Thermoelectric device and thermoelectric system comprising the same

Abstract

A thermoelectric system according to one embodiment of the present invention comprises a thermoelectric device, a wiring portion electrically connected to the thermoelectric device, and a wiring receiving portion disposed on one side of the thermoelectric device to accommodate the wiring portion. The wiring receiving portion comprises a case disposed on one side of the thermoelectric device and a cover covering the case. A bottom hole through which the wiring portion passes is formed in the bottom portion of the case, and a side wall hole through which the wiring portion passes is formed in the side wall of the case. The bottom portion comprises an upper surface of the bottom portion disposed to face the cover and a lower surface of the bottom portion disposed to face the thermoelectric device. The lower surface of the bottom portion comprises a first stepped portion protruding along the edge of the bottom hole in a direction toward the thermoelectric device.

Description

Technology Field

[0001] The present invention relates to a thermoelectric device, and more specifically, to a thermoelectric device utilizing a temperature difference between a low-temperature part and a high-temperature part of a thermoelectric element, and a thermoelectric system including the same. Background Technology

[0002] Thermoelectricity is a phenomenon caused by the movement of electrons and holes within a material, referring to the direct energy conversion between heat and electricity.

[0003] Thermoelectric devices are a general term for devices that utilize the thermoelectric phenomenon, and they have a structure in which a PN junction pair is formed by joining a P-type thermoelectric material and an N-type thermoelectric material between metal electrodes.

[0004] Thermoelectric devices can be classified into devices that utilize the temperature change of electrical resistance, devices that utilize the Seebeck effect, a phenomenon in which an electromotive force is generated by a temperature difference, and devices that utilize the Peltier effect, a phenomenon in which endothermic or exothermic reactions occur due to an electric current.

[0005] Thermoelectric devices are being applied in a wide variety of fields, including home appliances, electronic components, and communication parts. For instance, thermoelectric devices can be used in cooling devices, heating devices, and power generation devices. Consequently, the demand for the thermoelectric performance of thermoelectric devices is steadily increasing.

[0006] Recently, there is a need to generate electricity using high-temperature thermoelectric elements in applications such as automobiles and ships. In this case, a fluid flow section through which a first fluid passes is disposed on the low-temperature side of the thermoelectric element, and a heatsink is disposed on the high-temperature side of the thermoelectric element, allowing a second fluid, which is hotter than the first fluid, to pass through the heatsink. Accordingly, electricity can be generated due to the temperature difference between the low-temperature and high-temperature sides of the thermoelectric element. The problem to be solved

[0007] The technical problem to be solved by the present invention is to provide a thermoelectric device that utilizes the temperature difference between the low-temperature and high-temperature parts of a thermoelectric element and a thermoelectric system including the same. means of solving the problem

[0008] A thermoelectric system according to one embodiment of the present invention comprises a thermoelectric device, a wiring portion electrically connected to the thermoelectric device, and a wiring receiving portion disposed on one side of the thermoelectric device to accommodate the wiring portion. The wiring receiving portion comprises a case disposed on one side of the thermoelectric device and a cover covering the case. A bottom hole through which the wiring portion passes is formed in the bottom portion of the case, and a side wall hole through which the wiring portion passes is formed in the side wall of the case. The bottom portion comprises an upper surface of the bottom portion disposed to face the cover and a lower surface of the bottom portion disposed to face the thermoelectric device. The lower surface of the bottom portion comprises a first stepped portion protruding along the edge of the bottom hole in a direction toward the thermoelectric device.

[0009] The thermoelectric device comprises a fluid flow section, a thermoelectric module disposed on the fluid flow section, and a shield member disposed on the side of the thermoelectric module on the fluid flow section, wherein the wiring receiving section is disposed on the upper part of the shield member, and an upper hole through which the wiring section passes is formed on the upper part of the shield member, and the upper hole may be disposed to correspond to the bottom hole.

[0010] The upper portion of the shield member includes an upper surface positioned toward the wiring receiving portion and a lower surface positioned toward the fluid flow portion, and the upper surface may include a second stepped portion protruding along the edge of the upper hole in a direction toward the wiring receiving portion.

[0011] The second step portion can be arranged to be surrounded by the first step portion.

[0012] The first step portion and the second step portion may be arranged to be spaced apart from each other.

[0013] The side wall of the above case includes an outer surface of the case positioned to face the outside of the case and an inner surface of the case positioned to face the inside of the case, and the outer surface of the case may include a third stepped portion protruding in a direction toward the outside of the case along the edge of the side wall hole.

[0014] The distance between the first step portion and the second step portion may be greater than the height of the third step portion.

[0015] The height of the second step portion may be higher than the lower surface of the bottom portion of the wiring receiving portion and lower than the upper surface of the bottom portion of the wiring receiving portion.

[0016] It may further include an insulating member disposed between the upper part of the shield member and the wiring receiving part.

[0017] The above wiring receiving portion may further include an insulating member disposed between the case and the cover.

[0018] A thermoelectric system according to another embodiment of the present invention comprises a first thermoelectric device, a second thermoelectric device disposed spaced apart from the first thermoelectric device, a first wiring section electrically connected to the first thermoelectric device, a second wiring section electrically connected to the second thermoelectric device, and a wiring receiving section disposed on one side upper of the first thermoelectric device and the second thermoelectric device to accommodate the first wiring section and the second wiring section, wherein the wiring receiving section comprises a case disposed on one side upper of the first thermoelectric device and the second thermoelectric device, and a cover covering the case, wherein a first bottom hole through which the first wiring section passes and a second bottom hole through which the second wiring section passes are formed in the bottom portion of the case, and a side wall hole through which the first wiring section and the second wiring section pass is formed in the side wall of the case, wherein the bottom portion comprises an upper surface of the bottom portion disposed facing the cover and a lower surface of the bottom portion disposed facing the thermoelectric device, and the lower surface of the bottom portion is of the first bottom hole and the second bottom hole It includes a first step portion protruding along the edge in a direction toward the first thermoelectric device and the second thermoelectric device, respectively. Effects of the invention

[0019] According to an embodiment of the present invention, a thermoelectric system can be obtained that has a simple structure, is easy to assemble, and can accommodate a maximum number of thermoelectric elements within a predetermined space.

[0020] According to an embodiment of the present invention, a thermoelectric system with high thermoelectric performance can be obtained by increasing the temperature difference between the high-temperature part and the low-temperature part.

[0021] The thermoelectric system according to an embodiment of the present invention can be applied to a power generation device that generates electricity using the temperature difference between a high-temperature part and a low-temperature part.

[0022] A thermoelectric system according to an embodiment of the present invention can be applied to a Peltier device that cools or heats a specific object, such as a fluid. Brief explanation of the drawing

[0023] FIG. 1 is a perspective view of a thermoelectric device according to one embodiment of the present invention. FIG. 2 is a partially exploded view of a thermoelectric device according to one embodiment of the present invention. FIG. 3 is a perspective view of a fluid flow section included in a thermoelectric device according to one embodiment of the present invention. FIGS. 4 and 5 are thermoelectric elements according to embodiments of the present invention. FIG. 6 is a plan view of a thermoelectric module according to one embodiment of the present invention. FIG. 7 is an exploded perspective view of a thermoelectric module according to one embodiment of the present invention. FIG. 8 is a perspective view of a first frame included in a thermoelectric module according to one embodiment of the present invention. FIG. 9 is a perspective view of a second frame included in a thermoelectric module according to one embodiment of the present invention. FIG. 10 is a cross-sectional view of a thermoelectric device according to one embodiment of the present invention with a shield member assembled thereto. FIGS. 11(a) and FIGS. 11(b) respectively show enlarged cross-sections of R1 and R2 of FIG. 10. FIGS. 12(a) and FIGS. 12(b) respectively show enlarged cross-sections of R3 and R4 of FIG. 9. FIG. 13 illustrates the lower surface of the fluid guide of the present invention. FIG. 14 is a cross-sectional view of a thermoelectric device according to a comparative example and an embodiment. FIG. 15 is a thermoelectric system according to one embodiment of the present invention. FIG. 16 is an exploded perspective view of a wiring receiving portion disposed on one side of a plurality of thermoelectric devices according to one embodiment of the present invention. Fig. 17 is an enlarged view of D1 in Fig. 16. FIG. 18(a) is a top perspective view of a case of a wiring receiving portion according to one embodiment of the present invention, and FIG. 18(b) is a bottom perspective view of a case of a wiring receiving portion according to one embodiment of the present invention. FIG. 19(a) is a perspective view of a sixth shield member according to one embodiment of the present invention, and FIG. 19(b) is a perspective view of a fifth shield member according to one embodiment of the present invention. FIG. 20 is a cross-sectional perspective view showing the internal structure of a wiring receiving portion in a state where a shield member and a wiring receiving portion are assembled in a thermoelectric system according to one embodiment of the present invention. Figure 21 is a cross-sectional view of region E1 of Figure 20. FIG. 22 illustrates the internal structure of a wiring receiving portion according to one embodiment of the present invention. FIG. 23 is a top view of the F1 region of FIG. 22. Figure 24 is a cross-sectional view of the F2 region of Figure 22. Specific details for implementing the invention

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0025] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0026] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0027] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0028] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0029] In addition, terms such as first, second, A, B, (a), (b), etc. may be used when describing the components of the embodiments of the present invention.

