Mounting bracket, electronic device and display device having the same

Abstract

The present invention provides a mounting bracket, an electronic device including the same, and a display device. The electronic device includes a printed circuit board on which electronic components are mounted, a case including a board mounting portion including an interference wall on which the printed circuit board is mounted and which includes a coating layer applied to the outer surface, and a mounting member fixed to the printed circuit board and mounting the printed circuit board to the board mounting portion. The mounting member includes a through hole formed to face the interference wall, an interference portion that interferes with the interference wall, and a scratch projection formed around the through hole that protrudes from the interference portion and is arranged to scratch the outer surface of the interference wall when the interference portion interferes with the interference wall. At least a portion of the coating layer is removed by the scratch projection when the interference portion interferes with the interference wall.

Description

Technology Field

[0001] The present disclosure relates to an electronic device and a display device, and more specifically, to an electronic device and a display device that mounts a printed circuit board in a case. Background Technology

[0002] Electronic devices generally include electronic components and printed circuit boards (PCBs) on which these components are mounted, and refer to various types of devices capable of performing specific functions by receiving power.

[0003] A printed circuit board refers to a board formed by printing circuit line patterns using a conductive material, such as copper, on an electrically insulating substrate, on which electronic components can be mounted.

[0004] Generally, fastening methods using screws or similar means may be used during the process of mounting electronic device components. For example, a printed circuit board of an electronic device can be attached to the device's case by screws. When mounting electronic device components using screws, a separate fastening tool is required for screw fastening, which may increase manufacturing costs, and manufacturing time may increase because time is required for screw fastening. The problem to be solved

[0005] One aspect of the present disclosure may provide an electronic device having an improved structure that allows a printed circuit board to be easily mounted in the case of the electronic device.

[0006] Another aspect of the present disclosure may provide an electronic device having an improved structure that can improve the degree of grounding when a printed circuit board is mounted on an electronic device. means of solving the problem

[0007] An electronic device according to an example of the present disclosure may include: a printed circuit board on which an electronic component is mounted; a case including a board mounting portion on which the printed circuit board is mounted and which includes an interference wall; and a mounting member fixed to the printed circuit board and for mounting the printed circuit board to the board mounting portion, the mounting member including an interference portion that interferes with the interference wall and a scratch projection protruding from the interference portion and provided to scratch the outer surface of the interference wall when the interference portion interferes with the interference wall.

[0008] The interference wall includes a coating layer applied to the outer surface of the interference wall, and the scratch protrusion can penetrate the coating layer.

[0009] At least a portion of the coating layer can be removed by the scratch protrusion when the interference portion interferes with the interference wall.

[0010] The interference wall is covered by the coating layer and further comprises a conductive layer configured to include a conductive material, and the scratch protrusion can come into contact with the conductive layer.

[0011] The above substrate mounting portion includes an insertion hole formed to allow the interference portion and the scratch protrusion to be inserted, and the scratch protrusion can be inserted into the insertion hole and come into contact with the interference wall.

[0012] The insertion hole is formed to be open in a direction parallel to the direction in which the printed circuit board extends, and the scratch protrusion can be inserted into the insertion hole in a direction parallel to the direction in which the printed circuit board extends.

[0013] The interference portion includes a first extension portion extending toward the interference wall, a bending portion bent at one end of the first extension portion on the interference wall side, and a second extension portion extending from the bending portion, and the scratch projection may be disposed on the bending portion.

[0014] The second extension may extend from the bending portion so as to move away from the interference wall.

[0015] The mounting member comprises a mounting body that is seated on one surface of the printed circuit board, and a fixing part that extends from the mounting body and connects the mounting member to the printed circuit board, and the interference part may extend from the mounting body to penetrate the printed circuit board.

[0016] The interference wall is formed parallel to the mounting body, and the distance between the scratch protrusion and the mounting body when the interference part is not interfered with the interference wall can be arranged to be closer than the distance between the scratch protrusion and the mounting body when the interference part is interfered with the interference wall.

[0017] The interference portion includes a through hole formed to face the interference wall, and the scratch protrusion may be formed around the through hole.

[0018] The inner surface of the above scratch protrusion can be formed integrally with the outer circumference of the above through hole.

[0019] The above scratch protrusion may be formed to protrude in the direction in which the interference part is pressed when the through hole is machined and formed in the interference part.

[0020] The above interference part may be configured to include an elastic material.

[0021] The above substrate mounting portion and the above mounting member may be configured to include a conductive material.

[0022] A mounting bracket according to an example of the present disclosure is a mounting bracket provided for mounting a printed circuit board, on which an electronic component is mounted, to a case including an interference wall, and may include a bracket body provided to be seated on one surface of the printed circuit board, a fixing pin extending from the bracket body and provided to be fixed to the printed circuit board, an interference portion provided to interfere with the interference wall so that the mounting bracket is coupled to the case, and a scratch projection formed to protrude from the interference portion to scratch the outer surface of the interference wall when the interference portion interferes with the interference wall.

[0023] The interference wall includes a coating layer applied to the outer surface of the interference wall, and the scratch protrusion may come into contact with the inner side of the coating layer of the interference wall when the interference portion interferes with the interference wall.

[0024] The interference portion is slidably moved in a direction parallel to the direction in which the printed circuit board extends and is slidably moved against the interference wall so that the printed circuit board can be mounted in the case, and is provided so that at least a portion of the coating layer is removed when the scratch protrusion slides against the interference wall.

[0025] A display device according to one example of the present disclosure may include a display panel for displaying an image forward, a bottom chassis disposed at the rear of the display panel and including a substrate mounting portion, a printed circuit board on which electronic components are mounted and which is supported by the bottom chassis, and a mounting member for detachably mounting the printed circuit board to the substrate mounting portion, the mounting member comprising a fixing portion fixed to the printed circuit board, an interference portion that interferes with the substrate mounting portion so that the mounting member is coupled to the bottom chassis, and a scratching projection provided to scratch the outer surface of the substrate mounting portion when the interference portion interferes with the substrate mounting portion.

[0026] The printed circuit board is positioned at the rear of the bottom chassis, and the scratch protrusion may protrude from the front of the bottom chassis toward the rear. Effects of the invention

[0027] According to the concept of the present disclosure, an electronic device can easily mount a printed circuit board to a case by means of a mounting member comprising an interference portion that interferes with the case.

[0028] According to the concept of the present disclosure, an electronic device may include scratch protrusions to improve the degree to which a printed circuit board is grounded to a case. Brief explanation of the drawing

[0029] FIG. 1 is a perspective view illustrating an electronic device according to one embodiment of the present disclosure. Figure 2 is a drawing showing the rear cover separated from the bottom chassis in the electronic device of Figure 1. FIG. 3 is a diagram illustrating the coupling relationship between a printed circuit board and a case of an electronic device according to one embodiment of the present disclosure. Figures 4 and 5 are drawings illustrating the process of the printed circuit board of Figure 3 being coupled to a case. FIG. 6 is a diagram illustrating the coupling relationship between a mounting member of an electronic device and a printed circuit board according to one embodiment of the present disclosure. FIG. 7 is a drawing illustrating a mounting member fixed to a printed circuit board in an electronic device according to one embodiment of the present disclosure. FIG. 8 is a drawing illustrating a mounting member of an electronic device according to one embodiment of the present disclosure. Figure 9 is a drawing showing the mounting member of Figure 8 viewed from a different direction. Figure 10 is an enlarged view of A in Figure 9. FIG. 11 is a cross-sectional view illustrating the appearance of a printed circuit board in an electronic device according to one embodiment of the present disclosure before it is mounted in a case. FIG. 12 is a cross-sectional view showing the printed circuit board of FIG. 11 after it has been mounted in a case. Figure 13 is an enlarged view illustrating B of Figure 12. FIG. 14 is a drawing showing a printed circuit board mounted on the case of FIG. 12 viewed from a different direction. FIGS. 15 and 16 are drawings briefly illustrating the process of forming a scratch protrusion of an electronic device according to one embodiment of the present disclosure. FIG. 17 is a drawing illustrating a mounting member of an electronic device according to another embodiment of the present disclosure. FIG. 18 is a drawing showing the mounting member of FIG. 17 viewed from a different direction. Specific details for implementing the invention

[0030] The embodiments described in this specification and the configurations illustrated in the drawings are merely preferred examples of the disclosed invention, and various modifications that may replace the embodiments and drawings of this specification may exist at the time of filing this application.

