Electronic component

Abstract

The electronic component includes a body and an external electrode. The external electrode is disposed on the body and includes a conductive resin layer. The conductive resin layer includes a plurality of conductive particles. The plurality of conductive particles include a metal component including silver. An oxide is located on the leading edge of the conductive resin layer.

Description

Technology Field

[0001] The present disclosure relates to electronic components. Background Technology

[0002] A known electronic component comprises a body and an external electrode disposed on the body, the external electrode comprising a conductive resin layer (e.g., see Japanese Patent Publication No. Hei 5-144665). The problem to be solved

[0003] The conductive resin layer comprises, for example, a plurality of conductive particles and a resin. The conductive particles comprise, for example, silver (Ag). Silver has high conductivity and also tends to be resistant to oxidation. In a configuration where the conductive particles contain silver, there is a risk of silver migration to the external electrode. Silver migration is thought to occur, for example, due to the following events.

[0004] An electric field or heat acts on the silver contained in the conductive particles, and the silver ionizes. The silver contained in the conductive particles may also ionize under the influence of oxygen. The generated silver ions are attracted by the electric field generated between the external electrodes and move from the conductive resin layer. The electric field acting on the silver includes, for example, the electric field generated between the external electrodes, or the electric field generated between the external electrodes and the internal conductor disposed within the body. The silver ions moving from the conductive resin layer react with electrons supplied from, for example, the internal conductor or the external electrodes, and are deposited as silver on the surface of the body.

[0005] One aspect of the present disclosure aims to provide an electronic component that inhibits the migration growth of silver. means of solving the problem

[0006] An electronic component according to one aspect of the present disclosure comprises a body and an external electrode disposed on the body. The external electrode comprises a conductive resin layer comprising a plurality of conductive particles. The plurality of conductive particles comprises a metal component including silver. An oxide is located on the leading edge of the conductive resin layer.

[0007] In the above-mentioned embodiment, the oxide is located at the leading edge of the conductive resin layer. Migration of the oxide is less likely to occur than that of silver. Therefore, even in an environment where silver migration may occur, it is difficult for silver migration to grow from the conductive resin layer. The above-mentioned embodiment inhibits the growth of silver migration.

[0008] One embodiment of the above may include the following configuration. In this configuration, for example, the conductive resin layer includes a border containing an oxide.

[0009] In a configuration in which a conductive resin layer includes a border made of oxide, the conductive resin layer includes oxide at the border of said conductive resin layer. Therefore, this configuration reliably suppresses the growth of silver migration.

[0010] One embodiment of the above may include the following configuration. In this configuration, for example, the edge includes a surface where the oxide is exposed.

[0011] A configuration in which the rim includes a surface where oxide is exposed further inhibits the growth of silver migration more effectively.

[0012] The above-mentioned embodiment may include the following configuration. In this configuration, for example, the external electrode comprises a plating layer disposed on the outer side of the conductive resin layer, having a gap between it and the body. The oxide is exposed in the gap.

[0013] In a configuration where the external electrode includes the plating layer, the plating layer has a gap between it and the body. For example, when heat-treating a conductive resin layer, oxygen can easily penetrate through the gap between the plating layer and the body. Therefore, even in a configuration where the external electrode includes the plating layer, the oxide can be reliably disposed.

[0014] In a configuration where the oxide is exposed in the gap, the oxide hinders silver ions from moving from the conductive resin layer into the gap. Therefore, even in a configuration where the plating layer has a gap between it and the body, the configuration where the oxide is exposed in the gap reliably suppresses the growth of silver migration.

[0015] One embodiment of the above may include the following configuration. In this configuration, for example, the conductive resin layer includes a border on which an oxide is disposed.

[0016] In a configuration where the conductive resin layer includes a border on which an oxide is disposed, the oxide is located in front of the border of the conductive resin layer. Therefore, this configuration reliably suppresses the growth of silver migration.

[0017] One embodiment of the above may include the following configuration. In this configuration, for example, the external electrode includes a plating layer disposed on the outside of the conductive resin layer, having a gap between it and the body. The oxide is located in the gap.

[0018] In a configuration where the external electrode includes the plating layer, as described above, the oxide can be easily and reliably disposed.

[0019] In a configuration where oxide is located in the gap, the oxide hinders silver ions from moving through the gap. Therefore, even if the plating layer has a gap between it and the body, a configuration where oxide is located in the gap reliably suppresses the growth of silver migration.

[0020] One embodiment of the above may include the following configuration. In this configuration, for example, the oxide includes an oxide of a metal component included in the conductive particle.

[0021] In a configuration where the oxide comprises an oxide of a metal component included in the conductive particles, the oxide included at the edge of the conductive resin layer is an oxide of a metal component included in the conductive particles. Therefore, this configuration reliably and simply realizes the oxide located at the leading edge of the conductive resin layer.

[0022] One embodiment of the above may include the following configuration. In this configuration, for example, the conductive particle contains copper, and the oxide is an oxide containing silver and copper.

[0023] In a configuration in which the oxide includes an oxide containing silver and copper, for example, the oxide can be formed by heat-treating the conductive resin layer. Therefore, this configuration can realize the oxide located on the leading edge of the conductive resin layer more simply.

[0024] One embodiment of the above may include the following configuration. In this configuration, for example, the conductive particle comprises a core containing copper and a film covering the core containing silver.

[0025] A configuration in which a conductive particle comprises a core containing copper and a film containing silver reduces the electrical resistance of the conductive particle compared to a configuration in which the conductive particle comprises only copper. Therefore, a configuration in which a conductive particle comprises a core containing copper and a film containing silver reduces the electrical resistance of the conductive resin layer and reduces the ESR (equivalent series resistance) of the electronic component. This configuration allows for the reliable and simple formation of an oxide containing silver and copper.

[0026] One embodiment of the above may include the following configuration. In this configuration, for example, the oxide is located on the surface of the film.

[0027] A configuration in which the oxide is located on the surface of the film can more reliably realize the oxide located on the leading edge of the conductive resin layer.

[0028] One embodiment of the above may include the following configuration. In this configuration, for example, the oxide extends along the edge of the external electrode.