[0030] These terms are intended merely to distinguish a component from other components and are not limited by the nature, order, sequence, etc., of the said component.

[0031] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0032] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0033] FIG. 1 is a perspective view of a thermoelectric device according to one embodiment of the present invention, FIG. 2 is a partially exploded view of a thermoelectric device according to one embodiment of the present invention, and FIG. 3 is a perspective view of a fluid flow section included in a thermoelectric device according to one embodiment of the present invention.

[0034] Referring to FIGS. 1 to 3, the thermoelectric device (1000) includes a fluid flow section (1100) and a thermoelectric module (1200) disposed on the surface of the fluid flow section (1100).

[0035] A thermoelectric device (1000) according to an embodiment of the present invention can generate power by utilizing the temperature difference between a first fluid flowing through the interior of a fluid flow section (1100) and a second fluid passing through the exterior of the fluid flow section (1100). A plurality of thermoelectric devices (1000) may be arranged in parallel so as to be spaced apart at a predetermined interval to form a thermoelectric system. Accordingly, thermoelectric performance or power generation performance per unit area can be maximized. A thermoelectric device may be referred to as a power generation device, and a thermoelectric system may be referred to as a power generation system.

[0036] The first fluid flowing into the fluid flow section (1100) may be water, but is not limited thereto, and may be various types of fluids having cooling performance. The temperature of the first fluid flowing into the fluid flow section (1100) may be less than 100°C, preferably less than 50°C, more preferably less than 40°C, but is not limited thereto, and may be a fluid having a lower temperature than the second fluid. The temperature of the first fluid discharged after passing through the fluid flow section (1100) may be higher than the temperature of the first fluid flowing into the fluid flow section (1100).

[0037] According to an embodiment of the present invention, a thermoelectric module (1200) may be disposed on a first surface (1110) of a fluid flow section (1100) and a second surface (1120) facing the first surface (1110). A first fluid may flow from a side surface (1150) between the first surface (1110) and the second surface (1120) toward another side surface (1160) facing the side surface (1150) between the first surface (1110) and the second surface (1120). To this end, a fluid inlet may be disposed on the first side surface, and a fluid outlet may be disposed on the other side surface. A second fluid may flow from the fourth surface (1140), which is the upper surface between the first surface (1110) and the second surface (1120), toward the third surface (1130), which is the lower surface between the first surface (1110) and the second surface (1120). For convenience of explanation, the direction from the first surface (1110) toward the second surface (1120) may be referred to as the first direction in this specification, the direction from the fifth surface (1150) toward the sixth surface (1160), i.e., the direction through which the first fluid passes, may be referred to as the second direction, and the direction from the fourth surface (1140) toward the third surface (1130), i.e., the direction through which the second fluid passes, may be referred to as the third direction, but is not limited thereto.

[0038] Meanwhile, the second fluid passes through the outside of the fluid flow section (1100), for example, the heat sink (1220) of the thermoelectric module (1200) disposed outside the fluid flow section (1100). The second fluid may be exhaust heat or intake heat from an automobile, a ship, etc., but is not limited thereto. For example, the temperature of the second fluid may be 100°C or higher, preferably 200°C or higher, more preferably 220°C to 250°C, but is not limited thereto.

[0039] In this specification, the temperature of the first fluid flowing through the interior of the fluid flow section (1100) is described as being lower than the temperature of the second fluid passing through the heat sink (1220) of the thermoelectric module (1200) disposed outside the fluid flow section (1100). Accordingly, in this specification, the fluid flow section (1100) may be referred to as a duct or a cooling section. However, embodiments of the present invention are not limited thereto, and the temperature of the first fluid flowing through the interior of the fluid flow section (1100) may be higher than the temperature of the second fluid passing through the heat sink (1220) of the thermoelectric module (1200) disposed outside the fluid flow section (1100).

[0040] As illustrated in FIG. 3, the fluid flow section (1100) includes a flow path area (500), a fluid inflow area (510), and a fluid outflow area (520), and the first direction thickness of the flow path area (500) may be different from the first direction thickness of the fluid inflow area (510) and the fluid outflow area (520). For example, the first direction thickness in the flow path area (500) may be thinner than the first direction thickness in the fluid inflow area (510) and the fluid outflow area (520). Here, the fluid inflow area (510) is an area including one side (1150) of the fluid flow section (1100), and the fluid outflow area (520) is an area including the other side (1160) of the fluid flow section (1100).

[0041] Since thermoelectric modules (1200) are arranged on both sides of the Euro area (500), the thinner the thickness of the Euro area (500) is implemented, the number of thermoelectric devices accommodated per unit volume can be increased and the thermoelectric performance per unit volume can be improved.

[0042] According to an embodiment of the present invention, the thermoelectric module (1200) includes a thermoelectric element and a heat sink (1220) disposed on the thermoelectric element. The thermoelectric element according to an embodiment of the present invention may have the structure of the thermoelectric element (100) illustrated in FIGS. 4 and 5.

[0043] Referring to FIGS. 4 and 5, the thermoelectric element (100) includes a first substrate (110), a first electrode portion (120), a P-type semiconductor element (130), an N-type semiconductor element (140), a second electrode portion (150), and a second substrate (160).

[0044] A first electrode portion (120) is disposed between a first substrate (110) and a P-type semiconductor device (130) and an N-type semiconductor device (140), and a second electrode portion (150) is disposed between a second substrate (160) and a P-type semiconductor device (130) and an N-type semiconductor device (140). Accordingly, a plurality of P-type semiconductor devices (130) and a plurality of N-type semiconductor devices (140) are electrically connected by the first electrode portion (120) and the second electrode portion (150). A pair of P-type semiconductor devices (130) and N-type semiconductor devices (140) disposed between the first electrode portion (120) and the second electrode portion (150) and electrically connected can form a unit cell.

[0045] For example, when voltage is applied to the first electrode part (120) and the second electrode part (150) through the lead wires (181, 182), the substrate through which current flows from the P-type semiconductor device (130) to the N-type semiconductor device (140) absorbs heat and acts as a cooling part due to the Peltier effect, and the substrate through which current flows from the N-type semiconductor device (140) to the P-type semiconductor device (130) heats up and acts as a heating part. Alternatively, if a temperature difference is applied between the first electrode part (120) and the second electrode part (150), charges within the P-type semiconductor device (130) and the N-type semiconductor device (140) move due to the Seebeck effect, and electricity may be generated.

[0046] Here, the P-type semiconductor device (130) and the N-type semiconductor device (140) may be bismuth telluride (Bi-Te) semiconductor devices comprising bismuth (Bi) and tellurium (Te) as main raw materials. The P-type semiconductor device (130) may be a bismuth telluride (Bi-Te) thermoelectric leg comprising at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the P-type semiconductor device (130) may contain 99 to 99.999 wt% of Bi-Sb-Te, which is the main raw material, based on 100 wt% of the total weight, and may contain at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) in an amount of 0.001 to 1 wt%. The N-type semiconductor device (140) may be a bismuth telluride (Bi-Te) thermoelectric leg containing at least one of selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium (Te), bismuth (Bi), and indium (In). For example, the N-type semiconductor device (140) may contain 99 to 99.999 wt% of Bi-Se-Te, which is a main raw material, based on 100 wt% of total weight, and may contain at least one of nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga) and indium (In) in an amount of 0.001 to 1 wt%.

[0047] The P-type semiconductor device (130) and the N-type semiconductor device (140) can be formed in a bulk or stacked form. Generally, the bulk P-type semiconductor device (130) or the bulk N-type semiconductor device (140) can be obtained by a process of heat-treating a thermoelectric material to produce an ingot, crushing and sieving the ingot to obtain powder for thermoelectric legs, sintering the powder, and cutting the sintered body. At this time, the P-type semiconductor device (130) and the N-type semiconductor device (140) may be polycrystalline thermoelectric legs. In this way, when the P-type semiconductor device (130) and the N-type semiconductor device (140) are polycrystalline thermoelectric legs, the strength of the P-type semiconductor device (130) and the N-type semiconductor device (140) can be increased. A stacked P-type semiconductor device (130) or a stacked N-type semiconductor device (140) can be obtained by forming unit members by applying a paste containing a thermoelectric material onto a sheet-shaped substrate, and then stacking and cutting the unit members.

