Probe Head

Abstract

The present invention relates to a vertical probe head utilizing the torsional characteristics of a probe, wherein the upper receiving hole of the upper plate and the lower receiving hole of the lower plate are formed in a rotated state relative to each other so that the probe is inserted into the lower receiving hole in a twisted state, thereby maximizing the lateral reaction force applied by the lower receiving hole to the probe so that the probe can be stably supported by the receiving hole.

Description

Technology Field

[0001] The present invention relates to a probe head for testing semiconductor devices, and more specifically, to a vertical probe head that supports a probe by utilizing the torsional characteristics of the probe. Background Technology

[0002] Generally, the manufacturing process of a semiconductor device includes a patterning process for manufacturing semiconductor elements, an EDS (Electrical Die Sorting) process for electrically testing them to determine defects, and an assembly process for integrating each semiconductor element onto a wafer.

[0003] The above EDS process is a process that determines whether a defect exists by supplying a test current to each semiconductor device and examining the electrical signal output therefrom; probe devices that electrically contact each semiconductor device to test its performance are widely used.

[0004] Such a probe device is composed of, for example, a tester that supplies a test current and tests and analyzes the resulting signal, a probe card that electrically connects the test object (semiconductor device) to the tester, and a probe that comes into direct contact with the test object and the printed circuit board or space transformer of the probe card.

[0005] The above probe is generally provided with a probe head structure in which multiple probes are accommodated and assembled to ensure durability even during multiple tests, while maintaining appropriate contact pressure between the semiconductor device, which is the object to be tested, and the probe card to ensure stable contact.

[0006] Generally, the probe head is composed of a probe and a block in which the probe is received and assembled, and the first and second ends of the probe are received so as to protrude outward from the first and second surfaces of the block, respectively, and are electrically contacted with the pads of the printed circuit board or space transformer and the terminals of the semiconductor device with appropriate pressure.

[0007] A probe head with such a structure may be referred to as a 'vertical probe head,' and a 'vertical probe pin' is used in a vertical probe head. Since the present invention is intended for a vertical probe head, it will be referred to simply as a probe head or a probe.

[0008] In the above block, a receiving hole is formed at a pitch spacing corresponding to the contact terminal of the semiconductor device to be tested, and a probe is received and assembled in the receiving hole, and during testing, the probe is formed to slide inside the receiving hole by a predetermined pressure.

[0009] Referring to FIG. 1, a general probe head (30) is configured by a block consisting of an upper plate (33) having an upper receiving hole (34) formed therein and a lower plate (35) having a lower receiving hole (36) formed therein and spaced apart from the upper plate in the Z-axis direction, and a probe (40) being received in the upper receiving hole (34) and the lower receiving hole (36) and combined. The probe (40) includes a probe body (41), and the first end (upper end) (42) of the probe (40) contacts a pad (21) of a printed circuit board or a space transformer (20), and the second end (lower end) (43) of the probe (40) contacts a terminal (11) of a semiconductor device (10) to be tested.

[0010] In a general probe head (30), the upper and lower receiving holes (34, 36) are positioned so that they are offset by 'd' in a certain direction (exemplarily the X-axis direction in the drawing), so the probe (40) received in the receiving hole is pressed against the inner wall of the receiving hole as its body bends, and the inner wall of the receiving hole supports the probe by applying a side force as a reaction. However, since the probe is supported without being completely constrained in the receiving hole, the constraint force in the Z-axis direction is insufficient.

[0011] In this situation, as shown in FIG. 2, if the height of the pad (21) of the space transformer (20) differs due to processing errors or other factors, or if there is warpage in the space transformer, the probe (40) undergoes a process of adjustment to come into contact with the pad (21) of the space transformer. As the probe within the receiving hole is adjusted, the position supported by the lateral reaction force on the side of the receiving hole changes. When the position where the probe is supported within the receiving hole changes, the lateral reaction force acting on the probe changes. Consequently, the probe, which does not have an appropriate lateral reaction force applied, is not properly supported by the receiving hole, and a problem occurs where it detaches when separated for reasons such as repair of the probe head.

[0012] Furthermore, due to technical limitations in the process, it was difficult to control the lateral reaction force generated from the side of the receiving hole, making it difficult to resolve the above problems without adding external elements.

