Communication relay apparatus comprising heat transfer facilitator

Abstract

The present invention relates to a communication relay device having a heat transfer promoting member, characterized by comprising an electronic device provided in the communication relay device, a chip part provided in the electronic device, a heat dissipation device for dissipating heat generated from the chip part, and a heat transfer promoting member that is in contact with the chip part and the heat dissipation device and transfers heat from the chip part to the heat dissipation device.

Description

Technology Field

[0001] The present invention relates to a communication relay device having a heat transfer promoting part. Background Technology

[0002] Recently, with the increase in internet communication service subscribers, the use of communication repeaters has been increasing. To cool these communication repeaters, heat dissipation devices are being utilized.

[0003] Conventional communication repeaters are unable to efficiently manage heat generated from components such as printed circuit boards, which can cause high temperatures around the repeater to adversely affect not only the repeater itself but also neighboring equipment. Furthermore, conventional repeaters suffer from poor assembly quality of their heat dissipation devices, which leads to increased manufacturing costs and reduced productivity. In addition, because conventional repeaters require a heat sink to be integrally formed protruding from the outer surface of the bottom cover to release internal heat, this design increases the weight and size of the repeater and degrades its aesthetic appeal.

[0004] The background technology of the present invention is disclosed in Korean Utility Model Registration No. 20-0456957 (Registered on November 22, 2011; Title of invention: Repeater).

[0005] The information described above disclosed in the background technology of this invention is intended only to enhance understanding of the background of the present invention and may therefore include information that does not constitute prior art. The problem to be solved

[0006] The purpose of the present invention is to provide a communication relay device equipped with a heat transfer promoting part capable of improving heat dissipation performance.

[0007] However, the technical problems that the present invention aims to solve are not limited to those described above, and other unmentioned problems can be clearly understood by those skilled in the art from the description of the invention below. means of solving the problem

[0008] A communication relay device having a heat transfer promoting member according to one aspect of the present invention comprises: an electronic device provided in the communication relay device; a chip part provided in the electronic device; a heat dissipation device for dissipating heat generated from the chip part; and a heat transfer promoting member that is in contact with the chip part and the heat dissipation device and transfers heat from the chip part to the heat dissipation device.

[0009] The above heat dissipation device may comprise: a body portion installed in the communication relay device; and a heat transfer portion formed to protrude from the body portion in the direction of the chip portion, on which the heat transfer promoting portion is mounted.

[0010] In addition, the present invention further comprises a pressure amount correction part that is formed protruding from the body part and corrects the pressure amount of the heat transfer promoting part provided between the heat dissipation device and the electronic device at a constant level; and a plurality of pressure amount correction parts may be provided spaced apart from each other.

[0011] The above heat transfer promoting part may have elasticity.

[0012] The above heat transfer promoting member can be in close contact with the electronic device and the heat dissipation device to reduce the air gap between the electronic device and the heat dissipation device.

[0013] The above chip portion may comprise a plurality of communication chips; and a non-communication chip disposed spaced apart from the communication chips.

[0014] The number of the heat transfer promoting parts may be less than or equal to the number of the chip parts. A plurality of the chip parts may be in contact with at least one of the heat transfer promoting parts.

[0015] The sum of the planar areas of the heat transfer promoting portions facing the above chip portions may be greater than or equal to the sum of the planar areas of the above chip portions facing the above heat transfer promoting portions.

[0016] The size of the plane of the heat transfer promoting part on the surface facing the chip part may be larger than or equal to the size of the plane of the chip part facing the heat transfer promoting part.

[0017] The above heat transfer unit is provided in multiple quantities, and some of the multiple heat transfer units may have different heights in the direction of the heat transfer promoting unit.

[0018] The above heat transfer promoting members are provided in multiple numbers, and some of the multiple heat transfer promoting members may have different hardness or different compression ratios.

[0019] The above heat transfer promoting part can be manufactured as a thermal management composite material for thermal interface materials (TIM).

[0020] The above heat transfer unit may be provided in multiple spaced-apart units. Effects of the invention

[0021] A communication relay device equipped with a heat transfer promoting unit according to the present invention can efficiently dissipate heat generated in an electronic device.