[0031] Additionally, the same reference numerals or symbols presented in each drawing of this specification represent parts or components that perform substantially the same function.

[0032] Furthermore, the terms used in this specification are for describing embodiments and are not intended to limit or / or restrict the disclosed invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0033] Additionally, terms including ordinal numbers, such as "first," "second," etc., as used herein may be used to describe various components, but said components are not limited by said terms, and said terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and / or" includes a combination of a plurality of related described items or any one of a plurality of related described items.

[0034] Furthermore, although the following description is based on a display device as an embodiment of the present disclosure, it is not limited thereto. The concept of the present disclosure is applicable not only to display devices but also to various electronic devices to which printed circuit boards can be applied. In particular, the concept of the present disclosure is applicable to various types of electronic devices, provided that the device includes a printed circuit board on which electronic components are mounted and a case supporting the printed circuit board.

[0035] Hereinafter, embodiments according to the present disclosure will be described in detail with reference to the attached drawings.

[0036] FIG. 1 is a perspective view illustrating an electronic device according to one embodiment of the present disclosure. FIG. 2 is a drawing illustrating the rear cover separated from the bottom chassis of the electronic device of FIG. 1.

[0037] Referring to FIGS. 1 and 2, the electronic device (1) may be a display device (1). The display device (1) is a device capable of processing video signals received from the outside and visually displaying the processed video. FIGS. 1 and 2 illustrate the case where the display device (1) is a television (TV), but it is not limited thereto. For example, the display device (1) can be implemented in various forms such as a monitor, a portable multimedia device, a portable communication device, etc., and the form of the display device (1) is not limited as long as it is a device that visually displays video.

[0038] In addition, the display device (1) may be a large format display (LFD) installed outdoors, such as on a building rooftop or at a bus stop. Here, the outdoor area is not necessarily limited to an open space; the display device (1) according to one embodiment may be installed in any indoor location where many people can enter and exit, such as a subway station, shopping mall, movie theater, company, or store.

[0039] The display device (1) receives content including video signals and audio signals from various content sources and can output video and audio corresponding to the video signals and audio signals. For example, the display device (1) can receive content data through a broadcast receiving antenna or a wired cable, receive content data from a content playback device, or receive content data from a content provider's content provision server.

[0040] The display device (1) may be configured to display a screen. Specifically, the display device (1) may include a display panel (10) that displays an image in front.

[0041] A plurality of pixels are formed in the display panel (10), and the screen displayed in the screen display area (S) can be formed by a combination of light emitted from the plurality of pixels. For example, a single screen can be formed by combining light emitted by the plurality of pixels in a mosaic-like manner.

[0042] Each of the plurality of pixels can emit light of various brightness and various colors. Specifically, each of the plurality of pixels may include subpixels, and the subpixels may include a red subpixel capable of emitting red light, a green subpixel capable of emitting green light, and a blue subpixel capable of emitting blue light. Each of the plurality of pixels can emit light of various brightness and various colors through a combination of light emitted from the red subpixel, the green subpixel, and the blue subpixel, respectively.

[0043] The display panel (10) may be a self-emissive display panel such as an organic light-emitting diode (OLED) or a liquid crystal display (LCD). There are no special limitations on the type of display panel (10), and the display device (1) may include various types of display panels (10).

[0044] If the display panel (10) is an LCD panel, the display panel (10) may include a thin film transistor substrate in which thin film transistors (TFTs) are formed in a matrix form, a color filter substrate coupled in parallel with the thin film transistor substrate, and a liquid crystal injected between the thin film transistor substrate and the color filter substrate, the optical properties of which vary according to changes in voltage or temperature. Additionally, a backlight unit (BLU) (not shown) may be provided at the rear of the display panel (10). The backlight unit may be provided to emit light from the rear of the display panel (10) toward the display panel (10). In this case, the display panel (10) may block or allow light emitted from the backlight unit to pass through. However, it is not limited thereto, and as described above, the display panel (10) may be a self-emissive display panel such as an OLED panel.

[0045] On one side of the display panel (10), a cable (not shown) for transmitting video data to the display panel (10) and a display driver integrated circuit (DDI) (not shown) for processing digital video data and outputting an analog video signal may be provided.

[0046] The display device (1) may include a chassis (20, 30, 40) that supports a display panel (10). The chassis (20, 30, 40) may support the front, side, or rear of the display panel (10).

[0047] The display device (1) may include a top chassis (20) that supports the front or side of the display panel (10). The top chassis (20) may support the front of the display panel (10) by forming a bezel that is positioned to face the front of the display device (1). However, if the display device (1) is a bezel-less type display device with a very narrow or no bezel, the top chassis (20) may be provided to support only the side of the display panel (10). Furthermore, if the bottom chassis (40) supports the side of the display panel (10), the display device (1) may not include a top chassis (20).

[0048] The display device (1) may include a bottom chassis (40) positioned at the rear of the display panel (10). The bottom chassis (40) covers the rear of the display panel (10) and may support an optical sheet (not shown), the aforementioned backlight unit (not shown), and a printed circuit board (50), etc. If the display device (1) includes a top chassis (20), the bottom chassis (40) may be coupled to the rear of the top chassis (20).

[0049] The display device (1) may include a rear cover (30) forming the rear of the display device (1). The rear cover (30) is positioned at the rear of the bottom chassis (40) and can cover the bottom chassis (40) and a printed circuit board (50) mounted at the rear of the bottom chassis (40).

[0050] The bottom chassis (40) of the display device (1) may be referred to as a case (40). Alternatively, the entire configuration supporting the display panel (10), including not only the bottom chassis (40) but also the top chassis (20), rear cover (30), etc., may be referred to as a case (40).

[0051] The case (40) forms the outer shape of the display device (1), and the case (40) may include a printed circuit board (50) and various components for the display device (1) to display images or perform various functions. Although the case (40) is depicted as having a flat plate shape in FIGS. 1 and 2, the shape of the case (40) is not limited thereto. For example, the case (40) may have a curved plate shape corresponding to the shape of the display panel (10). Alternatively, the case (40) may be configured to be variable between a flat state and a curved state, and may be applied to a variable (bendable or flexible) display device (1).

[0052] However, as described above, the electronic device (1) according to the concept of the present disclosure is not limited to a display device (1) and may include various types of electronic devices. For example, the electronic device (1) may include a computer main body (not shown) including a central processing unit (CPU) of a PC (Personal Computer) (not shown).

[0053] Hereinafter, various types of electronic devices (1) that may include a display device (1) are described.

[0054] FIG. 3 is a diagram illustrating the coupling relationship between a printed circuit board and a case of an electronic device according to one embodiment of the present disclosure. FIG. 4 and FIG. 5 are diagrams illustrating the process of coupling the printed circuit board of FIG. 3 to the case.

[0055] Referring to FIGS. 3 to 5, the electronic device (1) may include a printed circuit board (50) on which an electronic component (P) is mounted. The printed circuit board (50) is formed by printing a circuit line pattern with a conductive material such as copper on an electrically insulating substrate, and may refer to a board on which an electronic component can be mounted.

[0056] The electronic device (1) may include various types of printed circuit boards (50). The printed circuit boards (50) may include a main board, a Switched Mode Power Supply (SMPS) board, a source board, etc.

[0057] The main board may include a processor and a power management device for driving the electronic device (1). The SMPS board may supply power for driving the electronic device (1). The source board may control the display panel (10), for example, if the electronic device (1) is a display device.

