing (PP') between the two pixels can be maintained the same as the pixel spacing (PP) within a single micropixel package (100).

[0164] The pixel spacing (PP) may be referred to as pixel pitch, and in the present embodiment, the pixel spacing (PP) is defined as the distance from the center of one pixel to the center of an adjacent pixel. However, since the embodiment of the display module (10) is not limited thereto, other definitions for the pixel spacing (PP) may also be applied.

[0165] In the above description, the arrangement relationship between the micropixel package (100), on which the inorganic light-emitting element (120) and the micropixel controller (130) are placed, and the first substrate (13) has been described. Below, a more detailed description will be provided regarding the placement of a portion of the power wiring in the micropixel package (100) to minimize IR drop.

[0166] FIG. 16 is a diagram showing power wiring of a module substrate (13) on which a micropixel package (100) is placed in a display module (10) according to one embodiment, FIG. 17 is a diagram showing power wiring of a module substrate (13) on which a micropixel package (100) is placed in a side cross-sectional view in a display module (10) according to one embodiment, FIG. 18 and FIG. 19 are diagrams showing power wiring in a single micropixel package (100) in a display module (10) according to one embodiment in a side cross-sectional view.

[0167] If the micropixel controller (130) and the inorganic light-emitting element (120) are each electrically connected to the power board (601) and the power voltage (V DD ) and reference voltage (V SS If ) is supplied, the supplied power voltage (V) depending on the difference in wiring length DD ) and reference voltage (V SS The size of ) can change.

[0168] For example, the further a micropixel controller (130) is from the power board (601), the longer the wiring may be, and the power voltage (V) supplied due to the IR drop caused by the self-resistance of the wiring DD The size of ) can be reduced. Accordingly, as the difference in distance from the power board (601) increases, the brightness of the pixel controlled by the micropixel controller (130) can be reduced.

[0169] Accordingly, the display device (1) of the present invention has a power supply voltage (V) supplied to each of a plurality of micropixel controllers (130) disposed in a display module (10). DD ) and reference voltage (V SS In order to minimize the IR drop of ), a portion of the power wiring can be formed in the micropixel package (100).

[0170] Referring to FIGS. 16 and 17, a plurality of micropixel packages (100) may be arranged on a first substrate (13) in a plurality of rows and a plurality of columns as previously described. That is, the display module (10) may include a plurality of micropixel packages (100) arranged in a two-dimensional manner in A rows and B columns.

[0171] Each of the plurality of micropixel packages (100) has a power supply voltage (V DD ) and reference voltage (V SS It can receive ) as input, and the power supply voltage (V DD ) is supplied to the micropixel controller (130), and the reference voltage (V SS ) can be supplied to an inorganic light-emitting element (120).

[0172] Specifically, the power voltage (V) supplied from the power board (601) DD ) and reference voltage (V SS ) can be applied to a micropixel package (100) placed on the first substrate (13) through voltage wiring (15, 17) of the first substrate (13).

[0173] Power voltage (V) supplied from the power board (601) DD ) and reference voltage (V SS ) can be applied to the micropixel package (100a) arranged in the first row (1600).

[0174] At this time, the micropixel packages (100b) arranged in rows (1650) other than the first row (1600) receive a voltage (V) from the micropixel packages (100) of the previous row. DD , V SS It can receive ) as input, and the input voltage (V DD , V SS ) can be passed to the next row of micropixel packages (100).

[0175] That is, a plurality of micropixel packages (100) are arranged in a first row (1600) and receive a voltage (V) from a power board (601). DD , VSS A plurality of first micropixel packages (100a) receiving ) and arranged in a row (1650) other than the first row (1600) and a voltage (V) from the micropixel packages (100) of the previous row DD , V SS It may include a plurality of second micropixel packages (100b) that receive input.

[0176] In other words, a plurality of micropixel packages (100) receive a voltage (V) from a power board (601). DD , V SS ) is received as input, and a voltage (V) is applied to an adjacent micropixel package (100) in the first direction. DD , V SS It may include a plurality of first micropixel packages (100a) that transmit a voltage, and a plurality of second micropixel packages (100b) that receive a voltage from an adjacent micropixel package (100) in a first direction.

[0177] FIGS. 16 and 17 illustrate that the row located at the top of the first substrate (110) is the first row (1600) connected to the power board (601), but this is merely one embodiment, and depending on the embodiment, the row located at the bottom or the row located at the side may correspond to the first row (1600), and there is no limitation on the position of the first row (1600). For convenience of explanation, the first row (1600) will be described below as an example corresponding to the row located at the top.

[0178] In other words, a plurality of micropixel packages (100) can be arranged in two dimensions on a first substrate (13) of a display module (10), and each of the plurality of micropixel packages (100) can be electrically connected to an adjacent micropixel controller in a first direction. The first direction may correspond, for example, to a column direction, i.e., the Z-axis direction.

[0179] Each of the plurality of micropixel packages (100) can be electrically connected to the micropixel packages (100) of adjacent rows and the first substrate (13) through voltage wiring (15, 17).

[0180] At this time, each of the plurality of micropixel packages (100) may include an internal connection wire (105, 107) that electrically connects a voltage wire (15, 17) electrically connected to the previous row of micropixel packages (100) and a voltage wire (15, 17) electrically connected to the next row of micropixel packages (100). In this way, the internal connection wire (105, 107) may electrically connect a voltage wire (15, 17) electrically connected to one of the micropixel packages (100) adjacent in the first direction among the plurality of voltage wires and a voltage wire (15, 17) electrically connected to another of the micropixel packages (100) adjacent in the first direction.

[0181] That is, voltage (V DD , V SS The ) can be input to the micropixel package (100) through voltage wiring (15, 17) provided on the first substrate (13) and connected to the micropixel package (100) of the previous row, and output to the voltage wiring (15, 17) provided on the first substrate (13) and connected to the micropixel package (100) of the next row through internal connection wiring (105, 107) provided inside the micropixel package (100).