[0029] The configuration in which the oxide extends along the edge of the external electrode reliably inhibits the growth of silver migration.

[0030] The present disclosure will be more fully understood from the detailed description provided below and the accompanying drawings, which are for illustrative purposes only and should not be construed as limiting the present disclosure.

[0031] The scope of the present disclosure will become more apparent from the detailed description provided below. However, it should be understood that the detailed description and specific examples illustrating embodiments of the present disclosure are given merely as examples, as various changes and modifications within the spirit and scope of the present disclosure will become apparent to those skilled in the art through this detailed description. Brief explanation of the drawing

[0032] FIG. 1 is a perspective view of a multilayer capacitor according to one embodiment. FIG. 2 is a drawing illustrating the cross-sectional configuration of a multilayer capacitor according to the present embodiment. FIG. 3 is a drawing illustrating the cross-sectional configuration of a multilayer capacitor according to the present embodiment. Figure 4 is a drawing illustrating the cross-sectional configuration of an external electrode. Figure 5 is a diagram illustrating the composition of conductive particles. FIG. 6 is a plan view illustrating the second electrode layer. Figure 7 is a diagram illustrating the composition of the external electrode and the oxide. Figures 8a and 8b are drawings illustrating the composition of conductive particles. Figure 9 is a diagram illustrating the composition of the external electrode and the oxide. FIG. 10 is a plan view illustrating a second electrode layer. Specific details for implementing the invention

[0033] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, identical elements or elements having the same function are indicated by the same reference number, and redundant descriptions are omitted.

[0034] With reference to FIGS. 1 to 6, the configuration of a multilayer capacitor C1 according to the present embodiment is described. FIG. 1 is a perspective view of a multilayer capacitor according to the present embodiment. FIGS. 2 and 3 are drawings illustrating the cross-sectional configuration of a multilayer capacitor according to the present embodiment. FIG. 4 is a drawing illustrating the cross-sectional configuration of an external electrode. FIG. 5 is a drawing illustrating the configuration of a conductive particle. FIG. 6 is a plan view illustrating a second electrode layer.

[0035] The electronic component includes, for example, a multilayer capacitor C1.

[0036] As shown in FIG. 1, the multilayer capacitor C1 includes a body (3) having a rectangular shape and a plurality of external electrodes (5). The multilayer capacitor C1 includes, for example, a pair of external electrodes (5). A pair of external electrodes (5) are disposed on the outer surface of the body (3). A pair of external electrodes (5) are spaced apart from each other. The rectangular shape includes a rectangular shape in which the corners and edges are chamfered, or a rectangular shape in which the corners and edges are rounded.

[0037] The body (3) includes four sides (3a) and a pair of end faces (3e) facing each other. The four sides (3a) and the pair of end faces (3e) have a rectangular shape. The four sides (3a) include a pair of sides (3a) facing each other and another pair of sides (3a) facing each other. The direction in which the pair of sides (3a) face each other is direction D2. The direction in which the other pair of sides (3a) face each other is direction D3. The direction in which the pair of end faces (3e) face each other is direction D1.

[0038] A multilayer capacitor C1 is soldered onto an electronic device. The electronic device includes, for example, a circuit board or other electronic components. In the multilayer capacitor C1, one of the four sides (3a) faces the electronic device. One side (3a) is positioned to form a mounting surface. One side (3a) is the mounting surface.

[0039] Direction D2 is a direction orthogonal to a pair of sides (3a) and is orthogonal to direction D3. Direction D1 is a direction parallel to a pair of sides (3a) and another pair of sides (3a), and is orthogonal to direction D2 and direction D3. Direction D3 is a direction orthogonal to another pair of sides (3a), and direction D1 is a direction orthogonal to each end face (3e). The length of the body (3) in direction D1 is, for example, greater than the length of the body (3) in direction D2 and also greater than the length of the body (3) in direction D3. Direction D1 is the direction of the longer side of the body (3). The length of the body (3) in direction D2 and the length of the body (3) in direction D3 may be equal to each other. The length of the body (3) in direction D2 and the length of the body (3) in direction D3 may be different from each other.

[0040] The length in direction D2 of the body (3) is the height of the body (3). The length in direction D3 of the body (3) is the width of the body (3). The length in direction D1 of the body (3) is the length of the body (3). For example, the height of the body (3) is 0.1 to 3.2 mm, the width of the body (3) is 0.1 to 6.3 mm, and the length of the body (3) is 0.2 to 7.5 mm. For example, the height of the body (3) is 2.5 mm, the width of the body (3) is 2.5 mm, and the length of the body (3) is 3.2 mm.

[0041] A pair of sides (3a) extend in direction D3 to connect the other pair of sides (3a). A pair of sides (3a) also extend in direction D1. A pair of sides (3a) extend in direction D2 to connect the pair of sides (3a). A pair of sides (3a) also extend in direction D1. A pair of end faces (3e) extend in direction D2 to connect the pair of sides (3a). A pair of end faces (3e) extend in direction D3 to connect the other pair of sides (3a).

[0042] The body (3) includes a corner portion located between the end face (3e) and the side (3a), and a corner portion located between one of the pair of side (3a) and one of the other pair of side (3a). For example, each corner portion is rounded to be curved. The body (3) has a so-called R chamfering process performed. The end face (3e) and the side (3a) are indirectly adjacent through the corner portion located between the end face (3e) and the side (3a). One of the pair of side (3a) and one of the other pair of side (3a) are indirectly adjacent through the corner portion located between one of the pair of side (3a) and one of the other pair of side (3a).

[0043] The body (3) is composed of a plurality of dielectric layers stacked in direction D2. The body (3) includes a plurality of stacked dielectric layers. In the body (3), the stacking direction of the plurality of dielectric layers coincides with direction D2. Each dielectric layer is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes a dielectric ceramic. The dielectric ceramic includes, for example, a BaTiO3-based, Ba(Ti, Zr)O3-based, or (Ba, Ca)TiO3-based. In the actual body (3), each dielectric layer is integrated to such an extent that the boundary between each dielectric layer cannot be seen.