[0013] In particular, since the probe is not completely constrained, the lateral reaction force that must be maintained statically can be affected during operation, making it difficult to stably support the probe in an independent form. Prior art literature

[0014] Published Patent No. 2024-0139725 (September 24, 2024) The problem to be solved

[0015] The present invention has been devised in consideration of the points described above, and aims to provide a probe head in which the probe is inserted into the receiving hole in a twisted state and stably supported in the receiving hole by arranging the receiving holes of the upper plate and the lower plate in a mutually rotated state without the addition of separate external elements. means of solving the problem

[0016] A probe head for testing a semiconductor device according to the present invention for solving the above-described purpose comprises: an upper plate having a plurality of upper receiving holes formed on an XY plane and having a square cross-section; a lower plate spaced apart from the upper plate in the Z-axis direction and having a lower receiving hole formed at each position corresponding to the upper receiving hole and having a square cross-section; and a probe having a body portion extending along the Z-axis direction, wherein the body portion is inserted and disposed in the upper receiving hole and the lower receiving hole corresponding to each other, wherein the upper receiving hole and the lower receiving hole corresponding to each other are offset in any one of the X-axis direction, the Y-axis direction, or the XY-axis direction, and the lower receiving hole is formed in a state rotated at a predetermined angle with respect to the upper receiving hole, so that the lower part of the probe is inserted into the lower receiving hole in a twisted state.

[0017] A pointed lower tip may be formed at the lower part of the above probe.

[0018] The lower receiving hole may be formed rotated at an angle ranging from 5 to 45 degrees relative to the upper receiving hole.

[0019] The body portion of the probe includes an upper portion inserted into the upper receiving hole and a lower portion inserted into the lower receiving hole, and the lower portion may be arranged in a position rotated at a predetermined angle with respect to the cross-section of the upper portion while being received in the lower receiving hole.

[0020] The upper portion may have substantially the same orientation in the cross-section of the upper receiving hole and in the XY plane while being received in the upper receiving hole.

[0021] The upper receiving hole and the lower receiving hole may have a square cross-section of the same size.

[0022] The body portion of the probe may have a square cross-section of a size that prevents free rotation within the upper receiving hole or the lower receiving hole. Effects of the invention

[0023] The probe head according to the present invention can secure a stable lateral reaction force by generating twist in the probe through the mutually different angular relationship between the receiving holes of the upper plate and the lower plate. This resolves the difficulties in maintaining the probe's orientation and securing lateral reaction force caused by external factors, such as warpage of the space transformer and the flatness of the pad, which were problems of the prior art, and makes it possible to control the lateral reaction force without process technical limitations.

[0024] Furthermore, the probe head according to the present invention solves the problem of unstable lateral reaction forces during operation caused by the probe not being completely constrained, thereby providing the function of stably supporting the probe in an independent form and inducing operation in a constant direction. Accordingly, assembly deviations between thousands to tens of thousands of probes can be minimized, and this has the effect of contributing to improved probe lifespan and workability. Brief explanation of the drawing

[0025] Figure 1 schematically shows a probe head in contact with a conventional semiconductor device. Figure 2 is a diagram illustrating the problems of a conventional probe head. FIG. 3 schematically shows a probe head according to an embodiment of the present invention. FIG. 4 schematically shows the planes of an upper plate and a lower plate according to an embodiment of the present invention. FIG. 5 is a perspective view showing a part of a probe head according to an embodiment of the present invention. FIG. 6 is a schematic plan view showing a probe coupled to a receiving hole of an upper plate and a lower plate according to an embodiment of the present invention. Specific details for implementing the invention

[0026] Hereinafter, a probe head according to the present invention will be described in detail with reference to the drawings.

[0027] The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0028] In the description referring to the attached drawings, identical components are assigned the same or related reference numerals regardless of drawing symbols, and redundant descriptions thereof are omitted. In describing the present invention, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the present invention, such detailed description is omitted.

[0029] FIG. 3 schematically shows a probe head according to an embodiment of the present invention, FIG. 4 schematically shows a plan view of an upper plate and a lower plate according to an embodiment of the present invention, FIG. 5 is a perspective view showing a part of a probe head according to an embodiment of the present invention, and FIG. 6 is a plan view schematically showing a probe coupled to a receiving hole of an upper plate and a lower plate according to an embodiment of the present invention.

