Camera module assembly device using induction heating

Abstract

The present invention relates to a camera module assembly device using induction heating, and more specifically comprises: a lens alignment unit equipped with a lens gripper for gripping a lens module mounted on a support; a sensor alignment unit equipped with a sensor gripper for gripping an image sensor inserted into the upper side of the lens module mounted on the support; a soldering bonding head that induction-heats and solders the lens module and the image sensor, respectively gripped by the lens gripper and the sensor gripper while mounted on the support; and a bonding head transfer that transfers the soldering bonding head to a soldering position. This configuration has the effect of automating a series of processes for assembling a lens module and an image sensor into a camera module by aligning the optical axes and reducing assembly time.

Description

Technology Field

[0001] The present invention relates to a camera module assembly device using induction heating, and more particularly to a camera module assembly device using induction heating capable of accurately aligning the optical axes of an image sensor and a lens module. Background Technology

[0002] Recently, there has been an increasing number of cases where cameras are installed in vehicles for purposes such as parking guidance or surrounding surveillance. Additionally, there is a growing demand to install cameras in vehicles for monitoring purposes to perform automated driving functions, such as lane keeping and traffic sign recognition.

[0003] Generally, cameras mounted on vehicles are configured as modules assembled from an image sensor PCB with an image sensor and a lens holder with a lens.

[0004] However, if the optical axis between the lens and the image sensor is not precisely aligned during the assembly of the camera module, it is difficult to implement a camera module with the desired high-performance capabilities.

[0005] In other words, when capturing a subject with a camera module, light entering from the subject through the lens must be focused at the correct position on the image sensor to obtain a clear image. However, if the camera module is assembled without the optical axis being properly aligned, the image information received by the image sensor becomes inaccurate, which significantly reduces the reliability of the camera module. Therefore, to implement a high-performance camera module with high reliability, the optical axis between the lens and the image sensor must be precisely aligned during camera module assembly.

[0006] To achieve this, the current process involves precisely aligning the image sensor PCB and lens, spraying epoxy between the image sensor and lens, pre-curing the outer surface by irradiating the epoxy with UV light, and then placing it in a high-temperature oven to complete a camera module that is fully cured to the interior.

[0007] However, since epoxy requires a long curing time—to the extent that it takes several days—too much time is invested in the pre-curing and main-curing processes, and there are inconveniences associated with large and cumbersome equipment. Prior art literature

[0008] Registered Patent 10-2666610 The problem to be solved

[0009] The present invention was devised to solve the problems of the aforementioned prior art, and aims to provide a camera module assembly device using induction heating that can accurately align the optical axes of an image sensor and a lens module, increase the assembly efficiency of the camera module, and realize a high-performance camera with high reliability. means of solving the problem

[0010] A camera module assembly device using induction heating according to the present invention for solving the above-mentioned problem comprises: a lens alignment unit equipped with a lens gripper for gripping a lens module mounted on a support; a sensor alignment unit equipped with a sensor gripper for gripping an image sensor inserted into the upper side of the lens module mounted on the support; a soldering bonding head that solders the lens module and the image sensor, respectively gripped by the lens gripper and the sensor gripper while mounted on the support, by induction heating; and a bonding head transfer that transfers the soldering bonding head to a soldering position.

[0011] In addition, the present invention further comprises a chart unit for determining whether the shooting area of ​​an image sensor mounted on the support matches a setting area set on the image sensor.

[0012] Meanwhile, the soldering bonding head comprises: an induction heating coil that induction heats and solders the lens module and the image sensor; a coil fixing body on which the induction heating coil is wound; and an upper cover and a side cover respectively coupled to the upper surface and the side surface of the coil fixing body.

[0013] Here, the induction heating coil is formed in a tube shape and a cooling water supply pipe is connected to the top, and is cooled by cooling water supplied to the inside through the cooling water supply pipe.

[0014] In addition, a steel solder pin is provided on the upper surface of the lens module, a pinhole is formed in the image sensor through which the solder pin passes, and a solder loop made of solder paste is installed through the solder pin, and the lens module and the image sensor are assembled by welding the solder loop by the induction heating coil.

[0015] In addition, a magnetic core is installed in the upper cover such that its lower end is adjacent to the upper surface of the solder pin.

[0016] Here, the magnetic core comprises an up-and-down adjustment jig that is spirally coupled to the upper cover and whose position is adjusted vertically; and a magnetic flux focusing core that is inserted and fixed to the up-and-down adjustment jig and whose lower end is adjacent to the upper surface of the solder pin. Effects of the invention

[0017] The camera module assembly device using induction heating according to the present invention, configured as described above, has the advantage of being able to automate a series of processes for assembling a camera module by aligning the lens module and the image sensor with optical axes.