[0044] As illustrated in FIGS. 2 and 3, the multilayer capacitor C1 includes a plurality of internal electrodes (7). Each internal electrode (7) is an internal conductor disposed within a body (3). Each internal electrode (7) is made of a conductive material commonly used as an internal conductor of a multilayer electronic component. The conductive material includes, for example, a non-metal. The conductive material includes, for example, nickel (Ni) or copper (Cu). The internal electrode (7) is formed as a sintered body of a conductive paste containing the conductive material. For example, the internal electrode (7) is made of nickel.

[0045] A plurality of internal electrodes (7) are arranged at different locations (layers) in direction D2. A plurality of internal electrodes (7) are arranged to face each other with a gap in direction D2 within the body (3). The internal electrodes (7) adjacent in direction D2 have different polarities from each other. One end of an internal electrode (7) is exposed to a corresponding end surface (3e) among a pair of end surfaces (3e). The internal electrode (7) includes an end portion exposed to a corresponding end surface (3e). A plurality of internal electrodes (7) includes an internal electrode (7) exposed to one end surface (3e) among a pair of end surfaces (3e) and an internal electrode (7) exposed to the other end surface (3e) among a pair of end surfaces (3e). The internal electrode (7) exposed on one end surface (3e) and the internal electrode (7) exposed on the other end surface (3e) are arranged alternately in direction D2. A plurality of internal electrodes (7) are arranged within the body (3) so as to be arranged in direction D2. The internal electrodes (7) are located in a plane approximately parallel to a pair of side surfaces (3a). The direction (direction D2) to which the internal electrodes (7) face is orthogonal to the direction (direction D3 and direction D1) parallel to the pair of side surfaces (3a).

[0046] When the stacking direction of the plurality of dielectric layers is direction D3, the plurality of internal electrodes (7) are positioned at different locations (layers) in direction D3. When the stacking direction of the plurality of dielectric layers is direction D3, the internal electrode (7) exposed on one end surface (3e) and the internal electrode (7) exposed on the other end surface (3e) are positioned alternately in direction D3. The internal electrode (7) is located within a plane approximately parallel to the other pair of side surfaces (3a). The internal electrodes (7) face each other in direction D3.

[0047] As shown in FIG. 1, the external electrode (5) is disposed at both ends of the body (3) in direction D1. Each external electrode (5) is disposed on the side of the corresponding end face (3e) of a pair of end faces (3e). For example, each external electrode (5) is disposed on four sides (3a) and one end face (3e). As shown in FIG. 2 and FIG. 3, the external electrode (5) includes a plurality of electrode portions (5a, 5e). The electrode portion (5a) is located on the side face (3a) and on the corner portion between the side face (3a) and the end face (3e). The electrode portion (5e) is located on the end face (3e). The external electrode (5) also includes an electrode portion located on the corner portion between adjacent sides (3a). Hereinafter, the corner portion between the side (3a) and the end surface (3e) is referred to as the first corner portion, and the corner portion between adjacent side (3a) is referred to as the second corner portion.

[0048] The external electrode (5) is formed on five surfaces, including four sides (3a) and one end surface (3e), and on the corner portion. The electrode portions (5a, 5e) adjacent to each other are physically connected and electrically connected. The electrode portion (5e) covers all of the end portions of the corresponding internal electrodes (7) among the plurality of internal electrodes (7). The electrode portion (5e) is directly connected to the corresponding internal electrode (7). The external electrode (5) is electrically connected to the corresponding internal electrode (7).

[0049] The external electrode (5) includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4, as also shown in FIGS. 2 to 4. The fourth electrode layer E4 includes the outermost layer of the external electrode (5). Each electrode portion (5a, 5e) includes the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4.

[0050] The first electrode layer E1 of the electrode portion (5a) is disposed on the first corner portion and is not disposed on the side portion (3a). The first electrode layer E1 of the electrode portion (5a) covers the entire first corner portion. The first electrode layer E1 does not cover the side portion (3a). The first electrode layer E1 of the electrode portion (5a) is in contact with the first corner portion. The side portion (3a) is exposed from the first electrode layer E1. The first electrode layer E1 of the electrode portion (5a) may be disposed on the side portion (3a). In this case, the first electrode layer E1 of the electrode portion (5a) covers a portion of the side portion (3a) and the entire first corner portion. That is, the first electrode layer E1 of the electrode portion (5a) is in contact with the said portion of the side portion (3a). The said portion of the area covered by the first electrode layer E1 of the electrode portion (5a) is located near the end surface (3e).

[0051] The second electrode layer E2 of the electrode portion (5a) is disposed on the first electrode layer E1 and on the side (3a). In the electrode portion (5a), the second electrode layer E2 covers the entire first electrode layer E1 and also covers a portion of the side (3a). The second electrode layer E2 of the electrode portion (5a) indirectly covers the first corner portion so that the first electrode layer E1 is positioned between the second electrode layer E2 and the body (3). In the electrode portion (5a), the second electrode layer E2 is in direct contact with the first electrode layer E1. The portion of the area covered by the second electrode layer E2 of the electrode portion (5a) is located near the end surface (3e). The side (3a) is exposed from the second electrode layer E2 in the remainder of the area excluding the portion covered by the second electrode layer E2. In the electrode portion (5a), the second electrode layer E2 is in direct contact with the side (3a). In the electrode portion (5a), the second electrode layer E2 directly covers the side (3a). The second electrode layer E2 of the electrode portion (5a) is located on the side (3a) and on the first corner portion.

[0052] The third electrode layer E3 of the electrode portion (5a) is disposed on the second electrode layer E2. In the electrode portion (5a), the third electrode layer E3 covers the second electrode layer E2. In the electrode portion (5a), the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion (5a), the third electrode layer E3 is in direct contact with the second electrode layer E2.

[0053] The fourth electrode layer E4 of the electrode portion (5a) is disposed on the third electrode layer E3. In the electrode portion (5a), the fourth electrode layer E4 covers the third electrode layer E3. In the electrode portion (5a), the fourth electrode layer E4 is in contact with the third electrode layer E3. That is, in the electrode portion (5a), the fourth electrode layer E4 is in direct contact with the third electrode layer E3.

