Vertical light-emitting diode package structure and manufacturing method thereof

Abstract

A vertical light-emitting diode package structure includes a first structural layer, a second structural layer, and a third structural layer. The second structural layer is connected to the first structural layer. The third structural layer is connected to the second structural layer such that the second structural layer is arranged between the first structural layer and the third structural layer. The first structural layer includes a first substrate and a first light-emitting element. The second structural layer includes a second substrate and a second light-emitting element. The third structural layer includes a third substrate and a third light-emitting element. The first light-emitting element, the second light-emitting element, and the third light-emitting element are individually disposed on the upper surfaces of the first substrate, the second substrate, and the third substrate.

Description

Technology Field

[0001] The present disclosure relates to a light-emitting diode package structure. More specifically, the present disclosure relates to a vertical light-emitting diode package structure capable of improving ease of manufacturing and reducing its size, and a method for manufacturing the same. Background Technology

[0002] Conventional light-emitting diode (LED) package structures include LEDs and dummy plugs fixed on a substrate. After the LEDs and dummy plugs are electrically connected, they are packaged together with adhesive. However, in conventional package structures, the LEDs are arranged horizontally. This means that LEDs of different colors must be arranged separately in the horizontal direction, which causes the package structure to become too large and makes it difficult to achieve compactness. The problem to be solved

[0003] Included within this specification. means of solving the problem

[0004] According to one aspect of the present disclosure, a vertical light-emitting diode package structure comprises a first structural layer, a second structural layer, and a third structural layer. The first structural layer comprises a first substrate, four first conductive elements, a first light-emitting element, and a first dummy plug. The first substrate has an upper surface and a bottom surface opposite to the upper surface. The four first conductive elements extend respectively from the upper surface to the bottom surface of the first substrate. The first light-emitting element is disposed on and electrically connected to the end surface of one of the four first conductive elements located on the upper surface of the first substrate. The first dummy plug is disposed on and electrically connected to the end surface of the other of the four first conductive elements located on the upper surface of the first substrate. The second structural layer is connected to the first structural layer, and the second structural layer comprises a second substrate, three second conductive elements, a second light-emitting element, and a second dummy plug. The second substrate has an upper surface and a lower surface opposite to the upper surface. Three second conductive elements extend individually from the upper surface to the lower surface of the second substrate, and the three second conductive elements are individually electrically connected to three of the four first conductive elements that are free from connection to the first light-emitting element. The second light-emitting element is placed on the end surface of one of the three second conductive elements located on the upper surface of the second substrate and is electrically connected. A second dummy plug is placed on the end surface of the other of the three second conductive elements located on the upper surface of the second substrate and is electrically connected.A third structural layer is connected to a second structural layer such that a second structural layer is arranged between the first structural layer and the third structural layer, and the third structural layer comprises a third substrate, two third conductive elements, a third light-emitting element, and a third dummy plug. The third substrate has an upper surface and a lower surface opposite to the upper surface. Two third conductive elements extend individually from the upper surface to the lower surface of the third substrate, and the two third conductive elements are individually electrically connected to two of three second conductive elements that are free from connection to the second light-emitting element. The third light-emitting element is placed on the end surface of one of the two third conductive elements located on the upper surface of the third substrate and is electrically connected. The third dummy plug is placed on the end surface of the other of the two third conductive elements located on the upper surface of the third substrate and is electrically connected.

[0005] According to another aspect of the present disclosure, a method for manufacturing a vertical light-emitting diode package structure comprises steps outlined below. A first-conductive-element arranging step is performed to individually extend four first conductive elements from the upper surface to the lower surface of a first substrate. A first arranging step is performed to obtain a first structural layer by individually arranging a first light-emitting element and a first dummy plug on the end surfaces of two of the four first conductive elements located on the upper surface of the first substrate, and to individually electrically connect them to two of the four first conductive elements. A second-conductive-element arranging step is performed to individually extend three second conductive elements from the upper surface to the lower surface of a second substrate. A second arrangement step is performed to obtain a second structural layer by individually arranging a second light-emitting element and a second dummy plug on the end surfaces of two of three second conductive elements located on the upper surface of the second substrate, and to make them individually electrically connected to two of the three second conductive elements. A third-conductive-element arranging step is performed to individually extend two third conductive elements from the upper surface to the lower surface of the third substrate. A third arrangement step is performed to obtain a third structural layer by individually arranging a third light-emitting element and a third dummy plug on the end surfaces of two third conductive elements located on the upper surface of the third substrate, and to make them electrically connected to the two third conductive elements.An assembling step is performed to form a vertical light-emitting diode package structure such that a first structural layer, a second structural layer, and a third structural layer are sequentially stacked and connected, three second conductive elements are individually electrically connected to three of four first conductive elements that are free from connection to the first light-emitting element, and two third conductive elements are individually electrically connected to two of three second conductive elements that are free from connection to the second light-emitting element. Effects of the invention