[0018] In addition, the simplified process can improve the assembly efficiency of the camera module, and since the UV-induced epoxy pre-curing process and the oven-based main curing process are eliminated, there are advantages in reducing facility costs, operating costs, and power consumption.

[0019] In addition, since alignment and solder bonding processes are performed within a single piece of equipment, the equipment becomes smaller and the process is simplified, offering the advantage of reduced costs and manpower.

[0020] In addition, there is an advantage in that a fast process yield can be achieved through induction heating solder bonding. Brief explanation of the drawing

[0021] FIG. 1 is a drawing showing the external appearance of a camera module assembly device using induction heating according to the present invention. FIGS. 2 and FIGS. 3 are drawings showing the interior of a camera module assembly device using induction heating according to the present invention. FIG. 4 is a figure showing a lens alignment unit according to the present invention. FIG. 5 is a figure showing a sensor alignment unit according to the present invention. FIGS. 6 to 8 show a soldering joint head according to the present invention. FIG. 9 is a simplified diagram showing the process of assembling a lens module and an image sensor according to the present invention. Specific details for implementing the invention

[0022] Hereinafter, an embodiment of a camera module assembly device using induction heating according to the present invention will be described in detail with reference to the attached drawings.

[0023] FIG. 1 is a drawing showing the exterior of a camera module assembly device using induction heating according to the present invention, and FIG. 2 and FIG. 3 are drawings showing the interior of a camera module assembly device using induction heating according to the present invention.

[0024] Also, FIG. 4 is a drawing showing a lens alignment unit according to the present invention, FIG. 5 is a drawing showing a sensor alignment unit according to the present invention, and FIG. 6 to 8 are drawings showing a soldering bonding head according to the present invention.

[0025] In addition, FIG. 9 is a simplified diagram showing the process of assembling a lens module and an image sensor according to the present invention.

[0026] A camera module assembly device using induction heating according to the present invention comprises a lens alignment unit (20) for positioning a lens module (L), a sensor alignment unit (30) for positioning an image sensor (S), a soldering bonding head (40) for soldering the lens module (L) and the image sensor (S), a bonding head transfer (50) for transferring the soldering bonding head (40) to a soldering position, and a chart unit (60) for establishing a reference when capturing an image of the image sensor (S).

[0027] The lens alignment unit (20) comprises a frame (21), a support (22) installed on the upper surface of the frame (21), an actuator (23) installed on the lower surface of the support (22), and a lens gripper (24) that operates by receiving power from the actuator (23) to grip a lens module (L) mounted on the support (22).

[0028] The above support (22) consists of a table (22a) and a mounting bracket (22b) installed on the table (22a).

[0029] One end of the table (22a) is bolted to the upper surface of the frame (21), and the other end extends outward toward the sensor alignment unit (30). A mounting hole (22c) is formed in this table (22a) for installing a mounting base (22b) and a lens gripper (24).

[0030] The above mounting base (22b) is installed at the end of the mounting hole (22c) of the table (22a), and the lens module (L) and image sensor (S) are mounted thereon.

[0031] The actuator (23) is a pneumatic cylinder that is kinetically connected to the lens gripper (24) to operate the lens gripper (24).

[0032] The lens gripper (24) grips or releases the lens module (L) by moving the two horizontally positioned pressure plates closer or further apart within the mounting hole (22c). Here, since the end of the lens gripper (24) goes under the mounting plate (22b), the lens gripper (24) grips the lower part of the lens module (L) that protrudes under the mounting plate (22b).

[0033] The sensor alignment unit (30) comprises a 6-axis movement unit (31), an actuator (32) connected to the 6-axis movement unit (31), and a sensor gripper (33) that operates by receiving power from the actuator (32) to grip an image sensor (S) placed on the upper side of a lens module (L) mounted on a support (22).

[0034] The above 6-axis movement unit (31) performs 6-axis movement in the X / Y / Z / Tx / R / Ty directions, and through this 6-axis movement, the image sensor (S) can be accurately positioned when inserted into the upper side of the lens module (L).

[0035] The actuator (32) is a pneumatic cylinder that is dynamically connected to the sensor gripper (33) to operate the sensor gripper (33).

[0036] The sensor gripper (33) grips or releases the image sensor (S) by moving two horizontally positioned pressure plates closer to or further apart from each other. Here, since the sensor gripper (33) operates above the mounting base (22b), it grips the image sensor (S) assembled on the upper part of the lens module (L) protruding above the mounting base (22b).

