Switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, and its control method

Abstract

A switchboard capable of predicting insulation degradation and tracking arc locations based on optical sensors, and a control method thereof are disclosed. The switchboard capable of predicting insulation degradation and tracking arc locations based on optical sensors comprises: one or more optical sensors arranged to detect optical signals generated within the switchboard; and a processor that determines the state of insulation degradation based on the optical signals received from the optical sensors and calculates the location of the arc when an arc occurs. Accordingly, by determining the state of insulation degradation based on optical signals, the effect of detecting insulation degradation at an early stage is achieved compared to conventional current and / or temperature-based methods.

Description

Technology Field

[0001] The present invention relates to a switchboard capable of predicting insulation degradation and tracking arc locations based on optical sensors, and a control method thereof. More specifically, the invention relates to a switchboard capable of predicting insulation degradation and tracking arc locations based on optical sensors and a control method thereof, which uses optical signals generated inside the switchboard to predict the state of insulation degradation and track the location of an arc when it occurs. Background Technology

[0003] A distribution panel is a facility that performs power distribution and control.

[0004] The interior of such switchboards contains various electrical components, including busbars, circuit breakers, cable connections, and insulating insulators. Insulation degradation may occur in these components due to prolonged operation, and if this degradation progresses, electrical anomalies such as partial discharge, corona discharge, and arc discharge may occur.

[0005] Conventionally, sensing technologies based on current, temperature, or voltage were primarily used to detect abnormal conditions inside switchboards. However, these methods were mostly reactive responses that detected abnormalities after they occurred, and had limitations in detecting insulation degradation in advance during its early stages.

[0006] In addition, conventional technology had the problem of increasing time and costs during maintenance and inspection because it was difficult to pinpoint the exact location of an arc even when it occurred.

[0007] Accordingly, there has been an increased need for technology capable of predicting insulation degradation using optical signals generated inside the switchboard and tracking the location of arcs when they occur. Prior art literature

[0009] Korean Registered Patent No. 10-1495058 (Published on Feb. 26, 2015) The problem to be solved

[0010] The objective of the present invention is to provide a switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, and a control method thereof, which can predict the state of insulation degradation in advance using optical signals generated inside the switchboard, accurately calculate the location of an arc when it occurs, and further predict potential fault locations by analyzing the progression of insulation degradation. means of solving the problem

[0012] A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking according to one embodiment of the present invention for achieving such an objective comprises: one or more optical sensors arranged to detect an optical signal generated inside the switchboard; and a processor that determines the insulation degradation state based on the optical signal received from the optical sensors and calculates the location of the arc when an arc occurs.

[0013] The above processor is characterized by determining the insulation degradation state based on at least one of the number of discharges, discharge energy, and discharge interval of the optical signal.

[0014] The above processor is characterized by calculating the position of the arc based on the difference in light intensity detected by one or more light sensors.

[0015] The processor is characterized by calculating the relative position of the arc based on the characteristic that the light intensity is inversely proportional to the square of the distance.

[0016] The above optical sensor is characterized by being positioned at least one of a busbar connection part, a circuit breaker terminal part, a cable connection part, and an insulating insulator.

[0017] The above-mentioned optical sensor is characterized by being arranged in a matrix form.

[0018] The above matrix-shaped optical sensor array is characterized by being arranged in multiple locations within the distribution panel.

[0019] It is characterized by further including a display unit configured to visually display the insulation degradation state and arc location.

[0020] The invention further includes an electric field sensor for measuring the electric field distribution inside the switchboard, and the processor determines the insulation degradation state based on data received from the optical sensor and the electric field sensor, calculates the location of the arc when an arc occurs, and determines the progress state of insulation degradation by analyzing the change in data of the optical sensor and the electric field sensor over time.

[0021] The above processor is characterized by calculating a direction vector representing the spatial movement of insulation degradation based on changes in measurement values ​​of a plurality of optical sensors and / or electric field sensors over time.

[0022] The above processor is characterized by calculating the rate of progression of insulation degradation based on the magnitude of the direction vector.

[0023] The above processor is characterized by determining the insulation degradation state by correlating optical sensor data and electric field sensor data.

[0024] The above processor is characterized by generating a reference value based on initial operation data or normal state data, and determining whether insulation degradation has occurred by comparing it with the reference value.

[0025] The above processor is characterized by storing insulation degradation status and arc occurrence history, and predicting potential fault locations based on this.

[0026] Meanwhile, a control method in a switchboard capable of predicting insulation degradation and tracking arc location based on an optical sensor according to one embodiment of the present invention comprises: receiving an optical signal generated inside the switchboard detected by one or more optical sensors; determining an insulation degradation state based on the optical signal; and calculating the location of the arc based on the optical signal when an arc occurs. Effects of the invention

[0028] According to various embodiments of the present invention as described above, by determining the insulation degradation state based on an optical signal, there is an effect of detecting insulation degradation early compared to conventional current and / or temperature-based methods.

[0029] In addition, by calculating the location of the arc using the difference in light intensity detected by one or more optical sensors, it is possible to accurately determine the location of the arc occurrence.

[0030] In addition, by analyzing the changes in data from the optical sensor and electric field sensor over time to determine the progression of insulation degradation and calculating its direction and speed, it is possible to predict potential failure locations in advance.