[0022] In addition, the present invention can improve the cooling performance of a communication relay device.

[0023] In addition, the present invention can reduce assembly labor and manufacturing time when manufacturing a communication relay device equipped with a heat transfer promoting unit, reduce the occurrence of defects in the communication relay device equipped with a heat transfer promoting unit, and improve the reliability of the device.

[0024] In addition, the present invention can reduce the occurrence of failures in a communication relay device equipped with a heat transfer promoting part.

[0025] However, the effects obtainable through the present invention are not limited to those described above, and other unmentioned technical effects will be clearly understood by those skilled in the art from the description of the invention below. Brief explanation of the drawing

[0026] The following drawings attached to this specification illustrate preferred embodiments of the present invention and serve to further enhance understanding of the technical concept of the present invention together with the detailed description of the invention provided below; therefore, the present invention should not be interpreted as being limited only to the matters described in such drawings. FIG. 1 is a perspective view illustrating a communication relay device having a heat transfer promoting part according to an embodiment of the present invention. FIG. 2 is an exploded perspective view illustrating a communication relay device having a heat transfer promoting part according to one embodiment of the present invention. FIG. 3 is a plan view illustrating an electronic device according to one embodiment of the present invention. FIG. 4 is a perspective view illustrating a heat dissipation device according to one embodiment of the present invention. FIG. 5 is a plan view illustrating a heat dissipation device according to one embodiment of the present invention. Figure 6 is a cross-sectional view in the AA direction of Figure 5. FIG. 7 is an exploded perspective view illustrating a heat dissipation device and an electronic device according to one embodiment of the present invention. FIG. 8 is a diagram illustrating the method of combining a heat dissipation device and an electronic device according to one embodiment of the present invention. FIG. 9 is a drawing showing a combined state of a communication relay device having a heat transfer promoting part according to one embodiment of the present invention. Specific details for implementing the invention

[0027] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Prior to this, terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the present invention, based on the principle that the inventor can appropriately define the concept of the terms to best describe his invention. Accordingly, the embodiments described in this specification and the configurations illustrated in the drawings are merely some of the most preferred embodiments of the present invention and do not represent all of the technical spirit of the present invention; therefore, it should be understood that various equivalents and modifications capable of replacing them may exist at the time of filing this application.

[0028] Additionally, as used herein, “comprise, include” and / or “comprising, including” specify the presence of the mentioned features, numbers, steps, actions, parts, elements, and / or groups thereof, and do not exclude the presence or addition of one or more other features, numbers, actions, parts, elements, and / or groups.

[0029] Additionally, to aid in understanding the invention, the attached drawings are not drawn to actual scale, and the dimensions of some components may be exaggerated. Furthermore, the same reference numerals may be assigned to identical components in different embodiments.

[0030] The statement that two subjects of comparison are 'identical' means that they are 'substantially identical.' Therefore, substantial identity may include deviations considered low in the industry, for example, deviations within 5%. Additionally, the statement that a parameter is uniform in a given area may mean that it is uniform from an average perspective.

[0031] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless specifically stated otherwise, the first component may also be the second component.

[0032] Throughout the specification, unless specifically stated otherwise, each component may be singular or plural.

[0033] The fact that any configuration is placed on the "upper (or lower)" of a component or on the "upper (or lower)" of a component may mean not only that any configuration is placed in contact with the upper (or lower) surface of said component, but also that another configuration may be interposed between said component and any configuration placed on (or below) said component.

[0034] Furthermore, where one component is described as being "on," "connected to," or "coupled to" another component, it should be understood that while the components may be directly connected or coupled to each other, another component may be "interposed" between each component, or that each component may be "connected," "coupled," or "coupled" through another component.

[0035] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Additionally, the use of “may” when describing embodiments of the present disclosure relates to “one or more embodiments of the present disclosure.” Expressions such as “one or more” and “one or more” preceding a list of elements modify the entire list of elements and do not modify individual elements of the list.

[0036] Throughout the specification, "A and / or B" means A, B, or A and B unless specifically stated otherwise, and "C to D" means C or more and D or less, unless specifically stated otherwise.