[0048] At this time, a pair of P-type semiconductor devices (130) and N-type semiconductor devices (140) may have the same shape and volume, or different shapes and volumes. For example, since the electrical conductivity characteristics of the P-type semiconductor device (130) and the N-type semiconductor device (140) are different, the height or cross-sectional area of ​​the N-type semiconductor device (140) may be formed differently from the height or cross-sectional area of ​​the P-type semiconductor device (130).

[0049] At this time, the P-type semiconductor device (130) or the N-type semiconductor device (140) may have a cylindrical shape, a polygonal column shape, an elliptical column shape, etc.

[0050] In this specification, the semiconductor device may be referred to as a thermoelectric leg, a thermoelectric structure, a semiconductor structure, etc.

[0051] The performance of a thermoelectric element according to one embodiment of the present invention can be expressed as a figure of merit (ZT). The figure of merit (ZT) can be expressed as Equation 1.

[0052]

[0053] Here, α is the Seebeck coefficient [V / K], σ is the electric conductivity [S / m], and α 2 σ is the power factor (Power Factor, [W / mK 2 ...is. And, T is temperature, and k is thermal conductivity [W / mK]. k can be expressed as a·cp·ρ, and a is thermal diffusivity [cm² 2 / S], cp is specific heat [J / gK], and ρ is density [g / cm³]. 3 ]am.

[0054] To obtain the thermoelectric performance index of a thermoelectric element, the Z value (V / K) is measured using a Z meter, and the thermoelectric performance index (ZT) can be calculated using the measured Z value.

[0055] Here, the first electrode portion (120) disposed between the first substrate (110) and the P-type semiconductor device (130) and the N-type semiconductor device (140), and the second electrode portion (150) disposed between the second substrate (160) and the P-type semiconductor device (130) and the N-type semiconductor device (140) comprise at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni), and may have a thickness of 0.01 mm to 0.3 mm. If the thickness of the first electrode portion (120) or the second electrode portion (150) is less than 0.01 mm, the function as an electrode is reduced and the electrical conductivity performance may be lowered, and if it exceeds 0.3 mm, the conductivity efficiency may be lowered due to an increase in resistance.

[0056] Additionally, the mutually facing first substrate (110) and second substrate (160) may be metal substrates, and their thickness may be 0.1 mm to 1.5 mm. If the thickness of the metal substrate is less than 0.1 mm or exceeds 1.5 mm, the heat dissipation characteristics or thermal conductivity may become excessively high, which may reduce the reliability of the thermoelectric element. Furthermore, when the first substrate (110) and the second substrate (160) are metal substrates, an insulating layer (170) may be further formed between the first substrate (110) and the first electrode portion (120) and between the second substrate (160) and the second electrode portion (150), respectively. The insulating layer (170) may include a material having a thermal conductivity of 1 to 20 W / mK. At this time, the insulating layer (170) may be a resin composition comprising at least one of epoxy resin and silicone resin and an inorganic material, a layer made of a silicone composite comprising silicone and an inorganic material, or an aluminum oxide layer. Here, the inorganic material may be at least one of oxides, nitrides, and carbides of aluminum, boron, silicon, etc.

[0057] Each insulating layer (170) may be a single insulating layer or multiple insulating layers of different compositions. At least a portion of at least one side of the first electrode portion (120) and the second electrode portion (150) is embedded in the insulating layer (170), and the upper surface of the insulating layer (170) disposed between the multiple electrodes included in each electrode portion may have a concave shape toward each substrate. When each insulating layer (170) is a multiple insulating layer, at least a portion of at least one side of the first electrode portion (120) and the second electrode portion (150) is embedded in the insulating layer (170) disposed at the top relative to each substrate, and the upper surface of the insulating layer (170) disposed between the multiple electrodes included in each electrode portion may have a concave shape toward each substrate.

[0058] At this time, the sizes of the first substrate (110) and the second substrate (160) may be formed differently. That is, the volume, thickness, or area of ​​one of the first substrate (110) and the second substrate (160) may be formed to be larger than the volume, thickness, or area of ​​the other. Here, the thickness may be the thickness in the direction from the first substrate (110) toward the second substrate (160), and the area may be the area in the direction perpendicular to the direction from the first substrate (110) toward the second substrate (160). Accordingly, the heat absorption performance or heat dissipation performance of the thermoelectric element can be increased. Preferably, the volume, thickness, or area of ​​the first substrate (110) may be formed to be larger than at least one of the volume, thickness, or area of ​​the second substrate (160). At this time, when the first substrate (110) is placed in a high-temperature region for the Seebeck effect, when applied as a heat-generating region for the Peltier effect, or when a sealing member for protection from the external environment of the thermoelectric element is placed on the first substrate (110), at least one of the volume, thickness, or area can be made larger than that of the second substrate (160). At this time, the area of ​​the first substrate (110) can be formed in a range of 1.2 to 5 times the area of ​​the second substrate (160). If the area of ​​the first substrate (110) is formed to be less than 1.2 times that of the second substrate (160), the effect on improving heat transfer efficiency is not high, and if it exceeds 5 times, the heat transfer efficiency is significantly reduced, and it may be difficult to maintain the basic shape of the thermoelectric module.

[0059] Additionally, a heat dissipation pattern, such as an uneven pattern, may be formed on at least one surface of the first substrate (110) and the second substrate (160). Accordingly, the heat dissipation performance of the thermoelectric element can be improved. When the uneven pattern is formed on the surface in contact with the P-type semiconductor element (130) or the N-type semiconductor element (140), the bonding characteristics between the semiconductor element and the substrate can also be improved.

[0060] Although not illustrated, a sealing member may be further disposed between the first substrate (110) and the second substrate (160). The sealing member may be disposed on the side of the first electrode portion (120), the P-type semiconductor device (130), the N-type semiconductor device (140), and the second electrode portion (150) between the first substrate (110) and the second substrate (160). Accordingly, the first electrode portion (120), the P-type semiconductor device (130), the N-type semiconductor device (140), and the second electrode portion (150) can be sealed from external moisture, heat, contamination, etc.

[0061] Referring again to FIGS. 1 and 2, a thermoelectric module (1200) may be disposed on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), respectively.

[0062] As described above, each thermoelectric element (100) comprises a first substrate (110) disposed to contact a fluid flow section (1100), a first electrode section (120) disposed on the first substrate (110), a plurality of semiconductor elements (130, 140) disposed on the first electrode section (120), a second electrode section (150) disposed on the plurality of semiconductor elements (130, 140), and a second substrate (160) disposed on the second electrode section (150), wherein a heat sink (1220) is disposed on the second substrate (160). At this time, the first substrate of the thermoelectric element disposed on the fluid flow section (1100) may be a metal substrate, and the metal substrate may be bonded to the surface of the fluid flow section (1100) by a thermal interface material (TIM, not shown). Since the metal substrate has excellent heat transfer performance, heat transfer between the thermoelectric element and the fluid flow section (1100) is facilitated. Additionally, if the metal substrate and the fluid flow section (1100) are bonded by a thermal interface material (TIM), heat transfer between the metal substrate and the fluid flow section (1100) may not be hindered. Here, the metal substrate may be one of a copper substrate, an aluminum substrate, and a copper-aluminum substrate, but is not limited thereto.

[0063] The thermoelectric module (1200) may include a connector for applying electricity to extract the generated electricity to the outside or to use it as a Peltier. According to an embodiment of the present invention, an insulating frame (900) may be placed around the connector to maintain a uniform bonding force between the thermoelectric module (1200) and the fluid flow part (1100) and to protect the wiring (W) connected to the connector.

[0064] In addition, according to an embodiment of the present invention, a shield member (1500) may be further disposed to prevent moisture or contaminants from penetrating into the thermoelectric module (1200).

[0065] FIG. 6 is a plan view of a thermoelectric module according to one embodiment of the present invention, FIG. 7 is an exploded perspective view of a thermoelectric module according to one embodiment of the present invention, FIG. 8 is a perspective view of a first frame included in a thermoelectric module according to one embodiment of the present invention, and FIG. 9 is a perspective view of a second frame included in a thermoelectric module according to one embodiment of the present invention.