[0182] In other words, each of the plurality of micropixel packages (100) has a voltage (V) through voltage wiring (15, 17) connected to the micropixel package (100) of the previous row. DD , V SS Receives ) as input, and the input voltage (V DD , V SS) can be output to a voltage line (15, 17) connected to the next row of micropixel packages (100) through internal connection lines (105, 107). That is, each of the plurality of micropixel packages (100) can output a voltage (V) through a voltage line (15, 17) connected to any one of the micropixel packages (100) adjacent in the first direction. DD , V SS Receives ) as input, and the input voltage (V DD , V SS ) can be output to a voltage wire (15, 17) connected to another one of the adjacent micropixel packages (100) in the first direction through an internal connection wire (105, 107).

[0183] The display module (10) may include a plurality of voltage wires (15, 17) that are arranged in each column of a plurality of micropixel packages (100), electrically connect the micropixel packages (100) arranged in adjacent rows, and transmit voltage between the micropixel packages (100).

[0184] Multiple voltage wirings (15, 17) are power supply voltages (V DD Multiple power voltage wiring (15) for ) and a reference voltage (V SS It may include a plurality of reference voltage wirings (17) for ).

[0185] Each of the plurality of power voltage wires (15) electrically connects two micropixel packages (100) arranged in adjacent rows while being arranged in the same column, and power voltage (V) between the two micropixel packages (100). DD Can convey ).

[0186] Each of the plurality of reference voltage wires (17) electrically connects two micropixel packages (100) arranged in adjacent rows while being arranged in the same column, and the reference voltage (V) between the two micropixel packages (100) ssCan convey ).

[0187] A plurality of voltage wires (15, 17) may be placed on a first substrate (13) corresponding to a module substrate and may be electrically connected to a micropixel package (100) placed on the upper surface of the first substrate (13).

[0188] Each of the plurality of micropixel packages (100) can be placed on the first substrate (13) and electrically connected to voltage wiring (15, 17).

[0189] Specifically, the internal connection wiring (105, 107) of each of the plurality of micropixel packages (100) can be electrically connected to the voltage wiring (15, 17) which is electrically connected to the micropixel package (100) placed in the previous row while being placed in the same column. Additionally, the internal connection wiring (105, 107) of each of the plurality of micropixel packages (100) can be electrically connected to the voltage wiring (15, 17) which is electrically connected to the micropixel package (100) placed in the next row while being placed in the same column.

[0190] Through this, the internal connection wiring (105, 107) can electrically connect the voltage wiring (15, 17) connected to the previous row of micropixel packages (100) and the voltage wiring connected to the next row of micropixel packages (100).

[0191] The internal connection wiring (105, 107) is the power supply voltage (V DD A first internal connection wiring (105) through which ) flows, and a reference voltage (V SS It may include a second internal connection wiring (107) through which ) flows.

[0192] Consequently, each of the plurality of micropixel packages (100) is placed in the same column as shown in FIG. 18 and is connected to the micropixel package (100) placed in the previous row through a power voltage wiring (15a) that provides a power voltage (V DDReceives ) as input, and the input power voltage (V DD ) can be output to the power voltage wiring (15b) connected to the next row of micropixel packages (100) through the first internal connection wiring (105).

[0193] At this time, the micropixel controller (130) is electrically connected to the first internal connection wiring (105) through the voltage supply wiring (1005), so that the power supply voltage (V DD ) can be supplied. That is, the first internal connection wiring (105) is electrically connected to the micropixel controller (130) and can receive the power supply voltage (V DD Can convey ).

[0194] Additionally, each of the plurality of micropixel packages (100) is arranged in the same column as shown in FIG. 19 and is connected to the micropixel package (100) arranged in the previous row through a reference voltage wiring (17a) to a reference voltage (V ss Receives ) as input, and the input reference voltage (V ss ) can be output to a reference voltage wire (17b) connected to the next row of micropixel packages (100) through the second internal connection wire (107).

[0195] At this time, each of the plurality of inorganic light-emitting elements (120) is electrically connected to the second internal connection wiring (107) through the voltage supply wiring (1007), so as to the reference voltage (V ss ) can be supplied. That is, the second internal connecting wiring (107) is electrically connected to a plurality of inorganic light-emitting elements (120) and can receive a reference voltage (V ss Can convey ).

[0196] The internal connection wiring (105, 107) provided in the micropixel package (100) may have improved wiring resistance compared to the voltage wiring (15, 17) provided in the module substrate (13), thereby allowing for higher electron mobility. Specifically, the difficulty of the process may be lower when mounting wiring in the micropixel package (100) compared to mounting wiring in the module substrate. Accordingly, the internal connection wiring (105, 107) provided in the micropixel package (100) may be mounted thicker than the voltage wiring (15, 17) provided in the module substrate (13), as shown in FIGS. 18 and 19, so that electron mobility may be higher.

[0197] Thus, the display module (10) of the present invention arranges voltage wiring (15, 17) that electrically connects between micropixel packages (100) on the module substrate, and arranges internal connection wiring (105, 107) that electrically connects between the voltage wiring (15, 17) inside the micropixel package (100), thereby providing a portion of the power wiring in the micropixel package (100).

[0198] The display module (10) can reduce the rate at which voltage passes through the voltage wiring (15, 17) of the module substrate (13) with low electron mobility through the internal connection wiring (105, 107) inside the micropixel package (100), and voltage (V) to the micropixel package (100) through only the voltage wiring (15, 17) in the module substrate (13). DD , V SS Compared to when supplying ), the IR drop of the voltage can be minimized.

[0199] Through this, the display module (10) enables a plurality of micropixel controllers (130) to be driven at the same voltage regardless of the distance from the power board (601), thereby preventing IR drop that may occur depending on the distance from the power board (601). As IR drop is minimized, the micropixel controllers (130) control the inorganic light-emitting element (120) at a constant voltage, thereby enabling the intended driving current (C D ) can be provided to the inorganic light-emitting element (120) to provide the intended brightness, thereby resolving brightness degradation and mura effects.