[0037] When syntax such as "at least one of A, B, and C", "at least one of A, B, or C", "at least one selected from the group of A, B, and C", or "at least one selected from A, B, and C" is used to specify a list of elements A, B, and C, the syntax can refer to any suitable combination.

[0038] The term "use" may be considered synonymous with the term "utilize." As used herein, "substantially," "about," and similar terms are used as terms of approximation rather than degree, and are intended to account for the inherent variation of measured or calculated values ​​that a person skilled in the art would recognize.

[0039] In this specification, terms such as first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or sections, but these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Accordingly, the first element, component, region, layer, or section discussed below may be named the second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0040] Spatial relative terms such as "beneath," "below," "lower," "above," and "upper" may be used herein for ease of explanation to describe the relationship between one element or feature and another element(s) or feature(s) as illustrated in the drawings. Spatially relative positions are to be understood as encompassing different orientations of the device in use or operation, in addition to the orientations depicted in the figures. For example, if the device in the drawing is inverted, an element described as "below" or "below" is understood as "above" or "upper" of another element. Thus, the term "below" may encompass both the up and down directions.

[0041] The terms used in this specification are intended to describe embodiments of the present disclosure and are not intended to limit the present disclosure.

[0042] FIG. 1 is a perspective view illustrating a communication relay device having a heat transfer promoting member according to one embodiment of the present invention, and FIG. 2 is an exploded perspective view illustrating a communication relay device having a heat transfer promoting member according to one embodiment of the present invention.

[0043] Referring to FIGS. 1 and 2, a communication relay device (1) having a heat transfer promoting part (160) according to one embodiment of the present invention may have a housing (10), a heat dissipation device (100), a heat transfer promoting part (160), an electronic device (200), and a chip part (250, see FIG. 3). Although not shown, the housing (10) may be provided with a coupling part (not shown) for installing the communication relay device (1) having the heat transfer promoting part (160) on an installation target such as a utility pole. Since the structure for fixing the communication relay device (1) having the heat transfer promoting part (160) to an installation target such as a utility pole is obvious to those skilled in the art to which the present invention belongs, detailed drawings and descriptions thereof will be omitted.

[0044] FIG. 3 is a plan view illustrating an electronic device according to one embodiment of the present invention.

[0045] Referring to FIGS. 1 to 3, an electronic device (200) may be provided in a communication relay device (1). The electronic device (200) may be connected to a signal transmission cable (202, 204) to receive or transmit a signal from the communication relay device (1). In one embodiment, the electronic device (200) may be a control unit such as a printed circuit board (PCB) that is provided within the communication relay device (1) and electrically connected to the communication relay device (1) or a component (not shown) provided within the communication relay device (1). Meanwhile, in this embodiment, the case where the electronic device (200) is a control unit such as a printed circuit board is described as an example, but the present invention is not limited thereto and various modifications are possible, such as including all components that generate heat, such as semiconductor devices or components such as batteries.

[0046] The chip portion (250) may be provided in the electronic device (200). The chip portion (250) may include a plurality of communication chips (270) and a non-communication chip (280) spaced apart from the communication chips (270).

[0047] FIG. 4 is a perspective view illustrating a heat dissipation device according to one embodiment of the present invention, FIG. 5 is a plan view illustrating a heat dissipation device according to one embodiment of the present invention, and FIG. 6 is a cross-sectional view in the AA direction of FIG. 5.

[0048] Referring to FIGS. 4 to 6, the heat dissipation device (100) can dissipate heat generated from the electronic device (200). More specifically, the heat dissipation device (100) can dissipate heat generated from the chip portion (250).

[0049] In one embodiment, the heat dissipation device (100) may have a body part (110) and a heat transfer part (120).

[0050] The body portion (110) may be installed in a communication relay device (1). The body portion (110) may be provided with various types of connecting portions (112, 114, 116). The connecting portions (112, 114, 116) may be of various forms, such as through holes or bolt fastening holes. The connecting portions (112, 114, 116) may be used to connect the heat dissipation device (100) to other parts or the communication relay device (1). The connecting portions (112, 114, 116) may be formed protruding from the body portion (110) and may be provided with a pressure amount correction portion (114) that constantly corrects the pressure amount of the heat transfer promoting portion (160) provided between the heat dissipation device (100) and the electronic device (200).