[0037] The above soldering bonding head (40) solders the lens module (L) and image sensor (S), which are respectively held by the lens gripper (24) and sensor gripper (33) while seated on the mounting base (22b) of the support (22), by fluid heating.

[0038] The soldering bonding head (40) comprises an induction heating coil (41) for induction heating and soldering a lens module (L) and an image sensor (S), a coil fixing body (42) on which the induction heating coil (41) is wound, an upper cover (43) and a side cover (44) respectively coupled to the upper surface and side of the coil fixing body (42), and a magnetic core (45) installed on the upper cover (43).

[0039] The above-mentioned induction heating coil (41) solders the lens module (L) and the image sensor (S). Further details regarding the soldering of the lens module (L) and the image sensor (S) are as follows.

[0040] A plurality of solder pins (L1) are provided on the upper surface of the lens module (L), and a plurality of pinholes (S1) through which the solder pins (L1) pass are formed in the image sensor (S), and a solder ring (L2), which is in the shape of a circular ring made of solder paste, is installed through the solder pins (L1). At this time, the solder pins (L1) and the pinholes (S1) are formed at a point where the optical axes align precisely when the lens module (L) and the image sensor (S) are assembled.

[0041] In this state, when power is supplied, the solder pin (L1) and the solder ring (L2) are heated and fused by the induction heating coil (41), thereby completing the assembly of the lens module (L) and the image sensor (S). Here, the solder pin (L1) is made of a steel material with good thermal conductivity, for example, a stainless metal series or a metal plated with tin or nickel on stainless metal, so that when the solder pin (L1) is heated, heat is quickly transferred, which helps to help the solder ring (L2) fuse more quickly.

[0042] Meanwhile, it is also possible to preheat the solder pin (L1) by irradiating it with a laser from a laser oscillator (not shown) before heating the solder pin (L1) and the solder ring (L2) with the induction heating coil (41), thereby allowing the subsequent induction heating of the solder pin (L1) by the induction heating coil (41) to be completed quickly.

[0043] Such an induction heating coil (41) can be configured in a tube shape to adopt water-cooling. Accordingly, a cooling water supply pipe (46) is connected to the top of the induction heating coil (41), and cooling water is supplied to the inside of the induction heating coil (41) through this cooling water supply pipe (46) so that the induction heating coil (41) can be rapidly cooled by the cooling water.

[0044] The magnetic core (45) is installed to penetrate the upper cover (43), so that its lower portion is adjacent to the upper surface of the solder pin (L1).

[0045] This magnetic core (45) is composed of an up-and-down adjustment jig (45a) and a magnetic flux focusing core (45b) that is inserted and fixed to the up-and-down adjustment jig (45a).

[0046] The above-described vertical adjustment jig (45a) is spirally coupled to the upper cover (43) to adjust the vertical position.

[0047] The above magnetic flux focusing core (45b) is made of a cylindrical ferrite material with a small diameter and is inserted and fixed to the vertical adjustment jig (45a), so that it moves together with the vertical adjustment jig (45a) when the jig (45a) rises or falls. Thus, the distance between the magnetic flux focusing core (45b) and the solder pin (L1) can be adjusted.

[0048] Accordingly, when the induction heating reaction is very slow, the distance between the magnetic flux focusing core (45b) and the solder pin (L1) is shortened, and conversely, when the induction heating reaction is excessively fast, the distance between the magnetic flux focusing core (45b) and the solder pin (L1) is increased. In this way, the induction heating reaction can be controlled by adjusting the distance between the magnetic flux focusing core (45b) and the solder pin (L1).

[0049] The above-mentioned joining head transfer (50) comprises a frame (51), a rail (52) installed on the frame (51), and a driving motor (53) installed at one end of the rail (52).

[0050] The above rail (52) is installed and fixed at the upper end of the frame (51).

[0051] The above drive motor (53) is kinetically connected to the soldering bonding head (40), so that when the drive motor (53) operates and the motor shaft rotates, this rotational force is transmitted to the soldering bonding head (40) and moves in a straight line along the rail (52).

[0052] The chart unit (60) above establishes a reference when capturing an image with the image sensor (S), is provided on the lower side of the support (22), and determines whether the shooting area of ​​the image sensor (S) mounted on the support (22) matches the setting area set in the image sensor (S). At this time, the image values ​​captured by the image sensor (S) are displayed through a monitor (11) provided on the outside of the housing (10) corresponding to the external shape of the present invention.

[0053] The operation of the camera module assembly device according to the present invention configured as described above is briefly explained as follows.

[0054] The lens module (L) is inserted into the mounting base (22b) and secured, and the lower part of the lens module (L) protruding from the lower side of the mounting base (22b) is gripped and secured using the lens gripper (24).