[0030] As shown in the drawing, a probe head (130) according to an embodiment of the present invention is a probe head for testing a semiconductor device, comprising: an upper plate (133) formed with a plurality of upper receiving holes (134) having a square cross-section and arranged on an XY plane; a lower plate (135) spaced apart from the upper plate in the Z-axis direction and having lower receiving holes (136) having a square cross-section formed at each position corresponding to the upper receiving holes; and a body portion (141) extending along the Z-axis direction, wherein the body portion comprises a probe (140) inserted and arranged in the upper receiving holes (134) and the lower receiving holes (136) corresponding to each other, wherein the upper receiving holes and the lower receiving holes corresponding to each other are arranged to be offset in any one of the X-axis direction, the Y-axis direction, or the XY-axis direction, and the lower receiving holes (136) are formed in a state rotated at a predetermined angle with respect to the upper receiving holes, so that the lower portion (144) of the probe is the It is characterized by being configured to be inserted into the lower receiving hole in a twisted state.

[0031] As shown in FIG. 3, in a probe head (130) according to an embodiment of the present invention, an upper plate (133) is positioned on an XY plane and has a plurality of upper receiving holes (134) formed with a square cross-section. The upper receiving holes (134) function so that the upper part (142) of the probe (140) is fitted into them and can move only in the up and down direction.

[0032] The lower plate (135) is spaced apart from the upper plate (133) in the Z-axis direction, and a lower receiving hole (136) having a square cross-section is formed at each position corresponding to the upper receiving hole. The lower receiving hole (136) functions to allow the lower part (144) of the probe to be inserted and move only in the up and down direction.

[0033] The upper receiving hole (134) formed in the upper plate and the lower receiving hole (136) formed in the lower plate may have a square cross-section of the same size. However, it is also possible to form the upper receiving hole and the lower receiving hole with different sizes and shapes.

[0034] The corresponding upper receiving hole (134) and lower receiving hole (136) may be offset in any one of the X-axis direction, Y-axis direction, or XY-axis direction. The offset functions to cause a lateral reaction force on the upper receiving hole and lower receiving hole as the probe bends during assembly, thereby allowing the probe to maintain its position while adhering to the receiving holes. Although FIG. 3 illustrates an example of being offset by 'd' in the X-axis direction, it should be noted that they may be offset in the Y-axis direction or XY-axis direction.

[0035] The upper plate (133) and the lower plate (135) may be made of silicon nitride (Si3N4) material. The upper plate and the lower plate made of silicon nitride (Si3N4) have the advantage of having low thermal expansion, which allows for stable maintenance of the precise probe arrangement while simultaneously ensuring high strength and insulation.

[0036] An air gap (G) is located in the space between the upper plate (133) and the lower plate. The air gap (G) provides a space where the probe (140) can flow or bend.

[0037] The probe (140) according to the present invention is a vertical probe pin and includes a body portion (141) extending along the Z-axis direction, and the body portion can be inserted and positioned into an upper receiving hole (134) of an upper plate and a lower receiving hole (136) of a lower plate that correspond to each other.

[0038] The body portion (141) of the probe may have a square cross-section of a size that prevents free rotation within the upper receiving hole (134) or the lower receiving hole (136). By having a square cross-section of a size that prevents free rotation within the upper receiving hole (134) or the lower receiving hole (136), the probe can come into close contact with the upper receiving hole and the lower receiving hole.

[0039] A slot (147) extending in the Z-axis direction may be formed in the body portion (141) of the probe. The slot (147) can improve the buckling characteristics of the probe by allowing the probe to bend more easily in one direction during testing. Although the drawing illustrates the formation of a single slot as an example, it is also possible to form multiple such slots.

[0040] The probe (140) has its upper portion (142) of the body portion (141) inserted into the upper receiving hole (134) of the upper plate, and its lower portion (144) inserted into the lower receiving hole (136) of the lower plate. At this time, the probe (140) bends and contacts the upper receiving hole or the lower receiving hole due to the offset between the upper receiving hole and the lower receiving hole, so the upper portion (142) and the lower portion (144) of the probe are pressed against the inner walls (W1, W2) of the upper receiving hole and the lower receiving hole, respectively, and the inner walls of the receiving holes apply a lateral reaction force as a reaction to this, thereby supporting the probe. As a result, the probe (140) can maintain its position while being supported by the upper receiving hole and the lower receiving hole.