[0051] A plurality of pressure correction units (114) may be provided spaced apart from each other. The pressure correction units (114) may be formed to protrude from the body part (110) toward the electronic device (200). Additionally, the pressure correction units (114) are spaced apart from each other so that the electronic device (200) is supported at the same height, thereby allowing the electronic device (200) to press the heat transfer promoting part (160) with a constant pressure, so that the pressing force can be adjusted equally.

[0052] The heat transfer section (120) extends from the body section (110). The heat transfer section (120) may be formed to protrude from the body section (110) toward the chip section (250). The heat transfer section (120) may be formed integrally with the body section (110) or installed on the body section (110) to provide a path for transferring heat. The heat transfer section (120) extends protruding from the body section (110), and a heat transfer promoting section (160) may be mounted on the protruding free end. In this embodiment, the heat transfer section (120) has a rectangular shape, and the mounting section (122) is a plane of the rectangular heat transfer section (120), and a heat transfer promoting section (160) having the same plane as the mounting section (122) may be mounted on the mounting section (120). Meanwhile, in this embodiment, the case where the heat transfer part (120) is a rectangular prism of various shapes is described as an example, but the present invention is not limited thereto and various modifications are possible. That is, the heat transfer part (120) extends from the body part (110) and can be equipped with a heat transfer promoting part (160).

[0053] In one embodiment, a plurality of heat transfer units (120) may be provided spaced apart. If the heat transfer units (120) are formed with the same size as the electronic device (200), the heat transfer efficiency can be improved, but it may be difficult to make close contact on all sides due to interference with components mounted on the electronic device (200). In this embodiment, a plurality of heat transfer units (120) may be provided spaced apart to solve this problem.

[0054] A plurality of heat transfer sections (120) are provided, and some of the heat transfer sections (120) may have different heights in the direction of the heat transfer promotion section (160). By designing the protrusion heights of the heat transfer sections (120) differently, the heat transfer distance can be varied, and in the chip section (250) where heat generation is particularly severe, a heat transfer section (120) with a height that can maximize the heat transfer rate can be formed to maximize heat dissipation efficiency.

[0055] When the electronic device (200) and the heat dissipation device (100) are in direct contact, an air gap may be formed due to fine irregularities on the contact interface, and due to such an air gap, it may be difficult to efficiently release heat generated from the electronic device (200), including the chip portion (250), to the outside. A heat transfer promoting portion (160) may be provided between the electronic device (200) and the heat dissipation device (100) to increase heat dissipation efficiency. The heat transfer promoting portion (160) may be in contact with the chip portion (250) and the heat dissipation device (100). That is, the heat transfer promoting portion (160) is in close contact with the chip portion (250) and the heat dissipation device (100) to transfer heat from the chip portion (250) to the heat dissipation device (100).

[0056] Additionally, the heat transfer promoting part (160) may have elasticity to reduce the air gap between the electronic device (200) and the heat transfer part (120). Additionally, the heat transfer promoting part (160) may be in close contact with the electronic device (200) and the heat dissipation device (100) to reduce the air gap between the electronic device (200) and the heat dissipation device (100), that is, the air gap between the electronic device (200) and the heat transfer part (120). In one embodiment, the heat transfer promoting part (160) may be manufactured from a thermal management composite material for a thermal interface material (TIM). By manufacturing the heat transfer promoting part (160) from a thermal management composite material, the heat transfer efficiency can be increased.

[0057] FIG. 7 is an exploded perspective view illustrating a heat dissipation device and an electronic device according to one embodiment of the present invention, FIG. 8 is a drawing explaining the method of combining the heat dissipation device and the electronic device according to one embodiment of the present invention, and FIG. 9 is a drawing showing the combined state of a communication relay device having a heat transfer promoting part according to one embodiment of the present invention.