[0200] In addition, the display module (10) of the present invention allows the output voltage of a micropixel package (100) to be transmitted to the next row of micropixel packages (100), thereby shortening the voltage wiring (15, 17) compared to when each micropixel package (100) is electrically connected to the power board (601), so that IR drop can be minimized.

[0201] In the above, a detailed description was provided regarding placing a portion of the power wiring in the micropixel package (100) to minimize IR drop. Below, a detailed description will be provided regarding placing a portion of the power wiring in the micropixel controller (130) to minimize IR drop.

[0202] FIG. 20 is a diagram showing an example of an arrangement of a micropixel controller (130) and an inorganic light-emitting element (120) constituting a display module (10) according to one embodiment.

[0203] Referring to FIG. 20, a display module (10) according to one embodiment does not include a micropixel package (100) as previously described, and may include a micropixel controller (130) and an inorganic light-emitting element (120) placed directly on a first substrate (13).

[0204] A pixel (P) composed of a plurality of inorganic light-emitting elements (120) can be arranged in rows and columns on a first substrate (13) corresponding to the module substrate of the display module (10). That is, the pixel (P) can be arranged on the upper surface of the first substrate (13) in a two-dimensional array consisting of M rows and N columns.

[0205] At this time, the micropixel controller (130) can also be arranged in multiple rows and columns on the first substrate (13). That is, the micropixel controller (130) can be arranged on the first substrate (110) in a two-dimensional array consisting of A rows and B columns.

[0206] In other words, a plurality of micropixel controllers (130) can be arranged in two dimensions on a first substrate (13) of a display module (10), and each of the plurality of micropixel controllers (130) can be electrically connected to an adjacent micropixel controller in a first direction. The first direction may correspond, for example, to a column direction, i.e., the Z-axis direction.

[0207] For example, the micropixel controller (130) may be positioned on the upper surface of the first substrate (110), as shown in FIG. 20, and may be positioned in the center of the space between the pixels (P1, P2, P3, P4) to be controlled. In this case, the micropixel controller (130) may be electrically connected to the anode of each pixel (P) to be controlled through anode wiring and may be electrically connected to the cathode of each pixel (P) to be controlled through cathode wiring.

[0208] However, according to the embodiment, the micropixel controller (130) may not be placed in the center of the space between the pixels (P1, P2, P3, P4), and may be placed without limitation as long as it is arranged in rows and columns and can be electrically connected to the pixels (P) to be controlled. For example, the micropixel controller (130) may be placed at a position corresponding to the pixel area of ​​the four pixels (P1, P2, P3, P4) that it controls. In the present embodiment, the pixel area is the area where each pixel is located, and when the active area of ​​the display panel (11) is divided into an array (MxN) identical to the array of pixels, the area containing each pixel can be defined as the pixel area of ​​the corresponding pixel. As a more specific example, the micropixel controller (130) may be placed in a single area that combines the pixel areas of the four pixels (P1, P2, P3, P4) that it controls, that is, the entire pixel area (PW). The micropixel controller (130) can be placed at a position corresponding to the center of the entire pixel area (PW).

[0209] Furthermore, depending on the embodiment, the micropixel controller (130) may be placed on the lower surface rather than the upper surface of the first substrate (13), in which case the micropixel controller (130) may be electrically connected to the pixels (P) to be controlled through via hole wiring. For convenience of explanation, the micropixel controller (130) being placed on the upper surface of the first substrate (13) will be described as an example.

[0210] At this time, the spacing between adjacent pixels among the plurality of pixels included in the display panel (11) may all be the same. In the present embodiment, the fact that certain values ​​are the same may include not only cases where the values ​​match perfectly, but also cases where they match within a certain error range.

[0211] FIG. 21 is a diagram showing power wiring of a module substrate (13) on which a micropixel controller (130) is placed in a display module (10) according to one embodiment, FIG. 22 is a diagram showing power wiring of a module substrate (13) on which a micropixel controller (130) is placed in a side cross-sectional view in a display module (10) according to one embodiment, and FIG. 23 is a diagram showing power wiring of one micropixel controller (130) in a display module (10) according to one embodiment in a side cross-sectional view.

[0212] FIGS. 21 and 22 show that a plurality of micropixel controllers (130) can be arranged on a first substrate (13) in a plurality of rows and a plurality of columns as previously described. That is, the display module (10) may include a plurality of micropixel controllers (130) arranged in a two-dimensional manner in A rows and B columns.

[0213] That is, a plurality of micropixel controllers (130) can be arranged in two dimensions on a first substrate (13), A micropixel controllers (130) can be arranged along a first direction (column direction), i.e., the Z-axis direction, and B micropixel controllers (130) can be arranged along a second direction (row direction), i.e., the X-axis direction.

[0214] Each of the plurality of micropixel controllers (130) has a power supply voltage (V DD ) and reference voltage (V SS It can receive ) as input, and the power supply voltage (V DD ) is supplied to the pixel circuit (131), and the reference voltage (V) is supplied to the pixel circuit (131). SS ) can be supplied to an inorganic light-emitting element (120).

[0215] Specifically, the power voltage (V) supplied from the power board (601) DD ) and reference voltage (V SS) can be applied to a micropixel controller (130) placed on the first substrate (13) through the voltage wiring (15, 17) of the first substrate (13).

[0216] Power voltage (V) supplied from the power board (601) DD ) and reference voltage (V SS ) can be applied to the micropixel controller (130a) arranged in the first row (2100).

[0217] At this time, the micropixel controller (130b) arranged in a row (2150) other than the first row (2100) receives a voltage (V) from the micropixel controller (130) of the previous row. DD , V SS It can receive ) as input, and the input voltage (V DD , V SS ) can be passed to the next row's micropixel controller (130).

[0218] That is, a plurality of micropixel controllers (130) are arranged in a first row (2100) and receive a voltage (V) from a power board (601). DD , V SS A plurality of first micropixel controllers (130a) receiving ) and arranged in a row (2150) other than the first row (2100) and receiving a voltage (V) from the micropixel controller (130) of the previous row DD , V SS It may include a plurality of second micropixel controllers (130b) that receive input.