[0055] Afterward, the image sensor (S) is inserted into the upper surface of the lens module (L) to assemble the lens module (L) and the image sensor (S). At this time, the solder pin (L1) of the lens module (L) is made to pass through the pinhole (S1) of the image sensor (S).

[0056] When the image sensor (S) is placed on the upper surface of the lens module (L), the image sensor (S) is gripped and fixed with the sensor gripper (33).

[0057] After the lens module (L) and image sensor (S) are firmly gripped by the lens gripper (24) and sensor gripper (33), respectively, through the above process, an alignment process is performed to accurately align the optical axis.

[0058] That is, an alignment step using an image is performed through the chart unit (60), and then the lens gripper (24) of the lens alignment unit (20) and the sensor gripper (33) of the sensor alignment unit (30) are finely adjusted to align the optical axis of the lens module (L) and the image sensor (S).

[0059] When the optical axis of the lens module (L) and the image sensor (S) aligns, the solder pin (L1) and the solder ring (L2) are fused through the induction heating coil (41) of the soldering bonding head (40) to complete the assembly.

[0060] The embodiments according to the present invention described above are not intended to limit the present invention and may be modified and embodied in various forms within the scope described in the claims of the present invention and the equivalent scope. Explanation of the symbols

[0061] 10: Housing 11: Monitor 20: Lens alignment unit 21: Frame 22: Support 22a: Table 22b: Mounting bracket 22c: Mounting hole 23: Actuator 24: Lens gripper 30: Sensor alignment unit 31: 6-axis motion unit 32: Actuator 33: Sensor gripper 40: Soldering joint head 41: Induction heating coil 42: Coil fixing body 43: Upper cover 44: Side cover 45: Magnetic core 45a: Vertical adjustment jig 45b: Magnetic flux focusing core 46: Coolant supply pipe 50: Joint head transfer 51: Frame 52: Rail 53: Drive motor 60: Chart unit L: Lens module L1: Solder pin L2: Solder loop S: Image sensor S1: Pinhole

Claims

Claim 1 A camera module assembly device comprising: a lens alignment unit (20) equipped with a lens gripper (24) for gripping a lens module (L) mounted on a support (22); a sensor alignment unit (30) equipped with a sensor gripper (33) for gripping an image sensor (S) inserted into the upper side of the lens module (L) mounted on the support (22); a soldering bonding head (40) for soldering the lens module (L) and the image sensor (S), which are respectively gripped by the lens gripper (24) and the sensor gripper (33) while mounted on the support (22), by induction heating; and a bonding head transfer (50) for transferring the soldering bonding head (40) to a soldering position; wherein the soldering bonding head (40) comprises an induction heating coil (41) for soldering the lens module (L) and the image sensor (S) by induction heating; A camera module assembly device using induction heating, comprising: a coil fixing body (42) on which the induction heating coil (41) is wound; and an upper cover (43) and a side cover (44) respectively coupled to the upper surface and the side surface of the coil fixing body (42); wherein a steel solder pin (L1) is provided on the upper surface of the lens module (L), a pin hole (S1) through which the solder pin (L1) passes is formed in the image sensor (S), and a solder ring (L2) made of solder paste is installed through the solder pin (L1), and the lens module (L) and the image sensor (S) are assembled by welding the solder ring (L2) by the induction heating coil (41). Claim 2 A camera module assembly device using induction heating, characterized by further comprising: a chart unit (60) for determining whether the shooting area of ​​the image sensor (S) mounted on the support (22) of claim 1 matches the setting area set in the image sensor (S). Claim 3 delete Claim 4 A camera module assembly device using induction heating according to claim 1, wherein the induction heating coil (41) is formed in a tube shape and a cooling water supply pipe is connected to the top, and is cooled by cooling water supplied inside through the cooling water supply pipe (46). Claim 5 delete Claim 6 A camera module assembly device using induction heating according to claim 1, characterized in that a magnetic core (45) is installed in the upper cover (43), the lower end of which is adjacent to the upper surface of the solder pin (L1). Claim 7 A camera module assembly device using induction heating according to claim 6, wherein the magnetic core (45) is composed of an up-and-down adjustment jig (45a) that is spirally coupled to the upper cover (43) and whose position is adjusted up and down; and a magnetic flux focusing core (45b) that is inserted and fixed to the up-and-down adjustment jig (45a) and whose lower end is adjacent to the upper surface of the solder pin (L1). Claim 8 A camera module assembly device using induction heating according to claim 1, wherein the solder pin (L1) is characterized by being a stainless metal plated with tin or nickel.

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