[0066] According to an embodiment of the present invention, a thermoelectric module (1200) may be disposed on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), respectively. The thermoelectric module (1200) includes a thermoelectric element and a heat sink, and redundant descriptions regarding the same content as described with reference to FIGS. 4 and 5 are omitted.

[0067] Referring to FIGS. 6 to 9, the thermoelectric module (1200) includes a first substrate (1201), a plurality of semiconductor elements (1202) disposed on the first substrate (1201), and a second substrate (1203) disposed on the plurality of semiconductor elements (1202). The first substrate (1201) may be the first substrate (110) described with reference to FIGS. 4 to 5, the plurality of semiconductor elements (1202) may be P-type semiconductor elements (130) and N-type semiconductor elements (140) described with reference to FIGS. 4 to 5, and the second substrate (1203) may be the second substrate (160) described with reference to FIGS. 4 to 5. Although not illustrated, a first electrode (120) described with reference to FIGS. 4 and 5 may be disposed between a first substrate (1201) and a plurality of semiconductor elements (1202), and a second electrode (150) described with reference to FIGS. 4 and 5 may be disposed between a plurality of semiconductor elements (1202) and a second substrate (1203).

[0068] According to an embodiment of the present invention, a first substrate (1201) is disposed on a first surface (1110) of a fluid flow section (1100). At this time, the first substrate (1201) may be disposed to be in direct contact with the first surface (1110) of the fluid flow section (1100), or may be disposed to be in indirect contact through a thermal interface material (TIM), etc.

[0069] According to an embodiment of the present invention, the first substrate (1201) includes first to fourth outer surfaces (1201S1 to 1201S4), the first outer surface (1201S1) and the second outer surface (1201S2) of the first substrate (1201) face each other, the third outer surface (1201S3) and the fourth outer surface (1201S4) of the first substrate (1201) face each other, and the first outer surface (1201S1) and the second outer surface (1201S2) of the first substrate (1201) can be sequentially arranged along a direction from the third surface (1130) of the fluid flow section (1100) toward the fourth surface (1140).

[0070] According to an embodiment of the present invention, the second substrate (1203) includes a plurality of sub-second substrates (1203-1, ..., 1203-4) arranged spaced apart from each other, and a sub-heatsink (1220-1, ..., 1220-4) may be disposed on each sub-second substrate (1203-1, ..., 1203-4). Accordingly, even if the second substrate (1203) is exposed to a high temperature, the problem of the thermoelectric element being damaged due to bending of the second substrate (1203) can be reduced.

[0071] According to an embodiment of the present invention, a sealing frame (800) may be further disposed on a first substrate (1201). The sealing frame (800) may include an insulating material and may be disposed between a plurality of sub-second substrates (1203-1, ..., 1203-4) on the first substrate (1201). Accordingly, the sealing frame (800) may seal the space between the first substrate (1201) and the plurality of sub-second substrates (1203-1, ..., 1203-4) by separating the plurality of sub-second substrates (1203-1, ..., 1203-4) from each other.

[0072] According to an embodiment of the present invention, a first region (800A), which is a part of the sealing frame (800), is placed on a first substrate (1201), and a second region (800B), which is a remaining part, can be placed on a first surface (1110) of the fluid flow section (1100) between the second outer edge (1201S2) of the first substrate (1201) and the fourth surface (1140) of the fluid flow section (1100). That is, the second region (800B) of the sealing frame (800) may not overlap with the first substrate (1201) in the first direction.

[0073] As described above, an electrode portion may be disposed between the first substrate (1201) and a plurality of semiconductor elements (1202).

[0074] Additionally, extension electrodes (T1, T2) extending toward the first outer edge (1201S1) of the first substrate (1201) may be further disposed on the first substrate (1201). In an embodiment of the present invention, the second fluid may flow in a direction from the second outer edge (1201S2) toward the first outer edge (1201S1). A connector is disposed on the extension electrodes (T1, T2), and wiring may be connected to the connector.

[0075] According to an embodiment of the present invention, an insulating frame (900) is further disposed on the extension electrodes (T1, T2). The insulating frame (900) can maintain a uniform bonding force between the thermoelectric module (1200) and the fluid flow part (1100) and protect the wiring connected to the connector.

[0076] According to an embodiment of the present invention, an opening (910) is formed in the insulating frame (900), and the opening (910) may be positioned at a location corresponding to at least a part of the extension electrodes (T1, T2), and the opening (910) may be filled with resin. Accordingly, the resin may be placed on the extension electrodes (T1, T2) to provide insulation, thereby increasing the withstand voltage performance of the thermoelectric module (1200). Here, the resin may include epoxy resin or silicone resin. If the insulating frame (900) includes a plastic material, the insulating frame (900) can be easily molded into various sizes and shapes. For example, the insulating frame (900) may be a plastic material applicable at high temperatures, such as PPS (polyphenylene sulfide). Accordingly, the problem of the shape of the insulating frame (900) being deformed by the second fluid at high temperatures can be prevented.

[0077] According to an embodiment of the present invention, a first region (900A), which is a part of the insulating frame (900), is placed on a first substrate (1201), and a second region (900B), which is a remaining part, can be placed on a first surface (1110) of the fluid flow section (1100) between the first outer edge (1201S1) of the first substrate (1201) and the third surface (1130) of the fluid flow section (1100). That is, the second region (900B) of the insulating frame (900) may not overlap with the first substrate (1201) in the first direction.

[0078] Meanwhile, referring to FIGS. 1 and 2, a shield member (1500) may be further disposed to prevent moisture or contaminants from penetrating into the thermoelectric module (1200). As described above, the fluid flow section (1100) includes a first surface (1110) and a second surface (1120) spaced apart from the first surface (1110) in a first direction, and a thermoelectric module (1200) is disposed on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), respectively. The first fluid flows through the first surface (1110) and the second surface (1120) of the fluid flow section (1100) along a second direction perpendicular to the first direction, and the second fluid, which is hotter than the first fluid, flows on the heat sink (1220) of the thermoelectric module (1200) along a third direction perpendicular to the first and second directions. Here, the third direction may be a direction from the fourth surface (1140) of the fluid flow section (1100) toward the third surface (1130).

[0079] FIG. 10 is a cross-sectional view of a thermoelectric device according to one embodiment of the present invention with a shield member assembled therein, FIG. 11(a) and FIG. 11(b) respectively show enlarged cross-sections of R1 and R2 of FIG. 10, FIG. 12(a) and FIG. 12(b) respectively show enlarged cross-sections of R3 and R4 of FIG. 9, FIG. 13 shows the lower surface of a fluid guide of the present invention, and FIG. 14 is a cross-sectional view of a thermoelectric device according to a comparative example and an embodiment.

[0080] Referring to FIG. 2 and FIG. 10, with the thermoelectric module (1200) assembled on the first surface (1110) and the second surface (1120) of the fluid flow section (1100), a first shield member (1510) is placed on the third surface (1130) of the fluid flow section (1100), and a second shield member (1520) is placed on the fourth surface (1140) of the fluid flow section (1100). In FIG. 2, two first shield members (1510) are arranged along the second direction on the third surface (1130) of the fluid flow section (1100), and two second shield members (1520) are arranged along the second direction on the fourth surface (1140) of the fluid flow section (1100), but the number of first shield members (1510) and second shield members (1520) is not limited thereto.

[0081] The first shield member (1510) is positioned on the third surface (1130) of the fluid flow section (1100), and may be extended to cover parts of the first surface (1110) and the second surface (1120) of the fluid flow section (1100). For example, the cross-section of the first shield member (1510) may be in the shape of a "C". Accordingly, the first shield member (1510) can protect not only the third surface (1130) of the fluid flow section (1100), but also the boundary between the first surface (1110) and the third surface (1130) and the boundary between the second surface (1120) and the third surface (1130).

[0082] Likewise, the second shield member (1520) is positioned on the fourth surface (1140) of the fluid flow section (1100) and may extend to cover parts of the first surface (1110) and the second surface (1120) of the fluid flow section (1100). For example, the cross-section of the second shield member (1520) may be in the shape of a "C". Accordingly, the second shield member (1520) can protect not only the fourth surface (1140) of the fluid flow section (1100), but also the boundary between the first surface (1110) and the fourth surface (1140) and the boundary between the second surface (1120) and the fourth surface (1140).

[0083] At this time, a first insulating member (1610) may be further disposed between the fluid flow section (1100) and the first shield member (1510), and a second insulating member (1620) may be further disposed between the fluid flow section (1100) and the second shield member (1520). According to this, even if a second fluid of high temperature flows on the surface of the first shield member (1510) and the second shield member (1520), the effect of the second fluid on the cooling performance of the first fluid within the fluid flow section (1100) can be minimized.