[0006] Included within this specification. Brief explanation of the drawing

[0007] The present disclosure can be more fully understood by reading the following detailed description of the embodiments with reference to the accompanying drawings: FIG. 1A is a three-dimensional schematic diagram of a vertical light-emitting diode package structure according to one embodiment of the present disclosure. Figure 1B is an exploded schematic diagram of the vertical light-emitting diode package structure of Figure 1A. FIG. 2A is a schematic cross-sectional view of the vertical light-emitting diode package structure of FIG. 1A along line 2A-2A. FIG. 2B is a schematic cross-sectional view of the vertical light-emitting diode package structure of FIG. 1A along line 2B-2B. FIG. 3 is a three-dimensional schematic diagram of a vertical light-emitting diode package structure according to another embodiment of the present disclosure. FIG. 4A is a schematic diagram of the lower part of the first substrate of FIG. 3. FIG. 4B is a schematic diagram of the lower part of the second substrate of FIG. 3. Fig. 4C is a schematic diagram of the lower part of the third substrate of Fig. 3. FIG. 5 is a step flow chart of a method for manufacturing a vertical light-emitting diode package structure according to another embodiment of the present disclosure. FIGS. 6A to 6H are cross-sectional schematic diagrams of each step in the method for manufacturing a vertical light-emitting diode package structure. FIGS. 7A to 7D are schematic cross-sectional views of each step in the method for manufacturing a vertical light-emitting diode package structure. Specific details for implementing the invention

[0008] The present disclosure will be further illustrated by the following specific embodiments. However, the embodiments may be applied to various inventive concepts and may be embodied within various specific ranges. The specific embodiments are for illustrative purposes only and are not limited to such practical details.

[0009] Refer to FIG. 1A and FIG. 1B. FIG. 1A is a three-dimensional schematic diagram of a vertical light-emitting diode package structure (100) according to one embodiment of the present disclosure. FIG. 1B is an exploded schematic diagram of the vertical light-emitting diode package structure (100) of FIG. 1A. The vertical light-emitting diode package structure (100) includes a first structural layer (110), a second structural layer (120), and a third structural layer (130). The second structural layer (120) is connected to the first structural layer (110). The third structural layer (130) is connected to the second structural layer (120) and causes the second structural layer (120) to be positioned between the first structural layer (110) and the third structural layer (130).

[0010] Refer to FIGS. 2A and FIGS. 2B. FIG. 2A is a schematic cross-sectional view of the vertical light-emitting diode package structure (100) of FIG. 1A along line 2A-2A. FIG. 2B is a schematic cross-sectional view of the vertical light-emitting diode package structure (100) of FIG. 1A along line 2B-2B. The first structural layer (110) comprises a first substrate (111), four first conductive elements (112), a first light-emitting element (113), and a first dummy plug (114). The first substrate (111) has an upper surface and a lower surface opposite to the upper surface. The four first conductive elements (112) individually extend from the upper surface to the lower surface of the first substrate (111) to cause the elements on both sides of the first substrate (111) to be electrically connected.

[0011] A first light-emitting element (113) is placed on the end surface of one of the four first conductive elements (112) located on the upper surface of the first substrate (111) and is electrically connected. A first dummy plug (114) is placed on the end surface of the other of the four first conductive elements (112) located on the upper surface of the first substrate (111) and is electrically connected. The first light-emitting element (113) and the first dummy plug (114) are fixed to the first conductive elements (112) through conductive glue so that structural and electrical connections can be achieved simultaneously, and the overall size of the first structural layer (110) can be reduced.