[0031] In addition, by combining optical sensors and electric field sensors for analysis, it is possible to improve the accuracy of determining insulation degradation.

[0032] In addition, it is possible to predict the timing of equipment maintenance based on insulation degradation status and arc occurrence history, which has the effect of improving maintenance efficiency. Brief explanation of the drawing

[0034] FIG. 1 is a diagram illustrating the configuration of a switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking according to one embodiment of the present invention. FIG. 2 is a flowchart illustrating a control method for a switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking according to an embodiment of the present invention. FIG. 3 is a block diagram showing the specific configuration of a switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking as illustrated in FIG. 1 according to one embodiment of the present invention. FIG. 4 is a drawing relating to a software module stored in a storage unit according to an embodiment of the present invention. Specific details for implementing the invention

[0035] The present invention will be described in more detail below with reference to the drawings. Furthermore, in describing the present invention, specific descriptions of related known functions or configurations are omitted if it is determined that such detailed descriptions would unnecessarily obscure the essence of the invention. Additionally, the terms described below are defined considering their functions in the present invention, and these may vary depending on the intentions or relationships of the user or operator. Therefore, their definitions should be based on the content throughout this specification.

[0036] FIG. 1 is a diagram illustrating the configuration of a switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking according to one embodiment of the present invention.

[0037] Referring to FIG. 1, a switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking according to one embodiment of the present invention includes an optical sensor (110) and a processor (120).

[0038] The optical sensor (110) may be configured to detect an optical signal generated inside the distribution board, and one or more may be installed. In this case, the optical sensor (110) may be configured, for example, as an infrared (IR) sensor, an ultraviolet (UV) sensor, and / or a combination thereof.

[0039] According to an embodiment, the optical sensor (110) can detect an optical signal generated by partial discharge, corona discharge and / or arc discharge occurring at a specific point inside the distribution board.

[0040] Additionally, one or more optical sensors (110) may be installed, and an optical signal of the entire distribution board may be detected using a single sensor, or an optical signal may be detected at spatially distributed locations using multiple sensors.

[0041] Meanwhile, the optical sensor (110) may be placed at least one of the busbar connection part, the circuit breaker terminal part, the cable connection part, and the insulating insulator. For example, the optical sensor (110) may be placed at a location where insulation degradation is likely to occur.

[0042] According to the embodiment, the optical sensor (110) is positioned around the busbar connection part to detect ultraviolet signals generated by micro-discharges occurring at the connection part. Additionally, the optical sensor (110) may be positioned near the circuit breaker terminal part to detect optical signals generated by contact degradation. Furthermore, the optical sensor (110) may be positioned around the cable connection part and / or the insulating insulator to detect optical signals resulting from surface discharge and / or insulation degradation. In this way, the optical sensor (110) is selectively positioned at a location where insulation degradation is highly likely to occur, thereby enabling more sensitive detection of degradation phenomena in the early stages.

[0043] In addition, the optical sensors (110) can be arranged in a matrix form.

[0044] At this time, the optical sensor (110) can be arranged in a matrix form on a transparent protective cover (not shown) that covers the upper part of the busbar, etc. inside the distribution board to prevent the risk of electric shock.

[0045] Meanwhile, according to an embodiment, the optical sensor (110) can be mounted on a transparent flexible PCB, and the PCB can be surrounded by a filler having insulating properties.

[0046] In addition, the above-described optical sensor (110) may be configured such that it is placed between transparent insulating plates, thereby being protected by the transparent insulating plates and thus protected from the external environment, while allowing an optical signal to reach the sensor. With such a structure, the optical sensor (110) can effectively detect an optical signal generated from an electrical anomaly inside the distribution board, while simultaneously maintaining insulation and protection functions.

[0047] According to an embodiment, a plurality of optical sensors (110) may be arranged in a two-dimensional array to cover a specific area inside a switchboard. For example, the plurality of optical sensors (110) may be arranged in a grid structure such as a 3x3, 5x5 and / or 10x10 shape. With this matrix arrangement, each sensor can detect an optical signal at a different location inside the switchboard, and the processor (120) can determine the spatial distribution of the optical signal by comparing and analyzing the optical signals received from each sensor.

[0048] According to one embodiment, the optical sensor (110) may be arranged in a 6x9 matrix form as shown in FIG. 5.

[0049] Referring to FIG. 5, a plurality of optical sensors (110) may be arranged in a matrix form on a protective cover (510) provided to protect the inside of the distribution board, and each optical sensor may be configured to detect an optical signal generated inside the distribution board.

[0050] At this time, the optical sensors (110) can be arranged in horizontal and vertical directions to form a two-dimensional matrix structure. For example, the optical sensors (110) can be arranged in rows A through I and columns 1 through 6, and can be composed of a total of 54 sensors. Here, each optical sensor detects an optical signal generated at a different location inside the switchboard, thereby allowing for precise determination of the spatial state inside the switchboard.

[0051] Meanwhile, the processor (120) can sequentially scan multiple optical sensors (110) to collect the measurement values ​​of each sensor.

[0052] In one embodiment, the processor (120) may operate in a scanning manner to sequentially read data from sensor A1 to sensor I6. At this time, the data received from each sensor may be repeatedly updated at a preset period.

[0053] The processor (120) can generate a heatmap based on the light signal values ​​collected from each light sensor (110).