[0058] The main board, SMPS board, source board, etc., can be arranged independently or merged together. Circuit boards arranged independently can be connected to each other to transmit data, signals, or power.

[0059] As shown in FIG. 2, a plurality of printed circuit boards (50) may be provided in a single electronic device (1). However, the number of printed circuit boards (50) provided in the electronic device (1) is not limited to that shown in FIG. 2. Alternatively, only one printed circuit board (50) may be provided in a single electronic device (1).

[0060] The electronic device (1) may include a case (40) provided to mount a printed circuit board (50). The printed circuit board (50) may be mounted to the case (40) by a mounting member (100).

[0061] The case (40) may include a board mounting portion (200) on which a printed circuit board (50) is mounted. The board mounting portion (200) may be provided to face one side of the printed circuit board (50) in the case (40). The board mounting portion (200) may be positioned on one side of the case (40) facing the printed circuit board (50).

[0062] The substrate mounting portion (200) may have a shape that protrudes toward the printed circuit board (50). Specifically, the case (40) may include a substrate spacing surface (40a) formed to face one side of the substrate mounting portion (200) of the printed circuit board (50) when the printed circuit board (50) is seated in the case (40), and the substrate mounting portion (200) may have a shape that protrudes from the substrate spacing surface (40a). Taking the example shown in FIG. 2, the substrate spacing surface (40a) may be provided on the rear of the bottom chassis (40) and may face the printed circuit board (50) positioned at the rear of the bottom chassis (40), and the substrate mounting portion (200) may be formed to protrude backward from the bottom chassis (40). However, the arrangement of the substrate mounting portion (200) and the printed circuit board (50) is not limited thereto.

[0063] As the substrate mounting portion (200) has a shape that protrudes from the substrate spacing surface (40a), the printed circuit board (50) can be mounted in the case (40) while being spaced apart from the substrate spacing surface (40a).

[0064] The case (40) may be formed to include a flat plate shape. In particular, the substrate spacing surface (40a) facing the printed circuit board (50) of the case (40) may be formed to include a flat plate shape. However, it is not limited thereto, and the substrate spacing surface (40a) and the case (40) including it may be formed to include various shapes in which the printed circuit board (50) can be mounted.

[0065] The substrate spacing surface (40a) and the substrate mounting portion (200) may be formed integrally. Specifically, the substrate mounting portion (200) may be manufactured by pressing a portion of a flat plate-shaped case (40). However, it is not limited thereto, and the substrate mounting portion (200) may be formed in various ways, and the substrate spacing surface (40a) and the substrate mounting portion (200) may be manufactured separately and then combined.

[0066] The substrate mounting portion (200) may include a mounting surface (210) on which a printed circuit board (50) is mounted. The mounting surface (210) may be formed so as to be parallel to the printed circuit board (50) and may be positioned to face a substrate through-hole (51, see FIG. 6) formed in the printed circuit board (50). The mounting surface (210) may be formed at one end of the direction side protruding from the substrate spacing surface (40a) of the substrate mounting portion (40).

[0067] The mounting surface (210) may be provided on the other side opposite to one side of the interference wall (240, see FIG. 11) that interferes with the interference part (130, see FIG. 6) described later.

[0068] The substrate mounting portion (200) may include an inclined surface (220) connecting the mounting surface (210) and the substrate spacing surface (40a). The inclined surface (220) may have a slope such that the width of the cross-section cut in a direction parallel to the substrate spacing surface (40a) of the substrate mounting portion (200) becomes narrower as it moves from the substrate spacing surface (40a) side toward the mounting surface (210) side. That is, the substrate mounting portion (200) may be formed to include the shape of a horn overall.

[0069] The substrate mounting portion (200) may include an insertion hole (230) formed to allow at least a portion of the mounting member (100) coupled to the printed circuit board (50) to be inserted. The substrate mounting portion (200) may be provided with a cavity formed inside the insertion hole (230) to accommodate at least a portion of the mounting member (100) inserted through the insertion hole (230). Alternatively, the substrate mounting portion (200) may have a concave space formed on the side opposite to the side where the printed circuit board (50) is mounted, and at least a portion of the mounting member (100) may be inserted through the insertion hole (230) and accommodated in the concave space of the substrate mounting portion (200).

[0070] The insertion hole (230) can be formed so that the interference part (130, see FIG. 6) described later is inserted, and accordingly, the printed circuit board (50) can be mounted by sliding on the board mounting part (200) by the mounting member (100).

[0071] The insertion hole (230) may be formed to be open in a direction parallel to the direction in which the printed circuit board (50) extends. That is, the insertion hole (230) may be formed so that the printed circuit board (50) can be inserted in a direction (M2) parallel to the direction in which the printed circuit board (50) extends. In this case, the insertion hole (230) may be provided on an inclined surface (220). However, it is not limited thereto, and the printed circuit board (50) may be mounted on the case (40) in various directions, and the insertion hole (230) may also be formed in correspondence to the direction (M2) in which the interference portion (130) of the mounting member (100) is inserted. For example, the printed circuit board (50) may be inserted in a direction (M1) parallel to the direction in which the printed circuit board (50) and the board spacing surface (40a) face each other, and in this case, the insertion hole (230) may be formed in the direction of M1 from the seating surface (210).

[0072] In cases where a plurality of substrate mounting portions (200) are provided to form a plurality of insertion holes (230), or where a plurality of insertion holes (230) are formed in a single substrate mounting portion (200), the plurality of insertion holes (230) may be formed to be open in a certain direction. That is, the plurality of insertion holes (230) may be formed such that the direction in which the interference portion (130) of the plurality of mounting members (100) is inserted is constant. Accordingly, the interference portion (130) may be easily mounted in the insertion hole (230) or easily detached from the insertion hole (230). However, this is not limited thereto, and the insertion holes (230) may be formed in various ways, and the insertion holes (230) may be formed as a single number.

[0073] However, the shape of the substrate mounting portion (200) is not limited thereto and may include various shapes in which the printed circuit board (50) can be mounted by the mounting member (100). For example, the mounting member (100) coupled to the printed circuit board (50) may include a hole (not shown) or a groove (not shown), and the substrate mounting portion (200) may include a projection (not shown) provided to penetrate the hole of the mounting member (100) or be inserted into the groove, so that the printed circuit board (50) may be mounted to the substrate mounting portion (200) in a manner in which the projection of the substrate mounting portion (200) and the hole or groove of the mounting member (100) interfere with each other.

[0074] The substrate mounting portion (200) may be provided in multiple numbers as shown in FIGS. 3 to 5. However, it is not limited thereto, and the substrate mounting portion (200) may be provided in various numbers so that the printed circuit board (50) can be stably mounted on the case (40). The substrate mounting portion (200) may also be provided in a single number.

[0075] With the above configuration, the printed circuit board (50) is moved in the M1 direction toward the case (40) from the position of FIG. 3 to the position of FIG. 4, and then as the printed circuit board (50) moves in the M2 direction, the interference portion (130, see FIG. 6) of the mounting member (100) coupled to the printed circuit board (50) is inserted into the insertion hole (230) in the M2 direction and can be mounted on the board mounting portion (200). However, as described above, the method of mounting the printed circuit board (50) to the board mounting portion (200) by the mounting member (100) is not limited thereto.

[0076] The interference portion (130) described below interferes with the interference wall (240, see FIG. 11) of the substrate mounting portion (200) so that the printed circuit board (50) is mounted on the substrate mounting portion (200), so that the printed circuit board (50) can be detachably mounted on the substrate mounting portion (200). For example, the interference portion (130) can be configured to be detachable after being inserted into the substrate mounting portion (200) through the insertion hole (230), so that the printed circuit board (50) can be detachably mounted on the substrate mounting portion (200). However, it is not limited thereto, and the printed circuit board (50) can be mounted in a manner that is not detachably mounted to the substrate mounting portion (200). Even if the electronic device (1) includes all the configurations described above, the printed circuit board (50) may be fixed in a manner that is not detachably mounted to the substrate mounting portion (200) by a separate fixing member (not shown).