[0054] In the electrode portion (5a), the third electrode layer E3 and the fourth electrode layer E4 are not in contact with the side (3a). In the electrode portion (5a), the third electrode layer E3 has a gap G between it and the side (3a). E3 It has and is disposed on the outer side of the second electrode layer E2. In the electrode portion (5a), the fourth electrode layer E4 has a gap G between it and the side (3a). E4 It has a second electrode layer E2 and is positioned on the outside. The fourth electrode layer E4 of the electrode portion (5a) is positioned on the outside of the third electrode layer E3 of the electrode portion (5a). The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion (5a) are located on the side (3a).

[0055] For example, in a configuration where one of the pair of sides (3a) is the mounting surface, the second electrode layer E2 of the electrode portion (5a) located on the other pair of sides (3a) may cover only a portion of the corner area between each of the other pair of sides (3a) and the end surface (3e), and a portion of each of the other pair of sides (3a). The said portion of the corner area between each of the other pair of sides (3a) and the end surface (3e) is located, for example, near the mounting surface side (3a). The said portion of each of the other pair of sides (3a) is located, for example, near the corner near the mounting surface side (3a) and the end surface (3e).

[0056] The electrode portion (5a) located on the other pair of sides (3a) may have the following configuration. The second electrode layer E2 of the electrode portion (5a) located on the other pair of sides (3a) indirectly covers the said portion of the corner portion between each of the other pair of sides (3a) and the end surface (3e) so that the first electrode layer E1 is located between the second electrode layer E2 and the first corner portion. The second electrode layer E2 of the electrode portion (5a) located on the other pair of sides (3a) directly covers the said portion of each of the other pair of sides (3a). The second electrode layer E2 of the electrode portion (5a) located on the other pair of sides (3a) directly covers the said portion of the portion of the first electrode layer E1 located on the corner portion between each of the other pair of sides (3a) and the end surface (3e). The electrode portion (5a) located on the other pair of sides (3a) includes an area where the first electrode layer E1 is exposed from the second electrode layer E2 and an area where the first electrode layer E1 is covered by the second electrode layer E2.

[0057] The first electrode layer E1 of the electrode portion (5e) is disposed on the end surface (3e). The first electrode layer E1 of the electrode portion (5e) covers the entire end surface (3e). The first electrode layer E1 of the electrode portion (5e) is in contact with the entire end surface (3e). That is, in the electrode portion (5e), ​​the first electrode layer E1 is in direct contact with the end surface (3e).

[0058] The second electrode layer E2 of the electrode portion (5e) is disposed on the first electrode layer E1. In the electrode portion (5e), ​​the second electrode layer E2 covers the first electrode layer E1. In the electrode portion (5e), ​​the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode portion (5e), ​​the second electrode layer E2 indirectly covers the end surface (3e) so that the first electrode layer E1 is located between the second electrode layer E2 and the end surface (3e). The second electrode layer E2 of the electrode portion (5e) is located on the end surface (3e).

[0059] The third electrode layer E3 of the electrode portion (5e) is disposed on the second electrode layer E2. In the electrode portion (5e), ​​the third electrode layer E3 covers the second electrode layer E2. In the electrode portion (5e), ​​the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode portion (5e), ​​the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode portion (5e), ​​the third electrode layer E3 is not in direct contact with the first electrode layer E1.

[0060] The fourth electrode layer E4 of the electrode portion (5e) is disposed on the third electrode layer E3. In the electrode portion (5e), ​​the fourth electrode layer E4 covers the third electrode layer E3. In the electrode portion (5e), ​​the fourth electrode layer E4 is in contact with the third electrode layer E3. That is, in the electrode portion (5e), ​​the fourth electrode layer E4 is in direct contact with the third electrode layer E3.

[0061] In the electrode portion (5e), ​​the third electrode layer E3 and the fourth electrode layer E4 are disposed outside the second electrode layer E2. The fourth electrode layer E4 of the electrode portion (5e) is disposed outside the third electrode layer E3 of the electrode portion (5e). The third electrode layer E3 and the fourth electrode layer E4 of the electrode portion (5e) are located on the end surface (3e).

[0062] The second electrode layer E2 of the electrode portion (5e) may cover only a portion of the end surface (3e). The said portion of the end surface (3e) is, for example, located near the side surface (3a). In this case, the electrode portion (5e) may have the following configuration. The second electrode layer E2 of the electrode portion (5e) indirectly covers the said portion of the end surface (3e) so that the first electrode layer E1 is located between the second electrode layer E2 and the end surface (3e). The second electrode layer E2 of the electrode portion (5e) directly covers only a portion of the part located on the end surface (3e) in the first electrode layer E1. That is, the electrode portion (5e) includes an area where the first electrode layer E1 is exposed from the second electrode layer E2 and an area where the first electrode layer E1 is covered by the second electrode layer E2.

[0063] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the body (3). The conductive paste is applied to one end surface (3e) and a first corner. The first electrode layer E1 is formed to cover one end surface (3e) and a first corner. The first electrode layer E1 is formed by sintering a metal component (metal powder) included in the conductive paste. The first electrode layer E1 includes, for example, a sintered metal layer. The first electrode layer E1 includes a sintered metal layer formed on the body (3). The first electrode layer E1 includes a sintered metal layer made of, for example, copper. The first electrode layer E1 may include a sintered metal layer made of nickel. The first electrode layer E1 may include a non-metal. The conductive paste may include, for example, powder made of copper or nickel, a glass component, an organic binder, and an organic solvent. The first electrode layer E1, which includes the electrode portions (5a, 5e), is formed integrally with each other, for example.

[0064] The second electrode layer E2 is formed by curing a conductive resin paste applied to the first electrode layer E1. The conductive resin paste is applied to the first electrode layer E1 and a portion of the side surface (3a). The second electrode layer E2 is formed across the first electrode layer E1 and the body (3). The conductive resin paste comprises, for example, a plurality of conductive particles, a resin, and an organic solvent. The resin may include a thermosetting resin. The thermosetting resin may include a phenolic resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a portion of the second corner portion. The second electrode layer E2, which includes the electrode portions (5a, 5e), is formed integrally with each other, for example.