[0219] In other words, a plurality of micropixel controllers (130) receive a voltage (V) from the power board (601). DD , V SS ) receives input, and voltage (V) is applied to the adjacent micropixel controller (130) in the first direction. DD , V SSIt may include a plurality of first micropixel controllers (130a) that transmit a voltage, and a plurality of second micropixel controllers (130b) that receive a voltage from an adjacent micropixel controller (130) in a first direction.

[0220] FIGS. 21 and 22 illustrate that the row located at the top of the first substrate (110) is the first row (2100) connected to the power board (601), but this is merely one embodiment, and depending on the embodiment, the row located at the bottom or the row located at the side may correspond to the first row (2100), and there is no limitation on the position of the first row (2100). For convenience of explanation, the first row (2100) will be described below as an example corresponding to the row located at the top.

[0221] Each of the plurality of micropixel controllers (130) can be electrically connected to the micropixel controllers (130) of adjacent rows and the first substrate (13) through voltage wiring (15, 17).

[0222] In other words, a plurality of micropixel controllers (130) can be arranged in two dimensions on a first substrate (13) of a display module (10), and each of the plurality of micropixel controllers (130) can be electrically connected to an adjacent micropixel controller in a first direction. The first direction may correspond, for example, to a column direction, i.e., the Z-axis direction.

[0223] At this time, each of the plurality of micropixel controllers (130) may include an internal connection wire (105, 107) that electrically connects a voltage wire (15, 17) electrically connected to the previous row of micropixel controllers (130) and a voltage wire (15, 17) electrically connected to the next row of micropixel controllers (130).

[0224] That is, voltage (VDD , V SS ) can be input to the micropixel controller (130) through voltage wiring (15, 17) provided on the first substrate (13) and connected to the micropixel controller (130) of the previous row, and output to the voltage wiring (15, 17) provided on the first substrate (13) and connected to the micropixel controller (130) of the next row through internal connection wiring (105, 107) provided inside the micropixel controller (130).

[0225] In other words, each of the plurality of micropixel controllers (130) has a voltage (V) through a voltage wiring (15, 17) connected to the micropixel controller (130) of the previous row. DD , V SS Receives ) as input, and the input voltage (V DD , V SS ) can be output to the voltage wiring (15, 17) connected to the next row's micropixel controller (130) through the internal connection wiring (105, 107).

[0226] Each of the plurality of micropixel controllers (130) may be electrically connected to a micropixel controller (130) adjacent in a first direction through a voltage wiring provided on a first substrate (13), and may include an internal connection wiring that electrically connects a voltage wiring electrically connected to one of the micropixel controllers (130) adjacent in the first direction and a voltage wiring electrically connected to another of the micropixel controllers (130) adjacent in the first direction. Each of the plurality of micropixel controllers (130) may transmit a voltage input from one of the micropixel controllers (130) electrically connected through the internal connection wiring to another of the electrically connected micropixel controllers (130).

[0227] The display module (10) may include a plurality of voltage wires (15, 17) that are arranged in each column of a plurality of micropixel controllers (130), electrically connect the micropixel controllers (130) arranged in adjacent rows, and transmit voltage between the micropixel controllers (130).

[0228] Multiple voltage wirings (15, 17) are power supply voltages (V DD Multiple power voltage wiring (15) for ) and a reference voltage (V SS It may include a plurality of reference voltage wirings (17) for ).

[0229] Each of the plurality of power voltage wires (15) electrically connects two micropixel controllers (130) arranged in adjacent rows while being arranged in the same column, and power voltage (V) between the two micropixel controllers (130). DD Can convey ).

[0230] Each of the plurality of reference voltage wires (17) electrically connects two micropixel controllers (130) arranged in adjacent rows while being arranged in the same column, and the reference voltage (V) between the two micropixel controllers (130) ss Can convey ).

[0231] A plurality of voltage wires (15, 17) may be placed on a first substrate (13) corresponding to a module substrate and may be electrically connected to a micropixel controller (130) placed on the upper surface of the first substrate (13).

[0232] Each of the plurality of micropixel controllers (130) can be placed on the first substrate (13) and electrically connected to the voltage wiring (15, 17).

[0233] Specifically, the internal connection wiring (105, 107) of each of the plurality of micropixel controllers (130) can be electrically connected to a voltage wiring (15, 17) that is electrically connected to a micropixel controller (130) placed in the previous row while being placed in the same column. Additionally, the internal connection wiring (105, 107) of each of the plurality of micropixel controllers (130) can be electrically connected to a voltage wiring (15, 17) that is electrically connected to a micropixel controller (130) placed in the next row while being placed in the same column. In this way, the internal connection wiring (105, 107) can electrically connect a voltage wiring (15, 17) that is electrically connected to one of the micropixel controllers (130) adjacent in the first direction among the plurality of voltage wirings, and a voltage wiring (15, 17) that is electrically connected to another of the micropixel controllers (130) adjacent in the first direction.

[0234] Through this, the internal connection wiring (105, 107) can electrically connect the voltage wiring (15, 17) connected to the previous row of micropixel controllers (130) and the voltage wiring connected to the next row of micropixel controllers (130).

[0235] The internal connection wiring (105, 107) is the power supply voltage (V DD A first internal connection wiring (105) through which ) flows, and a reference voltage (V SS It may include a second internal connection wiring (107) through which ) flows.

[0236] That is, each of the plurality of micropixel controllers (130) has a voltage (V) through a voltage wiring (15, 17) connected to any one of the micropixel controllers (130) adjacent in the first direction. DD , V SS Receives ) as input, and the input voltage (V DD , V SS) can be output to a voltage wire (15, 17) connected to another of the adjacent micropixel controllers (130) in the first direction through an internal connection wire (105, 107).