[0077] In addition to the aforementioned substrate mounting portion (200), the case (40) may include a substrate guide portion (201) that guides the movement of the printed circuit board (50). The substrate guide portion (201) may be formed to include a shape that protrudes from the substrate spacing surface (40a). The substrate guide portion (201) may include a guide projection (201a) of a protruding shape, and the printed circuit board (50) may have a guide hole (54a) formed at a position corresponding to the position of the guide projection (201a) when the printed circuit board (50) is mounted on the case (40). The guide projection (201a) may be inserted into the guide hole (54a).

[0078] The guide hole (54a) may extend in the direction in which the printed circuit board (50) is mounted on the board mounting portion (200). For example, as shown in FIG. 5, the guide hole (54a) may extend in a direction parallel to the M2 direction, which is the direction in which the printed circuit board (50) is mounted on the board mounting portion (200), that is, the direction in which the interference portion (130) is inserted into the insertion hole (230). The printed circuit board (50) may be guided to move in the direction in which it is mounted on the case (40) by the guide projection (201a) inserted into the guide hole (54a). Furthermore, even when the printed circuit board (50) is separated from the case (40), it may be guided to move in the direction in which it is separated from the case (40) by the guide projection (201a).

[0079] As illustrated in FIGS. 3 to 5, the case (40) may include a board mounting portion (202) in which both an insertion hole (230) into which an interference portion (130) of a mounting member (100) is inserted and a guide projection (201a) provided to guide the movement of a printed circuit board (50) are provided. The guide projection (201a) may be provided on a seating surface (210).

[0080] The guide projection (201a) of the substrate mounting portion (202) may have a protruding shape so as to be inserted into a guide hole (54b) formed in the printed circuit board (50), and may be provided to guide the movement of the printed circuit board (50) so that it can be mounted on the case (40) or separated from the case (40) by being inserted into the guide hole (54b).

[0081] A stopper (201b) formed in a protruding shape can be provided on the mounting surface (210) of the substrate mounting portion (202) so that the printed circuit board (50) is not easily detached after being mounted at a predetermined position on the case (40).

[0082] The stopper (201b) can be formed to protrude from the seating surface (210) of the substrate mounting portion (202) like a guide projection (201b), and can be formed to be inserted into the guide hole (54b) of the printed circuit board (50). The stopper (201b) can be inserted into the guide hole (54b) to support one side of the guide hole (54b), and accordingly, the printed circuit board (50) can be stably mounted in the case (40).

[0083] With the above configuration, the electronic device (1) can easily mount the printed circuit board (50), to which the mounting member (100) is attached, to the board mounting portion (200) of the case (40) by sliding it. In this case, manufacturing time and manufacturing costs can be reduced compared to the case where the printed circuit board (50) is directly fastened to the case (40), such as by screw fastening. In addition, even when it is necessary to separate the printed circuit board (50) from the case (40) again for repair or replacement of electronic components (p), it can be separated more easily compared to the case where the printed circuit board (50) is fastened to the case (40) by screws.

[0084] However, it is not limited thereto, and the case (40) may be configured to include various structures for mounting a printed circuit board (50) to the case (40). Unlike as shown in FIGS. 3 to 5, the case (40) may not be provided with a board guide portion (201), and may not be provided with a board mounting portion (202) including a guide projection (202a) to a stopper (202b).

[0085] In the following description, for convenience of explanation, a substrate mounting portion (200) that does not include a guide projection (202a) and a stopper (202b) is described as an example, but the following configurations may also be applied to a substrate mounting portion (200) that includes a guide projection (202a) and a stopper (202b).

[0086] FIG. 6 is a diagram illustrating the coupling relationship between a mounting member and a printed circuit board of an electronic device according to one embodiment of the present disclosure. FIG. 7 is a diagram illustrating the mounting member fixed to a printed circuit board in an electronic device according to one embodiment of the present disclosure.

[0087] Referring to FIGS. 6 and 7, the electronic device (1) may include a mounting member (100), and the mounting member (100) may be coupled to a printed circuit board (50). The mounting member (100) may be fixed to the printed circuit board (50) so that the printed circuit board (50) is mounted to the board mounting portion (200). The mounting member (100) may be referred to as a mounting bracket (100). In other words, the electronic device (1) may include a mounting bracket (100), and the mounting bracket (100) may be configured to mount the printed circuit board (50), on which the electronic component (P) is mounted, to the case (40).

[0088] The mounting member (100) may include a mounting body (110) that is seated on one side of the printed circuit board (50). The mounting body (110) may be provided so that the mounting member (100) can be supported by one side of the printed circuit board (50). The mounting body (110) may be seated on one side of the printed circuit board (50) opposite to the board mounting portion (200), but is not limited thereto.

[0089] The mounting body (110) may be formed to include a flat plate shape. The mounting body (110) may be formed to have a shape parallel to the printed circuit board (50). The mounting body (110) may be seated in close contact with one surface of the printed circuit board (50). However, it is not limited thereto, and the mounting body (110) may have various shapes that can be seated on the printed circuit board (50).

[0090] The mounting body (110) may be referred to as a bracket body (110). That is, the mounting bracket (100) may include a bracket body (110) provided to be seated on one side of a printed circuit board (50). The bracket body (110) may include a flat plate shape and may be formed to have a shape parallel to the printed circuit board (50). The bracket body (110) may be seated in close contact with one side of the printed circuit board (50).

[0091] The mounting body (110) may include a support portion (111) that is formed concavely toward the printed circuit board (50) when the mounting member (100) is coupled to the printed circuit board (50). A support hole (52) may be formed in the printed circuit board (50) at a position corresponding to the position of the support portion (111) of the mounting body (110), and the support portion (111) may be inserted into and received in the support hole (52). As the support portion (111) is inserted into the support hole (52), the mounting member (100) can be supported more stably on the printed circuit board (50).

[0092] In other words, the bracket body (110) may include a support member (111) that is inserted into and supported by a support hole (52), and the mounting bracket (100) may be more stably supported on the printed circuit board (50).

[0093] However, it is not limited thereto, and the mounting body (110) may have various shapes. Although FIGS. 6 and 7 show the support member (111) formed at the end of the mounting body (110), the support member (111) may be formed at a different location on the mounting body (110). In this case, depending on the location, the support member (111) may be inserted into a different component of the printed circuit board (50), such as a board through-hole (51), rather than the support hole (52). Alternatively, the mounting body (110) may not include the support member (111).

[0094] The mounting member (100) may include a fixing part (120) for coupling the mounting member (100) to a printed circuit board. The fixing part (120) may be extended from the mounting body (110) and configured so that the mounting member (100) is fixed to the printed circuit board (50).

[0095] The fixing part (120) may extend from the mounting body (110) so as to penetrate the printed circuit board (50) or at least be inserted into the printed circuit board (50) when the mounting member (100) is coupled to the printed circuit board (50). When the mounting body (110) is seated on one side opposite to the board mounting part (200) of the printed circuit board (50), the fixing part (120) may extend from the mounting body (110) toward the board mounting part (200).

[0096] The fixing part (120) may be provided in multiple numbers. The multiple fixing parts may be formed symmetrically with respect to each other. In this case, the mounting member (100) can be fixed more stably to the printed circuit board (50). However, it is not limited thereto, and the fixing part (120) may be provided in a single number.

[0097] At least a portion of the fixing portion (120) may be formed to penetrate a fixing hole (53) formed in the printed circuit board (50). At least a portion of the fixing portion (120) penetrating the fixing hole (53) may be fixed to the printed circuit board (50) through soldering fixation (F) as shown in FIG. 7. However, it is not limited thereto, and the fixing portion (120) may be fixed to the printed circuit board (50) in various ways.

[0098] At least a portion of the fixing portion (120) extends toward the substrate through-hole (51) and may be supported on the inner surface of the substrate through-hole (51). However, it is not limited thereto, and the entire fixing portion (120) may be supported on the printed circuit board (50) by passing through the fixing hole (53).