[0012] The second structural layer (120) comprises a second substrate (121), three second conductive elements (122), a second light-emitting element (123), and a second dummy plug (124). The second substrate (121) has an upper surface and a lower surface opposite the upper surface, and the second substrate (121) may have great light transmittance. The three second conductive elements (122) individually extend from the upper surface to the lower surface of the second substrate (121). The second light-emitting element (123) is placed on the end surface of one of the three second conductive elements (122) located on the upper surface of the second substrate (121) and is electrically connected. The second dummy plug (124) is placed on the end surface of the other of the three second conductive elements (122) located on the upper surface of the second substrate (121) and is electrically connected. The structure and arrangement of the elements within the second structural layer (120) are identical or similar to the first structural layer (110) mentioned above, and its details will not be given again here.

[0013] Three second conductive elements (122) are individually electrically connected to three of the four first conductive elements (112) that are free from connection to the first light-emitting element (113). More specifically, the three second conductive elements (122) can be electrically connected to the first conductive elements (112) through their end surfaces located on the lower surface of the second substrate (121). Additionally, the three second conductive elements (122) can be in more direct contact with the first dummy plug (114) through the end surfaces of the first conductive elements (112) located on the upper surface of the first substrate (111) or the end surfaces of the three second conductive elements (122) located on the lower surface of the second substrate (121), and can be connected via a conductive adhesive to achieve both structural and electrical connections simultaneously.

[0014] The third structural layer (130) comprises a third substrate (131), two third conductive elements (132), a third light-emitting element (133), and a third dummy plug (134). The third substrate (131) has an upper surface and a lower surface opposite to the upper surface, and the third substrate (131) may have a large light transmittance. Two third conductive elements (132) individually extend from the upper surface to the lower surface of the third substrate (131) and are electrically connected to two of three second conductive elements (122) that are individually free from connection to the second light-emitting element (123). The third light-emitting element (133) is positioned on the end surface of one of the two third conductive elements (132) located on the upper surface of the third substrate (131) and is electrically connected. A third dummy plug (134) is positioned on the other end surface of one of the two third conductive elements (132) located on the upper surface of the third substrate (131) and is electrically connected. The structure and arrangement of the elements within the third structural layer (130) are identical or similar to the first structural layer (110) and the second structural layer (120) described above, and their details will not be given again here.

[0015] It should be mentioned that three second conductive elements (122) can be aligned with three of four first conductive elements (112) that are individually free from connection to the first light-emitting element (113). Two third conductive elements (132) can be aligned with two of three second conductive elements (122) that are individually free from connection to the second light-emitting element (123), and four first conductive elements (112) can be arranged in a 2 x 2 array. Thus, it is advantageous to reduce the difficulty of structural arrangement and also to reduce the distance between elements. Additionally, the first light-emitting element (113), the second light-emitting element (123), and the third light-emitting element (133) can emit light independently without interference with each other.

[0016] Furthermore, the first light-emitting element (113) may be a red light-emitting element, the second light-emitting element (123) may be a green light-emitting element, and the third light-emitting element (133) may be a blue light-emitting element. In contrast, the area of ​​the first light-emitting element (113) may be larger than the area of ​​the second light-emitting element (123), and the area of ​​the second light-emitting element (123) may be larger than the area of ​​the third light-emitting element (133). Thus, the light emitted from the first light-emitting element (113) and the second light-emitting element (123) may be increased, which is advantageous for mixing color light of the vertical light-emitting diode package structure (100).

[0017] The vertical light-emitting diode package structure (100) may further include two adhesive layers (115, 125, glue layers) which can be arranged individually between the first structural layer (110) and the second structural layer (120), and between the second structural layer (120) and the third structural layer (1300). The two adhesive layers (115, 125) may provide a protective effect to improve the service life of the vertical light-emitting diode package structure (100). The vertical light-emitting diode package structure (100) may further include an adhesive layer (135). The adhesive layer (135) may be arranged on the upper surface of the third substrate (131) to cover the third light-emitting element (133) and the third dummy plug (134).

[0018] The vertical light-emitting diode package structure (100) may further include two conductive layers (116, 126, conductive layers) which can be arranged individually between the first structural layer (110) and the second structural layer (120), and between the second structural layer (120) and the third structural layer (130). The first structural layer (110), the second structural layer (120), and the third structural layer (130) can be electrically connected through the two conductive layers (116, 126). This is free from wire bonding for building circuits, reduces size, and improves manufacturing efficiency and yield. The vertical light-emitting diode package structure (100) may further include a conductive layer (136). The conductive layer (136) can be arranged on the upper surface of the adhesive layer (135) so that the vertical light-emitting diode package structure (100) is electrically connected to the outside.