[0237] Consequently, each of the plurality of micropixel controllers (130) is connected to the microcontroller (130) in the previous row through a power voltage wiring (15a) that is connected to the power voltage (V) and is placed in the same column as shown in FIG. 23. DD Receives ) as input, and the input power voltage (V DD ) can be output to the power voltage wiring (15b) connected to the next row of the micropixel controller (130) through the first internal connection wiring (105).

[0238] Additionally, each of the plurality of micropixel controllers (130) is arranged in the same column as shown in FIG. 23 and is connected to the micropixel controller (130) in the previous row through a reference voltage wiring (17a) that is connected to the reference voltage (V ss Receives ) as input, and the input reference voltage (V ss ) can be output to the reference voltage wiring (17b) connected to the next row's micropixel controller (130) through the second internal connection wiring (107).

[0239] At this time, the first internal connection wiring (105) is electrically connected to a pixel circuit (at least one thin-film transistor) (131) and supplies a power voltage (V) to the pixel circuit (131). DD ) can be supplied. In addition, the second internal connecting wire (107) is electrically connected to the cathode wire to supply a reference voltage (V) to the cathode of the inorganic light-emitting element (120). SS Can supply ).

[0240] The internal connection wiring (105, 107) provided in the micropixel controller (130) may have improved wiring resistance compared to the voltage wiring (15, 17) provided in the module substrate (13), thereby allowing for higher electron mobility. Specifically, the difficulty of the process may be lower when mounting wiring in the micropixel controller (130) compared to mounting wiring in the module substrate. Accordingly, the internal connection wiring (105, 107) provided in the micropixel controller (130) may be mounted thicker than the voltage wiring (15, 17) provided in the module substrate (13), as shown in FIG. 23, so that electron mobility may be higher.

[0241] Thus, the display module (10) of the present invention arranges voltage wiring (15, 17) that electrically connects between micropixel controllers (130) on the module substrate, and arranges internal connection wiring (105, 107) that electrically connects between the voltage wiring (15, 17) inside the micropixel controller (130), thereby providing a portion of the power wiring in the micropixel controller (130).

[0242] The display module (10) can reduce the rate at which voltage passes through the voltage wiring (15, 17) of the module substrate (13) with low electron mobility through the internal connection wiring (105, 107) inside the micropixel controller (130), and voltage (V) to the micropixel controller (130) through only the voltage wiring (15, 17) in the module substrate (13). DD , V SS Compared to when supplying ), the IR drop of the voltage can be minimized.

[0243] Through this, the display module (10) enables a plurality of micropixel controllers (130) to be driven at the same voltage regardless of the distance from the power board (601), thereby preventing IR drop that may occur depending on the distance from the power board (601). As IR drop is minimized, the micropixel controllers (130) control the inorganic light-emitting element (120) at a constant voltage, thereby enabling the intended driving current (C D ) can be provided to the inorganic light-emitting element (120) to provide the intended brightness, thereby resolving brightness degradation and mura effects.

[0244] In addition, the display module (10) of the present invention allows the output voltage of the micropixel controller (130) to be transmitted to the next row of micropixel controllers (130), thereby shortening the voltage wiring (15, 17) compared to when each micropixel controller (130) is electrically connected to the power board (601), so that IR drop can be minimized.

[0245] FIG. 24 is a drawing showing an example of a method in which a plurality of display modules (10) are coupled to a housing in a display device (1) according to one embodiment.

[0246] As described above, a plurality of display modules (10) can be arranged in a two-dimensional matrix form and fixed to a housing (20). Referring to the example in FIG. 24, a plurality of display modules (10) can be installed on a frame (21) located below them, and the frame (21) may have a two-dimensional mesh structure in which some areas corresponding to the plurality of display modules (10) are open.

[0247] Specifically, the frame (21) may have openings (21H) equal to the number of display modules (10), and the openings (21H) may have the same arrangement as the plurality of display modules (10).

[0248] Meanwhile, a plurality of display modules (10) may be mounted on the frame (21) by using magnetic force from a magnet, by being joined by a mechanical structure, or by being bonded by an adhesive. There are no restrictions on the method by which the display modules (10) are mounted on the frame (21).

[0249] The driving board (501), main board (301), and power board (601) can be placed at the bottom of the frame (21) and can be electrically connected to each of the multiple display modules (10) through an opening (21H) formed in the frame (21).

[0250] A lower cover (22) is attached to the lower part of the frame (21), and the lower cover (22) can form the lower surface of the display device (1).

[0251] In the example above, the case where the display module (10) is arranged in two dimensions was given as an example, but it is also possible for the display module (10) to be arranged in one dimension, and in this case, the structure of the frame (21) can also be transformed into a one-dimensional mesh structure.

[0252] Thus, the display device (1) of the present invention can realize a large-area screen by tiling a plurality of display modules (10) and fixing them to a housing (20). Through this, the display device (1) of the present invention, compared to when applying a plate for realizing a large-area screen, has a power supply voltage (V DD ) and reference voltage (V SS The power voltage wiring (15) and reference voltage wiring (17) for transmitting the power can be designed to be short, so that the IR drop occurring in proportion to the wiring length can be minimized.

[0253] FIG. 25 is a flowchart of a method for manufacturing a display module (10) according to one embodiment, and FIG. 26 to 31 are drawings showing a display module (10) that is drawn by some steps shown in FIG. 25.

[0254] Referring to FIG. 25, internal connection wiring (105, 107) is formed on the package substrate (2510).

[0255] The package substrate refers to the second substrate (110) described above, and the internal connection wiring (105, 107) can be formed inside the second substrate (110). For example, the internal connection wiring (105, 107) can be formed on the second substrate (110) by forming a layer of a metal material such as copper on the second substrate (110), and by undergoing a photolithography process including the coating, exposure, and development of a photosensitive material, and an etching process that selectively removes unnecessary parts. However, depending on the embodiment, the internal connection wiring (105, 107) can be formed on the upper surface, lower surface, or side surface of the second substrate (110).

[0256] At this time, the internal connecting wiring (105, 107) is the power supply voltage (V DD A first internal connection wiring (105) through which ) flows, and a reference voltage (V SS It may include a second internal connection wiring (107) through which ) flows.