[0099] The fixing part (120) may be referred to as a fixing pin (120). Alternatively, the mounting bracket (100) may include a fixing pin (120) that extends from the bracket body (110) and is provided to be fixed to the printed circuit board (50), so that the mounting bracket (100) can be fixed to the printed circuit board (50). At least a portion of the fixing pin (120) is formed to pass through the fixing hole (53) and can be fixed to the printed circuit board (50) through soldering fixation (F).

[0100] That is, the mounting member (100) can be easily fixed to the printed circuit board (50) and the mounting member (100) can be stably coupled to the printed circuit board (50) by inserting the fixing part (120) into the fixing hole (53) of the printed circuit board (50) and then fixing it to the printed circuit board (50) by soldering fixation (F). In other words, the mounting bracket (100) can be easily fixed to the printed circuit board (50) and the mounting bracket (100) can be stably coupled to the printed circuit board (50) by inserting the fixing pin (120) into the fixing hole (53) of the printed circuit board (50) and then fixing it to the printed circuit board (50) by soldering fixation (F).

[0101] The mounting member (100) may include an interference portion (130) provided to interfere with the substrate mounting portion (200). The configuration of the substrate mounting portion (200) that interferes with the interference portion (130) of the mounting member (100) may be referred to as an interference wall (240, see FIG. 11).

[0102] In other words, the mounting bracket (100) may include an interference portion (130) that is provided to interfere with the interference wall (240) so that the mounting bracket (100) is coupled to the case (40). The details regarding the interference portion (130) interfering with the interference wall (240) will be described later.

[0103] The interference portion (130) may extend from the mounting body (110). Specifically, the interference portion (130) may extend from the mounting body (110) toward the substrate mounting portion (200). In other words, the interference portion (130) may extend from the bracket body (110) toward the substrate mounting portion (200).

[0104] When the mounting body (110) is seated on one side opposite to the board mounting portion (200) of the printed circuit board (50), the interference portion (130) may be extended from the mounting body (110) to penetrate the printed circuit board (50). Alternatively, the interference portion (130) may be extended from the bracket body (110) to penetrate the printed circuit board (50). At this time, a board penetration hole (51) may be formed in the printed circuit board (50), and the interference portion (130) may penetrate the board penetration hole (51).

[0105] In other words, the interference portion (130) may be positioned on the side of the substrate mounting portion (200) of the printed circuit board (50), and the mounting body (110) may be positioned on the other side of the printed circuit board (50). In this case, the mounting member (100) may mount the printed circuit board (50) so that it is in closer contact with the substrate mounting portion (200). Accordingly, the bonding force between the printed circuit board (50) and the substrate mounting portion (200) can be improved, and the gap between the printed circuit board (50) and the substrate mounting portion (200) can be narrowed to promote miniaturization of the electronic device (1). However, it is not limited thereto, and if the mounting body (110) is seated on one side of the substrate mounting portion (200) of the printed circuit board (50), the interference portion (130) may not penetrate the printed circuit board (50).

[0106] The interference portion (130) may include an extension portion (132, 133) that interferes with the interference wall (240) and a connecting portion (131) that connects the extension portion (132, 133) and the mounting body (110). The connecting portion (131) may extend from the mounting body (110), and the extension portion (132, 133) may extend from the connecting portion (131). The connecting portion (131) may be provided to penetrate the substrate through-hole (51).

[0107] The extension portions (132, 133) may be formed to be bent and extended from one end of the connecting portion (131). The extension portions (132, 133) may include a first extension portion (132) that extends toward the mounting body (110) side from one end of the connecting portion (131), and a second extension portion (133) that is bent and extended from one end opposite to the connecting portion (131) of the first extension portion (132). A bending portion (134) with a bent shape may be provided between the first extension portion (132) and the second extension portion (133).

[0108] In other words, when a printed circuit board (50) is mounted on a board mounting portion (200) by a mounting member (100), the interference portion (130) may include a first extension portion (132) that extends toward an interference wall (240, see FIG. 11), a bending portion (134) that is bent at one end of the first extension portion (132) toward the interference wall (240), and a second extension portion (133) that extends from the bending portion (134).

[0109] The second extension part (133) may extend away from the bending part (134) in a direction away from the mounting body (110). That is, when the printed circuit board (50) is mounted on the board mounting part (200) by the mounting member (100), the second extension part (133) may extend away from the bending part (134) in a direction away from the interference wall (240). In this case, among the first extension part (132), the second extension part (133), and the bending part (134), the bending part (134) may be closest to the mounting body (110), or, to put it another way, the bending part (134) may be arranged to be closest to the interference wall (240).

[0110] However, the foregoing description regarding the configuration of the mounting member (100) is merely an example of the mounting member (100) according to the concept of the present disclosure, and the configuration of the mounting member (100) is not limited thereto. The mounting member (100) can be configured in various ways in a form that is fixed to the printed circuit board (50) and allows the printed circuit board (50) to be mounted to the board mounting portion (200). That is, the mounting member (100) can have various shapes depending on the shape of the board mounting portion (200) and the method of mounting the printed circuit board (50) to the board mounting portion (200).

[0111] For example, a mounting member (100) coupled to a printed circuit board (50) may include a hole (not shown) or a groove (not shown), and a board mounting part (200) may include a projection (not shown) provided to penetrate the hole of the mounting member (100) or be inserted into the groove, so that the printed circuit board (50) may be mounted to the board mounting part (200) in a manner in which the projection of the board mounting part (200) and the hole or groove of the mounting member (100) interfere with each other. In this case, the hole or groove of the mounting member (100) may perform the function of an interference part (130), and the projection of the board mounting part (200) may interfere with the hole or groove of the mounting member (100) and perform the function of an interference wall (240, FIG. 11) described later.

[0112] FIG. 8 is a drawing illustrating a mounting member of an electronic device according to one embodiment of the present disclosure. FIG. 9 is a drawing illustrating the mounting member of FIG. 8 viewed from a different direction. FIG. 10 is an enlarged view of A of FIG. 9. FIG. 11 is a cross-sectional view illustrating the appearance of a printed circuit board in an electronic device according to one embodiment of the present disclosure before it is mounted in a case. FIG. 12 is a cross-sectional view illustrating the appearance of the printed circuit board of FIG. 11 after it is mounted in a case. FIG. 13 is an enlarged view illustrating B of FIG. 12. FIG. 14 is a drawing illustrating the printed circuit board mounted in the case of FIG. 12 viewed from a different direction.

[0113] Referring to FIGS. 8 and FIGS. 14, as illustrated in FIGS. 4 and FIGS. 5, the printed circuit board (50) to which the mounting member (100) is attached can be mounted on the board mounting portion (200) by sliding in the M2 direction. Alternatively, the printed circuit board (50) to which the mounting bracket (100) is attached can be mounted on the board mounting portion (200) by sliding in the M2 direction.

[0114] The substrate mounting portion (200) includes an insertion hole (230), and the mounting member (100) may include an interference portion (130) that is inserted into the insertion hole (230). The interference portion (130) may be inserted through the insertion hole (230) toward the interference wall (240) of the substrate mounting portion (200). After being inserted into the insertion hole (230), the interference portion (130) may come into contact with the interference wall (240), and the mounting member (100) and the printed circuit board (50) may be mounted to the substrate mounting portion (200) by interfering with the interference wall (240). At this time, the scratch protrusion (140), which will be described later, may also be inserted through the insertion hole (230) together with the interference portion (130), and the scratch protrusion (140) may come into contact with the interference wall (240).

[0115] The interference wall (240) may be formed parallel to the mounting body (100). Furthermore, the interference wall (240) may be formed parallel to the printed circuit board (50). In this case, the interference portion (130) may move in a direction (M2) parallel to the mounting body (100) and the printed circuit board (50) and interfere with the interference wall (240), and the printed circuit board (50) may slide in the M2 direction and be mounted on the board mounting portion (200). At this time, the scratch protrusion (140) described later may also be inserted into the insertion hole (230) in a direction (M2) parallel to the direction in which the printed circuit board (50) extends and may come into contact with the interference wall (240).