[0084] A fastening hole is formed in the first shield member (1510), through which it can be fastened to the third surface (1130) of the fluid flow section (1100). Accordingly, the first insulation member (1610) can be placed between the fastening holes. Likewise, a fastening hole is formed in the second shield member (1520), through which it can be fastened to the fourth surface (1140) of the fluid flow section (1100). Accordingly, the second insulation member (1620) can be placed between the fastening holes.

[0085] According to an embodiment of the present invention, a thermoelectric module (1200) is assembled on a first surface (1110) and a second surface (1120) of a fluid flow section (1100), and a first shield member (1510) and a second shield member (1520) are assembled on a third surface (1130) and a fourth surface (1140) of the fluid flow section (1100). Then, a third shield member (1530) is disposed on the first surface (1110) of the fluid flow section (1100) and the thermoelectric module (1200), and a fourth shield member (1540) is disposed on the second surface (1120) of the fluid flow section (1100) and the thermoelectric module (1200). In FIG. 2, two third shield members (1530) are arranged along the second direction on the first surface (1110) of the fluid flow section (1100), and two fourth shield members (1530) are arranged along the second direction on the second surface (1120) of the fluid flow section (1100), but the number of third shield members (1530) and fourth shield members (1540) is not limited thereto.

[0086] At this time, the third shield member (1530) may be extended onto the first shield member (1510) on the third surface (1130) of the fluid flow section (1100) and the second shield member (1520) on the fourth surface (1140), and the fourth shield member (1540) may also be extended onto the first shield member (1510) on the third surface (1130) of the fluid flow section (1100) and the second shield member (1520) on the fourth surface (1140).

[0087] That is, the third shield member (1530) includes a third-1 region (1531) disposed on the third surface (1130) of the fluid flow section (1100), a third-2 region (1532) disposed on the first surface (1110) of the fluid flow section (1100), and a third-3 region (1533) disposed on the fourth surface (1140) of the fluid flow section (1100).

[0088] At this time, the third surface (1130) of the fluid flow section (1100), the first shield member (1510), and the third-1 region (1531) of the third shield member (1530) are arranged sequentially along the direction from the fourth surface (1140) toward the third surface (1130). When the first insulation member (1610) is arranged between the third surface (1130) and the first shield member (1510), the third surface (1130), the first insulation member (1610), the first shield member (1510), and the third-1 region (1531) of the third shield member (1530) can be arranged sequentially along the direction from the fourth surface (1140) toward the third surface (1130).

[0089] Additionally, the third-third region (1533) of the fourth surface (1140), the second shield member (1520), and the third shield member (1530) is arranged sequentially along the direction from the third surface (1130) toward the fourth surface (1140). When the second insulating member (1620) is arranged between the fourth surface (1140) and the second shield member (1520), the third-third region (1533) of the fourth surface (1140), the second insulating member (1620), the second shield member (1520), and the third shield member (1530) of the fluid flow section (1100) can be arranged sequentially along the direction from the third surface (1130) toward the fourth surface (1140).

[0090] In this way, the first shield member (1510) is covered by the third shield member (1530) and the fourth shield member (1540) on the side of the third surface (1130) of the fluid flow section (1100), and the second shield member (1520) is covered by the third shield member (1530) and the fourth shield member (1540) on the side of the fourth surface (1140) of the fluid flow section (1100). Therefore, the gap between the first shield member (1510) and the third shield member (1540), the gap between the first shield member (1510) and the fourth shield member (1540), the gap between the second shield member (1520) and the third shield member (1540), and the gap between the second shield member (1520) and the fourth shield member (1540) The problem of the second fluid flowing through the gap can be prevented, and accordingly, the effect of the high-temperature second fluid on the temperature of the first fluid within the fluid flow section (1100) can be minimized and the thermoelectric performance can be improved.

[0091] According to an embodiment of the present invention, an insulating member (not shown) may be further disposed between the first shield member (1510) and the third shield member (1530) and between the second shield member (1520) and the third shield member (1530) on the first surface (1110) of the fluid flow section (1100), between the first shield member (1510) and the fourth shield member (1540) and between the second shield member (1520) and the fourth shield member (1540) on the second surface (1120) of the fluid flow section (1100). Accordingly, the influence of the high-temperature second fluid on the temperature of the first fluid within the fluid flow section (1100) can be minimized, and thermoelectric performance can be improved.

[0092] According to an embodiment of the present invention, the third shield member (1530) may include four or fewer bends along the direction in which the second fluid flows from the third-3 region (1533) to the third-1 region (1531). For example, the third shield member (1530) may include a bend (1530B4) disposed between the third-3 region (1533) and the third-2 region (1532), bends (1530B2, 1530B3) disposed within the third-2 region (1532), and a bend (1530B1) disposed between the third-2 region (1532) and the third-1 region (1531).

[0093] As the number of bends formed in the third shield member (1530) along the direction in which the second fluid flows increases, the flow of the second fluid is obstructed, and the pressure difference between the inlet side and the outlet side of the second fluid tends to increase. As in the embodiment of the present invention, if the third shield member (1530) includes four or fewer bends along the direction in which the second fluid flows, it means that there are four or fewer points where the flow of the second fluid changes, and as a result, the pressure difference between the inlet side and the outlet side of the second fluid can be significantly reduced.

[0094] As shown in FIG. 14(a), in the comparative example in which the third shield member (1530) includes eight bends along the direction in which the second fluid flows, and as shown in FIG. 14(b), in the embodiment in which the third shield member (1530) includes four bends along the direction in which the second fluid flows, the pressure difference between the inlet side and the outlet side of the second fluid was compared, and it was confirmed that the embodiment (100mmAg) has an improvement effect of 20 to 40% compared to the comparative example (150mmAg).

[0095] Meanwhile, as described above, the first region (900A) of the insulating frame (900) may be placed on the first substrate (1201), and the second region (900B) may be placed on the first surface (1110) of the fluid flow section (1100) between the first outer edge (1201S1) of the first substrate (1201) and the third surface (1130) of the fluid flow section (1100). Also, the first region (800A) of the sealing frame (800) may be placed on the first substrate (1201), and the second region (800B) may be placed on the first surface (1110) of the fluid flow section (1100) between the second outer edge (1201S2) of the first substrate (1201) and the fourth surface (1140) of the fluid flow section (1100).

[0096] At this time, the sealing frame (800) and the insulation frame (900) may be placed below the third shield member (1530). That is, the third shield member (1530) may be placed to cover the sealing frame (800) and the insulation frame (900).

[0097] Referring to FIG. 2, FIG. 11(a) and FIG. 11(b), a through hole (S11, S12) corresponding to each other is disposed in the second region (900B) of the insulating frame (900) and the third shield member (1530), respectively, and the through hole (S11, S12) may be disposed so as not to overlap each other along the first direction with the first substrate (1201). According to an embodiment of the present invention, a fastening member (200) is disposed in the through hole (S11, S12) to fix the first surface (1110) of the fluid flow part (1100), the insulating frame (900), and the third shield member (1530). In this way, when a through hole (S11, S12) for the fastening member (200) is formed in the second region (900B) of the insulating frame (900) that extends to a region away from the first outer edge (1201S1) of the first substrate (1201), the first substrate (1201) and the fastening member (200) do not come into contact, so the withstand voltage of the thermoelectric element is improved, and the curved portion of the third sealing member (1530) can be not increased, so the flow of the second fluid can be improved.

[0098] Likewise, corresponding through holes (S21, S22) are disposed in the second region (800B) of the sealing frame (800) and the third shield member (1530), respectively, and the through holes (S21, S22) may be disposed so as not to overlap each other along the first direction with the first substrate (1201). According to an embodiment of the present invention, a fastening member (200) is disposed in the through holes (S21, S22) to fix the first surface (1110) of the fluid flow part (1100), the sealing frame (800), and the third shield member (1530). In this way, when a through hole (S21, S22) for the fastening member (200) is formed in the second region (800B) of the sealing frame (800) that extends to an area away from the second outer edge (1201S2) of the first substrate (1201), the first substrate (1201) and the fastening member (200) do not come into contact, so the withstand voltage is improved, and the curved portion of the third sealing member (1530) can be not increased, so the flow of the second fluid can be improved.