[0058] Referring to FIGS. 7 to 9, the number of heat transfer promoting parts (160) may be less than or equal to the number of chip parts (250). As shown in FIG. 8, a plurality of chip parts (250) may be in contact with one heat transfer promoting part (160), or a single chip part (250) may be in contact with one heat transfer promoting part (160). That is, a plurality of chip parts (250) may be in contact with at least one heat transfer promoting part (160) among the heat transfer promoting parts (160).

[0059] Additionally, as illustrated in FIG. 8, the sum of the planar areas of the heat transfer promoting section (160) facing the chip section (250) may be greater than or equal to the sum of the planar areas of the heat transfer promoting section (160) facing the chip section (250). That is, the size of the heat transfer promoting section (160) in contact with the chip section (250) may be formed to have a size greater than or equal to the size of the chip section (250) or the chip section (250). Furthermore, the size of the planar area of ​​the heat transfer promoting section (160) facing the chip section (250) may be greater than or equal to the size of the planar area of ​​the chip section (250) facing the heat transfer promoting section (160). In this way, the heat transfer performance can be improved by forming the planar area of ​​the heat transfer promoting section (160) to be greater than or equal to the planar area of ​​the chip section (250).

[0060] In one embodiment, a plurality of heat transfer promoting members (160) are provided, and some of the plurality of heat transfer promoting members (160) may have different hardness or different compression ratios. That is, the heat transfer promoting members (160) may have a material, hardness, or compression ratio that is efficient for heat dissipation from the chip portion (250) so as to efficiently dissipate heat generated from the chip portion (250).

[0061] The heat dissipation performance enhancement part (300) is formed to penetrate the body part (110) so that a communication component is inserted therein and is provided to enhance the heat dissipation performance of the communication component.

[0062] Hereinafter, the operation of a communication relay device having a heat transfer promoting member according to an embodiment of the present invention will be described with reference to the attached drawings.

[0063] Referring to FIGS. 1 to 9, heat is generated in an electronic device (200), such as a chip part (250), during operation of a communication relay device (1) according to one embodiment of the present invention. Since heat generated in the electronic device (200) causes problems with the lifespan and reliability of the equipment, it must be released to the outside. The heat generated in the electronic device (200) of this embodiment can be transferred to a heat transfer part (120) through a heat transfer promoting part (160) and released to the outside through a heat dissipation device (100). At this time, the heat transfer promoting part (160) reduces the air gap that may be generated at the contact surface in contact with the electronic device (200) and the heat transfer part (120), so that the heat generated in the electronic device (200), etc. can be efficiently released.

[0064] In addition, if the heat transfer promoting part (160) is attached to all parts where the electronic device (200) and the heat dissipation device (100) overlap, the occurrence of an air gap between the electronic device (200) and the heat dissipation device (100) can be minimized, thereby increasing heat dissipation efficiency; however, since components in the electronic device (200) are provided protruding from the electronic device (200), the heat transfer promoting part (160) cannot be attached to all sides of the electronic device (200). Therefore, according to one embodiment of the present invention, a plurality of heat transfer promoting parts (160) attached to the heat transfer part (120) are provided spaced apart. In addition, the heat transfer promoting part (160) must be in contact with the heat transfer part (120) over a wide area to improve heat transfer efficiency.

[0065] As shown in FIG. 8, the electronic device (200) and the heat dissipation device (100) are installed facing each other in a state where they are folded along a virtual line (H). In actual installation, the electronic device (200) is fixed in a state where it is placed on the heat dissipation device (100), but the structure in which the electronic device (200) and the heat dissipation device (100) are arranged is explained with reference to FIG. 8 and FIG. 9. Among the communication chips (270), chips 5 to 8 are installed to be in contact with the heat transfer promoting part (160) connected to line B, chip 9 among the communication chips (270) is installed to be in contact with the heat transfer promoting part (160) connected to line C, and chips 1 to 4 among the communication chips (270) can be installed to be in contact with the heat transfer promoting part (160) connected to line D. Additionally, among the non-communication chips (280), chip number 10 may be installed in contact with the heat transfer promoting part (160) connected to the F line, and chip number 11 among the non-communication chips (280) may be installed in contact with the heat transfer promoting part (160) connected to the E line.