[0116] The interference portion (130) may be configured such that the distance between the bending portion (134) and the mounting body (110) when not interfering with the interference wall (240) is closer than the distance between the bending portion (134) and the mounting body (110) when interfering with the interference wall (240). In another expression, as illustrated in FIGS. 11 and 12, the interference portion (130) may be configured such that the connection portion (131) and the first extension portion (132) are separated when interfering with the interference wall (240). In yet another expression, the angle (a2) between the connection portion (131) and the first extension portion (132) when the interference portion (130) is interfering with the interference wall (240) may be greater than the angle (a1) between the connection portion (131) and the first extension portion (132) when the interference portion (130) is not interfering with the interference wall (240). Accordingly, when the interference part (130) interferes with the interference wall (240), the bending part (134) can press the interference wall (240), and the printed circuit board (50) can be stably mounted on the board mounting part (200).

[0117] As described below, the scratch protrusion (140) may be formed to protrude from the bending portion (134) toward the interference wall (240). At this time, the distance between the scratch protrusion (140) and the mounting body (110) when the interference portion (130) is not interfered with by the interference wall (240) may be arranged to be closer than the distance between the scratch protrusion (140) and the mounting body (110) when the interference portion (130) is interfered with by the interference wall (240).

[0118] The interference portion (130) may be configured to include an elastic material. For example, the interference portion (130) may be configured to include an elastic metal material. Accordingly, the interference portion (130) is capable of elastic deformation and can easily interfere with the interference wall (240).

[0119] As described above, the interference portion (130) may include a first extension portion (132) extending toward the interference wall (240), a bending portion (134) bent at one end of the first extension portion (132) toward the interference wall (240), and a second extension portion (133) extending from the bending portion (134). The second extension portion (133) may extend from the bending portion (134) in a direction away from the interference wall (240).

[0120] Accordingly, even if the mounting body (110) is not sufficiently in contact with the printed circuit board (50) or the printed circuit board (50) is not sufficiently in contact with the mounting surface (210), the second extension part (133) can serve to guide the interference part (130) so that it can be easily inserted into the insertion hole (230). However, it is not limited thereto, and the interference part (130) and the second extension part (133) of the interference part (130) may have various shapes. For example, the second extension part (133) may be bent and extended from the first extension part (132), and may be extended in a direction parallel to the interference wall (240).

[0121] The interference wall (240) may include a conductive layer (240a) configured to include a conductive material and a coating layer (240b, 240c) applied to the outer surface of the interference wall (240).

[0122] The conductive material included in the conductive layer (240a) may include a conductive metal material such as iron (Fe). The coating layers (240b, 240c) are applied to the outside of the conductive layer (240a) to prevent the conductive layer (240a) from corroding.

[0123] The coating layer (240b, 240c) may include a plurality of coating layers (240b, 240c) as shown in FIG. 13, and specifically may include a first coating layer (240b) and a second coating layer (240c) applied to the outside of the first coating layer (240b).

[0124] The first coating layer (240b) and the second coating layer (240c) may include various materials capable of preventing corrosion of the conductive layer (240a). For example, the first coating layer (240b) may be a zinc (Zn) plated layer, and the second coating layer (240c) may be a layer for anti-fingerprint coating, for example, an acrylate coating layer.

[0125] However, it is not limited thereto, and the type of material constituting the coating layer (240b, 240c) is not limited thereto. The coating layer (240b, 240c) does not necessarily have to perform the function of preventing corrosion of the conductive layer (240a) and may be applied to the outer surface of the interference wall (240) for various purposes. In addition, the coating layer (240b, 240c) does not necessarily have to be provided as multiple layers distinct from one another, and the first coating layer (240b) and the second coating layer (240b) may be a single layer of the same type overall.

[0126] When an electronic device (1) performs a function, electromagnetic waves may be generated from the electronic device (1), and these electromagnetic waves may be radiated to other surrounding devices and act as noise that affects the operation of surrounding devices. In other words, this can cause electromagnetic interference (EMI). Furthermore, since electromagnetic waves can also affect the human body, international regulations to prevent this are also being implemented.

[0127] In particular, as illustrated in FIG. 2, the electronic device (1) may include a plurality of printed circuit boards (50) mounted in a case (40), and in order to reduce noise caused by electromagnetic waves, it may be required that the plurality of printed circuit boards (50) form a common ground through the case (40). In this regard, it is very important to improve the degree to which the printed circuit boards (50) are grounded through the case (40).

[0128] In order for the printed circuit board (50) to be grounded to the case (40), the board mounting portion (200) and the mounting member (100) may be configured to include a conductive material. Furthermore, the case (40) may be formed integrally including the board mounting portion (200), and the case (40) may be configured to include a conductive material overall. The conductive material that may be included in the board mounting portion (200) or the mounting member (100) may include a conductive metal material such as iron (Fe). Accordingly, the printed circuit board (50) may be grounded to the board mounting portion (200) through the mounting member (100). Alternatively, the board mounting portion (200) and the mounting bracket (100) may be configured to include a conductive material, and the printed circuit board (50) may be grounded to the board mounting portion (200) through the mounting bracket (100).

[0129] However, when the printed circuit board (50) is mounted on the board mounting portion (200), the interference portion (130) may not be sufficiently in contact with the interference wall (240), and accordingly, the printed circuit board (50) may not be sufficiently grounded to the case (40). Alternatively, the degree of contact between the interference portion (130) and the interference wall (240) may not be uniform, so a variation may occur in the degree to which the printed circuit board (50) is grounded to the case (40).

[0130] Alternatively, as described above, the interference wall (240) may include a coating layer (240b, 240c) applied to the outer surface, and the coating layer (240b, 240c) may be configured to include a non-conductive material. Therefore, even when the interference portion (130) of the mounting member (100) comes into contact with the interference wall (240), there is a possibility that the printed circuit board (50) may not be sufficiently grounded to the case (40) by the coating layer (240b, 240c).

[0131] To solve such problems, the mounting member (100) may include a scratch projection (140) formed to protrude from the interference portion (130). Alternatively, the mounting bracket (100) may include a scratch projection (140) formed to protrude from the interference portion (130).

[0132] The scratch protrusion (140) may be formed to protrude from the interference portion (130) toward the interference wall (240) when the printed circuit board (50) is mounted on the board mounting portion (200). The scratch protrusion (140) may be provided to contact the interference wall (240) and may be provided to scratch the outer surface of the interference wall (240) when the interference portion (130) interferes with the interference wall (240).

[0133] Specifically, when the interference portion (130) moves in the M2 direction and is inserted into the insertion hole (230), the scratch protrusion (130) may also move in the M2 direction together with the interference portion (130) and be inserted into the insertion hole (230). When the interference portion (130) interferes with the interference wall (240), the scratch protrusion (140) may also interfere with the interference wall (240). In other words, the interference portion (130) is slidably moved in a direction parallel to the direction in which the printed circuit board (50) extends and is slidably moved against the interference wall (240) so that the printed circuit board (50) can be mounted on the case (40), and at this time, the scratch protrusion (140) may also slide in the same direction relative to the interference wall (240).

[0134] The scratch protrusion (140) can penetrate the coating layer (240b, 240c) when the interference portion (130) interferes with the interference wall (240). At this time, the scratch protrusion (140) can penetrate the coating layer (240b, 240c) and come into contact with the inner side of the coating layer (240b, 240c) of the interference wall (240). That is, the scratch protrusion (140) can penetrate the coating layer (240b, 240c) and come into contact with the conductive layer (240a).

[0135] At least a portion of the coating layer (240b, 240c) may be removed by the scratch projection (140) when the interference portion (130) interferes with the interference wall (240). Alternatively, at least a portion of the coating layer (240b, 240c) may be removed when the scratch projection (140) slides against the interference wall (240), and a scratch (S) may be formed on the outer surface of the interference wall (240) so that the conductive layer (240a) is exposed to the outside. The scratch (S) may be formed along the direction in which the scratch projection (140) moves on the interference wall (240).