[0019] Refer to FIG. 3. FIG. 3 is a three-dimensional schematic diagram of a vertical light-emitting diode package structure (200) according to another embodiment of the present disclosure. The vertical light-emitting diode package structure (200) is similar to the vertical light-emitting diode package structure (100) described above. The difference is that three second conductive elements (222) can be individually aligned with three of four first conductive elements (212), two third conductive elements (232) can be individually aligned with two of three second conductive elements (222), the first light-emitting element (213), the second light-emitting element (223), and the third light-emitting element (233) can be aligned, and four first conductive elements (212) can be arranged in a 2 x 2 array. By aligning the first light-emitting element (213), the second light-emitting element (223), and the third light-emitting element (233), a spatial mixing effect of color light is achieved, which can improve the application scope of the vertical light-emitting diode package structure (200).

[0020] Refer to FIGS. 4A, FIGS. 4B, and FIGS. 4C. FIG. 4A is a schematic diagram of the bottom of the first substrate (211) of FIG. 3. FIG. 4B is a schematic diagram of the bottom of the second substrate (221) of FIG. 3. FIG. 4C is a schematic diagram of the bottom of the third substrate (231) of FIG. 3. Since the first light-emitting element (213), the second light-emitting element (223), and the third light-emitting element (233) are aligned, the circuits of the three second conductive elements (222) and the two third conductive elements (232) must be arranged individually on the bottom surfaces of the second substrate (221) and the third substrate (231) to ensure that the circuit is properly constructed. In FIGS. 3 and 4B, the second conductive element (222) at the upper right corner is blocked by the first light-emitting element (213), and it is necessary for the conductive extending element (E1) to be electrically connected to the first conductive element (212). Similarly, in FIGS. 3 and 4C, the third conductive element (232) at the upper right corner is blocked by the second light-emitting element (223), and it is necessary for the conductive extending element (E2) to be electrically connected to the three second conductive elements (222).

[0021] Refer to FIGS. 5, FIGS. 6A, FIGS. 6B, FIGS. 6C, FIGS. 6D, FIGS. 6E, FIGS. 6F, FIGS. 6G, and FIGS. 6H. FIGS. 5 is a step flowchart of a method (300) for manufacturing a vertical light-emitting diode package structure according to another embodiment of the present disclosure. FIGS. 6A through 6H are individually schematic cross-sectional views of each step (300) of the method for manufacturing a vertical light-emitting diode package structure. The method (300) for manufacturing a vertical light-emitting diode package structure includes step (310), step (320), step (330), step (340), step (350), step (360), and step (370).

[0022] In step (310), a first conductive element arrangement step is performed so that four first conductive elements (112) individually extend from the upper surface to the lower surface of the first substrate (111). Refer to FIG. 6A. For example, if the first substrate (111) is taken here, the first substrate (111) may be a through glass via (TGV) substrate, which may have a high light transmittance and may include through holes (H) for arranging other elements. The number and location of the through holes (H) may be adjusted according to requirements, and the present disclosure is not limited thereto. Refer to FIG. 6B. Since the four first conductive elements (112) may be copper columns, they may be free from etching and manufacturing costs may be reduced. The four first conductive elements (112) may have head portions having a width greater than the diameter of the through hole (H). The adhesive can fill the space between the four first conductive elements (112) and the through hole (H), and between the head portions and the upper surface of the first substrate (111), thereby achieving the effect of fixing the four first conductive elements (112).

[0023] Refer to FIG. 6C. In step (320), to obtain a first structural layer (110), a first light-emitting element (113) and a first dummy plug (114) are individually arranged on two end surfaces of four first conductive elements (112) located on the upper surface of a first substrate (111), and a first arrangement step is performed to make them individually electrically connected to the two first conductive elements (112) mentioned above. Refer to FIG. 6D and FIG. 6E. When the first light-emitting element (113) and the first dummy plug (114) are arranged, an adhesive layer (115) may be arranged to cover the upper surfaces of the first substrate (111), the first light-emitting element (113), and the first dummy plug (114). Then, laser drilling is performed and a conductive layer (116) is arranged.