[0066] Table 1 below is a table showing the cooling efficiency when the heat transfer promoting part (160) is provided when the temperature of the chip part (250) is 105 degrees (°C). As can be seen from Table 1 below, the measured temperature when the heat transfer promoting part (160) is provided is much lower than the measured temperature when the heat transfer promoting part (160) is not provided. Since the performance of the communication relay device (1) is greatly influenced by the temperature of the chip part (250), it can be seen from the table below that the communication relay device (1) according to one embodiment of the present invention has much superior cooling performance, etc., compared to conventional communication relay devices.

[0067]

[0068] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the claims below. Explanation of the symbols

[0069] 1 : Communication relay device 100 : Heat dissipation device 110: Body part 120: Heat transfer part 160 : Heat transfer promoting part 200 : Electronic device 250: Chip section 270: Communication chip 280: Non-communication chip 300: Heat dissipation performance enhancement part

Claims

Claim 1 A communication relay device having a heat transfer promoting unit, comprising: an electronic device provided in a communication relay device; a chip portion provided in the electronic device; a heat dissipation device for dissipating heat generated from the chip portion; and a heat transfer promoting portion that contacts the chip portion and the heat dissipation device and transfers heat from the chip portion to the heat dissipation device; wherein the heat dissipation device comprises: a body portion installed in the communication relay device; and a heat transfer portion formed to protrude from the body portion in the direction of the chip portion, on which the heat transfer promoting unit is mounted; and further comprising a pressure amount correction portion formed to protrude from the body portion and provided between the heat dissipation device and the electronic device, for consistently correcting the pressure amount of the heat transfer promoting unit. Claim 2 delete Claim 3 A communication relay device having a heat transfer promoting unit, characterized in that, in claim 1, the above-mentioned compression amount correction unit is provided in a plurality of units spaced apart from each other. Claim 4 A communication relay device having a heat transfer promoting part characterized in that, in claim 1, the heat transfer promoting part has elasticity. Claim 5 A communication relay device having a heat transfer promoting member, wherein, in claim 1, the heat transfer promoting member is in close contact with the electronic device and the heat dissipation device to reduce the air gap between the electronic device and the heat dissipation device. Claim 6 A communication relay device having a heat transfer promoting unit, wherein, in claim 1, the chip unit comprises a plurality of communication chips; and a non-communication chip spaced apart from the communication chips. Claim 7 A communication relay device having a heat transfer promoting part, characterized in that, in claim 1, the number of the heat transfer promoting part is less than or equal to the number of the chip part. Claim 8 A communication relay device having a heat transfer promoting part, characterized in that, in claim 7, a plurality of the above-mentioned chip parts are in contact with at least one of the above-mentioned heat transfer promoting parts. Claim 9 A communication relay device having a heat transfer promoting part, characterized in that, in claim 1, the sum of the planar areas of the heat transfer promoting part on the surface facing the chip part is greater than or equal to the sum of the planar areas of the chip part facing the heat transfer promoting part. Claim 10 A communication relay device having a heat transfer promoting part, characterized in that, in claim 1, the size of the plane of the heat transfer promoting part facing the chip part is greater than or equal to the size of the plane of the chip part facing the heat transfer promoting part. Claim 11 A communication relay device having a heat transfer promotion unit, wherein, in claim 1, the heat transfer unit is provided in a plurality of portions, and some of the plurality of heat transfer units have different heights in the direction of the heat transfer promotion unit. Claim 12 A communication relay device having a heat transfer promoting member, characterized in that, in any one of claims 1, 3 to 11, the heat transfer promoting member is provided in a plurality of such members, and some of the plurality of such members have different hardness or different compression ratios. Claim 13 A communication relay device having a heat transfer promoting member, characterized in that, in any one of claims 1, 3 to 11, the heat transfer promoting member is manufactured from a thermal management composite material for a thermal interface material (TIM). Claim 14 A communication relay device having a heat transfer promoting member, characterized in that, in any one of claims 1, 3 to 11, the heat transfer member is provided in a plurality of spaced-apart units.

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