[0065] The second electrode layer E2 includes a conductive resin layer covering the first electrode layer E1. As shown in FIG. 4, the second electrode layer E2 includes a resin (11) and a plurality of conductive particles (13). The plurality of conductive particles (13) form a conductive path within the second electrode layer E2. In FIG. 4, the cross-sectional configuration of the external electrode (5) is schematically illustrated. In FIG. 4, the hatching illustrating the cross-section is omitted. The shape and size of the conductive particles (13) illustrated in FIG. 4 differ from the shape and size of actual conductive particles.

[0066] The conductive particle (13) includes a metal component. This metal component includes silver. For example, the conductive particle (13) includes a core (15) and a film (17) covering the core (15), as shown in FIG. 5. The core (15) is made of copper. That is, the core (15) includes copper. The film (17) is made of silver. That is, the film (17) includes silver. The film (17) is in contact with, for example, the core (15). The film (17) directly covers, for example, the core (15). The thickness of the film (17) is, for example, 100 to 700 nm. The film (17) includes the outermost layer of the conductive particle (13). The conductive particle (13) includes a surface to which the film (17) is exposed. Conductive particles (13) adjacent to each other are electrically conductive to each other by contacting or being in close proximity to each other's films (17). The conductive particles (13) may, for example, be spherical. The conductive particles (13) may also be in the form of flakes. A plurality of conductive particles (13) may include spherical conductive particles (13) and flake-shaped conductive particles (13).

[0067] For example, the conductive particles (13) included in the second electrode layer E2 are included in an amount of 30 vol% or more relative to the total volume of the second electrode layer E2. In a configuration where the content ratio of the conductive particles (13) relative to the total volume of the second electrode layer E2 is 30 vol% or more, the conductive particles (13) tend to be distributed to the edge E2e of the second electrode layer E2 or to the vicinity of the edge E2e.

[0068] For example, the conductive particles (13) included in the second electrode layer E2 are included in an amount of 70 vol% or less relative to the total volume of the second electrode layer E2. In a configuration where the content ratio of the conductive particles (13) relative to the total volume of the second electrode layer E2 is 70 vol% or less, the second electrode layer E2 tends to secure a stress relief function.

[0069] The third electrode layer E3 is formed on the second electrode layer E2 by a plating method. The third electrode layer E3 includes, for example, a metal plating layer. The third electrode layer E3 may include a nickel plating layer. The third electrode layer E3 may include nickel. The nickel plating layer tends to have better solder corrosion resistance than the conductive particles (13) included in the second electrode layer E2. The third electrode layer E3 covers the second electrode layer E2.

[0070] The fourth electrode layer E4 is formed on the third electrode layer E3 by a plating method. The fourth electrode layer E4 includes, for example, a metal plating layer. The fourth electrode layer E4 may include a solder plating layer. The solder plating layer may include a tin (Sn) plating layer. The fourth electrode layer E4 may include tin. The fourth electrode layer E4 may be a tin-silver alloy (Sn-Ag) plating layer, a tin-bismuth alloy (Sn-Bi) plating layer, or a tin-copper alloy (Sn-Cu) plating layer. The fourth electrode layer E4 covers the third electrode layer E3.

[0071] The third electrode layer E3 and the fourth electrode layer E4 constitute a plating layer PL formed on the second electrode layer E2. That is, the external electrode (5) includes a plating layer PL, and the plating layer PL includes the third electrode layer E3 and the fourth electrode layer E4. The plating layer PL covers the second electrode layer E2. The third electrode layer E3, which includes the electrode portions (5a, 5e), is formed integrally with each other, for example. The fourth electrode layer E4, which includes the electrode portions (5a, 5e), is formed integrally with each other, for example. The plating layer PL may include another plating layer between the second electrode layer E2 and the third electrode layer E3. The plating layer PL may include another plating layer between the third electrode layer E3 and the fourth electrode layer E4.

[0072] The plating layer PL covering the second electrode layer E2 tends to adhere to the second electrode layer E2 but does not tend to adhere to the body (3). Therefore, the plating layer PL is spaced apart from the body (3) and has a gap between the bodies (3). The third electrode layer E3 has a gap G between it and the side surface (3a). E3 It has. Gap G E3 Silver is formed between the end of the third electrode layer E3 and the side (3a). The fourth electrode layer E4 has a gap G between it and the side (3a). E4 It has. Gap G E4 It is formed between the end of the fourth electrode layer E4 and the side (3a). The third electrode layer E3 and the fourth electrode layer E4 also have a gap between them and the second corner portion. Gap G E3 , G E4 The width is, for example, greater than 0 and 3 μm or less. The width of the gap between each of the third electrode layer E3 and the fourth electrode layer E4 and the second corner portion is, for example, greater than 0 and 3 μm or less. Gap G E3 The width of and the gap G E4 The width may be different. Gap G E3 , G E4The width of and the gap width between the third electrode layer E3 and the fourth electrode layer E4 and the second corner portion may be different.

[0073] As shown in FIG. 6, when viewed from a direction orthogonal to the side (3a), the second electrode layer E2 extends along the edge (6) of the outer electrode (5) on the side (3a). The second electrode layer E2 includes an edge E2e that extends along the edge (6) of the outer electrode (5). FIG. 6 is a plan view illustrating the second electrode layer.

[0074] As illustrated in FIGS. 6 and 7, the multilayer capacitor C1 includes an oxide (21). The edge E2e included in the second electrode layer E2 includes the oxide (21). That is, the oxide (21) is located on the leading side of the second electrode layer E2. The multilayer capacitor C1 includes the oxide (21) in the second electrode layer E2. The oxide (21) extends along the edge (6) of the external electrode (5). For example, the oxide (21) extends continuously along the edge (6) of the external electrode (5). The oxide (21) may also extend intermittently along the edge (6) of the external electrode (5). The thickness of the oxide (21) is, for example, 100 to 700 nm. FIG. 7 is a diagram illustrating the configuration of the external electrode and the oxide. In FIG. 7, the cross-sectional configuration of the external electrode (5) is schematically illustrated. The shape and size of the conductive particle (13) shown in Fig. 7 are also different from the shape and size of the actual conductive particle.