[0099] As illustrated in the comparative example of FIG. 14(a), when the third sealing member (1530) and the fluid flow section (1100) are directly connected, an inclined surface must be provided on the third sealing member (1530) to reduce the effect on the flow of the second fluid. Accordingly, the length (z1, z2) of the third sealing member (1530) must be extended in the direction in which the second fluid flows, and the actual area for placing the semiconductor device may be reduced. On the other hand, as illustrated in the embodiment of FIG. 14(b), when the third sealing member (1530) and the fluid flow section (1100) are connected through an insulating frame (900) and a sealing frame (800), the thermoelectric efficiency can be improved because the length of the third sealing member (1530) does not need to be extended beyond what is necessary in the direction in which the second fluid flows without increasing the number of bends. Additionally, as illustrated in the embodiment of FIG. 14(b), when the third sealing member (1530) and the fluid flow member (1100) are connected through the insulating frame (900) and the sealing frame (800), the first sealing member (1510) can be fixed to the third surface (1130) of the fluid flow member (1100) by the third sealing member (1530) and the fourth sealing member (1540), and the second sealing member (1520) can be fixed to the fourth surface (1140) of the fluid flow member (1100) by the third sealing member (1530) and the fourth sealing member (1540). Therefore, the connection between the first sealing member (1510) and the third surface (1130) of the fluid flow member (1100) and the second sealing member (1520) and The number of fastening holes and fastening members for fastening between the fourth surface (1140) of the fluid flow section (1100) can be minimized.

[0100] According to an embodiment of the present invention, the head (200H) of the fastening member (200) is seated on the edge of the through hole (S11, S21) of the third shield member (1530), and the head (200H) of the fastening member (200), the third shield member (1530), and the sealing frame (800), or the head (200H) of the fastening member (200), the third shield member (1530), and the insulating frame (900) may overlap each other in a first direction. In this way, when the head (200H) of the fastening member (800) is placed on an insulating member such as a sealing frame (800) or an insulating frame (900), not only can the withstand voltage of the thermoelectric device be lowered, but the third shield member (1530) does not come into direct contact with the first surface (1110) of the fluid flow part (1100), so the fluid flow part (1100) can be protected from the second fluid at a high temperature.

[0101] Meanwhile, the through hole (S22) of the sealing frame (800) or the through hole (S12) of the insulation frame (900) may be spaced apart from the column of the fastening member (200). To this end, the diameter of the through hole (S22) of the sealing frame (800) or the through hole (S12) of the insulation frame (900) may be larger than the diameter of the column of the fastening member (200). According to this, the fastening member (200) can be easily fastened, and the sealing frame (800) or the insulation frame (900) can be protected under frequent vibration environments.

[0102] Next, referring to FIG. 2, FIG. 12(a) and FIG. 12(b), the second region (800B) of the shield frame (800) and the second region (900B) of the insulation frame (900) include an upper surface positioned toward the third shield member (1530) and a lower surface positioned toward the first surface (1110) of the fluid flow portion (1100).

[0103] At this time, a groove (G1, G2) is formed in at least one of the lower surface of the second region (800B) of the shield frame (800) and the lower surface of the second region (900B) of the insulation frame (900), and the depth of the groove (G1, G2) in the first direction may be greater than the height in the first direction of the first substrate (1201). Accordingly, the groove (G1, G2) may be filled with a sealing material or an adhesive, and the bonding force between the shield frame (800) or the insulation frame (900) and the first surface (1110) of the fluid flow part (1100) may be increased, and the problem of external material penetrating into the first substrate (1201) may be prevented. However, to prevent overfilling of the sealing material or adhesive, the depth of the groove (G1, G2) in the first direction may be less than or equal to twice the height in the first direction of the first substrate (1201).

[0104] Referring again to FIG. 2 and FIG. 10 to FIG. 13, the first fluid guide (1710) is disposed on the third-1 region (1531) of the third shield member (1530) along the direction from the fourth surface (1140) of the fluid flow section (1100) toward the third surface (1130), and the second fluid guide (1720) is disposed on the third-3 region (1533) of the third shield member (1530) along the direction from the third surface (1130) of the fluid flow section (1100) toward the fourth surface (1140).

[0105] The second fluid guide (1720) branches the second fluid to ensure that the second fluid is evenly distributed to the thermoelectric module placed on the first surface (1110) of the fluid flow section (1100) and the thermoelectric module placed on the second surface (1120), and the first fluid guide (1710) ensures that the second fluid passing through the thermoelectric module placed on the first surface (1110) of the fluid flow section (1100) and the thermoelectric module placed on the second surface (1120) is discharged without causing a pressure difference between the inlet side and the outlet side.

[0106] At this time, the first fluid guide (1710) includes a surface (1712) parallel to the third surface (1130), and the second fluid guide (1720) includes a surface (1722) parallel to the fourth surface (1140). According to this, it is easy to form a through hole for a fastening member to pass through for fastening between the first fluid guide (1710) and the third surface (1130), and a through hole for a fastening member to pass through for fastening between the second fluid guide (1720) and the fourth surface (1140), and since the head of the fastening member can be seated on the parallel surfaces (1712, 1722) of the first and second fluid guides (1710, 1720), stable fastening is possible.

[0107] Meanwhile, as illustrated in FIG. 13, a pan nut (1730) may be disposed on the lower surface of the first fluid guide (1710) or the second fluid guide (1720). The pan nut (1730) may be disposed to correspond to a through hole through which a fastening member passes, and may be made of an insulating material. Accordingly, the fastening member may pass through the pan nut (1730), and the first and second fluid guides (1710, 1720) may be stably seated in the fluid flow section (1100).

[0108] According to an embodiment of the present invention, the maximum width (W1) along the first direction of the first fluid guide (1710) may be greater than the maximum width (W2) along the first direction of the second fluid guide (1720). Additionally, the distance (d1) between the third shield member (1530) and the fourth shield member (1540) in the second region (900B) of the insulating frame (900) may be greater than the distance (d2) between the third shield member (1530) and the fourth shield member (1540) in the second region of the sealing frame (800). Accordingly, since the distance between the thermoelectric devices is narrower in the discharge region than in the region where the second fluid flows in, the second fluid is not discharged at a rapid speed and remains in the heat sink of the thermoelectric device for a longer period, thereby improving the thermoelectric performance of the thermoelectric device.

[0109] For convenience of explanation, the description has focused on the third shield member (1530) positioned on the first surface (1110) of the fluid flow section (1100), but the same description may also apply to the fourth shield member (1540) positioned on the second surface (1120) of the fluid flow section (1100). The third shield member (1530) and the fourth shield member (1540) may be positioned symmetrically with respect to the fluid flow section (1100).

[0110] Meanwhile, as described above, the fluid flow section (1100) includes a flow path area (500), a fluid inflow area (510), and a fluid outflow area (520). Also, the thermoelectric module (1200) and the first to fourth shield members (1510, 1520, 1530, 1540) are all disposed on the flow path area (500).

[0111] According to an embodiment of the present invention, when a thermoelectric module (1200) and first to fourth shield members (1510, 1520, 1530, 1540) are all disposed on a fluid flow section (1100), a fifth shield member (1550) and a sixth shield member (1560) may be further disposed on a fluid inlet area (510), and a seventh shield member (1570) and an eighth shield member (1580) may be further disposed on a fluid discharge area (520). At this time, the fifth shield member (1550), the sixth shield member (1560), the seventh shield member (1570), and the eighth shield member (1580) may each be extended to cover a portion of the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100). Although not shown, an insulating member may be further disposed between the fluid inlet area (510) and the fifth shield member (1550), between the fluid inlet area (510) and the sixth shield member (1560), between the fluid discharge area (520) and the seventh shield member (1570), and between the fluid discharge area (520) and the eighth shield member (1580).

[0112] Meanwhile, as described above, the extension electrode of the thermoelectric module extends toward the direction in which the second fluid is discharged, a connector is disposed on the extension electrode, and wiring can be connected to the connector.

[0113] That is, when the second fluid flows in a direction toward the third surface (1130) from the fourth surface (1140) of the fluid flow section (1100), the extension electrode, connector, and wiring are positioned on the third surface (1130) side of the fluid flow section (1100), and the wiring can be guided in a direction toward the fourth surface (1140) from the third surface (1130) in the space between the fluid inflow area (510) and the fifth shield member (1550) and between the fluid inflow area (510) and the sixth shield member (1560), and then pulled out to the outside.

[0114] According to an embodiment of the present invention, a plurality of thermoelectric devices may form a thermoelectric system.

[0115] FIG. 15 is a thermoelectric system according to one embodiment of the present invention.