[0054] Specifically, as illustrated in FIG. 6, the heatmap can visually represent the internal state of the distribution panel by converting the magnitude of the light signal corresponding to each sensor location into color and / or density.

[0055] For example, areas with high light signal intensity may be displayed in a high-density red color scheme, and areas with low intensity may be displayed in a low-density red color scheme and / or a yellow color scheme. Additionally, the processor (120) may overlay the generated heatmap with an image simulating the inside of the distribution panel and output it through a display unit (e.g., a display unit) (not shown). At this time, the image output through the display unit, that is, the image obtained by overlaying the heatmap and the image simulating the inside of the distribution panel, may be as shown in FIG. 7. Meanwhile, the display unit may be configured on one side of the outside of the distribution panel, such as an LCD, to output the above-described image.

[0056] In one embodiment, the processor (120) may display an overlapping history of abnormal conditions based on sensor data accumulated over time. That is, locations where abnormal conditions occur repeatedly may be displayed with a gradually increasing intensity of color, thereby allowing for the intuitive identification of areas with a high probability of accidents.

[0057] Additionally, the optical sensors (110) arranged in a matrix form may be positioned so that the spacing between the sensors is maintained at a constant level so that specific areas inside the distribution board can be monitored in detail.

[0058] Meanwhile, the matrix-shaped optical sensor (110) array can be arranged in multiple locations within the distribution board.

[0059] According to the embodiment, the first matrix array may be placed in the busbar area, the second matrix array may be placed in the circuit breaker area, and the second matrix array may be placed in the cable connection area. Additionally, each matrix array may have different densities, and the optical sensor (110) may be placed at a relatively high density in the area where insulation degradation is likely to occur.

[0060] In addition, each matrix array can be fixed to the front, side, and / or internal structure of the power distribution unit and positioned to detect optical signals from different directions.

[0061] As described above, by means of the matrix array optical sensors (110) and the sensor structures placed at multiple locations, the processor (120) described later can calculate the location of arc occurrence by analyzing the difference in light intensity detected by each sensor. In particular, when multiple matrix arrays are placed at different locations, the processor (120) may estimate the three-dimensional location of the arc based on optical signals received from multiple directions.

[0062] The processor (120) can determine the insulation degradation state based on the optical signal received from the optical sensor (110) and calculate the location of the arc when an arc occurs. At this time, the intensity of the optical signal can be output as a digital value (e.g., an ADC value within the range of 0 to 1023).

[0063] The processor (120) receives optical signal data from each optical sensor (110) at a preset periodic interval and can determine the insulation degradation status based on the data.

[0064] For example, the processor (120) may determine that the optical signal intensity is in the range of 0 to 100, the optical signal intensity is in the range of 100 to 200, the optical signal intensity is in the initial deterioration state, and the optical signal intensity is 200 or more, the optical signal intensity is in the advanced deterioration state.

[0065] Additionally, the processor (120) can determine that arc occurrence is high when the optical signal from a specific sensor increases rapidly, and can calculate the location of arc occurrence using the signal difference between multiple sensors.

[0066] According to an embodiment, the processor (120) can determine the insulation degradation state by analyzing the intensity, frequency of occurrence, and / or temporal change of the optical signal received from the optical sensor (110).

[0067] More specifically, the processor (120) may determine that the optical signal intensity is in the range of 0 to 100, the optical signal intensity is in the range of 100 to 200, the optical signal intensity is in the initial deterioration state, and the optical signal intensity is 200 or higher, the optical signal intensity is in the advanced deterioration state.

[0068] Additionally, the processor (120) can count the number of times the intensity of the optical signal exceeds a threshold value during a certain time interval. At this time, if it occurs 2 or fewer times in 10 seconds, it can be determined as a normal state; if it occurs 3 to 10 times in 10 seconds, it can be determined as a partial discharge state; and if it occurs 10 or more times in 10 seconds, it can be determined as an insulation degradation progress state. Additionally, if a discharge event occurs repeatedly at the same location, the processor (120) can determine that location as a degradation occurrence area. Here, a discharge event may refer to a case where an optical signal generated by an electrical discharge phenomenon, such as partial discharge, corona discharge, and / or arc discharge caused by insulation degradation inside a switchboard, satisfies a preset condition.

[0069] Additionally, the processor (120) may determine that insulation degradation is in progress if the average value of the optical signal gradually increases over time. Additionally, the processor (120) may determine that the rate of degradation progression is increasing if the interval between discharge events gradually decreases.

[0070] The processor (120) determines that the optical signal is in a normal state when it is below a reference value, and determines that partial discharge and / or insulation degradation is in progress when the optical signal is repeatedly detected above a certain level.

[0071] Additionally, the processor (120) can determine whether an arc has occurred by comparing and analyzing signals received from a plurality of optical sensors (110), and calculate the location when an arc has occurred.

[0072] For example, four light sensors (110) may be placed at different locations inside the distribution board, and the light intensity measured by each sensor may be different. Here, the light intensity of sensor A may be 800, the light intensity of sensor B may be 600, the light intensity of sensor C may be 200, and the light intensity of sensor D may be 100. At this time, the processor (120) may determine that an arc has occurred near sensor A, which shows the highest value. Additionally, the processor (120) may correct the arc location to exist between sensor A and sensor B by considering the difference in value between sensor A and B.