[0075] The surface of the rim E2e includes an oxide (21). The rim E2e includes a surface where the oxide (21) is exposed. The entire surface of the rim E2e may include the oxide (21). In a configuration where the entire surface of the rim E2e includes the oxide (21), the rim E2e includes only the surface where the oxide (21) is exposed. Only a portion of the surface of the rim E2e may include the oxide (21). In a configuration where only a portion of the surface of the rim E2e includes the oxide (21), the remainder of the surface of the rim E2e may include a resin or a film (17). In a configuration where only a portion of the surface of the rim E2e includes the oxide (21), for example, the rim E2e includes a surface where the oxide (21) is exposed and a surface where the resin or a film (17) is exposed.

[0076] As shown in FIG. 7, the oxide (21) is positioned on the outside of the conductive particles (13). The oxide (21) is located on the surface of the film (17). The oxide (21) is in contact with the film (17). The oxide (21) may be in contact with the body (3). The oxide (21) may be in contact with the side (3a) or with the second corner. The oxide (21) may be in contact with the plating layer PL. The oxide (21) may be integrally formed on the outside of a plurality of conductive particles (13) that are adjacent to each other, for example, as shown in FIG. 7.

[0077] The oxide (21) includes, for example, an oxide of a metal component included in the conductive particle (13). The oxide (21) includes, for example, an oxide containing silver and copper. The oxide containing silver and copper is, for example (Ag x , Cu 1-x )O y It is indicated as such. The oxide (21) may include an oxide of copper. The oxide (21) includes, for example, an electrical insulator.

[0078] The oxide (21) is formed, for example, by heat treatment of the second electrode layer E2. The heat treatment of the second electrode layer E2 may be performed, for example, after forming the third electrode layer E3, and also before forming the fourth electrode layer E4. The heat treatment of the second electrode layer E2 may be performed after forming the fourth electrode layer E4. Conditions for the heat treatment of the second electrode layer E2 include, for example, a heating temperature or a heating time.

[0079] Oxygen that combines with the metal component included in the conductive particle (13) is the gap G E3 , G E4 Through this, there is a tendency to reach the edge E2e of the second electrode layer E2. Oxygen, gap G E3 , G E4 There is a tendency to infiltrate from. Heat degree in heat treatment, gap G E3 , G E4 Through this, there is a tendency to act on the edge E2e of the second electrode layer E2. Therefore, in the conductive particles (13) close to the edge E2e of the second electrode layer E2, oxide (21) is more likely to be formed compared to the conductive particles (13) spaced apart from the edge E2e of the second electrode layer E2.

[0080] When the heat treatment of the second electrode layer E2 is performed after forming the third electrode layer E3 and before forming the fourth electrode layer E4, an oxide of the metal included in the third electrode layer E3, for example, an oxide of nickel, may be formed on the end surface of the third electrode layer E3. The oxide of nickel tends to form a passivation film and is difficult to grow. Therefore, the third electrode layer E3 tends to have a gap between it and the body (3).

[0081] When the heat treatment of the second electrode layer E2 is performed after the fourth electrode layer E4 is formed, the oxide of the metal contained in the fourth electrode layer E4, for example, the oxide of tin, may be formed on the end surface of the fourth electrode layer E4. The oxide of tin tends to form a passivation film and is difficult to grow. Therefore, the fourth electrode layer E4 tends to have a gap between it and the body (3).

[0082] As illustrated in FIGS. 8a and 8b, the heat treatment of the second electrode layer E2 proceeds, for example, as follows. FIGS. 8a and 8b are drawings illustrating conductive particles and oxides. In FIGS. 8a and 8b, the conductive particles (13) and oxides (21) are schematically illustrated.

[0083] Copper that has moved toward the surface of the conductive particle (13) combines with oxygen together with silver contained in the film (17). As a result, as shown in FIG. 8a, an oxide (21) containing copper and silver is formed on the surface of the conductive particle (13), that is, on the surface of the film (17). That is, the oxide (21) contains copper and silver contained in the conductive particle (13). Copper originates from copper contained in the core (15). Silver originates from silver contained in the film (17). The oxide (21) is formed, for example, in the shape of a film. Although the mechanism by which copper contained in the core (15) moves toward the surface of the conductive particle (13) is not necessarily clear, it is speculated that if oxygen is present on the outside of the conductive particle (13), copper, which is more likely to combine with oxygen than silver, tends to move toward the surface of the conductive particle (13) during heat treatment.

[0084] As the copper moves, the oxide (21) grows. Copper tends to expand in volume due to oxidation. As a result, as shown in FIG. 8b, the thickness of the oxide (21) increases. Along with the movement of copper, voids (19) are formed within the conductive particles (13). The voids (19) tend to form near the surface of the core (15). Near the surface of the core (15) includes the interface between the core (15) and the film (17).

[0085] A plurality of conductive particles (13) include a plurality of conductive particles (13) in which oxide (21) is formed and a plurality of conductive particles (13) in which oxide (21) is not formed. A plurality of conductive particles (13) in which oxide (21) is not formed tend to contribute to the conductivity of the second electrode layer E2. A plurality of conductive particles (13) in which oxide (21) is formed tend to be located at the edge E2e of the second electrode layer E2 or near the edge E2e, for example, as shown in FIG. 7. The second electrode layer E2 of the electrode portion (5e) tends to include conductive particles (13) in which oxide (21) is not formed. The second electrode layer E2 of the electrode portion (5a) tends to include conductive particles (13) in which oxide (21) is formed.

[0086] As illustrated in FIG. 9, the multilayer capacitor C1 may include an oxide (23). The oxide (23) is disposed, for example, at the edge E2e included in the second electrode layer E2. That is, the second electrode layer E2 includes the edge E2e where the oxide (23) is disposed. The oxide (23) is located at the leading edge of the second electrode layer E2. FIG. 9 is a diagram illustrating the configuration of the external electrode and the oxide. In FIG. 9, the cross-sectional configuration of the external electrode (5) is schematically illustrated. The shape and size of the conductive particle (13) illustrated in FIG. 9 also differ from the shape and size of the actual conductive particle.