[0041] An upper tip (143) that contacts a pad (21) of a printed circuit board or a space transformer (20) may be provided at the upper end of the probe, and a lower tip (145) that contacts a terminal (1) of a semiconductor device (10) under test may be provided at the lower end of the probe. The lower tip (145) is preferably formed in a pointed shape to facilitate insertion when the lower part (144) of the probe is inserted into the lower receiving hole (136) in a twisted state. The pointed lower tip (145) may also help improve contact with the terminal (11) of the semiconductor device under test.

[0042] These probes (140) may be formed from an elastic material such as a metal or metal composite material having elasticity, and needle-type pins may be used.

[0043] The probe (140) slides up and down inside the receiving hole and bends within the air gap (G) to stably contact the pads of the printed circuit board or space transformer and the terminals of the semiconductor device under test.

[0044] However, although the probe (140) is structured to be supported by the upper and lower receiving holes by an offset between the upper receiving hole (134) and the lower receiving hole (136), the restraining force is not large, and if the height of the pads of the space transformer differs or there is warpage, the position where the probe is supported by lateral reaction force in the receiving hole changes, and the restraining force supporting the probe in the receiving hole may be greatly reduced.

[0045] The present invention forms the upper receiving hole (134) of the upper plate and the lower receiving hole (136) of the lower plate in a rotated state relative to each other, thereby allowing the probe to be inserted into the lower receiving hole in a twisted state. This maximizes the lateral reaction force applied to the probe in the lower receiving hole and strongly supports the probe, so that even if the position where the probe is supported within the receiving hole changes, the probe is strongly constrained in the Z-axis direction and does not detach due to the self-weight of the probe.

[0046] As shown in FIGS. 4 to 6, in a probe head (130) according to one embodiment of the present invention, the lower receiving hole (136) of the lower plate is formed in a state rotated at a predetermined angle with respect to the upper receiving hole (134) of the upper plate.

[0047] In the present invention, it is preferable that the lower receiving hole (136) be formed in a state rotated at an angle ranging from 5 to 45 degrees relative to the upper receiving hole (134). More preferably, it is preferable that the lower receiving hole be formed in a state rotated at an angle ranging from 10 to 15 degrees relative to the upper receiving hole, as this improves the restraining force in the Z-axis direction without reducing the strength of the probe. On the other hand, if the lower receiving hole is formed in a state rotated at an angle of less than 5 degrees relative to the upper receiving hole, the restraining force of the probe in the Z-axis direction is weakened, so the effect according to the present invention cannot be achieved, and if it is formed in a state rotated at an angle exceeding 45 degrees, the restraining force of the probe in the Z-axis direction is strengthened, but the probe may be twisted excessively, and the strength of the probe may be very weak, so this is not desirable.

[0048] Referring to FIG. 5, the upper portion (142) of the body portion (141) of the probe (140) is inserted into the upper receiving hole (134) of the upper plate, and the lower portion (144) of the body portion (141) is inserted into the lower receiving hole (136) of the lower plate, which is formed in a rotated state relative to the upper receiving hole (134). In other words, the lower portion (144) of the probe (140) is inserted into the lower receiving hole (136) in a twisted state, with the pointed lower tip (145) being inserted first into the lower receiving hole (136) in a rotated state. Here, the pointed lower tip (145) serves to smoothly insert the probe into the lower receiving hole even when the probe is twisted. Since the lower part (144) of the probe is inserted into the lower receiving hole (136) in a twisted state, the lower part (144) of the probe strongly presses against the inner wall (W2) of the lower receiving hole, and the inner wall (W2) of the lower receiving hole applies a strong lateral reaction force to the lower part of the probe in reaction to this, so the probe can be stably supported in the lower receiving hole.

[0049] Therefore, in addition to being supported by the offset formed between the upper receiving hole (134) and the lower receiving hole (136), the probe (140) is inserted and supported in a twisted state in the lower receiving hole (136), so the restraining force in the Z-axis direction is greatly improved, and the probe does not detach due to its own weight when separated for reasons such as repair of the probe head.

[0050] As shown in FIG. 6, the lower part (144) of the probe (140) is received in the lower receiving hole (136) and is arranged in a position rotated at a predetermined angle with respect to the cross-section of the upper part (142) of the probe.