[0073] In this way, the processor (120) can calculate the arc position using an interpolation method by using the ratio of light intensity for each sensor, and if sensor coordinates are stored in advance, it can calculate the 2D and / or 3D position of the arc using the coordinates.

[0074] Additionally, the processor (120) may determine that an arc has occurred if a rapid increase in light signals is detected simultaneously in multiple sensors within a certain period of time.

[0075] Meanwhile, the processor (120) may comprehensively determine the insulation degradation state by combining the intensity of the optical signal, the frequency of occurrence, and / or the temporal change. For example, the processor (120) may determine that the insulation degradation is progressing rapidly if the intensity of the optical signal is at an intermediate level (e.g., 150 to 200), the frequency of occurrence is high (e.g., 12 occurrences within 10 seconds), and the temporal change is on an increasing trend.

[0076] Meanwhile, the aforementioned optical signal intensity criteria, occurrence frequency criteria, and temporal change analysis methods can be set in various ways depending on the structure of the distribution panel, sensor characteristics, and operating environment.

[0077] The processor (120) can determine the insulation degradation state based on at least one of the number of discharges of the optical signal, the discharge energy, and the discharge interval.

[0078] For example, the processor (120) can determine the insulation degradation state by counting the number of discharge events detected during a preset time interval. More specifically, the processor (120) can calculate the degradation index as 1 if 2 discharges occur during 10 seconds, calculate the degradation index as 3 if 5 discharges occur during 10 seconds, and calculate the degradation index as 5 if 10 discharges occur during 10 seconds. That is, the degradation index can be calculated to increase in proportion to the number of discharges.

[0079] At this time, the processor (120) can determine that insulation softening is in progress if the number of discharges exceeds a preset threshold number (e.g., 9 times).

[0080] Additionally, the processor (120) can estimate the discharge energy based on the light intensity of each discharge event and determine the insulation degradation state based on this.

[0081] For example, if there are optical signals with light intensities of 200, 300, and 250 for 10 seconds, the energy for each may be 40,000, 90,000, and 62,500, which are the squares of the intensity, and the total discharge energy may be 192,500. At this time, the processor (120) may determine that an insulation degradation state has progressed if the total discharge energy exceeds a preset threshold.

[0082] Additionally, the processor (120) can determine the insulation degradation state by analyzing the time interval between discharge events. For example, if discharge events occur at t1, t2, t3, and t4 seconds respectively, and the interval between each time interval is 1.5 seconds (between t1 and t2), 0.5 seconds (between t2 and t3), and 0.3 seconds (between t3 and t4), the interval between discharges gradually decreases, and the processor (120) can determine that the insulation degradation is in progress. Additionally, the processor (120) can determine that the degradation state is in progress even if the average discharge interval decreases to a preset reference value (e.g., 1 second or less).

[0083] According to an embodiment, the processor (120) can count the number of discharge events detected during a certain period of time, estimate the discharge energy based on the light intensity of each discharge event, and analyze the time interval between discharge events.

[0084] For example, the processor (120) can continuously sample the optical signal received from the optical sensor (110) during a preset time interval. At this time, the processor (120) can define the point in time when three of the optical signals exceed a preset threshold as a single discharge event.

[0085] Additionally, the processor (120) can analyze the time interval between discharge events and determine the density of discharge occurrences using the analyzed time interval. At this time, it can be determined that the insulation deterioration progresses as the interval between discharges becomes shorter.

[0086] According to another embodiment, the processor (120) can analyze discharge events using a sliding window method. For example, the number of discharges and discharge energy for each interval can be calculated by moving a time window of 10 seconds in increments of 1 second. In this case, if a pattern is detected in which the number of discharges increases rapidly or the interval between discharges decreases in a specific interval, the processor (120) can determine that the insulation degradation is progressing rapidly.

[0087] The processor (120) can calculate the location of the arc based on the difference in light intensity detected by one or more light sensors.

[0088] The processor (120) can estimate the location of an arc occurrence based on the sensor that detected the highest light intensity by comparing the light intensity measured at each of the plurality of light sensors (110).

[0089] According to an embodiment, the processor (120) can calculate the location of the arc using an interpolation method by utilizing the relative ratio of light intensity between each sensor. That is, the location of the arc can be calculated by determining that if the arc is close to sensor A, the reception intensity of A is high, and if the arc is close to sensor B, the reception intensity of B is high.

[0090] Additionally, the processor (120) may calculate a more precise location by analyzing the light intensity distribution between adjacent sensors when the sensor array is configured in a matrix form.

[0091] At this time, the processor (120) can calculate the relative position of the arc based on the characteristic that light intensity is inversely proportional to the square of the distance.

[0092] In other words, the processor (120) can calculate the relative distance to the arc generation location from the light intensity values ​​measured at each sensor by utilizing the physical characteristic that the light intensity is inversely proportional to the square of the distance from the light source.

[0093] According to an embodiment, the processor (120) can calculate the position of the arc using a triangulation method with distance information calculated from a plurality of sensors.

[0094] Additionally, if the placement coordinates between the sensors are stored in advance, the processor (120) may calculate the absolute position of the arc using the coordinates.

[0095] Meanwhile, it may further include a display unit (not shown) configured to visually display the insulation degradation state and arc location.

[0096] At this time, the display unit can display the arc location or deterioration status in the form of an image on a screen simulating the interior of the distribution panel.