[0257] FIG. 26 is a drawing showing the side of a second substrate (110) on which internal connecting wiring (105, 107) is formed.

[0258] As illustrated in FIG. 26, the power supply voltage (V) to the second substrate (110) by the aforementioned process DD The first internal connection wiring (105) for ) and the reference voltage (V SS A second internal connection wiring (107) for ) can be formed.

[0259] Although not shown in FIG. 26, an electrode pad may be formed on the second substrate (110) to which an inorganic light-emitting element (120) and a micropixel controller (130) can be electrically connected.

[0260] Referring again to FIG. 25, an inorganic light-emitting element (120) and a micropixel controller (130) can be placed on a package substrate having internal connection wiring formed thereon.

[0261] As described above, the inorganic light-emitting element (120) may be a micro LED. A micro LED on a wafer or temporary substrate may be picked up and transferred by a transfer mechanism and then transferred onto a second substrate (110). At this time, the inorganic light-emitting element (120) may be transferred such that its anode and cathode face the upper surface of the second substrate (110). Any known transfer method may be adopted, such as a method using a laser, a method using a stamp, or a method using a roller.

[0262] Additionally, depending on the connection method between the inorganic light-emitting element (120) and the electrode pad, a soldering material or a conductive adhesive may be placed or applied on the electrode pad formed on the upper surface of the second substrate (110).

[0263] An electrode pad to which a micropixel controller (130) can be electrically connected may be formed on the upper surface of the second substrate (110) corresponding to the package substrate. At this time, the micropixel controller (130) may be placed on the electrode pad and electrically connected to the second substrate (110).

[0264] The micropixel controller (130) is formed with a pixel circuit (131) for controlling an inorganic light-emitting element (120) on the second substrate (110), and the description regarding its structure and operation is the same as that described in the embodiment of the display module (10) above.

[0265] Meanwhile, prior to mounting the micropixel controller (130) on the second substrate (110), circuit inspection can be performed individually, and only the micropixel controllers (130) determined to be good by the circuit inspection can be mounted on the second substrate (110). Therefore, compared to the case where the thin-film transistor circuit is mounted directly on the module substrate, circuit inspection and replacement of defective products are easier.

[0266] FIG. 27 is a drawing showing the side of a second substrate (110) on which an inorganic light-emitting element (120) and a micropixel controller (130) are transferred. By transferring the inorganic light-emitting element (120) and the micropixel controller (130) onto the upper surface of the second substrate (110) on which a soldering material or a conductive adhesive is placed or applied, the anode and cathode of the inorganic light-emitting element (120) and the connection pins of the micropixel controller (130) can be electrically connected to the electrode pads of the second substrate (110).

[0267] Meanwhile, before the inorganic light-emitting element (120) and the micropixel controller (130) are placed on the second substrate (110), a voltage supply wiring (1005) electrically connecting the first internal connection wiring (105) and the micropixel controller (130), and a voltage supply wiring (1007) electrically connecting the second internal connection wiring (107) and the inorganic light-emitting element (120) may be formed on the second substrate (110).

[0268] Referring again to FIG. 25, wiring and electrode pads are formed on the module substrate (2530).

[0269] The module substrate refers to the first substrate (13) described above, and wiring and electrode pads can be formed on both the upper and lower surfaces of the first substrate (13). For example, wiring and electrode pads can be formed on the first substrate (13) by forming a layer of a metal material such as copper on the upper surface of the first substrate (13), and by undergoing a photolithography process including the coating, exposure, and development of a photosensitive material, and an etching process that selectively removes unnecessary parts.

[0270] A plurality of voltage lines (15, 17) may be formed on the upper surface of the first substrate (13). Specifically, the plurality of voltage lines (15, 17) may be formed between package electrode pads (19) arranged in a plurality of rows and columns to electrically connect the micropixel packages (100) arranged in a plurality of rows and columns.

[0271] For example, as shown in FIG. 28, each of the plurality of voltage lines (15, 17) may be formed between two adjacent package electrode pads (19) while being arranged in the same row. At this time, the plurality of voltage lines (15, 17) are a power supply voltage (V DD Multiple power voltage wiring (15) for ) and a reference voltage (V SS It may include a plurality of reference voltage wirings (17) for ).

[0272] Referring again to FIG. 25, a micropixel package can be placed on the upper surface of a module substrate (2540).

[0273] On the upper surface of the first substrate (13) corresponding to the module substrate, package electrode pads (19) to which a micropixel package (100) can be electrically connected may be arranged in a plurality of rows and a plurality of columns.

[0274] At this time, the micropixel package (100) can be placed on the package electrode pad (19) and electrically connected to the first substrate (13). In other words, the micropixel package (100) can be placed on the first substrate (13) by electrically connecting the lower electrode pad provided on the micropixel package (100) and the package electrode pad (19) formed on the upper surface of the first substrate (13). For example, the lower electrode pad and the package electrode pad (19) can be electrically connected by soldering or a conductive adhesive.

[0275] FIG. 29 is a drawing showing the upper surface of a first substrate (13) on which a micropixel package (100) is placed. As shown in FIG. 29, a plurality of micropixel packages (100) may be arranged on the upper surface of the first substrate (13) in a two-dimensional array including a plurality of rows and a plurality of columns.

[0276] That is, a plurality of micropixel packages (100) can be arranged in two dimensions on a first substrate (13), A micropixel packages (100) can be arranged along a first direction (column direction), i.e., the Z-axis direction, and B micropixel packages (100) can be arranged along a second direction (row direction), i.e., the X-axis direction.

[0277] In other words, a plurality of micropixel packages (100) can be arranged in two dimensions on a module substrate (a first substrate described later) of a display module (10), and each of the plurality of micropixel packages (100) can be electrically connected to an adjacent micropixel controller in a first direction. The first direction may correspond, for example, to a column direction, i.e., the Z-axis direction.