[0136] With this configuration, the coating layer (240b, 240c) of the interference wall (240) can be removed by the scratch protrusion (140), and the degree to which the printed circuit board (50) is grounded to the board mounting portion (200) through the mounting member (100) can be improved. Furthermore, the degree to which the mounting member (100) is bonded to the interference wall (240) can be improved by the scratch protrusion (140). In other words, the mounting bracket (100) includes the scratch protrusion (140) so that the degree to which the mounting bracket (100) is bonded to the interference wall (240) and the degree to which the printed circuit board (50) is grounded to the board mounting portion (200) can be improved.

[0137] Additionally, the scratch protrusion (140) can selectively remove the coating layer (240b, 240c) and form a scratch (S) on the portion of the interference wall (240) that interferes with the interference portion (130) and the scratch protrusion (140) that contacts the scratch protrusion (140). Accordingly, the coating layer (240b, 240c) that remains unremoved can prevent the conductive layer (240a) from being damaged by corrosion or the like.

[0138] Below, the shape of the scratch protrusion (140) is described in more detail.

[0139] The scratch protrusion (140) may be formed to protrude from the interference portion (130) so as to be able to contact the interference wall (240). Specifically, the scratch protrusion (140) may be positioned between the first extension portion (132) and the second extension portion (133). Alternatively, the scratch protrusion (140) may be positioned on the bending portion (134) and may be formed to protrude from the bending portion (134) toward the interference wall (240). However, it is not limited thereto, and the scratch protrusion (140) may be formed in various ways as long as it protrudes from the interference portion (130) and can be able to contact the interference wall (240).

[0140] The interference portion (130) may include a through hole (135) formed to face the interference wall (240). The through hole (135) may be formed in the bending portion (134). At this time, a scratch protrusion (140) may be formed around the through hole (135). Specifically, the scratch protrusion (140) may be formed along the perimeter of the through hole (135) and may have a shape in which the inner side is penetrated along the direction protruding from the interference portion (130). In other words, the scratch protrusion (140) may have a hollow that penetrates in the direction facing the interference wall (240). The hollow of the scratch protrusion (140) may extend from the through hole (135) toward the interference wall (240). In other words, the scratch protrusion (140) may be formed to include a shape similar to a cylinder shape with a hollow.

[0141] The inner surface of the scratch protrusion (140) may be formed integrally with the outer circumference of the through hole (135). That is, the scratch protrusion (140) is formed along the outer circumference of the through hole (135), and the inner surface of the scratch protrusion (140) may be formed to protrude from the outer circumference of the through hole (135) toward the interference wall (240).

[0142] Furthermore, the scratch protrusion (140) may be formed integrally with the interference portion (130). However, it is not limited thereto, and the scratch protrusion (140) may be formed separately from the interference portion (130) and then combined with the interference portion (130).

[0143] As shown in FIG. 2, when the printed circuit board (50) is positioned at the rear of the bottom chassis (40), the scratch protrusion (140) may protrude from the front of the bottom chassis (40) toward the rear. However, it is not limited thereto, and the scratch protrusion (140) may be formed in various ways depending on the arrangement relationship between the printed circuit board (50) and the bottom chassis (40) and the method in which the printed circuit board (50) is mounted on the bottom chassis (40).

[0144] With the above configuration, the mounting member (100) includes a scratch projection (140) provided to scratch the outer wall of the interference wall (240) when the interference part (130) interferes with the interference wall (240), thereby improving the bonding force or contact force between the mounting member (100) and the interference wall (240) and improving the degree to which the printed circuit board (50) is grounded to the case (40). Alternatively, the mounting bracket (100) includes a scratch projection (140) provided to scratch the outer wall of the interference wall (240) when the interference part (130) interferes with the interference wall (240), thereby improving the bonding force or contact force between the mounting bracket (100) and the interference wall (240) and improving the degree to which the printed circuit board (50) is grounded to the case (40).

[0145] However, the configuration of the scratch protrusion (140) is not limited to the above description, and the scratch protrusion (140) may be formed to have various configurations that protrude from the interference portion (130) and scratch the outer surface of the interference wall (240) of the substrate mounting portion (200).

[0146] FIGS. 15 and 16 are drawings briefly illustrating the process of forming a scratch protrusion of an electronic device according to one embodiment of the present disclosure.

[0147] Referring to FIGS. 15 and 16, the scratch protrusion (140) can be manufactured by applying pressure to a part of the interference portion (130) using a tool (T) having a sharp tip. That is, the scratch protrusion (140) can be manufactured by burring.

[0148] As shown in FIG. 15, the tool (T) for manufacturing the scratch protrusion (140) can first be positioned between the first extension (132) and the second extension (133). That is, prior to manufacturing the scratch protrusion (140), the tool (T) can be positioned at the bending part (134).

[0149] The tip of the tool (T) is positioned on one side of the bending portion (134) and can move in the D1 direction as shown in FIG. 16 and penetrate the bending portion (134). The one side of the bending portion (134) referred to here may refer to the side opposite to the interference wall (240) when the interference portion (130) interferes with the interference wall (240) in a direction opposite to the direction in which the scratch projection (140) protrudes from the interference portion (130). That is, the D1 direction, which is the direction in which the tool (T) moves, may be a direction parallel to the direction in which the scratch projection (140) protrudes from the interference portion (130).

[0150] When the tool (T) moves in the D1 direction and penetrates the bending portion (134), a through hole (135) may be formed in the bending portion (134). At the same time, at least a portion of the bending portion (134) may be formed to protrude by being pressed by the tool (T) and bent in the D1 direction. That is, the scratch projection (140) may be formed such that at least a portion of the bending portion (130) is pressed to form a through hole (135), and is bent in the D1 direction at the location where the through hole (135) is formed.

[0151] According to this process, the scratch protrusion (140) can be formed to protrude in the direction (D1) in which the interference part (130) is pressed when the through hole (135) is formed by the interference part (130).

[0152] However, unlike as illustrated in FIGS. 15 and 16, the scratch protrusion (140) may be formed to protrude from a location other than the bending portion (134) of the interference portion (130), and the through hole (135) may be formed at a location other than the bending portion (134) on the interference portion (130). In this case, the tool (T) may press against a location other than the bending portion (134) of the interference portion (130) to penetrate the interference portion (130) and form the scratch protrusion (140).

[0153] The shape and size of the scratch protrusion (140) may vary depending on the type of tool (T), the travel distance of the tool (T), the degree of pressure applied to the interference part (130), etc. This is also the case for the through hole (135) formed in the interference part (130).

[0154] When the scratch protrusion (140) is manufactured according to this method, material costs and processing time can be reduced compared to the case where the scratch protrusion (140) is manufactured separately and attached to the interference part (130).

[0155] However, the description in FIGS. 15 and 16 is merely an example of a method for manufacturing a scratch protrusion (140) in a mounting member (100) of an electronic device (1) according to the concept of the present disclosure, and the scratch protrusion (140) can be manufactured in various ways.

[0156] FIG. 17 is a drawing illustrating a mounting member of an electronic device according to another embodiment of the present disclosure. FIG. 18 is a drawing illustrating the mounting member of FIG. 17 viewed from a different direction.

[0157] With reference to FIGS. 17 and 18, a mounting member of an electronic device according to another embodiment of the present disclosure will be described. In describing the embodiment illustrated in FIGS. 17 and 18, the same reference numerals may be assigned to configurations identical to those illustrated in FIGS. 1 to 16, and descriptions may be omitted.

[0158] Referring to FIGS. 17 and 18, the mounting member (1000) may include a plurality of scratch protrusions (140). Alternatively, the mounting bracket (1000) may include a plurality of scratch protrusions (140).