[0097] According to an embodiment, the display unit may be composed of a display device and may provide a graphic interface that simulates the internal structure of a switchboard.

[0098] The processor (120) can display the arc occurrence location in the form of a dot and / or an icon on the display unit described above, and can display the insulation degradation state by expressing it as a change in color and / or a change in density on the display unit described above. In addition, the change in the degradation state over time may be displayed in the form of an animation.

[0099] Additionally, the processor (120) may generate a risk map that expresses the risk level as a color intensity by accumulating a history of abnormal occurrences over time. At this time, this risk map may be displayed through a display unit.

[0100] Meanwhile, the processor (120) may accumulate and store abnormal conditions occurring inside the distribution board over time.

[0101] The processor (120) can analyze the location and frequency of occurrence of abnormal conditions that occur periodically and / or non-periodically, and based on this, can visually represent the risk level inside the switchboard. Specifically, the processor (120) can superimpose the location where the abnormal condition occurred onto a screen simulating the inside of the switchboard, and can represent it using different colors and / or densities depending on the frequency or intensity of the abnormal condition. For example, locations where abnormal conditions occur frequently may be displayed with high densities and / or red tones, while locations with relatively low occurrence frequencies may be displayed with low densities and / or blue tones. The risk map generated in this manner can be accumulated and displayed over time, allowing for an intuitive identification of locations with a high probability of accidents.

[0102] Additionally, the processor (120) can store abnormal state data and risk maps in a log format, and the stored data can be transmitted to an external device. In one embodiment, the data can be transmitted to a remote server and / or management system using Bluetooth Low Energy (BLE), WiFi, or 5G communication methods. Accordingly, the manager can monitor the status of the switchboard remotely in real-time or on a historical basis and take proactive measures for locations with a high probability of failure.

[0103] In addition, it may further include an electric field sensor (not shown) for measuring the electric field distribution inside the switchboard.

[0104] According to an embodiment, a plurality of electric field sensors may be installed inside a switchboard, and each electric field sensor may measure the electric field strength (unit, kV / m) at a specific location inside the switchboard. For example, the electric field sensors may be placed in the busbar area, the circuit breaker area, and / or the cable connection area inside the switchboard, respectively. In addition, the electric field sensors may be arranged in a matrix form to measure the electric field distribution inside the switchboard in a two-dimensional and / or three-dimensional form.

[0105] At this time, the processor (120) determines the insulation degradation state based on data received from the optical sensor and the electric field sensor, calculates the location of the arc when an arc occurs, and can determine the progress state of insulation degradation by analyzing the data of the optical sensor and the electric field sensor over time, that is, the change in data received from the optical sensor and the electric field sensor.

[0106] Here, the progression state of insulation degradation may include the direction and speed of progression of insulation degradation.

[0107] According to the embodiment, the electric field sensor can measure the electric field strength and / or distribution inside the switchboard, and a change in the electric field distribution may occur when insulation degradation occurs.

[0108] According to an embodiment, the processor (120) can simultaneously collect and analyze optical signals and electric field values ​​at the same location. For example, if at a specific location at time t1 the optical intensity is 80 and the electric field strength is 1.5, at time t2 the optical intensity is 120 and the electric field strength is 2.2, at time t3 the optical intensity is 200 and the electric field strength is 3.8, and at time t4 the optical intensity is 350 and the electric field strength is 5.5, the processor (120) determines that an increase in the optical signal and an increase in the electric field strength are occurring simultaneously, and determines that insulation degradation is in progress at that location. Additionally, the processor (120) may perform the same analysis at multiple locations to analyze the pattern of degradation starting at a specific location spreading to other locations.

[0109] For example, assuming that sensors are placed at three different locations A, B, and C inside a distribution board, if the electric field increases at location A at time t1, the electric field and optical signal increase at location B at time t2, and the electric field and optical signal increase at location C at time t3, the processor (120) determines that the degradation is moving in the direction A → B → C and can express this as a direction vector. That is, the processor (120) can calculate that the direction of degradation progression is from A to C.

[0110] Meanwhile, in a normal state, the electric field distribution inside the switchboard can maintain a constant pattern. However, if insulation degradation occurs, an electric field concentration phenomenon may occur at a specific location or the electric field distribution may change non-uniformly. Therefore, the processor (120) can determine whether insulation degradation has occurred by comparing this change in electric field distribution with a reference state.

[0111] As described above, the processor (120) can determine the insulation degradation state by combining optical sensor data and electric field sensor data, and can reduce false detections by analyzing the correlation between the two data. In addition, by simultaneously analyzing changes in the electric field and optical signal over time, it can more accurately determine whether insulation degradation is progressing.

[0112] The processor (120) can calculate a direction vector indicating the spatial movement of insulation degradation based on changes in the measurements of a plurality of optical sensors and / or electric field sensors over time.

[0113] According to an embodiment, the processor (120) can track the movement path of the location where degradation occurred by comparing the distribution of sensor data at different time points. For example, if a sensor location that showed a high value at a specific time point moves to a different location over time, the processor (120) can represent that movement as a vector.

[0114] At this time, the processor (120) can calculate the rate of progression of insulation degradation based on the magnitude of the direction vector.