[0278] At this time, the internal connection wiring (105, 107) of each of the plurality of micropixel packages (100) can be electrically connected to the voltage wiring (15, 17) electrically connected to the previous row of micropixel packages (100) and the voltage wiring (15, 17) electrically connected to the next row of micropixel packages (100).

[0279] Through this, the internal connection wiring (105, 107) can electrically connect the voltage wiring (15, 17) connected to the previous row of micropixel packages (100) and the voltage wiring connected to the next row of micropixel packages (100).

[0280] The internal connection wiring (105, 107) is the power supply voltage (V DD A first internal connection wiring (105) through which ) flows, and a reference voltage (V SS It may include a second internal connection wiring (107) through which ) flows.

[0281] In other words, each of the plurality of micropixel packages (100) can be electrically connected to a micropixel package (100) adjacent in a first direction through a voltage line provided on a module substrate, and may include an internal connection line that electrically connects a voltage line electrically connected to one of the micropixel packages (100) adjacent in the first direction and a voltage line electrically connected to another of the micropixel packages (100) adjacent in the first direction. Each of the plurality of micropixel packages (100) can transmit a voltage input from one of the micropixel packages (100) electrically connected through the internal connection line to another of the electrically connected micropixel packages (100).

[0282] Consequently, each of the plurality of micropixel packages (100) is placed in the same column and has a power voltage (V) through a power voltage wiring (15a) connected to the micropixel package (100) placed in the previous row. DDReceives ) as input, and the input power voltage (V DD ) can be output to the power voltage wiring (15b) connected to the next row of micropixel packages (100) through the first internal connection wiring (105).

[0283] At this time, the micropixel controller (130) is electrically connected to the first internal connection wiring (105) through the voltage supply wiring (1005), so that the power supply voltage (V DD ) can be supplied. That is, the first internal connection wiring (105) is electrically connected to the micropixel controller (130) and can receive the power supply voltage (V DD Can convey ).

[0284] Additionally, each of the plurality of micropixel packages (100) is arranged in the same column and is connected to the micropixel package (100) arranged in the previous row through a reference voltage wiring (17a) to a reference voltage (V ss Receives ) as input, and the input reference voltage (V ss ) can be output to a reference voltage wire (17b) connected to the next row of micropixel packages (100) through the second internal connection wire (107).

[0285] At this time, each of the plurality of inorganic light-emitting elements (120) is electrically connected to the second internal connection wiring (107) through the voltage supply wiring (1007), so as to the reference voltage (V ss ) can be supplied. That is, the second internal connecting wiring (107) is electrically connected to a plurality of inorganic light-emitting elements (120) and can receive a reference voltage (V ss Can convey ).

[0286] Referring again to FIG. 25, a driver IC (200) is connected to the module substrate (2550).

[0287] The driver IC (200) can be connected to the first substrate (110) by employing one of various bonding methods such as COF (Chip on Film) or FOG (Film on Glass) bonding, COG (Chip on Glass) bonding, or TAB (Tape Automated Bonding).

[0288] FIG. 30 is a cross-sectional view of a first substrate (13) to which a driver IC (200) is connected. For example, when COF bonding is adopted, as shown in FIG. 30, a driver IC (200) is mounted on a film (201), and one end of the film (201) on which the driver IC (200) is mounted can be electrically connected to the first substrate (13).

[0289] For example, one end of a film (201) on which a driver IC (200) is mounted can be electrically connected to a lower wiring pad (14) provided on the lower surface of a first substrate (13), and the lower electrode pad (14) electrically connected to the film (201) on which the driver IC (200) is mounted can be connected to an upper wiring on which a micropixel package (100) is placed through bi-hole wiring or side wiring. The micropixel package (100) can receive a gate signal and a data signal from the driver IC (200) through the upper wiring.

[0290] Referring again to FIG. 25, an FPCB is connected to a module substrate (2560).

[0291] FIG. 31 is a side cross-sectional view of a first substrate (13) to which an FPCB (205) is connected. As in the example described above, when COF bonding is adopted, the other end of the film (201) on which the driver IC (200) is mounted can be electrically connected to the FPCB (205), as shown in FIG. 31.

[0292] An FPCB (205) connected to a film (201) on which a driver IC (200) is mounted is electrically connected to a driving board (501) and can transmit timing control signals, image data, etc. output from the driving board (501) to the driver IC (200).

[0293] Additionally, the first substrate (13) may also be connected to an FPCB for receiving power, and the FPCB for power supply is electrically connected to a power board (601) to provide a power voltage (V DD ) or reference voltage (V SS ) can be supplied to a micropixel controller (130) or an inorganic light-emitting element (120). The power board (601) can be electrically connected to the first substrate (110) via an FPCB and electrically connected to the first row (1600) of micropixel packages (100) arranged on the first substrate (13) via wiring, thereby supplying a power voltage (V DD ) and reference voltage (V SS Can supply ).

[0294] Meanwhile, the manufacturing method of the display module (10) according to one embodiment may include not only all of the aforementioned processes but also only some of the processes. Alternatively, it may include additional processes.

[0295] Additionally, a method for manufacturing a display module (10) according to one embodiment may omit manufacturing a micropixel package (100) and may include placing a portion of the power wiring in a micropixel controller (130).

[0296] Specifically, according to an embodiment, a method for manufacturing a display module (10) may include forming internal connection wiring (15, 17) in a micropixel controller (130), forming voltage wiring (15, 17) in a module substrate (13), placing an inorganic light-emitting element (120) and a micropixel controller (130) in the module substrate (13), connecting a driver IC (200), and connecting an FPCB (205).

[0297] Meanwhile, the disclosed embodiments may be implemented in the form of a recording medium that stores instructions executable by a computer. The instructions may be stored in the form of program code and, when executed by a processor, may generate a program module to perform the operation of the disclosed embodiments. The recording medium may be implemented as a computer-readable recording medium.

[0298] Computer-readable recording media include all types of recording media that store instructions that can be decoded by a computer. Examples include ROM (read-only memory), RAM (random access memory), magnetic tape, magnetic disk, flash memory, optical data storage devices, etc.