[0116] Referring to FIG. 15, the thermoelectric system (2500) includes a first thermoelectric device (1000-1), a second thermoelectric device (1000-2) spaced apart from the first thermoelectric device (1000-1) along a first direction, a third thermoelectric device (1000-3) spaced apart from the second thermoelectric device (1000-2) along a first direction, a wiring section (not shown) electrically connected to the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3), and a wiring receiving section (2700) positioned on one side of the upper portion of the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) to accommodate a portion of the wiring section. For convenience of explanation, the first to third thermoelectric devices (1000-1, ..., 1000-3) are described as examples in this specification, but the number of thermoelectric devices included in the thermoelectric system (2500) is not limited to this and may include two or more thermoelectric devices.

[0117] The first fluid flows through each of the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) along a second direction perpendicular to the first direction, and the second fluid, which is hotter than the first fluid, can flow between the first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) along a third direction perpendicular to the first direction and the second direction.

[0118] The first thermoelectric device (1000-1), the second thermoelectric device (1000-2), and the third thermoelectric device (1000-3) may each be a thermoelectric device described with reference to FIGS. 1 to 13.

[0119] As described above, the wiring connected to the thermoelectric module included in each thermoelectric device is drawn out in a direction toward the fourth side (1140) from the third side (1130) of the fluid inflow area (510) of the fluid flow section (1100).

[0120] According to an embodiment of the present invention, the wiring receiving portion (2700) is positioned on the upper side of one side of a plurality of thermoelectric devices spaced apart along a first direction, for example, a first thermoelectric device (1000-1), a second thermoelectric device (1000-2), and a third thermoelectric device (1000-3). Here, one side refers to the fluid inflow area (510) of the fluid flow portion (1100), and the upper side refers to the surface positioned in the direction in which the second fluid flows, that is, the fourth surface (1140) of the fluid flow portion (1100) when the second fluid flows in a third direction toward the third surface (1130) from the fourth surface (1140) of the fluid flow portion (1100).

[0121] The wiring receiving section (2700) serves to collect wiring drawn from multiple thermoelectric devices and guide it to the outside. When the wiring receiving section (2700) is positioned on one side of the upper part of the fluid flow section (1100), that is, in the fluid inlet area (510), it does not obstruct the flow of the second fluid passing through the thermoelectric module (1200) positioned in the flow path area (520), thereby increasing thermoelectric performance. Additionally, since the temperature of the fluid inlet area (510) is lower than that of the fluid discharge area (520), the temperature of the wiring passing through the wiring receiving section (2700) can be maintained at a lower state.

[0122] FIG. 16 is an exploded perspective view of a wiring receiving portion disposed on one side of a plurality of thermoelectric devices according to one embodiment of the present invention, and FIG. 17 is an enlarged view of D1 of FIG. 16.

[0123] Referring to FIGS. 16 and 17, a wiring receiving portion (2700) according to an embodiment of the present invention includes a case (2710) disposed on the upper side of one side of the first to third thermoelectric devices (1000-1, 1000-2, 1000-3) and a cover (2720) covering the case (2710). As described above, a fifth shield member (1550) and a sixth shield member (1560) may be further disposed on one side of the first to third thermoelectric devices (1000-1, 1000-2, 1000-3), i.e., in the fluid inflow area (510). The fifth shield member (1550) may be disposed on the first surface (1110) side of the fluid flow section (1100), and the sixth shield member (1560) may be disposed on the second surface (1120) side of the fluid flow section (1100). Accordingly, the wiring receiving section (2700) may be disposed on the fifth shield member (1550) and the sixth shield member (1560).

[0124] A plurality of bottom holes (2712H) are formed in the bottom portion (2712) of the case (2710), and a plurality of side wall holes (2714H) are formed in the side wall (2714) of the case (2710).

[0125] A first wiring section (W1), connected to a first thermoelectric device (1000-1) and guided in a direction from the third surface (1130) of the fluid flow section (1100) toward the fourth surface (1140), passes through a first bottom hole (2712H1) and is drawn out to the outside through a side wall hole (2714H); a second wiring section (W2), connected to a second thermoelectric device (1000-2) and guided in a direction from the third surface (1130) of the fluid flow section (1100) toward the fourth surface (1140), passes through a second bottom hole (2712H2) and is drawn out to the outside through a side wall hole (2714H); and a third wiring section (W2), connected to a third thermoelectric device (1000-3) and guided in a direction from the third surface (1130) of the fluid flow section (1100) toward the fourth surface (1140). The wiring section (W3) can be pulled out to the outside through the side wall hole (2714H) after passing through the third bottom hole (2712H3).

[0126] At this time, the number of multiple side wall holes (2714H) formed in the case (2710) may be less than the number of multiple bottom holes (2712H). For example, wiring connected to each thermoelectric device passes through each bottom hole, and multiple wiring that has passed through multiple bottom holes may pass through a single side wall hole.

[0127] According to an embodiment of the present invention, the wiring receiving portion (2700) may further include an insulating member (2730). The insulating member (2730) may be disposed between the case (2710) and the cover (2720). When the wiring portion (W) passes through the bottom hole (2712H) and the side wall hole (2714H) of the case (2710) and the insulating member (2730) is received within the case (2710), and the cover (2720) is disposed on the insulating member (2730), the wiring portion (W) can be protected from a second fluid at a high temperature.

[0128] According to an embodiment of the present invention, a case (2710) and a cover (2720) can be fastened by a fastening member (1900). To this end, fastening holes corresponding to each other may be formed in the case (2710) and the cover (2720). For example, a plurality of fastening holes (2714T) spaced apart at a predetermined interval are formed on a side wall of the case (2710) that is opposite to the side wall where a side wall hole (2714H) is formed, and a plurality of fastening holes (2720T) corresponding to the fastening holes (2714T) of the case (2710) are also formed on the side wall of the cover (2720), and the fastening member (1900) can fix the case (2710) and the cover (2720) by penetrating the fastening holes (2720T) and the fastening holes (2714T). At this time, the side wall of the case (2710) in which the fastening hole (2714T) is formed may include a protrusion (2714P) that protrudes toward the interior of the case (2710). The protrusion (2714P) corresponds to the fastening hole (2714T) and can accommodate the fastening hole (2714T). Accordingly, since the protrusion (2714P) can accommodate a fastening member (1900) entering toward the interior of the case (2710), the problem of the fastening member (1900) causing damage to the wiring member (W) or insulation member (2730) accommodated inside the case (2710) can be prevented.

[0129] FIG. 18(a) is a top perspective view of a case of a wiring receiving portion according to one embodiment of the present invention, FIG. 18(b) is a bottom perspective view of a case of a wiring receiving portion according to one embodiment of the present invention, FIG. 19(a) is a perspective view of a sixth shield member according to one embodiment of the present invention, FIG. 19(b) is a perspective view of a fifth shield member according to one embodiment of the present invention, FIG. 20 is a cross-sectional perspective view showing the internal structure of a wiring receiving portion in a state where the shield member and the wiring receiving portion are assembled in a thermoelectric system according to one embodiment of the present invention, FIG. 21 is a cross-sectional view of the E1 area of ​​FIG. 20.

[0130] Referring to FIGS. 18 to 21, the bottom portion (2712) of the case (2710) includes a bottom portion upper surface (2712U) positioned toward the cover (2720) and a bottom portion lower surface (2712L) positioned toward the thermoelectric device (1000). Additionally, the bottom portion lower surface (2712L) includes a first stepped portion (2712S) protruding along the edge of the bottom hole (2712H) in a direction toward the thermoelectric device (1000).

[0131] This first step portion (2712S) can protect the wiring portion (W) from the second fluid at a high temperature in the gap between the upper portion of the fifth and sixth shield members (1550, 1560) and the lower portion of the wiring receiving portion (2700).

[0132] According to an embodiment of the present invention, an insulating member (1800) may be further disposed between the upper portion of the fifth and sixth shield members (1550, 1560) and the wiring receiving portion (2700). Accordingly, the possibility of the wiring portion (W) being exposed to a second fluid at a high temperature in the gap between the upper portion of the fifth and sixth shield members (1550, 1560) and the lower portion of the wiring receiving portion (2700) can be reduced.

[0133] Meanwhile, according to an embodiment of the present invention, a fifth shield member (1550) is disposed on the first surface (1110) side of the fluid flow section (1100), and a sixth shield member (1560) is disposed on the second surface (1120) side. The fifth shield member (1550) and the sixth shield member (1560) may be disposed to meet on the third surface (1130) and the fourth surface (1140) of the fluid flow section (1100). For convenience of explanation, the fifth and sixth shield members (1550, 1560) disposed on the third surface (1130) of the fluid flow section (1100) are respectively referred to as the upper portions of the fifth and sixth shield members (1550, 1560). A wiring section (W) electrically connected to each thermoelectric device (1000) is guided in the space between the first surface (1110) of the fluid flow section (1100) and the fifth shield member (1550) and between the second surface (1120) of the fluid flow section (1100) and the sixth shield member (1560), in a direction from the third surface (1130) of the fluid flow section (1100) toward the fourth surface (1140), and then passes through the upper hole (1500H) formed by the fifth shield member (1550) and the sixth shield member (1560) and the bottom hole (2712H) of the case (2710). To this end, the upper hole (1500H) formed by the fifth shield member (1550) and the sixth shield member (1560) can be positioned to correspond to the bottom hole (2712H) of the case (2710).