[0115] According to an embodiment, the processor (120) can calculate the rate of progression of insulation degradation using the length of a direction vector and a time interval. For example, the processor (120) can calculate the rate of progression of insulation degradation as the distance traveled per unit time by calculating the distance traveled by the degradation location over a certain period of time.

[0116] The processor (120) can determine the insulation degradation state by correlating optical sensor data and electric field sensor data.

[0117] According to the embodiment, the processor (120) can determine that there is a high possibility of insulation degradation when an increase in optical signal and a change in electric field occur simultaneously at the same location.

[0118] Additionally, the processor (120) may calculate the correlation coefficient between the two sensor data and determine the deterioration state if it is above a certain threshold.

[0119] The processor (120) can generate a reference value based on initial operation data and / or normal state data and determine whether insulation deterioration has occurred by comparing it with the reference value.

[0120] According to an embodiment, the processor (120) can set a normal state reference value using data collected during the initial operation of the switchboard.

[0121] At this time, the processor (120) can automatically correct the reference value according to changes in the environment.

[0122] According to an embodiment, the processor (120) can automatically correct the reference value according to changes in temperature, humidity and / or external lighting.

[0123] Additionally, the processor (120) may distinguish between arc discharge and abnormal optical noise by analyzing the pattern of the optical signal. That is, the processor (120) may distinguish between arc discharge and external optical noise by analyzing the duration, waveform, and / or repetition pattern of the optical signal.

[0124] The processor (120) stores the insulation degradation status and arc generation history, and can predict the location where a failure may occur based on this.

[0125] According to an embodiment, the processor (120) can store data on the insulation degradation state and / or arc occurrence location over time.

[0126] At this time, the processor (120) can determine that a specific location is a fault risk area if deterioration occurs repeatedly at that location.

[0127] In addition, the processor (120) may analyze the increasing trend of the insulation degradation state to predict the possibility of failure.

[0128] As described above, the present invention has the effect of detecting insulation degradation early compared to conventional current and / or temperature-based methods by determining the insulation degradation state based on optical signals.

[0129] In addition, by calculating the location of the arc using the difference in light intensity detected by one or more optical sensors, it is possible to accurately determine the location of the arc occurrence.

[0130] In addition, by analyzing the changes in data from the optical sensor and electric field sensor over time to determine the progression of insulation degradation and calculating its direction and speed, it is possible to predict potential failure locations in advance.

[0131] In addition, by combining optical sensors and electric field sensors for analysis, it is possible to improve the accuracy of determining insulation degradation.

[0132] In addition, it is possible to predict the timing of equipment maintenance based on insulation degradation status and arc occurrence history, which has the effect of improving maintenance efficiency.

[0133] In summary, the present invention as described above can detect insulation degradation and partial discharge at an early stage based on optical signals, thereby preventing major accidents such as fires or explosions caused by arc discharges. In particular, since switchboards are equipment widely installed in public facilities, industrial facilities, and residential facilities, applying the present invention has the effect of reducing fire accidents that may occur in power facilities and minimizing casualties and property damage resulting therefrom.

[0135] FIG. 2 is a flowchart illustrating a control method for a switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking according to an embodiment of the present invention.

[0136] Referring to FIG. 2, a control method for a switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking according to one embodiment of the present invention may include an optical signal reception step (S210), an insulation degradation state determination step (S220), and an arc location calculation step (S230).

[0137] In step S210, the switchboard (100) capable of predicting insulation degradation based on optical sensors and tracking arc locations can receive optical signals generated inside the switchboard detected by one or more optical sensors. At this time, the optical sensor (110) may be composed of, for example, an infrared (IR) sensor, an ultraviolet (UV) sensor, and / or a combination thereof. According to an embodiment, the optical sensor (110) can detect optical signals generated by partial discharge, corona discharge, and / or arc discharge occurring at specific points inside the switchboard. Additionally, one or more optical sensors (110) may be installed, and the optical signals of the entire switchboard may be detected using a single sensor, or optical signals may be detected at spatially distributed locations using multiple sensors.

[0138] In step S220, the switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking can determine the insulation degradation state based on the optical signal received in step S210. The switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking receives optical signal data from each optical sensor (110) at a preset periodic interval and can determine the insulation degradation state based on the data. The switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking can determine the insulation degradation state by analyzing the intensity, frequency of occurrence, and / or temporal change of the optical signal received from the optical sensor (110).

[0139] In step S230, the switchboard (100) capable of predicting insulation degradation based on optical sensors and tracking the location of an arc can calculate the location of the arc based on an optical signal when an arc occurs. The switchboard (100) capable of predicting insulation degradation based on optical sensors and tracking the location of an arc can determine whether an arc has occurred by comparing and analyzing signals received from a plurality of optical sensors (110), and can calculate the location when an arc occurs. The switchboard (100) capable of predicting insulation degradation based on optical sensors and tracking the location of an arc can calculate the location of the arc using an interpolation method by utilizing the ratio of light intensity for each sensor, and if sensor coordinates are stored in advance, it can calculate the 2D and / or 3D location of the arc using the coordinates.

[0140] In addition, all operation processes of the processor (120) as described above may be included in a control method of a switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking according to an embodiment of the present invention.