[0024] In step (330), a second conductive element arrangement step is performed so that three second conductive elements (122) individually extend from the upper surface to the lower surface of the second substrate (121). In step (340), a second arrangement step is performed so that a second light-emitting element (123) and a second dummy plug (124) are individually arranged on two end surfaces of the three second conductive elements (122) located on the upper surface of the second substrate (121) to obtain a second structural layer (120), and are individually electrically connected to the two second conductive elements (122). The details of steps (330) and (340) are individually identical or similar to steps (310) and (320), the details thereof of which will not be given again here.

[0025] In step (350), a third conductive element arrangement step is performed so that two third conductive elements (132) individually extend from the upper surface to the lower surface of the third substrate (131). In step (360), a third arrangement step is performed so that a third light-emitting element (133) and a third dummy plug (134) are individually arranged on the end surfaces of two third conductive elements (132) located on the upper surface of the third substrate (131) to obtain a third structural layer (130), and are individually electrically connected to the two third conductive elements (132). The details of steps (350) and (360) are individually identical or similar to steps (310) and (320), the details thereof of which will not be given again here.

[0026] In step (370), an assembly step is performed such that a first structural layer (110), a second structural layer (120), and a third structural layer (130) are sequentially stacked and connected to form a vertical light-emitting diode package structure (100), three second conductive elements (122) are individually electrically connected to three of four first conductive elements (112) that are free from connection to the first light-emitting element (113), and two third conductive elements (132) are individually electrically connected to two of three second conductive elements (122) that are free from connection to the second light-emitting element (123). Refer to FIGS. 6F through 6H. To be more specific, a conductive adhesive may be applied first to the locations of the first structural layer (110), the second structural layer (120), and the third structural layer (130) to be electrically connected. Then, the first structural layer (110), the second structural layer (120), and the third structural layer (130) are aligned, stacked, and compressed, and then cut to obtain a plurality of vertical light-emitting diode package structures (100).

[0027] Refer to FIGS. 7A, 7B, 7C, and 7D. FIGS. 7A through 7D are different cross-sectional schematic diagrams of each step in the method (300) for manufacturing a vertical light-emitting diode package structure. In FIGS. 7A through 7D, four first conductive elements (212), three second conductive elements (222), and two third conductive elements (232) are manufactured by a chemical plating method. For example, a seed layer (C) may first be sputtered into a through hole (H) of a first substrate (211), and then the through hole (H) is filled by a chemical plating method to form four first conductive elements (212), three second conductive elements (222), and two third conductive elements (232). In FIG. 7D, the thickness can be reduced by a chemical plating method, and the package size can be further reduced. Furthermore, since it is free from filling with adhesive for fixing, the complexity of manufacturing can be reduced.

[0028] In this regard, within the vertical light-emitting diode package structure of the present disclosure, the first light-emitting element, the second light-emitting element, and the third light-emitting element are stacked in a vertical direction, and the structural size after packaging can be effectively reduced. In addition, by adopting independent packaging and a modular design, the manufacturing process of die bonding can be simplified, and the difficulty of testing and repairing can be reduced.

[0029] Although the present disclosure has been described in considerable detail with reference to specific embodiments thereof, other embodiments are possible. Accordingly, the spirit and scope of the appended claims should not be limited to the description of the embodiments included herein.

[0030] It will be apparent to those skilled in the art that various modifications and variations may be made to the structure of this disclosure without departing from the scope or spirit of this disclosure. In view of the foregoing, this disclosure is intended to encompass such modifications and variations as long as they are within the scope of the following claims.