[0087] The oxide (23) is the gap G E3 It is located at. The oxide (23) may be in contact with the body (3). The oxide (23) may be in contact with the side (3a) or with the second corner portion. The oxide (23) may be in contact with the third electrode layer E3. The oxide (23) is in the gap G E3 In addition, gap G E3 and gap G E4 It may be located at. The thickness of the oxide (23) is, for example, greater than 0 and less than or equal to 3 μm. The width of the oxide (23) is, for example, greater than 0 and less than or equal to 30 μm.

[0088] As illustrated in FIG. 10, the oxide (23) extends along the edge (6) of the outer electrode (5), just like the oxide (21). For example, the oxide (23) extends continuously along the edge (6) of the outer electrode (5). The oxide (23) may also extend intermittently along the edge (6) of the outer electrode (5). FIG. 10 is a plan view illustrating a second electrode layer.

[0089] The oxide (23) includes, for example, an oxide of a metal component contained in the conductive particle (13), just like the oxide (21). The oxide (23) includes, for example, an oxide containing silver and copper. The oxide containing silver and copper is, for example (Ag x , Cu 1-x )O y It is indicated as such. The oxide (23) may include an oxide of copper. The oxide (23) includes, for example, an electrical insulator.

[0090] The oxide (23) is formed by heat treatment of the second electrode layer E2, for example, like the oxide (21). The mechanism by which the oxide (23) is formed is not necessarily clear, but it is presumed that it is formed on the edge E2e as the formation of the oxide (21) progresses further. The oxide (23) may be formed integrally with the oxide (21).

[0091] In the multilayer capacitor C1, the oxide (21) is located on the leading side of the second electrode layer E2. The oxide (21) makes it difficult for silver to migrate. The oxide (21) prevents silver ions from moving from the second electrode layer E2. Therefore, even in an environment where silver migration may occur, it is difficult for silver migration to grow from the second electrode layer E2. The multilayer capacitor C1 suppresses the growth of silver migration.

[0092] In the multilayer capacitor C1, the oxide (23) is located on the leading side of the second electrode layer E2. The oxide (23) makes it difficult for silver to migrate. The oxide (23) prevents silver ions from moving from the second electrode layer E2. Therefore, even in an environment where silver migration may occur, it is difficult for silver migration to grow further from the second electrode layer E2. The multilayer capacitor C1 further suppresses the growth of silver migration.

[0093] In the multilayer capacitor C1, the second electrode layer E2 may include a border E2e containing oxide (21).

[0094] In a configuration where the second electrode layer E2 includes a border E2e made of oxide (21), the second electrode layer E2 includes oxide (21) in the border E2e. Therefore, this configuration reliably suppresses the migration growth of silver.

[0095] In the stacked capacitor C1, the edge E2e may include a surface where the oxide (21) is exposed.

[0096] A configuration in which the edge E2e includes a surface where the oxide (21) is exposed further inhibits the migration growth of silver more effectively.

[0097] In the multilayer capacitor C1, the external electrode (5) may include a plating layer PL disposed on the outside of the second electrode layer E2, having a gap between it and the body (3). For example, the third electrode layer E3 has a gap G between it and the body (3). E3 Having, the fourth electrode layer E4 has a gap G between it and the body (3). E4 It has an oxide (21) that may be exposed in the gap between the plating layer PL and the body (3).

[0098] In a configuration where the external electrode (5) includes a plating layer PL, the plating layer PL has a gap between it and the body (3). For example, when heat-treating the second electrode layer E2, oxygen can easily penetrate through the gap between the plating layer PL and the body (3). Therefore, even if the external electrode (5) includes a plating layer PL, the oxide (21) can be reliably disposed.

[0099] In a configuration where the oxide (21) is exposed in the gap between the plating layer PL and the body (3), the oxide (21) prevents silver ions from moving from the second electrode layer E2 to the gap between the plating layer PL and the body (3). Therefore, even in a configuration where the plating layer PL has a gap between it and the body (3), the configuration where the oxide (21) is exposed in the gap between the plating layer PL and the body (3) reliably suppresses the growth of silver migration.

[0100] In the multilayer capacitor C1, the second electrode layer E2 may include a border E2e on which oxide (23) is disposed.

[0101] In a configuration where the second electrode layer E2 includes a border E2e on which the oxide (23) is disposed, the oxide (23) is located in front of the border E2e of the second electrode layer E2. Therefore, this configuration reliably suppresses the growth of silver migration.

[0102] In the multilayer capacitor C1, the external electrode (5) may include the plating layer PL, and the oxide (23) may be located in the gap between the plating layer PL and the body (3).

[0103] In a configuration where the external electrode (5) includes a plating layer PL, as described above, the oxide (23) can be easily and reliably placed.

[0104] In a configuration where the oxide (23) is located in the gap between the plating layer PL and the body (3), the oxide (23) prevents silver ions from moving through the gap between the plating layer PL and the body (3). Therefore, even if the plating layer PL has a gap between it and the body (3), the configuration where the oxide (23) is located in the gap between the plating layer PL and the body (3) reliably suppresses the growth of silver migration.

[0105] In the multilayer capacitor C1, the oxide (21) may include an oxide of a metal component included in the conductive particle (13).

[0106] In a configuration where the oxide (21) comprises an oxide of a metal component included in the conductive particle (13), the oxide included in the edge E2e of the second electrode layer E2 is an oxide of a metal component included in the conductive particle (13). Therefore, this configuration reliably and simply realizes the oxide (21) located on the leading side of the second electrode layer E2. This configuration reliably and simply realizes the oxide (23) located on the leading side of the second electrode layer E2.

[0107] In the multilayer capacitor C1, the conductive particles (13) may include copper, and the oxide (21) may include an oxide containing silver and copper.

[0108] In a configuration where the oxide (21) comprises an oxide containing silver and copper, for example, the oxide (21) can be formed by heat-treating the second electrode layer E2. Accordingly, this configuration can more easily realize the oxide (21) located on the leading side of the second electrode layer E2. This configuration can more easily realize the oxide (23) located on the leading side of the second electrode layer E2.