[0141] Meanwhile, as described above, a control method for a switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking according to one embodiment of the present invention may be implemented as a computer program (or computer program product) including instructions executable by a computer. The computer program includes programmable machine instructions processed by a processor (120) and may be implemented in a high-level programming language, an object-oriented programming language, an assembly language, or a machine language. Additionally, the computer program may be recorded on a tangible computer-readable recording medium (e.g., memory, hard disk, magnetic / optical medium or SSD (Solid-State Drive), etc.).

[0143] FIG. 3 is a block diagram showing the specific configuration of a switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking as illustrated in FIG. 1 according to one embodiment of the present invention.

[0144] Referring to FIG. 3, a switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking includes an optical sensor (110), a processor (120), and a storage unit (130).

[0145] The processor (120) controls the overall operation of the switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking.

[0146] Specifically, the processor (120) includes RAM (121), ROM (122), main CPU (123), graphics processing unit (124), first to n interfaces (125-1 to 125-n) and a bus (126).

[0147] RAM (121), ROM (122), main CPU (123), graphics processing unit (124), first to n interfaces (125-1 to 125-n), etc. can be connected to each other via a bus (126).

[0148] The first to n interfaces (125-1 to 125-n) are connected to the various components described above. One of the interfaces may be a network interface connected to an external device through a network.

[0149] The main CPU (123) accesses the storage unit (130) and performs booting using the O / S stored in the storage unit (130). Then, it performs various operations using various programs, content, data, etc. stored in the storage unit (130).

[0150] In particular, the main CPU (123) can determine the insulation degradation state based on the optical signal received from one or more optical sensors and calculate the location of the arc when an arc occurs.

[0151] A set of instructions for booting the system is stored in the ROM (122). When a turn-on command is input and power is supplied, the main CPU (123) copies the O / S stored in the storage unit (130) to the RAM (121) according to the instructions stored in the ROM (122), and executes the O / S to boot the system. When booting is complete, the main CPU (123) copies various application programs stored in the storage unit (130) to the RAM (121), and executes the application programs copied to the RAM (121) to perform various operations.

[0152] The graphics processing unit (124) generates a screen containing various objects such as icons, images, and text using a calculation unit (not shown) and a rendering unit (not shown). The calculation unit (not shown) calculates attribute values ​​such as coordinate values, shape, size, and color for each object to be displayed according to the layout of the screen based on a received control command. The rendering unit (not shown) generates a screen of various layouts containing objects based on the attribute values ​​calculated by the calculation unit (not shown).

[0153] In particular, the graphics processing unit (124) can implement objects generated by the main CPU (123) into a GUI (Graphic User Interface), icon, user interface screen, etc.

[0154] Meanwhile, the operation of the above-described processor (120) can be performed by a program stored in the storage unit (130).

[0155] The storage unit (130) stores various data, such as an O / S (Operating System) software module for operating a switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking, and various multimedia content.

[0156] In particular, the storage unit (130) may include a software module for determining the insulation degradation state based on optical signals received from one or more optical sensors and calculating the location of the arc when an arc occurs.

[0158] FIG. 4 is a drawing relating to a software module stored in a storage unit according to an embodiment of the present invention.

[0159] Referring to FIG. 4, the storage unit (130) may store programs such as an optical signal receiving module (131), an insulation deterioration state determination module (132), and an arc location calculation module (133).

[0160] Meanwhile, the operation of the processor (120) described above can be performed by a program stored in the storage unit (130). Below, the detailed operation of the processor (120) using the program stored in the storage unit will be explained in detail.

[0161] Specifically, the optical signal receiving module (131) can receive an optical signal generated inside the switchboard detected by one or more optical sensors. At this time, the optical sensor (110) may be composed of, for example, an infrared (IR) sensor, an ultraviolet (UV) sensor, and / or a combination thereof. According to an embodiment, the optical sensor (110) can detect an optical signal generated by partial discharge, corona discharge, and / or arc discharge occurring at a specific point inside the switchboard. Additionally, one or more optical sensors (110) may be installed, and an optical signal of the entire switchboard may be detected using a single sensor, or an optical signal may be detected at spatially distributed locations using multiple sensors.

[0162] The insulation degradation state determination module (132) can determine the insulation degradation state based on an optical signal. The insulation degradation state determination module (132) receives optical signal data from each optical sensor (110) at a preset periodic interval and can determine the insulation degradation state based on the data. The insulation degradation state determination module (132) can determine the insulation degradation state by analyzing the intensity, frequency of occurrence, and / or temporal change of the optical signal received from the optical sensor (110).

[0163] The arc location calculation module (133) can calculate the location of the arc based on an optical signal when an arc occurs. The arc location calculation module (133) can determine whether an arc has occurred by comparing and analyzing signals received from a plurality of optical sensors (110), and can calculate the location when an arc occurs. The arc location calculation module (133) can calculate the arc location using an interpolation method by using the ratio of light intensity for each sensor, and if sensor coordinates are stored in advance, it can calculate the 2D and / or 3D location of the arc using the coordinates.

[0164] Meanwhile, a non-transitory computer-readable medium storing a program that sequentially performs the control method according to the present invention may be provided.

[0165] A non-transient readable medium refers to a medium that stores data semi-permanently and can be read by a device, rather than a medium that stores data for a short period of time, such as a register, cache, or memory. Specifically, the various applications or programs described above may be stored and provided on non-transient readable media such as CDs, DVDs, hard disks, Blu-ray discs, USBs, memory cards, and ROMs.