[0159] A plurality of scratch protrusions (140) may each be formed to protrude from the interference portion (130). Specifically, a plurality of scratch protrusions (140) may each be formed to protrude from the bending portion (134). However, this is not limited thereto, and at least some of the plurality of scratch protrusions (140) may be formed in various ways, such as protruding from the bending portion (134) and at least some of the others protruding from different locations of the interference portion (130).

[0160] A plurality of scratch protrusions (140) may be spaced apart from each other. However, this is not limited thereto, and a plurality of scratch protrusions (140) may be arranged to be in contact with each other.

[0161] A plurality of scratch protrusions (140) may be provided to scratch the outer surface of the interference wall (240) when the interference portion (130) comes into contact with the interference wall (240). Each of the plurality of scratch protrusions (140) may penetrate the coating layer (240b, 240c) and may come into contact with the conductive layer (240a) by removing the coating layer (240b, 240c) applied to the outer surface of the interference wall (240). Alternatively, the plurality of scratch protrusions (140) may each form a scratch (S), and a plurality of scratches (S) may be formed on the interference wall (240). However, this is not limited thereto, and when the plurality of scratch protrusions (140) are arranged to come into contact with each other, the plurality of scratch protrusions (140) may slide against the interference wall (240) to form one large scratch (S).

[0162] A plurality of scratch protrusions (140) can each be manufactured by burring as shown in FIGS. 15 and FIGS. 16. However, this is not limited thereto, and a plurality of scratch protrusions (140) can be manufactured in various ways.

[0163] Although FIGS. 17 and 18 illustrate a mounting member (1000) that includes two scratch protrusions (140), it is not limited thereto, and the mounting member (1000) may include three or more scratch protrusions (140). The number of scratch protrusions (140) provided on the mounting member (1000) can be selected in various ways, and depending on the number of scratch protrusions (140), the degree to which the printed circuit board (50) is coupled to the board mounting portion (200) and the degree to which it is grounded by the mounting member (1000) may vary. In other words, the number of scratch protrusions (140) formed on the mounting bracket (1000) can be selected in various ways, and accordingly, the degree to which the printed circuit board (50) is coupled to the board mounting portion (200) and the degree to which it is grounded may vary.

[0164] Specific embodiments have been illustrated and described above. However, the invention is not limited to the embodiments described above, and those skilled in the art may make various modifications without departing from the essence of the technical concept of the invention as described in the following claims. Explanation of the symbols

[0165] 1; electronic device, display device 10; Display panel 40; Case 50; printed circuit board 51; Substrate through-hole 52; Support hole 53; Fixing hole 54a, 54b; Guide hole 100; mounting member, mounting bracket 110; Mounting body, bracket body 111; support part 120; fixing part, fixing pin 130; interference part 131; connection part 132; 1st extension part 133; 2nd extension part 134; Bending part 135; Through hole 140; scratch protrusion 200, 202; substrate mounting part 201; Substrate guide section 210; seating surface 220; inclined surface 230; insertion hole 240; interference wall 240a; conductive layer 240b, 240c; coating layer P; Electronic components S; Scratch

Claims

Claim 1 An electronic device comprising: a printed circuit board on which electronic components are mounted; a case including a board mounting portion including an interference wall on which the printed circuit board is mounted and which includes a coating layer applied to the outer surface; and a mounting member fixed to the printed circuit board and mounting the printed circuit board to the board mounting portion; wherein the mounting member includes an interference portion that interferes with the interference wall and has a through hole formed to face the interference wall; and a scratch projection formed around the through hole, which is provided to protrude from the interference portion and scratch the outer surface of the interference wall when the interference portion interferes with the interference wall, and wherein at least a portion of the coating layer is removed by the scratch projection when the interference portion interferes with the interference wall. Claim 2 In claim 1, the scratch protrusion is an electronic device that penetrates the coating layer. Claim 3 delete Claim 4 In paragraph 2, the interference wall further comprises a conductive layer configured to include a conductive material and covered by the coating layer, and the scratch protrusion is an electronic device in contact with the conductive layer. Claim 5 An electronic device according to claim 1, wherein the substrate mounting portion includes an insertion hole formed to allow the interference portion and the scratch protrusion to be inserted, and the scratch protrusion is inserted into the insertion hole and contacts the interference wall. Claim 6 An electronic device according to claim 5, wherein the insertion hole is formed to be open in a direction parallel to the direction in which the printed circuit board extends, and the scratch protrusion is inserted into the insertion hole in a direction parallel to the direction in which the printed circuit board extends. Claim 7 In claim 1, the interference portion comprises a first extension portion extending toward the interference wall, a bending portion bent at one end of the first extension portion on the interference wall side, and a second extension portion extending from the bending portion, and the scratch protrusion is an electronic device disposed on the bending portion. Claim 8 In claim 7, the second extension is an electronic device extending from the bending portion so as to move away from the interference wall. Claim 9 In claim 1, the mounting member comprises a mounting body that is seated on one surface of the printed circuit board, a fixing part that extends from the mounting body and connects the mounting member to the printed circuit board, and the interference part is an electronic device that extends from the mounting body to penetrate the printed circuit board. Claim 10 An electronic device according to claim 9, wherein the interference wall is formed parallel to the mounting body, and the distance between the scratch protrusion and the mounting body when the interference part is not interfered with by the interference wall is shorter than the distance between the scratch protrusion and the mounting body when the interference part is interfered with by the interference wall. Claim 11 delete Claim 12 An electronic device according to claim 1, wherein the inner surface of the scratch protrusion is formed integrally with the outer circumference of the through hole. Claim 13 An electronic device according to claim 1, wherein the scratch projection is formed to protrude in the direction in which the interference portion is pressed when the through hole is machined and formed in the interference portion. Claim 14 An electronic device according to claim 1, wherein the interference portion is configured to include an elastic material. Claim 15 An electronic device according to claim 1, wherein the substrate mounting portion and the mounting member are configured to include a conductive material. Claim 16 A mounting bracket provided for coupling a printed circuit board, on which electronic components are mounted, to a case including an interference wall having a coating layer applied to its outer surface, comprising: a bracket body provided to be seated on one surface of the printed circuit board; a fixing pin extending from the bracket body and provided to be fixed to the printed circuit board; an interference portion provided to be interfered with by the interference wall so that the mounting bracket is coupled to the case and includes a through hole formed to face the interference wall; and a scratch projection formed protruding from the circumference of the through hole to scratch the outer surface of the interference wall when the interference portion interferes with the interference wall; wherein at least a portion of the coating layer is removed by the scratch projection when the interference portion interferes with the interference wall. Claim 17 In claim 16, the above scratch protrusion is a mounting bracket that contacts the inner side of the coating layer of the interference wall when the interference portion interferes with the interference wall. Claim 18 In claim 17, the interference portion is slidably moved in a direction parallel to the direction in which the printed circuit board extends and is slidably moved against the interference wall so that the printed circuit board can be mounted in the case, and the mounting bracket is provided such that at least a portion of the coating layer is removed when the scratch protrusion slides against the interference wall. Claim 19 A display device comprising: a display panel that displays an image forward; a bottom chassis including a substrate mounting portion disposed at the rear of the display panel and including an interference wall having a coating layer applied to its outer surface; a printed circuit board on which electronic components are mounted and which is supported by the bottom chassis; and a mounting member that detachably mounts the printed circuit board to the substrate mounting portion; wherein the mounting member comprises: a fixing portion fixed to the printed circuit board; an interference portion including a through hole formed to face the interference wall and which interferes with the substrate mounting portion so that the mounting member is coupled to the bottom chassis; and a scratch projection formed around the through hole and arranged to scratch the outer surface of the substrate mounting portion when the interference portion interferes with the substrate mounting portion; and wherein at least a portion of the coating layer is removed by the scratch projection when the interference portion interferes with the interference wall. Claim 20 In claim 19, the printed circuit board is positioned at the rear of the bottom chassis, and the scratch protrusion is a display device protruding from the front of the bottom chassis toward the rear.

Images