[0109] In the multilayer capacitor C1, the conductive particles (13) may include a core (15) containing copper and a film (17) covering the core (15) containing silver.

[0110] A configuration in which the conductive particle (13) comprises a core (15) containing copper and a film (17) containing silver reduces the electrical resistance of the conductive particle (13) compared to a configuration in which the conductive particle (13) comprises only copper. Accordingly, a configuration in which the conductive particle (13) comprises a core (15) containing copper and a film (17) containing silver reduces the electrical resistance of the second electrode layer E2 and reduces the ESR of the multilayer capacitor C1. This configuration can reliably and easily form an oxide (21) containing silver and copper. This configuration can reliably and easily form an oxide (23) containing silver and copper.

[0111] In the multilayer capacitor C1, the oxide (21) may be located on the surface of the film (17).

[0112] A configuration in which the oxide (21) is located on the surface of the film (17) can more reliably realize the oxide (21) located on the leading side of the second electrode layer E2. This configuration can more reliably realize the oxide (23) located on the leading side of the second electrode layer E2.

[0113] In the stacked capacitor C1, the oxide (21) may extend along the edge (6) of the external electrode (5).

[0114] The configuration in which the oxide (21) extends along the edge (6) of the outer electrode (5) reliably inhibits the growth of silver migration.

[0115] In the stacked capacitor C1, the oxide (23) may extend along the edge (6) of the external electrode (5).

[0116] The configuration in which the oxide (23) extends along the edge (6) of the outer electrode (5) further inhibits the growth of silver migration.

[0117] In this specification, where it is described that an element is disposed on another element, the element may be disposed directly on the other element or indirectly on the other element. If an element is disposed indirectly on the other element, an intervening element exists between the element and the other element. If an element is disposed directly on the other element, an intervening element does not exist between the element and the other element.

[0118] In this specification, where it is described that an element is located on another element, the element may be located directly on the other element or indirectly on the other element. If an element is located indirectly on the other element, an intervening element exists between the element and the other element. If an element is located directly on the other element, an intervening element does not exist between the element and the other element.

[0119] In this specification, where it is described that one element covers another element, the element may cover the other element directly or indirectly. If one element covers another element indirectly, an intervening element exists between the one element and the other element. If one element covers another element directly, an intervening element does not exist between the one element and the other element.

[0120] It should be understood that not all aspects, benefits, and features described herein are necessarily achieved or included in any specific example. In fact, as various examples have been described and illustrated here, it is evident that other examples may vary in arrangement and detail.

[0121] A multilayer capacitor C1 containing oxide (23) does not need to contain oxide (21). That is, in a multilayer capacitor C1 containing oxide (23), the second electrode layer E2 does not need to include a border E2e made of oxide (21). The process of placing oxide (23) on the border E2e of the second electrode layer E2 that does not contain oxide (21) may include applying oxide along the border E2e of the second electrode layer E2 before forming the plating layer PL, without performing the aforementioned heat treatment after forming the second electrode layer E2.

[0122] In the present embodiment and variations, a multilayer capacitor was described as an example of an electronic component, but applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, multilayer solid-state battery components, or multilayer composite components, or electronic components other than multilayer electronic components.

Claims

Claim 1 An electronic component comprising a body, a conductive resin layer containing a plurality of conductive particles, a plating layer disposed on the outside of the conductive resin layer having a gap between it and the body, and an external electrode disposed on the body, wherein the plurality of conductive particles contain a metal component including silver, and an oxide is located on the leading edge of the conductive resin layer. Claim 2 An electronic component according to claim 1, wherein the conductive resin layer comprises a border made of the oxide. Claim 3 In paragraph 2, the above-mentioned edge is an electronic component comprising a surface where the oxide is exposed. Claim 4 In paragraph 2 or 3, the oxide is an electronic component exposed to the gap. Claim 5 An electronic component according to any one of claims 1 to 3, wherein the conductive resin layer comprises a border on which the oxide is disposed. Claim 6 In claim 5, the external electrode comprises a plating layer disposed on the outside of the conductive resin layer having a gap between it and the body, and the oxide is an electronic component located in the gap. Claim 7 An electronic component according to any one of claims 1 to 3, wherein the oxide comprises an oxide of a metal component included in the conductive particle. Claim 8 An electronic component according to claim 7, wherein the conductive particles further comprise copper, and the oxide comprises an oxide of the silver and the copper. Claim 9 In claim 8, the conductive particle comprises an electronic component including a core containing copper and a film covering the core, which includes silver. Claim 10 In claim 9, the oxide is an electronic component located on the surface of the film. Claim 11 An electronic component according to any one of claims 1 to 3, wherein the oxide extends along the edge of the external electrode. Claim 12 An electronic component comprising a body and a conductive resin layer containing a plurality of conductive particles, and having an external electrode disposed on the body, wherein the plurality of conductive particles contain a metal component including silver, and an oxide is located on the leading edge side of the conductive resin layer, and the oxide contains an oxide of the metal component included in the conductive particles. Claim 13 In claim 12, the above conductive resin layer comprises an electronic component including a border made of the oxide. Claim 14 In paragraph 13, the above-mentioned rim is an electronic component comprising a surface where the oxide is exposed. Claim 15 An electronic component according to claim 13 or 14, wherein the external electrode comprises a plating layer disposed on the outside of the conductive resin layer having a gap between it and the body, and the oxide is exposed in the gap. Claim 16 An electronic component according to any one of claims 12 to 14, wherein the conductive resin layer comprises a border on which the oxide is disposed. Claim 17 In claim 16, the external electrode comprises a plating layer disposed on the outside of the conductive resin layer having a gap between it and the body, and the oxide is an electronic component located in the gap. Claim 18 In claim 12, the conductive particles further comprise copper, and the oxide comprises an oxide of silver and copper, an electronic component. Claim 19 In claim 18, the conductive particle comprises an electronic component including a core containing copper and a film covering the core, together with containing silver. Claim 20 In paragraph 19, the oxide is an electronic component located on the surface of the film. Claim 21 In any one of claims 12 to 14, the oxide is an electronic component extending along the edge of the external electrode.

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