[0166] In addition, although the bus is not shown in the above-described block diagram of the switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking, communication between each component in the switchboard (100) capable of optical sensor-based insulation degradation prediction and arc location tracking may be performed via the bus. Additionally, each device may further include a processor, such as a CPU or a microprocessor, that performs the various steps described above.

[0167] Furthermore, although preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the specific embodiments described above. It is understood that various modifications can be made by those skilled in the art without departing from the essence of the invention as claimed in the claims, and such modifications should not be understood individually from the technical spirit or perspective of the present invention. Explanation of the symbols

[0169] 100: Switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking 110 : Optical sensor 120 : Processor

Claims

Claim 1 One or more optical sensors positioned to detect optical signals generated inside the distribution panel; The apparatus further includes a processor that determines the insulation degradation state based on the optical signal received from the optical sensor and calculates the location of the arc when an arc occurs; and a display unit configured to visually display the insulation degradation state and the arc location; wherein the optical sensors are arranged in a matrix form in multiple numbers and mounted on a transparent flexible PCB, and the transparent flexible PCB is surrounded by a filler having insulating properties, or the optical sensors are placed between transparent insulating plates so that the optical signals can reach the optical sensors while being protected from the external environment; the processor compares and analyzes the optical signals received from each of the optical sensors arranged in the matrix form to identify the spatial distribution of the optical signals, analyzes the light intensity distribution between adjacent sensors to calculate the arc occurrence location based on the spatial distribution, generates a heat map by converting the magnitude of the optical signal corresponding to the location of each optical sensor into color and / or density based on the optical signal values ​​collected from each of the optical sensors, superimposes the generated heat map with an image simulating the inside of the switchboard and outputs it through the display unit, and based on sensor data accumulated over time, the history of abnormal state occurrences A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized by displaying locations overlaid on a heatmap, indicating locations where abnormal conditions occur repeatedly with gradually increasing color intensity to intuitively identify areas with a high probability of accidents, and determining a location as a degradation area when discharge events occur repeatedly at the same location. Claim 2 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized in that, in claim 1, the processor determines the insulation degradation state based on at least one of the number of discharges, discharge energy, and discharge interval of the optical signal. Claim 3 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, wherein, in claim 1, the processor calculates the location of the arc based on the difference in light intensity detected by one or more optical sensors. Claim 4 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized in that, in claim 3, the processor calculates the relative position of the arc based on the characteristic that the light intensity is inversely proportional to the square of the distance. Claim 5 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized in that, in claim 1, the optical sensor is positioned at least one of a busbar connection part, a circuit breaker terminal part, a cable connection part, and an insulating insulator. Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, wherein, in claim 1, it further includes an electric field sensor for measuring the electric field distribution inside the switchboard, and the processor determines the insulation degradation state based on data received from the optical sensor and the electric field sensor, calculates the location of the arc when an arc occurs, and determines the progress state of insulation degradation by analyzing the change in data of the optical sensor and the electric field sensor over time. Claim 10 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized in that, in claim 9, the processor calculates a direction vector indicating the spatial movement of insulation degradation based on changes in measurement values ​​of a plurality of optical sensors and / or electric field sensors over time. Claim 11 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized in that, in claim 10, the processor calculates the rate of progression of insulation degradation based on the magnitude of the direction vector. Claim 12 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized in that, in claim 9, the processor determines the insulation degradation state by correlating optical sensor data and electric field sensor data. Claim 13 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized in that, in claim 9, the processor generates a reference value based on initial operation data or normal state data and determines whether insulation degradation has occurred by comparing it with the reference value. Claim 14 A switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, characterized in that, in claim 9, the processor stores the insulation degradation state and arc occurrence history, and predicts the location where a fault may occur based thereon. Claim 15 A control method in a switchboard capable of optical sensor-based insulation degradation prediction and arc location tracking, comprising: receiving an optical signal generated inside the switchboard detected by one or more optical sensors; and determining an insulation degradation state based on the optical signal. The method further includes the step of calculating the location of the arc based on the optical signal when an arc occurs; and the step of visually displaying the insulation degradation state and the arc location; wherein the optical sensors are arranged in a matrix form in multiple numbers and mounted on a transparent flexible PCB, and the transparent flexible PCB is surrounded by a filler having insulating properties, or the optical sensors are placed between transparent insulating plates so that the optical signals can reach the optical sensors while being protected from the external environment; the step of calculating the location of the arc involves comparing and analyzing the optical signals received from each of the optical sensors arranged in the matrix form to determine the spatial distribution of the optical signals, and analyzing the light intensity distribution between adjacent sensors to calculate the location of the arc occurrence based on the spatial distribution; the step of visually displaying involves generating a heatmap by converting the magnitude of the optical signal corresponding to the location of each optical sensor into color and / or density based on the optical signal values ​​collected from each of the optical sensors, superimposing the generated heatmap with an image simulating the inside of the switchboard and outputting it through the display unit, and superimposing the history of abnormal state occurrences based on sensor data accumulated over time onto the heatmap. A control method characterized by indicating locations where abnormal conditions occur repeatedly, such that the color intensity gradually increases to allow for intuitive identification of areas with a high probability of accidents, and determining a location as a deterioration area when a discharge event occurs repeatedly at the same location.

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