[0051] On the other hand, the upper portion (142) of the probe, while being received in the upper receiving hole (134), may have substantially the same orientation in the XY plane as the cross-section of the upper receiving hole. Here, "substantially the same orientation" means that while the upper portion of the probe may be positioned with partial support on the inner wall (W1) of the upper receiving hole while inserted into the upper receiving hole, the upper portion of the probe and the cross-section of the upper receiving hole have a generally consistent orientation in the XY plane as shown in FIG. 6.

[0052] A probe head (130) according to one embodiment of the present invention is configured such that the lower receiving hole (136) of a lower plate (135) is formed in a state rotated at a predetermined angle with respect to the upper receiving hole (134) of an upper plate (133), so that the lower part (144) of the probe (140) is inserted into the lower receiving hole (136) in a twisted state, thereby maximizing the lateral reaction force applied by the lower receiving hole (136) to the lower part of the probe so that the probe is stably supported within the lower receiving hole.

[0053] Accordingly, the probe head according to the present invention can secure a stable lateral reaction force by generating twist in the probe through the mutually different angular relationship between the receiving holes of the upper plate and the lower plate. This resolves the difficulties in maintaining the probe's orientation and securing lateral reaction force caused by external factors, such as warpage of the space transformer and the flatness of the pad, which were problems of the prior art, and makes it possible to control the lateral reaction force without process technical limitations.

[0054] Furthermore, the probe head according to the present invention solves the problem of unstable lateral reaction forces during operation caused by the probe not being completely constrained, thereby providing the function of stably supporting the probe in an independent form and inducing operation in a constant direction. Accordingly, assembly deviations between thousands to tens of thousands of probes can be minimized, and this can contribute to extending the lifespan of the probes and improving workability.

[0055] Although the present invention has been illustrated and described above in relation to preferred embodiments to illustrate the principles of the invention, the invention is not limited to the configuration and operation as illustrated and described. Rather, those skilled in the art will understand that numerous changes and modifications to the invention are possible without departing from the spirit and scope of the appended claims. Explanation of the symbols

[0056] 30, 130: Probe head 133: Upper plate 134: Upper receiving hole 135: Lower plate 136: Lower receiving hole 140: Probe 141: Body of the probe 142: Upper part of the probe 143: Upper tip 144: Lower part of the probe 145: Lower tip 147: Slot d: Offset G: Air gap W1: Inner wall of the upper receiving hole W2: Inner wall of the lower receiving hole

Claims

Claim 1 A probe head for testing semiconductor devices comprises: an upper plate disposed on an XY plane and having a plurality of upper receiving holes formed with a square cross-section; and a lower plate spaced apart from the upper plate in the Z-axis direction and having lower receiving holes formed with a square cross-section at each position corresponding to the upper receiving holes. A probe head comprising: a body portion extending along the Z-axis direction, wherein the body portion is inserted and disposed in the upper receiving hole and the lower receiving hole corresponding to each other; wherein the upper receiving hole and the lower receiving hole corresponding to each other are disposed offset in any one of the X-axis direction, the Y-axis direction, or the XY-axis direction, and the lower receiving hole is formed in a state rotated at a predetermined angle with respect to the upper receiving hole, so that the lower part of the probe is inserted into the lower receiving hole in a twisted state, wherein the body portion of the probe includes an upper part inserted into the upper receiving hole and a lower part inserted into the lower receiving hole, wherein the upper part has the same directionality in the cross-section of the upper receiving hole and the XY plane when received in the upper receiving hole, and the lower part is configured to have a state of being rotated at a predetermined angle with respect to the cross-section of the upper part when received in the lower receiving hole. Claim 2 A probe head according to claim 1, characterized in that a pointed lower tip is formed at the lower end of the probe. Claim 3 A probe head according to claim 1, characterized in that the lower receiving hole is formed in a state rotated at an angle ranging from 5 to 45 degrees relative to the upper receiving hole. Claim 4 delete Claim 5 delete Claim 6 A probe head according to claim 1, characterized in that the upper receiving hole and the lower receiving hole have a square cross-section of the same size. Claim 7 A probe head according to claim 1, characterized in that the body portion of the probe has a square cross-section of a size that prevents free rotation within the upper receiving hole or the lower receiving hole.

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