[0299] As described above, the disclosed embodiments have been explained with reference to the attached drawings. Those skilled in the art will understand that the present invention may be practiced in forms different from the disclosed embodiments without changing the technical spirit or essential features of the invention. The disclosed embodiments are illustrative and should not be interpreted restrictively. Explanation of the symbols

[0300] 1: Display device 10: Display module 11: Display panel 13: First substrate 100: Micropixel package 110: Second substrate 120: Inorganic light-emitting diode 130: Micropixel controller 200: Driver IC

Claims

Claim 1 A display module comprising a plurality of pixels, the display module comprising: a first substrate; a plurality of micropixel packages arranged two-dimensionally on the upper surface of the first substrate; and a plurality of voltage lines electrically connecting micropixel packages adjacent in a first direction; wherein each of the plurality of micropixel packages comprises: a second substrate; a plurality of inorganic light-emitting elements disposed on the upper surface of the second substrate; a micropixel controller disposed on the second substrate and controlling the plurality of inorganic light-emitting elements; and an internal connection line formed inside the second substrate and electrically connecting a voltage line electrically connected to one of the micropixel packages adjacent in a first direction and a voltage line electrically connected to another of the micropixel packages adjacent in a first direction. Claim 2 In claim 1, each of the plurality of voltage lines is a display module that transmits voltage between the micropixel packages. Claim 3 In paragraph 2, each of the plurality of micropixel packages receives a voltage through a voltage wiring electrically connected to one of the micropixel packages adjacent in a first direction, and outputs the received voltage through an internal connection wiring to a voltage wiring electrically connected to another of the micropixel packages adjacent in the first direction, thereby forming a display module. Claim 4 In paragraph 3, the internal connecting wiring is a display module with a higher electron mobility compared to the plurality of voltage wirings. Claim 5 In paragraph 3, the plurality of micropixel packages comprises: a plurality of first micropixel packages that receive voltage from a power board and transmit voltage to an adjacent micropixel package in a first direction through voltage wiring; and a plurality of second micropixel packages that receive voltage from an adjacent micropixel package in a first direction. Claim 6 In paragraph 3, the internal connecting wiring is electrically connected to the plurality of inorganic light-emitting elements and the micropixel controller, and is a display module that transmits a voltage input from any one of the micropixel packages adjacent in a first direction to each of the plurality of inorganic light-emitting elements and the micropixel controller. Claim 7 In claim 6, the internal connection wiring comprises: a first internal connection wiring through which a power supply voltage flows; and a second internal connection wiring through which a reference voltage flows; wherein the first internal connection wiring is electrically connected to the micropixel controller to transmit the power supply voltage, and the second internal connection wiring is electrically connected to the plurality of inorganic light-emitting elements to transmit the reference voltage, thereby forming a display module. Claim 8 In claim 1, each of the plurality of pixels is composed of two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and the plurality of inorganic light-emitting elements constitute a display module that forms two or more pixels among the plurality of pixels. Claim 9 In claim 1, the micropixel controller comprises: a third substrate; and at least one thin-film transistor disposed on the third substrate; and the at least one thin-film transistor is a display module that switches the plurality of inorganic light-emitting elements and supplies a driving current to the plurality of inorganic light-emitting elements. Claim 10 A display device comprising: a plurality of display modules including a plurality of pixels arranged in two dimensions; and a frame supporting the plurality of display modules; wherein each of the plurality of display modules includes: a first substrate; a plurality of micropixel packages arranged in two dimensions on the upper surface of the first substrate; and a plurality of voltage lines electrically connecting micropixel packages adjacent in a first direction; and each of the plurality of micropixel packages includes: a second substrate; a plurality of inorganic light-emitting elements disposed on the upper surface of the second substrate; a micropixel controller disposed on the second substrate and controlling the plurality of inorganic light-emitting elements; and an internal connection line formed inside the second substrate and electrically connecting a voltage line electrically connected to one of the micropixel packages adjacent in a first direction and a voltage line electrically connected to another of the micropixel packages adjacent in a first direction among the plurality of voltage lines. Claim 11 In claim 10, each of the plurality of voltage lines is a display device that transmits voltage between the micropixel packages. Claim 12 A display device according to claim 11, wherein each of the plurality of micropixel packages receives a voltage through a voltage wiring electrically connected to any one of the micropixel packages adjacent in a first direction, and outputs the received voltage through an internal connection wiring to a voltage wiring electrically connected to another of the micropixel packages adjacent in the first direction. Claim 13 In paragraph 12, the internal connecting wiring is a display device having a higher electron mobility compared to the plurality of voltage wirings. Claim 14 A display device according to claim 12, wherein the plurality of micropixel packages comprises: a plurality of first micropixel packages that receive voltage from a power board and transmit voltage to an adjacent micropixel package in a first direction through voltage wiring; and a plurality of second micropixel packages that receive voltage from an adjacent micropixel package in a first direction. Claim 15 In claim 12, the internal connecting wiring is electrically connected to the plurality of inorganic light-emitting elements and the micropixel controller, and transmits a voltage input from any one of the micropixel packages adjacent in a first direction to each of the plurality of inorganic light-emitting elements and the micropixel controller. Claim 16 A display device according to claim 15, wherein the internal connection wiring comprises: a first internal connection wiring through which a power supply voltage flows; and a second internal connection wiring through which a reference voltage flows; wherein the first internal connection wiring is electrically connected to the micropixel controller to transmit the power supply voltage, and the second internal connection wiring is electrically connected to the plurality of inorganic light-emitting elements to transmit the reference voltage. Claim 17 In claim 10, each of the plurality of pixels is composed of two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and the plurality of inorganic light-emitting elements constitute two or more pixels among the plurality of pixels in a display device. Claim 18 In claim 10, the micropixel controller comprises: a third substrate; and at least one thin-film transistor disposed on the third substrate; and the at least one thin-film transistor is a display device that switches the plurality of inorganic light-emitting elements and supplies a driving current to the plurality of inorganic light-emitting elements.

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