[0134] According to an embodiment of the present invention, the upper portions of the fifth and sixth shield members (1550, 1560) include an upper surface (1550U, 1560U) positioned toward the wiring receiving portion (2700) and a lower surface (1550B, 1560B) positioned toward the third surface (1130) of the fluid flow portion (1100). Additionally, the upper surface (1550U, 1560U) of the fifth and sixth shield members (1550, 1560) includes a second stepped portion (1550S, 1560S) protruding along the edge of the upper hole (1500H) in a direction toward the wiring receiving portion (2700).

[0135] These second step portions (1550S, 1560S) can protect the wiring portion (W) from the second fluid at a high temperature in the gap between the upper portion of the fifth and sixth shield members (1550, 1560) and the lower portion of the wiring receiving portion (2700).

[0136] According to an embodiment of the present invention, the second step portion (1550S, 1560S) may be arranged to be surrounded by the first step portion (2712S). Accordingly, in the gap between the upper portion of the fifth and sixth shield members (1550, 1560) and the lower portion of the wiring receiving portion (2700), the wiring portion (W) is double-protected by the first step portion (2712S) and the second step portion (1550S, 1560S), thereby minimizing the influence received from the second fluid at a high temperature.

[0137] According to an embodiment of the present invention, the height of the second step portion (1550S, 1560S) may be higher than the lower surface (2712L) of the bottom portion of the wiring receiving portion (2700). Accordingly, in the gap between the upper portion of the fifth and sixth shield members (1550, 1560) and the lower portion of the wiring receiving portion (2700), the wiring portion (W) is double-protected by the first step portion (2712S) and the second step portion (1550S, 1560S), thereby minimizing the influence received from the second fluid at a high temperature. Additionally, the height of the second step portion (1550S, 1560S) may be positioned lower than the upper surface (2712U) of the bottom portion of the wiring receiving portion (2700). According to this, the possibility of the wiring portion (W) being damaged by the edge of the second step portion (1550S, 1560S) can be reduced.

[0138] FIG. 22 illustrates the internal structure of a wiring receiving portion according to one embodiment of the present invention, FIG. 23 is a top view of the F1 region of FIG. 22, and FIG. 24 is a cross-sectional view of the F2 region of FIG. 22.

[0139] Referring to FIGS. 22 to 24, the side wall (1714) of the case (2710) of the wiring receiving portion (2700) includes an outer surface of the case (2714_O) positioned to face the outside of the case (2710) and an inner surface of the case (2714_I) positioned to face the inside of the case (2710), and the outer surface of the case (2714_O) includes a third stepped portion (2714S) protruding in a direction toward the outside of the case (2710) along the edge of the side wall hole (2714H).

[0140] The side wall hole (2714H) and the third step portion (2714S) can be fitted into the hole (3000H) of the support plate (3000) that fixes the plurality of thermoelectric devices (1000) on one side of the plurality of thermoelectric devices (1000). Accordingly, since the case (2710) of the wiring receiving portion (2700) and the support plate (3000) can be fixed to each other, the number of fastening members for fastening between the case (2710) of the wiring receiving portion (2700) and the support plate (3000) can be reduced.

[0141] Meanwhile, according to an embodiment of the present invention, a first step portion (2712S) is disposed on the bottom portion (2712) of the case (2710) of the wiring receiving portion (2700), and a third step portion (2714S) is disposed on the side wall (2714). At this time, for the assembly of the wiring receiving portion (2700), a plurality of thermoelectric devices (1000), and a support plate (3000), the case (2710) of the wiring receiving portion (2700) can be moved in a direction toward the plurality of thermoelectric devices (1000) to place a second step portion (1550S, 1560S) within the first step portion (2712S), and then moved in a direction toward the support plate (3000) to insert the third step portion (2714S) into the hole (3000H) of the support plate (3000). In order to move the case (2710) of the wiring receiving portion (2700) toward the support plate (3000), the first step portion (2712S) surrounding the second step portion (1550S, 1560S) may be arranged so as to be spaced apart from the second step portion (1550S, 1560S). At this time, the distance (x1) between the first step portion (2712S) and the second step portion (1550S, 1560S) may be greater than the height (x2) of the third step portion (2714S). Accordingly, the outer surface of the case (1714_O) can move to the wall surface of the support plate (3000).

[0142] Throughout the entire specification, the thermoelectric element (100) is described as comprising a first substrate (110), a first electrode (120), a P-type thermoelectric leg (130), an N-type thermoelectric leg (140), a second electrode (150), and a second substrate (160); however, the definition of the thermoelectric element (100) is not limited thereto, and the thermoelectric element (100) may include a first electrode (120), a P-type thermoelectric leg (130), an N-type thermoelectric leg (140), a second electrode (150), and a second substrate (160), and may mean that it is disposed on the first substrate (110).

[0143] The power generation system can generate electricity using heat sources originating from ships, automobiles, power plants, geothermal energy, etc., and multiple power generation units can be arranged to efficiently converge the heat sources. In this case, each power generation unit can improve the cooling performance of the low-temperature portion of the thermoelectric element by enhancing the bonding force between the thermoelectric module and the fluid flow section. Consequently, the efficiency and reliability of the power generation system can be improved, thereby enhancing the fuel efficiency of transportation devices such as ships and vehicles. Therefore, in the shipping and transportation industries, this enables the reduction of transportation costs and the creation of an eco-friendly industrial environment, while when applied to manufacturing industries such as steel mills, it can reduce material costs.

[0144] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as described in the following claims.

Claims

Claim 1 The thermoelectric device comprises a wiring portion electrically connected to the thermoelectric device, and a wiring receiving portion disposed on the upper side of one side of the thermoelectric device to accommodate the wiring portion, wherein the thermoelectric device comprises a fluid flow portion, a thermoelectric module disposed on the fluid flow portion, and a shield member disposed on the side of the thermoelectric module on the fluid flow portion, wherein the wiring receiving portion is disposed on the upper side of the shield member, and wherein the wiring receiving portion comprises a case disposed on the upper side of one side of the thermoelectric device and a cover covering the case, wherein a bottom hole through which the wiring portion passes is formed in the bottom portion of the case, and a side wall hole through which the wiring portion passes is formed in the side wall of the case, wherein the bottom portion comprises an upper surface of the bottom portion disposed toward the cover and a lower surface of the bottom portion disposed toward the thermoelectric device, wherein the lower surface of the bottom portion comprises a first stepped portion protruding along the edge of the bottom hole in a direction toward the thermoelectric device, and wherein an upper hole through which the wiring portion passes is formed in the upper side of the shield member, and wherein the A thermoelectric system in which a shield member includes a second stepped portion protruding along the edge of the upper hole in a direction toward the wiring receiving portion, and the second stepped portion is arranged to be surrounded by the first stepped portion. Claim 2 delete Claim 3 In claim 1, the upper portion of the shield member comprises an upper surface positioned toward the wiring receiving portion and a lower surface positioned toward the fluid flow portion, and the second step portion is a thermoelectric system positioned on the upper surface of the shield member. Claim 4 delete Claim 5 A thermoelectric system according to claim 1, wherein the first stepped portion and the second stepped portion are spaced apart from each other. Claim 6 A thermoelectric system according to claim 5, wherein the side wall of the case comprises an outer surface of the case positioned to face the outside of the case and an inner surface of the case positioned to face the inside of the case, and the outer surface of the case comprises a third stepped portion protruding in a direction toward the outside of the case along the edge of the side wall hole. Claim 7 In claim 6, a thermoelectric system in which the distance between the first stepped portion and the second stepped portion is greater than the height of the third stepped portion. Claim 8 In paragraph 3, the thermoelectric system in which the height of the second step portion is higher than the lower surface of the bottom portion of the wiring receiving portion and lower than the upper surface of the bottom portion of the wiring receiving portion. Claim 9 A thermoelectric system according to paragraph 3, further comprising an insulating member disposed between the upper part of the shield member and the wiring receiving part. Claim 10 In claim 1, the above wiring receiving portion further comprises an insulating member disposed between the case and the cover, forming a thermoelectric system. Claim 11 delete

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