Claims

Claim 1 A first structural layer; a second structural layer connected to the first structural layer; and a third structural layer connected to the second structural layer so as to arrange the second structural layer between the first structural layer and the third structural layer; wherein the first structural layer comprises: a first substrate having an upper surface and a lower surface opposite to the upper surface; four first conductive elements individually extending from the upper surface to the lower surface of the first substrate; and a first light-emitting element disposed on and electrically connected to an end surface of one of the four first conductive elements located on the upper surface of the first substrate. and a first dummy plug disposed on and electrically connected to another end surface of the four first conductive elements located on the upper surface of the first substrate; and the second structural layer comprises: a second substrate having an upper surface and a lower surface opposite to the upper surface; three second conductive elements extending individually from the upper surface to the lower surface of the second substrate, the three second conductive elements being electrically connected to three of the four first conductive elements that are individually free from connection to the first light-emitting element; and a second light-emitting element disposed on and electrically connected to the end surface of one of the three second conductive elements located on the upper surface of the second substrate. and a second dummy plug disposed on and electrically connected to another end surface of the three second conductive elements located on the upper surface of the second substrate; and the third structural layer comprises: a third substrate having an upper surface and a lower surface opposite to the upper surface; two third conductive elements extending individually from the upper surface to the lower surface of the third substrate, the two third conductive elements being electrically connected to two of the three second conductive elements that are individually free from connection to the second light-emitting element;A vertical light-emitting diode package structure comprising: a third light-emitting element disposed on and electrically connected to the end surface of one of the two third conductive elements located on the upper surface of the third substrate; and a third dummy plug disposed on and electrically connected to the end surface of the other of the two third conductive elements located on the upper surface of the third substrate. Claim 2 A vertical light-emitting diode package structure according to claim 1, wherein the three second conductive elements are individually aligned with three of the four first conductive elements that are free from connection to the first light-emitting element, and the two third conductive elements are individually aligned with two of the three second conductive elements that are free from connection to the second light-emitting element. Claim 3 In paragraph 2, the vertical light-emitting diode package structure in which the four first conductive elements are arranged in a 2 x 2 array. Claim 4 A vertical light-emitting diode package structure according to claim 1, wherein the three second conductive elements are individually aligned with three of the four first conductive elements, the two third conductive elements are individually aligned with two of the three second conductive elements, and the first light-emitting element, the second light-emitting element, and the third light-emitting element are aligned. Claim 5 In claim 4, the vertical light-emitting diode package structure in which the four first conductive elements are arranged in a 2 x 2 array. Claim 6 A vertical light-emitting diode package structure according to claim 1, wherein the first light-emitting element is a red light-emitting element, the second light-emitting element is a green light-emitting element, and the third light-emitting element is a blue light-emitting element. Claim 7 A step of performing a first conductive element arrangement step to individually extend four first conductive elements from the upper surface to the lower surface of a first substrate; a step of performing a first arrangement step to individually arrange a first light-emitting element and a first dummy plug on two end surfaces of the four first conductive elements located on the upper surface of the first substrate to obtain a first structural layer, and to individually electrically connect them to the two of the four first conductive elements; a step of performing a second conductive element arrangement step to individually extend three second conductive elements from the upper surface to the lower surface of a second substrate; a step of performing a second arrangement step to individually arrange a second light-emitting element and a second dummy plug on two end surfaces of the three second conductive elements located on the upper surface of the second substrate to obtain a second structural layer, and to individually electrically connect them to the two of the three second conductive elements; and a step of performing a third conductive element arrangement step to individually extend two third conductive elements from the upper surface to the lower surface of a third substrate. Step; to obtain a third structural layer, a third light-emitting element and a third dummy plug are individually arranged on the end surfaces of the two third conductive elements located on the upper surface of the third substrate, and a third arrangement step is performed to make them electrically connected to the two third conductive elements;A method for manufacturing a vertical light-emitting diode package structure, comprising the step of performing an assembly step such that the first structural layer, the second structural layer, and the third structural layer are sequentially stacked and connected to form a vertical light-emitting diode package structure, wherein the three second conductive elements are individually electrically connected to three of the four first conductive elements that are free from connection to the first light-emitting element, and the two third conductive elements are individually electrically connected to two of the three second conductive elements that are free from connection to the second light-emitting element. Claim 8 A method for manufacturing a vertical light-emitting diode package structure according to claim 7, wherein the three second conductive elements are individually aligned with three of the four first conductive elements that are free from connection to the first light-emitting element, and the two third conductive elements are individually aligned with two of the three second conductive elements that are free from connection to the second light-emitting element. Claim 9 A method for manufacturing a vertical light-emitting diode package structure, wherein, in claim 8, the four first conductive elements are arranged in a 2 x 2 array. Claim 10 A method for manufacturing a vertical light-emitting diode package structure according to claim 7, wherein the three second conductive elements are individually aligned with three of the four first conductive elements, the two third conductive elements are individually aligned with two of the three second conductive elements, and the first light-emitting element, the second light-emitting element, and the third light-emitting element are aligned. Claim 11 A method for manufacturing a vertical light-emitting diode package structure, wherein, in claim 10, the four first conductive elements are arranged in a 2 x 2 array. Claim 12 A method for manufacturing a vertical light-emitting diode package structure according to claim 7, wherein the first light-emitting element is a red light-emitting element, the second light-emitting element is a green light-emitting element, and the third light-emitting element is a blue light-emitting element.

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